Ultrasonic laser combined machining system and method
By separating the laser processing and ultrasonic cleaning process stages and utilizing the laminar gas barrier of the air curtain auxiliary module, the vibration offset and beam quality degradation problems caused by coupling in ultrasonic-assisted laser composite processing are solved, achieving high-quality and efficient cleaning effects for ultra-precision processing.
Patent Information
- Application Number
- CN202511141272.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-14
- Publication Date
- 2025-09-16
AI Technical Summary
In existing ultrasonic-assisted laser composite processing technology, the coupling of high-frequency sound pressure field and laser thermal field causes vibration offset of the workpiece positioning system, affecting processing accuracy and surface quality. In addition, the photothermal absorption characteristics and dynamic refractive index changes of the cleaning liquid medium cause the beam quality to deteriorate, making it difficult to meet ultra-precision processing requirements.
A multi-physics field timing decoupling control strategy is adopted to separate the laser processing and ultrasonic cleaning process stages, and a laminar gas barrier is formed through the air curtain auxiliary module. The gas-liquid interface is accurately reconstructed using a high-pressure gas jet to establish a local dry processing environment, avoid mechanical-optical coupling interference, and ensure processing quality.
It effectively avoids submicron vibration deviation, ensures processing quality and cleaning effect, meets ultra-precision processing requirements, avoids mechanical-optical coupling interference in traditional synchronous processes, and improves processing accuracy and cleanliness.
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Figure CN120644781A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of processing methods, and in particular to an ultrasonic laser composite processing system and method. Background Art
[0002] Current ultrasonic-assisted laser composite machining technology generally adopts a cleaning-machining synchronous process architecture. Although it can effectively solve the problem of real-time removal of machining debris, it causes significant technical contradictions: First, the coupling of the high-frequency acoustic pressure field and the laser thermal field causes the workpiece positioning system to produce submicron vibration offsets, which directly causes dynamic instability of the machining reference surface, resulting in non-uniform deformation of the machined surface and significantly reducing the surface forming quality; second, the cavitation bubble collapse disturbance accompanying the laser machining process will induce non-steady-state fluctuations in fluid mechanics. This dynamic refraction effect of the multiphase medium not only destroys the stability of the machining environment, but also causes beam energy distribution distortion and focus drift, ultimately leading to deterioration of machining accuracy.
[0003] It is worth noting that the fully immersion processing system adopted by the current conventional technology has dual negative effects: on the one hand, the fully immersion solid-liquid coupling processing mode will cause significant laser energy attenuation and nonlinear refraction effects, resulting in uncontrollable disturbances to the beam transmission path and nonlinear optical losses, thereby restricting further improvement of processing accuracy; on the other hand, the photothermal absorption characteristics and dynamic refractive index changes of the cleaning liquid medium directly cause the deterioration of beam quality and the attenuation of focusing characteristics, seriously restricting the realization of ultra-precision processing needs. Summary of the Invention
[0004] The embodiments of the present invention provide an ultrasonic laser composite processing system and method to systematically optimize the process defects existing in the ultrasonic-assisted laser composite processing technology in the prior art, so that the processing method is more suitable for products and scenarios with cleanliness requirements and stress sensitivity of the workpiece.
[0005] According to a first aspect of the present invention, there is provided an ultrasonic laser composite machining system, comprising: Laser processing module, used for processing workpieces; An ultrasonic cleaning module includes a cleaning tank and an ultrasonic component mounted on the cleaning tank, wherein the cleaning tank is filled with a cleaning medium and a workpiece is placed in the cleaning tank; The control module is connected to the laser processing module and the ultrasonic component to control the laser processing module and the ultrasonic component to not operate at the same time.
[0006] The ultrasonic laser composite machining system of the present invention constructs a multi-physical field timing decoupling control strategy. By setting a control module to control the operating time of the ultrasonic components in the laser machining module and the ultrasonic cleaning module, the laser machining and ultrasonic cleaning are decomposed into discrete process stages. This not only ensures the periodic stress elimination of the heat affected zone (HAZ), but also avoids the mechanical-optical coupling interference in the traditional synchronous process, and can also meet the needs of ultra-precision machining of workpieces.
