Epoxy pouring sealant as well as preparation method and application thereof

Abstract

The invention discloses an epoxy pouring sealant as well as a preparation method and application thereof, and the epoxy pouring sealant is prepared from a component A and a component B in a mass ratio of 100: (25-35), the formula A comprises 55-60 parts by weight of epoxy resin, 10-15 parts by weight of a diluent, 27-32 parts by weight of a filler and 0.5-1.5 parts by weight of a coupling agent; the component B comprises a curing agent and an accelerant, and the weight ratio of the accelerant in the component B is less than or equal to 2wt%; the epoxy resin comprises nitrile rubber modified epoxy resin and bisphenol A epoxy resin, and the mass ratio of the nitrile rubber modified epoxy resin to the bisphenol A epoxy resin is (3-6): (4-7). The buffer performance and the adhesive force can be improved at the same time, and therefore the requirement for improving the buffer performance and the adhesive force under the complex working condition of carbon fiber spiral glow discharge can be met.

Description

Technical Field

[0001] The present invention relates to the technical field of sealants, and in particular to an epoxy potting adhesive and a preparation method and application thereof. Background Art

[0002] The carbon fiber spiral glow discharge electrode structure consists of carbon fiber wrapped around a metal inner electrode with a PTFE insulation layer. However, due to uneven thickness and defects in the PTFE insulation layer during production, the PTFE insulation layer broke down over time. Since an air purifier using this structure requires over 100 tubes, the failure rate was high. Ultimately, to ensure product quality, the PTFE insulation layer was replaced with a 0.2mm alumina ceramic tube.

[0003] However, the use of alumina ceramic tubes solves the problem of electrode life, but also creates the following problems:

[0004] 1) Ceramic tubes are brittle and can only withstand very small deformations. Large deformation, twisting, or large vibrations at both ends of the tube can easily cause the tube to break.

[0005] 2) Copper wire is generally used to connect carbon fiber and other conductors. However, since carbon fiber cannot be tinned, the carbon fiber and copper wire can only be connected by winding, resulting in a large contact area. Due to the difference in the characteristics of the two materials, the copper wire is easily oxidized to form verdigris under long-term power supply, which is prone to insulation short circuit problems without protection.

[0006] 3) Carbon fibers discharge on the surface of the insulation layer, but theoretically there are two separation points between the carbon fibers and the insulation layer. Normal product processing involves fixing one separation point on the surface of the insulation layer and leaving the other separation point outside the insulation layer as the circuit connection point. Regardless of the treatment method, the discharge characteristics of the two separation points will be different during discharge. If exposed to air, it is easy to cause a series of problems such as discharge disorder, oxidation of the treatment point, wire breakage, and insulation failure.

[0007] In order to solve the above problem, a potting process can be used. Specifically, after the spiral discharge electrodes are arranged into a suitable structure, glue is used to pot the two ends.

[0008] Considering the brittle nature of ceramic tubes, silicone potting glue and polyurethane potting glue can be used. However, in actual application, these two glues have poor adhesion to the ceramic and carbon fiber interface. Therefore, after a period of use, gaps will appear, and the internal parts are prone to ignition and failure. Epoxy potting glue has guaranteed adhesion, but conventional epoxy potting glue is relatively hard after curing. After curing, the two ends of the electrode lack buffering, and the product is prone to breakage in the drop test. Moreover, when the selected epoxy curing rate is not appropriate, the internal strain deformation during curing can cause individual ceramic tubes to twist and break. Therefore, the potting glue in the prior art has the defect of not being able to simultaneously improve the buffering performance and adhesion. Summary of the Invention

[0009] Therefore, the technical problem to be solved by the present invention is that the potting glue in the prior art cannot simultaneously improve the cushioning performance and adhesion, and thus provides an epoxy potting glue and its preparation method and application to solve the above problems.

