Flexible microprobe precision etching processing device and processing technology

Abstract

The invention discloses a flexible microprobe precision etching processing device and a processing technology, and relates to the field of flexible microprobe processing, and the scheme depends on an initial, middle and tail three-section independent liquid change area and a rotating disc type automatic pick-and-place structure in an annular solvent bin. The device supports a turntable through a mounting plate and a rotating seat and is provided with a driving-driven gear driven by a stepping motor for transmission, so that stable rotation and high-precision positioning of the turntable are ensured; the clamping lifter, the electromagnetic locking device and the prying frame are in linkage to complete automatic lifting and placing of the base plate frame. A closed-loop liquid recovery channel is formed by the bottom liquid passing hole and the sliding hopper, and liquid retention and cross contamination are avoided. According to the process, the gradient etching process of pre-etching, main etching and fine etching trimming is achieved through three-section conduit replacement, it is guaranteed that the solution concentration and the flow velocity are controllable, the etching depth uniformity and repeatability are improved, and meanwhile manual errors are reduced through automatic taking and placing. The whole device is compact in structure, closed-loop in action logic and stable and reliable in process, and the machining consistency and the yield are remarkably improved.

Description

Technical Field

[0001] The present invention relates to the field of flexible microprobe processing, and in particular to a flexible microprobe precision etching processing device and a processing technology. Background Art

[0002] Existing flexible microprobe etching processes typically utilize a single solution immersion method. However, this method, due to the tendency for the solution to generate concentration gradients in a static environment, makes it difficult to uniformly control the etching depth and rate, making it incapable of meeting the requirements for high-precision microstructure processing. Furthermore, manual handling of substrates relies heavily on empirical judgment, resulting in low processing efficiency. Furthermore, during multiple transfers, the probe tip is easily damaged or misaligned due to minor displacements or vibrations, thus impacting the yield of the finished product.

[0003] In addition, when replacing etching solutions, traditional processes often use a method of cross-mixing the old and new liquids by emptying the entire process and then re-injecting them. This method not only increases the cost of solvent consumption, but also brings about environmental pollution and secondary treatment problems, making it difficult to achieve green production goals. Most existing equipment lacks the functions of zoned liquid replacement and automatic gradient transfer, and cannot optimize the solution formula and concentration separately at different etching stages, thus limiting the level of fine control over etching depth and morphology. In order to solve the above bottlenecks, there is an urgent need for a flexible microprobe etching processing system that can realize multi-stage solution replacement and complete automated precise placement and gradient transfer to improve processing consistency, operating efficiency and resource utilization. Summary of the Invention

[0004] The purpose of the present invention is to solve the problem that the solution gradient is difficult to control in the traditional etching process, and to propose a flexible micro-probe precision etching processing device and processing technology.

[0005] To achieve the above-mentioned objectives, the present invention adopts the following technical solutions: a flexible microprobe precision etching processing device, comprising a plurality of substrate racks for mounting flexible microprobe substrates, and an immersion assembly for placing the substrate racks, wherein the immersion assembly is provided with a support assembly and a plurality of pick-and-place assemblies, wherein a control assembly for controlling the pick-and-place assemblies is mounted on the support assembly, and the immersion assembly includes a solvent tank, wherein the solvent tank is provided with a plurality of partitioning chambers for separating the substrate racks, and a liquid changing assembly is provided at the bottom of the solvent tank;

[0006] The support assembly includes a turntable that rotates within the solvent chamber;

[0007] The control assembly includes a driver for driving the turntable to rotate and a clamping lifter for driving the pick-and-place assembly to lift the substrate rack, the clamping lifter includes an electric telescopic rod and a clamping column fixed at its end;

[0008] The pick-and-place assembly includes a pry frame with a fulcrum forming a lever, and a locking wheel at the end of the pry frame for locking the substrate frame. The other end of the pry frame is provided with an electromagnetic lock that cooperates with a locking column.

[0009] As a further description of the above technical solution: the solvent bin includes a ring bin for fixing the separation bin, and a sliding hopper is installed at one end of the ring bin, and a plurality of liquid holes for solution replacement are provided at the bottom of the ring bin.

[0010] As a further description of the above technical solution: the liquid exchange component includes an initial liquid exchange tank, a middle liquid exchange tank and a terminal liquid exchange tank located at the bottom of the annular tank, which are connected to form three independent replacement solutions, and the bottoms of the initial liquid exchange tank, the middle liquid exchange tank and the terminal liquid exchange tank are all provided with conduits.

