Biochip packaging method

Abstract

The invention discloses a biological chip packaging method. The method comprises the following steps: step 1, combining a chip with a carrier plate through an adhesive; 2, connecting an electrode on the chip with the carrier plate by using a gold wire; 3, the surfaces of the electrodes are covered with Agcl glue, the electrodes comprise a working electrode and a reference electrode, and the surfaces of the working electrode or the reference electrode are covered with the Agcl glue; 4, dam packaging is conducted on the chip through dam DAM glue, so that the electrode covered with the Agcl glue is exposed, and silica gel dispensing is conducted, specifically, silica gel is operated through a gel painting machine, and the silica gel is painted on the surface of a product along a set path; one-time glue painting and dam enclosing are conducted, and glue painting operation can be achieved only through one-time glue painting; the invention belongs to the field of biological chip packaging, and particularly relates to a biological chip packaging method. According to the invention, the problems of obvious insufficiency in waterproof, moistureproof, electrical insulation and other performances of the biochip, complicated structure, complicated process flow and high manufacturing cost are solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of biochip packaging methods, and in particular relates to a biochip packaging method. Background Art

[0002] In the practical application and development of biochip technology, the packaging process has always been a key factor restricting its performance improvement and widespread adoption. Currently, mainstream biochip technology relies on a method of creating circuits by drilling holes in a substrate and spotting probes. However, during testing, the chip surface is completely exposed to the external environment. Dust, particulate matter, and electromagnetic interference can easily affect the accuracy of chip detection, resulting in large deviations in test data and low reliability, making it difficult to meet the requirements of precise detection.

[0003] Furthermore, traditional biochip packaging technology is cumbersome and expensive. Some packaging processes require masking the chip's central region with photoresist, which is then removed after plastic encapsulation to expose the central electrode. This complex process not only reduces production efficiency but also significantly increases labor and time costs. While ceramic and metal packaging offer better protection, their high material costs make large-scale biochip production and application difficult. Furthermore, the materials used in traditional plastic encapsulation processes lack optimal adhesion to resin substrates like epoxy glass, resulting in significant deficiencies in waterproofing, moisture resistance, and electrical insulation, making it impossible to guarantee the stable operation of biochips in complex environments.

[0004] This invention provides a biochip packaging method that enhances the chip's detection sensitivity to target substances through AgCl coating, broadening its application range. A disposable adhesive dam technology simplifies the packaging process, significantly improving production efficiency. The excellent compatibility of the dam's silicone rubber material with the substrate enables low-cost, high-performance, multi-layered protection. This method effectively overcomes the shortcomings of traditional biochip packaging technology and provides a new solution for the development of biochips. Summary of the Invention

[0005] In view of the above situation, in order to overcome the defects of the existing technology, the present invention provides a biochip packaging method, which effectively solves the problems in the current market such as obvious deficiencies in waterproof and moisture-proof performance, electrical insulation, etc., as well as complex structure and high production cost.

[0006] The technical solution adopted by the present invention is as follows: The present invention proposes a biochip packaging method, step 1: combining the chip and the carrier board by an adhesive;

[0007] Step 2: Connecting the electrodes on the chip to the carrier using gold wires;

[0008] Step 3: The surface of the electrode is covered with AgCl glue, and the electrode includes a working electrode and a reference electrode, wherein the surface of the working electrode or the reference electrode is covered with the AgCl glue;

[0009] Step 4: Using DAM glue to dam the chip to expose the electrodes covered with AgCl glue, including:

[0010] Silicone dot application: Use a glue painting machine to apply silicone onto the product surface along a set path;

[0011] The height and width of the dam are adjusted by parameters: including adjusting the air pressure of the glue dispenser, which can squeeze the glue out of the glue barrel.

[0012] Furthermore, in the step 1, the chip is fixed on the carrier board by the adhesive.

[0013] Furthermore, in step 2, one end of the gold wire is connected to the carrier board, and the other end is connected to the electrode on the chip.

[0014] Furthermore, in the step three, the electrodes include the working electrode and the reference electrode, and the working electrode is covered with the AgCl glue to enhance the functionality of the chip.

[0015] Furthermore, in the step four, the chip is encapsulated by using the dam DAM glue to encapsulate the gold wire, the carrier board and part of the chip to avoid being affected by dust, particles, electromagnetic waves and the like in the environment.

[0016] Furthermore, in the step 4, a disposable glue dam is used, and the glue painting operation can be completed by only applying glue once.

