Glow discharge control methods, devices and electronic equipment

Abstract

This invention provides a glow discharge control method, apparatus, and electronic device, including receiving and setting discharge power and pressure until the discharge power and pressure meet automatic control conditions, and then controlling automatic temperature rise; during the automatic temperature rise process, acquiring the temperature of the sample stage in the reaction chamber, and alternately increasing the pressure and discharge power based on upper and lower limit power curves and upper and lower limit pressure curves, until the discharge power and pressure reach the final temperature rise value, and then entering a continuous control process; during the continuous control process, maintaining the temperature in the reaction chamber based on the upper and lower temperature limits, the current discharge power and pressure, and the upper and lower limit power and pressure curves; in response to entering the automatic temperature drop process, alternately decreasing the pressure and discharge power based on the upper and lower limit power curves and upper and lower limit pressure curves, until the discharge power and pressure reach the final temperature drop value. This improves the deposition success rate.

Description

Technical Field

[0001] This disclosure relates to the field of microwave plasma chemical vapor deposition technology, and in particular to a glow discharge control method, apparatus and electronic equipment. Background Technology

[0002] The glow discharge process of microwave plasma chemical vapor deposition in the reaction chamber involves four stages: ignition, heating, continuous process control, and cooling. The optimal glow discharge area for each stage is located directly above the sample stage: centered horizontally, with the lower edge of the discharge area intersecting the upper edge of the sample stage vertically (this varies depending on the process gas used, as the visible discharge area differs from the actual area).

[0003] Different microwave energy power and reaction chamber pressure (while the process gas is continuously input into the reaction chamber, the vacuum pump also continuously extracts air from the reaction chamber. By controlling the opening of the electric proportional valve, a stable pressure can be maintained) will cause the glow discharge region to be in different positions within the reaction chamber, causing the central region to shift or the glow discharge to fail, thus leading to deposition failure. Summary of the Invention

[0004] In view of the aforementioned problems, and in conjunction with the first aspect of the present invention, embodiments of the present invention provide a glow discharge control method, the method comprising:

[0005] In response to the start-up operation of glow discharge, the system receives the set discharge power and set pressure of the reaction chamber input through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves. The system continues to control the automatic temperature rise until the discharge power and pressure of the reaction chamber meet the automatic control conditions. The upper and lower limit power curves and the upper and lower limit pressure curves are obtained based on the optimal discharge power, minimum discharge power and maximum discharge power that meet the optimal glow discharge region obtained by testing under different pressures.

[0006] During the automatic temperature control process, the temperature of the sample stage in the reaction chamber is obtained by an infrared thermometer installed in the reaction chamber. Based on the upper and lower limit power curves and the upper and lower limit pressure curves, the pressure and the discharge power are alternately increased according to the current discharge power and the current pressure in the reaction chamber until the discharge power and the pressure in the reaction chamber reach the final temperature value, and then the continuous control process begins.

[0007] During the continuous control process, the temperature inside the reaction chamber is maintained based on the received upper and lower temperature limits input through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower limit power curves, and the upper and lower limit pressure curves.

[0008] In response to entering the automatic cooling process, based on the upper and lower limit power curves and the upper and lower limit pressure curves, and according to the current discharge power and the current pressure in the reaction chamber, the pressure and the discharge power are alternately reduced until the discharge power and the pressure in the reaction chamber reach the final cooling value.

[0009] In a preferred embodiment, the response to the glow discharge start-up operation, receiving the set discharge power and set pressure of the reaction chamber input via the operation panel, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and controlling the automatic temperature rise, includes:

[0010] In response to the activation operation of the glow discharge, a first set pressure input through the operation panel is received, wherein the first set pressure is less than a first preset pressure threshold.

[0011] According to the first set pressure, the pressure in the reaction chamber is continuously increased, and during the continuous increase of the pressure, the input of the set discharge power of the reaction chamber through the operation panel is prohibited until the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, wherein the first preset pressure threshold is greater than the second preset pressure threshold.

[0012] When the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, the system receives the set discharge power and set pressure of the reaction chamber input through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and then controls the automatic temperature rise.

[0013] In a preferred embodiment, when the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, the system receives the set discharge power and set pressure of the reaction chamber input via the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and then controls the system to enter automatic temperature control, including:

[0014] If the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, and the discharge power is less than the preset power threshold, then a set discharge power is received, which is between the upper and lower limits of the discharge power relative to the pressure and set by the operation panel. The upper and lower limits of the power are determined according to the upper and lower limit power curves of the discharge power relative to the pressure.

[0015] If the discharge power is greater than or equal to the preset power threshold, and the pressure in the reaction chamber is less than the second preset pressure threshold, the system receives a set pressure set by the operation panel between the pressure corresponding to the current discharge power and the upper and lower limit pressures of the discharge power. The upper and lower limit pressures are determined based on the upper and lower limit pressure curves of the pressure relative to the discharge power.

[0016] The automatic temperature rise is initiated when the discharge power and pressure of the reaction chamber meet the automatic control conditions. The automatic control conditions include that the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold and the discharge power is greater than or equal to the preset power threshold.

[0017] In a preferred embodiment, the step of alternatingly increasing the pressure and discharge power based on the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power and the current pressure inside the reaction chamber, until the discharge power and pressure of the reaction chamber reach the final value for temperature rise, and then entering a continuous control process, includes:

[0018] Perform the following steps alternately:

[0019] Based on the current discharge power of the reaction chamber, the pressure is controlled to increase according to a preset pressure increase value until the current pressure in the reaction chamber reaches the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves.

[0020] Based on the current pressure of the reaction chamber, the discharge power is controlled to increase according to a preset power increase value until the current discharge power of the reaction chamber reaches the upper limit power corresponding to the current pressure in the upper and lower limit power curves.

[0021] The process continues until the discharge power and pressure in the reaction chamber reach their final heating values, at which point the process enters a continuous control phase.

[0022] In a preferred embodiment, maintaining the temperature within the reaction chamber during the continuous control process, based on the received upper and lower temperature limits input via the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower limit power curves, and the upper and lower limit pressure curves, includes:

[0023] During the continuous control process, if the temperature inside the reaction chamber is higher than the upper temperature limit, the following steps are repeated until the temperature inside the reaction chamber is lower than the upper temperature limit, at which point the current control is stopped:

[0024] According to a first interval, the discharge power is reduced by a first preset power change amount until the number of times the discharge power is reduced reaches a first threshold, or the temperature in the reaction chamber is lower than the upper temperature limit, or the discharge power is reduced to the lower limit power corresponding to the current pressure in the upper and lower limit power curves. If the number of times the discharge power is reduced reaches the first threshold or the discharge power is reduced to the lower limit power corresponding to the current pressure in the upper and lower limit power curves, and the temperature in the reaction chamber is still higher than the upper temperature limit, then according to a second interval, the pressure is reduced by a first preset pressure change amount until the number of times the pressure is reduced reaches a second threshold, or the temperature in the reaction chamber is lower than the upper temperature limit, or the pressure is reduced to the lower limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves.

[0025] During the continuous control process, if the temperature inside the reaction chamber is lower than the lower limit, the following steps are repeated until the temperature inside the reaction chamber is higher than the lower limit, at which point the current control is stopped:

[0026] According to the third interval, the pressure is increased by the second preset pressure change amount until the number of times the pressure is increased reaches the third threshold, or the temperature in the reaction chamber is higher than the lower limit, or the pressure increases to the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves. If the number of times the pressure is increased reaches the third threshold, or the pressure increases to the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves, and the temperature in the reaction chamber is still lower than the lower limit, then according to the fourth interval, the discharge power is increased by the second preset power change amount until the number of times the discharge power is increased reaches the fourth threshold, or the temperature in the reaction chamber is higher than the lower limit, or the discharge power increases to the upper limit pressure corresponding to the current pressure in the upper and lower limit power curves.

[0027] In a preferred embodiment, the step of alternately decreasing the pressure and discharge power based on the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power and the current pressure inside the reaction chamber, until the discharge power and pressure of the reaction chamber reach the final value for cooling, includes:

[0028] Perform the following steps alternately:

[0029] Based on the current pressure of the reaction chamber, the discharge power is controlled to decrease according to a preset power reduction value until the current discharge power of the reaction chamber reaches the lower limit power corresponding to the current pressure in the upper and lower limit power curves.

[0030] Based on the current discharge power of the reaction chamber, the pressure is controlled to decrease according to a preset pressure reduction value until the current pressure in the reaction chamber reaches the lower limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves.

[0031] Until the discharge power and pressure in the reaction chamber reach their final cooling values.

[0032] In a preferred embodiment, the upper and lower limit power curves include:

[0033] Upper limit power curve: Lower limit power curve: Where x1 is the pressure inside the reaction chamber, y1 and y2 are the discharge power, y1 and y2 are the upper limit discharge power and lower limit discharge power for the same pressure inside the reaction chamber, a1, b1, c1, d1 and e1 are all fitted parameters, and a2, b2, c2, d2 and e2 are all fitted parameters.

