Sound cavity structure, manufacturing method thereof and electronic equipment

Abstract

The invention discloses an acoustic cavity structure, a manufacturing method thereof and electronic equipment. The sound cavity structure comprises a middle frame assembly, a screen assembly and a loudspeaker, the middle frame assembly comprises a middle frame and a sealing dustproof piece, the middle frame comprises a first through hole, and the sealing dustproof piece comprises a second through hole. The sealing dustproof piece is attached to the second surface of the middle frame and covers the first through hole, and the first through hole is communicated with the second through hole. The screen assembly is attached to the first surface of the middle frame, and the loudspeaker is attached to the sealing dustproof piece. The loudspeaker comprises an open cavity facing the first through hole, and the open cavity, the second through hole, the first through hole and the screen assembly define an equivalent sound cavity of the loudspeaker. By adopting the loudspeaker with the open cavity, the thickness of the acoustic cavity structure can be reduced. In this way, the electronic equipment can be lightened and thinned, and meanwhile the equivalent sound cavity can be used for providing a working cavity with the same or higher size for the loudspeaker. The sound cavity structure can be effectively sealed, so that the electronic equipment can be effectively waterproof, and the audio performance of the loudspeaker can be ensured.

Description

Acoustic cavity structure, manufacturing method thereof, and electronic device

[0001] This application claims priority to the Chinese patent application filed on July 27, 2023, with application number 202310939812.1 and invention name “A sound cavity structure, a manufacturing method thereof, and an electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of terminal equipment, and in particular to an acoustic cavity structure and a manufacturing method thereof, and an electronic device. Background Art

[0003] Speakers are installed in electronic devices to provide sound playback. The speaker consists of a housing and a speaker core housed within the housing. The speaker core and the housing form a front cavity and a rear cavity, with the front cavity communicating with the sound outlet. Speakers are typically mounted on the electronic device's midframe. To ensure effective sound playback, the front cavity must be sealed, and a sealing rubber ring must be pressed against the midframe at the sound outlet to create a flat seal. This prevents external liquids from entering the electronic device through the sound outlet and potentially affecting the circuit boards on the midframe.

[0004] As electronic devices become thinner and lighter, speakers also need to be thinner. This thinning reduces the volume of the front and rear cavities, which in turn degrades the speaker's audio performance. To achieve this thinness and weight reduction while maintaining audio performance, speakers with open cavities (hereinafter referred to as open speakers) can be used. The open cavity can be formed in either the front or rear cavity.

[0005] However, for example, if the open cavity is formed in the front chamber, the sound outlet of the open speaker is connected to the open cavity, making it impossible to seal it by pressing the sealing rubber ring against the middle frame. Therefore, traditional sealing methods cannot meet the sealing requirements of electronic devices that include open speakers. Poor sealing of open speakers can lead to abnormal audio performance and the risk of waterproof failure.

[0006] Summary of the Invention

[0007] The present application provides a sound cavity structure and a manufacturing method thereof, and an electronic device to solve the problem of poor sealing effect in electronic devices using speakers with open cavities.

[0008] In the first aspect, the present application provides a sound cavity structure, including: a middle frame assembly, including a middle frame and a sealing dustproof part; the middle frame includes a first surface, a second surface, and a first through hole connecting the first surface and the second surface; wherein the first surface and the second surface are opposite surfaces; the sealing dustproof part is attached to the second surface and covers the first through hole, the sealing dustproof part includes a second through hole, and the second through hole is connected to the first through hole; a screen assembly and a speaker, the screen assembly is attached to the first surface, and the speaker is attached to the sealing dustproof part; the speaker includes an open cavity facing the first through hole, and the open cavity, the second through hole, the first through hole and the screen assembly form an equivalent sound cavity of the speaker.

[0009] The acoustic cavity structure provided in the embodiment of the present application uses a speaker with an open cavity, which can reduce the thickness of the speaker, thereby reducing the thickness of the acoustic cavity structure, and further realizing the lightness and thinness of the electronic device. At the same time, the screen assembly is bonded to the middle frame assembly to form a front shell assembly, thereby realizing the seal between the middle frame and the screen assembly; then the speaker with an open cavity is bonded to the middle frame assembly, and the seal between the speaker and the middle frame is realized by a sealing dustproof part. It can be seen that the acoustic cavity structure uses the screen assembly and the middle frame assembly to form an equivalent acoustic cavity of an open speaker, which can provide the speaker with a working cavity of equal or higher volume while realizing the lightness and thinness of the electronic device. In this way, not only can effective sealing be performed, so that the electronic device can be effectively waterproof, but also the audio performance of the speaker can be guaranteed.

[0010] In some implementations, the middle frame includes a middle plate and a frame surrounding the edge of the middle plate, with a first through hole defined in the middle plate. The frame includes a sound-conducting sidewall on a side facing the first through hole, and the sound-conducting sidewall is connected to the middle plate at a first angle. The middle frame also includes multiple sound-conducting holes extending through the frame and the sound-conducting sidewall, and the sound-conducting holes are connected to the equivalent sound cavity. In this way, the sound-conducting holes and the equivalent sound cavity can form a sound channel to improve the audio performance of the speaker.

[0011] In some implementations, the sealing dustproof member includes a base plate and a dustproof member, which are connected at a second angle; the second angle is equal to the first angle; the base plate is bonded to the middle plate, and the dustproof member is bonded to the sound-conducting sidewall; and the center of the base plate includes a second through hole. This allows for seamless bonding between the speaker and the sealing dustproof member, improving sealing effectiveness.

[0012] In some implementations, the sealing dustproof member includes a stacked substrate, a dustproof net, and a first adhesive layer; the substrate's area for forming the base sheet includes a first hollow hole, the substrate's area for forming the dustproof sheet includes a second hollow hole; the dustproof net's area for forming the base sheet includes a third hollow hole; the first adhesive layer's area for forming the base sheet includes a fourth hollow hole, the first adhesive layer's area for forming the dustproof sheet includes a fifth hollow hole; the first, third, and fourth hollow holes are connected to form a second through hole; the second and fifth hollow holes are connected to expose the area of ​​the dustproof net for forming the dustproof sheet. In this way, the sealing dustproof member can not only form an equivalent acoustic cavity in the subsequent production process, but also provide a dustproof function.

[0013] In some implementations, a speaker includes a core and a housing having two adjacent side surfaces formed with openings. The core is located within the housing and is spaced a first distance L1 from the edge of the housing's opening to form an open cavity. This allows the portion of the housing forming the open cavity to be eliminated, thereby reducing the thickness of the speaker.

[0014] In some implementations, the edge of the housing's open end includes an annular wire groove; the surface of the base plate includes a first sealing rib, which is continuously formed in an area adjacent to the edges of the base plate and the dustproof sheet. The first sealing rib is configured to be embedded in the annular wire groove and abut against the edge of the housing's open end. This allows for a seal between the speaker and the dustproof seal, improving the sealing effect.

[0015] Some implementations further include: a second adhesive layer; the second adhesive layer continuously covers the edges of the first surface and the edge of the first through hole; the second adhesive layer is used to adhere the screen assembly to the first surface and to seal the end of the first through hole facing the first surface. This can improve the bonding strength between the screen assembly and the midframe and achieve a good sealing effect.

[0016] In some implementations, the sealing dustproof member further includes a third adhesive layer positioned between the substrate and the dustproof screen. The area of ​​the third adhesive layer forming the base plate includes a sixth hollow hole, and the area of ​​the third adhesive layer forming the dustproof screen includes a seventh hollow hole. The sixth hollow hole is used to form the second through hole, and the seventh hollow hole is used to expose the area of ​​the dustproof screen forming the dustproof screen. Thus, the substrate and the dustproof screen are bonded via the third adhesive layer, thereby reducing costs.

