Electronic device

Abstract

The invention discloses an electronic device which comprises a shell, a heat source and a radiator, the shell is provided with a containing space and a first surface, the heat source is arranged in the containing space, the radiator is arranged on the first surface of the shell, a part of the shell is arranged between the heat source and the radiator, and the radiator is provided with a plurality of tubular spaces with two open ends. The plurality of tubular spaces respectively extend along a first direction parallel to the first surface and are arranged on the first surface in parallel, the radiator defines a height in a second direction perpendicular to the first surface, at least one of the tubular spaces defines a width in a third direction, and the third direction is parallel to the first surface and perpendicular to the first direction. The ratio of the height to the width is between 1.4 and 5.2.

Description

Technical Field

[0001] The present disclosure relates to an electronic device, and more particularly to an electronic device with a heat dissipation function. Background Art

[0002] In the current field of display technology, light-emitting diodes (LEDs), such as organic light-emitting diodes (OLEDs) and micro-LEDs (Micro LEDs / μLEDs), are one of the most promising technologies. Their advantages include low power consumption, high contrast, wide color gamut, high brightness, small size, thinness, and energy saving.

[0003] Taking light-emitting diode (LED) display devices as an example, they are often used in the field of outdoor multimedia displays. However, when the heat energy generated by the external light radiation plus the internal heating components exceeds the temperature tolerance of the internal components of the display device, the display device may be damaged. In known LED display devices, an external circulation heat dissipation method is usually adopted. For example, a fan can be used in conjunction with ventilation and heat dissipation holes formed on the housing of the display device to introduce cold air outside the housing into the housing and discharge the hot air inside the housing out of the housing. In this circulation heat dissipation method, the electronic components in the LED display device are cooled to maintain the normal operation of the LED display device. However, because the LED display device is set in an outdoor environment for a long time, dust, moisture, and even small insects in the environment may enter the housing of the LED display device through the ventilation holes, which may cause damage to the electronic components inside the LED display device.

[0004] Therefore, how to provide an electronic device that can prevent dust, moisture, and foreign matter from the environment from entering its housing while providing an appropriate heat dissipation effect is one of the important issues in the industry. Summary of the Invention

[0005] The present disclosure provides an electronic device that can prevent dust, moisture, and foreign matter from the environment from entering its housing while providing an appropriate heat dissipation effect.

[0006] According to the present disclosure, an electronic device includes a housing, a heat source, and a radiator. The housing has a storage space and a first surface. The heat source is disposed in the storage space, and the radiator is disposed on the first surface of the housing. A portion of the housing is interposed between the heat source and the radiator. The radiator has a plurality of tubular spaces with open ends. These tubular spaces extend along a first direction parallel to the first surface and are arranged in parallel on the first surface. The radiator is defined by a height in a second direction perpendicular to the first surface. At least one of these tubular spaces is defined by a width in a third direction parallel to the first surface and perpendicular to the first direction. The ratio of the height to the width is between 1.4 and 5.2. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 FIG. 1 is a perspective schematic diagram of an electronic device according to an embodiment of the present disclosure.

[0008] Figure 2 For example Figure 1 A cross-sectional perspective view of the electronic device shown.

[0009] Figure 3 2 is a cross-sectional view of a heat sink according to an embodiment of the present disclosure.

[0010] Figure 4 This is a cross-sectional view of a tubular space of a radiator according to an embodiment of the present disclosure.

[0011] Figure 5 FIG. 1 is a perspective schematic diagram of an electronic device according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0012] The following will describe an electronic device according to a preferred embodiment of the present disclosure with reference to the relevant drawings, wherein the same components will be described with the same reference symbols. It should be understood that the following description provides many different embodiments for implementing different implementations of some embodiments of the present disclosure. The specific components and arrangements described below are only for a simple and clear description of some embodiments of the present disclosure. Of course, these embodiments are only for illustrative purposes and are not intended to limit the scope of the present disclosure. In addition, repeated numbers or marks may be used in different embodiments. These repetitions are only for a simple and clear description of some embodiments of the present disclosure and do not represent any correlation between the different embodiments and / or structures discussed. Furthermore, when a component is said to be on or above another component, it includes a situation where a component is in direct contact with another component; alternatively, there may be a situation where there are one or more other components in between, in which case a component may not be in direct contact with another component.

[0013] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used in the embodiments to describe the relative relationship of one component to another component in the drawings. It is understood that if the device in the drawings is turned upside down, the component described as being on the "lower" side will become the component on the "upper" side.

