Digital converter and method of manufacturing the same

Abstract

A digital converter and a method of manufacturing the same are disclosed. The digital converter includes: a base layer including a folded portion, a first non-folded portion, and a second non-folded portion spaced apart from the first non-folded portion in a first direction, the folded portion being interposed between the first non-folded portion and the second non-folded portion, in which the folded portion includes a plurality of through holes; a guide pattern disposed on the base layer in the folded portion and surrounding at least a portion of each of the plurality of through holes in a plan view; and a sensing line disposed on the base layer in the folded portion, positioned between the plurality of through-holes in a plan view, and bent along edges of the plurality of through-holes.

Description

Technical Field

[0001] The present disclosure generally relates to a digitizer and, more particularly, to a digitizer and a method of manufacturing the digitizer. Background Art

[0002] With the advancement of information technology, display devices have become increasingly important as an interface between users and information. For example, the use of display devices such as liquid crystal display (LCD) devices, organic light emitting display (OLED) devices, plasma display panel (PDP) devices, and quantum dot display devices is increasing.

[0003] The display device may include a digitizer that detects external input. For example, the digitizer may be operable using electromagnetic resonance (EMR) and may include various sensing coils activated by electrical signals. Summary of the Invention

[0004] Embodiments of the present disclosure provide a digitizer having a guide pattern designed to prevent cracks in a sensing line located at a folded portion.

[0005] An embodiment of the present disclosure provides a method for manufacturing the digitizer.

[0006] According to an embodiment of the present disclosure, a digitizer includes: a base layer including a folded portion, a first non-folded portion, and a second non-folded portion spaced apart from the first non-folded portion in a first direction, and the folded portion is interposed between the first non-folded portion and the second non-folded portion, wherein the folded portion includes a plurality of through holes; a guide pattern provided on the base layer at the folded portion and surrounding at least a portion of each of the plurality of through holes in a plan view; and a sensing line provided on the base layer at the folded portion, positioned between the plurality of through holes in a plan view, and bent along edges of the plurality of through holes.

[0007] The base layer includes: an intermediate base layer; an upper base layer disposed above the intermediate base layer; and a lower base layer disposed below the intermediate base layer.

[0008] The sensing lines include: a first upper sensing line disposed on the upper surface of the middle base layer; a second upper sensing line disposed on the upper surface of the upper base layer; a first lower sensing line disposed on the lower surface of the middle base layer; and a second lower sensing line disposed on the lower surface of the lower base layer.

[0009] The digitizer further includes: a dummy line disposed in the first non-folding portion and the second non-folding portion and extending in the first direction, wherein the dummy line is disposed only on the upper substrate layer.

[0010] The guide pattern completely surrounds each of the plurality of through holes in a plan view.

[0011] The sensing line includes a bent pattern having a predetermined curvature in a plan view. Each of the plurality of through holes includes an end portion having the predetermined curvature, and the guide pattern has a shape corresponding to the shape of the bent pattern and surrounds the end portion.

[0012] A method for manufacturing a digital converter according to an embodiment of the present disclosure includes: providing a base layer including a folded portion; forming a plurality of dummy patterns on the base layer at the folded portion; forming a sensing line disposed between the plurality of dummy patterns in a plan view on the base layer at the folded portion; and forming a plurality of through holes and a guide pattern surrounding at least a portion of each of the plurality of through holes by removing a portion of each of the plurality of dummy patterns and a portion of the base layer.

[0013] The base layer further includes a first non-folding portion and a second non-folding portion spaced apart from each other in a first direction, with the folding portion interposed between the first non-folding portion and the second non-folding portion. The method further includes forming a dummy line on the base layer at the first non-folding portion and the second non-folding portion. A sensing line is further formed on the base layer at the first non-folding portion and the second non-folding portion.

[0014] The formation of sensing lines and dummy lines on the base layer at the first non-folded portion and the second non-folded portion includes: forming a first upper sensing line on the upper surface of the intermediate base layer, and forming a first lower sensing line on the lower surface of the intermediate base layer; forming an upper base layer covering the first upper sensing line on top of the intermediate base layer, and forming a lower base layer covering the first lower sensing line under the intermediate base layer; and forming a second upper sensing line and a dummy line spaced apart from the second upper sensing line on the upper surface of the upper base layer, and forming a second lower sensing line on the lower surface of the lower base layer.

[0015] The sensing line includes a bent pattern having a predetermined curvature in a plan view, and each of the dummy patterns includes a head portion adjacent to the bent pattern and a stem portion extending from the head portion.

[0016] In forming the plurality of through holes and the guide pattern, a portion of the head and the entire stem are removed to form the guide pattern, each of the plurality of through holes includes an end portion having a predetermined curvature, and the guide pattern has a shape corresponding to that of the curved pattern and surrounds the end portion.

[0017] A method for manufacturing a digital converter according to an embodiment of the present disclosure includes: providing a base layer including a folded portion; forming a plurality of dummy patterns on the base layer at the folded portion; forming a guide pattern surrounding each of the plurality of dummy patterns in a plan view on the base layer at the folded portion; forming a sensing line arranged between the plurality of dummy patterns in a plan view on the base layer at the folded portion; and forming a plurality of through holes by removing all of the dummy patterns and a portion of the base layer, wherein each of the plurality of through holes is surrounded by the guide pattern.

[0018] In forming the plurality of through holes, all of the plurality of dummy patterns are removed using the inner side of the guide pattern as a boundary.

[0019] The base layer further includes a first non-folding portion and a second non-folding portion spaced apart from each other in a first direction, with the folding portion interposed between the first non-folding portion and the second non-folding portion. The method further includes forming a dummy line on the base layer at the first non-folding portion and the second non-folding portion. A sensing line is further formed on the base layer at the first non-folding portion and the second non-folding portion.

[0020] The formation of sensing lines and dummy lines on the base layer at the first non-folded portion and the second non-folded portion includes: forming a first upper sensing line on the upper surface of the intermediate base layer, and forming a first lower sensing line on the lower surface of the intermediate base layer; forming an upper base layer covering the first upper sensing line on top of the intermediate base layer, and forming a lower base layer covering the first lower sensing line under the intermediate base layer; and forming a second upper sensing line and a dummy line spaced apart from the second upper sensing line on the upper surface of the upper base layer, and forming a second lower sensing line on the lower surface of the lower base layer.

[0021] A digitizer according to an embodiment of the present disclosure may include a base layer having a folded portion including a plurality of through-holes, a guide pattern provided on the base layer at the folded portion and surrounding at least a portion of each through-hole in a plan view, and a sensing line provided on the base layer at the folded portion and extending in a meandering path along an edge of the through-hole. The sensing line may include a meandering pattern having a predetermined curvature in a plan view.

[0022] Because the guide pattern surrounds at least a portion of each via in plan view, folding the digitizer at the folded portion redistributes stress that would otherwise be concentrated on the curved pattern to the guide pattern. This redistribution helps mitigate the occurrence of cracks in the curved pattern of the sensing line. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Illustrative, non-limiting embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0024] Figure 1 is a perspective view illustrating a deployed form of a display device according to an embodiment of the present disclosure.

[0025] Figure 2 and Figure 3 It is an icon Figure 1 A perspective view of a folded form of a display device.

[0026] Figure 4 It is an icon Figure 1 An exploded perspective view of a display device.

[0027] Figure 5 It is an icon Figure 1 sectional view of a display device.

[0028] Figure 6 and Figure 7 is a plan view illustrating a digitizer according to an embodiment of the present disclosure.

[0029] Figure 8 yes Figure 6 An enlarged plan view of area A.

[0030] Figure 9 It is along Figure 8 A cross-sectional view taken along line II'.

[0031] Figure 10 It is along Figure 8 A cross-sectional view taken along line II-II'.

[0032] Figure 11 The diagram is included in Figure 6 Cross-sectional view of the substrate layer in the digitizer.

[0033] Figure 12 It is an icon Figure 11 Floor plan of the basement floor.

[0034] Figure 13 is a plan view illustrating a digitizer according to another embodiment of the present disclosure.

[0035] Figure 14 yes Figure 13 An enlarged plan view of area B.

[0036] Figure 15 It is along Figure 14 A cross-sectional view taken along line III-III'.

[0037] Figure 16 、 Figure 17 、 Figure 18 、 Figure 19 and Figure 20 is a view illustrating a method of manufacturing a digitizer according to an embodiment of the present disclosure.

[0038] Figure 21 、 Figure 22 and Figure 23 is a view illustrating a method of manufacturing a digitizer according to another embodiment of the present disclosure.

[0039] Figure 24 、 Figure 25 、 Figure 26 and Figure 27 is a view illustrating a method of manufacturing a digitizer according to still another embodiment of the present disclosure. DETAILED DESCRIPTION

[0040] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the accompanying drawings, the same reference numerals are used for the same components, and redundant descriptions of these components will be omitted.

[0041] Figure 1 is a perspective view illustrating a deployed form of a display device according to an embodiment of the present disclosure. Figure 2 and Figure 3 It is an icon Figure 1 For example, Figure 2 The diagram is in the inward folded state. Figure 1 A perspective view of the display device, and Figure 3 The diagram is in the folded out form. Figure 1 A perspective view of a display device.

