Method for improving tension on surface of circuit board and circuit board processing equipment

Abstract

The invention discloses a method for improving tension on the surface of a circuit board and circuit board processing equipment, and the method comprises the following steps: S100, carrying out the exposure processing of the circuit board, and forming a solder mask pattern; s200, carrying out atmospheric cyclone plasma treatment on the surface of the exposed circuit board; s300, developing the circuit board after the atmospheric cyclone plasma treatment, and rinsing and drying the circuit board after the development is completed; and S400, characters are printed on the circuit board in a jet printing mode, and secondary drying treatment is carried out. According to the method for improving the tension on the surface of the circuit board, the surface tension of the circuit board can be improved so as to improve the character adhesive force, and the'basin edge effect 'caused by sudden temperature rise of the substrate due to plasma treatment can be avoided, so that the character jet printing quality and the overall reliability of the circuit board are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a method for increasing the surface tension of a circuit board and circuit board processing equipment. Background Art

[0002] Character printing is a critical step in the production and processing of printed circuit boards (PCBs). Character adhesion directly impacts the quality and reliability of the boards. However, existing character printing processes face a pressing issue: insufficient surface tension of the solder mask layer. Typically, the surface tension of the solder mask is ≤24 dynes / cm². This low surface tension makes it difficult for character ink to adhere properly to the solder mask surface, resulting in poor character adhesion. This can easily cause characters to fall off during use, impacting the proper function and performance of the PCB. Summary of the Invention

[0003] The present invention aims to address at least one of the technical problems existing in the prior art. To this end, the present invention proposes a method for increasing the surface tension of a circuit board. This method can increase the surface tension of the circuit board to improve character adhesion and avoid the "edge effect" caused by the sudden increase in substrate temperature caused by plasma treatment, thereby improving the character printing quality and overall reliability of the circuit board.

[0004] The present invention also provides a circuit board processing device for implementing the above-mentioned method for increasing the surface tension of the circuit board.

[0005] According to the first aspect of the present invention, the method for increasing the surface tension of a circuit board comprises the following steps: S100: Expose the circuit board to form a solder mask pattern; S200: performing atmospheric cyclonic plasma treatment on the surface of the exposed circuit board; S300: Developing the circuit board after the atmospheric cyclonic plasma treatment, and rinsing and drying the circuit board after the development is completed; S400: Print characters on the circuit board and perform secondary drying.

[0006] The method for increasing the surface tension of a circuit board according to an embodiment of the present invention has at least the following beneficial effects: the present invention can effectively increase the surface tension of the circuit board surface by performing an atmospheric cyclone plasma treatment on the surface of the circuit board after the solder mask pattern is formed by the exposure process, and can generally increase it to 30-40 dynes / cm², meeting the requirements of character printing. The higher surface tension enables the character ink to better adhere to the surface of the circuit board, greatly reducing the risk of the characters falling off during use, and improving the quality and reliability of the circuit board. In addition, increasing the surface tension of the circuit board by the method of the present invention not only improves the adhesion of the characters, but also has a positive effect on other properties of the circuit board. The higher surface tension helps to improve the operability and compatibility of the circuit board in subsequent processing. For example, in processes such as welding and coating, it can better combine with other materials, reduce defects and problems caused by insufficient surface tension, and thus improve the overall performance and service life of the circuit board.

[0007] According to some embodiments of the present invention, in step S200, the medium selected for the atmospheric cyclonic plasma treatment is an argon / oxygen mixed gas.

[0008] According to some embodiments of the present invention, in step S200, the medium selected for the atmospheric cyclonic plasma treatment is a nitrogen / hydrogen mixed gas.

[0009] According to some embodiments of the present invention, in step S100 and step S200, P is the device power of the atmospheric cyclonic plasma treatment, and E is the exposure energy, and the device power and the exposure energy satisfy: 0.8×E≤P≤1.2×E.

[0010] According to some embodiments of the present invention, the power of the device is 800-1200W.

[0011] According to some embodiments of the present invention, in step S200, the speed of the circuit board during the large-scale cyclonic plasma treatment is 2-3 m / min.

