Preparation method of silver-nickel alloy and preparation method of bonding wire

Abstract

The invention relates to the technical field of bonding wires, in particular to a preparation method of a silver-nickel alloy and a preparation method of a bonding wire. The preparation method of the silver-nickel alloy comprises the following steps that a first silver strip is covered with a second silver strip, and a composite silver strip is obtained; the composite silver strip is rolled and annealed in sequence, and the silver-nickel alloy is obtained; wherein the first silver strip is provided with a plurality of grooves, nickel powder is arranged in the grooves, and the nickel powder is located between the first silver strip and the second silver strip. According to the preparation method of the silver-nickel alloy, the nickel powder is evenly distributed in the grooves in a surface machining mode, the nickel powder is fixed to the designed position in the rolling process, and the uniformity of the silver-nickel alloy is improved; nickel powder is pressed in the composite silver strip under the action of external force through rolling, Ag-Ni and Ag-Ag are fully diffused through annealing, metallurgical connection is formed, a small amount of nickel powder is left on an interface, the fine grain strengthening effect is achieved, and the mechanical property of the silver-nickel alloy is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of bonding wires, and in particular to a method for preparing a silver-nickel alloy and a method for preparing a bonding wire. Background Art

[0002] Bonding wire is one of the five major structural materials in microelectronic packaging, used to achieve electrical connections between the chip and the external frame. Silver-based bonding wire is widely used in microelectronic packaging due to its excellent electrical properties, including its ability to reduce high-frequency device noise and heat generation in high-power light-emitting diodes (LEDs), as well as its reasonable cost factor and its ability to effectively improve conversion efficiency in electronic packaging. However, pure silver wire has low strength during application and is prone to defects such as wire collapse and arc instability in low-curvature lead packages. It is also prone to failure under high temperature conditions, making it unable to meet the requirements of miniaturized, high-density, and multifunctional microelectronic device packaging.

[0003] Nickel is an element with excellent mechanical properties and high strength. When nickel is added at a level of 5wt% to 20wt%, silver-based bonding wires exhibit excellent electrical conductivity, thermal conductivity, and electrical corrosion resistance, as well as good wear resistance and strength. However, the solid solubility of nickel in silver is only 2%. When the nickel content reaches 2.5wt%, silver-based bonding wires become difficult to process, making it difficult to obtain high-nickel, high-strength, and tough silver-based bonding wires.

[0004] In view of this, this invention is proposed. Summary of the Invention

[0005] The first object of the present invention is to provide a method for preparing a silver-nickel alloy, thereby improving the uniformity and mechanical properties of the silver-nickel alloy.

[0006] A second object of the present invention is to provide a method for preparing a bonding wire, thereby improving the mechanical properties of the bonding wire.

[0007] In order to achieve the above-mentioned purpose of the present invention, the following technical solutions are adopted:

[0008] In a first aspect, the present invention provides a method for preparing a silver-nickel alloy, comprising the following steps:

[0009] covering the first silver ribbon with a second silver ribbon to obtain a composite silver ribbon; and rolling and annealing the composite silver ribbon in sequence to obtain the silver-nickel alloy;

[0010] The first silver belt is provided with a plurality of grooves, and nickel powder is provided in the grooves. The nickel powder is located between the first silver belt and the second silver belt.

[0011] Furthermore, the ratio of the mass of the nickel powder to the total mass of the first silver ribbon and the second silver ribbon is 1:(20-60);

[0012] And / or, the particle size of the nickel powder is 15 to 50 μm.

[0013] Further, the second silver ribbon comprises a planar silver ribbon; or,

[0014] The second silver belt includes a silver belt provided with a bump, and the bump matches with the groove of the first silver belt.

[0015] Furthermore, the length of the first silver belt and the second silver belt is 200-400 mm, the width is 100-200 mm, and the thickness is 2-4 mm.

[0016] Furthermore, the shape of the groove of the first silver ribbon includes at least one of a circle, a square, and a rectangle; the ratio of the equivalent diameter of the groove of the first silver ribbon to the width of the first silver ribbon is 1:(25-50), and the longest span of the groove of the first silver ribbon does not exceed 1 / 10 of the width of the first silver ribbon;

[0017] And / or, the ratio of the groove depth of the first silver strip to the thickness of the first silver strip is 1:(1.5-3).

