A method and system for detecting abnormal partition line cutting of a dimming liquid crystal film

Abstract

The application relates to the technical field of light-adjusting liquid crystal film production, and provides a light-adjusting liquid crystal film partition line cutting abnormality detection method and system, which places the to-be-detected light-adjusting film in a detection environment with constant temperature and humidity, analyzes an equivalent circuit of the film sheet, detects parallel internal resistance of the corresponding equivalent circuit, precontrol environment conditions to reduce the influence of environment changes on the detection resistance value, and the detection precision of the internal resistance is improved; the internal resistance of the partition line area is comprehensively analyzed according to the detection, different states of the partition line cutting are judged according to different detection results, long-time power-on detection is not needed, the cutting state detection of the entire light-adjusting film partition line can be quickly realized, the detection efficiency is high, the detection accuracy can be improved through the set judgment condition, and the detection precision is ensured.

Description

Technical Field

[0001] This invention relates to the field of dimming liquid crystal film production technology, and in particular to a method and system for detecting abnormalities in the partition line cutting of dimming liquid crystal films. Background Technology

[0002] As people's material needs improve, dimming liquid crystal film (PDLC film) technology has been upgraded to local dimming liquid crystal film technology. The most crucial aspect of this technology is the cutting of the local dimming lines, currently achieved through laser engraving and conductive layer pre-cutting techniques. Because these are relatively new technologies, many defective products still occur during production. Some of these defects are detectable as two connected zones after the film is powered on. Others have incompletely cut local dimming lines, which become apparent after prolonged power-on. For laser engraving, collinear cutting can occur, causing all zones along a certain line to fail to light up. Other complex issues include collinear cutting damage and incomplete local dimming lines, which currently require film disassembly for analysis.

[0003] Currently, defective product inspection mainly relies on manual methods. Inspectors illuminate different sections of the dimming liquid crystal film and visually inspect for any connecting sections. Because the film cannot withstand surge current, the opening and closing must be gradual, making this testing process time-consuming and labor-intensive. Furthermore, this method can only detect connecting sections or collinear plane breaks, but cannot detect incomplete breaks in the dividing lines. If these defective films reach downstream applications, such as during lamination, it will cause even greater losses. On the other hand, continuously powering each film for extended periods would significantly increase delivery time and labor and material costs. Moreover, it would be impossible to determine the cause of collinear plane breaks, requiring detailed analysis by engineers, making the inspection process labor-intensive, inaccurate, and time-consuming. Summary of the Invention

[0004] The purpose of this invention is to provide a method and system for detecting abnormalities in the partitioning of dimming liquid crystal films, so as to solve the problems of time-consuming, labor-intensive and inaccurate manual detection of partitioning of dimming liquid crystal films.

[0005] In a first aspect, embodiments of the present invention provide a method for detecting abnormal cutting of partition lines in a dimming liquid crystal film, comprising:

[0006] S100: Place the dimming liquid crystal film to be tested in a test environment with preset temperature and humidity.

[0007] S200, determine the adjacent test zones of the dimming liquid crystal film, and obtain the internal resistance of the test zones under the temperature and humidity conditions; the test zones include adjacent first zones and second zones, and the area between the first zone and the second zone is a partition line region;

[0008] S300. Determine the parallel resistance value corresponding to the partition line area according to the internal resistance of the first partition and the internal resistance of the second partition.

[0009] S400. When it is confirmed that the parallel resistance value corresponding to the partition line area is less than the minimum value of the preset resistance value, determine that there is an abnormality in the cutting of the partition line.

[0010] Optionally, the internal resistance of the first partition is R1, the internal resistance of the second partition is R2, and the equivalent internal resistance of the partition line is R3.

[0011] The parallel resistance value corresponding to the partition line area is R partition, and R partition = 1 / (1 / R3 + 1 / (R1 + R2)); when cutting normally, 1 / R3 is infinitely close to 0, then R partition = R1 + R2.

[0012] The parallel resistance value corresponding to the first partition is R partition1, and R partition1 = 1 / (1 / R1 + 1 / (R2 + R3)).

[0013] The parallel resistance value corresponding to the second partition is R partition2, and R partition2 = 1 / (1 / R2 + 1 / (R1 + R3)).

