Electronic equipment and control method

Abstract

The invention provides electronic equipment and a control method, and is applied to the technical field of heat dissipation. The electronic equipment comprises at least one heating component which can form a hot area; the heat dissipation device has a first state and a second state, the first state represents that the heat dissipation device exchanges heat between the first operation area and the heat area of the electronic equipment, and the second state represents that the heat dissipation device exchanges heat among the first operation area, the second operation area and the heat area of the electronic equipment; the use frequencies of the first operation area and the second operation area are different; under the condition that the electronic equipment is in different target scenes, the electronic equipment has different first operation areas and second operation areas, and the target scenes represent the heat dissipation requirements of the electronic equipment.

Description

Technical Field

[0001] The present disclosure relates to the field of heat dissipation technology, and in particular to an electronic device and a control method thereof. Background Art

[0002] Currently, traditional heat dissipation devices cannot meet the heat dissipation requirements of electronic devices, resulting in a poor user experience. Summary of the Invention

[0003] In view of this, the present disclosure provides an electronic device and a control method.

[0004] According to a first aspect of the present disclosure, an electronic device is provided, comprising: at least one heat-generating component capable of forming a heat zone; a heat dissipation device having a first state and a second state, the first state representing that the heat dissipation device generates heat exchange between a first operating area and the heat zone of the electronic device, and the second state representing that the heat dissipation device generates heat exchange between the first operating area, the second operating area, and the heat zone of the electronic device, and the first operating area and the second operating area have different frequencies of use; when the electronic device is in different target scenarios, the electronic device has different first operating areas and second operating areas, and the target scenarios represent the heat dissipation requirements of the electronic device.

[0005] According to an embodiment of the present disclosure, the heat dissipation device includes multiple heat dissipation parts, multiple heat dissipation parts correspond one-to-one to multiple thermal areas, and multiple heat dissipation parts correspond to one operating area; or multiple heat dissipation parts correspond one-to-one to multiple thermal areas, and multiple heat dissipation parts correspond one-to-one to multiple operating areas; or multiple heat dissipation parts correspond one-to-one to multiple thermal areas, and the heat dissipation parts correspond to at least two operating areas; or one heat dissipation part corresponds to at least two thermal areas, and the heat dissipation part corresponds to one operating area; wherein, the multiple heat dissipation parts have different first states and / or second states, and the electronic device controls the target heat dissipation part to operate according to the target scene to heat the first operating area corresponding to the target scene, and the target heat dissipation part represents that the distance between the heat dissipation part and the first operating area meets the preset condition.

[0006] According to an embodiment of the present disclosure, the first operating area has a target temperature, and the electronic device can control the target heat dissipation part to operate according to the target temperature so that the first operating area and the hot area reach the target temperature; when the temperature of the first operating area is greater than the preset temperature, the target heat dissipation part is controlled to operate to exchange heat between the hot area, the first operating area and at least one second operating area so that the hot area and the first operating area reach the target temperature, and the preset temperature is greater than the target temperature.

[0007] According to an embodiment of the present disclosure, the heat dissipation part includes: a fluid circulation device, including a cavity, having a fluid inlet and a fluid outlet, and the volume of the cavity can change so that the fluid moves from the fluid inlet toward the fluid outlet; a target body, used to divide the fluid inlet and / or the fluid outlet into a first path and at least one second path, at least one second path is connected to the first path, and when the fluid flows from the fluid outlet to the fluid inlet, the fluid in the second path collides with the fluid in the first path at the connection point to slow down the flow of the fluid from the fluid outlet to the fluid inlet; a flow channel, the two ends of the flow channel are respectively connected to the fluid inlet and the fluid outlet.

[0008] According to an embodiment of the present disclosure, the target body is used to divide the fluid inlet and / or fluid outlet into multiple diversion areas, and the multiple diversion areas are arranged at intervals along a direction perpendicular to the direction of fluid flow. The diversion areas include a first path and at least one second path.

[0009] According to an embodiment of the present disclosure, the multiple flow channels include a first part, a second part and a third part; the first part is arranged corresponding to the hot area, the second part is arranged corresponding to the operating area, and the third part is used to connect the first part and the second part, and the layout density of the flow channels in the first part and the layout density of the flow channels in the second part are both greater than the layout density of the flow channels in the third part.

[0010] According to an embodiment of the present disclosure, the arrangement of the flow channel includes at least one of the following: setting a pipe in the electronic device as a flow channel; opening a channel on the target surface of the electronic device to form a flow channel; deforming the target part in the electronic device to form an internal cavity as the flow channel.

[0011] According to an embodiment of the present disclosure, the second path is arranged in a curved manner and both ends are connected to the first path. The directions of the two ends of the second path are the same as the direction of fluid flow from the fluid inlet to the fluid outlet.

[0012] According to an embodiment of the present disclosure, the device further includes: a fixing frame embedded in the interior of the electronic device, the fixing frame being formed with a notch for placing the flow channel of the heat dissipation part, and the flow channel being fixed in the notch.

[0013] According to an embodiment of the present disclosure, the heat dissipation portion further includes an adhesive layer, and the adhesive layer is used to attach the heat dissipation portion to the surface of the electronic device.

[0014] A second aspect of the present disclosure provides a control method, including: acquiring a target scene of an electronic device, the target scene representing the heat dissipation requirements of the electronic device; determining, based on the target scene, a first operating area and a second operating area of ​​a plurality of operating areas in the electronic device; controlling the switching of a heat dissipation device state to achieve heat exchange between the operating area and the thermal area; wherein the heat dissipation device has a first state and a second state, the first state representing that the heat dissipation device generates heat exchange between the first operating area and the thermal area of ​​the electronic device, and the second state representing that the heat dissipation device generates heat exchange between the first operating area, the second operating area and the thermal area of ​​the electronic device, and the first operating area and the second operating area have different usage frequencies.

[0015] According to an embodiment of the present disclosure, the method also includes: obtaining a first target temperature, the first target temperature representing preset temperatures corresponding to the hot area and the first operating area respectively when the electronic device is in a target scene; and according to the first target temperature, controlling the heat dissipation device to operate so that the first operating area and the hot area reach the first target temperature.

[0016] According to an embodiment of the present disclosure, the method also includes: obtaining environmental information of the electronic device; adjusting the first target temperature according to the environmental information to obtain a second target temperature; and controlling the heat dissipation device to operate according to the second target temperature so that the first operating area and the heat area reach the second target temperature.

[0017] According to an embodiment of the present disclosure, the switching of the heat dissipation device state is controlled to achieve heat exchange between the operating area and the hot area, including: according to the target temperature, controlling the heat dissipation device to operate so that the first operating area and the hot area reach the target temperature; in response to the temperature of the first operating area being greater than the preset temperature, controlling the heat dissipation device to operate to exchange heat between the hot area, the first operating area and at least one second operating area so that the hot area and the first operating area reach the target temperature, and the preset temperature is greater than the target temperature.

[0018] A third aspect of the present disclosure provides a control device, including: an acquisition module, used to acquire a target scene of an electronic device, the target scene representing the heat dissipation requirements of the electronic device; a determination module, used to determine a first operating area and a second operating area of ​​multiple operating areas in the electronic device according to the target scene; a control module, used to control the switching of the heat dissipation device state to achieve heat exchange between the operating area and the thermal area; wherein the heat dissipation device has a first state and a second state, the first state representing that the heat dissipation device generates heat exchange between the first operating area and the thermal area of ​​the electronic device, and the second state representing that the heat dissipation device generates heat exchange between the first operating area, the second operating area and the thermal area of ​​the electronic device, and the first operating area and the second operating area have different usage frequencies.

