High-toughness corrosion-resistant aluminum alloy profile and preparation process thereof

Abstract

The invention relates to the technical field of aluminum alloys, and discloses a high-toughness corrosion-resistant aluminum alloy profile and a preparation process thereof. The preparation method comprises the following steps that S1, an aluminum alloy base material is taken and subjected to anodic oxidation treatment and chambering treatment, and a pretreated aluminum alloy is obtained; s2, the pretreated aluminum alloy is taken and subjected to physical sputtering and plasma cladding treatment, and an aluminum alloy profile is obtained; the composite ceramic powder is prepared from the following raw materials in parts by mass: 25 to 35 parts of nickel-plated SiC, 20 to 30 parts of Cr2O3 and 10 to 20 parts of Al2O3; the preparation method of nickel-plated SiC comprises the following steps: coarsening, activating and reducing SiC, and then plating nickel on the surface; the nickel plating solution comprises 20-30 g / L of nickel sulfate, 40-60 mL / L of lactic acid and the balance of water; according to the nickel plating process, the pH value is 4.5-5.0, the nickel plating temperature is 60-70 DEG C, and the time is 15-20 min.

Description

Technical Field

[0001] The invention relates to the technical field of aluminum alloys and discloses a high-toughness, corrosion-resistant aluminum alloy profile and a preparation process thereof. Background Art

[0002] Aluminum alloys are currently the second most widely used metal material after steel. They offer numerous advantages, such as low density, excellent electrical conductivity, and good processability, making them widely used in aerospace, automotive, and electronic communications. However, with the advancement of industrial technology, the performance requirements for metal materials are becoming increasingly stringent. The toughness and corrosion resistance of conventional aluminum alloys are no longer sufficient for these increasingly demanding applications, limiting their application.

[0003] Aluminum alloy profiles are often surface-treated using thermal spraying to deposit ceramic particles on the metal surface to create a reinforced coating to enhance performance. However, this coating suffers from issues such as low bonding strength, high porosity, and ceramic particle segregation, resulting in minimal performance gains. Therefore, research into a highly tough and corrosion-resistant aluminum alloy profile and its preparation process is of great significance. Summary of the Invention

[0004] The object of the present invention is to provide a high-toughness, corrosion-resistant aluminum alloy profile and a preparation process thereof, so as to solve the problems raised in the above-mentioned background technology.

[0005] In order to solve the above technical problems, the present invention provides the following technical solution: a preparation process of a high-toughness, corrosion-resistant aluminum alloy profile, comprising the following steps:

[0006] S1: melting raw materials to obtain an ingot; preheating and then performing extrusion treatment and heat treatment to obtain an aluminum alloy substrate; taking the aluminum alloy substrate, performing anodizing treatment and pore expansion treatment to obtain a pretreated aluminum alloy;

[0007] S2: taking the pretreated aluminum alloy and performing physical sputtering to obtain an aluminum alloy having a molybdenum sulfide-chromium-aluminum-silicon layer on the surface;

[0008] S3: performing plasma cladding treatment to obtain an aluminum alloy profile with a ceramic layer on the surface;

[0009] Plasma cladding treatment uses composite ceramic powder, which is a combination of nickel-plated SiC, Cr2O3, and Al2O3.

[0010] More optimally, composite ceramic powder is used in plasma cladding treatment; the process is synchronous powder feeding, the ion gas flow rate is 2-3 L / min, the argon flow rate is 6-7 L / min, the transfer arc voltage is 30-35 V, the transfer current is 90-100 A, the spray distance is 12-18 mm, the power is 1.5-2 kW, the scanning speed is 4-7 mm / s, and the plasma arc spot diameter is 2.5-3.0 mm.

[0011] More optimally, the particle size of the nano-ceramic powder is 30 to 50 nm.

[0012] More optimally, the composite ceramic powder includes the following raw materials, calculated by mass: 25 to 35 parts of nickel-plated SiC, 20 to 30 parts of Cr2O3, and 10 to 20 parts of Al2O3.

[0013] More optimally, the thickness of the ceramic layer is 1.5 to 3 mm.