[0014] Optionally, the S400 further includes:

[0015] Set R1 and R2 to fluctuate between 150 kΩ and 200 kΩ. When it is confirmed that 300 kΩ < R partition < 400 kΩ, determine that there is no abnormality in the cutting of the partition line of the to-be-tested partition; where the minimum value of the preset resistance value is 300 kΩ.

[0016] Optionally, in the S400, when it is confirmed that the parallel resistance value corresponding to the partition line area is less than the minimum value of the preset resistance value, determining that there is an abnormality in the cutting of the partition line includes:

[0017] S410. If the parallel resistance value R partition corresponding to the partition line area is greater than the relay resistance value R0 and less than the preset resistance value, it is necessary to comprehensively judge whether the partition of the dimming liquid crystal film is available in combination with the voltage and internal resistance conditions.

[0018] S420. If the parallel resistance value corresponding to the partition line area is less than or equal to the relay resistance value R0, confirm that the partition line is not cut and directly determine it as defective.

[0019] Optionally, the relay resistance value R0 is taken as 10 kΩ.

[0020] Optionally, in the S410, comprehensively judging whether the partition of the dimming liquid crystal film is available in combination with the voltage and internal resistance conditions includes:

[0021] S411, light up the second partition and obtain the partial voltage of the first partition;

[0022] S412, comprehensively judge whether the partition of the dimming liquid crystal film is available according to the partial voltage of the first partition and the internal resistance situation;

[0023] Among them, if the partial voltage of the first partition is V1 and the partial voltage of the second partition is V2, then R1 / R3 = V1 / (48 - V1);

[0024] If 10kΩ < R partition 1 + R partition 2 - R partition < 12kΩ and V1 is less than 2V, the first partition is in a completely foggy state, and it is considered that the film partition line cutting is normal;

[0025] If 12kΩ < R partition 1 + R partition 2 - R partition < 27kΩ and V1 is between 2V and 5V, it indicates that the first partition is slightly transparent; at this time, by closing the second partition and using the second partition as a power supply for discharging, a flashing phenomenon is generated in the first partition, and then it is judged whether the film is abnormal. If there is a flash, the film is determined to be abnormal;

[0026] If 27kΩ < R partition 1 + R partition 2 - R partition < 300kΩ and V1 > 5V, the first partition is in an obvious transparent state, and the film is determined to be abnormal.

[0027] Optionally, the S400 further includes:

[0028] If 400kΩ < R partition < OL, it is determined that the common line surface of the partition line of the to-be-tested partition is not completely cut off and has no influence on power-on;

[0029] If R partition shows OL, it is determined that the common line surface of the partition line of the to-be-tested partition is completely cut off.

[0030] Optionally, when 12kΩ < R partition 1 + R partition 2 - R partition < 27kΩ, send the to-be-tested dimming liquid crystal film to the test area for long-term power-on for power-on repair.

[0031] Optionally, in the S100, placing the to-be-tested dimming liquid crystal film in a detection environment with a preset temperature and humidity includes:

[0032] Place the to-be-tested dimming liquid crystal film in a detection environment with a temperature of 5°C - 55°C and a humidity maintained at 20% - 80%;

[0033] After the placement time reaches 2H, transfer the to-be-tested dimming liquid crystal film to the test area for internal resistance detection.

[0034] In a second aspect, an embodiment of the present invention further provides a detection system for abnormal cutting of the partition line of a dimming liquid crystal film, which is used to implement the detection method for abnormal cutting of the partition line of a dimming liquid crystal film as described in the first aspect.

[0035] The embodiments of the present invention have at least the following technical effects:

[0036] The method and system for detecting abnormal partition line cutting in a dimming liquid crystal film provided in this invention places the dimming film under test in a constant temperature and humidity testing environment. By analyzing the equivalent circuit of the film and detecting the parallel internal resistance of the corresponding equivalent circuit, the environmental conditions are pre-controlled to reduce the impact of environmental changes on the detected resistance, thus improving the detection accuracy of the internal resistance. Based on a comprehensive analysis of the detected internal resistance in the partition line area, different states of partition line cutting are determined according to different detection results. This method does not require prolonged power-on testing and can quickly detect the cutting status of the entire dimming film's partition lines, resulting in high detection efficiency. Furthermore, the set judgment conditions can improve detection accuracy and ensure precision. Attached Figure Description

