Method and system for detecting linear cutting abnormity of dimming liquid crystal film partition

Abstract

The invention relates to the technical field of dimming liquid crystal membrane production, and provides a dimming liquid crystal membrane partition line cutting abnormity detection method and system.The dimming liquid crystal membrane partition line cutting abnormity detection method comprises the steps that a to-be-detected dimming membrane is placed in a detection environment with the constant temperature and humidity, equivalent circuit analysis is conducted on the membrane, and parallel internal resistance of the corresponding equivalent circuit is detected; environmental conditions are controlled in advance to reduce the influence of environmental changes on the detection resistance value, so that the detection precision of the internal resistance is improved; according to the detection internal resistance condition of the partition line area, comprehensive analysis is carried out, so that different states of partition line cutting are judged according to different detection results, long-time power-on detection is not needed, the cutting condition detection of the whole dimming film partition line can be quickly realized, the detection efficiency is high, the detection accuracy can be improved through set judgment conditions, and the detection cost is reduced. The detection precision is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of dimming liquid crystal film production, and in particular to a method and system for detecting abnormalities in partition line cutting of a dimming liquid crystal film. Background Art

[0002] As people's material needs increase, PDLC film technology has evolved to zoned dimming PDLC film technology. The most critical aspect of this technology is the cutting of the zone lines, currently achieved through laser engraving and conductive layer pre-cutting. Because these are relatively new technologies, many defective products still occur during production. Some of these defects are caused by connections between two zones, which can be detected immediately after the film is powered on. Others are caused by incomplete zone cutting, which becomes apparent after prolonged power-on. Laser engraving can also cause collinear cuts, resulting in all zones in a given zone being unlit. Furthermore, complex situations such as collinear cuts and uncut zone lines require disassembly and analysis.

[0003] Currently, defective product detection is primarily a manual process. Inspectors illuminate the dimming liquid crystal film in sections and visually observe whether any sections are connected. Because the film cannot withstand surge current, it needs to be opened and closed slowly, making this a time-consuming and labor-intensive testing process. Furthermore, this detection method can only detect connected sections and cuts on collinear surfaces; it cannot detect incomplete severance of the partition lines. If these problematic films are circulated downstream, such as during the assembly process, even greater losses will result. Keeping each film powered for an extended period significantly increases shipping time and labor and material costs. Furthermore, it is impossible to determine the cause of cuts on collinear surfaces, requiring detailed analysis by engineers. This results in a labor-intensive and time-consuming inspection process and low accuracy. Summary of the Invention

[0004] The purpose of the present invention is to provide a method and system for detecting abnormalities in line cutting of a dimming liquid crystal film partition, so as to solve the problem that the existing manual detection of the dimming liquid crystal film partition is time-consuming and labor-intensive and has low detection accuracy.

[0005] In a first aspect, an embodiment of the present invention provides a method for detecting abnormalities in the cutting of a partition line of a dimming liquid crystal film, comprising: S100, placing the dimming liquid crystal film to be tested in a testing environment with preset temperature and humidity; S200, determining adjacent subareas to be tested of the dimming liquid crystal film, and obtaining the internal resistance corresponding to the subareas to be tested under the temperature and humidity conditions; the subareas to be tested include adjacent first and second subareas, and the area between the first and second subareas is a partition line area; S300. Determine the parallel resistance value corresponding to the partition line area according to the internal resistance of the first partition and the internal resistance of the second partition; S400. When it is confirmed that the parallel resistance value corresponding to the partition line area is less than the minimum value of the preset resistance value, it is determined that there is an abnormality in the cutting of the partition line.

[0006] Optionally, the internal resistance of the first partition is R1, the internal resistance of the second partition is R2, and the equivalent internal resistance of the partition line is R3; The parallel resistance value corresponding to the partition line area is R partition, R partition = 1 / (1 / R3 + 1 / (R1 + R2)); during normal cutting, 1 / R3 is infinitely close to 0, then R partition = R1 + R2; The parallel resistance value corresponding to the first partition is R partition1, R partition1 = 1 / (1 / R1 + 1 / (R2 + R3)); The parallel resistance value corresponding to the second partition is R partition2, R partition2 = 1 / (1 / R2 + 1 / (R1 + R3)).

