Display device and display panel thereof

Abstract

The invention relates to the technical field of display, in particular to a display device and a display panel thereof. The display panel comprises a display module, a chip on film and a flexible circuit board, the display module is provided with a display area and a non-display area; the chip on film is provided with a first plane area, a bending area and a second plane area which are connected in sequence; the first plane area is bound with the display module located in the non-display area, and the second plane area is located on the backlight side of the display module and is bound with the flexible circuit board; an integrated circuit is arranged on the chip on film in the second plane area; the display panel further comprises a first bonding layer, one side of the first bonding layer is bonded with the backlight side of the display module, the other side of the first bonding layer is bonded with the chip on film located in the second plane area, the first bonding layer is provided with a groove, and the integrated circuit is bonded in the groove. According to the display panel, the integrated circuit arranged on the chip on film can be prevented from tilting, and the performance stability of the display panel is ensured.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display device and a display panel thereof. Background Art

[0002] In related technologies, IC TAPE (a double-sided adhesive foam structure) is usually used to fix the integrated circuit (IC). Although this improves the stability of the connection to a certain extent, after the display panel is bent, the integrated circuit (IC) will almost always warp to varying degrees, which not only affects the appearance quality of the display panel, but also causes interference with the entire device.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the Invention

[0004] The purpose of the present disclosure is to overcome the above-mentioned deficiencies of the prior art and provide a display device and a display panel thereof, which can prevent the integrated circuit disposed on the chip-on-film from warping and ensure the performance stability of the display panel.

[0005] According to one aspect of the present disclosure, there is provided a display panel comprising a display module, a chip-on-film (COF) and a flexible circuit board;

[0006] The display module has a display area and a non-display area;

[0007] The COF has a first planar area, a bending area, and a second planar area connected in sequence; the first planar area is bound to the display module located in the non-display area, and the second planar area is located on the backlight side of the display module and is bound to the flexible circuit board;

[0008] In the second plane area, an integrated circuit is provided on the chip-on-film;

[0009] The display panel further includes a first adhesive layer, one side of the first adhesive layer is bonded to the backlight side of the display module, and the other side is bonded to the COF located in the second plane area. The first adhesive layer has a groove, and the integrated circuit is bonded in the groove.

[0010] In one embodiment of the present disclosure, there is a gap between the sidewall of the groove and the integrated circuit.

[0011] In one embodiment of the present disclosure, the first adhesive layer comprises a first sub-adhesive layer and a second sub-adhesive layer connected to each other;

[0012] The second sub-adhesive layer has an avoidance through hole, and the first sub-adhesive layer is bonded to the backlight side of the display module; the second sub-adhesive layer is located between the first sub-adhesive layer and the chip-on-film, thereby forming the groove at the avoidance through hole and the first sub-adhesive layer.

[0013] In one embodiment of the present disclosure, the display panel further comprises a first supporting structure; the deformation of the first supporting structure is no more than 5%;

[0014] The first support structure has a first fan-shaped support structure, which is arranged on the inner side of the bending area. The first fan-shaped support structure has a first surface, which is fitted and connected to at least a part of the inner side of the bending area.

[0015] In one embodiment of the present disclosure, the first surface is completely fitted and connected to the inner side of the bending area.

[0016] In one embodiment of the present disclosure, the first fan-shaped support structure has an expanded state and a bent state;

[0017] In the expanded state, the first fan-shaped support structure further has a second surface connected to the first surface; on the second surface, the first fan-shaped support structure has a plurality of protrusions, the width of the protrusions gradually decreases in a direction away from the chip-on-film, and a second adhesive layer is provided between each of the protrusions;

[0018] In the bent state, the first fan-shaped support structure further has a third surface connected to the first surface, and the third surface is formed after the protrusions are bonded to each other through the second adhesive layer.

[0019] In one embodiment of the present disclosure, the first support structure further includes two auxiliary support structures respectively connected to both ends of the first fan-shaped support structure, wherein one of the auxiliary support structures is connected to the chip-on-film located in the first plane area, and the other auxiliary support structure is connected to the chip-on-film located in the second plane area;

[0020] In the bent state, the two auxiliary support structures are arranged opposite to each other and are closely connected, thereby forming a fourth surface on the side close to the first fan-shaped support structure;

[0021] The fourth surface is bonded to at least a portion of the third surface.

[0022] In one embodiment of the present disclosure, the cross-section of the protrusion is triangular, and the fourth surface is completely fitted and connected to the third surface.

[0023] In one embodiment of the present disclosure, the cross-section of the protrusion is trapezoidal;

[0024] In the bent state, a notch is provided in the middle of the third surface, thereby forming a glue overflow groove between the fourth surface and the third surface.

[0025] In one embodiment of the present disclosure, the display panel further includes a second supporting structure, the second supporting structure is plate-shaped, and the Vickers hardness of the second supporting structure is not less than 100 HV, or the Shore hardness of the second supporting structure is A24 to D80;

[0026] The second supporting structure has a bending support segment, which is arranged on the inner side of the bending area, and the bending support segment is in contact with the inner side of the bending area.

[0027] In one embodiment of the present disclosure, the second support structure further includes a first support plane segment and a second support plane segment respectively connected to both sides of the bent support segment;

[0028] The first supporting plane segment is connected to the chip-on-film of the first plane area; the orthographic projection of the first adhesive layer on the display module is located within the orthographic projection of the second supporting plane segment on the display module, and the second supporting plane segment is located between the first adhesive layer and the chip-on-film.

[0029] In one embodiment of the present disclosure, the second supporting structure is made of memory alloy.

[0030] In one embodiment of the present disclosure, the display panel further includes a first supporting structure;

[0031] The second supporting structure is located on a side of the first supporting structure away from the chip-on-film.

[0032] According to another aspect of the present disclosure, a display device is provided, comprising the above-mentioned display panel.

[0033] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0035] Figure 1 FIG. 1 is a schematic structural diagram of a display panel in one embodiment of the present disclosure.

[0036] Figure 2 FIG. 1 is a schematic structural diagram of a display panel in one embodiment of the present disclosure.

[0037] Figure 3 FIG. 1 is a schematic structural diagram of a display panel in one embodiment of the present disclosure.

[0038] Figure 4 This is a schematic structural diagram of a display panel in the first embodiment of the present disclosure.

[0039] Figure 5 Schematic diagram of the structure of a display panel in the second embodiment of the present disclosure.

[0040] Figure 6 Schematic diagram of the structure of a display panel in the third embodiment of the present disclosure.

[0041] Figure 7 Schematic diagram of the structure of a display panel in the fourth embodiment of the present disclosure.

[0042] Figure 8 Schematic diagram of the structure of a display panel in the fifth embodiment of the present disclosure.

[0043] Figure 9 Schematic diagram of the structure of a display panel in the sixth embodiment of the present disclosure.

[0044] Figure 10 Schematic diagram of the structure of a display panel in the seventh embodiment of the present disclosure.