[0012] According to the second aspect of the present invention, the circuit board processing equipment is used to implement the method of increasing the surface tension of the circuit board as described in any of the above items, including an exposure device, a plasma cleaning device, a developing device and a character printing device connected in sequence through a transmission device.

[0013] The method for increasing the surface tension of a circuit board according to an embodiment of the present invention has at least the following beneficial effects: the process steps of exposure, plasma cleaning, development and character printing are integrated into one device, thereby realizing continuous and automated production of circuit board processing. Manual intervention is reduced, and production efficiency and product quality are improved. The integrated equipment design reduces the floor space of the equipment and saves production space. At the same time, it also facilitates the installation, commissioning and maintenance of the equipment, reducing production costs. Moreover, the various process steps are closely connected through the transmission device, which can better achieve process coordination. For example, plasma cleaning is performed immediately after the exposure process to ensure the quality of the solder mask layer pattern and provide a good foundation for subsequent development and character printing. This synergy helps to improve the overall quality and performance of the circuit board.

[0014] According to some embodiments of the present invention, the plasma cleaning device includes a jig for placing the circuit board, the jig is provided with a centering component, the centering component centers the circuit board, and a plurality of nozzles are mounted above the jig for spraying a plasma mixture toward the circuit board.

[0015] According to some embodiments of the present invention, the nozzles are arranged in two rows in an upper and lower staggered manner, and each row is provided with 9 nozzles.

[0016] According to some embodiments of the present invention, a sensing component and a controller electrically connected to the sensing component are provided at the front end of the plasma cleaning device. When the sensing component senses that the circuit board enters the fixture, the controller controls the nozzle to operate immediately.

[0017] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which: Figure 1 A schematic flow chart of a method for increasing surface tension of a circuit board according to an embodiment of the present invention; Figure 2 Schematic diagram of circuit board processing equipment according to an embodiment of the present invention.

[0019] Reference numerals: exposure device 100 ; plasma cleaning device 200 ; developing device 300 ; character printing device 400 . DETAILED DESCRIPTION

[0020] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0021] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0022] In the description of the present invention, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0023] In the description of the present invention, unless otherwise explicitly defined, terms such as "set," "install," and "connect" should be interpreted broadly. Those skilled in the art can reasonably determine the specific meanings of these terms in the present invention based on the specific content of the technical solution. In the description of the present invention, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with such embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. In the description of this specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with such embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0024] Reference Figure 1 The present invention provides a method for increasing the surface tension of a circuit board, comprising the following steps: S100: Expose the circuit board to form a solder mask pattern; S200: performing atmospheric cyclonic plasma treatment on the surface of the exposed circuit board; S300: Developing the circuit board after the atmospheric cyclonic plasma treatment, and rinsing and drying the circuit board after the development is completed; S400: Print characters on the circuit board and perform secondary drying.

[0025] In a specific embodiment, step S100 involves evenly coating the surface of the circuit board substrate with solder resist ink, which can be done by screen printing, spraying, or other methods. The solder resist-coated circuit board is then placed in an exposure machine. Appropriate exposure parameters, such as exposure energy and exposure time, are set based on the desired solder resist pattern design. Under ultraviolet light, the solder resist ink undergoes a photochemical reaction, forming the desired solder resist pattern.

[0026] In a specific embodiment, step S200 involves rapidly transferring the exposed circuit board to a large cyclonic plasma treatment device. This device generates high-energy plasma, which collides and reacts with the circuit board surface, altering its molecular structure, increasing surface roughness and the number of reactive groups, and thus significantly increasing the surface tension. By properly configuring parameters such as the treatment gas type, flow rate, treatment power, and treatment time, the surface tension can be raised to a level that meets the requirements for inkjet printing.

[0027] In a specific embodiment, step S300 develops the circuit board after the atmospheric cyclonic plasma treatment, and rinses and dries the circuit board after the development is completed.

[0028] After the cyclonic plasma treatment, the PCB is placed in a developer, where a developer solution is used to remove unexposed solder mask ink, leaving the solder mask pattern clearly visible. After development, the PCB is placed in a rinser and rinsed with deionized water to remove any residual developer solution and impurities. Finally, the PCB is placed in a dryer to completely dry the surface, preparing it for subsequent inkjet printing.