[0007] Optionally, the S_{400} further includes: Set R1 and R2 to fluctuate between 150 kΩ and 200 kΩ. When it is confirmed that 300 kΩ < R partition < 400 kΩ, it is determined that there is no abnormality in the cutting of the partition line of the measured partition; where the minimum value of the preset resistance value is 300 kΩ.

[0008] Optionally, in the S_{400}, when it is confirmed that the parallel resistance value corresponding to the partition line area is less than the minimum value of the preset resistance value, determining that there is an abnormality in the cutting of the partition line includes: S_{410}. If the parallel resistance value R partition corresponding to the partition line area is greater than the relay resistance value R0 and less than the preset resistance value, it is necessary to comprehensively judge whether the partition of the dimming liquid crystal film is available in combination with the voltage and internal resistance conditions; S_{420}. If the parallel resistance value corresponding to the partition line area is less than or equal to the relay resistance value R0, it is confirmed that the partition line is not cut and it is directly determined as defective.

[0009] Optionally, the relay resistance value R0 is taken as 10 kΩ.

[0010] Optionally, in the S_{410}, comprehensively judging whether the partition of the dimming liquid crystal film is available in combination with the voltage and internal resistance conditions includes: S_{411}. Light up the second partition and obtain the partial voltage of the first partition; S_{412}. Comprehensively judge whether the partition of the dimming liquid crystal film is available according to the partial voltage of the first partition and the internal resistance conditions; Among them, the partial voltage of the first partition is V1, the partial voltage of the second partition is V2, then R1 / R3 = V1 / (48 - V1); If 10 kΩ < R partition 1 + R partition 2 - R < 12 kΩ and V1 is less than 2 V, the first partition is in a completely foggy state, indicating that the diaphragm partition line cutting is normal; If 12 kΩ < R partition 1 + R partition 2 - R < 27 kΩ and V1 is between 2 V and 5 V, it indicates that the first partition is slightly transparent; at this time, by closing the second partition, using the second partition as a power source for discharging, a flashing phenomenon is generated in the first partition, and then it is judged whether the diaphragm is abnormal. If there is a flash, the diaphragm is determined to be abnormal; If 27 kΩ < R partition 1 + R partition 2 - R < 300 kΩ and V1 > 5 V, the first partition is in an obvious transparent state, and the diaphragm is determined to be abnormal.

[0011] Optionally, the S400 further includes: If 400 kΩ < R partition < OL, it is determined that the collinear surface of the partition line of the measured partition is not completely cut off, which has no effect on power-on; If R partition shows OL, it is determined that the collinear surface of the partition line of the measured partition is completely cut off.

[0012] Optionally, when 12 kΩ < R partition 1 + R partition 2 - R < 27 kΩ, the dimming liquid crystal film to be detected is sent to the test area for long-term power-on for power-on repair.

[0013] Optionally, in the S100, placing the dimming liquid crystal film to be detected in a detection environment with a preset temperature and humidity includes: Placing the dimming liquid crystal film to be detected in a detection environment with a temperature of 5°C - 55°C and a humidity maintained at 20% - 80%; After the placement time reaches 2 H, the dimming liquid crystal film to be detected is transferred to the test area for internal resistance detection.

[0014] In a second aspect, an embodiment of the present invention further provides a detection system for abnormal cutting of the partition line of a dimming liquid crystal film, which is used to implement the detection method for abnormal cutting of the partition line of a dimming liquid crystal film as described in the first aspect.