[0017] In some implementations, the speaker further includes a second sealing rib formed continuously along the edge of the housing's opening end; the second sealing rib is configured to abut against the substrate, thereby achieving a seal between the speaker and the dustproof seal, improving the sealing effect.

[0018] In some implementations, the sealing dust shield further includes a bracket positioned within the second through hole and configured to support the sealing dust shield. The bracket is configured to be removed after the sealing dust shield is attached to the second surface. This provides rigidity to the sealing dust shield, facilitating its installation onto the midframe.

[0019] In the second aspect, the present application provides a method for manufacturing an acoustic cavity structure, which is used to manufacture the acoustic cavity structure provided in the first aspect, and the method includes: providing a middle frame assembly, a screen assembly and a speaker, the middle frame assembly includes a middle frame and a sealing dustproof part, the middle frame includes a first surface, a second surface, and a first through hole connecting the first surface and the second surface; wherein the first surface and the second surface are opposite surfaces; the sealing dustproof part is attached to the second surface and covers the first through hole, the sealing dustproof part includes a second through hole, and the second through hole is connected to the first through hole; the screen assembly is attached to the first surface of the middle frame; the speaker is attached to the sealing dustproof part; the speaker includes an open cavity facing the first through hole, and the open cavity, the second through hole, the first through hole and the screen assembly form an equivalent acoustic cavity of the speaker.

[0020] The method for manufacturing the acoustic cavity structure provided in the embodiment of the present application is that the screen assembly and the middle frame assembly are bonded together to form a front shell assembly, thereby achieving a seal between the middle frame and the screen assembly; then the speaker with an open cavity is bonded to the middle frame assembly, and the sealing between the speaker and the middle frame is achieved by a sealing dustproof part. It can be seen that the acoustic cavity structure manufactured by this method can use the screen assembly and the middle frame assembly to form an equivalent acoustic cavity of an open speaker, and can provide a working cavity of equal or higher volume for the speaker while achieving lightweight electronic equipment. In this way, not only can effective sealing be achieved, so that the electronic device can be effectively waterproof, but also the audio performance of the speaker can be guaranteed.

[0021] Some implementations further include: processing a sound-conducting sidewall on the frame of the middle frame; wherein the sound-conducting sidewall is connected to the middle plate of the middle frame at a first angle; and processing a plurality of sound-conducting holes through the frame and the sound-conducting sidewall in the stacked structure, wherein the sound-conducting holes are connected to the equivalent sound cavity. In this way, the sound-conducting holes and the equivalent sound cavity can form a sound channel to improve the audio performance of the speaker.

[0022] In some implementations, the following steps are used to fabricate a sealed dustproof member: providing a substrate, a dustproof screen, and a first adhesive layer; integrally molding the substrate and the dustproof screen to form an assembly; applying an external force to a predetermined region of the assembly to deform the assembly; and laminating the first adhesive layer to a surface of the dustproof screen away from the substrate to form the sealed dustproof member. The sealed dustproof member includes a base plate and a dustproof sheet, wherein the base plate and the dustproof sheet form a second angle equal to the first angle. This allows the sealed dustproof member to be compatible with the speaker housing structure, ensuring seamless fit between the speaker and the sealed dustproof member, thereby enhancing sealing effectiveness.

[0023] In some implementations, attaching the sealing dustproof member to the second surface and covering the first through hole includes attaching the base piece of the sealing dustproof member to the midplane using a first adhesive layer, and attaching the dustproof sheet of the sealing dustproof member to the sound guide sidewall. This can improve the seamless attachment of the sealing dustproof member to the midframe.

[0024] In some implementations, attaching the screen assembly to the first surface of the middle frame includes applying a second adhesive layer to the edges of the first surface and the edge of the first through-hole; and attaching the screen assembly to the first surface of the middle frame using the second adhesive layer. This can improve the bonding strength between the screen assembly and the middle frame and achieve a good sealing effect.

[0025] In some implementations, attaching the speaker to the sealing dustproof member includes: machining an annular wire groove at the edge of the open end of the speaker housing, and injection-molding a first sealing rib on the surface of the base plate, wherein the first sealing rib is continuously formed in the area adjacent to the edge of the base plate and the dustproof member; snapping the speaker onto the sealing dustproof member and securing it to the second surface of the middle frame, and embedding the first sealing rib in the annular wire groove so that the open end edge of the speaker housing abuts the first sealing rib. In this way, the speaker and the sealing dustproof member can be sealed, improving the sealing effect.

[0026] In some implementations, manufacturing the sealing dustproof member further includes laminating a third adhesive layer between the substrate and the dustproof net. In this way, the substrate and the dustproof net are bonded via the third adhesive layer, which can reduce costs.

[0027] In some implementations, attaching the speaker to the sealing dustproof member includes: injection-molding a second sealing rib on the edge of the open end of the speaker housing; snapping the speaker onto the sealing dustproof member and securing it to the second surface of the middle frame; and abutting the substrate against the second sealing rib. This ensures a seal between the speaker and the sealing dustproof member, improving the sealing effect.

[0028] In some implementations, manufacturing the sealing dustproof member further includes: injection molding a bracket in the second through-hole, the bracket being used to support the sealing dustproof member; and after attaching the sealing dustproof member to the second surface and covering the first through-hole, further including: removing the bracket from the sealing dustproof member. In this way, the bracket can provide rigidity to the sealing dustproof member, facilitating installation of the sealing dustproof member on the midframe.

[0029] In a third aspect, the present application provides an electronic device comprising the acoustic cavity structure provided in the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0031] FIG1 is a schematic structural diagram of an electronic device 100;

[0032] FIG2 is a partial schematic diagram of the AA section in FIG1 ;

[0033] FIG3 is a schematic structural diagram of a speaker assembly 40;

[0034] FIG4 is a first structural diagram of a speaker 401 provided in an embodiment of the present application;

[0035] FIG5 is a first structural diagram of a sound cavity structure 50 provided in an embodiment of the present application;

[0036] FIG6 is a second structural diagram of the acoustic cavity structure 50 provided in an embodiment of the present application;

[0037] FIG7 is a third structural diagram of the acoustic cavity structure 50 provided in an embodiment of the present application;

[0038] FIG8 is a first structural diagram of the middle frame 101 provided in an embodiment of the present application;

[0039] FIG9 is a second structural diagram of the middle frame 101 provided in an embodiment of the present application;

[0040] FIG10 is a schematic structural diagram of a middle frame assembly provided in an embodiment of the present application;

[0041] FIG11 is a first partial schematic diagram of section BB in FIG6 ;

[0042] FIG12 is an enlarged view of area C in FIG8 ;

[0043] FIG13 is a side view of a speaker 401 provided in an embodiment of the present application;

[0044] FIG14 is a schematic structural diagram of the sound-guiding sidewall 105 and the middle plate 103 provided in an embodiment of the present application;

[0045] FIG15 is a first structural diagram of a sealing dustproof member 201 provided in an embodiment of the present application;

[0046] FIG16 is a first exploded structural diagram of the sealing dustproof member 201 provided in an embodiment of the present application;

[0047] FIG17 is a second exploded structural diagram of the sealing dustproof member 201 provided in an embodiment of the present application;

[0048] FIG18 is a second partial schematic diagram of the BB section in FIG6 ;

[0049] FIG19 is an enlarged view of area D in FIG11 ;

[0050] FIG20 is a third structural diagram of the middle frame 101 provided in an embodiment of the present application;

[0051] FIG21 is a second structural diagram of the speaker 401 provided in an embodiment of the present application;

[0052] FIG22 is a second structural diagram of the sealing dustproof member 201 provided in an embodiment of the present application;

[0053] FIG23 is a third structural diagram of the sealing dustproof member 201 provided in an embodiment of the present application;

[0054] FIG24 is a flow chart of a method for manufacturing a sound cavity structure according to an embodiment of the present application;

[0055] FIG25 is a schematic diagram of a process flow for manufacturing a sealing dustproof member according to an embodiment of the present application;

[0056] FIG26 is a schematic diagram of a process flow for manufacturing a middle frame assembly according to an embodiment of the present application;

[0057] FIG27 is a schematic diagram of a first process flow for manufacturing the acoustic cavity structure 50 provided in an embodiment of the present application;

[0058] FIG28 is a schematic diagram of a second process flow for manufacturing the acoustic cavity structure 50 provided in an embodiment of the present application. DETAILED DESCRIPTION

[0059] The following will clearly describe the technical solutions in the embodiments of the present application in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments of the present application, other embodiments obtained by ordinary technicians in this field without making any creative work are all within the scope of protection of this application.