[0014] Here, the terms "about," "approximately," and "substantially" generally indicate a range within 20%, preferably within 10%, and more preferably within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value. The quantities given herein are approximate quantities, that is, even without the specific wording of "about," "approximately," or "substantially," the meaning of "about," "approximately," or "substantially" may be implied.

[0015] It is understood that although the terms "first," "second," "third," etc. may be used herein to describe various components, constituents, regions, layers, and / or parts, these components, constituents, regions, layers, and / or parts should not be limited by these terms, and these terms are merely used to distinguish different components, constituents, regions, layers, and / or parts. Thus, a first component, component, region, layer, and / or part discussed below may be referred to as a second component, component, region, layer, and / or part without departing from the teachings of some embodiments of the present disclosure.

[0016] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meanings as commonly understood by those skilled in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the context or context of the relevant art and this disclosure, and should not be interpreted in an idealized or overly formal manner unless otherwise defined in the embodiments of this disclosure.

[0017] Some embodiments of the present disclosure may be combined with the following Figure 1 It is understood that the drawings of the embodiments of the present disclosure are also considered part of the description of the embodiments of the present disclosure. It should be understood that the drawings of the embodiments of the present disclosure are not shown to scale with actual devices and components. The shapes and thicknesses of the embodiments may be exaggerated in the drawings to clearly illustrate the features of the embodiments of the present disclosure. In addition, the structures and devices in the drawings are shown in a schematic manner to clearly illustrate the features of the embodiments of the present disclosure.

[0018] In some embodiments of the present disclosure, relative terms such as "lower", "upper", "parallel", "vertical", "below", "above", "top", "bottom", etc. should be understood as the orientation shown in the paragraph and related drawings. Such relative terms are only for the convenience of description and do not mean that the device described needs to be manufactured or operated in a specific orientation. Terms related to joining and connection, such as "connected" and "connected", unless otherwise defined, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, but having other structures disposed between the two structures. Furthermore, such terms related to joining and connection may also include situations where both structures are movable or both structures are fixed.

[0019] Please also refer to Figure 1 and Figure 2 As shown, Figure 1 is a three-dimensional schematic diagram of an electronic device 10 according to an embodiment of the present disclosure. Figure 2 For example Figure 1The electronic device 10 is a cross-sectional perspective view shown in FIG. In this embodiment, the electronic device 10 may be, for example, but not limited to, a light-emitting diode display device, but the present disclosure is not limited thereto. In other embodiments, the electronic device 10 may also be other types of electronic devices, particularly electronic devices suitable for outdoor use, such as micro LED displays, sub-millimeter LED displays, organic light-emitting diode (OLED) displays, quantum dot LED displays, liquid crystal displays, etc., but the present disclosure is not limited thereto.

[0020] like Figure 1 and Figure 2 As shown, the electronic device 10 of this embodiment includes a housing 11, a heat source 12 and a heat sink 13. Figure 2 As shown, the housing 11 has a housing space 111 and a first surface 112. The heat source 12 is disposed within the housing space 111, and the heat sink 13 is disposed on the first surface 112 of the housing 11, with a portion of the housing 11 interposed between the heat source 12 and the heat sink 13. In this embodiment, the first surface 112 of the housing 11 may be, for example, but not limited to, the outer surface of the back panel of the housing 11, i.e., the heat sink 13 is disposed outside the back panel of the housing 11. It should be noted that the above description is merely exemplary and is not intended to limit the scope of this disclosure.

[0021] In this embodiment, to make the electronic device 10 suitable for outdoor use, the housing 111 must be sealed (i.e., the housing of the electronic device lacks ventilation holes for external air to flow in). This prevents dust, moisture, and even small insects from entering the housing 11 of the electronic device 10 through the ventilation holes, potentially damaging the internal electronic components of the electronic device 10. Furthermore, the heat sink 13 must be designed to provide sufficient heat dissipation efficiency to prevent overheating and damage to the internal electronic components of the electronic device 10. In one embodiment, the electronic device 10 can meet IP66 or higher water and dustproof ratings. For example, the electronic device 10 of the present disclosure has a fully enclosed design suitable for outdoor use, achieves a brightness of 3000 nits, and achieves an IPX6 or higher water and dustproof rating. Therefore, even in outdoor temperatures as high as 50 degrees Celsius, the internal temperature of the electronic device 10 can still be maintained within operating temperature specifications and can operate normally. However, the operating conditions of the electronic device 10 of the present disclosure are not limited thereto. In this embodiment, the housing 11 itself can provide a completely enclosed accommodating space 111. In another embodiment, the housing 11 can be combined with a display panel (not shown) to form the accommodating space 111 into a sealed space. It should be noted that the above description is merely an example and is not intended to limit the scope of this disclosure.