[0010] An epoxy potting adhesive comprising a composition A and a composition B in a mass ratio of 100:(25-35);

[0011] The composition A comprises 55-60 parts by weight of epoxy resin, 10-15 parts by weight of diluent, 27-32 parts by weight of filler, and 0.5-1.5 parts by weight of coupling agent;

[0012] The composition B comprises a curing agent and an accelerator, wherein the weight proportion of the accelerator in the composition B is less than or equal to 2 wt %;

[0013] The epoxy resin comprises a nitrile rubber modified epoxy resin and a bisphenol A epoxy resin, and the mass ratio of the nitrile rubber modified epoxy resin to the bisphenol A epoxy resin is (3-6): (4-7).

[0014] Furthermore, the epoxy potting compound has a Shore hardness of 40-55, an elongation at break of more than 40%, and an electrical strength of more than 20 KV / mm.

[0015] Furthermore, the volume resistivity of the epoxy potting compound is greater than 10 12 Ω·m, surface drying time is greater than 5 hours;

[0016] And / or, the viscosity of formulation A is 4000-6000 mPa·s.

[0017] In an optional embodiment, the nitrile rubber-modified epoxy resin includes a glycidyl ether and a nitrile rubber adduct, preferably HyPox RM-20; in the present invention, as long as the nitrile-modified epoxy resin has a viscosity of about 5000 mPa·s, the purpose of the present invention can be achieved, for example, a carboxyl-terminated nitrile rubber-modified epoxy resin obtained by modifying a solid epoxy resin (EP) with a liquid carboxyl-terminated nitrile rubber (CTBN). The HyPox RM-20 listed in the present invention is a brand of CVC Thermosetting Special Materials Co., Ltd.

[0018] And / or, the bisphenol A epoxy resin includes epoxy resin E51.

[0019] The diluent is a diluent containing an alkyl chain and an ether bond, preferably an AGE diluent, which refers to a solution or reagent used in the field of biochemistry to treat and dilute AGE (Advanced Glycation End Products), such as aliphatic glycidyl ether (AGE);

[0020] And / or, the filler is one or more of wollastonite, nano-aluminum hydroxide, and titanium dioxide; the filler can also be composed of carbon black and heavy calcium carbonate.

[0021] And / or, the coupling agent is a silane coupling agent. Preferably, the coupling agent includes one or more of KH560, KH570, and KH550.

[0022] In an optional embodiment, the curing agent includes a polyetheramine curing agent and an alicyclic amine curing agent; both curing agents can cure epoxy at room temperature, but the curing speed is different. The reaction activity of the alicyclic amine curing agent is higher. Controlling the ratio of the two can control the operation time of the finished potting glue. Generally, the operation time is controlled at 90 minutes and the surface drying time is controlled at about 6 hours. Therefore, the ratio of the polyetheramine curing agent and the alicyclic amine curing agent can be adjusted according to the specific process time requirements.

[0023] And / or, the accelerator comprises dimethylbenzylamine.

[0024] Furthermore, the polyetheramine curing agent is polyetheramine D2000; the polyetheramine D2000 in the present invention can also be replaced by other polyetheramine products, such as the D230 series; since the D230 series polyetheramine curing agent has a small amount of soft segments, it is necessary to adjust the ratio of the polyetheramine curing agent to the alicyclic amine curing agent and the dosage ratio of the accelerator according to conventional adjustment methods before use. This adjustment is a conventional method and will not be repeated here.

[0025] And / or, the alicyclic amine curing agent is one or more of 1,3-BAC (1,3-diaminomethylcyclohexane), methylcyclohexanediamine, and 1,4-cyclohexanediamine.

[0026] Compared with 1,3-BAC, methylcyclohexanediamine introduces a methyl group, which reduces the rigidity of the ring and increases flexibility, but also reduces the activity. If the curing agent is adjusted with the same 90-min operating window time and 6-h surface drying time, the amount of methylcyclohexanediamine needs to be increased during curing, and the amount of accelerator needs to be increased. When polyetheramine 2000 and methylcyclohexanediamine are designed in proportion, the product hardness can be reduced to 45 and the elongation at break can reach more than 50%; but the cost of methylcyclohexanediamine is much higher than that of 1,3-BAC; although the structure of 1,4-cyclohexanediamine is similar to that of 1,3-BAC, the 1 and 4 positions affect the electron cloud structure, which will cause a slight decrease in activity. The output of this type of amine is small and the cost is slightly higher; therefore, considering all factors, 1,3-BAC is better.