[0019] A fourth aspect of the present disclosure further provides a computer-readable storage medium having executable instructions stored thereon, which, when executed by a processor, causes the processor to execute the above-mentioned control method.

[0020] The fifth aspect of the present disclosure further provides a computer program product, comprising a computer program, which implements the above-mentioned control method when executed by a processor.

[0021] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and other objects, features and advantages of the present disclosure will become more apparent through the following description of the embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0023] Figure 1 The following schematically shows the heat distribution diagram of the keyboard surface of a notebook computer in the related art;

[0024] Figure 2 The following schematically shows a structural diagram of an electronic device according to an embodiment of the present disclosure;

[0025] Figure 3A Schematically shows one of the layout diagrams between the heat dissipation part and the thermal area according to an embodiment of the present disclosure;

[0026] Figure 3B Schematically shows a second layout diagram between the heat dissipation portion and the thermal area according to an embodiment of the present disclosure;

[0027] Figure 3C The third schematic diagram schematically shows the arrangement between the heat dissipation portion and the thermal area according to an embodiment of the present disclosure;

[0028] Figure 3D Schematically shows a fourth layout diagram between the heat dissipation portion and the thermal area according to an embodiment of the present disclosure;

[0029] Figure 4A One of the schematic diagrams of a fluid circulation device according to an embodiment of the present disclosure is schematically shown;

[0030] Figure 4B The second schematic diagram of the fluid circulation device according to the embodiment of the present disclosure is schematically shown;

[0031] Figure 4C Schematically shows a schematic diagram of a fluid circulation device according to an embodiment of the present disclosure;

[0032] Figure 4DA schematic diagram schematically illustrates the forward flow in the flow guide area according to an embodiment of the present disclosure;

[0033] Figure 4E Schematically shows a schematic diagram of reverse flow in the diversion area according to an embodiment of the present disclosure;

[0034] Figure 5 Schematically shows a layout diagram of a fluid circulation device according to an embodiment of the present disclosure;

[0035] Figure 6 One of the flow charts of the control method according to an embodiment of the present disclosure is schematically shown;

[0036] Figure 7 Schematically shows a second flow chart of a control method according to an embodiment of the present disclosure;

[0037] Figure 8 The structural block diagram of the control device according to an embodiment of the present disclosure is schematically shown.

[0038] [Description of Reference Numerals]

[0039] 100-electronic equipment; 101-heating component; 102-heat dissipation part; 1021-fluid circulation device; 1022-flow channel;

[0040] D1-first part; D2-second part; D3-third part;

[0041] H-hot zone; W-operating zone. DETAILED DESCRIPTION

[0042] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present disclosure. In the detailed description below, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. However, it is apparent that one or more embodiments may also be implemented without these specific details. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present disclosure.

[0043] The terms used herein are only for describing specific embodiments and are not intended to limit the present disclosure. The terms "comprise," "include," etc. used herein indicate the presence of features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0044] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0045] When expressions such as "at least one of A, B, and C, etc." are used, they should generally be interpreted in accordance with the meaning commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include but is not limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.).

[0046] The embodiments of the present disclosure provide an electronic device and a control method. Before introducing the technical solutions provided by the embodiments of the present disclosure, the related technologies involved in the present disclosure are first described.

[0047] As users place increasing demands on the performance of electronic devices, power consumption requirements are also increasing. For consumer electronic devices, local areas of the device become bottlenecks in limiting power consumption growth due to the limited distribution and stacking of system components.

[0048] For example, refer to Figure 1 On laptop systems, the keyboard and fan areas (cold zones) are typically cooler, while the CPU / GPU and heat pipe fin areas are typically hotter. The temperature difference between the two is typically over 15 degrees Celsius. As the area most frequently touched by users, the temperature of the keyboard surface significantly impacts the user experience. Addressing this localized overheating of the keyboard surface is a pressing issue.

[0049] To address the localized high temperature on the keyboard surface, the keyboard surface is usually composed of a metal C-side component, a keyboard, a heat-dissipating film, and a metal bracket. However, metal brackets, graphite, or copper foil are conventional heat dissipation methods for keyboard surfaces.

[0050] On the one hand, the thermal conductivity of the temperature-averaging film has a limit, and its temperature-averaging ability is limited; on the other hand, the thermal conductivity of the temperature-averaging film is fixed, and it is impossible to achieve intelligent control of the temperature of the keyboard operating area.

[0051] An embodiment of the present disclosure provides an electronic device, comprising: at least one heat-generating component capable of forming a heat zone; a heat dissipation device having a first state and a second state, the first state indicating that the heat dissipation device generates heat exchange between a first operating area and the heat zone of the electronic device, and the second state indicating that the heat dissipation device generates heat exchange between the first operating area, the second operating area, and the heat zone of the electronic device, and the first operating area and the second operating area have different frequencies of use; when the electronic device is in different target scenarios, the electronic device has different first operating areas and second operating areas, and the target scenarios indicate the heat dissipation requirements of the electronic device.

[0052] The electronic device may be a device with a heat-generating component. The heat-generating component of the electronic device of the embodiment of the present disclosure can generate heat during operation, and there is a temperature difference between different areas of the electronic device. The electronic device of the embodiment of the present disclosure may be a mobile phone, a smart screen, a tablet computer, a wearable electronic device, an in-vehicle electronic device, an augmented reality (AR) device, a virtual reality (VR) device, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), a projector, an augmented reality (AR)\virtual reality (VR) device, a media player, a television set and other devices. The embodiment of the present disclosure does not impose any special restrictions on the specific form of the device. The operating system of the electronic device may include but is not limited to Flyme operating system, Android operating system, IOS operating system, Symbian operating system, BlackBerry operating system, Windows Phone operating system, etc.

[0053] The embodiments of the present disclosure are described using a laptop computer as an example.

[0054] The following will be passed Figures 2 to 5 The electronic device according to the embodiment of the present disclosure is described in detail.

[0055] Figure 2 The schematic diagram schematically shows the structure of an electronic device according to an embodiment of the present disclosure.

[0056] like Figure 2 As shown, the electronic device 100 of this embodiment includes: at least one heat-generating component 101 and a heat dissipation device.

[0057] The heat generating component 101 can form a hot zone.

[0058] The heat dissipation device has a first state and a second state. The first state indicates that the heat dissipation device generates heat exchange between the first operating area and the hot area of ​​the electronic device 100. The second state indicates that the heat dissipation device generates heat exchange between the first operating area, the second operating area and the hot area of ​​the electronic device 100. The first operating area and the second operating area have different usage frequencies.

[0059] When the electronic device 100 is in different target scenarios, the electronic device 100 has different first operating areas and second operating areas. The target scenarios represent the heat dissipation requirements of the electronic device 100 .

[0060] For example, the heat generating component 101 may be a component inside the electronic device 100 . The heat generating component 101 can generate heat during operation, thereby forming a hot area in the electronic device 100 .

[0061] An electronic device 100 may have a heat-generating component 101. For example, if the electronic device 100 is a fan, the heat-generating component 101 may be the fan's motor. An electronic device 100 may also have multiple heat-generating components 101. For example, if the electronic device 100 is a laptop computer, the heat-generating component 101 may be a CPU, a GPU, or the fins of a heat pipe.

[0062] The hot zone can be the area of ​​the electronic device 100 corresponding to the heat-generating component 101. During operation, the heat-generating component 101 generates heat and radiates heat to its surroundings, thereby increasing the temperature of the area of ​​the electronic device 100 where the heat-generating component 101 is located, forming a hot zone. The area opposite the hot zone is the cold zone, and the temperature of the hot zone is higher than that of the cold zone.

