Communication socket

Abstract

A communication socket comprises a shell, a heat dissipation assembly and an adjusting frame. The shell comprises a containing cavity and a heat dissipation opening communicated with the containing cavity. The heat dissipation assembly comprises a heat dissipation substrate which is located on the shell; a guide assembly connected to the heat dissipation substrate; and the heat conduction block is connected to the lower surface of the heat dissipation substrate and corresponds to the heat dissipation opening. The adjusting frame is arranged on the heat dissipation assembly, is used for moving the heat dissipation assembly, and comprises a pressing block corresponding to the guide assembly; and the stop block is positioned in the accommodating cavity. When the communication module is located in the containing cavity and is adjacent to the stop block, the heat conduction block is separated from the communication module. After the communication module pushes the heat conduction block, the pressing block slides along the guide assembly, so that the heat conduction block passes through the heat dissipation opening and abuts against the communication module.

Description

Technical Field

[0001] The present invention relates to a communication socket, and in particular to an optical communication socket with a heat dissipation component. Background Art

[0002] To process massive amounts of data, data servers often use optical communication as a data transmission method. With the rapid development of optical communication, the data transmission rate of optical communication modules has gradually increased, generating a large amount of heat, which requires a heat dissipation structure to cool it.

[0003] The heat dissipation structure is typically installed on the housing of an optical communication socket and extends through a heat dissipation opening in the housing. When an optical communication module is inserted into the housing, its upper surface contacts the heat conductive block of the heat dissipation structure to conduct heat. However, repeated insertion and removal of the optical communication module can cause scratches on the lower surface of the heat conductive block, increasing the thermal resistance between the heat conductive block and the optical communication module, thereby reducing the heat dissipation efficiency of the optical communication module. Summary of the Invention

[0004] In view of this, an adjustment frame is provided in the communication socket in the present invention, which can lift the heat dissipation component to separate it from the upper surface of the optical communication module during the process of plugging and unplugging the optical communication module, thereby reducing the probability of scratches on the lower surface of the heat conductive block, so as to maintain the heat dissipation effect of the heat dissipation component on the optical communication module.

[0005] One embodiment of the present invention discloses a communication socket, comprising a shell, a heat dissipation assembly, and an adjustment frame. The shell comprises a receiving cavity and a heat dissipation opening connected to the receiving cavity. The heat dissipation assembly comprises a heat dissipation substrate, located on the shell; a guide assembly, connected to the heat dissipation substrate; and a heat conductive block, connected to the lower surface of the heat dissipation substrate and corresponding to the heat dissipation opening. The adjustment frame is provided on the heat dissipation assembly for moving the heat dissipation assembly, and comprises a pressing block, corresponding to the guide assembly; and a stop block, located in the receiving cavity. When the communication module is located in the receiving cavity and adjacent to the stop block, the heat conductive block is separated from the communication module. After the communication module pushes the heat conductive block, the pressing block slides along the guide assembly to pass the heat conductive block through the heat dissipation opening and abut against the communication module.

[0006] According to an embodiment of the present invention, the communication socket further includes a connector disposed in the accommodating cavity. When the communication module is electrically connected to the connector, the heat conductive block passes through the heat dissipation opening and abuts against the communication module.

[0007] According to one embodiment of the present invention, the housing further includes a through-hole communicating with the accommodating cavity. The stopper extends through the through-hole into the accommodating cavity and is proximate to the connector. The through-hole is longer than the stopper, and the through-hole and the stopper are measured in the same direction.

[0008] According to one embodiment of the present invention, the communication socket further includes an elastic component that abuts the above-mentioned adjustment frame and is close to the above-mentioned connector, wherein when the above-mentioned stop block is not pushed by the above-mentioned communication module, the above-mentioned elastic component maintains the above-mentioned adjustment frame in an initial position to separate the above-mentioned heat conductive block from the above-mentioned accommodating cavity.

[0009] According to an embodiment of the present invention, the connector is located at the rear end of the housing, and a socket of the housing is located at the front end of the housing, wherein the communication module enters the accommodating cavity through the socket.

[0010] According to an embodiment of the present invention, the heat dissipation assembly further includes a plurality of fins connected to the upper surface of the heat dissipation substrate.

[0011] According to an embodiment of the present invention, the guide assembly further includes a pressing inclined surface extending and tilting relative to the heat dissipation substrate. When the communication module pushes the heat conductive block, the pressing block slides along the pressing inclined surface.