[0007] In some embodiments, the control module is configured to control the laser processing module and the ultrasonic component to execute the following timing sequence: Starting the laser processing module to process the workpiece and continuing the process for a first preset time; Turn off the laser processing module and wait for a second preset time; The ultrasonic component is started to clean the workpiece and continues to run for a third preset time.
[0008] Therefore, through such a setting, the laser processing and ultrasonic cleaning in the process can be completely discretized, thereby effectively avoiding the coupling effect of the high-frequency sound pressure field and the laser thermal field causing the workpiece positioning system to produce submicron vibration offset, thereby ensuring the processing quality during processing.
[0009] In some embodiments, the first preset time is set to , the second preset time is set to t d , , the third preset time is set to t u , , in, f is the laser pulse frequency; t system is the inherent delay of the system; the coefficient k =0.2~0.5.
[0010] Therefore, through such settings, the execution time of each process is designed with the laser pulse frequency of the laser processing module as the core benchmark, so that delayed waiting can be used to balance the thermal impact and energy accumulation generated during the processing of the laser processing module, thereby ensuring the cleaning effect during ultrasonic cleaning, and at the same time making the time of the entire cycle process as short as possible, so as to take into account both processing quality and cleaning effect.
[0011] In some embodiments, the control module includes a timing controller, and the timing controller is electrically connected to the laser processing module and the ultrasonic component respectively.
[0012] In some embodiments, the liquid level of the cleaning medium is higher than the processing surface of the workpiece, and the system further includes: The air curtain auxiliary module is used to continuously blow auxiliary gas on the surface of the workpiece to form a laminar gas barrier during the laser processing module's processing of the workpiece.
[0013] Therefore, through such a setting, the air curtain auxiliary module can be used to achieve precise reconstruction of the gas-liquid interface through a high-pressure gas jet, establish a local dry processing environment, and effectively eliminate the interference of medium refractive index fluctuations on laser transmission.
[0014] In some embodiments, the auxiliary gas includes a mixed gas of nitrogen and argon.
[0015] Therefore, through such an arrangement, a micron-sized metal nitride / oxide composite protective layer can be self-generated on the processed surface through the in-situ reaction of the specific gas component with the molten pool, thereby achieving dual functional coupling.
[0016] In some embodiments, the air curtain auxiliary module includes at least two sets of air blowing components, and the two sets of air blowing components are evenly distributed around the processing position of the laser processing module.
[0017] Therefore, by setting it in this way, the formation quality of the laminar gas barrier formed at the processing position of the laser processing module can be ensured.
[0018] According to a second method of the present invention, there is provided an ultrasonic laser composite machining method, which is used in the ultrasonic laser composite machining system described in the first aspect, comprising: Starting the laser processing module to process the workpiece and continuing the process for a first preset time; Turn off the laser processing module and wait for a second preset time; The ultrasonic component is started to clean the workpiece and continues to run for a third preset time.
[0019] The ultrasonic laser composite processing method of the present invention can utilize the ultrasonic laser composite processing system of the first aspect mentioned above to process the workpiece, so as to be able to completely discretize the laser processing and ultrasonic cleaning in the process, thereby effectively avoiding the coupling effect of the high-frequency sound pressure field and the laser thermal field causing the workpiece positioning system to produce submicron vibration offset, so as to ensure the processing quality during processing, and not only ensure the periodic stress elimination of the heat affected zone (HAZ), but also avoid the mechanical-optical coupling interference in the traditional synchronous process, and can also meet the needs of ultra-precision processing of the workpiece.
[0020] In some embodiments, the first preset time is set to , the second preset time is set to t d , , the third preset time is set to t u , , in, f is the laser pulse frequency; t system is the inherent delay of the system; the coefficient k =0.2~0.5.
[0021] Therefore, through such settings, the execution time of each process is designed with the laser pulse frequency of the laser processing module as the core benchmark, so that delayed waiting can be used to balance the thermal impact and energy accumulation generated during the processing of the laser processing module, thereby ensuring the cleaning effect during ultrasonic cleaning, and at the same time making the time of the entire cycle process as short as possible, so as to take into account both processing quality and cleaning effect.
[0022] In some embodiments, further comprising: During the laser processing module's processing of the workpiece, auxiliary gas is continuously blown onto the workpiece surface to form a laminar gas barrier.