[0037] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0038] Figure 1 A connection diagram of a detection system for abnormal cutting of dimming liquid crystal film partition lines provided in an embodiment of the present invention;

[0039] Figure 2 A flowchart illustrating a method for detecting abnormalities in the partition line cutting of a dimming liquid crystal film, provided as an embodiment of the present invention;

[0040] Figure 3 A schematic diagram of a dimming liquid crystal film partition equivalent circuit provided in an embodiment of the present invention;

[0041] Figure 4 A schematic diagram of the specific process of step S400 in a method for detecting abnormal partition line cutting of a dimming liquid crystal film provided in an embodiment of the present invention;

[0042] Figure 5 This is a schematic diagram of the specific process of step S410 in a method for detecting abnormality in the partition line cutting of a dimming liquid crystal film provided in an embodiment of the present invention.

[0043] Figure label:

[0044] 100 - First partition; 200 - Second partition; 300 - Partition line; 400 - Detection module; 500 - Control module. Detailed Implementation

[0045] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0047] Those skilled in the art will understand that, unless specifically stated otherwise, the singular forms “a,” “an,” “the,” and “the” used herein may also include the plural forms. It should be further understood that the term “comprising” as used in this specification means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. The term “and / or” as used herein includes all or any units and all combinations of one or more associated listed items.

[0048] like Figure 1 As shown, this embodiment of the invention provides a detection system for abnormal cutting of partition lines 300 in a dimming liquid crystal film. The system is used to implement a method for detecting abnormal cutting of partition lines 300 in a dimming liquid crystal film. The detection system includes a control module 500, a detection module 400, and a dimming liquid crystal film to be tested, with multiple partitions cut into it. In this embodiment, two adjacent partitions are used as detection counterparts to determine whether there is an abnormality in the cutting of the partition lines 300 between these two partitions. The detection module 400 detects the parallel resistance of each partition to be tested, and the control module 500 processes the data obtained after detection and provides corresponding detection judgment criteria. The detection module 400 is electrically connected to the corresponding partition through conductive or metal contacts to obtain the internal resistance detection data of the corresponding partition. The control unit is electrically connected to the detection module 400 and analyzes the internal resistance detection data of the corresponding partition to determine whether the cutting of the partition lines 300 is normal.

[0049] Optionally, the detection module 400 can be a multimeter. Test points are set on the partition to be tested. The multimeter is connected to the corresponding test points through wires. Since the multimeter can detect both resistance and voltage and current, it can meet the relevant requirements of subsequent test methods and does not need to be replaced frequently.

[0050] Optionally, the control module 500 uses a microcontroller (the specific type can be selected according to the requirements of data processing and circuitry, and is not specifically limited in this embodiment) to reduce costs while meeting data processing requirements.

[0051] Optionally, in the detection method for abnormal cutting of dimming liquid crystal film partition line 300 in this embodiment of the invention, the data detected by the detection module 400 can also be input into the host computer for analysis, or the data can be analyzed manually to determine whether the cutting of partition line 300 is abnormal.

[0052] Combination Figure 1 and Figure 2 As shown, this embodiment of the invention provides a method for detecting abnormal cutting of the dimming liquid crystal film partition line 300. This detection method can be based on the detection system corresponding to the aforementioned embodiment and mainly includes the following steps S100~S400, specifically:

[0053] S100 places the dimming liquid crystal film to be tested in a test environment with preset temperature and humidity.

[0054] Optionally, in S100, the dimming liquid crystal film to be tested is placed in a testing environment with preset temperature and humidity, including:

[0055] The dimming liquid crystal film to be tested is placed in a testing environment with a preset temperature of 5℃~55℃ (selectable values ​​are 5℃, 15℃, 20℃, 25℃, 30℃, 35℃, 40℃, 45℃, 50℃, 55℃, etc.) and a preset humidity of 20%~80% (selectable values ​​are 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, etc.).

[0056] After a placement time of 2 hours, the dimming liquid crystal film to be tested is transferred to the test area for internal resistance testing, which helps to ensure the accuracy of the internal resistance test.

