Ejector pin device for wafer bonding and control method of ejector pin device

Abstract

The invention relates to an ejector pin device for wafer bonding and a control method of the ejector pin device. The ejector pin device comprises an air cylinder, a connecting rod assembly, a guide rail, an ejector block and a base. The air cylinder is connected with the base and used for pressing down or lifting the connecting rod assembly. The connecting rod assembly comprises a counter-acting force assembly and a supporting piece. The counter-acting force assembly is used for providing upward counter-acting force when making contact with the air cylinder. The supporting piece is connected with the counter-acting force assembly and used for supporting the counter-acting force assembly; the guide rail is fixed on the base, is connected with the connecting rod assembly and is used for providing a direction for the movement of the connecting rod assembly; and the top block is connected with the connecting rod assembly and is used for applying an acting force to the wafer on the chuck so as to be used for wafer bonding. Through the ejector pin device, the initial force can start from zero, the action point of the ejector block on the wafer is ensured to be in the center of the wafer, and the process requirement is met.

Description

Technical Field

[0001] The present application mainly relates to the field of semiconductor equipment, and in particular to a ejector pin device for wafer bonding and a control method for the ejector pin device. Background Art

[0002] With the continuous development of semiconductor technology, wafer bonding has been widely used. During the bonding process, two wafers are directly bonded through intermolecular forces. At the beginning of bonding, an external initial force is applied to the wafers through a pin device to initiate bonding. This initial force must be stable and precise, so the pin device is extremely important in wafer bonding applications. As the wafer bonding process improves, the requirements for wafer edge stress, deformation, and surface symmetry after bonding are also becoming increasingly stringent. The location of the initial force has a significant impact on the wafer bonding process. Therefore, the requirements for the location of the initial force application point of the pin device are also becoming increasingly stringent.

[0003] In existing ejector pin devices, the initial force output is excessive due to the inherent weight of the connecting rod structure. Although the connecting rod structure is already very small, it still cannot meet process requirements. Reducing the weight of the connecting rod structure will lead to problems such as insufficient rigidity. Furthermore, the existing ejector pin device is fixed to the chuck and cannot be moved. Due to the positional errors of the robotic arm, the ejector pin's point of action is not always centered, affecting the alignment of the wafer bonding process. Summary of the Invention

[0004] One purpose of the present application is to provide a pin device for wafer bonding and a control method for the pin device, so as to solve the problems in the prior art that the initial force output of the pin device is too large and does not meet the process requirements, and the action point of the pin device is not necessarily at the center, which affects the accuracy of wafer bonding.

[0005] According to one aspect of the present application, there is provided an ejector pin device for wafer bonding, the ejector pin device comprising: a cylinder, a connecting rod assembly, a guide rail, an ejector block and a base;

[0006] The cylinder is connected to the base and is used to press down or lift the connecting rod assembly;

[0007] The connecting rod assembly includes a reaction force assembly and a support member;

[0008] The reaction force assembly is used to provide an upward reaction force when contacting the cylinder;

[0009] The support member is connected to the reaction force assembly and is used to support the reaction force assembly;

[0010] The guide rail is fixed on the base and connected to the connecting rod assembly to provide a direction for the movement of the connecting rod assembly;

[0011] The top block is connected to the connecting rod assembly and is used to apply force to the wafer on the chuck for wafer bonding.

[0012] Optionally, the ejector device includes a displacement sensor, which is fixed on the base and connected to the support member, and is used to feedback the position of the ejector block.

[0013] Optionally, the reaction force assembly includes a magnetic spring and a snap connection;

[0014] The magnetic spring is used to provide an upward reaction force when the cylinder presses down on the magnetic spring;

[0015] The clamping part is connected to the supporting member and is used to fasten the magnetic spring.

[0016] Optionally, the magnetic spring is connected to the top block, and the guide rail is fixed to the side of the clamping connection, and is used to drive the magnetic spring and the top block to press downward, thereby applying a force to the wafer on the chuck.

