Cold and hot dual-purpose cup

Abstract

The invention discloses a cold and hot dual-purpose cup which comprises a cup body, a cup cover and a semiconductor refrigeration system arranged in the cup body, the cup body comprises a shell, an inner container and a support, the bottom wall of the inner container or the whole inner container is made of metal, and the semiconductor refrigeration system comprises a semiconductor refrigeration piece, a refrigeration piece heat insulation plate, first cooling fins and a cooling fan; the support comprises an upper support body and a lower support body, the upper support body is fixed to the bottom of the inner container, and the upper support body and the lower support body are folded to form an installation cavity of the semiconductor refrigeration system. The shell is provided with a plurality of first heat dissipation holes corresponding to the first heat dissipation fan, and a bottom plate of the shell is provided with a second ventilation opening. The refrigerating system is installed and fixed through the upper support and the lower support, the supports are positioned, installed and fixed in the shell through the multiple installation columns, the structure is simple and reasonable, and the product cost is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor refrigeration, in particular to a hot and cold dual-purpose cup. Background Art

[0002] When people engage in outdoor leisure activities, they often need to refrigerate food, drinks, etc. Chinese utility model CN204176959U discloses a vehicle-mounted heating and cooling dual-purpose bag, comprising: a heating and cooling device, including a semiconductor refrigeration plate, a metal plate and a cooling fan, one side of the semiconductor refrigeration plate is tightly fitted with the metal plate, and the other side of the semiconductor refrigeration plate is in contact with a heat sink, and the heat sink is externally provided with a cooling fan; an on-board power supply, which supplies power to the semiconductor refrigeration plate and the cooling fan; a bag body, which comprises an inner layer, a middle layer and an outer layer, the inner layer being a heat-conducting layer, the middle layer being a heat-insulating layer, and the outer layer being cotton cloth. This patent discloses a solution for providing cooling or heating with semiconductor refrigeration sheets, and uses cotton cloth as a soft shell. However, this technical solution is to transfer the heat or cooling generated by the semiconductor refrigeration sheets to the metal fibers in the inner layer of the bag through metal plates and metal tubes. The metal fibers then transfer the heat or cooling to the objects to achieve heating or cooling. Its heat transfer effect is not as good as that of air cooling. The applicant has made further improvements to the existing technology by improving the heat transfer method in the cloth bag and the structure of the semiconductor refrigeration system, thus resulting in the present application. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a hot and cold dual-purpose cup, which adopts a fiber soft shell as the box body, and a semiconductor refrigeration system with air-cooled heat transfer is fixedly installed on the soft shell. It has the advantages of good heat exchange effect and scientific and reasonable structure, so as to overcome the shortcomings of the existing technology.

[0004] In order to solve the above technical problems, the technical solution of the present invention is:

[0005] A hot and cold dual-purpose cup, comprising a cup body, a cup lid, and a semiconductor refrigeration system arranged in the cup body, characterized in that: the cup body comprises an outer shell, an inner liner, and a bracket, the bottom wall of the inner liner or the entire inner liner is made of metal, the semiconductor refrigeration system comprises a semiconductor refrigeration plate, a refrigeration plate insulation board, a first heat dissipation fin, and a heat dissipation fan; one end of the semiconductor refrigeration plate exchanges heat with the bottom wall of the inner liner, and the other end exchanges heat with the first heat dissipation fin, the bracket comprises an upper bracket and a lower bracket, the upper bracket is fixed to the bottom of the inner liner, and the upper bracket and the lower bracket are combined to form an installation cavity for the semiconductor refrigeration system, the outer shell is provided with a plurality of first heat dissipation holes corresponding to the position of the first heat dissipation fan, and a second vent is provided on the bottom plate of the outer shell, therefore, an air forced convection channel is formed by the first heat dissipation holes, the first heat dissipation fan, the air duct opening of the lower bracket, and the second vent, and an insulation layer is provided between the inner liner and the outer shell.

[0006] The upper bracket includes a mounting ring and a first mounting column arranged below the mounting ring, and the mounting ring is fixedly connected to the inner tank; the lower bracket includes a fan rack and a second mounting column, and the cooling fan is installed in the fan rack. The fan rack is provided with a duct enclosure, and the duct enclosure is used to surround the side of the cooling fan to form an air duct, and a fan mounting plate is provided at the bottom of the fan rack, and the side of the fan mounting plate is hollowed out to form the air duct opening of the lower bracket; the first mounting column and the second mounting column are adapted to be connected and fixed.

[0007] The second mounting column is arranged around the air duct enclosure.

[0008] A third mounting column is provided at the lower portion of the lower bracket, a fourth mounting column is provided on the bottom plate of the housing, and the third mounting column and the fourth mounting column are adapted and fixedly connected.

[0009] A first positioning plate is further provided below the mounting ring, and a second positioning plate is provided on the bottom or base plate of the housing, and the circuit board component is clamped by the first and second positioning plates.