[0011] As a further description of the above technical solution: the support assembly includes a mounting plate fixed on the inner wall of the ring bin, a rotating seat supporting the rotation of the turntable is fixed on the mounting plate, and a support ring is provided at the edge of the turntable.

[0012] As a further description of the above technical solution: the driver includes a stepper motor fixed on a mounting plate, the output shaft of the stepper motor is fixed with a driving gear, the surface of the driving gear is meshed with a driven gear, and the driven gear is fixed to the bottom of the turntable.

[0013] As a further description of the above technical solution: the pick-and-place assembly also includes a pin seat fixed on the turntable, and the pin seat is movably connected to the pry frame.

[0014] As a further description of the above technical solution: the electromagnetic lock includes a lock buckle movably connected to the top of the pry frame, the top of the lock buckle is fixed with a first magnetic block by a tension spring, the top of the lock buckle is fixed with a second magnetic block, and also includes an adsorption seat fixed on the pry frame, one side of the adsorption seat is provided with multiple electromagnets, and one side of the lock buckle is provided with a limit pin for limiting it, and the limit pin is fixed on the pry frame.

[0015] As a further description of the above technical solution: the bottom of the lock is hook-shaped, and the side wall of the clamping column is provided with a plurality of grooves that cooperate with the lock to hook.

[0016] As a further description of the above technical solution: the top of the substrate rack is arranged in a semi-open arc shape, and the locking wheel slides at the opening of the substrate rack.

[0017] As a further description of the above technical solution: The flexible microprobe precision etching process includes the following steps:

[0018] S1, pre-treating the flexible microprobe substrate and installing it in the substrate holder;

[0019] S2. Place the substrate racks into independent compartments in sequence and start the initial liquid exchange process. Liquid is supplied from the initial liquid exchange compartment and continuously replaced in the area through the bottom conduit, so that the substrate surface completes the first stage of pre-etching in the stable flow of etching solution.

[0020] S3, after the substrate rack is moved into the area connected to the middle liquid exchange tank, the substrate rack is placed in the second solution for main etching treatment;

[0021] S4: After the middle stage processing is completed, the substrate rack is lifted to the end liquid exchange tank position for final fine etching, trimming and residue removal;

[0022] S5. Conversely, while the substrate rack in the first section solution moves toward the second section solution, the substrate rack in the second end solution moves toward the third section solution, and the substrate rack in the third section solution completes the processing and moves out to the terminal liquid exchange tank, forming a synchronous displacement replacement with the same gradient.

[0023] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0024] This solution solves the problems of uneven solution replacement, difficult to control the etching time of multiple batches of substrates, and easy damage to substrates during manual transfer in existing etching processes by constructing a flexible microprobe precision etching process with multi-stage liquid replacement function, automatic rotation transfer mechanism and precise electronic control pick-and-place coordination. It realizes high-consistency immersion, high-precision displacement and automatic synchronous control of multi-stage etching rhythm of flexible microprobes throughout the etching process, thereby significantly improving the uniformity of microstructure etching and the repeatability of the process, effectively ensuring the clarity of the edge contour of the microprobe and the overall yield, and reducing the impact of operation dependence and human error on process stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a three-dimensional schematic diagram of the present invention;

[0026] Figure 2 It is a schematic diagram of the explosion of the soaking assembly of the present invention;

[0027] Figure 3 is a three-dimensional schematic diagram of the control assembly of the present invention;

[0028] Figure 4 is a schematic cross-sectional view of a support assembly of the present invention;

[0029] Figure 5 is a schematic cross-sectional view of a control assembly of the present invention;

[0030] Figure 6 A three-dimensional schematic diagram of a pick-and-place assembly of the present invention;

[0031] Figure 7It is a three-dimensional schematic diagram of the electromagnetic lock of the present invention.

