Semiconductor structure, semiconductor packaging structure and optical computing device

Abstract

The embodiment of the invention provides a semiconductor structure, a semiconductor packaging structure and optical computing equipment, and the semiconductor structure comprises a bearing structure which is provided with a first limiting structure on the upper surface; the photonic integrated circuit chip is fixed on the bearing structure, and an optical coupling area is formed at the edge position of one side of the photonic integrated circuit chip; the optical fiber array comprises optical fibers and an optical fiber base used for fixing the optical fibers, a second limiting structure is arranged on the lower surface of the optical fiber base, the first limiting structure and the second limiting structure are used for achieving pluggable connection, and orthographic projections of the optical fibers and the second limiting structure on the lower surface of the optical fiber base have overlapped parts; the lens array comprises lenses, and the lenses are configured to converge light emitted by the optical coupling area into the optical fibers and / or converge light emitted by the optical fibers into the optical coupling area when the optical fiber array is connected to the bearing structure in a pluggable mode. According to the technical scheme provided by the embodiment of the invention, the packaging yield is improved through plugging of the optical fiber array.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a semiconductor structure, a semiconductor packaging structure, and an optical computing device. Background Art

[0002] In applications such as optical communications in data centers and optical interconnection in computing systems, co-packaged optics (CPO) has become a hot research area and product development direction. Its technical solution is to co-package optical engines (OEs) and application-specific integrated circuits (ASICs) on the same packaging substrate to minimize circuit losses between the ASIC chip and the optical engine, thereby improving signal integrity and reducing power consumption.

[0003] Products utilizing CPO technology often involve reflow soldering of ASIC chips and optical engines. Currently, one end of a fiber array (FA) is permanently glued to the optical engine, while the other end is connected to a fiber connector, such as a mechanical transfer (MT) ferrule-based optical connector. When reflow soldering the ASIC chip and optical engine to the package substrate, the reflow soldering temperature is high (typically around 260 degrees Celsius), which neither the fiber array nor the optical connector at the other end can withstand. Furthermore, the optical engine with a pigtail at one end presents challenges during reflow soldering.

[0004] It can be seen that the existing packaging method has the problem of low yield rate. Summary of the Invention

[0005] In view of the above problems, the present application is proposed to provide a semiconductor structure, a semiconductor packaging structure and an optical computing device that solve the above problems or at least partially solve the above problems.

[0006] Therefore, in one embodiment of the present application, a semiconductor structure is provided, comprising:

[0007] A bearing structure, wherein the upper surface of the bearing structure is provided with a first limiting structure;

[0008] A photonic integrated circuit chip fixed to the supporting structure, wherein an optical coupling region is formed at an edge position of one side of the photonic integrated circuit chip;

[0009] An optical fiber array comprising a plurality of optical fibers and an optical fiber base for securing the optical fibers, wherein a second limiting structure for use with the first limiting structure is provided on the lower surface of the optical fiber base, wherein one of the first limiting structure and the second limiting structure is a protrusion and the other is a groove, and the first limiting structure and the second limiting structure are used to achieve a pluggable connection between the optical fiber array and the supporting structure, and the optical fibers and the second limiting structure have overlapping orthographic projections on the lower surface of the optical fiber base;

[0010] One or more lens arrays, each lens array comprising lenses configured to converge light emitted through the optical coupling region into the optical fiber and / or converge light emitted from the optical fiber into the optical coupling region when the optical fiber array is pluggable and connected to the supporting structure.

[0011] In another embodiment of the present application, a semiconductor packaging structure is provided, comprising: a packaging substrate, a second electronic integrated circuit chip and the semiconductor structure described above; the second electronic integrated circuit chip and the semiconductor structure are fixed on the packaging substrate, and the electronic integrated circuit chip and the semiconductor structure are electrically connected through wiring on the packaging substrate.

[0012] In yet another embodiment of the present application, an optical computing device is provided, comprising: the above-mentioned semiconductor packaging structure.

