Power supply device and method for manufacturing power supply device

Abstract

The invention provides a power supply device and a method for manufacturing the power supply device, which can easily position two substrates in connection. A power supply device is provided with a lower substrate, an upper substrate disposed so as to face the lower substrate, and a plurality of substrate connection members (10) that connect the lower substrate and the upper substrate, the substrate connection members having: a main body section that defines the positions of the lower substrate and the upper substrate in the direction (D1) by the lower substrate being brought into contact with the bottom surface thereof and the upper substrate being brought into contact with the upper surface thereof; a protruding part (11) that protrudes from the bottom surface of the main body part and positions the main body part in a direction (D2) perpendicular to the direction (D1) with respect to the lower substrate; and a protruding part (12) which protrudes from the upper surface of the main body part and positions the main body part relative to the upper substrate in a direction (D2) perpendicular to the direction (D1), a plurality of positioning holes (31) which are embedded with the protruding part are arranged on the lower substrate, and a plurality of positioning holes which are embedded with the protruding part are arranged on the upper substrate.

Description

Technical Field

[0001] The present invention relates to a power supply device and a method for manufacturing the power supply device. Background Art

[0002] Patent document 1 discloses a wiring substrate, a method for manufacturing the same, and a columnar terminal for the wiring substrate. The wiring substrate is a wiring substrate having a first substrate connected to a second substrate. A plurality of electrodes are arranged on the main surface of the first substrate. A plurality of columnar terminals for connection to the second substrate are bonded to the plurality of electrodes via solder portions. The columnar terminal comprises: a columnar terminal body made of a conductive material; and a solder resist layer made of a material having lower solder wettability than the columnar terminal body and covering the center portion of the outer peripheral surface of the columnar terminal body in the height direction. The columnar terminal has a shape that is symmetrical in the vertical direction across the solder resist layer. The area of ​​the outer peripheral surface of the columnar terminal body that is not covered by the solder resist layer is larger than the area of ​​the area covered by the solder resist layer.

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2016-21550

[0004] In the above-mentioned conventional technology, the first substrate and the second substrate are connected via a plurality of columnar terminals, but no consideration is given to the positioning of the first substrate and the second substrate during the connection. Summary of the Invention

[0005] An object of the present invention is to provide a power supply device and a method for manufacturing the power supply device, which can easily perform positioning when connecting two substrates.

[0006] (1) One embodiment of the present invention comprises: a first substrate; a second substrate, which is arranged opposite to the first substrate; and a plurality of substrate connecting members, which connect the first substrate and the second substrate, the substrate connecting members having: a main body, which defines the positions of the first substrate and the second substrate in the facing direction by having one end face for the first substrate to abut and the other end face for the second substrate to abut; a first protrusion, which is protruding from one end face of the main body and positions the main body relative to the first substrate in a direction perpendicular to the facing direction; and a second protrusion, which is protruding from the other end face of the main body and positions the main body relative to the second substrate in a direction perpendicular to the facing direction, a plurality of first positioning holes are provided on the first substrate and are engaged with the first protrusions, and a plurality of second positioning holes are provided on the second substrate and are engaged with the second protrusions.

[0007] In such a power supply device, a plurality of substrate connecting members are used to connect the first substrate and the second substrate. The positions of the first substrate and the second substrate in the facing direction are defined by the main body of the plurality of substrate connecting members. Specifically, the positions of the first substrate and the second substrate in the facing direction are defined by the first substrate abutting against one end face of the main body and the second substrate abutting against the other end face of the main body. The first protrusion protruding from one end face of the main body engages with the first positioning hole of the first substrate, and the second protrusion protruding from the other end face of the main body engages with the second positioning hole of the second substrate. Therefore, the substrate connecting member is positioned relative to the first substrate and the second substrate in a direction perpendicular to the facing direction in which the first substrate and the second substrate form a facing relationship. By having a plurality of such substrate connecting members, positioning of the first substrate and the second substrate when they are connected to each other becomes easier, thereby improving working efficiency.

[0008] (2) In the above (1), the substrate connecting member may be conductive and electrically connect the first substrate and the second substrate, the first protrusion may be fixed to the first substrate by solder, and the second protrusion may be fixed to the second substrate by solder.

[0009] In this structure, the substrate connecting member is conductive. Thus, the substrate connecting member also functions as a current-carrying connection component. Therefore, in addition to the substrate connecting member, there is no need to arrange additional current-carrying connection components, such as those for large currents, on the first and second substrates. Consequently, the layout of the first and second substrates is simplified. Consequently, the first and second protrusions of the substrate connecting member can be easily engaged with the first positioning hole of the first substrate and the second positioning hole of the second substrate, making it easier to position the first and second substrates when they are connected.

[0010] (3) Alternatively, in the above (1) or (2), there is further provided a conductive member for electrically connecting the first substrate and the second substrate, a first through hole for allowing the conductive member to pass through is provided on the first substrate, and a second through hole for allowing the conductive member to pass through is provided on the above-mentioned second substrate, and the conductive member is fixed to the first substrate and the second substrate by solder.

[0011] In such a structure, a conductive member is provided for electrically connecting the first substrate and the second substrate. The conductive member passes through the first through hole of the first substrate and the second through hole of the second substrate. By using a plurality of conductive members, for example, the electrical signal lines of the first substrate and the second substrate are connected via the conductive member, it is not necessary to gather the electrical signal lines on the first substrate and the second substrate at one location. As a result, the space occupied by the connection of the electrical signal lines between the first substrate and the second substrate is reduced, thereby simplifying the layout of the first substrate and the second substrate. Therefore, it is easy to fit the first protrusion and the second protrusion of the substrate connecting member into the first through hole of the first substrate and the second through hole of the second substrate, making it easier to position the first substrate and the second substrate when they are connected to each other.

[0012] (4) Alternatively, in the above-mentioned (3), the conductive component may include: a core portion; and an anti-fall-off portion, which is provided at one end portion of the core portion so as to protrude in a direction perpendicular to the extension direction of the core portion relative to the core portion and is hooked on the first substrate or the second substrate.

[0013] In this structure, a retaining portion is provided at one end of the core portion of the conductive member. This retaining portion protrudes perpendicularly to the core portion's extension direction and hooks onto the first or second substrate. This prevents the conductive member from falling off the first or second substrate and becoming hooked thereon. Consequently, the conductive member is easily secured to the first or second substrate.

[0014] (5) In any one of the above (1) to (4), the main body and the core may be cylindrical, and the diameter of the core may be smaller than the diameter of the main body.

[0015] In this structure, by making the diameter of the core portion of the conductive member smaller than the diameter of the main body portion of the substrate-connecting member, for example, when an electrical signal line is connected between the first and second substrates via the conductive member, the space occupied by the connection between the first and second substrates is further reduced, thereby further simplifying the layout of the first and second substrates. Furthermore, since the diameter of the main body portion of the substrate-connecting member is larger than the diameter of the core portion of the conductive member, the connection strength between the first and second substrates is improved.