[0027] A method for preparing an epoxy potting adhesive comprises adopting the above-mentioned epoxy potting adhesive ratio to prepare a composition A and a composition B respectively, and mixing the composition A and the composition B in a mass ratio of 100:(25-35). The ratio has little effect on the result.

[0028] Furthermore, the formulation A and formulation B are respectively prepared by mixing and vacuum degassing.

[0029] The present invention also includes the use of the epoxy potting adhesive in a spiral glow discharge electrode.

[0030] The technical solution of the present invention has the following advantages:

[0031] 1. The present invention provides an epoxy potting adhesive, which is obtained by configuring raw materials of specific types and proportions according to the performance requirements and application environment of the potting adhesive product. Specifically, the epoxy potting adhesive is developed with moderate curing time requirements, certain elasticity of the epoxy after curing, low hardness, good elongation at break and electrical strength, so that it can meet the requirements of improving buffering performance and adhesion under the complex working conditions of carbon fiber spiral glow discharge; in addition, two epoxy resins, nitrile rubber modified epoxy resin and bisphenol A epoxy resin, are compounded to achieve low viscosity and high elasticity. The compound application of the two can control the elasticity and curing deformation of the final product within a certain range, and has a certain guarantee for the electrical strength and the aging rate of the potting adhesive caused by glow discharge, thereby meeting the requirements of buffering performance and adhesion of the final product.

[0032] 2. The present invention provides an epoxy potting compound, wherein the diluent is a diluent containing an alkyl chain and an ether bond, preferably an AGE diluent. The molecular structure contains a large number of alkyl chains and ether bonds, resulting in excellent wettability and good flexibility in the cured product. Addition of this diluent can effectively improve the fluidity and permeability of the product, slow the curing reaction rate, and reduce the shrinkage of the cured product. Furthermore, the diluent in Formula A of the present invention is strictly controlled to 10-15 parts by weight. If the addition amount is too low, the potting compound has difficulty penetrating the carbon fibers, resulting in bubbles between the carbon fibers and affecting the product's lifespan. If the addition amount is too high, the resin's viscosity is too low, causing the added filler to settle. Therefore, strict control of the diluent content effectively ensures the product's service life.

[0033] 3. The epoxy potting compound provided by the present invention preferably uses wollastonite as a filler. Wollastonite is added primarily to improve the insulation performance of the product and reduce costs. Furthermore, the addition of wollastonite makes the product appear gray. Potting compounds used in electronic circuit products also help to keep the circuits and structures confidential. Conventional potting compounds are generally made black, using carbon black as a colorant. When added in small amounts, the insulation performance is generally not affected. However, in high-frequency AC environments, carbon black significantly affects the product's lifespan. Therefore, in this product, the filler is preferably wollastonite, an opaque filler that can reduce costs, improve insulation performance, and reduce the curing shrinkage of the epoxy, making the epoxy appear gray. DETAILED DESCRIPTION

[0034] The following examples are provided for a better understanding of the present invention and are not intended to limit the best mode of implementation. They do not limit the content and scope of protection of the present invention. Any product identical or similar to the present invention obtained by anyone under the guidance of the present invention or by combining the features of the present invention with other prior arts shall fall within the scope of protection of the present invention.

[0035] If no specific experimental steps or conditions are specified in the examples, the conventional experimental steps or conditions described in the literature in this field can be used. If the manufacturer of the reagents or instruments is not specified, they are all commercially available conventional reagents.

[0036] Example 1

[0037] A method for preparing an epoxy potting compound, comprising:

[0038] 1) Composition and preparation of Formulation A;

[0039] Composition A includes:

[0040] Epoxy resin: HyPox RM-20 29 parts, E51 29 parts,

[0041] Diluent: AGE 12 parts,

[0042] Filler: 29 parts of wollastonite,

[0043] Coupling agent: KH560 1 part;

[0044] Preparation of Formula A: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formula A.