[0042] In this specification, a plane may be defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. For example, the first direction DR1 and the second direction DR2 may be perpendicular to each other. A direction perpendicular to the plane (for example, the thickness direction of the display device DD) may be a third direction DR3. In other words, the third direction DR3 may be perpendicular to each of the first direction DR1 and the second direction DR2.

[0043] Reference Figure 1 、 Figure 2 and Figure 3 , the display device DD according to an embodiment of the present disclosure may include a display area DA, a transmission area TA, and a non-display area NDA.

[0044] The display area DA may be an area that displays an image by generating light or by adjusting the transmittance of light provided from an external light source. A plurality of pixels may be provided in the display area DA. Each of the pixels may generate light based on a drive signal. For example, the pixels may be arranged in a matrix along a first direction DR1 and a second direction DR2.

[0045] The non-display area NDA may be an area where no image is displayed. The non-display area NDA may be positioned at the periphery of the display area DA. The non-display area NDA may surround at least a portion of the display area DA in a plan view. For example, the non-display area NDA may completely surround (e.g., completely enclose) the display area DA in a plan view.

[0046] The transmissive area TA may have a transmittance greater than that of both the display area DA and the non-display area NDA. Natural light, visible light, infrared light, and other types of light may pass through the transmissive area TA and enter the display device DD. The display device DD may further include a sensor that uses visible light passing through the transmissive area TA to capture an external image or uses infrared light passing through the transmissive area TA to detect the approach (or proximity) of an external object. The sensor may overlap with the transmissive area TA in a plan view. The transmissive area TA may be positioned inside the display area DA. However, the present disclosure is not limited thereto, and the transmissive area TA may be positioned inside the non-display area NDA, or may be surrounded by the display area DA and the non-display area NDA.

[0047] like Figure 2 As illustrated in , the display device DD according to an embodiment of the present disclosure may be a foldable display device. For example, the display device DD may be foldable along an imaginary first folding axis AX1 extending in the second direction DR2.

[0048] The display device DD may include a folding area FA folded along a first folding axis AX1 , and first and second non-folding areas NFA1 and NFA2 spaced apart from each other in a first direction DR1 with the folding area FA therebetween.

[0049] The display device DD may be folded along the first folding axis AX1 using an inner folding method. In this context, the inner folding method may refer to folding in such a manner that the first non-folding area NFA1 and the second non-folding area NFA2 face each other. However, the present disclosure is not limited thereto.

[0050] like Figure 3 As shown in FIG, the display device DD can be folded along an imaginary second folding axis AX2 extending in a second direction DR2. In this case, the display device DD can be folded along the second folding axis AX2 using an outward folding method. In this context, the outward folding method may refer to folding in a direction in which the first non-folding area NFA1 and the second non-folding area NFA2 are oriented in opposite directions.

[0051] In an embodiment, the display device DD may be operable using only one of the inner folding method and the outer folding method. In another embodiment, the display device DD may be operable in both the inner folding method and the outer folding method along a single folding axis.

[0052] Figure 4 It is an icon Figure 1 An exploded perspective view of a display device. Figure 5 It is an icon Figure 1 sectional view of a display device.

[0053] Reference Figure 4 and Figure 5 A display device DD according to an embodiment of the present disclosure may include a display module DM, an upper functional layer disposed on the display module DM, and a lower functional layer disposed below the display module DM. The upper functional layer may include an anti-reflection layer ARL and a cover window CW. The lower functional layer may include a protective layer PFL, a digitizer DGT, a shielding layer SHL, a cushion layer CUS, a metal plate MP, a step compensation member SC, and a lower insulating layer ISL.

[0054] The display module DM may include a display panel DP and a touch member TSM. The display panel DP may include a plurality of light-emitting elements that emit light. Each of the plurality of light-emitting elements may include a lower electrode, a light-emitting layer, and an upper electrode. Holes in the lower electrode and electrons in the upper electrode may recombine in the light-emitting layer to form excitons. Then, when the excitons transition from an excited state to a ground state, the light-emitting layer may emit light. The light-emitting layer may emit light having a specific color (e.g., red, green, or blue). For example, the light-emitting layer may include at least one of an organic light-emitting material and quantum dots.

[0055] The touch member TSM may be disposed on the display panel DP. The touch member TSM may be disposed directly on the display panel DP. In other words, the touch member TSM may be disposed directly on the display panel DP without an adhesive member. In an alternative embodiment, the touch member TSM may be attached to the upper surface of the display panel DP via an adhesive member.

[0056] The touch member TSM can detect a user's touch. For example, the touch member TSM can use a method such as a mutual capacitance method or a self-capacitance method to obtain coordinate information based on an external input such as a user's touch. The touch member TSM may include a plurality of touch electrodes, transmission lines connected to the corresponding touch electrodes, and at least one touch insulation layer.

[0057] An anti-reflection layer (ARL) may be disposed on the touch member TSM. The anti-reflection layer (ARL) may be attached to the upper surface of the display module DM via a first adhesive layer (ADL1). Specifically, the anti-reflection layer (ARL) may be attached to the upper surface of the touch member (TSM) via the first adhesive layer (ADL1). The anti-reflection layer (ARL) may reduce reflection of external light on the display device (DD). In embodiments, the anti-reflection layer (ARL) may include a polarizer and / or a phase retarder. In alternative embodiments, the anti-reflection layer (ARL) may include color filters and a black matrix disposed between the color filters.

[0058] The first adhesive layer ADL1 may be disposed between the display module DM and the anti-reflection layer ARL. The first adhesive layer ADL1 may attach the display module DM and the anti-reflection layer ARL.

[0059] A cover window CW may be disposed on the anti-reflection layer ARL. The cover window CW may include a transparent material to allow light provided by the display module DM to pass through and reach the outside. In embodiments, the cover window CW may include a flexible material. Accordingly, the cover window CW may be foldable about a folding axis AX. The cover window CW may include a first cover layer CW1, a second cover layer CW2, and a frame pattern BZ.

[0060] The first cover layer CW1 may be disposed on the anti-reflection layer ARL. The first cover layer CW1 may be attached to the upper surface of the anti-reflection layer ARL via a second adhesive layer ADL2. The first cover layer CW1 may include thin glass or a synthetic resin. For example, the synthetic resin may include polyimide (PI) or polyethylene terephthalate (PET).

[0061] The second adhesive layer ADL2 may be disposed between the anti-reflection layer ARL and the first cover layer CW1. The second adhesive layer ADL2 may attach the anti-reflection layer ARL and the first cover layer CW1.

[0062] The second cover layer CW2 may be disposed on the first cover layer CW1. The second cover layer CW2 may include a material having a lower modulus than the first cover layer CW1. Furthermore, the second cover layer CW2 may have a thickness greater than the thickness of the first cover layer CW1 (or a length in the third direction DR3). Accordingly, the second cover layer CW2 may protect the first cover layer CW1. For example, the second cover layer CW2 may have a multi-layer structure. In embodiments, the second cover layer CW2 may include an anti-fingerprint layer.

[0063] The frame pattern BZ may be disposed inside the second cover layer CW2. The frame pattern BZ may partially overlap with an edge of the second cover layer CW2. The frame pattern BZ may include an organic material including a light-blocking material having a black color.

[0064] A protective layer PFL may be disposed below the display module DM. The protective layer PFL may be attached to the lower surface of the display module DM via a third adhesive layer ADL3. The protective layer PFL may protect the display module DM from external impacts. The protective layer PFL may include a flexible organic material. For example, the protective layer PFL may include polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalate (PEN), or the like. These materials may be used alone or in combination.

[0065] The third adhesive layer ADL3 may be disposed between the display module DM and the protection layer PFL. The third adhesive layer ADL3 may attach the display module DM and the protection layer PFL.

[0066] The digitizer DGT can be disposed below the protective layer PFL. The digitizer DGT can be attached to the lower surface of the protective layer PFL via a fourth adhesive layer ADL4. The digitizer DGT can detect input from an electromagnetic pen. For example, the digitizer DGT can be driven using electromagnetic resonance (EMR). The digitizer DGT (or base layer BL) can include a first non-folding portion NFP1, a second non-folding portion NFP2, and a folding portion FP.

[0067] The first non-folding portion NFP1 may at least partially overlap the first non-folding area NFA1. The second non-folding portion NFP2 may at least partially overlap the second non-folding area NFA2. The folding portion FP may overlap the folding area FA. The folding portion FP may be disposed between the first non-folding portion NFP1 and the second non-folding portion NFP2. In other words, the first non-folding portion NFP1 may be spaced apart from the second non-folding portion NFP2 in the first direction DR1 with the folding portion FP interposed therebetween.

[0068] A plurality of through holes HL may be provided in the folded portion FP. The through holes HL may penetrate the folded portion FP in the thickness direction (or in the third direction DR3). The through holes HL may be spaced apart from each other in the first direction DR1. In addition, the through holes HL may be spaced apart from each other in the second direction DR2. The digitizer DGT may further include a guide pattern (GDP, see FIG. 1 ) surrounding at least a portion of each of the through holes HL in a plan view. Figure 8 ) and a sensing line (eg, Figure 8 The following will refer to the first extended sensing line EL1. Figure 8 to provide a detailed description.

