Magnetic field probe and magnetic field detection device

Abstract

The invention provides a magnetic field probe and magnetic field detection equipment, which are used for carrying out high-resolution positioning on magnetic field noise vertical to the surface of an object, so that the problem of electromagnetic noise in electronic equipment can be solved subsequently in a targeted manner, and the product yield of the electronic equipment is ensured. In the magnetic field probe, a first resonant ring comprises a first ring part, a second resonant ring is located on one side of the first resonant ring in the thickness direction of the first resonant ring, the second resonant ring and the first resonant ring are arranged in a spaced mode, the second resonant ring comprises a second ring part, and the second ring part and the first ring part are oppositely arranged. The first transmission line section and the second transmission line section are both located on the side, away from the first resonant ring, of the second resonant ring, the first transmission line section intersects with the first resonant ring and is electrically connected with the first resonant ring, and in the thickness direction of the first transmission line section, the second transmission line section is located on one side of the first transmission line section and is spaced from the first transmission line section; the second transmission line segment intersects with the second resonant ring and is electrically connected with the second resonant ring.

Description

Technical Field

[0001] The present application relates to the field of magnetic field detection technology, and in particular to a magnetic field probe and a magnetic field detection device. Background Art

[0002] In electronic devices like mobile phones and tablets, components are stacked and circuit board traces are highly integrated and miniaturized, creating a complex internal electromagnetic environment. The presence of electromagnetic noise can lead to far-field radiation, reduced communication sensitivity, and interference immunity issues. Currently, near-field scanning is often used to identify noise sources in electronic devices. However, traditional magnetic field probes cannot accurately locate magnetic field noise perpendicular to the surface of an object. This makes it difficult to effectively address electromagnetic noise within electronic devices, reducing the product yield. Summary of the Invention

[0003] The present application provides a magnetic field probe and a magnetic field detection device for high-resolution positioning of magnetic field noise perpendicular to the surface of an object, which facilitates the subsequent targeted resolution of electromagnetic noise inside electronic equipment and ensures the product yield of electronic equipment.

[0004] In a first aspect, the present application provides a magnetic field probe, comprising a first resonant ring, a second resonant ring, a first transmission line segment, and a second transmission line segment, wherein the first resonant ring comprises a first ring portion, and along a thickness direction of the first resonant ring, the second resonant ring is located on one side of the first resonant ring and is spaced apart from the first resonant ring, and the second resonant ring comprises a second ring portion, and the second ring portion is arranged opposite to the first ring portion;

[0005] The first transmission line segment and the second transmission line segment are both located on a side of the second resonant ring away from the first resonant ring. The first transmission line segment is arranged to intersect with the first resonant ring and is electrically connected to the first resonant ring. Along the thickness direction of the first transmission line segment, the second transmission line segment is located on one side of the first transmission line segment and is spaced apart from the first transmission line segment. The second transmission line segment is arranged to intersect with the second resonant ring and is electrically connected to the second resonant ring.

[0006] In the magnetic field probe shown in this application, the first resonant ring and the second resonant ring are designed to intersect with the first transmission line segment and the second transmission line segment, respectively. When the first resonant ring and the second resonant ring are placed parallel to the surface of the object, the first resonant ring and the second resonant ring in the magnetic field probe can couple with the magnetic field perpendicular to the outer surface of the object and resonate, thereby detecting the magnetic field perpendicular to the outer surface of the object. Therefore, the magnetic field probe can perform high-resolution positioning of electromagnetic noise inside the object and accurately locate the noise source inside the object. The magnetic field probe has a strong magnetic field detection capability and high noise resolution, which facilitates the subsequent targeted resolution of electromagnetic noise inside the object and ensures the product yield of electronic equipment.

[0007] In one embodiment, the first transmission line segment and the first resonant ring are perpendicular to each other, and the second transmission line segment and the second resonant ring are perpendicular to each other.

[0008] In the magnetic field probe shown in this application, the first resonant ring and the second resonant ring are designed to be perpendicular to the first transmission line segment and the second transmission line segment, respectively. When the first resonant ring and the second resonant ring are placed parallel to the surface of the object, the first resonant ring and the second resonant ring in the magnetic field probe can couple with the magnetic field perpendicular to the outer surface of the object and resonate, thereby detecting the magnetic field perpendicular to the outer surface of the object. Therefore, the magnetic field probe can perform high-resolution positioning of electromagnetic noise inside the object to accurately locate the noise source inside the object. The magnetic field probe has strong magnetic field detection capabilities and high noise resolution, which facilitates subsequent targeted resolution of electromagnetic noise inside the object and ensures the product yield of electronic equipment.

[0009] In one embodiment, the magnetic field probe further includes a balun transmission structure. The balun transmission structure is located on a side of the second resonant ring facing away from the first resonant ring, between the first transmission line segment and the second transmission line segment, and spaced apart from both the first and second transmission line segments. The balun transmission structure may be a Marchand balun. The balun transmission structure can convert the differential signals output by the first resonant ring and the stacked resonant ring into single-ended signals, facilitating analysis of magnetic field noise detected by the magnetic field probe 2000 by a signal analyzer.

[0010] In one embodiment, the path length for transmitting the first signal output by the first resonant ring to the first transmission line segment is a first length, and the path length for transmitting the second signal output by the second resonant ring to the second transmission line segment is a second length, and the second length is equal to the first length.

[0011] The first signal output by the first resonant ring and the second signal output by the second resonant ring are differential signals. Since the path length of the first signal output by the first resonant ring to reach the first transmission line segment is the same as the path length of the second signal output by the second resonant ring to reach the first transmission line segment, after the first signal reaches the first transmission line segment and the second signal reaches the second transmission line segment, the phase difference between the signals transmitted on the first transmission line segment and the second transmission line segment does not change, and the signals transmitted on the first transmission line segment and the second transmission line segment are still differential signals.

[0012] In one embodiment, the first resonant ring includes a first output end connected to the first ring portion, the second resonant ring includes a second output end connected to the second ring portion, the first transmission line segment includes a first input end facing the first resonant ring, and the second transmission line segment includes a second input end facing the second resonant ring;

[0013] The magnetic field probe further includes a first output plate, a second output plate, a first input plate, and a second input plate;

[0014] The first output plate and the second output plate are both located on a side of the second resonant ring away from the first resonant ring, and are spaced apart from the second resonant ring. The first output plate is electrically connected to the first output end. The second output plate is located on one side of the first output plate, is spaced apart from the first output plate, and is electrically connected to the second output end.

[0015] The first input board and the second input board are both located on a side of the first transmission line segment facing away from the second transmission line segment, and are both spaced apart from the first transmission line segment. The first input board is electrically connected to the first output board and the first input end. The second input board is located on one side of the first input board, is spaced apart from the first input board, and is electrically connected to the second output board and the second input end.

[0016] The path length of the first signal transmitted from the first output terminal to the first output board is a third length, the path length of the second signal transmitted from the second input board to the second input terminal is a fourth length, and the fourth length is equal to the third length;

[0017] The path length of the first signal transmitted from the first input board to the first input terminal is a fifth length, and the path length of the second signal transmitted from the second output terminal to the second output board is a sixth length, which is equal to the fifth length;

[0018] The path length of the first signal transmitted from the first output board to the first input board is the seventh length, and the path length of the second signal transmitted from the second output board to the second input board is the eighth length, which is equal to the seventh length.

[0019] In the magnetic field probe of the present application, the transmission path of the first signal from the first output end to the first input end and the transmission path of the second signal from the second output end to the second input end are divided into three sections. The path length of the first signal transmitted from the first output end to the first output plate is designed to be equal to the path length of the second signal transmitted from the second input plate to the second input end. The path length of the first signal transmitted from the first input plate to the first input end is designed to be the same as the path length of the second signal transmitted from the second output end to the second input plate. The transmission path of the first signal transmitted from the first output plate to the first input plate is designed to be the same as the transmission path of the second signal transmitted from the second output plate to the second input plate. This compensates for the phase difference between the signal output by the first resonant ring reaching the first transmission line segment and the signal output by the second resonant ring reaching the second transmission line segment, thereby ensuring that the signals transmitted on the first transmission line segment and the second transmission line segment are differential signals.

[0020] In one embodiment, the first output plate is spaced apart from and opposite to the first output end, and the second output plate is spaced apart from and opposite to the second output end;

[0021] The magnetic field probe further includes a first output portion and a second output portion, the first output portion being electrically connected between the first output plate and the first output end, and the second output portion being electrically connected to the second output plate and the second output end;

[0022] The length of the first output portion is the third length, and the length of the second output portion is the sixth length.

[0023] In the magnetic field probe shown in the present application, a first output portion is designed between the first output plate and the first output end, and a second output portion is designed between the second output plate and the second output end to compensate for the phase difference between the signal output by the first resonant ring reaching the first transmission line segment and the signal output by the second resonant ring reaching the second transmission line segment, thereby ensuring that the signals transmitted on the first transmission line segment and the second transmission line segment are differential signals.

[0024] In one embodiment, the first input plate is spaced apart from and opposite to the first input end, and the second input plate is spaced apart from and opposite to the second input end;

[0025] The magnetic field probe further includes a first input portion and a second input portion, the first input portion being electrically connected between the first input plate and the first input end, and the second input portion being electrically connected between the second input plate and the second input end;

[0026] The length of the first input portion is the fifth length, and the length of the second input portion is the fourth length.

[0027] In the magnetic field probe shown in the present application, a first input part is designed between the first input plate and the first input end, and a second input part is designed between the second input plate and the second input end to compensate for the phase difference between the signal input by the first resonant ring reaching the first transmission line segment and the signal input by the second resonant ring reaching the second transmission line segment, thereby ensuring that the signals transmitted on the first transmission line segment and the second transmission line segment are differential signals.

