Intelligent IC carrier plate carrying device and carrying method thereof

Abstract

The invention discloses an intelligent IC carrier plate carrying device and a carrying method thereof, and belongs to the technical field of IC carrier plate carrying. The intelligent IC carrier plate carrying device comprises a carrying table, the transverse driving end of a driving device is sleeved with a transverse moving frame, the output end of an air cylinder is connected with a suction cup carrying assembly, and a static elimination assembly is further fixedly welded to the top of a cover plate. According to the device, the suction area of the carrying suction cup can be flexibly adjusted, the device can be adjusted in a self-adaptive mode to be tightly attached to the top of an IC carrier plate with the uneven surface, the device further has the buffering and retracting protection function, and when gas of the device is cut off accidentally or the device breaks down, the device is not prone to falling off. The first spring drives the movable round sleeve and the movable cylinder to retract, the sucker device and the like are prevented from being impacted and damaged, in addition, redundant compressed air generated by injection into the groove body can be introduced into the hollow rod through the exhaust guide box, and static electricity on the surface of the IC carrier plate is neutralized through charges generated by the discharge electrode.

Description

Technical Field

[0001] The present invention relates to the technical field of IC carrier board transportation, and in particular to an intelligent IC carrier board transportation device and a transportation method thereof. Background Art

[0002] Smart IC substrates are fundamental components that play a key role in modern electronics manufacturing. They are typically made of specific insulating materials and feature a sophisticated and complex circuit wiring structure. Their primary function is to provide electrical connections and physical support for integrated circuit (IC) chips. Circuits on the substrate precisely connect the chip to the external circuit system, enabling the chip to stably and efficiently transmit signals and power, thereby ensuring the normal operation of the entire electronic device. Smart IC substrates are widely used in various electronic products such as smartphones, tablets, high-performance computers, and artificial intelligence devices. Their performance directly impacts important indicators such as the computing speed, data processing capabilities, signal transmission stability, and product miniaturization and integration of electronic devices. They are one of the core supporting components for the intelligent, high-performance, and miniaturized development of electronic products.

[0003] The intelligent IC carrier handling device is an advanced automation equipment used in semiconductor manufacturing and other related fields. It is mainly composed of a robotic arm, a drive system, a control system, a visual recognition system, and a grasping mechanism. By integrating advanced intelligent control algorithms and sensor technology, it can accurately identify and locate IC carriers, and use the robotic arm and grasping mechanism to quickly and stably grasp the IC carriers, and transport them from one workstation to another according to preset paths and instructions. During the handling process, it can also monitor and adjust the handling status in real time to ensure the handling accuracy and quality of the IC carriers. It has the characteristics of high efficiency, precision, flexibility, and automated operation, which can effectively improve production efficiency, reduce labor costs, and improve the reliability and consistency of the production process. It is widely used in IC packaging testing, chip manufacturing and other production links.

[0004] Existing intelligent IC carrier handling devices are typically composed of a drive device, a control system, and a suction cup suction handling mechanism. In actual use, visual sensors, a drive device, and a suction cup suction handling mechanism are generally used to carry and place the intelligent IC carrier. However, in long-term actual use, this type of handling device has exposed a series of prominent deficiencies:

[0005] First, in the semiconductor manufacturing process, IC carriers come in various sizes. If the suction cup assembly of the handling device cannot be flexibly adjusted, problems will arise. For example, in the manufacturing of consumer electronic chips, small-sized IC carriers are often used for mobile phone chip packaging. If a large-sized suction cup is used for transportation, the suction force will be dispersed, and multiple carriers may be mistakenly grabbed, causing chip damage and production chaos, affecting production efficiency and product quality. In server chip manufacturing, IC carriers are usually larger in area. If a small-sized suction cup is used, it cannot cover a sufficient area, and it is very easy to cause the IC carrier to fall due to unstable adsorption. In order to overcome these problems, the existing intelligent IC carrier handling device usually requires personnel to stop the machine when sucking IC carriers of various sizes, and then replace the suction cup assemblies of various sizes to ensure its stability during transportation. However, this will undoubtedly have a great impact on actual production efficiency, and it is very manpower-consuming, which brings a great labor burden to the staff.

[0006] Secondly, during the entire production cycle of IC substrates, from the initial manufacturing link to the transportation and circulation process, and then to the early processing stage, due to the influence of various process conditions, transportation environment, and processing operations, its surface is very likely to have uneven conditions such as bulges or depressions. Taking the IC substrate of automotive electronic chips as an example, given that the use environment of automobiles is complex and changeable, and faces high temperature, low temperature, vibration, electromagnetic interference and other harsh conditions, it puts forward extremely high requirements on the reliability of the chip. This makes the IC substrate of automotive electronic chips more complex and sophisticated in manufacturing process than other fields. Correspondingly, the probability of its surface unevenness is also relatively high. The suction cup assembly lacks adaptive adjustment when handling such uneven substrates. When it comes into contact with raised areas on the substrate surface, it is very likely to cause irreparable damage to the substrate due to a hard collision, directly resulting in product scrapping. Furthermore, when it encounters recessed areas, the suction cup cannot fit tightly into the recessed areas, resulting in insufficient suction force. The substrate is very likely to fall during handling, which not only damages the IC substrate itself but also frequently disrupts the normal production process, increasing production costs and causing numerous difficult-to-solve problems in handling operations, seriously affecting the continuity and stability of production.

[0007] Third, in a highly automated working environment like a semiconductor production workshop where equipment operates continuously for long periods of time, it is difficult to completely avoid the occurrence of unexpected situations. Among them, accidental gas outages or system failures are relatively common problems. Once such a situation occurs, if the handling device lacks an effective protection mechanism, the suction cup assembly performing the handling task will rapidly drop due to the loss of control of the cylinder, and then violently collide with the collection rack or the carrier rack. The impact force generated by this collision will not only cause structural damage to the carrier rack and the collection rack, but more seriously, it will cause devastating damage to the smart IC carriers placed on them, resulting in a large number of chips being scrapped. At the same time, the suction cup device itself is also very likely to be damaged by the collision and need to be repaired or replaced. In large-scale integrated circuit manufacturing companies, the production capacity of a production line can reach thousands of IC carriers per hour. The economic losses caused by an impact damage accident due to equipment failure will be extremely huge, including not only the cost of a large number of scrapped chips, but also the equipment maintenance costs, which will undoubtedly bring great trouble to actual use.

[0008] Fourthly, due to the precise internal circuit structure and highly sensitive electronic components of smart IC carriers, their tolerance to static electricity is extremely low. During transportation, static electricity is easily accumulated due to frequent contact and friction with various components of the transportation device. Taking the precision semiconductor manufacturing environment of IC carriers for computer CPU chips as an example, although the energy carried by static electricity may seem small, it is enough to change the electrical properties of the internal circuits of the chip. Once this happens, the performance of the chip will be significantly reduced or even directly scrapped. For example, in the key production step of chip packaging, if the static electricity on the surface of the IC carrier is not eliminated in a timely and effective manner, the instantaneous high voltage generated by the static electricity release during the subsequent electrical connection with the chip may break down the extremely small and delicate circuits inside the chip, resulting in complete loss of chip function. This will not only cause waste of raw materials and increase production costs, but will also seriously affect the production cycle and delivery schedule of the product. Summary of the Invention

[0009] The object of the present invention is to provide an intelligent IC carrier board transport device and a transport method thereof, comprising a transport platform, a card placement slot is provided on the top of the transport platform, a driving device is further provided on the top of the transport platform, a lateral driving end of the driving device is sleeved with a lateral moving frame, a cylinder is provided on the top of the lateral moving frame, connecting plates 1 and 2 are provided on the outer walls on both sides of the lateral moving frame, the tops of the connecting plates 1 and 2 are fixedly connected with electromagnetic valve groups 1 and 2 respectively, a high-voltage power supply is provided at the bottom of the connecting plate 1, a suction cup transport assembly is connected to the output end of the cylinder, and the suction cup transport assembly includes a support plate, the top of the support plate is mounted on the output end of the cylinder by screws, a fixing cylinder is provided on the outer wall of the support plate, and the top of the fixing cylinder A cover plate is provided on the top of the cover plate, and a connecting shell is fixedly installed on the top of the cover plate, and multiple metal connecting tubes are movably sleeved inside the connecting shells, and multiple metal connecting tubes are fixedly connected to the top of the exhaust boxes. The top of the cover plate is also fixedly welded with an electrostatic elimination component, and the electrostatic elimination component includes an exhaust guide box, and the bottom of the exhaust guide box is welded to the top of the cover plate. A connecting cylinder is provided at the bottom of the cover plate, and a groove body is formed between the multiple connecting cylinders. The insides of the multiple groove bodies are respectively slidably connected with movable circular sleeve one, movable circular sleeve two, movable circular sleeve three and movable cylinder, and cavity one and cavity two are opened inside the movable circular sleeve one, movable circular sleeve two and movable circular sleeve three, and the movable circular sleeve one, movable circular sleeve two, movable circular sleeve three and the circumferential outer wall of the movable cylinder are fixedly connected with a limiting ring.