[0063] The operating area of ​​the electronic device 100 is the area that interacts with the user and generates information during use. Examples include the area on a keyboard where the "QWAS" keys are located, the area where the arrow keys are located, and the touchpad. For example, the area in the center of a mobile phone screen. It should be noted that the cold area of ​​the electronic device 100 includes the operating area, meaning that during use, the temperature of the operating area is lower than that of the hot area.

[0064] The target scenario may be an application scenario of the electronic device 100. For example, a laptop computer gaming scenario, a study scenario, an office scenario, etc. Because the area of ​​contact between the user and the electronic device 100 (the operating area) may vary in different target scenarios, the requirements for transferring the temperature of the hot area to the area of ​​contact with the user (the cold area) may also vary.

[0065] The frequency of user interaction between the operating area of ​​the electronic device 100 and the user varies in different application scenarios. An area with a high interaction frequency (i.e., the number of user contacts per unit time exceeds a preset threshold) can be referred to as the first operating area, while an area with a low interaction frequency (i.e., the number of user contacts per unit time is less than a preset threshold) can be referred to as the second operating area. In both cases, the preset threshold value remains the same. For example, in a laptop computer used for gaming, the first operating area might be the area containing the "QWAS" keys or the left palm rest, while the second operating area might be the area containing the touchpad. In a laptop computer used for learning, the first operating area might be the area containing the touchpad, while the second operating area might be the area containing the function keys (F1-F12).

[0066] For example, in a gaming scenario, the first operating area of ​​an electronic device might be the area where the "QWAS" keys are located, and the second operating area might be the area where the arrow keys are located. In a work scenario, the first operating area might be a touchpad, and the second operating area might be the area where the function keys (F1-F12) are located. In a learning scenario, the first operating area might be a touchpad, and the second operating area might be the area where the space bar is located. In a meeting scenario, the first operating area might be the area where the Enter key is located, and the second operating area might be the area where the function keys (F1-F12) are located. Depending on the scenario, at least one of the first and second operating areas can be different.

[0067] The heat dissipation device may be a heat conducting device capable of transferring heat from the hot zone to the operating zone, thereby lowering the temperature of the hot zone and raising the temperature of the operating zone. For example, the heat dissipation device may be a fan, a vapor chamber, or the like.

[0068] The first state may be when the heat dissipation device exchanges heat between the hot zone and the first operating zone (high-frequency operating zone). The second state may be when the heat dissipation device exchanges heat between the first operating zone (high-frequency operating zone), the second operating zone (low-frequency operating zone), and the hot zone. The first state may also be when the heat dissipation device exchanges heat between the hot zone and the second operating zone (low-frequency operating zone). In other words, the target area for heat transfer from the hot zone varies in different states.

[0069] The state switching of the heat sink can be triggered by a physical switch, mode switching, etc. For example, if the heat sink is a fan, switching the physical switch to the first gear triggers the first state, heating the first operating area. Switching the physical switch to the second gear triggers the second state, heating the first operating area and the second operating area. If the heat sink is a heat spreader, switching the mode to the first mode triggers the first state, heating the first operating area. Switching the mode to the second mode triggers the second state, heating the first operating area and the second operating area.

[0070] It can be understood that in different target scenarios, the heat dissipation device can switch the working state according to the high-frequency operating area and the low-frequency operating area of ​​the electronic device 100, so that the heat in the hot area can be conducted between the high-frequency operating area and / or the low-frequency operating area respectively. It can not only meet the heat dissipation needs of the electronic device 100, but also realize intelligent control of the heat dissipation of the electronic device 100 to meet the requirements of the hot area and the operating area for the operating temperature in different usage scenarios, thereby improving the user experience.

[0071] Figure 3A Schematically shows one of the layout diagrams between the heat dissipation part and the thermal area according to an embodiment of the present disclosure; Figure 3B Schematically shows a second layout diagram between the heat dissipation portion and the thermal area according to an embodiment of the present disclosure; Figure 3C The third schematic diagram schematically shows the arrangement between the heat dissipation portion and the thermal area according to an embodiment of the present disclosure; Figure 3D The fourth schematic diagram of the layout between the heat dissipation part and the thermal area according to an embodiment of the present disclosure is schematically shown.

[0072] In one embodiment, for example Figure 2 The heat dissipation device of the electronic device 100 shown may further include: a plurality of heat dissipation parts 102 .

[0073] Regarding the layout between multiple heat dissipation parts 102 and multiple thermal areas.

[0074] In one possible implementation, Figure 3A As shown, the plurality of heat dissipation portions 102 correspond one-to-one to the plurality of thermal zones, and the plurality of heat dissipation portions 102 correspond to one operating zone.

[0075] One heat dissipation portion 102 corresponds to one thermal area, and multiple heat dissipation portions 102 correspond to one operating area.

[0076] In one example, continuing with the laptop keyboard surface, the laptop's thermal zones include a first thermal zone H1, a second thermal zone H2, a third thermal zone H3, and a fourth thermal zone H4. The operating zone includes operating zone W1 and operating zone W2. The heat dissipation portion 102 includes a first heat dissipation portion 102, a second heat dissipation portion 102, a third heat dissipation portion 102, and a fourth heat dissipation portion 102. One side of the first heat dissipation portion 102 corresponds to the first thermal zone H1, while the other side corresponds to the operating zone W1. One side of the second heat dissipation portion 102 corresponds to the second thermal zone H2, while the other side corresponds to the operating zone W1. In other words, the two heat dissipation portions 102 (the first heat dissipation portion 102 and the second heat dissipation portion 102) can simultaneously transfer heat from the two thermal zones (H1 and H2) to the same operating zone W1. One side of the third heat dissipation portion 102 corresponds to the third hot area H3, and the other side of the third heat dissipation portion 102 corresponds to the operating area W2; one side of the fourth heat dissipation portion 102 corresponds to the fourth hot area H4, and the other side of the fourth heat dissipation portion 102 corresponds to the operating area W2; that is, the two heat dissipation portions 102 (the third heat dissipation portion 102 and the fourth heat dissipation portion 102) can simultaneously transfer heat from the two hot areas (H3 and H4) to the same operating area W2.

[0077] It can be understood that multiple heat zones correspond to one operating zone, which can achieve rapid heating of the operating zone.

[0078] In another possible implementation, Figure 3B As shown, the plurality of heat dissipation portions 102 correspond one-to-one to the plurality of thermal zones, and the plurality of heat dissipation portions 102 correspond one-to-one to the plurality of operating zones.

[0079] In one example, one heat dissipation portion 102 corresponds to one thermal area and one operating area.

[0080] Continuing with the laptop keyboard surface as an example, the laptop's thermal zones include a first thermal zone H1 and a second thermal zone H2. The heat dissipation portion 102 includes a first heat dissipation portion 102 and a second heat dissipation portion 102. The operating zones include an operating zone W1 and an operating zone W2. One side of the first heat dissipation portion 102 corresponds to the first thermal zone H1, while the other side of the first heat dissipation portion 102 corresponds to the operating zone W1. One side of the second heat dissipation portion 102 corresponds to the second thermal zone H2, while the other side of the second heat dissipation portion 102 corresponds to the operating zone W2. In other words, the two heat dissipation portions 102 (the first heat dissipation portion 102 and the second heat dissipation portion 102) transfer heat from the two thermal zones (H1 and H2) to different operating zones (W1 and W2), respectively.

[0081] It can be understood that a heat dissipation portion realizes heat exchange between a hot area and an operating area, and can achieve fine control of the heat exchange between the hot area and the operating area.

[0082] In another possible implementation, Figure 3C As shown, the plurality of heat dissipation portions 102 correspond one-to-one to the plurality of thermal zones, and the heat dissipation portions 102 correspond to at least two operating zones.