[0022] In addition, in this embodiment, if the electronic device 10 is an LED display device, its heat source 12 can be, for example, but not limited to, an LED display unit (including each LED), a driving circuit, a control circuit, etc. of the LED display device, but the present disclosure is not limited thereto. In addition, in this embodiment, the housing 11 can further include a second surface 113, which is arranged opposite to the first surface 112, so that the heat source 12 is located between the first surface 112 and the second surface 113. If the electronic device 10 is an LED display device, the second surface 113 can be, for example, but not limited to, a display surface of the electronic device 10, and the user can face the display surface to see the image. It should be noted that the above description is only an example and is not intended to limit the scope of the present disclosure.

[0023] It should be noted that, in order for the electronic device 10 to receive external signals, the first surface 112 of the housing 11 may include a port arrangement area 114. One or more signal receiving ports may be arranged in the port arrangement area 114 according to product specifications.

[0024] Next, please refer to Figure 1 and Figure 3 As shown, Figure 3 is a cross-sectional view of the heat sink 13 according to an embodiment of the present disclosure, in particular, Figure 3FIG. 1 is a cross-sectional view of the heat sink 13 according to an embodiment of the present disclosure taken along a transverse section perpendicular to the first direction X. FIG.

[0025] like Figure 1 and Figure 3 As shown, the heat sink 13 has a plurality of tubular spaces 131 with open ends. These tubular spaces 131 extend along a first direction X parallel to the first surface 112 and are arranged in parallel on the first surface 112. In addition, the heat sink 13 defines a height H in a second direction Y perpendicular to the first surface 112. At least one of the tubular spaces 131 defines a width C in a third direction Z parallel to the first surface 112 (i.e., perpendicular to the second direction Y) and perpendicular to the first direction X. The ratio of the height H to the width C is between 1.4 and 5.2, that is, the ratio of the height H to the width C is greater than or equal to 1.4 and less than or equal to 5.2 (1.4≤H / C≤5.2). In this embodiment, the first direction X is parallel to the direction of gravity. Therefore, when the air inside the tubular spaces 131 absorbs heat to form hot air, the hot air moves upward and leaves the tubular spaces 131 through the upper openings of the tubular spaces 131. At the same time, cold air from the external environment enters the tubular spaces 131 through the lower openings of the tubular spaces 131. In this way, natural convection can be formed, allowing the radiator 13 to achieve a heat dissipation effect without the need for an additional fan.

[0026] It should be noted that in this embodiment, multiple heat sinks 13 can also be provided at the same time. Figure 1 As shown, multiple radiators 13 can be arranged side by side on a heat dissipation plate (not shown) to form a radiator assembly, and then the heat dissipation plate is arranged on the first surface 112 of the housing 11, or as shown in FIG. Figure 2 As shown, each heat sink 13 is directly attached to the first surface 112 of the housing 11. Each heat sink 13 includes but is not limited to the five aforementioned tubular spaces 131, and these heat sinks 13 can be separated from each other or connected to each other. In addition, considering the position of the port setting area 114 of the first surface 112 and / or the appearance structure of the housing 11, heat sinks 13 of different lengths can be used to cover the entire first surface 112 as much as possible, approximately or completely, thereby improving its heat dissipation efficiency. It should be noted that the above description is only an example and is not intended to limit the scope of this disclosure.

[0027] In particular, this embodiment forms a plurality of tubular spaces 131 on the heat sink 13 and designs the dimensions of the heat sink 13 and the tubular spaces 131 to meet the condition that the ratio of height H to width C is between 1.4 and 5.2. This balance can be achieved between heat dissipation effect, material cost, and overall weight, thereby providing an electronic device 10 with better product competitiveness.