[0029] In a specific embodiment, step S400 involves transferring the dried circuit board to a character printing device. Printing parameters, such as printing speed and ink volume, are set according to the character design requirements, and then the characters are printed. After printing is complete, the circuit board is placed back into the drying device for a secondary drying process, which rapidly solidifies the characters and improves their adhesion and durability.

[0030] Refer to the table below:

[0031] As can be understood, the present invention effectively increases the surface tension of the circuit board by subjecting it to atmospheric cyclonic plasma treatment after forming the solder mask pattern through exposure. This treatment typically reaches 30-40 dynes / cm², meeting the requirements for inkjet printing. This higher surface tension allows the ink to adhere better to the circuit board surface, significantly reducing the risk of ink falling off during use and improving the quality and reliability of the circuit board.

[0032] In particular, surface interactions release a significant amount of energy, causing the substrate temperature to rise sharply, often reaching 60°C or even higher. The character ink undergoes a rapid curing reaction in high-temperature environments, far exceeding the curing rate under normal conditions. This rapid curing prevents the character ink's molecular structure from fully adjusting and aligning, preventing it from forming a good interface with the circuit board surface. This reduces adhesion between the characters and the circuit board, leading to curling and peeling of the character edges, a phenomenon known as the "edge effect."

[0033] The present invention places the atmospheric cyclonic plasma treatment step after exposure and before development, effectively avoiding the need for plasma treatment before character printing. This allows the circuit board surface temperature to remain within a normal range during character printing, preventing the high temperatures generated by the plasma treatment from causing rapid curing of the characters. The character ink can cure normally under suitable temperature conditions, allowing the molecular structure to be fully adjusted and arranged to form a tight interface with the circuit board surface. This significantly improves the adhesion of the characters, reduces the risk of character detachment, and significantly enhances the printing quality and durability of the characters.

[0034] Furthermore, while conventional plasma treatment, performed before inkjet printing, can increase the surface tension of the PCB to a certain extent, it takes a long time before inkjet printing can begin. During this time, the PCB surface may be affected by environmental factors, such as dust and moisture in the air, which can adhere to the surface and cause a decrease in surface tension. Furthermore, chemical reactions such as oxidation may occur on the PCB surface during subsequent storage and transportation, further affecting the stability of surface tension.

[0035] The proposed large-scale cyclonic plasma treatment is performed after exposure and before development. This allows the treated circuit board surface to quickly enter subsequent processes such as development, rinsing, and drying, reducing the surface's contact time with the external environment and lowering the risk of contaminant adhesion and surface oxidation. Simultaneously, the development process can further clean the circuit board surface, removing unexposed solder resist ink and impurities, making the surface smoother and cleaner, and facilitating the full effectiveness of the large-scale cyclonic plasma treatment. Therefore, pre-treatment with large-scale cyclonic plasma can more effectively increase the surface tension of the circuit board surface, and the surface tension is more stable, maintaining it at a level that meets the requirements for inkjet printing for a long time.

[0036] Furthermore, conventional plasma treatment is carried out before character printing, which requires additional equipment operation and process arrangement, increasing the complexity of the process flow and the production cycle. Moreover, since it is necessary to wait for the surface temperature of the circuit board to drop to a suitable range before character printing can be carried out after plasma treatment, this will cause pauses and waiting time in the production line, reducing production efficiency. In the present invention, the large-scale cyclone plasma treatment is pre-placed after exposure and before development, forming a close connection with the exposure, development and other processes, making the entire process flow smoother and more efficient. The large-scale cyclone plasma treatment is carried out immediately after exposure, and then the development, rinsing, drying and character printing processes are carried out in sequence, reducing the waiting time between processes and the equipment switching time, and improving the utilization rate and production efficiency of the production line. At the same time, since problems such as the "basin edge effect" and unstable surface tension are avoided, the defective rate and rework rate are reduced, further improving production efficiency and product quality.

[0037] Furthermore, this invention reduces the defective rate by avoiding the "basin edge effect" and unstable surface tension problems associated with conventional plasma treatment before inkjet printing. Defective products require reprocessing, increasing costs for raw materials, energy, and labor, further reducing production costs.