[0010] Preferably, the plurality of connecting shells and the plurality of exhaust boxes correspond to each other, the plurality of connecting shells and the plurality of exhaust boxes are fan-shaped in size and shape, and the central connecting shell of the cover plate and the exhaust box are cylindrical.

[0011] Preferably, the ends of the multiple metal connecting tubes extend into the interior of the multiple grooves and are connected to the outer walls of the movable circular sleeve 1, movable circular sleeve 2, movable circular sleeve 3 and the top of the movable cylinder and are communicated with the cavity 1 inside each of them and the internal cavity of the movable cylinder.

[0012] Preferably, the top of the cover plate is provided with exhaust holes, a plurality of the exhaust holes correspond to a plurality of grooves, and the plurality of the exhaust holes are located inside the exhaust guide box.

[0013] Preferably, a hollow rod is connected to the end of the exhaust guide box, a through opening is opened on the outer wall of the hollow rod, a discharge electrode is provided on the top of the hollow rod, and the discharge electrode is electrically connected to the high-voltage power supply.

[0014] Preferably, the outer wall at the end of the hollow rod pressure relief valve is connected to an exhaust arc plate pressure relief valve, and the outer wall at the end of the hollow rod is connected to an exhaust arc plate. The outer wall on one side of the exhaust arc plate is an inclined surface, and the inclined outer wall is provided with an exhaust port.

[0015] Preferably, multiple springs are provided inside the trough bodies, and the multiple springs are respectively sleeved on the circumferential outer walls of multiple connecting cylinders. The ends of the multiple springs are fixedly welded to the bottom of the cover plate, and the ends of the multiple springs are fixedly welded to the outer walls of the movable circular sleeve one, movable circular sleeve two, movable circular sleeve three and the end of the movable cylinder.

[0016] Preferably, a spring 2 and a mounting tube are welded to the inner wall of the cavity 2 inside the multiple movable circular sleeves 1, 2 and 3, a suction cup tube is welded to the end of the multiple springs 2, and the multiple suction cup tubes are respectively sleeved on the corresponding circumferential outer walls of the mounting tubes. The multiple mounting tubes are communicated with the cavity 1, and the same suction cup tube is provided on the top of the mounting tube.

[0017] Preferably, the output end of the solenoid valve group 1 is connected to air pipe 1, and the ends of multiple air pipes 1 are connected to the tops of multiple vacuum boxes; the output end of the solenoid valve group 2 is connected to air pipe 2, and the ends of multiple air pipes 2 are connected to the outer wall of the connecting shell, and the multiple connecting shells correspond to the multiple trough bodies respectively.

[0018] An intelligent IC carrier board transporting method, an intelligent IC carrier board transporting device transporting method, the specific steps are as follows:

[0019] S1: Preparation for transportation: When in use, the carrier placement rack and the collection rack carrying multiple smart IC carriers can be placed in multiple placement slots respectively, and then the driving device can be used to move and transport the multiple smart IC carriers.

[0020] S2: Adjustment of the size of the suction cup assembly: Before transporting, the control system inside the transport platform can be used to control the start of the solenoid valve group 1 to control the air intake selection of multiple connection shells. For example, when a smaller-sized smart IC carrier needs to be transported, the operator injects external compressed gas into the solenoid valve group 1 through the control system instruction. The solenoid valve group 1 will accurately select the connection shell at the center of the cover plate for air injection according to the signal of the control system. At this time, the compressed gas enters the groove at the center of the bottom of the cover plate. Due to the effect of the gas pressure, the spring 1 inside the groove is subjected to the tensile force and begins to stretch and deform. The stretching of the spring 1 drives the movable cylinder in the center area to move outward and extend to the outside. Then the control system controls the solenoid valve group 2 to perform suction operation on the corresponding vacuum box. The vacuum box is connected to the movable cylinder. Through the suction action of the vacuum box, a negative pressure environment is quickly formed inside the movable cylinder. The adsorption force generated by this negative pressure environment is sufficient to firmly grasp the smaller smart IC carrier. Then the drive device starts to work and transports the grasped smart IC carrier to the designated position. During this process, the pneumatic cylinder plays a crucial role, controlling the lifting, lowering, and placement of the intelligent IC carrier, ensuring smooth and accurate handling. When handling larger intelligent IC carriers, the control system stops supplying air to the central connector housing. The air within the central slot slowly escapes through the exhaust port. As the air escapes, Spring 1, deprived of its gas pressure support, begins to retract. This retraction drives the connected movable cylinder back into the corresponding central slot, and the control system then selects to supply air to other connector housings. As air is injected into the outermost connector housings, more suction cup cylinders participate in the gripping process, and their diameters increase, thereby expanding the gripping area. This method allows for better handling of IC carriers of various sizes without replacing the suction cup assembly, significantly improving the versatility and stability of the handling device. It also reduces the risk of accidental drops when handling IC carriers with smaller suction cups, as well as the problem of multiple IC carriers being accidentally gripped when larger suction cups are used.

[0021] S3: Flexible and adaptive adjustment: When using the movable circular sleeve 1, movable circular sleeve 2 or movable circular sleeve 3 to suck and transport large IC carriers of various sizes, in order to ensure that stable suction and grasping can be achieved when facing IC carriers with certain protrusions or depressions on the surface, the transport device has a flexible and adaptive adjustment function. When the cylinder drives the suction cup assembly to descend and approach the IC carrier, the suction cup cylinder will be subjected to different degrees of force due to the uneven surface of the IC carrier. At this time, the spring 2 comes into play. It has good elasticity and can adjust according to the force exerted on the suction cup cylinder. The suction cup assembly can be adaptively adjusted according to the force applied. When encountering a raised part, Spring 2 will be compressed, allowing the suction cup tube to retract upward a certain distance to avoid a hard collision with the raised part. When encountering a recessed part, Spring 2 will extend, allowing the suction cup tube to extend downward to better fit the recessed part. This adaptive adjustment method enables the suction cup assembly to fit more closely to the top outer wall of the intelligent IC carrier, providing more stable adsorption force, ensuring the flexibility and reliability of the handling process, and reducing the problem of adsorption effect being affected by recessed or raised positions on the surface of the IC carrier.