[0023] Therefore, through such a setting, the air curtain auxiliary module can be used to achieve precise reconstruction of the gas-liquid interface through a high-pressure gas jet, establish a local dry processing environment, and effectively eliminate the interference of medium refractive index fluctuations on laser transmission. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0025] Figure 1 A schematic diagram of the structure of an ultrasonic laser composite machining system according to an embodiment of the present invention; Figure 2 This is a principle block diagram of an ultrasonic laser composite machining system according to one embodiment of the present invention; Figure 3 This is a principle block diagram of an ultrasonic laser composite machining system according to another embodiment of the present invention; Figure 4 This is a flow chart of an ultrasonic laser composite machining method according to one embodiment of the present invention; Explanation of the accompanying symbols: 1. Laser processing module; 11. Laser emitter; 12. Reflector; 13. Lens; 2. Ultrasonic cleaning module; 21. Cleaning tank; 22. Ultrasonic component; 23. Steel plate; 24. Cleaning medium; 25. Drain port; 3. Control module; 4. Workpiece; 5. Air curtain auxiliary module; 51. Blowing component. DETAILED DESCRIPTION
[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.
[0027] It should be noted that, unless there is any conflict, the embodiments and features in the embodiments of this application can be combined with each other.
[0028] In the description of this application, it should be understood that if the terms "center", "middle", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. Features defined as "first" and "second" are used to distinguish feature names, rather than having special meanings. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "multiple" means two or more.
[0029] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.
[0030] It should also be noted that, in this document, the terms "include" and "comprising" include not only those elements, but also other elements not explicitly listed, or elements inherent to such processes, methods, articles, or devices. In the absence of further limitations, elements defined by the phrase "include..." do not exclude the presence of other identical elements in the process, method, article, or device that includes the elements. The terms used in this document are generally commonly used by those skilled in the art. If there is any inconsistency with commonly used terms, the terms in this document shall prevail.
[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.
[0032] The present invention will be further described in detail below with reference to the accompanying drawings.
[0033] Figure 1 and Figure 2 The composition of the ultrasonic laser composite processing system according to one embodiment of the present invention is schematically shown. Figure 1 and Figure 2 As shown, the ultrasonic laser composite processing system of the present invention includes a laser processing module 1, an ultrasonic cleaning module 2 and a control module 3.
[0034] The ultrasonic cleaning module 2 is used to ultrasonically clean the workpiece 4. The ultrasonic cleaning module 2 includes a cleaning tank 21 and an ultrasonic component 22 installed on the cleaning tank 21. The cleaning tank 21 is filled with a cleaning medium 24, and the workpiece 4 to be processed is placed in the cleaning tank 21 to achieve cleaning of the workpiece 4. The cleaning medium 24 can be selected from the media commonly used in the prior art, for example, it can be a water-based cleaning agent, a semi-aqueous cleaning agent or an organic solvent cleaning agent. The installation position of the ultrasonic component 22 on the cleaning tank 21 is preferably set at the setting position of the workpiece 4 in the cleaning tank 21. For example, referring to Figure 1As shown, the workpiece 4 can be placed at the bottom of the cleaning tank 21. The bottom of the cleaning tank 21 is set as a steel plate 23 or the cleaning tank 21 is made of steel, which helps to improve the vibration conduction effect, and the liquid level of the cleaning medium 24 is equal to or higher than the processing surface of the workpiece 4. Then, the ultrasonic component 22 can be installed at the bottom outside the cleaning tank 21 to ensure the quality of ultrasonic cleaning of the workpiece 4. The structure of the cleaning tank 21 can be a tank structure with an open top or a closed tank structure. It only needs to reserve space for other modules to move during operation and not affect the working conditions of other modules. The specific structure of the cleaning tank 21 is not limited in the present invention.
[0035] The laser processing module 1 is a module for processing the workpiece 4. Exemplarily, the laser processing module 1 may include a laser emitter 11, a reflector 12, and a lens 13, wherein the reflector 12 and the lens 13 are both arranged on the path of the laser emitted by the laser emitter 11 to adjust the light output path of the laser and adjust and control the laser beam so that the laser beam can be projected onto the surface of the workpiece 4 for processing. Since the workpiece 4 is placed in the cleaning tank 21, the laser processing module 1 can be arranged at the top of the cleaning tank 21 in the overall system to process the workpiece 4 from the top of the cleaning tank 21. In other embodiments, the laser processing module 1 may include only the emitter 11, or only the emitter 11 and the lens 13.