[0018] Furthermore, along the width direction of the first silver strip, the distance between adjacent grooves is 2 to 6 mm;

[0019] And / or, along the length direction of the first silver strip, the distance between adjacent grooves is 5 to 15 mm.

[0020] Furthermore, in the silver strip provided with the bumps, the ratio of the bump thickness to the total thickness of the silver strip is 1:(1.5-4).

[0021] Further, it includes at least one of the following features (1) to (3);

[0022] (1) The rolling includes cold rolling deformation;

[0023] (2) The total deformation of the rolling is 100% to 500%;

[0024] (3) The rolling deformation of a single rolling pass is 10% to 20%.

[0025] Furthermore, the annealing includes: annealing at 700-850° C. for 1-2 hours under a protective atmosphere.

[0026] In a second aspect, the present invention further provides a method for preparing a bonding wire, including the method for preparing the silver-nickel alloy as described above.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] The preparation method of the silver-nickel alloy provided by the present invention uniformly distributes nickel powder in grooves by surface processing, fixes the nickel powder in designed positions during rolling, and improves the uniformity and consistency of the nickel powder in the silver-nickel alloy. The composite silver strip is subjected to external force during rolling, pressing the nickel powder therein, and then annealing is performed to fully diffuse the Ag-Ni and Ag-Ag to form a metallurgical connection. However, a small amount of nickel powder still remains at the interface, which plays a role in grain refinement and strengthening, thereby improving the strength and other mechanical properties of the silver-nickel alloy.

[0029] The silver-nickel alloy prepared by the preparation method of the silver-nickel alloy of the present invention is used to prepare bonding wires, and the bonding wires have good strengthening effect and excellent mechanical properties such as breaking force and elongation. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0031] Figure 1 This is a schematic structural diagram of the first silver belt and the second silver belt of the present invention.

[0032] Figure 2 This is a schematic structural diagram of another first silver belt and a second silver belt of the present invention.

[0033] Figure 3 Schematic diagram of the structure of the composite silver belt of the present invention.

[0034] Figure 4 Schematic diagram of the structure of another composite silver strip of the present invention.

[0035] Figure 5 Schematic diagram of the dimensions of the first silver ribbon in Example 1 of the present invention. DETAILED DESCRIPTION

[0036] The technical scheme of the present invention will be clearly and completely described below in conjunction with the accompanying drawings and specific embodiments, but it will be understood by those skilled in the art that the following described embodiments are part of embodiments of the present invention, rather than all embodiments, and are only used to illustrate the present invention, and should not be considered as limiting the scope of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of the present invention. Those who do not specify specific conditions in the embodiments are carried out according to normal conditions or the conditions recommended by the manufacturer. Those whose reagents or instruments are not specified by the manufacturer are conventional products that can be purchased commercially.

[0037] The following is a detailed description of a method for preparing a silver-nickel alloy and a method for preparing a bonding wire according to the present invention.

[0038] See also Figure 1 、 Figure 2 、 Figure 3 and Figure 4 In some embodiments of the present invention, a method for preparing a silver-nickel alloy is provided, comprising the following steps:

[0039] covering the first silver ribbon with the second silver ribbon to obtain a composite silver ribbon; and rolling and annealing the composite silver ribbon in sequence to obtain a silver-nickel alloy;

[0040] The first silver belt is provided with a plurality of grooves, and nickel powder is provided in the grooves. The nickel powder is located between the first silver belt and the second silver belt.

[0041] The method for preparing the silver-nickel alloy comprises the following steps: selecting a silver ribbon and nickel powder as raw materials, processing evenly distributed grooves of a certain size and shape on the surface of the silver ribbon, placing nickel powder in the grooves, covering the grooves with a layer of silver ribbon, pressing the nickel powder in the middle, and completing the preparation of the silver-nickel alloy through rolling and annealing.

[0042] Compared with directly adding nickel powder to prepare silver-nickel alloy during the smelting process, uneven addition is very likely to occur; through surface processing, the nickel powder is evenly distributed in the grooves of the silver strip, so that the nickel powder is fixed in the designed position during the rolling process, thereby improving the uniformity and consistency of the nickel powder in the silver-nickel alloy; through rolling, the composite silver strip presses the nickel powder into it under the action of external force, and through annealing, Ag-Ni and Ag-Ag are fully diffused to form a metallurgical connection, but a small amount of nickel powder still remains at the interface, which plays a role in fine grain strengthening, thereby improving the strength and other mechanical properties of the silver-nickel alloy.