[0022] S4: Buffer retraction protection: In order to cope with unexpected situations that may occur in the equipment, such as accidental gas outage or system failure, the handling device is designed with a buffer retraction protection function to fully protect the intelligent IC carrier and suction cup device on the collection rack or carrier placement rack to avoid damage and cost losses caused by unexpected downtime. When the equipment is accidentally cut off from gas or a system failure occurs, the supply of compressed gas will suddenly stop. At this time, the air inside the designated slot will quickly lose through the exhaust hole, and the gas pressure will drop sharply. Since the spring 1 was in a stretched state during the previous working process, when the gas pressure disappears, the spring 1 will quickly restore its elastic deformation and generate a retraction force. This retraction force will drive the designated movable circular sleeve 1, movable circular sleeve 2, movable circular sleeve 3 or movable cylinder in use to quickly retract into its own slot. This rapid retraction action can effectively reduce the impact caused by the cylinder rapidly descending and contacting the collection rack or the carrier rack due to unexpected shutdown. The end of the cylinder's stroke is a certain distance away from the collection rack or the carrier rack. Only by using compressed gas to drive the designated movable circular sleeve one, movable circular sleeve two, movable circular sleeve three and movable cylinder to push out can the cylinder cooperate to contact the IC carrier. When the movable circular sleeve one, movable circular sleeve two, movable circular sleeve three and movable cylinder are retracted, the suction cup cylinder and the fixed cylinder cannot touch the collection rack, the carrier rack or the IC carrier when the cylinder descends to the limit position, avoiding the situation where the suction cup device falls due to machine failure and causes impact, thereby fully protecting the collection rack, the carrier rack, the intelligent IC carrier and the suction cup device, and reducing the cost loss caused by impact damage.

[0023] S5: Static electricity elimination blowing: In the process of injecting compressed air into the designated slot, in order to reduce the accumulation of static electricity on the surface of the smart IC carrier and ensure the safety of its working environment, the handling device is provided with a static electricity elimination blowing function. When compressed air is injected into the designated slot, excess air will be generated. This excess air is discharged through the exhaust holes set at the top and then enters the exhaust guide box. The exhaust guide box plays the role of guiding the airflow, and orderly introduces the exhausted air into the hollow rod. A discharge electrode is set inside the hollow rod. When the air enters the hollow rod, the discharge electrode will generate positive and negative charges. These positive and negative charges interact with the exhausted gas to form a uniform guided airflow. This guided airflow will blow to the top of the carrier placement rack and the collection rack in a uniform and gentle manner to blow the surface of the smart IC carrier. In this way, the static electricity on the surface of the smart IC carrier can be effectively neutralized, the accumulation of static electricity can be reduced, the safe working environment of the smart IC carrier can be ensured, and the impact of static electricity on its performance and life can be reduced.

[0024] Compared with the prior art, the beneficial effect of the present invention is that: in the actual use process, the device can flexibly change the area of ​​the suction cup used for transportation. In specific use, before transportation, it can be controlled by the control system inside the transportation platform so that it can start the solenoid valve group 1 to control the air intake selection of multiple connection shells. For example, when it is necessary to transport a smaller-sized smart IC carrier, the operator injects external compressed gas into the solenoid valve group 1 through the control system instruction. The solenoid valve group 1 will accurately select the connection shell at the center of the cover plate according to the signal of the control system. Gas is injected, and compressed gas enters the slot at the center of the bottom of the cover. Due to the effect of gas pressure, the spring 1 inside the slot is subjected to a tensile force and begins to stretch and deform. The stretching of the spring 1 drives the movable cylinder in the center area to move outward and extend to the outside. Then the control system controls the solenoid valve group 2 to perform a suction operation on the corresponding vacuum box. The vacuum box is connected to the movable cylinder. Through the suction effect of the vacuum box, a negative pressure environment is quickly formed inside the movable cylinder. The adsorption force generated by this negative pressure environment is sufficient to firmly grasp the smaller smart IC carrier. Then the drive device starts to work and moves the grasped smart IC carrier. The air cylinder plays an important role in the process of transporting the intelligent IC carrier to the designated position. It is mainly responsible for controlling the lifting, lowering and placement of the intelligent IC carrier to ensure the smooth and accurate transportation process. When a larger intelligent IC carrier needs to be transported, the control system stops supplying gas to the connecting shell at the center. At this time, the gas inside the central tank body will be slowly discharged through the exhaust hole. As the gas is discharged, the spring 1 begins to retract due to the loss of the support of the gas pressure. The retraction of the spring 1 drives the connected movable cylinder to retract to the corresponding center tank body, and then the control system selects to supply gas to other connecting shells again. The air intake of the shell connects to the outer shell. The further the air is injected into the inner shell, the more suction cups are involved in the adsorption and the larger their diameters are, thus increasing the adsorption and grasping area. Therefore, by controlling the air intake, the device can flexibly adjust the size of the suction cup assembly, change the number and diameter of the suction cups involved in the adsorption to adapt to the functions of IC substrates of different sizes, improve versatility and stability, reduce the risk of accidental dropping when transporting IC substrates with smaller suction cups, and reduce the trouble of incorrectly grasping multiple IC substrates when sucking with larger suction cups. It can also reduce the labor burden of manually replacing multiple suction cup devices.

[0025] Furthermore, when using the movable circular sleeve 1, movable circular sleeve 2 or movable circular sleeve 3 to suck and carry a variety of large and various sizes of IC carriers, in order to ensure that stable suction and gripping can be achieved when facing IC carriers with certain protrusions or depressions on the surface, the carrying device has a flexible adaptive adjustment function. When the cylinder drives the suction cup assembly to descend and approach the IC carrier, the suction cup cylinder will be subjected to different degrees of force due to the unevenness of the IC carrier surface. At this time, the spring 2 comes into play. It has good elasticity and can adaptively adjust according to the force applied to the suction cup cylinder. When encountering a protrusion, the spring 2 will be compressed, so that the suction cup cylinder can retract upward a certain distance to avoid a hard collision with the protrusion; when encountering a depression, the spring 2 will extend, so that the suction cup cylinder can extend downward to better fit the depression. This adaptive adjustment method enables the suction cup assembly to fit more closely to the top outer wall of the intelligent IC carrier, providing a more stable adsorption force, ensuring the flexibility and reliability of the carrying process, and reducing the problem of the adsorption effect being affected by the depressions or protrusions on the surface of the IC carrier.

[0026] In order to cope with unexpected situations that may occur in the equipment, such as accidental gas outage or system failure, the handling device is designed with a buffer retraction protection function to fully protect the intelligent IC carrier and suction cup device on the collection rack or carrier rack to avoid damage and cost losses caused by unexpected shutdown. When the equipment is accidentally cut off from gas or a system failure occurs, the supply of compressed gas will suddenly stop. At this time, the air inside the designated slot will quickly lose through the exhaust hole, and the gas pressure will drop sharply. Since spring one was in a stretched state during the previous working process, when the gas pressure disappears, spring one will quickly restore its elastic deformation and generate a retraction force. This retraction force will drive the designated movable circular sleeve one, movable circular sleeve two, movable circular sleeve three or movable cylinder in use to quickly retract into its own slot. This rapid retraction action can effectively reduce the risk of accidental shutdown causing the cylinder to drop rapidly and contact the collection rack or carrier rack. The impact is caused by the fact that the end of the stroke of the cylinder is at a certain distance from the collection rack or the carrier plate placement rack. Only by using compressed gas to drive the designated movable circular sleeve 1, movable circular sleeve 2, movable circular sleeve 3 and movable cylinder to push out can the cylinder contact the IC carrier plate. When the movable circular sleeve 1, movable circular sleeve 2, movable circular sleeve 3 and movable cylinder are all retracted, the suction cup cylinder and the fixed cylinder cannot touch the collection rack, the carrier plate placement rack or the IC carrier plate when the cylinder descends to the limit position, thereby avoiding the situation where the suction cup device falls due to machine failure and causes impact, thereby fully protecting the collection rack, the carrier plate placement rack, the intelligent IC carrier plate and the suction cup device, reducing the cost loss caused by impact damage, and making it possible to use compressed gas to drive it to flexibly adjust the suction cup selection. This air pressure-driven method can also better provide active protection functions in the event of equipment failure, reducing the occurrence of safety hazards;