[0013] In the technical solution provided in the embodiment of the present application, a supporting structure is used to achieve pluggability between the optical fiber array and the photonic integrated circuit chip. In this way, the combination of the photonic integrated circuit chip and the supporting structure can be reflow-soldered onto the packaging substrate first, and then the optical fiber array can be positioned on the supporting structure in a pluggable manner. In this way, not only can the high temperature during reflow soldering be prevented from damaging the coating layer of the optical fiber array, but the influence of the optical fiber array's pigtail on welding can also be avoided, thereby improving the packaging yield and reducing the packaging difficulty. In addition, the pluggability between the optical fiber array and the supporting structure can be achieved by the protrusion structure and groove structure located below the optical fiber, which has the advantages of small size and simple process. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0015] Figure 1A schematic structural diagram of a semiconductor structure provided in one embodiment of the present application when the optical fiber array is not pluggably connected to the supporting structure;

[0016] Figure 2 A schematic structural diagram of a semiconductor structure provided by an embodiment of the present application when an optical fiber array is pluggably connected to a supporting structure;

[0017] Figure 3 A cross-sectional view of a semiconductor structure provided by an embodiment of the present application when an optical fiber array is pluggably connected to a supporting structure;

[0018] Figure 4 A schematic structural diagram of a semiconductor structure provided by another embodiment of the present application when the optical fiber array is not pluggably connected to the supporting structure;

[0019] Figure 5 A first packaging schematic diagram provided in an embodiment of the present application;

[0020] Figure 6 A second packaging schematic diagram provided in an embodiment of the present application;

[0021] Figure 7 A third packaging schematic diagram provided in an embodiment of the present application. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below based on the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0023] In addition, some of the processes described in the specification, claims and the above-mentioned figures of this application include multiple operations that appear in a specific order. These operations may not be executed in the order in which they appear in this document or may be executed in parallel. The serial numbers of the operations, such as 201, 202, etc., are only used to distinguish between different operations, and the serial numbers themselves do not represent any order of execution. In addition, these processes may include more or fewer operations, and these operations may be executed in sequence or in parallel. It should be noted that the descriptions of "first", "second", etc. in this document are used to distinguish different messages, devices, modules, etc., and do not represent the order of precedence, nor do they limit "first" and "second" to be different types.

[0024] First, the terms used in the embodiments of the present application are explained. It is understood that this explanation is for a clearer understanding of the embodiments of the present application and does not necessarily constitute a limitation on the embodiments of the present application.

[0025] A photonic integrated circuit (PIC) chip uses photons to process and transmit information. It includes one or more optical devices.

[0026] Optical devices refer to devices that can process, manipulate, transmit and / or detect optical signals, such as waveguides, couplers, modulators, detectors, etc. Optical devices include active optical devices and passive optical devices.

[0027] Edge couplers refer to couplers located at the edge of a photonic chip. The advantages of end-face couplers are high coupling efficiency and large operating bandwidth.

[0028] The following will be combined Figure 1-Figure 4 The semiconductor structure provided in the embodiments of the present application is introduced in detail. Figure 1 This is a schematic structural diagram of a semiconductor structure provided by an embodiment of the present application when the optical fiber array is not pluggably connected to the supporting structure. Figure 2 This is a schematic structural diagram of a semiconductor structure provided by an embodiment of the present application when an optical fiber array is pluggably connected to a supporting structure. Figure 3 A cross-sectional view of a semiconductor structure provided by an embodiment of the present application when an optical fiber array is pluggably connected to a supporting structure. Figure 4 A schematic structural diagram of a semiconductor structure provided in yet another embodiment of the present application when the optical fiber array is not pluggably connected to the supporting structure.

[0029] like Figure 1 、 Figure 2 、 Figure 3 and Figure 4As shown, the semiconductor structure 1 may include: a supporting structure 11, wherein the upper surface of the supporting structure 11 is provided with a first limiting structure 111; a photonic integrated circuit chip 12 fixed to the supporting structure 11, wherein an optical coupling region (not shown) is formed at an edge position on one side of the photonic integrated circuit chip 12; an optical fiber array 13, wherein the optical fiber array 13 includes a plurality of optical fibers 131 and an optical fiber base 132 for fixing the optical fibers 131, wherein the lower surface 133 of the optical fiber base 132 is provided with a second limiting structure 134 used in conjunction with the first limiting structure 111, and the first limiting structure 111 and the second limiting structure 134 are provided. 4 is a protrusion and the other is a groove, the first limiting structure 111 and the second limiting structure 134 are used to realize the pluggable connection between the optical fiber array 13 and the supporting structure 11, and the optical fiber 131 and the second limiting structure 134 have an overlapping part in the positive projection of the lower surface 133 of the optical fiber base 132; one or more optical lenses 14, the one or more optical lenses 14 are configured to converge the light emitted through the optical coupling area into the optical fiber 131 and / or converge the light emitted by the optical fiber 131 into the optical coupling area when the optical fiber array 13 is pluggable and connected to the supporting structure 11.