[0034] In a preferred embodiment, the upper and lower pressure limit curves include:

[0035] Upper limit pressure curve: Lower limit pressure curve: Where x2 is the discharge power, y3 and y4 are the pressures inside the reaction chamber, y3 and y4 are the upper and lower pressure limits for the same discharge power, a3, b3, c3, d3, and e3 are all fitted parameters, and a4, b4, c4, d4, and e4 are all fitted parameters.

[0036] In conjunction with a second aspect of the present invention, an embodiment of the present invention provides a glow discharge control device, the device comprising:

[0037] The receiving module is configured to respond to the start operation of glow discharge, receive the set discharge power and set pressure of the reaction chamber input through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and then control the automatic temperature rise. The upper and lower limit power curves and the upper and lower limit pressure curves are obtained based on the optimal discharge power, minimum discharge power and maximum discharge power that conform to the optimal glow discharge region obtained by testing under different pressures.

[0038] The heating control module is configured to, during the automatic heating process, acquire the temperature of the sample stage in the reaction chamber using an infrared thermometer installed in the reaction chamber, and based on the upper and lower limit power curves and the upper and lower limit pressure curves, alternately increase the pressure and the discharge power according to the current discharge power and the current pressure in the reaction chamber, until the discharge power and the pressure in the reaction chamber reach the final heating value, and then enter the continuous control process;

[0039] A continuous control module is configured to maintain the temperature inside the reaction chamber during the continuous control process based on the received upper and lower temperature limits input through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower limit power curves, and the upper and lower limit pressure curves.

[0040] The cooling control module is configured to, in response to entering the automatic cooling process, based on the upper and lower limit power curves and the upper and lower limit pressure curves, alternately decrease the pressure and the discharge power according to the current discharge power and the current pressure in the reaction chamber, until the discharge power and the pressure in the reaction chamber reach the final cooling value.

[0041] In conjunction with a third aspect of the present invention, an embodiment of the present invention provides an electronic device, comprising:

[0042] A processor and a machine-readable storage medium; the machine-readable storage medium and the processor are connected, the machine-readable storage medium is used to store programs, instructions or code, and the processor is used to execute the programs, instructions or code in the machine-readable storage medium to implement the method described in any one of the first aspects.

[0043] Compared with the prior art, the glow discharge control method, apparatus and electronic equipment provided in this disclosure can achieve at least the following beneficial effects:

[0044] The system receives and sets the discharge power and pressure until they meet the automatic control conditions, at which point it enters automatic temperature control. During automatic temperature control, the temperature of the sample stage within the reaction chamber is acquired, and based on the upper and lower limit power and pressure curves, the pressure and discharge power are alternately increased until they reach their final heating values, at which point continuous control begins. During continuous control, the temperature within the reaction chamber is maintained based on the upper and lower temperature limits, the current discharge power and pressure, and the upper and lower limit power and pressure curves. In response to entering automatic cooling, the pressure and discharge power are alternately decreased based on the upper and lower limit power and pressure curves, until they reach their final cooling values. In this way, throughout the entire glow discharge initiation and continuous discharge process, the matching relationship between microwave power and reaction chamber pressure can be controlled, stabilizing the glow discharge region in the optimal position, improving the glow discharge success rate, and thus increasing the deposition success rate.

[0045] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0046] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0047] Figure 1 This is a block diagram of the architecture of the microwave plasma chemical vapor deposition apparatus provided in the embodiments of the present invention.

[0048] Figure 2 This is a schematic diagram of the execution flow of the glow discharge control method provided in the embodiment of the present invention.

[0049] Figure 3 This is a schematic diagram of the upper and lower limit power curves provided in an embodiment of the present invention.

[0050] Figure 4 This is a schematic diagram of the upper and lower pressure curves provided in an embodiment of the present invention.

[0051] Figure 5 This is a schematic block diagram of the glow discharge control device provided in an embodiment of the present invention.

[0052] Figure 6 This is a schematic diagram of exemplary hardware and software components of the glow discharge control device provided in an embodiment of the present invention. Detailed Implementation

[0053] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0054] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0055] This invention provides a glow discharge control method, which can be applied to MPCVD (Microwave Plasma Chemical Vapor Deposition) devices. See [link to relevant documentation]. Figure 1 As shown, the MPCVD apparatus may include:

[0056] The system includes a reaction chamber, a microwave energy source, a process gas supply unit, an electric proportional valve, a vacuum pump, and a vacuum gauge. The reaction chamber provides a crystal growth environment and contains a sample stage for supporting the grown crystal. The microwave energy source and the process gas supply unit are connected to the reaction chamber via pipes. The vacuum pump is connected to the reaction chamber via a pipe, and the electric proportional valve and the vacuum gauge are installed on the pipe connecting the vacuum pump and the vacuum reaction chamber.

[0057] Further, see Figure 2 As shown, the method includes the following steps.

[0058] In step S11, in response to the start operation of glow discharge, the set discharge power and set pressure of the reaction chamber are received through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves. The automatic control is initiated when the discharge power and pressure of the reaction chamber meet the automatic control conditions. The upper and lower limit power curves and the upper and lower limit pressure curves are obtained based on the optimal discharge power, minimum discharge power and maximum discharge power that meet the optimal glow discharge region obtained by testing under different pressures.

[0059] Glow discharge, also known as glow discharge, occurs when a sufficiently high voltage is applied between two electrodes, ionizing atoms or molecules in a gas and producing electrons, ions, and neutral particles. These charged particles move under the influence of an electric field, forming a current and emitting a glow, hence the name glow discharge. During glow discharge, electrons are emitted from the cathode, accelerated in the electric field, and collide with gas atoms or molecules, ionizing them and producing new electrons and ions, creating an electron avalanche effect that sustains the discharge. Glow discharge has a relatively low discharge current and a relatively high voltage, and is commonly used in plasma processing, thin film deposition, and other fields.

[0060] The upper and lower limit power curves describe the upper and lower limits of the allowable range of discharge power in the reaction chamber as a function of pressure during a specific process. They define reasonable power ranges at different stages to ensure process stability and product quality. These curves are based on extensive experimental data and process experience. The upper limit power is designed to prevent excessive power from causing equipment damage, sample overheating, or adverse physicochemical reactions; the lower limit power ensures sufficient energy to maintain glow discharge or achieve desired process effects, such as film growth rate and quality.

[0061] The upper and lower pressure limit curves describe the upper and lower limits of the allowable range of pressure variation within the reaction chamber as a function of discharge power during the process. They control the gas environment within the reaction chamber, affecting factors such as gas molecular density and reaction rate. These upper and lower pressure limit curves are also determined based on experimental and process requirements. Excessively high upper pressure may lead to gas leakage, equipment sealing problems, or affect gas ionization and the reaction process; conversely, excessively low lower pressure may prevent sufficient gas molecules from participating in the reaction, impacting process performance such as the uniformity and density of the thin film.

[0062] See Figure 3 The diagram shows the upper and lower power limit curves. It includes the upper power curve, the curve corresponding to the optimal power, and the lower power curve. These curves are obtained based on the control range of discharge power relative to pressure. (See also...) Figure 4 The graph shows the upper and lower pressure limit curves. It includes the upper pressure curve, the curve corresponding to the optimal pressure, and the lower pressure curve. These curves are obtained based on the control range of pressure relative to discharge power. The minimum ignition power was determined after collecting pressure data; the minimum ignition pressure was 6 Torr, and the power was 480-530 W. The optimal, minimum, and maximum powers within the optimal glow discharge region were tested at different pressures.

[0063] It can be explained that the optimal matching data between power and pressure is obtained by acquiring sampling data from the actual operation of the MPCVD device. Because the power and pressure values ​​fluctuate during the operation of the MPCVD device and due to process requirements, the values ​​need to be fine-tuned based on the optimal data. Therefore, upper and lower limits are added to the optimal matching data to form the upper and lower limit curve range between power and pressure. The control objective is to keep the power and pressure within the upper and lower limit curve range when the equipment changes during operation.

[0064] In this embodiment of the disclosure, when the operator triggers the glow discharge start command via the operation panel, the system begins to execute subsequent operations. The system receives the set discharge power and set pressure input to the reaction chamber by the operator via the operation panel, based on the upper and lower limit power curves and the upper and lower limit pressure curves. These set parameters are initial values ​​determined by the operator within the range specified by the upper and lower limit curves, according to process requirements and experience.

[0065] Furthermore, the system continuously monitors the actual discharge power and pressure of the reaction chamber and compares them with the automatic control conditions. These automatic control conditions are typically a pre-set threshold range or a specific logical relationship. When the actual discharge power and pressure meet these conditions, it indicates that the initial state of the reaction chamber has reached the requirements for automatic temperature control. Once the discharge power and pressure of the reaction chamber meet the automatic control conditions, the system sends a control signal to initiate the automatic temperature control phase.

[0066] In step S12, during the automatic temperature control process, the temperature of the sample stage in the reaction chamber is obtained by an infrared thermometer installed in the reaction chamber. Based on the upper and lower limit power curves and the upper and lower limit pressure curves, the pressure and discharge power are alternately increased according to the current discharge power and the current pressure in the reaction chamber until the discharge power and the pressure in the reaction chamber reach the final value of the temperature rise, and then the continuous control process begins.