[0027] In the process of injecting compressed air into the designated slot, in order to reduce the accumulation of static electricity on the surface of the smart IC carrier and ensure the safety of its working environment, the handling device is provided with a static electricity elimination blowing function. When compressed air is injected into the designated slot, excess air will be generated. This excess air is discharged through the exhaust hole set at the top and then enters the exhaust guide box. The exhaust guide box plays the role of guiding the airflow, and orderly introduces the exhausted air into the hollow rod. A discharge electrode is set inside the hollow rod. When the air enters the hollow rod, the discharge electrode will generate positive and negative charges. These positive and negative charges interact with the exhausted gas to form a uniform guided airflow. This guided airflow will blow to the top of the carrier placement rack and the collection rack in a uniform and gentle manner, blowing the surface of the smart IC carrier. In this way, the static electricity on the surface of the smart IC carrier can be effectively neutralized, the accumulation of static electricity can be reduced, the safe working environment of the smart IC carrier can be ensured, the impact of static electricity on its performance and life can be reduced, and the compressed gas can be fully utilized in various ways. Then, by using this flexible suction cup method, the outflowing gas can be fully utilized. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0029] Figure 2 It is a schematic structural diagram of the transverse movable frame of the present invention;

[0030] Figure 3 This is a schematic diagram of the fixed cylinder structure of the present invention;

[0031] Figure 4 This is a schematic diagram of the exhaust guide box structure of the present invention;

[0032] Figure 5 This is a schematic diagram of the internal cross-sectional structure of the fixing cylinder of the present invention;

[0033] Figure 6 This is a schematic diagram of the structure of the transport suction cup of the present invention;

[0034] Figure 7 This is a schematic diagram of the suction cup installation structure of the present invention;

[0035] Figure 8 This is a rear view structural diagram of the movable circular sleeve of the present invention;

[0036] Explanation of reference numerals in the figure: 100, transport platform; 110, card placement slot; 120, drive device; 200, horizontal moving frame; 210, cylinder; 220, connecting plate 1; 230, high-voltage power supply; 240, solenoid valve group 1; 250, connecting plate 2; 260, solenoid valve group 2; 300, support plate; 310, fixing cylinder; 320, cover plate; 321, connecting shell; 322, metal connecting pipe; 323, exhaust box; 324, exhaust hole; 330, exhaust guide box ; 331. Hollow rod; 332. Through-hole; 333. Discharge electrode; 334. Exhaust arc plate; 340. Connecting cylinder; 350. Spring one; 400. Movable circular sleeve one; 410. Limiting ring; 420. Cavity one; 430. Cavity two; 440. Suction cup cylinder; 441. Spring two; 442. Mounting cylinder; 500. Movable circular sleeve two; 600. Movable circular sleeve three; 700. Movable cylinder. DETAILED DESCRIPTION

[0037] The following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0038] See also Figure 1-8 , the present invention provides a technical solution:

[0039] An intelligent IC carrier transport device and a transport method thereof include a transport platform 100, a card placement slot 110 is provided on the top of the transport platform 100, and a driving device 120 is also provided on the top of the transport platform 100;

[0040] In some embodiments: the transfer platform 100 and the driving device 120 are existing technologies. The specific principles can be referred to the Heluo chip transfer machine, which belongs to the existing technology and needs no further explanation.

[0041] The lateral driving end of the driving device 120 is sleeved with a lateral moving frame 200, a cylinder 210 is provided on the top of the lateral moving frame 200, and a connecting plate 1 220 and a connecting plate 2 250 are respectively provided on the outer walls of both sides of the lateral moving frame 200, and the tops of the connecting plates 1 220 and 250 are fixedly connected to the solenoid valve group 1 240 and the solenoid valve group 2 260 respectively;

[0042] In some embodiments, the solenoid valve group 1 240 and the solenoid valve group 2 260 are existing mature technologies. The solenoid valve group 1 240 is connected to an external vacuum pump through a pipeline. With the help of precise instructions issued by the external control system, the solenoid valve group 1 240 can achieve highly selective operation and can accurately select one of the multiple connection shells 321 for vacuum operation. It is worth noting that the multiple connecting shells 321 have significant differences in size specifications, with the connecting shells 321 closer to the outside having larger volumes. Furthermore, through the coordinated operation of an external control system and the solenoid valve assembly 240, the negative pressure generated during the vacuuming of different connecting shells 321 can be flexibly adjusted. When transporting smaller IC carriers, the vacuuming of the relatively smaller connecting shells 321 located in the center can be precisely controlled. The negative pressure is adjusted to an appropriate value based on the characteristics of the carrier and the handling requirements, ensuring sufficient and stable suction force for the small carrier and preventing the carrier from falling due to insufficient suction. When transporting large IC carriers, the larger connecting shells 321 on the outside can be selected for vacuuming, while the negative pressure intensity is increased to cover a larger area of ​​the carrier and ensure the stability of the carrier during transportation, thereby achieving efficient and reliable transportation of IC carriers of various sizes.

[0043] Solenoid valve group 260 is primarily responsible for the precise and selective input of external compressed air. It features multiple air supply ports, each with finely adjustable air flow through an external control system. During actual handling, different suction cup sizes require varying ejection pressures. For example, smaller suction cups require relatively low ejection pressures. By adjusting solenoid valve group 260 through the control system and reducing the air flow at the corresponding air supply port, the system provides the perfect air pressure for the smaller suction cups, enabling them to eject and securely hold small IC substrates. Larger suction cups, however, require higher ejection pressures due to their structure and required surface area. In this case, the control system increases the air flow at the corresponding air supply port of solenoid valve group 260 to ensure sufficient air pressure for ejection, allowing them to securely and firmly hold large IC substrates. Through such precise control of the gas supply volume, the working requirements of suction cups of different sizes can be better adapted, and the stability of the entire handling device when dealing with IC carriers of various sizes can be significantly improved, ensuring the efficient and smooth progress of the handling operation. The above are all existing mature technologies.

[0044] A high-voltage power supply 230 is provided at the bottom of the connecting plate 1 220. The output end of the cylinder 210 is connected to a suction cup transport assembly. The suction cup transport assembly includes a support plate 300. The top of the support plate 300 is mounted on the output end of the cylinder 210 with screws. A fixing cylinder 310 is provided on the outer wall of the support plate 300. A cover plate 320 is provided on the top of the fixing cylinder 310. A connecting shell 321 is fixedly mounted on the top of the cover plate 320. A plurality of metal connecting tubes 322 are movably connected inside the connecting shells 321. A plurality of metal connecting tubes 322 are fixedly connected to the tops of the plurality of metal connecting tubes 322. An exhaust box 323 is fixedly connected to the tops of the plurality of metal connecting tubes 322.

[0045] In some embodiments: multiple vacuum boxes 323 can move together during the downward movement of movable circular sleeve 1 400, movable circular sleeve 2 500, movable circular sleeve 3 600 and movable cylinder 700, and their multiple metal connecting tubes 322 are all against the outside of spring 1 350 to reduce collision with spring 1 350 and avoid affecting the selective ejection of movable circular sleeve 1 400, movable circular sleeve 2 500, movable circular sleeve 3 600 and movable cylinder 700 in the later stage.

[0046] The top of the cover plate 320 is also fixedly welded with an electrostatic elimination assembly, which includes an exhaust guide box 330. The bottom of the exhaust guide box 330 is welded to the top of the cover plate 320. The bottom of the cover plate 320 is provided with a connecting cylinder 340, and a groove is formed between multiple connecting cylinders 340.

[0047] In some embodiments, the spring disposed inside the groove formed between the plurality of connecting cylinders 340 only rests against the circumferential outer walls of the plurality of connecting cylinders 340 , thereby reducing its influence on the gas injection and the movement of the metal connecting tube 322 .

[0048] The interiors of the multiple troughs are respectively slidably connected with movable circular sleeve 1 400, movable circular sleeve 2 500, movable circular sleeve 3 600 and movable cylinder 700, and the movable circular sleeve 1 400, movable circular sleeve 2 500 and movable circular sleeve 3 600 are provided with cavity 1 420 and cavity 2 430, and the outer circumferential walls of the movable circular sleeve 1 400, movable circular sleeve 2 500, movable circular sleeve 3 600 and movable cylinder 700 are fixedly connected with a limiting ring 410.

[0049] In some embodiments, a rubber ring may be embedded in the outer wall of the limiting ring 410 to reduce the outflow of compressed gas from the limiting ring 410 and the inner wall of the tank body.