[0038] In particular, pre-treatment with high-pressure cyclonic plasma improves character adhesion and reduces the risk of character peeling, thereby enhancing the electrical performance and reliability of the circuit board. Furthermore, higher surface tension helps improve the board's operability and compatibility during subsequent processing, such as soldering and coating, enabling better bonding with other materials, reducing defects and issues caused by insufficient surface tension, and further enhancing the overall performance and service life of the circuit board.

[0039] Increasing the surface tension of circuit boards using the method of the present invention not only improves the adhesion of characters but also positively impacts other circuit board properties. Higher surface tension helps improve the circuit board's operability and compatibility during subsequent processing, such as soldering and coating, enabling better bonding with other materials and reducing defects and problems caused by insufficient surface tension, thereby improving the overall performance and service life of the circuit board.

[0040] Reference Figure 1For step S200: the exposed surface of the circuit board is subjected to atmospheric cyclonic plasma treatment. In some embodiments, the medium used for atmospheric cyclonic plasma treatment is an argon / oxygen mixture. Argon, as an inert gas, provides high-energy particles in the plasma, physically bombarding contaminants on the circuit board surface, effectively removing impurities such as grease and dust. Oxygen, with its strong oxidizing properties, chemically reacts with organic matter on the circuit board surface, further cleaning the surface and introducing reactive groups to increase surface tension. The synergistic effect of this argon / oxygen mixture enables more efficient cleaning and activation of the circuit board surface, providing an excellent foundation for subsequent inkjet printing. The optimized mixing ratio of argon and oxygen maximizes the surface tension of the circuit board while ensuring effective cleaning. After treatment, the surface tension of the circuit board can be increased to 35-45 dynes / cm², far exceeding the level of conventional processes, significantly improving the adhesion of the printed characters. Furthermore, compared to single-gas plasma treatment, the argon / oxygen mixture allows for better control of energy distribution during the treatment process, reducing damage to the circuit board substrate and solder mask. The buffering effect of argon can reduce the direct impact of plasma on the surface of the circuit board, and the moderate oxidizing effect of oxygen will not excessively damage the chemical structure of the surface of the circuit board, thereby ensuring the quality and performance of the circuit board.

[0041] In a specific embodiment, a device with a large cyclone plasma processing function is prepared to ensure that the device can accurately control the gas flow rate and mixing ratio. Then, high-purity argon and oxygen are selected, with the argon purity being not less than 99.99% and the oxygen purity being not less than 99.5%. A circuit board substrate is prepared and exposure treatment is performed according to step S100 to form a solder mask pattern. The argon and oxygen are then introduced into the mixing chamber of the large cyclone plasma processing device through a gas pipeline, with the argon flow rate set to 12-18 L / min and the oxygen flow rate set to 3-7 L / min, so that the volume ratio of argon to oxygen is 3:1-6:1. The device power is set to 800-1000 W, and the processing time is 30-60 seconds. The exposed circuit board is quickly placed in the fixture of the large cyclone plasma processing device, and the device is started so that the argon / oxygen mixed gas forms a plasma under the action of a high-voltage electric field, thereby treating the surface of the circuit board. During the treatment process, the surface state of the circuit board is monitored in real time through an observation window on the device to ensure uniform treatment.

[0042] In other embodiments, the medium used for atmospheric cyclonic plasma treatment is a nitrogen / hydrogen mixture. Nitrogen, in the plasma, primarily acts as a physical bombardment and dilution agent, removing tiny particles and contaminants from the circuit board surface. Hydrogen, with its reducing properties, can reduce oxides formed on the circuit board surface due to oxidation to metals or low-valent compounds, thereby restoring the activity of the circuit board surface. This nitrogen / hydrogen mixture treatment method achieves deep cleaning and reduction of the circuit board surface, improving surface quality. After treatment with the nitrogen / hydrogen mixture plasma, the wettability of the circuit board surface is significantly improved. The increased surface tension allows the character ink to spread better across the circuit board surface, forming a uniform, dense character layer, enhancing character clarity and adhesion. The reducing effect of hydrogen can eliminate potential defects on the circuit board surface, such as oxide layers and stress concentrations, thereby improving the electrical performance and reliability of the circuit board. Furthermore, the protective effect of nitrogen prevents the circuit board from re-oxidizing during the treatment process, ensuring the durability of the treatment effect.

