Multiple structures and foldable electronic device including same

Abstract

A foldable electronic device (100) according to the present invention comprises: a first case (110); a second housing (120); a hinge structure (164a) coupled to the first housing (110) and the second housing (120); a hinge housing (165) in which the hinge structure (164a) is arranged; a first dustproof structure (811) and a second dustproof structure (812) arranged between the first housing (110) and the hinge housing (165); and a first support structure (821) arranged between the first dust prevention structure (811) and the second dust prevention structure (812) in a longitudinal direction of the hinge housing (165), the first dust prevention structure (811) and the first support structure (821) may be in contact with each other or may be spaced apart from each other by a distance less than a length of the first support structure (821), the second dust-proof structure (812) and the first support structure (821) may be in contact with each other or may be spaced apart from each other by a distance less than a length of the first support structure (821), and at least a portion of each of the first dust-proof structure (811) and the second dust-proof structure (812) may be in contact with a first portion (621) of an outer surface of the hinge housing (165) in an unfolded state or a folded state of the electronic device.

Description

Technical Field

[0001] Embodiments of the present disclosure described herein relate to a plurality of structures and a foldable electronic device including the plurality of structures. Background Art

[0002] Portable electronic devices (such as smartphones) can provide a variety of functions based on various types of applications, as well as call functions. In the process of providing these functions, the portable electronic device can output a screen corresponding to each function. Users may want to use a wider screen when using various functions. However, in typical portable electronic devices, when the display device is expanded to display the screen, the overall size increases, and thus portability is degraded. Therefore, foldable portable electronic devices are being developed to increase the screen size while maintaining portability. Summary of the Invention

[0003] Technical issues A foldable electronic device typically includes at least one folding axis along which the foldable electronic device can fold. The foldable electronic device may include a first housing, a second housing, and a hinge structure coupled to the first housing and the second housing. The foldable electronic device may be configured to fold about the hinge structure. When the foldable electronic device is folded, the components of the foldable electronic device need to move relative to each other (e.g., about the folding axis in the hinge structure). Therefore, it may be difficult to maintain a seal around and within the hinge structure to prevent contaminants, such as dust and other particles, from entering the electronic device at the hinge structure.

[0004] Because contaminants can interfere with the function of electronic devices, such as by blocking airflow or creating undesirable conductivity between components, it is desirable to prevent contaminants from entering electronic devices. Therefore, it is desirable to prevent contaminants from entering foldable electronic devices via the hinge structure.

[0005] Additionally, if one or more components of a foldable electronic device move in an unintended manner when the foldable electronic device is folded, such that at least one component of the electronic device is not in the intended position relative to another component of the foldable electronic device, a portion of the foldable electronic device may experience unexpected or unintended deformation. This deformation can damage the components of the foldable electronic device, especially if it occurs repeatedly. Therefore, it is desirable that the components of the electronic device move in an intended manner and remain in their intended positions when the foldable electronic device is folded.

[0006] Technical Solution According to at least one embodiment of the present disclosure, a foldable electronic device (or a portable electronic device, a portable communication device, or a foldable electronic device with a communication function) includes: a first shell; a second shell; a hinge structure coupled to the first shell and the second shell; a hinge shell in which the hinge structure is disposed; a first dustproof structure and a second dustproof structure disposed between the first shell and the hinge shell; and a first support structure disposed between the first dustproof structure and the second dustproof structure in the longitudinal direction of the hinge shell. According to at least one embodiment of the present disclosure, the first dustproof structure and the first support structure are in contact with each other or spaced apart from each other by a distance less than the length of the first support structure. According to at least one embodiment of the present disclosure, the second dustproof structure and the first support structure are in contact with each other or spaced apart from each other by a distance less than the length of the first support structure.

[0007] According to at least one embodiment of the present disclosure, a foldable electronic device includes: a first shell; a second shell; a hinge structure coupled to the first shell and the second shell; a hinge shell accommodating at least a portion of the hinge structure and substantially disposed between the first shell and the second shell; at least one first structure disposed between an inner surface of the first shell and an outer surface of the hinge shell and at least partially in contact with a first portion of the outer surface of the hinge shell when the foldable electronic device changes from an unfolded state to a folded state; and at least one second structure disposed between the inner surface of the first shell and the outer surface of the hinge shell so as to be adjacent to the first structure and at least partially in contact with a second portion of the outer surface of the hinge shell, different from the first portion, when the foldable electronic device changes from an unfolded state to a folded state. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a view showing an unfolded state of the electronic device according to the embodiment.

[0009] Figure 2 is a diagram showing a method according to an embodiment of the present invention. Figure 1 A view of a folded state of an electronic device.

[0010] Figure 3 is an exploded perspective view of a portable communication device or an electronic device according to an embodiment.

[0011] Figure 4 is an exploded perspective view showing a configuration in which a plurality of structures are installed in an electronic device according to an embodiment.

[0012] Figure 5 are views illustrating examples of various structures according to the embodiment.

[0013] Figure 6 is a view illustrating a deployed state of an electronic device including a plurality of structures according to an embodiment.

[0014] Figure 7 is a view illustrating a folded state of an electronic device including a plurality of structures according to an embodiment.

[0015] Figure 8 are views showing examples of first and second structures of an electronic device according to an embodiment.

[0016] Figures 9a to 9f 2 is a diagram illustrating a dustproof structure and a supporting structure of an electronic device according to an embodiment.

[0017] Figure 10 1 is a view illustrating an example of the widths of the dustproof structure and the supporting structure of the electronic device according to the embodiment.

[0018] Figure 11 A dustproof structure and a supporting structure according to an embodiment are shown.

[0019] Figure 12 : is a view showing an example of a height relationship between a dustproof structure and a supporting structure according to an embodiment.

[0020] Figure 13 is a view illustrating a supporting structure included in an electronic device according to an embodiment.

[0021] Figure 14 1 and 2 are views illustrating an example of an assembling process between a first housing and a supporting structure of the electronic device according to the embodiment.

[0022] Figure 15 2 is a diagram illustrating an example of a method of manufacturing an electronic device according to an embodiment.

[0023] Figure 16 Views showing a support structure according to an embodiment.

[0024] Figure 17 2 is a view illustrating an assembling process of a support structure including a channel and a first housing according to an embodiment.

[0025] Figure 18 1 and 2 are views illustrating an assembling process of a support structure and a first housing including a guide recess according to an embodiment.

[0026] Figure 19 is a view illustrating an electronic device including a support structure assembled to a housing in a sliding manner according to an embodiment.

[0027] Figure 20 is a view illustrating an electronic device including a support structure assembled to a housing in a sliding manner according to an embodiment.

[0028] Figure 21is a view illustrating an electronic device including a support structure assembled to a housing in a sliding manner according to an embodiment.

[0029] Figure 22 1 and 2 are views illustrating an example of a sliding operation of a supporting structure assembled with a first housing of the electronic device according to the embodiment. DETAILED DESCRIPTION

[0030] Hereinafter, at least one embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0031] Embodiments of the present disclosure provide multiple structures having support structures and dustproof structures, and foldable electronic devices including the multiple structures. The dustproof structure is a structure that blocks some, most, or all dust, particles, contaminants, or foreign matter from passing through. The dustproof structure included in the electronic device can prevent some, most, or all dust, particles, contaminants, or foreign matter from entering the electronic device through a specific path at least partially blocked by the dustproof structure.

[0032] Embodiments of the present disclosure provide a plurality of structures for maintaining a constant gap between each of a first housing and a second housing and a hinge housing by a support structure in close contact with a dustproof structure, and a foldable electronic device including the plurality of structures.

[0033] The support structure can be arranged between components of the foldable electronic device, for example, between the first housing or the second housing and the hinge housing or hinge structure. When the first housing or the second housing is pushed toward the hinge housing or the hinge structure, the support structure can resist the movement of the first housing or the second housing toward the hinge housing or the hinge structure. When the hinge housing or the hinge structure is pushed toward the first housing or the second housing, the support structure can resist the movement of the hinge housing or the hinge structure toward the first housing or the second housing.

[0034] Embodiments of the present disclosure provide multiple structures for preventing or reducing the infiltration of external foreign matter between each of a first shell and a second shell and a hinge shell and / or between the dustproof structure and the supporting structure by bringing the dustproof structure into close contact with the supporting structure, as well as a foldable electronic device including the multiple structures.

[0035] A foldable electronic device according to an embodiment of the present disclosure may include multiple structures. Technology related to a dustproof structure among the multiple structures is disclosed in Korean Patent Publication No. 10-2021-0047139 (published on April 29, 2021, and titled "Electronic Device Including Dustproof Structure"; inventor Hee-cheol MOON), which was first filed by the present applicant. As described in Korean Patent Publication No. 10-2021-0047139, a foldable electronic device may include a dustproof structure to prevent or reduce the infiltration of external foreign matter.

[0036] In the detailed description of the present disclosure, various other aspects and effects provided by the structures according to various embodiments and the electronic device including the structures may be mentioned depending on the embodiments.

[0037] Figure 1 2 is a view illustrating an unfolded state of the electronic device 100 according to an embodiment of the present disclosure. Figure 2 The present invention is shown in the embodiment of the present invention. Figure 1 FIG. 1 is a view of the folded state of the electronic device 100 .

[0038] In the detailed description below, a configuration in which a pair of housings are coupled via a hinge structure so as to be rotatable will be described. However, it should be noted that this embodiment does not limit the portable communication devices or electronic devices according to various embodiments of the present disclosure. For example, the portable communication devices or electronic devices according to various embodiments of the present disclosure may include two or more housings, and the "pair of housings" in the embodiments disclosed below may mean "two housings of the two or more housings coupled to each other so as to be rotatable."

[0039] Reference Figure 1 , the electronic device 100 (or foldable electronic device, portable electronic device, portable communication device or portable device) may include a hinge structure (eg, Figure 3The electronic device 100 includes a pair of housings 110 and 120 rotatably coupled together (with a hinge structure 164a) so as to fold relative to each other, a hinge housing 165 covering the foldable portions of the pair of housings 110 and 120, and a display 130 (e.g., a flexible display or a foldable display) disposed or accommodated in the space formed by the pair of housings 110 and 120. The hinge housing 165 may be located between at least a portion of the first housing 110 and at least a portion of the second housing 120. The hinge structure 164a may be disposed between the display 130 and the hinge housing 165 and may be connected to the first housing 110 and the second housing 120. In an embodiment, the electronic device 100 may include a foldable housing coupled so as to be rotatable from a position in which the pair of housings 110 and 120 are folded to face each other to a position in which the pair of housings 110 and 120 are unfolded to be disposed side by side. In the present disclosure, when the pair of housings 110 and 120 are unfolded to be arranged side by side with each other, the surface on which the display 130 is provided may be defined as the front surface of the electronic device 100, and the surface facing away from the front surface may be defined as the rear surface of the electronic device 100. In addition, the surface surrounding the space between the front surface and the rear surface may be defined as the side surface of the electronic device 100.

[0040] In an embodiment, the pair of housings 110 and 120 may include a first housing 110 having a sensor area 131d, a second housing 120, a first rear cover 140, and a second rear cover 150. The pair of housings 110 and 120 of the electronic device 100 is not limited to Figure 1 and Figure 2 The forms and combinations shown in the figures may be realized by combinations and / or combinations of other shapes or components. For example, in an embodiment, the first housing 110 and the first rear cover 140 may be formed integrally with each other, and the second housing 120 and the second rear cover 150 may be formed integrally with each other. In an embodiment, the first housing 110 may include the first rear cover 140, and the second housing 120 may include the second rear cover 150.

[0041] Depending on the embodiment, the first housing 110 and the second housing 120 may be disposed on opposite sides of a first axis (e.g., folding axis A) and may have completely symmetrical shapes relative to the folding axis A. In an embodiment, the first housing 110 and the second housing 120 may be rotatable about different folding axes relative to the hinge structure 164a or the hinge housing 165. For example, the first housing 110 and the second housing 120 may be coupled to the hinge structure 164a or the hinge housing 165 so as to be rotatable. Depending on the embodiment, by rotating about the folding axis A or a different folding axis, the first housing 110 and the second housing 120 may be rotated between a position in which two different areas of the front surface are folded to face each other, a position in which the two different areas are tilted relative to each other, or a position in which the two different areas are unfolded to be arranged side by side.

[0042] As used herein, the expression "side by side positioning" or "side by side extension" may mean a state in which two structures are at least partially positioned close to each other or a state in which at least the portions positioned close to each other are arranged in parallel. In an embodiment, the expression "side by side arrangement" may mean that the two structures are positioned close to each other and are arranged to face parallel directions or the same direction. In an embodiment, the expression "side by side arrangement" may be interpreted as having a meaning including a state in which the two structures are tilted relative to each other within a range of about 160 degrees to about 180 degrees. In the detailed description below, expressions such as "side by side" and "parallel" may be used. However, these expressions can be easily understood with reference to the accompanying drawings based on the shape or arrangement relationship of the structures.

[0043] Depending on the embodiment, the angle or distance between the first housing 110 and the second housing 120 may vary depending on whether the electronic device 100 is in an unfolded state (or flat state or open state), a folded state (or closed state), or an intermediate state. Depending on the embodiment, the first housing 110 may include a sensor area 131d in addition to the second housing 120, in which various sensors are disposed. However, the first housing 110 and the second housing 120 may have symmetrical shapes in other areas. In embodiments, the sensor area 131d may be disposed in addition to, or in place of, at least a portion of the second housing 120.

[0044] In an embodiment, the first housing 110 may be connected to a hinge structure (eg, Figure 3 The hinge structure 164a of the electronic device 100 may include a first surface 111 facing the front surface of the electronic device 100 when the electronic device 100 is in the unfolded state, a second surface 112 facing away from the first surface 111, and a first side member 113 surrounding at least a portion of the space between the first and second surfaces 111, 112. In an embodiment, the first side member 113 may include a first side surface 113a arranged parallel to the folding axis A, a second side surface 113b extending from one end of the first side surface 113a in a direction perpendicular to the folding axis A, and a third side surface 113c extending from the opposite end of the first side surface 113a in a direction perpendicular to the folding axis A. When describing various embodiments of the present disclosure, the terms "parallel" or "perpendicular" are used with respect to the arrangement relationship between the side surfaces described above. However, in some embodiments, the terms "parallel" or "perpendicular" may also include "partially parallel," "partially perpendicular," "substantially parallel," or "substantially perpendicular." In an embodiment, the terms "parallel" or "perpendicular" may also include an oblique arrangement relationship within a range of approximately 10 degrees or less.