[0028] In one embodiment, the first input plate is spaced apart from the first output plate, and the second input plate is spaced apart from the second output plate;

[0029] The magnetic field probe further includes a first conductive member and a second conductive member, the first conductive member being located on a side of the first input plate away from the first input end and electrically connecting the first input plate and the first output plate, the second conductive member being located on a side of the second input plate away from the second input end and electrically connecting the second input plate and the second input end, and being spaced apart from the first conductive member;

[0030] The distance between the first input portion and the surface of the first output plate facing the first output end is the seventh length, and the distance between the second input portion and the surface of the second output plate facing the second output end is the eighth length.

[0031] In the magnetic field probe shown in the present application, a first conductive member is used to electrically connect the first input plate and the first output plate, and a second conductive member is used to electrically connect the second input plate and the second input end. The distance between the first input portion and the surface of the first output plate facing the first output end is designed to be equal to the distance between the second input portion and the surface of the second output plate facing the second output end. This compensates for the phase difference between the signal input by the first resonant ring reaching the first transmission line segment and the signal input by the second resonant ring reaching the second transmission line segment, thereby ensuring that the signals transmitted on the first transmission line segment and the second transmission line segment are differential signals.

[0032] In one embodiment, the first resonant ring further includes a first transmission portion, the first transmission portion is connected to one side of the first ring portion and is electrically connected to the first transmission line segment;

[0033] The second resonant ring further includes a second transmission portion, which is connected to one side of the second ring portion, is arranged opposite to the first transmission portion, and is electrically connected to the second transmission line segment;

[0034] The magnetic field probe further includes two first shielding members, which are respectively located on opposite sides of the first transmission portion and the second transmission portion, and are spaced apart from the first transmission portion and the second transmission portion.

[0035] The two first shielding parts can not only shield the signals near the magnetic field probe, preventing the nearby signals from interfering with the signal transmission on the first transmission part and the second transmission part, but also prevent the signals transmitted on the first transmission part and the second transmission part from leaking from both sides, reducing the loss of the signal transmitted on the first transmission part and the second transmission part, and ensuring the reliability of the magnetic field probe.

[0036] In one embodiment, the magnetic field probe further includes two second shielding members, which are respectively located on opposite sides of the first transmission line segment and the second transmission line segment and are spaced apart from the first transmission line segment and the second transmission line segment.

[0037] The two second shielding components can not only shield the signals near the magnetic field probe, preventing the nearby signals from interfering with the signal transmission on the first transmission line segment and the second transmission line segment, but also prevent the signals transmitted on the first transmission line segment and the second transmission line segment from leaking from both sides, thereby reducing the loss of the signal transmitted on the first transmission line segment and the second transmission line segment, and ensuring the reliability of the magnetic field probe.

[0038] In one embodiment, the magnetic field probe further includes a first main body plate and a second main body plate;

[0039] The first main body plate is located on a side of the second resonant ring away from the first resonant ring and is spaced apart from the second resonant ring. The first main body plate is provided with a first avoidance hole and a first notch. Both the first avoidance hole and the first notch penetrate the first main body plate along the thickness direction of the first main body plate. The first avoidance hole is arranged opposite to the second ring portion, and the first notch penetrates the hole wall surface of the first avoidance hole and the circumferential surface of the first main body plate.

[0040] The second main body plate is located on a side of the first resonant ring away from the second resonant ring, and is spaced apart from the first resonant ring. The second main body plate is provided with a second avoidance hole and a second notch. Both the second avoidance hole and the second notch penetrate the second main body plate along the thickness direction of the second main body plate. The second avoidance hole is arranged opposite to the second ring portion, and the second notch penetrates the hole wall surface of the second avoidance hole and the circumferential surface of the second main body plate.

[0041] The first avoidance hole and the second avoidance hole can avoid the magnetic field, so as to prevent the design of the first main plate and the second main plate from affecting the detection magnetic field of the first resonant ring and the second resonant ring.

[0042] In one embodiment, the magnetic field probe further includes a third main body plate and a fourth main body plate, the third main body plate being located on a side of the second transmission line segment facing away from the first transmission line segment and being spaced apart from the second transmission line segment, and the fourth main body plate being located on a side of the first transmission line segment facing away from the second transmission line segment and being spaced apart from the first transmission line segment.

[0043] In one embodiment, a magnetic field probe includes a first substrate, which includes a first dielectric substrate, a first resonant ring, and a second resonant ring. The first resonant ring and the second resonant ring are both located within the first dielectric substrate. The first substrate is a circuit board. The first and second resonant rings can be metal components within the circuit board, simplifying the manufacturing process of the first and second resonant rings and reducing the manufacturing cost of the magnetic field probe.

[0044] In one embodiment, the magnetic field probe includes a second substrate, which includes a second dielectric substrate, a first transmission line segment, and a second transmission line segment. The first transmission line segment and the second transmission line segment are both located within the second dielectric substrate. The second substrate is a circuit board. The first and second transmission line segments can be metal components within the circuit board, simplifying the manufacturing process of the first and second transmission line segments and reducing the manufacturing cost of the magnetic field probe.

[0045] In one embodiment, the second substrate is provided with a fixing hole extending through the thickness of the second substrate. The magnetic field probe can be fastened to a robotic arm of the magnetic field detection device using the fixing hole to achieve assembly of the magnetic field probe and the robotic arm.

[0046] In a second aspect, the present application provides a magnetic field detection device, comprising any of the above-mentioned magnetic field probes and a signal analyzer, wherein the signal analyzer is electrically connected to the magnetic field probe.

[0047] In the magnetic field detection device shown in the present application, the first resonant ring and the second resonant ring of the magnetic field probe are designed to intersect with the first transmission line segment and the second transmission line segment, respectively. When the first resonant ring and the second resonant ring are placed parallel to the surface of the object, the first resonant ring and the second resonant ring in the magnetic field probe can couple with the magnetic field perpendicular to the outer surface of the object and resonate, thereby detecting the magnetic field perpendicular to the outer surface of the object. Therefore, the magnetic field probe can perform high-resolution positioning of the electromagnetic noise inside the object to accurately locate the noise source inside the object. The magnetic field probe has a strong magnetic field detection capability and high noise resolution, which facilitates the subsequent targeted solution of the electromagnetic noise inside the object and ensures the product yield of the electronic equipment.

[0048] In one embodiment, the signal analyzer is a spectrum analyzer or a vector network analyzer, which can restore and analyze the magnetic field detected by the magnetic field probe, thereby facilitating subsequent targeted resolution of electromagnetic noise inside the electronic device and ensuring the product yield of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0050] Figure 1 It is a schematic diagram of the partial structure of an electronic device;

[0051] Figure 2 yes Figure 1 Magnetic field noise simulation results of the electronic device shown;

[0052] Figure 3 This is a schematic diagram of the structure of the magnetic field probe in the magnetic field detection device provided by this application;

[0053] Figure 4 yes Figure 3 A schematic diagram of the local structure of the magnetic field probe shown;

[0054] Figure 5 yes Figure 4 A schematic structural diagram of the first substrate in the magnetic field probe shown;

[0055] Figure 6 yes Figure 5 A schematic diagram of a partial structure of the first substrate shown;

[0056] Figure 7 yes Figure 6 A schematic diagram of the exploded structure of the first substrate shown;

[0057] Figure 8 yes Figure 4 A schematic structural diagram of the second substrate in the magnetic field probe shown;

[0058] Figure 9 yes Figure 8 A schematic diagram of a partial structure of the second substrate shown;

[0059] Figure 10 yes Figure 4 A schematic diagram of the local structure of the magnetic field probe shown;

[0060] Figure 11 yes Figure 9 A schematic diagram of the planar structure of the second substrate is shown;

[0061] Figure 12 yes Figure 10 Schematic diagram of the partial structure of the magnetic field probe shown. DETAILED DESCRIPTION

[0062] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application.

[0063] This application provides a magnetic field detection device that can detect and analyze magnetic field noise from electronic devices. The electronic devices can include mobile phones, tablet computers, personal computers, multimedia players, e-book readers, laptop computers, in-vehicle devices, wearable devices, and other electronic products. The following description uses a mobile phone as an example.

[0064] The magnetic field detection equipment may include a robotic arm, a magnetic field probe and a signal analyzer. The magnetic field probe may be mounted on the robotic arm and may be moved by the robotic arm. The signal analyzer may be connected to the magnetic field probe. For example, the signal analyzer may be connected to the magnetic field probe via a radio frequency cable. The magnetic field probe may detect the magnetic field noise of the electronic device and convert the detected magnetic field noise into an electrical signal and send it to the signal analyzer. The signal analyzer may receive the electrical signal sent by the magnetic field probe and may analyze the magnetic field noise of the electronic device based on the electrical signal. The signal analyzer may be a spectrum analyzer or a vector network analyzer.

[0065] It should be noted that the "connection" mentioned in this application when describing the magnetic field detection equipment includes two situations: "direct connection" and "indirect connection". For example, "A is connected to B", includes two situations: "A is directly connected to B" and "A is connected to B through C".

[0066] See also Figure 1 , Figure 1 1 is a schematic diagram of a partial structure of the electronic device 1000. For ease of description, the width direction of the electronic device 1000 is defined as the X1-axis direction, the length direction of the electronic device 1000 is defined as the Y1-axis direction, and the thickness direction of the electronic device 1000 is defined as the Z1-axis direction. The X1-axis direction, the Y1-axis direction, and the Z1-axis direction are perpendicular to each other.

