Curing packaging equipment and packaging method of chip

Abstract

The invention relates to the field of chip packaging, in particular to chip curing and packaging equipment and a packaging method.The chip curing and packaging equipment comprises a baking oven, the interior of the baking oven is divided into multiple layers of curing units from top to bottom, each layer of curing unit comprises a rotating disc rotationally connected into the baking oven, and multiple material grooves are formed in the outer ring of each rotating disc; a material tray is placed in each material groove; according to the designed chip curing and packaging equipment, chips to be baked can be continuously added from the position of a feeding opening, meanwhile, the baked chips can be continuously taken down from the position of a discharging opening, the three links of feeding, baking and discharging are executed in an assembly line mode, packaging materials on the chips can be continuously baked and processed, and the packaging efficiency is improved. And the materials do not need to be taken after the baking temperature is reduced, so that the time is saved, the overall curing efficiency is improved, the effect of slowly reducing the temperature can be achieved by distributing the heating power of the infrared heater, and the problem of cracks or layering in the packaging material caused by thermal stress generated by rapid cooling is avoided.

Description

Technical Field

[0001] The present invention relates to the field of chip packaging, and in particular to a chip curing packaging device and a packaging method. Background Art

[0002] Chip curing packaging is used to heat and cure the packaging material injection-molded on the chip, so that the packaging material forms a hard protective shell, encapsulating the chip, bonding wires, frame and base island, protecting the chip and bonding wires, preventing mechanical external forces from damaging the chip and preventing the chip and bonding wires from moisture.

[0003] Currently, the chip curing and packaging method usually adopts the baking heating method, that is, the chip is placed in a baking oven and a specified baking temperature is set to heat and cure the packaging material. Due to the structure of the baking oven, only a certain amount of chips can be put in each baking, and they must be taken out after the baking is completed before new chips can be placed. This is relatively cumbersome. At the same time, during each loading and unloading process, it is necessary to wait for the temperature inside the baking oven to drop before manual operation can be carried out. During this waiting period, time is wasted. Moreover, when the baked chip is taken out, if the temperature of the packaging material itself is high, thermal stress may be generated due to rapid cooling, resulting in cracks or delamination inside the packaging material, causing chip packaging failure.

[0004] Therefore, in order to solve the above problems, a chip curing packaging device and a packaging method are proposed. Summary of the Invention

[0005] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0006] The technical solution adopted by the present invention to solve its technical problem is as follows: a chip curing and packaging device according to the present invention includes a baking oven, wherein the interior of the baking oven is divided into multiple layers of curing units, each layer of curing units includes a turntable rotatably connected to the baking oven, and each turntable has multiple material slots on the outer ring, each material slot has a material tray placed in it, and a chip is placed on the material tray. Infrared heaters are provided at the upper and lower positions of the turntable, and the infrared heaters are used to cure the packaging material on the chip; A plurality of feed ports are provided on the front side wall of the baking oven, each feed port corresponds to each layer of curing unit one by one, and a pushing assembly is provided at each feed port, which is used to push the material tray to the material slot on the turntable. A plurality of discharge ports are provided on one side wall of the baking oven, each discharge port corresponds to each layer of curing unit one by one, and a unloading assembly is provided at each discharge port, which is used to load and unload the material tray from the material slot on the turntable.

[0007] Preferably, each of the pushing components includes slide rails symmetrically arranged on both sides of the feed port, two adjacent slide rails are slidably connected to a slide plate, both sides of the slide plate are fixedly connected to a No. 1 spring, and the end of the No. 1 spring is fixedly connected to the front side wall of the baking oven; A strip-shaped sliding hole is provided in the middle of the slide, and the sliding hole is arranged along the width direction of the slide. A push rod is slidably connected in the sliding hole. A No. 2 spring is fixedly connected to the upper end of the push rod. The end of the No. 2 spring extends toward the front side wall of the baking oven and is fixed to the inner side wall of the slide groove. A push plate is also fixedly connected to the upper end of the push rod, and the lower end of the push rod passes downward through the sliding hole.