[0045] In an embodiment, the second housing 120 may be connected to a hinge structure (eg, Figure 3 The hinge structure 164a of the electronic device 100 may include a third surface 121 facing the front surface of the electronic device 100 when the electronic device 100 is unfolded, a fourth surface 122 facing away from the third surface 121, and a second side member 123 surrounding at least a portion of the space between the third and fourth surfaces 121, 122. In an embodiment, the second side member 123 may include a fourth side surface 123a parallel to the folding axis A, a fifth side surface 123b extending from one end of the fourth side surface 123a in a direction perpendicular to the folding axis A, and a sixth side surface 123c extending from the opposite end of the fourth side surface 123a in a direction perpendicular to the folding axis A. In an embodiment, the third surface 121 may be arranged to face the first surface 111 when the electronic device 100 is folded. In an embodiment, the second side member 123 may have a shape substantially identical to that of the first side member 113 or may be formed from a material substantially identical to that of the first side member 113, although there may be slight differences in the specific shape.

[0046] In an embodiment, the electronic device 100 may include a receiving portion 101 configured to accommodate the display 130 by combining the structural shapes of the first housing 110 and the second housing 120. The receiving portion 101 may have substantially the same size as the display 130. In an embodiment, due to the sensor area 131d, the receiving portion 101 may have two or more different widths W1 and W2 in a direction perpendicular to the folding axis A. For example, the receiving portion 101 may have a first width W1 between a first portion 120a of the second housing 120 parallel to the folding axis A and a first portion 110a of the first housing 110 formed at the periphery of the sensor area 131d, and a second width W2 formed by a second portion 120b of the second housing 120 and a second portion 110b of the first housing 110 that does not correspond to the sensor area 131d and is parallel to the folding axis A. In this case, the second width W2 may be greater than the first width W1. For example, the receiving portion 101 may have a first width W1 between the first portion 110a of the first housing 110 and the first portion 120a of the second housing 120, which are asymmetrical in shape, and a second width W2 between the second portion 110b of the first housing 110 and the second portion 120b of the second housing 120, which are symmetrical in shape. In an embodiment, the first portion 110a and the second portion 110b of the first housing 110 may have different distances from the folding axis A. The width of the receiving portion 101 is not limited to the example shown. In an embodiment, the receiving portion 101 may have two or more different widths due to the shape of the sensor area 131d or the asymmetrical portions of the first housing 110 and the second housing 120.

[0047] In an embodiment, at least a portion of the first housing 110 and at least a portion of the second housing 120 may be formed from a metal material or a non-metal material having a selected degree of rigidity to support the display 130. In an embodiment, at least a portion of the first housing 110 and at least a portion of the second housing 120 may include a conductive material. When the first housing 110 and the second housing 120 include conductive materials, the electronic device 100 may use the portions of the first housing 110 and the second housing 120 formed from the conductive materials to transmit and receive radio waves. For example, the processor or communication module of the electronic device 100 may use a portion of the first housing 110 and a portion of the second housing 120 to perform wireless communication.

[0048] In an embodiment, the sensor area 131d may have a specific area adjacent to one corner of the first housing 110. However, the arrangement, shape, or size of the sensor area 131d is not limited to the example shown. For example, in an embodiment, the sensor area 131d may be provided in another corner of the first housing 110 or in any area between the upper and lower corners of the first housing 110. In an embodiment, the sensor area 131d may be provided in at least a portion of the second housing 120. In an embodiment, the sensor area 131d may be provided to extend across the first and second housings 110, 120. In an embodiment, the electronic device 100 may include components exposed on the front surface of the electronic device 100 through the sensor area 131d or one or more openings formed in the sensor area 131d, and various functions may be performed by these components. The components provided in the sensor area 131d may include, for example, at least one of a front-facing camera device, a proximity sensor, an illumination sensor, an iris recognition sensor, an ultrasonic sensor, or an indicator.

[0049] In an embodiment, the first back cover 140 may be disposed on the second surface 112 of the first housing 110 and may have a substantially rectangular periphery. In an embodiment, the periphery of the first back cover 140 may be at least partially surrounded by the first housing 110. Similarly, the second back cover 150 may be disposed on the fourth surface 122 of the second housing 120, and at least a portion of the periphery of the second back cover 150 may be surrounded by the second housing 120.

[0050] In the illustrated embodiment, the first back cover 140 and the second back cover 150 may have a substantially symmetrical shape relative to the folding axis A. In embodiments, the first back cover 140 and the second back cover 150 may include a variety of different shapes. In embodiments, the first back cover 140 may be integrally formed with the first housing 110, and the second back cover 150 may be integrally formed with the second housing 120.

[0051] In an embodiment, the first back cover 140, the second back cover 150, the first housing 110 and the second housing 120 can provide a space in which various components of the electronic device 100 (e.g., a printed circuit board, an antenna module, a sensor module, or a battery) are arranged by a structure combined with each other. In an embodiment, one or more components can be set or visually exposed on the rear surface of the electronic device 100. For example, one or more components or sensors can be visually exposed through the first rear area 141 of the first back cover 140. In an embodiment, the sensor can include a proximity sensor, a rear camera device and / or a flash. In an embodiment, at least a portion of the sub-display 152 can be visually exposed through the second rear area 151 of the second back cover 150.

[0052] The display 130 may be disposed in a space formed by the pair of housings 110 and 120. For example, the display 130 may be placed in a receiving portion (eg, Figure 1 The first housing 110 may be provided with a first rear cover 140, a first rear cover 150, and a second rear cover 150. The first rear cover 150 may be provided with a first rear cover 140, a first rear cover 150, and a second rear cover 150. The first rear cover 150 may be provided with a first rear cover 140, a first rear cover 150, and a second rear cover 150.

[0053] In an embodiment, the display 130 may refer to a display whose at least a portion of the area can be deformed into a flat or curved shape. In an embodiment, the display 130 may include a folding portion 131c, a first portion 131a provided on one side of the folding portion 131c (for example, on the right side of the folding portion 131c), and a second portion 131b provided on the opposite side of the folding portion 131c (for example, on the left side of the folding portion 131c). For example, the first portion 131a may be provided on the first surface 111 of the first housing 110, and the second portion 131b may be provided on the third surface 121 of the second housing 120. For example, the display 130 may be provided across Figure 3 The hinge housing 165 or hinge structure 164a extends from the first surface 111 to the third surface 121, and at least a portion corresponding to the hinge housing 165 or hinge structure 164a (for example, the folding portion 131c) may be a flexible portion that can be deformed from a flat shape to a curved shape.

[0054] In the embodiment, the division of the area of ​​the display 130 is illustrative, and the display 130 may be divided into a plurality of areas (eg, four or more areas or two areas) depending on the structure or function of the display 130. For example, in Figure 1 In the embodiment shown, the folded portion 131c can be folded along a vertical axis (e.g., Figure 3 The display 130 may be divided into regions by the folding portion 131c or the folding axis A. However, in an embodiment, the display 130 may be divided into regions with respect to another folding portion (e.g., with respect to the horizontal axis (e.g., Figure 3 x-axis) or another folding axis (e.g., parallel to the x-axis) Figure 3 The above-described division of the display 130 into regions is achieved only by a pair of housings 110 and 120 and a hinge structure (eg, Figure 3 The physical division is performed by the hinge housing 165 or the hinge structure 164a), and basically one display 130 can be provided on a pair of housings 110 and 120 and a hinge structure (eg, Figure 3 The hinge housing 165 or the hinge structure 164a) provides an area or space in which a full screen can be displayed.

[0055] According to an embodiment, the first portion 131a and the second portion 131b may have shapes that are completely symmetrical with each other with respect to the folded portion 131c. However, unlike the second portion 131b, the first portion 131a may include a notch region (eg, Figure 3 In the notch area 133, the first portion 131a may have a shape symmetrical to that of the second portion 131b in other areas. For example, the first portion 131a and the second portion 131b may include portions symmetrical in shape and portions asymmetrical in shape.

[0056] Further references Figure 3 , the hinge housing 165 may be disposed between the first housing 110 and the second housing 120 and may hide internal components (eg, Figure 3 In an embodiment, the hinge housing 165 may be hidden by a portion of the first housing 110 and a portion of the second housing 120, or may be exposed to the outside, depending on the operating state of the electronic device 100 (e.g., the unfolded state or the folded state). For example, the hinge housing 165 may be more exposed to the outside in the folded state than in the unfolded state.

[0057] Hereinafter, operations of the first housing 110 and the second housing 120 and an area of ​​the display 130 according to an operation state (eg, an unfolded state and a folded state) of the electronic device 100 will be described.

[0058] In an embodiment, when the electronic device 100 is in the unfolded state (eg, Figure 1 When the first housing 110 and the second housing 120 are in a 180-degree angle, the first portion 131a and the second portion 131b of the display 130 can be arranged to face the same direction, for example, to display images in parallel directions. In addition, the folding portion 131c can form the same plane as the first portion 131a and the second portion 131b.

[0059] In an embodiment, when the electronic device 100 is in a folded state (eg, Figure 2 ), the first housing 110 and the second housing 120 may be arranged to face each other. For example, when the electronic device 100 is in the folded state (eg, Figure 2 ), the first portion 131a and the second portion 131b of the display 130 may form a narrow angle (eg, an angle between 0 and 10 degrees) and may face each other. Figure 2 , at least a portion of the folded portion 131c may form a curved surface having a specific curvature.

[0060] In an embodiment, when the electronic device 100 is in an intermediate state, the first housing 110 and the second housing 120 may be arranged to form a specific angle, such as a 90-degree or 120-degree angle. For example, in the intermediate state, the first portion 131a and the second portion 131b of the display 130 may form an angle that is larger than the angle in the folded state and smaller than the angle in the unfolded state. At least a portion of the folded portion 131c may form a curved surface having a specific curvature. In this case, the curvature may be smaller than the curvature in the folded state.

[0061] Figure 3 is an exploded perspective view of a portable communication device or electronic device 100 according to an embodiment of the present disclosure.

[0062] Reference Figure 3 In an embodiment, the electronic device 100 may include a display 130, a support member assembly 160, at least one printed circuit board 170, a first housing 110, a second housing 120, a first back cover 140, and a second back cover 150. In the present disclosure, the display 130 may be referred to as a display module or a display assembly.

[0063] The display 130 may include a display panel 131 (e.g., a flexible display panel) and at least one board 132 or layer on which the display panel 131 is mounted. In an embodiment, the board 132 may be disposed between the display panel 131 and the support member assembly 160. The display panel 131 may be disposed on one surface of the board 132 (e.g., Figure 3 The plate 132 may be formed in a shape corresponding to the display panel 131. For example, a partial area of ​​the plate 132 may be formed in a shape corresponding to the notch area 133 of the display panel 131.

[0064] The support member assembly 160 may include a first support member 161, a second support member 162, a hinge structure 164a disposed between the first support member 161 and the second support member 162, a hinge housing 165 that covers the hinge structure 164a when the hinge structure 164a is viewed from the outside, and a wiring member (e.g., a flexible printed circuit board (FPCB)) that intersects the first support member 161 and the second support member 162. In an embodiment, the support member assembly 160 may include a first hinge plate 164b mounted on the first support member 161 and a second hinge plate 164c mounted on the second support member 162. In an embodiment, the wiring member may be disposed in a direction (e.g., an x-axis direction) that intersects the first support member 161 and the second support member 162. The wiring member may be hidden by the first hinge plate 164b or the second hinge plate 164c and may not be shown. Figure 3 middle.

[0065] Depending on the embodiment, the first hinge plate 164b may be mounted inside the first housing 110, and the second hinge plate 164c may be mounted inside the second housing 120. In one embodiment, the first hinge plate 164b may be mounted directly on the first support member 161, and the second hinge plate 164c may be mounted directly on the second support member 162. In one embodiment, the first hinge plate 164b (or second hinge plate 164c) may be mounted directly on another structure inside the first housing 110 (or second housing 120) (e.g., the first rotation support surface 114 or the second rotation support surface 124). For example, the structure inside the first housing 110 (or second housing 120) on which the first hinge plate 164b (or second hinge plate 164c) is mounted may vary depending on the embodiment. In one embodiment, the hinge structure 164a may be mounted on the first hinge plate 164b and the second hinge plate 164c, and may rotatably connect the second hinge plate 164c to the first hinge plate 164b. For example, the folding axis (e.g. Figure 1A folding axis A) may be formed by the hinge structure 164 a , and the first housing 110 and the second housing 120 (or the first support member 161 and the second support member 162 ) may be substantially rotatable relative to each other about the folding axis A.

[0066] In an embodiment, the support member assembly 160 may be disposed between the board 132 and at least one printed circuit board 170. For example, the first support member 161 may be disposed between the first portion 131a of the display 130 and the first printed circuit board 171. The second support member 162 may be disposed between the second portion 131b of the display 130 and the second printed circuit board 172.

[0067] As mentioned above, the at least one printed circuit board 170 may include a first printed circuit board 171 disposed on one side of the first support member 161 and a second printed circuit board 172 disposed on one side of the second support member 162. The first printed circuit board 171 and the second printed circuit board 172 may be disposed in a space formed by the support member assembly 160, the first housing 110, the second housing 120, the first back cover 140, and the second back cover 150. Components for implementing various functions of the electronic device 100 may be disposed on the first printed circuit board 171 and the second printed circuit board 172.

[0068] In an embodiment, the first housing 110 and the second housing 120 can be assembled together so as to be coupled to opposite sides of the support member assembly 160 when the display 130 is coupled to the support member assembly 160. The first housing 110 and the second housing 120 can be slidably coupled to opposite sides of the support member assembly 160, such as the first support member 161 and the second support member 162, respectively. In some embodiments, the first support member 161 and the second support member 162 can be substantially accommodated in the first housing 110 and the second housing 120 and can be interpreted as a portion of the first housing 110 and a portion of the second housing 120.

[0069] In an embodiment, the first housing 110 may include a first rotation support surface 114, and the second housing 120 may include a second rotation support surface 124 corresponding to the first rotation support surface 114. The first rotation support surface 114 and the second rotation support surface 124 may include curved surfaces corresponding to the curved surface included in the hinge housing 165.

[0070] In an embodiment, when the electronic device 100 is in the unfolded state (eg, Figure 1), the first rotation support surface 114 and the second rotation support surface 124 may cover the hinge housing 165 so that the hinge housing 165 is not exposed or is minimally exposed on the rear surface of the electronic device 100. In an embodiment, when the electronic device 100 is in the folded state (e.g., Figure 2 , the first rotation support surface 114 and the second rotation support surface 124 may rotate along a curved surface included in the hinge housing 165 so that the hinge housing 165 is maximally exposed on the rear surface of the electronic device 100.