[0014] More optimally, the preparation of the nickel-plated SiC includes the following steps: immersing SiC in a 20% by volume hydrofluoric acid aqueous solution, roughening for 20 to 30 minutes, washing with water, and drying to obtain roughened SiC; immersing the roughened SiC in a 0.8% potassium borohydride solution for 2 to 4 hours, washing with water, and drying to obtain activated SiC; immersing the activated SiC in a 40 g / L NaH2PO2·H2O aqueous solution, reducing for 30 to 40 minutes, washing with water, and drying to obtain reduced SiC; and performing surface nickel plating on the reduced SiC; the nickel plating solution includes the following raw materials: 20 to 30 g / L nickel sulfate, 40 to 60 mL / L lactic acid, and the remainder water; the nickel plating process is: pH value 4.5 to 5.0, nickel plating temperature 60 to 70°C, and time 15 to 20 minutes.

[0015] More optimally, the specific steps of the anodizing treatment and pore expansion treatment are: anodizing treatment: the anode is an aluminum alloy substrate, the cathode is an inert metal platinum; the electrolyte is an aqueous solution of 0.5-1wt% phosphoric acid and 0.005-0.008M aluminum oxalate; the temperature is 20-25°C; the oxidation voltage is 170-180V; the treatment time is 3-6min; pore expansion treatment: 3-6wt% phosphoric acid is used for treatment for 30-60min.

[0016] More optimally, the specific steps of physical sputtering are: use a vacuum pump to evacuate to 5×10 -2Pa, introduce inert gas argon, start the pulse bias power supply, and perform surface cleaning: the voltage is set to 700V~800V, the duty cycle is 40%~50%, the frequency is 20KHz~30KHz, and the time is 5~6min; after surface cleaning, set the voltage to 400~500V, the duty cycle is 20~30%, the frequency is 10~20KHz, the gas pressure is 0.6~1Pa, turn on the chromium silicon aluminum target and the molybdenum sulfide target, and deposit at 70~80A for 6~10min.

[0017] More optimally, in the chromium-silicon-aluminum target, the silicon content is 4-8 wt%, the aluminum content is 20-30 wt%, and the balance is chromium.

[0018] More optimally, the aluminum alloy substrate includes the following components, in percentage by mass: Si: 2-4%, Zn: 1-2%, Mn: 0.1-0.3%, Fe: 0.1-0.3%, Cr: 0.05-0.15%, Ti: 0.02-0.1%, Cu: 1-2%, Mg: 1.2-1.8%, and the balance is Al and unavoidable impurities.

[0019] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: first, anodizing and pore expansion treatments are performed to form an ordered nanopore structure on the surface of the substrate, thereby improving the bonding strength between the next physical sputtering layer and the substrate; physical sputtering treatment can produce high-purity, dense films, which are often used in intermediate transition layers to improve bonding strength. This solution adopts chromium-silicon-aluminum targets and molybdenum sulfide targets. The addition of chromium and silicon can improve the impact resistance and corrosion resistance of the metal substrate surface. Molybdenum sulfide can further improve the mechanical properties and corrosion resistance of the surface layer on the one hand, and can be used as lubricating particles on the other hand to reduce the problem of coating quality degradation caused by the difference in properties between metal and silicon; after physical sputtering, the inner pores are There are inevitably gaps between the walls, which cannot be completely filled. Therefore, this scheme performs plasma cladding treatment in the next step. Plasma cladding treatment uses a composition of nickel-plated SiC, Cr2O3, and Al2O3. After the SiC surface is nickel-plated, during the plasma cladding process, the molten nickel is coated on the outside, which improves the bonding strength with other metal oxide powders to ensure that the impact resistance and tensile strength are improved. At the same time, the molten metal during laser cladding can fill the pores in the physical sputtering layer and improve the bonding strength of other raw materials in the plasma cladding layer, thereby improving the overall density and surface quality, and finally producing a high-toughness, high-corrosion-resistant aluminum alloy profile. DETAILED DESCRIPTION

[0020] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0021] It should be noted that the raw materials involved in the present invention are purchased from any manufacturer without any special restrictions, and illustratively include: aluminum oxalate (Shanghai Jiachen Chemical Co., Ltd.); lactic acid (CAS: 79-33-4); SiC, Cr2O3, Al2O3 (particle size of 30-50 nm, Kramar);

[0022] Unless otherwise specified, the following are parts by mass and mass ratios;

[0023] Anodizing electrolyte: an aqueous solution of 0.75 wt% phosphoric acid and 0.0065 M aluminum oxalate;