[0043] In a specific embodiment, a large cyclone plasma treatment device is prepared to ensure that the device has precise gas mixing and flow control functions. High-purity nitrogen and hydrogen are selected, and the purity of nitrogen is not less than 99.999%, and the purity of hydrogen is not less than 99.99%. Prepare a circuit board substrate and perform exposure treatment according to step S100. Introduce nitrogen and hydrogen into the mixing chamber of the equipment, set the nitrogen flow rate to 15-20L / min, and the hydrogen flow rate to 1-3L / min, so that the volume ratio of nitrogen to hydrogen is 5:1-20:1. Set the equipment power to 800-900W and the processing time to 25-50 seconds. Place the exposed circuit board on the fixture of the equipment, start the equipment, and form a plasma with the nitrogen / hydrogen mixture to treat the surface of the circuit board. It should be noted that during the treatment process, the gas pressure and flow of the equipment should be checked regularly to ensure the stability of the treatment process.

[0044] Specifically, in steps S100 and S200, P represents the equipment power of the atmospheric cyclonic plasma treatment, and E represents the exposure energy. The equipment power used for atmospheric cyclonic plasma treatment and the exposure energy during exposure must satisfy the following relationship: 0.8 × E ≤ P ≤ 1.2 × E. Establishing a reasonable matching relationship between equipment power and exposure energy allows the two process steps, exposure and atmospheric cyclonic plasma treatment, to work together to achieve optimal processing results. Exposure energy determines the quality of the solder mask pattern, while equipment power influences the plasma treatment's surface modification effect on the circuit board. This matching relationship ensures that the two process steps mutually enhance each other, jointly increasing the surface tension of the circuit board surface and providing optimal conditions for inkjet printing. However, in actual production, exposure energy and equipment power may fluctuate due to equipment performance, environmental factors, and other factors. By setting the range of 0.8 × E ≤ P ≤ 1.2 × E, certain parameter fluctuations can be tolerated, ensuring process stability. Even if the exposure energy or equipment power varies within a reasonable range, consistent processing results can be maintained, reducing the defective rate. Reasonable matching of equipment power and exposure energy avoids excessive settings of equipment power or exposure energy, thereby reducing energy consumption. While ensuring processing results, the goal of energy conservation and consumption reduction is achieved, reducing production costs.

[0045] Furthermore, the equipment power used for the large-scale cyclonic plasma treatment mentioned in the present invention should meet the requirements of 800-1200W. This power range can meet the processing requirements of different types and specifications of circuit boards. Whether it is a common FR-4 circuit board or a special CEM-3 composite substrate, suitable processing parameters can be found within this power range to effectively increase surface tension. Within this power range, large-scale cyclonic plasma treatment can generate plasma with sufficient energy to effectively clean, activate, and modify the circuit board surface. After treatment, the surface tension of the circuit board can reach 30-45 dynes / cm², which meets the requirements of inkjet printing and improves the adhesion of the characters. Furthermore, the power range of 800-1200W is within the normal operating range of the equipment, does not impose excessive load on the equipment, reduces the equipment failure rate, and improves the reliability and service life of the equipment. At the same time, if the power is less than 800W, the circuit board surface modification is likely to be insufficient and the tension-raising effect is poor. If it exceeds 1200W, the circuit board may overheat and be damaged. Therefore, the power range of 800-1200W is the optimal choice.

[0046] Specifically, in step S200, the speed of the circuit board during the large-scale cyclonic plasma treatment is 2-3 m / min. During implementation, the transmission device of the large-scale cyclonic plasma treatment equipment is adjusted to enable stable transmission of the circuit board at a speed of 2-3 m / min. The tension of the conveyor belt and the operation of the transmission system are checked to ensure the accuracy of the transmission speed. A speed adjustment device can be provided on the equipment to facilitate adjustment of the transmission speed according to actual production needs. A transmission speed of 2-3 m / min ensures that the circuit board spends an appropriate amount of time in the plasma treatment area, allowing the plasma to evenly affect the circuit board surface. This avoids problems such as insufficient treatment due to excessive speed or excessive treatment due to excessive speed, thereby improving the uniformity of the treatment effect. Within this speed range, high production efficiency can be achieved while ensuring treatment quality. A certain number of circuit boards can be processed per minute, meeting the needs of large-scale production. Furthermore, a reasonable transmission speed also facilitates continuous and stable operation of the equipment, reducing equipment downtime.