[0043] In some embodiments of the present invention, the ratio of the mass of nickel powder to the total mass of the first silver ribbon and the second silver ribbon is 1:(20-60); typically but not limitatively, for example, the ratio of the mass of nickel powder to the total mass of the first silver ribbon and the second silver ribbon can be 1:20, 1:30, 1:40, 1:50, 1:60 or a range of any two thereof.

[0044] In some embodiments of the present invention, the mass percentage of nickel in the silver-nickel alloy is 1.5% to 5%; typically but not limitatively, for example, the mass percentage of nickel in the silver-nickel alloy can be 1.5%, 2%, 3%, 4%, 5% or a range consisting of any two thereof.

[0045] In some embodiments of the present invention, the particle size of the nickel powder is 15 to 50 μm; typically but not limitatively, for example, the particle size of the nickel powder can be 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm or a range of any two thereof.

[0046] In some embodiments of the present invention, the second silver ribbon comprises a planar silver ribbon;

[0047] or,

[0048] The second silver belt includes a silver belt provided with a convex block, and the convex block matches with the groove of the first silver belt.

[0049] In some embodiments of the present invention, the method for preparing the first silver ribbon includes:

[0050] A plurality of grooves are machined on the surface of a silver raw material strip by mechanical processing, and then surface treatment is performed to obtain a first silver strip.

[0051] In some embodiments of the present invention, when the second silver ribbon is a silver ribbon provided with bumps, the preparation method thereof includes:

[0052] A plurality of bumps are machined on the surface of the silver raw material strip by mechanical processing, and then the surface is treated to obtain a second silver strip.

[0053] In some embodiments of the present invention, the surface treatment includes: degreasing the surface and removing burrs.

[0054] In some embodiments of the present invention, the machining includes: machining using a milling machine.

[0055] In some embodiments of the present invention, the length of the first silver ribbon and the second silver ribbon is 200-400 mm, the width is 100-200 mm, and the thickness is 2-4 mm; the length, width and thickness of the first silver ribbon are the same as those of the second silver ribbon; typically but not limitatively, the length of the first silver ribbon and the second silver ribbon are both 200 mm, 250 mm, 300 mm, 350 mm, 400 mm or a range of any two thereof; the width of the first silver ribbon and the second silver ribbon are both 100 mm, 150 mm, 200 mm or a range of any two thereof; the thickness of the first silver ribbon and the second silver ribbon are both 2 mm, 3 mm, 4 mm or a range of any two thereof.

[0056] In some embodiments of the present invention, the purity of the first silver ribbon and the second silver ribbon are both 99.999%.

[0057] In some embodiments of the present invention, the shape of the grooves of the first silver ribbon includes at least one of a circle, a square, and a rectangle.

[0058] In some embodiments of the present invention, the ratio of the equivalent diameter of the groove of the first silver ribbon to the width of the first silver ribbon is 1:(25-50); typically but not limitatively, for example, the ratio of the equivalent diameter of the groove of the first silver ribbon to the width of the first silver ribbon is 1:25, 1:30, 1:35, 1:40, 1:45, 1:50 or a range of values ​​consisting of any two thereof; the longest span of the groove shape of the first silver ribbon does not exceed 1 / 10 of the width of the first silver ribbon.

[0059] In some embodiments of the present invention, the ratio of the groove depth of the first silver ribbon to the thickness of the first silver ribbon is 1:(1.5-3); typically but not limitatively, for example, the ratio of the groove depth of the first silver ribbon to the thickness of the first silver ribbon can be 1:1.5, 1:2, 1:2.5, 1:3 or a range of any two thereof.

[0060] In some embodiments of the present invention, the distance between adjacent grooves along the width direction of the first silver ribbon is 2 to 6 mm; typically but not limitatively, for example, the distance between adjacent grooves along the width direction of the first silver ribbon can be 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, or a range of any two thereof.

[0061] In some embodiments of the present invention, the distance between adjacent grooves along the length direction of the first silver strip is 5 to 15 mm; typically but not limitatively, for example, the distance between adjacent grooves along the length direction of the first silver strip can be 5 mm, 7 mm, 9 mm, 11 mm, 13 mm, 15 mm, or a range consisting of any two thereof.

[0062] It can be understood that the distance between adjacent grooves refers to the vertical distance between two adjacent sides of the two grooves.