[0050] Specifically, the plurality of connecting shells 321 correspond to the plurality of exhaust boxes 323 , and the plurality of connecting shells 321 and the plurality of exhaust boxes 323 are fan-shaped in size and shape. The central connecting shell 321 and the exhaust box 323 of the cover plate 320 are cylindrical.

[0051] In some embodiments, it is convenient to provide various negative pressure strengths according to various sizes of smart IC carriers, thereby better improving their stability during transportation.

[0052] Furthermore, the ends of the multiple metal connecting tubes 322 extend into the interior of the multiple grooves and are connected to the outer walls of the tops of the movable circular sleeve 1 400 , movable circular sleeve 2 500 , movable circular sleeve 3 600 and movable cylinder 700 and are communicated with the internal cavities of the cavity 1 420 and the movable cylinder 700 in their respective interiors.

[0053] Furthermore, an exhaust hole 324 is opened on the top of the cover plate 320 , and a plurality of the exhaust holes 324 correspond to a plurality of grooves, and the plurality of the exhaust holes 324 are located inside the exhaust guide box 330 .

[0054] In some embodiments: multiple exhaust holes 324 are small, which is convenient for exhausting the internal compressed gas, so that when the gas supply is stopped, the designated movable circular sleeve 1 400, movable circular sleeve 2 500, movable circular sleeve 3 600 and movable cylinder 700 can be reset by using their respective equipped springs 1 350. When the movable circular sleeve 1 400, movable circular sleeve 2 500, movable circular sleeve 3 600 or movable cylinder 700 is pneumatically lifted, some of the excess gas can be discharged through the exhaust holes 324 into the interior of the hollow rod 331.

[0055] In some embodiments: the exhaust hole 324 is designed to balance the pressure, etc., and its aperture is small. When gas is injected normally, the rate at which the gas is discharged through the exhaust hole is adapted to the compression and flow of the gas in the cylinder, and will not cause a situation where the pressure difference on both sides is too large and it is difficult to push. When the gas injection is stopped, the potential energy of the spring 1 350 will drive the designated movable circular sleeve 1 400, movable circular sleeve 2 500, movable circular sleeve 3 600 or movable cylinder 700 to retract, and then, when there is no new gas injection, the gas will be exhausted through the exhaust hole 324 and slowly retracted into the corresponding groove body, so that it can meet the flexible change of pushing out the corresponding suction cup part while also being able to retract and store it, which is convenient for carrying smart IC carriers of various sizes.

[0056] Furthermore, a hollow rod 331 is connected to the end of the exhaust guide box 330 , a through hole 332 is opened on the outer wall of the hollow rod 331 , and a discharge electrode 333 is provided on the top of the hollow rod 331 , and the discharge electrode 333 is electrically connected to the high-voltage power supply 230 .

[0057] In some embodiments, the discharge electrode 333 is electrically connected to the high-voltage power supply 230, which provides the necessary power for the entire static elimination system. When the high-voltage power supply 230 supplies power to the discharge electrode 333, it generates a high voltage. This high voltage ionizes the air surrounding the electrode, generating positive and negative charges. These positive and negative charges are thoroughly mixed with the airflow discharged from the exhaust holes 324 and introduced into the hollow rod 331 via the exhaust guide box 330. The mixed airflow, carrying the charges, gently and evenly flows toward the surfaces of the smart IC carriers atop the carrier placement and collection racks. Because opposite charges attract, the positive and negatively charged airflow effectively neutralizes static electricity generated on the surface of the smart IC carriers due to friction and other factors, thereby reducing the potential threat of static electricity to the performance and lifespan of the smart IC carriers. This ensures that the IC carriers can be handled and subsequently handled in a safe, low-static environment, ensuring the smooth progress of the semiconductor manufacturing process. The above is prior art.

[0058] It is worth noting that the outer wall at the end of the hollow rod 331 is connected to an exhaust arc plate 334. The outer wall on one side of the exhaust arc plate 334 is an inclined surface, and the inclined outer wall is provided with an exhaust port, which is convenient for eliminating static electricity of the smart IC carrier and ensuring that the IC carrier can be transported and other subsequent operations in a safe, low-static environment.

[0059] It is worth noting that multiple springs 350 are provided inside the trough bodies, and the multiple springs 350 are respectively sleeved on the circumferential outer walls of the multiple connecting cylinders 340. The ends of the multiple springs 350 are fixedly welded to the bottom of the cover plate 320, and the ends of the multiple springs 350 are fixedly welded to the outer walls of the ends of the movable circular sleeve 1 400, movable circular sleeve 2 500, movable circular sleeve 3 600 and movable cylinder 700.

[0060] In addition, a spring 2 441 and a mounting tube 442 are welded to the inner wall of the cavity 2 430 inside the movable circular sleeve 1 400, the movable circular sleeve 2 500 and the movable circular sleeve 3 600, and a suction cup tube 440 is welded to the end of the spring 2 441. The suction cup tubes 440 are respectively sleeved on the outer circumference of the corresponding mounting tube 442. The mounting tubes 442 are communicated with the cavity 1 420, and the same suction cup tube 440 is arranged on the top of the mounting tube 442.

[0061] In some embodiments, the bottom of the movable cylinder 700 is only provided with a single suction cup cylinder 400 , which is the same as the movable cylinder 700 , because the single suction cup cylinder 400 will not cause unstable adsorption due to the uneven smart IC carrier.

[0062] In addition, the output end of the solenoid valve group 1 240 is connected to the air pipe 1, and the ends of the multiple air pipes 1 are connected to the tops of the multiple vacuum boxes 323. The output end of the solenoid valve group 2 260 is connected to the air pipe 2, and the ends of the multiple air pipes 2 are connected to the outer wall of the connecting shell 321. The multiple connecting shells 321 correspond to the multiple trough bodies respectively.

[0063] In some embodiments: the device can be powered by an external power supply, the device uses a control system installed inside the transfer platform 100, and is controlled by an operating screen, all of which belong to the existing technology.

[0064] An intelligent IC carrier board transporting method, an intelligent IC carrier board transporting device transporting method, the specific steps are as follows:

[0065] S1: Transportation preparation: When in use, the carrier placement rack and the collection rack carrying multiple smart IC carriers can be placed in multiple placement slots 110 respectively, and then the driving device 120 can be used to move and transport the multiple smart IC carriers.

[0066] S2: Adjustment of the size of the suction cup assembly: Before transporting, the control system inside the transport platform 100 can be used to control the solenoid valve group 240 to control the air intake selection of multiple connection shells 321. For example, when a smaller-sized smart IC carrier needs to be transported, the operator injects external compressed gas into the solenoid valve group 240 through the control system instruction. The solenoid valve group 240 will accurately select the connection shell 321 at the center of the cover plate 320 for air injection according to the signal of the control system. At this time, the compressed gas enters the groove at the bottom center of the cover plate 320, and the compressed gas is discharged by the solenoid valve group 240. Due to the effect of gas pressure, the spring 1 350 inside the tank body is subjected to a tensile force and begins to stretch and deform. The stretching of the spring 1 350 drives the movable cylinder 700 in the central area to move outward and extend to the outside. Then the control system controls the solenoid valve group 260 to perform a suction operation on the corresponding vacuum box 323. The vacuum box 323 is connected to the movable cylinder 700. Through the suction action of the vacuum box 323, a negative pressure environment is quickly formed inside the movable cylinder 700. The adsorption force generated by this negative pressure environment is sufficient to firmly grasp the smaller smart IC carrier. Then the drive device 120 starts working and the grasped smart IC carrier is The C carrier is transported to the designated position. In this process, the cylinder 210 plays an important role. It is mainly responsible for controlling the lifting, lowering and placement of the smart IC carrier to ensure the smooth and accurate transportation process. When a larger-sized smart IC carrier needs to be transported, the control system stops supplying gas to the connecting shell 321 at the center position. At this time, the gas inside the central groove body will slowly be discharged through the exhaust hole 324. As the gas is discharged, the spring 1 350 begins to retract due to the loss of gas pressure support. The retraction of the spring 1 350 drives the movable cylinder 700 connected to it to retract to the corresponding center groove The air is then supplied to other connecting shells 321 through the control system. The more air is injected into the connecting shells 321, the more suction cup cylinders 440 are involved in adsorption, and the larger their diameters are, so the adsorption and grasping area is also larger. In this way, it is possible to better adapt to the grasping of IC carriers of various sizes without replacing the suction cup device, which greatly improves the versatility and stability of the transport device, and at the same time reduces the risk of accidental dropping when transporting IC carriers with smaller suction cups, and the trouble of incorrectly grasping multiple IC carriers when sucking with larger suction cups.