[0016] (6) Alternatively, in any one of the above (1) to (5), a power element is mounted on the first substrate, a control system element is mounted on the second substrate, the first substrate and the second substrate are housed in a housing, and the first substrate is thermally coupled to the housing.

[0017] In this structure, by mounting the power components on the first substrate and the control system components on the second substrate, the wiring patterns formed on the first and second substrates are simplified. This simplifies the layout of the first and second substrates. Furthermore, the first substrate is thermally coupled to the housing, effectively dissipating heat generated by the power components mounted on the first substrate to the housing.

[0018] (7) Another embodiment of the present invention is a method for manufacturing a power supply device as described in (3) to (6) above, comprising: a first step of connecting a first substrate and a second substrate by a plurality of substrate connecting components; and a second step of inserting a conductive component into the first through hole and the second through hole after performing the first step.

[0019] In such a method for manufacturing a power supply device, a plurality of substrate connecting members are used to connect the first and second substrates. The positions of the first and second substrates in the facing direction are defined by the main bodies of the plurality of substrate connecting members. Specifically, the positions of the first and second substrates in the facing direction are defined by the first substrate abutting against one end face of the main body and the second substrate abutting against the other end face of the main body. The first protrusion protruding from one end face of the main body engages with the first positioning hole of the first substrate, and the second protrusion protruding from the other end face of the main body engages with the second positioning hole of the second substrate. Therefore, the substrate connecting member is positioned relative to the first and second substrates in a direction perpendicular to the facing direction in which the first and second substrates form a facing relationship. By having a plurality of such substrate connecting members, positioning of the first and second substrates when they are connected to each other becomes easier, thereby improving work efficiency.

[0020] In addition, a conductive member is provided for electrically connecting the first substrate and the second substrate. In such a structure, the conductive member passes through the first through hole of the first substrate and the second through hole of the second substrate. By using a plurality of conductive members, for example, the electrical signal lines between the first substrate and the second substrate are connected by the conductive member, it is not necessary to gather the electrical signal lines on the first substrate and the second substrate in one place. As a result, the space occupied by the connection of the electrical signal lines between the first substrate and the second substrate is reduced, thereby simplifying the layout of the first substrate and the second substrate. Therefore, it is easy to make the first protrusion and the second protrusion of the substrate connecting member fit together with the first through hole of the first substrate and the second through hole of the second substrate, making it easier to position the first substrate and the second substrate when they are connected to each other.

[0021] Furthermore, the conductive member is inserted into the first through-hole and the second through-hole in a state where the first substrate and the second substrate are positioned by the substrate connecting member.

[0022] (8) Alternatively, the above-mentioned (7) may further include a third step, in which, after the second step is performed, the substrate connecting member and the conductive member are fixed to the first substrate and the second substrate by applying solder to the first substrate and the second substrate, melting the solder and cooling it.

[0023] In this method, the substrate connecting member and the conductive member can be simultaneously fixed to the first and second substrates while the substrate connecting member and the conductive member are assembled to the first and second substrates. Therefore, the efficiency of fixing the substrate connecting member and the conductive member to the first and second substrates can be improved.

[0024] According to the present invention, positioning of two substrates during connection can be easily performed. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a perspective view showing a power supply device according to one embodiment of the present invention.

[0026] Figure 2 It is along Figure 1 A cross-sectional view along line II-II is shown.

[0027] Figure 3 It is a schematic plan view showing the lower substrate.

[0028] Figure 4 It is a schematic plan view showing the upper substrate.

[0029] Figure 5 This is a partially enlarged view of a power supply device according to one embodiment of the present invention.

[0030] Figure 6 It is a perspective view showing a substrate connecting member.

[0031] Figure 7 It is a perspective view showing a conductive member.

[0032] Figure 8 This is a partially enlarged view of a power supply device according to one embodiment of the present invention.

[0033] Figure 9 It is a cross-sectional view showing a method for manufacturing a power supply device according to one embodiment of the present invention.

[0034] Figure 10 It is a cross-sectional view showing a method for manufacturing a power supply device according to one embodiment of the present invention.

[0035] Figure 11 It is a cross-sectional view showing a method for manufacturing a power supply device according to one embodiment of the present invention.

[0036] Figure 12 It is a cross-sectional view showing a method for manufacturing a power supply device according to one embodiment of the present invention.

[0037] Figure 13 It is a cross-sectional view showing a method for manufacturing a power supply device according to one embodiment of the present invention.

[0038] Figure 14 This is an exploded perspective view showing an example of a conventional power supply device as a comparative example.

[0039] Figure 15 This is a perspective view showing an example of a common connecting member as a comparative example.

[0040] Description of Reference Numerals

[0041] 1...power supply device; 2...housing; 3...lower substrate (first substrate); 4...upper substrate (second substrate); 10...substrate connecting member; 11...projection (first projection); 12...projection (second projection); 13...main body; 13B...upper surface (other end surface); 13C...bottom surface (one end surface); 20...conductive member; 21...anti-falling portion; 22...core; 22A...one end portion; 30...electronic component (power element); 31...positioning hole (first positioning hole); 32...through hole (first through hole); 40...electronic component (control system element); 41...positioning hole (second positioning hole); 42...through hole (second through hole); 50...solder; D1, D2...directions. DETAILED DESCRIPTION

[0042] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the accompanying drawings, the same or equivalent elements are denoted by the same reference numerals, and duplicate descriptions are omitted.

[0043] Figure 1 It is a perspective view showing a power supply device 1 according to one embodiment of the present invention. Figure 2 It is along Figure 1 The power supply device 1 is entirely covered by a housing 2. The housing 2 is, for example, box-shaped, but the shape of the housing 2 is not limited thereto.

[0044] Power supply device 1 is, for example, part of a DC-DC converter. It includes a lower substrate 3 (first substrate), an upper substrate 4 (second substrate), a substrate connecting member 10, and a conductive member 20. Lower substrate 3 and upper substrate 4 are housed in housing 2. Lower substrate 3 is thermally coupled to housing 2. Figure 1The direction D1 shown thereafter is the facing direction of the lower substrate 3 and the upper substrate 4. The direction D2 is a direction perpendicular to the direction D1.

[0045] Figure 3 It is a schematic plan view showing the lower substrate 3 . Figure 5 FIG. 1 is a partially enlarged view of a power supply device 1 according to an embodiment of the present invention. Figure 5 For convenience, the substrate connecting member 10 and the conductive member 20 are omitted. The lower substrate 3 has principal surfaces S3 and S2. The principal surface S3 is the surface of the lower substrate 3 perpendicular to the direction D1. The principal surface S3 is the principal surface on the upper side of the lower substrate 3 (on the upper substrate 4 side).