[0015] The embodiment of the present invention has at least the following technical effects: The embodiments of the present invention provide a method and system for detecting abnormal cutting of a dimming liquid crystal film partition line. The method places the dimming film to be tested in a detection environment with constant temperature and humidity, analyzes the equivalent circuit of the film, and detects the parallel internal resistance of the corresponding equivalent circuit. By pre-controlling the environmental conditions to reduce the influence of environmental changes on the detection resistance value, it is beneficial to improve the detection accuracy of the internal resistance. The internal resistance of the partition line area is comprehensively analyzed, and the different states of the partition line cutting are judged according to different detection results. There is no need for long-term power-on detection, and the cutting condition detection of the entire dimming film partition line can be quickly realized. The detection efficiency is high, and the detection accuracy can be improved by setting the judgment conditions to ensure the detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 A connection diagram of a detection system for abnormal cutting of a dimming liquid crystal film partition line provided by an embodiment of the present invention; Figure 2 A flow chart of a method for detecting abnormalities in cutting of a partition line of a dimming liquid crystal film provided by an embodiment of the present invention; Figure 3 A schematic diagram of an equivalent circuit of a dimming liquid crystal film partition provided by an embodiment of the present invention; Figure 4 A schematic diagram of a specific flow of step S400 in a method for detecting abnormalities in cutting of a partition line of a dimming liquid crystal film provided by an embodiment of the present invention; Figure 5 This is a schematic diagram of a specific flow of step S410 in a method for detecting abnormal cutting of a dimming liquid crystal film partition line provided by an embodiment of the present invention.

[0018] Reference numerals: 100-first partition; 200-second partition; 300-partition line; 400-detection module; 500-control module. DETAILED DESCRIPTION

[0019] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] Those skilled in the art will understand that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art in the art to which this invention belongs. It should also be understood that terms such as those defined in common dictionaries should be understood to have meanings consistent with their meanings in the context of the prior art and, unless specifically defined as such, will not be interpreted in an idealized or overly formal sense.

[0021] It will be understood by those skilled in the art that, unless otherwise stated, the singular forms "a," "an," "said," and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present invention refers to the presence of the stated features, integers, steps, operations, elements, and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. The term "and / or" used herein includes all or any unit and all combinations of one or more associated listed items.

[0022] like Figure 1 As shown, an embodiment of the present invention provides a detection system for abnormal cutting of a dimming liquid crystal film partition line 300, which is used to implement a detection method for abnormal cutting of a dimming liquid crystal film partition line 300. The detection system includes: a control module 500, a detection module 400, and a dimming liquid crystal film to be detected to determine the partition. Multiple partitions are cut on the dimming liquid crystal film to be detected. In the embodiment of the present invention, two adjacent partitions are used as detection counterparts to determine whether there is an abnormality in the cutting of the partition line 300 between the two partitions. Among them, the parallel resistance of each partition to be tested is detected by the detection module 400, and the control module 500 processes the data obtained after the detection and provides corresponding detection judgment basis. The detection module 400 is electrically connected to the corresponding partition through conductive or metal contacts, etc., and is used to obtain the internal resistance detection data of the corresponding partition. The control unit is electrically connected to the detection module 400, and is used to analyze the internal resistance detection data of the corresponding partition to determine whether the cutting of the partition line 300 is normal.

[0023] Optionally, the detection module 400 can use a multimeter, and test points are set on the partition to be detected. The multimeter contacts or connects to the corresponding test points through wires. Since the multimeter can detect resistance as well as voltage and current, it can meet the relevant requirements of subsequent testing methods and there is no need to frequently replace the detection module 400.

[0024] Optionally, the control module 500 uses a single chip microcomputer (the specific type can be selected according to the requirements of data processing and circuit, and is not specifically limited in this embodiment) to reduce costs while meeting the data processing requirements.

[0025] Optionally, in the method for detecting abnormal cutting of the dimming liquid crystal film partition line 300 of an embodiment of the present invention, the data detected by the detection module 400 can be input into the host computer for analysis, or the data can be analyzed manually to determine whether the cutting of the partition line 300 is abnormal.

[0026] Combine Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a method for detecting abnormal cutting of a dimming liquid crystal film partition line 300. The detection method can be based on the detection system corresponding to the above embodiment and mainly includes the following steps S100 to S400, specifically: S100 , placing the dimming liquid crystal film to be tested in a testing environment with preset temperature and humidity.