[0067] S3: Flexible and adaptive adjustment: When using the movable circular sleeve 1 400, the movable circular sleeve 2 500 or the movable circular sleeve 3 600 to suck and carry large IC carriers of various sizes, in order to ensure that stable suction and grasping can be achieved when facing IC carriers with certain protrusions or depressions on the surface, the carrying device has a flexible and adaptive adjustment function. When the cylinder 210 drives the suction cup assembly to descend and approach the IC carrier, due to the unevenness of the IC carrier surface, the suction cup cylinder 440 will be subjected to different degrees of force. At this time, the spring 2 441 comes into play. It has good elasticity and can adjust according to the suction cup cylinder 440. When encountering a raised part, the second spring 441 will be compressed, so that the suction cup tube 440 can retract a certain distance upward to avoid a hard collision with the raised part; when encountering a recessed part, the second spring 441 will extend, so that the suction cup tube 440 can extend downward to better fit the recessed part. This adaptive adjustment method enables the suction cup assembly to fit the top outer wall of the smart IC carrier more closely, providing a more stable adsorption force, ensuring the flexibility and reliability of the handling process, and reducing the problem of the adsorption effect being affected by the recessed or raised positions on the surface of the IC carrier.

[0068] S4: Buffer retraction protection: In order to cope with unexpected situations that may occur in the equipment, such as accidental gas outage or system failure, the handling device is designed with a buffer retraction protection function to fully protect the intelligent IC carrier and suction cup device on the collection rack or carrier placement rack to avoid damage and cost losses caused by unexpected downtime. When the equipment is accidentally cut off from gas or a system failure occurs, the supply of compressed gas will suddenly stop. At this time, the air inside the designated slot will quickly lose through the exhaust hole 324, and the gas pressure will drop sharply. Since the spring 1 350 was in a stretched state during the previous working process, when the gas pressure disappears, the spring 1 350 will quickly restore its elastic deformation and generate a retraction force. This retraction force will drive the designated movable circular sleeve 1 400, movable circular sleeve 2 500, movable circular sleeve 3 600 or movable cylinder 700 in use to quickly retract into its own slot. This rapid retraction action can In order to effectively reduce the impact caused by the cylinder 210 rapidly descending and contacting the collection rack or the carrier rack due to unexpected shutdown, the end of the stroke of the cylinder 210 is at a certain distance from the collection rack or the carrier rack. It can only cooperate with the cylinder 210 to contact the IC carrier by using compressed gas to drive the specified movable circular sleeve 1 400, movable circular sleeve 2 500, movable circular sleeve 3 600 and movable cylinder 700 to push out. When the movable circular sleeve 1 400, movable circular sleeve 2 500, movable circular sleeve 3 600 and movable cylinder 700 are all retracted, the suction cup cylinder 440 and the fixed cylinder 310 cannot touch the collection rack, the carrier rack or the IC carrier when the cylinder 210 descends to the extreme position, avoiding the situation where the suction cup device falls due to machine failure and causes impact, thereby fully protecting the collection rack, the carrier rack, the intelligent IC carrier and the suction cup device, and reducing the cost loss caused by impact damage.

[0069] S5: Static electricity elimination blowing: In the process of injecting compressed air into the designated slot, in order to reduce the accumulation of static electricity on the surface of the smart IC carrier and ensure the safety of its working environment, the handling device is provided with a static electricity elimination blowing function. When compressed air is injected into the designated slot, excess air will be generated. This excess air is discharged through the exhaust hole 324 set at the top and then enters the exhaust guide box 330. The exhaust guide box 330 plays the role of guiding the airflow, and orderly introduces the exhausted air into the hollow rod 331. The hollow rod 331 is provided with a discharge electrode 333. When the air enters the hollow rod 331, the discharge electrode 333 will generate positive and negative charges. These positive and negative charges interact with the exhausted gas to form a uniform guided airflow. This guided airflow will blow to the top of the carrier placement rack and the collection rack in a uniform and gentle manner to blow the surface of the smart IC carrier. In this way, the static electricity on the surface of the smart IC carrier can be effectively neutralized, the accumulation of static electricity can be reduced, the safe working environment of the smart IC carrier can be ensured, and the impact of static electricity on its performance and life can be reduced.

[0070] Working principle of the present invention: When in use, the carrier placement rack and the collection rack carrying multiple smart IC carriers can be placed in multiple placement slots 110 respectively, and then the driving device 120 can be used to move and transport the multiple smart IC carriers. Before transporting, the control system inside the transport platform 100 can be used to control it so that it can start the solenoid valve group 240 to control the air intake selection of multiple connection shells 321. For example, when it is necessary to transport a smaller-sized smart IC carrier, the operator injects external compressed gas into the solenoid valve group 240 through the control system instruction. The solenoid valve group 240 will accurately select the connection shell 321 at the center of the cover plate 320 for injection according to the signal of the control system. At this time, the compressed gas enters the groove at the center of the bottom of the cover plate 320. Due to the effect of the gas pressure, the spring 1 350 inside the groove is subjected to a tensile force and begins to stretch and deform. The stretching of the spring 1 350 drives the movable cylinder 700 in the central area to move outward and extend to the outside. Then the control system controls the solenoid valve group 260 to perform a suction operation on the corresponding vacuum box 323. The vacuum box 323 is connected to the movable cylinder 700. Through the suction action of the vacuum box 323, a negative pressure environment is quickly formed inside the movable cylinder 700. The adsorption force generated by this negative pressure environment is sufficient to firmly grasp the smaller smart IC carrier. Then the drive device 120 starts to work and transports the grasped smart IC carrier to the designated position. In this process In the process, the air cylinder 210 plays an important role. It is mainly responsible for controlling the grabbing, lifting and lowering and placing actions of the intelligent IC carrier to ensure the smoothness and accuracy of the handling process. When a larger-sized intelligent IC carrier needs to be handled, the control system stops supplying gas to the connecting shell 321 at the center position. At this time, the gas inside the central tank body will be slowly discharged through the exhaust hole 324. As the gas is discharged, the spring 1 350 begins to retract due to the loss of the support of the gas pressure. The retraction of the spring 1 350 drives the connected movable cylinder 700 to retract to the corresponding center tank body, and then the control system selects to supply air to other designated connecting shells 321 again. The more gas is injected into the connecting shell 321 outside, the more suction cup cylinders 440 are involved in the adsorption. The larger the amount, and the larger its diameter, the larger the area for adsorption and grasping. In this way, it is possible to better adapt to the grasping of IC carriers of various sizes without replacing the suction cup device, which greatly improves the versatility and stability of the handling device. At the same time, it reduces the risk of accidental dropping of IC carriers when transporting IC carriers with smaller suction cups, and the trouble of incorrect grasping of multiple IC carriers when sucking with larger suction cups. When using the movable circular sleeve 1 400, the movable circular sleeve 2 500 or the movable circular sleeve 3 600 to absorb and transport larger IC carriers of various sizes, in order to ensure stable absorption and grasping when facing IC carriers with certain protrusions or depressions on the surface, the handling device has a flexible adaptive adjustment function.When the cylinder 210 drives the suction cup assembly to descend and approach the IC carrier, the suction cup cylinder 440 will be subjected to different degrees of force due to the possible unevenness of the surface of the IC carrier. At this time, the second spring 441 comes into play. It has good elasticity and can adaptively adjust according to the force applied to the suction cup cylinder 440. When encountering a raised part, the second spring 441 will be compressed, so that the suction cup cylinder 440 can retract a certain distance upward to avoid a hard collision with the raised part; when encountering a recessed part, the second spring 441 will extend, so that the suction cup cylinder 440 can extend downward to better fit the recessed part. This adaptive adjustment method enables the suction cup assembly to fit more closely to the top outer wall of the intelligent IC carrier, providing a more stable adsorption force, ensuring the flexibility and reliability of the handling process, and reducing the problem of the adsorption effect being affected by recessed or raised positions on the surface of the IC carrier. In order to cope with unexpected situations that may occur in the equipment, such as accidental gas outage or system failure, the handling device is designed with a buffer retraction protection function to fully protect the intelligent IC carrier and suction cup device on the collection rack or carrier rack to avoid damage and cost losses caused by unexpected shutdown. When the equipment is accidentally cut off from gas or a system failure occurs, the supply of compressed gas will suddenly stop. At this time, the air inside the designated slot will quickly lose through the exhaust hole 324, and the gas pressure will drop sharply. Since the spring 1 350 was in a stretched state during the previous working process, when the gas pressure disappears, the spring 1 350 will quickly restore its elastic deformation and generate a retraction force. This retraction force will drive the designated movable circular sleeve 1 400, movable circular sleeve 2 500, movable circular sleeve 3 600 or movable cylinder 700 in use to quickly retract into its own slot. This rapid retraction action can effectively reduce the impact caused by the cylinder 210 rapidly descending and contacting the collection rack or carrier rack due to an unexpected shutdown. The end of the stroke of the cylinder 210 is a certain distance away from the collection rack or carrier rack. Compressed gas is used to drive the designated movable circular sleeve 1 400, movable circular sleeve 2 500, movable circular sleeve 3 600 and movable cylinder 700 to push out so that they can cooperate with the cylinder 210 to contact the IC carrier. When the movable circular sleeve 1 400, movable circular sleeve 2 500, movable circular sleeve 3 600 and movable cylinder 700 are all retracted, the suction cup cylinder 440 and the fixed cylinder 310 cannot touch the collection rack, the carrier placement rack or the IC carrier when the cylinder 210 descends to the limit position, thereby avoiding the situation where the suction cup device falls due to machine failure and causes collision , thereby fully protecting the collection rack, carrier placement rack, smart IC carrier and suction cup device, reducing the cost loss caused by impact damage. In the process of injecting compressed air into the designated slot, in order to reduce the accumulation of static electricity on the surface of the smart IC carrier and ensure the safety of its working environment, the handling device is equipped with a static elimination and blowing function. When compressed air is injected into the designated slot, excess air will be generated. This excess air is discharged through the exhaust hole 324 set at the top and then enters the exhaust guide box 330.The exhaust guide box 330 guides the airflow, systematically directing the exhausted air into the hollow rod 331. Discharge electrodes 333 are located within the hollow rod 331. When air enters the hollow rod 331, the discharge electrodes 333 generate positive and negative charges. These charges interact with the exhausted air, forming a uniform, guided airflow. This airflow gently and evenly flows toward the top of the carrier placement rack and collection rack, brushing the surface of the smart IC carrier. This effectively neutralizes static electricity on the surface of the smart IC carrier, reducing static accumulation, ensuring a safe operating environment for the smart IC carrier, and minimizing the impact of static electricity on its performance and lifespan.