[0071] In the above detailed description, ordinal numbers such as first and second are used to simply distinguish components such as the first shell 110, the second shell 120, the first side member 113, and the second side member 123. However, it should be noted that the present disclosure is not limited to the description of the ordinal numbers. For example, although the sensor area 131d is shown as being formed in the first shell 110, the sensor area 131d may be formed in the second shell 120 or may be formed in both the first shell 110 and the second shell 120. Although the first rear area 141 and the sub-display 152 are shown as being provided on the first back cover 140 and the second back cover 150, respectively, the first rear area 141 for arranging the sensor and the sub-display 152 for outputting the screen may both be provided on one of the first back cover 140 and the second back cover 150.

[0072] In the following detailed description, please refer to Figures 1 to 3 In describing the following embodiments, components that are the same as those in the previous embodiments or can be easily understood from the previous embodiments will be given the same reference numerals or will not be given reference numerals, and detailed descriptions thereof will also be omitted.

[0073] According to an embodiment, the electronic device 100 may include a plurality of structures 210, 310, 220, and 320 provided between the hinge housing 165 and the first housing 110 or the second housing 120. According to an embodiment, the plurality of structures may include at least one first structure 210, at least one second structure 310, at least one third structure 220, and at least one fourth structure 320.

[0074] At least one of the first structure 210 or the third structure 220 may be a structure that prevents or reduces the infiltration of solid particles (such as dust or debris) or liquid-form foreign matter. For example, the first structure 210 and the third structure 220 may be dustproof structures (or sweepers or fiber structures) that prevent or reduce the infiltration of solid particles or liquid-form foreign matter into the electronic device 100.

[0075] At least one of the second structure 310 or the fourth structure 320 may be a structure that maintains a gap between at least one of the first housing 110 or the second housing 120 and the hinge housing 165. For example, the second structure 310 may be a support structure (or a spacer or gap-maintaining member) that maintains a gap between the first housing 110 and the hinge housing 165, and the fourth structure 320 may be a support structure (or a spacer or gap-maintaining member) that maintains a gap between the second housing 120 and the hinge housing 165. At least one of the second structure 310 or the fourth structure 320 may be formed from a material having lubricity and may provide wear resistance and a smooth feel suitable for the folding lifespan determined by repeated folding and unfolding of the electronic device. The second structure 310 and the fourth structure 320 may be formed from a non-polar material with low surface energy and lubricity. For example, the second structure 310 and the fourth structure 320 may be formed from a resin such as POM, UHMWPE, PTFE, and / or PEEK.

[0076] According to an embodiment, the first structure 210 may contact the second structure 310 or may be spaced apart from the second structure 310 by a distance less than the length of the second structure 310. The third structure 220 may contact the fourth structure 320 or may be spaced apart from the fourth structure 320 by a distance less than the length of the fourth structure 320.

[0077] According to an embodiment, at least one of the first structure 210, the second structure 310, the third structure 220, or the fourth structure 320 may be formed of a material having elasticity, may accumulate elastic force while being compressed by elastic force, and may return to its original shape when no external force is applied. For example, the second structure 310 and the fourth structure 320 may include an elastic material, and may suppress or reduce noise or wear caused by friction during operation of the electronic device.

[0078] Figure 4 is an exploded perspective view showing a configuration in which a plurality of structures are installed in an electronic device according to an embodiment.

[0079] Reference Figure 4 According to an embodiment, the electronic device 100 (or a foldable electronic device, a portable electronic device, a portable communication device, or a portable device) may include a first shell 110, a second shell 120, a first structure 210, a second structure 310, a third structure 220, and a fourth structure 320.

[0080] The first housing 110 may include a hinge housing (eg, Figure 2 and Figure 3The first seating portion 401 corresponds to the outer circumferential surface of the hinge housing 165. When viewed from the Z axis direction to the -Z axis direction, the first seating portion 401 may have a concave shape. The first seating portion 401 may be arranged along the folding axis A (e.g., Figure 1 The folding axis A) is formed long. Depending on the hinge structure's hinge operation (or the electronic device's folding operation), the first seating portion 401 may overlap with at least a portion of the hinge housing with a constant gap therebetween, or may be positioned adjacent to the hinge housing. At least one first structure 210 and at least one second structure 310 may be positioned within at least a portion of the first seating portion 401.

[0081] The second housing 120 may include a second seating portion 402 corresponding to the outer circumferential surface of the hinge housing. The second seating portion 402 may have a concave shape when viewed from the z-axis direction to the -z-axis direction. The second seating portion 402 may be arranged along the folding axis A (e.g., Figure 1 The folding axis A) is formed long. Depending on the hinge structure's hinge operation (or the electronic device's folding operation), the second seating portion 402 may overlap with at least a portion of the hinge housing with a constant gap therebetween, or may be positioned adjacent to the hinge housing. At least one third structure 220 and at least one fourth structure 320 may be positioned within at least a portion of the second seating portion 402.

[0082] Figure 5 : is a view showing an example of a first structure according to an embodiment. Figure 5 In the drawing <501> is a diagram showing an example of a perspective view of the first structure, and FIG <502> is a view showing an example of a state before the fiber member of the first structure is pressed, and FIG. <503> is a view showing an example of a state in which the fiber member of the first structure is pressed.

[0083] Reference Figure 5 , such as drawing <501> 、 <502> and <503> As shown, the first structure (or third structure 220 ) may include a fiber member 212 (or fiber bundle or ciliary member) and a base member 211 .

[0084] The base member 211 may be formed of, for example, plastic, polymer, and / or fiber, and may have a plate shape with a constant thickness. The fiber member 212 may be woven and arranged in a specific arrangement on the base member 211. The base member 211 may have a width parallel to the X-axis and a length parallel to the Y-axis (or folding axis).

[0085] According to an embodiment, an adhesive member (eg, a double-sided tape or a liquid adhesive material) may be provided on the bottom of the base member 211 and may fix the base member 211 to the first seating portion (eg, Figure 4 The first placement portion 401 and the second placement portion (eg, Figure 4 402 of the second placement portion).

[0086] The fiber member 212 can be composed of multiple components, each component including multiple fibers, and the components can be inserted into recesses or holes 213 arranged in a specific pattern in the base member 211. One component can be fixedly inserted into one recess or hole 213. Each component can include a specific number of fibers, and the components can include the same or similar number of fibers. According to an embodiment, the number of fibers constituting each component can vary depending on the size, shape, or pattern arrangement of the recess or hole 213. At least a portion of the lower end of the component of the fiber member 212 can be inserted into the base member 211 or can protrude downward from the base member 211. The pattern of the recess or hole 213 of the base member 211 into which the component of the fiber member 212 is fixedly inserted can have various arrangements, including a zigzag pattern arrangement, a matrix or lattice arrangement, a mixture of a lattice arrangement and a zigzag pattern, a random arrangement, and / or a straight line arrangement. According to an embodiment, the pattern of the recess or hole 213 can include a concave-convex pattern.

[0087] At least a portion of the fiber member 212 assembly may be fixed to the base member 211, and the remainder of the assembly may be arranged upward (in the Z-axis direction) relative to the upper surface of the base member 211. The lower portion of the fiber member 212 assembly (e.g., the portion relatively close to the base member 211) may be fixedly inserted while being centered on one side of a recess or hole 213 formed in the base member 211, and the upper portion of the fiber member 212 assembly (e.g., the portion relatively far from the base member 211) may be arranged with irregular gaps between adjacent fibers. Depending on the embodiment, the recesses or holes 213 of the base member 211 may be spaced apart at intervals such that the fibers included in the fiber member 212 can contact each other in the longitudinal direction of the base member 211 (e.g., the Y-axis direction). The upper surface of the fiber member 212 may have a constant height. Since the lower portion of the fiber member 212 is concentrated in the base member 211 and the upper portion of the fiber member 212 is dispersed, the fiber member 212 may be provided in the shape of an inverted cone (a shape with a wide surface facing upward).

[0088] As drawing <502> As shown, the first structure 210 described above may be provided to have a constant height in an upward direction relative to the base member 211. Thereafter, the first structure 210 may be provided in the first placement portion (or the second placement portion), and the hinge housing (eg, Figure 2 and Figure 3 The hinge housing 165) can be placed on the first structure 210. For example, as shown in FIG. <503> As shown, at least a portion of the first structure 210 may have at least a portion of its upper surface curved (fibers of the fiber member 212 are bent at a height difference H1-H2). Even though the upper portion of the fiber member 212 of the first structure 210 is curved, the spaces between the fibers can be closed when the fibers of the fiber member 212 are entangled with each other, and the space between the hinge housing 165 and the first seating portion can be closed. Therefore, even if the space between the first seating portion and the hinge housing 165 deforms due to the hinge operation of the hinge housing 165, the deformed space can be closed by the first structure 210, thereby preventing or reducing the infiltration of foreign matter from the outside. The height of the fiber member 212 can vary depending on the size of the space between the hinge housing 165 and the first seating portion. The number of fibers comprising the assembly of the fiber member 212 can be selected so that after the first structure 210 is placed in the first seating portion, the fibers are pressed by the hinge housing and the spaces between the fibers are closed. Furthermore, the number of fibers comprising a assembly can vary depending on the thickness (or diameter) of the fibers. Alternatively, the material, elasticity, and diameter of the fibers may be determined so that the original shape of the fiber member 212 is maintained even if the hinge operation of the electronic device 100 is performed more than a specified number of times (e.g., more than 20,000 times), and based on this determination, the number of fibers of the component concentrated in one recess or hole 213 may be determined. For example, at least one of various fibers including artificial fibers, natural fibers, optical fibers, and / or glass fibers may be used as the fibers of the fiber member 212, and mixed fibers may be used as needed.

[0089] Figure 6 : is a view showing an unfolded state of an electronic device according to an embodiment. Figure 6 In the drawing <601> It shows Figure 1 A view of the unfolded state of the electronic device is shown. Figure 6 In the drawing <602> It is shown along Figure 1 1-B1' of the electronic device. <602> : is a view showing an example of a cross section obtained by cutting a position where a dustproof structure of an electronic device is provided. Figure 6 In the drawing <603> It is shown along Figure 1 1 is a view of an example of a cross section of an electronic device taken along line B2-B2'. <603> is a view showing an example of a cross section obtained by cutting a position where a support structure of an electronic device is provided.

[0090] Reference Figure 6, the electronic device 100 may include a first housing 110 , a second housing 120 , a hinge housing 165 , a display 130 , a first structure 210 and a second structure 310 .

[0091] The first housing 110 may include a first seating portion 401 and a first seating protrusion 611. The first seating protrusion 611 may protrude in the Z axis direction. The first seating protrusion 611 may protrude in the Z axis direction. Figure 1 The first seating portion 401 may be provided adjacent to the first seating protrusion 611, and thus the first seating protrusion 611 may limit the positions of the first structure 210 and the second structure 310 seated in the first seating portion 401.

[0092] The second housing 120 may include a second seating portion 402 and a second seating protrusion 612. The second seating protrusion 612 may protrude in the Z axis direction. The second seating protrusion 612 may protrude in the Z axis direction. Figure 1 The second seating portion 402 may be formed long in the folding axis A) and / or in the arrangement direction of the plurality of second structures 310 and / or in the arrangement direction of the plurality of fourth structures 320. The second seating portion 402 may be provided adjacent to the second seating protrusion 612, and thus the second seating protrusion 612 may limit the positions of the second structure 310 and the fourth structure 320 seated in the second seating portion 402.

[0093] When the electronic device 100 is in the unfolded state (open state), the display 130 can be in a substantially flat state. The display 130 can be disposed in the space formed by the first housing 110 and the second housing 120. The plurality of structures 210, 310, 220, and 320 can be disposed below the hinge housing 165 that covers the foldable portion of the first housing 110 and the second housing 120. The first structure 210 and the second structure 310 can be disposed between the hinge housing 165 and the first housing 110. The third structure 220 and the fourth structure 320 can be disposed between the hinge housing 165 and the second housing 120.

[0094] When the electronic device 100 is in the unfolded state (open state), a portion of the outer surface (or rear surface or exterior) (e.g., the surface facing the -Z axis direction) of the hinge housing 165 may be placed on the first structure 210 and the third structure 220. When the electronic device 100 is in the unfolded state (open state), the first structure 210 may be provided on the inner surface (or front surface, interior or surface facing the +Z axis direction) of the first housing 110 (e.g., the inner surface) of the hinge housing 165. Figure 13The third structure 220 may be positioned between the inner surface of the second housing 120 and the outer surface of the hinge housing 165 when the electronic device 100 is in the unfolded state (open state). The first and second locating protrusions 611 and 612 may be positioned facing each other. The fabric members of the first structure 210 positioned in the first locating portion 401 and the fabric members of the third structure 220 positioned in the second locating portion 402 may be positioned to face each other in the Z-axis direction. The upper ends of the fabric members of the first and third structures 210, 220 may be pressed by the rear surface of the hinge housing 165, potentially bending in certain directions. When the electronic device 100 is in the unfolded state, the entire upper surface of the first and third structures 210, 220 (or more than a certain percentage) may be bent by the rear surface of the hinge housing 165.

[0095] When the electronic device 100 is in the unfolded state, at least a portion of the remaining outer surface of the hinge housing 165 can rest on the second structure 310 and the fourth structure 320. When the electronic device 100 is in the unfolded state (open state), the second structure 310 can be positioned between the inner surface of the first housing 110 and the outer surface of the hinge housing 165. When the electronic device 100 is in the unfolded state (open state), the fourth structure 320 can be positioned between the inner surface of the second housing 120 and the outer surface of the hinge housing 165. The first seating protrusion 611 and the second seating protrusion 612 can be positioned facing each other. The second structure 310 positioned in the first seating portion 401 and the fourth structure 320 positioned in the second seating portion 402 can be positioned adjacent to each other. The second structure 310 positioned in the first seating portion 401 and the fourth structure 320 positioned in the second seating portion 402 can contact the hinge housing 165. The second structure 310 positioned in the first seating portion 401 and the fourth structure 320 positioned in the second seating portion 402 may be in close contact with the hinge housing 165 and may maintain a constant gap between each of the first and second housings 110 and 120 and the hinge housing 165 .

[0096] According to an embodiment, when the electronic device is in the unfolded state, the first structure 210 may face a first portion 621 of the outer surface (e.g., rear surface or exterior) of the hinge housing 165. When the electronic device is in the unfolded state, the first structure 210 may contact at least a portion of the first portion 621 of the outer surface of the hinge housing 165. When the electronic device is in the unfolded state, the second structure 310 may face a second portion 622 of the outer surface of the hinge housing 165 that is different from the first portion 621. When the electronic device is in the unfolded state, the second structure 310 may contact at least a portion of the second portion 622 of the outer surface of the hinge housing 165.