[0024] The aluminum alloy substrate comprises the following components, calculated by mass percentage: Si: 4%, Zn: 1%, Mn: 0.15%, Fe: 0.25%, Cr: 0.05%, Ti: 0.05%, Cu: 1%, Mg: 1.5%, and the balance being Al and unavoidable impurities;

[0025] Example 1: S1: An aluminum alloy substrate was subjected to an anodic oxidation treatment using the aluminum alloy substrate as an anode and platinum as a cathode at a treatment temperature of 24° C., an oxidation voltage of 175 V, and an anodic oxidation time of 4 min; and then a pore expansion treatment was performed using 5 wt % phosphoric acid for 40 min to obtain a pretreated aluminum alloy.

[0026] S2: Take the pre-treated aluminum alloy and use a vacuum pump to evacuate to 5×10 -2 Pa, argon gas was introduced, and the pulse bias power supply was started, with the voltage set to 800V, the duty cycle to 40%, the frequency to 20KHz, and the surface cleaning for 5 minutes; the pulse bias amplitude was reduced to 400V, the duty cycle to 20%, the frequency to 10KHz, and the gas pressure to 0.8Pa, and the chromium silicon aluminum target and the molybdenum sulfide target were turned on, and deposition was carried out at 70A for 8 minutes to obtain a physically sputtered aluminum alloy with a molybdenum sulfide-chromium-aluminum-silicon layer on the surface; the silicon content in the chromium silicon aluminum target was 6wt%, the aluminum content was 25wt%, and the balance was chromium;

[0027] S3: immersing SiC in a 20% by volume aqueous solution of hydrofluoric acid for 30 minutes to roughen it, washing it with water, and drying it to obtain roughened SiC; immersing the roughened SiC in a 0.8% aqueous solution of potassium borohydride for activation for 2 hours, washing it with water, and drying it to obtain activated SiC; immersing the activated SiC in a 40 g / L aqueous solution of NaH2PO2·H2O for reduction for 30 minutes, washing it with water, and drying it to obtain reduced SiC; performing surface nickel plating on the reduced SiC, washing it with water, and drying it to obtain nickel-plated SiC; the nickel plating solution used comprises: 30 g / L nickel sulfate, 50 mL / L lactic acid, and a pH of 4.5; the nickel plating temperature is 60°C, and the time is 16 minutes;

[0028] S4: Plasma cladding treatment is performed on the physically sputtered aluminum alloy to obtain a high-toughness, corrosion-resistant aluminum alloy profile with a ceramic layer on the surface; composite ceramic powder is used for plasma cladding treatment; the composite ceramic powder includes: 30 parts of nickel-plated SiC, 25 parts of Cr2O3, and 12 parts of Al2O3; the process is synchronous powder feeding, the ion gas flow rate is 2L / min, the argon flow rate is 7L / min, the transfer arc voltage is 30V, the transfer current is 90A, the spray distance is 15mm, the power is 1.5kW, the scanning speed is 5mm / s, the plasma arc spot diameter is 2.5mm, and the plasma cladding layer thickness is 1.5mm.

[0029] Example 2: S1: An aluminum alloy substrate was subjected to an anodic oxidation treatment using the aluminum alloy substrate as an anode and platinum as a cathode at a treatment temperature of 24° C., an oxidation voltage of 175 V, and an anodic oxidation time of 4 min; followed by a pore expansion treatment using 5 wt % phosphoric acid for 40 min to obtain a pretreated aluminum alloy;

[0030] S2: Take the pre-treated aluminum alloy and use a vacuum pump to evacuate to 5×10 -2 Pa, argon gas was introduced, and the pulse bias power supply was started, with the voltage set to 800V, the duty cycle to 40%, the frequency to 20KHz, and the surface cleaning for 5 minutes; the pulse bias amplitude was reduced to 400V, the duty cycle to 20%, the frequency to 10KHz, the working pressure to 0.8Pa, and the chromium silicon aluminum target and the molybdenum sulfide target were turned on, and deposition was carried out at 70A for 8 minutes to obtain a physically sputtered aluminum alloy with a molybdenum sulfide-chromium-aluminum-silicon layer on the surface; the silicon content in the chromium silicon aluminum target was 8wt%, the aluminum content was 30wt%, and the balance was chromium;