[0071] The above content is a further detailed description of the present invention in conjunction with specific implementation methods. It cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, they can make several simple deductions or substitutions without departing from the concept of the present invention, which should be regarded as falling within the scope of protection determined by the claims submitted for the present invention.

Claims

1. An intelligent IC carrier transport device, comprising a transport platform (100), characterized in that: The top of the transport platform (100) is provided with a placement slot (110), and the top of the transport platform (100) is also provided with a driving device (120), the lateral driving end of the driving device (120) is sleeved with a lateral moving frame (200), the top of the lateral moving frame (200) is provided with a cylinder (210), and the outer walls of both sides of the lateral moving frame (200) are respectively provided with a connecting plate 1 (220) and a connecting plate 2 (250), and the tops of the connecting plate 1 (220) and the connecting plate 2 (250) are respectively fixedly connected with electromagnetic Valve group 1 (240) and solenoid valve group 2 (260), a high-voltage power supply (230) is provided at the bottom of the connecting plate 1 (220), the output end of the cylinder (210) is connected to a suction cup transport assembly, the suction cup transport assembly includes a support plate (300), the top of the support plate (300) is mounted on the output end of the cylinder (210) by screws, the outer wall of the support plate (300) is provided with a fixing cylinder (310), the top of the fixing cylinder (310) is provided with a cover plate (320), the top of the cover plate (320) is fixedly mounted There is a connecting shell (321), a plurality of metal connecting tubes (322) are movably sleeved inside the connecting shells (321), a plurality of metal connecting tubes (322) are fixedly connected to the top of an exhaust box (323), a static elimination component is also fixedly welded to the top of the cover plate (320), the static elimination component includes an exhaust guide box (330), the bottom of the exhaust guide box (330) is welded to the top of the cover plate (320), a connecting cylinder (340) is provided at the bottom of the cover plate (320), and a plurality of the connecting cylinders (340) are fixedly welded to the top of the cover plate (320). A groove body is formed between the plurality of groove bodies, wherein movable circular sleeve 1 (400), movable circular sleeve 2 (500), movable circular sleeve 3 (600) and movable cylinder (700) are slidably connected inside the plurality of groove bodies, and cavity 1 (420) and cavity 2 (430) are provided inside the movable circular sleeve 1 (400), movable circular sleeve 2 (500) and movable circular sleeve 3 (600), and the outer circumferential walls of the movable circular sleeve 1 (400), movable circular sleeve 2 (500), movable circular sleeve 3 (600) and movable cylinder (700) are fixedly connected to a limiting ring (410).

2. The intelligent IC carrier transport device according to claim 1, characterized in that: The plurality of connecting shells (321) and the plurality of exhaust boxes (323) correspond to each other, and the plurality of connecting shells (321) and the plurality of exhaust boxes (323) are fan-shaped in size and shape. The central connecting shell (321) and the exhaust box (323) of the cover plate (320) are cylindrical.

3. The intelligent IC carrier transport device according to claim 1, characterized in that: The ends of the plurality of metal connecting tubes (322) extend into the interior of the plurality of grooves and are connected to the outer walls of the tops of the movable circular sleeve 1 (400), movable circular sleeve 2 (500), movable circular sleeve 3 (600) and movable cylinder (700), and are in communication with the internal cavities of the cavity 1 (420) and the movable cylinder (700) within the respective interiors.

4. The intelligent IC carrier transport device according to claim 1, characterized in that: An exhaust hole (324) is provided on the top of the cover plate (320), a plurality of the exhaust holes (324) correspond to a plurality of slots, and the plurality of the exhaust holes (324) are located inside the exhaust guide box (330).

5. The intelligent IC carrier transport device according to claim 1, characterized in that: The exhaust guide box (330) is connected to a hollow rod (331) at its end, a through opening (332) is provided on an outer wall of the hollow rod (331), and a discharge electrode (333) is provided on the top of the hollow rod (331), and the discharge electrode (333) is electrically connected to the high-voltage power supply (230).

6. The intelligent IC carrier transport device according to claim 1, characterized in that: The outer wall at the end of the hollow rod (331) is connected to an exhaust arc plate (334), and one side outer wall of the exhaust arc plate (334) is an inclined surface, and an exhaust port is provided on the inclined outer wall.

7. The intelligent IC carrier transport device according to claim 1, characterized in that: A plurality of springs (350) are provided inside the groove bodies, and the plurality of springs (350) are respectively sleeved on the circumferential outer walls of the plurality of connecting cylinders (340). The ends of the plurality of springs (350) are fixedly welded to the bottom of the cover plate (320), and the ends of the plurality of springs (350) are fixedly welded to the outer walls of the ends of the movable circular sleeve (400), the movable circular sleeve (500), the movable circular sleeve (600) and the movable cylinder (700).