[0030] In some embodiments, the supporting structure 11 is a rigid structure, wherein the material of the supporting structure 11 may include but is not limited to glass, silicon, metal or ceramic.

[0031] In some embodiments, the photonic integrated circuit chip 12 may include a silicon photonic integrated circuit chip. The photonic integrated circuit chip 12 includes a first surface and a second surface disposed opposite each other, and a side surface connecting the first and second surfaces. The side surface of the photonic integrated circuit chip 12 is the cut surface of the photonic integrated circuit chip 12 when it is cut from the wafer. This cut surface may also be referred to as an edge.

[0032] In some embodiments, the photonic integrated circuit chip 12 may include an edge coupler disposed at an edge position on one side of the photonic integrated circuit chip. The area on the first surface of the photonic integrated circuit chip 12 near the side where the edge coupler is located is also known as an optical coupling region. The number of edge couplers may be multiple, meaning that multiple optical coupling regions are formed on the photonic integrated circuit chip 12. The multiple optical coupling regions may be arranged in an array at the edge position on one side of the photonic integrated circuit chip 12. The array may be a one-dimensional or multi-dimensional array.

[0033] In some embodiments, the number of the above-mentioned optical fibers 131 is multiple. The optical fiber array can be composed of multiple optical fibers arranged in one dimension or two dimensions, and each optical fiber can independently transmit optical signals. The working principle of the optical fiber array is mainly based on the total reflection principle of light and the waveguide principle. When light propagates inside the optical fiber, due to the refractive index distribution characteristics of the optical fiber, the light can be totally reflected inside the optical fiber, thereby realizing long-distance transmission of light. The optical fiber array realizes the parallel transmission of multiple optical signals by arranging multiple optical fibers side by side, greatly improving the transmission efficiency of optical communication. In other words, multiple optical fibers in the optical fiber array are arranged in an array form, and the array can be a one-dimensional or multi-dimensional array.

[0034] like Figure 1 As shown, the fiber optic base 132 may include an optical end face 200, wherein the optical end face 200 refers to the end face of the optical fiber array where light is emitted / input. The optical end face 200 of the fiber optic base 132 is formed by polishing the exposed ends of the optical fibers 131 to achieve low-loss optical coupling. In other words, the end faces of the optical fibers 131 (the end faces where light is injected / output) are disposed on the optical end face 200 of the fiber optic base 132. In some embodiments, the end faces of multiple optical fibers 131 are distributed on the optical end face 200 of the fiber optic base 132 in the form of an array (a one-dimensional array or a two-dimensional array).

[0035] In some embodiments, the number of optical coupling regions is consistent with the number of optical fibers in the optical fiber array, and the arrangement of the multiple optical coupling regions at the edge position on one side of the photonic integrated circuit chip 12 is consistent with the arrangement of the multiple optical fibers in the optical fiber array (that is, the arrangement of the end faces of the multiple optical fibers 131 on the optical end face 200 of the optical fiber base 132).

[0036] The first limiting structure 111 and the second limiting structure 134 are not only used to realize the pluggable connection between the optical fiber array and the supporting structure, but also used to realize the alignment and positioning of the optical fiber array on the supporting structure.

[0037] The projections and grooves fit tightly together to achieve pluggability. In an alternative embodiment, the projections and grooves are arranged perpendicular to the lower surface of the fiber optic base 132 to achieve pluggability. In other words, the projections and grooves can be plugged in and out of the fiber optic base 132 in a direction perpendicular to the lower surface of the fiber optic base 132.