[0067] The electronic device 1000 often includes multiple devices such as a camera, a speaker, and a circuit board. To ensure the utilization of the internal space of the electronic device 1000, multiple devices are often stacked inside the electronic device 1000, and the wiring on the circuit board is also highly integrated and miniaturized, resulting in a very complex electromagnetic environment inside the electronic device 1000. For example, the circuit board will generate magnetic field noise, there will be strong magnetic field noise perpendicular to the circuit board at the through holes on the circuit board, and there will be magnetic field noise in multiple directions in the non-flat structure area inside the electronic device 1000. These magnetic field noises will cause the existence of magnetic fields in multiple directions on the outer surface of the electronic device 1000.

[0068] It is understood that the magnetic field in each direction on the outer surface of the electronic device 1000 can be decomposed into a magnetic field component perpendicular to the outer surface of the electronic device 1000 and a magnetic field component parallel to the outer surface of the electronic device 1000.

[0069] →→

[0070] The first magnetic field B1 on the outer surface of the electronic device 1000 and the first magnetic field B2 parallel to the electronic device 1000 → As an example, the second magnetic field B2 on the outer surface of the → The magnetic field on the outer surface of the sub-device 1000 is analyzed, wherein the first magnetic field B1 is parallel to the Z1 axis direction, and the second magnetic field B2 is parallel to the X1Y2 plane.

[0071] See also Figure 2 , Figure 2 yes Figure 1 The magnetic field noise simulation result diagram of the electronic device 1000 is shown. Figure 2 The simulation diagram shown is a diagram showing the noise electric field simulation result of the MCLK signal (master clock signal) in the electronic device 1000 when the camera is working.

[0072] from Figure 2 It can be seen that the areas where noise sources S1 and S2 are located are small, the noise strong field area is small, the noise can be transmitted through the cavity and metal shell, and the noise interference path is relatively hidden. A miniaturized and highly sensitive magnetic field probe is required to locate the noise source.

[0073] It should be noted that when electromagnetic noise exists inside the electronic device 1000, the electronic device 1000 may generate far-field radiation, reduce communication sensitivity or cause anti-interference problems, which may affect the reliability of the electronic device 1000. In the preparation process of the electronic device 1000, near-field scanning is often used to locate the noise source inside the electronic device 1000.

[0074] →

[0075] After that, the traditional magnetic field probe cannot accurately locate the first magnetic field B1 perpendicular to the outer surface of the electronic device 1000, that is, it cannot accurately locate the magnetic field noise perpendicular to the surface of the object. When the signal analyzer recovers the magnetic field noise detected by the magnetic field probe, it will lack the magnetic field information perpendicular to the outer surface of the electronic device 1000, resulting in the signal analyzer being unable to accurately reproduce the noise source, and thus unable to determine the type of magnetic field noise, and unable to specifically solve the electromagnetic noise inside the electronic device 1000. Furthermore, the existing magnetic field probe is large in size, resulting in the magnetic field probe being unable to accurately locate noise sources in a smaller area, and unable to specifically solve the electromagnetic noise inside the electronic device 1000. In addition, since the amplitude of the electromagnetic noise generated by the circuit board is small, the scanning accuracy of the near-field scan is low. When using a traditional magnetic field probe for noise positioning, the signal analyzer cannot receive the magnetic field noise, and thus cannot accurately locate the noise source inside the electronic device 1000. Therefore, the traditional magnetic field probe can no longer meet the usage requirements.

[0076] See also Figure 3 , Figure 3 It is a structural schematic diagram of the magnetic field probe 2000 in the magnetic field detection device provided in this application.

[0077] Next, for the sake of convenience of description, the width direction of the magnetic field probe 2000 is defined as the X2 axis direction, the length direction of the magnetic field probe 2000 is defined as the Y2 axis direction, and the height direction of the magnetic field probe 2000 is defined as the Z2 axis direction. The X2 axis direction, the Y2 axis direction and the Z2 axis direction are perpendicular to each other.

[0078] The magnetic field probe 2000 includes a first substrate 100 and a second substrate 200. The second substrate 200 is connected to one side of the first substrate 100 along the thickness direction of the first substrate 100 (the Z2 axis direction in the figure) and is arranged to intersect with the first substrate 100. The second substrate 200 includes a radio frequency end 200a and a fixed end 200b. The radio frequency end 200a is located at the end of the second substrate 200 away from the first substrate 100 and is electrically connected to the signal analyzer. The fixed end 200b is located between the radio frequency end 200a and the first substrate 100, and is spaced apart from both the radio frequency end 200a and the first substrate 100. It is used to securely connect to the robotic arm to mount the magnetic field probe 2000 on the robotic arm. Exemplarily, the fixed end 200b is provided with a fixing hole 200c that passes through the fixed end 200b along the thickness direction of the fixed end 200b (the X2 axis direction in the figure). In this case, the fixed end 200b can serve as a locking lug. The magnetic field probe 2000 can be fastened to the robotic arm using the fixing holes to achieve assembly of the magnetic field probe 2000 and the robotic arm.

[0079] In this embodiment, the first substrate 100 and the second substrate 200 are both in the shape of flat plates, and the first substrate 100 and the second substrate 200 are perpendicular to each other. It should be noted that the qualifiers such as parallel and perpendicular mentioned in this application regarding relative positional relationships are all based on the current level of technology, rather than being absolutely strict definitions in a mathematical sense. A small amount of deviation is allowed, and both approximately parallel and approximately perpendicular are acceptable. For example, A and B are parallel, which means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 degrees and 10 degrees. For example, A and B are perpendicular, which means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 degrees and 100 degrees.

[0080] See also Figures 3 to 5 , Figure 4 yes Figure 3 The schematic diagram of the partial structure of the magnetic field probe 2000 is shown. Figure 5 yes Figure 4 The structure diagram of the first substrate 100 in the magnetic field probe 2000 is shown. Figure 4 and Figure 5 The first dielectric substrate 110 is not shown.

[0081] The first substrate 100 includes a first dielectric substrate 110, a second metal plate 120, a first metal plate 130, a first resonant ring 140, a second resonant ring 150, a first grounding member 160, a second grounding member 170, a first output member 180, a second output member 190, and a first shielding member 100a. The second metal plate 120, the first metal plate 130, the first resonant ring 140, the second resonant ring 150, the first grounding member 160, the second grounding member 170, the first output member 180, the second output member 190, and the first shielding member 100a are all located inside the first dielectric substrate 110. It should be understood that the shape of the first substrate 100 is not limited to the square shape shown in the figure, and may also be circular or other special shapes.

[0082] The first substrate 100 may be a circuit board, and the second metal plate 120, the first metal plate 130, the first resonant ring 140, the second resonant ring 150, the first grounding member 160, the second grounding member 170, the first output member 180, the second output member 190, and the first shielding member 100a may all be metal structures within the circuit board. For example, the second metal plate 120, the first metal plate 130, the first resonant ring 140, and the second resonant ring 150 may all be metal layers within the circuit board, and the first grounding member 160, the second grounding member 170, the first output member 180, the second output member 190, and the first shielding member 100a may all be metal vias within the circuit board. This simplifies the manufacturing process of the first substrate 100 and helps reduce the manufacturing cost of the magnetic field probe 2000. It should be noted that the metal vias mentioned in this application refer to the metal layer located on the surface of the via or the metal pillars disposed within the via.

[0083] In this embodiment, the first dielectric substrate 110 includes three first sub-dielectric substrates, which are stacked sequentially along the thickness direction of the first substrate 100 (the Z2-axis direction in the figure). In other embodiments, the first dielectric substrate 110 may include one, two, or more than four first sub-dielectric substrates. This application does not impose any specific limitations on the layer structure of the first dielectric substrate 110.

[0084] See also Figure 6 and Figure 7 , Figure 6 yes Figure 5 The schematic diagram of the partial structure of the first substrate 100 is shown in FIG. Figure 7 yes Figure 6 The exploded structure diagram of the first substrate 100 is shown in FIG. Figure 6 and Figure 7 The first shielding member 100 a is not shown at all.

[0085] The second metal plate 120 includes a second main body plate 121, a third output plate 122, and a fourth output plate 123. The second main body plate 121 is provided with a second avoidance hole 124, a second notch 125, and a second through-hole 126. The second avoidance hole 124, the second notch 125, and the second through-hole 126 all penetrate the second main body plate 121 along the thickness direction of the second main body plate 121 (the Z2 axis direction in the figure). The second notch 125 is located on the front side of the second avoidance hole 124 and penetrates the hole wall surface of the second avoidance hole 124 and the front circumferential surface of the second main body plate 121. The second avoidance hole 124 can avoid the magnetic field, preventing the second main body plate 121 from affecting the magnetic field detection of the first resonant ring 140 and the second resonant ring 150. It should be understood that the shape of the second avoidance hole 124 is not limited to the square shown in the figure, and can also be circular or other special shapes.

[0086] The second through hole 126 is located on the rear side of the second avoidance hole 124 and is spaced apart from the second avoidance hole 124. That is, the second through hole 126 is located on the side of the second avoidance hole 124 away from the second notch 125. The second through hole 126 includes a first sub-through hole 1261 and a second sub-through hole 1262, and the second sub-through hole 1262 is located on the right side of the first sub-through hole 1261 and is spaced apart from the first sub-through hole 1261. It should be understood that the shapes of the first sub-through hole 1261 and the second sub-through hole 1262 are not limited to the circular shape shown in the figure, and can also be square or other special shapes. In some other embodiments, the second through hole 126 may also not include the first sub-through hole 1261 and the second sub-through hole 1262, and the second through hole 126 is a complete through hole, and this application does not impose specific restrictions on this.