[0036] For example, referring to Figure 1 As shown, Figure 1 The arrangement of the laser processing module 1 and the ultrasonic cleaning module 2 in the ultrasonic laser composite processing system of the present invention is schematically shown. Figure 1 As shown, in this embodiment, the cleaning tank 21 is a tank structure with an open top. The workpiece 4 is placed at the bottom of the cleaning tank 21, and the cleaning medium 24 is filled in the cleaning tank 21. The distance between the liquid level of the cleaning medium 24 and the top of the cleaning tank 21 is 35 mm, so that the cleaning medium 24 is far above the surface of the workpiece 4, so that the workpiece 4 is completely immersed in the cleaning medium 24, and the surface to be processed of the workpiece 4 is placed facing the top of the cleaning tank 21. The ultrasonic component 22 is configured as an ultrasonic transducer, which is arranged on the outside of the bottom of the cleaning tank 21 and is provided in three groups. A drain port 25 is also provided on one side of the bottom of the cleaning tank 21 for discharging the cleaning medium 24 in the cleaning tank 21 so as to replace the cleaning medium 24 in the cleaning tank 21. The laser processing module 1 is arranged at the top of the cleaning tank 21, which includes a laser emitter 11, a reflector 12 and a lens 13. The reflector 12 and the lens 13 are arranged on the light output path of the laser emitter 11 so that the laser emitted by the laser emitter 11 enters the cleaning medium 24 from the top of the cleaning tank 21 to process the surface of the workpiece 4.
[0037] The control module 3 is connected to the laser processing module 1 and the ultrasonic module and is used to control the operation of the laser processing module 1 and the ultrasonic component 22. Specifically, when controlling the operation of the laser processing module 1 and the ultrasonic component 22, the control module 3 controls the laser processing module 1 and the ultrasonic component 22 to operate at different times.
[0038] Specifically, the control module 3 can be implemented using a timing controller. The timing controller is connected to the laser emitter 11 of the laser processing module 1 and is also connected to the ultrasonic component 22, thereby being able to control the operation of the laser processing module 1 and the ultrasonic component 22. When controlling the operation of the laser processing module 1 and the ultrasonic component 22, their operation can be controlled according to the following timing: Starting the laser processing module 1 to process the workpiece 4 and continuing the process for a first preset time; Turn off the laser processing module 1 and wait for a second preset time; The ultrasonic component 22 is started to clean the workpiece 4 and continues to run for a third preset time.
[0039] By controlling the operation of the laser processing module 1 and the ultrasonic component 22 in the aforementioned manner, complete separation of laser processing and ultrasonic cleaning is achieved. Specifically, a delay waiting process is added before the ultrasonic component 22 operates, allowing ultrasonic cleaning to proceed after the thermal effects of the laser processing have stabilized and the residual energy generated by the laser processing has dissipated. This design ensures the cleaning effect during ultrasonic cleaning, while balancing the quality of laser processing with the cleaning effect of ultrasonic cleaning.
[0040] Specifically, in some possible implementations, when the above-mentioned timing control is executed, the first preset time can be set to , the second preset time is set to t d , , the third preset time is set to t u , ,in, f is the laser pulse frequency; t system is the inherent delay of the system; the coefficient k =0.2~0.5.
[0041] In the above embodiment, the overall timing control design is designed with the laser pulse frequency of the laser processing module 1 as the core. f is the number of pulses emitted per second, then The period of a single laser pulse, in the above embodiment, It can be the time for the laser to continue outputting until the processing action is completed. For example,f =1000Hz, then =0.001s, which means the laser completes the processing in 1ms. After that, the laser processing module is turned off and a delay wait is performed.
[0042] When delaying waiting, the set time t d Half the processing time of laser processing module 1, plus t system Among them, half of the processing time of the laser processing module 1 is an empirical half-cycle buffer, which is an empirical value to reserve time for the material heat diffusion and plasma dissipation of the workpiece 4 to avoid the interference of the ultrasonic wave on the laser processing condition due to premature connection. t system The inherent delay of the system is the hardware device response time (such as laser ratio signal transmission, circuit delay, etc.) and software instruction synchronization time. These times are basic delays that cannot be eliminated by the device itself. The delay time setting can ensure td This fully covers the dissipation of laser processing effects and the device's own response delays. This design ensures that the physical processes of laser processing (such as thermal effects and plasma) are already stable when ultrasonic waves are activated, preventing interference between the two energy fields.