[0038] For example, Figure 1 As shown, the first limiting structure 111 is a protrusion, and the second limiting structure 134 is a groove. Figure 4 As shown, the first limiting structure 111 is a groove, and the second limiting structure 134 is a protrusion.

[0039] In some embodiments, the optical fiber 131 is clamped in the optical fiber base 132, the second limiting structure 134 is located on the lower surface of the optical fiber base 132, and there is an overlapping part in the orthographic projection of the optical fiber 131 and the second limiting structure 134 on the lower surface of the optical fiber base 132, that is, the second limiting structure 134 is located below the optical fiber 131. Exemplarily, the second limiting structure 134 may be located directly below the optical fiber 131.

[0040] In some embodiments, as Figure 1 As shown, the optical fiber base 132 may include: a substrate 132b and a cover plate 132a, and the optical fiber 131 is clamped between the substrate 132b and the cover plate 132a. In practical applications, the second limiting structure 134 may be set on the substrate or the cover plate in the optical fiber base 132, and this embodiment of the application does not specifically limit this. Figure 1 As shown, the second limiting structure 134 is provided on the substrate 132b. Optionally, the cover plate may be a glass cover plate.

[0041] like Figure 1 and Figure 3 As shown, one or more lens arrays 14 include lenses, which are fixed on the optical signal propagation path 300 between the optical coupling region and the optical fiber 131 when the optical fiber array 13 is pluggable connected to the supporting structure 11. The lens is configured to converge the light emitted through the optical coupling region into the optical fiber and / or converge the light emitted from the optical fiber into the optical coupling region when the optical fiber array is pluggable connected to the supporting structure.

[0042] In some optional embodiments, such as Figure 3 As shown, the above-mentioned semiconductor array includes a lens array, which is fixed at the edge position of one side of the photonic integrated circuit chip 12. The lenses in the lens array are located on the optical signal propagation path 300 between the optical coupling area and the optical fiber 131 when the optical fiber array 13 is pluggable and connected to the supporting structure 11.

[0043] In other optional embodiments, such as Figure 3 As shown, the above-mentioned semiconductor array includes a lens array, which is fixed on the optical end face 200 of the optical fiber base 132. The lenses in the lens array are located on the optical signal propagation path 300 between the optical coupling area and the optical fiber 131 when the optical fiber array 13 is pluggable and connected to the supporting structure 11.

[0044] In some other optional embodiments, Figure 1As shown, the semiconductor array includes two lens arrays 14, namely a first lens array 14a and a second lens array 14b. The first lens array is fixed (e.g., by gluing) to an edge of one side of the optical coupling region of the photonic integrated circuit chip 12, and the second lens array is fixed (e.g., by gluing) to the optical end face 200 of the optical fiber base 132. The lenses in the first lens array 14a and the second lens array 14b are both located on the optical signal propagation path 300 between the optical coupling region and the optical fiber 131 when the optical fiber array 13 is pluggable connected to the supporting structure 11. The lenses in the first lens array 14a and the second lens array 14b are configured to converge light emitted from the optical coupling region into the optical fiber 131 and / or converge light emitted from the optical fiber 131 into the optical coupling region when the optical fiber array 13 is pluggable connected to the supporting structure 11. Exemplarily, the lenses in the first lens array 14a are configured to converge the light emitted by the photonic integrated circuit chip 12 through the optical coupling region into a collimated light beam, and the lenses in the second lens array 14b are configured to converge the collimated light beam to the optical fiber 131. Exemplarily, the lenses in the second lens array 14b are configured to converge the light emitted by the optical fiber 131 into a collimated light beam, and the lenses in the first lens array 14a are configured to converge the collimated light beam to the optical coupling region. A collimated light beam refers to a light beam in which the angle between any two light rays is less than or equal to a preset threshold. The preset threshold can be determined by a collimation standard recognized in the field.

