Composite member, joined body, and holding device

Abstract

The composite material of the composite component made of the composite material comprises aluminum nitride and silicon carbide, and the content of the aluminum nitride is larger than that of the silicon carbide.

Description

Technical Field

[0001] The present invention relates to a composite component, a joint body and a holding device. Background Art

[0002] Composite components made of multiple materials are known. For example, Patent Documents 1 and 2 disclose composite components containing silicon carbide as the primary constituent phase and also including titanium silicide, titanium carbide, and the like. Furthermore, Patent Document 3 discloses a composite component containing titanium silicide as the primary constituent phase and also including silicon carbide, titanium carbide, and the like.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent No. 6182082

[0006] Patent Document 2: Japanese Patent No. 5666748

[0007] Patent Document 3: Japanese Patent Application Laid-Open No. 2021-116218 Summary of the Invention

[0008] Problems to be solved by the invention

[0009] However, existing technologies such as those described in Patent Documents 1 to 3 still leave room for improvement in improving thermal conductivity and increasing the thermal expansion coefficient in composite components. For example, the composite components described in Patent Documents 1 and 2 contain silicon carbide particles, while the composite component described in Patent Document 3 contains titanium silicide particles. As a result, gaps are likely to form between the particles within the composite component, hindering heat transfer and potentially reducing thermal conductivity.

[0010] An object of the present invention is to provide a technology for improving thermal conductivity and increasing the thermal expansion coefficient in a composite member.

[0011] Solutions for solving problems

[0012] The present invention has been made to solve at least a part of the above-mentioned problems, and can be implemented as the following aspects.

[0013] (1) According to one embodiment of the present invention, there is provided a composite member made of a composite material. In the composite member, the composite material contains aluminum nitride and silicon carbide, and the content of aluminum nitride is greater than the content of silicon carbide.

[0014] According to this configuration, the content of aluminum nitride in the composite component is greater than that of silicon carbide. As a result, a solid solution of aluminum nitride is easily formed between silicon carbide particles within the composite component. Therefore, heat transfer through the solid solution of aluminum nitride is more facilitated than in composite components primarily composed of silicon carbide. Consequently, the thermal conductivity of the composite component is increased, thereby enhancing the thermal conductivity of the composite component. Furthermore, compared to composite components primarily composed of silicon carbide, the content of aluminum nitride, which has a high thermal expansion coefficient, is greater, thereby increasing the thermal expansion coefficient of the composite component.

[0015] (2) In the composite member of the above embodiment, a titanium compound may be included as the composite material. According to this configuration, the composite member includes a titanium compound, thereby enabling control of the thermal expansion coefficient of the composite member formed of aluminum nitride and silicon carbide. Thus, for example, when other components that reach high temperatures are bonded to the composite member and the composite member is used as a heat dissipation member, it is possible to suppress the other components from being separated from the composite member due to differences in thermal expansion. As a result, the composite member can efficiently release heat from other components (dissipate heat) while maintaining a bonded state with the other components.

[0016] (3) In the composite member of the above embodiment, the aluminum nitride content can be 10% by mass or more and 50% by mass or less. With this configuration, the composite member contains a certain amount of aluminum nitride, which makes it relatively easy to control properties such as the thermal expansion coefficient. This makes it possible to easily control the thermal expansion coefficient of the composite member.

[0017] (4) In the composite component of the above embodiment, the content of silicon carbide can be greater than 1% by mass and less than 30% by mass. With this configuration, the composite component contains a larger amount of aluminum nitride than silicon carbide. This facilitates the formation of a solid solution of aluminum nitride, further reducing the gaps between silicon carbide particles and facilitating heat transfer. Consequently, the thermal conductivity of the composite component can be further improved.

[0018] (5) In the composite member of the above embodiment, the thermal conductivity can be 80 W / (m·K) or higher. According to this configuration, a solid solution of aluminum nitride is formed between silicon carbide particles within the composite member, thereby enabling the thermal conductivity of the composite member to be 80 W / (m·K) or higher.

[0019] (6) According to another embodiment of the present invention, a joint body is provided. The joint body comprises the above-mentioned composite member and a ceramic material joined to the composite member. According to this configuration, the joint body comprises the ceramic material joined to the composite member that easily transfers heat. As a result, heat from the ceramic material can be efficiently released through the composite member, thereby suppressing damage to the joint body caused by heat.