[0069] The fourth adhesive layer ADL4 may be disposed between the protective layer PFL and the digitizer DGT. Specifically, the fourth adhesive layer ADL4 may include a first portion and a second portion. The first portion of the fourth adhesive layer ADL4 may be separated from the second portion of the fourth adhesive layer ADL4 by the folding area FA in the first direction DR1. The first portion of the fourth adhesive layer ADL4 may attach a portion of the protective layer PFL to the first non-folding portion NFP1. The second portion of the fourth adhesive layer ADL4 may attach another portion of the protective layer PFL to the second non-folding portion NFP2.

[0070] The shielding layer SHL may be provided below the digitizer DGT. The shielding layer SHL may be provided on the lower surface of the digitizer DGT without an adhesive member. The shielding layer SHL may shield (e.g., block) electromagnetic interference noise. The shielding layer SHL may include metal. For example, the shielding layer SHL may include magnetic metal powder (MMP). However, the present disclosure is not limited thereto, and the shielding layer SHL may include permalloy, invar, stainless steel, or the like, which are alloys of nickel (Ni) and iron (Fe). These may be used alone or in combination with one another.

[0071] The shielding layer SHL may include a first shielding layer SHL1 and a second shielding layer SHL2. The first shielding layer SHL1 may be spaced apart from the second shielding layer SHL2 in the first direction DR1 in the folding area FA. The first shielding layer SHL1 may overlap a portion of the folding portion FP and the first non-folding portion NFP1. The second shielding layer SHL2 may overlap another portion of the folding portion FP and the second non-folding portion NFP2. However, the present disclosure is not limited thereto, and the shielding layer SHL may completely overlap the folding area FA and cover the through hole HL.

[0072] A cushion layer CUS may be disposed below the shielding layer SHL. The cushion layer CUS may be attached to the lower surface of the shielding layer SHL via a fifth adhesive layer ADL5. The cushion layer CUS may protect the display module DM from external impacts. In addition, the cushion layer CUS may prevent foreign matter from entering the through hole HL when the display device DD is unfolded (in other words, when the display device DD is not folded). For example, the cushion layer CUS may include a foam tape or a foam pad.

[0073] The cushion layer CUS may include a first cushion layer CUS1 and a second cushion layer CUS2. The first cushion layer CUS1 may be spaced apart from the second cushion layer CUS2 in the first direction DR1 in the folding area FA. The first cushion layer CUS1 may overlap with the first shielding layer SHL1. In addition, the first cushion layer CUS1 may overlap with a portion of the folding portion FP and the first non-folding portion NFP1 in a plan view. The second cushion layer CUS2 may overlap with the second shielding layer SHL2. In addition, the second cushion layer CUS2 may overlap with another portion of the folding portion FP and the second non-folding portion NFP2 in a plan view. Since the first cushion layer CUS1 is spaced apart from the second cushion layer CUS2 in the first direction DR1 within the folding area FA, the digital converter DGT may be easily deformed when the folding portion FP is folded (or bent) with a predetermined curvature.

[0074] The fifth adhesive layer ADL5 may be disposed between the shielding layer SHL and the cushion layer CUS. Specifically, the fifth adhesive layer ADL5 may include a first portion and a second portion. The first portion of the fifth adhesive layer ADL5 may be spaced apart from the second portion of the fifth adhesive layer ADL5 in the first direction DR1 in the folding area FA. The first portion of the fifth adhesive layer ADL5 may attach the first shielding layer SHL1 and the first cushion layer CUS1. The second portion of the fifth adhesive layer ADL5 may attach the second shielding layer SHL2 and the second cushion layer CUS2.

[0075] The metal plate MP, the step compensation member SC, and the lower insulating layer ISL may be disposed under the cushion layer CUS.

[0076] The metal plate MP can protect the display module DM from external impact. For example, the metal plate MP can include stainless steel. The metal plate MP can include a first metal layer MP1 and a second metal layer MP2. The first metal layer MP1 can contact the first pad layer CUS1, and the second metal layer MP2 can contact the second pad layer CUS2.

[0077] The step compensation member SC may include a double-sided tape or an insulating film. The step compensation member SC may include a first step compensation layer SC1 and a second step compensation layer SC2. The first step compensation layer SC1 may contact the first underlayer CUS1 and may be adjacent to the first metal layer MP1. The second step compensation layer SC2 may contact the second underlayer CUS2 and may be adjacent to the second metal layer MP2.

[0078] A lower insulating layer ISL may be disposed below the metal plate MP. The lower insulating layer ISL may block noise, such as static electricity, generated from the outside. The lower insulating layer ISL may include an inorganic insulating material and / or an organic insulating material. The lower insulating layer ISL may include a first lower insulating layer ISL1 and a second lower insulating layer ISL2. The first lower insulating layer ISL1 may contact the first metal layer MP1, and the second lower insulating layer ISL2 may contact the second metal layer MP2.

[0079] Figure 6 and Figure 7 is a plan view illustrating a digitizer according to an embodiment of the present disclosure. For example, Figure 6 is a plan view illustrating a sensing coil provided at the front surface DGT-F (or upper surface) of the digitizer DGT, and Figure 7 is a plan view illustrating a sensing coil provided at a rear surface DGT-B (or lower surface) of the digitizer DGT.

[0080] Reference Figure 6 The digitizer DGT according to an embodiment of the present disclosure may include an active area AA and an inactive area NAA. The active area AA may be an area for detecting input from a pen (eg, an electromagnetic pen). The active area AA may be Figure 4 The invalid area NAA may surround the active area AA. The invalid area NAA may overlap with the display area DA. Figure 4 The non-display area NDA overlaps.

[0081] The digitizer DGT may include a plurality of first sensing coils RF, a plurality of first connector lines CCL1 , and a connector CNT.

[0082] The connector CNT may be provided at one side of the digitizer DGT. For example, the connector CNT may be provided at the right side of the inactive area NAA. In other words, the connector CNT may be provided in the second non-folding portion NFP2.

[0083] The first connector line CCL1 can be arranged on one side of the digitizer DGT. For example, the first connector line CCL1 can be arranged on the right side of the inactive area NAA. In other words, the first connector line CCL1 can be arranged in the second non-folding portion NFP2. The first connector line CCL1 can be arranged along the second direction DR2. In addition, each of the first connector lines CCL1 can extend in the first direction DR1. The first end of the first connector line CCL1 can be connected to the connector CNT, and the second end of the first connector line CCL1 can be connected to the first sensing coil RF.

[0084] The first sensing coil RF may be arranged in the active area AA and the inactive area NAA. The first sensing coil RF may extend from the second non-folding portion NFP2 to the first non-folding portion NFP1. The first sensing coil RF may extend in an open loop shape. For example, the first sensing coil RF may extend from the right side of the inactive area NAA through the active area AA to the left side of the inactive area NAA, and then loop back to the right side of the active area AA, thereby maintaining an open loop shape. The first sensing coil RF may be connected to the first connector connection line CCL1. The first sensing coil RF may be connected to the connector CNT via the first connector connection line CCL1.

[0085] Each of the first sensing coils RF may include a plurality of first extension sensing wires EL1 and a plurality of first connection sensing wires CL1 .

[0086] The first extended sensing lines EL1 may be disposed in the active area AA and the inactive area NAA. The first extended sensing lines EL1 may be disposed along the second direction DR2. Each of the first extended sensing lines EL1 may extend in the first direction DR1. For example, each of the first sensing coils RF may include at least one pair of first extended sensing lines EL1, and the pair of first extended sensing lines EL1 may extend in the first direction DR1.

[0087] The first extended sensing line EL1 may be disposed at the first non-folding portion NFP1, the second non-folding portion NFP2, and the folding portion FP. The first extended sensing line EL1 may extend between the through-holes HL at the folding portion FP. In an embodiment, the first extended sensing line EL1 may extend in a curved manner along the edge of the through-hole HL at the folding portion FP. In other words, the first extended sensing line EL1 may extend in a curved path along the edge of the through-hole HL at the folding portion FP.

[0088] Accordingly, each of the first extended sensing lines EL1 may include a bent pattern (RP, see Figure 8 ). The following will refer to Figure 8 to provide a detailed description.

[0089] In an embodiment, the first extended sensing line EL1 may include a first upper sensing line (UL1, see Figure 9 ) and the second upper sensing line (UL2, see Figure 9 ). For example, the first upper sensing line can be arranged below the second upper sensing line. Figure 9 to provide a detailed description.

[0090] Dummy Line (DML, see Figure 9) may be disposed between the first extended sensing lines EL1. In other words, the dummy lines may be spaced apart from the first extended sensing lines EL1 in the second direction DR2. The dummy lines may be disposed at (or in) the first non-folding portion NFP1 and the second non-folding portion NFP2. The dummy lines may not be disposed at (or in) the folding portion FP. The dummy lines may be disposed along the second direction DR2. Each of the dummy lines may extend in the first direction DR1.

[0091] The first connection sensing lines CL1 may be disposed in the inactive area NAA. For example, the first connection sensing lines CL1 may be disposed at the left side of the inactive area NAA and the right side of the inactive area NAA. Each of the first connection sensing lines CL1 may extend in the second direction DR2.

[0092] The first connection sensing line CL1 may be disposed in the first non-folding portion NFP1 and the second non-folding portion NFP2. The first connection sensing line CL1 may be connected to the first extension sensing line EL1. For example, the first connection sensing line CL1 may be connected to the first end of the first extension sensing line EL1 at the left side of the inactive area NAA. Furthermore, the first connection sensing line CL1 may be connected to the first connector connection line CCL1. For example, the first connection sensing line CL1 may be connected to the second end of the first extension sensing line EL1 and the first connector connection line CCL1 at the right side of the inactive area NAA.