[0008] Preferably, the unloading assembly includes a hydraulic rod arranged above the discharge port, the output end of the hydraulic rod is horizontally pointed to the axis position of the turntable, and the output end of the hydraulic rod is fixedly connected to a pusher block; A sliding layer is provided on the inner side wall of each material trough, in which a push plate is provided. One end of the push plate is fixedly connected to an extrusion rod, and the other end of the push plate is close to a push block. The push block squeezes the push plate, and the extrusion rod pushes the material tray in the material trough away.

[0009] Preferably, the material tray includes a tray at the top, the tray is hollowed out, and extensions are symmetrically provided on both sides of the tray; Steps are symmetrically arranged on both sides of each material trough, and both sides of the tray slide along the steps and are installed in the material trough.

[0010] Preferably, an arc-shaped elastic plate is symmetrically provided on the inner side wall of each material trough, the elastic plate is located above the step, and the elastic plate is used to clamp the tray.

[0011] Preferably, an auxiliary rod is provided at the end of each of the extrusion rods, the auxiliary rod is located above the step, and the extrusion rod squeezes the material tray and the auxiliary rod squeezes the elastic plate.

[0012] Preferably, a plurality of positioning holes are provided on the outer ring of each turntable, and each group of positioning holes is provided on both sides of each material trough; Positioning rods are arranged on both sides of the end surface of each slide plate close to the front side wall of the baking oven, and the positioning rods pass through the guide holes arranged in the front side wall of the baking oven.

[0013] Preferably, a receiving plate is provided on the outer side of each discharge port, one side of the receiving plate is rotatably connected to the side wall of the baking oven, and a conveyor belt is provided on the other side of the receiving plate.

[0014] A chip curing and packaging method, wherein the chip curing and packaging method uses the above-mentioned chip curing and packaging equipment to cure and package the chip, and the chip curing and packaging method comprises the following steps: Step 1: Prepare the materials, plasma clean the substrate with the chip, and then cover the chip with the packaging material through injection molding to form a plastic packaging material; Step 2: Baking and curing: Place the plastic encapsulation material in a material tray, then put the material tray and the plastic encapsulation material into the curing packaging equipment. The plastic encapsulation material is baked in the curing packaging equipment to heat and cure the packaging material, turning it from a semi-solid state into a solid protective shell for the chip, forming a packaging blank; Step 3: Finished product: laser marking is performed on the surface of the package blank, followed by ball planting, reflow soldering, water washing and cutting to form the finished product; Step 4: Shipping. The finished products undergo appearance quality inspection and moisture baking in turn, and are finally packaged and shipped.

[0015] Preferably, when the finished product is cut in step three, a water jet is used for cutting.

[0016] The present invention is beneficial in that: 1. Compared with the existing quantitative baking and curing method, the chip curing and packaging equipment designed in the present invention can continuously add chips to be baked from the feed port and continuously remove the baked chips from the discharge port. The three links of loading, baking and unloading are performed in an assembly line, which can continuously bake the packaging materials on the processed chips without waiting for the baking temperature to drop before taking out the materials, saving time and improving the overall curing efficiency.

[0017] 2. In the present invention, by distributing the heating power of the infrared heater on the cover plate 37, the temperature can be slowly lowered, thereby avoiding thermal stress caused by rapid cooling, which may lead to cracks or delamination problems inside the packaging material. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A three-dimensional diagram of a chip curing and packaging device according to the present invention; Figure 2 This is a front view of the chip curing and packaging equipment of the present invention; Figure 3 is a three-dimensional diagram of the curing unit in the present invention; Figure 4 A top view of the curing unit of the present invention; Figure 5 for Figure 4 A partial enlarged view of point A in the middle; Figure 6 Schematic diagram of the bottom structure of the curing unit in the present invention; Figure 7 A perspective view of the turntable of the present invention; Figure 8 A three-dimensional diagram of the cover plate of the present invention; Figure 9 A perspective view of the pusher assembly of the present invention; Figure 10 A top view of the pusher assembly of the present invention; Figure 11 A perspective view of the blanking assembly of the present invention; Figure 12 for Figure 11 A partial enlarged view of point B in the middle; Figure 13 It is a side view of the blanking assembly in the present invention; Figure 14 A perspective view of the material tray of the present invention; Figure 15 This is a schematic diagram of the material tray loading and stacking state in the present invention; Figure 16 This is a flow chart of the chip curing and packaging method of the present invention.