[0047] Reference Figure 2 The present invention also proposes a circuit board processing equipment for implementing the method of increasing the surface tension of the circuit board as described in any of the above items, comprising an exposure device 100, a plasma cleaning device 200, a developing device 300 and a character printing device 400 connected in sequence through a transmission device.

[0048] In a specific embodiment, an exposure device 100, a plasma cleaning device 200, a developing device 300, and a character printing device 400 are sequentially installed on a production line and connected by a transmission device. The transmission device can take the form of a conveyor belt or a robotic arm to ensure smooth transfer of circuit boards between the various devices. Each device is debugged and calibrated to ensure proper operation and meet process requirements. For example, the exposure parameters of the exposure device 100, the gas flow rate and power of the plasma cleaning device 200, the development time and temperature of the developing device 300, and the printing speed and ink volume of the character printing device 400 are adjusted. During operation, the circuit board to be processed is placed at the feed port of the exposure device 100, and the equipment is started. The circuit board then passes through the exposure device 100 for exposure, the plasma cleaning device 200 for atmospheric cyclonic plasma treatment, the developing device 300 for development, and the character printing device 400 for character printing. Throughout the entire process, the equipment control system monitors and adjusts the operating status of each device in real time to ensure process stability and consistency.

[0049] It's understandable that integrating the exposure, plasma cleaning, development, and inkjet printing process steps into a single device enables continuous and automated circuit board processing. This reduces manual intervention, improving production efficiency and product quality. The integrated equipment design reduces the equipment's footprint, saving production space. It also facilitates equipment installation, commissioning, and maintenance, reducing production costs. Furthermore, the various process steps are closely connected via a transmission device, enabling better process synergy. For example, performing plasma cleaning immediately after exposure ensures the quality of the solder mask pattern and provides a good foundation for subsequent development and inkjet printing. This synergy helps improve the overall quality and performance of the circuit boards.

[0050] Furthermore, in some embodiments, the plasma cleaning device 200 includes a jig for placing the circuit board, and the jig is designed and manufactured according to the size and shape of the circuit board. The jig should have sufficient strength and stability to withstand the pressure and temperature changes during the plasma cleaning process. A centering component is installed on the jig, and the centering component can be positioned mechanically or optically. For example, mechanical positioning pins and positioning grooves are used to enable the circuit board to be accurately placed in the center of the jig. A plurality of nozzles are set up above the jig, and the number and arrangement of the nozzles should be optimized according to the size and processing requirements of the circuit board. During operation, the circuit board is placed on the jig, and the centering component automatically centers the circuit board. Start the plasma cleaning device 200, and the nozzle sprays a plasma mixture to process the surface of the circuit board.

[0051] As you can understand, the centering assembly helps center the PCB, ensuring that the plasma mixture ejected from the printhead is evenly applied to the PCB surface. This avoids uneven treatment caused by offset PCB placement and improves treatment uniformity. Uniform plasma treatment effectively cleans, activates, and modifies the PCB surface, increasing surface tension and creating optimal conditions for subsequent character printing. This ensures character adhesion, clarity, and durability, improving the overall quality of the PCB.

[0052] Furthermore, a nozzle layout is designed based on the size of plasma cleaning device 200 and the processing requirements of the circuit board. The nozzles are arranged in two rows, staggered vertically, with nine nozzles in each row. The nozzle installation position and angle can be adjusted so that the plasma mixture sprayed by the nozzles covers the entire surface of the circuit board. During operation, the circuit board is placed on a fixture and plasma cleaning device 200 is activated. The two rows of staggered nozzles simultaneously spray the plasma mixture, providing a comprehensive and uniform treatment of the circuit board surface. The two rows of staggered nozzles create a cross-spray effect, ensuring that the plasma mixture covers the entire surface of the circuit board, including edges and corners. This avoids blind spots caused by improper nozzle arrangement and improves the comprehensiveness of the treatment effect. Furthermore, the staggered nozzle arrangement optimizes the airflow distribution of the plasma mixture, ensuring a more uniform airflow across the circuit board surface. This reduces airflow interference and eddy currents, improving the stability and effectiveness of the plasma treatment.