[0017] Optionally, the magnetic spring includes a magnetic shaft and a magnetic sleeve, the clamp fastens the magnetic shaft, and the magnetic shaft is sleeved on the magnetic sleeve located below the clamp;

[0018] When the cylinder presses down on the magnetic shaft, the magnetic shaft moves in the magnetic sleeve to form an upward reaction force.

[0019] Optionally, the reaction force assembly further includes a contact member and an upward cylinder;

[0020] The contact member is fixed above the support member, and the upward cylinder is connected to the support member;

[0021] When the cylinder moves downward, it contacts the contact piece, and the upward cylinder provides an upward reaction force.

[0022] Optionally, the support member is connected to the top block, and the guide rail is fixed to a side surface of the support member, and is used to drive the support member and the top block to press downward, thereby applying a force to the wafer on the chuck.

[0023] Optionally, the reaction force assembly includes a proportional valve, which is connected to the upward cylinder and is used to control the reaction force value provided by the upward cylinder.

[0024] Optionally, the ejector device includes a force sensor and a connecting plate, the connecting plate is used to connect the force sensor and the cylinder, and the force sensor is fixed on the base to feed back the pressure of the cylinder in the vertical direction.

[0025] According to another aspect of the present application, a control method for an ejector device is also provided, the method comprising:

[0026] The ejector device as described above is installed on the mobile platform, and the wafer on the chuck is pressed down by the ejector device;

[0027] In response to the pressing operation, obtaining image information of the chuck in a first direction, and determining first deviation data between a center of the top block and a center of the chuck;

[0028] Obtaining image information of the chuck in a second direction, and determining second deviation data between the center of the wafer and the center of the chuck;

[0029] determining an offset between a center of a wafer and a center of a top block according to the first deviation data and the second deviation data; and

[0030] The movable platform is driven to move according to the offset, so as to control the ejector device to move to the center of the wafer.

[0031] Optionally, obtaining image information of the chuck in the second direction and determining second deviation data between the center of the wafer and the center of the chuck includes:

[0032] Acquire image information of a plurality of shooting positions of the chuck in a second direction;

[0033] Determine the edge of the wafer and the edge of the chuck light-transmitting groove based on image information at multiple shooting positions;

[0034] Calculate the center of the wafer based on the edge of the wafer, and calculate the center of the chuck based on the edge of the chuck light-transmitting slot; and

[0035] A second deviation data between the center of the wafer and the center of the chuck is determined.

[0036] According to another aspect of the present application, a computer-readable storage medium is provided, on which computer instructions are stored. When the computer instructions are executed by a processor, the control method of the ejector device as described above is implemented.

[0037] Compared with the prior art, the ejector device described in this application includes a cylinder, a connecting rod assembly, a guide rail, an ejector block, and a base; the cylinder is connected to the base and is used to press down or lift the connecting rod assembly; the connecting rod assembly includes a reaction force assembly and a support member; the reaction force assembly is used to provide an upward reaction force when it contacts the cylinder; the support member is connected to the reaction force assembly and is used to support the reaction force assembly; the guide rail is fixed to the base and connected to the connecting rod assembly to provide a direction for the movement of the connecting rod assembly; the ejector block is connected to the connecting rod assembly and is used to apply a force to the wafer on the chuck for wafer bonding. Through this ejector device, the initial force can be started from zero, improving the quality of wafer bonding. In addition, the ejector device is installed on a mobile platform, and the offset between the center of the wafer and the center of the ejector block is determined by a calibration conversion method, thereby driving the mobile platform to move to control the ejector device to move to the position of the wafer center. By adjusting the ejector device in real time, the initial force is always applied to the center of the wafer, meeting process requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to make the above-mentioned objects, features and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings, wherein:

[0039] Figure 1 A schematic structural diagram of a ejector pin device for wafer bonding provided according to one aspect of the present application is shown;