[0012] According to one embodiment of the present invention, the adjustment frame further includes a lifting block corresponding to the guide assembly, wherein when the adjustment frame is located at an initial position, the lifting block maintains the heat dissipation assembly in a lifted position, and the heat conductive block is separated from the accommodating cavity.

[0013] According to an embodiment of the present invention, the guide assembly further includes a lifting slope inclined relative to the heat dissipation substrate, and when the heat dissipation assembly is lifted from a pressing position to the lifting position, the lifting block slides along the lifting slope.

[0014] According to an embodiment of the present invention, the guide assembly extends along an insertion direction and is connected to a side surface of the heat dissipation substrate.

[0015] According to one embodiment of the present invention, the adjustment frame includes a main rod and a connecting rod connected to the main rod, the main rod is adjacent to the guide assembly, the pressing block is connected to the inner side of the main rod, and the connecting rod abuts against the upper surface of the heat dissipation substrate.

[0016] According to an embodiment of the present invention, the stop block is connected to the lower surface of the main rod.

[0017] According to an embodiment of the present invention, the communication socket further includes a coupling frame disposed on the housing to restrict the heat dissipation component and the adjustment frame to the housing.

[0018] According to an embodiment of the present invention, the coupling frame further includes a main side plate, the main side plate includes a buckling hole, and the housing includes a buckling structure, and the buckling structure is buckled in the buckling hole.

[0019] According to an embodiment of the present invention, the coupling frame further includes an elastic piece connected to the main side plate and abutting against the upper surface of the heat dissipation substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 FIG. 1 is a schematic diagram of a communication socket according to an embodiment of the present invention.

[0021] Figure 2 FIG. 4 is an exploded view of a communication socket according to an embodiment of the present invention.

[0022] Figure 3 FIG2 is a cross-sectional view of a communication socket according to an embodiment of the present invention. The communication socket can be disposed on a circuit board of an electronic device.

[0023] Figure 4 FIG. 1 is a schematic diagram of a communication socket in an operation process according to an embodiment of the present invention, wherein the heat dissipation component is in a raised position.

[0024] Figure 5 FIG. 1 is a schematic diagram of a communication socket in an operation process according to an embodiment of the present invention, wherein the heat dissipation component is located in a pressing position.

[0025] Main component symbols

[0026] Communication socket 1

[0027] Housing 10

[0028] Accommodating chamber 11

[0029] Socket 12

[0030] Heat dissipation opening 13

[0031] Perforation 14

[0032] Buckle structure 15

[0033] Connector 20

[0034] Heat dissipation component 30

[0035] Heat dissipation substrate 31

[0036] Fin 32

[0037] Thermal block 33

[0038] Guide assembly 34

[0039] Pressing slope 341

[0040] Lifting slope 342

[0041] Adjustment stand 40

[0042] Main rod 41

[0043] Connecting rod 42

[0044] Pressing block 43

[0045] Lifting block 44

[0046] Stop block 45

[0047] Elastic component 50

[0048] Combined frame 60

[0049] Main side panel 61

[0050] Buckle hole 611

[0051] Elastic sheet 62

[0052] Communication module A1

[0053] Circuit board A2

[0054] Insertion direction D1

[0055] Remove direction D2

[0056] Pressing direction D3

[0057] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0058] In order to facilitate those skilled in the art to understand and implement the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the present invention provides many applicable creative concepts, which can be implemented in a variety of specific forms. The specific embodiments discussed in the text are merely specific ways to make and use the present invention and are not intended to limit the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention.

[0059] In addition, repeated numbers or labels may be used in different embodiments. These repetitions are only for the purpose of simply and clearly describing the present invention and do not represent any relationship between the different embodiments and / or structures discussed. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a centrally located component. When a component is considered to be "disposed on" another component, it can be directly disposed on the other component or there may be a centrally located component.

[0060] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art in the art of the present invention. The terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.