[0046] A wiring pattern (not shown) is formed on the lower substrate 3. Electronic components 30 are arranged on this wiring pattern. For example, power elements are mounted as electronic components 30. Power elements are electronic components that generate a large amount of heat. Alternatively, electronic components 30 that generate a large amount of heat, such as transformers and reactors, may be mounted on the lower substrate 3.

[0047] A main MOS, a reset MOS, a synchronous rectification MOS, and a buffer MOS are mounted on the main surface S3 of the lower substrate 3 as examples of power elements serving as the electronic component 30 .

[0048] On the main surface S2 of the lower substrate 3, facing in the opposite direction from the main surface S3, a pattern winding for the primary side transformer is provided, as an example. In the corresponding area of ​​the main surface S3, the winding formed of copper plate is soldered to the wiring pattern. Thus, the pattern winding on the main surface S2 and the winding on the main surface S3, together with the iron core (not shown), form a transformer. The main surface S2 is the main surface on the lower side of the lower substrate 3.

[0049] The lower substrate 3 has a positioning hole 31 (first positioning hole) and a through hole 32 (first through hole). The positioning hole 31 and the through hole 32 are each holes provided in the lower substrate 3 and pass through the lower substrate 3. A plurality of positioning holes 31 and a plurality of through holes 32 are provided on the lower substrate 3. The positioning holes 31 and the through holes 32 are each circular. The diameter of the positioning hole 31 is larger than the diameter of the through hole 32. The positioning hole 31 is a hole for the substrate connecting member 10 described below to be engaged. The through hole 32 is a hole for the conductive component 20 described below to pass through. When viewed from the direction D1, a wiring pattern not shown is provided on the lower substrate 3 and around the positioning hole 31 and the through hole 32.

[0050] Figure 4 : This is a schematic top view showing the upper substrate 4. The upper substrate 4 is arranged facing the lower substrate 3 in the direction D1. With respect to the lower substrate 3, the upper substrate 4 is arranged at a position opposite to the bottom of the housing 2. Therefore, with respect to the upper substrate 4, the lower substrate 3 is arranged on the bottom side of the housing 2 (refer to Figure 2 The upper substrate 4 is parallel to the lower substrate 3 and arranged along direction D1. The upper substrate 4 has principal surfaces S4 and S5. Principal surface S4 is the surface of the upper substrate 4 perpendicular to direction D1. Principal surface S4 is the lower principal surface of the upper substrate 4. In other words, principal surface S4 faces principal surface S3 of the lower substrate 3 in direction D1.

[0051] A wiring pattern (not shown) is formed on the upper substrate 4. An electronic component 40 is provided on the wiring pattern, and a control system element, for example, is mounted as the electronic component 40. Figure 1 and Figure 4 As shown, on the principal surface S4 of the upper substrate 4, an IC, capacitors such as thin film capacitors, and resistors are provided as examples of control system components. Other electronic components besides control system components may also include common coils and fuses. As an example, a signal connector is provided on the principal surface S5 of the upper substrate 4, which faces in the opposite direction from the principal surface S4. The principal surface S5 is the upper principal surface of the upper substrate 4.

[0052] The upper substrate 4 has a positioning hole 41 (second positioning hole) and a through hole 42 (second through hole) (see Figure 5 ). The positioning hole 41 and the through hole 42 are each a hole provided in the upper substrate 4 and pass through the upper substrate 4. A plurality of positioning holes 41 and a plurality of through holes 42 are provided on the upper substrate 4. The positioning hole 41 and the through hole 42 are each circular. The diameter of the positioning hole 41 is larger than the diameter of the through hole 42. The positioning hole 41 is a hole for the substrate connecting member 10 described below to be engaged. The through hole 42 is a hole for the conductive component 20 described below to pass through. When viewed from the direction D1, a wiring pattern (not shown) is provided on the upper substrate 4 and around the positioning hole 41 and the through hole 42.

[0053] Refer again Figure 2 A heat dissipation component 5 is provided between the bottom of the housing 2 and the power supply device 1. The heat dissipation component 5 is a component for dissipating the heat generated by the power supply device 1 toward the housing 2. The heat dissipation component 5 is, for example, an insulating material such as an insulating sheet, but the material of the heat dissipation component 5 is not limited thereto. As the heat dissipation component 5, an insulating material with good thermal conductivity is preferred. A plurality of heat dissipation components 5 are provided between the bottom of the housing 2 and the power supply device 1. The heat dissipation components 5 are arranged in an array along the direction D2. In addition, Figure 2 In the figure, for convenience of explanation, the conductive member 20 is omitted.

[0054] As described above, a member with good thermal conductivity, such as copper, is disposed from the main surface S3 to the main surface S2 of the lower substrate 3, particularly where the power elements are located. Heat from the power elements is dissipated to the housing 2 via the copper and heat dissipation member 5. The lower substrate 3 and the housing 2 are thermally coupled via the heat dissipation member 5, and heat from the electronic components 30 located on the lower substrate 3 is dissipated to the housing 2 via the copper and heat dissipation member 5.

[0055] Figure 6 It is a perspective view showing the substrate connecting member 10 . Figure 8 This is a partially enlarged view of a power supply device 1 according to one embodiment of the present invention. The substrate connecting member 10 is a columnar member that connects the lower substrate 3 and the upper substrate 4. Specifically, the substrate connecting member 10 is interposed between the lower substrate 3 and the upper substrate 4. Multiple substrate connecting members 10 are provided in the power supply device 1. The substrate connecting members 10 may have either a solid or hollow structure.

[0056] The substrate connecting member 10 includes a main body 13, a protrusion 11 (first protrusion), and a protrusion 12 (second protrusion). The main body 13 is cylindrical and elongated in direction D1. The main body 13 defines the position of the lower substrate 3 and the upper substrate 4 in direction D1. Specifically, the length of the main body 13 in direction D1 represents the distance between the lower substrate 3 and the upper substrate 4. In other words, the length of the main body 13 in direction D1 defines the position of the upper substrate 4 relative to the lower substrate 3, thereby ensuring positioning in direction D1.

[0057] Main body 13 includes side surface 13A, top surface 13B (the other end surface), and bottom surface 13C (one end surface). Side surface 13A connects top surface 13B and bottom surface 13C in direction D1. Side surface 13A is a curved surface without any irregularities. Top surface 13B and bottom surface 13C are surfaces perpendicular to direction D1 and without any circular irregularities.