[0019] In the figure: 1. Baking oven; 2. Curing unit; 3. Turntable; 4. Material trough; 5. Material tray; 6. Infrared heater; 7. Feed port; 8. Discharge port; 9. Slide rail; 10. Slide plate; 11. Spring No. 1; 12. Slide hole; 13. Push rod; 14. Spring No. 2; 15. Hydraulic rod; 16. Receiver plate; 17. Conveyor belt; 18. Motor; 19. Push block; 20. Slide layer; 21. Push plate; 22. Extrusion rod; 23. Spring No. 3; 24. Tray; 25. Extension; 26. Support leg; 27. Strip mouth; 28. Limit plate; 29. ​​Step; 30. Elastic plate; 31. Auxiliary rod; 32. Positioning hole; 33. Positioning rod; 34. Guide hole; 35. Gear; 36. Gear ring; 37. Cover plate; 38. Vertical axis. DETAILED DESCRIPTION

[0020] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0021] Reference Figures 1-8 A chip curing and packaging device includes a baking oven 1. The baking oven 1 is divided into multiple layers of curing units 2 in the upper and lower parts. Each layer of curing unit 2 includes a turntable 3 rotatably connected to the baking oven 1. Each turntable 3 has multiple material slots 4 on the outer ring. Each material slot 4 has a material tray 5 placed in it, and a chip is placed on the material tray 5. Infrared heaters 6 are provided at the upper and lower parts of the turntable 3 to cure the packaging material on the chip. like Figure 1 and Figure 3As shown, a plurality of feed ports 7 are provided on the front side wall of the baking oven 1, each feed port 7 corresponds to each layer of the curing unit 2 one by one, and a pushing assembly is provided at each feed port 7, which is used to push the material tray 5 to the material slot 4 on the turntable 3. A plurality of discharge ports 8 are provided on the right side wall of the baking oven 1, each discharge port 8 corresponds to each layer of the curing unit 2 one by one, and a blanking assembly is provided at each discharge port 8, which is used to load and unload the material tray 5 from the material slot 4 on the turntable 3; In this embodiment, a driving assembly is further provided under each turntable 3 to drive the turntable 3 to rotate. The driving assembly may be a motor 18, which is controlled and executed by a background control system. A gear 35 is fixedly connected to the output end of the motor 18. The gear 35 engages with a gear ring 36, and the gear ring 36 rotates coaxially with the turntable 3. Each driving assembly drives the corresponding turntable 3. The upper and lower layers of turntables 3 are connected together by a vertical shaft 38, that is, the inner ring of each turntable 3 is rotatably connected to the vertical shaft 38, and the upper and lower ends of the vertical shaft 38 are fixedly connected to the inside of the baking oven 1; A fan-shaped cover plate 37 is provided above and below each turntable 3. An infrared heater 6 is provided on the cover plate 37. The heat generated by the infrared heater 6 above each turntable 3 is radiated to the top of the chip, and the heat generated by the infrared heater 6 below each turntable 3 is radiated to the bottom surface of the chip and heats the substrate carrying the chip, so that the packaging material is heated evenly. The heating power of the infrared heaters 6 at both ends of each cover plate 37 is lower than that in the middle, so that when the packaging material enters between the infrared heaters 6, the heating temperature is slowly increased, and when the chip is removed from between the infrared heaters 6, the heating temperature is slowly decreased, thereby reducing the temperature difference between the cured packaging material and the external environment temperature, and reducing the occurrence of cracks or delamination inside the packaging material; The specific operation of the chip curing packaging equipment is as follows: Loading, the driving assembly drives the turntable 3 to rotate. When one of the material troughs 4 rotates to a position opposite to the feed port 7, the driving assembly pauses. During the pause, the pushing assembly is used to load the material, pushing the material tray 5 with the chips along the feed port 7 into the material trough 4. After that, the driving assembly drives the turntable 3 to rotate, and the turntable 3 rotates slowly. Baking: The turntable 3 gradually rotates the chip from the feed port 7 to between the upper and lower cover plates 37. The heat generated by the infrared heater 6 is radiated to the packaging material to heat and cure the packaging material. The slowly rotating turntable 3 allows the packaging material to be heated and cured for a long time. After that, the turntable 3 gradually transfers the chip from the cover plate 37 to the discharge port 8. Unloading, the material tray 5 is transferred to the discharge port 8, the material tray 5 is removed from the material trough 4 by the unloading component, and unloaded from the feed port 7; Compared with the existing quantitative baking and curing method, the chip curing and packaging equipment designed in this embodiment can continuously add chips to be baked from the feed port 7, and can continuously remove the baked chips from the discharge port 8. The three links of loading, baking and unloading are performed in an assembly line, which can continuously bake the packaging materials on the processed chips, and there is no need to wait for the baking temperature to drop before taking the materials, saving time and improving the overall curing efficiency. By distributing the heating power of the infrared heater 6, the effect of slowly lowering the temperature can be achieved, avoiding thermal stress caused by rapid cooling, which leads to cracks or delamination problems inside the packaging material.