[0031] S3: immersing SiC in a 20% by volume aqueous solution of hydrofluoric acid for 30 minutes, washing with water, and drying to obtain roughened SiC; immersing the roughened SiC in a 0.8% aqueous solution of potassium borohydride for 2 hours, washing with water, and drying to obtain activated SiC; immersing the activated SiC in a 40 g / L aqueous solution of NaH2PO2·H2O for 30 minutes, washing with water, and drying to obtain reduced SiC; performing surface nickel plating on the reduced SiC, washing with water, and drying to obtain nickel-plated SiC; the nickel plating solution used comprises: 30 g / L nickel sulfate, 50 mL / L lactic acid, and a pH of 5.0; the nickel plating temperature is 70°C, and the time is 15 minutes;

[0032] S4: Plasma cladding treatment is performed on the physically sputtered aluminum alloy to obtain a high-toughness, corrosion-resistant aluminum alloy profile with a ceramic layer on the surface; composite ceramic powder is used for plasma cladding treatment; the composite ceramic powder includes: 35 parts of nickel-plated SiC, 20 parts of Cr2O3, and 15 parts of Al2O3; the process is synchronous powder feeding, the ion gas flow rate is 2L / min, the argon flow rate is 7L / min, the transfer arc voltage is 30V, the transfer current is 90A, the spray distance is 15mm, the power is 1.5kW, the scanning speed is 5mm / s, the plasma arc spot diameter is 2.5mm, and the plasma cladding layer thickness is 1.5mm.

[0033] Example 3: S1: An aluminum alloy substrate was subjected to an anodic oxidation treatment using the aluminum alloy substrate as an anode and platinum as a cathode at a treatment temperature of 24° C., an oxidation voltage of 175 V, and an anodic oxidation time of 4 min; followed by a pore expansion treatment using 5 wt % phosphoric acid for 40 min to obtain a pretreated aluminum alloy;

[0034] S2: Take the pre-treated aluminum alloy and use a vacuum pump to evacuate to 5×10 -2 Pa, argon gas was introduced, and the pulse bias power supply was started, with the voltage set to 800V, the duty cycle to 40%, the frequency to 20KHz, and the surface cleaning for 5 minutes; the pulse bias amplitude was reduced to 400V, the duty cycle to 20%, the frequency to 10KHz, and the gas pressure to 0.8Pa, and the chromium silicon aluminum target and the molybdenum sulfide target were turned on, and deposition was carried out at 70A for 8 minutes to obtain a physically sputtered aluminum alloy with a molybdenum sulfide-chromium-aluminum-silicon layer on the surface; the silicon content in the chromium silicon aluminum target was 6wt%, the aluminum content was 25wt%, and the balance was chromium;

[0035] S3: immersing SiC in a 20% by volume aqueous solution of hydrofluoric acid for 30 minutes to roughen it, washing it with water, and drying it to obtain roughened SiC; immersing the roughened SiC in a 0.8% aqueous solution of potassium borohydride for activation for 2 hours, washing it with water, and drying it to obtain activated SiC; immersing the activated SiC in a 40 g / L aqueous solution of NaH2PO2·H2O for reduction for 30 minutes, washing it with water, and drying it to obtain reduced SiC; performing surface nickel plating on the reduced SiC, washing it with water, and drying it to obtain nickel-plated SiC; the nickel plating solution used comprises: 30 g / L nickel sulfate, 50 mL / L lactic acid, and a pH of 4.5; the nickel plating temperature is 60°C, and the time is 16 minutes;

[0036] S4: Plasma cladding treatment is performed on the physically sputtered aluminum alloy to obtain a high-toughness, corrosion-resistant aluminum alloy profile with a ceramic layer on the surface; composite ceramic powder is used for plasma cladding treatment; the composite ceramic powder includes: 35 parts of nickel-plated SiC, 20 parts of Cr2O3, and 15 parts of Al2O3; the process is synchronous powder feeding, the ion gas flow rate is 2L / min, the argon flow rate is 7L / min, the transfer arc voltage is 30V, the transfer current is 90A, the spray distance is 15mm, the power is 1.5kW, the scanning speed is 5mm / s, the plasma arc spot diameter is 2.5mm, and the plasma cladding layer thickness is 1.5mm.