[0032] Legend:

[0033] 10. Support assembly; 11. Mounting plate; 12. Rotating seat; 13. Turntable; 14. Support ring; 20. Soaking assembly; 21. Solvent chamber; 211. Ring chamber; 212. Sliding hopper; 213. Liquid outlet; 22. Liquid exchange assembly; 221. Initial liquid exchange chamber; 222. Middle liquid exchange chamber; 223. Terminal liquid exchange chamber; 224. Conduit; 30. Control assembly; 31. Clamping lifter; 311. Electric telescopic rod ; 312, clamping column; 32, driver; 321, stepping motor; 322, driving gear; 323, driven gear; 40, pick-and-place assembly; 41, pry frame; 42, electromagnetic lock; 421, lock; 422, adsorption seat; 423, electromagnet; 424, first magnetic block; 425, second magnetic block; 426, limit pin; 43, locking wheel; 44, pin seat; 50, partition compartment; 60, substrate rack. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] like Figure 1 - Figure 7 As shown, the present invention provides: a flexible microprobe precision etching processing device, including a plurality of substrate racks 60 for mounting flexible microprobe substrates, and an immersion assembly 20 for placing the substrate racks 60, wherein the immersion assembly 20 is provided with a support assembly 10 and a plurality of pick-and-place assemblies 40, and a control assembly 30 for controlling the pick-and-place assemblies 40 is mounted on the support assembly 10, and the immersion assembly 20 includes a solvent tank 21, wherein the solvent tank 21 is provided with a plurality of partition chambers 50 for separating the substrate racks 60, and a liquid changing assembly 22 is provided at the bottom of the solvent tank 21;

[0036] The support assembly 10 includes a turntable 13 that rotates within a solvent chamber 21;

[0037] The control assembly 30 includes a driver 32 for driving the turntable 13 to rotate and a clamping lifter 31 for driving the pick-and-place assembly 40 to lift the substrate rack 60. The clamping lifter 31 includes an electric telescopic rod 311 and a clamping column 312 fixed at its end.

[0038] The pick-and-place assembly 40 includes a pry frame 41 with a fulcrum forming a lever, and a locking wheel 43 at the end of the pry frame 41 for locking the substrate frame 60 . The other end of the pry frame 41 is provided with an electromagnetic locker 42 that cooperates with the locking column 312 .

[0039] Specifically, such as Figure 2 As shown, the solvent chamber 21 includes a ring chamber 211 for fixing the separation chamber 50, and a sliding hopper 212 is installed at one end of the ring chamber 211. The bottom of the ring chamber 211 is provided with a plurality of liquid holes 213 for solution replacement.

[0040] The annular structure of the annular bin 211 not only provides precise fixed support for the separation bin 50, but also realizes the reliability of the positioning of the separation bin 50 by setting a positioning groove on the wall of the annular bin 211 that fits the separation bin 50, ensuring that each substrate rack 60 is always in a predetermined position during the initial, middle and final liquid exchange processes, facilitating the precise position locking of the stepper motor 321, and avoiding displacement caused by vibration or rotation of the turntable 13; the multiple liquid holes 213 arranged at the bottom of the annular bin 211 can form a directional flow channel during liquid replacement, so that the old etching liquid can be quickly discharged through the holes and avoid the formation of liquid retention areas on the bin wall or between the substrates. The sliding hopper 212 at one end of the annular bin 211 is accurately connected to the overflow liquid level in the bin through the tilt angle, and can guide the processed substrate rack 60 to the collection area after the final liquid exchange, realizing automatic unloading of the substrate after processing and liquid recovery closed loop, thereby improving the overall working continuity, etching uniformity and resource utilization efficiency of the equipment.

[0041] Specifically, such as Figure 1 and Figure 2 As shown, the fluid exchange component 22 includes an initial fluid exchange chamber 221, a middle fluid exchange chamber 222 and a terminal fluid exchange chamber 223 located at the bottom of the annular chamber 211 and connected to form three independent replacement solutions, and a conduit 224 is provided at the bottom of the initial fluid exchange chamber 221, the middle fluid exchange chamber 222 and the terminal fluid exchange chamber 223.

[0042] The liquid exchange component 22 divides the liquid exchange process into three independent spaces at the bottom of the annular chamber 211: the initial liquid exchange chamber 221, the middle liquid exchange chamber 222, and the terminal liquid exchange chamber 223, and sets a conduit 224 at the bottom of each section, thereby achieving fine control of the flow rate and concentration of the etching liquid. In the initial liquid exchange chamber 221, fresh etching liquid is continuously injected through the conduit 224 and transported upward through the connecting channel at the bottom of the annular chamber 211, which can quickly replace the original liquid and ensure that the surface of the microprobe obtains a uniform pre-etching treatment in the first stage; when the sample moves with the turntable 13 to the middle liquid exchange chamber 222, the conduit 224 of this section assumes the responsibility of stably transporting the main etching liquid, making the reaction conditions very different from the initial stage, thereby achieving a precise increment of the engraving depth; the terminal liquid exchange chamber 223 also continuously provides a quantitative solution through the bottom conduit 224, and quickly takes away the reaction residue to complete the final refinement and residue removal;

[0043] The design of independent conduits 224 in the three stages not only ensures the closed circulation of the solution in each chamber, but also allows for flexible adjustment of the flow rate and replacement frequency of each section, thereby achieving a gradient change in the etching solution formula and forming a precise match between etching rate and depth.