[0060] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0061] In addition, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0062] The electronic devices described in the embodiments of the present application include but are not limited to mobile phones, foldable screen mobile phones, notebook computers, tablet computers, laptop computers, personal digital assistants or wearable devices, etc. The following description uses a mobile phone as the electronic device.

[0063] Fig. 1 is a schematic structural diagram of an electronic device 100. Fig. 2 is a partial schematic diagram of the AA section in Fig. 1 .

[0064] As shown in Figures 1 and 2, the electronic device 100 may include a screen 10, a body 20, and a rear cover 30, which are buckled together in sequence. A speaker assembly 40 is provided on the body 20 to enable the electronic device to have a sound playback function.

[0065] The speaker assembly 40 is a component that converts electrical signals into sound signals for playback. The speaker assembly 40 may be composed of a diaphragm, a voice coil, a permanent magnet, and a bracket.

[0066] The operating principle of the speaker assembly 40 may include: the electronic device 100 sends an electrical signal, such as an audio signal, to the voice coil of the speaker assembly 40. When the electrical signal is applied to the voice coil of the speaker assembly 40, the voice coil generates an alternating magnetic field under the influence of the electrical signal. Simultaneously, the permanent magnet generates a constant magnetic field with constant magnitude and direction. Because the magnitude and direction of the magnetic field generated by the voice coil continuously change with the electrical signal, the interaction of the two magnetic fields causes the voice coil to move perpendicular to the direction of electrical signal transmission within the voice coil. Because the voice coil is connected to the diaphragm, the diaphragm vibrates, which in turn causes air vibrations, producing sound.

[0067] It should be noted that the electronic device 100 may also include components such as a circuit board, a battery, and a camera assembly, which are not listed here one by one.

[0068] To facilitate the explanation of the positions of various components in the electronic device 100, the embodiment of the present application exemplarily establishes a three-dimensional coordinate system based on the electronic device 100, wherein the x-axis direction is the width direction of the electronic device 100, the y-axis direction is the length direction of the electronic device 100, and the z-axis direction is the thickness direction of the electronic device 100.

[0069] FIG3 is a schematic structural diagram of a speaker assembly 40 .

[0070] As shown in Figures 2 and 3 , speaker assembly 40 employs a closed structure. It includes a housing 41 and a speaker core 42 housed within housing 41. Speaker core 42 is the core component for producing sound and includes a diaphragm that vibrates to produce sound. Housing 41 provides a sound cavity for speaker core 42, achieving the desired acoustic performance.

[0071] The speaker core 42 and the shell 41 form a front cavity 43 and a rear cavity 44. The front cavity 43 faces the screen 10, and the rear cavity 44 faces the rear shell 30. The rear cavity 44 is a closed cavity to prevent sound leakage. The area of ​​the shell 41 corresponding to the front cavity 43 is provided with a sound outlet 45, which is connected to the front cavity 43 but not to the rear cavity 44. Correspondingly, a sound outlet hole 21 is provided on the body 20, which is connected to the sound outlet 45 to form a sound outlet channel. In this way, when the speaker core 42 is working, it can push the air in the front cavity 43 to vibrate, and the vibrating air in the front cavity 43 is discharged from the sound outlet channel to form sound.

[0072] To ensure proper sound reproduction, the front cavity 43 must be sealed, and a sealing rubber ring 46 is used to press the sound outlet 45 against the body 20 to achieve a flat seal. This prevents external liquid from entering the electronic device through the sound outlet 21 and then the sound outlet 45, thereby preventing it from affecting the circuit boards on the body 20.

[0073] The speaker assembly 40 has a certain thickness h40 due to the presence of the front cavity 43 and the rear cavity 44. Thus, the speaker assembly 40 occupies the internal space of the electronic device, thereby increasing the thickness of the electronic device and making it difficult to achieve a thinner and lighter electronic device.

[0074] In order to achieve thinner and lighter electronic devices, the speaker assembly 40 can be thinned. However, the thinning of the speaker assembly 40 reduces the volume of the front cavity and the rear cavity, thereby reducing the audio performance of the speaker assembly 40. In addition, the width W of the sound outlet 45 of the closed speaker assembly 40 is 45 If it is too small, the width of the sound channel will be smaller, which will also affect the audio performance of the speaker.

[0075] FIG4 is a first structural diagram of a speaker 401 provided in an embodiment of the present application.

[0076] As shown in Figure 4, in some embodiments, to meet the requirements for thinner and lighter electronic devices and improve audio performance, embodiments of the present application provide a speaker 401. Speaker 401 may include a core 403 and a housing 404 with openings formed on two adjacent sides. Core 403 is the core component for generating external sound and includes a diaphragm for vibrating and producing sound. Housing 404 provides a sound cavity for core 403 to achieve the corresponding acoustic performance.

[0077] The core 403 is located within the housing 404, with the upper surface of the core 403 being at a first distance L1 from the edge of the open end of the housing 404. The housing 404 and the core 403 define an open cavity 402 (the dotted line area in FIG4 ). The lower surface of the core 403 and the housing 404 define a closed cavity (not shown). It should be noted that the terms "upper" and "lower" described herein are based solely on the state shown in FIG4 .

[0078] Speaker 401 may be a speaker having an open cavity 402 (hereinafter referred to as an open speaker). Open cavity 402 may be formed in the front cavity or the rear cavity. For example, if open cavity 402 is formed in the front cavity, the closed cavity formed by the lower surface of core 403 and shell 404 is the rear cavity.

[0079] However, taking the example of the open cavity 402 formed in the front cavity, in this way, in conjunction with Figure 3, the sound outlet of the open speaker will be connected to the open cavity 402, making it impossible to use the commonly used sealing method of pressing the rubber ring with the body 20 for sealing. It can be seen that the commonly used sealing method cannot meet the sealing requirements of electronic devices including open speakers, and poor sealing of electronic devices will cause abnormal audio performance of the open speaker and the risk of waterproof failure of the electronic device. Among them, the risk of waterproof failure includes air and liquid leakage from the contact surface between the speaker housing and the middle frame to the motherboard compartment, air and liquid leakage from the inclined surface of the speaker sound outlet to the motherboard compartment, or air and liquid leakage from the hole dug in the speaker sound outlet.

[0080] In order to solve the above problems, an embodiment of the present application provides a sound cavity structure 50 and a manufacturing method thereof, which utilizes the screen assembly and the middle frame assembly of the electronic device 100 to form an equivalent sound cavity of an open speaker, thereby reducing the thickness of the speaker 401 to achieve the lightweight and thin electronic device; and, effectively sealing the connection area between the screen assembly, the middle frame assembly and the speaker 401 to achieve IPX8 level waterproof sealing, so that the electronic device can be effectively waterproof; and based on the effective sealing effect, the width of the sound output channel can be increased to improve the audio performance of the speaker 401.

[0081] FIG5 is a first schematic diagram of the structure of the acoustic cavity structure 50 provided in an embodiment of the present application. FIG6 is a second schematic diagram of the structure of the acoustic cavity structure 50 provided in an embodiment of the present application. FIG7 is a third schematic diagram of the structure of the acoustic cavity structure 50 provided in an embodiment of the present application. Among them, FIG5 and FIG6 can show schematic diagrams of the structure of the acoustic cavity structure 50 from different perspectives, and FIG7 does not show the structure of the speaker 401 compared to FIG6.