[0045] It should be noted that there are multiple optical coupling regions, multiple optical fibers 131, and the lens array 14 includes multiple lenses arranged in an array. The arrangement of the multiple lenses is consistent with the arrangement of the multiple optical coupling regions and the arrangement of the multiple optical fibers 131. The multiple optical coupling regions correspond one-to-one with the multiple optical fibers 131, the multiple lenses in the lens array 14 correspond one-to-one with the multiple optical coupling regions, and the multiple lenses in the lens array 14 correspond one-to-one with the multiple optical fibers.

[0046] In the technical solution provided in the embodiments of this application, a carrier structure is used to achieve pluggability between the optical fiber array and the photonic integrated circuit chip. This allows the combination of the photonic integrated circuit chip and the carrier structure to be reflow-soldered onto the packaging substrate, and then the optical fiber array can be positioned on the carrier structure in a pluggable manner. This prevents high temperatures during reflow soldering from damaging the fiber array's coating, thereby improving the package yield rate. Furthermore, the pluggability between the optical fiber array and the carrier structure is achieved through the protrusions and grooves located below the optical fibers, offering advantages such as a small size and simple process.

[0047] In some embodiments, there are multiple optical coupling regions, and the multiple optical coupling regions are arranged in the form of an array at the edge position of one side of the photonic integrated circuit chip, and the array includes a first arrangement direction. It should be noted that the multiple optical coupling regions can be arranged in the form of a one-dimensional array or in the form of a two-dimensional array. When the multiple optical coupling regions are arranged in the form of a one-dimensional array, the one-dimensional array only includes one arrangement direction, and the arrangement direction can be directly determined as the first arrangement direction. When the multiple optical coupling regions are arranged in the form of a two-dimensional array, the two-dimensional array includes two arrangement directions, namely, a row direction and a column direction. Any one of the row direction and the column direction can be selected as the first arrangement direction, and the embodiments of the present application do not specifically limit this.

[0048] Whether the optical fiber array can be accurately positioned directly affects the optical coupling efficiency. Therefore, in practical applications, it is necessary to ensure that the dimensional error between the groove and the protrusion is within a reasonable range. In some embodiments, Figure 4 As shown, when the optical fiber array 13 is pluggably connected to the supporting structure 11, the dimensional error between the groove and the protrusion along the above-mentioned first arrangement direction is less than or equal to 10 microns, and / or the dimensional error between the groove and the protrusion along the second direction is less than or equal to 10 microns; wherein the second direction is perpendicular to the first arrangement direction and perpendicular to the lower surface of the optical fiber base.

[0049] In practical applications, such as Figure 1 and Figure 4 As shown, when the optical fiber array 13 is fixed to the supporting structure 11, the protrusion can be exactly embedded in the groove. In order to achieve precise positioning in the x, y, and z directions, the dimensional tolerances of the protrusions and grooves must be strictly controlled so that the repeatability of the insertion and removal positioning of the optical fiber array on the adapter plate is about 5 microns. The dimensional tolerances of the protrusions and grooves are related to the lens and optical path design. The size of the spot size can be determined by the optical path design and the curvature radius, thickness, and material of the lens. The larger the spot size, the larger the translation tolerance along the x and y directions can be, but the smaller the angular tolerance. Conversely, the smaller the spot size, the smaller the translation tolerance along the x and z directions needs to be, but the larger the angular tolerance. The two need to reach a balance. In theory, the optical fiber array is placed horizontally on the supporting structure, but there will be errors in the alignment process, resulting in upward or downward tilting, with a certain angular error (i.e., angular tolerance). Among them, the y direction is the direction perpendicular to the optical end face of the fiber optic base, the z direction is perpendicular to the lower surface of the fiber optic base, the optical end face of the fiber optic base and the lower surface of the fiber optic base are perpendicular, and the x direction is parallel to the optical end face of the fiber optic base and the lower surface of the fiber optic base.

[0050] Optionally, the dimensional error between the grooves and the protrusions along the first arrangement direction is between 1 and 10 microns, and / or the dimensional error between the grooves and the protrusions along the second direction is between 1 and 10 microns. Exemplarily, the dimensional error between the grooves and the protrusions along the first arrangement direction is about 5 microns, and / or the dimensional error between the grooves and the protrusions along the second direction is about 5 microns.

[0051] In some embodiments, the lower surface of the optical fiber base 13 is a plane, and the first arrangement direction is parallel to the lower surface of the optical fiber base 13 .