[0063] In some embodiments of the present invention, in a silver ribbon provided with bumps, the ratio of the bump thickness to the total thickness of the silver ribbon is 1:(1.5-4); typically but not limitatively, for example, in a silver ribbon provided with bumps, the ratio of the bump thickness to the total thickness of the silver ribbon can be 1:1.5, 1:2, 1:3, 1:4 or a range of any two thereof.

[0064] In some embodiments of the present invention, the position distribution, shape, and width of the protrusions are the same as those of the corresponding grooves.

[0065] In some embodiments of the present invention, nickel powder is sprayed into the grooves of the first silver strip, and vibration treatment is performed during the spraying process, with a vibration frequency of 45 to 55 Hz.

[0066] In some embodiments of the present invention, rolling includes cold deformation.

[0067] In some embodiments of the present invention, the total deformation of rolling is 100% to 500%; typically but not limiting, for example, the total deformation of rolling can be 100%, 200%, 300%, 400%, 500% or a range of any two thereof.

[0068] In some embodiments of the present invention, the rolling deformation of a single rolling pass is 10% to 20%; typically but not limitatively, for example, the rolling deformation of a single rolling pass can be 10%, 12%, 14%, 16%, 18%, 20% or a range of any two thereof.

[0069] Through large-ratio rolling deformation, the concave-convex structure on the surface of the composite silver strip can be made to press the nickel powder into it under the action of external force, and through annealing, Ag-Ni and Ag-Ag are fully diffused to form a metallurgical connection, but a small amount of nickel powder still remains at the interface, which plays a role in fine grain strengthening.

[0070] In some embodiments of the present invention, annealing includes: annealing at 700-850° C. for 1-2 hours under a protective atmosphere; typically but not limitatively, for example, the annealing temperature can be 700° C., 750° C., 800° C., 850° C., or a range consisting of any two thereof; the annealing time can be 1 hour, 1.5 hours, 2 hours, or a range consisting of any two thereof.

[0071] In some embodiments of the present invention, the protective atmosphere comprises argon.

[0072] In some embodiments of the present invention, a method for preparing a bonding wire is further provided, including the method for preparing the silver-nickel alloy.

[0073] The silver-nickel alloy prepared by the preparation method of the silver-nickel alloy of the present invention is used to prepare bonding wires, and the bonding wires have good strengthening effect and excellent mechanical properties such as breaking force and elongation.

[0074] Example 1

[0075] The method for preparing the silver-nickel alloy provided in this embodiment comprises the following steps:

[0076] Select two silver raw material strips with the size of 200mm×100mm×3mm; see Figure 5A first silver strip is obtained by processing a plurality of grooves on a silver raw material strip using a milling machine, and then degreasing and removing burrs on the surface after processing; wherein the grooves have a size of 4 mm × 4 mm × 1.5 mm, and the spacing between adjacent grooves along the width direction of the first silver strip is 4 mm, and the spacing between adjacent grooves along the length direction of the first silver strip is 10 mm; a second silver strip is obtained by processing a plurality of bumps on another silver raw material strip using a milling machine, and then degreasing and removing burrs on the surface after processing; wherein the bumps have a size of 4 mm × 4 mm × 1 mm, and the spacing between adjacent bumps along the width direction of the second silver strip is 4 mm, and the spacing between adjacent bumps along the length direction of the second silver strip is 10 mm;

[0077] Spraying nickel powder with a particle size of 50 μm into the grooves of the first silver ribbon, and vibrating the ribbon at a frequency of 50 Hz during the spraying process; then covering the surface of the first silver ribbon sprayed with nickel powder with the second silver ribbon so that the nickel powder is located between the first and second silver ribbons, thereby obtaining a composite silver ribbon;

[0078] The composite silver strip is rolled, and the rolling is cold-rolled deformation with a total deformation of 129% and a single-pass rolling deformation of 10%; the rolled composite silver strip is annealed at 850°C for 2h in an argon atmosphere with an argon gas flow rate of 3L / min to obtain a billet; the billet is then processed into a size of 5mm×10mm and stored in a vacuum for standby use.

[0079] According to m=ρv, the total mass of the first and second silver ribbons can be calculated to be 1260g, and the mass of nickel powder is 25.63g. According to the solubility formula of the master alloy C Ni =m Ni / (m Ni +m Ag ), the theoretical Ni solubility of this billet is calculated to be 2%.