[0083] In one example, one heat dissipation portion 102 corresponds to one thermal zone, and one heat dissipation portion 102 corresponds to multiple operating zones.

[0084] Continuing with the laptop keyboard surface as an example, the laptop's thermal zones include a first thermal zone H1. The heat dissipation portion 102 includes a first heat dissipation portion 102. The operating zones include an operating zone W1 and an operating zone W2. One side of the first heat dissipation portion 102 corresponds to the first thermal zone H1, the other side of the first heat dissipation portion 102 corresponds to the operating zone W1, and the other side of the first heat dissipation portion 102 corresponds to the operating zone W2. In other words, one heat dissipation portion 102 (first heat dissipation portion 102) transfers heat from one thermal zone (H1) to different operating zones (W1 and W2).

[0085] It can be understood that one heat dissipation portion 102 implements heat exchange between one hot area and multiple operating areas, which can save costs.

[0086] In another possible implementation, Figure 3D As shown, one heat dissipation portion 102 corresponds to at least two thermal zones, and the heat dissipation portion 102 corresponds to one operating zone.

[0087] In one example, one heat dissipation portion 102 corresponds to multiple thermal zones, and one heat dissipation portion 102 corresponds to one operating zone.

[0088] Continuing with the laptop keyboard surface as an example, the laptop's thermal zones include a first thermal zone H1 and a second thermal zone H2. The heat dissipation portion 102 includes a first heat dissipation portion 102. The operating zone includes an operating zone W1. One side of the first heat dissipation portion 102 corresponds to the first thermal zone H1, the other side of the first heat dissipation portion 102 corresponds to the second thermal zone H2, and the other side of the first heat dissipation portion 102 corresponds to the operating zone W1. In other words, a single heat dissipation portion 102 (the first heat dissipation portion 102) transfers heat from two thermal zones (H1 and H2) to the same operating zone (W1).

[0089] It can be understood that a heat dissipation part realizes heat exchange between multiple hot areas and an operating area, which not only improves the heating efficiency of the operating area but also saves costs.

[0090] In some embodiments, multiple heat dissipation parts 102 have different first states and / or second states. The electronic device 100 controls the target heat dissipation part 102 to operate according to the target scene to heat the first operating area corresponding to the target scene. The target heat dissipation part 102 indicates that the distance between the heat dissipation part 102 and the first operating area meets the preset conditions.

[0091] For example, each heat dissipation portion 102 has different states when working in different scenarios. Figure 3A , the first heat dissipation part 102 corresponds to the first operating area W1, then the first heat dissipation part 102 has the first state, and the third heat dissipation part 102 corresponds to the second operating area W2, then the third heat dissipation part 102 also has the first state. At this time, the heat dissipation part 102 does not have the second state, but when the first heat dissipation part 102 and the third heat dissipation part 102 work at the same time, the heat dissipation device has the second state. Figure 3C The first heat dissipation part 102 corresponds to the first operating area W1 and the second operating area W2, and the first heat dissipation part 102 can have a first state and a second state. When only the first operating area W1 or the second operating area W2 needs to be heated, the first heat dissipation part 102 is in the first state; when the first operating area W1 and the second operating area W2 need to be heated at the same time, the first heat dissipation part 102 is in the second state. The first state and the second state can be switched.

[0092] The preset condition can be that the distance between the heat dissipation portion 102 and the first operating area meets a target threshold. The target heat dissipation portion 102 can be the heat dissipation portion 102 whose distance from the first operating area meets the target threshold in the target scenario. For example, in a gaming scenario, if the area where the "QWAS" key is located needs to be heated, the heat dissipation portion 102 (target heat dissipation portion 102) that is less than 10 cm away from the "QWAS" key area will be activated.

[0093] In some embodiments, the first operating area has a target temperature, and the electronic device 100 can control the target heat dissipation portion 102 to operate according to the target temperature so that the first operating area and the thermal area reach the target temperature.

[0094] For example, the target temperature may be a temperature set for the first operating area in a target scenario. For example, in a gaming scenario, the target temperature for the area where the "QWAS" keys of the keyboard are located may be 40 degrees.

[0095] In one example, continuing with the laptop keyboard, in a gaming scenario, the area where the "QWAS" key is located is a high-frequency operating area (the first operating area). Before the heat dissipation device is activated, the initial temperature of the area where the "QWAS" key is located is 10 degrees Celsius. To enhance the user's gaming experience, the target temperature of the area where the "QWAS" key is located can be set to 28 degrees Celsius. The target heat dissipation unit 102, located within a distance of the "QWAS" key area less than the target threshold, is activated to conduct heat from the hot zone to the area where the "QWAS" key is located, raising the temperature of the area where the "QWAS" key is located to 28 degrees Celsius, thereby improving the user experience.

[0096] In other embodiments, when a heat dissipation portion 102 corresponds to at least one thermal zone, and the heat dissipation portion 102 corresponds to at least one first operating zone and at least one second operating zone, the first operating zone has a target temperature, and the electronic device 100 can control the target heat dissipation portion 102 to operate according to the target temperature so that the first operating zone and the thermal zone reach the target temperature; when the temperature of the first operating zone is greater than a preset temperature, the target heat dissipation portion 102 is controlled to operate to exchange heat between the thermal zone, the first operating zone, and the at least one second operating zone so that the thermal zone and the first operating zone reach the target temperature, and the preset temperature is greater than the target temperature.

[0097] For example, the preset temperature may be an upper limit for heating the operating area. The preset temperature is greater than the target temperature. For example, in a gaming scenario, the target temperature for the area where the "QWAS" keys are located on the keyboard may be 20 degrees Celsius. The preset temperature may be 30 degrees Celsius.

[0098] In one example, the keyboard surface of the above-mentioned laptop computer is used as an example for explanation. Figure 3C One side of the first heat sink 102 corresponds to the CPU area, another side corresponds to the keyboard's "QWAS" key area, and yet another side corresponds to the keyboard's numeric area. The first heat sink 102's portions corresponding to the "QWAS" key area and the numeric area operate independently. That is, the first heat sink 102 can independently heat the "QWAS" key area or the numeric area; it can also heat both the "QWAS" key area and the numeric area simultaneously.

[0099] In a gaming scenario, the area of ​​the keyboard where the "QWAS" key resides is a high-frequency operation area (the first operation area), while the numeric area is a low-frequency operation area (the second operation area). Before the heat dissipation device is activated, the initial temperature of the area where the "QWAS" key resides is 10°C. The target heat dissipation section 102 (the first heat dissipation section 102), whose distance from the "QWAS" key area is less than the target threshold, is activated. First, the heat conduction switch between the first heat dissipation section 102 and the area where the "QWAS" key resides is turned on, while the heat conduction switch between the first heat dissipation section 102 and the numeric area is turned off. This concentrates the heat in the heat area and conducts it to the area where the "QWAS" key resides, raising the temperature there to 20°C. As the target heat dissipation portion 102 continues to operate, the area where the "QWAS" key is located is continuously heated. When the temperature in the area where the "QWAS" key is located rises to 30 degrees (equal to a preset threshold), the heat conduction switch between the first heat dissipation portion 102 and the digital area is turned on, allowing the first heat dissipation portion 102 to conduct heat from the hot area to both the area where the "QWAS" key is located and the digital area, reducing the heat supplied to the area where the "QWAS" key is located by the first heat dissipation portion 102, and maintaining the temperature in the area where the "QWAS" key is located at around 20 degrees, which is more comfortable for the user.

[0100] It should be noted that if the heat dissipation portion 102 corresponds to multiple second operating zones, the number of open second operating zones can be increased in stages. For example, if the temperature of the first operating zone does not return to the target temperature within a preset time (e.g., 1 minute) after the first operating zone is opened, the second operating zone will be opened simultaneously. This process continues until the temperature of the first operating zone drops to the target temperature within the preset time.