[0052] In some embodiments, the lower surface of the optical fiber base 13 is a plane, the upper surface of the supporting structure 11 includes a first plane area, and the first limiting structure 111 is arranged in the first plane area. When the first limiting structure 111 and the second limiting structure 134 are pluggable and connected, the lower surface of the optical fiber base 13 is in contact with the first plane area of ​​the upper surface of the supporting structure 11 (e.g., Figure 2 shown).

[0053] In some embodiments, the protrusions and grooves can be designed into any polygon or circle, and this embodiment of the present application does not specifically limit this.

[0054] In some optional embodiments, such as Figure 1 and Figure 4 As shown, the first limiting structure 111 is a cube structure; the first side of the cube structure and the first arrangement direction (for example Figure 1 The second side of the cube structure is parallel to the second direction (e.g. Figure 1 It should be noted that when the first limiting structure 111 is a cubic structure, the second limiting structure 134 is also a cubic structure, that is, the groove and the protrusion are both cubic structures.

[0055] In order to facilitate the smooth insertion of the protrusion into the groove, Figure 1 As shown, the end of the protrusion is provided with a chamfer, and / or the edge of the notch of the groove is provided with a chamfer.

[0056] In the technical solution provided in the embodiment of the present application, the edges of the protrusions and grooves are chamfered to facilitate blind insertion between the optical fiber array and the supporting structure.

[0057] In some embodiments, the above-mentioned supporting structure can be a supporting plate, which includes an upper surface and a lower surface arranged opposite to each other, the photonic integrated circuit chip is fixed on the upper surface of the supporting plate, and the first limiting structure is arranged on the upper surface of the supporting plate.

[0058] In other embodiments, Figure 1As shown, the supporting structure 11 includes: a first supporting plate 112, a second supporting plate 113 and a connector 114 for connecting the first supporting plate 112 and the second supporting plate 113; the photonic integrated circuit chip 12 is fixed on the lower surface of the first supporting plate 112; the first limiting structure 111 is arranged on the upper surface of the second supporting plate 113; when the optical fiber array 13 is pluggable and connected to the supporting structure 11, the connector 114 is located between the side surface 121 of the photonic integrated circuit chip 12 and the optical end face 200 of the optical fiber base 132.

[0059] During actual packaging, the lower surface of the first carrier plate 112 may be adhered to the upper surface of the photonic basic circuit chip 12 .

[0060] The supporting structure 11 can be an integrally molded structure. The supporting structure 11 can be made of transparent materials such as glass and optical plastics, or opaque materials such as metal and ceramics. For supporting structures 11 made of opaque materials, openings can be provided in the connector to allow smooth passage of optical signals between the optical coupling region and the end face of the optical fiber. For supporting structures 11 made of transparent materials, openings are not required to simplify design and processing.

[0061] In the embodiment of the present application, the supporting structure 11 is a Z-shaped structure.

[0062] In some embodiments, as Figure 1 As shown, the optical end face 200 includes the end face of the optical fiber 131; an opening 100 is provided on the connector 114; when the optical fiber array 13 is pluggable and connected to the supporting structure 11, the opening 100 is located on the optical signal propagation path between the optical coupling region and the end face of the optical fiber.

[0063] In addition, the material selection of the supporting structure 11 and the thickness at each position need to meet certain stiffness requirements so that the entire Z-shaped supporting structure has sufficient stiffness. The second supporting plate of the supporting structure 11 used to support the optical fiber array is suspended. The stiffness of the supporting structure 11 needs to ensure that the entire supporting structure 11 does not deform and does not produce displacement, thereby affecting the stability of the optical path.

[0064] As an option, Figure 1As shown, the semiconductor structure 1 includes a light engine fixed on a supporting structure 11. The light engine includes a photonic integrated circuit chip 12 and a first electronic integrated circuit chip 15. The light engine is a core component for realizing the mutual conversion between electrical signals and optical signals. Among them, the first electronic integrated circuit chip 15 can be an analog electronic integrated circuit chip. Among them, the analog electronic integrated circuit chip has functions such as a driver (Driver, for example: modulator driver) and a trans-impedance amplifier (TIA). Exemplarily, the light engine and the first limiting structure 111 are both located on the upper surface of the supporting structure 11.