[0093] Further references Figure 7 The digital converter DGT may include a plurality of second sensing coils CF, a plurality of second connector lines CCL2 and a connector CNT.

[0094] The second connector lines CCL2 may be provided on one side of the digitizer DGT. For example, the second connector lines CCL2 may be provided in the second non-folding portion NFP2. The second connector lines CCL2 may be provided along the second direction DR2. In addition, each of the second connector lines CCL2 may extend in the first direction DR1. A first end of the second connector line CCL2 may be connected to the connector CNT, and a second end of the second connector line CCL2 may be connected to the second sensing coil CF.

[0095] The second sensing coil CF can be arranged in the active area AA and the inactive area NAA. The second sensing coil CF can extend in an open loop shape. For example, the second sensing coil CF can extend from the upper side of the inactive area NAA through the active area AA to the lower side of the inactive area NAA, and then loop back to the active area AA to reach the upper side of the inactive area NAA, thereby forming an open loop shape. The second sensing coil CF can be connected to the second connector connection line CCL2. The second sensing coil CF can be connected to the connector CNT through the second connector connection line CCL2.

[0096] Each of the second sensing coils CF may include a plurality of second extension sensing lines EL2 and a plurality of second connection sensing lines CL2.

[0097] The second extended sensing lines EL2 may be disposed in the active area AA and the inactive area NAA. The second extended sensing lines EL2 may be disposed along the first direction DR1. Each of the second extended sensing lines EL2 may extend in the second direction DR2.

[0098] The second extended sensing line EL2 may be provided in the first non-folding portion NFP1, the second non-folding portion NFP2, and the folding portion FP. Figure 7 , but in the folded portion FP, each of the second extension sensing lines EL2 may extend in the second direction DR2 while passing between adjacent through holes HL.

[0099] In an embodiment, the second extended sensing line EL2 may be disposed below the first extended sensing line EL1. In other words, the second sensing coil CF may be disposed below the first sensing coil RF.

[0100] The second connection sensing line CL2 can be arranged in the active area AA and the inactive area NAA. The second connection sensing line CL2 can be arranged in the first non-folding portion NFP1, the second non-folding portion NFP2, and the folding portion FP. The second connection sensing line CL2 can be connected to the second extension sensing line EL2 and the second connector connection line CCL2. For example, the second connection sensing line CL2 can be connected to the second connector connection line CCL2 and connected to the first end of the second extension sensing line EL2 at the upper side of the inactive area NAA. In addition, the second connection sensing line CL2 can be connected to the second connector connection line CCL2 and connected to the second end of the second extension sensing line EL2 at the lower side of the inactive area NAA.

[0101] The second connection sensing line CL2 may extend between the through-holes HL in the folded portion FP. In an embodiment, the second connection sensing line CL2 may extend along a curved path along the edge of the through-hole HL in the folded portion FP. The second connection sensing line CL2 may be connected to the second extension sensing line EL2 extending between adjacent through-holes HL in the folded portion FP.

[0102] For example, the first sensing coil RF may be a sensing coil, and the second sensing coil CF may be a driving coil. When current is applied to the second sensing coil CF, a magnetic field may be generated between the second sensing coil CF and the first sensing coil RF. The first sensing coil RF may detect the induced electromagnetic force from the electromagnetic pen and output a sensing signal to one terminal of each of the first sensing coils RF. However, the present disclosure is not limited thereto, and the first sensing coil RF may be a driving coil, and the second sensing coil CF may be a sensing coil.

[0103] Figure 8 yes Figure 6 An enlarged plan view of area A.

[0104] Reference Figure 8 Through holes HL may be provided at the folded portion FP of the digitizer DGT. Each through hole HL may have a first width WD1 in the first direction DR1. For example, the first width WD1 may be greater than or equal to approximately 0.1 mm and less than or equal to approximately 0.5 mm. Each through hole HL may have a second width WD2 in the second direction DR2. For example, the second width WD2 may be greater than or equal to approximately 4 mm and less than or equal to approximately 10 mm.

[0105] The through-holes HL may include a plurality of first through-holes HL1 and a plurality of second through-holes HL2. The first through-holes HL1 may be spaced apart from each other in the second direction DR2. The first through-holes HL1 may be spaced apart from the second through-holes HL2 in the first direction DR1. For example, a first separation distance DS1 between the first through-holes HL1 and the second through-holes HL2 in the first direction DR1 may be greater than or equal to approximately 0.1 mm and less than or equal to approximately 0.3 mm. The second through-holes HL2 may be spaced apart from each other in the second direction DR2. The separation distance between the first through-holes HL1 in the second direction DR2 and the separation distance between the second through-holes HL2 in the second direction DR2 may be equal to each other. The second separation distance DS2 between adjacent through-holes HL in the second direction DR2 may be greater than or equal to approximately 0.1 mm and less than or equal to approximately 0.3 mm.

[0106] The second through hole HL2 may be offset from the first through hole HL1 by a predetermined distance in the second direction DR2. The predetermined distance offset in the second direction DR2 may be less than half the second width WD2. Accordingly, the folded portion FP other than the through hole HL may have a slit-like mesh pattern. In other words, the folded portion FP other than the through hole HL may have a slit-like mesh pattern. In an embodiment, each of the through holes HL may include an end portion HL-ED having a predetermined curvature.

[0107] The first non-folding portion NFP1 and the second non-folding portion (NFP2, see Figure 6 ) may have substantially the same or symmetrical shapes. Accordingly, hereinafter, the following description will focus on the first non-folding portion NFP1. The description of the first non-folding portion NFP1 may be used to replace the description of the second non-folding portion NFP2.

[0108] The first extended sensing lines EL1 may be disposed at the first non-folding portion NFP1 and the folding portion FP. Each of the first extended sensing lines EL1 may extend between the through holes HL in the folding portion FP. In an embodiment, each of the first extended sensing lines EL1 may extend in a winding path along the edge of the through hole HL in the folding portion FP.

[0109] In an embodiment, each of the first extended sensing lines EL1 may include a patterned portion PP in the folded portion FP. The patterned portion PP may be disposed between the through holes HL. Specifically, the patterned portion PP may include a first pattern P1, a second pattern P2, a bent pattern RP, and a third pattern P3.

[0110] Each of the first and second patterns P1 and P2 may extend in the second direction DR2. The first and second patterns P1 and P2 may be spaced apart from each other in the first direction DR1 with corresponding through holes HL interposed therebetween.

[0111] The bent pattern RP may connect the first pattern P1 and the second pattern P2. The bent pattern RP may have a predetermined curvature. In an embodiment, the bent pattern RP may have a shape corresponding to the shape of the end portion HL-ED of each of the through holes HL.

[0112] The third pattern P3 may extend from the second pattern P2 in the first direction DR1. The third pattern P3 may be connected to the first pattern P1 of another patterned portion PP included in the same first extended sensing line EL1. Figure 8As shown in FIG. , the third pattern P3 may have a straight line extending in the first direction DR1; however, the present disclosure is not limited to this configuration. For example, the third pattern P3 may have a predetermined curvature like the curved pattern RP. In this case, the third pattern P3 may have a shape corresponding to the shape of the end portion HL-ED of each of the through holes HL.

[0113] The digitizer DGT may further include a guide pattern GDP disposed in the folded portion FP. Each of the guide patterns GDP may surround at least a portion of each of the through holes HL in a plan view. Each of the guide patterns GDP may be disposed between the corresponding through hole HL and the first extended sensing line EL1 in a plan view.

[0114] In an embodiment, Figure 8 As illustrated in , the guide pattern GDP may completely surround each of the through-holes HL in a plan view. In other words, the guide pattern GDP may have a shape corresponding to a shape of an edge of the corresponding through-hole HL.

[0115] The guide pattern GDP may be disposed between the through hole HL and the patterned portion PP, and the patterned portion PP extends in a meandering path along an edge of the through hole HL.

[0116] When the digitizer DGT is folded at the folded portion FP, stress may be concentrated on the bent pattern RP having a predetermined curvature. Such concentrated stress may cause cracks in the bent pattern RP of each of the first extended sensing lines EL1.

[0117] To prevent cracks from forming in the flexure pattern RP, the digitizer DGT according to an embodiment of the present disclosure may include a guide pattern GDP that surrounds at least a portion of each of the through-holes HL in plan view. Accordingly, when the digitizer DGT is folded at the folded portion FP, stress is distributed to the guide pattern GDP. By distributing this stress to the guide pattern GDP, the stress on the flexure pattern RP can be reduced, thereby minimizing the risk of cracks in the flexure pattern RP of each of the first extended sensing lines EL1.

[0118] Figure 9 It is along Figure 8 For example, Figure 9 is a cross-sectional view illustrating the first non-folded portion NFP1 of the digitizer DGT. Figure 10 It is along Figure 8 For example, Figure 10 is a cross-sectional view illustrating a folded portion FP of the digitizer DGT. Figure 11 The diagram is included in Figure 6 Cross-sectional view of the substrate layer in the digitizer. Figure 12 It is an icon Figure 11 Floor plan of the basement floor.