[0045] Figure 11 Schematic diagram of the structure of a display panel in the seventh embodiment of the present disclosure.

[0046] Figure 12 for Figure 11 Middle, enlarged view of H.

[0047] Figure 13 Schematic diagram of the structure of the display panel in the seventh embodiment of the present disclosure.

[0048] Figure 14 This is a structural schematic diagram of a first supporting structure in one embodiment of the present disclosure.

[0049] Figure 15 This is a structural schematic diagram of a first supporting structure in one embodiment of the present disclosure.

[0050] Figure 16 This is a structural schematic diagram of a first supporting structure in one embodiment of the present disclosure.

[0051] Figure 17This is a structural schematic diagram of a first supporting structure in one embodiment of the present disclosure.

[0052] Figure 18 This is a structural schematic diagram of a first supporting structure in one embodiment of the present disclosure.

[0053] Figure 19 This is a structural schematic diagram of a first supporting structure in one embodiment of the present disclosure.

[0054] Figure 20 This is a structural schematic diagram of a first supporting structure in one embodiment of the present disclosure.

[0055] Figure 21 This is a structural schematic diagram of a first supporting structure in one embodiment of the present disclosure.

[0056] Figure 22 This is a structural schematic diagram of a first supporting structure in one embodiment of the present disclosure.

[0057] Figure 23 This is a structural schematic diagram of a first supporting structure in one embodiment of the present disclosure.

[0058] Figure 24 This is a structural schematic diagram of a first supporting structure in one embodiment of the present disclosure.

[0059] Figure 25 This is a structural schematic diagram of a first supporting structure in one embodiment of the present disclosure.

[0060] Figure 26 FIG. 1 is a schematic structural diagram of a display panel in one embodiment of the present disclosure.

[0061] Figure 27 FIG. 1 is a schematic structural diagram of a display panel in one embodiment of the present disclosure. DETAILED DESCRIPTION

[0062] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent identical or similar structures, and thus their detailed descriptions will be omitted. Furthermore, the figures are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0063] Although relative terms such as "upper" and "lower" are used in this specification to describe the relationship of one illustrated component to another, these terms are used herein for convenience only, such as in accordance with the orientation of the illustrations in the accompanying drawings. It will be understood that if the illustrated device were flipped upside down, the component described as "upper" would become the component "lower." When a structure is referred to as "on" another structure, this may mean that the structure is integrally formed with the other structure, that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via the other structure.

[0064] The terms "a", "an", "the", "said", and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express open-ended inclusion and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first", "second", etc. are used only as labels and are not intended to limit the quantity of their objects.

[0065] In this application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0066] In an embodiment of the present disclosure, a thin film transistor (TFT) includes an active layer, a gate insulating layer and a gate that are stacked. The active layer is located in the semiconductor layer, and the active layer includes a channel region and a source and a drain located on both sides of the channel region. The channel region maintains semiconductor properties, and the source and the drain are both conductive. In an embodiment of the present disclosure, when using transistors with opposite polarities or when the direction of current changes during circuit operation, the functions of the "source" and the "drain" are sometimes interchanged, that is, the "drain" and the "source" can be interchanged. In an embodiment of the present disclosure, for any transistor, one of the "source" and the "drain" is referred to as the first electrode of the transistor, and the other is referred to as the second electrode of the transistor.

[0067] The present disclosure provides a display device, wherein the display device includes a display panel PNL.

[0068] In one embodiment of the present disclosure, the display panel PNL may be an OLED (Organic Light-Emitting Diode, OLED for short) display panel PNL. Figure 1The display panel PNL includes a display area AA and a non-display area BB located outside the display area AA. The non-display area BB can be a continuous annular area surrounding the display area AA or a discontinuous area surrounding the display area AA. The display area AA can be used to emit light to display images, while the non-display area BB does not emit light.

[0069] In this example, see Figure 2 and Figure 4 The display panel PNL includes a display module, a polarizer POL, and a cover layer CG disposed on the light-emitting side of the display module. The polarizer POL is located between the display module and the cover layer CG and is bonded to the polarizer POL and the cover layer CG via a fourth adhesive layer OCA. To ensure effective bonding, the orthographic projection of the polarizer POL on the cover layer CG is within the orthographic projection of the fourth adhesive layer OCA on the cover layer CG, and the orthographic projection of the polarizer POL on the cover layer CG is smaller than the orthographic projection of the fourth adhesive layer OCA on the cover layer CG.

[0070] The display module includes a driver backplane DBP and a pixel layer PIXL, which are stacked in sequence. The driver backplane DBP may include a stacked base substrate SBT and a driver layer DRL, with the pixel layer PIXL disposed on the side of the driver layer DRL facing away from the base substrate SBT. In this example, the pixel layer PIXL is provided with light-emitting elements LD for display, and the driver layer DRL is provided with pixel circuits PDC that drive each light-emitting element LD to emit light.

[0071] In one embodiment of the present disclosure, the material of the substrate SBT may be an organic material, such as polymethyl methacrylate (PMMA), polyvinyl alcohol (PVA), polyvinyl phenol (PVP), polyether sulfone (PES), polyimide, polyamide, polyacetal, polycarbonate (PC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or a combination thereof. Of course, the substrate SBT may also be other materials not shown.

[0072] Optionally, in the drive layer (DRL), any pixel circuit may include a thin film transistor (TFT) and a storage capacitor. Furthermore, the thin film transistor may be selected from a top-gate thin film transistor, a bottom-gate thin film transistor, or a dual-gate thin film transistor; the material of the active layer of the thin film transistor may be an amorphous silicon semiconductor material, a low-temperature polysilicon semiconductor material, a metal oxide semiconductor material, an organic semiconductor material, a carbon nanotube semiconductor material, or other types of semiconductor materials; and the thin film transistor may be an N-type thin film transistor or a P-type thin film transistor.

[0073] It is understandable that, among the transistors in the pixel circuit, the types of any two transistors may be the same or different. For example, in some embodiments, in a pixel circuit, some transistors may be N-type transistors and some transistors may be P-type transistors. Again for example, in other embodiments, in a pixel circuit, the material of the active layer of some transistors may be a low-temperature polysilicon semiconductor material, and the material of the active layer of some transistors may be a metal oxide semiconductor material. In some embodiments of the present disclosure, the thin film transistors are low-temperature polysilicon transistors. In some other embodiments of the present disclosure, some thin film transistors are low-temperature polysilicon transistors, and some thin film transistors are metal oxide transistors.