[0082] As shown in Figures 5, 6 and 7, in some embodiments, the acoustic cavity structure 50 may include: a middle frame assembly, a screen assembly 301 and a speaker 401. Among them, the middle frame assembly may include a middle frame 101 and a sealing dustproof member 201. The middle frame 101 is a larger structural member that carries components such as circuit boards and batteries and is used to form the body of the acoustic cavity structure 50; the sealing dustproof member 201 and the speaker 401 are both installed on the middle frame 101 and are both located on the side of the middle frame 101 opposite to the screen assembly 301. The sealing dustproof member 201 is used to seal and dustproof the speaker 401.

[0083] Figure 8 is a first structural diagram of the middle frame 101 provided in an embodiment of the present application. Figure 9 is a second structural diagram of the middle frame 101 provided in an embodiment of the present application. Figures 8 and 9 may show structural diagrams of the middle frame 101 from different perspectives.

[0084] As shown in Figures 8 and 9, in some embodiments, to facilitate description of the internal structural layout of the acoustic cavity structure 50, the middle frame 101 is defined as including a first surface 101a and a second surface 101b. The first surface 101a is the surface of the middle frame 101 facing the screen assembly 301; the second surface 101b is the surface of the middle frame 101 facing away from the screen assembly 301. In other words, the first surface 101a and the second surface 101b are opposing surfaces.

[0085] It should be noted that the second surface 101 b of the middle frame 101 may also be provided with a circuit board compartment and a battery compartment, etc., which are not listed here one by one.

[0086] The middle frame 101 may include a first through hole 102 connecting the first surface 101a and the second surface 101b. The area where the first through hole 102 is located is used to install the sealing dustproof member 201 and the speaker 401 to subsequently form an equivalent sound cavity of the speaker 401.

[0087] The structural shape of the first through hole 102 can be adapted to the structural shape of the speaker 401. For example, if the speaker 401 has a square structure, the first through hole 102 has a square structure; if the speaker 401 has a rectangular structure, the first through hole 102 has a rectangular structure.

[0088] FIG10 is a schematic structural diagram of a middle frame assembly provided in an embodiment of the present application.

[0089] As shown in Figures 8 and 10 , in some embodiments, the sealing dustproof member 201 is attached to the second surface 101b of the middle frame 101 and covers the first through-hole 102. The sealing dustproof member 201 may include a second through-hole 202, which is connected to the first through-hole 102. Exemplarily, the second through-hole 202 has the same structure and dimensions as the first through-hole 102 to avoid affecting the volume of the equivalent acoustic cavity subsequently formed.

[0090] FIG11 is a first partial schematic diagram of the BB section in FIG6 .

[0091] As shown in Figure 11, in some embodiments, the screen assembly 301 is attached to the first surface 101a to seal the end of the first through hole 102 facing the first surface 101a. The speaker 401 is attached to the sealing dustproof member 201 to seal the end of the first through hole 102 facing the second surface 101b.

[0092] Referring again to Figure 4 , speaker 401 includes an open cavity 402 facing first through hole 102. Thus, open cavity 402, second through hole 202, first through hole 102, and screen assembly 301 can form an equivalent acoustic cavity for speaker 401. For example, when open cavity 402 is formed by a front cavity, the equivalent acoustic cavity serves as the front cavity of speaker 401.

[0093] The acoustic cavity structure 50 provided in the embodiment of the present application adopts a loudspeaker 401 having an open cavity 402, and the wall thickness of the shell 404 originally used to form the front cavity can be eliminated to reduce the z-axis thickness h of the loudspeaker 401. 401 , so that the thickness of the acoustic cavity structure 50 is reduced, thereby achieving a thinner and lighter electronic device. For example, the z-axis thickness h of the speaker 401 is 401 It can be reduced by 0.8mm, and the reduced thickness includes the wall thickness of the shell 404 and the distance to avoid the screen assembly 301. At the same time, the screen assembly 301 is fitted with the middle frame assembly to form a front shell assembly, thereby achieving sealing between the middle frame 101 and the screen assembly 301; the speaker 401 with an open cavity is then fitted with the middle frame assembly, and the sealing between the speaker 401 and the middle frame 101 is achieved through the sealing dustproof part 201. It can be seen that the sound cavity structure 50 uses the screen assembly 301 and the middle frame assembly to form an equivalent sound cavity of the open speaker 401, which can provide the speaker 401 with an equal or higher volume of working cavity while achieving the lightness and thinness of the electronic device 100. In this way, not only can effective sealing be performed to achieve IPX8 level waterproof sealing, so that the electronic device can be effectively waterproof, but also the audio performance of the speaker 401 can be guaranteed.

[0094] FIG12 is an enlarged view of region C in FIG8 .

[0095] 8 , 11 and 12 , in some embodiments, the middle frame 101 may include a middle plate 103 and a frame 104 surrounding four edges of the middle plate 103 , and the first through hole 102 is provided on the middle plate 103 .

[0096] A side of the frame 104 facing the first through hole 102 includes a sound-conducting sidewall 105 . Exemplarily, the sound-conducting sidewall 105 may be located on the top of the frame 104 .

[0097] The middle frame 101 may also include multiple sound guide holes 106 extending through the frame 104 and the sound guide sidewalls 105. The sound guide holes 106 communicate with the equivalent sound cavity. Alternatively, the top of the frame 104 may be provided with multiple sound outlet holes 107. The number of sound outlet holes 107 is the same as the number of sound guide holes 106, and they correspond one-to-one.

[0098] The sound outlet hole 107 and the sound guide hole 106 are connected to the open cavity 402 of the speaker 401, forming a sound channel. Thus, when the core 403 of the speaker 401 is in operation, it can cause the air in the equivalent sound cavity to vibrate. The vibrating air in the equivalent sound cavity is then guided out through the sound guide hole 106 and the sound outlet hole 107, forming sound.

[0099] Since the speaker 401 can be effectively sealed, the width W of the sound guide hole 106 can be increased. 106 , the width W of the sound guide hole 106 106 Greater than the width W of the sound outlet 45 of the closed speaker assembly 40 shown in FIG. 3 45 In this way, the embodiment of the present application can increase the width of the sound output channel, thereby improving the audio performance of the speaker 401.

[0100] FIG13 is a side view of the speaker 401 provided in an embodiment of the present application.

[0101] As shown in FIG13 , in some embodiments, the housing 404 of the speaker 401 may include a first opening edge 4041 and a second opening edge 4042. The first opening edge 4041, the second opening edge 4042, and the core 403 are configured to enclose an open cavity 402. A predetermined angle α0 is formed between the first opening edge 4041 and the second opening edge 4042. Exemplarily, the predetermined angle α0 is an obtuse angle.

[0102] FIG14 is a schematic structural diagram of the sound-guiding sidewall 105 and the middle plate 103 provided in an embodiment of the present application.

[0103] 11 , 13 , and 14 , in some embodiments, to adapt to the shape of the housing 404 for seamless installation of the speaker 401 , the sound-conducting sidewall 105 is connected to the middle plate 103 at a first angle α1 , where the first angle α1 is equal to the preset angle α0 .

[0104] Thus, the contact surface between the housing 404 of the speaker 401 and the sound-conducting sidewall 105 is an inclined surface. When the speaker 401 is mounted on the middle frame 101, the sound-conducting sidewall 105 can better support the speaker 401 and prevent the speaker 401 from sliding toward the middle plate 103.

[0105] FIG15 is a first structural schematic diagram of the sealing dustproof component 201 provided in an embodiment of the present application.