[0043] During the ultrasonic cleaning phase, the set time t u It is 0.2-0.5 times the delay waiting time. Such a design is an engineering simplification design. Since the time required to ensure that the state of the material after laser processing is stable has been taken into account in the delay waiting stage, it does not take too long to ultrasonically clean the workpiece 4 movement. Such an ultrasonic cleaning time design can effectively clear the residues of laser processing, such as slag, debris, etc., and can avoid excessive cleaning of the workpiece 4 and damage to the material of the workpiece 4. The above-mentioned laser processing-delay waiting-ultrasonic cleaning process can be repeated to complete the processing of the workpiece 4.
[0044] This invention constructs a multi-physics field timing decoupling control strategy. By supporting a multi-channel, industrial-grade programmable timing controller, it decomposes laser processing and ultrasonic cleaning into discrete process stages and implements switching between the two process windows based on a phase difference algorithm. The overall timing design process uses the laser pulse frequency of laser processing module 1 as the core benchmark, designing the execution time of each process. This allows for the use of delayed waiting to balance the thermal impact and energy accumulation generated by laser processing module 1 during processing, ensuring the cleaning effect during ultrasonic cleaning. It also minimizes the entire cycle time, achieving a balanced balance between processing quality and cleaning effect.
[0045] In some other possible implementations, refer to Figure 3 As shown, the ultrasonic laser composite processing system of the present invention may further include an air curtain auxiliary module 5. Specifically, the air curtain auxiliary module 5 is used to continuously blow auxiliary gas on the surface of the workpiece 4 while the laser processing module 1 is processing the workpiece 4, so as to form a laminar gas barrier.
[0046] For example, the air curtain auxiliary module 5 is also connected to the control module 3 so as to be controlled by the control module 3. Specifically, during control, the air curtain auxiliary module 5 and the laser processing module 1 can be controlled to start and stop simultaneously, so that during the process of the laser processing module 1 processing the workpiece 4, a laminar gas barrier can be formed on the surface of the workpiece 4, and the high-pressure gas jet is used to achieve precise reconstruction of the gas-liquid interface, establish a local dry processing environment, and effectively eliminate the interference of the medium refractive index fluctuation on the laser transmission.
[0047] In some possible implementations, the auxiliary gas blown by the air curtain auxiliary module 5 can be set to a mixture of nitrogen and argon. This specific gas component can then react in situ with the molten pool to self-generate a micron-scale metal nitride / oxide composite protective layer on the processed surface, achieving dual-functional coupling.
[0048] Specifically, the air curtain auxiliary module 5 includes a blowing component 51, and the blowing component 51 is used to blow out auxiliary gas. The blowing component 51 includes an air inlet pipe and an air outlet. The air inlet pipe is connected to the air supply equipment to realize air supply. The air outlet is a structure for blowing out auxiliary gas, which is arranged toward the processing surface of the workpiece 4. In some possible embodiments, the blowing component 51 can be provided with at least two groups, and is evenly distributed with the processing position of the laser processing module 1 as the center, thereby ensuring the formation quality of the laminar gas barrier formed at the processing position of the laser processing module 1. In addition, the setting of the blowing component 51 can also be set so that the blowing angle of the blowing outlet is set at an angle of 60°-75° with the processing surface of the workpiece 4. Furthermore, the air curtain auxiliary module 5 can also be set so that the auxiliary gas it blows out is a compressed gas of 0.3Mpa-0.6Mpa. Through such a setting, the formation quality of the laminar gas barrier formed at the processing position of the laser processing module 1 can be further ensured.
[0049] In other possible embodiments, the blowing assembly 51 can also be configured to be relatively fixed with the outer shell and other structures of the laser processing module 1 through a connecting structure, thereby ensuring that the blowing assembly 51 can move synchronously with the movement of the laser processing module 1 during the laser processing process, so as to ensure the effect of the laminar gas barrier formed on the workpiece 4.