[0037] Comparative Example 1 (nickel-plated SiC was replaced with SiC, and the remaining steps were the same as those in Example 1): S1: An aluminum alloy substrate was subjected to an anodic oxidation treatment with the aluminum alloy substrate as an anode and platinum as a cathode at a treatment temperature of 24° C., an oxidation voltage of 175 V, and an anodic oxidation time of 4 min; followed by a pore expansion treatment using 5 wt % phosphoric acid for 40 min to obtain a pretreated aluminum alloy;

[0038] S2: Take the pre-treated aluminum alloy and use a vacuum pump to evacuate to 5×10 -2 Pa, argon gas was introduced, and the pulse bias power supply was started, with the voltage set to 800V, the duty cycle to 40%, the frequency to 20KHz, and the surface cleaning for 5 minutes; the pulse bias amplitude was reduced to 400V, the duty cycle to 20%, the frequency to 10KHz, and the gas pressure to 0.8Pa, and the chromium silicon aluminum target and the molybdenum sulfide target were turned on, and deposition was carried out at 70A for 8 minutes to obtain a physically sputtered aluminum alloy with a molybdenum sulfide-chromium-aluminum-silicon layer on the surface; the silicon content in the chromium silicon aluminum target was 6wt%, the aluminum content was 25wt%, and the balance was chromium;

[0039] S3: Plasma cladding treatment is performed on the physically sputtered aluminum alloy to obtain a high-toughness, corrosion-resistant aluminum alloy profile with a ceramic layer on the surface; composite ceramic powder is used for plasma cladding treatment; the composite ceramic powder includes: 30 parts SiC, 25 parts Cr2O3, and 12 parts Al2O3; the process is synchronous powder feeding, the ion gas flow rate is 2L / min, the argon flow rate is 7L / min, the transfer arc voltage is 30V, the transfer current is 90A, the spray distance is 15mm, the power is 1.5kW, the scanning speed is 5mm / s, the plasma arc spot diameter is 2.5mm, and the plasma cladding layer thickness is 1.5mm.

[0040] Comparative Example 2 (plasma cladding treatment was directly performed on the pretreated aluminum alloy, and the remaining steps were consistent with those of Example 1): S1: An aluminum alloy substrate was taken and anodized with the aluminum alloy substrate as the anode and platinum as the cathode at a treatment temperature of 24° C., an oxidation voltage of 175 V, and an anodization time of 4 min; then, a pore expansion treatment was performed using 5 wt % phosphoric acid for 40 min to obtain a pretreated aluminum alloy;

[0041] S2: Roughening SiC by immersing it in a 20% by volume aqueous solution of hydrofluoric acid for 30 minutes, washing it with water, and drying it to obtain roughened SiC; activating the roughened SiC by immersing it in a 0.8% aqueous solution of potassium borohydride for 2 hours, washing it with water, and drying it to obtain activated SiC; reducing the activated SiC by immersing it in a 40 g / L aqueous solution of NaH2PO2·H2O for 30 minutes, washing it with water, and drying it to obtain reduced SiC; plating the surface of the reduced SiC with nickel, washing it with water, and drying it to obtain nickel-plated SiC; the nickel plating solution used comprises: 30 g / L nickel sulfate, 50 mL / L lactic acid, and a pH of 4.5; the nickel plating temperature is 60°C, and the time is 16 minutes;

[0042] S3: Plasma cladding treatment is performed on the pretreated aluminum alloy to obtain a high-toughness, corrosion-resistant aluminum alloy profile with a ceramic layer on the surface; composite ceramic powder is used for plasma cladding treatment; the composite ceramic powder includes: 30 parts of nickel-plated SiC, 25 parts of Cr2O3, and 12 parts of Al2O3; the process is synchronous powder feeding, the ion gas flow rate is 2L / min, the argon flow rate is 7L / min, the transfer arc voltage is 30V, the transfer current is 90A, the spray distance is 15mm, the power is 1.5kW, the scanning speed is 5mm / s, the plasma arc spot diameter is 2.5mm, and the plasma cladding layer thickness is 1.5mm.