[0027] Optionally, in S100, placing the dimming liquid crystal film to be tested in a testing environment with a preset temperature and humidity includes: Place the dimming liquid crystal film to be tested in a testing environment with a preset temperature of 5℃~55℃ (optional values ​​include 5℃, 15℃, 20℃, 25℃, 30℃, 35℃, 40℃, 45℃, 50℃, 55℃, etc.) and a preset humidity of 20%~80% (optional values ​​include 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, etc.).

[0028] After the placement time reaches 2 hours, the dimming liquid crystal film to be tested is transferred to the test area for internal resistance testing, which is conducive to ensuring the accuracy of the internal resistance test.

[0029] S200, determine the adjacent partitions to be tested of the dimming liquid crystal film, and obtain the internal resistance corresponding to the partitions to be tested under the temperature and humidity conditions; the partitions to be tested include the adjacent first partition 100 and second partition 200, and the partition line 300 area is between the first partition 100 and the second partition 200.

[0030] Specifically, the equivalent internal resistance of the first partition 100 is R1, the equivalent internal resistance of the second partition 200 is R2, and the equivalent internal resistance of the partition line 300 is R3. However, in actual testing, these three resistance values ​​cannot be directly measured. The lines between the resistance values ​​cannot be cut off for testing, and only the parallel resistance values ​​can be measured. The equivalent circuit of the partition to be tested is as follows: Figure 3 shown.

[0031] S300 , determining a parallel resistance value corresponding to the partition line 300 region according to the internal resistance of the first partition 100 and the internal resistance of the second partition 200 .

[0032] Specifically, by testing the equivalent circuit, the parallel resistance value corresponding to the area of the partition line 300 is R partition, and R partition = 1 / (1 / R3 + 1 / (R1 + R2)); when cutting normally, 1 / R3 approaches 0 infinitely, so R partition = R1 + R2; The parallel resistance value corresponding to the first partition 100 is R partition 1, and R partition 1 = 1 / (1 / R1 + 1 / (R2 + R3)); The parallel resistance value corresponding to the second partition 200 is R partition 2, and R partition 2 = 1 / (1 / R2 + 1 / (R1 + R))

[0033] S400. When it is confirmed that the parallel resistance value corresponding to the area of the partition line 300 is less than the minimum value of the preset resistance value, it is determined that the cutting of the partition line 300 is abnormal.

[0034] Set R1 and R2 to fluctuate between 150 kΩ and 200 kΩ (the internal resistance of the partition under the conditions of temperature 25°C and humidity 50%-60%). The resistance value R3 of the partition line 300 is OL (>200 MΩ) under normal conditions (completely cut off), and at this time 1 / R3 ≈ 0. When it is confirmed that 300 kΩ < R partition < 400 kΩ, it is determined that the cutting of the partition line 300 of the partition to be measured is normal; among them, the minimum value of the preset resistance value is 300 kΩ.

[0035] Optionally, as Figure 4 shown, in step S400, when it is confirmed that the parallel resistance value corresponding to the area of the partition line 300 is less than the minimum value of the preset resistance value, it is determined that the cutting of the partition line is abnormal, specifically including: S410. If the parallel resistance value R partition corresponding to the area of the partition line 300 is greater than the relay resistance value R0 and less than the preset resistance value, it is necessary to comprehensively judge whether the partition of the dimming liquid crystal film is available in combination with the voltage and internal resistance conditions.

[0036] S420. If the parallel resistance value corresponding to the area of the partition line 300 is less than or equal to the relay resistance value R0, it is confirmed that the partition line 300 is not cut, and it is directly determined as defective.

[0037] It should be noted that steps S410 and S420 represent two different judgment methods, and the order between them is not specifically limited.