[0074] In one embodiment of the present disclosure, see Figure 2 and Figure 3The driving layer DRL may include a semiconductor layer SCL, a gate insulating layer GI, a gate layer GT, an interlayer dielectric layer ILD, a source / drain metal layer SD, and a planarization layer PLN, etc., stacked between the substrate SBT and the pixel layer PIXL. Each thin film transistor and storage capacitor may be formed by film layers such as the semiconductor layer SCL, the gate insulating layer GI, the gate layer GT, the interlayer dielectric layer ILD, and the source / drain metal layer SD. The positional relationship of each film layer may be determined according to the film layer structure of the thin film transistor. Furthermore, the semiconductor layer SCL may be used to form the channel region of the transistor, as well as the first and second electrodes located on both sides of the channel region. If necessary, it may also be formed by conductorization to form partial wiring or conductive structures. The gate layer GT may be used to form one or more gate layer wirings such as scan wiring, reset control wiring, and light emission control wiring, and may also be used to form the gate of a transistor, and may also be used to form part or all of the electrode plates of a storage capacitor. The source / drain metal layer SD may be used to form source / drain metal layer wirings such as data wiring and driving power supply voltage wiring, and may also be used to form part of the electrode plates of a storage capacitor. Of course, in other embodiments of the present disclosure, the driving layer DRL may further include other film layers as needed, for example, an inorganic buffer layer BUF located between the semiconductor layer SCL and the substrate SBT. As needed, any of the above-mentioned film layers such as the semiconductor layer SCL, the gate layer GT, the source / drain metal layer SD, etc. may also be multi-layered. For example, the driving layer DRL may include two different semiconductor layers SCL, or two or three source / drain metal layers SD, or two or three gate layers GT. Accordingly, the insulating film layers in the driving layer DRL (such as the gate insulating layer GI, the interlayer dielectric layer ILD, the planarization layer PLN, etc.) may be adaptively increased or decreased, or new insulating film layers may be added as needed.

[0075] As an example, the driving layer DRL may include an inorganic buffer layer BUF, a semiconductor layer SCL, a gate insulating layer GI, a gate layer GT, an interlayer dielectric layer ILD, a source / drain metal layer SD, and a planarization layer PLN stacked sequentially on the surface of the substrate SBT, and the thin film transistor formed in this way is a top-gate thin film transistor. In other examples, the driving layer may include an inorganic buffer layer, a gate layer, a gate insulating layer, a semiconductor layer, a source / drain metal layer, and a planarization layer stacked sequentially on the surface of the substrate SBT, and the thin film transistor formed in this way is a bottom-gate thin film transistor. In other examples, the driving layer may also have a dual-gate thin film transistor, etc.

[0076] It is understandable that the above example of the driving backplane DBP is only one possible manner of the driving backplane DBP in the embodiment of the present disclosure. In other embodiments of the present disclosure, the driving backplane DBP may also have other structures.

[0077] In one embodiment of the present disclosure, see Figure 2 and Figure 3 The light emitting element LD in the pixel layer PIXL is a thin film light emitting element, which may include two stacked electrodes and a light emitting functional layer EFL sandwiched between the two electrodes. Figure 3 The pixel layer PIXL may include a pixel electrode layer PEL, a light-emitting functional layer EFL, and a common electrode layer COML, which are sequentially stacked on the side of the planarization layer PLN facing away from the substrate SBT. The pixel electrode layer PEL includes multiple pixel electrodes. The portion of the light-emitting functional layer EFL connected to the pixel electrodes serves as the light-emitting functional unit of the light-emitting element LD. The common electrode layer COML serves as a common electrode electrically connected to the light-emitting functional units of each light-emitting element LD.

[0078] In this example, see Figure 3 , the pixel layer PIXL may further include a pixel definition layer PDL located between the pixel electrode layer PEL and the light-emitting functional layer EFL. The pixel definition layer PDL has a plurality of through pixel openings arranged in a one-to-one correspondence with the plurality of pixel electrodes, and any pixel opening exposes at least a portion of the corresponding pixel electrode. For example, the pixel definition layer PDL covers the edge of the pixel electrode and exposes at least a portion of the internal area of ​​the pixel electrode, so that the pixel definition layer PDL can effectively define the actual effective area of ​​the pixel electrode (the area directly connected to the light-emitting functional unit), thereby defining the light-emitting area and light-emitting area of ​​the light-emitting element LD. The light-emitting functional layer EFL at least covers the pixel electrode exposed by the pixel definition layer PDL. The common electrode layer COML may cover the light-emitting functional layer EFL. The pixel electrode and the common electrode layer COML provide carriers such as electrons and holes to the light-emitting functional layer EFL, so that the light-emitting functional layer EFL emits light. The portion of the light-emitting functional layer EFL located between the pixel electrode and the common electrode layer COML may serve as a light-emitting functional unit. The pixel electrode, the common electrode layer COML, and the light-emitting functional unit form the light-emitting element LD. One of the pixel electrode and the common electrode layer COML serves as an anode of the light emitting element LD, and the other serves as a cathode of the light emitting element LD.

[0079] In an example, the pixel electrode may serve as an anode of the light emitting element LD, and the common electrode layer COML may serve as a cathode of the light emitting element LD.

[0080] In some embodiments of the present disclosure, the types of the light-emitting elements LD are different, and the materials and film layers of the light-emitting functional units are different.

[0081] In this example, the light-emitting functional layer (EFL) may include an organic light-emitting layer, and may include one or more of a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injection layer. Furthermore, the organic light-emitting layer may include a light-emitting layer host material and a light-emitting layer guest material. The light-emitting layer guest material may be a fluorescent dopant or a phosphorescent dopant, and in particular, may be a thermally activated delayed fluorescent material.

[0082] In one embodiment of the present disclosure, see Figure 2 and Figure 3 , the display module also includes a thin film encapsulation layer TFE located above the pixel layer PIXL. It is understandable that the thin film encapsulation layer TFE is located on the side of the pixel layer PIXL away from the driving layer DRL. In this example, the thin film encapsulation layer TFE includes an inorganic encapsulation layer and an organic encapsulation layer that are alternately stacked. The inorganic encapsulation layer can effectively block external moisture and oxygen, and prevent water and oxygen from invading the pixel layer PIXL and causing aging of the material in the pixel layer PIXL. Optionally, the edge of the inorganic encapsulation layer may be located in the non-display area BB. The organic encapsulation layer is located between two adjacent inorganic encapsulation layers to achieve planarization and reduce the stress between the inorganic encapsulation layers. Among them, the edge of the organic encapsulation layer may be located between the edge of the display area AA and the edge of the inorganic encapsulation layer. For example, see Figure 3 The thin film encapsulation layer TFE includes a first inorganic encapsulation layer CVD1, an organic encapsulation layer IJP, and a second inorganic encapsulation layer CVD2, which are sequentially stacked on the side of the pixel layer PIXL away from the substrate SBT. Of course, in other embodiments of the present disclosure, the display module can also use other methods to encapsulate and protect the pixel layer PIXL.

[0083] In one embodiment of the present disclosure, the display module further includes a back film layer SCF located on the backlight side. In other words, the back film layer SCF can be adhered to the surface of the base substrate SBT away from the driving layer DRL.