8. The intelligent IC carrier transport device according to claim 1, characterized in that: The inner wall of the cavity 2 (430) inside the movable circular sleeve 1 (400), the movable circular sleeve 2 (500) and the movable circular sleeve 3 (600) is welded with a spring 2 (441) and a mounting tube (442), and the ends of the spring 2 (441) are welded with a suction cup tube (440). The suction cup tubes (440) are respectively sleeved on the outer circumference of the corresponding mounting tube (442). The mounting tubes (442) are communicated with the cavity 1 (420), and the top of the mounting tube (442) is provided with an identical suction cup tube (440).

9. The intelligent IC carrier transport device according to claim 1, characterized in that: The output end of the solenoid valve group 1 (240) is connected to the air pipe 1, and the ends of the multiple air pipes 1 are connected to the tops of the multiple vacuum boxes (323). The output end of the solenoid valve group 2 (260) is connected to the air pipe 2, and the ends of the multiple air pipes 2 are connected to the outer wall of the connecting shell (321). The multiple connecting shells (321) respectively correspond to the multiple trough bodies.

10. A method for transporting an intelligent IC carrier, according to any one of claims 1 to 9, comprising the following steps, characterized in that: S1: Preparation for transportation: When in use, the carrier placement rack and the collection rack carrying multiple smart IC carriers can be placed inside multiple placement slots (110) respectively, and then the driving device (120) can be used to move and transport the multiple smart IC carriers. S2: Adjustment of the size of the suction cup assembly: Before transporting, the control system inside the transport platform (100) can be used to control the solenoid valve group 1 (240) to control the air intake selection of multiple connection shells (321). For example, when a smaller-sized smart IC carrier needs to be transported, the operator injects external compressed gas into the solenoid valve group 1 (240) through the control system instruction. The solenoid valve group 1 (240) will accurately select the connection shell (321) at the center of the cover plate (320) for air injection according to the signal of the control system. At this time, the compressed gas enters the groove at the bottom center of the cover plate (320). In the process, due to the effect of gas pressure, the spring 1 (350) inside the tank body is subjected to a tensile force and begins to stretch and deform. The stretching of the spring 1 (350) drives the movable cylinder (700) in the central area to move outward and extend to the outside. Then the control system controls the electromagnetic valve group 2 (260) to perform a suction operation on the corresponding vacuum box (323). The vacuum box (323) is connected to the movable cylinder (700). Through the suction effect of the vacuum box (323), a negative pressure environment is quickly formed inside the movable cylinder (700). The adsorption force generated by this negative pressure environment is sufficient to firmly grasp the smaller intelligent IC carrier board. Then the driving device (120) starts to work. The gripped smart IC carrier is moved to the designated position. In this process, the air cylinder (210) plays an important role. It is mainly responsible for controlling the gripping, lifting and lowering and placement of the smart IC carrier to ensure the smoothness and accuracy of the handling process. When a larger-sized smart IC carrier needs to be transported, the control system stops supplying gas to the connecting shell (321) at the center position. At this time, the gas inside the central tank body will be slowly discharged through the exhaust hole (324). As the gas is discharged, the spring (350) begins to retract due to the loss of the support of the gas pressure. The retraction of the spring (350) drives the movable cylinder (700) connected to it to retract. To the inside of the groove body at the corresponding center, and then the control system is used to select the air intake of the designated other connection shells (321). The further the air is injected into the connection shells (321) outside, the more suction cup cylinders (440) are involved in the adsorption, and the larger the diameter is, so the adsorption and grasping area is also larger. In this way, it is possible to better adapt to the grasping of IC carriers of various sizes without replacing the suction cup device, which greatly improves the versatility and stability of the handling device, and at the same time reduces the risk of accidental dropping when the smaller suction cup is used to carry the IC carrier, and reduces the trouble of incorrect grasping of multiple IC carriers when the larger suction cup is used to absorb. S3: Flexible and adaptive adjustment: When using the movable circular sleeve 1 (400), the movable circular sleeve 2 (500) or the movable circular sleeve 3 (600) to suck and carry larger IC carriers of various sizes, in order to ensure that stable suction and grasping can be achieved when facing IC carriers with certain protrusions or depressions on the surface, the carrying device has a flexible and adaptive adjustment function. When the cylinder (210) drives the suction cup assembly to descend and approach the IC carrier, the suction cup cylinder (440) will be subjected to different degrees of force due to the unevenness of the IC carrier surface. At this time, the spring 2 (441) comes into play. It has good elasticity and can adjust the suction cup cylinder according to the degree of the suction cup cylinder. The force applied to (440) is adaptively adjusted. When encountering a raised portion, the second spring (441) is compressed, so that the suction cup tube (440) can be retracted upward by a certain distance to avoid a hard collision with the raised portion; when encountering a recessed portion, the second spring (441) is extended, so that the suction cup tube (440) can be extended downward to better fit the recessed portion. This adaptive adjustment method enables the suction cup assembly to fit more closely to the top outer wall of the smart IC carrier, providing a more stable adsorption force, ensuring the flexibility and reliability of the handling process, and reducing the problem of the adsorption effect being affected by the presence of recessed or raised positions on the surface of the IC carrier. S4: Buffered retraction protection: In order to cope with unexpected situations that may occur in the equipment, such as accidental gas outage or system failure, the handling device is designed with a buffered retraction protection function to fully protect the intelligent IC carrier and suction cup device on the collection rack or carrier placement rack to avoid damage and cost losses caused by unexpected downtime. When the equipment is accidentally cut off or the system fails, the supply of compressed gas will suddenly stop. At this time, the air inside the designated slot will quickly lose through the exhaust hole (324), and the gas pressure will drop sharply. Since the spring one (350) is in a stretched state during the previous working process, when the gas pressure disappears, the spring one (350) will quickly restore its elastic deformation and generate a retraction force. This retraction force will drive the designated movable circular sleeve one (400), movable circular sleeve two (500), movable circular sleeve three (600) or movable cylinder (700) in use to quickly retract into its own slot. This rapid retraction action can effectively reduce accidents. The shutdown causes the cylinder (210) to drop rapidly and contact the collection rack or the carrier rack, causing a collision. The end of the stroke of the cylinder (210) is a certain distance away from the collection rack or the carrier rack. Only by using compressed gas to drive the designated movable circular sleeve 1 (400), movable circular sleeve 2 (500), movable circular sleeve 3 (600) and movable cylinder (700) to push out can the cylinder (210) cooperate with the IC carrier. When the movable circular sleeve 1 (400), movable circular sleeve 2 (500), movable circular sleeve 3 (600) and movable cylinder (700) are all retracted, the suction cup cylinder (440) and the fixed cylinder (310) cannot touch the collection rack, the carrier rack or the IC carrier when the cylinder (210) drops to the limit position, thereby avoiding the situation where the suction cup device falls due to machine failure and causes a collision, thereby fully protecting the collection rack, the carrier rack, the intelligent IC carrier and the suction cup device, and reducing the cost loss caused by impact damage. S5: static electricity elimination and blowing: in the process of injecting compressed air into the designated slot, in order to reduce the accumulation of static electricity on the surface of the intelligent IC carrier and ensure the safety of its working environment, the handling device is provided with a static electricity elimination and blowing function. When the compressed air is injected into the designated slot, excess air will be generated. The excess air is discharged through the exhaust hole (324) provided on the top and then enters the exhaust guide box (330). The exhaust guide box (330) plays the role of guiding the airflow, and orderly introduces the exhausted air into the hollow rod (331). The hollow rod (331) is provided with a discharge electrode (333). When the air enters the hollow rod (331), the discharge electrode (333) will generate positive and negative charges. These positive and negative charges interact with the exhausted gas to form a uniform guide airflow. This guide airflow will blow towards the top of the carrier placement rack and the collection rack in a uniform and gentle manner to blow the surface of the intelligent IC carrier. In this way, the static electricity on the surface of the intelligent IC carrier can be effectively neutralized, the accumulation of static electricity can be reduced, the safe working environment of the intelligent IC carrier can be ensured, and the impact of static electricity on its performance and life can be reduced.

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