[0038] Optionally, the relay resistance R0 is taken as 10 kΩ. That is, when R of the partition < 10 kΩ, it is determined that the partition line 300 of the film is cut poorly. It should be noted that the relay resistance R0 being taken as 10 kΩ is based on actual test data. For all partition lines with abnormalities, more than ninety percent of the partition lines have a resistance value less than 10 kΩ; moreover, a partition line with a resistance value less than 10 kΩ must be abnormal. According to the calculation formula for the resistance of the partition line R of the partition = 1 / (1 / R3 + 1 / (R1 + R2)), at this time, R3 is much smaller than R1 or R2, and the voltage division is too large. Therefore, hierarchical screening can be performed based on this relay resistance value, screening out most of the qualified products and defective products for the first time, and then performing secondary screening on the remaining small part to improve efficiency.

[0039] In addition, if 10 kΩ < R of the partition < 300 kΩ, it is necessary to comprehensively judge whether the partition of the dimming liquid crystal film is available by combining the voltage and internal resistance conditions.

[0040] Optionally, as Figure 5 shown, in step S410, for how to comprehensively judge whether the partition of the dimming liquid crystal film is available by combining the voltage and internal resistance conditions, it specifically includes the following steps: S411, light the second partition 200 and obtain the voltage division of the first partition 100. Here, lighting the second partition 200 means applying a voltage of 48 V (volt) to the second partition 200.

[0041] S412, comprehensively judge whether the partition of the dimming liquid crystal film is available according to the voltage division and internal resistance conditions of the first partition 100.

[0042] Among them, the voltage division of the first partition 100 is V1, and the voltage division of the second partition 200 is V2, then R1 / R3 = V1 / (48 - V1). Here, 48 represents that the working voltage of the film is 48 V; the specific judgment methods include the following three situations: (1) If 10 kΩ < R of partition 1 + R of partition 2 - R of the partition < 12 kΩ, and when V1 is less than 2 V, the first partition 100 is in a completely foggy state, and it is considered that the partition line 300 of the film is cut normally. Because when the partition function of the film is normal, when one of the partitions is lit, the voltage division of the other partition adjacent to it is small, and there will be no phenomena such as becoming transparent or flickering (the film needs an initial voltage of about 3 V - 5 V to become transparent).

[0043] (2) If 12 kΩ < R Partition 1 + R Partition 2 - R Partition < 27 kΩ and V1 is between 2 V and 5 V, it indicates that the first partition 100 is slightly transmissive. At this time, by closing the second partition 200, the second partition 200 is equivalent to a power supply at this time, and it is discharged by using it, so that the first partition 100 generates a flashing phenomenon, and then it is judged whether the diaphragm is abnormal. If there is a flash, it is determined that the diaphragm is abnormal. Here, "slightly transmissive" means that due to the low voltage, the liquid crystal does not turn completely, resulting in scattered light passing through. At this time, looking through the diaphragm is like looking through fog, and only the outline can be seen.

[0044] Optionally, when 12 kΩ < R Partition 1 + R Partition 2 - R Partition < 27 kΩ, the dimming liquid crystal film to be detected is sent to the test area for long-term power-on for power-on repair (which can only be achieved for the case of slight connection). Because when a short-circuit occurs, most cases are due to slight connection on the partition line 300, etc., and in a few cases, a small section of the line is not cut. Therefore, through long-term power-on, the temperature of the slightly connected point rises, so as to burn off the slightly connected point. However, if a small section of the partition line 300 is not cut or there are too many connections, etc., it cannot be solved by power-on.

[0045] (3) If 27 kΩ < R Partition 1 + R Partition 2 - R Partition < 300 kΩ and V1 > 5 V, the first partition 100 is in an obvious transmissive state, and it is determined that the diaphragm is abnormal.

[0046] It should be noted that in this embodiment, the basis for judging whether the partition of the dimming film is available through the internal resistance value range of R Partition 1 + R Partition 2 - R Partition is as follows: When R1 / R3 = V1 / (48 - V1), according to the fluctuation range of R1 and R2 themselves, the resistances of R Partition 1, R Partition 2, and R Partition are calculated, and then the resistance difference of R Partition 1 + R Partition 2 - R Partition is used to reflect R1 / R3, so as to reflect the voltage division situation of the first partition. Because R1, R2, and R3 cannot be directly measured in the partition film and can only be tested by cutting the film, an indirect method can only be adopted for characterization.