[0084] In one embodiment of the present disclosure, the display module has a binding area in the non-display area BB. The binding area is bound to the flexible circuit board (FPC) via a chip-on-film (COF). After the chip-on-film (COF) is bent, the flexible circuit board (FPC) is located on the backlight side of the display panel (PNL). In this example, the flexible circuit board (FPC) is bonded to the back film layer (SCF). It is understood that the chip-on-film (COF) has a first planar area, a bending area, and a second planar area. The first planar area and the second planar area are located on either side of the bending area, and the first planar area partially overlaps with the non-display area BB of the display panel (PNL). The second planar area is located on the backlight side of the display panel (PNL), and the bending area is semicircular.

[0085] In one embodiment of the present disclosure, an integrated circuit IC is disposed on the second plane area of ​​the chip on film (COF).

[0086] In related technologies, IC TAPE (a double-sided adhesive foam structure) is usually used to fix the integrated circuit (IC) between the cover chip film and the back film layer of the display module, which improves the stability of the connection to a certain extent. However, after the bending process of the cover chip film, the integrated circuit will almost always warp to varying degrees. This not only affects the appearance quality of the display panel, but also causes interference with the entire machine. In addition, existing reliability tests have shown that the shaking of the integrated circuit and the interference with the display module during the test process are the main reasons for the NG of tests such as falling balls and drops. Analysis shows that the starting point of the broken screen is located directly below the integrated circuit (IC).

[0087] The applicant analyzed the cause of the broken screen and found that the integrated circuit warped, on the one hand, because the IC TAPE (a double-sided adhesive foam structure) was not firmly bonded, and on the other hand, because the bending stress in the bending area of ​​the cover film was too large and transmitted to the integrated circuit, causing the integrated circuit to warp.

[0088] In order to solve at least one of the above problems and alleviate the warping of the integrated circuit, the present disclosure proposes three different solution strategies.

[0089] First strategy:

[0090] See also Figure 4 The display panel PNL further includes a first adhesive layer FMA, one side of the first adhesive layer FMA is bonded to the backlight side (back film layer SCF) of the display module, and the other side is bonded to the chip-on-film COF. The first adhesive layer FMA has a groove, and the integrated circuit IC is bonded in the groove.

[0091] In the present disclosure, by providing a first adhesive layer FMA with a groove and allowing the integrated circuit IC to be bonded in the groove, the effective bonding area between the first adhesive layer FMA and the back film layer SCF and the chip-on-chip film COF is increased (the design of the first adhesive layer FMA in the present disclosure increases the effective bonding area of ​​the area near the integrated circuit IC), thereby improving the bonding force between the integrated circuit IC and the chip-on-chip film COF, providing a more stable foundation for the subsequent bending process, and reducing the possibility of the integrated circuit IC warping after the bending process. In other words, the provision of the first adhesive layer FMA improves the stability and reliability of the connection. This refined design makes the connection between the integrated circuit IC and the chip-on-chip film COF stronger during the module bending process, effectively reducing the risk of connection failure due to stress concentration.

[0092] Second strategy:

[0093] See also Figure 5The display panel PNL has a second support structure SM, which is plate-shaped; the second support structure SM has a bending support segment, which is bonded to the inner side of the bending area, and the bending support segment is in contact with the inner side of the bending area.

[0094] In the present disclosure, the second support structure SM is set up to play a precise skeleton constraint role on the deformation of the bending zone, and can improve the support for the bending zone, so that the deformation of the bending zone is more uniform, and can change the force transmission path, so that the stress originally concentrated in the bending zone can be dispersed to the second support structure SM, thereby alleviating the problem of stress concentration.

[0095] Third strategy:

[0096] See also Figure 6 The display panel PNL has a first supporting structure FB; the first supporting structure FB has a first fan-shaped supporting structure SFB, the first fan-shaped supporting structure SFB is adhesively arranged on the inner side of the bending area, and the first fan-shaped supporting structure SFB has a first surface, and the first surface is in contact with at least a portion of the inner side of the bending area.

[0097] In the present disclosure, the first supporting structure FB is set up to play a skeletal constraint role on the deformation of the bending zone, and can improve the support for the bending zone, so that the deformation of the bending zone is more uniform, and can change the force transmission path, so that the stress originally concentrated in the bending zone can be dispersed to the first supporting structure FB, thereby alleviating the problem of stress concentration.

[0098] The embodiments of the present disclosure adopt at least one of the above three strategies.

[0099] In the first embodiment of the present disclosure, the display panel PNL is designed based on the first strategy. Figure 4 and Figure 27 The display panel PNL also includes a first adhesive layer FMA, one side of the first adhesive layer FMA is bonded to the backlight side of the display module (the back film layer SCF), and the other side is bonded to the cover chip film COF. The first adhesive layer FMA has a groove, and the integrated circuit IC is bonded in the groove. It can be understood that the orthographic projection of the first adhesive layer FMA on the back film layer SCF is larger than the orthographic projection of the integrated circuit IC on the back film layer SCF. In the present disclosure, by providing a first adhesive layer FMA with a groove and making the integrated circuit IC bonded in the groove, the effective bonding area of ​​the first adhesive layer FMA and the back film layer SCF and the cover chip film COF is increased (the design of the first adhesive layer FMA increases the effective bonding area of ​​the area near the integrated circuit IC), thereby improving the bonding force between the integrated circuit IC and the cover chip film COF, providing a more stable foundation for the subsequent bending process, and reducing the possibility of the integrated circuit IC warping after the bending process.

[0100] In one example of the present disclosure, the size of the groove is adapted to the size of the integrated circuit IC. In other words, both the sidewalls and end faces of the groove are bonded to the integrated circuit IC (wherein the sidewalls of the groove refer to the groove walls parallel to the arrangement direction of the integrated circuit IC and the back film layer SCF, and the end faces of the groove walls refer to the groove walls parallel to the chip-on-film COF). In this example, the present disclosure sets the size of the groove to be adapted to the integrated circuit IC, which can increase the bonding area between the first bonding layer FMA and the integrated circuit IC, thereby improving bonding stability.

[0101] In another example of the present disclosure, see Figure 4 The size of the groove is larger than the size of the integrated circuit IC. In other words, the orthographic projection of the groove on the backing film layer SCF is larger than the orthographic projection of the integrated circuit IC on the backing film layer SCF (the sidewalls of the groove surround the integrated circuit IC and have a gap between them). In the present disclosure, setting the groove size slightly larger can reduce the probability of misalignment between the groove and the integrated circuit IC during assembly, avoiding the problem of protrusion of the chip-on-film (COF) at the integrated circuit IC due to misaligned installation. In the present disclosure, this gap is 0.2mm-0.5mm. It is understood that there is a gap of 0.2mm-0.5mm between the sidewalls of the groove and the integrated circuit IC. If the gap is too small, the anti-misalignment effect is not significant. If the gap is too large, it will lead to a reduction in the bonding area between the first adhesive layer FMA and the chip-on-film (COF), reducing the bonding strength. For example, there is a gap of 0.2mm between the sidewalls of the groove and the integrated circuit IC. For another example, there is a gap of 0.28mm between the sidewalls of the groove and the integrated circuit IC. For another example, there is a gap of 0.36mm between the sidewalls of the groove and the integrated circuit IC. For another example, there is a 0.43 mm gap between the sidewall of the groove and the integrated circuit IC. For another example, there is a 0.5 mm gap between the sidewall of the groove and the integrated circuit IC. Of course, it is understandable that the gaps between the corresponding positions of the sidewalls of the groove and the integrated circuit IC can be the same or different.