[0017] Furthermore, the carrier is a carrier or a substrate.

[0018] Furthermore, it includes a carrier board, an adhesive is arranged on the carrier board, a chip is connected above the adhesive, electrodes are provided on the chip, the electrodes include a working electrode and a reference electrode, gold wires are used to connect the electrodes and the pads of the carrier board, the Agcl glue is arranged on the electrodes, and the dam DAM glue encapsulates the gold wires, the carrier board and part of the chip, and the electrodes of the Agcl glue are exposed.

[0019] The beneficial effects achieved by the present invention using the above structure are as follows:

[0020] 1. Through AgCl coating technology, the adsorption characteristics of silver glue on biological molecules such as proteins are utilized to form a characteristic potential difference between the working electrode and the reference electrode, accurately capturing the component information of the target substance in the solution to be tested, and achieving high-sensitivity detection of the concentration of specific components in the solution.

[0021] 2. A one-time adhesive dam replaces the traditional complex packaging process. By precisely controlling the dam shape, the packaging process is completed in a single step, significantly improving production efficiency. The high compatibility of the silicone rubber dam with the substrate material provides multiple protection features such as waterproofing, electrical insulation, and high and low temperature resistance. It also avoids the use of expensive ceramic or metal packaging materials, significantly reducing production costs and achieving the dual advantages of high performance and economy. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is an overall flow chart of a biochip packaging method proposed in the present invention.

[0023] Figure 2 This is a schematic diagram of electrodes for a biochip packaging method proposed in the present invention.

[0024] Among them, 1. Carrier board, 2. Adhesive, 3. Chip, 4. Electrode, 5. Gold wire, 6. Agcl glue, 7. Dam glue.

[0025] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0027] In the description of the present invention, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limiting the present invention.

[0028] like Figure 1 As shown, the present invention proposes a biochip packaging method.

[0029] Step 1: Combine the chip 3 and the carrier 1 with the adhesive 2. The chip 3 may be a biochip.

[0030] In some embodiments, the chip 3 may be fixed on the carrier 1 via an adhesive 2 above the carrier 1 .

[0031] In some embodiments, the carrier 1 may be a carrier or a substrate.

[0032] After curing, the adhesive 2 generates bonding force, firmly bonding the chip 3 to the carrier 1, thereby connecting the chip 3 to the carrier 1 and providing a basis for electrical connection.

[0033] Step 2: Use gold wire 5 to connect the electrodes 4 on the chip 3 to the carrier 1.

[0034] In some embodiments, one end of the gold wire 5 is connected to the carrier 1 , and the other end is connected to the electrode 4 on the chip 3 .

[0035] The gold wire 5 is electrically connected to the electrode 4 and the carrier board 1 by using a welding process.

[0036] Step three: The surface of the electrode 4 is covered with AgCl glue 6. The electrode 4 includes a working electrode and a reference electrode, wherein the surface of the working electrode or the reference electrode is covered with AgCl glue 6.

[0037] In some embodiments, electrode 4 includes a working electrode and a reference electrode, and the working electrode is covered with AgCl gel 6 to enhance the functionality of the chip. The coating of AgCl gel 6 facilitates the covalent chemical bonding of the chip with nucleic acid probes labeled with special chemical methods, protein antigens and antibodies, and other substances. For example, the AgCl gel electrode can adsorb certain specific components in proteins, creating a potential difference between the working electrode and the reference electrode, thereby detecting the composition of a substance in the test solution, thereby enhancing the functionality and application range of the chip.

[0038] Step 4: Use the damming glue 7 to dam the chip 3 so that the electrodes covered with the AgCl glue are exposed, including:

[0039] Silicone dot application: Use a glue painting machine to apply silicone onto the product surface along a set path;

[0040] Adjust the height and width of the dam through parameters: including adjusting the air pressure of the glue dispenser, which can squeeze the glue out of the glue barrel.

[0041] In some embodiments, the chip 3 is dammed and packaged using a DAM glue 7 to encapsulate the gold wire 5, the carrier board 1 and part of the chip 3 to prevent them from being affected by dust, particles, electromagnetic waves, etc. in the environment.

[0042] In some embodiments, a disposable glue dam is used, and the glue painting operation can be completed by only applying glue once, thereby optimizing the efficiency of the glue dam operation.

[0043] The DAM glue used in dam construction can be silicone rubber.