[0106] As shown in conjunction with Figures 8 and 15 , in some embodiments, the sealing dustproof member 201 may include a base plate 2011 and a dustproof plate 2012. To adapt to the structure of the housing 404 and ensure a sealing effect, the base plate 2011 and the dustproof plate 2012 are connected at a second angle α2; wherein the second angle α2 is equal to the preset angle α0 and also equal to the first angle α1.

[0107] FIG16 is a first exploded structural diagram of the sealing dustproof component 201 provided in an embodiment of the present application.

[0108] As shown in Figures 15 and 16 , in some embodiments, the sealing and dustproof member 201 may include a sequentially stacked substrate 203, a dustproof net 204, and a first adhesive layer 205. The substrate 203 serves as the framework of the sealing and dustproof member 201, the dustproof net 204 is used to prevent dust, and the first adhesive layer 205 is used to connect the sealing and dustproof member 201 to other structural components.

[0109] Exemplarily, the substrate 203 can be made of soft adhesive such as soft silicone or rubber, the dustproof net 204 can be made of wire mesh or woven mesh, and the first adhesive layer 205 can be made of adhesive with strong adhesive force such as backing adhesive, hot melt adhesive or ultraviolet (UV) adhesive.

[0110] The area of ​​the substrate 203 used to form the base plate 2011 includes a first hollow hole 2031, and the area of ​​the substrate 203 used to form the dustproof plate 2012 includes a second hollow hole 2032; the area of ​​the dustproof net 204 used to form the base plate 2011 includes a third hollow hole 2041; the area of ​​the first adhesive layer 205 used to form the base plate 2011 includes a fourth hollow hole 2051, and the area of ​​the first adhesive layer 205 used to form the dustproof plate 2012 includes a fifth hollow hole 2052.

[0111] Thus, after the substrate 203, the dustproof net 204, and the first adhesive layer 205 are stacked together in sequence, the first hollow hole 2031, the third hollow hole 2041, and the fourth hollow hole 2051 correspond to and are connected to form the second through hole 202. The second hollow hole 2032 and the fifth hollow hole 2052 correspond to and are connected to each other. Because the dustproof net 204 is located between the substrate 203 and the first adhesive layer 205, the second hollow hole 2032 and the fifth hollow hole 2052 can be used to expose the area of ​​the dustproof net 204 that is used to form the dustproof sheet 2012.

[0112] In some embodiments, the substrate 203 can be integrally formed with the dustproof net 204. In this way, the sealing dustproof part 201 adopts a double-layer structure, which can save the z-direction space occupied by the acoustic cavity structure 50, thereby reducing the z-direction thickness of the acoustic cavity structure 50 and further reducing the z-direction thickness of the electronic device.

[0113] FIG17 is a second exploded structural diagram of the sealing dustproof component 201 provided in an embodiment of the present application.

[0114] 15 and 17 , in some embodiments, the sealing and dustproof member 201 may further include a third adhesive layer 207, which is located between the substrate 203 and the dustproof net 204. Thus, the sealing and dustproof member 201 may be formed by stacking the substrate 203, the third adhesive layer 207, the dustproof net 204, and the first adhesive layer 205 in this order.

[0115] The area of ​​the third adhesive layer 207 forming the base sheet 2011 includes a sixth hollow hole 2071, and the area of ​​the third adhesive layer 207 forming the dustproof sheet 2012 includes a seventh hollow hole 2072. Thus, the first hollow hole 2031, the sixth hollow hole 2071, the third hollow hole 2041, and the fourth hollow hole 2051 correspond to and communicate with each other to form the second through hole 202. The second hollow hole 2032, the seventh hollow hole 2072, and the fifth hollow hole 2052 correspond to and communicate with each other, exposing the area of ​​the dustproof net 204 forming the dustproof sheet 2012, thereby realizing the dustproof function of the dustproof net 204.

[0116] In some embodiments, to conserve z-direction space within the acoustic cavity structure 50, the dust screen 204 may not be provided in the area of ​​the base plate 2011 within the sealed dustproof member 201, but may be provided only in the area of ​​the dustproof plate 2012. Thus, by reducing the thickness of the dust screen 204 in the z-direction space, the z-direction thickness of the acoustic cavity structure 50 can be reduced, further reducing the z-direction thickness of the electronic device.

[0117] Fig. 18 is a second partial schematic diagram of the BB section in Fig. 6. Fig. 18 only shows the structure of the middle frame 101 and the sealing dustproof member 201.

[0118] As shown in Figure 18, in some embodiments, when the sealing dustproof member 201 is installed on the middle frame 101, the base plate 2011 is aligned with the middle plate 103, and the dustproof member 2012 is aligned with the sound-conducting sidewall 105. The center of the base plate 2011 includes a second through hole 202. For example, the edge of the base plate 2011 forming the second through hole 202 can be flush with the edge of the middle plate 103 forming the first through hole 102, thereby facilitating the subsequent formation of an equivalent acoustic cavity of a predetermined volume. The predetermined equivalent acoustic cavity can meet the sound generation requirements of the speaker 401, ensuring audio performance.

[0119] Referring again to Figure 11, when installing the speaker 401, the first opening edge 4041 of the housing 404 is in contact with the base plate 2011, and the second opening edge 4042 of the housing 404 is in contact with the dustproof sheet 2012. In this way, the speaker 401 is sealed and in contact with the middle frame 101 via the sealed dustproof member 201, and forms an equivalent acoustic cavity with the screen assembly 301. The dustproof sheet 2012 is connected to the equivalent acoustic cavity via the dustproof net 204, so that the sound generated by the core 403 of the speaker 401 during operation can be sequentially guided out through the sound guide hole 106 and the sound outlet hole 107. At the same time, the dustproof net 204 is used to prevent external dust from entering the acoustic cavity structure 50.

[0120] 4 and 15 again, the edge of the open end of the housing 404 of the speaker 401 includes an annular wire groove 405 . The annular wire groove 405 is continuously formed on the edge of the housing 404 for forming the open cavity 402 .

[0121] The surface of the substrate 203 includes a first sealing rib 206, which is continuously formed in the area near the edge of the base plate 2011 and the dustproof sheet 2012. The first sealing rib 206 is an annular structure that can achieve an annular seal. The first sealing rib 206 can be made of an elastic and deformable material, such as rubber.

[0122] When attaching the speaker 401 to the sealing and dustproof member 201, first secure the speaker 401 to the middle frame 101 with screws to stabilize it. Simultaneously, insert the first sealing rib 206 into the annular wire groove 405 to abut against the edge of the opening of the housing 404. This effectively seals both the sound guide hole 106 and the open cavity 402 from the middle frame 101, preventing external liquid from entering the open cavity 402 through the sound guide hole 106 and then leaking into the circuit board area.

[0123] FIG19 is an enlarged view of the D region in FIG11 .

[0124] As shown in Figure 19, in some embodiments, the first sealing rib 206 and the shell 404 adopt an interference fit. By utilizing the deformable characteristics of the first sealing rib 206, the first sealing rib 206 can be deformed according to the structure of the annular wire groove 405 to be tightly combined with the annular wire groove 405 to improve the sealing effect.

[0125] First sealing rib 206 protrudes from the corresponding contact surface relative to annular groove 405, as shown by the dashed line portion of first sealing rib 206 in Figure 18. Thus, when speaker 401 is attached to sealing dustproof member 201, first sealing rib 206 is embedded in annular groove 405 and abuts against housing 404. Leveraging its elasticity, first sealing rib 206 is flattened by housing 404 and elastically deformed to apply pressure to housing 404, thereby improving the sealing effect at the contact surface between speaker 401 and sealing dustproof member 201.

[0126] FIG20 is a third structural diagram of the middle frame 101 provided in an embodiment of the present application, wherein the state shown in FIG20 is a structural diagram of the first surface 101 a of the middle frame 101 .

