Laser supplementary lighting processing device and method

Abstract

The invention belongs to the field of laser industrial processing, and discloses a laser supplementary lighting processing device and method, which comprises a shell, a laser main light source, a laser auxiliary light source, a scanning galvanometer, a CCD (Charge Coupled Device) camera, a reflecting mirror, a spectroscope and a control device, the laser main light source is arranged in the shell and is used for emitting working laser; the CCD camera is arranged on one side of the shell and used for detecting machining defects generated after the working laser acts. The laser auxiliary light source is arranged on the other side of the shell and used for emitting supplementary laser. The scanning galvanometer is arranged on a light path of the laser auxiliary light source to reflect and adjust the auxiliary laser to act on the working surface; the CCD camera detects the machining condition of the working face in real time and feeds back images to the control device, the control device compares the images to recognize defect data for positioning calibration, then the laser auxiliary light source is controlled to emit supplementary light, and the scanning galvanometer is controlled to act on the defect face; according to the scheme, a closed-loop process is formed by processing, detecting and light supplementing, and the reliability of laser equipment is improved.

Description

Technical Field

[0001] The present invention belongs to the field of laser industrial processing, and in particular relates to a laser light-filling processing device and method. Background Art

[0002] Laser industrial processing utilizes high-energy lasers to trigger energy conversion through the interaction of light energy with matter. When a high-energy laser beam illuminates an object's surface, its unique monochromaticity (single wavelength) and high coherence result in a highly concentrated photon energy, far exceeding that of ordinary light sources. Electrons on the surface absorb the photon energy and transition to a high-energy state. These electrons then transfer energy to atoms in the lattice through collisions, causing them to vibrate violently (generating heat). This process is used to achieve material processing. Therefore, as a core component of the equipment, the advanced design of the laser directly impacts its performance in industrial processing.

[0003] During long-term use, some light source components of the laser will gradually be damaged, resulting in uneven output light spot energy and defects in the processed surface; or because the roughness of the processed surface is inconsistent, the processing heat required is different. When the uniform laser passes through the processed surface, the local processed surface cannot be completely processed due to unevenness, resulting in incomplete and defective processed surface, which leads to a decrease in the processing efficiency and quality of the laser device. Summary of the Invention

[0004] The purpose of the present invention is to provide a laser light-filling processing device and method to solve the problems existing in the above-mentioned prior art.

[0005] On the one hand, in order to achieve the above-mentioned purpose, the present invention provides a laser light-filling processing device, comprising a shell, a working surface, a main laser light source, an auxiliary laser light source, a first scanning galvanometer, a second scanning galvanometer, a camera, a reflector, a spectrometer and a control device; the main laser light source, the second scanning galvanometer and the reflector are all arranged inside the shell, the auxiliary laser light source, the first scanning galvanometer, the camera and the reflector are installed on the outer wall of the shell, a first light hole is opened on the top of the shell, the light path emitted by the main laser light source passes through the first light hole to reach the working surface, and the spectrometer is arranged on the reflected light of the working surface On the path, a second light hole is provided on the outer wall of the shell, and the reflected light of the spectrometer passes through the second light hole to reach the reflector, and the camera is arranged on the reflected light path of the reflector; a third light hole is also provided on the outer wall of the shell, and the laser auxiliary light source emits laser to the first scanning galvanometer, and the laser passes through the third light hole to the second scanning galvanometer after being reflected by the first scanning galvanometer, and the laser reflected by the second scanning galvanometer passes through the first light hole to reach the working surface; the laser main light source, the laser auxiliary light source, the first scanning galvanometer, the second scanning galvanometer and the camera are all electrically connected to the control device.

[0006] Optionally, a window piece is provided in the first light-transmitting hole.

[0007] Optionally, the swing angles of the first scanning galvanometer and the second scanning galvanometer are controlled by the control device.

[0008] A laser light-filling processing method, applied to the aforementioned laser light-filling processing device, comprises:

[0009] S1: The control device controls the main laser light source to emit a processing light spot to the working surface. The reflected light from the working surface is reflected to the reflector by the beam splitter. The CCD camera receives the reflected light from the reflector and images the processing status of the working surface. The imaging data is transmitted to the control device. The control device compares and trains the imaging data to confirm the defect location coordinates.