[0050] For example, continue to refer to Figure 1 As shown, in Figure 1 In the embodiment shown, the blowing portion of the air curtain auxiliary module 5 is also arranged at the top of the cleaning tank 21. The air curtain auxiliary module 5 is provided with two groups of blowing components 51, both of which extend into the cleaning medium 24, and the blowing outlets of the blowing components 51 are arranged at an angle of 60° to the processing surface of the workpiece 4. The two groups of blowing components 51 are symmetrically arranged with the processing position of the laser processing module 1 as the center. The two groups of blowing components 51 of the air curtain auxiliary module 5 are both connected to the timing controller, and the laser emitter 11 of the laser processing module 1 and the ultrasonic component 22 of the ultrasonic cleaning module 2 are also connected to the timing controller, so that the execution timing of each module can be controlled by the timing controller.
[0051] The ultrasonic laser composite machining system of the present invention utilizes a control module 3 to control the operating time of the ultrasonic components 22 in the laser machining module 1 and the ultrasonic cleaning module 2, thereby decomposing the laser machining and ultrasonic cleaning into discrete process stages. This ensures periodic stress relief in the heat-affected zone (HAZ) while avoiding the mechanical-optical coupling interference seen in conventional synchronous processes. Furthermore, an air curtain assist module 5 is incorporated to form a laminar gas barrier on the machining surface of the workpiece 4 to ensure machining quality during laser machining. When the laser machining module 1 stops, the air curtain assist module 5 also stops, allowing the ultrasonic cleaning module 2 to clean the workpiece 4, achieving dual-function coupling.
[0052] Figure 4 The overall process of the ultrasonic laser composite processing method of one embodiment of the present invention is schematically shown. The ultrasonic laser composite processing method of the present invention is applicable to the ultrasonic laser composite processing system of any embodiment described above to realize processing and cleaning of the workpiece 4, ensure the processing quality of the workpiece 4, and meet the ultra-precision processing requirements of the workpiece 4. Figure 4 As shown, the ultrasonic laser composite processing method of the present invention includes the following steps: Step S11: starting the laser processing module to process the workpiece and continuing the process for a first preset time; Step S12: Turn off the laser processing module and wait for a second preset time; Step S13: Start the ultrasonic component to clean the workpiece, and continue to run for a third preset time.
[0053] Among them, in step S11, it is a step of processing the workpiece 4. Specifically, the first preset time can be set to .in, f is the laser pulse frequency, then is the period of a single laser pulse. In the above embodiment, It can be the time for the laser to continue outputting until the processing action is completed. For example, f =1000Hz, then =0.001s, that is, the laser completes the processing in 1ms.
[0054] In step S12, the delay waiting can reserve time for the thermal diffusion of the material of the workpiece 4 and the dissipation of the plasma, so as to avoid the interference of the ultrasonic wave on the working conditions of the laser processing due to premature access. Specifically, the second preset time can be set to t d , That is to say, the second preset time t d Set to half the processing time of laser processing module 1, and add t system Half of the processing time of the laser processing module 1 is an empirical half-cycle buffer, which is an empirical value to reserve time for the material heat diffusion and plasma dissipation of the workpiece 4 to avoid the interference of the ultrasonic wave on the laser processing condition. t system The inherent delay of the system is the hardware device response time (such as laser ratio signal transmission, circuit delay, etc.) and software instruction synchronization time. These times are basic delays that cannot be eliminated by the device itself. The delay time setting can ensure t d This fully covers the dissipation of laser processing effects and the device's own response delays. This design ensures that the physical processes of laser processing (such as thermal effects and plasma) are already stable when ultrasonic waves are activated, preventing interference between the two energy fields.
[0055] In step S13, the workpiece 4 is ultrasonically cleaned. Specifically, the third preset time can be set to t u , Specifically, the time set t u The delay waiting time is 0.2-0.5 times the delay waiting time. This design is an engineering simplification. Because the delay waiting period takes into account the time required to ensure the material's state stabilizes after laser processing, ultrasonic cleaning of the workpiece 4 does not require a long time. This ultrasonic cleaning time design effectively removes laser processing residues such as slag and debris, while also avoiding excessive cleaning of the workpiece 4, which could damage the material.