[0040] Figure 2 A connection method between the top block and the connecting rod assembly in one embodiment of the present application is shown;

[0041] Figure 3 Another connection method between the top block and the connecting rod assembly in one embodiment of the present application is shown;

[0042] Figure 4 A schematic structural diagram of an ejector device using a magnetic spring in one embodiment of the present application is shown;

[0043] Figure 5 A schematic diagram showing a partial structure of an ejector device when a magnetic spring is used in one embodiment of the present application;

[0044] Figure 6 A schematic diagram showing the use of an ejector device in one embodiment of the present application is shown;

[0045] Figure 7 A schematic structural diagram of an ejector device using an upward cylinder in one embodiment of the present application is shown;

[0046] Figure 8 A schematic flow chart showing a control method for an ejector device according to another aspect of the present application is provided;

[0047] Figure 9 A schematic diagram of an A-direction view of an embodiment of the present application is shown;

[0048] Figure 10 A schematic diagram showing image information of an A-direction view in one embodiment of the present application is shown;

[0049] Figure 11 A schematic diagram of a B-direction view in one embodiment of the present application is shown;

[0050] Figure 12 A schematic diagram of image information of the B-direction view in one embodiment of the present application is shown.

[0051] The same or similar reference numerals in the drawings represent the same or similar components. DETAILED DESCRIPTION

[0052] In order to make the above-mentioned objectives, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below with reference to the accompanying drawings.

[0053] In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application may also be implemented in other ways different from those described herein. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0054] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0055] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood to refer to the orientations depicted in that section and the accompanying drawings. These relative terms are used solely for convenience of description and do not necessarily imply that the devices described herein must be manufactured or operated in a specific orientation. Therefore, they should not be construed as limiting the present application.

[0056] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various pipes, channels, components, areas, layers and / or parts, these components, areas, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different pipes, channels, components, areas, layers and / or parts.

[0057] Figure 1A structural schematic diagram of a pin device for wafer bonding provided according to one aspect of the present application is shown, wherein the pin device includes: a cylinder 10, a connecting rod assembly 20, a guide rail 30, a ejector block 40 and a base 1; the cylinder 10 is connected to the base 1 for pressing down or lifting the connecting rod assembly 20; the connecting rod assembly 20 includes a reaction force assembly 21 (not shown) and a support member 22 (not shown); the reaction force assembly 21 is used to provide an upward reaction force when it contacts the cylinder 10; the support member 22 is connected to the reaction force assembly 21 for supporting the reaction force assembly 21; the guide rail 30 is fixed on the base 1 and connected to the connecting rod assembly 20 for providing a direction for the movement of the connecting rod assembly 20; the ejector block 40 is connected to the connecting rod assembly 20 for applying a force to the wafer on the chuck 50 for wafer bonding.

[0058] The base 1 is used as a fixing device for the ejector device to fix other components. The base 1 can use an inverted L-shaped structure. The cylinder 10 can be fixed to the horizontal part of the base 1. The cylinder 10 can be a downward-lifting cylinder for pressing or lifting the connecting rod assembly 20. When the cylinder 10 drives the connecting rod assembly 20 to move, the moving direction is provided by the guide rail 30 fixed to the connecting rod assembly 20. The guide rail is also fixed to the side of the base 1. A sliding block can be set on the guide rail 40. The sliding block drives the connecting rod assembly 20 to move downward or lift upward; the connecting rod assembly 20 includes The reaction force assembly 21 and the support member 22 for supporting and fixing the reaction force assembly 21 are included. When the cylinder 10 presses down on the reaction force assembly 21, the reaction force assembly 21 provides an upward reaction force to offset the gravity of the connecting rod assembly 20 itself, so that the output force of the entire device can start from zero initial force; the top block 40 is connected to the bottom end of the connecting rod assembly 20. When the connecting rod assembly 20 moves, it drives the top block 40 at the bottom to move. When pressed downward, it contacts the wafer on the chuck 50 located below the ejector device and applies force to the wafer.