[0067] During heating, the MPCVD device is equipped with an infrared thermometer to monitor the sample stage temperature in real time. Changes in power and pressure affect the sample stage and serve as a reference temperature for glow discharge. In this embodiment, the infrared thermometer, located within the reaction chamber, measures the temperature of the sample stage in real time and transmits the temperature signal to the control system.

[0068] Furthermore, based on the upper and lower limit power curves and pressure curves, and considering the current discharge power and pressure in the reaction chamber, the pressure and discharge power are alternately increased according to a specific strategy. For example, first, according to the upper and lower limit pressure curves, the pressure in the reaction chamber is increased within a certain range to increase the gas molecule density, which is beneficial for increasing the reaction rate; then, according to the upper and lower limit power curves, the discharge power is increased to provide more energy for the reaction and promote temperature rise. This alternating increase method can avoid process instability caused by excessive adjustment of a single parameter. For example, if only the discharge power is increased without adjusting the pressure, it may lead to local overheating or uneven gas ionization; conversely, if only the pressure is increased without increasing the power, it may not be able to provide enough energy to maintain the temperature rise.

[0069] Furthermore, the discharge power and pressure of the reaction chamber are continuously monitored. When they reach the final value of the temperature rise, it indicates that the temperature inside the reaction chamber has approached or reached the expected process temperature, at which point the continuous control process begins.

[0070] In step S13, during the continuous control process, the temperature inside the reaction chamber is maintained based on the received upper and lower temperature limits input through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower limit power curves, and the upper and lower limit pressure curves.

[0071] In this embodiment, the system receives the upper and lower temperature limits input by the operator via the operation panel, and simultaneously acquires the current discharge power and pressure of the reaction chamber, as well as the upper and lower limit power curves and pressure curves. Based on the received parameters, the temperature of the sample stage within the reaction chamber is monitored in real time. When the temperature approaches the upper temperature limit, the system reduces the discharge power or adjusts the pressure according to a control algorithm (such as a PID control algorithm) to reduce the energy input to the reaction chamber, causing the temperature to drop. When the temperature approaches the lower temperature limit, the system increases the discharge power or adjusts the pressure to increase the energy input, causing the temperature to rise.

[0072] By dynamically adjusting the discharge power and pressure, the temperature inside the reaction chamber is maintained between the upper and lower temperature limits, ensuring the stability of the process and the consistency of product quality.

[0073] In step S14, in response to entering the automatic control cooling process, based on the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power of the reaction chamber and the current pressure inside the reaction chamber, the pressure and the discharge power are alternately reduced until the discharge power and the pressure of the reaction chamber reach the final cooling value.

[0074] In this embodiment, when the operator triggers the command to enter the automatic cooling process, the system begins to execute the cooling operation. Based on the upper and lower limit power curves and the upper and lower limit pressure curves, the control system alternately reduces the pressure and discharge power according to the current discharge power and pressure in the reaction chamber, following a strategy opposite to the heating process. For example, it first reduces the discharge power to decrease energy input, causing the temperature to begin to drop; then it reduces the pressure in the reaction chamber to lower the gas molecule density, further promoting temperature reduction. This alternating reduction method ensures a smooth cooling process and avoids equipment damage or sample cracking due to improper parameter adjustments.

[0075] Furthermore, the discharge power and pressure of the reaction chamber are continuously monitored. When they reach the final value for cooling, it indicates that the temperature inside the reaction chamber has been reduced to a safe range, and the cooling process is over.

[0076] The above technical solution receives and sets the discharge power and pressure until they meet the automatic control conditions, at which point it enters automatic temperature control. During automatic temperature control, the temperature of the sample stage inside the reaction chamber is acquired, and based on the upper and lower limit power curves and upper and lower limit pressure curves, the pressure and discharge power are alternately increased according to the current discharge power and pressure until they reach the final temperature values, entering a continuous control process. During continuous control, the temperature inside the reaction chamber is maintained according to the upper and lower temperature limits, the current discharge power and pressure, and the upper and lower limit power and pressure curves. In response to entering the automatic temperature control cooling process, based on the upper and lower limit power curves and upper and lower limit pressure curves, the pressure and discharge power are alternately decreased according to the current discharge power and pressure until they reach the final cooling values. In this way, throughout the entire process of glow discharge ignition and continuous discharge, the matching relationship between microwave power and reaction chamber pressure can be controlled, stabilizing the glow discharge region in the optimal position and improving the success rate of glow discharge and crystal deposition.

[0077] In a preferred embodiment, in step S11, the response to the glow discharge start-up operation, receiving the set discharge power and set pressure of the reaction chamber input via the operation panel, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and controlling the automatic temperature rise, includes:

[0078] In step S111, in response to the activation operation of the glow discharge, a first set pressure input through the operation panel is received, wherein the first set pressure is less than a first preset pressure threshold.

[0079] In this embodiment of the disclosure, when an operator triggers a glow discharge start command via the control panel, this electrical signal change is detected. This signal is transmitted to the central processing unit (CPU) or a dedicated control chip as a trigger signal to start subsequent processes.

[0080] The control panel has a dedicated pressure input interface. Operators input a relatively low initial pressure setting value based on process requirements and the preliminary range of the upper and lower pressure limit curves. This value is set to be lower than a first preset pressure threshold, which is a safety upper limit determined based on the equipment's pressure-bearing capacity, the performance of the gas supply system, and past experimental data.

[0081] In step S112, the pressure inside the reaction chamber is continuously increased according to the first set pressure, and during the continuous increase of the pressure, the input of the set discharge power of the reaction chamber through the operation panel is prohibited until the pressure inside the reaction chamber is greater than or equal to the second preset pressure threshold, wherein the first preset pressure threshold is greater than the second preset pressure threshold.

[0082] In this embodiment, a control signal is sent to the gas supply system based on the received first set pressure value. The gas supply system typically includes components such as a gas source, a gas flow controller, and valves. The control system controls the gas flow rate entering the reaction chamber by adjusting the opening of the gas flow controller, thereby gradually increasing the pressure within the reaction chamber. That is, the gas valve is gradually opened, allowing more gas to enter the reaction chamber, and the pressure rises accordingly.

[0083] Furthermore, during the pressure increase, the actual pressure value within the reaction chamber is monitored in real time. This is achieved through a pressure sensor installed within the reaction chamber. The pressure sensor converts the pressure signal into an electrical signal and transmits it to the analog-to-digital converter (ADC) of the control system, where it is converted into a digital signal for processing and display. The control system then uses an appropriate control algorithm (such as proportional-integral-derivative control or PID algorithm) to precisely adjust the gas flow rate based on the deviation between the actual pressure value and the target value (the initial set pressure), ensuring that the pressure rises steadily at the expected rate.

[0084] Furthermore, during the continuous increase in pressure, the discharge power input function on the control panel is locked. This is to prevent operators from mistakenly inputting discharge power before the pressure reaches the appropriate range, which could lead to an unstable discharge state within the reaction chamber, affecting equipment safety and process efficiency. For example, if excessively high discharge power is applied when the pressure is too low, it may cause incomplete gas ionization, resulting in localized overheating or arcing, damaging the electrodes or samples within the reaction chamber. The control system, through software programming, disables button or touch operations related to discharge power input on the control panel during the pressure increase phase. Simultaneously, it displays a prompt message on the control panel screen informing the operator that the pressure adjustment phase is in effect and that inputting discharge power is prohibited.

[0085] Furthermore, when the pressure inside the reaction chamber is greater than or equal to the second preset pressure threshold, the signal detected by the pressure sensor, after being processed by the control system, will trigger a change in the corresponding status flag. The second preset pressure threshold is a key parameter, indicating that the gas environment inside the reaction chamber has reached a condition where discharge power can be safely applied. This value is usually optimized and set according to process requirements and equipment characteristics. When the actual pressure reaches or exceeds this value, the control system considers the pressure adjustment phase to be over and releases the lock on the discharge power input function on the operation panel.

[0086] For example, when power = 0, the pressure can be set and output from 0 to 276 Torr; when the actual pressure is below 6 Torr, the power cannot be set or discharged.

[0087] In step S113, when the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, the set discharge power and set pressure of the reaction chamber are input through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and the automatic control heating is initiated.

[0088] In this embodiment, when the pressure within the reaction chamber is greater than or equal to a second preset pressure threshold, the discharge power and pressure input functions on the operation panel return to normal. The operator can input the set discharge power and pressure values ​​for the reaction chamber via the operation panel, based on the upper and lower limit power curves and pressure curves, and in conjunction with specific process requirements. The upper and lower limit power curves and pressure curves have been verified and optimized through extensive experiments; they define reasonable ranges for discharge power and pressure at different process stages to ensure process stability and product quality. The values ​​input by the operator are again checked for validity by the control system to ensure they are within the range specified by the upper and lower limit curves.

[0089] Furthermore, the actual discharge power and pressure values ​​of the reaction chamber are continuously monitored and compared with the settings input by the operator and the automatic control conditions. The automatic control conditions are typically a judgment logic that integrates multiple factors. Once the discharge power and pressure of the reaction chamber meet the automatic control conditions, the control system will issue a control signal to initiate the automatic temperature control program.