[0022] Reference Figures 1-10 Each of the pushing components includes slide rails 9 symmetrically arranged on both sides of the feed port 7, and a slide plate 10 is slidably connected to two adjacent slide rails 9. Both sides of the slide plate 10 are fixedly connected to a No. 1 spring 11, and the end of the No. 1 spring 11 is fixedly connected to the front side wall of the baking oven 1; A strip-shaped sliding hole 12 is provided in the middle of the slide 10. The sliding hole 12 is arranged along the width direction of the slide 10. A push rod 13 is slidably connected in the sliding hole 12. A No. 2 spring 14 is fixedly connected to the upper end of the push rod 13. The end of the No. 2 spring 14 extends toward the front side wall of the baking oven 1 and is fixed to the inner side wall of the slide groove. A push plate is also fixedly connected to the upper end of the push rod 13. The lower end of the push rod 13 downwardly passes through the sliding hole 12. In this embodiment, the elastic coefficient of the No. 2 spring 14 used is greater than the elastic coefficient of the No. 1 spring 11; after the material tray 5 is placed on the slide 10, the push rod 13 in the middle position of the slide 10 is pushed, and the push rod 13 first drives the slide 10 to move along the slide rail 9, pushing the material tray 5 to the position of the feed port 7, and then the push rod 13 is pushed hard. At this time, the push rod 13 will drive the push plate to move, and the push plate pushes the material tray 5 on the slide 10, pushing the material tray 5 along the feed port 7 to the paused turntable 3, that is, pushing it into the material trough 4, and then release the push rod 13. Under the elastic force of the No. 1 spring 11 to which it is connected, the rear side of the slide 10 moves away from the front wall of the baking oven 1 and resets. At the same time, the push rod 13 is also retreated and reset under the elastic force of the No. 2 spring 14 to which it is connected.

[0023] like Figure 3 As shown, the feed port 7 is set to a flat-mouth shape, the purpose of which is to reduce the outflow of heat inside the baking oven 1 and reduce the waste of heat resources. It also reduces the heat radiation damage to the operator at the feed port 7 caused by hot air. The flat-mouth-shaped feed port 7 is matched with the pushing component, which can easily push the material tray 5 into the material slot 4 on the turntable 3, making operation convenient.

[0024] Reference Figures 1-13The unloading assembly includes a hydraulic rod 15 arranged above the discharge port 8, the output end of the hydraulic rod 15 is horizontally pointed to the axis position of the turntable 3, and the output end of the hydraulic rod 15 is fixedly connected to a pusher block 19; A sliding layer 20 is provided on the inner side wall of each material trough 4, and a push plate 21 is provided in the sliding layer 20. One end of the push plate 21 is fixedly connected to an extrusion rod 22, and the other end of the push plate 21 is close to the push block 19. The push block 19 squeezes the push plate 21, and the extrusion rod 22 pushes the material tray 5 in the material trough 4 away. The dried chips are transferred to the discharge port 8 position, the turntable 3 stops running, and then the unloading assembly is driven, the hydraulic rod 15 drives the pushing block 19, the pushing block 19 moves toward the discharge port 8, and at the same time the pushing block 19 squeezes the pushing plate 21, and the pushing plate 21 moves along the slide slot, and the pushing plate 21 pushes the material tray 5 in the material trough 4 away and pushes it out along the discharge port 8; then the hydraulic rod 15 drives the pushing block 19 away from the discharge port 8 to reset, and at the same time, the pushing plate 21 retreats away from the discharge port 8 under the elastic force of the No. 3 springs 23 connected on both sides thereof to reset, completing the unloading link. After the unloading is completed, the turntable 3 continues to rotate; the discharge port 8 is also set in a flat shape, and its purpose is also to reduce the outflow of heat inside the baking oven 1, reduce the waste of heat resources, and reduce the heat radiation damage to the operator when taking materials.