[0010] The bottom of the shell is provided with an opening, an edge of the opening is provided with a step, and the bottom plate is installed by pressing on the step.

[0011] The cup cover includes a first cover body and a second cover body. A water outlet is provided on both the first cover body and the second cover body. The two water outlets are fitted together. A hand-flip cover plate is provided on the first cover body corresponding to the position of the water outlet. The hand-flip cover plate is provided with a sealing head. The sealing head is used to be inserted into the water outlet to prevent water overflow.

[0012] The second cover is used to cover the cup body. A sealing ring is provided between the inner mounting wall of the second cover and the inner liner of the cup body. The outer wall of the sealing ring is provided with a tooth-shaped structure.

[0013] The inner container is provided with a flange, the flange wraps the upper edge of the cup body shell, and the outer edge of the second cover body abuts against the inner container flange.

[0014] The above technical solution has the following beneficial effects:

[0015] The present invention adopts a semiconductor refrigeration system to integrate the heating and cooling functions into one device. The heating and cooling functions can be switched simply by changing the direction of the current. The beverage or food in the cup can be refrigerated and stored, and can also be heated and kept warm, achieving the purpose of multi-purpose hot and cold.

[0016] The present invention installs and fixes the refrigeration system through upper and lower brackets, and the brackets are positioned and fixed inside the shell through multiple installation columns. The structure is simple and reasonable, and the product material cost is low, making the product more competitive. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic structural diagram of a hot and cold dual-purpose cup of the present invention.

[0018] Figure 2 This is a schematic diagram of the assembly structure of the inner liner and the bracket of the hot and cold dual-purpose cup of the present invention.

[0019] Figure 3 This is a cross-sectional diagram of the inner tank and bracket assembly.

[0020] Figure 4 Exploded view of a hot and cold dual-purpose cup (shell omitted).

[0021] Figure 5 This is a partial enlarged view of the cross-sectional view of the inner tank and upper bracket assembly. DETAILED DESCRIPTION

[0022] The following is a further description of specific embodiments of the present invention in conjunction with the accompanying drawings. It should be noted that the description of these embodiments is intended to facilitate understanding of the present invention and does not constitute a limitation of the present invention. In addition, the technical features involved in the various embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

[0023] See also Figure 1-Figure 5 As shown, the present invention discloses a hot and cold dual-purpose cup, comprising a cup body 10, a cup cover 20, and a semiconductor refrigeration system arranged in the cup body. The cup body comprises an outer shell, an inner liner 1, and a bracket. The material of the inner liner is metal, or the bottom of the inner liner is metal and the cup body is plastic. The semiconductor refrigeration system comprises a semiconductor refrigeration plate 3, a refrigeration plate heat insulation board 4, a first heat dissipation fin 5, and a heat dissipation fan 6; one end of the semiconductor refrigeration plate exchanges heat with the bottom wall of the inner liner, and the other end exchanges heat with the first heat dissipation fin. The bracket comprises an upper bracket 2 and a lower bracket 7. The upper bracket is fixed to the bottom of the inner liner 1. The upper bracket and the lower bracket are combined to form an installation cavity for the semiconductor refrigeration system. The outer shell is provided with a plurality of first heat dissipation holes corresponding to the position of the first heat dissipation fan. The first heat dissipation holes are located at the bottom of the inner liner. Figure 1 In the area marked 11 (the first heat dissipation hole is not shown in the figure), a second vent 81 is provided on the bottom plate 8 of the outer shell. Therefore, an air forced convection channel is formed by the first heat dissipation hole, the first heat dissipation fan 6, the air duct opening of the lower bracket, and the second vent 81. An insulation layer is provided between the inner liner and the outer shell, and the insulation layer uses 2mm thick insulation cotton.

[0024] The upper bracket includes a mounting ring 21 and a first mounting column 23 positioned below the mounting ring. The mounting ring is fixedly connected to the inner liner. A groove 101 is provided on the bottom sidewall of the inner liner, and the mounting ring 21 has a corresponding annular protrusion that fits into the groove 101, forming an anti-detachment structure. The lower bracket includes a fan frame and a second mounting column 72. The cooling fan is mounted within the fan frame. The fan frame is equipped with an air duct enclosure 71, which surrounds the sides of the cooling fan to form an air duct. A fan mounting plate is provided at the bottom of the fan frame, and a hollowed-out area next to the fan mounting plate forms the air duct opening of the lower bracket. The first mounting column 23 is inserted into the inner tube of the second mounting column 72, thus securing the upper and lower brackets. The second mounting column 72 is positioned around the air duct enclosure 71.

[0025] A third mounting column 73 is provided at the lower portion of the lower bracket, and a fourth mounting column 83 is provided on the bottom plate of the housing. The third mounting column is inserted into the inner tube of the fourth mounting column to achieve a fixed connection between the lower bracket and the bottom plate of the housing.