[0010] S2: The control device adjusts the swing angles of the first scanning galvanometer and the second scanning galvanometer based on the coordinates of the defect position, and controls each scanning galvanometer to reflect the laser emitted by the auxiliary light source to the defect position;

[0011] Repeat step S2 until the machined surface is free of defects.

[0012] Optionally, a laser light-filling processing method, applied to the aforementioned laser light-filling processing device, includes:

[0013] The main laser light source and the auxiliary laser light source are turned on, the forming surface of the working surface is processed by the laser emitted by the main laser light source, and the local area of ​​the working surface is processed by the laser emitted by the auxiliary light source.

[0014] The technical effects of the present invention are:

[0015] The laser fill light processing device provided by the present invention can improve the efficiency and quality of laser industrial processing by setting a working light source, an auxiliary light source and other components to cooperate separately. At the same time, the use of local fill light technology can improve the yield of finished products while reducing thermal stress to greatly improve product reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] The accompanying drawings, which constitute part of this application, are intended to provide a further understanding of this application. The exemplary embodiments and descriptions of this application are intended to explain this application and do not constitute an improper limitation on this application. In the accompanying drawings:

[0018] Figure 1 Schematic diagram of the overall structure of the processing device in an embodiment of the present invention;

[0019] Figure 2 Schematic diagram of the implementation process in an embodiment of the present invention;

[0020] Explanation of reference numerals: 1. Shell; 2. Main laser light source; 3. Auxiliary laser light source; 4. First scanning galvanometer; 5. Second scanning galvanometer; 6. CCD camera; 7. Reflector; 8. Spectrometer; 9. Control device; 10. Working surface. DETAILED DESCRIPTION

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0022] To facilitate understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings, and several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0023] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0024] The words “include,” “including,” “have,” “contain,” etc. used in this article are open-ended terms, meaning including but not limited to.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which the present invention pertains. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0026] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0027] like Figure 1-Figure 2 As shown, a laser light-filling processing device is provided in this embodiment, including a shell 1, a working surface 10, a main laser light source 2, an auxiliary laser light source 3, a first scanning galvanometer 4, a second scanning galvanometer 5, a camera, a reflector 7, a spectrometer 8 and a control device 9; the main laser light source 2, the second scanning galvanometer 5 and the reflector 7 are all arranged inside the shell 1, the auxiliary laser light source 3, the first scanning galvanometer 4, the camera and the reflector 7 are installed on the outer wall of the shell 1, a first light hole is opened on the top of the shell 1, the light path emitted by the main laser light source 2 passes through the first light hole to reach the working surface 10, and the spectrometer 8 is arranged on the reflector of the working surface 10. In the optical path, a second light hole is provided on the outer wall of the shell 1, and the reflected light of the spectrometer 8 passes through the second light hole to reach the reflector 7, and the camera is arranged on the reflected light path of the reflector 7; a third light hole is also provided on the outer wall of the shell 1, and the laser auxiliary light source 3 emits laser to the first scanning galvanometer 4, and the laser passes through the third light hole to the second scanning galvanometer 5 after being reflected by the first scanning galvanometer 4, and the laser reflected by the second scanning galvanometer 5 passes through the first light hole to reach the working surface 10; the laser main light source 2, the laser auxiliary light source 3, the first scanning galvanometer 4, the second scanning galvanometer 5 and the camera are all electrically connected to the control device 9.

[0028] like Figure 1 As shown, this embodiment provides a high-power laser fill light processing device, the structure of which includes: a shell 1, a main laser light source 2, an auxiliary laser light source 3, a scanning galvanometer, a CCD camera 6, a reflector 7, a spectrometer 8, and a control device 9; the main laser light source 2 is arranged in the shell 1 for emitting a working laser; the CCD camera 6 is arranged on one side of the shell 1 for detecting processing defects after the working laser acts; the auxiliary laser light source 3 is arranged on the other side of the shell 1 for emitting a supplementary laser; the scanning galvanometer is arranged on the optical path of the auxiliary laser light source 3 to reflect and adjust the auxiliary laser to act on the working surface 10; the CCD camera 6 detects the processing status of the working surface 10 in real time and feeds back the image to the control device 9, the control device 9 compares the image to identify the defect data for positioning and calibration, and then controls the auxiliary laser light source 3 to emit supplementary light, and acts on the defect surface by controlling the scanning galvanometer; the laser processing device formed in the above manner can make the processing detection and fill light form a closed-loop process, thereby greatly improving the reliability of the laser equipment.