[0097] When the electronic device is in the unfolded state, the third structure 220 may face a third portion of the outer surface of the hinge housing 165. The third portion 623 may be a portion distinct from the first portion 621 and the second portion 622 and may be symmetrical with the first portion 621 relative to the folding axis A (or the hinge housing 165). When the electronic device is in the unfolded state, the third structure 220 may contact at least a portion of the third portion 623 of the outer surface of the hinge housing 165. When the electronic device is in the unfolded state, the fourth structure 320 may face a fourth portion 624 of the outer surface of the hinge housing 165. The fourth portion 624 may be a portion distinct from the first portion 621, the second portion 622, and the third portion 623 and may be symmetrical with the second portion 622 relative to the folding axis A (or the hinge housing 165). When the electronic device is in the unfolded state, the fourth structure 320 may contact at least a portion of the fourth portion 624 of the outer surface of the hinge housing 165.

[0098] According to an embodiment, at least a portion of the at least one first structure 210 may contact the first portion 621 of the outer surface of the hinge housing 165 while the electronic device 100 changes from the unfolded state to the folded state. At least a portion of the at least one second structure 310 may contact the second portion 622 of the outer surface of the hinge housing 165 while the electronic device 100 changes from the unfolded state to the folded state. At least a portion of the at least one third structure 220 may contact the third portion 623 of the outer surface of the hinge housing 165 while the electronic device 100 changes from the unfolded state to the folded state. At least a portion of the at least one fourth structure 320 may contact the fourth portion 624 of the outer surface of the hinge housing 165 while the electronic device 100 changes from the unfolded state to the folded state.

[0099] According to an embodiment, the space between the first housing 110 and the hinge housing 165 can be sealed by the first structure 210 and the second structure 310, and thus the infiltration of foreign matter from the outside between the first housing 110 and the hinge housing 165 can be prevented or reduced. The space between the second housing 120 and the hinge housing 165 can be sealed by the third structure 220 and the fourth structure 320, and thus the infiltration of foreign matter from the outside between the second housing 120 and the hinge housing 165 can be prevented or reduced.

[0100] Figure 7 : is a view showing a folded state of an electronic device according to an embodiment. Figure 7 In the drawing <701> It shows Figure 2 A view of the folded state of the electronic device is shown. Figure 7 In the drawing <702> It is shown along Figure 21-C1' of the electronic device. <702> : is a view showing an example of a cross section obtained by cutting a position where a dustproof structure of an electronic device is provided. Figure 7 In the drawing <703> It is shown along Figure 2 2 ' is a diagram showing an example of a cross section of an electronic device taken along line C2-C2'. <703> is a view showing an example of a cross section obtained by cutting a position where a support structure of an electronic device is provided.

[0101] Reference Figure 6 and Figure 7 When the electronic device 100 is in the folded state, the display 130 may have a folding portion (eg, Figure 1 and Figure 3 The folding portion 131c of the display 130 is folded. The first hinge plate 164b and the second hinge plate 164c, which are disposed below and support the display 130, can be separated from each other and can be arranged in an upright position in the Z-axis direction. The rear surface of the first housing 110 and the rear surface of the second housing 120 can be arranged to face away from each other. The first and second mounting protrusions 611 and 612 can be spaced apart from each other, with the hinge housing 165 located therebetween.

[0102] When the electronic device 100 is in the folded state, the first structure 210 can be positioned above the first seating protrusion 611 in the Z-axis direction, and the third structure 220 can be positioned above the second seating protrusion 612 in the Z-axis direction. The first structure 210 can be positioned facing one edge of the hinge housing 165 (the edge facing the X-axis direction), and the third structure 220 can be positioned facing the opposite edge of the hinge housing 165 (the edge facing the -X-axis direction). Therefore, some of the fiber members of the first structure 210 can remain upright, while others can face one edge of the hinge housing 165 and be curved. Some of the fiber members of the third structure 220 can remain upright, while others can face the opposite edge of the hinge housing 165 and be curved. The first structure 210 can close the gap between the first housing 110 and the hinge housing 165, and the third structure 220 can close the gap between the second housing 120 and the hinge housing 165. Therefore, it is possible to prevent or reduce the infiltration of foreign matter through the gaps between the first housing 110 , the second housing 120 , and the hinge housing 165 .

[0103] When the electronic device 100 is in the folded (closed) state, the second structure 310 can be positioned above the first seating protrusion 611 in the Z-axis direction, and the fourth structure 320 can be positioned above the second seating protrusion 612 in the Z-axis direction. The second structure 310 can be positioned facing one edge of the hinge housing 165 (the edge facing the X-axis direction), and the fourth structure 320 can be positioned facing the opposite edge of the hinge housing 165 (the edge facing the -X-axis direction). The second structure 310 can contact one edge of the hinge housing 165, and the fourth structure 320 can contact the opposite edge of the hinge housing 165. Thus, the second structure 310 can close the gap between the first housing 110 and the hinge housing 165, and the fourth structure 320 can close the gap between the second housing 120 and the hinge housing 165. This can prevent or reduce the infiltration of foreign matter through the gaps between the first and second housings 110, 120, and the hinge housing 165.

[0104] In the following, reference will be made to Figures 8 to 22 The first structure 210 (or the third structure 220 ) and the second structure 310 (or the fourth structure 320 ) formed between the hinge housing 165 and the first housing 110 (or the second housing 120 ) are described.

[0105] Figure 8 are views showing examples of first and second structures of an electronic device according to an embodiment.

[0106] Reference Figure 8 , the electronic device according to the embodiment may include a first structure 810 (eg, Figures 3 to 7 210) (and / or Figures 3 to 7 and a second structure 820 (eg, a third structure 220 ) having one or more support structures 821 , 822 , and 823 . Figures 3 to 7 The second structure 310) (and / or Figures 3 to 7 The fourth structure (for example, Figures 3 to 7 The fourth structure 320)).

[0107] The one or more support structures 821, 822, and 823 and the one or more dust-proof structures 811, 812, 813, and 814 may be disposed in the longitudinal direction along the folding axis A. For example, the one or more support structures 821, 822, and 823 and the one or more dust-proof structures 811, 812, 813, and 814 may be disposed along the hinge housing (e.g., Figure 2 、 Figure 3 、 Figure 6 and Figure 7The hinge housing 165) is arranged in the longitudinal direction.

[0108] The number of support structures 821, 822, and 823 may be different from the number of dustproof structures 811, 812, 813, and 814. The number of dustproof structures 811, 812, 813, and 814 may be greater than the number of support structures 821, 822, and 823. For example, the number of dustproof structures 811, 812, 813, and 814 may be greater than the number of support structures 821, 822, and 823 by at least one.

[0109] One or more support structures 821, 822 and 823 and one or more dustproof structures 811, 812, 813 and 814 may be arranged alternately. The dustproof structures 811, 812, 813 and 814 may be provided on opposite sides of the hinge housing and may prevent or reduce foreign matter from penetrating through the opposite sides of the hinge housing.

[0110] According to an embodiment, the one or more dustproof structures 811, 812, 813 and 814 may include a first dustproof structure 811, a second dustproof structure 812, a third dustproof structure 813 and a fourth dustproof structure 814. The one or more supporting structures 821, 822 and 823 may include a first supporting structure 821, a second supporting structure 822 and a third supporting structure 823.

[0111] According to an embodiment, the first support structure 821 supporting one side of the hinge housing may be located between the first dustproof structure 811 and the second dustproof structure 812. The second support structure 822 supporting the central portion of the hinge housing may be located between the second dustproof structure 812 and the third dustproof structure 813. The third support structure 823 supporting the opposite side of the hinge housing may be located between the third dustproof structure 813 and the fourth dustproof structure 814. The second support structure 822 may be located between the first support structure 821 and the third support structure 823. The second support structure 822 corresponding to the central portion of the hinge housing may be formed to be longer than at least one of the first support structure 821 or the third support structure 823. The second support structure 822 may have a second length L2 that is longer than the first length L1 of at least one of the first support structure 821 or the third support structure 823. Because the second support structure 822 supporting the central portion of the hinge housing is formed to be longer than at least one of the first support structure 821 or the third support structure 823, the hinge housing can be securely supported without sagging. For example, because the second support structure 822 supporting the central portion of the hinge housing is formed to be longer than at least one of the first support structure 821 or the third support structure 823, sagging of the area of ​​the housing adjacent to the hinge housing 165 (e.g., the first housing 110 or the second housing 120) can be reduced.

[0112] According to an embodiment, the first dustproof structure 811 and the second dustproof structure 812 may be in contact with the first supporting structure 821, or may be spaced apart from the first supporting structure 821 by a distance less than the length of the first supporting structure 821. The second dustproof structure 812 and the third dustproof structure 813 may be in contact with the second supporting structure 822, or may be spaced apart from the second supporting structure 822 by a distance less than the length of the second supporting structure 822.

[0113] According to an embodiment, at least one of the first support structure 821, the second support structure 822, or the third support structure 823 may be formed as a substructure that is separated from each other. For example, the second support structure 822, which is longer than the first support structure 821 and the third support structure 823, may be formed as a substructure that is separated from each other. The at least one substructure that is separated from each other may have a shorter length than the first support structure 821 and the third support structure 823.

[0114] According to an embodiment, the plurality of dustproof structures 811, 812, 813, and 814 and the plurality of support structures 821, 822, and 823 may be arranged symmetrically. The plurality of dustproof structures 811, 812, 813, and 814 included in the first structure 810 may be symmetrical with the plurality of dustproof structures included in the third structure, with the folding axis A parallel to the longitudinal direction of the hinge housing located therebetween. The plurality of support structures 821, 822, and 823 included in the second structure 820 may be symmetrical with the plurality of support structures included in the fourth structure, with the folding axis A parallel to the longitudinal direction of the hinge housing located therebetween.

[0115] According to an embodiment, the first dust-proof structure 811 and the second dust-proof structure 812 included in each of the first structure 810 and the third structure may be symmetrical with the third dust-proof structure 813 and the fourth dust-proof structure 814, with a virtual axis (or the second support structure 822) perpendicular to the folding axis A located therebetween. The first support structure 821 included in each of the second structure 820 and the fourth structure may be symmetrical with the third support structure 823, with a virtual axis (or the second support structure 822) perpendicular to the folding axis A located therebetween.

[0116] According to an embodiment, the arrangement, length, and / or number of the dust-proof structures 811 , 812 , 813 , and 814 and the support structures 821 , 822 , and 823 may be determined according to the length of the hinge housing.

[0117] Figures 9a to 9f 2 is a diagram illustrating a dustproof structure and a supporting structure of an electronic device according to an embodiment.

[0118] Reference Figures 9a to 9f, the electronic device according to the embodiment may include at least one dustproof structure 9101, 9102, 9103, 9104, 9105 or 9125 (for example, Figure 8 and at least one supporting structure 9201, 9202, 9203, 9204, 9205 or 9225 (e.g., Figure 8 support structures 821, 822 and 823).

[0119] According to an embodiment, Figure 9a The at least one first dustproof structure 9101 shown may include at least one dustproof recess 9111 formed by removing a portion of the first dustproof structure 9101. The at least one dustproof recess 9111 may be formed in a carved shape toward the folding axis A (or in the X-axis direction). At least one first support structure 9201 may be disposed in the dustproof recess 9111. For example, the width Ws of the first support structure 9201 may be narrower than the width Wg of the dustproof recess 9111. The width of the placement protrusions (e.g., the first placement protrusions 611 and the second placement protrusions 612) that limit the position of the first support structure 9201 may be formed to be wide within the difference between the width Ws of the first support structure 9201 and the width Wg of the dustproof recess 9111. Therefore, the support structure 9201 may be more easily received due to the first shell (e.g., Figures 1 to 7 The first housing 110 and the second housing (eg, Figures 1 to 7 The force applied to the support structure 9201 by the movement of the second housing 120) can be controlled. For example, the width Ws of the first support structure 9201 can be equal to the width Wg of the dustproof recess 9111. One lateral end of the first support structure 9201 and the opposite lateral end of the placement protrusion can be aligned, making it easy to manufacture the first and second housings including the placement protrusion. For example, the width Ws of the first support structure 9201 can be greater than the width Wg of the dustproof recess 9111. As the width Ws of the first support structure 9201 increases, the surface area of ​​the support structure 9201 in contact with the hinge housing can be increased, allowing the support structure 9201 to securely support the hinge housing. For example, because the surface area of ​​the support structure 9201 in contact with the hinge shell 165 increases as the width Ws of the first support structure 9201 increases, when the first shell 110 and the second shell 120 perform a folding operation (or are in a closed state), the support structure 9201 can maintain a constant gap between the hinge shell and the area of ​​the first shell 110 and / or the second shell 120 adjacent to the hinge shell.

[0120] According to an embodiment, Figure 9bThe at least one first dustproof structure 9102 shown may include multiple dustproof recesses 9121 and 9122 formed by removing portions of the first dustproof structure 9102. The first dustproof recess 9121 and the second dustproof recess 9122, included in the multiple dustproof recesses 9121 and 9122, may be formed in opposite directions with a carved shape. The first dustproof recess 9121 may be formed in a carved shape in the -X axis direction. At least one first support structure 9211 may be disposed in the first dustproof recess 9121. The second dustproof recess 9122 may be formed in a carved shape in the X axis direction. At least one second support structure 9212 may be disposed in the second dustproof recess 9122. The first support structure 9211 and the second support structure 9212 may have the same size or different sizes. For example, the first support structure 9211 closer to the folding axis and the second support structure 9212 farther away from the folding axis may have different sizes.

[0121] For example, the sizes of the plurality of support structures 9211 and 9212 may be determined depending on the orientation of the housings corresponding to the support structures 9211 and 9212 (e.g., the first housing located on one side relative to the folding axis or the second housing located on the opposite side relative to the folding axis). The first support structure 9211 and the second support structure 9212 having different sizes and included in the second structure corresponding to the first housing, and the first support structure 9211 and the second support structure 9212 having different sizes and included in the fourth structure corresponding to the second housing may be symmetrical with each other, with the central axis of the hinge housing parallel to the folding axis located therebetween.