[0020] (7) In the joint body of the above embodiment, the difference between the thermal expansion coefficient of the composite member and the thermal expansion coefficient of the ceramic material may be 0.3×10 -6 According to this structure, the difference between the thermal expansion coefficient of the composite member and the thermal expansion coefficient of the ceramic material is 0.3×10 -6 / K or less, so even when the bonded structure reaches a high temperature, it is possible to suppress the ceramic material from being separated from the composite member due to thermal expansion. Therefore, it is possible to suppress damage to the bonded structure caused by heat.

[0021] (8) In the above-described joint structure, the ceramic material may be formed of alumina. With this configuration, the ceramic material is formed of alumina, which has relatively low thermal conductivity, but is joined to a composite member that easily transfers heat. This allows the heat of the ceramic material formed of alumina to be efficiently released through the composite member, thereby suppressing damage to the joint structure caused by heat.

[0022] (9) In the joint structure of the above-described embodiment, the composite member and the ceramic material may be joined by metal bonding. According to this configuration, the composite member and the ceramic material are joined by metal bonding, which relatively easily transfers heat. As a result, heat from the ceramic material is relatively easily transferred to the composite member, and thus the heat of the ceramic material can be released more efficiently via the composite member. Therefore, damage to the joint structure caused by heat can be suppressed.

[0023] (10) According to another embodiment of the present invention, a holding device is provided. The holding device includes the above-mentioned joint body, the ceramic material has a chuck electrode, and the composite component has a cooling function. According to this configuration, the holding device can use the chuck electrode of the ceramic material to hold the object. In this case, the heat of the ceramic material is transferred to the composite component that easily transfers heat, and can be released to the outside of the joint body through the cooling function of the composite component. As a result, damage to the holding device caused by heat can be suppressed.

[0024] The present invention can be implemented in various forms, for example, as a method for manufacturing a composite member and a joint, an apparatus including the composite member and the joint, a system including a holding device, and a control method for these apparatuses and systems. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a perspective view of the holding device according to the first embodiment.

[0026] Figure 2 This is a cross section of the holding device according to the first embodiment.

[0027] Figure 3 It is a diagram illustrating a cross section of the composite member according to the first embodiment.

[0028] Figure 4 This is a diagram illustrating the mixing ratio of raw materials in samples used in the evaluation test.

[0029] Figure 5 It is a figure which shows the result of an evaluation test. DETAILED DESCRIPTION

[0030] <First embodiment>

[0031] Figure 1 It is a perspective view of the holding device 100 according to the first embodiment. Figure 2 : is a cross section of the holding device 100 of the first embodiment. The holding device 100 of the first embodiment is, for example, an electrostatic chuck that holds a wafer W by adsorbing it with electrostatic attraction, and is provided in an etching device or the like. The holding device 100 includes a bonded body 1, which includes a ceramic material 10, a composite member 20, and a bonding portion 30. In the bonded body 1, as shown in FIG. Figure 1 As shown, a ceramic material 10, a joint portion 30, and a composite member 20 are stacked in order from the positive side in the z-axis direction (stacking direction). In this embodiment, the joint 1 is a columnar body having a substantially circular cross-section perpendicular to the stacking direction. It should be noted that the figures schematically illustrate the configuration of the various components and do not accurately represent the ratio of the dimensions of the various components.

[0032] The ceramic material 10 is a substantially circular flat plate member formed of aluminum oxide (Al2O3). The ceramic material 10 has a pair of main surfaces 10a and 10b (see Figure 2 ). A loading surface for loading the wafer W is formed on one of the main surfaces 10a of a pair of main surfaces 10a and 10b. The wafer W loaded on the loading surface is adsorbed and fixed to the loading surface by the electrostatic attraction generated by the chuck electrode 11 arranged inside the ceramic material 10. A heating electrode (not shown) for heating the wafer W adsorbed and fixed to the loading surface may also be built into the ceramic material 10. It should be noted that the material forming the ceramic material 10 may also be aluminum nitride (AlN), zirconium oxide (ZrO2), silicon nitride (Si3N4), silicon carbide (SiC), yttrium oxide (Y2O3), etc.