[0059] It should be noted that when the top block 40 is connected to the bottom end of the connecting rod assembly 20, Figure 2 As shown, it can be connected to the bottom end of the reaction force component 21 in the connecting rod component 20. At this time, the reaction force component 21 plays the role of pressing the top block downward; Figure 3 As shown, the top block 40 can also be connected to the bottom end of the support member 22. In this case, the support member 22 can use an inverted L structure, the horizontal portion is used to fix the support reaction force component 21, the side is connected to the guide rail 30, and the bottom end of the side is used to connect the top block 40, thereby pressing the top block 40 downward under the sliding of the guide rail.

[0060] In one embodiment of the present application, the ejector device includes a displacement sensor 60, which is fixed to the base 1 and connected to the support member 22 to provide feedback on the position of the ejector block 40. The displacement sensor 60 and the support member 22 can be connected by screws. When the connecting rod assembly 20 is pressed downward or lifted upward by the cylinder 10, the connecting rod assembly 20 slides on the guide rail 40, and the displacement sensor 60 monitors the displacement of the connecting rod assembly 20.

[0061] In one embodiment of the present application, the reaction force assembly 21 includes a magnetic spring 211 and a clamp 212; the magnetic spring 211 is used to provide an upward reaction force when the cylinder 10 presses down on the magnetic spring 211; the clamp 212 is connected to the support member 22 to fasten the magnetic spring 211. Figure 4 One end of the support member 22 is connected to the displacement sensor 60, and the other end is fixed to the clamping joint 212. The clamping joint 212 supports the magnetic spring 211. The cylinder 10 moves downward and contacts the magnetic spring 211. The magnetic spring 211 provides an upward reaction force to offset the self-gravity of the connecting rod assembly 20, so that the output force of the entire ejector device can start from 0mN.

[0062] refer to Figure 4 , the magnetic spring 211 is connected to the top block 40, and the guide rail 30 is fixed to the side of the clamping joint 212, which is used to drive the magnetic spring 211 and the top block 40 to press down, thereby applying a force to the wafer on the chuck. Here, the side of the clamping joint 212 is connected to the guide rail 30, so that the clamping joint 212 and the support member 22 where the clamping joint 212 is located can be driven to move together through the guide rail 40. Because the clamping joint 212 tightens the magnetic spring 211, when the clamping joint moves up and down, the magnetic spring 211 also moves up and down. The top block 40 is connected to the magnetic spring 211. When the cylinder 10 presses the magnetic spring 211 downward, the top block 40 moves downward and contacts the surface of the chuck 50, providing initial force for bonding.

[0063] refer to Figure 5The magnetic spring 211 includes a magnetic shaft 01 and a magnetic sleeve 02. The clamp 212 fastens the magnetic shaft 01, and the magnetic shaft 01 is sleeved on the magnetic sleeve 02 located below the clamp. When the cylinder is pressed down on the magnetic shaft 01, the magnetic shaft 01 moves in the magnetic sleeve 02 to form an upward reaction force. Here, the clamp 212 fastens the magnetic shaft 01, and the upper end of the magnetic shaft 01 is connected to the cylinder 10 and sleeved in the magnetic sleeve 02 to move up and down. The magnetic spring achieves stable and continuous reverse force output through the interaction between the two permanent magnets of the magnetic sleeve and the magnetic shaft. The reaction force of the magnetic spring at each position within the travel range is equal, and the magnitude of the reaction force can be adjusted by the amount of magnetization. By using a passive constant-force magnetic spring, the reaction force component does not require external driving force, thereby making the structure of the entire ejector device compact and able to maintain the accuracy of the downward pressure point of the ejector block on the wafer, so that the quality of wafer bonding can be greatly improved, greatly meeting the process requirements.