[0045] 2) Composition and preparation of Formulation B;

[0046] Composition B includes:

[0047] Curing agent: D2000 65.3 parts, 1,3-BAC 32.7 parts;

[0048] Accelerator: 2 parts of dimethylbenzylamine.

[0049] Preparation of Formulation B: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formulation B.

[0050] 3) Preparation of epoxy potting compound:

[0051] Mix component A and component B in a mass ratio of 100:30.

[0052] The performance of the epoxy potting adhesive of this embodiment was tested, and the test results are shown in Table 1 below.

[0053] Table 1

[0054] project Test results Shore A hardness 50 Electric strength (MV / m) 22.1 Volume resistivity / (Ω·m) <![CDATA[1.5×10 13 ]]> Elongation at break / % 48 color grey .

[0055] Example 2

[0056] A method for preparing an epoxy potting compound, comprising:

[0057] 1) Composition and preparation of Formulation A;

[0058] Composition A includes:

[0059] Epoxy resin: HyPox RM-20 30 parts, E51 30 parts,

[0060] Diluent: AGE 10 parts,

[0061] Filler: 27 parts of wollastonite,

[0062] Coupling agent: KH560 0.5 parts;

[0063] Preparation of Formula A: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formula A.

[0064] 2) Composition and preparation of Formulation B;

[0065] Composition B includes:

[0066] Curing agent: D2000 65.8 parts, 1,3-BAC 33.2 parts;

[0067] Accelerator: 1 part dimethylbenzylamine.

[0068] Preparation of Formulation B: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formulation B.

[0069] 3) Preparation of epoxy potting compound:

[0070] Mix component A and component B in a mass ratio of 100:30.

[0071] The performance of the epoxy potting adhesive of this embodiment was tested, and the test results are shown in Table 2 below.

[0072] Table 2

[0073] project Test results Shore A hardness 48 Electric strength (MV / m) 22.3 Volume resistivity / (Ω·m) <![CDATA[1.6×10 13 ]]> Elongation at break / % 43 color grey .

[0074] Example 3

[0075] A method for preparing an epoxy potting compound, comprising:

[0076] 1) Composition and preparation of Formulation A;

[0077] Composition A includes:

[0078] Epoxy resin: HyPox RM-20 27.5 parts, E51 27.5 parts,

[0079] Diluent: AGE 15 parts,

[0080] Filler: 32 parts of wollastonite,

[0081] Coupling agent: KH560 1.5 parts;

[0082] Preparation of Formula A: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formula A.

[0083] 2) Composition and preparation of Formulation B;

[0084] Composition B includes:

[0085] Curing agent: D2000 65.3 parts, 1,3-BAC 32.7 parts;

[0086] Accelerator: 2 parts of dimethylbenzylamine.

[0087] Preparation of Formulation B: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formulation B.

[0088] 3) Preparation of epoxy potting compound:

[0089] Mix component A and component B in a mass ratio of 100:30.

[0090] The performance of the epoxy potting adhesive of this embodiment was tested, and the test results are shown in Table 3 below.

[0091] Table 3

[0092] project Test results Shore A hardness 53 Electric strength (MV / m) 20.5 Volume resistivity / (Ω·m) <![CDATA[1.6×10 13 ]]> Elongation at break / % 42 color grey

[0093] Example 4

[0094] A method for preparing an epoxy potting compound, comprising:

[0095] 1) Composition and preparation of Formulation A;

[0096] Composition A includes:

[0097] Epoxy resin: HyPox RM-20 34.8 parts, E51 23.2 parts,

[0098] Diluent: AGE 12 parts,

[0099] Filler: 29 parts of wollastonite,

[0100] Coupling agent: KH560 1 part;

[0101] Preparation of Formula A: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formula A.

[0102] 2) Composition and preparation of Formulation B;

[0103] Composition B includes:

[0104] Curing agent: D2000 65.3 parts, 1,3-BAC 32.7 parts;

[0105] Accelerator: 2 parts of dimethylbenzylamine.