[0061] Figure 1 FIG. 1 is a schematic diagram of a communication socket 1 according to an embodiment of the present invention. Figure 2 FIG. 1 is an exploded view of a communication socket 1 according to an embodiment of the present invention. Figure 3 FIG1 is a cross-sectional view of a communication socket 1 according to an embodiment of the present invention. The communication socket 1 can be disposed on a circuit board A2 of an electronic device. Figure 4 The communication module A1 can be inserted into the communication socket 1 and electrically connected to the communication socket 1. In this embodiment, the electronic device can be a server or a router, etc. The communication socket 1 can be an optical communication socket, and the communication module A1 can be an optical communication module. The optical fiber can be inserted into the communication module A1. The communication module A1 receives the optical signal from the optical fiber and converts it into an electronic signal, and the communication module A1 transmits the electronic signal to the circuit board A2 via the communication socket 1. In addition, the electronic device can output the electronic signal to the communication module A1 via the circuit board A2 and the communication socket 1, and the electronic signal can be converted into an optical signal via the communication module A1. The communication module A1 can transmit the optical signal to the optical fiber.

[0062] The communication socket 1 includes a shell 10, a connector 20, a heat dissipation component 30, an adjustment frame 40, multiple elastic components 50, and a coupling frame 60. The shell 10 can be a metal shell. The shell 10 can be a long strip structure and can extend along an insertion direction D1. The shell 10 can include a accommodating cavity 11, a socket 12, a heat dissipation opening 13 and multiple through-holes 14. The accommodating cavity 11 can extend along the insertion direction D1. The socket 12, the heat dissipation opening 13, and the multiple through-holes 14 are connected to the accommodating cavity 11. The socket 12 is formed at the front end of the shell 10. The heat dissipation opening 13 and the multiple through-holes 14 are formed on the upper surface of the shell 10. The lower surface of the shell 10 faces the circuit board A2.

[0063] In this embodiment, the area of ​​the heat dissipation opening 13 is larger than that of the through-hole 14. The area of ​​the heat dissipation opening 13 is greater than half the area of ​​the top surface of the housing 10. The heat dissipation opening 13 and the through-hole 14 can be elongated and extend along the insertion direction D1. The heat dissipation opening 13 is located near the socket 12. The through-hole 14 is located near the rear end of the housing 10 and can be located at the edge of the top surface of the housing 10.

[0064] Connector 20 is disposed within cavity 11 and is located at the rear end of housing 10. In this embodiment, communication module A1 enters cavity 11 via socket 12. Connector 20 can be an electrical connector that receives electronic signals from communication module A1 or outputs electronic signals to communication module A1.

[0065] The heat dissipation assembly 30 is located on the housing 10 and is movable relative to the housing 10. The heat dissipation assembly 30 includes a heat dissipation substrate 31, a plurality of fins 32, a heat conductive block 33, and a plurality of guide assemblies 34. The heat dissipation substrate 31, the plurality of fins 32, the heat conductive block 33, and the plurality of guide assemblies 34 may be an integrally formed structure and may be made of the same heat conductive material, such as metal. The heat dissipation substrate 31 is located on the upper surface of the housing 10. The heat dissipation substrate 31 may be a long strip-shaped plate-like structure and may extend along the insertion direction D1. The heat dissipation substrate 31 may be parallel to the upper surface of the housing 10. In a direction perpendicular to the upper surface of the heat dissipation substrate 31, the heat dissipation substrate 31 may cover the heat dissipation opening 13.

[0066] A plurality of fins 32 are connected to the upper surface of the heat dissipation substrate 31. The plurality of fins 32 may extend perpendicularly to the upper surface of the heat dissipation substrate 31. The fins 32 may be parallel to each other and separated from each other. A heat conductive block 33 is connected to the lower surface of the heat dissipation substrate 31 and corresponds to the heat dissipation opening 13. The lower surface of the heat dissipation substrate 31 faces the housing 10. The heat conductive block 33 may be an elongated structure extending along the insertion direction D1. In a direction perpendicular to the lower surface of the heat dissipation substrate 31, the heat conductive block 33 may cover the heat dissipation opening 13. The lower surface of the heat conductive block 33 faces the heat dissipation opening 13 of the housing 10. The area of ​​the lower surface of the heat conductive block 33 is equal to or approximately equal to the area of ​​the heat dissipation opening 13. In this embodiment, "approximately equal to" means an error range of +10% to -10%. The thickness of the heat conductive block 33 may be between 0.3 times and 3 times the thickness of the heat dissipation substrate 31. The thickness of the heat conducting block 33 and the thickness of the heat dissipation substrate 31 are measured in the same direction perpendicular to the insertion direction D1 .