[0122] According to an embodiment, the support structures 9231 and 9232 may be respectively arranged at Figure 9c The first support structure 9231 can be disposed on one side of the dustproof structure 9103, and the second support structure 9232 can be disposed on the opposite side of the first dustproof structure 9103. The first support structure 9231 and the second support structure 9232 can have the same size or different sizes. The separation distance between the first support structure 9231 and the first dustproof structure 9103 can be equal to or different from the separation distance between the second support structure 9232 and the first dustproof structure 9103. The separation distance between the support structures 9231 and 9232 and the first dustproof structure 9103 can be determined based on the orientation of the housings corresponding to the support structures 9231 and 9232 (e.g., the first housing located on one side relative to the folding axis or the second housing located on the opposite side relative to the folding axis).

[0123] According to the embodiment, Figure 9dAs shown, at least one first support structure 9204 can be disposed between the plurality of dustproof structures 9141 and 9142. For example, at least one support structure 9204 can be disposed between the first dustproof structure 9141 and the second dustproof structure 9142. The first support structure 9204 can include a first protrusion 9214 and a second protrusion 9224. The first protrusion 9214 is formed on one side surface of the first support structure 9204 facing the first dustproof structure 9141 and has a curved shape. The second protrusion 9224 is formed on the opposite side surface of the first support structure 9204 facing the second dustproof structure 9142 and has a curved shape. One end of the first dustproof structure 9141 facing the first support structure 9204 can be formed in a "C" shape, and the opposite end of the first dustproof structure 9141 facing the first support structure 9204 can be formed in an inverted "C" shape. The first dustproof structure 9141 can include a first dustproof recess 9143 corresponding to the first protrusion 9214. The first dust protection recess 9143 can be formed in a carved shape in the -Y axis direction. The second dust protection structure 9142 can include a second dust protection recess 9144 corresponding to the second protrusion 9224. The second dust protection recess 9144 can be formed in a carved shape in the Y axis direction. The first dust protection structure 9141 can be formed in a shape that at least partially surrounds the first protrusion 9214 (or the first edge) of the support structure 9204. The first dust protection structure 9141 can contact the first protrusion 9214 (or the first edge) of the support structure 9204. This can prevent or reduce the infiltration of foreign matter between the first dust protection structure 9141 and the first support structure 9204. The second dust protection structure 9142 can be formed in a shape that at least partially surrounds the second protrusion 9224 (or the second edge) of the support structure 9204. The second dust protection structure 9142 can contact the second protrusion 9224 (or the second edge) of the support structure 9204. The penetration of foreign matter into the space between the second dustproof structure 9142 and the first support structure 9204 can be prevented or reduced.

[0124] According to an embodiment, at least one first support structure 9205 may be provided at Figure 9e The first dustproof structure 9105 is shown inside. The first dustproof structure 9105 can be formed to surround at least one first support structure 9205. This can prevent or reduce the infiltration of foreign matter between the first dustproof structure 9105 and the first support structure 9205, and can prevent or reduce the infiltration of foreign matter into the gap of the first support structure 9205.

[0125] According to an embodiment, Figure 9fThe first dustproof structure 9125 shown can be arranged to overlap with the first support structure 9225. The first dustproof structure 9125 can be arranged above and below the first support structure 9225. The infiltration of foreign matter between the first dustproof structure 9125 and the first support structure 9225 can be prevented or reduced, and the infiltration of foreign matter into the gap of the first support structure 9225 can be prevented or reduced.

[0126] Figure 10 1 is a view illustrating an example of the widths of the dustproof structure and the supporting structure of the electronic device according to the embodiment.

[0127] Reference Figure 10 , the electronic device may include at least one dustproof structure 1010 and at least one support structure 1020. The width of the at least one dustproof structure 1010 may be greater than the width of the at least one support structure 1020. As the width of the dustproof structure 1010 increases, the inflow path of external foreign matter is lengthened, thereby preventing or reducing the infiltration of external foreign matter into the electronic device.

[0128] According to an embodiment, the virtual centerline F on which the at least one dustproof structure 1010 is disposed may coincide with the virtual centerline F on which the at least one support structure 1020 is disposed. The longitudinal centerline F of the at least one dustproof structure 1010 may coincide with the longitudinal centerline F of the at least one support structure 1020. The centerline F may be formed parallel to the folding axis A. The at least one dustproof structure 1010 may include a first dustproof region 1011 and a second dustproof region 1012 that are divided from each other, with the virtual centerline F located therebetween. The width Wd1 of the first dustproof region 1011 located on one side of the centerline F may be equal to or similar to the width Wd2 of the second dustproof region 1012 located on the opposite side of the centerline F. The at least one support structure 1020 may include a first support region 1021 and a second support region 1022 that are divided from each other, with the virtual centerline F located therebetween. The width Ws1 of the first supporting region 1021 on one side relative to the center line F may be equal to or similar to the width Ws2 of the second supporting region 1022 on the opposite side relative to the center line F.

[0129] According to an embodiment, a width Wd1 of the first dust-proof region 1011 located on one side relative to the center line F may be greater than a width Ws1 of the first supporting region 1021 located on one side relative to the center line F. A width Wd2 of the second dust-proof region 1012 located on the opposite side relative to the center line F may be greater than a width Ws2 of the second supporting region 1022 located on the opposite side relative to the center line F.

[0130] Figure 11 A dustproof structure and a supporting structure according to an embodiment are shown.

[0131] Reference Figure 11 According to an embodiment, at least one of the dustproof structure 1110 or the support structure 1120 may be formed in a polygonal shape with curved corners. For example, the dustproof structure 1110 and the support structure 1120 may be formed in a quadrilateral shape with rounded corners.

[0132] The base member (eg, Figure 5 The base member 211 of the dustproof structure 1110 may be formed in a quadrilateral shape with rounded corners, and the plurality of cilia (eg, Figure 5 The fiber member 212 may be formed in a quadrilateral shape with rounded corners, or the base member and the plurality of cilia may be formed in a quadrilateral shape with rounded corners.

[0133] The curvature R2 of the corner of the support structure 1120 may be different from the curvature R1 of the corner of the dustproof structure 1110. The curvature R2 of the corner of the support structure 1120 may be greater than the curvature R1 of the corner of the dustproof structure 1110. The curvature R2 of the corner of the support structure 1120 formed of an injection molded material may be greater than the curvature R1 of the corner of the dustproof structure 1110.

[0134] Figure 12 : is a view showing an example of the height relationship between the dustproof structure and the support structure according to the embodiment. Figure 12 In the drawing <1201> is a view showing an example of a state before the dustproof structure and the support structure are pressed by the hinge housing, and FIG <1202> is a view showing an example of a state in which the dustproof structure and the supporting structure are pressed by the hinge housing.

[0135] Reference Figure 12 , the dustproof structure 1210 and the support structure 1220 according to the embodiment may be in a hinged housing (eg, Figure 2 、 Figure 3 、 Figure 6 and Figure 7 The hinge housing 165 has different heights before being pressed. Keep the hinge housing and the first housing (eg, Figures 1 to 4 、 Figure 6 and Figure 7 The first housing 110 and the second housing (eg, Figures 1 to 4 、 Figure 6 and Figure 7 The height Hs of the support structure 1220 may be lower than the height Hd of the dust-proof structure 1210 to provide a designated gap between the support structure 1220 and the second housing 120 .

[0136] According to an embodiment, at least a portion of the dustproof structure 1210 can be pressed by the hinge housing according to at least one of the unfolded state and the folded state of the electronic device. The upper ends of at least some of the fiber members included in the dustproof structure 1210 can be pressed by the rear surface of the hinge housing 165. Therefore, the fiber members can bend in a specific direction.

[0137] At least one of the dustproof structure 1210 or the support structure 1220 according to the embodiment may be formed by an insert molding method. For example, the dustproof structure 1210 and the support structure 1220 may be formed integrally with each other by an insert molding method.

[0138] Figure 13 is a view illustrating a supporting structure included in an electronic device according to an embodiment.

[0139] exist Figure 13 In the drawing <1301> It is a three-dimensional diagram of the support structure included in the electronic device, drawing <1302> It is a plan view of the support structure included in the electronic device, drawing <1303> Is along the drawing <1302> A cross-sectional view of the electronic device taken along line D1-D1' in FIG. <1304> Is along the drawing <1302> A cross-sectional view of the electronic device taken along line D2-D2' in FIG.

[0140] Reference Figure 13 , the electronic device according to the embodiment may include a first housing 110 (and / or a second housing (eg, Figures 1 to 4 、 Figure 6 and Figure 7 a second shell 120 ), one or more dust-proof structures 1311 and 1312 and at least one supporting structure 1320 .

[0141] One or more dust-proof structures 1311 and 1312 may be included in at least one first structure (eg, Figures 3 to 7 The first structure 210 and Figure 8 810) (and / or Figures 3 to 7 In the third structure 220).

[0142] The support structure 1320 may include at least one second structure (e.g., Figures 3 to 7 The second structure 310 and Figure 8 820) (and / or Figures 3 to 7The support structure 1320 included in the at least one second structure can be positioned adjacent to the first dustproof structure 1311 in the -Y axis direction and adjacent to the second dustproof structure 1312 in the +Y axis direction. The support structure 1320 can be positioned between the first dustproof structure 1311 and the second dustproof structure 1312. For example, the first dustproof structure 1311 and the second dustproof structure 1312 can be in contact with the support structure 1320, or can be spaced apart from the support structure 1320 by a distance less than the length of the support structure 1320.

[0143] At least a portion of the support structure 1320 may be formed with a reverse gradient or an undercut structure. At least a portion of the side surface of the support structure 1320 may be formed with a reverse gradient or an undercut structure. For example, at least a portion of the support structure 1320 may be formed such that the width increases from the seating surface 1135 (or inner surface) of the first housing 110 toward the hinge housing (e.g., Figures 1 to 7 The support structure 1320 may include a body region 1321 , a neck region 1322 , and a head region 1330 .

[0144] The neck region 1322 may be provided between the head region 1330 and the seating surface 1135 of the first housing 110. For example, the neck region 1322 may be provided between the body region 1321 and the head region 1330 and may connect the body region 1321 and the head region 1330. The neck region 1322 may have a narrower width than the body region 1321 and the head region 1330.

[0145] The body region 1321 may extend from the neck region 1322 to the seating surface 1135 of the first housing 110. At least a portion of a side surface of the body region 1321 extending from the neck region 1322 having a narrow width may have an inclined surface.

[0146] The head region 1330 may face the outer surface of the hinge housing. The head region 1330 may be the area in contact with the rear surface of the hinge housing. The head region 1330 may protrude further toward the first dustproof structure 1311 and the second dustproof structure 1312 than the neck region 1322. The seating surface 1135 of the first housing 110 and at least a portion of the head region 1330 may each have a length parallel to the +Y axis direction (and / or the -Y axis direction). The length of at least a portion of the head region 1330 may be longer than the length of the seating surface 1135 of the first housing 110. The seating surface 1135 of the first housing 110 and at least a portion of the head region 1330 may each have a width parallel to the +X axis direction (and / or the -X axis direction). The width of at least a portion of the head region 1330 may be less than or equal to the width of the seating surface 1135 of the first housing 110.

[0147] The header region 1330 may include a first header region 1331, a second header region 1332, and a third header region 1333. The first header region 1331 may extend from the third header region 1333, overlapping with the receiving space 1350 (or the first receiving space) in which the support structure 1320 is positioned, toward the first dustproof structure 1311. The first header region 1331 may be positioned on the third sidewall 1133 of the first housing 110. The first header region 1331 may extend from the third header region 1333, overlapping with the receiving space 1350 in which the support structure 1320 is positioned, toward the first dustproof structure 1311. The gap between the first header region 1331, which is positioned on the third sidewall 1133 of the first housing 110 and extends toward the first dustproof structure 1311, and the first dustproof structure 1311 may be minimized. Therefore, infiltration of foreign matter between the first header region 1331 of the support structure 1320 and the first dustproof structure 1311 may be prevented or reduced.

[0148] The second header region 1332 can be positioned on the fourth sidewall 1134 of the first housing 110. The second header region 1332 can extend from the third header region 1333, which overlaps with the receiving space 1350 in which the support structure 1320 is positioned, toward the second dustproof structure 1312. The gap between the second header region 1332, which is positioned on the fourth sidewall 1134 of the first housing 110 and extends toward the second dustproof structure 1312, and the second dustproof structure 1312 can be minimized. Thus, infiltration of foreign matter between the second header region 1332 of the support structure 1320 and the second dustproof structure 1312 can be prevented or reduced.

[0149] The third head region 1333 may be disposed between the first head region 1331 and the second head region 1332 and may connect the first head region 1331 and the second head region 1332 .

[0150] According to an embodiment, the inclined surfaces of the body region 1321 and the neck region 1322 of the support structure 1320 may face at least one of the first sidewall 1131, the second sidewall 1132, the third sidewall 1133, or the fourth sidewall 1134 of the first housing 110 to form a first cavity 1351. For example, the body region 1321 and the neck region 1322 may be arranged to face the third sidewall 1133 in the -Y axis direction and the fourth sidewall 1134 in the +Y axis direction to form the first cavity 1351. For example, the body region 1321 and the neck region 1322 may be arranged to face the first sidewall 1131 in the -X axis direction and the second sidewall 1132 in the +X axis direction to form the first cavity 1351. For example, the body region 1321 and the neck region 1322 may be arranged to face the first sidewall 1131, the second sidewall 1132, the third sidewall 1133, and the fourth sidewall 1134 of the first housing 110 to form the first cavity 1351. The first cavity 1351 may be filled with the adhesive member 1360. The support structure 1320 may be fixed to the first housing 110 by the adhesive member 1360.

[0151] The first housing 110 may include a plurality of side walls surrounding a receiving space 1350 in which the support structure 1320 is disposed. The plurality of side walls may include a first side wall 1131 (eg, Figure 6 and Figure 7 The first sidewall 1131 and the second sidewall 1132 may be provided with a first mounting protrusion 611, a second sidewall 1132 facing the first sidewall 1131, a third sidewall 1133 located between the first and second sidewalls 1132, and a fourth sidewall 1134 facing the third sidewall 1133. The first and second sidewalls 1131 and 1132 may be formed long along the folding axis. The third and fourth sidewalls 1133 and 1134 may be arranged perpendicular to the folding axis. The third sidewall 1133 may be provided between the first dustproof structure 1311 and the support structure 1320. The fourth sidewall 1134 may be provided between the second dustproof structure 1312 and the support structure 1320.

[0152] According to an embodiment, at least one of the first sidewall 1131 or the third sidewall 1133 may include a first interlocking protrusion 1141 protruding toward the support structure 1320. At least one of the second sidewall 1132 or the fourth sidewall 1134 may include a second interlocking protrusion 1142 protruding toward the support structure 1320. For example, the first sidewall 1131 may include the first interlocking protrusion 1141 protruding toward the support structure 1320. The second sidewall 1132 may include the second interlocking protrusion 1142 protruding toward the support structure 1320. The first interlocking protrusion 1141 and the second interlocking protrusion 1142 may be disposed to face each other with the support structure 1320 located therebetween.