[0090] In a preferred embodiment, in step S113, when the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, the system receives the set discharge power and set pressure of the reaction chamber input via the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and then controls the system to enter automatic temperature control, including:

[0091] In step S1131, if the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, and the discharge power is less than the preset power threshold, then the set discharge power, which is between the upper and lower limits of the discharge power relative to the pressure and set by the operation panel, is received. The upper and lower limits of the power are determined according to the upper and lower limit power curves of the discharge power relative to the pressure.

[0092] In this embodiment, when the pressure inside the reaction chamber is greater than or equal to a second preset pressure threshold, the pressure sensor converts the pressure signal into an electrical signal in real time and transmits it to the analog-to-digital converter (ADC) of the control system. After the ADC converts the analog signal into a digital signal, the control system compares the digital signal with the second preset pressure threshold stored in memory. Once the actual pressure is detected to have reached or exceeded the threshold, the control system removes some restrictions on the discharge power input function on the operation panel, allowing the operator to input discharge power-related parameters, but further judgment will be made based on the magnitude of the discharge power.

[0093] Simultaneously, the actual discharge power within the reaction chamber is continuously monitored, which is achieved through a power sensor. The power sensor converts the discharge power signal into an electrical signal and transmits it to the control system, where it is processed to obtain the actual discharge power value. The control system compares this actual value with a preset power threshold, a key parameter set according to process requirements and equipment characteristics. When the actual discharge power is determined to be less than the preset power threshold, the control system determines that the discharge power setting needs to be adjusted.

[0094] Furthermore, the upper and lower power limits corresponding to the current pressure are displayed on the control panel screen, prompting the operator to input the set discharge power within this range. The operator inputs the set value via the buttons or touchscreen on the control panel. After this value is transmitted to the control system, the system performs a validity check again to ensure that the input set discharge power is within the upper and lower power limits. If the input value is valid, the control system stores it as the current set discharge power and prepares to adjust the discharge power of the reaction chamber based on this value.

[0095] In step S1132, if the discharge power is greater than or equal to the preset power threshold, and the pressure in the reaction chamber is less than the second preset pressure threshold, a set pressure is received by the operation panel between the pressure corresponding to the current discharge power and the upper and lower limit pressures of the discharge power. The upper and lower limit pressures are determined according to the upper and lower limit pressure curves of the pressure relative to the discharge power.

[0096] In this embodiment, the actual discharge power within the reaction chamber is continuously monitored. When the discharge power is determined to be greater than or equal to a preset power threshold, it indicates that the discharge power has reached a basic condition required by the process. As mentioned above, a pressure sensor monitors the pressure within the reaction chamber in real time and transmits the signal to the control system. The control system compares the actual pressure value with a second preset pressure threshold. When the actual pressure is found to be less than the second preset pressure threshold, it determines that the pressure setting needs to be adjusted. For example, if the second preset pressure threshold is 40 Torr, and the current actual pressure is 35 Torr, it indicates that the pressure has not yet reached the stable range required by the process.

[0097] Furthermore, the control panel displays the upper and lower pressure ranges corresponding to the current discharge power, prompting the operator to input a set pressure within this range. After the operator inputs the set value via the control panel, the control system checks its validity to ensure that the input set pressure is within the upper and lower pressure ranges. If the input value is valid, the control system stores it as the current set pressure and prepares to adjust the pressure in the reaction chamber based on this value.

[0098] For example, when the actual pressure is >= 6 Torr, the power in the range of y1-y2 can be set and output; when the actual power is >= 500W, the pressure in the range of y3-y4 can be set and output.

[0099] The automatic temperature rise is initiated when the discharge power and pressure of the reaction chamber meet the automatic control conditions. The automatic control conditions include that the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold and the discharge power is greater than or equal to the preset power threshold.

[0100] In this embodiment, the pressure and discharge power within the reaction chamber are continuously monitored in real time, and the actual pressure value is compared with a second preset pressure threshold, and the actual discharge power value is compared with a preset power threshold. Only when both conditions are met simultaneously—that the pressure within the reaction chamber is greater than or equal to the second preset pressure threshold and the discharge power is greater than or equal to the preset power threshold—is the discharge power and pressure within the reaction chamber considered to meet the automatic control conditions. This comprehensive judgment ensures that the gas environment and energy input within the reaction chamber reach a stable state suitable for automatic temperature control, avoiding abnormalities in the temperature rise process caused by one parameter meeting the standard while another parameter is unstable. Once the automatic control conditions are met, the control system sends a control signal to initiate the automatic temperature control program.

[0101] For example, automatic control can be performed when the actual pressure is >= 6 Torr and the actual power is >= 500W.

[0102] In a preferred embodiment, in step S12, based on the upper and lower limit power curves and the upper and lower limit pressure curves, and according to the current discharge power and the current pressure inside the reaction chamber, the pressure and discharge power are alternately increased until the discharge power and pressure of the reaction chamber reach the final value of the temperature rise, and a continuous control process is entered, including:

[0103] Perform the following steps alternately:

[0104] Based on the current discharge power of the reaction chamber, the pressure is controlled to increase according to a preset pressure increase value until the current pressure in the reaction chamber reaches the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves.

[0105] In this embodiment, the current discharge power value of the reaction chamber is first acquired in real time by a power sensor. This sensor converts the physical quantity of discharge power into an electrical signal, which is then processed by an analog-to-digital converter (ADC) to obtain a digital signal for the control system to read and analyze. Simultaneously, the control system reads pre-stored upper and lower limit pressure curve data from memory. This curve data is stored in the form of an array or table, recording the upper and lower pressure limits corresponding to different discharge powers. Then, based on the current discharge power value, the upper and lower limit pressure values ​​are searched within the upper and lower limit pressure curves to determine the upper limit pressure value corresponding to the current discharge power.

[0106] Based on the preset pressure increase value, a control signal is sent to the gas supply system. The gas supply system includes components such as a gas source, a gas flow controller, and valves. The control system adjusts the gas flow rate entering the reaction chamber by regulating the opening of the gas flow controller, thereby adjusting the pressure.

[0107] After each adjustment, the actual pressure in the reaction chamber is monitored in real time by a pressure sensor and compared with the target upper limit pressure value. If the actual pressure is less than the target upper limit pressure value, the control system continues to increase the gas flow rate by the preset pressure increase value, causing the pressure to continue to rise. If the actual pressure reaches or exceeds the target upper limit pressure value, the control system stops increasing the gas flow rate and maintains the current pressure stable. For example, if the current pressure is 40 Torr, the preset pressure increase value is 2 Torr / time, and the target upper limit pressure is 50 Torr, the control system will first increase the gas flow rate to raise the pressure to 42 Torr, then check again. If it still has not reached 50 Torr, it will continue to increase the flow rate to 44 Torr, and so on, until the pressure reaches 50 Torr.

[0108] Based on the current pressure of the reaction chamber, the discharge power is controlled to increase according to a preset power increase value until the current discharge power of the reaction chamber reaches the upper limit power corresponding to the current pressure in the upper and lower limit power curves.

[0109] In this embodiment of the disclosure, when the pressure inside the reaction chamber reaches the upper limit pressure set in the previous stage, the control system obtains the current pressure value of the reaction chamber through a pressure sensor. Simultaneously, it reads pre-stored upper and lower limit power curve data from memory, which records the upper and lower power limits corresponding to different pressures.

[0110] Then, based on the current pressure value, the upper and lower limit power curves are searched to determine the upper limit power value corresponding to the current pressure. For example, if the current pressure is 50 Torr, the upper limit power corresponding to 50 Torr in the upper and lower limit power curves is 400W, and the lower limit power is 200W. The control system will then use 400W as the target value for increasing the discharge power. Based on the preset power increase value, a control signal is sent to the discharge power adjustment device (such as an RF power controller). The discharge power adjustment device adjusts its output power according to the control signal, thereby changing the discharge power within the reaction chamber.

[0111] After each adjustment, the control system monitors the actual discharge power value in the reaction chamber in real time using a power sensor and compares it with the target upper limit power value. If the actual discharge power value is less than the target upper limit power value, the control system continues to increase the discharge power according to the preset power increase value; if the actual discharge power value reaches or exceeds the target upper limit power value, the control system stops increasing the discharge power and maintains the current power stable. For example, if the current discharge power is 300W, the preset power increase value is 20W / time, and the target upper limit power is 400W, the control system will first increase the discharge power to 320W, check again, and if it still has not reached 400W, continue to increase it to 340W, and so on, until the discharge power reaches 400W.

[0112] The process continues until the discharge power and pressure in the reaction chamber reach their final heating values, at which point the process enters a continuous control phase.

[0113] In this embodiment, a cyclic structure is used to alternately execute the two steps described above. After each step of increasing the pressure according to the discharge power is completed, the control system automatically switches to the step of increasing the discharge power according to the pressure, and vice versa. This alternating execution method can gradually and smoothly adjust the discharge power and pressure of the reaction chamber to the final value required for heating.