[0028] In this embodiment, if Figure 3 As shown, the heat sink 13 includes a first side wall 132, a second side wall 133, a third side wall 134, a fourth side wall 135 and at least two partition walls 136. The first side wall 132 is used to be adjacent to the first surface 112. The second side wall 133 is arranged opposite to the first side wall 132 and away from the first surface 112. The third side wall 134 is arranged opposite to the fourth side wall 135. The third side wall 134 connects one side of the first side wall 132 and one side of the second side wall 133 respectively. The fourth side wall 135 connects the other side of the first side wall 132 and the other side of the second side wall 133 respectively, so that the heat sink 13 defines a heat dissipation space with open ends. In addition, the partition wall 136 is arranged between the first side wall 132 and the second side wall 133, and its two sides are respectively connected to the first side wall 132 and the second side wall 133, so that a plurality of tubular spaces 131 are formed in the heat dissipation space. In this embodiment, as shown in FIG. Figure 3 As shown, four partition walls 136 are provided in the heat dissipation space, thereby dividing the heat dissipation space into five tubular spaces 131. In other words, a portion of the first side wall 132, a portion of the second side wall 133, and at least two partition walls 136 constitute one of the tubular spaces 131. It should be noted that the above description is merely an example and is not intended to limit the scope of this disclosure.

[0029] like Figure 3 As shown, in this embodiment, the first sidewall 132 and the second sidewall 133 are each defined to have a thickness A. In one embodiment, the first sidewall 132, the second sidewall 133, the third sidewall 134, and the fourth sidewall 135 are each defined to have a thickness A. Furthermore, in this embodiment, each of the partition walls 136 is each defined to have a thickness B. It should be noted that the above description is merely an example and is not intended to limit the scope of this disclosure.

[0030] Please also refer to Figure 3 and Figure 4 As shown, Figure 4 is a cross-sectional view of a tubular space 131 of the radiator 13 according to an embodiment of the present disclosure, in particular, Figure 4 For example Figure 3 The dotted area S in FIG. 1 shows a cross-sectional view of a tubular space 131 of the radiator 13. In this embodiment, in the cross-section of the tubular space 131, a portion of the first side wall 132, a portion of the second side wall 133, and two partition walls 136 forming the tubular space 131 collectively define an inner cross-sectional area and an outer cross-sectional area. The ratio of the inner cross-sectional area to the outer cross-sectional area is between 0.1 and 0.9. Specifically, as Figure 4 As shown, the dotted area S (as Figure 3) includes two partition walls 136 and a portion of the first side wall 132 and a portion of the second side wall 133, wherein the first side wall 132 and the second side wall 133 have a thickness A, and the partition wall 136 has a thickness B. Therefore, the cross-sectional area of ​​the tube can be calculated by the following formula (1):

[0031] Cross-sectional area of ​​the tube = C*(H-2A) Formula (1)

[0032] In addition, the above-mentioned outer cross-sectional area of ​​the tube can be calculated by the following formula (2):

[0033] External cross-sectional area of ​​the tube = (C + 2B) * H (2)

[0034] Therefore, when the condition defined in this embodiment is that the ratio of the inner cross-sectional area of ​​the tube to the outer cross-sectional area of ​​the tube is between 0.1 and 0.9, the following formula (3) can be obtained:

[0035] 0.1 ≤ [C * (H-2A)] / [(C+2B) * H] ≤ 0.9 Formula (3)

[0036] In summary, in order to make the electronic device 10 of this embodiment more competitive, the heat sink 13 can be designed and manufactured according to the constraints of the above formulas (1) to (3), thereby achieving a balance between heat dissipation effect, material cost and overall weight.

[0037] Furthermore, in this embodiment, the thickness A of the first sidewall 132, the second sidewall 133, the third sidewall 134, and the fourth sidewall 135 can be designed within an appropriate range to strike a balance between heat dissipation, material cost, and overall weight. For example, the thickness A of at least one of the first sidewall 132, the second sidewall 133, the third sidewall 134, and the fourth sidewall 135 can be, for example, but not limited to, between 1 mm and 7 mm, i.e., 1 mm ≤ thickness A ≤ 7 mm. Furthermore, the thickness B of the partition wall 136 can also be designed within an appropriate range to strike a balance between heat dissipation, material cost, and overall weight. For example, the thickness B of the partition wall 136 can be, for example, but not limited to, between 1 mm and 4 mm, i.e., 1 mm ≤ thickness B ≤ 4 mm. Furthermore, the height H of the heat sink 13 can also be designed within an appropriate range to strike a balance between heat dissipation, material cost, and overall weight. For example, the height H of the heat sink 13 may be, but is not limited to, between 7 mm and 26 mm, ie, 7 mm ≤ height H ≤ 26 mm.