[0080] Example 2

[0081] The method for preparing the silver-nickel alloy provided in this embodiment comprises the following steps:

[0082] Two silver raw material strips with dimensions of 200 mm × 100 mm × 3 mm were selected; a plurality of grooves were machined into one of the silver raw material strips using a milling machine, and the surface was degreased and burrs were removed after machining to obtain a first silver strip; wherein the grooves had dimensions of 4 mm × 4 mm × 1.5 mm, and the spacing between adjacent grooves along the width direction of the first silver strip was 2 mm, and the spacing between adjacent grooves along the length direction of the first silver strip was 5 mm; a plurality of bumps were machined into the other silver raw material strip using a milling machine, and the surface was degreased and burrs were removed after machining to obtain a second silver strip; wherein the bumps had dimensions of 4 mm × 4 mm × 1 mm, and the spacing between adjacent bumps along the width direction of the second silver strip was 2 mm, and the spacing between adjacent bumps along the length direction of the second silver strip was 5 mm;

[0083] Spraying nickel powder with a particle size of 50 μm into the grooves of the first silver ribbon, and vibrating the ribbon at a frequency of 50 Hz during the spraying process; then covering the surface of the first silver ribbon sprayed with nickel powder with the second silver ribbon so that the nickel powder is located between the first and second silver ribbons, thereby obtaining a composite silver ribbon;

[0084] The composite silver strip is rolled, and the rolling is cold-rolled deformation with a total deformation of 268% and a single-pass rolling deformation of 15%; the rolled composite silver strip is annealed at 850°C for 2h in an argon atmosphere with an argon gas flow rate of 3L / min to obtain a billet; the billet is then processed into a size of 5mm×10mm and stored in a vacuum for standby use.

[0085] According to m=ρv, the total mass of the first and second silver ribbons is 1260g, and the mass of nickel powder is 63g. According to the solubility formula of the master alloy C Ni =m Ni / (m Ni +m Ag ), the theoretical Ni solubility of this billet is calculated to be 4.8%.

[0086] Example 3

[0087] The method for preparing the silver-nickel alloy provided in this embodiment comprises the following steps:

[0088] Two silver raw material strips measuring 200 mm × 100 mm × 3 mm were selected; a plurality of grooves were machined into one of the silver raw material strips using a milling machine, and the surface was degreased and burrs were removed after machining to obtain a first silver strip; wherein the grooves had dimensions of 4 mm × 4 mm × 1.5 mm, the spacing between adjacent grooves along the width direction of the first silver strip was 4 mm, and the spacing between adjacent grooves along the length direction of the first silver strip was 10 mm;

[0089] Nickel powder with a particle size of 50 μm was sprayed into the grooves of the first silver ribbon, and vibration was performed during the spraying process at a frequency of 50 Hz. A second silver ribbon (i.e., another silver raw material ribbon) was then covered on the surface of the first silver ribbon sprayed with nickel powder, so that the nickel powder was located between the first and second silver ribbons, thereby obtaining a composite silver ribbon.

[0090] The composite silver strip is rolled, and the rolling is cold-rolled deformation with a total deformation of 129% and a single-pass rolling deformation of 10%; the rolled composite silver strip is annealed at 850°C for 2h in an argon atmosphere with an argon gas flow rate of 3L / min to obtain a billet; the billet is then processed into a size of 5mm×10mm and stored in a vacuum for standby use.

[0091] According to m=ρv, the total mass of the first and second silver ribbons can be calculated to be 1260g, and the mass of nickel powder is 23.72g. According to the solubility formula of the master alloy CNi =m Ni / (m Ni +m Ag ), the theoretical Ni solubility of this billet is calculated to be 1.9%.

[0092] Comparative Example 1

[0093] The preparation method of the silver-nickel alloy provided in this comparative example comprises the following steps:

[0094] 1260 g of silver and 25.63 g of nickel were weighed and placed in a smelting furnace to heat and melt. During the melting process, an inert gas was introduced and the molten metal was mechanically stirred to promote the fusion of the silver and nickel to obtain a molten silver-nickel alloy liquid.

[0095] The molten silver-nickel alloy liquid is poured into a mold, and naturally cooled and solidified to obtain an alloy block; a cutting machine is used to trim and polish the alloy block.