[0114] For example, during the temperature control process: (1) When the final pressure and power settings are not within the range of y1-y2 and y3-y4, the power setting is forcibly adjusted to y1. If the power setting is >10KW, the power setting is forcibly adjusted to 10KW. (2) First, based on the current discharge power, control the pressure to increase to the value within the range of y3-y4 (the value of increase varies for different processes each time). When the value of increase is >y3, increase to y3. (3) After the actual pressure reaches the value of increase, control the power to increase to the value within the range of y1-y2 based on the current pressure (the value of increase varies for different processes each time). When the value of increase is >y1, increase to y1. (4) Repeat steps (1) and (2) until the pressure and power reach the final temperature value.

[0115] In a preferred embodiment, step S13, in the continuous control process, maintaining the temperature within the reaction chamber based on the received upper and lower temperature limits input via the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower limit power curves, and the upper and lower limit pressure curves, includes:

[0116] During the continuous control process, if the temperature inside the reaction chamber is higher than the upper temperature limit, the following steps are repeated until the temperature inside the reaction chamber is lower than the upper temperature limit, at which point the current control is stopped:

[0117] According to a first interval, the discharge power is reduced by a first preset power change amount until the number of times the discharge power is reduced reaches a first threshold, or the temperature in the reaction chamber is lower than the upper temperature limit, or the discharge power is reduced to the lower limit power corresponding to the current pressure in the upper and lower limit power curves. If the number of times the discharge power is reduced reaches the first threshold or the discharge power is reduced to the lower limit power corresponding to the current pressure in the upper and lower limit power curves, and the temperature in the reaction chamber is still higher than the upper temperature limit, then according to a second interval, the pressure is reduced by a first preset pressure change amount until the number of times the pressure is reduced reaches a second threshold, or the temperature in the reaction chamber is lower than the upper temperature limit, or the pressure is reduced to the lower limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves.

[0118] In this embodiment of the disclosure, during continuous control, a temperature sensor monitors the temperature inside the reaction chamber in real time and converts it into an electrical signal, which is then transmitted to the control system. The control system converts the electrical signal into a digital signal using an analog-to-digital converter (ADC) and compares it with the upper temperature limit input on the operation panel. When the temperature inside the reaction chamber is detected to be higher than the upper temperature limit, the control system initiates a temperature regulation program.

[0119] The first interval duration is determined comprehensively based on factors such as the thermal inertia of the reaction chamber and the stability requirements of the process. If the thermal inertia of the reaction chamber is large and the temperature change is relatively slow, the first interval duration can be set to be longer, such as 5 seconds, to avoid system instability caused by too frequent adjustments; conversely, if the thermal inertia is small, the first interval duration can be set to be shorter, such as 1 second.

[0120] The first preset power change is set based on equipment performance and process characteristics. It must ensure that each power reduction effectively lowers the energy input within the reaction chamber, thereby reducing temperature, without causing adverse effects on the process due to excessive power fluctuations. For example, in a plasma etching process, the first preset power change might be set to 10W.

[0121] Then, according to the first interval, a control signal is periodically sent to the discharge power adjustment device (such as an RF power controller) to reduce the output power according to the first preset power change amount. After each power reduction, the control system monitors the temperature inside the reaction chamber again through a temperature sensor.

[0122] The number of power reductions is recorded by a counter. If the number of power reductions reaches the first threshold (this threshold is set according to the power adjustment range and temperature regulation efficiency allowed by the process, for example, 5 times), or the temperature in the reaction chamber is lower than the upper temperature limit, or the discharge power is reduced to the lower limit power corresponding to the current pressure in the upper and lower limit power curves (the control system finds the lower limit power value in the upper and lower limit power curve data based on the current pressure value), then the operation of reducing the discharge power is stopped.

[0123] If the number of times the discharge power is reduced reaches the first threshold or the discharge power is reduced to the lower limit power corresponding to the current pressure in the upper and lower limit power curves, and the temperature inside the reaction chamber is still higher than the upper temperature limit, the control system will start the pressure adjustment program.

[0124] The pressure is reduced by a first preset pressure change amount (set according to the performance of the gas supply system and the process sensitivity to pressure, such as 2 Torr) according to a second interval duration (also set according to the characteristics of the reaction chamber and process requirements, possibly slightly longer or shorter than the first interval duration). The control system reduces the gas flow rate into the reaction chamber by adjusting the opening of the gas flow controller, thereby reducing the pressure.

[0125] After each pressure reduction, the temperature inside the reaction chamber is monitored. The number of pressure reductions is recorded by a counter. The pressure reduction operation is stopped when the number of pressure reductions reaches the second threshold (e.g., 4 times), or when the temperature inside the reaction chamber is lower than the upper temperature limit, or when the pressure is reduced to the lower limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves (the control system finds the lower limit pressure value in the upper and lower limit pressure curve data based on the current discharge power value).

[0126] During the continuous control process, if the temperature inside the reaction chamber is lower than the lower limit, the following steps are repeated until the temperature inside the reaction chamber is higher than the lower limit, at which point the current control is stopped:

[0127] According to the third interval, the pressure is increased by the second preset pressure change amount until the number of times the pressure is increased reaches the third threshold, or the temperature in the reaction chamber is higher than the lower limit, or the pressure increases to the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves. If the number of times the pressure is increased reaches the third threshold, or the pressure increases to the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves, and the temperature in the reaction chamber is still lower than the lower limit, then according to the fourth interval, the discharge power is increased by the second preset power change amount until the number of times the discharge power is increased reaches the fourth threshold, or the temperature in the reaction chamber is higher than the lower limit, or the discharge power increases to the upper limit pressure corresponding to the current pressure in the upper and lower limit power curves.

[0128] In this embodiment, a temperature sensor continuously monitors the temperature inside the reaction chamber and transmits it to the control system. When the control system detects that the temperature inside the reaction chamber is below the lower limit, it initiates a temperature rise regulation program.

[0129] The setting of the third interval duration takes into account the response time of gas state adjustment within the reaction chamber and the stability of the process. If the gas state adjustment response is fast, the third interval duration can be shorter, such as 2 seconds; conversely, it can be longer, such as 4 seconds.

[0130] The second preset pressure change is set based on the pressure requirements of the process and the capacity of the gas supply system. For example, in a chemical vapor deposition process, the second preset pressure change might be set to 3 Torr to ensure that increasing the gas flow rate does not cause excessive impact on the process.

[0131] Then, according to the third interval, a control signal is periodically sent to the gas flow controller, causing it to increase the gas flow rate into the reaction chamber according to the second preset pressure change, thereby increasing the pressure inside the reaction chamber. After each pressure increase, the control system monitors the temperature inside the reaction chamber through a temperature sensor.

[0132] The number of pressure increases is recorded by a counter. If the number of pressure increases reaches the third threshold (set according to the pressure adjustment range and temperature regulation efficiency allowed by the process, for example, 6 times), or the temperature in the reaction chamber is higher than the lower limit, or the pressure increases to the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves (the control system finds the upper limit pressure value in the upper and lower limit pressure curve data based on the current discharge power value), then the pressure increase operation is stopped.

[0133] If the pressure is increased three times to the threshold or the pressure is increased to the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves, and the temperature inside the reaction chamber is still lower than the lower limit, the control system will start the power adjustment program.

[0134] The discharge power is increased by a second preset power change amount (set according to the power response characteristics of the reaction chamber and process requirements, e.g., 3 seconds) according to the fourth interval duration. The control system sends a control signal to the discharge power adjustment device to increase its output power.

[0135] After each power increase, the temperature inside the reaction chamber is monitored. The number of power increases is recorded by a counter. When the number of power increases reaches the fourth threshold (e.g., 5 times), or the temperature inside the reaction chamber is higher than the lower limit, or the discharge power increases to the upper limit power corresponding to the current pressure in the upper and lower limit power curves (the control system finds the upper limit power value in the upper and lower limit power curve data based on the current pressure value), the operation of increasing the discharge power is stopped.

[0136] For example, during continuous process control, (1) set the upper temperature limit and the lower temperature limit; (2) when the temperature is higher than the upper temperature limit, reduce the power by one power change (which can be set) every 1 minute (1 minute interval). If the power reduction value is lower than y2 according to the current pressure, the power is reduced to y2; (3) if the temperature is lower than the upper temperature limit within 3 power reductions, stop the current adjustment; (4) if the power reduction number is greater than 3 times, or the power has dropped to y2 and the temperature is still higher than the upper temperature limit, reduce the pressure by one pressure change (which can be set) every 1 minute (1 minute interval). If the pressure reduction value is lower than y4, the pressure is reduced to y4; (5) if the temperature is lower than the upper temperature limit within 3 pressure reductions, stop the current adjustment; (6) if the pressure reduction number is greater than 3 times, or the pressure has dropped to y4 and the temperature is still higher than the upper temperature limit, repeat the above steps (2)-(6) until the temperature is lower than the upper temperature limit, then stop the current adjustment. (7) When the temperature is below the lower limit of the lower temperature, increase the pressure by one pressure change (adjustable) every 1 minute. If the increased pressure value is higher than y3 according to the current discharge power, the pressure will be increased to y3. (8) If the temperature is higher than the lower limit of the lower temperature within 3 increases of the pressure, stop this adjustment. (9) If the number of pressure increases is greater than 3, or the pressure has risen to y3 and the temperature is still below the lower limit of the lower temperature, increase the power by one power change (adjustable) every 1 minute. If the increased power value is higher than y1, the power will be increased to y1. (10) If the temperature is higher than the lower limit of the lower temperature within 3 increases of the power, stop this adjustment. If the number of power increases is greater than 3, or the power has risen to y1 and the temperature is still above or below the lower limit of the lower temperature, repeat the above steps (7)-(11) until the temperature is above the lower limit of the lower temperature, then stop this adjustment.