[0119] Reference Figure 8 、 Figure 9 and Figure 10 The digitizer DGT according to an embodiment of the present disclosure may include a base layer BL, a first upper sensing line UL1, a second upper sensing line UL2, a plurality of dummy lines DML, a first insulating layer IL1, a first lower sensing line DL1, a second lower sensing line DL2, a plurality of guide patterns GDP, and a second insulating layer IL2. The base layer BL may include a middle base layer BLC, an upper base layer BLU, and a lower base layer BLD. A through hole HL provided in the folded portion FP may penetrate the base layer BL, the first insulating layer IL1, and the second insulating layer IL2 in the thickness direction (or in the third direction DR3).

[0120] The first upper sensing line UL1 may be provided on the intermediate base layer BLC in the first non-folding portion NFP1 and the folding portion FP. Specifically, the first upper sensing line UL1 may be provided on the upper surface of the intermediate base layer BLC at the first non-folding portion NFP1 and the folding portion FP. The first upper sensing line UL1 may correspond to Figure 6 The first extended sensing line EL1 is formed.

[0121] The upper base layer BLU may be disposed on the intermediate base layer BLC in the first non-folding portion NFP1 and the folding portion FP. The upper base layer BLU may cover the first upper sensing line UL1.

[0122] The second upper sensing line UL2 may be provided on the upper substrate layer BLU in the first non-folding portion NFP1 and the folding portion FP. Specifically, the second upper sensing line UL2 may be provided on the upper surface of the upper substrate layer BLU in the first non-folding portion NFP1 and the folding portion FP. The second upper sensing line UL2 may correspond to Figure 6 The second upper sensing line UL2 may overlap the first upper sensing line UL1 in the third direction DR3.

[0123] A dummy line DML may be provided on the upper substrate layer BLU in the first non-folding portion NFP1. Specifically, the dummy line DML may be provided on the upper surface of the upper substrate layer BLU in the first non-folding portion NFP1. The dummy line DML may not be provided in the folding portion FP. The dummy line DML may be spaced apart from the second upper sensing line UL2 in the second direction DR2. The dummy line DML may compensate for a step formed by the second upper sensing line UL2.

[0124] The first insulating layer IL1 may be disposed on the upper base layer BLU in the first non-folding portion NFP1 and the folding portion FP. The first insulating layer IL1 may cover the second upper sensing line UL2 and the dummy line DML in the first non-folding portion NFP1.

[0125] The first lower sensing line DL1 may be disposed under the intermediate base layer BLC in the first non-folding portion NFP1 and the folding portion FP. Specifically, the first lower sensing line DL1 may be disposed on the lower surface of the intermediate base layer BLC in the first non-folding portion NFP1 and the folding portion FP. The first lower sensing line DL1 may correspond to Figure 7 The first down sensing line DL1 may overlap the first and second upper sensing lines UL1 and UL2 in the third direction DR3.

[0126] The lower substrate layer BLD may be disposed under the intermediate substrate layer BLC in the first non-folding portion NFP1 and the folding portion FP. The lower substrate layer BLD may cover the first lower sensing line DL1.

[0127] The second lower sensing line DL2 may be disposed under the lower substrate layer BLD in the first non-folding portion NFP1 and the folding portion FP. Specifically, the second lower sensing line DL2 may be disposed on the lower surface of the lower substrate layer BLD in the first non-folding portion NFP1 and the folding portion FP. The second lower sensing line DL2 may extend in the second direction DR2 in the first non-folding portion NFP1. The second lower sensing line DL2 may correspond to Figure 7 The second extended sensing line EL2 may overlap the first down sensing line DL1, the dummy line DML, and the first and second upper sensing lines UL1 and UL2 in the third direction DR3.

[0128] The second insulating layer IL2 may be disposed under the lower base layer BLD in the first non-folding portion NFP1 and the folding portion FP. The second insulating layer IL2 may cover the second lower sensing line DL2.

[0129] Each of the guide patterns GDP may surround at least a portion of each of the through holes HL in a plan view. In other words, the guide pattern GDP may be adjacent to each of the through holes HL in a cross-sectional view. The guide pattern GDP may be positioned closer to each of the through holes HL than the upper sensing lines UL1 and UL2 and the lower sensing lines DL1 and DL2.

[0130] The guide pattern GDP may be provided on the base layer BL in the folded portion FP. The guide pattern GDP may not be provided in the first non-folded portion NFP1. The guide pattern GDP may be provided on at least one of the intermediate base layer BLC, the upper base layer BLU, and the lower base layer BLD in the folded portion FP. For example, Figure 10 As illustrated in FIG, the guide pattern GDP may be disposed on each of the upper surface of the middle substrate layer BLC, the lower surface of the middle substrate layer BLC, the upper surface of the upper substrate layer BLU, and the lower surface of the lower substrate layer BLD. However, the present disclosure is not limited thereto.

[0131] The guide pattern GDP may be disposed on the upper surface of the intermediate substrate layer BLC in the folded portion FP. In this case, the first upper sensing line UL1 may be disposed between the guide patterns GDP in the folded portion FP. The upper substrate layer BLU may cover the first upper sensing line UL1 and the guide pattern GDP in the folded portion FP.

[0132] The guide pattern GDP may be disposed on the upper surface of the upper substrate layer BLU in the folded portion FP. In this case, the second upper sensing line UL2 may be disposed between the guide patterns GDP in the folded portion FP. The first insulating layer IL1 may cover the second upper sensing line UL2 and the guide pattern GDP at the folded portion FP.

[0133] The guide pattern GDP may be disposed on the lower surface of the intermediate substrate layer BLC in the fold portion FP. In this case, the first lower sensing line DL1 may be disposed between the guide patterns GDP in the fold portion FP. The lower substrate layer BLD may cover the first lower sensing line DL1 and the guide pattern GDP at the fold portion FP.

[0134] The guide pattern GDP may be disposed on the lower surface of the lower substrate layer BLD in the fold portion FP. In this case, the second lower sensing line DL2 may be disposed between the guide patterns GDP in the fold portion FP. The second insulating layer IL2 may cover the second lower sensing line DL2 and the guide pattern GDP at the fold portion FP.

[0135] Further references Figure 11 and Figure 12The base layer BL may include a matrix MT containing a filler, and a plurality of fiber strands arranged in a woven pattern in the matrix MT in a plan view. For example, the plurality of fiber strands may include a first fiber strand FL1 extending in a first direction DR1 and a second fiber strand FL2 extending in a second direction DR2. Each of the intermediate base layer BLC, the upper base layer BLU, and the lower base layer BLD may be a prepreg layer impregnated with the matrix MT and including a plurality of fiber strands extending in the corresponding direction. For example, the intermediate base layer BLC may include a first fiber strand FL1, the upper base layer BLU may include a second fiber strand FL2, and the lower base layer BLD may include a second fiber strand FL2.

[0136] The matrix MT may include synthetic resins such as epoxy resin, polyester, polyamide, polycarbonate, polypropylene, polybutylene, vinyl ester, etc. These may be used alone or in combination with one another.

[0137] The filler included in the matrix MT may include silica, barium sulfate, sintered talc, barium titanate, titanium oxide, clay, alumina, mica, boehmite, zinc borate, zinc stannate, etc. They may be used alone or in combination with each other.

[0138] Fiber strands FL1 and FL2 may be disposed in a matrix MT. For example, each of the fiber strands FL1 and FL2 may be glass fiber reinforced plastic (GFRP). Each of the fiber strands FL1 and FL2 may be provided as a bundle of glass fibers GL. The diameter of a strand of glass fiber GL included in a fiber strand may be greater than or equal to approximately 3 microns and less than or equal to approximately 10 microns. However, the diameter of the glass fiber GL is not limited thereto.

[0139] like Figure 12 As illustrated in FIG, the fiber lines FL1 and FL2 may be alternately arranged in a weave pattern along the first direction DR1 and the second direction DR2 in a plan view. For example, the middle base layer BLC may include first fiber lines FL1 extending in the first direction DR1, and each of the upper base layer BLU and the lower base layer BLD may include second fiber lines FL2 extending in the second direction DR2.

[0140] In the embodiment, the first insulating layer IL1, the second insulating layer IL2, the middle base layer BLC, the upper base layer BLU, and the lower base layer BLD may include the same material as each other. In other words, each of the first insulating layer IL1 and the second insulating layer IL2 may include a matrix MT containing a filler and fiber lines FL1 and FL2 disposed in the matrix MT and extending in corresponding directions.

[0141] Each of the first insulating layer IL1, the second insulating layer IL2, the intermediate base layer BLC, the upper base layer BLU, and the lower base layer BLD may include a matrix MT, and the matrix MT may include a synthetic resin such as epoxy resin, polyester, polyamide, etc. For example, each of the first insulating layer IL1, the second insulating layer IL2, the intermediate base layer BLC, the upper base layer BLU, and the lower base layer BLD may be referred to as a resin layer.

[0142] When the density of the composition impregnated in the plurality of resin layers differs between the first non-folded part NFP1 and the folded part FP, the first thickness TH1 of the first non-folded part NFP1 and the second thickness TH2 of the folded part FP may also differ.