[0025] Reference Figures 1-15 The material tray 5 includes a tray 24 at the top, the tray 24 is hollowed out, and extensions 25 are symmetrically provided on both sides of the tray 24; Steps 29 are symmetrically provided on both sides of each material trough 4, and both sides of the tray 24 slide along the steps 29 and are installed in the material trough 4; The material tray 5 provided in the embodiment of the present invention not only takes into account the stability of the upper and lower stacking of the material tray 5, but also takes into account the convenience of loading; firstly, in terms of the convenience of loading, support legs 26 are symmetrically provided on both sides of the bottom of each tray 24. When the upper and lower material trays 5 are stacked, the support legs 26 at the bottom of the upper tray 24 can be embedded in the strip openings 27 provided on both sides of the lower tray 24. At the same time, limit plates 28 are also provided on the support legs 26. The limit plates 28 are used to constrain the depth of the support legs 26 embedded in the strip openings 27 to ensure that the upper and lower material trays 5 are neatly stacked; secondly, in terms of the convenience of loading, the upper and lower material trays 5 are neatly stacked, and the chips can be placed on the tray 24 in advance to prepare for the loading link. When loading, the extensions 25 on both sides of the tray 24 are placed on the steps 29 and can slide into the material trough 4 along the steps 29, and slide out of the material trough 4, so as to facilitate the loading of the material tray 5.

[0026] Reference Figures 1-13 , an arc-shaped elastic plate 30 is symmetrically provided on the inner side wall of each material trough 4, the elastic plate 30 is located above the step 29, and the elastic plate 30 is used to clamp the tray 24; An elastic plate 30 is set in each material slot 4. After the tray 24 slides into the material slot 4 along the step 29, the extensions 25 on both sides of the tray 24 will be squeezed on the step 29 by the elastic plate 30, squeezing the tray 24 to stabilize it. Even if the turntable 3 vibrates during the rotation process, the material tray 5 can be stabilized in the material slot 4, ensuring that the heat source can be fully and evenly radiated to the packaging material covering the chip.

[0027] Reference Figures 1-13 , an auxiliary rod 31 is provided at the end of each of the extrusion rods 22, the auxiliary rod 31 is located above the step 29, and the extrusion rod 22 squeezes the material tray 5, and the auxiliary rod 31 squeezes the elastic plate 30; The auxiliary rod 31 is used to squeeze and support the elastic plate 30, and assist the blanking component in pushing the material tray 5 away from the material. When the pushing plate 21 cooperates with the squeezing rod 22 to squeeze and push the material tray 5 away, the auxiliary rod 31 slides along the top of the step 29 and squeezes the elastic plate 30 upward, so that the elastic plate 30 no longer squeezes the material tray 5. At this time, the material tray 5 is in a free state on the step 29, and the squeezing rod 22 can smoothly squeeze the material tray 5 out of the material trough 4. If the squeezing rod 22 squeezes the material tray 5, the elastic plate 30 is still squeezed on the material tray 5. At the moment the material tray 5 is separated from the elastic plate 30, the material tray 5 suddenly loses resistance. At this time, the material tray 5 has the problem of sliding toward the discharge port 8 by itself, which makes the material tray 5 unstable when triggering the blanking.