[0106] Preparation of Formulation B: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formulation B.

[0107] 3) Preparation of epoxy potting compound:

[0108] Mix component A and component B in a mass ratio of 100:30.

[0109] The performance of the epoxy potting adhesive of this embodiment was tested, and the test results are shown in Table 4 below.

[0110] Table 4

[0111] project Test results Shore A hardness 48 Electric strength (MV / m) 23.5 Volume resistivity / (Ω·m) <![CDATA[2.2×10 14 ]]> Elongation at break / % 52 color grey .

[0112] Example 5

[0113] A method for preparing an epoxy potting compound, comprising:

[0114] 1) Composition and preparation of Formulation A;

[0115] Composition A includes:

[0116] Epoxy resin: HyPox RM-20 20 parts, E51 40 parts,

[0117] Diluent: AGE 12 parts,

[0118] Filler: 29 parts of wollastonite,

[0119] Coupling agent: KH560 1 part;

[0120] Preparation of Formula A: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formula A.

[0121] 2) Composition and preparation of Formulation B;

[0122] Composition B includes:

[0123] Curing agent: D2000 65.3 parts, 1,3-BAC 32.7 parts;

[0124] Accelerator: 2 parts of dimethylbenzylamine.

[0125] Preparation of Formulation B: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formulation B.

[0126] 3) Preparation of epoxy potting compound:

[0127] Mix component A and component B in a mass ratio of 100:30.

[0128] The performance of the epoxy potting adhesive of this embodiment was tested, and the test results are shown in Table 5 below.

[0129] Table 5

[0130] project Test results Shore A hardness 55 Electric strength (MV / m) 22.5 Volume resistivity / (Ω·m) <![CDATA[2.2×10 14 ]]> Elongation at break / % 41 color grey .

[0131] Example 6

[0132] A method for preparing an epoxy potting compound, comprising:

[0133] 1) Composition and preparation of Formulation A;

[0134] Composition A includes:

[0135] Epoxy resin: 29 parts of carboxyl-terminated nitrile rubber modified epoxy resin, 29 parts of E51,

[0136] Diluent: AGE 12 parts,

[0137] Filler: 29 parts of wollastonite,

[0138] Coupling agent: KH560 1 part;

[0139] Preparation of Formula A: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formula A.

[0140] 2) Composition and preparation of Formulation B;

[0141] Composition B includes:

[0142] Curing agent: D2000 65.3 parts, methylcyclohexanediamine 32.7 parts;

[0143] Accelerator: 2 parts of dimethylbenzylamine.

[0144] Preparation of Formulation B: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formulation B.

[0145] 3) Preparation of epoxy potting compound:

[0146] Mix component A and component B in a mass ratio of 100:30.

[0147] The performance of the epoxy potting adhesive of this embodiment was tested, and the test results are shown in Table 6 below.

[0148] Table 6

[0149]

[0150]

[0151] Example 7

[0152] A method for preparing an epoxy potting compound, comprising:

[0153] 1) Composition and preparation of Formulation A;

[0154] Composition A includes:

[0155] Epoxy resin: HyPox RM-20 29 parts, E51 29 parts,

[0156] Diluent: AGE 12 parts,

[0157] Filler: 28 parts of aluminum hydroxide (above 20000 mesh), 1 part of titanium dioxide, ball milled and dispersed;

[0158] Coupling agent: KH570 1 part;

[0159] Preparation of Formula A: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formula A.

[0160] 2) Composition and preparation of Formulation B;

[0161] Composition B includes:

[0162] Curing agent: D2000 65.3 parts, 1,4-cyclohexanediamine 32.7 parts;

[0163] Accelerator: 2 parts of dimethylbenzylamine.

[0164] Preparation of Formulation B: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formulation B.

[0165] 3) Preparation of epoxy potting compound:

[0166] Mix component A and component B in a mass ratio of 100:30.

[0167] The performance of the epoxy potting adhesive of this embodiment was tested, and the test results are shown in Table 7 below.