[0087] It should be noted that the directional terms such as “top”, “bottom”, “left”, “right”, “front” and “back” used in this application to describe the magnetic field probe 2000 are mainly based on the attached Figure 3 The display orientation is explained in the figure, with the positive direction of the Z2 axis as the "top", the negative direction of the Z2 axis as the "bottom", the positive direction of the Y2 axis as the "left", the negative direction of the Y2 axis as the "right", the positive direction of the X2 axis as the "back", and the negative direction of the X2 axis as the "front". It does not constitute a limitation on the orientation of the magnetic field probe 2000 in actual application scenarios.

[0088] The third output plate 122 and the fourth output plate 123 are both located within the second through-hole 126 and spaced apart from the wall of the second through-hole 126. The fourth output plate 123 is located to the right of the third output plate 122 and spaced apart from the third output plate 122. Specifically, the third output plate 122 is located within the first sub-through-hole 1261 and spaced apart from the wall of the first sub-through-hole 1261. The fourth output plate 123 is located within the second sub-through-hole 1262 and spaced apart from the wall of the second sub-through-hole 1262. It should be understood that the shapes of the third output plate 122 and the fourth output plate 123 are not limited to the circular shapes shown in the figure; they can also be square or other special shapes.

[0089] The first metal plate 130 is located on the top side of the second metal plate 120 and is spaced apart from the second metal plate 120. The first metal plate 130 is arranged opposite to the second metal plate 120. It should be noted that the "relative arrangement" mentioned in the description of the magnetic field probe 2000 in this application means that the orthographic projection of one on the other at least partially covers the other. For example, A and B are arranged opposite to each other, which means that the orthographic projection of A on B at least partially covers B, or that the orthographic projection of B on A at least partially covers A. The same descriptions in the following text can be understood in the same way. Exemplarily, the first metal plate 130 is arranged parallel to the second metal plate 120.

[0090] The first metal plate 130 includes a first main body plate 131, a first output plate 132, and a second output plate 133. The first main body plate 131 is provided with a first avoidance hole 134, a first notch 135, and a first through-hole 136. The first avoidance hole 134, the first notch 135, and the first through-hole 136 all penetrate the first main body plate 131 along the thickness direction of the first main body plate 131 (Z2 axis direction in the figure). The first avoidance hole 134 is arranged opposite to the second avoidance hole 124, and the first notch 135 is arranged opposite to the second notch 125. The first notch 135 is located on the front side of the first avoidance hole 134 and penetrates the hole wall surface of the first avoidance hole 134 and the front circumferential surface of the first main body plate 131. The first notch 135 is arranged opposite to the second notch 125. The first avoidance hole 134 can avoid the magnetic field, preventing the first main body plate 131 from affecting the magnetic field detection of the first resonant ring 140 and the second resonant ring 150. It should be understood that the shape of the first avoidance hole 134 is not limited to the square shape shown in the figure, and may also be circular or other special shapes.

[0091] The first through hole 136 is located behind the first avoidance hole 134 and is spaced apart from the first avoidance hole 134. Specifically, the first through hole 136 is located on the side of the first avoidance hole 134 facing away from the first notch 135. The first through hole 136 is positioned opposite the second through hole 126. It should be understood that the shape of the first through hole 136 is not limited to the square shape shown in the figure; it can also be circular or other special shapes.

[0092] The first output plate 132 and the second output plate 133 are both located within the first through-hole 136 and spaced apart from the wall of the first through-hole 136. Specifically, the second output plate 133 is located to the right of the first output plate 132 and spaced apart from the first output plate 132. The first output plate 132 is positioned opposite the third output plate 122, while the second output plate 133 is positioned opposite the fourth output plate 123. It should be understood that the shapes of the first and second output plates 132, 133 are not limited to the square shape shown in the figure; they can also be round or other special shapes.

[0093] In other embodiments, the first through-hole 136 may also include a third sub-through-hole and a fourth sub-through-hole, with the fourth sub-through-hole located to the right of the third sub-through-hole and spaced apart from the third sub-through-hole. The third sub-through-hole is disposed opposite the first sub-through-hole 1261, and the fourth sub-through-hole is disposed opposite the second sub-through-hole 1262. In this case, the first output plate 132 is located within the third sub-through-hole and spaced apart from the wall of the third sub-through-hole, while the second output plate 133 is located within the fourth sub-through-hole and spaced apart from the wall of the fourth sub-through-hole.

[0094] The first resonant ring 140 and the second resonant ring 150 are located between the second metal plate 120 and the first metal plate 130, and are spaced apart from both the second metal plate 120 and the first metal plate 130. Exemplarily, the first resonant ring 140 and the second resonant ring 150 are arranged parallel to the second metal plate 120 and the first metal plate 130. The first resonant ring 140 includes a first ring portion 141, a first grounding portion 142, and a first transmission portion 143. The first ring portion 141 is arranged opposite the second avoidance hole 124 and the first avoidance hole 134, and surrounds the second avoidance hole 124 and the first avoidance hole 134. The first grounding portion 142 and the first transmission portion 143 are both connected to one side of the first ring portion 141. Exemplarily, the first grounding portion 142 and the first transmission portion 143 are both connected to the rear side of the first ring portion 141. The first grounding portion 142, the first ring portion 141, and the first transmission portion 143 are connected in sequence. Illustratively, the first grounding portion 142 , the first ring portion 141 and the first transmission portion 143 are integrally formed.

[0095] The first grounding portion 142 includes a first grounding end 144, which is located at one end of the first grounding portion 142 away from the first ring portion 141. Along the X2-axis direction, the first grounding end 144 is located between the second avoidance hole 124 and the first sub-through hole 1261, and is spaced apart from both the second avoidance hole 124 and the first sub-through hole 1261. The first grounding end 144 is provided with a first grounding hole 145, which passes through the first grounding end 144 along the thickness direction of the first grounding end 144 (the Z2-axis direction in the figure). It should be understood that the shapes of the first grounding end 144 and the first grounding hole 145 are not limited to the circular shape shown in the figure, and can also be square or other special shapes.

[0096] The first transmission portion 143 is located to the right of the first grounding portion 142 and is spaced apart from the first grounding portion 142. The first transmission portion 143 includes a first output end 146, which is the end of the first transmission portion 143 away from the first ring portion 141 and is connected to the first ring portion 141. The first output end 146 is located opposite the third output plate 122 and the first output plate 132, and is electrically connected to the first output plate 132. Along the thickness direction of the first substrate 100, the first output end 146 is spaced apart from the first output plate 132, with a distance H1 between the first output end 146 and the first output plate 132. Furthermore, the first output end 146 is provided with a first output hole 147, which extends through the first output end 146 along the thickness direction (the Z2-axis direction in the figure). It should be understood that the shapes of the first output end 146 and the first output hole 147 are not limited to the circular shape shown in the figure, but may also be square or other special shapes.

[0097] Along the thickness direction of the first resonant ring 140 (the Z2-axis direction in the figure), the second resonant ring 150 is located on one side of the first resonant ring 140. That is, the second resonant ring 150 is located on the top side of the first resonant ring 140. In other words, the second resonant ring 150 is located between the first resonant ring 140 and the first metal plate 130. Specifically, the second resonant ring 150 is spaced apart from and opposite to the first resonant ring 140. The second resonant ring 150 includes a second ring portion 151, a second grounding portion 152, and a second transmission portion 153. The second ring portion 151 is arranged opposite to the first ring portion 141, the second avoidance hole 124, and the first avoidance hole 134, and is arranged around the second avoidance hole 124 and the first avoidance hole 134. The second grounding portion 152 and the second transmission portion 153 are both connected to the rear side of the second ring portion 151. The second grounding portion 152, the second ring portion 151, and the second transmission portion 153 are connected in sequence. Illustratively, the second grounding portion 152 , the second ring portion 151 and the second transmission portion 153 are integrally formed.

[0098] The second grounding portion 152 is located on the right side of the first transmission portion 143 and is spaced apart from the first transmission portion 143. The second grounding portion 152 includes a second grounding end 154, which is the end of the second grounding portion 152 away from the second ring portion 151. Along the X2 axis, the second grounding end 154 is located between the second avoidance hole 124 and the second sub-through hole 1262, and is spaced apart from the second avoidance hole 124 and the second sub-through hole 1262. Among them, the second grounding end 154 is provided with a second grounding hole 155, and the second grounding hole 155 passes through the second grounding end 154 along the thickness direction of the second grounding end 154 (Z2 axis direction in the figure). It should be understood that the shape of the second grounding end 154 and the second grounding hole 155 is not limited to the circle shown in the figure, and can also be square or other special shapes.

[0099] The second transmission portion 153 is located to the left of the second grounding portion 152 and is spaced apart from the second grounding portion 152. The second transmission portion 153 is disposed opposite the first transmission portion 143. The second transmission portion 153 includes a second output end 156. This is the end of the second transmission portion 153 away from the second ring portion 151 and is connected to the second ring portion 151. The second output end 156 is located opposite the fourth output plate 123 and the second output plate 133 and is electrically connected to the second output plate 133. Along the thickness direction of the first substrate 100, the second output end 156 is spaced apart from the second output plate 133, with a distance H5 between the second output end 156 and the second output plate 133. Furthermore, the second output end 156 is provided with a second output hole 157, which extends through the second output end 156 along the thickness direction (Z2-axis direction in the figure). It should be understood that the shapes of the second output end 156 and the second output hole 157 are not limited to the circular shape shown in the figure and can also be square or other special shapes.