[0058] The protrusion 11 is a protrusion of the substrate connecting member 10 that engages with the positioning hole 31 of the lower substrate 3. That is, the lower substrate 3 is provided with a plurality of positioning holes 31 that engage with the protrusion 11. The protrusion 11 positions the main body 13 of the substrate connecting member 10 relative to the lower substrate 3 in a direction D2 that is perpendicular to the direction D1. The state in which the protrusion 11 and the positioning hole 31 engage with each other means that they are positioned in the direction D2. In other words, easy positioning means that the protrusion 11 and the positioning hole 31 are easily engaged. In the direction D2, the position of the protrusion 11 is determined by determining the position of the positioning hole 31.

[0059] The protrusion 11 is provided on the bottom surface 13C of the main body 13. Specifically, the protrusion 11 protrudes from the bottom surface 13C of the main body 13. The protrusion 11 is integrated with the main body 13 by, for example, forging. The protrusion 11 may be fixed to the bottom surface 13C of the main body 13, or may be provided inside the main body 13 and protrude from the bottom surface 13C of the main body 13 in the direction D1.

[0060] The protrusion 11 has a generally cylindrical shape that is elongated in direction D2. The length of the protrusion 11 in direction D1 is shorter than the length of the main body 13 in direction D1. The protrusion 11 positions the main body 13 relative to the lower substrate 3 in direction D2. As described above, the position of the protrusion 11 in direction D2 is determined by the position of the positioning hole 31. Therefore, the position of the main body 13, and therefore the position of the substrate coupling member 10, is determined by the position of the positioning hole 31.

[0061] The protrusion 11 includes a side surface 11A and a bottom surface 11B. In the direction D1, the side surface 11A is connected to the bottom surface 11B. The side surface 11A is a curved surface without any concavities or convexities. The side surface 11A is fitted into the positioning hole 31 in a manner opposite to the positioning hole 31 (see Figure 7 Bottom surface 11B is a surface perpendicular to direction D1 without any unevenness. When viewed from direction D1, bottom surface 11B has a circular shape that matches the shape of positioning hole 31. Furthermore, when viewed from direction D1, the center of protrusion 11 (bottom surface 11B) is aligned with the center of main body 13 (bottom surface 13C).

[0062] The protrusion 12 is a protrusion of the substrate connecting member 10 that engages with the positioning hole 41 of the upper substrate 4. That is, a plurality of positioning holes 41 that engage with the protrusion 12 are provided on the upper substrate 4. The protrusion 12 positions the main body 13 of the substrate connecting member 10 relative to the upper substrate 4 in a direction D2 that is perpendicular to the direction D1. As with the case of the protrusion 11, the state in which the protrusion 12 and the positioning hole 41 engage with each other means that positioning is performed in the direction D2. In other words, easy positioning means that the protrusion 12 and the positioning hole 41 are easily engaged. In the direction D2, the position of the protrusion 12 is determined by determining the position of the positioning hole 41.

[0063] Furthermore, when the substrate-connecting member 10 is mated with the lower substrate 3 and the upper substrate 4, the bottom surface 13C abuts the main surface S3 of the lower substrate 3, and the top surface 13B abuts the main surface S4 of the upper substrate 4. This positions the main body 13 of the substrate-connecting member 10 relative to the lower substrate 3 and the upper substrate 4. Thus, the substrate-connecting member 10 positions the upper substrate 4 relative to the lower substrate 3. In other words, the main body 13 defines the positions of the lower and upper substrates 3 and 4 in the facing direction D1 by abutting the lower substrate 3 against the bottom surface 13C and the upper substrate 4 against the top surface 13B.

[0064] The protrusion 12 is provided on the upper surface 13B of the main body 13. Specifically, the protrusion 12 protrudes from the upper surface 13B of the main body 13. The protrusion 12 is integrated with the main body 13, for example, by forging. The protrusion 12 may be fixed to the upper surface 13B of the main body 13, or may be provided inside the main body 13 and protrude from the upper surface 13B of the main body 13 in the direction D1.

[0065] Protrusion 12 has a generally cylindrical shape that is elongated in direction D2. The length of protrusion 12 in direction D1 is shorter than the length of main body 13 in direction D1. Protrusion 12 positions main body 13 relative to upper substrate 4 in direction D2. As described above, the position of protrusion 12 in direction D2 is determined by the position of positioning hole 41. Therefore, the position of main body 13, and ultimately the position of substrate coupling member 10, is determined by the position of positioning hole 41.

[0066] The protrusion 12 includes a side surface 12A and an upper surface 12B. In the direction D1, the side surface 12A is connected to the upper surface 12B. The side surface 12A is a curved surface without bumps. The side surface 12A is fitted into the positioning hole 41 in a manner opposite to the positioning hole 41. The upper surface 12B is a surface without bumps that is perpendicular to the direction D1. When viewed from the direction D1, the upper surface 12B is a circular shape that matches the shape of the positioning hole 41. In addition, when viewed from the direction D1, the center of the protrusion 12 (upper surface 12B) is aligned with the center of the main body 13 (upper surface 13B).

[0067] The substrate connecting member 10 is conductive. The material of the substrate connecting member 10 is a metal such as copper (Cu). The protrusion 11 of the substrate connecting member 10 is engaged with the positioning hole 31, and the bottom surface 13C is fixed to the wiring pattern of the lower substrate 3 by a solder not shown in the figure. The protrusion 12 of the substrate connecting member 10 is engaged with the positioning hole 41, and the upper surface 13B is fixed to the wiring pattern of the upper substrate 4 by a solder not shown in the figure. The substrate connecting member 10 electrically connects the lower substrate 3 and the upper substrate 4. That is, current can be energized in the substrate connecting member 10. Specifically, the substrate connecting member 10 electrically connects the wiring pattern formed on the lower substrate 3 and the wiring pattern formed on the upper substrate 4. The substrate connecting member 10 is a current-carrying connecting member for a large current to flow through the electronic component 30. As the cross-sectional area of ​​the main body 13 of the substrate connection member 10 taken along the direction D2 increases, the conductive path becomes larger when electrically connected to the wiring pattern via solder, and thus the resistance decreases.

[0068] Solder 50, described below, is provided between bottom surface 13C and principal surface S3 of lower substrate 3. Bottom surface 13C contacts solder 50 applied to principal surface S4. Solder 50, described below, is provided between top surface 13B and principal surface S4 of upper substrate 4. Top surface 13B contacts solder 50 applied to principal surface S4.

[0069] As described above, the lower substrate 3 and the upper substrate 4 are connected by the plurality of substrate connection members 10. At this time, the plurality of substrate connection members 10 are arranged at locations such that the lower substrate 3 and the upper substrate 4 are connected stably.

[0070] Figure 7 2 is a perspective view showing the conductive member 20. The conductive member 20 is a member that electrically connects the lower substrate 3 and the upper substrate 4. That is, the conductive member 20 is sandwiched between the lower substrate 3 and the upper substrate 4. Specifically, one end 22A of the conductive member 20 passes through the through hole 42, and the other end 22B of the conductive member 20 passes through the through hole 32 (see FIG. Figure 8 That is, the lower substrate 3 is provided with a through hole 32 through which the conductive member 20 passes, and the upper substrate 4 is provided with a through hole 42 through which the conductive member 20 passes.

