Upper capillary interlayer type temperature equalizing device

By adopting a double-layer plate design and sandwiching a capillary layer on the temperature equalizer, the problem of difficult capillary tissue backflow is solved, and more efficient heat conduction and thermal management are achieved.

CN120651036APending Publication Date: 2025-09-16MICROLOOPS HUIZHOU CORP +1
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Patent Information

Application Number
CN202410297160.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-03-15
Publication Date
2025-09-16

AI Technical Summary

Technical Problem

The capillary structure in the upper plate of the existing temperature homogenizing plate is easily affected by the vaporized working fluid and is not easy to flow back, resulting in low heat conduction efficiency.

Method used

A double-layer plate design is adopted, with a capillary layer sandwiched, and a connecting edge is set between the lower capillary tissue and the sandwiched capillary layer, so that the capillary layer is conducive to reflux, and the tube part and the tube capillary tissue are combined to enhance the reflux effect.

Benefits of technology

The reflux efficiency of the liquid working fluid is improved, the heat conduction effect is enhanced, and the thermal management performance of the temperature vapor chamber is improved.

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Abstract

An upper capillary interlayer type temperature equalizing device comprises a lower plate part and an upper plate part, the upper plate part covers the lower plate part, and a cavity is formed between the lower plate part and the upper plate part. The upper plate part further comprises an outer plate piece, at least one inner plate piece which is overlapped with the outer plate piece and is positioned in the cavity, and at least one clamping capillary layer which is clamped between the outer plate piece and the inner plate piece; wherein the lower plate part is provided with a lower capillary tissue located in the cavity, a connecting edge protruding out of the periphery of the inner plate is formed at the position, opposite to the periphery of the inner plate, of the clamping capillary layer, and the connecting edge makes contact with the lower capillary tissue. Therefore, the upper plate part is provided with the outer plate piece and the inner plate piece, so that the clamping capillary layer can ensure that the liquid working fluid flows back.
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Description

Technical Field

[0001] The present invention relates to a heat exchanger, in particular to an upper capillary sandwich type temperature equalizing device. Background Art

[0002] The existing heat spreader mainly has a capillary structure in both the upper and lower plates. When the working fluid inside the heat spreader undergoes a vapor phase change when heated, the heat is quickly transferred from the heated lower plate to the upper plate. After condensation on the upper plate, the vaporized working fluid returns to a liquid state and then flows back to the lower plate through the capillary structure.

[0003] However, the capillary structure in the upper plate of the conventional temperature vaporizer is often easily affected by the vaporized working fluid and is difficult to flow back, so it needs to be improved. Summary of the Invention

[0004] The main purpose of the present invention is to provide an upper capillary sandwich type temperature equalizing device, which makes the upper plate of the temperature equalizing plate be designed with a double-layer plate so as to sandwich at least one capillary layer, so that the capillary layer can be conducive to backflow through the setting of the double-layer plate.

[0005] To achieve the above-mentioned objectives, the present invention provides an upper capillary sandwich temperature equalizing device, comprising a lower plate portion and an upper plate portion, wherein the upper plate portion and the lower plate portion overlap and form a chamber between the lower plate portion and the upper plate portion, wherein the upper plate portion further comprises an outer plate, at least one inner plate portion overlapping the outer plate portion and located within the chamber, and at least one sandwiched capillary layer sandwiched between the outer plate portion and the inner plate portion; wherein a lower capillary structure is provided on the lower plate portion and located within the chamber, and the sandwiched capillary layer has a connecting edge formed at a periphery of the inner plate portion relative to the periphery of the inner plate portion, protruding beyond the periphery of the inner plate portion, and the connecting edge contacts the lower capillary structure.

[0006] Optionally, the lower capillary tissue is further provided with a lateral portion covering the inner wall of the chamber periphery, wherein the lateral portion cooperates with the inner wall of the chamber periphery and extends toward the outer plate to contact the connecting edge.

[0007] Optionally, an upper capillary structure is provided on the inner plate.

[0008] Optionally, the periphery of the upper capillary tissue contacts the lower capillary tissue.

[0009] Optionally, it further includes at least one tube portion having a closed end and an open end, and the outer plate is provided with at least one connecting hole connected to the open end.

[0010] Optionally, a capillary tissue is provided in the tube portion.

[0011] Optionally, the tube capillary tissue extends a flange from the open end of the tube portion, and the sandwiched capillary layer is provided with at least one connecting hole corresponding to the connecting hole, the size of the connecting hole is smaller than the outer diameter of the flange so that the sandwiched capillary layer is in contact with the tube capillary tissue.

[0012] Optionally, the inner plate of the upper plate portion is further provided with at least one through hole corresponding to the connecting hole so that the chamber is in communication with the interior of the tube portion.