[0096] According to the master alloy solubility formula C Ni =m Ni / (m Ni +m Ag ), the theoretical Ni solubility of this billet is calculated to be 2%.

[0097] Test example

[0098] The compositions of the annealed blanks of Example 1 and Comparative Example 1 were tested, and the results are shown in Table 1.

[0099] The Ni element content in the blank was detected by inductively coupled plasma spectrometry. 10 g of the blank was taken every 1 cm as a composition detection sample, and 10 samples were taken for detection.

[0100] Table 1

[0101]

[0102]

[0103] As shown in Table 1, the target composition of Ni element is 2%. The average value of 10 samples of silver-nickel alloy prepared by the preparation method of the silver-nickel alloy of the present invention is 1.99903%, the relative error is only 0.0045%, and the standard deviation is only 3.03×10 -6 , indicating that the composition fluctuation is extremely small, and the composition of the silver-nickel alloy is accurate and precise; while the average value of 10 samples of silver-nickel alloy prepared by the traditional melting-rolling method is 1.77251%, which deviates significantly from the target composition, and the relative error reaches 11.4%, reflecting that the data fluctuation is large and the preparation method has poor accuracy.

[0104] Φ25 μm SHP bonding wires were prepared using the silver-nickel alloys prepared in Examples 1 to 3 and Comparative Example 1. The performance of each SHP bonding wire was tested. Ten samples were taken for testing, and the results are shown in Table 2.

[0105] The tensile strength and elongation tests were carried out according to the method specified in GB / T 10573, with a specimen gauge length of 100 mm and a tensile speed of 10 mm / min.

[0106] Table 2

[0107]

[0108] As can be seen from Table 2, the bonding wire prepared using the silver-nickel alloy of the present invention has better breaking force and elongation, and has better performance consistency.

[0109] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for preparing a silver-nickel alloy, characterized in that: The steps include: covering the first silver ribbon with a second silver ribbon to obtain a composite silver ribbon; and rolling and annealing the composite silver ribbon in sequence to obtain the silver-nickel alloy; The first silver belt is provided with a plurality of grooves, and nickel powder is provided in the grooves. The nickel powder is located between the first silver belt and the second silver belt.

2. The method for preparing the silver-nickel alloy according to claim 1, wherein: The ratio of the mass of the nickel powder to the total mass of the first silver ribbon and the second silver ribbon is 1:(20-60); And / or, the particle size of the nickel powder is 15 to 50 μm.

3. The method for preparing the silver-nickel alloy according to claim 1, wherein: The second silver ribbon comprises a planar silver ribbon; or, The second silver belt includes a silver belt provided with a bump, and the bump matches with the groove of the first silver belt.

4. The method for preparing the silver-nickel alloy according to claim 1, wherein: The length of the first silver belt and the second silver belt is 200-400 mm, the width is 100-200 mm, and the thickness is 2-4 mm.

5. The method for preparing the silver-nickel alloy according to claim 1, wherein: The shape of the groove of the first silver ribbon includes at least one of a circle, a square and a rectangle; the ratio of the equivalent diameter of the groove of the first silver ribbon to the width of the first silver ribbon is 1:(25-50), and the longest span of the groove of the first silver ribbon does not exceed 1 / 10 of the width of the first silver ribbon; And / or, the ratio of the groove depth of the first silver strip to the thickness of the first silver strip is 1:(1.5-3).

6. The method for preparing the silver-nickel alloy according to claim 1, wherein: Along the width direction of the first silver strip, the distance between adjacent grooves is 2 to 6 mm; And / or, along the length direction of the first silver strip, the distance between adjacent grooves is 5 to 15 mm.

7. The method for preparing the silver-nickel alloy according to claim 3, wherein: In the silver strip provided with the bumps, the ratio of the bump thickness to the total thickness of the silver strip is 1:(1.5-4).

8. The method for preparing silver-nickel alloy according to claim 1, wherein: including at least one of the following features (1) to (3); (1) The rolling includes cold rolling deformation; (2) The total deformation of the rolling is 100% to 500%; (3) The rolling deformation of a single rolling pass is 10% to 20%.

9. The method for preparing a silver-nickel alloy according to claim 1, wherein: The annealing comprises: annealing at 700-850° C. for 1-2 hours under a protective atmosphere.

10. A method for preparing a bonding wire, characterized in that: The invention relates to a method for preparing the silver-nickel alloy according to any one of claims 1 to 9.

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