[0064] In one embodiment of the present application, the ejector device includes a force sensor 70 and a connecting plate 80. The connecting plate 80 is used to connect the force sensor 70 and the cylinder 10. The force sensor 70 is fixed on the base 1 and is used to feedback the vertical pressure of the cylinder 10. Figure 4 As shown, the force sensor 70 is fixed on the base 1 of the ejector device, and the lower end is connected to the cylinder 10 through the connecting plate 80, so as to monitor the pressure of the cylinder 10 in the vertical direction.

[0065] refer to Figure 4 The displacement sensor 60 and the guide rail 40 are fixed to the side of the base of the ejector device. The ejector device is installed on a movable platform 90 that can move in the X-axis and Y-axis directions. The position of the ejector device is controlled by the movable platform 90. Figure 6 As shown, the movable platform 90 is mounted on the upper chuck a, the lower surface of the upper chuck a is used to place the upper wafer b, and the upper surface of the lower chuck c is used to place the lower wafer d, so that under the pressure applied by the ejector device 100, the upper wafer b and the lower wafer d are bonded.

[0066] In another embodiment of the present application, the reaction force assembly 21 further includes a contact member 213 and an upward cylinder 214; the contact member 213 is fixed above the support member 22, and the upward cylinder 214 is connected to the support member 22; when the cylinder 10 moves downward and contacts the contact member 213, the upward cylinder 214 provides an upward reaction force. Figure 7As shown, the reaction force component 21 can use an upward cylinder. At this time, a contact member 213 is provided and placed above the support member 22. The contact member 213 moves downward under the drive of the cylinder 10, and the upward cylinder 214 connected to the support member 22 provides an upward reaction force after being subjected to pressure, thereby offsetting the influence of the component's own gravity. At this time, the components include the support member, the contact member and the upward cylinder.

[0067] Continuing from the above embodiment, the support member 22 is connected to the top block 40, and the guide rail 30 is fixed to the side of the support member 22 to drive the support member 22 and the top block 40 to press down and apply force to the wafer on the chuck 50. Figure 7 The support member 200 uses an inverted L-shaped component. The contact member 213 is fixed on the horizontal part of the support member 22, and screws are installed on the horizontal part to fix the displacement sensor 60 below. The side fixes the guide rail 30, and the upward cylinder 214 is connected to the side of the support member 22 through a connecting structure. The bottom of the support member 22 can be connected to the top block 40 through a connecting rod connection; when the cylinder 10 acts downward, it contacts the upper surface of the contact member 213. At this time, an upward force is provided to the upward cylinder 214, thereby offsetting the self-gravity of the movable parts. At this time, the movable parts include the contact member, the upward cylinder and the support member; the support member 200 slides on the guide rail 30, driving the top block 40 at the bottom to press down the wafer on the chuck 50.

[0068] The reaction force assembly 21 includes a proportional valve 215 (not shown), which is connected to the upward cylinder 214 and is used to control the reaction force provided by the upward cylinder 214. Here, the force provided by the upward cylinder 214 can be precisely controlled using the proportional valve. The magnitude of the controlled force is the self-weight of the movable component, thereby offsetting the effect of gravity on the initial force.

[0069] Figure 8 A flow chart illustrating a control method for an ejector device according to another aspect of the present application is provided. The method comprises: installing the ejector device described above on a mobile platform, and using the ejector device to press down a wafer on a chuck; in response to the pressing operation, acquiring image information of the chuck in a first direction and determining first deviation data between the center of the ejector block and the center of the chuck; acquiring image information of the chuck in a second direction and determining second deviation data between the center of the wafer and the center of the chuck; determining an offset between the center of the wafer and the center of the ejector block based on the first and second deviation data; and driving the mobile platform to move based on the offset to control the ejector device to move to the center of the wafer. This enables real-time adjustment of the ejector device, ensuring that the initial force always acts on the center of the wafer.