[0067] A plurality of guide components 34 may be respectively connected to two opposite side surfaces of the heat dissipation substrate 31. In other words, the heat dissipation substrate 31 is located between the plurality of guide components 34. The guide component 34 may be a long strip-shaped plate-like structure, which may extend along the insertion direction D1 and may be perpendicular to the heat dissipation substrate 31. In this embodiment, the guide component 34 includes a pressing slope 341 and a lifting slope 342. The pressing slope 341 and the lifting slope 342 may be inclined relative to the extension of the upper surface and the lower surface of the heat dissipation substrate 31, and may be inclined relative to the insertion direction D1. The pressing slope 341 may be parallel to the lifting slope 342 and separated from the lifting slope 342. In this embodiment, the pressing slope 341 may be located on the upper surface of the guide component 34, and the lifting slope 342 may be located on the lower surface of the guide component 34. The lower surface of the guide component 34 is opposite to the upper surface of the guide component 34 and faces the upper surface of the shell 10. In this embodiment, the shortest distance between the pressing inclined surface 341 and the upper surface of the housing 10 is greater than the shortest distance between the lifting inclined surface 342 and the upper surface of the housing 10 .

[0068] The adjustment frame 40 is disposed on the heat dissipation assembly 30 for moving the heat dissipation assembly 30. The adjustment frame 40 includes a plurality of main rods 41, a plurality of connecting rods 42, a plurality of pressing blocks 43, a plurality of lifting blocks 44, and a plurality of stop blocks 45. The plurality of main rods 41, the plurality of connecting rods 42, the plurality of pressing blocks 43, the plurality of lifting blocks 44, and the plurality of stop blocks 45 can be an integrally formed structure and can be made of the same material, such as metal or plastic. The plurality of main rods 41 are adjacent to the guide assembly 34 and the heat dissipation substrate 31. In other words, the guide assembly 34 and the heat dissipation substrate 31 are located between the plurality of main rods 41. The plurality of main rods 41 can extend along the insertion direction D1 and can be parallel to each other. The plurality of connecting rods 42 are connected to the plurality of main rods 41 and are located between the plurality of main rods 41. The plurality of connecting rods 42 can extend perpendicular to the insertion direction D1 and can be parallel to each other. In this embodiment, the connecting rod 42 abuts against the upper surface of the heat dissipation substrate 31 and may be located between the plurality of fins 32 .

[0069] The plurality of pressing blocks 43 are connected to the inner side surfaces of the plurality of main rods 41 and correspond to the guide assembly 34. In this embodiment, the pressing blocks 43 contact the pressing inclined surface 341. When the adjustment frame 40 moves relative to the heat dissipation assembly 30, the pressing blocks 43 slide along the pressing inclined surface 341.

[0070] The lifting block 44 is connected to the inner side surfaces of the plurality of main rods 41 and corresponds to the guide assembly 34. In this embodiment, the lifting block 44 contacts the lifting slope 342. When the adjustment frame 40 moves relative to the heat dissipation assembly 30, the lifting block 44 slides along the lifting slope 342.

[0071] A plurality of stoppers 45 are connected to the lower surfaces of the plurality of main rods 41 and are located within the accommodating cavity 11. In this embodiment, the plurality of stoppers 45 are connected to the rear ends of the plurality of main rods 41 and are adjacent to the rear end of the housing 10. The stoppers 45 extend through the through-holes 14 of the housing 10 into the accommodating cavity 11 and are adjacent to the connector 20. The length of the through-holes 14 is greater than the length of the stoppers 45, and the lengths of the through-holes 14 and the stoppers 45 are measured in the same direction parallel to the insertion direction D1.

[0072] A plurality of elastic components 50 are located in the accommodating cavity 11, abutting against the adjustment frame 40 and close to the connector 20. In this embodiment, one end of each elastic component 50 abuts against the stop block 45, and the other end of each elastic component 50 abuts against the housing 10. The elastic component 50 can be a spring. The elastic component 50 applies elastic force to the adjustment frame 40 to maintain the adjustment frame 40 in the Figure 3 and Figure 4 The heat dissipation assembly 30 is kept in a raised position by the adjustment frame 40. When the heat dissipation assembly 30 is in the raised position, the heat conducting block 33 is separated from the accommodating cavity 11.

[0073] In one embodiment, when the adjustment bracket 40 is in the initial position, the lifting block 44 maintains the heat dissipation assembly 30 in the raised position, and the lower surface of the heat conductive block 33 is separated from the heat dissipation opening 13. In another embodiment, when the adjustment bracket 40 is in the initial position, the lower surface of the heat conductive block 33 is located within the heat dissipation opening 13.