[0028] Reference Figures 1-10 , a plurality of positioning holes 32 are provided on the outer ring of each turntable 3, and each group of positioning holes 32 is provided on both sides of each material trough 4; Positioning rods 33 are provided on both sides of the end surface of each slide 10 close to the front side wall of the baking oven 1, and the positioning rods 33 pass through the guide holes 34 provided on the front side wall of the baking oven 1; The positioning holes 32 provided on the turntable 3 are used to guide the movement of the slide 10 so that the slide 10 can accurately push the material tray 5 into the material trough 4. The specific operation is as follows: the turntable 3 stops rotating and pushes the slide 10. The slide 10 drives the positioning rod 33 to be inserted into the guide hole 34. The guide hole 34 cooperates with the positioning rod 33 to constrain the movement path of the slide 10, so that the slide 10 can accurately push the material tray 5 into the material trough 4.

[0029] Reference Figures 1-6 , a receiving plate is provided on the outside of each discharge port 8, one side of the receiving plate 16 is rotatably connected to the side wall of the baking oven 1, and the other side of the receiving plate 16 is provided; A receiving plate 16 is provided, one side of which is connected to the output end of the reduction motor. The reduction motor can drive the receiving plate 16 to deflect and rotate from a horizontal state to a tilted downward state. When the unloading component pushes the material tray 5 to the position of the discharge port 8, the receiving plate 16 is in a horizontal state. When the material tray 5 is placed on the receiving plate 16, the receiving plate 16 rotates slowly, and the other side of the receiving plate 16 is tilted toward the conveyor belt 17. Under the guidance of the inclined receiving plate 16, the material tray 5 slides onto the conveyor belt 17, and the conveyor belt 17 transports it away from the chip curing packaging equipment, which is convenient for removing the material tray 5.

[0030] Reference Figure 16 A chip curing and packaging method is provided, wherein the chip curing and packaging method uses the above-mentioned chip curing and packaging equipment to cure and package the chip, and the chip curing and packaging method comprises the following steps: Step 1: Prepare the materials, plasma clean the substrate with the chip, and then cover the chip with the packaging material through injection molding to form a plastic packaging material; Step 2: Baking and curing: Place the plastic encapsulation material in the material tray 5, then put the material tray 5 together with the plastic encapsulation material into the curing and packaging equipment. The plastic encapsulation material is baked in the curing and packaging equipment to heat and cure the packaging material, turning it from a semi-solid state into a solid protective shell for the chip, forming a packaging blank; Step 3: Finished product: laser marking is performed on the surface of the package blank, followed by ball planting, reflow soldering, water washing and cutting to form the finished product; Step 4: Shipping. The finished products undergo appearance quality inspection and moisture baking in turn, and are finally packaged and shipped.

[0031] When the finished product is cut in step three, a water jet is used for cutting.

[0032] Working principle: The specific operation of the chip curing packaging equipment is as follows: Loading, the driving assembly drives the turntable 3 to rotate. When one of the material troughs 4 rotates to a position opposite to the feed port 7, the driving assembly pauses. During the pause, the pushing assembly is used to load the material, pushing the material tray 5 with the chips along the feed port 7 into the material trough 4. After that, the driving assembly drives the turntable 3 to rotate, and the turntable 3 rotates slowly. Baking: The turntable 3 gradually rotates the chip from the feed port 7 to between the upper and lower cover plates 37. The heat generated by the infrared heater 6 is radiated to the packaging material to heat and cure the packaging material. The slowly rotating turntable 3 allows the packaging material to be heated and cured for a long time. After that, the turntable 3 gradually transfers the chip from the cover plate 37 to the discharge port 8. Unloading, the material tray 5 is transferred to the discharge port 8, the material tray 5 is removed from the material trough 4 by the unloading component, and unloaded from the feed port 7; Then repeat the steps of loading, baking and unloading in sequence.

[0033] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the foregoing embodiments. The foregoing embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip curing and packaging device, characterized by: The oven comprises a baking oven, wherein the interior of the oven is divided into multiple layers of curing units, each layer of curing units comprising a turntable rotatably connected to the oven, each turntable having multiple material slots on the outer ring, each of which contains a material tray, on which chips are placed, and infrared heaters are provided at the upper and lower positions of the turntable for curing the packaging material on the chips; A plurality of feed ports are provided on the front side wall of the baking oven, each feed port corresponds to each layer of curing unit one by one, and a pushing assembly is provided at each feed port, which is used to push the material tray to the material slot on the turntable. A plurality of discharge ports are provided on one side wall of the baking oven, each discharge port corresponds to each layer of curing unit one by one, and a unloading assembly is provided at each discharge port, which is used to load and unload the material tray from the material slot on the turntable.