[0013] Optionally, the tube portion forms a tube end outside the flange of the tube capillary structure, and the tube end is engaged with the inner plate.

[0014] Optionally, the interposed capillary layer and the tube capillary tissue are both made of woven meshes. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a perspective exploded view of the first embodiment of the present invention.

[0016] Figure 2 This is a three-dimensional exploded view of the upper plate portion of the present invention from another perspective.

[0017] Figure 3 This is a schematic cross-sectional diagram of the first embodiment of the present invention.

[0018] Figure 4 This is a cross-sectional schematic diagram of the second embodiment of the present invention.

[0019] Figure 5 It is a cross-sectional exploded schematic diagram of the third embodiment of the present invention.

[0020] Figure 6 It is a cross-sectional combined schematic diagram of the third embodiment of the present invention.

[0021] Figure 7 It is a cross-sectional combined schematic diagram of the fourth embodiment of the present invention.

[0022] In the picture: 1: lower plate; 10: lower capillary tissue; 10a: lateral portion; 2: upper plate; 20: outer plate; 20a: connecting hole; 21: inner plate; 21a: through hole; 22: sandwiched capillary layer; 22a: connecting edge; 22b: connecting hole; 23: upper capillary tissue; 3: tube; 3a: closed end; 3b: open end; 3c: tube end; 30: tube capillary tissue; 30a: flange; A: chamber. DETAILED DESCRIPTION

[0023] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0024] See also Figure 1 The figure is a perspective exploded view of the first embodiment of the present invention. The present invention provides an upper capillary sandwich type temperature equalizing device, comprising a lower plate portion 1 and an upper plate portion 2 covering the lower plate portion 1; wherein: like Figure 1 and Figure 3 As shown, the lower plate portion 1 is used to contact a heat source (not shown) and can be overlapped with the upper plate portion 2 to form a chamber A between the lower plate portion 1 and the upper plate portion 2. Specifically, a recessed shape can be formed on the lower plate portion 1 so that when it overlaps the upper plate portion 2, the recessed shape is covered by the upper plate portion 2 and sealed with the lower plate portion 1, thereby forming the chamber A. In addition, the lower plate portion 1 is provided with a lower capillary structure 10. The lower capillary structure 10 is located in the chamber A and can be composed of a woven mesh, powder sintering, or grooves formed on the surface of the lower plate portion 1.

[0025] Please also refer to Figures 1 to 3 As shown, the upper plate portion 2 includes an outer plate 20, at least one inner plate 21 overlapping the outer plate 20 and having holes, and at least one sandwiched capillary layer 22 sandwiched between the outer plate 20 and the inner plate 21. The sandwiched capillary layer 22 can be composed of a woven mesh and has a connecting edge 22a protruding outside the peripheral edge of the inner plate 21 formed relative to the peripheral edge of the inner plate 21; in other words, the sandwiched capillary layer 22 is larger in outer dimensions than the inner plate 21, so that it can have the connecting edge 22a protruding outside the peripheral edge of the inner plate 21, and when the upper plate portion 2 and the lower plate portion 1 are covered, the sandwiched capillary layer 22 is in contact with the lower capillary tissue 10 with its connecting edge 22a. In the embodiment of the present invention, the lower capillary structure 10 is further provided with a lateral portion 10a that covers the inner wall of the periphery of the chamber A. The lateral portion 10a cooperates with the inner wall of the periphery of the chamber A and extends toward the outer plate 20 of the upper plate portion 2 to contact the connecting edge 22a of the sandwiched capillary layer 22.

[0026] In addition, if Figure 4 As shown, in the second embodiment of the present invention, an upper capillary structure 23 can be further provided on the inner plate 21 of the upper plate portion 2. The upper capillary structure 23 is located on a surface of the inner plate 21 opposite to the lower plate portion 1 and can be composed of a woven mesh, powder sintering, or grooves formed on the surface of the inner plate 21. Preferably, the periphery of the upper capillary structure 23 also contacts the lower capillary structure 10, or further contacts the lateral portion 10a of the lower capillary structure 10.

[0027] Therefore, by adopting the above-mentioned structure, the capillary sandwich type temperature equalizing device of the present invention can be obtained.