[0153] According to an embodiment, the inner surfaces 1136 of the first and second sidewalls 1131, 1132 of the first housing 110 may face the inclined surfaces of the main body region 1321 and the neck region 1322 of the support structure to form a second cavity 1352. The main body region 1321 and the neck region 1322 may be arranged to face the first sidewall 1131 having the stepped inner surface 1136 in the -X axis direction to form the second cavity 1352. The main body region 1321 and the neck region 1322 may be arranged to face the second sidewall 1132 having the stepped inner surface 1136 in the +X axis direction to form the second cavity 1352. The inner surface 1136, which is further spaced from the support structure 1320 relative to the inner surfaces of the first and second interlocking protrusions 1141, 1142, may face the inclined surfaces of the main body region 1321 and the neck region 1322, and thus the second cavity 1352 may form a relatively large space. The second cavity 1352 communicating with the first cavity 1351 may be filled with an adhesive member 1360. The support structure 1320 may be fixed to the first housing 110 by the adhesive member 1360.

[0154] According to an embodiment, the adhesive member 1360 may include a first protrusion region 1361 , a second protrusion region 1362 , a third protrusion region 1363 , and a fourth protrusion region 1364 .

[0155] The first protruding area 1361 of the adhesive member 1360 may protrude in a direction opposite to the direction of the first interlocking protrusion 1141 of the first shell 110. The first interlocking protrusion 1141 may protrude in the X-axis direction (or toward the head area 1330 of the support structure 1320), and the first protruding area 1361 of the adhesive member 1360 may protrude farther in the -X-axis direction than the support structure 1320 (e.g., the third head area 1333 of the support structure). The first protruding area 1361 of the adhesive member 1360 may be formed to engage with the first interlocking protrusion 1141. The first protruding area 1361 of the adhesive member 1360 may engage with the first interlocking protrusion 1141 to face the first interlocking protrusion 1141 in the Z-axis direction. Therefore, the support structure 1320 adhering to the first protruding area 1361 of the adhesive member 1360 in the Z-axis direction (e.g., toward Figure 1 、 Figure 3 、 Figure 6 and Figure 7 direction of the display 130).

[0156] The second protruding area 1362 of the adhesive member 1360 may protrude in a direction opposite to the direction of the second interlocking protrusion 1142 of the first shell 110. The second protruding area 1362 of the adhesive member 1360 may protrude farther in the X-axis direction than the support structure 1320 (e.g., the third head area 1333 of the support structure), and the second interlocking protrusion 1142 may protrude in the -X-axis direction (or toward the head area 1330 of the support structure 1320). The second protruding area 1362 of the adhesive member 1360 may be formed to engage with the second interlocking protrusion 1142. The second protruding area 1362 of the adhesive member 1360 may engage with the second interlocking protrusion 1142 to face the second interlocking protrusion 1142 in the Z-axis direction. Therefore, adhesion of the support structure 1320 to the second protruding area 1362 of the adhesive member 1360 in the Z-axis direction (e.g., toward Figure 1 、 Figure 3 、 Figure 6 and Figure 7 direction of the display 130).

[0157] The third protruding region 1363 of the adhesive member 1360 may protrude in a direction opposite to the direction of the first head region 1331 of the support structure 1320. The third protruding region 1363 of the adhesive member 1360 may protrude from the third sidewall 1133 in the Y-axis direction (or toward the neck region 1322 of the support structure), and the first head region 1331 of the support structure 1320 may protrude in the -Y-axis direction. The third protruding region 1363 of the adhesive member 1360 may be formed to engage with the first head region 1331 of the support structure 1320. The third protruding region 1363 of the adhesive member 1360 may engage with the first head region 1331 of the support structure 1320 to face the first head region 1331 of the support structure 1320 in the Z-axis direction. Therefore, the support structure 1320 adhered to the third protruding region 1363 of the adhesive member 1360 in the Z-axis direction (for example, toward Figure 1 、 Figure 3 、 Figure 6 and Figure 7 direction of the display 130).

[0158] The fourth protruding region 1364 of the adhesive member 1360 may protrude in a direction opposite to the direction of the second head region 1332 of the support structure 1320. The fourth protruding region 1364 of the adhesive member 1360 may protrude from the fourth sidewall 1134 in the -Y axis direction (or toward the neck region 1332 of the support structure), and the second head region 1332 of the support structure 1320 may protrude in the Y axis direction. The fourth protruding region 1364 of the adhesive member 1360 may be formed to engage with the second head region 1332 of the support structure 1320. The fourth protruding region 1364 of the adhesive member 1360 may engage with the second head region 1332 of the support structure 1320 to face the second head region 1332 of the support structure 1320 in the Z axis direction. Therefore, adhesion of the support structure 1320 to the fourth protruding region 1364 of the adhesive member 1360 in the Z axis direction (e.g., toward the neck region 1332) may be prevented or reduced. Figure 1 、 Figure 3 、 Figure 6 and Figure 7 direction of the display 130).

[0159] Figure 14 1 and 2 are views illustrating an example of an assembling process between a first housing and a supporting structure of an electronic device according to an embodiment.

[0160] Reference Figure 14In operation 1401, a first housing 110 (and / or a second housing 120) including a receiving space 1350 may be provided. At least a recess may be formed in the first housing 110, and the receiving space 1350 may be formed in the form of the recess. An adhesive member 1360 may be applied to the receiving space 1350.

[0161] In operation 1402 , the support structure 1320 may be assembled (or inserted) into the receiving space 1350 of the first housing 110 in a vertical direction (or in a direction parallel to a depth direction of the receiving space).

[0162] In operation 1403, after the support structure 1320 is assembled, the adhesive member 1360 may be cured and the support structure 1320 may be fixed to the first housing 110 by the adhesive member 1360. The portion of the adhesive member 1360 attached to the support structure 1320 may be coupled to engage with the first interlocking protrusion 1141 and the second interlocking protrusion 1142 of the first housing 110.

[0163] Figure 15 2 is a diagram illustrating an example of a method of manufacturing an electronic device according to an embodiment.

[0164] Reference Figure 15 In operation 1501, a first housing 110 (and / or a second housing 120) including a receiving space 1350 (or a first receiving space), a second receiving space 1451, and a third receiving space 1452 may be provided. A plurality of recesses may be formed in the first housing 110, and the receiving spaces 1350, the second receiving space 1451, and the third receiving space 1452 may be formed as recesses. The receiving spaces 1350, the second receiving space 1451, and the third receiving space 1452 may be arranged in a row.

[0165] In operation 1502, adhesive member 1360 may be applied to at least one of receiving space 1350, second receiving space 1451, or third receiving space 1452. For example, adhesive member 1360 may be applied to at least a portion of third receiving space 1452 where support structure 1320 is to be seated.

[0166] In operation 1503, the support structure 1320 may be assembled (or inserted) into the receiving space of the first housing 110 in a vertical direction (or in a direction parallel to the depth direction of the receiving space). After the support structure 1320 is assembled, the adhesive member 1360 may be cured and fixed to the first housing 110 by the adhesive member 1360.

[0167] In operation 1504, the first dustproof structure 1311 may be assembled to the second receiving space 1451, and the second dustproof structure 1312 may be assembled to the third receiving space 1452. The first dustproof structure 1311 assembled to the second receiving space 1451 and the second dustproof structure 1312 assembled to the third receiving space 1452 may be attached to the first housing 110. The first dustproof structure 1311, the support structure 1320, and the second dustproof structure 1312 may be arranged in a row.

[0168] Figure 16 A view showing a support structure according to an embodiment. Figure 16 In the drawing <1601> is a perspective view showing a support structure according to an embodiment, and FIG. <1602> is a rear view of a support structure according to an embodiment.

[0169] Reference Figure 16 , support structure 1620 (e.g., Figures 13 to 15 The support structure 1320 may include a head region 1330, a neck region 1322 and a body region 1321.

[0170] The main body region 1321 may include a channel 1610 formed in the longitudinal direction of the main body region 1321. The channel 1610 may be formed from the main body region 1321 facing the first housing (eg, Figures 1 to 15 The installation surface (eg, the first housing 110 in at least one of Figure 13 The bottom surface 1323 of the seating surface 1135 is formed in a carved shape toward the head area 1330.

[0171] The channel 1610 may be formed through the main body region 1321 from one side surface of the main body region 1321 facing the -Y axis direction to the other side surface of the main body region 1321 facing the Y axis direction. The channel 1610 may be used as an adhesive member applied to the receiving space of the first shell (e.g., Figures 13 to 15 The liquid adhesive member 1360 can move through the channel 1610 after the support structure is assembled into the receiving space, and thus can prevent or reduce the liquid adhesive member 1360 from overflowing from the receiving space.

[0172] Figure 17 2 is a view illustrating an assembling process of a support structure including a channel and a first housing according to an embodiment.

[0173] Reference Figure 17 In operation 1701 , a first housing 110 (and / or a second housing 120 ) including a receiving space 1350 may be provided. A liquid adhesive member 1360 may be applied to the first housing 110 .

[0174] In operation 1702, at least a portion of the support structure 1620 may be accommodated in the receiving space 1350 of the first housing 110. The support structure 1620 may include a channel 1610 parallel to the seating surface 1135 of the first housing 110. According to an embodiment, in order to prevent or reduce overflow of the liquid adhesive member 1360 that occurs when the support structure 1620 is fastened obliquely rather than vertically to the seating surface 1135 of the first housing 110, the support structure 1620 may include the channel 1610.

[0175] In operation 1703, when the support structure 1620 is positioned obliquely and not vertically secured to the seating surface 1135 of the first housing 110, the channel 1610 may also be positioned obliquely relative to the seating surface 1135. The liquid adhesion member 1360 can be moved from one end of the channel 1610 to the opposite end of the channel 1610. The liquid adhesion member 1360 can be moved from one end of the channel 1610, which is located away from the seating surface 1135, to the opposite end of the channel 1610, which is located closer to the seating surface 1135. Because the liquid adhesion member 1360 is dispersed from the area where the liquid adhesion member 1360 is concentrated to the opposite area through the channel 1610, it is possible to prevent or reduce the liquid adhesion member 1360 from deviating to one or the opposite side. Consequently, it is possible to prevent or reduce the liquid adhesion member 1360 from overflowing from the receiving space 1350.

[0176] In operation 1704, the liquid adhesive member 1360 may be pressed by the weight of the support structure 1620 and may be moved between the support structure 1620 and the first housing 110. The liquid adhesive member 1360 and the support structure 1620 may be formed in the receiving space 1350 without being offset. The liquid adhesive member 1360 may be formed into a solid adhesive member 1360 through a curing process. The support structure 1620 may be fixed to the first housing 110 by the solid adhesive member 1360 without being offset (or tilted). The bottom surface 1323 of the support structure 1620 may be arranged parallel to the seating surface 1135 of the first housing 110. Depending on the embodiment, at least a portion of the bottom surface 1323 of the support structure 1620 may be in direct contact with the seating surface 1135 of the first housing 110. Depending on the embodiment, at least a portion of the bottom surface 1323 of the support structure 1620 may be fixed to the seating surface 1135 of the first housing 110 by the solid adhesive member 1360.

[0177] Figure 18 1 and 2 are views illustrating an assembling process of a support structure and a first housing including a guide recess according to an embodiment.

[0178] Reference Figure 18In operation 1801, a first housing 110 (and / or a second housing 120) including a guide recess 1810 and a receiving space 1350 may be provided. The guide recess 1810 and the receiving space 1350 may have the same depth. The guide recess 1810 and the receiving space 1350 may be formed in the same direction as a sculpture. The guide recess 1810 may be formed in the same direction as the receiving space 1350 from the seating surface 1135 of the first housing 110 as a sculpture. The guide recess 1810 may be connected to the receiving space 1350. The guide recess 1810 may be positioned deeper than the receiving space 1350. A liquid adhesive member 1360 may be applied to the first housing 110. The liquid adhesive member 1360 may fill the guide recess 1810 and a portion of the receiving space 1350.

[0179] In operation 1802, at least a portion of the support structure 1820 may be received in the receiving space 1350 of the first housing 110. The support structure 1820 may include a guide protrusion 1821 corresponding to the guide recess 1810. The guide protrusion 1821 may protrude from the bottom surface 1323 of the support structure 1820 toward the guide recess 1810.

[0180] In operation 1803, the guide protrusion 1821 of the support structure 1820 may be aligned with the guide recess 1810 of the first housing 110. The guide protrusion 1821 of the support structure 1820 may be assembled to the guide recess 1810 of the first housing 110 in a direction perpendicular to the seating surface 1135 of the first housing 110. According to an embodiment, the guide protrusion 1821 of the support structure 1820 may be assembled to the guide recess 1810 of the first housing 110 before the liquid adhesive member 1360 is pressed by the support structure 1820. The support structure 1820 may be assembled vertically in a direction perpendicular to the seating surface 1135 of the first housing 110. Therefore, the support structure 1820 may be prevented from being assembled obliquely relative to the seating surface 1135 of the first housing 110.

[0181] In operation 1804, the liquid adhesive member 1360 may be pressed by the weight of the support structure 1820 and may be moved between the support structure 1820 and the first housing 110. The liquid adhesive member 1360 and the support structure 1820 may be formed in the receiving space 1350 without being offset. The liquid adhesive member 1360 may be formed into a solid adhesive member 1360 through a curing process. The support structure 1820 may be fixed to the first housing 110 by the solid adhesive member 1360 without being offset (or tilted). The bottom surface 1323 of the support structure 1820 may be arranged parallel to the seating surface 1135 of the first housing 110. Depending on the embodiment, at least a portion of the bottom surface 1323 of the support structure 1820 may be in direct contact with the seating surface 1135 of the first housing 110. Depending on the embodiment, at least a portion of the bottom surface 1323 of the support structure 1820 may be fixed to the seating surface 1135 of the first housing 110 by the solid adhesive member 1360.

[0182] Figure 19 is a view illustrating an electronic device including a support structure assembled to a housing in a sliding manner according to an embodiment.

[0183] Reference Figure 19 The electronic device according to the embodiment may include a first housing 110 (or a second housing), at least one supporting structure 1920, and at least one dustproof structure 1911 and 1912. Hereinafter, the at least one dustproof structure 1911 and 1912 will be exemplified as including a first dustproof structure 1911 and a second dustproof structure 1912.