[0056] In addition, in some possible embodiments, the system is further provided with an air curtain auxiliary module 5. In these embodiments, during step S11, i.e., while the laser processing module 1 is processing the workpiece 4, auxiliary gas can be continuously blown onto the surface of the workpiece 4 to form a laminar gas barrier. This allows for precise reconstruction of the gas-liquid interface through the high-pressure gas jet, establishing a local dry processing environment and effectively eliminating interference from medium refractive index fluctuations on laser transmission. The aforementioned laser processing-delayed waiting-ultrasonic cleaning process can be repeated to complete the processing of the workpiece 4.
[0057] The ultrasonic laser composite processing method of the present invention can utilize the above-mentioned ultrasonic laser composite processing system to process the workpiece 4, so as to completely discretize the laser processing and ultrasonic cleaning in the process, thereby effectively avoiding the coupling effect of the high-frequency sound pressure field and the laser thermal field causing the workpiece 4 positioning system to produce submicron vibration offset, so as to ensure the processing quality during processing, and not only ensure the periodic stress elimination of the heat affected zone (HAZ), but also avoid the mechanical-optical coupling interference in the traditional synchronous process, and can also meet the ultra-precision processing requirements of the workpiece 4.
[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. An ultrasonic laser composite processing system, characterized in that: include: A laser processing module (1) is used to process a workpiece (4); An ultrasonic cleaning module (2) comprises a cleaning tank (21) and an ultrasonic component (22) mounted on the cleaning tank (21), wherein the cleaning tank (21) contains a cleaning medium (24), and a workpiece (4) is placed in the cleaning tank (21); The control module (3) is connected to the laser processing module (1) and the ultrasonic component (22) and is used to control the laser processing module (1) and the ultrasonic component (22) to operate at different times.
2. The ultrasonic laser composite processing system according to claim 1, characterized in that: The control module (3) is configured to control the laser processing module (1) and the ultrasonic component (22) to execute according to the following time sequence: Starting the laser processing module (1) to process the workpiece (4), and continuing the process for a first preset time; Turning off the laser processing module (1) and delaying to wait for a second preset time; The ultrasonic component (22) is started to clean the workpiece (4), and the operation continues for a third preset time.
3. The ultrasonic laser composite processing system according to claim 2, characterized in that: The first preset time is set to , the second preset time is set to t d , , the third preset time is set to t u , , in, f is the laser pulse frequency; t system is the inherent delay of the system; the coefficient k =0.2~0.
5.
4. The ultrasonic laser composite processing system according to claim 1, characterized in that: The control module (3) includes a timing controller, and the timing controller is electrically connected to the laser processing module (1) and the ultrasonic component (22) respectively.
5. The ultrasonic laser composite machining system according to any one of claims 1 to 4, characterized in that: The liquid level of the cleaning medium (24) is higher than the processing surface of the workpiece (4), and the system further comprises: The air curtain auxiliary module (5) is used for continuously blowing auxiliary gas onto the surface of the workpiece (4) to form a laminar gas barrier during the process of the laser processing module (1) processing the workpiece (4).
6. The ultrasonic laser composite processing system according to claim 5, characterized in that: The auxiliary gas includes a mixed gas of nitrogen and argon.
7. The ultrasonic laser composite processing system according to claim 5, characterized in that: The air curtain auxiliary module (5) comprises at least two sets of air blowing components (51), and the two sets of air blowing components (51) are evenly distributed around the processing position of the laser processing module (1).
8. An ultrasonic laser composite machining method, used in the ultrasonic laser composite machining system according to any one of claims 1 to 7, characterized in that: include: Starting the laser processing module (1) to process the workpiece (4), and continuing the process for a first preset time; Turning off the laser processing module (1) and delaying to wait for a second preset time; The ultrasonic component (22) is started to clean the workpiece (4), and the operation continues for a third preset time.
9. The ultrasonic laser composite processing method according to claim 8, characterized in that: The first preset time is set to , the second preset time is set to t d , , the third preset time is set to t u , , in, f is the laser pulse frequency; t system is the inherent delay of the system; the coefficient k =0.2~0.
5.
10. The ultrasonic laser composite processing method according to claim 8 or 9, characterized in that: Also includes: During the process of the laser processing module (1) processing the workpiece (4), auxiliary gas is continuously blown onto the surface of the workpiece (4) to form a laminar gas barrier.