[0102] In one embodiment of the present disclosure, the first adhesive layer FMA can be arranged in layers. In other words, see Figure 27 The first adhesive layer FMA includes a first sub-adhesive layer FMA1 and a second sub-adhesive layer FMA2. One side of the first sub-adhesive layer FMA1 is connected to the backlight side of the display module; the second sub-adhesive layer FMA2 has a clearance hole in the middle, and the second sub-adhesive layer FMA2 is connected to the other side of the first sub-adhesive layer FMA1, thereby forming a groove at the clearance hole. In the embodiment of the present disclosure, the first adhesive layer FMA is arranged in layers, which is more convenient for operation. In one example, the second sub-adhesive layer FMA2 can be a continuous film layer.

[0103] In another example, the second sub-adhesive layer FMA2 can be formed by multiple sub-adhesive structures. It can be understood that the second sub-adhesive layer FMA2 can have multiple sub-adhesive structures, and the sub-adhesive structures are arranged in a ring in sequence, thereby forming the avoidance through hole on the inner side of each sub-adhesive structure.

[0104] Of course, in other embodiments, the first adhesive layer FMA can be provided integrally.

[0105] In one embodiment of the present disclosure, the first adhesive layer FMA is made of foam. Foam has good cushioning properties and strong adhesion. Of course, the first adhesive layer FMA in the present disclosure can also be made of other materials.

[0106] In the second embodiment of the present disclosure, see Figure 5 The display panel PNL is designed based on the second strategy. In this embodiment, the display panel PNL has a second support structure SM. The second support structure SM is plate-shaped and has a bent support segment disposed inside the bending region, and the bent support segment is completely aligned with the inner side of the bending region.

[0107] In the present disclosure, the second support structure SM is set up to play a skeletal constraint role on the deformation of the bending zone, and can improve the support for the bending zone, so that the deformation of the bending zone is more uniform, and can change the force transmission path, so that the stress originally concentrated in the bending zone can be dispersed to the second support structure SM, thereby alleviating the problem of stress concentration.

[0108] In one embodiment of the present disclosure, the bending support segment may have a shape that is compatible with the bending area, so that the bending support segment can completely fit the bending area and play a skeletal constraint role on the bending area.

[0109] In one embodiment of the present disclosure, the second support structure SM also includes a first support plane segment and a second support plane segment, wherein the first support plane segment and the second support plane segment are respectively connected on both sides of the bent support segment. It can be understood that the first support plane segment, the bent support segment and the second support plane segment are connected in sequence.

[0110] The first planar support segment is disposed in the first planar region and connected to the COF in the first planar region. The second planar support segment is disposed in the second planar region and connected to the COF in the second planar region. The first and second planar support segments provided in the present disclosure can further decompose stress in the bending region through the bending support segment to the first and second planar support segments, further alleviating stress concentration issues.

[0111] In one embodiment of the present disclosure, the second supporting structure SM may only have a bent state, that is, the shape of the second supporting structure SM is the same as the shape of the chip on film COF in the bent state.

[0112] In another embodiment, the second support structure SM may have a bent state and a flat state (non-bent state). The shape of the second support structure SM in the bent state is the same as that of the chip-on-film (COF) in the bent state, and the shape of the second support structure SM in the flat state is the same as that of the chip-on-film (COF) in the flat state.

[0113] In an embodiment of the present disclosure, the second support structure SM has a Vickers hardness of no less than 100 HV, or a Shore hardness of the second support structure SM of A24 to D80. In one example, the second support structure SM is made of a shape memory alloy having a Vickers hardness of no less than 100 HV, such as 100 HV, 105 HV, 110 HV, 125 HV, 130 HV, etc. In another example, the second support structure SM is made of a shape memory polymer having a Shore hardness of A24 to D80, such as A24, A30, A50, D80, etc.

[0114] In this embodiment, the second support structure SM is made of memory alloy. Through the phase change deformation characteristics of the alloy material, the second support structure SM can guide the COF bending area to bend according to a preset trajectory, thereby ensuring the accuracy and consistency of the display panel PNL during the bending process. This feature not only improves the manufacturing accuracy of the product, but also provides a more reliable foundation for the subsequent assembly and testing process. In the present disclosure, the second support structure SM has unique shape memory effect, phase change pseudo-elasticity and other characteristics through thermoelasticity and martensitic phase transformation and its inversion. The so-called shape memory effect refers to the property that a material can "remember" its original shape and restore its initial shape under certain conditions (generally temperature). Utilizing this characteristic, the bending radius of the bending zone can be made more precisely controllable to prevent its warping stress from being transferred to the integrated circuit.

[0115] In one embodiment of the present disclosure, see Figure 26 The second support structure SM can be a whole sheet structure ( Figure 26 a) is more suitable for COF (thicker) multi-layer wiring. When the bending stress is high, it can apply greater and more comprehensive stress to the bending area to prevent bending out of place or rebound. In another embodiment, the second support structure SM is a strip structure ( Figure 26b) has better bending directivity and is more suitable for situations where high bending precision is required. In addition, the bending force can be controlled by adjusting the strip spacing, thereby improving efficiency and reducing material costs. In another embodiment, the second support structure SM can be a diamond mesh ( Figure 26 c), which is suitable for situations where the deformation requirement is large. The mesh structure has better scalability and flexibility, and can be applied to situations where some local special-shaped structures of the whole machine need to be avoided; in another embodiment, the second support structure SM can be a triangular hollow structure ( Figure 26 In d), the triangular structure is more stable and less prone to deformation and rebound, making it suitable for situations with higher reliability testing requirements.

[0116] In the third embodiment of the present disclosure, the display panel PNL is designed based on the third strategy. Figure 6 The display panel PNL has a first supporting structure FB; the first supporting structure FB has a first fan-shaped supporting structure SFB, the first fan-shaped supporting structure SFB is arranged on the inner side of the bending area (in the present disclosure, the inner side of the bending area refers to the side facing the center of the display module), and the first fan-shaped supporting structure SFB has a first surface, and the first surface is in contact with at least a portion of the inner side of the bending area.

[0117] In the present disclosure, the first supporting structure FB is set up to play a skeletal constraint role on the deformation of the bending zone, and can improve the support for the bending zone, so that the deformation of the bending zone is more uniform, and can change the force transmission path, so that the stress originally concentrated in the bending zone can be dispersed to the first supporting structure FB, thereby alleviating the problem of stress concentration.