[0100] The first grounding member 160 is disposed through the first grounding hole 145 of the first grounding end 144 and electrically connects the second main plate 121 of the second metal plate 120, the first grounding end 144 of the first resonant ring 140, and the first main plate 131 of the first metal plate 130 to achieve grounding of the first resonant ring 140. The first grounding member 160 is spaced apart from the first ring portion 141 of the first resonant ring 140, the first transmission portion 143 of the first resonant ring 140, and the second resonant ring 150.

[0101] The second grounding member 170 is disposed through the second grounding hole 155 of the second grounding end 154 and electrically connects the second main plate 121 of the second metal plate 120, the second grounding end of the second resonant ring 150, and the first main plate 131 of the first metal plate 130 to achieve grounding of the second resonant ring 150. The second grounding member 170 is spaced apart from the first grounding member 160, the second ring portion 151 of the second resonant ring 150, the second transmission portion 153 of the second resonant ring 150, and the first resonant ring 140.

[0102] The first output member 180 is disposed through the first output hole 147 of the first output end 146 and is electrically connected to the third output plate 122 of the second metal plate 120, the first output end 146 of the first resonant ring 140, and the first output plate 132 of the first metal plate 130. The first output member 180 is spaced apart from the first ring portion 141 of the first resonant ring 140, the first ground portion 142 of the first resonant ring 140, the second resonant ring 150, and the first ground member 160.

[0103] In this embodiment, first output member 180 includes a first output portion 181 and a first connecting portion 182. First output portion 181 is located between first output end 146 and first output plate 132, and is electrically connected therebetween. First connecting portion 182 is connected to one side of first output portion 181 and is located between first output end 146 and third output plate 122, and is connected therebetween. The length of first output portion 181 is h1, where h1 = H1.

[0104] The second output member 190 is disposed through the second output hole 157 of the second output end 156 and is electrically connected to the fourth output plate 123 of the second metal plate 120, the second output end 156 of the second resonant ring 150, and the second output plate 133 of the first metal plate 130. The second output member 190 is spaced apart from the first resonant ring 140, the second ring portion 151 of the second resonant ring 150, the second ground portion 152 of the second resonant ring 150, the second ground member 170, and the first output member 180.

[0105] In this embodiment, second output member 190 includes a second output portion 191 and a second connecting portion 192. Second output portion 191 is located between second output terminal 156 and second output plate 133 and electrically connected therebetween. Second connecting portion 192 is connected to one side of second output portion 191 and is located between second output terminal 156 and fourth output plate 123, connecting therebetween. The length of second output portion 191 is h2, where h2 = H5.

[0106] The first shielding member 100a is located between the second main plate 121 of the second metal plate 120 and the first main plate 131 of the first metal plate 130, and is electrically connected between the second main plate 121 and the first main plate 131. It is spaced apart from the first resonant ring 140, the second resonant ring 150, the first grounding member 160, the second grounding member 170, the first output member 180, and the second output member 190. In this embodiment, two first shielding members 100a are provided, located on opposite sides of the first transmission portion 143 and the second transmission portion 153, and spaced apart from the first transmission portion 143 and the second transmission portion 153. Each first shielding member 100a includes a plurality of first shielding posts 100b, which are spaced apart along the length of the first transmission portion 143 and the second transmission portion 153. The distance between two adjacent first shielding posts 100b is less than 1 / 20 of the wavelength corresponding to the operating frequency of the magnetic field probe 2000. Exemplarily, each first shielding member 100a includes two first shielding posts 100b. In other embodiments, the first shielding member 100a may not include multiple first shielding posts 100b. The first shielding member 100a may be a continuous metal wall. This application does not impose any specific restrictions on the structure of the first shielding member 100a.

[0107] It should be noted that the two first shielding parts 100a can not only shield the signals near the magnetic field probe 2000, preventing the nearby signals from interfering with the signal transmission on the first transmission part 143 and the second transmission part 153, but also prevent the signals transmitted on the first transmission part 143 and the second transmission part 153 from leaking from both sides, thereby reducing the loss of the signal transmitted on the first transmission part 143 and the second transmission part 153, and ensuring the reliability of the use of the magnetic field probe 2000.

[0108] It should be understood that the shapes of the first grounding member 160, the second grounding member 170, the first output member 180, the second output member 190 and the first shielding column 100b are not limited to the cylindrical shape shown in the figure, but can also be square columns or other columns. This application does not make specific restrictions on this.

[0109] See also Figure 3 、 Figure 5、 Figure 8 and Figure 9 , Figure 8 yes Figure 4 The structural diagram of the second substrate 200 in the magnetic field probe 2000 is shown. Figure 9 yes Figure 8 The partial structural diagram of the second substrate 200 is shown. Figure 8 and Figure 9 The second dielectric substrate 210 is not shown.

[0110] The second substrate 200 is located on a side of the second resonant ring 150 facing away from the first resonant ring 140 and is spaced apart from the second resonant ring 150. In this embodiment, the second substrate 200 is located on a side of the first metal plate 130 facing away from the second resonant ring 150 and is spaced apart from the first metal plate 130. The second substrate 200 includes a second dielectric substrate 210, a third metal plate 220, a fourth metal plate 230, a first conductive member 240, a second conductive member 250, a first transmission line segment 260, a second transmission line segment 270, a balun transmission structure 280, a first input member 290, a second input member 200d, a second shielding member 200e, and an isolating member 200f. The third metal plate 220, the fourth metal plate 230, the balun transmission structure 280, the first input member 290, the second input member 200d, the second shielding member 200e, and the isolating member 200f are all located within the second dielectric substrate 210. The fixing hole 200c passes through the second dielectric substrate 210, the third metal plate 220 and the fourth metal plate 230. It should be understood that the shape of the second substrate 200 is not limited to the long strip shown in the figure, and can also be circular or other special shapes.

[0111] Among them, the second substrate 200 can be a circuit board, and the third metal plate 220, the fourth metal plate 230, the first conductive component 240, the second conductive component 250, the first transmission line segment 260, the second transmission line segment 270, the balun transmission structure 280, the first input component 290, the second input component 200d, the second shielding component 200e and the isolation component 200f can all be metal structures inside the circuit board. For example, the third metal plate 220, the fourth metal plate 230, the first transmission line segment 260, the second transmission line segment 270 and the balun transmission structure 280 can all be metal layers inside the circuit board, and the first conductive component 240, the second conductive component 250, the first input component 290, the second input component 200d, the second shielding component 200e and the isolation component 200f can all be metal vias inside the circuit board, so as to simplify the process technology of the second substrate 200 and help reduce the preparation cost of the magnetic field probe 2000.

[0112] In this embodiment, the second dielectric substrate 210 includes three second sub-dielectric substrates, which are stacked sequentially along the thickness direction of the second substrate 200 (the X2 axis in the figure). In other embodiments, the second dielectric substrate 210 may include one, two, or more than four second sub-dielectric substrates. This application does not impose any specific limitations on the layer structure of the second dielectric substrate 210.

[0113] In this embodiment, the third metal plate 220 is arranged to intersect with the second metal plate 120, the first metal plate 130, the first resonant ring 140, and the second resonant ring 150. Exemplarily, the third metal plate 220 is perpendicular to the second metal plate 120, the first metal plate 130, the first resonant ring 140, and the second resonant ring 150. The third metal plate 220 includes a third main plate 221, a first input plate 222, and a second input plate 223. The third main plate 221 is provided with a third through-hole 226, which extends through the third main plate 221 along its thickness (the X2 axis in the figure). Specifically, the third through-hole 226 is located at the end of the third main plate 221 facing the first substrate 100 and extends through the end surface of the third main plate 221 facing the first substrate 100. It should be understood that the shape of the third through-hole 226 is not limited to the square shape shown in the figure; it can also be circular or other special shapes.

[0114] Both the first input plate 222 and the second input plate 223 are located within the third through-hole 226 and are spaced apart from the wall of the third through-hole 226. Specifically, the first input plate 222 is electrically connected to the first output plate 132. The second input plate 223 is located to the right of the first input plate 222, spaced apart from the first input plate 222, and electrically connected to the second output plate 133. It should be understood that the shapes of the first input plate 222 and the second input plate 223 are not limited to the square shape shown in the figure; they can also be round or other shapes.

[0115] In other embodiments, the third through-hole 226 may include a fifth sub-through-hole and a sixth sub-through-hole, with the sixth sub-through-hole located to the right of the fifth sub-through-hole and spaced apart from the third sub-through-hole. In this case, the first input plate 222 is located within the fifth sub-through-hole and spaced apart from the wall of the fifth sub-through-hole, and the second input plate 223 is located within the sixth sub-through-hole and spaced apart from the wall of the sixth sub-through-hole.

[0116] The fourth metal plate 230 is located in front of the third metal plate 220 and is spaced apart from the third metal plate 220. The fourth metal plate 230 is arranged opposite to the third metal plate 220. Exemplarily, the fourth metal plate 230 is arranged parallel to the third metal plate 220. In this embodiment, the fourth metal plate 230 includes a fourth main plate 231, a third input plate 232 and a fourth input plate 233. The fourth main plate 231 is provided with a sixth through hole 236, which passes through the fourth main plate 231 along the thickness direction of the fourth main plate 231 (the X2 axis direction in the figure). Specifically, the sixth through hole 236 is located at one end of the fourth main plate 231 facing the first substrate 100. The sixth through hole 236 is arranged opposite to the third through hole 226. Exemplarily, the sixth through hole 236 includes a seventh sub-through hole 2361 and an eighth sub-through hole 2362, with the eighth sub-through hole 2362 located to the right of the seventh sub-through hole 2361 and spaced apart from the seventh sub-through hole 2361. It should be understood that the shapes of the seventh sub-through hole 2361 and the eighth sub-through hole 2362 are not limited to the circular shapes shown in the figure; they may also be square or other shapes. In other embodiments, the sixth through hole 236 may not include the seventh sub-through hole 2361 and the eighth sub-through hole 2362, and the sixth through hole 236 may be a complete through hole. This application does not impose any specific limitations on this.