[0070] refer to Figure 6 The ejector device 100 is installed on the mobile platform 90, which uses an X / Y micro-motion platform. When the cylinder moves downward and contacts the connecting rod assembly, the reaction force assembly in the connecting rod assembly provides an upward reaction force, thereby offsetting the self-gravity. The ejector block connected to the connecting rod assembly begins to apply pressure to the wafer on the chuck. Before applying pressure, the position of the downward pressure point of the ejector block is adjusted so that the initial force acts on the center of the wafer. The difference between the center of the ejector block and the center of the wafer can be calculated by calibration conversion. The ejector device can be adjusted in real time through the mobile platform, that is, the position of the downward pressure point of the ejector block is adjusted so that the initial force always acts on the center of the wafer, thereby ensuring the bonding quality of the upper wafer and the lower wafer. The specific process is as follows:

[0071] When responding to the downward pressing operation of the top block, the image information of the first direction of the chuck is obtained, and the first direction refers to the direction in which the shooting device shoots from the bottom of the chuck upward, such as Figure 9 The A-direction view shown represents a first direction, wherein the photographing device 2 is used to take a picture in the A-direction view below the upper chuck to obtain picture information in the A-direction view; Figure 10 As shown, C represents the top block and D represents the chuck. The circle where the top block is located and the center hole circle of the chuck can be obtained from the captured image information. The center of the top block can be calculated using the circle where the top block is located, and the center of the chuck can be calculated using the center hole circle of the chuck. The first deviation data between the center of the top block and the center of the chuck can be recorded.

[0072] Next, obtain image information of the second direction of the chuck, and use the image information of the second direction to identify the deviation data between the center of the wafer and the center of the top block. In one embodiment of the present application, image information of the chuck at multiple shooting positions in the second direction can be obtained; the edge of the wafer and the edge of the chuck light-transmitting groove are determined based on the image information at the multiple shooting positions; the center of the wafer is calculated based on the edge of the wafer, and the center of the chuck is calculated based on the edge of the light-transmitting groove of the chuck; and the second deviation data between the center of the wafer and the center of the chuck is determined.

[0073] The second direction refers to the direction of shooting downward from above the chuck using multiple shooting devices, such as Figure 11 The B-direction view shown represents the second direction. The shooting position refers to the position of the light-transmitting slot. The number of shooting devices is determined according to the number of light-transmitting slots on the chuck. For example, if there are four light-transmitting slots, four shooting devices 2 are used to shoot the light-transmitting slots at four locations to obtain four picture information. Figure 12As shown, E represents the edge segment of the light-transmitting groove, and F represents the edge segment of the wafer. Each image includes information about the edge segment of the light-transmitting groove and the edge segment of the wafer. Then, based on the information about the edge segments of the light-transmitting groove at four locations, a circle where the light-transmitting groove is located is fitted, and the center of the circle where the light-transmitting groove is located is calculated, which is also the center of the chuck. Based on the information about the edge segments of the wafer at four locations, a circle where the wafer is located is fitted, and the center of the wafer is obtained. The deviation data between the center of the wafer and the center of the chuck is recorded. With the center of the chuck as the middle value, the offset between the center of the wafer and the center of the ejector block is calculated. The mobile platform is driven according to the offset, and the ejector pin device is automatically controlled to move and center through the mobile platform, so that the ejector block reaches the center of the wafer.

[0074] The present application also provides a computer-readable storage medium having computer instructions stored thereon. When the computer instructions are executed by a processor, the control method of the ejector device as described above is implemented.

[0075] The basic concepts have been described above. It will be apparent to those skilled in the art that the above disclosures are merely illustrative and do not constitute limitations on this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and amendments to this application. Such modifications, improvements, and amendments are suggested in this application and remain within the spirit and scope of the exemplary embodiments of this application.

[0076] At the same time, this application uses specific terms to describe the embodiments of this application. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "one embodiment," "an embodiment," or "an alternative embodiment" mentioned twice or multiple times in different locations in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application may be appropriately combined.

[0077] In some embodiments, numbers are used to describe the quantity of components and attributes. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise stated, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the description and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the settings of such numerical values ​​are as accurate as possible within the feasible range.