[0101] It can be understood that by pre-heating the first operating area, the temperature of the first operating area can be quickly made to reach the target temperature; when the temperature of the first operating area exceeds the preset temperature, the first operating area and the second operating area are heated at the same time to disperse the heat so that the temperature of the first operating area will not overheat, thereby ensuring a good user experience.

[0102] In one embodiment, referring to Figure 3A The heat dissipation part 102 in the electronic device 100100 may further include: a fluid circulation device 1021 and a flow channel 1022.

[0103] Exemplarily, the fluid circulation device 1021 has a fluid inlet and a fluid outlet, and the ends of the flow channel 1022 are connected to the fluid inlet and the fluid outlet, respectively. The flow channel 1022 contains fluid, and the fluid circulation device 1021 is used to drive the fluid to flow within the flow channel 1022. The flow channels 1022 correspond to the hot zone and the operating zone, respectively. When the fluid flows within the flow channel 1022, the fluid absorbs heat when passing through the hot zone and releases heat when passing through the operating zone, achieving heat exchange between the hot zone and the operating zone, thereby heating the operating zone.

[0104] For example, the fluid may be water, ethanol, silicone oil, etc.

[0105] The fluid circulation device 1021 may be a piezoelectric micropump, a magnetic piston micropump, etc. The piezoelectric micropump may include a valve micropump and a valveless micropump, etc.

[0106] Because valved micropumps are prone to mechanical fatigue when cycling on and off to a certain degree, are difficult to manufacture, and can easily lead to increased costs, and are prone to insufficient self-priming for special fluids, such as high-viscosity fluids, resulting in significantly reduced heat exchange efficiency, the fluid circulation device 1021 of the present embodiment uses a valveless micropump.

[0107] In one example, referring to Figure 4A The fluid circulation device 1021 includes a cavity, a film is disposed on the cavity, and a driving component is disposed on the cavity, the driving component drives the film to expand and contract to change the volume of the cavity. For example, the driving component can be a piezoelectric piece.

[0108] Gradual expansion sections are provided at the fluid inlet and the fluid outlet of the cavity, and the inner diameter of the gradual expansion section gradually increases in the direction from the fluid inlet to the fluid outlet.

[0109] When the cavity volume increases, the flow rate of the fluid in the flow channel 1022 entering the cavity from the fluid inlet is greater than the flow rate of the fluid flowing into the cavity from the fluid outlet. When the cavity volume decreases, the flow rate of the fluid flowing out of the cavity from the fluid inlet is less than the flow rate of the fluid flowing out of the cavity from the fluid outlet, thereby achieving a circulating flow of the fluid in the flow channel 1022.

[0110] In another example, referring to Figure 4B , the fluid circulation device 1021 includes a cavity and a target body.

[0111] The cavity has a fluid inlet and a fluid outlet. Both ends of the flow channel 1022 are connected to the fluid inlet and the fluid outlet respectively. The volume of the cavity can be changed to allow the fluid to move from the fluid inlet toward the fluid outlet.

[0112] The target body is used to divide the fluid inlet and / or fluid outlet into a first path and at least one second path, and the at least one second path is connected to the first path. When the fluid flows from the fluid outlet to the fluid inlet, the fluid in the second path collides with the fluid in the first path at the connection point to slow down the flow of the fluid from the fluid outlet to the fluid inlet.

[0113] Exemplarily, the target object can be a filler used to divide the fluid inlet and / or fluid outlet into a first path and at least one second path. Specifically, a first transition section is provided at the fluid inlet of the cavity, a second transition section is provided at the fluid outlet, the target object is located within the transition section, a first end of the flow channel 1022 is connected to the side of the first transition section away from the cavity, and a second end of the flow channel 1022 is connected to the side of the second transition section away from the cavity.

[0114] In the case where the target body divides the fluid inlet / outlet into a first path and multiple second paths, the multiple second paths are divided into two groups, the two groups of second paths are respectively located on both sides of the first path, and the multiple second paths in each group of second paths are arranged at intervals along the direction in which the first path is extended, and the second paths in the two groups are staggered along the first path.

[0115] When the cavity volume increases, the fluid within flow channel 1022 flows into the cavity from the fluid inlet and fluid outlet, respectively. The direction of fluid flow from flow channel 1022 through the fluid inlet to the cavity is the same as the direction of fluid flow from the fluid outlet to the fluid inlet. In this case, the fluid at the fluid inlet flows into the first and second paths separately. When the fluid in the second path merges with the fluid in the first path at the junction, it creates less resistance to the flow of fluid in the first path. This allows the fluid to flow smoothly from flow channel 1022 through the fluid inlet to the cavity. However, the direction of fluid flow from flow channel 1022 through the fluid outlet to the cavity is opposite to the direction of fluid flow from the fluid inlet to the fluid outlet. In this case, the fluid at the fluid outlet flows into the first and second paths separately. The fluid in the second path collides with the fluid in the first path at the junction, forming vortices and pressure loss, significantly increasing flow resistance and inhibiting the flow of fluid from flow channel 1022 through the fluid outlet into the cavity. Therefore, the fluid flow rate of fluid in flow channel 1022 entering the cavity from the fluid inlet is greater than the flow rate of fluid entering the cavity from the fluid outlet.

[0116] When the volume of the cavity is reduced, the fluid in the flow channel 1022 flows out from the cavity to the fluid inlet and the fluid outlet, respectively. The direction in which the fluid flows from the cavity through the fluid outlet to the flow channel 1022 is the same as the direction in which the fluid flows from the fluid inlet to the fluid outlet. At this time, the fluid at the fluid outlet flows into the first path and the second path respectively. When the fluid in the second path and the fluid in the first path merge at the connection point, they can produce less resistance to the flow of the fluid in the first path, so that the fluid can flow smoothly from the cavity through the fluid outlet to the flow channel 1022. The direction in which the fluid flows from the cavity through the fluid inlet to the flow channel 1022 is opposite to the direction in which the fluid flows from the fluid inlet to the fluid outlet. At this time, the fluid at the fluid inlet flows into the first path and the second path respectively. The fluid in the second path collides with the fluid in the first path at the connection point, forming vortices and pressure loss, which greatly increases the flow resistance, thereby inhibiting the flow of the fluid from the cavity through the fluid inlet to the flow channel 1022. Therefore, when the volume of the cavity is reduced, the flow rate of the fluid flowing out of the fluid inlet of the cavity is smaller than the flow rate of the fluid flowing out of the fluid outlet of the cavity, thereby achieving a circulating flow of the fluid in the flow channel 1022 .

[0117] It is understood that the structure in which the target body forms a first and second diverging flow path at the inlet and outlet of the cavity not only reduces backflow during fluid circulation, ensuring smoother flow and improving the operating efficiency of the circulation device, but also reduces the generation of abnormal noise, thereby enhancing the practicality of the fluid circulation device. Furthermore, the target body is less susceptible to mechanical fatigue during operation, thereby extending the service life of the fluid circulation device.

[0118] In some embodiments, reference Figure 4C The fluid circulation device 1021 can adopt single drive, double drive, series connection, parallel connection and other forms to effectively improve the circulation efficiency and heat dissipation capacity.

[0119] In some embodiments, the second path is curved and connected to the first path at both ends. The directions of the two ends of the second path are the same as the direction of fluid flow from the fluid inlet to the fluid outlet.

[0120] In one example, referring to Figure 4D When fluid flows from the fluid inlet to the fluid outlet (in the forward direction), the fluid splits at the first end of the connection between the first and second paths. One path continues forward along the first path, while the other path flows forward along the second path. The fluid then merges at the second end of the connection with the first path. Because the direction of fluid outflow from the second end of the second path aligns with the direction of fluid flow in the first path, the fluid flows smoothly from the fluid inlet to the fluid outlet.