[0137] By implementing the control steps described above for temperatures exceeding the upper and lower limits, the discharge power and pressure can be flexibly adjusted based on the actual temperature inside the reaction chamber, combined with the upper and lower limit power curves and pressure curves. This maintains the temperature inside the reaction chamber within the set range, ensuring smooth process operation and product quality stability.

[0138] In a preferred embodiment, in step S14, the step of alternately decreasing the pressure and the discharge power based on the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power and the current pressure inside the reaction chamber, until the discharge power and pressure of the reaction chamber reach the final value of cooling, includes:

[0139] Perform the following steps alternately:

[0140] Based on the current pressure of the reaction chamber, the discharge power is controlled to decrease according to a preset power reduction value until the current discharge power of the reaction chamber reaches the lower limit power corresponding to the current pressure in the upper and lower limit power curves.

[0141] In this embodiment of the disclosure, during the cooling process, the control system monitors the pressure value inside the reaction chamber in real time using a high-precision pressure sensor. The pressure sensor converts the physical quantity of pressure inside the reaction chamber into an electrical signal, which is then processed by a signal conditioning circuit (such as amplification and filtering) and then converted into a digital signal by an analog-to-digital converter (ADC), and transmitted to the control system for reading and analysis.

[0142] The system reads pre-stored upper and lower limit power curve data from its storage units (such as memory, hard drives, etc.). This data is usually stored in the form of arrays or tables, recording the upper and lower power limits corresponding to different pressure values. Based on the currently monitored pressure value, the system searches within the upper and lower limit power curve data. If the current pressure value happens to be a sampling point on the curve, the corresponding lower limit power value is directly obtained.

[0143] The preset power reduction value is determined comprehensively based on factors such as the thermal inertia of the reaction chamber, the stability requirements of the process, and the safe operating range of the equipment. If the thermal inertia of the reaction chamber is large and the temperature change is relatively slow, the preset power reduction value can be set larger to accelerate the cooling rate; however, if the thermal inertia is small and the temperature change is sensitive, the preset power reduction value should be set smaller to avoid excessively rapid temperature drop that could lead to process instability or equipment damage. For example, in a semiconductor manufacturing process with high temperature control requirements, the preset power reduction value might be set to 10W / cycle; while in some material processing processes with a higher tolerance for temperature changes, the preset power reduction value could be set to 50W / cycle.

[0144] At the same time, the preset power reduction value should also take into account the performance of the discharge power regulation device. If the discharge power regulation device can adjust the power output quickly and accurately, and respond sensitively to power changes, then the preset power reduction value can be appropriately increased; otherwise, the preset power reduction value should be decreased to ensure the smoothness and accuracy of power adjustment.

[0145] Based on the current discharge power of the reaction chamber, the pressure is controlled to decrease according to a preset pressure reduction value until the current pressure in the reaction chamber reaches the lower limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves.

[0146] In this embodiment, a power sensor monitors the discharge power value of the reaction chamber in real time and converts it into a digital signal for processing and analysis. The working principle of the power sensor is similar to that described above, converting the physical quantity of power into an electrical signal, which is then processed and converted for the control system to read. Pre-stored upper and lower limit pressure curve data are read from the storage unit. These data record the upper and lower pressure limits corresponding to different discharge power values. Based on the currently monitored discharge power value, the lower limit pressure value corresponding to the current discharge power is determined by searching the upper and lower limit pressure curves.

[0147] The setting of the preset pressure reduction value needs to comprehensively consider the process's pressure requirements and the performance of the gas supply system. If the process is sensitive to pressure changes, and rapid pressure changes may affect the process performance, then the preset pressure reduction value should be set relatively small. Conversely, if the process has a high tolerance for pressure changes, and in order to improve cooling efficiency, the preset pressure reduction value can be appropriately increased. For example, in a chemical vapor deposition process, the preset pressure reduction value might be set to 1 Torr / cycle; while in some simple material heating processes, the preset pressure reduction value can be set to 5 Torr / cycle.

[0148] At the same time, the preset pressure reduction value must be matched with the response speed and control accuracy of the gas supply system. If the gas supply system can quickly and accurately adjust the gas flow rate to control the pressure, then the preset pressure reduction value can be appropriately increased; conversely, the preset pressure reduction value should be decreased to ensure the stability and accuracy of pressure adjustment.

[0149] Until the discharge power and pressure in the reaction chamber reach their final cooling values.

[0150] In this embodiment, a cyclic structure is used to alternately execute the two steps described above. After completing the step of reducing the discharge power according to the current pressure, the control system automatically switches to the step of reducing the pressure according to the current discharge power, and vice versa. This alternating execution method can gradually and smoothly reduce the discharge power and pressure of the reaction chamber to the final value required for cooling.

[0151] After each adjustment of the discharge power or pressure, the current actual discharge power and pressure values are monitored in real time and compared with the preset final temperature reduction values. The final temperature reduction values are determined according to specific process requirements and the safe operating range of the equipment. When the actual discharge power and pressure values reach or are lower than the final temperature reduction values simultaneously, the control system determines that the final stage of temperature reduction has been reached, stops the operation of alternately reducing the pressure and discharge power, and completes the temperature reduction process. For example, if the final temperature reduction values are set to a discharge power of 100 W and a pressure of 20 Torr, when the actually monitored discharge power is 98 W and the pressure is 19 Torr, the control system considers that the final temperature reduction values have been reached and stops the control operation.

[0152] Exemplarily, (1) when the set values of the final pressure and power for temperature reduction are not within the ranges of y1 - y2 and y3 - y4 relative to each other, the power set value is forced to be adjusted to y2; (2) first, according to the current pressure, the power is controlled to be reduced to a reduced value within the range of y1 - y2 (the reduced value is different for each process each time), and when the reduced value < y2, it is reduced to y2; (3) after the actual power reaches the reduced value, then according to the current discharge power, the pressure is controlled to be reduced to a reduced value within the range of y3 - y4 (the reduced value is different for each process each time), and when the reduced value < y4, it is reduced to y4; (4) steps (1) and (2) are repeated until the pressure and power reach the final temperature reduction values.

[0153] In a preferred embodiment, the upper and lower limit power curves include:

[0154] Upper limit power curve: ; Lower limit power curve: ; where x1 is the pressure in the reaction chamber, y1 and y2 are the discharge powers respectively, y1 and y2 are the upper limit discharge power and the lower limit discharge power for the same pressure in the reaction chamber, a1, b1, c1, d1, e1 are all parameters obtained by fitting, and a2, b2, c2, d2, e2 are all parameters obtained by fitting.

[0155] In a preferred embodiment, the upper and lower limit pressure curves include:

[0156] Upper limit pressure curve: ; Lower limit pressure curve: ; where x2 is the discharge power, y3 and y4 are the pressures in the reaction chamber respectively, y3 and y4 are the upper limit pressure and the lower limit pressure for the same discharge power, a3, b3, c3, d3, e3 are all parameters obtained by fitting, and a4, b4, c4, d4, e4 are all parameters obtained by fitting.

[0157] As shown in Table 1, the lower limit and upper limit of power can be obtained by experimenting with different pressures and optimal powers:

[0158] Table 1

[0159]

[0160]

[0161] Using the pressure, optimal power, lower power limit, and upper power limit shown in Table 1, upper and lower limit pressure curves and upper and lower limit power curves are obtained through fitting. For example, a1, b1, c1, d1, and e1 can be respectively: a1 is... b1 is c1 is -0.0193, d1 is 31.923, e1 is 377.09; and a2, b2, c2, d2, e2 can be respectively: a2 is b2 is c2 is -0.0455, d2 is 29.996, and e2 is 294.17. Meanwhile, a3, b3, c3, d3, and e3 can be respectively: a3 is... b3 is c3 is d3 is 0.0154, e3 is -4.2561; and a4, b4, c4, d4, e4 can be respectively: a4 is b4 is c4 is d4 is 0.019, e4 is -4.1996, and thus we obtain the following... Figure 3 and Figure 4 The upper and lower limit pressure curves and the upper and lower limit power curves.

[0162] This invention provides a glow discharge control device, see [link to relevant documentation]. Figure 5 As shown, the device includes:

[0163] The receiving module 510 is configured to respond to the start operation of glow discharge, receive the set discharge power and set pressure of the reaction chamber input through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and then control the automatic temperature rise. The upper and lower limit power curves and the upper and lower limit pressure curves are obtained based on the optimal discharge power, minimum discharge power and maximum discharge power that meet the optimal glow discharge region obtained by testing under different pressures.