2. The chip curing and packaging equipment according to claim 1, characterized in that: Each of the pusher assemblies includes slide rails symmetrically arranged on both sides of the feed port, with slide plates slidably connected to the two adjacent slide rails, and a No. 1 spring fixedly connected to both sides of the slide plate, the end of the No. 1 spring being fixedly connected to the front side wall of the baking oven; A strip-shaped sliding hole is provided in the middle of the slide, and the sliding hole is arranged along the width direction of the slide. A push rod is slidably connected in the sliding hole. A No. 2 spring is fixedly connected to the upper end of the push rod. The end of the No. 2 spring extends toward the front side wall of the baking oven and is fixed to the inner side wall of the slide groove. A push plate is also fixedly connected to the upper end of the push rod, and the lower end of the push rod passes downward through the sliding hole.

3. The chip curing and packaging equipment according to claim 1, characterized in that: The unloading assembly includes a hydraulic rod arranged above the discharge port, the output end of the hydraulic rod is horizontally pointed to the axis position of the turntable, and the output end of the hydraulic rod is fixedly connected to a pusher block; A sliding layer is provided on the inner side wall of each material trough, in which a push plate is provided. One end of the push plate is fixedly connected to an extrusion rod, and the other end of the push plate is close to a push block. The push block squeezes the push plate, and the extrusion rod pushes the material tray in the material trough away.

4. The chip curing and packaging equipment according to claim 3, characterized in that: The material tray includes a tray at the top, the tray is hollowed out, and extensions are symmetrically arranged on both sides of the tray; Steps are symmetrically arranged on both sides of each material trough, and both sides of the tray slide along the steps and are installed in the material trough.

5. The chip curing and packaging equipment according to claim 4, characterized in that: An arc-shaped elastic plate is symmetrically arranged on the inner side wall of each material trough. The elastic plate is located above the step and is used to clamp the tray.

6. The chip curing and packaging equipment according to claim 3, characterized in that: An auxiliary rod is provided at the end of each of the extrusion rods. The auxiliary rod is located above the step, and the extrusion rod squeezes the material tray and the auxiliary rod squeezes the elastic plate.

7. The chip curing and packaging equipment according to claim 3, characterized in that: A plurality of positioning holes are provided on the outer ring of each turntable, and each group of positioning holes is provided on both sides of each material trough; Positioning rods are arranged on both sides of the end surface of each slide plate close to the front side wall of the baking oven, and the positioning rods pass through the guide holes arranged in the front side wall of the baking oven.

8. The chip curing and packaging equipment according to claim 3, characterized in that: A receiving plate is arranged on the outside of each discharge port, one side of the receiving plate is rotatably connected to the side wall of the baking oven, and a conveyor belt is arranged on the other side of the receiving plate.

9. A chip curing and packaging method, wherein the chip curing and packaging method uses the chip curing and packaging device according to any one of claims 1 to 8 to perform curing and packaging on the chip, characterized in that: The chip curing packaging method includes the following steps: Step 1: Prepare the materials, plasma clean the substrate with the chip, and then cover the chip with the packaging material through injection molding to form a plastic packaging material; Step 2: Baking and curing: Place the plastic encapsulation material in a material tray, then put the material tray and the plastic encapsulation material into the curing packaging equipment. The plastic encapsulation material is baked in the curing packaging equipment to heat and cure the packaging material, turning it from a semi-solid state into a solid protective shell for the chip, forming a packaging blank; Step 3: Finished product: laser marking is performed on the surface of the package blank, followed by ball planting, reflow soldering, water washing and cutting to form the finished product; Step 4: Shipping. The finished products undergo appearance quality inspection and moisture baking in turn, and are finally packaged and shipped.

10. The chip curing and packaging method according to claim 9, characterized in that: When the finished product is cut in step three, a water jet is used for cutting.

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