[0029] The working surface 10 and the primary laser light source 2 are mechanically fixed to relatively central portions of the housing 1. The primary laser light source 2 emits a beam through the housing 1 that impacts the workpiece at the working surface 10. A beam splitter 8 is positioned in the direction of the primary light source. This wavelength-based beam splitter transmits the beam from the primary light source and reflects visible light from the workpiece.

[0030] The CCD camera 6 is arranged on one side of the housing 1 by mechanical fixation or other means. The reflector 7 is arranged at the front end of the optical path of the CCD camera 6 and is used to receive the reflected light source in the housing 1. The spectroscope 8 is arranged in the housing 1 and is used to receive the image of the working surface 10 and reflect it to the reflector 7. The reflector 7 is then reflected into the CCD camera 6 through the reflector 7. The optional reflector 7 and the CCD camera 6 are connected and fixed to the housing 1 through the external housing 1. The connection between the housing 1 and the external housing 1 where the CCD camera 6 is arranged is provided with a light hole. The workpiece on the working surface 10 is reflected by natural light and imaged to the spectroscope 8. The spectroscope 8 reflects the light beam of this wavelength. The reflected light path of the spectroscope 8 arranged here is connected to the reflector 7. The reflected light path of the reflector 7 is connected to the CCD camera 6 to receive the image data of the tool on the working surface 10.

[0031] The CCD camera 6 is used to perform real-time imaging of the processing conditions of the working surface 10. The imaged data is transmitted to the control device 9. The control device 9 compares the data transmitted here with the stored qualified imaging data so that it can quickly analyze the defect position in the imaging picture and confirm the defect position coordinates.

[0032] The auxiliary laser light source 3 is disposed on the other side of the housing 1. A first scanning galvanometer mirror 4 is disposed at the light-emitting end of the auxiliary laser light source 3. The first scanning galvanometer mirror 4 and the auxiliary laser light source 3 are secured to the other side of the housing 1 via an external housing 1 disposed thereon. A light aperture is provided at the connection between the external housing 1 and the housing 1. The light beam emitted by the auxiliary laser light source 3 is incident on the reflector 7 of the first scanning galvanometer mirror 4, and is then reflected by the first scanning galvanometer mirror 4 into the housing 1. A second scanning galvanometer mirror 5 is disposed within the housing 1 to receive and reflect the light beam from the first scanning galvanometer mirror 4, directing it toward the work surface 10.

[0033] The control device 9 can control the first scanning galvanometer 4 and the second scanning galvanometer 5 to swing in the horizontal direction or the vertical direction so that the light beam is displaced. The control mechanism adjusts the coordinated swing angle of the first scanning galvanometer 4 and the second scanning galvanometer 5 so that the laser beam emitted by the laser auxiliary light source 3 acts on the position of the working surface 10.

[0034] In practice, the laser energy of the auxiliary laser light source 3 is less than that of the main laser light source 2, and the spot of the main laser light source 2 is larger than that of the auxiliary laser light source 3. For example, in laser edge banding, the main laser light source 2 can be a homogenized surface spot to heat the heated surface of the edge banding material, while the auxiliary laser light source 3 can be a collimated parallel point spot to supplement the remaining defects after the heated surface.

[0035] In practice, a window is provided on the light-emitting side of the housing 1, through which the main laser light source 2 and the auxiliary laser light source 3 are emitted to the working surface 10. The window provided on the outside of the housing 1 can effectively prevent smoke or dust generated during the operation of the laser from contaminating the internal components.