[0143] In order to achieve a substantially equal first thickness TH1 of the first non-folding portion NFP1 and a substantially equal second thickness TH2 of the folding portion FP, the dummy line DML may be provided only on the upper base layer BLU at the first non-folding portion NFP1, while the guide pattern GDP may be provided on at least one of the intermediate base layer BLC, the upper base layer BLU, and the lower base layer BLD at the folding portion FP. This configuration allows the density of the composition impregnated in the base layers BLC, BLU, and BLD and the insulating layers IL1 and IL2 to be adjusted so that they are substantially the same at the first non-folding portion NFP1 and the folding portion FP. Figure 17 and Figure 18 To describe its detailed description.

[0144] Figure 13 : is a plan view illustrating a digitizer according to another embodiment of the present disclosure. For example, Figure 13 is a plan view illustrating a sensing coil provided at the front surface DGT2 -F of the digitizer DGT2 . Figure 14 yes Figure 13 An enlarged plan view of area B. Figure 15 It is along Figure 14 A cross-sectional view taken along line III-III'.

[0145] Reference Figure 13 、 Figure 14 and Figure 15 According to another embodiment of the present disclosure, the display device DD2 may include a display module (DM, see Figure 5 ), anti-reflection layer (ARL, see Figure 5 ), Cover Window (CW, see Figure 5 ) and digital converter DGT2. In addition to the digital converter DGT2, the display device DD2 can be the same as the one described above. Figures 1 to 5 The display devices DD described are essentially identical.

[0146] A digitizer DGT2 according to another embodiment of the present disclosure may include a plurality of first sensing coils RF, a plurality of first connector connection lines CCL1, a connector CNT, and a plurality of guide patterns GDP'. Each of the first sensing coils RF may include a first extended sensing line EL1 and a first connection sensing line CL1. The first extended sensing line EL1 may include a first upper sensing line UL1 and a second upper sensing line UL2 disposed on the first upper sensing line UL1.

[0147] The digitizer DGT2 may be the same as that described above with reference to FIG. 1 , except that each of the guide patterns GDP′ has a shape corresponding to that of the meander pattern RP in a plan view and surrounds the end portions HL-ED of the through-hole HL. Figures 6 to 12 The digital converter DGT described is basically the same. Therefore, the above references may be omitted or summarized in the following parts. Figures 6 to 12 A redundant description of the description of the digitizer DGT is provided.

[0148] A plurality of through holes HL may be provided at the folded portion FP' of the digitizer DGT2. The through holes HL may include a plurality of first through holes HL1 and a plurality of second through holes HL2. The first through holes HL1 may be spaced apart from the second through holes HL2 in the first direction DR1. The second through holes HL2 may be offset from the first through holes HL1 by a predetermined distance in the second direction DR2. In an embodiment, each of the through holes HL may include an end portion HL-ED having a predetermined curvature.

[0149] Each of the first extended sensing lines EL1 may include a patterned portion PP at the folded portion FP′. The patterned portion PP may include a first pattern P1, a second pattern P2, a bent pattern RP, and a third pattern P3.

[0150] Each of the first and second patterns P1 and P2 may extend in the second direction DR2. The first and second patterns P1 and P2 may be spaced apart from each other in the first direction DR1 with corresponding through holes HL interposed therebetween. For example, each of the first and second patterns P1 and P2 may be a straight line pattern.

[0151] The bent pattern RP may connect the first pattern P1 and the second pattern P2. The bent pattern RP may have a predetermined curvature. In an embodiment, the bent pattern RP may have a shape corresponding to the shape of the end portion HL-ED of each of the through holes HL.

[0152] The guide pattern GDP' may be provided at the folded portion FP'. Each of the guide patterns GDP' may surround at least a portion of each of the through holes HL in a plan view. Figure 14As illustrated in FIG, the guide pattern GDP' may surround the end portion HL-ED of each through-hole HL. For example, the guide pattern GDP' may have a shape corresponding to the shape of the end portion HL-ED of the through-hole HL and the shape of the meander pattern RP. In other words, the guide pattern GDP' may be provided only between the end portion HL-ED of the through-hole HL and the meander pattern RP, and may not be provided between the through-hole HL and the straight pattern (e.g., the first pattern P1 or the second pattern P2).

[0153] When the digitizer DGT2 is folded at the folding portion FP', stress may be concentrated at the curved pattern RP having a predetermined curvature. The digitizer DGT2 according to another embodiment of the present disclosure may include a guide pattern GDP' surrounding the end HL-ED of the through hole HL in a plan view. In other words, the guide pattern GDP' may be provided only at the area where stress is concentrated. Accordingly, when the digitizer DGT2 is folded at the folding portion FP', stress may be distributed to the guide pattern GDP'. When stress is distributed to the guide pattern GDP', stress applied to the curved pattern RP may be reduced. Accordingly, cracks may not occur at the curved pattern RP of each of the first extended sensing lines EL1.

[0154] Figure 16 、 Figure 17 、 Figure 18 、 Figure 19 and Figure 20 is a view illustrating a method of manufacturing a digitizer according to an embodiment of the present disclosure. Figure 17 It is along Figure 16 A cross-sectional view taken along line IV-IV'. Figure 18 It is along Figure 16 A cross-sectional view taken along line V-V'. Figure 20 It is along Figure 19 A cross-sectional view taken along line VI-VI'.

[0155] The following reference Figure 16 、 Figure 17 、 Figure 18 、 Figure 19 and Figure 20 The method of manufacturing a digitizer described above may be a method of manufacturing a digitizer Figures 6 to 12 Hereinafter, the above references may be omitted or summarized in the following parts. Figures 6 to 12 A redundant description of the description of the digitizer DGT is provided.

[0156] Reference Figure 16 、 Figure 17 、 Figure 18 、 Figure 19 and Figure 20, a method of manufacturing a digitizer DGT according to an embodiment of the present disclosure may include: forming a plurality of dummy patterns DMP on a base layer BL at a folded portion FP; forming a sensing line disposed between the dummy patterns DMP in a plan view on the base layer BL at the folded portion FP; and forming a plurality of through holes HL and a guide pattern GDP surrounding at least a portion of each of the through holes HL by removing a portion of the dummy patterns DMP and a portion of the base layer BL.

[0157] like Figure 16 、 Figure 17 and Figure 18 As shown in FIG, a first non-folding portion NFP1, a second non-folding portion (NFP2, see Figure 6 ) and the base layer BL of the folded part FP.

[0158] The first non-folding portion NFP1 may be aligned with the second non-folding portion (NFP2, see FIG. Figure 6 ) are spaced apart and the folded portion FP is interposed therebetween. Figure 6 ) can have substantially the same or symmetrical shapes, so the following description will focus on the first non-folded portion NFP1.

[0159] like Figure 16 As shown in FIG, a plurality of dummy patterns DMP may be formed on the base layer BL at the folded portion FP. The dummy patterns DMP may include a plurality of first dummy patterns DMP1 and a plurality of second dummy patterns DMP2. The first dummy patterns DMP1 may be spaced apart from each other in the second direction DR2. The first dummy patterns DMP1 may be spaced apart from the second dummy patterns DMP2 in the first direction DR1. The second dummy patterns DMP2 may be spaced apart from each other in the second direction DR2. The second dummy patterns DMP2 may be offset from the first dummy patterns DMP1 in the second direction DR2 by a predetermined distance.

[0160] At the folded portion FP, a plurality of sensing lines disposed between the dummy patterns DMP in a plan view may be formed on the base layer BL. For example, first extended sensing lines EL1 disposed between the dummy patterns DMP in a plan view may be formed. Each of the first extended sensing lines EL1 may extend in a first direction DR1 to bend along an edge of the dummy pattern DMP.

[0161] Specifically, if Figure 17 and Figure 18As shown in FIG, a first upper sensing line UL1 may be formed on the upper surface of the intermediate base layer BLC at the first non-folding portion NFP1. The first upper sensing line UL1 may correspond to the first extended sensing line EL1. In addition, dummy patterns DMP and the first upper sensing line UL1 disposed between the dummy patterns DMP may be formed on the upper surface of the intermediate base layer BLC at the folding portion FP.

[0162] An upper base layer BLU may be formed on the intermediate base layer BLC at the first non-folding portion NFP1 and the folding portion FP. The upper base layer BLU may be embedded with the first upper sensing line UL1 at the first non-folding portion NFP1. In other words, the upper base layer BLU may embed the first upper sensing line UL1 in the first non-folding portion NFP1. Accordingly, the upper base layer BLU may cover the first upper sensing line UL1 at the first non-folding portion NFP1. Furthermore, the upper base layer BLU may be embedded with the dummy pattern DMP and the first upper sensing line UL1 at the folding portion FP. Furthermore, the upper base layer BLU may embed the dummy pattern DMP and the first upper sensing line UL1 in the folding portion FP. Accordingly, the upper base layer BLU may cover the dummy pattern DMP and the first upper sensing line UL1 at the folding portion FP.

[0163] A second upper sensing line UL2 and a dummy line DML spaced apart from the second upper sensing line UL2 in the second direction DR2 may be formed on the upper surface of the upper base layer BLU at the first non-folding portion NFP1. The second upper sensing line UL2 may correspond to the first extended sensing line EL1. Furthermore, dummy patterns DMP and the second upper sensing line UL2 disposed between the dummy patterns DMP may be formed on the upper surface of the upper base layer BLU at the folding portion FP.