[0117] The third input plate 232 and the fourth input plate 233 are both located within the sixth through-hole 236 and spaced apart from the wall of the sixth through-hole 236. The third input plate 232 is positioned opposite the first input plate 222, while the fourth input plate 233 is located to the right of the third input plate 232, spaced apart from the third input plate 232, and opposite the second input plate 223. Specifically, the third input plate 232 is located within the seventh sub-through-hole 2361 and spaced apart from the wall of the seventh sub-through-hole 2361. The fourth input plate 233 is located within the eighth sub-through-hole 2362 and spaced apart from the wall of the eighth sub-through-hole 2362. It should be understood that the shapes of the third input plate 232 and the fourth input plate 233 are not limited to the circular shapes shown in the figure; they may also be square or other special shapes.

[0118] Please also refer to Figure 10 , Figure 10 yes Figure 4 A schematic diagram of the partial structure of the magnetic field probe 2000 is shown.

[0119] The first conductive member 240 and the second conductive member 250 are both located on the side of the third metal plate 220 facing away from the fourth metal plate 230. Specifically, the first conductive member 240 is located on the side of the first input plate 222 facing away from the third input plate 232 and is electrically connected to the first input plate 222 and the first output plate 132, thereby achieving electrical connection between the first input plate 222 and the first output plate 132. The surface of the first conductive member 240 facing the first input plate 222 is electrically connected to the first input plate 222, while the surface of the first conductive member 240 facing the first substrate 100 is electrically connected to the first output plate 132. In other words, the first output end 146 of the first resonant ring 140 is electrically connected to the first input plate 222 via the first output member 180, the first output plate 132, and the first conductive member 240.

[0120] The second conductive member 250 is located to the right of the first conductive member 240 and spaced apart from the first conductive member 240. Specifically, the second conductive member 250 is located on the side of the second input plate 223 facing away from the fourth input plate 233 and is electrically connected to the second input plate 223 and the second output plate 133, thereby establishing an electrical connection between the second input plate 223 and the second output plate 133. The surface of the second conductive member 250 facing the second input plate 223 is electrically connected to the second input plate 223, while the surface of the second conductive member 250 facing the first substrate 100 is electrically connected to the second output plate 133. In other words, the second output end 156 of the second resonant ring 150 is electrically connected to the second input plate 223 via the second output member 190, the second output plate 133, and the second conductive member 250.

[0121] Please also refer to Figure 11 , Figure 11 yes Figure 9 Schematic diagram of the planar structure of the second substrate 200 is shown.

[0122] The first transmission line segment 260, the second transmission line segment 270, and the balun transmission structure 280 are all located between the third metal plate 220 and the fourth metal plate 230, and are spaced apart from the third metal plate 220 and the fourth metal plate 230. Specifically, the first transmission line segment 260, the second transmission line segment 270, and the balun transmission structure 280 are all intersected with the first resonant ring 140 and the second resonant ring 150. Exemplarily, the first transmission line segment 260, the second transmission line segment 270, and the balun transmission structure 280 are all perpendicular to the first resonant ring 140 and the second resonant ring 150. The first transmission line segment 260 is electrically connected to the first resonant ring 140, and the second transmission line segment 270 is electrically connected to the second resonant ring 150.

[0123] The first transmission line segment 260 is electrically connected to the first transmission portion 143 of the first resonant ring 140. The first transmission line segment 260 includes a first transmission segment 261 and a first extension segment 262. The first transmission segment 261 includes a first input end 263, which is located at the end of the first transmission segment 261 facing the first substrate 100. The first input end 263 is located opposite the first input plate 222 and is electrically connected to the first input plate 222. Along the thickness direction of the second substrate 200, the first input end 263 is spaced apart from the first input plate 222. The distance between the first input end 263 and the first input plate 222 is H6, where H6 = H5. Furthermore, the first input end 263 is provided with a first input hole 264, which extends through the first input end 263 along the thickness direction (the X2 axis in the figure). It should be understood that the shapes of the first input end 263 and the first input hole 264 are not limited to the circular shape shown in the figure; they can also be square or other special shapes.

[0124] The first extension section 262 is connected to the end of the first transmission section 261 away from the first input end 263. Exemplarily, the first extension section 262 and the first transmission section 261 can be integrally formed. The first extension section 262 includes a first connection end 265, which is located at the end of the first extension section 262 away from the first transmission section 261 and is arranged opposite to the third main body plate 221. The first connection end 265 is provided with a first connection hole 266, which passes through the first connection end 265 along the thickness direction of the first connection end 265 (the X2 axis direction in the figure). It should be understood that the shape of the first connection end 265 is not limited to the square shown in the figure, but can also be round or other special shapes. Moreover, the shape of the first connection hole 266 is not limited to the round shown in the figure, but can also be square or other special shapes.

[0125] Along the thickness direction of the first transmission line segment 260 (the X2 axis in the figure), the second transmission line segment 270 is located on one side of the first transmission line segment 260 and is spaced apart from the first transmission line segment 260. Exemplarily, the second transmission line segment 270 is located in front of the first transmission line segment 260 and spaced apart from the first transmission line segment 260. It is electrically connected to the second transmission portion 153 of the second resonant ring 150. The second transmission line segment 270 includes a second transmission segment 271 and a second extension segment 272. Specifically, the second transmission line segment 270 is disposed opposite the first transmission segment 261. The second transmission segment 271 includes a second input end 273. The second input end 273 is located at the end of the second transmission segment 271 facing the first substrate 100, to the right of the first input end 263, and spaced apart from the first input end 263. The second input end 273 is disposed opposite the second input plate 223 and the fourth input plate 233, and is electrically connected to the second input plate 223. Along the thickness direction of the second substrate 200, the second input end 273 is spaced apart from the second input plate 223. The distance between the second input end 273 and the second input plate 223 is H2, where H2 = H1. Furthermore, the second input end 273 is provided with a second input hole 274, which extends through the second input end 273 along the thickness direction (the X2 axis in the figure). It should be understood that the shapes of the second input end 273 and the second input hole 274 are not limited to the circular shapes shown in the figure; they may also be square or other special shapes.

[0126] The second extension section 272 is connected to the end of the second transmission section 271 away from the second input end 273. The second extension section 272 is located to the left of the first extension section 262 and spaced apart from the first extension section 262. Exemplarily, the second extension section 272 and the second transmission section 271 may be integrally formed. The second extension section 272 includes a second connection end 275, which is located at the end of the second extension section 272 away from the second transmission section 271 and is disposed opposite the third main plate 221. The second connection end 275 is defined by a second connection hole 276 extending through the second connection end 275 along its thickness (in the X2-axis direction shown in the figure). It should be understood that the shape of the second connection end 275 is not limited to the square shape shown in the figure, but may also be circular or other special shapes. Furthermore, the shape of the second connection hole 276 is not limited to the circular shape shown in the figure, but may also be square or other special shapes.

[0127] The balun transmission structure 280 is located between the first extension section 262 and the second extension section 272, and is spaced apart from the first extension section 262 and the second extension section 272. The balun transmission structure 280 may be a Marchand balun. The first input member 290 is disposed through the first input hole 264 of the first input end 263 and electrically connects the first input plate 222 of the third metal plate 220, the first input end 263 of the first transmission line segment 260, and the third input plate 232 of the fourth metal plate 230. This enables electrical conduction between the first input plate 222 and the first transmission line segment 260, and further enables electrical conduction between the first resonant ring 140 and the first transmission line segment 260. Along the height direction of the magnetic field probe 2000, the distance between the first input member 290 and the surface of the first output plate 132 facing the first resonant ring 140 is H3.

[0128] In this embodiment, the first input member 290 includes a first input portion 291 and a third connecting portion 292. The first input portion 291 is located between the first input plate 222 and the first input end 263, and is electrically connected between the first input plate 222 and the first input end 263. The third connecting portion 292 is connected to one side of the first input portion 291 and is located between the first input end 263 and the third input plate 232, and is connected between the first input end 263 and the third input plate 232. The length of the first input portion 291 is h3, where h3 = H6.

[0129] The second input member 200d is disposed through the second input hole 274 of the second input end 273 and electrically connects the second input plate 223 of the third metal plate 220, the second input end 273 of the second transmission line segment 270, and the fourth input plate 233 of the fourth metal plate 230. This ensures electrical conduction between the second input plate 223 and the second transmission line segment 270, and thus between the second resonant ring 150 and the second transmission line segment 270. Specifically, the second input member 200d is located to the right of the first input member 290 and spaced apart from the first input member 290. Along the height of the magnetic field probe 2000, the distance between the second input member 200d and the surface of the second output plate 133 facing the second resonant ring 150 is H4, where H4 = H3. In other words, along the height of the magnetic field probe 2000, the second input member 200d is flush with the first input member 290.

[0130] In this embodiment, the second input member 200d includes a second input portion 201d and a fourth connecting portion 202d. The second input portion 201d is located between the second input plate 223 and the second input terminal 273 and is electrically connected between the second input plate 223 and the second input terminal 273. The third connecting portion 292 is connected to one side of the second input portion 201d and is located between the second input terminal 273 and the fourth input plate 233, connecting between the second input terminal 273 and the fourth input plate 233. The length of the second input portion 201d is h4, where h4 = H2.