[0168] Table 7

[0169] project Test results Shore A hardness 49 Electric strength (MV / m) 23.1 Volume resistivity / (Ω·m) <![CDATA[2.5×10 14 ]]> Elongation at break / % 45 color White .

[0170] Example 8

[0171] A method for preparing an epoxy potting compound, comprising:

[0172] 1) Composition and preparation of Formulation A;

[0173] Composition A includes:

[0174] Epoxy resin: HyPox RM-20 29 parts, E51 29 parts,

[0175] Diluent: AGE 12 parts,

[0176] Filler: 27 parts of heavy calcium carbonate, 2 parts of carbon black;

[0177] Coupling agent: KH560 1 part;

[0178] Preparation of Formula A: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formula A.

[0179] 2) Composition and preparation of Formulation B;

[0180] Composition B includes:

[0181] Curing agent: D2000 65.3 parts, 1,3-BAC 32.7 parts;

[0182] Accelerator: 2 parts of dimethylbenzylamine.

[0183] Preparation of Formulation B: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formulation B.

[0184] 3) Preparation of epoxy potting compound:

[0185] Mix component A and component B in a mass ratio of 100:30.

[0186] The performance of the epoxy potting adhesive of this embodiment was tested, and the test results are shown in Table 8 below.

[0187] Table 8

[0188] project Test results Shore A hardness 50 Electric strength (MV / m) 19.7 Volume resistivity / (Ω·m) <![CDATA[1.3×10 12 ]]> Elongation at break / % 55 color black

[0189] Note: The mechanical properties are enhanced, but when testing the electrical strength, the discharge time is significantly advanced.

[0190] Example 9

[0191] A method for preparing an epoxy potting compound, comprising:

[0192] 1) Composition and preparation of Formulation A;

[0193] Composition A includes:

[0194] Epoxy resin: HyPox RM-20 29 parts, E51 29 parts,

[0195] Diluent: AGE 12 parts,

[0196] Filler: 29 parts of wollastonite,

[0197] Coupling agent: KH560 1 part;

[0198] Preparation of Formula A: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formula A.

[0199] 2) Composition and preparation of Formulation B;

[0200] Composition B includes:

[0201] Curing agent: D2000 65.3 parts, T403 32.7 parts;

[0202] Accelerator: 2 parts of dimethylbenzylamine.

[0203] Preparation of Formulation B: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formulation B.

[0204] 3) Preparation of epoxy potting compound:

[0205] Mix component A and component B in a mass ratio of 100:30.

[0206] The performance of the epoxy potting adhesive of this embodiment was tested, and the test results are shown in Table 9 below.

[0207] Table 9

[0208] project Test results Shore A hardness 42 Electric strength (MV / m) 21.5 Volume resistivity / (Ω·m) <![CDATA[1.5×10 14 ]]> Elongation at break / % 55 color grey .

[0209] Comparative Example 1

[0210] A method for preparing an epoxy potting compound, comprising:

[0211] 1) Composition and preparation of Formulation A;

[0212] Composition A includes:

[0213] Epoxy resin: HyPox RM-20 26 parts, E51 26 parts,

[0214] Diluent: AGE 18 parts,

[0215] Filler: 29 parts of wollastonite,

[0216] Coupling agent: KH560 1 part;

[0217] Preparation of Formula A: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formula A.

[0218] 2) Composition and preparation of Formulation B;

[0219] Composition B includes:

[0220] Curing agent: D2000 65.3 parts, 1,3-BAC 32.7 parts;

[0221] Accelerator: 2 parts of dimethylbenzylamine.

[0222] Preparation of Formulation B: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formulation B.

[0223] 3) Preparation of epoxy potting compound:

[0224] Mix component A and component B in a mass ratio of 100:30.

[0225] The performance of the epoxy potting adhesive of this embodiment was tested, and the test results are shown in Table 10 below.

[0226] Table 10

[0227] project Test results Shore A hardness 60 Electric strength (MV / m) 20.1 Volume resistivity / (Ω·m) <![CDATA[1.1×10 12 ]]> Elongation at break / % 38 color grey .