[0121] Reference Figure 4EWhen fluid flows from the fluid outlet to the fluid inlet (in the reverse direction), the fluid splits at the second end of the connection between the first and second paths. One path continues forward along the first path, while the other path flows forward along the second path, merging at the first end where it connects to the first path. Because the direction of fluid outflow from the first end of the second path is opposite to the direction of fluid flow in the first path, the fluid in the second path collides with the fluid in the first path at the connection point at the first end, slowing the flow of fluid from the fluid outlet to the fluid inlet.

[0122] In some embodiments, continue to refer to Figure 4B The target body is used to divide the fluid inlet and / or fluid outlet into multiple diversion areas, and the multiple diversion areas are arranged at intervals along a direction perpendicular to the direction of fluid flow. The diversion areas include a first path and at least one second path.

[0123] For example, the flow guiding area may be a flow area composed of a first path and a second path. The target body divides the fluid inlet / fluid outlet into a plurality of flow guiding areas along a direction perpendicular to the direction of fluid flow.

[0124] In one example, continue with Figure 4B The target body is arranged in the transition section, and the space in the transition section is divided into a plurality of flow guiding areas along the inner diameter direction of the transition section. Each flow guiding area includes a first path and a second path.

[0125] It can be understood that the multiple flow guide areas can improve the circulation efficiency of the fluid while ensuring the smooth flow of the fluid, thereby further improving the heat exchange efficiency.

[0126] In some embodiments, the plurality of flow channels 1022 include a first portion D1, a second portion D2, and a third portion D3; the first portion D1 is arranged corresponding to the hot area, the second portion D2 is arranged corresponding to the operating area, and the third portion D3 is used to connect the first portion D1 and the second portion D2, and the layout density of the flow channels 1022 in the first portion D1 and the layout density of the flow channels 1022 in the second portion D2 are both greater than the layout density of the flow channels 1022 in the third portion D3.

[0127] For example, the flow channel 1022 may be arranged in an S-shape, a meander shape, a spiral shape, etc. This embodiment of the present disclosure does not limit this.

[0128] In one example, referring to Figure 3A. The flow channel 1022 of the fourth heat dissipation part 102 is divided into a first part D1, a second part D2 and a third part D3. The first part D1 flow channel 1022 corresponds to the fourth heat zone H4, and is arranged in an S shape at the fourth heat zone H4. The second part D2 flow channel 1022 corresponds to the operating area W2, and is arranged in an S shape at the operating area W2. The third part D3 flow channel 1022 connects the first part D1 flow channel 1022 and the second part D2 flow channel 1022. The fluid circulation device 1021 drives the fluid to flow in the flow channel 1022. The fluid flows through the flow channel 1022 of the first part D1, and can absorb the heat of the fourth heat zone H4, thereby increasing the temperature of the fluid and reducing the temperature of the fourth heat zone H4. The fluid flows to the second part D2 flow channel 1022 through the third part D3, and can release heat, thereby increasing the temperature of the operating area W2 and reducing the temperature of the fluid. The fluid flows through the third portion D3 to the flow channel 1022 of the first portion D1 again, and circulates in sequence to achieve heat exchange between the hot area and the operating area.

[0129] It is understandable that different regional flow channels are arranged at different densities, which can not only ensure heat exchange efficiency but also save costs.

[0130] The flow channel 1022 may be arranged in various forms.

[0131] In one implementation, a pipe is provided in the electronic device 100 as the flow channel 1022 .

[0132] In one example, to facilitate installation of the flow channel 1022 , the electronic device 100 further includes a fixing frame embedded inside the electronic device 100 . The fixing frame is formed with a slot for placing the flow channel 1022 of the heat dissipation device portion, and the flow channel 1022 is fixed in the slot.

[0133] Take the keyboard of a laptop as an example, refer to Figure 3A , a pipe can be embedded in the keyboard surface body to form a flow channel 1022 to exchange heat between the hot area and the operating area of ​​the keyboard surface.

[0134] Reference Figure 5 , a pipe can be buried on the surface of the keyboard surface to form a flow channel 1022 to exchange heat between the hot area and the operating area of ​​the keyboard surface. That is, the flow channel 1022 is buried in the gaps between the keyboard keys.

[0135] In another possible implementation, a channel is opened on the target surface of the electronic device 100 to form the flow channel 1022 .

[0136] In one example, a cavity is formed by machining or etching a metal surface of the keyboard surface to serve as the flow channel 1022 .

[0137] In yet another possible implementation, the target component within the electronic device 100 is deformed to form an internal cavity as the flow channel 1022 .

[0138] In one example, high-pressure fluid (gas or liquid) is injected into a metal tube or a double-layer metal plate to cause the metal to undergo plastic deformation in a mold, thereby forming the flow channel 1022 .

[0139] In some embodiments, the heat dissipation portion 102 further includes an adhesive layer, and the adhesive layer is used to attach the heat dissipation portion 102 to the surface of the electronic device 100 .

[0140] In one example, the heat dissipation portion 102 and the electronic device 100 can be independent of each other. An adhesive layer is applied to the surface of the heat dissipation portion 102. When the heat dissipation device is in use, the heat dissipation portion 102 is attached to the surface of the heat dissipation device, with a portion of the flow channel 1022 of the heat dissipation portion 1022 corresponding to the hot zone and a portion of the flow channel 1022 corresponding to the operating zone.

[0141] It can be understood that the heat dissipation part is used in an adhesive manner for ease of use.

[0142] The following will be through 6~ Figure 7 The control method of the embodiment of the present disclosure is described in detail.

[0143] Figure 6 One of the flow charts of the control method according to the embodiment of the present disclosure is schematically shown.

[0144] like Figure 6 As shown, the control method of this embodiment includes operations S210 to S230.

[0145] In operation S210 , a target scene of the electronic device is acquired, where the target scene represents a heat dissipation requirement of the electronic device.

[0146] In operation S220 , a first operation area and a second operation area of ​​a plurality of operation areas in the electronic device are determined according to the target scenario.

[0147] In operation S230 , switching of the heat dissipation device state is controlled to achieve heat exchange between the operating area and the thermal area.

[0148] The heat dissipation device has a first state and a second state. The first state indicates that the heat dissipation device generates heat exchange between the first operating area and the hot area of ​​the electronic device. The second state indicates that the heat dissipation device generates heat exchange between the first operating area, the second operating area and the hot area of ​​the electronic device. The first operating area and the second operating area have different usage frequencies.

[0149] For example, the description of the target scene, the hot area, the heat dissipation device, the operating area, the first state and the second state can refer to the above description of Figure 2 The description is not repeated here.

[0150] In one example, a target scene for an electronic device is obtained, and based on the target scene, a high-frequency operating area and a low-frequency operating area of ​​the electronic device in the target scene are determined. A heat dissipation device can be controlled to exchange heat between the high-frequency operating area and the hot area (a first state) to reduce the temperature of the hot area and increase the temperature of the high-frequency operating area. The heat dissipation device can also be controlled to exchange heat between the low-frequency operating area and the hot area (a first state) to reduce the temperature of the hot area and increase the temperature of the low-frequency operating area. The heat dissipation device can also be controlled to exchange heat between the high-frequency operating area, the low-frequency operating area, and the hot area (a second state) to reduce the temperature of the hot area and increase the temperatures of both the high-frequency operating area and the low-frequency operating area.

[0151] As described above, the control method of this embodiment further includes operations S310 to S320.

[0152] In operation S310 , a first target temperature is acquired, where the first target temperature represents preset temperatures corresponding to a hot area and a first operating area respectively when the electronic device is in a target scene.