[0164] The heating control module 520 is configured to, during the automatic heating process, acquire the temperature of the sample stage in the reaction chamber using an infrared thermometer installed in the reaction chamber, and based on the upper and lower limit power curves and the upper and lower limit pressure curves, alternately increase the pressure and the discharge power according to the current discharge power and the current pressure in the reaction chamber, until the discharge power and the pressure in the reaction chamber reach the final heating value, and then enter the continuous control process;

[0165] The continuous control module 530 is configured to maintain the temperature inside the reaction chamber during the continuous control process based on the received upper and lower temperature limits input through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower limit power curves, and the upper and lower limit pressure curves.

[0166] The cooling control module 540 is configured to, in response to entering the automatic cooling process, alternately reduce the pressure and the discharge power based on the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power and the current pressure in the reaction chamber, until the discharge power and the pressure in the reaction chamber reach the final cooling value.

[0167] In a preferred embodiment, the receiving module 510 is configured as follows:

[0168] In response to the activation operation of the glow discharge, a first set pressure input through the operation panel is received, wherein the first set pressure is less than a first preset pressure threshold.

[0169] According to the first set pressure, the pressure in the reaction chamber is continuously increased, and during the continuous increase of the pressure, the input of the set discharge power of the reaction chamber through the operation panel is prohibited until the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, wherein the first preset pressure threshold is greater than the second preset pressure threshold.

[0170] When the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, the system receives the set discharge power and set pressure of the reaction chamber input through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and then controls the automatic temperature rise.

[0171] In a preferred embodiment, the receiving module 510 is configured as follows:

[0172] If the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, and the discharge power is less than the preset power threshold, then a set discharge power is received, which is between the upper and lower limits of the discharge power relative to the pressure and set by the operation panel. The upper and lower limits of the power are determined according to the upper and lower limit power curves of the discharge power relative to the pressure.

[0173] If the discharge power is greater than or equal to the preset power threshold, and the pressure in the reaction chamber is less than the second preset pressure threshold, the system receives a set pressure set by the operation panel between the pressure corresponding to the current discharge power and the upper and lower limit pressures of the discharge power. The upper and lower limit pressures are determined based on the upper and lower limit pressure curves of the pressure relative to the discharge power.

[0174] The automatic temperature rise is initiated when the discharge power and pressure of the reaction chamber meet the automatic control conditions. The automatic control conditions include that the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold and the discharge power is greater than or equal to the preset power threshold.

[0175] In a preferred embodiment, the temperature control module 520 is configured as follows:

[0176] Perform the following steps alternately:

[0177] Based on the current discharge power of the reaction chamber, the pressure is controlled to increase according to a preset pressure increase value until the current pressure in the reaction chamber reaches the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves.

[0178] Based on the current pressure of the reaction chamber, the discharge power is controlled to increase according to a preset power increase value until the current discharge power of the reaction chamber reaches the upper limit power corresponding to the current pressure in the upper and lower limit power curves.

[0179] The process continues until the discharge power and pressure in the reaction chamber reach their final heating values, at which point the process enters a continuous control phase.

[0180] In a preferred embodiment, the continuous control module 530 is configured as follows:

[0181] During the continuous control process, if the temperature inside the reaction chamber is higher than the upper temperature limit, the following steps are repeated until the temperature inside the reaction chamber is lower than the upper temperature limit, at which point the current control is stopped:

[0182] According to a first interval, the discharge power is reduced by a first preset power change amount until the number of times the discharge power is reduced reaches a first threshold, or the temperature in the reaction chamber is lower than the upper temperature limit, or the discharge power is reduced to the lower limit power corresponding to the current pressure in the upper and lower limit power curves. If the number of times the discharge power is reduced reaches the first threshold or the discharge power is reduced to the lower limit power corresponding to the current pressure in the upper and lower limit power curves, and the temperature in the reaction chamber is still higher than the upper temperature limit, then according to a second interval, the pressure is reduced by a first preset pressure change amount until the number of times the pressure is reduced reaches a second threshold, or the temperature in the reaction chamber is lower than the upper temperature limit, or the pressure is reduced to the lower limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves.

[0183] During the continuous control process, if the temperature inside the reaction chamber is lower than the lower limit, the following steps are repeated until the temperature inside the reaction chamber is higher than the lower limit, at which point the current control is stopped:

[0184] According to the third interval, the pressure is increased by the second preset pressure change amount until the number of times the pressure is increased reaches the third threshold, or the temperature in the reaction chamber is higher than the lower limit, or the pressure increases to the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves. If the number of times the pressure is increased reaches the third threshold, or the pressure increases to the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves, and the temperature in the reaction chamber is still lower than the lower limit, then according to the fourth interval, the discharge power is increased by the second preset power change amount until the number of times the discharge power is increased reaches the fourth threshold, or the temperature in the reaction chamber is higher than the lower limit, or the discharge power increases to the upper limit pressure corresponding to the current pressure in the upper and lower limit power curves.

[0185] In a preferred embodiment, the cooling control module 540 is configured as follows:

[0186] Perform the following steps alternately:

[0187] Based on the current pressure of the reaction chamber, the discharge power is controlled to decrease according to a preset power reduction value until the current discharge power of the reaction chamber reaches the lower limit power corresponding to the current pressure in the upper and lower limit power curves.

[0188] Based on the current discharge power of the reaction chamber, the pressure is controlled to decrease according to a preset pressure reduction value until the current pressure in the reaction chamber reaches the lower limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves.

[0189] Until the discharge power and pressure in the reaction chamber reach their final cooling values.

[0190] In a preferred embodiment, the upper and lower limit power curves include:

[0191] Upper limit power curve: Lower limit power curve: Where x1 is the pressure inside the reaction chamber, y1 and y2 are the discharge power, y1 and y2 are the upper limit discharge power and lower limit discharge power for the same pressure inside the reaction chamber, a1, b1, c1, d1 and e1 are all fitted parameters, and a2, b2, c2, d2 and e2 are all fitted parameters.

[0192] In a preferred embodiment, the upper and lower pressure limit curves include:

[0193] Upper limit pressure curve: Lower limit pressure curve: Where x2 is the discharge power, y3 and y4 are the pressures inside the reaction chamber, y3 and y4 are the upper and lower pressure limits for the same discharge power, a3, b3, c3, d3, and e3 are all fitted parameters, and a4, b4, c4, d4, and e4 are all fitted parameters.

[0194] This invention provides an electronic device, comprising:

[0195] Processor, machine-readable storage medium;

[0196] The machine-readable storage medium is connected to the processor. The machine-readable storage medium is used to store programs, instructions, or code. The processor is used to execute the programs, instructions, or code in the machine-readable storage medium to implement the method described in any of the foregoing embodiments.

[0197] Figure 6 The glow discharge control device 100 shown includes a processor 1001 and a memory 1003. The processor 1001 and the memory 1003 are connected, for example, via a bus 1002. Optionally, the glow discharge control device 100 may further include a communication component 1004, which can be used for data interaction between the device 100 and other devices, such as data transmission and / or data reception. It should be noted that in actual scheduling, the communication component 1004 is not limited to one, and the structure of this glow discharge control device 100 does not constitute a limitation on the embodiments of this application.

[0198] Processor 1001 may be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. It can implement or execute the various exemplary logic blocks, modules, and circuits described in conjunction with the disclosure of this application. Processor 1001 may also be a combination that implements computing functions, such as including one or more microprocessor combinations, a combination of a DSP and a microprocessor, etc.

[0199] Bus 1002 may include a pathway for transmitting information between the aforementioned components. Bus 1002 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. Bus 1002 can be divided into address bus, data bus, control bus, etc. For ease of representation, Figure 6 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.

[0200] The memory 1003 may be ROM (Read Only Memory) or other types of static storage devices capable of storing static information and instructions, RAM (Random Access Memory) or other types of dynamic storage devices capable of storing information and instructions, or EEPROM (Electrically Erasable Programmable Read Only Memory), CD-ROM (Compact Disc Read Only Memory) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital universal optical discs, Blu-ray discs, etc.), magnetic disk storage media, other magnetic storage devices, or any other medium capable of carrying or storing program code and capable of being read by a computer, without limitation herein.

[0201] The memory 1003 is used to store program code for executing the embodiments of this disclosure, and its execution is controlled by the processor 1001. The processor 1001 is used to execute the program code stored in the memory 1003 to implement the steps shown in the foregoing embodiments of the glow discharge control method.

[0202] The preferred embodiments of the present disclosure have been described in detail above with reference to the accompanying drawings. However, the present disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present disclosure, various changes, modifications, substitutions and variations can be made to these embodiments, and all such changes, modifications, substitutions and variations fall within the protection scope of the present disclosure.