[0044] Silicone rubber for dam operations has good adhesion to resin substrates such as epoxy glass; silicone rubber has low modulus and high elasticity, which enables it to adapt to different environmental deformations; its waterproof, moisture-proof and insulating properties are derived from the molecular structure's barrier to moisture and ions and its electronic insulation, ensuring the electrical insulation and structural stability of the chip in complex environments.

[0045] A glue coating machine is used to directly coat the dam DAM glue 7 to form the biochip packaging structure, replacing the complex process of traditional photoresist masking, plastic sealing, and glue removal, thus simplifying the chip packaging technology.

[0046] A biochip packaging structure obtained by a biochip packaging method includes a carrier 1, an adhesive 2 disposed on the carrier 1, a chip 3 connected above the adhesive 2, electrodes 4 disposed on the chip 3, including a working electrode and a reference electrode, and gold wires 5 for connecting the electrodes 4 to pads on the carrier 1. AgCl glue 6 is disposed on the electrodes 4, and a damming adhesive 7 encapsulates the chip 3, the gold wires 5, and the carrier 1. The electrode 4 where the AgCl glue 6 is disposed is exposed.

[0047] The dam glue 7 is used to protect the chip 3 and the gold wire 5, and to prevent the chip 3 and the gold wire 5 from being affected by dust, particles, electromagnetic waves, etc. in the environment.

[0048] Agcl glue 6 facilitates the covalent chemical bonding of the chip with nucleic acid probes labeled by special chemical methods, protein antigens and antibodies, and other substances. For example, the electrode of Agcl glue can adsorb certain special components in the protein, causing a potential difference between the working electrode and the reference electrode, thereby detecting the components of a substance in the solution to be tested, thereby enhancing the functionality and application range of the biochip.

[0049] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0050] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

[0051] The present invention and its embodiments are described above. This description is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if a person skilled in the art is inspired by this and, without departing from the purpose of the present invention, designs structures and embodiments similar to this technical solution without inventiveness, they shall fall within the scope of protection of the present invention.

Claims

1. A biochip packaging method, characterized in that: Step 1: bonding the chip (3) to the carrier (1) via an adhesive (2); Step 2: Using gold wires (5) to connect the electrodes (4) on the chip (3) to the carrier (1); Step 3: The surface of the electrode (4) is covered with AgCl glue (6), and the electrode (4) includes a working electrode and a reference electrode, wherein the surface of the working electrode or the reference electrode is covered with the AgCl glue (6); Step 4: Using a dam DAM glue (7) to dam the chip (3) to expose the electrodes covered with the AgCl glue, including: Silicone dot application: Use a glue painting machine to apply silicone onto the product surface along a set path; The height and width of the dam are adjusted by parameters: including adjusting the air pressure of the glue dispenser, which can squeeze the glue out of the glue barrel.

2. The biochip packaging method according to claim 1, wherein: In the step 1, the chip (3) is fixed on the carrier (1) via the adhesive (2) above the carrier.

3. The biochip packaging method according to claim 2, wherein: In the second step, one end of the gold wire (5) is connected to the carrier (1), and the other end is connected to the electrode (4) on the chip (3).

4. The biochip packaging method according to claim 3, wherein: In the step three, the electrode (4) includes the working electrode and the reference electrode, and the working electrode is covered with the AgCl glue (6) to enhance the functionality of the chip.

5. The biochip packaging method according to claim 4, characterized in that: In the fourth step, the chip (3) is encapsulated by using the dam DAM glue (7), and the gold wire (5), the carrier board (1) and part of the chip (3) are encapsulated to avoid being affected by dust, particles, electromagnetic waves, etc. in the environment.

6. The biochip packaging method according to claim 5, characterized in that: In the step 4, a one-time glue dam is used, and the glue painting operation can be completed by only applying glue once.

7. The biochip packaging method according to claim 1, wherein: The carrier (1) is a carrier or a substrate.

8. A biochip packaging method, characterized in that: Prepared according to any one of claims 1 to 6: The invention comprises a carrier (1), an adhesive (2) is arranged on the carrier (1), a chip (3) is connected above the adhesive (2), an electrode (4) is provided on the chip (3), the electrode (4) comprises a working electrode and a reference electrode, a gold wire (5) is used to connect the electrode (4) and the pad of the carrier (1), the AgCl glue (6) is arranged on the electrode (4), and the dam DAM glue (7) encapsulates the gold wire (5), the carrier (1) and part of the chip (3), and the electrode (4) is exposed by the AgCl glue (6).

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