[0044] The synergistic effect of the three independent liquid exchange chambers and the bottom conduit 224 not only realizes the multi-level gradient replacement of the etching liquid, but also ensures that the liquid environment in each stage remains highly stable, realizing the full process automation, repeatable and high-precision processing of the flexible microprobe from pre-etching to main etching to fine trimming.

[0045] Specifically, such as Figure 4 As shown, the support assembly 10 includes a mounting plate 11 fixed on the inner wall of the ring chamber 211 , a rotating seat 12 supporting the rotation of a turntable 13 is fixed on the mounting plate 11 , and a support ring 14 is provided at the edge of the turntable 13 .

[0046] The mounting plate 11 is rigidly fixed to the inner wall of the ring chamber 211, serving as a load-bearing bridge between the turntable 13 and the entire solvent chamber 21, providing a reliable reference surface for the subsequent rotation of the turntable 13. The rotating seat 12 is fastened to the mounting plate 11, and its precision-machined bearings enable the turntable 13 to rotate smoothly and freely under load without causing jamming due to vibration or uneven force.

[0047] The support ring 14 can support the skid frame 41 so that the skid frame 41 can remain horizontal on the turntable 13 to avoid excessive falling and motion interference.

[0048] Specifically, such as Figure 5As shown, the driver 32 includes a stepper motor 321 fixed on the mounting plate 11 , a driving gear 322 is fixed to the output shaft of the stepper motor 321 , a driven gear 323 is meshed on the surface of the driving gear 322 , and the driven gear 323 is fixed to the bottom of the turntable 13 .

[0049] A stepper motor 321 is securely mounted on the mounting plate 11 on the inner wall of the ring chamber 211. A driving gear 322 is secured to its output shaft, precisely meshing with a driven gear 323 fixed to the bottom of the turntable 13, achieving direct power transmission to the turntable 13. The stepper motor 321 inherently possesses high-resolution pulse control capabilities. Combined with its gear ratio design, it converts the motor's minute steps into minute angular displacements of the turntable 13, enabling precise positioning of the center of each compartment 50 during each fluid exchange or placement operation. Furthermore, the gear meshing mechanism balances output torque with stability through mechanical force amplification.

[0050] Specifically, such as Figure 4 As shown, the pick-and-place assembly 40 further includes a pin seat 44 fixed on the turntable 13 , and the pin seat 44 is movably connected to the pry frame 41 .

[0051] The pin seat 44 serves as a fulcrum of the pry frame 41 and can meet the movement requirements of the pry frame 41 .

[0052] Specifically, such as Figure 6 As shown, the electromagnetic lock 42 includes a lock buckle 421 movably connected to the top of the pry frame 41, the top of the lock buckle 421 is fixed with a first magnetic block 424 by a tension spring, the top of the lock buckle 421 is fixed with a second magnetic block 425, and also includes an adsorption seat 422 fixed on the pry frame 41, and a plurality of electromagnets 423 are provided on one side of the adsorption seat 422, and a limit pin 426 is provided on one side of the lock buckle 421 for limiting its position, and the limit pin 426 is fixed on the pry frame 41.

[0053] By setting up the adsorption seat 422, the concave-convex design on the surface of the adsorption seat 422 can meet the needs of the first magnetic block 424 to be adsorbed and then the second magnetic block 425 can be adsorbed. During use, as the electromagnet 423 is started, the closer first magnetic block 424 is first adsorbed onto the adsorption seat 422. At this time, the tension spring is stretched, causing the lock 421 to deflect accordingly. After the lock 421 deflects to a certain angle, the distance between the second magnetic block 425 and the adsorption seat 422 is reduced, allowing it to be further adsorbed, thereby meeting the large-span electromagnetic response deflection of the lock 421.

[0054] Specifically, such as Figure 7 As shown, the bottom of the lock buckle 421 is hook-shaped, and the side wall of the clamping column 312 is provided with a plurality of grooves that cooperate with the lock buckle 421 to hook.