[0036] The working process of the high-performance laser light-filling device described in this embodiment is feasible as follows:

[0037] The control device 9 controls the main laser light source 2 to emit a working light spot, the working light spot acts on the working surface 10, the CCD camera 6 collects image data of the working surface 10, the control device 9 analyzes and compares the image data of the working surface 10 collected by the CCD camera 6 and confirms the calculated defect position, the control device 9 controls the laser auxiliary light source 3 to emit the laser auxiliary light spot and coordinately controls the swing angle of the first scanning galvanometer 4 and the second scanning galvanometer 5, the laser auxiliary light source 3 acts on the defect of the working surface 10, the CCD camera 6 collects image data of the working surface 10 to confirm the processing status, completes the processing if there is no defect, and continues to fill in the light if there is a defect.

[0038] It is feasible that the main laser light source 2 and the auxiliary laser light source 3 can also perform collaborative processing at the same time. The main laser light source 2 is responsible for processing the forming surface of the working surface 10, and at the same time, the auxiliary laser light source 3 performs predetermined processing on the local area of ​​the working surface 10, so that the product processing surface forms a composite processing surface, thereby enhancing the functional diversity of the high-performance laser fill light processing device.

[0039] The high-power laser light-filling processing device provided in this embodiment can improve the efficiency and quality of laser industrial processing by cooperating with the provided working light source, the laser auxiliary light source 3 and other components.

[0040] The high-performance laser light-filling processing device provided in this embodiment can improve accuracy and speed and significantly improve the yield rate when performing industrial precision manufacturing under the control of the control device 9. The use of local light-filling technology can improve the yield rate of finished products while reducing thermal stress and greatly improving product reliability.

[0041] The above description is merely a preferred embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A laser light-filling processing device, characterized in that: The invention comprises a shell (1), a working surface (10), a main laser light source (2), an auxiliary laser light source (3), a first scanning galvanometer (4), a second scanning galvanometer (5), a camera, a reflector (7), a spectroscope (8) and a control device (9); the main laser light source (2), the second scanning galvanometer (5) and the reflector (7) are all arranged inside the shell (1); the auxiliary laser light source (3), the first scanning galvanometer (4), the camera and the reflector (7) are installed on the outer wall of the shell (1); a first light hole is opened on the top of the shell (1); the light path emitted by the main laser light source (2) passes through the first light hole to reach the working surface (10); the spectroscope (8) is arranged on the reflected light path of the working surface (10); A second light hole is provided on the outer wall of the shell (1), and the reflected light of the spectroscope (8) passes through the second light hole to reach the reflector (7), and the camera is arranged on the reflected light path of the reflector (7); a third light hole is also provided on the outer wall of the shell (1), and the laser auxiliary light source (3) emits laser light to the first scanning galvanometer (4), and the laser light passes through the third light hole to the second scanning galvanometer (5) after being reflected by the first scanning galvanometer (4), and the laser light reflected by the second scanning galvanometer (5) passes through the first light hole to reach the working surface (10); the laser main light source (2), the laser auxiliary light source (3), the first scanning galvanometer (4), the second scanning galvanometer (5) and the camera are all electrically connected to the control device (9).

2. The device according to claim 1, characterized in that A window piece is arranged in the first light-through hole.

3. The device according to claim 1, characterized in that The swing angles of the first scanning galvanometer (4) and the second scanning galvanometer (5) are controlled by the control device (9).

4. A laser light-filling processing method, applied to a laser light-filling processing device according to any one of claims 1 to 3, characterized in that: include: S1: The control device (9) controls the main laser light source (2) to emit a processing light spot to the working surface (10), the reflected light of the working surface (10) is reflected to the reflector (7) via the beam splitter (8), the CCD camera (6) receives the reflected light from the reflector (7) and images the processing condition of the working surface (10), and the imaging data is transmitted to the control device (9); the control device (9) performs comparison training on the imaging data to confirm the coordinates of the defect position; S2: The control device (9) adjusts the swing angles of the first scanning galvanometer (4) and the second scanning galvanometer (5) based on the coordinates of the defect position, and controls each scanning galvanometer to reflect the laser light emitted by the auxiliary light source to the defect position; Repeat step S2 until the machined surface is free of defects.

5. A laser light-filling processing method, applied to a laser light-filling processing device according to any one of claims 1 to 3, characterized in that: include: The main laser light source (2) and the auxiliary laser light source (3) are turned on, the forming surface of the working surface (10) is processed by the laser emitted by the main laser light source (2), and the local area of ​​the working surface (10) is processed by the laser emitted by the auxiliary laser light source.

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