Claims

1. A pin device for wafer bonding, characterized in that: The ejector device comprises: a cylinder, a connecting rod assembly, a guide rail, an ejector block and a base; The cylinder is connected to the base and is used to press down or lift the connecting rod assembly; The connecting rod assembly includes a reaction force assembly and a support member; The reaction force assembly is used to provide an upward reaction force when contacting the cylinder; The support member is connected to the reaction force assembly and is used to support the reaction force assembly; The guide rail is fixed on the base and connected to the connecting rod assembly to provide a direction for the movement of the connecting rod assembly; The top block is connected to the connecting rod assembly and is used to apply force to the wafer on the chuck for wafer bonding.

2. The ejector device according to claim 1, characterized in that: The ejector device includes a displacement sensor, which is fixed on the base and connected to the support member, and is used to feedback the position of the ejector block.

3. The ejector device according to claim 1, characterized in that: The reaction force assembly includes a magnetic spring and a snap connection; The magnetic spring is used to provide an upward reaction force when the cylinder presses down on the magnetic spring; The clamping part is connected to the supporting member and is used to fasten the magnetic spring.

4. The ejector device according to claim 3, characterized in that: The magnetic spring is connected to the top block, and the guide rail is fixed to the side of the clamping joint, and is used to drive the magnetic spring and the top block to press down, thereby applying a force to the wafer on the chuck.

5. The ejector device according to claim 3, characterized in that: The magnetic spring includes a magnetic shaft and a magnetic sleeve, the clamp fastens the magnetic shaft, and the magnetic shaft is sleeved on the magnetic sleeve located below the clamp; When the cylinder presses down on the magnetic shaft, the magnetic shaft moves in the magnetic sleeve to form an upward reaction force.

6. The ejector device according to claim 1, characterized in that: The reaction force assembly further includes a contact member and an upward cylinder; The contact member is fixed above the support member, and the upward cylinder is connected to the support member; When the cylinder moves downward, it contacts the contact piece, and the upward cylinder provides an upward reaction force.

7. The ejector device according to claim 6, characterized in that: The support member is connected to the top block, and the guide rail is fixed to the side surface of the support member and is used to drive the support member and the top block to press downward to apply force to the wafer on the chuck.

8. The ejector device according to claim 6, characterized in that: The reaction force assembly includes a proportional valve, which is connected to the upward cylinder and is used to control the reaction force value provided by the upward cylinder.

9. The ejector device according to claim 1, characterized in that: The ejector device includes a force sensor and a connecting plate. The connecting plate is used to connect the force sensor and the cylinder. The force sensor is fixed on the base and is used to feed back the pressure of the cylinder in the vertical direction.

10. A control method for an ejector device, characterized in that: The method comprises: Installing an ejector device according to any one of claims 1 to 9 on the mobile platform, and using the ejector device to press down the wafer on the chuck; In response to the pressing operation, obtaining image information of the chuck in a first direction, and determining first deviation data between a center of the top block and a center of the chuck; Obtaining image information of the chuck in a second direction, and determining second deviation data between the center of the wafer and the center of the chuck; determining an offset between a center of a wafer and a center of a top block according to the first deviation data and the second deviation data; and The movable platform is driven to move according to the offset, so as to control the ejector device to move to the center of the wafer.

11. The method according to claim 10, characterized in that Obtaining image information of the chuck in the second direction and determining second deviation data between the center of the wafer and the center of the chuck, including: Acquire image information of a plurality of shooting positions of the chuck in a second direction; Determine the edge of the wafer and the edge of the chuck light-transmitting groove based on image information at multiple shooting positions; Calculate the center of the wafer based on the edge of the wafer, and calculate the center of the chuck based on the edge of the chuck light-transmitting slot; and A second deviation data between the center of the wafer and the center of the chuck is determined.

12. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the control method of the ejector device according to claim 10 or 11 is implemented.

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