[0026] A first positioning plate 22 is further provided below the mounting ring, and a second positioning plate is provided on the bottom or base plate of the housing. The circuit board component 9 is clamped by the first and second positioning plates to achieve installation and positioning of the circuit board component.

[0027] The bottom of the shell is provided with an opening, the edge of the opening is provided with a step, and the bottom plate is installed by pressing on the step.

[0028] The cup cover includes a first cover body 22 and a second cover body 21. A water outlet is provided on both the first cover body and the second cover body. The two water outlets are fitted together. A hand-flip cover plate 23 is provided on the first cover body corresponding to the position of the water outlet. The hand-flip cover plate is provided with a sealing head. The outside of the sealing head is wrapped with a silicone rubber part, which is used to be inserted into the water outlet to prevent water overflow.

[0029] The second cover 21 is used to cover the cup body. A sealing ring 24 is provided between the inner mounting wall of the second cover and the inner liner of the cup body. The outer wall of the sealing ring is provided with a tooth-shaped structure to achieve a better sealing effect.

[0030] The inner liner is provided with a flange, which wraps around the upper edge of the cup body shell, and the outer edge of the second cover body abuts against the flange of the inner liner.

[0031] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It is apparent to those skilled in the art that various changes, modifications, substitutions, and variations to these embodiments may be made without departing from the principles and spirit of the present invention, and these changes and modifications still fall within the scope of protection of the present invention.

Claims

1. A hot and cold dual-purpose cup, comprising a cup body, a cup lid, and a semiconductor refrigeration system disposed within the cup body, characterized in that: The cup body includes an outer shell, an inner liner, and a bracket. The bottom wall of the inner liner or the entire inner liner is made of metal. The semiconductor refrigeration system includes a semiconductor refrigeration plate, a refrigeration plate insulation board, a first heat dissipation fin, and a heat dissipation fan. One end of the semiconductor refrigeration plate exchanges heat with the bottom wall of the inner liner, and the other end exchanges heat with the first heat dissipation fin. The bracket includes an upper bracket and a lower bracket. The upper bracket is fixed to the bottom of the inner liner. The upper bracket and the lower bracket are combined to form an installation cavity for the semiconductor refrigeration system. The outer shell has a plurality of first heat dissipation holes corresponding to the position of the first heat dissipation fan, and a second vent is provided on the bottom plate of the outer shell. Therefore, an air forced convection channel is formed by the first heat dissipation holes, the first heat dissipation fan, the air duct opening of the lower bracket, and the second vent. An insulation layer is provided between the inner liner and the outer shell.

2. The hot and cold dual-purpose cup according to claim 1, characterized in that: The upper bracket includes a mounting ring and a first mounting column arranged below the mounting ring, and the mounting ring is fixedly connected to the inner tank; the lower bracket includes a fan rack and a second mounting column, and the cooling fan is installed in the fan rack. The fan rack is provided with a duct enclosure, and the duct enclosure is used to surround the side of the cooling fan to form an air duct, and a fan mounting plate is provided at the bottom of the fan rack, and the side of the fan mounting plate is hollowed out to form the air duct opening of the lower bracket; the first mounting column and the second mounting column are adapted to be connected and fixed.

3. The hot and cold dual-purpose cup according to claim 2, characterized in that: The second mounting column is arranged around the air duct enclosure.

4. The hot and cold dual-purpose cup according to claim 2, characterized in that: A third mounting column is provided at the lower portion of the lower bracket, a fourth mounting column is provided on the bottom plate of the housing, and the third mounting column and the fourth mounting column are adapted and fixedly connected.

5. The hot and cold dual-purpose cup according to claim 4, characterized in that: A first positioning plate is further provided below the mounting ring, and a second positioning plate is provided on the bottom or base plate of the housing, and the circuit board component is clamped by the first and second positioning plates.

6. The hot and cold dual-purpose cup according to claim 4, characterized in that: The bottom of the shell is provided with an opening, an edge of the opening is provided with a step, and the bottom plate is installed by pressing on the step.

7. The hot and cold dual-purpose cup according to claim 1, characterized in that: The cup cover includes a first cover body and a second cover body. A water outlet is provided on both the first cover body and the second cover body. The two water outlets are fitted together. A hand-flip cover plate is provided on the first cover body corresponding to the position of the water outlet. The hand-flip cover plate is provided with a sealing head. The sealing head is used to be inserted into the water outlet to prevent water overflow.

8. The hot and cold dual-purpose cup according to claim 7, characterized in that: The second cover is used to cover the cup body. A sealing ring is provided between the inner mounting wall of the second cover and the inner liner of the cup body. The outer wall of the sealing ring is provided with a tooth-shaped structure.

9. The hot and cold dual-purpose cup according to claim 8, characterized in that: The inner container is provided with a flange, the flange wraps the upper edge of the cup body shell, and the outer edge of the second cover body abuts against the inner container flange.

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