[0153] In operation S320 , the heat dissipation device is controlled to operate so that the first operating area and the thermal area reach the first target temperature according to the first target temperature.

[0154] Illustratively, the first operating region may be a high-frequency operating region or a low-frequency operating region.

[0155] The first target temperature may include the temperature set for the first operating area in different application scenarios and the temperature set for the hot area in different application scenarios, that is, the temperature to be reached by heating the first operating area and the temperature to be reached by dissipating heat from the hot area.

[0156] In one example, based on the operating state of the electronic device (the running application is a game application), the current target scene of the electronic device is determined to be a gaming scene. The target temperature (20 degrees Celsius) desired for the hot zone (the area corresponding to the CPU) and the target temperature (28 degrees Celsius) desired for the high-frequency operation area (the area where the "QWAS" key is located) in the gaming scene are obtained. The heat dissipation device is then controlled to transfer heat from the hot zone to the high-frequency operation area, maintaining the temperature of the hot zone at approximately 20 degrees Celsius and the temperature of the high-frequency operation area at approximately 28 degrees Celsius.

[0157] As described above, the control method of this embodiment further includes operations S410 to S430.

[0158] In operation S410 , environmental information of the electronic device is acquired.

[0159] In operation S420, the first target temperature is adjusted according to the environmental information to obtain a second target temperature.

[0160] In operation S430 , the heat dissipation device is controlled to operate so that the first operating area and the thermal area reach the second target temperature according to the second target temperature.

[0161] Exemplarily, the environmental information may be the environment that the electronic device is currently in. For example, the environmental information may be summer (high temperature environment), winter (low temperature environment), etc.

[0162] The second target temperature can be the desired temperature for the thermal zone and operating zone of the electronic device when the electronic device is in different environments and different application scenarios. As the environment in which the electronic device is located changes, the desired temperatures for the thermal zone and operating zone may change. For example, if the computer is in winter, the desired temperature for the thermal zone is 20 degrees Celsius, and the desired temperature for the operating zone is 28 degrees Celsius. If the computer is in summer, the desired temperature for the thermal zone is 20 degrees Celsius, and the desired temperature for the operating zone is 25 degrees Celsius.

[0163] In one example, based on the operating state of the electronic device (the running application is a game application), the current target scene of the electronic device is determined to be a game scene. The target temperature (20 degrees) that the hot area (the area corresponding to the CPU) and the target temperature (28 degrees) that the high-frequency operation area (the area where the "QWAS" key is located) want to reach in the game scene are obtained. At this time, the environmental information obtained for the electronic device is summer. When the computer is in summer, the temperature that the hot area wants to reach is 20 degrees, and the temperature that the operation area wants to reach is 25 degrees. Therefore, the temperature that the operation area wants to reach is adjusted to 25 degrees. The heat dissipation device is controlled to work and transfer the heat from the hot area to the high-frequency operation area, so that the temperature of the hot area is maintained at about 20 degrees, and the temperature of the high-frequency operation area is maintained at about 25 degrees.

[0164] As described above, in operation S230, the switching of the heat dissipation device state is controlled to achieve heat exchange between the operating area and the hot area. In one implementation, as shown in FIG. Figure 7 As shown, the operation may further include operations S231 to S232.

[0165] In operation S231 , according to the target temperature, the heat dissipation device is controlled to operate so that the first operating area and the thermal area reach the target temperature.

[0166] In operation S232 , it is determined whether the temperature of the first operating area is greater than a preset temperature, and the preset temperature is greater than a target temperature.

[0167] In operation S232, if the temperature of the first operating region is greater than a preset temperature, the heat dissipation device is controlled to perform heat exchange between the hot region, the first operating region, and at least one second operating region, so that the hot region and the first operating region reach a target temperature. If the temperature of the first operating region is less than or equal to the preset temperature, operation S231 is performed.

[0168] Exemplarily, the priority of heat exchange between the high-frequency operating area and the thermal area is higher than the priority of heat exchange between the low-frequency operating area and the thermal area.

[0169] In one example, when controlling the operation of the heat dissipation device according to the target temperatures (20 degrees and 28 degrees) of the thermal area (the area corresponding to the CPU) and the operating area (the area where the "QWAS" key is located), priority is given to controlling the heat from the area corresponding to the CPU to be transferred to the area where the "QWAS" key is located. When the temperature of the area where the "QWAS" key is located exceeds 28 degrees, for example, reaching 29 degrees, the heat dissipation device can be controlled to simultaneously exchange heat between the area where the "QWAS" key is located and the digital area, so that the heat from the area corresponding to the CPU is simultaneously transferred to the area where the "QWAS" key is located and the digital area, thereby reducing the heat supply from the area corresponding to the CPU to the area where the "QWAS" key is located, and maintaining the temperature of the area where the "QWAS" key is located at around 28 degrees, which is more comfortable for the user.

[0170] It should be noted that if the heat dissipation section corresponds to multiple second operating zones, the number of open second operating zones can be increased in stages. For example, if the temperature of the first operating zone does not return to the target temperature within a preset time (e.g., 1 minute), the second operating zone will be opened simultaneously. This process continues until the temperature of the first operating zone drops to the target temperature within the preset time.

[0171] Based on the above control method, the present disclosure also provides a control device. Figure 8 The device is described in detail.

[0172] Figure 8 The structural block diagram of the control device according to an embodiment of the present disclosure is schematically shown.

[0173] like Figure 8 As shown, the control device 500 of this embodiment includes: an acquisition module 510 , a determination module 520 and a control module 530 .

[0174] The acquisition module 510 is used to acquire a target scene of the electronic device, where the target scene represents the heat dissipation requirement of the electronic device. In one embodiment, the acquisition module 510 can be used to perform the operation S210 described above, which will not be repeated here.

[0175] The determination module 520 is used to determine a first operation area and a second operation area of ​​a plurality of operation areas in the electronic device according to the target scene. In one embodiment, the determination module 520 can be used to perform the operation S220 described above, which will not be repeated here.

[0176] The control module 530 is used to control the switching of the heat dissipation device state to achieve heat exchange between the operating area and the hot area. In one embodiment, the control module 530 can be used to perform the operation S230 described above, which will not be repeated here.

[0177] According to embodiments of the present disclosure, any multiple modules among the acquisition module 510, determination module 520, and control module 530 may be combined into a single module, or any one of these modules may be split into multiple modules. Alternatively, at least part of the functionality of one or more of these modules may be combined with at least part of the functionality of other modules and implemented in a single module. According to embodiments of the present disclosure, at least one of the acquisition module 510, determination module 520, and control module 530 may be at least partially implemented as a hardware circuit, such as a field programmable gate array (FPGA), a programmable logic array (PLA), a system on a chip, a system on a substrate, a system on a package, an application-specific integrated circuit (ASIC), or may be implemented in hardware or firmware through any other reasonable means of circuit integration or packaging, or may be implemented in any one of the three implementation methods of software, hardware, and firmware, or any appropriate combination of any of these. Alternatively, at least one of the acquisition module 510, determination module 520, and control module 530 may be at least partially implemented as a computer program module that, when executed, performs the corresponding functionality.

[0178] The present disclosure also provides a computer-readable storage medium, which may be included in the device / apparatus / system described in the above embodiments, or may exist independently and not be incorporated into the device / apparatus / system. The computer-readable storage medium carries one or more programs, and when executed, implements the method according to the embodiments of the present disclosure.

[0179] According to embodiments of the present disclosure, a computer-readable storage medium may be a non-volatile computer-readable storage medium, such as, but not limited to, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In the present disclosure, a computer-readable storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0180] The embodiments of the present disclosure also include a computer program product, which includes a computer program containing program code for executing the method shown in the flowchart. When the computer program product is run in a computer system, the program code is used to enable the computer system to implement the control method provided by the embodiments of the present disclosure.