[0074] The coupling frame 60 is disposed on the housing 10 and is used to restrict the heat dissipation component 30 and the adjustment frame 40 on the housing 10. The coupling frame 60 includes a plurality of main side plates 61 and a plurality of elastic sheets 62. The plurality of main side plates 61 can extend along the insertion direction D1, and the heat dissipation substrate 31, the guide component 34, and / or the adjustment frame 40 can be located between the plurality of main side plates 61. Each main side plate 61 includes a plurality of snap-fit ​​holes 611. The housing 10 includes a plurality of snap-fit ​​structures 15 connected to the side of the housing 10. The snap-fit ​​structure 15 snaps into the snap-fit ​​hole 611 to snap the coupling frame 60 onto the housing 10. The elastic sheet 62 is connected to the main side plates 61 and abuts against the upper surface of the heat dissipation substrate 31. The elastic sheet 62 is used to provide a downward pressure on the heat dissipation component 30.

[0075] Figure 4 FIG2 is a schematic diagram of a communication socket 1 in an operation process according to an embodiment of the present invention, wherein the heat dissipation component 30 is in a raised position, the adjustment bracket 40 is in an initial position, and the communication module A1 is in a starting position. Figure 4In the embodiment, the communication module A1 is inserted into the housing 11 of the housing 10 through the socket 12 along the insertion direction D1 and reaches the starting position adjacent to the stop block 45. In other words, the communication module A1 does not push the stop block 45 during the movement process of entering the socket 12 and moving to the starting position. Therefore, the elastic force generated by the elastic component 50 can maintain the heat dissipation component 30 at Figure 3 and Figure 4 Because the communication module A1 does not contact the heat conductive block 33 during the movement of the communication module A1 into the socket 12 and to the starting position, the heat conductive block 33 is unlikely to scratch the upper surface of the communication module A1 during the movement of the communication module A1, thereby maintaining the heat dissipation effect of the heat dissipation assembly 30 on the communication module A1.

[0076] Figure 5 The schematic diagram of the communication socket 1 in an operation process according to an embodiment of the present invention, wherein the heat dissipation component 30 is located at a pressing position and the communication module A1 is located at an end position. When the communication module A1 continues to be inserted into the connector 20 along the insertion direction D1 until Figure 5 During the process of reaching the final position and electrically connecting with the connector 20, the communication module A1 pushes the stop block 45 to move along the insertion direction D1. At this time, the pressing block 43 and the lifting block 44 move along the insertion direction D1 along with the adjustment frame 40. The pressing block 43 slides along the pressing inclined surface 341 of the guide assembly 34, and the lifting block 44 slides along the lifting inclined surface 342 of the guide assembly 34.

[0077] In this embodiment, the lifting block 44 slides along the lifting slope 342 of the guide assembly 34 toward the upper end of the lifting slope 342, allowing the lifting block 44 to move the heat sink 30 in the downward pressing direction D3. Furthermore, the pressing block 43 slides along the pressing slope 341 of the guide assembly 34 toward the upper end of the pressing slope 341, pushing the heat conductive block 33 of the heat sink 30 in the downward pressing direction D3 and contacting the upper surface of the communication module A1 through the heat dissipation opening 13. In this embodiment, the downward pressing direction D3 is perpendicular to the insertion direction D1.

[0078] In this embodiment, the thermally conductive block 33 does not contact the top surface of the communication module A1 until the communication module A1 is at or near its final position. In other words, when the communication module A1 is electrically connected to the connector 20, the thermally conductive block 33 passes through the heat dissipation opening 13 and abuts the communication module A1. This reduces the chance of the thermally conductive block 33 scratching the top surface of the communication module A1.

[0079] In this embodiment, when the communication module A1 is removed from the communication socket 1, the communication module A1 moves along a removal direction D2 opposite to the insertion direction D1. Figure 5 The end position to Figure 4When the adjusting bracket 40 moves from its starting position, the elastic component 50 pushes the stop block 45 of the adjusting bracket 40 to move along the removal direction D2. The pressing block 43 can slide along the pressing slope 341 of the guide component 34 toward the lower end of the pressing slope 341. The lifting block 44 slides relative to the lifting slope 342 of the guide component 34 toward the lower end of the lifting slope 342, thereby moving the heat dissipation component 30 from Figure 5 The pressing position is raised to Figure 4 In other words, when the heat dissipation assembly 30 is lifted from the pressing position to the lifting position, the lifting block 44 lifts the heat conductive block 33 to reduce the probability of scratching the upper surface of the communication module A1 caused by the heat conductive block 33.