[0118] In one embodiment of the present disclosure, the first surface is completely in contact with the bending zone, so that better support can be provided for the bending zone, the deformation of the bending zone can be better controlled, and the problem of stress concentration can be alleviated. In this example, the first fan-shaped support structure SFB can only have a bent state (that is, whether in the bent state of the chip-on-film COF or in the non-bent state of the chip-on-film COF, the first fan-shaped support structure SFB maintains the bent state unchanged). In another example, the first fan-shaped support structure SFB can have a flattened state (non-bent state) and a bent state before and after the bending of the bending zone. In the flattened state, the first surface can be partially connected to the bending zone. In this way, after bending, it can be ensured that the first surface is completely in contact with the bending zone. In this example, in the expanded state, the first fan-shaped support structure SFB also has a second surface opposite the first surface. The second surface has multiple interconnected protrusions, each of which is narrow at the top and wide at the bottom (for example, the protrusions are triangular, trapezoidal, etc.). The protrusions are fixedly bonded to each other in the bent state via a second adhesive layer (the second adhesive layer is not shown in the figure) (the protrusions are bonded to each other via the second adhesive layer and then bent to form a third surface). This ensures that the first fan-shaped support structure SFB also has a bending shape that adapts to the bending zone.

[0119] In another embodiment of the present disclosure, the first surface is partially in contact with the bending zone, so that the processing accuracy requirements of the first fan-shaped support structure SFB are relatively low, which facilitates the processing of the first fan-shaped support structure SFB. In this example, the first fan-shaped support structure SFB can only have a bent state (that is, whether in the bent state of the chip-on-film COF or in the non-bent state of the chip-on-film COF, the first fan-shaped support structure SFB maintains the bent state unchanged). In another example, the first fan-shaped support structure SFB can have a flattened state (non-bent state) and a bent state before and after the bending zone is bent. In the flattened state, the first surface is completely in contact with the bending zone, so that after bending, it can be ensured that the first surface is partially in contact with the bending zone. In this example, in the expanded state, the first fan-shaped support structure SFB also has a second surface opposite to the first surface, and the second surface has a plurality of protrusions connected to each other, each protrusion has a structure that is narrow at the top and wide at the bottom (for example, the structure of the protrusion is triangular, trapezoidal, etc.), and the protrusions are fixedly bonded in the bent state through a second adhesive layer (the second adhesive layer is not shown in the figure) (in the bent state, the protrusions are bonded to form a third surface). In this way, it is ensured that the first fan-shaped support structure SFB also has a bending shape that is adapted to the bending area.

[0120] In this embodiment, see Figure 14-Figure 25, the number of protrusions is 3-6, so that it can avoid the problem of small contact area between the first surface and the bending area and few support points due to the number of protrusions, and the problem of each protrusion sticking to each other in the flattened state due to too many protrusions. In other words, the central angle of each protrusion is between 30°-60°. The larger the protrusion angle, the larger the gap between the ideal arc surface (the arc surface of the bending area) and the fitting arc surface (the first surface actually formed) after bending, which is not conducive to the fit between the first fan-shaped support structure SFB and the chip-on-chip film COF, and will cause the problem of local stress concentration, further leading to an increased risk of wiring breakage. However, the smaller the protrusion angle, the closer the distance between the glue-coated surfaces before bending, which will cause the second adhesive layers to stick to each other, and even cause the second adhesive layer to fail.

[0121] In this embodiment, see Figures 8-15 The cross section of the protrusion is a triangle, such as an isosceles triangle. Thus, when the first fan-shaped support structure SFB is in a bent state, its cross section is a semicircle. That is, in the bent state, the second surface is a plane.

[0122] In one embodiment of the present disclosure, see Figure 16-19 The cross section of the protrusion can be a trapezoid, such as an isosceles trapezoid. Thus, when the first fan-shaped support structure SFB is bent, its cross section is annular. That is, in the bent state, the middle portion of the third surface formed by bonding the protrusions will have a notch.

[0123] In one embodiment of the present disclosure, the first support structure FB further includes two auxiliary support structures RFB, which are respectively connected to the two sides of the first fan-shaped support structure SFB, wherein one auxiliary support structure RFB is connected to the chip-on-film (COF) located in the first planar region; and the other auxiliary support structure RFB is connected to the chip-on-film (COF) located in the second planar region. In the bent state, the two auxiliary support structures RFB are arranged relative to each other and are bonded to each other, thereby forming a cavity between the two auxiliary support structures RFB and the bending region, with the first fan-shaped support structure SFB located in the cavity. In the flattened state, the two auxiliary support structures RFB are separated from each other and are respectively located at the two ends of the first fan-shaped support structure SFB. In this example, the two auxiliary support structures RFB, as well as the auxiliary support structure RFB and its adjacent protrusions, are bonded by a second adhesive layer.

[0124] In the present disclosure, auxiliary support structures RFB are respectively provided on both sides of the first fan-shaped support structure SFB, which can increase the contact (bonding) area between the first support structure FB and the chip-on-film COF, thereby improving the connection stability between the first support structure FB and the chip-on-film COF, and further ensuring the relative position of the first support structure FB and the bending area.

[0125] In one embodiment of the present disclosure, in the bent state, the two auxiliary support structures RFB form a fourth surface close to the first fan-shaped support structure SFB. Figure 14 、 Figure 15 、 Figure 20-25 When each protrusion is an isosceles triangle, the height of the auxiliary support structure RFB is equal to the height of the protrusion, and when the first fan-shaped support structure SFB is in a bent state, the third surface and the fourth surface are in contact. Figure 16-19 When each protrusion is an isosceles trapezoid, the height of the auxiliary support structure RFB is greater than the height of the protrusion. When the first fan-shaped support structure SFB is in a bent state, the third surface is fitted with the fourth surface, and a glue overflow groove C1 is formed between the notch on the third surface and the fourth surface (if there is no glue overflow groove C1, the glue on each bonding surface may overflow from the side after bending, which will cause problems such as foreign matter sticking to the surface or direct glue pulling during the process). In this example, the height difference between the auxiliary support structure RFB and the protrusion is between 0.1-0.2mm. For example, the height difference between the auxiliary support structure RFB and the protrusion is 0.1mm, 0.12mm, 0.145mm, 0.168mm, 0.189mm, 0.2mm, etc.

[0126] In one example, the two auxiliary support structures RFB may have the same structure. Of course, in other examples, the two auxiliary support structures RFB may have different structures. For example, both auxiliary support structures RFB may have rectangular cross-sections. For another example, one auxiliary support structure RFB may have a rectangular cross-section, while the other auxiliary support structure RFB may have a trapezoidal cross-section.