[0071] The conductive member 20 is fixed to the lower substrate 3 and the upper substrate 4 by solder. The conductive member 20 is made of a metal such as copper (Cu) and has electrical conductivity. An electrical signal flows through the conductive member 20 .

[0072] A plurality of conductive members 20 are provided in the power supply device 1. The number of conductive members 20 provided in the power supply device 1 is greater than the number of substrate coupling members 10. By arbitrarily determining the positions of the through holes 32 and 42 in the lower substrate 3 and the upper substrate 4, the placement of the conductive members 20 can be appropriately determined, and the number of conductive members 20 to be arranged can also be appropriately determined.

[0073] The conductive member 20 includes a core 22 and a retaining portion 21. The retaining portion 21 is provided at one end 22A of the core 22 so as to protrude perpendicularly to the extending direction of the core 22. The retaining portion 21 is hooked on the lower substrate 3 or the upper substrate 4.

[0074] The anti-dropout portion 21 is provided at one end portion 22A of the conductive member 20. The anti-dropout portion 21 is substantially cylindrical and elongated in the direction D2. When viewed from the direction D1, the diameter of the anti-dropout portion 21 is larger than the diameter of the through hole 42 of the upper substrate 4.

[0075] In this embodiment, in a state where the conductive member 20 passes through the lower substrate 3 and the upper substrate 4, the anti-falling portion 21 is arranged on the main surface S5 of the upper substrate 4. The anti-falling portion 21 includes a bottom surface 21A. The bottom surface 21A is a surface of the anti-falling portion 21 that is perpendicular to the direction D1 and has no unevenness, and is opposite to the main surface S5 of the upper substrate 4. In this embodiment, the bottom surface 21A is in contact with the main surface S5. By the bottom surface 21A being in contact with the main surface S5 of the upper substrate 4, the anti-falling portion 21 is hooked on the upper substrate 4 (refer to Figure 8 The anti-fall-off portion 21 is fixed to the upper substrate 4 by solder.

[0076] The core 22 has a cylindrical shape that is elongated in direction D1. The other end 22B of the core 22 (conductive member 20) tapers toward the distal end in direction D1. When viewed from direction D1, the diameter of the core 22 is smaller than the diameter of the retaining portion 21. When viewed from direction D1, the diameter of the core 22 is smaller than the diameter of the through-holes 32 and 42.

[0077] As described above, the main body 13 of the substrate coupling member 10 and the core 22 of the conductive member 20 are cylindrical. The diameter of the core 22 in the direction D2 is smaller than the diameter of the main body 13 in the direction D2. Therefore, the conductive member 20 is thinner than the main body 13 of the substrate coupling member 10. Furthermore, the diameter of the core 22 in the direction D2 is smaller than the diameter of the through-holes 32 and 42 in the direction D2.

[0078] The other end 22B of the core 22 (conductive member 20) is fixed to the lower substrate 3 by solder. In the direction D1, the anti-dropout portion 21 is integrated with the core 22, for example, by forging or the like. Specifically, the core 22 is integrated with the bottom surface 21A of the anti-dropout portion 21 on the side of the one end 22A of the conductive member 20. Therefore, as Figure 7 As shown, the conductive member 20 has a nail-like shape.

[0079] Next, a method for manufacturing the power supply device 1 will be described. Figures 9 to 13 This is a cross-sectional view illustrating a method for manufacturing a power supply device 1 according to one embodiment of the present invention. The soldering process in the following manufacturing method is generally referred to as reflow soldering. In reflow soldering, the solder is melted in a reflow oven using, for example, infrared rays or hot air. Alternatively, the power supply device 1 can be manufactured using laser welding, which uses a laser as a heat source. Laser welding enables more precise soldering.

[0080] First, if Figure 9 As shown, solder 50 is applied to the main surface S4 of the upper substrate 4. Solder 50 is applied to areas on the main surface S4 where wiring patterns 51 are formed, where electronic components 40 and substrate connecting members 10 are located, and other areas where component fixation and electrical conduction are required. The applied solder 50 may be, for example, paste solder.

[0081] Thereafter, the protrusion 12 of the substrate connecting member 10 is fitted into the positioning hole 41 from the main surface S4 side of the upper substrate 4. At this time, solder 50 is sandwiched between the upper surface 13B of the substrate connecting member 10 and the wiring pattern 51 of the upper substrate 4. Therefore, the substrate connecting member 10 is arranged on the main surface S4 of the upper substrate 4. In addition, the electronic component 40 is arranged on the main surface S4 coated with the solder 50. Moreover, in order to melt the solder 50 coated on the upper substrate 4, the upper substrate 4 is passed through a reflow furnace and then cooled. In addition, the cooling mentioned here is not limited to active cooling, but also includes cooling to near room temperature by being left standing after passing through the reflow furnace. Thus, the substrate connecting member 10 and the electronic component 40 are fixed to the upper substrate 4 by the solder 50, so that the substrate connecting member 10 and the electronic component 40 are mounted on the upper substrate 4. At this time, the substrate connection member 10 and the upper substrate 4 are fixed by the solder 50 and the electronic component 40 and the upper substrate 4 are fixed by the solder 50 at the same time, thereby improving the work efficiency when mounting the electronic component 40 on the main surface S4.

[0082] Then, if Figure 10As shown, the upper substrate 4 is flipped over along the thickness direction (direction D1) of the upper substrate 4. Next, solder 50 is applied to the main surface S5 facing the opposite direction to the main surface S4. The solder 50 is applied to the parts on the main surface S5 where the wiring pattern 52 is formed and the electronic components 40 are arranged, etc., where it is necessary to ensure that the components are fixed and energized. In addition, the application of the solder 50 to the main surface S5 may be performed before flipping the upper substrate 4. Thereafter, the electronic components 40 are assembled on the main surface S5 coated with the solder 50, and after the solder 50 is passed through the reflow furnace and melted, it is cooled and the electronic components 40 are fixedly mounted on the main surface S5.

[0083] Afterwards, if Figure 11 As shown, solder 50 is applied to the main surface S2 of the lower substrate 3, which faces the opposite direction from the main surface S3. Solder 50 is applied to areas on the main surface S2 where wiring patterns 54 are formed and electronic components 30 are located, where the components need to be secured and energized. Alternatively, solder 50 may be applied with the main surface S2 of the lower substrate 3 facing the upper substrate 4. Next, the electronic components 30 are mounted on the main surface S2 coated with solder 50. The solder 50 is melted in a reflow oven and then cooled to secure and mount the electronic components 30 on the main surface S2.