[0203] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction, and such combinations should also be considered as part of this disclosure. To avoid unnecessary repetition, this disclosure will not further describe the various possible combinations. The technical scope of this application is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A glow discharge control method, characterized in that, The method includes: In response to the start-up operation of glow discharge, the system receives the set discharge power and set pressure of the reaction chamber input through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves. The system continues to control the automatic temperature rise until the discharge power and pressure of the reaction chamber meet the automatic control conditions. The upper and lower limit power curves and the upper and lower limit pressure curves are obtained based on the optimal discharge power, minimum discharge power and maximum discharge power that meet the optimal glow discharge region obtained by testing under different pressures. During the automatic temperature control process, the temperature of the sample stage in the reaction chamber is obtained by an infrared thermometer installed in the reaction chamber. Based on the upper and lower limit power curves and the upper and lower limit pressure curves, the pressure and the discharge power are alternately increased according to the current discharge power and the current pressure in the reaction chamber until the discharge power and the pressure in the reaction chamber reach the final temperature value, and then the continuous control process begins. During the continuous control process, the temperature inside the reaction chamber is maintained based on the received upper and lower temperature limits input through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower limit power curves, and the upper and lower limit pressure curves. In response to entering the automatic control cooling process, based on the upper and lower limit power curves and the upper and lower limit pressure curves, and according to the current discharge power and the current pressure in the reaction chamber, the pressure and the discharge power are alternately reduced until the discharge power and the pressure in the reaction chamber reach the final cooling value.

2. The glow discharge control method according to claim 1, characterized in that, The response to the glow discharge start-up operation receives the set discharge power and set pressure of the reaction chamber input via the operation panel, and controls the automatic temperature rise until the discharge power and pressure of the reaction chamber meet the automatic control conditions, including: In response to the activation operation of the glow discharge, a first set pressure input through the operation panel is received, wherein the first set pressure is less than a first preset pressure threshold. According to the first set pressure, the pressure in the reaction chamber is continuously increased, and during the continuous increase of the pressure, the input of the set discharge power of the reaction chamber through the operation panel is prohibited until the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, wherein the first preset pressure threshold is greater than the second preset pressure threshold. When the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, the system receives the set discharge power and set pressure of the reaction chamber input through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and then controls the automatic temperature rise.

3. The glow discharge control method according to claim 2, characterized in that, When the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, the system receives the set discharge power and set pressure of the reaction chamber input via the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and then controls the system to enter automatic temperature control mode, including: If the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, and the discharge power is less than the preset power threshold, then a set discharge power is received, which is between the upper and lower limits of the discharge power relative to the pressure and set by the operation panel. The upper and lower limits of the power are determined according to the upper and lower limit power curves of the discharge power relative to the pressure. If the discharge power is greater than or equal to the preset power threshold, and the pressure in the reaction chamber is less than the second preset pressure threshold, the system receives a set pressure set by the operation panel between the pressure corresponding to the current discharge power and the upper and lower limit pressures of the discharge power. The upper and lower limit pressures are determined based on the upper and lower limit pressure curves of the pressure relative to the discharge power. The automatic temperature rise is initiated when the discharge power and pressure of the reaction chamber meet the automatic control conditions. The automatic control conditions include that the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold and the discharge power is greater than or equal to the preset power threshold.

4. The glow discharge control method according to claim 1, characterized in that, Based on the upper and lower limit power curves and the upper and lower limit pressure curves, and according to the current discharge power and current pressure in the reaction chamber, the pressure and discharge power are alternately increased until the discharge power and pressure in the reaction chamber reach the final value for temperature rise, and then a continuous control process is entered, including: Perform the following steps alternately: Based on the current discharge power of the reaction chamber, the pressure is controlled to increase according to a preset pressure increase value until the current pressure in the reaction chamber reaches the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves. Based on the current pressure of the reaction chamber, the discharge power is controlled to increase according to a preset power increase value until the current discharge power of the reaction chamber reaches the upper limit power corresponding to the current pressure in the upper and lower limit power curves. The process continues until the discharge power and pressure in the reaction chamber reach their final heating values, at which point the continuous control process begins.

5. The glow discharge control method according to claim 1, characterized in that, During the continuous control process, maintaining the temperature within the reaction chamber based on the received upper and lower temperature limits input via the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower limit power curves, and the upper and lower limit pressure curves includes: During the continuous control process, if the temperature inside the reaction chamber is higher than the upper temperature limit, the following steps are repeated until the temperature inside the reaction chamber is lower than the upper temperature limit, at which point the current control is stopped: According to a first interval, the discharge power is reduced by a first preset power change amount until the number of times the discharge power is reduced reaches a first threshold, or the temperature in the reaction chamber is lower than the upper temperature limit, or the discharge power is reduced to the lower limit power corresponding to the current pressure in the upper and lower limit power curves. If the number of times the discharge power is reduced reaches the first threshold or the discharge power is reduced to the lower limit power corresponding to the current pressure in the upper and lower limit power curves, and the temperature in the reaction chamber is still higher than the upper temperature limit, then according to a second interval, the pressure is reduced by a first preset pressure change amount until the number of times the pressure is reduced reaches a second threshold, or the temperature in the reaction chamber is lower than the upper temperature limit, or the pressure is reduced to the lower limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves. During the continuous control process, if the temperature inside the reaction chamber is lower than the lower limit, the following steps are repeated until the temperature inside the reaction chamber is higher than the lower limit, at which point the current control is stopped: According to the third interval, the pressure is increased by the second preset pressure change amount until the number of times the pressure is increased reaches the third threshold, or the temperature in the reaction chamber is higher than the lower limit, or the pressure increases to the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves. If the number of times the pressure is increased reaches the third threshold, or the pressure increases to the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves, and the temperature in the reaction chamber is still lower than the lower limit, then according to the fourth interval, the discharge power is increased by the second preset power change amount until the number of times the discharge power is increased reaches the fourth threshold, or the temperature in the reaction chamber is higher than the lower limit, or the discharge power increases to the upper limit pressure corresponding to the current pressure in the upper and lower limit power curves.

6. The glow discharge control method according to claim 1, characterized in that, Based on the upper and lower limit power curves and the upper and lower limit pressure curves, and according to the current discharge power and current pressure within the reaction chamber, the pressure and discharge power are alternately decreased until the discharge power and pressure of the reaction chamber reach their final cooling values, including: Perform the following steps alternately: Based on the current pressure of the reaction chamber, the discharge power is controlled to decrease according to a preset power reduction value until the current discharge power of the reaction chamber reaches the lower limit power corresponding to the current pressure in the upper and lower limit power curves. Based on the current discharge power of the reaction chamber, the pressure is controlled to decrease according to a preset pressure reduction value until the current pressure in the reaction chamber reaches the lower limit pressure corresponding to the current discharge power in the upper and lower limit pressure curves. Until the discharge power and pressure in the reaction chamber reach their final cooling values.

7. The glow discharge control method according to any one of claims 1-6, characterized in that, The upper and lower limit power curves include: Upper limit power curve: Lower limit power curve: ; Where x1 is the pressure inside the reaction chamber, y1 and y2 are the discharge power, y1 and y2 are the upper limit discharge power and lower limit discharge power for the same pressure inside the reaction chamber, a1, b1, c1, d1 and e1 are all fitted parameters, and a2, b2, c2, d2 and e2 are all fitted parameters.

8. The glow discharge control method according to any one of claims 1-6, characterized in that, The upper and lower pressure limit curves include: Upper limit pressure curve: Lower limit pressure curve: ; Where x2 is the discharge power, y3 and y4 are the pressures inside the reaction chamber, y3 and y4 are the upper and lower pressure limits for the same discharge power, a3, b3, c3, d3, and e3 are all fitted parameters, and a4, b4, c4, d4, and e4 are all fitted parameters.

9. A glow discharge control device, characterized in that, The device includes: The receiving module is configured to respond to the start operation of glow discharge, receive the set discharge power and set pressure of the reaction chamber input through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and then control the automatic temperature rise. The upper and lower limit power curves and the upper and lower limit pressure curves are obtained based on the optimal discharge power, minimum discharge power and maximum discharge power that conform to the optimal glow discharge region obtained by testing under different pressures. The heating control module is configured to, during the automatic heating process, acquire the temperature of the sample stage in the reaction chamber using an infrared thermometer installed in the reaction chamber, and based on the upper and lower limit power curves and the upper and lower limit pressure curves, alternately increase the pressure and the discharge power according to the current discharge power and the current pressure in the reaction chamber, until the discharge power and the pressure in the reaction chamber reach the final heating value, and then enter the continuous control process; A continuous control module is configured to maintain the temperature inside the reaction chamber during the continuous control process based on the received upper and lower temperature limits input through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower limit power curves, and the upper and lower limit pressure curves. The cooling control module is configured to, in response to entering the automatic cooling process, based on the upper and lower limit power curves and the upper and lower limit pressure curves, alternately decrease the pressure and the discharge power according to the current discharge power and the current pressure in the reaction chamber, until the discharge power and the pressure in the reaction chamber reach the final cooling value.

10. An electronic device, characterized in that, include: Processor, machine-readable storage medium; The machine-readable storage medium is connected to the processor, the machine-readable storage medium is used to store programs, instructions or code, and the processor is used to execute the programs, instructions or code in the machine-readable storage medium to implement the method of any one of claims 1-8.

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