[0080] In this embodiment, during the movement of the communication module A1 from the starting position to the removal direction D2 and away from the socket 12 of the housing 10, the elastic component 50 and the adjustment frame 40 maintain the heat dissipation component 30 at the position of Figure 3 and Figure 4 The heat conducting block 33 of the heat dissipation assembly 30 is separated from the upper surface of the communication module A1, and the heat conducting block 33 is unlikely to cause scratches on the upper surface of the heat dissipation assembly 30 during the movement of the heat dissipation assembly 30, thereby maintaining the heat dissipation effect of the heat dissipation assembly 30 on the optical communication module A1.

[0081] In summary, the communication socket 1 of the present invention utilizes the adjustment bracket 40 and the guide assembly 34 of the heat dissipation assembly 30 to lift the heat dissipation assembly 30 and separate it from the upper surface of the optical communication module A1 during the insertion and removal of the optical communication module A1, thereby reducing the probability of scratches on the lower surface of the heat conductive block 33, thereby maintaining the heat dissipation effect of the heat dissipation assembly 30 on the optical communication module A1.

[0082] For ordinary technicians in this field, they can make other corresponding changes or adjustments based on the creative scheme and creative concept of the present invention in combination with the actual needs generated, and these changes and adjustments should fall within the scope of protection of the claims of the present invention.

Claims

1. A communication socket, characterized in that: include: The housing comprises a receiving cavity and a heat dissipation opening connected to the receiving cavity; Heat dissipation components, including: a heat dissipation substrate, located on the housing; A guide assembly connected to the heat dissipation substrate; and a heat conducting block connected to the lower surface of the heat dissipation substrate and corresponding to the heat dissipation opening; and an adjustment frame disposed on the heat dissipation assembly for moving the heat dissipation assembly and comprising: A pressing block corresponding to the above-mentioned guide assembly; and A stop block is located in the accommodating cavity; When the communication module is located in the accommodating cavity and adjacent to the stop block, the heat conducting block is separated from the communication module. When the communication module pushes the heat conducting block, the pressing block slides along the guide assembly to move the heat conducting block through the heat dissipation opening and abut against the communication module.

2. The communication socket according to claim 1, wherein: The device further comprises a connector disposed in the accommodating cavity, wherein when the communication module is electrically connected to the connector, the heat conducting block passes through the heat dissipation opening and abuts against the communication module.

3. The communication socket according to claim 2, wherein: The shell further includes a through hole connected to the accommodating cavity, wherein the stop block extends through the through hole into the accommodating cavity and is close to the connector. The length of the through hole is greater than the length of the stop block, and the length of the through hole and the length of the stop block are measured in the same direction.

4. The communication socket according to claim 2, wherein: It further includes an elastic component that abuts against the adjustment frame and is close to the connector, wherein when the stop block is not pushed by the communication module, the elastic component maintains the adjustment frame at an initial position to separate the heat conductive block from the accommodating cavity.

5. The communication socket according to claim 2, wherein: The connector is located at the rear end of the shell, and a socket of the shell is located at the front end of the shell, wherein the communication module enters the accommodating cavity through the socket.

6. The communication socket according to claim 1, wherein: The heat dissipation component further includes a plurality of fins connected to the upper surface of the heat dissipation substrate.

7. The communication socket according to claim 1, wherein: The guide assembly further includes a pressing inclined surface extending and tilting relative to the heat dissipation substrate. When the communication module pushes the heat conductive block, the pressing block slides along the pressing inclined surface.

8. The communication socket according to claim 1, wherein: The adjustment frame further includes a lifting block corresponding to the guide assembly, wherein when the adjustment frame is located at an initial position, the lifting block maintains the heat dissipation assembly at a lifted position, and the heat conductive block is separated from the accommodating cavity.

9. The communication socket according to claim 8, wherein: The guide assembly further includes a lifting inclined surface inclined relative to the heat dissipation substrate. When the heat dissipation assembly is lifted from a pressing position to the lifting position, the lifting block slides along the lifting inclined surface.

10. The communication socket according to claim 1, wherein: The adjustment frame includes a main rod and a connecting rod connected to the main rod, the main rod is adjacent to the guide assembly, the pressing block is connected to the inner side of the main rod, and the connecting rod abuts against the upper surface of the heat dissipation substrate.

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