[0127] In one embodiment of the present disclosure, the material of the second adhesive layer can be AB glue, in which A glue is mainly epoxy resin and B glue is mainly curing agent. A glue and B glue are respectively applied to the two adjacent surfaces of two adjacent protrusions, the two adjacent surfaces of the protrusion and the auxiliary support structure RFB, and the two opposite surfaces of the two auxiliary support structures RFB. When A glue and B glue come into contact after bending, a curing reaction occurs between the two, thereby achieving bonding. Adhesion using AB glue can achieve autonomous curing without the aid of external conditions. In another embodiment, the material of the second adhesive layer can be UV glue (ultraviolet curing adhesive). UV glue is applied to the surface to be bonded of the first fan-shaped support structure SFB. The main components of UV glue are oligomers of the acrylate series and monomers of some acrylate series. When these components are irradiated with ultraviolet light, the photoinitiator (or photosensitizer) therein will absorb ultraviolet light to produce active free radicals or cations, thereby initiating monomer polymerization and cross-linking chemical reactions, so that the adhesive is cured within a few seconds. In another embodiment, the second adhesive layer may be made of a thermosetting adhesive. The thermosetting adhesive is applied to the surface to be bonded of the first sector-shaped support structure SFB. The thermosetting adhesive primarily comprises a resin and a curing agent, and is a type of adhesive that cures upon heating. Of course, in other embodiments not shown, the second adhesive layer may also be made of other materials.

[0128] In one embodiment of the present disclosure, the deformation of the first support structure FB is no greater than 5%. For example, the deformation of the first support structure FB is 5%, 4%, 3%, 2%, 1%, or 0%. In this example, the material of the first support structure FB can be ceramic, silicone, or plastic.

[0129] In one embodiment of the present disclosure, the first surface is adhered to the bending area via a third adhesive layer, and the material of the third adhesive layer may be a pressure sensitive adhesive (PSA).

[0130] Of course, in other embodiments of the present disclosure, the above three strategies can be combined in any two or in combination of three strategies.

[0131] In the fourth embodiment of the present disclosure, see Figure 7 The display panel PNL is designed based on a combination of the first strategy and the second strategy. In this embodiment, the display panel PNL is provided with a first adhesive layer FMA and a second support structure SM.

[0132] In this embodiment, a portion of the second planar support segment of the second support structure SM is located between the second sub-adhesive layer FMA2 and the chip-on-film (COF). In other words, the orthographic projection of the second sub-adhesive layer FMA2 on the COF lies within the orthographic projection of the second planar support segment on the COF. This allows the second support structure SM to exert greater downward pressure on the first adhesive layer FMA, thereby strengthening the adhesion of the first adhesive layer FMA's associated structures.

[0133] In the present disclosure, the first adhesive layer FMA increases the effective bonding area between the integrated circuit IC and the back film layer SCF and the chip-on-film COF (the design of the first adhesive layer FMA increases the effective bonding area of ​​the area near the integrated circuit IC), thereby improving the bonding force between the integrated circuit IC and the chip-on-film COF; at the same time, the second support structure SM can increase the support for the bending area and play a skeletal constraint role on the deformation of the bending area, making the deformation of the bending area more uniform, and can change the force transmission path, so that the stress originally concentrated in the bending area can be dispersed to the second support structure SM, which can alleviate the problem of stress concentration to a certain extent. In other words, when the first adhesive layer FMA and the second support structure SM are provided at the same time, the bonding force between the integrated circuit IC and the chip-on-film COF is unevenly improved, and the problem of stress concentration is also alleviated, further solving the problem of warping of the integrated circuit IC.

[0134] In the fifth embodiment of the present disclosure, see Figure 8 The display panel PNL is designed based on a combination of the first strategy and the third strategy. In other words, in this embodiment, the display panel PNL is provided with the first adhesive layer FMA and the first supporting structure FB.

[0135] In this embodiment, the first supporting structure FB and the first adhesive layer FMA do not overlap each other.

[0136] In the present disclosure, the first adhesive layer FMA increases the effective bonding area between the integrated circuit IC and the back film layer SCF and the chip-on-film COF (the design of the first adhesive layer FMA increases the effective bonding area of ​​the area near the integrated circuit IC), thereby improving the bonding force between the integrated circuit IC and the chip-on-film COF. At the same time, the first support structure FB can increase the support for the bending zone and play a skeletal constraint role on the deformation of the bending zone, making the deformation of the bending zone more uniform, and can change the force transmission path, so that the stress originally concentrated in the bending zone can be dispersed to the first support structure FB, which can alleviate the problem of stress concentration to a certain extent. In other words, when the first adhesive layer FMA and the first support structure FB are provided at the same time, the bonding force between the integrated circuit IC and the chip-on-film COF is unevenly improved, and the problem of stress concentration is also alleviated, further solving the problem of warping of the integrated circuit IC.

[0137] In the sixth embodiment of the present disclosure, see Figure 9 The display panel PNL is designed based on a combination of the second strategy and the third strategy. In this embodiment, the display panel PNL is provided with a first supporting structure FB and a second supporting structure SM.

[0138] In this embodiment, the second support structure SM is located between the first support structure FB and the chip-on-film (COF), and the orthographic projection of the first support structure FB on the COF is located within the orthographic projection of the second support structure SM on the COF. For example, the orthographic projection of the first support structure FB on the COF is smaller than the orthographic projection of the second support structure SM on the COF.

[0139] In the present disclosure, the simultaneous provision of the first support structure FB and the second support structure SM can further increase the support for the bending zone, and play a skeletal constraint role on the deformation of the bending zone, so that the deformation of the bending zone is more uniform, and can change the force transmission path, so that the stress originally concentrated in the bending zone can be dispersed to the first support structure FB and the second support structure SM, further alleviating the problem of stress concentration. Thus, after greatly reducing the stress concentration, the possibility of the integrated circuit IC warping under stress is further reduced.

[0140] In the seventh embodiment of the present disclosure, see Figure 10 、 Figure 11 、 Figure 12 、 Figure 13 The display panel PNL is designed based on a combination of the first strategy, the second strategy, and the third strategy. In this embodiment, the display panel PNL is provided with a first adhesive layer FMA, a first supporting structure FB, and a second supporting structure SM.

[0141] The second support structure SM is located between the first support structure FB and the chip-on-film (COF), and the orthographic projection of the first support structure FB on the COF is located within the orthographic projection of the second support structure SM on the COF. For example, the orthographic projection of the first support structure FB on the COF is smaller than the orthographic projection of the second support structure SM on the COF.

[0142] Part of the second planar support segment of the second support structure SM is located between the second sub-adhesive layer FMA2 and the chip-on-film (COF). In other words, the orthographic projection of the second sub-adhesive layer FMA2 on the COF lies within the orthographic projection of the second planar support segment on the COF. This allows the second support layer to provide greater downward pressure on the first adhesive layer FMA, thereby strengthening the adhesion of the first adhesive layer FMA's associated structures.