[0084] Next, solder 50 is applied to the main surface S3 of the lower substrate 3. Solder 50 is applied to areas on the main surface S3 where wiring patterns 53 are formed, and where the electronic components 30 and substrate connecting member 10 are located, where component fixation and electrical conduction are required. Subsequently, when the electronic components 30 are mounted on the main surface S3, the electronic components 30 can be mounted on the main surface S3 coated with solder 50.

[0085] Afterwards, if Figure 12 As shown, the lower substrate 3 and the upper substrate 4 are connected by the substrate connecting member 10 by fitting the protrusion 11 of the substrate connecting member 10, which has been fixed to the upper substrate 4 by solder 50, into the positioning hole 31 from the main surface S3 side of the lower substrate 3 (first step). At this time, the solder 50 is interposed between the bottom surface 13C of the substrate connecting member 10 and the wiring pattern 53 of the lower substrate 3.

[0086] After the above steps have been completed, Figure 13 As shown, the conductive component 20 is inserted into the through hole 42 and the through hole 32 in the lower substrate 3 by passing the other end 22B of the conductive component 20 through the through hole 42 of the upper substrate 4, and the one end 22A of the conductive component 20 is passed through the through hole 42 of the upper substrate 4, thereby sequentially inserting the conductive component 20 into the through hole 42 and the through hole 32 (second process).

[0087] In this state, the upper and lower substrates 4 and 3 are passed through a reflow furnace to melt the solder 50 applied to the upper and lower substrates 4 and 3, followed by cooling. Thus, the electronic components 30 are fixed to the main surfaces S2 and S3 by the solder 50, the substrate connecting member 10 is fixed to the lower substrate 3 by the solder 50, and the conductive member 20 is fixed to the lower and upper substrates 3 and 4 by the solder 50. Specifically, the lower and upper substrates 3 and 4 are passed through a reflow furnace to melt the solder 50, followed by cooling, thereby fixing one end 22A of the conductive member 20 to the upper substrate 4 and the other end 22B to the lower substrate 3, while also fixing the substrate connecting member 10 to the lower substrate 3. In other words, after the second step described above is performed, the solder 50 applied to the lower and upper substrates 3 and 4 is melted and cooled, thereby fixing the substrate connecting member 10 and the conductive member 20 to the lower and upper substrates 3 and 4 (the third step).

[0088] In the above-described method for manufacturing power supply device 1, conductive member 20 is inserted into through-holes 32 and 42 while lower substrate 3 and upper substrate 4 are positioned in directions D1 and D2 by substrate coupling member 10. In order to position lower substrate 3 and upper substrate 4 in directions D1 and D2 with substrate coupling member 10 engaged (after the first step), it is preferable that two or more substrate coupling members 10 be engaged with two or more positioning holes 31 and 41, or that a substrate coupling member 10 having a polygonal cross-section along direction D2 be engaged with positioning holes 31 and 41.

[0089] Figure 14 This is an exploded perspective view showing an example of a conventional power supply device 1A as a comparative example. The power supply device 1A includes a lower substrate 3A instead of the lower substrate 3 of the power supply device 1, and an upper substrate 4A instead of the upper substrate 4. In addition, the power supply device 1A includes a base plate 60 arranged between the lower substrate 3A and the upper substrate 4A. The upper substrate 4A includes a positioning hole (not shown) instead of the positioning hole 41. The base plate 60 is a component that guides the lower substrate 3A and the upper substrate 4A to connect to each other in the correct position. A plurality of bosses 61 are fixed to the base plate 60. In such a power supply device 1A, the lower substrate 3A and the base plate 60 are fixed to each other. Moreover, the bosses 61 are fitted into the positioning holes (not shown) of the upper substrate 4A, whereby the base plate 60 and the upper substrate 4A are fixed by fixing screws (not shown).

[0090] If the dimensional accuracy of the boss 61 and the positioning hole (not shown) in the upper substrate 4A exceeds the allowable range when viewed from direction D1, the boss 61 will not align with the positioning hole (not shown) in the upper substrate 4A. This will make it difficult to secure the base plate 60 and the upper substrate 4A via the boss 61, using fixing screws (not shown). Furthermore, multiple bosses 61 and fixing screws (not shown) are required, increasing costs. Furthermore, the lower substrate 3A and upper substrate 4A become larger, resulting in an increased size of the power supply unit 1A.

[0091] To address this issue, the power supply device 1 of this embodiment uses multiple substrate connecting members 10 to connect the lower substrate 3 and the upper substrate 4. The positions of the lower substrate 3 and the upper substrate 4 in direction D1 are defined by the main bodies 13 of the multiple substrate connecting members 10. Specifically, the lower substrate 3 abuts against the bottom surface 13C of the main body 13, and the upper substrate 4 abuts against the top surface 13B of the main body 13, thereby defining the positions of the lower substrate 3 and the upper substrate 4 in the opposing direction D1. The protrusions 11 projecting from the bottom surface 13C of the main body 13 engage with the positioning holes 31 of the lower substrate 3, while the protrusions 12 projecting from the top surface 13B of the main body 13 engage with the positioning holes 41 of the upper substrate 4. Thus, the substrate connecting members 10 are positioned relative to the lower substrate 3 and the upper substrate 4 in direction D2. By having a plurality of such substrate connecting members 10, there is no need to use bosses 61 and fixing screws (not shown) in the connection between the lower substrate 3 and the upper substrate 4. Thus, low costs are achieved. In addition, the sizes of the lower substrate 3 and the upper substrate 4 can be reduced, thereby achieving miniaturization of the power supply device 1. Moreover, the substrate connecting member 10 is not a structure fixed to other components like the boss 61, and therefore can be moved independently in the direction D2, thereby increasing the degree of freedom in configuration between the lower substrate 3 and the upper substrate 4. In addition, the position of the upper substrate 4 relative to the lower substrate 3 can be adjusted according to the length of the main body 13 of the substrate connecting member 10 in the direction D1. Thus, positioning of the lower substrate 3 and the upper substrate 4 in connection with each other is facilitated, thereby improving work efficiency. Therefore, in this embodiment, consideration is given to positioning in the connection between the lower substrate 3 and the upper substrate 4.

[0092] Furthermore, the lower substrate 3 and the upper substrate 4 can be connected to each other at any position on the lower substrate 3 and the upper substrate 4, thereby optimizing the design of the wiring patterns on the lower substrate 3 and the upper substrate 4. This allows for miniaturization of the lower substrate 3 and the upper substrate 4.

[0093] Furthermore, in this embodiment, the substrate connecting member 10 is conductive. Thus, the substrate connecting member 10 also functions as a current-carrying connection component. Therefore, there is no need to provide separate current-carrying connection components for high currents on the lower substrate 3 and the upper substrate 4 in addition to the substrate connecting member 10. This simplifies the layout of the lower substrate 3 and the upper substrate 4. Consequently, the protrusions 11 and 12 of the substrate connecting member 10 easily fit into the positioning holes 31 and 41 of the lower substrate 3 and the upper substrate 4, making it easier to position the lower and upper substrates 3 and 4 during connection.