[0164] A first insulating layer IL1 may be formed on the upper base layer BLU at the first non-folding portion NFP1 and the folding portion FP. The first insulating layer IL1 may be embedded with the second upper sensing line UL2 and the dummy line DML at the first non-folding portion NFP1. In other words, the first insulating layer IL1 may embed the second upper sensing line UL2 and the dummy line DML in the first non-folding portion NFP1. Accordingly, the first insulating layer IL1 may cover the second upper sensing line UL2 and the dummy line DML at the first non-folding portion NFP1. Furthermore, the first insulating layer IL1 may be embedded with the second upper sensing line UL2 and the dummy pattern DMP at the folding portion FP. In other words, the first insulating layer IL1 may embed the second upper sensing line UL2 and the dummy pattern DMP in the folding portion FP. Accordingly, the first insulating layer IL1 may cover the second upper sensing line UL2 and the dummy pattern DMP at the folding portion FP.

[0165] A first lower sensing line DL1 may be formed on the lower surface of the intermediate base layer BLC at the first non-folded portion NFP1. The first lower sensing line DL1 may correspond to Figure 7 In addition, dummy patterns DMP and first lower sensing lines DL1 disposed between the dummy patterns DMP may be formed on the lower surface of the intermediate base layer BLC at the folded portion FP.

[0166] A lower base layer BLD may be formed below the intermediate base layer BLC at the first non-folding portion NFP1 and the folding portion FP. The lower base layer BLD may be impregnated with (e.g., embedded in) the first lower sensing line DL1 at the first non-folding portion NFP1. Accordingly, the lower base layer BLD may cover the first lower sensing line DL1 at the first non-folding portion NFP1. Furthermore, the lower base layer BLD may be impregnated with (e.g., embedded in) the dummy pattern DMP and the first lower sensing line DL1 at the folding portion FP. Accordingly, the lower base layer BLD may cover the dummy pattern DMP and the first lower sensing line DL1 at the folding portion FP.

[0167] A second lower sensing line DL2 may be formed on the lower surface of the lower base layer BLD at the first non-folded portion NFP1. The second lower sensing line DL2 may correspond to Figure 7 The dummy patterns DMP and the second lower sensing lines DL2 disposed between the dummy patterns DMP may be formed on the lower surface of the lower substrate layer BLD at the folded portion FP.

[0168] A second insulating layer IL2 may be formed below the lower base layer BLD at the first non-folding portion NFP1 and the folding portion FP. The second insulating layer IL2 may be impregnated (e.g., embedded) with the second lower sensing line DL2 at the first non-folding portion NFP1. Accordingly, the second insulating layer IL2 may cover the second lower sensing line DL2 at the first non-folding portion NFP1. Furthermore, the second insulating layer IL2 may be impregnated (e.g., embedded) with a dummy pattern DMP and the second lower sensing line DL2 at the folding portion FP. Accordingly, the second insulating layer IL2 may cover the dummy pattern DMP and the second lower sensing line DL2 at the folding portion FP.

[0169] Each of the first insulating layer IL1, the second insulating layer IL2, the intermediate base layer BLC, the upper base layer BLU, and the lower base layer BLD may include a synthetic resin. For example, each of the first insulating layer IL1, the second insulating layer IL2, the intermediate base layer BLC, the upper base layer BLU, and the lower base layer BLD may be referred to as a resin layer.

[0170] In order to make the first thickness TH1 of the first non-folding portion NFP1 and the second thickness TH2 of the folding portion FP substantially equal to each other, the dummy line DML may be provided on the upper base layer BLU only at the first non-folding portion NFP1, and the dummy pattern DMP may be provided on at least one of the middle base layer BLC, the upper base layer BLU, and the lower base layer BLD at the folding portion FP.

[0171] Accordingly, the density of the composition impregnated into the plurality of resin layers BLC, BLU, BLD, IL1, and IL2 may be adjusted to be substantially the same at the first non-folded portion NFP1 and the folded portion FP.

[0172] For example, the density of the first components (e.g., the first and second upper sensing lines UL1 and UL2, the dummy lines DML, and the first and second lower sensing lines DL1 and DL2) immersed in the resin layer at the first non-folding portion NFP1 may be equal to the density of the second components (e.g., the first and second upper sensing lines UL1 and UL2, the dummy patterns DMP, and the first and second lower sensing lines DL1 and DL2) immersed in the resin layer at the folding portion FP.

[0173] In this case, the thickness of individual resin layers may differ between the first non-folding portion NFP1 and the folding portion FP, but the total thickness of all resin layers BLC, BLU, BLD, IL1 and IL2 may be substantially the same as each other at the first non-folding portion NFP1 and the folding portion FP.

[0174] like Figure 19 and Figure 20 As shown in FIG, a plurality of through holes HL can be formed by removing a portion of the dummy pattern DMP and a portion of the base layer BL. Specifically, a portion of each of the dummy patterns DMP and a portion of the base layer BL that overlap with the cutting area CA can be removed. In a plan view, the cutting area CA can have a shape corresponding to the shape of each of the dummy patterns DMP. In a plan view, the area of ​​the cutting area CA can be smaller than the area of ​​each of the dummy patterns DMP.

[0175] Accordingly, a through hole HL penetrating the base layer BL, the first insulating layer IL1, and the second insulating layer IL2 in the thickness direction may be formed. In addition, the remaining portion of each of the dummy patterns DMP may form a guide pattern GDP. The guide pattern GDP may completely surround each of the through holes HL in a plan view.

[0176] Figure 21 、 Figure 22 and Figure 23 is a view illustrating a method of manufacturing a digitizer according to another embodiment of the present disclosure. Figure 22 It is along Figure 21 Hereinafter, the above references may be omitted or summarized in the following parts. Figures 16 to 20 A redundant description of the description of the method of manufacturing a digitizer is provided.

[0177] The following reference Figure 21 、 Figure 22 and Figure 23 The method of manufacturing a digitizer described above may be a method of manufacturing a digitizer Figures 6 to 12 Hereinafter, the above references may be omitted or summarized in the following parts. Figures 6 to 12 A redundant description of the description of the digitizer DGT is provided.

[0178] Reference Figure 21 、 Figure 22 and Figure 23 According to another embodiment of the present disclosure, a method of manufacturing a digitizer DGT may include: forming a plurality of dummy patterns DMP′ and a guide pattern GDP surrounding each of the dummy patterns DMP′ on a base layer BL at a folded portion FP; forming a sensing line positioned between the dummy patterns DMP′ in a plan view on the base layer BL at the folded portion FP; and forming a plurality of through holes HL each surrounded by the guide patterns GDP by removing all of the dummy patterns DMP′ and a portion of the base layer BL.

[0179] like Figure 21 As shown in FIG, dummy patterns DMP' may be formed on the base layer BL at the folded portion FP. The dummy patterns DMP' may include a plurality of first dummy patterns DMP1' and a plurality of second dummy patterns DMP2'. The first dummy patterns DMP1' may be spaced apart from each other in the second direction DR2. The first dummy patterns DMP1' may be spaced apart from the second dummy patterns DMP2' in the first direction DR1. The second dummy patterns DMP2' may be spaced apart from each other in the second direction DR2. The second dummy patterns DMP2' may be offset from the first dummy patterns DMP1' in the second direction DR2 by a predetermined distance.

[0180] A guide pattern GDP surrounding each of the dummy patterns DMP' in a plan view may be formed on the base layer BL at the folded portion FP. The guide pattern GDP may be spaced apart from the dummy pattern DMP'. The guide pattern GDP may have a shape corresponding to that of each of the dummy patterns DMP'.

[0181] Sensing lines positioned between the dummy patterns DMP' in a plan view may be formed on the base layer BL at the folded portion FP. For example, first extended sensing lines EL1 may be formed between the dummy patterns DMP' in a plan view. Each of the first extended sensing lines EL1 may extend in a first direction DR1 and bend along edges of the dummy pattern DMP' and edges of the guide pattern GDP.

[0182] like Figure 22 As shown in FIG, a dummy pattern DMP′, a guide pattern GDP, and a first upper sensing line UL1 may be formed on the upper surface of the middle substrate layer BLC. A dummy pattern DMP′, a guide pattern GDP, and a second upper sensing line UL2 may be formed on the upper surface of the upper substrate layer BLU. A dummy pattern DMP′, a guide pattern GDP, and a first lower sensing line DL1 may be formed on the lower surface of the middle substrate layer BLC. A dummy pattern DMP′, a guide pattern GDP, and a second lower sensing line DL2 may be formed on the lower surface of the lower substrate layer BLD.

[0183] like Figure 23 As shown in FIG, the through hole HL can be formed by removing all of the dummy pattern DMP' and a portion of the base layer BL. Specifically, all of the dummy pattern DMP' and a portion of the base layer BL that overlap with the cutting area CA can be removed. In a plan view, the cutting area CA can have a shape corresponding to the shape of each of the dummy patterns DMP' and the guide pattern GDP. In a plan view, the area of ​​the cutting area CA can be larger than the area of ​​each of the dummy patterns DMP'.

[0184] The cutting area CA may overlap the inner side of the guide pattern GDP. In other words, the entire dummy pattern DMP′ and a portion of the base layer BL may be removed using the inner side of the guide pattern GDP as a boundary.