[0047] In some embodiments, for the case of co-linear plane cutting (for example: when cutting the partition line 300, the power is too large or affected by other factors, and the co-linear plane is cut. At this time, the partition line 300 is cut off), the judgment of the abnormal cutting of the partition line 300 in S400 also includes: For the diaphragm with co-linear electrodes covering all partitions, the influence of co-linear plane cutting is small and can be not tested. For the partition film with co-linear electrodes only connecting the last two partitions, the influence of co-linear plane cutting is large.

[0048] Therefore, it is also judged in two cases respectively: (1) If 400 kΩ < R partition < OL, it is determined that the common line surface of the partition line 300 of the partition to be measured is not completely cut off, which has no impact on power-on.

[0049] Specifically, theoretically, there is a situation where 400 kΩ < R partition < OL (the reason for the large partition resistance value is that since the common line surface is cut, the area through which the current can flow becomes smaller, which is equivalent to a smaller cross-sectional area of the resistor, that is, the resistance value increases). However, this situation rarely occurs in actual production. Therefore, it is only marked as a possible defective product and requires further detailed research by engineers to determine.

[0050] (2) If R partition shows OL, it is determined that the common line surface of the partition line 300 of the partition to be measured is completely cut off.

[0051] The detection method for abnormal cutting of the dimming film partition line 300 provided by the embodiment of the present invention first places the dimming film to be measured in a detection environment with constant temperature and humidity. By analyzing the equivalent circuit of the film and detecting the parallel internal resistance of the corresponding equivalent circuit, and by pre-controlling the environmental conditions to reduce the influence of environmental changes on the detected resistance value, it is beneficial to improve the detection accuracy of the internal resistance. Through comprehensive analysis of the detected internal resistance situation in the area of the partition line 300, different states of the cutting of the partition line 300 are judged according to different detection results. It does not require long-term power-on detection, can quickly detect the cutting condition of the entire dimming film partition line 300, has high detection efficiency, and can improve the detection accuracy through the set judgment conditions, ensuring the detection precision.

[0052] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0053] The terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more. ​In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal connections between two components. A person of ordinary skill in the art can understand the specific meanings of the above terms in the present invention based on the specific circumstances. In the description of this specification, specific features, structures, materials, or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for detecting abnormalities in the cutting of a partition line of a dimming liquid crystal film, characterized in that: Including: S100: Place the dimming liquid crystal film to be detected in a detection environment with a preset temperature and humidity. S200: Determine adjacent measurement zones of the dimming liquid crystal film, and obtain the internal resistance corresponding to the measurement zones under this temperature and humidity condition; the measurement zones include adjacent first and second zones, and a zone line area is between the first and second zones. S300: Determine the parallel resistance value corresponding to the zone line area according to the internal resistance of the first zone and the internal resistance of the second zone. S400: When it is confirmed that the parallel resistance value corresponding to the zone line area is less than the minimum value of the preset resistance value, determine that there is an abnormality in the cutting of the zone line.

2. The method for detecting abnormality in cutting of a partition line of a dimming liquid crystal film according to claim 1, characterized in that: The internal resistance of the first zone is R1, the internal resistance of the second zone is R2, and the equivalent internal resistance of the zone line is R3. The parallel resistance value corresponding to the zone line area is R_zone, and R_zone = 1 / (1 / R3 + 1 / (R1 + R2)); when cutting is normal, 1 / R3 is infinitely close to 0, so R_zone = R1 + R2. The parallel resistance value corresponding to the first zone is R_zone1, and R_zone1 = 1 / (1 / R1 + 1 / (R2 + R3)). The parallel resistance value corresponding to the second zone is R_zone2, and R_zone2 = 1 / (1 / R2 + 1 / (R1 + R3)).