[0033] The composite component 20 is a sintered component made of a composite material, including aluminum nitride (AlN), silicon carbide (SiC), and a titanium compound. In the composite component 20 of the present embodiment, the content of aluminum nitride is greater than the content of silicon carbide. Specifically, the content of aluminum nitride is greater than 10% by mass and less than 50% by mass, while the content of silicon carbide is greater than 1% by mass and less than 30% by mass. As a result, the thermal conductivity of the composite component 20 is greater than 80 W / (m·K). In the present embodiment, the difference between the thermal expansion coefficient of the composite component 20 and the thermal expansion coefficient of the ceramic material 10 is 0.3×10 -6 / K or less. Figure 2 As shown, the composite member 20 has a plurality of refrigerant flow paths 21 for allowing the refrigerant to flow.

[0034] Figure 3 It is a diagram illustrating a cross section of the composite member 20 according to the first embodiment. Figure 3 Schematically shows a cross section of the composite member 20 photographed using a scanning electron microscope (SEM). Figure 3 In the cross-sectional view shown, silicon carbide (area R1 indicated by dashed hatching), aluminum nitride (area R2 indicated by dotted hatching), and titanium compound (area R3 indicated by dotted hatching) appear. The silicon carbide, aluminum nitride, and titanium compound in the cross section of the composite member 20 are distinguished by Figure 3 The cross-section shown was analyzed by comparing with the results of energy dispersive X-ray analysis of the same cross-section.

[0035] like Figure 3 As shown, silicon carbide is contained in a particle state, while aluminum nitride is contained as a solid solution. As a result, within composite member 20, the gaps between silicon carbide particles, which act as a barrier to heat transfer, are filled with the aluminum nitride solid solution. Consequently, composite member 20 has a higher thermal conductivity than composite members composed primarily of silicon carbide particles, thereby improving thermal conductivity.

[0036] like Figure 3 As shown in the cross-sectional view of FIG, the titanium compound contained in the composite member 20 occupies a large portion of the cross-section of the composite member 20. Therefore, the ease with which the composite member 20 thermally expands is determined by the ease with which the titanium compound thermally expands. Therefore, the inclusion of the titanium compound can adjust the degree of thermal expansion of the composite member 20.

[0037] The joint 30 is disposed between the other main surface 10b of the pair of main surfaces 10a and 10b of the ceramic material 10 and the composite member 20. The joint 30 joins the ceramic material 10 and the composite member 20. In this embodiment, the joint 30 is a metal compound composed of Al—Mg. This facilitates heat transfer between the ceramic material 10 and the composite member 20.

[0038] Next, the evaluation test of the composite member is described. In this evaluation test, by changing the raw material mixing ratio and firing temperature when manufacturing the composite member, multiple composite members with different constituent phase contents were produced, and the thermal conductivity and thermal expansion coefficient of each were evaluated and compared.

[0039] Figure 4This is a diagram illustrating the mixing ratio of raw materials in the samples of the composite components used in this evaluation test. First, the method for preparing the samples used in this evaluation test is described. In this evaluation test, 8 samples were prepared as samples for evaluation. The 8 samples were prepared by mixing Figure 4 At least three of the five raw materials shown are formed and used Figure 4 The five raw materials used were particles having the following particle sizes.

[0040] SiC: 15.5 μm (average particle size)

[0041] AlN: 15μm (median value)

[0042] Si: 10.12 μm (average particle size)

[0043] Ti: 27 μm (average particle size)

[0044] TiSi2: 5-10 μm (average particle size)

[0045] like Figure 4 As shown, Samples 1 and 2 do not use aluminum nitride and titanium silicide (TiSi2) as raw materials. Samples 3 through 8 use a larger amount of aluminum nitride than silicon carbide as raw materials. Samples 6 and 8 differ from Samples 3 through 5 and 7 in that titanium silicide is used instead of silicon as a raw material. The firing temperature is 1450°C for Sample 2 and 1400°C for all samples except Sample 2.

[0046] Figure 5 It is a figure which shows the result of this evaluation test. Figure 5 For each of Samples 1 to 8, the contents of the five constituent phases (unit: mass %), thermal conductivity (unit: W / (m·K)), thermal expansion coefficient (unit: ×10 -6 / K) and apparent density (g / cm 3 The contents of the five constituent phases in the sample were determined using an X-ray diffraction apparatus (measurement conditions: CuKα, 40 kV, 40 mA, 2θ = 5-70°) using a mortar-ground sample. Thermal conductivity was measured using a laser flash method.