[0184] The first housing 110 may include a first receiving space 1350 for accommodating the support structure 1920 therein, a second receiving space 1451 for accommodating the first dustproof structure 1911 therein, and a third receiving space 1452 for accommodating the second dustproof structure 1912 therein. The first receiving space 1350 and the second receiving space 1451 may be connected to each other. The first receiving space 1350 and the third receiving space 1452 may be connected to each other by a first coupling protrusion 1940 (e.g., Figure 13 The first coupling protrusion 1940 may protrude toward at least one of the support structure 1920 or the second dustproof structure 1912. For example, the first coupling protrusion 1940 may protrude from the side wall of the first housing 110 toward the support structure 1920.

[0185] The first housing 110 may include a fourth receiving space 1930. The fourth receiving space 1930 may be formed between the first receiving space 1350 and the second receiving space 1451. The fourth receiving space 1930 may be connected to the first receiving space 1350 and the second receiving space 1451. A second seating surface 1952 formed by the fourth receiving space 1930 may be formed to be aligned with the first seating surface 1951 (e.g., Figure 13 A step 1953 may be formed between the second seating surface 1952 and the first seating surface 1951. When the support structure 1920 slides, the step 1953 may limit the movement of the support structure 1920.

[0186] The first dustproof structure 1911 may be located on one side of the support structure 1920, and the second dustproof structure 1912 may be located on the opposite side of the support structure 1920. One of the first dustproof structure 1911 and the second dustproof structure 1912 may be provided on a portion of the support structure 1920 that is slidably assembled to the first housing 110. For example, at least a portion of the first dustproof structure 1911 may be provided on a flange 1922 of the support structure 1920 that is slidably assembled to the first housing 110. The first dustproof structure 1911 may directly face the support structure 1920. The first dustproof structure 1911 can be in close contact with the support structure 1920 without a separate separating member, thereby preventing or reducing the infiltration of foreign matter between the first dustproof structure 1911 and the support structure 1920. The sidewall on which the first coupling protrusion 1940 of the first housing 110 is formed may be provided between the second dustproof structure 1912 and the support structure 1920.

[0187] Support structure 1920 can slide while contacting at least a portion of the outer surface of first housing 110 (and / or second housing 120). Support structure 1920 can be assembled into the first receiving space of the first housing by sliding from second receiving space 1451 to first receiving space 1350. Support structure 1920 may include a body region 1923, a second coupling protrusion 1921, a flange 1922, and a recess 1924.

[0188] The second coupling protrusion 1921 may protrude toward at least one of the first dustproof structure 1911 or the second dustproof structure 1912. The second coupling protrusion 1921 may protrude in a direction opposite to the direction of the first coupling protrusion 1940 of the first shell 110. For example, the second coupling protrusion 1921 may protrude from the main body area 1923 toward the second dustproof structure 1912. The second coupling protrusion 1921 may protrude in a direction parallel to the sliding direction of the support structure 1920. The second coupling protrusion 1921 may be formed to engage with the first coupling protrusion 1940 of the first shell 110. The second coupling protrusion 1921 of the support structure 1920 may engage with the first coupling protrusion 1940 of the first shell 110 so that the second coupling protrusion 1921 of the support structure 1920 faces the first coupling protrusion 1940 of the first shell 110 in the thickness direction of the support structure 1920. Therefore, the support structure 1920 coupled to the first coupling protrusion 1940 of the first housing 110 can be prevented or reduced from being displaced in the thickness direction of the support structure 1920 (eg, toward the Figure 1 、 Figure 3 、 Figure 6 and Figure 7 direction of the display 130).

[0189] The flange 1922 may protrude in a direction opposite to the direction of the second coupling protrusion 1921. For example, the flange 1922 may protrude from the main body region 1923 toward the first dustproof structure 1911. The flange 1922 may be received in the fourth receiving space 1930 of the first housing 110. When the support structure 1920 slides, the flange 1922 may be stopped by the step 1953, thereby limiting the sliding of the support structure 1920.

[0190] The recess 1924 may be provided on the side surface of the support structure 1920. The recess 1924 may be formed in a concave shape corresponding to the first coupling protrusion 1940 of the first housing 110. The recess 1924 may be coupled to at least a portion of the first coupling protrusion 1940 in a sliding manner.

[0191] Figure 20 is a view illustrating an electronic device including a support structure assembled to a housing in a sliding manner according to an embodiment.

[0192] Reference Figure 20 , the electronic device according to the embodiment may include a first housing 110 (or a second housing), at least one supporting structure 1920 and at least one dustproof structure 1911 and 1912. Figure 20 The electronic device shown includes a plurality of plates 2011 and 2012 instead of flanges. Figure 20 The electronic device shown may have Figure 19The electronic devices shown in FIG. 1 and FIG. 2 have the same construction. Therefore, the previous description may apply to the same components or operations.

[0193] According to an embodiment, the plurality of plates 2011 and 2012 may include a first plate 2011 and a second plate 2012 spaced apart from each other with the support structure 1920 located therebetween.

[0194] The first plate 2011 may be disposed between the first dustproof structure 1911 and the first housing 110. A portion of the first dustproof structure 1911 may be disposed on the flange 1922 of the support structure 1920. The first plate 2011 may be disposed between at least a portion of the remainder of the first dustproof structure 1911 and the first housing 110. The thickness of the first plate 2011 may correspond to the difference between the maximum thickness of the support structure 1920 and the thickness of the first dustproof structure 1911. For example, the thickness of the first plate 2011 may correspond to the thickness of the flange 1922 disposed on the first housing 110.

[0195] The second plate 2012 may be disposed between the second dustproof structure 1912 and the first housing 110. At least a portion of the second dustproof structure 1912 may be disposed on the second plate 2012. The thickness of the second plate 2012 may correspond to the difference between the maximum thickness of the support structure 1920 and the thickness of the second dustproof structure 1912. The thickness of the second plate 2012 may be equal to or different from the thickness of the first plate 2011.

[0196] Figure 21 is a view illustrating an electronic device including a support structure assembled to a housing in a sliding manner according to an embodiment.

[0197] Reference Figure 21 , the electronic device according to the embodiment may include a first housing 110 (or a second housing), at least one supporting structure 1920 and at least one dustproof structure 1911 and 1912. Figure 21 The electronic device shown further includes a third dustproof structure 1913 (or auxiliary dustproof structure), Figure 21 The electronic device shown may have Figure 19 The electronic devices shown are of substantially the same construction. Therefore, the previous description may apply to the same components or operations.

[0198] At least a portion of the third dustproof structure 1913 may be disposed on the flange 1922 of the support structure 1920. The third dustproof structure 1913 may be disposed between the first dustproof structure 1911 and the main body region 1923 of the support structure 1920. The third dustproof structure 1913 may have a different thickness than at least one of the first dustproof structure 1911 or the second dustproof structure 1912. The third dustproof structure 1913 may have a thickness smaller than at least one of the first dustproof structure 1911 or the second dustproof structure 1912. The thickness of the third dustproof structure 1913 may correspond to the difference between the thickness of the main body region 1923 of the support structure 1920 and the thickness of the flange 1922. The third dustproof structure 1913 may be disposed between the first dustproof structure 1911 and the support structure 1920 and may be in close contact with both the first dustproof structure 1911 and the support structure 1920. This may prevent or reduce the infiltration of foreign matter between the first dustproof structure 1911 and the support structure 1920.

[0199] Figure 22 1 and 2 are views illustrating an example of a sliding operation of a supporting structure assembled with a first housing of the electronic device according to the embodiment.

[0200] Reference Figure 22 In operation 2201, a first receiving space 1350 (eg, Figures 19 to 21 The first receiving space 1350 and the second receiving space 1451 (eg, Figures 19 to 21 The support structure 1920 may be placed in the second receiving space 1451 of the first housing 110 (or the second housing).

[0201] In operation 2202 , first support structure 1920 may be slid from second receiving space 1451 to first receiving space 1350 .

[0202] In operation 2203 , the liquid adhesive member 1360 may be applied to the second receiving space 1451 . The liquid adhesive member 1360 may be expanded from the second receiving space 1451 to the first receiving space 1350 , and thus the support structure 1920 may be fixed to the first housing 110 by the adhesive member 1360 .

[0203] In operation 2204, the first dustproof structure 1911 may be assembled to the second receiving space 1451. Since the second receiving space 1451 and the first receiving space 1350 are connected without a separate partition member, the first dustproof structure 1911 may be assembled to the second receiving space 1451 so as to be in close contact with the support structure 1920 accommodated in the first receiving space 1350.

[0204] Meanwhile, the dustproof structure and the supporting structure described above are not limited to the embodiments described with reference to the accompanying drawings, and the dustproof structure and the supporting structure described with reference to the accompanying drawings can be applied in combination with each other. For example, the dustproof structure and the supporting structure described with reference to the accompanying drawings can be provided in multiple locations in the electronic device according to the embodiment. Figure 3 、 Figure 4 、 Figures 6 to 13 、 Figure 16 and Figures 19 to 21 Each support structure described herein, or a combination thereof, may be provided in the electronic device according to the embodiment. In addition, a plurality of reference structures may be provided in the electronic device according to the embodiment. Figures 3 to 13 、 Figure 16 and Figures 19 to 21 Each of the dust-proof structures described, or a combination thereof may be provided in the electronic device according to the embodiment.

[0205] In addition, refer to Figure 14 、 Figure 15 、 Figure 17 、 Figure 18 and Figure 22 At least one assembly method described can be applied with reference to Figure 3 、 Figure 4 、 Figures 6 to 13 、 Figure 16 and Figures 19 to 21 Support structure described, and reference Figure 14 、 Figure 15 、 Figure 17 、 Figure 18 and Figure 22 At least one assembly method described can be applied with reference to Figures 3 to 13 、 Figure 16 and Figures 19 to 21 Described dustproof structure.

[0206] According to at least one embodiment, a foldable electronic device may include a first housing, a second housing, and a hinge coupled to the first housing and the second housing. The foldable electronic device may further include a first member disposed between the first housing and the hinge, and a first support structure disposed between the first housing and the hinge, wherein the first member and the first support structure are adjacent to each other. When the foldable electronic device is in a folded state or an unfolded state, the first member contacts both the hinge housing and the first housing.

[0207] The hinge may include a hinge structure coupled to the first housing and the second housing, and a hinge housing in which the hinge structure is disposed.

[0208] When the foldable electronic device is in the folded state and when the foldable electronic device is in the unfolded state, the first member can be in contact with both the hinge housing and the first housing. When the foldable electronic device is in a state between the folded state and the unfolded state, the first member can be in contact with both the hinge housing and the first housing.

[0209] The first member and the first support structure may be in contact with each other. The first member and the first support structure may be arranged such that when deformed during use, the first member and the first support structure will contact each other. The first member and the first support structure may be spaced apart from each other by a distance that is less than a length of the first support structure, the length of the first support structure being measured in a direction parallel to the folding axis of the hinge. The first member and the first support structure may be spaced apart from each other by a distance that is less than a width of the first support structure, the width of the first support structure being measured in a direction perpendicular to the folding axis of the hinge. The first member and the first support structure may be spaced apart by a distance that is less than a minimum distance between two external points of the first support structure, where the distance passes through the center of mass of the support structure.

[0210] The first member may be arranged to prevent at least some dust, particles, contaminants or foreign matter from passing between the first housing and the hinge.The first member may be a dust-tight structure.

[0211] The foldable electronic device may include a second member positioned between the first housing and the hinge, such that the first support structure is positioned between the first and second members. The second member and the first support structure may be adjacent to each other. When the foldable electronic device is in a folded state or an unfolded state, the second member may contact both the hinge housing and the first housing.

[0212] When the foldable electronic device is in the folded state and when the foldable electronic device is in the unfolded state, the second member can contact both the hinge housing and the first housing. When the foldable electronic device is in a state between the folded state and the unfolded state, the second member can contact both the hinge housing and the first housing.

[0213] The second member and the first support structure may be in contact with each other. The second member and the first support structure may be arranged such that when deformed during use, the second member and the first support structure will contact each other. The second member and the first support structure may be spaced apart from each other by a distance that is less than the length of the first support structure, the length of the first support structure being measured in a direction parallel to the folding axis of the hinge. The second member and the first support structure may be spaced apart from each other by a distance that is less than the width of the first support structure, the width of the first support structure being measured in a direction perpendicular to the folding axis of the hinge. The second member and the first support structure may be spaced apart from each other by a distance that is less than the minimum distance between two external points of the first support structure, where the distance passes through the center of mass of the support structure.

[0214] The second member may be arranged to prevent at least some dust, particles, contaminants or foreign matter from passing between the first housing and the hinge.The second component may be a dust-tight structure.

[0215] The support structure may be configured such that if the first housing is pushed toward the hinge, the support structure resists movement of the first housing toward the hinge. The support structure may be configured such that if the first housing is pushed toward the hinge when the foldable electronic device is in a folded state, the support structure resists movement of the first housing toward the hinge. The support structure may be configured such that if the first housing is pushed toward the hinge when the foldable electronic device is in an unfolded state, the support structure resists movement of the first housing toward the hinge. The support structure may be configured such that if the first housing is pushed toward the hinge when the foldable electronic device is in a state between the folded state and the unfolded state, the support structure resists movement of the first housing toward the hinge. The force provided by the support structure when resisting a push may be greater than the force provided by the first member when resisting the same push. The force provided by the support structure when resisting a push may be greater than the force provided by the second member when resisting the same push.

[0216] According to at least one embodiment, a foldable electronic device (100) may include a first shell (110), a second shell (120), a hinge structure (164a) coupled to the first shell (110) and the second shell (120), a hinge shell (165) provided with the hinge structure (164a), a first dustproof structure (811) and a second dustproof structure (812) provided between the first shell (110) and the hinge shell (165), and a first supporting structure (821) provided between the first dustproof structure (811) and the second dustproof structure (812) in the longitudinal direction of the hinge shell (165).

[0217] According to an embodiment, the first dust-proof structure (811) and the first supporting structure (821) may be in contact with each other or may be spaced apart from each other by a distance that is less than the length of the first supporting structure (821).

[0218] According to an embodiment, the second dust-proof structure (812) and the first supporting structure (821) may be in contact with each other, or may be spaced apart from each other by a distance less than the length of the first supporting structure (821).

[0219] According to an embodiment, at least a portion of the first dustproof structure (811) and at least a portion of the second dustproof structure (812) can contact the first portion (621) of the outer surface of the hinge housing (165) in a folded state or an unfolded state of the foldable electronic device (100).