3. The method for detecting abnormality in cutting of a partition line of a dimming liquid crystal film according to claim 2, characterized in that: S400 further includes: Set R1 and R2 to fluctuate between 150 kΩ and 200 kΩ. When it is confirmed that 300 kΩ < R_zone < 400 kΩ, determine that there is no abnormality in the cutting of the zone line of the measurement zone; where the minimum value of the preset resistance value is 300 kΩ.

4. The method for detecting abnormal cutting of a partition line of a dimming liquid crystal film according to claim 3, characterized in that: In S400, when it is confirmed that the parallel resistance value corresponding to the zone line area is less than the minimum value of the preset resistance value, determining that there is an abnormality in the cutting of the zone line includes: S410: If the parallel resistance value R_zone corresponding to the zone line area is greater than the relay resistance value R0 and less than the preset resistance value, it is necessary to comprehensively judge whether the zone of the dimming liquid crystal film is available in combination with the voltage and internal resistance conditions. S420: If the parallel resistance value corresponding to the zone line area is less than or equal to the relay resistance value R0, confirm that the zone line is not cut and directly determine it as defective.

5. The method for detecting abnormal cutting of a partition line of a dimming liquid crystal film according to claim 4, characterized in that: The relay resistance value R0 is taken as 10 kΩ.

6. The method for detecting abnormal cutting of a partition line of a dimming liquid crystal film according to claim 4, characterized in that: In S410, comprehensively judging whether the zone of the dimming liquid crystal film is available in combination with the voltage and internal resistance conditions includes: S411: Light the second zone and obtain the partial voltage of the first zone. S412: Comprehensively judge whether the zone of the dimming liquid crystal film is available according to the partial voltage of the first zone and the internal resistance conditions. Among them, the partial voltage of the first zone is V1, and the partial voltage of the second zone is V2, then R1 / R3 = V1 / (48 - V1). If 10 kΩ < R_zone_1 + R_zone_2 - R_zone < 12 kΩ and V1 is less than 2V, the first zone is in a completely foggy state, and it is considered that the cutting of the film zone line is normal. If 12 kΩ < R partition 1 + R partition 2 - R < 27 kΩ and V1 is between 2 V and 5 V, it indicates that the first partition is slightly transmissive. At this time, by turning off the second partition and using the second partition as a power source for discharging, a flashing phenomenon is generated in the first partition, and then it is judged whether the diaphragm is abnormal. If there is a flash, the diaphragm is determined to be abnormal. If 27 kΩ < R partition 1 + R partition 2 - R < 300 kΩ and V1 > 5 V, the first partition is in an obvious transmissive state, and the diaphragm is determined to be abnormal.

7. The method for detecting abnormal cutting of a partition line of a dimming liquid crystal film according to claim 2, characterized in that: The S400 further includes: If 400 kΩ < R partition < OL, it is determined that the coplanar surface of the partition line of the待测 partition is not completely cut off, which has no effect on power-on. If R partition shows OL, it is determined that the coplanar surface of the partition line of the待测 partition is completely cut off.

8. The method for detecting abnormalities in cutting of a partition line of a dimming liquid crystal film according to claim 6, characterized in that: When 12 kΩ < R partition 1 + R partition 2 - R < 27 kΩ, the dimming liquid crystal film to be detected is sent to the test area for long-term power-on for power-on repair.

9. The method for detecting abnormal cutting of a dimming liquid crystal film partition line according to claim 1, characterized in that: In the S100, placing the dimming liquid crystal film to be detected in a detection environment with a preset temperature and humidity includes: Placing the dimming liquid crystal film to be detected in a detection environment with a temperature of 5°C to 55°C and a humidity maintained at 20% to 80%. After the placement time reaches 2 H, the dimming liquid crystal film to be detected is transferred to the test area for internal resistance detection.

10. A detection system for abnormal cutting of partition lines of dimming liquid crystal film, characterized in that: For implementing the detection method for abnormal cutting of the partition line of the dimming liquid crystal film according to any one of claims 1 to 9.

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