[0228] Comparative Example 2

[0229] A method for preparing an epoxy potting compound, comprising:

[0230] 1) Composition and preparation of Formulation A;

[0231] Composition A includes:

[0232] Epoxy resin: HyPox RM-20 32 parts, E51 32 parts,

[0233] Diluent: AGE 6 parts,

[0234] Filler: 29 parts of wollastonite,

[0235] Coupling agent: KH560 1 part;

[0236] Preparation of Formula A: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formula A.

[0237] 2) Composition and preparation of Formulation B;

[0238] Composition B includes:

[0239] Curing agent: D2000 65.3 parts, 1,3-BAC 32.7 parts;

[0240] Accelerator: 2 parts of dimethylbenzylamine.

[0241] Preparation of Formulation B: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formulation B.

[0242] 3) Preparation of epoxy potting compound:

[0243] Mix component A and component B in a mass ratio of 100:30.

[0244] The performance of the epoxy potting adhesive of this embodiment was tested, and the test results are shown in Table 11 below.

[0245] Table 11

[0246]

[0247]

[0248] Note: If the amount of diluent added is too small, the viscosity of component A is high, it is difficult to ensure the dispersion of wollastonite after adding filler, vacuum degassing is also difficult, the amount of bubbles in the forcedly prepared product is also large, and the electrical strength test does not meet the standard.

[0249] Comparative Example 3

[0250] A method for preparing an epoxy potting compound, comprising:

[0251] 1) Composition and preparation of Formulation A;

[0252] Composition A includes:

[0253] Epoxy resin: HyPox RM-20 58 parts,

[0254] Diluent: AGE 12 parts,

[0255] Filler: 29 parts of wollastonite,

[0256] Coupling agent: KH560 1 part;

[0257] Preparation of Formula A: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formula A.

[0258] 2) Composition and preparation of Formulation B;

[0259] Composition B includes:

[0260] Curing agent: D2000 65.3 parts, 1,3-BAC 32.7 parts;

[0261] Accelerator: 2 parts of dimethylbenzylamine.

[0262] Preparation of Formulation B: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formulation B.

[0263] 3) Preparation of epoxy potting compound:

[0264] Mix component A and component B in a mass ratio of 100:30.

[0265] The performance of the epoxy potting adhesive of this embodiment was tested, and the test results are shown in Table 12 below.

[0266] Table 12

[0267] project Test results Shore A hardness 35 Electric strength (MV / m) 18.5 Volume resistivity / (Ω·m) <![CDATA[1.5×10 14 ]]> Elongation at break / % 65 color grey .

[0268] Comparative Example 4

[0269] A method for preparing an epoxy potting compound, comprising:

[0270] 1) Composition and preparation of Formulation A;

[0271] Composition A includes:

[0272] Epoxy resin: E51 58 parts,

[0273] Diluent: AGE 12 parts,

[0274] Filler: 29 parts of wollastonite,

[0275] Coupling agent: KH560 1 part;

[0276] Preparation of Formula A: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formula A.

[0277] 2) Composition and preparation of Formulation B;

[0278] Composition B includes:

[0279] Curing agent: D2000 65.3 parts, 1,3-BAC 32.7 parts;

[0280] Accelerator: 2 parts of dimethylbenzylamine.

[0281] Preparation of Formulation B: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formulation B.

[0282] 3) Preparation of epoxy potting compound:

[0283] Mix component A and component B in a mass ratio of 100:30.

[0284] The performance of the epoxy potting adhesive of this embodiment was tested, and the test results are shown in Table 13 below.

[0285] Table 13

[0286] project Test results Shore A hardness 65 Electric strength (MV / m) 24.5 Volume resistivity / (Ω·m) <![CDATA[1.9×10 14 ]]> Elongation at break / % 15 color grey .

[0287] Comparative Example 5

[0288] A method for preparing an epoxy potting compound, comprising:

[0289] 1) Composition and preparation of Formulation A;

[0290] Composition A includes:

[0291] Epoxy resin: E44 29 parts, E51 29 parts,

[0292] Diluent: AGE 12 parts,

[0293] Filler: 29 parts of wollastonite,

[0294] Coupling agent: KH560 1 part;

[0295] Preparation of Formula A: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formula A.