[0094] Figure 15 It is a perspective view showing an example of a common connecting member 20A as a comparative example. Figure 15 The connecting member 20A shown in (a) is Figure 15 The connecting parts 20A shown in (b) face in opposite directions to the direction D1. Figure 15 As shown, a connection component 20A for electric signal lines called a BtoB connector has been conventionally used to connect the electric signal lines between the lower substrate 3 and the upper substrate 4. In this case, the electric signal lines on the lower substrate 3 and the upper substrate 4 need to be gathered together at the connection component 20A.

[0095] However, in this embodiment, a conductive member 20 that electrically connects the lower substrate 3 and the upper substrate 4 may be provided instead of the connecting component 20A. In such a structure, the conductive member 20 passes through the through-hole 32 of the lower substrate 3 and the through-hole 42 of the upper substrate 4. By using a plurality of conductive members 20, the electrical signal lines between the lower substrate 3 and the upper substrate 4 are connected via the conductive members 20, thereby eliminating the need to gather the electrical signal lines on the lower substrate 3 and on the upper substrate 4 at one location. As a result, the space occupied by the connection of the electrical signal lines between the lower substrate 3 and the upper substrate 4 is reduced, thereby simplifying the layout of the lower substrate 3 and the upper substrate 4. Therefore, it is easy to fit the protrusions 11 and 12 of the substrate connecting member 10 into the through-hole 32 of the lower substrate 3 and the through-hole 42 of the upper substrate 4, making it easier to position the lower substrate 3 and the upper substrate 4 in connection with each other. Furthermore, since the conductive member 20 is smaller than the connecting component 20A, the space occupied by the mechanism for connecting the electrical signals between the lower substrate 3 and the upper substrate 4 can be reduced, thereby miniaturizing the power supply device 1 .

[0096] Furthermore, in this embodiment, the conductive member 20 includes a core portion 22 and a retaining portion 21. Thus, the retaining portion 21 is provided at one end portion 22A of the core portion 22 of the conductive member 20. The retaining portion 21 protrudes perpendicularly to the direction in which the core portion 22 extends relative to the core portion 22 and is hooked onto the lower substrate 3 or the upper substrate 4. This prevents the conductive member 20 from being hooked onto the lower substrate 3 or the upper substrate 4 and detaching from the lower substrate 3 or the upper substrate 4. Consequently, the conductive member 20 is easily secured to the lower substrate 3 or the upper substrate 4.

[0097] Furthermore, in this embodiment, by making the core portion 22 of the conductive member 20 smaller in diameter than the main body 13 of the substrate-connecting member 10, the space occupied by the electrical signal lines connecting the lower substrate 3 and the upper substrate 4 can be further reduced when the conductive member 20 is used to connect the electrical signal lines between the lower substrate 3 and the upper substrate 4. For example, compared to a case where the conductive member 20 having a diameter smaller than the main body 13 of the substrate-connecting member 10 is used alone to connect the upper and lower substrates 4, without using the conductive member 20 having a diameter smaller than that of the main body 13 of the substrate-connecting member 10, or a case where the core portion 22 of the conductive member 20 has the same diameter as the main body 13 of the substrate-connecting member 10, the use of the conductive member 20 having a diameter smaller than that of the main body 13 of the substrate-connecting member 10 can reduce the space occupied by the electrical signal lines connecting the lower substrate 3 and the upper substrate 4. This further simplifies the layout of the lower substrate 3 and the upper substrate 4. The diameter of the main body 13 of the substrate-connecting member 10 is larger than the diameter of the core 22 of the conductive member 20, thereby increasing the connection strength between the lower substrate 3 and the upper substrate 4. Furthermore, the main body 13 of the substrate-connecting member 10 is thicker than the core 22 of the conductive member 20, thereby allowing a large current to flow through the substrate-connecting member 10.

[0098] Furthermore, in this embodiment, by mounting power components on lower substrate 3 and control system components on upper substrate 4, the wiring patterns formed on lower substrate 3 and upper substrate 4 are simplified. Consequently, the layout of lower substrate 3 and upper substrate 4 is simplified. Furthermore, lower substrate 3 and upper substrate 4 are housed in housing 2, with lower substrate 3 and housing 2 thermally coupled. This effectively dissipates heat generated by the power components mounted on lower substrate 3 to housing 2.

[0099] Furthermore, in this embodiment, when manufacturing power supply device 1, conductive member 20 is inserted into through-holes 32 and 42 while lower substrate 3 and upper substrate 4 are positioned by substrate coupling member 10. This facilitates insertion of conductive member 20 into through-holes 32 and 42.

[0100] In addition, in this embodiment, after the lower substrate 3 and the upper substrate 4 are connected by multiple substrate connecting components 10, the conductive component 20 is inserted into the through hole 32 and the through hole 42, and the conductive component 20 is fixed to the lower substrate 3 and the upper substrate 4 by solder, thereby easily achieving electrical connection between the lower substrate 3 and the upper substrate 4 through the conductive component 20.

[0101] Furthermore, in this embodiment, when manufacturing power supply device 1, after conductive member 20 is inserted into through-holes 32 and 42, solder 50 is applied to lower substrate 3 and upper substrate 4. Solder 50 is melted and cooled, thereby securing substrate coupling member 10 and conductive member 20 to lower substrate 3 and upper substrate 4. This allows substrate coupling member 10 and conductive member 20 to be simultaneously secured to lower substrate 3 and upper substrate 4 while they are assembled thereto. Consequently, the efficiency of securing substrate coupling member 10 and conductive member 20 to lower substrate 3 and upper substrate 4 can be improved.

[0102] In addition, in this embodiment, after the protrusion 12 of the substrate connecting member 10 is engaged with the positioning hole 41 of the upper substrate 4 and fixed to the upper substrate 4 by solder 50, the upper substrate 4 is turned over, and the protrusion 11 of the substrate connecting member 10 is engaged with the positioning hole 31 of the lower substrate 3 and fixed to the lower substrate 3 by solder 50. As a result, the lower substrate 3 and the upper substrate 4 can be easily and reliably connected through the substrate connecting member 10.

[0103] Furthermore, the present invention is not limited to the above-described embodiment. For example, in the above-described embodiment, the positioning hole 31 and the through-hole 32 are each circular, but this is not particularly limiting. For example, the shapes of the positioning hole 31 and the through-hole 32 are not limited to circular; they may also be elliptical, oblong, or polygonal, such as a triangle or a quadrilateral.

[0104] In the above embodiment, the positioning hole 41 and the through hole 42 are each circular, but the shape is not limited to this. For example, the shapes of the positioning hole 41 and the through hole 42 are not limited to circles, but may also be ellipses, oblongs, triangles, quadrilaterals, or other polygonal shapes.