[0127] As shown in conjunction with Figures 11 and 20 , in some embodiments, the acoustic cavity structure 50 may further include a second adhesive layer 501. The second adhesive layer 501 continuously covers the edges of the first surface 101a and the edges of the first through-hole 102. In this way, the second adhesive layer 501 can be used to provide an annular seal around the edges of the middle frame 101 and the opening, thereby improving the sealing effect.

[0128] The second adhesive layer 501 adheres the screen assembly 301 to the first surface 101a, improving the bonding strength between the screen assembly 301 and the middle frame 101. This also enhances the sealing effect of the screen assembly 301 on the end of the first through-hole 102 facing the first surface 101a. This allows for a well-sealed equivalent acoustic cavity when subsequently coupled to the speaker 401, thereby improving audio performance.

[0129] FIG21 is a second structural diagram of the speaker 401 provided in an embodiment of the present application.

[0130] As shown in FIG21 , in some embodiments, the speaker 401 may further include a second sealing rib 406 formed continuously along the edge of the opening end of the housing 404. The second sealing rib 406 is an annular structure that can achieve an annular seal. Exemplarily, the second sealing rib 406 can be formed using a glue drawing process.

[0131] In this loudspeaker 401 , the annular wire groove 405 (as shown in FIG. 4 ) may be omitted from the edge of the open end of the housing 404 , or the annular wire groove 405 may be retained and a second sealing rib 406 may be provided inside the annular wire groove 405 .

[0132] The second sealing rib 406 is made of the same material and has the same properties as the first sealing rib 206 , and both can be elastically deformed by external forces.

[0133] FIG22 is a second structural schematic diagram of the sealing dustproof component 201 provided in an embodiment of the present application.

[0134] As shown in FIG22 , in some embodiments, to accommodate the structure of speaker 401 shown in FIG21 , the first sealing rib 206 is removed from the surface of base plate 203 of sealing dustproof member 201, forming a flat surface. Alternatively, a second annular wire groove (not shown) may be provided on the surface of base plate 203, the structure of which may be the same as that of annular wire groove 405.

[0135] The material of the base plate 203 in the sealing dustproof member 201 can be a hard material, such as a glass fiber board, a steel sheet or a plastic bracket, etc. In this way, a certain hardness can be provided for the sealing dustproof member 201 to facilitate the pressure applied by the second sealing rib 406.

[0136] When the speaker 401 is attached to the sealing dustproof member 201, the speaker 401 can use the second sealing rib 406 to abut against the flat substrate 203, or the second sealing rib 406 can be embedded in the second annular groove on the substrate 203 to abut against the substrate 203. In this way, the sealing effect between the speaker 401 and the sealing dustproof member 201 can be improved.

[0137] It should be noted that the manner and effect of achieving sealing between the speaker 401 and the substrate 203 using the second sealing rib 406 can be referred to as shown in FIG19 , which will not be described in detail here.

[0138] FIG23 is a third structural schematic diagram of the sealing dustproof component 201 provided in an embodiment of the present application.

[0139] As shown in FIG23 , in some embodiments, since the sealing dustproof member 201 shown in FIG15 is made of a soft rubber material as a frame, the sealing dustproof member 201 is relatively soft and easily bends and deforms during installation. To increase the hardness of the sealing dustproof member 201 , the sealing dustproof member 201 may further include a bracket 208 .

[0140] The bracket 208 is located in the second through hole 202 and is used to support the sealing dustproof component 201. The bracket 208 can be made of polycarbonate (PC) plastic material or a material with a certain hardness.

[0141] For example, the bracket 208 may be connected to the substrate 203 , and after the substrate 203 is formed, the bracket 208 may be injection molded in the second through hole 202 .

[0142] Bracket 208 facilitates the installation of sealing and dustproof member 201 onto middle frame 101 and is not an integral component of sealing and dustproof member 201. Therefore, bracket 208 needs to be removed after sealing and dustproof member 201 is attached to second surface 101b. This removal process can be performed using laser ablation or other methods.

[0143] 22 , since its base plate 203 can be made of a hard material, the sealing dustproof member 201 has a certain hardness. Therefore, in the sealing dustproof member 201 shown in FIG22 , its base plate 203 may not be provided with a bracket 208 for auxiliary support.

[0144] In some embodiments, in the acoustic cavity structure 50 shown in the aforementioned embodiment, the open cavity 402 of the speaker 401 is located in the front cavity, facing the screen assembly 301, and a seal is formed with the screen assembly 301. If the open cavity 402 is located in the rear cavity, that is, facing the rear housing of the electronic device 100, a seal can be formed with the rear housing of the electronic device 100. If the open cavity 402 faces the battery cover, a seal can be formed with the battery cover.

[0145] It should be noted that the solution of forming a seal using the rear shell or the battery cover can refer to the solution of forming a seal using the screen assembly 301, which will not be repeated here.

[0146] The acoustic cavity structure 50 provided in the embodiment of the present application uses a speaker 401 with an open cavity 402, which can reduce the thickness of the speaker 401 and thus reduce the space occupied in the thickness direction of the acoustic cavity structure 50. The speaker 401 is bonded by the sealing dustproof part 201, which can improve the sealing effect to achieve IPX8 level waterproof sealing, preventing water from entering from the outside through the sound outlet 107 and leaking into the circuit board compartment. At the same time, the screen assembly 301 is sealed and bonded to the middle frame 101 through the second adhesive layer 501. The screen assembly 301, the first through hole 102, the second through hole 202 and the open cavity 402 can form an equivalent acoustic cavity of the speaker 401. In this way, while making the thickness of the electronic device 100 smaller, the volume of the equivalent acoustic cavity can meet the volume requirements required for the speaker 401 to produce sound, thereby ensuring audio performance. In addition, due to the good sealing effect, the width of the sound channel can be expanded while ensuring the sealing width at both ends of the sound guide hole 106, thereby further improving the audio performance of the speaker 401. It can be seen that the acoustic cavity structure 50 can achieve lightweight and thin electronic devices, improve the sealing effect for effective waterproofing, and ensure the audio performance of electronic devices.

[0147] Figure 24 is a flow chart of the method for manufacturing the acoustic cavity structure provided in an embodiment of the present application.

[0148] As shown in FIG24 , in some embodiments, the method for manufacturing the acoustic cavity structure is used to manufacture the acoustic cavity structure 50 provided in any of the aforementioned embodiments. The method may include the following steps S101 to S104:

[0149] Step S101, provide a middle frame assembly, a screen assembly and a speaker.

[0150] The middle frame assembly includes a middle frame 101 and a sealing dustproof part 201. The middle frame 101 includes a first surface 101a, a second surface 101b, and a first through hole 102 connecting the first surface 101a and the second surface 101b. The first surface 101a and the second surface 101b are opposite surfaces.

[0151] Figure 25 is a schematic diagram of the process flow for making a sealing dustproof part provided in an embodiment of the present application.

[0152] In some embodiments, a sealing dustproof member is manufactured according to the following steps 201 to 204:

[0153] In step 201, as shown in FIG25(a), a substrate 203 and a dust screen 204 are provided. A first hollow hole 2031 and a second hollow hole 2032 are machined on the substrate 203; and a third hollow hole 2041 is machined on the dust screen 204.

[0154] In step 202, as shown in FIG25(b), the substrate 203 and the dust screen 204 are integrally formed, and a first sealing rib 206 is injection-molded on the surface of the substrate 203 to form an assembly to save z-axis stacking space. Furthermore, an external force is applied to a predetermined area of ​​the assembly to cause deformation of the assembly.

[0155] The preset area may be an area between the first hollow hole 2031 and the second hollow hole 2032 , so that the deformed assembly includes the base piece 2011 and the dustproof piece 2012 , and a second angle α2 is formed between the base piece 2011 and the dustproof piece 2012 .