[0131] The second shielding member 200e and the isolating member 200f are electrically connected between the third main plate 221 of the third metal plate 220 and the fourth main plate 231 of the fourth metal plate 230, and are spaced apart from the first transmission line segment 260, the second transmission line segment 270, the balun transmission structure 280, the first input member 290, and the second input member 200d. In this embodiment, two second shielding members 200e are provided, located on opposite sides of the first transmission line segment 260 and the second transmission line segment 270, and are spaced apart from the first transmission line segment 260 and the second transmission line segment 270. Each second shielding member 200e includes a plurality of second shielding posts 200g, which are spaced apart from each other. The distance between two adjacent second shielding posts 200g is less than 1 / 20 of the wavelength corresponding to the operating frequency of the magnetic field probe 2000. The multiple second shielding posts 200g of the two second shielding members 200e are connected to the edges of the third main plate 221 and the fourth main plate 231, and are arranged around the first transmission line segment 260 and the second transmission line segment 270. In other embodiments, the second shielding member 200e may not include the multiple second shielding posts 200g, and the second shielding member 200e may be a continuous metal wall. This application does not impose any specific restrictions on the structure of the second shielding member 200e.

[0132] It should be noted that the two second shielding members 200e can not only shield the signals near the magnetic field probe 2000, preventing the nearby signals from interfering with the signal transmission on the first transmission line segment 260 and the second transmission line segment 270, but also prevent the signals transmitted on the first transmission line segment 260 and the second transmission line segment 270 from leaking out from both sides, thereby reducing the signal loss transmitted on the first transmission line segment 260 and the second transmission line segment 270, and ensuring the reliability of the magnetic field probe 2000.

[0133] The isolation member 200f is located between the first transmission line segment 260 and the second transmission line segment 270, and is located on the inner side of the balun transmission structure 280, and is spaced apart from the second shielding member 200e. Exemplarily, the isolation member 200f includes a plurality of isolation columns 200h, which are arranged in a sequentially spaced manner along the length direction of the second substrate 200 (the Z2 axis direction in the figure). The distance between two adjacent isolation columns 200h is less than 1 / 20 of the wavelength corresponding to the operating frequency of the magnetic field probe 2000. In some other embodiments, the isolation member 200f may not include a plurality of isolation columns 200h, and the isolation member 200f may be a continuous metal wall. The present application does not impose any specific restrictions on the structure of the isolation member 200f.

[0134] It should be understood that the isolation member 200f can isolate the first transmission line segment 260 and the second transmission line segment 270, thereby preventing the signals transmitted on the first transmission line segment 260 and the second transmission line segment 270 from influencing each other, reducing the loss of the signal transmitted on the first transmission line segment 260 and the second transmission line segment 270, and ensuring the reliability of the magnetic field probe 2000.

[0135] It should be noted that in the magnetic field detection device, the signal input from the magnetic field probe 2000 to a signal analyzer such as a spectrum analyzer or vector network analyzer must be a single-ended signal so that the spectrum analyzer or vector network analyzer can analyze the signal. However, during the magnetic field detection process, the first resonant ring 140 and the second resonant ring 150 couple to generate a resonant signal, which is then output in a differential dual-ended form. That is, the first signal D+ output by the first resonant ring 140 and the second signal D- output by the second resonant ring 150 are differential signals. The balun transmission structure 280 can convert the differential signal output by the first resonant ring 140 and the second resonant ring 150 into a single-ended signal. That is, the balun transmission structure 280 can convert the differential signal into a signal input format that meets the signal analyzer's signal input format and then transmit it to the signal analyzer, thereby facilitating the signal analyzer's analysis of the magnetic field noise detected by the magnetic field probe 2000. The phase difference between the first signal D+ and the second signal D- is 180 degrees.

[0136] Please also refer to Figure 12 , Figure 12 yes Figure 10 A schematic diagram of the partial structure of the magnetic field probe 2000 is shown.

[0137] The first signal D+ output by the first resonant ring 140 sequentially passes through the first output terminal 146, the first output element 180, the first output plate 132, the first conductive element 240, the first input plate 222, and the first input element 290, and arrives at the first transmission line segment 260 from the first input terminal 263. The path length of the first signal D+ from the first output terminal 146 to the first output plate 132 is a third length Q3, where Q3 = h1 = H1. The path length of the first signal D+ from the first output plate 132 to the first input plate 222 is a seventh length Q7, where Q7 = H3. The path length of the first signal D+ from the first input plate 222 to the first input terminal 263 is a fifth length Q5 = h3 = H6.

[0138] The second signal D- output by the second resonant ring 150 passes sequentially through the second output terminal 156, the second output element 190, the second output plate 133, the second conductive element 250, the second input plate 223, and the second input element 200d, and arrives at the second transmission line segment 270 from the second input terminal 273. The path length of the second signal D- from the second output terminal 156 to the second output plate 133 is a sixth length Q6, where Q6 = h2 = H5. The path length of the second signal D- from the second output plate 133 to the second input plate 223 is an eighth length Q8, where Q8 = H4. The path length of the second signal D- from the second input plate 223 to the second input terminal 273 is a fourth length Q4, where Q4 = h4 = H2.

[0139] In this embodiment, the path length of the first signal D+ output by the first resonant ring 140 from the first output terminal 146 to the first transmission line segment 260 is a first length Q1, where Q1 = Q3 + Q7 + Q5 = H1 + H3 + H6. The path length of the second signal D+ output by the second resonant ring 150 from the second output terminal 156 to the second transmission line segment 270 is a second length Q2, where Q2 = Q6 + Q8 + Q4 = H5 + H4 + H2 = Q1.

[0140] It can be understood that the first signal D+ output by the first resonant ring 140 and the second signal D− output by the second resonant ring 150 are differential signals. Since the path length of the first signal D+ output by the first resonant ring 140 to reach the first transmission line segment 260 is the same as the path length of the second signal D+ output by the second resonant ring 150 to reach the first transmission line segment 260, after the first signal D+ reaches the first transmission line segment 260 and the second signal D− reaches the second transmission line segment 270, the phase difference between the signals transmitted on the first transmission line segment 260 and the second transmission line segment 270 can still be maintained at 180 degrees. The signals transmitted on the first transmission line segment 260 and the second transmission line segment 270 are still differential signals. The balun transmission structure 280 can convert the differential signal into a single-ended signal to facilitate the analysis of the magnetic field noise detected by the magnetic field probe 2000 by a signal analyzer such as a spectrum analyzer or a vector network analyzer.

[0141] In the magnetic field probe 2000 shown in the present application, the first resonant ring 140 and the second resonant ring 150 are designed to be perpendicular to the first transmission line segment 260 and the second transmission line segment 270. When the first resonant ring 140 and the second resonant ring 150 are placed parallel to the outer surface of the electronic device 1000, that is, when the first substrate 100 is parallel to the outer surface of the electronic device 1000 and the second substrate 200 is perpendicular to the outer surface of the electronic device 1000, the X2Y2 plane is parallel to the X1Y1 plane, and the Z2 axis direction is parallel to the Z1 axis direction. The first resonant ring 140 and the second resonant ring 150 in the magnetic field probe 2000 can be perpendicular to the → plane perpendicular to the electronic device 1000.

[0142] The magnetic field on the outer surface ( Figure 1 The first magnetic field B1 shown is coupled and resonates, thereby detecting the magnetic field perpendicular to the outer surface of the electronic device 1000. Therefore, the magnetic field probe 2000 can perform high-resolution positioning of the electromagnetic noise inside the electronic device 1000 to accurately locate the noise source inside the electronic device 1000. The magnetic field probe 2000 has a strong magnetic field detection capability and high noise resolution, so as to facilitate the subsequent targeted solution of the electromagnetic noise inside the electronic device 1000 and ensure the product yield of the electronic device 1000.

[0143] Furthermore, in the magnetic field probe 2000, by designing the distance between the first output end 146 of the first resonant ring 140 and the first output plate 132 to be equal to the distance between the second input end 273 of the second transmission line segment 270, and the distance between the first input end 263 of the first transmission line segment 260 to be equal to the distance between the second output end 156 of the second resonant ring 150 and the second output plate 133, a phase difference between the signal output by the first resonant ring 140 reaching the first transmission line segment 260 and the signal output by the second resonant ring 150 reaching the second transmission line segment 270 is compensated. This ensures that the signals transmitted on the first transmission line segment 260 and the second transmission line segment 270 are differential signals, thereby ensuring that the balun transmission structure 280 can convert the differential signal into a single-ended signal, thereby facilitating analysis of the magnetic field noise detected by the magnetic field probe 2000 by a signal analyzer such as a spectrum analyzer or a vector network analyzer.

[0144] Furthermore, compared with traditional magnetic field probes, when using the magnetic field probe 2000 shown in the present application to detect magnetic field noise, the magnetic field probe 2000 shown in the present application is in a resonant mode within the working frequency band, and the differential signal is converted into a radio frequency signal through the balun transmission structure 280. The magnetic field probe 2000 can be well matched with the impedance of the adapter cable or specific adapter equipment, and the reflected power is small; the magnetic field probe 2000 does not use related resistors, capacitors, and inductors for tuning, that is, the magnetic field probe 2000 can adjust the working frequency by changing its own size, so the magnetic field probe 2000 has a small loss of coupled signal energy; in the equivalent magnetic field probe 2000, the first substrate 100 is 1 port, and the radio frequency end 200a of the second substrate 200 is 2 ports. The S21 of the magnetic field probe 2000 is large, and the magnetic field probe 2000 can achieve low-level detection of noise signals. When the noise signal amplitude (i.e., the incident power of the magnetic field probe) is small, due to the low test lower limit of signal analyzers such as spectrum analyzers or vector network analyzers, the noise signal power received by the traditional magnetic field probe will be less than the test lower limit of the signal analyzer, resulting in the signal analyzer being unable to analyze the magnetic field noise. The traditional magnetic field probe cannot detect noise signals with low radiation levels. The magnetic field probe 2000 shown in this application can receive more noise signals, and the noise signal power received by the magnetic field probe 2000 is higher. The signal analyzer can analyze the magnetic field noise, that is, the magnetic field probe 2000 shown in this application can effectively detect noise signals with low radiation levels.