[0047] In this evaluation test, eight samples were evaluated based on the thermal conductivity and thermal expansion coefficient obtained by bonding with alumina, assuming that the composite member was bonded to a ceramic material composed of alumina. The thermal conductivity of alumina (Al2O3) is approximately less than 30 W / (m·K), and the thermal expansion coefficient is approximately 7.65×10 -6 / K. Therefore, when the sample is used as a composite member bonded to a ceramic material composed of alumina, the thermal conductivity of the sample is preferably 80 W / (m·K) or more, which is more than twice the thermal conductivity of alumina. The thermal expansion coefficient of the sample is preferably within ±0.3×10 -6 / K within 7.35~7.95×10 -6 Hereinafter, the thermal conductivity of 80 W / (m·K) is referred to as the “reference thermal conductivity”, and the thermal conductivity of 7.35 to 7.95×10 -6 The thermal expansion coefficient of / K is called the "base thermal expansion coefficient".

[0048] As described above, Samples 1 and 2 do not contain aluminum nitride as a raw material and therefore do not contain aluminum nitride as a constituent phase. It can be seen that in Sample 1, the thermal expansion coefficient is the baseline thermal expansion coefficient, but the thermal conductivity is less than the baseline thermal conductivity. On the other hand, it can be seen that in Sample 2, which uses the same raw materials and blending ratio as Sample 1 but is fired at a higher temperature than Sample 1, although the thermal conductivity is greater than the baseline thermal conductivity, the thermal expansion coefficient is less than the baseline thermal expansion coefficient. Therefore, in Sample 1, the heat of the ceramic material is difficult to release, and in Sample 2, the joint body may be damaged due to the thermal expansion difference.

[0049] On the other hand, in samples 3 to 8, the content of aluminum nitride contained as a constituent phase is greater than the content of silicon carbide. Specifically, the content of aluminum nitride in samples 3 to 8 is greater than 10% by mass and less than 50% by mass, and the content of silicon carbide is greater than 1% by mass and less than 30% by mass. As a result, the thermal conductivity of each of samples 3 to 8 is greater than the baseline thermal conductivity, and the thermal expansion coefficient is the same as or greater than the baseline thermal expansion coefficient. Therefore, it is clear that while suppressing the damage of the joint body caused by the thermal expansion difference, it is easy to release the heat of the ceramic material (easy to dissipate heat).

[0050] According to the composite member 20 of the present embodiment described above, the content of aluminum nitride in the composite member 20 is greater than the content of silicon carbide. As a result, a solid solution of aluminum nitride is easily formed between silicon carbide particles within the composite member 20. Therefore, heat transfer is facilitated through the solid solution of aluminum nitride, compared to composite members primarily composed of silicon carbide. Consequently, the thermal conductivity of the composite member 20 is increased, thereby enhancing the thermal conductivity of the composite member 20. Furthermore, the composite member 20 contains a greater content of aluminum nitride, which has a higher coefficient of thermal expansion, than composite members primarily composed of silicon carbide. This increases the thermal expansion coefficient of the composite member 20.

[0051] Furthermore, in general, in composite components containing a large amount of silicon carbide particles, the distribution of silicon carbide within the composite component deviates. Consequently, the thermal conductivity within the composite component becomes uneven. For example, when the composite component is used as a component for transferring heat, heat is not transferred evenly. In the composite component 20 of this embodiment, since a solid solution of aluminum nitride is easily formed between the silicon carbides, the thermal conductivity within the composite component 20 is easily uniform. In other words, the uniformity of the thermal conductivity within the composite component 20 can be improved, thereby improving the thermal conductivity of the composite component 20. Thus, when the composite component 20 is used as a component for transferring heat, heat can be transferred evenly, thereby enabling stable heat release.

[0052] Furthermore, in the composite member 20 of this embodiment, the content of silicon carbide is lower than the content of aluminum nitride. This reduces the content of silicon carbide, which is relatively difficult to process, in the composite member 20, thereby improving the workability of the composite member 20. Furthermore, the surface roughness of the composite member 20 can be improved.

[0053] Furthermore, according to the composite member 20 of this embodiment, the inclusion of a titanium compound in the composite member 20 allows the thermal expansion coefficient of the composite member 20, which is formed of aluminum nitride and silicon carbide, to be controlled. Consequently, in the joined body 1, by making the thermal expansion coefficient of the composite member 20 close to that of the ceramic material 10, it is possible to suppress separation of the ceramic material 10 from the composite member 20 due to the difference in thermal expansion. Consequently, the composite member 20 can efficiently dissipate heat from the ceramic material 10, thereby improving the thermal conductivity of the composite member 20 and suppressing damage to the joined body 1.