[0156] In step 203 , as shown in FIG. 25 ( c ), a bracket 208 is injection-molded in the second through hole 101 . The bracket 208 can be fixed on the substrate 203 to support the sealing dustproof component 201 .

[0157] It should be noted that the bracket 208 is an auxiliary structure and can be selected or discarded according to the actual assembly effect. Therefore, step 203 may not be performed.

[0158] In step 204 , as shown in FIG. 25 ( d ), a first adhesive layer 205 is attached to the surface of the dustproof net 204 away from the substrate 203 to obtain a sealed dustproof member 201 .

[0159] In some embodiments, if the z-direction stacking space is sufficient and to avoid high processing costs, the substrate 203 and the dustproof net 204 may not be formed as an integral unit, but a third adhesive layer 207 (back glue or other adhesive method) may be formed between the substrate 203 and the dustproof net 204 (as shown in Figure 17).

[0160] Step S102 : attaching the sealing and dustproof member 201 to the second surface 101 and covering the first through hole 102 .

[0161] The sealing and dustproof component 201 includes a second through hole 202 , and the second through hole 202 is connected to the first through hole 102 .

[0162] FIG26 is a schematic diagram of a process flow for manufacturing a middle frame assembly according to an embodiment of the present application.

[0163] In conjunction with Figures 11 and 26(a), in some embodiments, a middle frame 101 and a sealing dustproof member 201 are provided. A sound-conducting sidewall 105 is fabricated on the frame 104 of the middle frame 101; the sound-conducting sidewall 105 is connected to the middle plate 103 of the middle frame 101 at a first angle α1, where the first angle α1 is equal to the second angle α2; and a plurality of sound-conducting holes 106 are fabricated in the laminated structure of the frame 104 and the sound-conducting sidewall 105, extending through the frame 104 and the sound-conducting sidewall 105.

[0164] As shown in Figures 11 and 26(b), the sealing and dustproof member 201 is attached to the second surface 101b of the middle frame 101 using the first adhesive layer 205, covering the first through-hole 102. The base plate 2011 is attached to the middle plate 103, the dustproof sheet 2012 is attached to the sound-conducting sidewall 105, and the second through-hole 202 is connected to the first through-hole 102, with their edges aligned.

[0165] As shown in Figure 26(c), the bracket 208 in the sealing dustproof member 201 is removed by laser cutting to obtain the middle frame assembly. Figure 26(c) shows the structure of the first surface 101a and the structure of the second surface 101b of the middle frame assembly.

[0166] Step S103 , attaching the screen assembly 301 to the first surface 101 a of the middle frame 101 .

[0167] FIG27 is a schematic diagram of the first process flow for manufacturing the acoustic cavity structure 50 provided in an embodiment of the present application.

[0168] As shown in (a) of Figure 27, in some embodiments, a second adhesive layer 501 is applied to the four edges of the first surface 101a and the edge of the first through hole 102; the screen assembly 301 is attached to the first surface 101a of the middle frame 101 using the second adhesive layer 501 to obtain a front shell assembly.

[0169] In this way, on the first surface 101 a , an annular seal is completed at the opening position of the middle frame 101 using adhesive or other sealing glue, and then sealed with the screen assembly 301.

[0170] Step S104 , attaching the speaker 401 to the sealing dustproof member 201 .

[0171] As shown in FIG. 27( b ), in some embodiments, the speaker 401 includes an open cavity 402 facing the first through hole 102 , and an annular wire groove 405 is processed on the edge of the open end of the housing 404 of the speaker 401 .

[0172] As shown in Figures 19 and 27(c), in some embodiments, the speaker 401 is assembled with the front housing assembly. The speaker 401 is snapped onto the sealing dustproof member 201 and fixed to the second surface 101b of the middle frame 101. The first sealing rib 206 is inserted into the annular wire groove 405 so that the open end edge of the housing 404 of the speaker 401 abuts the first sealing rib 206 to achieve a seal.

[0173] In this way, the open cavity 402, the second through hole 202, the first through hole 102 and the screen assembly 301 form an equivalent acoustic cavity of the speaker 401. The sound guide hole 106 is connected to the equivalent acoustic cavity.

[0174] FIG28 is a schematic diagram of a second process flow for manufacturing the acoustic cavity structure 50 provided in an embodiment of the present application.

[0175] As shown in FIG28( a ), in some embodiments, a second sealing rib 406 is injection molded at the edge of the open end of the speaker housing 404. In this scenario, the surface of the base plate 203 of the sealing dustproof member 201 can be flat or include a second annular wire groove.

[0176] As shown in FIG28( b ), in some embodiments, the speaker 401 is assembled with the front housing assembly. The speaker 401 is snapped onto the sealing dustproof member 201 and fixed to the second surface 101 b of the middle frame 101. The substrate 203 is then brought into contact with the second sealing rib 406 to achieve a seal.

[0177] In this way, the open cavity 402 , the second through hole 202 , the first through hole 102 and the screen assembly 301 form an equivalent acoustic cavity of the speaker 401 .

[0178] In the manufacturing method of the acoustic cavity structure 50 provided in the embodiment of the present application, the screen assembly 301 is bonded to the middle frame assembly to form a front shell assembly, thereby achieving a seal between the middle frame 101 and the screen assembly 301; the speaker 401 with an open cavity is then bonded to the middle frame assembly, and the sealing between the speaker 401 and the middle frame 101 is achieved through the sealing dustproof part 201. It can be seen that the acoustic cavity structure 50 can form an equivalent acoustic cavity, providing a working cavity of the same volume for the speaker 401. In this way, not only can effective sealing be performed to achieve an IPX8 level of waterproof sealing and enable the electronic device to be effectively waterproof, but the audio performance of the speaker 401 can also be guaranteed.

[0179] It should be noted that in the method for manufacturing the acoustic cavity structure provided in the embodiment of the present application, the description of the structural characteristics of the acoustic cavity structure 50 and the beneficial effects achieved is relatively brief. The corresponding content can refer to the content of the acoustic cavity structure embodiment and will not be repeated here.

[0180] An embodiment of the present application further provides an electronic device, comprising a rear housing and an acoustic cavity structure 50 provided in any of the aforementioned embodiments. The rear housing is snap-fitted to the second surface 101b of the middle frame 101 to form a closed cavity with the acoustic cavity structure 50. Thus, the acoustic cavity structure 50 is relatively thin and has excellent sealing and audio performance, thereby achieving a thinner and lighter electronic device, effectively waterproofing the electronic device, and ensuring the audio performance of the electronic device.

[0181] It should be noted that those skilled in the art will readily conceive of other embodiments of the present application after considering the specification and practicing the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope of this application is indicated by the following claims.

[0182] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A sound cavity structure, characterized in that: include: A middle frame assembly, comprising a middle frame (101) and a sealing dustproof member (201); the middle frame (101) comprises a first surface (101a), a second surface (101b), and a first through hole (102) connecting the first surface (101a) and the second surface (101b); wherein the first surface (101a) and the second surface (101b) are opposite surfaces; the sealing dustproof member (201) is attached to the second surface (101b) and covers the first through hole (102); the sealing dustproof member (201) comprises a second through hole (202), and the second through hole (202) is connected to the first through hole (102); A screen assembly (301) and a speaker (401), wherein the screen assembly (301) is attached to the first surface (101a), and the speaker (401) is attached to the sealing dustproof component (201); the speaker (401) comprises an open cavity (402) facing the first through hole (102), and the open cavity (402), the second through hole (202), the first through hole (102) and the screen assembly (301) form an equivalent sound cavity of the speaker (401).