[0145] Furthermore, the size of the magnetic field probe 2000 shown in this application is much smaller than the wavelength corresponding to the operating frequency of the magnetic field probe 2000. Therefore, the magnetic field probe 2000 shown in this application can detect more points of noise information within a wavelength of the operating frequency, and the resolution of the magnetic field probe 2000 can be close to 1 / 50. For example, when the operating frequency of the magnetic field probe 2000 is 1.26 GHz, the corresponding wavelength is 238 mm. At this time, the maximum dimension of the magnetic field probe 2000 is only 5 mm. When the area where the electromagnetic noise source is located is small, due to the small size of the magnetic field probe 2000 shown in this application, the smaller the area that the magnetic field probe 2000 can locate, the closer it can be to the area where the noise source is located. Therefore, the magnetic field probe 2000 shown in this application can achieve high-precision detection of magnetic field noise.

[0146] It should be noted that in the magnetic field probe 2000 shown in the present application, the operating frequency of the magnetic field probe 2000 can be adjusted by adjusting the resonant frequency of the first resonant ring 140 and the second resonant ring 150, the width of the first transmission line segment 260 and the second transmission line segment 270, and the size of the balun transmission structure 280, so as to design a high-precision and high-resolution magnetic field probe 2000 at different operating frequencies to cover the operating frequency band required for near-field scanning.

[0147] The above description is only a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by any person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application; the embodiments of this application and the features of the embodiments can be combined with each other unless there is a conflict. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A magnetic field probe, characterized in that: The invention comprises a first resonant ring, a second resonant ring, a first transmission line segment, and a second transmission line segment, wherein the first resonant ring comprises a first ring portion, and along the thickness direction of the first resonant ring, the second resonant ring is located on one side of the first resonant ring and is spaced apart from the first resonant ring, and the second resonant ring comprises a second ring portion, and the second ring portion is arranged opposite to the first ring portion; The first transmission line segment and the second transmission line segment are both located on a side of the second resonant ring away from the first resonant ring. The first transmission line segment is arranged to intersect with the first resonant ring and is electrically connected to the first resonant ring. Along the thickness direction of the first transmission line segment, the second transmission line segment is located on one side of the first transmission line segment and is spaced apart from the first transmission line segment. The second transmission line segment is arranged to intersect with the second resonant ring and is electrically connected to the second resonant ring.

2. The magnetic field probe according to claim 1, characterized in that The first transmission line segment and the first resonant ring are perpendicular to each other, and the second transmission line segment and the second resonant ring are perpendicular to each other.

3. The magnetic field probe according to claim 1 or 2, characterized in that The magnetic field probe also includes a balun transmission structure, which is located on a side of the second resonant ring away from the first resonant ring, between the first transmission line segment and the second transmission line segment, and spaced apart from both the first transmission line segment and the second transmission line segment.

4. The magnetic field probe according to any one of claims 1 to 3, characterized in that The path length for transmitting the first signal output by the first resonant ring to the first transmission line segment is a first length, and the path length for transmitting the second signal output by the second resonant ring to the second transmission line segment is a second length, which is equal to the first length.

5. The magnetic field probe according to claim 4, characterized in that The first resonant ring includes a first output end connected to the first ring portion, the second resonant ring includes a second output end connected to the second ring portion, the first transmission line segment includes a first input end facing the first resonant ring, and the second transmission line segment includes a second input end facing the second resonant ring; The magnetic field probe further includes a first output plate, a second output plate, a first input plate, and a second input plate; The first output plate and the second output plate are both located on a side of the second resonant ring away from the first resonant ring, and are spaced apart from the second resonant ring. The first output plate is electrically connected to the first output end. The second output plate is located on one side of the first output plate, spaced apart from the first output plate, and is electrically connected to the second output end. The first input board and the second input board are both located on a side of the first transmission line segment facing away from the second transmission line segment, and are both spaced apart from the first transmission line segment. The first input board is electrically connected to the first output board and the first input end. The second input board is located on one side of the first input board, is spaced apart from the first input board, and is electrically connected to the second output board and the second input end. wherein the path length of the first signal transmitted from the first output terminal to the first output board is a third length, and the path length of the second signal transmitted from the second input board to the second input terminal is a fourth length, and the fourth length is equal to the third length; The path length of the first signal transmitted from the first input board to the first input terminal is a fifth length, and the path length of the second signal transmitted from the second output terminal to the second output board is a sixth length, and the sixth length is equal to the fifth length; The path length of the first signal transmitted from the first output board to the first input board is the seventh length, and the path length of the second signal transmitted from the second output board to the second input board is the eighth length, which is equal to the seventh length.

6. The magnetic field probe according to claim 5, characterized in that The first output plate is spaced apart from and opposite to the first output end, and the second output plate is spaced apart from and opposite to the second output end; The magnetic field probe further includes a first output portion and a second output portion, wherein the first output portion is electrically connected between the first output plate and the first output end, and the second output portion is electrically connected between the second output plate and the second output end; The length of the first output portion is the third length, and the length of the second output portion is the sixth length.

7. The magnetic field probe according to claim 6, characterized in that The first input plate is spaced apart from and opposite to the first input end, and the second input plate is spaced apart from and opposite to the second input end; The magnetic field probe further includes a first input portion and a second input portion, wherein the first input portion is electrically connected between the first input plate and the first input end, and the second input portion is electrically connected between the second input plate and the second input end; The length of the first input portion is the fifth length, and the length of the second input portion is the fourth length.

8. The magnetic field probe according to claim 7, characterized in that The first input plate is spaced apart from the first output plate, and the second input plate is spaced apart from the second output plate; The magnetic field probe further includes a first conductive member and a second conductive member, the first conductive member being located on a side of the first input board away from the first input end and electrically connecting the first input board and the first output board, the second conductive member being located on a side of the second input board away from the second input end and electrically connecting the second input board and the second input end, and being spaced apart from the first conductive member; The distance between the first input portion and the surface of the first output plate facing the first output end is the seventh length, and the distance between the second input portion and the surface of the second output plate facing the second output end is the eighth length.

9. The magnetic field probe according to any one of claims 1 to 8, characterized in that The first resonant ring further includes a first transmission portion, which is connected to one side of the first ring portion and is electrically connected to the first transmission line segment; The second resonant ring further includes a second transmission portion, which is connected to one side of the second ring portion, is arranged opposite to the first transmission portion, and is electrically connected to the second transmission line segment; The magnetic field probe further includes two first shielding members, which are respectively located on opposite sides of the first transmission portion and the second transmission portion, and are spaced apart from the first transmission portion and the second transmission portion.

10. The magnetic field probe according to any one of claims 1 to 9, characterized in that The magnetic field probe further includes two second shielding members, which are respectively located on opposite sides of the first transmission line segment and the second transmission line segment and are spaced apart from the first transmission line segment and the second transmission line segment.

11. The magnetic field probe according to any one of claims 1 to 10, characterized in that The magnetic field probe further includes a first main body plate and a second main body plate; The first main body plate is located on a side of the second resonant ring facing away from the first resonant ring and is spaced apart from the second resonant ring. The first main body plate is provided with a first avoidance hole and a first notch. Both the first avoidance hole and the first notch penetrate the first main body plate along the thickness direction of the first main body plate. The first avoidance hole is arranged opposite to the second ring portion, and the first notch penetrates the hole wall surface of the first avoidance hole and the circumferential surface of the first main body plate. The second main body plate is located on a side of the first resonant ring away from the second resonant ring, and is spaced apart from the first resonant ring. The second main body plate is provided with a second avoidance hole and a second notch. Both the second avoidance hole and the second notch penetrate the second main body plate along the thickness direction of the second main body plate. The second avoidance hole is arranged opposite to the second ring portion, and the second notch penetrates the hole wall surface of the second avoidance hole and the circumferential surface of the second main body plate.

12. The magnetic field probe according to any one of claims 1 to 11, characterized in that The magnetic field probe also includes a third main body plate and a fourth main body plate. The third main body plate is located on a side of the second transmission line segment facing away from the first transmission line segment and is spaced apart from the second transmission line segment. The fourth main body plate is located on a side of the first transmission line segment facing away from the second transmission line segment and is spaced apart from the first transmission line segment.

13. The magnetic field probe according to any one of claims 1 to 12, characterized in that The magnetic field probe includes a first substrate, which includes a first dielectric substrate, a first resonant ring, and a second resonant ring. The first resonant ring and the second resonant ring are both located inside the first dielectric substrate, wherein the first substrate is a circuit board.

14. The magnetic field probe according to any one of claims 1 to 13, characterized in that The magnetic field probe includes a second substrate, which includes a second dielectric substrate, the first transmission line segment, and the second transmission line segment. The first transmission line segment and the second transmission line segment are both located inside the second dielectric substrate, wherein the second substrate is a circuit board.

15. The magnetic field probe according to claim 14, characterized in that The second substrate is provided with a fixing hole, and the fixing hole penetrates the second substrate along the thickness of the second substrate.

16. A magnetic field detection device, characterized in that: The method comprises the magnetic field probe and a signal analyzer according to any one of claims 1 to 15, wherein the signal analyzer is electrically connected to the magnetic field probe.

17. The magnetic field detection device according to claim 16, characterized in that: The signal analyzer is a spectrum analyzer or a vector network analyzer.

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