[0038] In addition, in this embodiment, the first side wall 132, the second side wall 133, the third side wall 134 and the fourth side wall 135 can, for example but not limited to, form a trapezoid together. Figure 1 and Figure 3 As shown, the second sidewall 133 is slightly smaller than the first sidewall 132 (for example, in the third direction Z, the length of the second sidewall 133 is shorter than the length of the first sidewall 132). Therefore, in a cross-section perpendicular to the first direction X, the first sidewall 132, the second sidewall 133, the third sidewall 134, and the fourth sidewall 135 forming the heat dissipation space together form a trapezoid. It should be noted that the above description is merely an example and is not intended to limit the scope of this disclosure.

[0039] Next, please refer to Figure 2 As shown, in this embodiment, the heat source 12 is adjacent to the second surface 113 of the shell 11, and there is a distance between the heat source 12 and the first surface 112 of the shell 11, and the size of this distance is defined by the size of the shell 11. In addition, the electronic device 10 of this embodiment may further include a plurality of heat pipes 14 (heat pipes), which are arranged in the accommodating space 111 and located between the heat source 12 and the first surface 112 of the shell 11, wherein at least a portion of these heat pipes 14 has a bent shape. More specifically, at least one of these heat pipes includes a first portion and a second portion, and the first portion is bent relative to the second portion. For example, in this embodiment, these heat pipes 14 respectively have a first end 141, a second end 142, and a middle portion 143 located between the two ends. The middle portion 143 is bent relative to the first end portion 141, and the first end portion 141 of at least one heat pipe 14 is in direct or indirect contact with the heat source 12 to absorb heat generated by the heat source 12, while the second end portion 142 is in direct or indirect contact with the housing 11 (at the first surface 112) to transfer heat to the housing 11. For example, in one embodiment, the first end portion 141 of at least one heat pipe 14 is in direct contact with the heat source 12. In another embodiment, the first end portion 141 of at least one heat pipe 14 may be in indirect contact with the heat source 12, for example, but not limited to, through a thermal conductive paste. The thermal conductive paste may be, for example, but not limited to, a silicone-based thermal conductive paste, which may be polysiloxane-based and supplemented with highly thermally conductive fillers (e.g., metal-containing materials). This paste has excellent electrical insulation and thermal conductivity, and can operate for long periods of time in a temperature range of, for example, -60°C to 250°C without drying, hardening, or melting. Of course, the thermal conductive paste may also be a non-silicon-based thermal conductive paste, and this disclosure is not limited thereto.

[0040] In addition, in one embodiment, the second end 142 of at least one heat pipe 14 directly contacts the housing 11 (at the first surface 112) and transfers heat to the housing 11. In another embodiment, the second end 142 of at least one heat pipe 14 may contact the housing 11 (at the first surface 112) through a heat conductor 15, and then transfer heat to the housing 11 through the heat conductor 15. The heat conductor 15 may be, for example, but not limited to, a heat conducting component fabricated from an aluminum ingot, and may be flat or have a plurality of fins. The heat conductor 15 is disposed within the accommodating space 111 and on the inner sidewall of the housing 11 opposite the first surface 112, and the second end 142 of the heat pipe 14 is connected to the heat conductor 15. Furthermore, thermal paste may be additionally disposed between the second end 142 and the housing 11, between the second end 142 and the heat conductor 15, or between the housing 11 and the heat conductor 15, without limitation in this disclosure. Therefore, the heat generated by the heat source 12 can be transferred to the housing 11 through the thermal paste, heat pipe 14, and thermal conductive element 15 in sequence, and then dissipated to the environment through the heat sink 13. It should be noted that the above description is only an example and is not intended to limit the scope of this disclosure.

[0041] In this embodiment, the electronic device 10 is, for example, a landscape display device; of course, in other embodiments, the electronic device may also be, for example, a portrait display device.

[0042] Please refer to Figure 5 As shown, the electronic device 10' of another embodiment of the present disclosure can be, for example, but not limited to, a portrait display device, which includes a housing 11, a heat source (not shown) and a radiator 13', wherein the radiator 13' has a plurality of tubular spaces 131' with open ends, and these tubular spaces 131' extend along a first direction X (gravity direction) parallel to the first surface 112 and are arranged in parallel on the first surface 112. Therefore, when the air inside these tubular spaces 131' absorbs heat to form hot air, the hot air will move upward and leave these tubular spaces 131' from the upper openings of these tubular spaces 131', while the cold air in the external environment will enter the interior of these tubular spaces 131' from the lower openings of these tubular spaces 131'. In this way, natural convection can be formed, so that the radiator 13 can achieve the heat dissipation effect without the need for an additional fan. In addition, regarding the structure and configuration of each component in the electronic device 10 ′ of this embodiment, reference may be made to the structure and configuration of each component in the electronic device 10 of the previous embodiment, and no further details will be given here.