[0043] Comparative Example 3 (plasma cladding treatment was not performed, and the remaining steps were the same as those in Example 1): S1: An aluminum alloy substrate was subjected to an anodic oxidation treatment using the aluminum alloy substrate as an anode and platinum as a cathode at a treatment temperature of 24° C., an oxidation voltage of 175 V, and an anodic oxidation time of 4 min; followed by a pore expansion treatment using 5 wt % phosphoric acid for 40 min to obtain a pretreated aluminum alloy;

[0044] S2: Take the pre-treated aluminum alloy and use a vacuum pump to evacuate to 5×10 -2 Pa, introduce argon, start the pulse bias power supply, set the voltage to 800V, the duty cycle to 40%, the frequency to 20KHz, and clean the surface for 5 minutes; reduce the pulse bias amplitude to 400V, the duty cycle to 20%, the frequency to 10KHz, the gas pressure to 0.8Pa, turn on the chromium silicon aluminum target and the molybdenum sulfide target, and deposit at 70A for 8 minutes to obtain an aluminum alloy profile; the silicon content in the chromium silicon aluminum target is 6wt%, the aluminum content is 25wt%, and the balance is chromium.

[0045] Comparative Example 4 (the physical sputtering process was changed, and the remaining steps were consistent with Example 1): S1: An aluminum alloy substrate was subjected to an anodic oxidation treatment with the aluminum alloy substrate as the anode and platinum as the cathode at a treatment temperature of 24° C., an oxidation voltage of 175 V, and an anodic oxidation time of 4 min; and then a pore expansion treatment was performed using 5 wt % phosphoric acid for 40 min to obtain a pretreated aluminum alloy;

[0046] S2: Take the pre-treated aluminum alloy and use a vacuum pump to evacuate to 5×10 -2 Pa, argon gas was introduced, and the pulse bias power supply was started with the voltage set to 800V, the duty cycle to 40%, the frequency to 20KHz, and the surface was cleaned for 5 minutes; the pulse bias amplitude was reduced to 400V, the duty cycle to 20%, the frequency to 10KHz, and the gas pressure to 0.8Pa, and the chromium-silicon-aluminum target was turned on and deposition was carried out at 70A for 8 minutes to obtain a physically sputtered aluminum alloy with a chromium-aluminum-silicon layer on the surface; the silicon content of the chromium-silicon-aluminum target was 16wt%, the aluminum content was 25wt%, and the balance was chromium;

[0047] S3: immersing SiC in a 20% by volume aqueous solution of hydrofluoric acid for 30 minutes to roughen it, washing it with water, and drying it to obtain roughened SiC; immersing the roughened SiC in a 0.8% aqueous solution of potassium borohydride for activation for 2 hours, washing it with water, and drying it to obtain activated SiC; immersing the activated SiC in a 40 g / L aqueous solution of NaH2PO2·H2O for reduction for 30 minutes, washing it with water, and drying it to obtain reduced SiC; performing surface nickel plating on the reduced SiC, washing it with water, and drying it to obtain nickel-plated SiC; the nickel plating solution used comprises: 30 g / L nickel sulfate, 50 mL / L lactic acid, and a pH of 4.5; the nickel plating temperature is 60°C, and the time is 16 minutes;

[0048] S4: Plasma cladding treatment is performed on the physically sputtered aluminum alloy to obtain a high-toughness, corrosion-resistant aluminum alloy profile with a ceramic layer on the surface; composite ceramic powder is used for plasma cladding treatment; the composite ceramic powder includes: 30 parts of nickel-plated SiC, 25 parts of Cr2O3, and 12 parts of Al2O3; the process is synchronous powder feeding, the ion gas flow rate is 2L / min, the argon flow rate is 7L / min, the transfer arc voltage is 30V, the transfer current is 90A, the spray distance is 15mm, the power is 1.5kW, the scanning speed is 5mm / s, the plasma arc spot diameter is 2.5mm, and the plasma cladding layer thickness is 1.5mm.