[0055] The hook-shaped bottom of the lock buckle 421 can form a matching limit with the groove on the side wall of the clamping column 312. After being hooked, the clamping column 312 cannot be separated unless it moves to a state where the prying frame 41 contacts the support ring 14.

[0056] Specifically, such as Figure 2 As shown, the top of the substrate rack 60 is arranged in a semi-open arc shape, and the locking wheel 43 slides at the opening of the substrate rack 60.

[0057] By providing the substrate rack 60 , a hook is provided on the top of the substrate rack 60 (the hook is provided with a semi-open arc shape at the top), which can meet the requirements of the locking wheel 43 moving inside and lifting it when deflected at the corresponding position.

[0058] The flexible microprobe precision etching process includes the following steps:

[0059] The treatment processes applicable to this device are as follows:

[0060] The flexible microprobe substrate is pre-cleaned and dried, and then mounted in the substrate holder 60;

[0061] The substrate racks 60 are sequentially placed in the positions of the partition chambers 50 connected to the initial liquid exchange chamber 221 inside the solvent chamber 21, and the initial liquid exchange process is started. The initial liquid exchange chamber 221 supplies liquid and continuously replaces the solution in the area through the bottom conduit 224, so that the substrate surface completes the first stage of pre-etching in the stable flow of etching solution;

[0062] After maintaining the predetermined soaking time, the system controls the stepper motor 321 to drive the turntable 13 to rotate precisely, causing the prying frame 41 to move to the corresponding position of the substrate rack 60, and activates the electric telescopic rod 311 to drive the clamping column 312 to rise and fall. At the same time, the electromagnet 423 attracts and releases the lock 421, causing it to be locked in the groove of the clamping column 312, driving the prying frame 41 to deflect and causing the locking wheel 43 to lift and lock the opening of the substrate rack 60, thereby lifting it. The turntable 13 continues to rotate, driving the lifted substrate rack 60 to move into the connecting area of ​​the middle liquid exchange chamber 222. After that, the clamping column 312 extends and releases the lock 421 to complete the lowering action, placing the substrate rack 60 in the second-stage solution for the main etching process. Conversely, the substrate rack 60 in the second-stage solution is simultaneously removed.

[0063] After the middle stage processing is completed, the substrate rack 60 is lifted to the end liquid exchange bin 223 position again through the above-mentioned automatic pick-and-place action for final fine etching, trimming and residue removal. After completion, the substrate rack 60 is lifted again and sent to the slide hopper 212 position for removal.

[0064] When the present solution is in use, the pre-treated flexible microprobe substrate is fixed on the substrate rack 60 and then placed in the corresponding partition chamber 50 in the annular chamber 211 (the initial liquid exchange chamber 221 is connected to the corresponding position of the annular chamber 211). At this time, the initial liquid exchange chamber 221 continuously replaces the solution in the partition chamber 50 within the corresponding area of ​​the annular chamber 211, keeping multiple substrate racks 60 placed therein in a stable immersion. At the same time, after the predetermined time of the first immersion is reached, the stepping motor 321 of its driver 32 drives the turntable 13 to rotate accurately on the rotating seat 12 through the driving gear 322 and the driven gear 323. At the same time, the pick-and-place assembly 40 installed on the turntable 13 moves accordingly, and the locking wheel 43 of the pick-and-place assembly 40 slides at the opening of the multiple substrate racks 60 until it moves to the corresponding substrate rack 60 position, and then the pick-and-place assembly 40 of the corresponding number of substrate racks 60 moves it. When the locking wheel 43 of the lever 420 is lifted, the locking wheel 431 of the lever 420 is released, and the locking wheel 432 of the lever 420 is released, so that the lever 420 is lifted and the locking wheel 432 of the lever 420 is released.

[0065] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A flexible microprobe precision etching processing device, comprising a plurality of substrate racks (60) for mounting flexible microprobe substrates, and an immersion assembly (20) for placing the substrate racks (60), wherein a support assembly (10) and a plurality of pick-and-place assemblies (40) are arranged in the immersion assembly (20), and a control assembly (30) for controlling the pick-and-place assemblies (40) is mounted on the support assembly (10), characterized in that: The immersion component (20) includes a solvent chamber (21), a plurality of partition chambers (50) for separating substrate racks (60) are provided in the solvent chamber (21), and a liquid replacement component (22) is provided at the bottom of the solvent chamber (21); The support assembly (10) includes a turntable (13) rotating in a solvent chamber (21); The control assembly (30) includes a driver (32) for driving the turntable (13) to rotate and a locking lifter (31) for driving the pick-and-place assembly (40) to lift the substrate rack (60), wherein the locking lifter (31) includes an electric telescopic rod (311) and a locking column (312) fixed at its end; The pick-and-place assembly (40) comprises a pry frame (41) having a fulcrum forming a lever, and a locking wheel (43) at the end of the pry frame (41) for locking the substrate frame (60), and an electromagnetic locker (42) is provided at the other end of the pry frame (41) for cooperating with a locking column (312).