[0054] Furthermore, according to the composite member 20 of this embodiment, the content of aluminum nitride is 10% to 50% by mass. That is, the composite member 20 contains a certain amount of aluminum nitride, which makes it relatively easy to control properties such as the thermal expansion coefficient. Therefore, the thermal expansion coefficient of the composite member 20 can be easily controlled.

[0055] Furthermore, according to the composite member 20 of this embodiment, the silicon carbide content is between 1% and 30% by mass. That is, the aluminum nitride content in the composite member 20 is higher than the silicon carbide content. This facilitates the formation of a solid solution of aluminum nitride between the silicon carbides, further reducing the gaps between the silicon carbide particles and facilitating heat transfer. Consequently, the thermal conductivity of the composite member 20 can be further improved.

[0056] Furthermore, according to the composite member 20 of the present embodiment, aluminum nitride forms a solid solution between silicon carbides within the composite member 20 , so that the thermal conductivity of the composite member 20 can be made 80 W / (m·K) or more.

[0057] Furthermore, the bonded structure 1 of this embodiment includes the ceramic material 10 bonded to the heat-conducting composite member 20. This allows heat from the ceramic material 10 to be efficiently released through the composite member 20, thereby suppressing heat-induced damage to the bonded structure 1.

[0058] In addition, according to the joint body 1 of this embodiment, the difference in thermal expansion coefficient between the composite member 20 and the ceramic material 10 is 0.3×10 -6 Therefore, even when the bonded structure 1 reaches a high temperature, it is possible to suppress the ceramic material 10 from being separated from the composite member 20 due to thermal expansion. Therefore, it is possible to suppress damage to the bonded structure 1 caused by heat.

[0059] Furthermore, according to the joined body 1 of this embodiment, the ceramic material 10 is formed of alumina, which has relatively low thermal conductivity, but is joined to the composite member 20, which easily transfers heat. This allows the heat of the ceramic material 10 formed of alumina to be efficiently dissipated through the composite member 20, thereby suppressing damage to the joined body 1 caused by heat.

[0060] Furthermore, according to the joined body 1 of this embodiment, the composite member 20 and the ceramic material 10 are joined at a joint portion 30 formed by a metal joint that relatively easily transfers heat. This facilitates the transfer of heat from the ceramic material 10 to the composite member 20, allowing the heat from the ceramic material 10 to be released more efficiently via the composite member 20. Consequently, damage to the joined body 1 caused by heat can be suppressed.

[0061] Furthermore, the holding device 100 of this embodiment is an electrostatic chuck, and can hold the wafer W using the chuck electrode 11 of the ceramic material 10. In this case, heat from the ceramic material 10 is transferred to the composite member 20, which easily transfers heat, and can be released to the exterior of the bonded structure 1 via the refrigerant flowing through the refrigerant flow path 21 of the composite member 20. This can prevent damage to the holding device 100 caused by heat.

[0062] <Modification of this embodiment>

[0063] The present invention is not limited to the above-described embodiment, and can be implemented in various forms without departing from the spirit and scope of the present invention. For example, the following modifications are also possible.

[0064] [Variation 1]

[0065] In the above embodiment, the composite member 20 contains a titanium compound. The composite member may not contain a titanium compound, but the thermal expansion coefficient of the composite member can be adjusted by adjusting the content of the titanium compound.

[0066] [Variation 2]

[0067] In the above embodiment, the aluminum nitride content of the composite member 20 is 10% to 50% by mass. The aluminum nitride content is not limited to this. Preferably, the aluminum nitride content is greater than the silicon carbide content. A relatively high aluminum nitride content facilitates control of the composite member's thermal expansion coefficient.

[0068] [Variation 3]

[0069] In the above-described embodiment, the silicon carbide content of the composite member 20 is 1% by mass or greater and 30% by mass or less. The silicon carbide content is preferably lower than the aluminum nitride content. A relatively low silicon carbide content facilitates the formation of a solid solution with aluminum nitride, further reducing the gaps between silicon carbide particles and facilitating heat transfer. Consequently, the thermal conductivity of the composite member can be further improved.

[0070] [Variation 4]

[0071] In the above embodiment, the thermal conductivity is set to 80 W / (m·K) or more to facilitate heat dissipation of the ceramic material 10 when the bonded body is used as an electrostatic chuck. However, the thermal conductivity of the composite member is not limited thereto.