[0043] It should be noted that the features of the various embodiments may be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

[0044] In summary, the electronic device disclosed herein includes a housing, a heat source, and a heat sink. The housing has a housing and a first surface. The heat source is disposed within the housing, the heat sink is disposed on the first surface of the housing, and a portion of the housing is interposed between the heat source and the heat sink. The heat sink includes a plurality of tubular spaces with open ends. The tubular spaces extend in a first direction parallel to the first surface and are arranged in parallel on the first surface. The heat sink defines a height in a second direction perpendicular to the first surface, and at least one tubular space defines a width in a third direction parallel to the first surface and perpendicular to the first direction. The ratio of the height to the width is between 1.4 and 5.2. Compared to conventional technologies, the electronic device disclosed herein can, on the one hand, form a sealed housing suitable for outdoor environments, thereby preventing dust, moisture, and even small insects from entering the housing of the electronic device through ventilation holes and causing damage to the internal electronic components of the electronic device. On the other hand, the heat sink design can provide appropriate heat dissipation, allowing the electronic device to maintain its internal temperature within operating temperature specifications and operate normally even in high outdoor temperatures.

[0045] The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or variations that do not depart from the spirit and scope of the present invention should be included in the scope of the appended patent applications.

Claims

1. An electronic device, characterized in that: Include: A housing having a receiving space and a first surface; a heat source disposed in the accommodating space; and a heat sink disposed on the first surface of the housing, wherein a portion of the housing is interposed between the heat source and the heat sink; The radiator has a plurality of tubular spaces with open ends, each of which extends in a first direction parallel to the first surface and is arranged in parallel on the first surface. The radiator is defined by a height in a second direction perpendicular to the first surface, and at least one of the plurality of tubular spaces is defined by a width in a third direction parallel to the first surface and perpendicular to the first direction. The ratio of the height to the width is between 1.4 and 5.

2.

2. The electronic device according to claim 1, wherein The radiator includes a first side wall, a second side wall, a third side wall, a fourth side wall and at least two partition walls, the first side wall is adjacent to the first surface, the second side wall is arranged opposite to the first side wall and away from the first surface, the third side wall is arranged opposite to the fourth side wall, the third side wall respectively connects one side edge of the first side wall and one side edge of the second side wall, the fourth side wall respectively connects the other side edge of the first side wall and the other side edge of the second side wall, and the at least two partition walls are arranged between the first side wall and the second side wall.

3. The electronic device according to claim 2, wherein: A portion of the first side wall, a portion of the second side wall, and the at least two partitioning walls constitute at least one of the multiple tubular spaces. In a cross-section perpendicular to the first direction, the portion of the first side wall, the portion of the second side wall, and the at least two partitioning walls jointly define an inner cross-sectional area of ​​the tube and an outer cross-sectional area of ​​the tube, and the ratio of the inner cross-sectional area of ​​the tube to the outer cross-sectional area of ​​the tube is between 0.1 and 0.

9.

4. The electronic device according to claim 2, wherein: The thickness of at least one of the first sidewall, the second sidewall, the third sidewall and the fourth sidewall is between 1 mm and 7 mm.

5. The electronic device according to claim 2, wherein: In a cross section perpendicular to the first direction, the first side wall, the second side wall, the third side wall and the fourth side wall of the heat sink together form a trapezoid.

6. The electronic device according to claim 2, wherein: The thickness of the partition wall is between 1 mm and 4 mm.

7. The electronic device according to claim 1, wherein: The height ranges from 7 mm to 26 mm.

8. The electronic device according to claim 1, wherein: There is a distance between the heat source and the first surface. 9 . The electronic device as claimed in claim 1 , further comprising a plurality of heat pipes disposed in the accommodating space and located between the heat source and the first surface, wherein a first end portion of at least one of the plurality of heat pipes contacts the heat source.

10. The electronic device according to claim 9, wherein: At least one of the plurality of heat pipes includes a first portion and a second portion, and the first portion is bent relative to the second portion.

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