[0049] Performance test: The aluminum alloy profiles prepared in Examples 1 to 3 and Comparative Examples 1 to 4 were taken; (1) the impact resistance was tested with reference to GB / T229-2020; the specimens were Charpy V-notch, and the radius of curvature of the pendulum hammer edge was 2 mm; (2) the corrosion resistance was tested using an electrochemical analyzer in a three-electrode system; the test solution was a 3.5 wt% sodium chloride aqueous solution; the scanning rate was 1 mV / s; see Table 1 for details;

[0050] Table 1:

[0051]

[0052] Conclusion: Comparative Example 1 replaces nickel-plated SiC with SiC, and the performance decreases significantly; Comparative Example 2 directly performs plasma cladding treatment on the pretreated aluminum alloy, and does not perform physical sputtering treatment in advance to obtain a base layer, so the performance is not as good as the embodiment; Comparative Example 3 only performs physical sputtering without plasma cladding treatment, and the performance also decreases; Comparative Example 4 changes the physical sputtering process, only uses a chromium-silicon-aluminum target, and increases the silicon content. Due to the influence of adhesion, lubricity, etc., the quality of the physical sputtering layer decreases, affecting the overall performance; In summary, the aluminum alloy profile prepared by the present invention has good toughness and corrosion resistance.

[0053] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A process for preparing a high-toughness, corrosion-resistant aluminum alloy profile, characterized by: The following steps are involved: S1: taking an aluminum alloy substrate, performing anodizing treatment and pore expansion treatment to obtain a pretreated aluminum alloy; S2: taking the pretreated aluminum alloy and performing physical sputtering to obtain an aluminum alloy having a molybdenum sulfide-chromium-aluminum-silicon layer on the surface; S3: performing plasma cladding treatment to obtain an aluminum alloy profile with a ceramic layer on the surface; Plasma cladding treatment uses composite ceramic powder, which is a combination of nickel-plated SiC, Cr2O3, and Al2O3.

2. The process for preparing a high-toughness, corrosion-resistant aluminum alloy profile according to claim 1, characterized in that: The composite ceramic powder includes the following raw materials, calculated by mass: 25 to 35 parts of nickel-plated SiC, 20 to 30 parts of Cr2O3, and 10 to 20 parts of Al2O3.

3. The process for preparing a high-toughness, corrosion-resistant aluminum alloy profile according to claim 1, characterized in that: The thickness of the ceramic layer is 1.5 to 3 mm.

4. The process for preparing a high-toughness, corrosion-resistant aluminum alloy profile according to claim 1, characterized in that: The preparation of nickel-plated SiC comprises the following steps: roughening, activating, and reducing SiC, and then performing surface nickel plating; the nickel plating solution comprises the following raw materials: 20-30 g / L nickel sulfate, 40-60 mL / L lactic acid, and the remainder water; the nickel plating process comprises: pH value 4.5-5.0, nickel plating temperature 60-70° C., and time 15-20 min.

5. The process for preparing a high-toughness, corrosion-resistant aluminum alloy profile according to claim 1, characterized in that: The specific steps of the anodizing treatment and the pore enlarging treatment are as follows: anodizing treatment: the anode is an aluminum alloy substrate, the cathode is an inert metal; the electrolyte is an aqueous solution of 0.5-1wt% phosphoric acid and 0.005-0.008M aluminum oxalate; the temperature is 20-25°C; the oxidation voltage is 170-180V; the treatment time is 3-6min; the pore enlarging treatment: 3-6wt% phosphoric acid is used for treatment for 30-60min.

6. The process for preparing a high-toughness, corrosion-resistant aluminum alloy profile according to claim 1, characterized in that: The specific steps of physical sputtering are: after surface cleaning, set the voltage to 400-500V, the duty cycle to 20-30%, the frequency to 10-20KHz, the gas pressure to 0.6-1Pa, turn on the chromium silicon aluminum target and the molybdenum sulfide target, and deposit at 70-80A for 6-10 minutes.

7. The process for preparing a high-toughness, corrosion-resistant aluminum alloy profile according to claim 6, characterized in that: In the chromium-silicon-aluminum target, the silicon content is 4-8 wt%, the aluminum content is 20-30 wt%, and the balance is chromium.

8. The process for preparing a high-toughness, corrosion-resistant aluminum alloy profile according to claim 1, characterized in that: The aluminum alloy substrate includes the following components in percentage by mass: Si: 2-4%, Zn: 1-2%, Mn: 0.1-0.3%, Fe: 0.1-0.3%, Cr: 0.05-0.15%, Ti: 0.02-0.1%, Cu: 1-2%, Mg: 1.2-1.8%, and the balance is Al and unavoidable impurities.

9. The aluminum alloy profile prepared according to the process for preparing a high-toughness, corrosion-resistant aluminum alloy profile according to any one of claims 1 to 8.

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