[0053] In some embodiments, a sensing component is installed at the front end of the plasma cleaning apparatus 200. The sensing component can be a photoelectric sensor, infrared sensor, or other sensor. Ensure that the sensing component can accurately sense the position of the circuit board entering the jig. Specifically, the sensing component is electrically connected to the controller, and a control program is written so that the controller immediately activates the nozzle when it senses the circuit board entering the jig. Before operation, the sensing component and controller are debugged to check the sensing sensitivity and control accuracy. If necessary, the position and parameters of the sensing component are adjusted to ensure proper operation. During operation, the circuit board is placed on the conveyor. When the circuit board enters the jig of the plasma cleaning apparatus 200, the sensing component senses the presence of the circuit board and transmits a signal to the controller. Upon receiving the signal, the controller immediately activates the nozzle, spraying a plasma mixture to treat the surface of the circuit board. The configuration of the sensing component and controller enables automated control of the plasma cleaning apparatus 200. When the circuit board enters the jig, the nozzle automatically activates without manual intervention, improving production efficiency and automation. The printhead only starts running when the PCB is in the jig, avoiding energy waste caused by the printhead continuously running when there is no PCB. This reduces production costs and also reduces equipment wear and failure rate.

[0054] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the scope of the present invention.

Claims

1. A method for increasing the surface tension of a circuit board, characterized in that: The steps include: S100: Expose the circuit board to form a solder mask pattern; S200: performing atmospheric cyclonic plasma treatment on the surface of the exposed circuit board; S300: Developing the circuit board after the atmospheric cyclonic plasma treatment, and rinsing and drying the circuit board after the development is completed; S400: Print characters on the circuit board and perform secondary drying.

2. The method for increasing the surface tension of a circuit board according to claim 1, characterized in that: In step S200, the medium selected for the atmospheric cyclonic plasma treatment is an argon / oxygen mixed gas.

3. The method for increasing the surface tension of a circuit board according to claim 1, characterized in that: In step S200, the medium selected for the atmospheric cyclonic plasma treatment is a nitrogen / hydrogen mixed gas.

4. The method for increasing the surface tension of a circuit board according to claim 1, characterized in that: In step S100 and step S200, P is the device power of the atmospheric cyclonic plasma treatment, and E is the exposure energy. The device power and the exposure energy satisfy: 0.8×E≤P≤1.2×E.

5. The method for increasing the surface tension of a circuit board according to claim 4, characterized in that: The power of the equipment is 800-1200W.

6. The method for increasing the surface tension of a circuit board according to claim 1, characterized in that: In step S200, the speed of the circuit board during the large-scale cyclonic plasma treatment is 2-3 m / min.

7. A circuit board processing device for implementing the method for increasing the surface tension of a circuit board according to any one of claims 1 to 6, characterized in that: The invention comprises an exposure device, a plasma cleaning device, a developing device and a character printing device which are sequentially connected through a transmission device.

8. The method for increasing the surface tension of a circuit board according to claim 7, characterized in that: The plasma cleaning device includes a jig for placing a circuit board. The jig is provided with a centering component, which centers the circuit board. A plurality of nozzles are mounted above the jig for spraying a plasma mixture toward the circuit board.

9. The method for increasing the surface tension of a circuit board according to claim 8, characterized in that: The nozzles are arranged in two rows with an upper and lower staggered position, and each row is provided with 9 nozzles.

10. The method for increasing the surface tension of a circuit board according to claim 8, characterized in that: The front end of the plasma cleaning device is provided with an induction component and a controller electrically connected to the induction component. The induction component is used to sense when the circuit board enters the fixture, and the controller controls the nozzle to run immediately.

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