[0143] In the present disclosure, the first adhesive layer FMA increases the effective bonding area between the integrated circuit IC and the back film layer SCF and the chip-on-chip film COF (the design of the first adhesive layer FMA increases the effective bonding area of ​​the area near the integrated circuit IC), thereby improving the bonding force between the integrated circuit IC and the chip-on-chip film COF; at the same time, the first support structure FB and the second support structure SM can increase the support for the bending zone, and play a skeletal constraint role on the deformation of the bending zone, making the deformation of the bending zone more uniform, and can change the force transmission path, so that the stress originally concentrated in the bending zone can be dispersed to the first support structure FB and the second support structure SM, thereby alleviating the problem of stress concentration to a greater extent. In other words, when the first adhesive layer FMA, the first support structure FB and the second support structure SM are provided at the same time, the bonding force between the integrated circuit IC and the chip-on-chip film COF is unevenly improved, and the problem of stress concentration is also alleviated, further solving the problem of warping of the integrated circuit IC.

[0144] In the present disclosure, before the chip-on-film COF is bent, the first adhesive layer FAM, the first support structure FB and the second support structure SM are attached to corresponding positions to ensure that necessary support and constraints are provided during the bending process (first, the first adhesive layer FAM is attached to the surface of the integrated circuit IC to ensure that it can be in close contact with the integrated circuit IC and provide sufficient bonding area. Then, the second support structure SM is attached on top of the first adhesive layer FAM so that it can cover the bending area of ​​the chip-on-film COF (the second support structure SM only includes the bending support segment). Finally, the first support structure FB is attached on the top and side of the second support structure SM to ensure that they can be tightly connected and form an integral structure). During bending, the alloy in the second support structure SM undergoes phase change deformation by applying external stimulation (such as temperature change), so that the bending area of ​​the chip-on-film COF bends according to a pre-set trajectory, playing a role of skeleton constraint; after bending, the first support structure FB is completely shaped under the constraint of the second support structure SM and the action of the second adhesive layer, locking the shape of the bending area of ​​the chip-on-film COF to prevent warping.

[0145] The solution disclosed in this disclosure, firstly, solves the pain points of the related art, namely, the risk of interference with the whole machine and the risk of reliability testing caused by the easy warping of integrated circuits, thereby improving product yield, lifespan and competitiveness, and reducing production costs and maintenance costs. Secondly, compared with the single IC TAPE in the related art, the structure is novel, the functional division is clear, and the three-stage structure is creatively designed. The entire process of the bending process is optimized before, during and after, which not only improves the reliability and stability of the product, but also reduces the risk in the production process. Thirdly, there is no need to add an additional module attachment process, and it can be integrated with the IC TAPE in the existing technology to attach incoming materials, thereby simplifying the production process, improving production efficiency, and being highly practical. This not only helps to enhance the market competitiveness of enterprises, but also helps to promote technological progress and industrial upgrading of the entire industry. At the same time, the structure also has good compatibility and scalability, and can be widely used in the manufacture of different types of OLED display devices.

[0146] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

Claims

1. A display panel, characterized in that: The display panel comprises a display module, a chip-on-film and a flexible circuit board; The display module has a display area and a non-display area; The COF has a first planar area, a bending area, and a second planar area connected in sequence; the first planar area is bound to the display module located in the non-display area, and the second planar area is located on the backlight side of the display module and is bound to the flexible circuit board; In the second plane area, an integrated circuit is provided on the chip-on-film; The display panel further includes a first adhesive layer, one side of the first adhesive layer is bonded to the backlight side of the display module, and the other side is bonded to the COF located in the second plane area. The first adhesive layer has a groove, and the integrated circuit is bonded in the groove.

2. The display panel according to claim 1, wherein: A gap is formed between a sidewall of the groove and the integrated circuit.

3. The display panel according to claim 1, wherein: The first adhesive layer comprises a first sub-adhesive layer and a second sub-adhesive layer connected to each other; The second sub-adhesive layer has an avoidance through hole, and the first sub-adhesive layer is bonded to the backlight side of the display module; the second sub-adhesive layer is located between the first sub-adhesive layer and the chip-on-film, thereby forming the groove at the avoidance through hole and the first sub-adhesive layer.

4. The display panel according to claim 1, wherein: Therefore, the display panel further comprises a first supporting structure; the deformation of the first supporting structure is no more than 5%; The first support structure has a first fan-shaped support structure, which is arranged on the inner side of the bending area. The first fan-shaped support structure has a first surface, which is fitted and connected to at least a part of the inner side of the bending area.

5. The display panel according to claim 4, wherein: The first surface is completely fitted and connected to the inner side of the bending area.

6. The display panel according to claim 4, wherein: The first fan-shaped support structure has an expanded state and a bent state; In the expanded state, the first fan-shaped support structure further has a second surface connected to the first surface; on the second surface, the first fan-shaped support structure has a plurality of protrusions, the width of the protrusions gradually decreases in a direction away from the chip-on-film, and a second adhesive layer is provided between each of the protrusions; In the bent state, the first fan-shaped support structure further has a third surface connected to the first surface, and the third surface is formed after the protrusions are bonded to each other through the second adhesive layer.

7. The display panel according to claim 6, wherein: The first support structure further includes two auxiliary support structures respectively connected to both ends of the first fan-shaped support structure, wherein one of the auxiliary support structures is connected to the chip-on-film located in the first plane area, and the other auxiliary support structure is connected to the chip-on-film located in the second plane area; In the bent state, the two auxiliary support structures are arranged opposite to each other and are closely connected, thereby forming a fourth surface on the side close to the first fan-shaped support structure; The fourth surface is bonded to at least a portion of the third surface.

8. The display panel according to claim 7, wherein: The cross section of the protrusion is triangular, and the fourth surface is completely fitted and connected to the third surface.

9. The display panel according to claim 7, wherein: The cross section of the protrusion is trapezoidal; In the bent state, a notch is formed in the middle of the third surface, thereby forming a glue overflow groove C1 between the fourth surface and the third surface.

10. The display panel according to any one of claims 1 to 3, characterized in that: The display panel further includes a second supporting structure, the second supporting structure is plate-shaped, and the Vickers hardness of the second supporting structure is not less than 100 HV, or the Shore hardness of the second supporting structure is A24 to D80; The second supporting structure has a bending support segment, which is arranged on the inner side of the bending area, and the bending support segment is in contact with the inner side of the bending area.

11. The display panel according to claim 10, wherein: The second support structure further includes a first support plane segment and a second support plane segment respectively connected to both sides of the bent support segment; The first supporting plane segment is connected to the chip-on-film of the first plane area; the orthographic projection of the first adhesive layer on the display module is located within the orthographic projection of the second supporting plane segment on the display module, and the second supporting plane segment is located between the first adhesive layer and the chip-on-film.

12. The display panel according to claim 10, wherein: The second supporting structure is made of memory alloy.

13. The display panel according to claim 10, wherein: The display panel further includes a first supporting structure; The second supporting structure is located on a side of the first supporting structure away from the chip-on-film.

14. A display device, characterized in that: A display panel according to any one of claims 1 to 13.

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