2. The acoustic cavity structure according to claim 1, characterized in that: The middle frame (101) comprises a middle plate (103) and a frame (104) surrounding the edge of the middle plate (103); the first through hole (102) is provided on the middle plate (103); A side of the frame (104) facing the first through hole (102) comprises a sound-conducting side wall (105), and the sound-conducting side wall (105) is connected to the middle plate (103) at a first angle; The middle frame (101) further comprises a plurality of sound guide holes (106) penetrating the frame (104) and the sound guide side wall (105), and the sound guide holes (106) are connected to the equivalent sound cavity.

3. The acoustic cavity structure according to claim 2, characterized in that: The sealing dustproof member (201) comprises a base plate (2011) and a dustproof plate (2012), wherein the base plate (2011) and the dustproof plate (2012) are connected at a second angle; wherein the second angle is equal to the first angle; The base sheet (2011) is bonded to the middle plate (103), and the dustproof sheet (2012) is bonded to the sound-conducting side wall (105); The center of the base plate (2011) includes the second through hole (202).

4. The acoustic cavity structure according to claim 3, characterized in that: The sealing dustproof component (201) comprises a substrate (203), a dustproof net (204) and a first adhesive layer (205) which are stacked in sequence; The area of ​​the substrate (203) used to form the base sheet (2011) includes a first hollow hole (2031), and the area of ​​the substrate (203) used to form the dustproof sheet (2012) includes a second hollow hole (2032); The area of ​​the dustproof net (204) used to form the base sheet (2011) comprises a third hollow hole (2041); The area of ​​the first adhesive layer (205) used to form the base sheet (2011) includes a fourth hollow hole (2051), and the area of ​​the first adhesive layer (205) used to form the dustproof sheet (2012) includes a fifth hollow hole (2052); The first hollow hole (2031), the third hollow hole (2041) and the fourth hollow hole (2051) are connected to form the second through hole (202); the second hollow hole (2032) and the fifth hollow hole (2052) are connected to expose the area of ​​the dustproof net (204) used to form the dustproof sheet (2012).

5. The acoustic cavity structure according to claim 4, characterized in that: The loudspeaker (401) comprises a core (403) and a shell (404) with two adjacent side surfaces forming openings; The inner core (403) is located inside the shell (404) and has a first distance L1 from the edge of the opening end of the shell (404) to enclose the open cavity (402).

6. The acoustic cavity structure according to claim 5, characterized in that: The edge of the opening end of the housing (404) comprises an annular wire groove (405); The surface of the substrate (203) comprises a first sealing rib (206), wherein the first sealing rib (206) is continuously formed in the area adjacent to the edges of the base sheet (2011) and the dustproof sheet (2012); The first sealing rib (206) is used to be embedded in the annular wire groove (405) so as to abut against the edge of the opening end of the shell (404).

7. The acoustic cavity structure according to claim 1, characterized in that: Also includes: a second adhesive layer (501); The second adhesive layer (501) continuously covers the edges around the first surface (101a) and the edge of the first through hole (102); The second adhesive layer (501) is used to achieve the bonding of the screen assembly (301) and the first surface (101a), and is used to seal the end of the first through hole (102) facing the first surface (101a).

8. The acoustic cavity structure according to claim 5, characterized in that: The sealing and dustproof component (201) further includes: a third adhesive layer (207); The third adhesive layer (207) is located between the substrate (203) and the dustproof net (204); The area of ​​the third adhesive layer (207) used to form the base sheet (2011) includes a sixth hollow hole (2071), and the area of ​​the third adhesive layer (207) used to form the dustproof sheet (2012) includes a seventh hollow hole (2072); The sixth hollow hole (2071) is used to form the second through hole (202), and the seventh hollow hole (2072) is used to expose the area of ​​the dustproof net (204) used to form the dustproof sheet (2012).

9. The acoustic cavity structure according to claim 8, characterized in that: The loudspeaker (401) further comprises a second sealing rib (406), wherein the second sealing rib (406) is continuously formed at the edge of the opening end of the housing (404); The second sealing rib (406) is used for abutting against the substrate (203).

10. The acoustic cavity structure according to claim 1, characterized in that: The sealing dustproof component (201) further includes a bracket (208); The bracket (208) is located in the second through hole (202) and is used to support the sealing dustproof component (201); The support (208) is used to be cut off after the sealing and dustproof component (201) is attached to the second surface (101b).

11. A method for manufacturing a sound cavity structure, characterized in that: For making the acoustic cavity structure according to any one of claims 1 to 10, the method comprises: A middle frame assembly, a screen assembly and a speaker are provided, wherein the middle frame assembly comprises a middle frame and a sealing dustproof member, wherein the middle frame comprises a first surface, a second surface, and a first through hole connecting the first surface and the second surface; wherein the first surface and the second surface are opposite surfaces; The sealing and dustproof member is attached to the second surface and covers the first through hole, wherein the sealing and dustproof member includes a second through hole, and the second through hole is connected to the first through hole; Attaching the screen assembly to the first surface of the middle frame; The speaker is attached to the sealing dustproof part; the speaker includes an open cavity facing the first through hole, and the open cavity, the second through hole, the first through hole and the screen assembly form an equivalent sound cavity of the speaker.

12. The method according to claim 11, characterized in that Also includes: Processing a sound-conducting side wall on the frame of the middle frame; wherein the sound-conducting side wall is connected to the middle plate of the middle frame at a first angle; In the stacked structure of the frame and the sound-conducting side wall, a plurality of sound-conducting holes penetrating the frame and the sound-conducting side wall are processed, and the sound-conducting holes are communicated with the equivalent sound cavity.

13. The method according to claim 12, characterized in that Follow the steps below to make the sealing dustproof part: Provide substrate, dust screen and first adhesive layer; Integrally molding the substrate and the dustproof net to obtain an assembly; Applying external force to a preset area of ​​the assembly to cause the assembly to deform; The first adhesive layer is adhered to the surface of the dustproof net away from the substrate to obtain a sealed dustproof component; wherein the sealed dustproof component includes a base plate and a dustproof plate, and a second angle is formed between the base plate and the dustproof plate, and the second angle is equal to the first angle.

14. The method according to claim 13, characterized in that The step of attaching the sealing and dustproof member to the second surface and covering the first through hole comprises: The first adhesive layer is used to adhere the base plate of the sealing dustproof component to the middle plate, and the dustproof sheet of the sealing dustproof component is adhered to the sound-conducting side wall.

15. The method according to claim 11, characterized in that The step of attaching the screen assembly to the first surface of the middle frame includes: Applying a second adhesive layer on the edges of the first surface and the edges of the first through hole; The screen assembly is attached to the first surface of the middle frame by using the second adhesive layer.

16. The method according to claim 13, characterized in that The step of attaching the speaker to the sealing dustproof member comprises: Processing an annular wire groove at the edge of the open end of the speaker housing, and injection molding a first sealing rib on the surface of the substrate, wherein the first sealing rib is continuously formed in the area adjacent to the edge of the base sheet and the dustproof sheet; The speaker is buckled onto the sealing dustproof part and fixed to the second surface of the middle frame, and The first sealing rib is embedded in the annular wire groove so that the edge of the opening end of the speaker housing abuts against the first sealing rib.

17. The method according to claim 13, characterized in that The manufacturing of the sealing dustproof part also includes: A third adhesive layer is attached between the substrate and the dustproof net.

18. The method according to claim 13, characterized in that The step of attaching the speaker to the sealing dustproof member comprises: Injection molding a second sealing rib at the edge of the opening end of the speaker housing; The speaker is buckled onto the sealing and dustproof component and fixed to the second surface of the middle frame, and the substrate is abutted against the second sealing rib.

19. The method according to claim 13, characterized in that The manufacturing of the sealing dustproof part also includes: Injection-molding a bracket in the second through hole, the bracket being used to support the sealing and dustproof component; After the sealing and dustproofing member is attached to the second surface and covers the first through hole, the method further includes: The bracket in the sealing dustproof part is cut off.

20. An electronic device, characterized in that: It comprises the acoustic cavity structure as described in any one of claims 1-10.

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