[0181] When the computer program is executed by the processor, the above functions defined in the system / device of the embodiment of the present disclosure are performed. According to the embodiment of the present disclosure, the system, device, module, unit, etc. described above can be implemented by a computer program module.

[0182] In one embodiment, the computer program may be stored on a tangible storage medium, such as an optical storage device or a magnetic storage device. In another embodiment, the computer program may be transmitted and distributed in the form of a signal over a network medium, downloaded and installed via a communication component, and / or installed from a removable medium. The program code contained in the computer program may be transmitted using any suitable network medium, including but not limited to wireless, wired, or any suitable combination thereof.

[0183] In such an embodiment, the computer program can be downloaded and installed from a network via the communication portion, and / or installed from a removable medium. When the computer program is executed by the processor, the above-described functions defined in the system of the embodiment of the present disclosure are performed. According to the embodiment of the present disclosure, the systems, devices, means, modules, units, etc. described above can be implemented by computer program modules.

[0184] According to an embodiment of the present disclosure, the program code for executing the computer program provided by the embodiment of the present disclosure can be written in any combination of one or more programming languages. Specifically, these computer programs can be implemented using high-level procedural and / or object-oriented programming languages, and / or assembly / machine languages. Programming languages ​​include, but are not limited to, languages ​​such as Java, C++, Python, "C" or similar programming languages. The program code can be executed entirely on the user computing device, partially on the user device, partially on a remote computing device, or entirely on a remote computing device or server. In cases involving a remote computing device, the remote computing device can be connected to the user computing device through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computing device (for example, using an Internet service provider to connect via the Internet).

[0185] The flowcharts and block diagrams in the accompanying drawings illustrate the possible implementation architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present disclosure. In this regard, each box in the flowchart or block diagram can represent a module, program segment, or a part of code, and the above-mentioned module, program segment, or a part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flowchart, and the combination of boxes in the block diagram or flowchart, can be implemented with a dedicated hardware-based system that performs the specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0186] Those skilled in the art will appreciate that the features described in the various embodiments and / or claims of this disclosure may be combined and / or coupled in various ways, even if such combinations and / or couplings are not explicitly described in this disclosure. In particular, the features described in the various embodiments and / or claims of this disclosure may be combined and / or coupled in various ways without departing from the spirit and teachings of this disclosure. All such combinations and / or couplings are intended to fall within the scope of this disclosure.

[0187] The embodiments of the present disclosure are described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Although each embodiment has been described separately above, this does not mean that the measures in each embodiment cannot be used in combination to advantage. The scope of the present disclosure is defined by the appended claims and their equivalents. Without departing from the scope of the present disclosure, those skilled in the art may make various substitutions and modifications, which should all fall within the scope of the present disclosure.

Claims

1. An electronic device comprising: at least one heat-generating component, the heat-generating component being capable of forming a hot zone; The heat dissipation device has a first state and a second state, wherein the first state indicates that the heat dissipation device generates heat exchange between a first operating area of ​​the electronic device and the hot area, and the second state indicates that the heat dissipation device generates heat exchange between the first operating area, the second operating area, and the hot area of ​​the electronic device, and the first operating area and the second operating area have different usage frequencies; When the electronic device is in different target scenarios, the electronic device has different first operating areas and second operating areas, and the target scenarios represent heat dissipation requirements of the electronic device.

2. The electronic device according to claim 1, wherein the heat dissipation device comprises a plurality of heat dissipation parts. The plurality of heat dissipation portions correspond to the plurality of thermal zones one-to-one, and the plurality of heat dissipation portions correspond to one operating zone; or The plurality of heat dissipation portions correspond one-to-one to the plurality of thermal zones, and the plurality of heat dissipation portions correspond one-to-one to the plurality of operating zones; or The plurality of heat dissipation portions correspond one-to-one to the plurality of thermal zones, and the heat dissipation portions correspond to at least two operating zones; or One of the heat dissipation portions corresponds to at least two of the thermal regions, and the heat dissipation portion corresponds to one operating region; in, The multiple heat dissipation parts have different first states and / or second states. The electronic device controls the target heat dissipation part to operate according to the target scene to heat the first operating area corresponding to the target scene. The target heat dissipation part indicates that the distance between the heat dissipation part and the first operating area meets a preset condition.

3. The electronic device according to claim 2, wherein the first operating region has a target temperature. The electronic device is capable of controlling the target heat dissipation part to operate according to the target temperature so that the first operating area and the thermal area reach the target temperature; When the temperature of the first operating area is greater than a preset temperature, the target heat dissipation part is controlled to operate to exchange heat between the hot area, the first operating area and at least one second operating area so that the hot area and the first operating area reach the target temperature, and the preset temperature is greater than the target temperature.

4. The electronic device according to claim 2, wherein the heat dissipation portion comprises: A fluid circulation device comprising a cavity having a fluid inlet and a fluid outlet, wherein the volume of the cavity can be changed to allow the fluid to move from the fluid inlet toward the fluid outlet; a target body, configured to divide the fluid inlet and / or the fluid outlet into a first path and at least one second path, wherein the at least one second path is connected to the first path, and when the fluid flows from the fluid outlet to the fluid inlet, the fluid in the second path collides with the fluid in the first path at the connection point, thereby slowing down the flow of the fluid from the fluid outlet to the fluid inlet; The two ends of the flow channel are respectively connected to the fluid inlet and the fluid outlet.

5. The electronic device according to claim 4, wherein the target body is used to divide the fluid inlet and / or the fluid outlet into multiple diversion areas, the multiple diversion areas are arranged at intervals along a direction perpendicular to the direction of fluid flow, and the diversion areas include the first path and the at least one second path.

6. The electronic device according to claim 4, wherein the plurality of flow channels include a first portion, a second portion, and a third portion; the first portion is disposed corresponding to the hot area, the second portion is disposed corresponding to the operating area, and the third portion is configured to connect the first portion and the second portion. The layout density of the flow channels in the first portion and the layout density of the flow channels in the second portion are both greater than the layout density of the flow channels in the third portion.

7. The electronic device according to claim 4, wherein the arrangement of the flow channel comprises at least one of the following: providing a pipe as a flow channel in the electronic device; Opening a channel on a target surface of the electronic device to form a flow channel; The target part within the electronic device is deformed to form an internal cavity as a flow channel.

8. A control method comprising: Acquire a target scenario of the electronic device, where the target scenario represents a heat dissipation requirement of the electronic device; Determining, according to the target scenario, a first operating area and a second operating area of ​​a plurality of operating areas in the electronic device; Control the switching of the heat dissipation device state to achieve heat exchange between the operating area and the hot area; The heat dissipation device has a first state and a second state. The first state indicates that the heat dissipation device generates heat exchange between the first operating area and the hot area of ​​the electronic device. The second state indicates that the heat dissipation device generates heat exchange between the first operating area, the second operating area and the hot area of ​​the electronic device. The first operating area and the second operating area have different usage frequencies.

9. The control method according to claim 8, further comprising: Acquire a first target temperature, where the first target temperature represents preset temperatures corresponding to the thermal area and the first operating area respectively when the electronic device is in the target scene; According to the first target temperature, the heat dissipation device is controlled to operate so that the first operating area and the hot area reach the first target temperature.

10. The control method according to claim 9, further comprising: Acquiring environmental information of the electronic device; adjusting the first target temperature according to the environmental information to obtain the second target temperature; According to the second target temperature, the heat dissipation device is controlled to operate so that the first operating area and the hot area reach the second target temperature.

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