2. The flexible microprobe precision etching processing device according to claim 1, characterized in that: The solvent chamber (21) includes a ring chamber (211) for fixing the separation chamber (50), and a sliding hopper (212) is installed at one end of the ring chamber (211). The bottom of the ring chamber (211) is provided with a plurality of liquid holes (213) for solution replacement.

3. The flexible microprobe precision etching processing device according to claim 1, characterized in that: The liquid exchange component (22) includes an initial liquid exchange chamber (221), a middle liquid exchange chamber (222), and a terminal liquid exchange chamber (223) located at the bottom of the annular chamber (211) and connected to form three independent replacement solutions, and a conduit (224) is provided at the bottom of each of the initial liquid exchange chamber (221), the middle liquid exchange chamber (222), and the terminal liquid exchange chamber (223).

4. The flexible microprobe precision etching processing device according to claim 2, characterized in that: The support assembly (10) comprises a mounting plate (11) fixed on the inner wall of the ring bin (211), a rotating seat (12) supporting the rotation of the turntable (13) being fixed on the mounting plate (11), and a support ring (14) being provided at the edge of the turntable (13).

5. The flexible microprobe precision etching processing device according to claim 4, characterized in that: The driver (32) includes a stepper motor (321) fixed on the mounting plate (11), a driving gear (322) is fixed to the output shaft of the stepper motor (321), a driven gear (323) is meshed on the surface of the driving gear (322), and the driven gear (323) is fixed to the bottom of the turntable (13).

6. The flexible microprobe precision etching processing device according to claim 1, characterized in that: The pick-and-place assembly (40) further comprises a pin seat (44) fixed on the turntable (13), and the pin seat (44) is movably connected to the pry frame (41).

7. The flexible microprobe precision etching processing device according to claim 5, characterized in that: The electromagnetic locker (42) includes a lock buckle (421) movably connected to the top of the pry frame (41), a first magnetic block (424) is fixed to the top of the lock buckle (421) through a tension spring, a second magnetic block (425) is fixed to the top of the lock buckle (421), and also includes an adsorption seat (422) fixed on the pry frame (41), a plurality of electromagnets (423) are provided on one side of the adsorption seat (422), and a limiting pin (426) for limiting the lock buckle (421) is provided on one side of the lock buckle (421), and the limiting pin (426) is fixed on the pry frame (41).

8. The flexible microprobe precision etching processing device according to claim 7, characterized in that: The bottom of the lock buckle (421) is hook-shaped, and the side wall of the clamping column (312) is provided with a plurality of grooves that cooperate with the lock buckle (421) to hook.

9. The flexible microprobe precision etching processing device according to claim 1, characterized in that: The top of the substrate frame (60) is arranged in a semi-open arc shape, and the locking wheel (43) slides at the opening of the substrate frame (60).

10. A flexible microprobe precision etching process, using the flexible microprobe precision etching apparatus according to claim 7, characterized in that: The following steps are involved: S1, pre-processing the flexible microprobe substrate and installing it in the substrate holder (60); S2, placing the substrate racks (60) into the independent compartments (50) in sequence, and starting the initial liquid replacement process, wherein the initial liquid replacement compartment (221) supplies liquid and continuously replaces the solution in the region through the bottom conduit (224), so that the substrate surface completes the first stage of pre-etching in the stable flow of etching solution; S3, after the substrate rack (60) is moved into the area connected to the middle liquid exchange chamber (222), the substrate rack (60) is placed in the second solution for main etching treatment; S4, after the middle stage processing is completed, the substrate rack (60) is lifted to the end liquid exchange chamber (223) position, and the final fine etching, trimming and residue removal processing is performed; S5. Conversely, while the substrate rack (60) in the first section solution moves toward the second section solution, the substrate rack (60) in the second end solution moves toward the third section solution, and the substrate rack (60) in the third section solution completes the processing and moves out to the terminal liquid exchange chamber (223), forming a synchronous displacement replacement with the same gradient.

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