[0065] In some optional embodiments, such as Figure 1 As shown, the semiconductor structure 1 also includes: a first electronic integrated circuit chip 15; the first surface of the photonic integrated circuit chip 15 is fixed to the lower surface of the first carrier plate 112 (for example, by gluing or welding); the first electronic integrated circuit chip 15 is fixed to the second surface of the photonic integrated circuit chip 12 opposite to the first surface; the first electronic integrated circuit chip 15 and the second electronic integrated circuit chip 15 constitute a light engine.

[0066] Optionally, the semiconductor structure 1 further includes a light engine substrate 16, wherein the third surface of the first electronic integrated circuit chip 15 is fixed to the second surface of the photonic integrated circuit chip 12, and the fourth surface of the first electronic integrated circuit chip 15 is fixed to the light engine substrate 16. The third surface and the fourth surface are opposite to each other.

[0067] In practical applications, the photonic integrated circuit chip 12 can be directly fixed to the supporting structure 11, or a heat dissipation cover can be installed on the upper surface of the photonic integrated circuit chip 12, and then the supporting structure 11 can be fixed on the heat dissipation cover, which helps to dissipate heat from the photonic integrated circuit chip 12.

[0068] Another embodiment of the present application provides a semiconductor package structure. The semiconductor package structure includes: a package substrate, a second electronic integrated circuit chip, and the semiconductor structure described in each of the above embodiments; the second electronic integrated circuit chip and the semiconductor structure are fixed to the package substrate, and the electronic integrated circuit chip and the semiconductor structure are electrically connected via wiring on the package substrate.

[0069] In some embodiments, the semiconductor package structure may be referred to as an optoelectronic co-package structure.

[0070] The following describes a packaging method for the semiconductor structure and semiconductor packaging structure. The packaging method may include the following steps:

[0071] Step 1: If Figure 5As shown, the second lens array 14b is mounted on the optical end face of the optical fiber base of the optical fiber array 13 by active coupling to obtain an optical fiber assembly.

[0072] During coupling, a far-field or near-field beam quality analyzer may be used to monitor the collimation and pointing angle of the light beam to adjust the position of the second lens array 14b.

[0073] Step 2: If Figure 6 As shown, the optical fiber assembly is temporarily fixed to the bearing structure 11 through the first limiting structure and the second limiting structure to form a bearing assembly.

[0074] Step 3: If Figure 7 As shown, the first lens array 14a and the supporting assembly are clamped simultaneously for active coupling and mounting.

[0075] During coupling, the entire light engine can be turned upside down to facilitate clamping, observation, dispensing and curing of the first lens array 14a.

[0076] After step 3, the above-mentioned semiconductor structure can be obtained.

[0077] Next, the optical fiber assembly can be pulled out from the semiconductor structure, and then the semiconductor structure after the optical fiber assembly is pulled out and the second electronic integrated circuit chip are packaged onto the packaging substrate through reflow soldering. After the reflow soldering is completed, the optical fiber assembly is fixed to the supporting structure through the first limiting structure and the second limiting structure, thereby obtaining the above-mentioned semiconductor packaging structure.

[0078] When the bearing structure 11 is as Figure 1 In the Z-shaped structure shown in FIG, the lower surface of the second carrier plate 113 is lower than the lower surface of the light engine substrate. Therefore, in one practicable embodiment, a cavity for accommodating the second carrier plate 113 of the supporting structure 11 can be pre-set on the packaging substrate. In another practicable embodiment, the semiconductor structure after the optical fiber assembly is removed can be packaged at the edge of the packaging substrate. After packaging, the second carrier plate 113 is suspended in the air.

[0079] The present application also provides an optical computing device, which may include the semiconductor package structure described in the above embodiment.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some of the technical features therein with equivalents. However, these modifications or replacements do not deviate from the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application. In addition, if two or more features, systems, products, materials, and / or methods described herein are not mutually inconsistent, any combination of these features, systems, products, materials, and / or methods is included within the scope of the present disclosure.