[0220] According to an embodiment, at least a portion of the first support structure (1320) may be formed such that the width decreases from the inner surface (1135) of the first housing (110) toward the hinge housing (165) and then increases.

[0221] The length of the first support structure can be measured along an axis parallel to the folding axis of the hinge structure. The height of the first support structure can be measured along an axis between the point at which the first support structure contacts the first shell during use and the point at which the first support structure contacts the hinge shell during use. The width of the first support structure can be measured along any axis perpendicular to both the length axis and the height axis. At least a portion of the first support structure can be formed so that its width decreases and then increases between the inner surface of the first shell and the hinge shell. At least a portion of the first support structure can be formed so that its width has a minimum value at a point between the first shell and the hinge shell, the width of the portion of the first support structure at the minimum value being less than the width of the portion of the support structure at a point adjacent to the first shell and the hinge shell.

[0222] According to an embodiment, at least a portion of the first support structure (1320) may include a head region (1330) facing the outer surface of the hinge housing (165) and a neck region (1322) disposed between the head region (1330) and the inner surface (1135) of the first housing (110).

[0223] According to an embodiment, the head region (1330) may protrude further toward at least one of the first dust-proof structure (1311) or the second dust-proof structure (1312) than the neck region (1322).

[0224] According to an embodiment, a portion of the first housing (110) may include a receiving space (1350) in which at least a portion of the first support structure (1320) is accommodated.

[0225] According to an embodiment, a portion of the first support structure (1320) may be spaced apart from an inner surface of the receiving space (1350) to form at least one cavity (1351).

[0226] According to an embodiment, an adhesive member (1360) may be formed in at least one cavity (1351). According to an embodiment, an inner surface of the receiving space (1350) may include a step structure (1136).

[0227] According to an embodiment, a portion of the step structure may be spaced apart from a portion of the first supporting structure (1320) to form at least one cavity (1352), and the adhesive member (1360) may be formed in the at least one cavity (1352).

[0228] According to an embodiment, when the foldable electronic device (100) is in a closed state, at least a portion of the first support structure (310) may be in contact with a second portion (622) of the outer surface of the hinge housing (165) that is different from the first portion (621).

[0229] According to an embodiment, the foldable electronic device (100) may further include a third dustproof structure (813) arranged in a straight line with the second dustproof structure (812) in the longitudinal direction of the hinge housing (165), and a second supporting structure (822) arranged between the second dustproof structure (812) and the third dustproof structure (813).

[0230] According to an embodiment, the first support structure (821) may have a different length than the second support structure (822).

[0231] According to an embodiment, at least one of the first dust-proof structure (811) or the second dust-proof structure (812) may include a recess (9111, 9121, 9122).

[0232] According to an embodiment, at least a portion of the first support structure (9201, 9202, 9211, 9212) may be disposed in the recess (9111, 9121, 9122).

[0233] According to an embodiment, at least one (9141) of the first dust-proof structure (9141) or the second dust-proof structure (9142) may include at least one recess (9143, 9144) formed at one end.

[0234] According to an embodiment, the first support structure (9204) may have at least one protrusion (9124, 9224) corresponding to at least one recess (9143, 9144).

[0235] According to an embodiment, the first dust prevention structure (9105) may at least partially surround a first edge of the first support structure (9205), and the second dust prevention structure may at least partially surround a second edge of the first support structure.

[0236] According to an embodiment, the first dustproof structure (1010) may have a first virtual center line (F) parallel to the hinge housing (165), and the first support structure (1020) may coincide with at least a portion of the first virtual center line (F).

[0237] According to an embodiment, a first curvature (R1) of at least one corner of the first dust-proof structure (1110) may be smaller than a second curvature (R2) of at least one corner of the first supporting structure (1120).

[0238] According to an embodiment, the first dust-proof structure (1210) may have a greater height than the first supporting structure (1220).

[0239] According to an embodiment, the first support structure (1620) may include a channel (1610) formed in a longitudinal direction of the hinge housing (165).

[0240] According to an embodiment, the first support structure (1820) may include at least one guide protrusion (1821).

[0241] According to an embodiment, each of the first housing (110) and the second housing (120) may include at least one guide recess (1810) corresponding to the guide protrusion (1821).

[0242] According to an embodiment, the foldable electronic device (100) may further include a third dustproof structure and a fourth dustproof structure arranged between the second shell (120) and the hinge shell (165), and a second supporting structure (320) arranged between the second shell (120) and the hinge shell (165) so as to be adjacent to the third dustproof structure and the fourth dustproof structure.

[0243] According to an embodiment, the first dustproof structure (811) and the second dustproof structure (812) provided between the first shell (110) and the hinge shell (165) may be symmetrical with the third dustproof structure and the fourth dustproof structure provided between the second shell (120) and the hinge shell (165).

[0244] According to an embodiment, the first support structure (310) provided between the first housing (110) and the hinge housing (165) may be symmetrical with the second support structure (320) provided between the second housing (120) and the hinge housing (165).

[0245] According to an embodiment, the first support structure (310) may slide while in contact with at least a portion of the outer surface of the hinge housing (165).

[0246] According to an embodiment, the first housing (110) may include a first combining protrusion (1940).

[0247] According to an embodiment, the first supporting structure (1920) may include a recess (1924) coupled to at least a portion of the first coupling protrusion (1940) in a sliding manner and provided on a side surface of the first supporting structure (1920), and a flange (1922) protruding in a direction opposite to the direction of the second coupling protrusion (1921).

[0248] According to an embodiment, at least a portion of the first dust-proof structure 1911 may overlap with the flange ( 1922 ).

[0249] According to at least one embodiment, a foldable electronic device (100) may include: a first housing (110); a second housing (120); a hinge structure (164a) coupled to the first housing (110) and the second housing (120); a hinge housing (165) accommodating at least a portion of the hinge structure (164a) and substantially disposed between the first housing (110) and the second housing (120); at least one first structure (210) disposed between an inner surface of the first housing (110) and an outer surface of the hinge housing (165) and disposed on the foldable electronic device. The sub-device (100) at least partially contacts a first portion (621) of the outer surface of the hinge housing (165) when the sub-device (100) changes from the unfolded state to the folded state; and at least one second structure (310) is arranged between the inner surface of the first housing (110) and the outer surface of the hinge housing (165) so as to be adjacent to the first structure (210) and at least partially contact a second portion (622) of the outer surface of the hinge housing (165) different from the first portion (621) when the foldable electronic device (100) changes from the unfolded state to the folded state.

[0250] According to the embodiment of the present disclosure, the gap between each of the first housing and the second housing and the hinge housing can be kept constant by the support structure in close contact with the dustproof structure.

[0251] According to an embodiment of the present disclosure, the dustproof structure can be in close contact with the support structure, and thus can prevent or reduce penetration of external foreign matter between each of the first and second housings and the hinge housing and / or between the dustproof structure and the support structure.

[0252] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments and include various changes, equivalents or replacements for corresponding embodiments. Regarding the description of the accompanying drawings, similar figure numerals may be used to refer to similar or related elements. It should be understood that, unless the relevant context clearly indicates otherwise, the singular form of the noun corresponding to the item may include one or more things. As used herein, each phrase such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any one or all possible combinations of the items listed together in a corresponding phrase. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish a corresponding component from another component and do not limit the component in other aspects (e.g., importance or order). It should be understood that if an element (e.g., a first element) is referred to as being “coupled with” another element (e.g., a second element), “coupled to” another element (e.g., the second element), “connected with” another element (e.g., the second element), or “connected to” another element (e.g., the second element), with or without the term “operably” or “communicatively”, it means that the element may be coupled with the other element directly (e.g., by wire), wirelessly, or via a third element.

[0253] Depending on the situation, the expression "adapted to or configured to" used in this disclosure may be used interchangeably with, for example, expressions such as "suitable for," "capable of," "adapted to," "made to," "capable of," or "designed to" in hardware or software. The expression "a device configured to" may mean that the device is "capable of" working together with another device or other component. For example, "a processor configured to perform A, B, and C" may refer to a dedicated processor (e.g., an embedded processor) for performing the corresponding operations, or a general-purpose processor (e.g., a CPU or AP) that performs the corresponding operations by executing one or more programs stored in a memory device (e.g., memory 130).

[0254] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integral component adapted to perform one or more functions, or its smallest unit or portion. A "module" may be implemented mechanically or electronically and may include, for example, an application-specific integrated circuit (ASIC) chip, a field-programmable gate array (FPGA), or a programmable logic device that is known or to be developed for performing certain operations.

[0255] At least a portion of the apparatuses (e.g., modules or functions thereof) or methods (e.g., operations) according to various embodiments may be implemented by instructions stored in a computer-readable storage medium (e.g., memory 130) in the form of program modules. When executed by a processor (e.g., processor 120), the instructions may cause the processor to perform the functions corresponding to the instructions. Computer-readable storage media may include hard disks, floppy disks, magnetic media (e.g., magnetic tapes), optical media (e.g., CD-ROMs, DVDs, magneto-optical media (e.g., floppy disks)), embedded memories, and the like. The instructions may include code generated by a compiler or code executable by an interpreter.

[0256] According to various embodiments, each of the components described above (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately provided in different components. According to various embodiments, one or more of the components described above may be omitted, or one or more other components may be added. Alternatively or in addition, multiple components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as they were performed by the corresponding components in the multiple components before integration. According to various embodiments, the operations performed by a module, program, or another component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be performed in a different order or omitted, or one or more other operations may be added.

[0257] It will be understood that, unless there is a conflict between two embodiments or features, all of the above-described embodiments and their technical features can be combined with each other in any combination. That is, every combination of two or more of the above-described embodiments is contemplated and included in the present disclosure. One or more features from any embodiment can be incorporated into any other embodiment and provide corresponding advantages or benefits.

Claims

1. A foldable electronic device (100), comprising: a first housing (110); A second housing (120); a hinge structure (164a), the hinge structure (164a) being coupled to the first housing (110) and the second housing (120); A hinge housing (165), wherein the hinge structure (164a) is arranged in the hinge housing (165); a first dustproof structure (811) and a second dustproof structure (812), wherein the first dustproof structure (811) and the second dustproof structure (812) are arranged between the first housing (110) and the hinge housing (165); as well as a first supporting structure (821), the first supporting structure (821) being arranged between the first dustproof structure (811) and the second dustproof structure (812) in the longitudinal direction of the hinge housing (165), wherein the first dustproof structure (811) and the first supporting structure (821) are in contact with each other or are spaced apart from each other by a distance less than the length of the first supporting structure (821), wherein the second dustproof structure (812) and the first supporting structure (821) are in contact with each other or are spaced apart from each other by a distance less than the length of the first supporting structure (821), and Wherein, at least a portion of the first dustproof structure (811) and at least a portion of the second dustproof structure (812) are in contact with a first portion (621) of the outer surface of the hinge housing (165) in a folded state or an unfolded state of the foldable electronic device (100).

2. The foldable electronic device (100) according to claim 1, wherein: At least a portion of the first support structure (1320) is formed such that a width decreases and then increases from an inner surface (1135) of the first housing (110) toward the hinge housing (165).

3. The foldable electronic device (100) according to claim 1, wherein: At least a portion of the first support structure (1320) comprises: a head region (1330), the head region (1330) being configured to face the outer surface of the hinge housing (165); and a neck region (1322), the neck region (1322) being disposed between the head region (1330) and the inner surface (1135) of the first shell (110), and Wherein, the head region (1330) protrudes further toward at least one of the first dustproof structure (1311) or the second dustproof structure (1312) than the neck region (1322).

4. The foldable electronic device (100) according to claim 1, wherein A portion of the first housing (110) includes a receiving space (1350) for accommodating at least a portion of the first support structure (1320) therein, wherein a portion of the first support structure (1320) is spaced apart from the inner surface of the receiving space (1350) to form at least one cavity (1351), and Wherein, an adhesive member (1360) is formed in the at least one cavity (1351).

5. The foldable electronic device (100) according to claim 4, wherein: The inner surface of the receiving space (1350) includes a step structure (1136), and Wherein, a portion of the step structure is spaced apart from a portion of the first support structure (1320) to form at least one cavity (1352), and an adhesive member (1360) is formed in the at least one cavity (1352).

6. The foldable electronic device (100) according to claim 1, wherein: When the foldable electronic device (100) is in a closed state, at least a portion of the first support structure (310) contacts a second portion (622) of the outer surface of the hinge housing (165) that is different from the first portion (621).

7. The foldable electronic device (100) according to claim 1, further comprising: a third dustproof structure (813), the third dustproof structure (813) being arranged in a straight line with the second dustproof structure (812) in the longitudinal direction of the hinge housing (165); as well as a second supporting structure (822), the second supporting structure (822) being arranged between the second dustproof structure (812) and the third dustproof structure (813), Wherein, the first supporting structure (821) has a different length from the second supporting structure (822).

8. The foldable electronic device (100) according to claim 1, wherein At least one of the first dustproof structure (811) or the second dustproof structure (812) includes a recess (9111, 9121, 9122), and Wherein, at least a portion of the first supporting structure (9201, 9202, 9211, 9212) is arranged in the recess (9111, 9121, 9122).

9. The foldable electronic device (100) according to claim 1, wherein: At least one (9141) of the first dustproof structure (9141) or the second dustproof structure (9142) includes at least one recess (9143, 9144) formed at one end, and Wherein, the first supporting structure (9204) has at least one protrusion (9124, 9224) corresponding to the at least one recess (9143, 9144).

10. The foldable electronic device (100) according to claim 1, wherein The first dustproof structure (9105) at least partially surrounds a first edge of the first support structure (9205), and Wherein, the second dustproof structure at least partially surrounds the second edge of the first supporting structure.

11. The foldable electronic device (100) according to claim 1, wherein The first dustproof structure (1010) has a first virtual center line (F) parallel to the hinge housing (165), and Wherein, the first support structure (1020) coincides with at least a portion of the first virtual center line (F).

12. The foldable electronic device (100) according to claim 1, wherein A first curvature (R1) of at least one corner of the first dustproof structure (1110) is smaller than a second curvature (R2) of at least one corner of the first supporting structure (1120).

13. The foldable electronic device (100) according to claim 1, wherein The first dustproof structure (1210) has a greater height than the first supporting structure (1220).

14. The foldable electronic device (100) according to any one of claims 1 to 13, wherein The first supporting structure (1620) includes a channel (1610) formed in the longitudinal direction of the hinge housing (165).

15. The foldable electronic device (100) according to any one of claims 1 to 13, wherein The first support structure (1820) includes at least one guide protrusion (1821), and Wherein, each of the first shell (110) and the second shell (120) includes at least one guide recess (1810) corresponding to the guide protrusion (1821).

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