[0072] [Variation 5]

[0073] In the above embodiment, the joint body 1 includes the ceramic material 10, the composite member 20, and the joint portion 30. However, the structure of the joint body 1 is not limited thereto. The material forming the member to be joined to the composite member 20 is not limited to ceramics such as alumina, and the difference in thermal expansion coefficient between the member and the composite member is not limited to 0.3×10 -6 / K or less. The joint does not need to be a metal joint. Any structure that can utilize the high thermal conductivity of the composite member may be sufficient.

[0074] [Variation 6]

[0075] In the above embodiment, the bonded structure 1 is used for the holding device 100 , but the application field of the bonded structure 1 is not limited thereto, and the bonded structure 1 can be applied to any field where the high thermal conductivity of the composite member can be utilized.

[0076] The present invention has been described above based on its embodiments and variations. However, the embodiments described above are intended to facilitate understanding of the present invention and do not limit the present invention. The present invention may be modified and improved without departing from the scope of its subject matter and the claims, and equivalents thereof are included in the present invention. In addition, if a technical feature is not described as an essential feature in this specification, it may be deleted as appropriate.

[0077] (Application Example 1)

[0078] A composite component, characterized in that it is a composite component made of composite materials.

[0079] The composite material comprises aluminum nitride and silicon carbide,

[0080] The content of aluminum nitride is greater than that of silicon carbide.

[0081] (Application Example 2)

[0082] The composite member according to Application Example 1 is characterized by further comprising a titanium compound as the composite material.

[0083] (Application Example 3)

[0084] The composite member according to Application Example 1 or Application Example 2 is characterized in that the content of aluminum nitride is 10 mass % or more and 50 mass % or less.

[0085] (Application Example 4)

[0086] The composite member according to Application Example 1 or Application Example 2 is characterized in that the content of silicon carbide is 1 mass % or more and 30 mass % or less.

[0087] (Application Example 5)

[0088] The composite member according to any one of Application Examples 1 to 4 is characterized in that the thermal conductivity is 80 W / (m·K) or more.

[0089] (Application Example 6)

[0090] A joint body, characterized by comprising:

[0091] The composite member described in any one of Application Examples 1 to 5; and

[0092] A ceramic material is bonded to the composite component.

[0093] (Application Example 7)

[0094] The bonded body according to Application Example 6 is characterized in that the difference between the thermal expansion coefficient of the composite member and the thermal expansion coefficient of the ceramic material is 0.3×10 -6 / K or less.

[0095] (Application Example 8)

[0096] The bonded body according to Application Example 6 or Application Example 7 is characterized in that the ceramic material is formed of aluminum oxide.

[0097] (Application Example 9)

[0098] The joined body according to any one of Application Examples 6 to 8 is characterized in that the composite member and the ceramic material are joined by metal joining.

[0099] (Application Example 10)

[0100] A holding device, characterized by comprising:

[0101] The conjugate described in any one of Application Examples 6 to 9,

[0102] The ceramic material has a chuck electrode,

[0103] The composite component has a cooling function.

[0104] Description of Reference Numerals

[0105] 1…Retention device

[0106] 10…ceramic components

[0107] 11…Chuck electrode

[0108] 20…Composite components

[0109] 21…Refrigerant flow path

Claims

1. A composite component, characterized in that: It is a composite component made of composite materials. The composite material comprises aluminum nitride and silicon carbide, The content of aluminum nitride is greater than that of silicon carbide.

2. The composite component according to claim 1, characterized in that A titanium compound is also included as the composite material.

3. The composite component according to claim 1 or claim 2, characterized in that: The content of aluminum nitride is 10 mass % or more and 50 mass % or less.

4. The composite component according to claim 1 or claim 2, characterized in that: The content of silicon carbide is 1 mass % or more and 30 mass % or less.

5. The composite component according to claim 1 or claim 2, characterized in that: The thermal conductivity is 80W / (m·K) or more.

6. A conjugate, characterized in that: have: The composite member according to claim 1 or claim 2, and A ceramic material is bonded to the composite component.

7. The joint body according to claim 6, characterized in that The difference between the thermal expansion coefficient of the composite component and the thermal expansion coefficient of the ceramic material is 0.3×10 -6 / K or less.

8. The joint body according to claim 6, characterized in that The ceramic material is formed of aluminum oxide.

9. The joint body according to claim 6, characterized in that The composite member and the ceramic material are joined by metallic joining.

10. A holding device, characterized in that: A method comprising: providing the bonded body according to claim 6, The ceramic material has a chuck electrode, The composite component has a cooling function.

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