[0057] S200, determine the adjacent test partitions of the dimming liquid crystal film, and obtain the internal resistance of the test partitions under the temperature and humidity conditions; the test partitions include the adjacent first partition 100 and second partition 200, and the area between the first partition 100 and the second partition 200 is the partition line 300 region.

[0058] Specifically, the equivalent internal resistance of the first partition 100 is R1, the equivalent internal resistance of the second partition 200 is R2, and the equivalent internal resistance of the partition line 300 is R3. However, these three resistance values cannot be directly measured during actual testing because the lines between the resistance values cannot be cut for testing. Only the parallel resistance value can be measured. The equivalent circuit of the partition to be measured is as Figure 3 shown.

[0059] S300, determine the parallel resistance value corresponding to the area of the partition line 300 according to the internal resistance of the first partition 100 and the internal resistance of the second partition 200.

[0060] Specifically, by testing the equivalent circuit, the parallel resistance value corresponding to the area of the partition line 300 is R partition, and R partition = 1 / (1 / R3 + 1 / (R1 + R2)); when normally cutting, 1 / R3 is infinitely close to 0, so R partition = R1 + R2;

[0061] The parallel resistance value corresponding to the first partition 100 is R partition 1, and R partition 1 = 1 / (1 / R1 + 1 / (R2 + R3));

[0062] The parallel resistance value corresponding to the second partition 200 is R partition 2, and R partition 2 = 1 / (1 / R2 + 1 / (R1 + R3)).

[0063] S400, when it is confirmed that the parallel resistance value corresponding to the area of the partition line 300 is less than the minimum value of the preset resistance value, it is determined that there is an abnormality in the cutting of the partition line 300.

[0064] Set R1 and R2 to fluctuate between 150 kΩ and 200 kΩ (the partition internal resistance under the conditions of temperature 25 °C and humidity 50% - 60%). The resistance value R3 of the partition line 300 is OL (> 200 MΩ) under normal conditions (completely cut), and at this time 1 / R3 ≈ 0. When it is confirmed that 300 kΩ < R partition < 400 kΩ, it is determined that there is no abnormality in the cutting of the partition line 300 of the partition to be measured; among them, the minimum value of the preset resistance value is 300 kΩ.

[0065] Optionally, as Figure 4 shown, in step S400, when it is confirmed that the parallel resistance value corresponding to the area of the partition line 300 is less than the minimum value of the preset resistance value, it is determined that there is an abnormality in the cutting of the partition line 300, which specifically includes:

[0066] S410, if the parallel resistance value R partition corresponding to the area of the partition line 300 is greater than the relay resistance value R0 and less than the preset resistance value, it is necessary to comprehensively judge whether the partition of the dimming liquid crystal film is available in combination with the voltage and internal resistance conditions.

[0067] S420, if the parallel resistance value corresponding to the area of the partition line 300 is less than or equal to the relay resistance value R0, it is confirmed that the partition line 300 is not cut, and it is directly determined as defective.

[0068] It should be noted that steps S410 and S420 represent two different judgment methods, and the order between them is not specifically limited.

[0069] Optionally, the relay resistance value R0 is taken as 10 kΩ. That is, when R of the partition < 10 kΩ, it is determined that the partition line 300 of the light-dimming liquid crystal film is cut poorly. It should be noted that the relay resistance value R0 being taken as 10 kΩ is based on actual test data. For all partition lines with abnormalities, more than ninety percent of the partition lines have a resistance value less than 10 kΩ; moreover, the partition lines with a resistance value less than 10 kΩ must be abnormal. According to the calculation formula for the resistance value of the partition line R of the partition = 1 / (1 / R3 + 1 / (R1 + R2)), at this time R3 is much smaller than R1 or R2, and the voltage division is too large. Therefore, hierarchical screening can be performed according to this relay resistance value, screening out most of the qualified products and defective products for the first time, and performing secondary screening on the remaining small part to improve efficiency.

[0070] In addition, if 10 kΩ < R of the partition < 300 kΩ, it is necessary to comprehensively judge whether the partition of the light-dimming liquid crystal film is available by combining the voltage and internal resistance conditions.

[0071] Optionally, as Figure 5 [[ID=ll]]shown, in step S410, for how to comprehensively judge whether the partition of the light-dimming liquid crystal film is available by combining the voltage and internal resistance conditions, it specifically includes the following steps:

[0072] S411, light up the second partition 200 and obtain the voltage division of the first partition 100. Here, lighting up the second partition 200 means applying a voltage of 48 V (volts) to the second partition 200.