[0028] In addition, if Figure 5 and Figure 6As shown, in the third embodiment of the present invention, the present invention may further include at least one tube portion 3 having a closed end 3a and an open end 3b. A capillary structure 30 is disposed within the tube portion 3. The capillary structure 30 may be a woven mesh, with a flange 30a extending from the open end 3b of the tube portion 3. The outer plate 20 of the upper plate portion 2 is provided with at least one connecting hole 20a for communication with the open end 3b of the tube portion 3. The size of the connecting hole 20a closely matches the open end 3b of the tube portion 3. Furthermore, the interposed capillary layer 22 of the upper plate portion 2 is provided with at least one connecting hole 22b corresponding to the connecting hole 20a. The size of the connecting hole 22b is smaller than the outer diameter of the flange 30a, so that the capillary structure 30 can contact the connecting hole 22b of the interposed capillary layer 22 through its flange 30a. The contact effect is achieved by both being made of woven mesh material and having a certain degree of plasticity. In addition, the inner plate 21 of the upper plate portion 2 is further provided with at least one through hole 21a corresponding to the connecting hole 22b, so that the chamber A formed by the lower plate portion 1 and the upper plate portion 2 can be connected to the tube portion 3; at this time, the inner plate 21 may not have or be provided with a structure such as a hole.

[0029] Furthermore, if Figure 7 As shown, in the fourth embodiment of the present invention, the tube portion 3 can also form a tube end 3c outside the flange 30a of the above-mentioned tubular capillary structure 30. The tube end 3c can be a part of the tube portion 3, and after the flange 30a is exposed by methods such as annular cutting, the smaller connecting hole 22b can be extended into and contact the flange 30a, and the tube end 3c is connected to the inner plate 21 in a ladder-like or vertical direction so that the tube portion 3 can be fixed on the connecting hole 20a of the upper plate portion 2.

[0030] Therefore, with the present invention's upper capillary sandwich-type temperature equalization device, the upper plate portion 2 of the temperature equalization plate is arranged through an outer plate 20 and an inner plate 21, thereby sandwiching a capillary layer 22 between the outer plate 20 and the inner plate 21, thereby ensuring the return flow of the liquid working fluid. Furthermore, the present invention can further incorporate a tube portion 3, such as a heat pipe, into the upper plate portion 2 to form a temperature equalization device commonly known as a "3D temperature equalization plate." This further facilitates the return flow of the capillary structure 30 within the tube portion 3 with the sandwiched capillary layer 22 of the upper plate portion 2.

[0031] The above embodiments are merely preferred embodiments for the purpose of fully illustrating the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are within the scope of protection of the present invention. The scope of protection of the present invention shall be subject to the claims.

Claims

1. An upper capillary sandwich type temperature equalizing device, characterized in that: include: Lower the board; as well as an upper plate portion, covering the lower plate portion to form a chamber between the lower plate portion and the upper plate portion, the upper plate portion comprising an outer plate, at least one inner plate portion overlapping the outer plate portion and located within the chamber, and at least one interposed capillary layer interposed between the outer plate portion and the inner plate portion; The lower plate portion is provided with a lower capillary structure in the chamber, and the sandwiched capillary layer is formed with a connecting edge protruding outside the inner plate periphery relative to the inner plate periphery, and the connecting edge contacts the lower capillary structure.

2. The upper capillary sandwich type temperature equalizing device according to claim 1, characterized in that: The lower capillary structure is further provided with a lateral portion covering the inner wall of the chamber periphery. The lateral portion matches the inner wall of the chamber periphery and extends toward the outer plate to contact the connecting edge.

3. The upper capillary sandwich type temperature equalizing device according to claim 1, characterized in that: An upper capillary structure is provided on the inner plate.

4. The upper capillary sandwich type temperature equalizing device according to claim 3, characterized in that: The periphery of the upper capillary tissue contacts the lower capillary tissue.

5. The upper capillary sandwich type temperature equalizing device according to claim 1, characterized in that: The outer plate further comprises at least one tube portion having a closed end and an open end, and the outer plate is provided with at least one connecting hole connected to the open end.

6. The upper capillary sandwich type temperature equalizing device according to claim 5, characterized in that: A capillary tissue is arranged in the tube portion.

7. The upper capillary sandwich type temperature equalizing device according to claim 6, characterized in that: The capillary tube structure extends a flange from the open end of the tube portion, and the sandwiched capillary layer is provided with at least one connecting hole corresponding to the connecting hole. The size of the connecting hole is smaller than the outer diameter of the flange so that the sandwiched capillary layer contacts the capillary tube structure.

8. The upper capillary sandwich type temperature equalizing device according to claim 7, characterized in that: The inner plate of the upper plate portion is further provided with at least one through hole corresponding to the connecting hole so that the chamber is communicated with the interior of the tube portion.

9. The upper capillary sandwich type temperature equalizing device according to claim 8, characterized in that: The tube portion forms a tube end outside the flange of the tube capillary structure, and the tube end is connected with the inner plate.

10. The upper capillary sandwich type temperature equalizing device according to any one of claims 6 to 9, characterized in that: The sandwiched capillary layer and the tube capillary structure are both made of woven mesh.