[0296] 2) Composition and preparation of Formulation B;

[0297] Composition B includes:

[0298] Curing agent: D2000 65.3 parts, 1,3-BAC 32.7 parts;

[0299] Accelerator: 2 parts of dimethylbenzylamine.

[0300] Preparation of Formulation B: Mix and stir the above ingredients at room temperature, and vacuum degas to obtain Formulation B.

[0301] 3) Preparation of epoxy potting compound:

[0302] Mix component A and component B in a mass ratio of 100:30.

[0303] The performance of the epoxy potting adhesive of this embodiment was tested, and the test results are shown in Table 14 below.

[0304] Table 14

[0305] project Test results Shore A hardness 68 Electric strength (MV / m) 24.3 Volume resistivity / (Ω·m) <![CDATA[1.9×10 14 <!-- 12 -->]]> Elongation at break / % 17 color grey .

[0306] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will readily appreciate that other variations or modifications based on the above descriptions are possible. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. An epoxy potting compound, characterized in that: Comprising a formulation A and a formulation B with a mass ratio of 100:(25-35); The composition A comprises 55-60 parts by weight of epoxy resin, 10-15 parts by weight of diluent, 27-32 parts by weight of filler, and 0.5-1.5 parts by weight of coupling agent; The composition B comprises a curing agent and an accelerator, wherein the weight proportion of the accelerator in the composition B is less than or equal to 2 wt %; The epoxy resin comprises a nitrile rubber modified epoxy resin and a bisphenol A epoxy resin, and the mass ratio of the nitrile rubber modified epoxy resin to the bisphenol A epoxy resin is (3-6): (4-7).

2. The epoxy potting compound according to claim 1, wherein: The epoxy potting glue has a Shore hardness of 40-55, an elongation at break of more than 40%, and an electrical strength of more than 20 KV / mm.

3. The epoxy potting compound according to claim 1 or 2, characterized in that: The volume resistivity of the epoxy potting compound is greater than 10 12 Ω·m, surface drying time is greater than 5 hours; And / or, the viscosity of formulation A is 4000-6000 mPa·s.

4. The epoxy potting adhesive according to any one of claims 1 to 3, characterized in that: The nitrile rubber modified epoxy resin comprises a glycidyl ether and nitrile rubber adduct, preferably HyPox RM-20; And / or, the bisphenol A epoxy resin includes epoxy resin E51.

5. The epoxy potting adhesive according to any one of claims 1 to 4, characterized in that: The diluent is a diluent containing an alkyl chain and an ether bond, preferably an AGE diluent; And / or, the filler is one or more of wollastonite, nano-aluminum hydroxide, and titanium dioxide; And / or, the coupling agent is a silane coupling agent. Preferably, the coupling agent includes one or more of KH560, KH570, and KH550.

6. The epoxy potting adhesive according to any one of claims 1 to 5, characterized in that: The curing agent includes polyetheramine curing agent and alicyclic amine curing agent; And / or, the accelerator includes one or more of dimethylbenzylamine and dimethylimidazole.

7. The epoxy potting compound according to claim 6, wherein: The polyetheramine curing agent is polyetheramine D2000; And / or, the alicyclic amine curing agent is one or more of 1,3-diaminomethylcyclohexane, methylcyclohexanediamine, and 1,4-cyclohexanediamine.

8. A method for preparing epoxy potting adhesive, characterized in that: The epoxy potting adhesive according to any one of claims 1 to 7 is used to prepare component A and component B respectively, and the component A and component B are mixed in a mass ratio of 100:(25-35) to obtain the epoxy potting adhesive.

9. The preparation method according to claim 8, characterized in that The formulation A and formulation B are respectively prepared by mixing and vacuum degassing.

10. Use of the epoxy potting compound according to any one of claims 1 to 7 in a spiral glow discharge electrode.

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