Claims

1. A semiconductor structure, characterized in that include: A bearing structure, wherein the upper surface of the bearing structure is provided with a first limiting structure; A photonic integrated circuit chip fixed to the supporting structure, wherein an optical coupling region is formed at an edge position of one side of the photonic integrated circuit chip; An optical fiber array comprising a plurality of optical fibers and an optical fiber base for securing the optical fibers, wherein a second limiting structure for use with the first limiting structure is provided on the lower surface of the optical fiber base, wherein one of the first limiting structure and the second limiting structure is a protrusion and the other is a groove, and the first limiting structure and the second limiting structure are used to achieve a pluggable connection between the optical fiber array and the supporting structure, and the optical fibers and the second limiting structure have overlapping orthographic projections on the lower surface of the optical fiber base; One or more lens arrays, each lens array comprising lenses configured to converge light emitted through the optical coupling region into the optical fiber and / or converge light emitted from the optical fiber into the optical coupling region when the optical fiber array is pluggable and connected to the supporting structure.

2. The semiconductor structure according to claim 1, wherein: There are a plurality of optical coupling regions, and the plurality of optical coupling regions are arranged in an array at an edge position of one side of the photonic integrated circuit chip, and the array includes a first arrangement direction; When the optical fiber array is pluggably connected to the supporting structure, a dimensional error between the groove and the protrusion along the first arrangement direction is less than or equal to 10 microns, and / or a dimensional error between the groove and the protrusion along the second direction is less than or equal to 10 microns; The second direction is perpendicular to the first arrangement direction and perpendicular to the lower surface of the optical fiber base.

3. The semiconductor structure according to claim 2, wherein: The first limiting structure is a cube structure; A first side of the cube structure is parallel to the first arrangement direction, and a second side of the cube structure is parallel to the second direction.

4. The semiconductor structure according to any one of claims 1 to 3, characterized in that The end of the protrusion is provided with a chamfer.

5. The semiconductor structure according to claim 2, wherein: The notch edge of the groove is provided with a chamfer.

6. The semiconductor structure according to any one of claims 1 to 3, characterized in that The bearing structure includes: a first bearing plate, a second bearing plate, and a connecting member for connecting the first bearing plate and the second bearing plate; The photonic integrated circuit chip is fixed on the lower surface of the first carrier plate; The first limiting structure is provided on the upper surface of the second supporting plate; When the optical fiber array is pluggably connected to the supporting structure, the connecting member is located between the side surface of the photonic integrated circuit chip and the optical end face of the optical fiber base.

7. The semiconductor structure according to claim 6, wherein: The optical end face includes the end face of the optical fiber; the connecting member is provided with an opening; When the optical fiber array is pluggably connected to the supporting structure, the opening is located on the optical signal propagation path between the optical coupling region and the end face of the optical fiber.

8. The semiconductor structure according to claim 6, wherein: Also includes: First electronic integrated circuit chip; The first surface of the photonic integrated circuit chip is fixed to the lower surface of the first supporting plate; The first electronic integrated circuit chip is fixed to a second surface of the photonic integrated circuit chip opposite to the first surface; The first electronic integrated circuit chip and the second electronic integrated circuit chip constitute a light engine.

9. The semiconductor structure according to any one of claims 1 to 3, characterized in that The one or more lens arrays include a first lens array and a second lens array; The first lens array is fixed at an edge position on one side of the optical coupling region of the photonic integrated circuit chip; The second lens array is fixed to the optical end face of the optical fiber base; When the optical fiber assembly is pluggably connected to the supporting structure, the lenses in the first lens array and the lenses in the second lens array are configured to converge the light emitted through the optical coupling area into the optical fiber and / or converge the light emitted by the optical fiber into the optical coupling area.

10. A semiconductor packaging structure, characterized in that: include: A packaging substrate, a second electronic integrated circuit chip and a semiconductor structure as claimed in any one of claims 1 to 9; The second electronic integrated circuit chip and the semiconductor structure are fixed on the packaging substrate, and the electronic integrated circuit chip and the semiconductor structure are electrically connected through wiring on the packaging substrate.

11. An optical computing device, characterized in that include: The semiconductor package structure according to claim 10.

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