[0185] As a result, through holes HL penetrating the base layer BL, the first insulating layer IL1, and the second insulating layer IL2 in the thickness direction may be formed, and each through hole HL is surrounded by the guide pattern GDP. The guide pattern GDP may completely surround each through hole HL in a plan view.

[0186] Figure 24 、 Figure 25 、 Figure 26 and Figure 27 is a view illustrating a method of manufacturing a digitizer according to still another embodiment of the present disclosure. Figure 25 It is along Figure 24 A cross-sectional view taken along line VIII-VIII'. Figure 27 It is along Figure 26 Hereinafter, the above references may be omitted or summarized. Figures 16 to 20 A redundant description of the description of the method of manufacturing a digitizer is provided.

[0187] The following reference Figure 24 、 Figure 25 、 Figure 26 and Figure 27 The method of manufacturing a digitizer described above may be a method of manufacturing a digitizer Figures 13 to 15 Hereinafter, the above references may be omitted or summarized in the following parts. Figures 13 to 15 A redundant description of the description of the digitizer DGT2 is provided.

[0188] Reference Figure 24 、 Figure 25 、 Figure 26 and Figure 27 According to another embodiment of the present disclosure, a method of manufacturing a digitizer DGT2 may include: forming a plurality of dummy patterns DMP″ on a base layer BL at a folded portion FP′; forming a sensing line disposed between the dummy patterns DMP″ in a plan view on the base layer BL at the folded portion FP′; and forming a plurality of through holes HL and a guide pattern GDP surrounding at least a portion of each of the through holes HL by removing a portion of the dummy pattern DMP″ and a portion of the base layer BL.

[0189] like Figure 24 and Figure 25 As illustrated in the figure, a dummy pattern DMP" may be formed on the base layer BL at the folded portion FP'. Each of the dummy patterns DMP" may include a head DMP"-HD and a stem DMP"-RD. The head DMP"-HD may have a predetermined curvature. The stem DMP"-RD may extend from the head DMP"-HD in the second direction DR2. The stem DMP"-RD may be connected to another head DMP"-HD included in the same dummy pattern DMP".

[0190] A sensing line disposed between the dummy patterns DMP″ in a plan view may be formed on the base layer BL at the folded portion FP′. For example, a first extended sensing line EL1 disposed between the dummy patterns DMP″ in a plan view may be formed. Each of the first extended sensing lines EL1 may extend in a first direction DR1 to bend along an edge of the dummy pattern DMP″. Accordingly, each of the first extended sensing lines EL1 may include a bent pattern RP adjacent to a header portion DMP″-HD of each of the dummy patterns DMP″ and having a predetermined curvature.

[0191] like Figure 26 and Figure 27As illustrated in FIG, the through hole HL may be formed by removing a portion of the dummy pattern DMP″ and a portion of the base layer BL. Specifically, a portion of each of the dummy patterns DMP″ and a portion of the base layer BL that overlap with the cutting area CA may be removed. More specifically, a portion of the head portion DMP″-HD and the entire stem portion DMP″-RD may be removed.

[0192] Accordingly, a through hole HL penetrating the base layer BL, the first insulating layer IL1, and the second insulating layer IL2 in the thickness direction may be formed. Furthermore, the remaining portion of the header DMP″-HD may form a guide pattern GDP′. The guide pattern GDP′ may surround an end portion HL-ED of each of the through holes HL. The guide pattern GDP′ may have a shape corresponding to that of the bent pattern RP.

[0193] The embodiments of the present disclosure can be applied to various display devices. For example, the embodiments of the present disclosure are applicable to display devices for vehicles, ships, and aircraft, portable communication devices, exhibition or information transmission displays, medical display devices, and the like.

[0194] The foregoing is an illustration of embodiments of the present disclosure and should not be construed as limiting thereof. Although some embodiments have been described with reference to the accompanying drawings, it will be readily appreciated by those skilled in the art that many changes and modifications may be made thereto without departing from the spirit and scope of the present disclosure as set forth in the claims.

Claims

1. A digitizer, comprising: a base layer comprising a folded portion, a first unfolded portion, and a second unfolded portion spaced apart from the first unfolded portion in a first direction, the folded portion being interposed between the first and second unfolded portions, wherein the folded portion comprises a plurality of through holes; a guide pattern provided on the base layer at the folded portion and surrounding at least a portion of each of the plurality of through holes in a plan view; and A sensing line is provided on the base layer at the folded portion, is positioned between the plurality of through-holes in the plan view, and is bent along edges of the plurality of through-holes.

2. The digitizer according to claim 1, wherein The base layer comprises: mid-basal layer; an upper substrate layer disposed above the middle substrate layer; and The lower base layer is arranged below the middle base layer.

3. The digitizer according to claim 2, wherein: The sensing line includes: a first upper sensing line, disposed on the upper surface of the intermediate base layer; a second upper sensing line, disposed on the upper surface of the upper base layer; a first lower sensing line disposed on the lower surface of the intermediate base layer; and The second lower sensing line is disposed on the lower surface of the lower base layer.

4. The digitizer of claim 2 , further comprising: a virtual line provided in the first unfolded portion and the second unfolded portion and extending in the first direction, Wherein, the dummy line is only arranged on the upper base layer.

5. The digitizer according to claim 1, wherein The guide pattern completely surrounds each of the plurality of through holes in the plan view.

6. A digitiser according to any one of claims 1 to 5, wherein: The sensing line includes a bent pattern having a predetermined curvature in the plan view, wherein each of the plurality of through holes includes an end portion having a predetermined curvature, and The guide pattern has a shape corresponding to that of the curved pattern and surrounds the end portion.

7. A method of manufacturing a digitizer, the method comprising: providing a base layer including a folded portion; forming a plurality of dummy patterns on the base layer at the folded portion; forming a sensing line disposed between the plurality of dummy patterns in a plan view on the base layer at the folded portion; as well as A plurality of through holes and a guide pattern surrounding at least a portion of each of the plurality of through holes are formed by removing a portion of each of the plurality of dummy patterns and a portion of the base layer.

8. The method according to claim 7, wherein: The base layer further includes a first non-folded portion and a second non-folded portion, the first non-folded portion and the second non-folded portion are spaced apart from each other in a first direction and the folded portion is interposed between the first non-folded portion and the second non-folded portion, The method further comprises: forming imaginary lines on the base layer at the first unfolded portion and the second unfolded portion, and The sensing line is further formed on the base layer at the first non-folding portion and the second non-folding portion.

9. The method according to claim 8, wherein The forming of the sensing line and the dummy line on the base layer at the first non-folding portion and the second non-folding portion includes: forming a first upper sensing line on an upper surface of the intermediate base layer, and forming a first lower sensing line on a lower surface of the intermediate base layer; forming an upper substrate layer covering the first upper sensing line on top of the intermediate substrate layer, and forming a lower substrate layer covering the first lower sensing line under the intermediate substrate layer; and A second upper sensing line and the dummy line spaced apart from the second upper sensing line are formed on an upper surface of the upper substrate layer, and a second lower sensing line is formed on a lower surface of the lower substrate layer.

10. The method according to any one of claims 7 to 9, in, The sensing line includes a bent pattern having a predetermined curvature in the plan view, and Each of the dummy patterns includes a head portion adjacent to the curved pattern and a stem portion extending from the head portion.

11. The method according to claim 10, wherein: In the forming of the plurality of through holes and the guide pattern, removing a portion of the head and the entire stem to form the guide pattern, Each of the plurality of through holes includes an end portion having a predetermined curvature, and The guide pattern has a shape corresponding to that of the bent pattern and surrounds the end portion.

12. A method of manufacturing a digitizer, the method comprising: providing a base layer including a folded portion; forming a plurality of dummy patterns on the base layer at the folded portion; forming a guide pattern surrounding each of the plurality of dummy patterns in a plan view on the base layer at the folded portion; forming a sensing line disposed between the plurality of dummy patterns in the plan view on the base layer at the folded portion; as well as A plurality of through holes are formed by removing all of the dummy patterns and a portion of the base layer, wherein each of the plurality of through holes is surrounded by the guide pattern.

13. The method according to claim 12, wherein: In the forming of the plurality of through holes, all of the plurality of dummy patterns are removed using an inner side of the guide pattern as a boundary.

14. The method according to claim 12 or 13, wherein: The base layer further includes a first non-folded portion and a second non-folded portion, the first non-folded portion and the second non-folded portion are spaced apart from each other in a first direction and the folded portion is interposed between the first non-folded portion and the second non-folded portion, The method further comprises: forming imaginary lines on the base layer at the first unfolded portion and the second unfolded portion, and The sensing line is further formed on the base layer at the first non-folding portion and the second non-folding portion.

15. The method according to claim 14, wherein The forming of the sensing line and the dummy line on the base layer at the first non-folding portion and the second non-folding portion includes: forming a first upper sensing line on an upper surface of the intermediate base layer, and forming a first lower sensing line on a lower surface of the intermediate base layer; forming an upper substrate layer covering the first upper sensing line on top of the intermediate substrate layer, and forming a lower substrate layer covering the first lower sensing line under the intermediate substrate layer; and A second upper sensing line and the dummy line spaced apart from the second upper sensing line are formed on an upper surface of the upper substrate layer, and a second lower sensing line is formed on a lower surface of the lower substrate layer.

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