[0105] Furthermore, in the above embodiment, the main body 13 of the substrate connecting member 10 is cylindrical and elongated in direction D1, but this is not particularly limited to this configuration. For example, it may be a columnar shape with an elliptical or oblong base, or a columnar shape with a polygonal base such as a triangle or a quadrilateral. Furthermore, the main body 13 of the substrate connecting member 10 may be cylindrical. Furthermore, the main body 13 of the substrate connecting member 10 may be cylindrical or cylindrical, with the center portion of the side surface 13A in direction D1 bulging outward along direction D2 or tapering toward the center of the main body 13.

[0106] Furthermore, in the above embodiment, the top surface 13B and bottom surface 13C of the main body 13 of the substrate coupling member 10 are smooth, but this is not particularly limiting. For example, top surface 13B and bottom surface 13C may have unevenness. Furthermore, top surface 13B and bottom surface 13C may be inclined relative to direction D1.

[0107] Furthermore, in the above embodiment, the protrusion 11 of the substrate connecting member 10 is cylindrical, but the shape is not particularly limited to this. For example, the protrusion 11 may be cylindrical with an elliptical or oblong bottom surface to match the shape of the positioning hole 31, or may be cylindrical with a polygonal bottom surface such as a triangle or a quadrilateral.

[0108] Furthermore, in the above embodiment, the protrusion 12 of the substrate coupling member 10 is cylindrical, but the shape is not particularly limited to this. For example, the protrusion 12 may be cylindrical with an elliptical or oblong bottom surface to match the shape of the positioning hole 41, or may be cylindrical with a polygonal bottom surface such as a triangle or a quadrilateral.

[0109] Furthermore, in the above embodiment, the substrate connecting member 10 is conductive and made of a metal such as copper, but the present invention is not limited to this embodiment. For example, the substrate connecting member 10 may not be conductive and may be made of a resin.

[0110] Furthermore, in the above embodiment, the retaining portion 21 is positioned on the principal surface S5 of the upper substrate 4 while the conductive member 20 extends through the lower substrate 3 and the upper substrate 4. However, the present invention is not limited to this embodiment. For example, the retaining portion 21 may be positioned on the principal surface S2 of the lower substrate 3 while the conductive member 20 extends through the lower substrate 3 and the upper substrate 4. In other words, the retaining portion 21 is hooked and fixed to the lower substrate 3.

[0111] In addition, in the above-mentioned embodiment, the anti-falling portion 21 of the conductive component 20 is in the shape of a cylindrical column that is longer in the direction D2, but is not particularly limited to such a manner. For example, the anti-falling portion 21 may also be in the shape of a column having an elliptical, oblong or other bottom surface, or may be in the shape of a column having a polygonal bottom surface such as a triangle or a quadrilateral. Moreover, the anti-falling portion 21 may extend in a manner extending from the core 22 of the conductive component 20 toward the direction D2. That is, the conductive component 20 may be in the shape of an L when viewed from a direction perpendicular to the surface to which the anti-falling portion 21 and the core 22 are fixed. In this case, the anti-falling portion 21 is also opposite to the upper substrate 4, so that the conductive component 20 is hooked on the upper substrate 4 without falling off.

[0112] In the above embodiment, the bottom surface 21A of the anti-fall portion 21 is a surface without unevenness, but the present invention is not limited to this embodiment. For example, the bottom surface 21A may have unevenness. In addition, the bottom surface 21A may be inclined relative to the direction D1.

[0113] Furthermore, in the above embodiment, the core portion 22 of the conductive member 20 is cylindrical, but the core portion 22 is not particularly limited to this form. For example, the core portion 22 may be cylindrical with an elliptical or oblong base, or may be cylindrical with a polygonal base such as a triangle or a quadrilateral. Furthermore, the other end portion 22B of the conductive member 20 tapers toward the distal end in the direction D1, but the distal end of the other end portion 22B of the conductive member 20 may not taper.

[0114] Furthermore, in the above embodiment, electronic components 30 are provided on lower substrate 3, and electronic components 40 are provided on upper substrate 4. However, this is not particularly limited to this configuration. For example, only one of electronic components 30 and 40 may be provided in power supply device 1. In other words, electronic components may be provided on only one of lower substrate 3 and upper substrate 4.

Claims

1. A power supply device, characterized in that: have: 1st substrate; a second substrate disposed opposite to the first substrate; and a plurality of substrate connecting members connecting the first substrate and the second substrate; The substrate connecting member comprises: a main body portion, which defines the positions of the first substrate and the second substrate in the facing direction by having one end face thereof abutted by the first substrate and the other end face thereof abutted by the second substrate; a first protrusion portion protruding from the one end face of the main body portion and positioning the main body portion relative to the first substrate in a direction perpendicular to the facing direction; and a second protrusion protruding from the other end surface of the main body and positioning the main body relative to the second substrate in a direction perpendicular to the facing direction. The first substrate is provided with a plurality of first positioning holes that are engaged with the first protrusions. The second substrate is provided with a plurality of second positioning holes that fit into the second protrusions.

2. The power supply device according to claim 1, wherein: The substrate connecting member has electrical conductivity and electrically connects the first substrate and the second substrate. The first protrusion is fixed to the first substrate by solder, The second protrusion is fixed to the second substrate by solder.

3. The power supply device according to claim 1, wherein: further comprising a conductive member electrically connecting the first substrate and the second substrate, The first substrate is provided with a first through hole through which the conductive member passes. The second substrate is provided with a second through hole through which the conductive member passes. The conductive member is fixed to the first substrate and the second substrate by solder.

4. The power supply device according to claim 3, wherein: The conductive member includes a core portion and a fall-off prevention portion provided at one end portion of the core portion so as to protrude in a direction perpendicular to an extending direction of the core portion relative to the core portion and hooked on the first substrate or the second substrate.

5. The power supply device according to claim 4, characterized in that: The main body and the core are cylindrical, The core portion has a diameter smaller than that of the body portion.

6. The power supply device according to claim 1, wherein: A power element is mounted on the first substrate. A control system component is mounted on the second substrate. The first substrate and the second substrate are accommodated in a housing. The first substrate is thermally coupled to the housing.

7. A method for manufacturing a power supply device, the method for manufacturing a power supply device according to claim 3, characterized in that: include: The first step is to connect the first substrate and the second substrate by the plurality of substrate connecting members; as well as In the second step, after the first step is performed, the conductive member is inserted into the first through hole and the second through hole.

8. The method for manufacturing a power supply device according to claim 7, wherein: The third step further includes fixing the substrate connecting member and the conductive member to the first substrate and the second substrate by applying solder to the first substrate and the second substrate, melting the solder, and cooling the solder after the second step is performed.

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