[0073] S412, comprehensively judge whether the partition of the light-dimming liquid crystal film is available according to the voltage division of the first partition 100 and the internal resistance conditions.

[0074] If the voltage division of the first partition 100 is V1 and the voltage division of the second partition 200 is V2, then R1 / R3 = V1 / (48 - V1). Here, 48 represents that the working voltage of the film is 48 V; the specific judgment methods include the following three situations:

[0075] (l) If 10 kΩ < R of partition 1 + R of partition 2 - R of the partition < 12 kΩ and V1 is less than 2 V, the first partition 100 is in a completely fog state, and it is considered that the partition line 300 of the film is cut normally. Because when the partition function of the film is normal, when one partition is lit, the voltage division of the other partition adjacent to it is smaller, and there will be no phenomena such as becoming transparent or flickering (the film needs an initial voltage of about 3 V - 5 V to become transparent).

[0076] (2) If 12 kΩ < R partition 1 + R partition 2 - R partition < 27 kΩ and V1 is between 2 V and 5 V, it indicates that the first partition 100 is slightly transparent. At this time, by closing the second partition 200, the second partition 200 is equivalent to a power source at this time, and it is discharged by using it, so that the first partition 100 generates a flashing phenomenon, and then it is judged whether the diaphragm is abnormal. If there is a flash, it is determined that the diaphragm is abnormal. Among them, "slightly transparent" means that due to the low voltage, the liquid crystal does not turn completely, resulting in the scattered light passing through. At this time, looking through the diaphragm is like looking through fog, and only the outline can be seen.

[0077] Optionally, when 12 kΩ < R partition 1 + R partition 2 - R partition < 27 kΩ, the dimming liquid crystal film to be detected is sent to the test area for long-term power-on for power-on repair (repair can be achieved only for the case of slight connection). Because when a short-circuit occurs, most of the cases are due to slight connection on the partition line 300, etc., and in a few cases, a small section of the line is not cut. Therefore, through long-term power-on, the temperature of the slightly connected point rises, so as to burn off the slightly connected point. However, if a small section of the partition line 300 is not cut or there are too many connections, etc., it cannot be solved by power-on.

[0078] (3) If 27 kΩ < R partition 1 + R partition 2 - R partition < 300 kΩ and V1 > 5 V, the first partition 100 is in an obvious transparent state, and it is determined that the diaphragm is abnormal.

[0079] It should be noted that in this embodiment, the basis for judging whether the partition of the dimming film is available through the internal resistance value range of R partition 1 + R partition 2 - R partition is as follows: When R1 / R3 = V1 / (48 - V1), according to the fluctuation range of R1 and R2 themselves, the resistance values of R partition 1, R partition 2, and R partition are calculated, and then the resistance value difference of R partition 1 + R partition 2 - R partition is used to reflect R1 / R3, so as to reflect the voltage division situation of the first partition. Because R1, R2, and R3 cannot be directly measured in the partition film and can only be tested by cutting the film, an indirect method can only be adopted for characterization.

[0080] In some embodiments, for the case of collinear plane cutting damage (for example: when cutting the partition line 300, the power is too large or affected by other factors, and the collinear plane is cut. At this time, the partition line 300 is cut off), the judgment of the abnormal cutting of the partition line 300 in S400 also includes:

[0081] For the diaphragm with collinear electrodes covering all partitions, the influence of collinear plane cutting damage is small and it can be not tested. For the partition film with collinear electrodes only connecting the last two areas, the influence of collinear plane cutting damage is large.

[0082] Therefore, it is also judged separately in two cases:

[0083] (1)If 400 kΩ < R partition < OL, it is determined that the common line surface of the partition line 300 of the partition to be measured is not completely cut off, which has no effect on power-on.

[0084] Specifically, theoretically, there is a situation where 400 kΩ < R partition < OL (the reason for the large partition resistance value is that the common line surface is cut, and the area through which the current can flow becomes smaller, which is equivalent to a smaller cross-sectional area of the resistor, that is, the resistance value increases). However, this situation rarely occurs in actual production. Therefore, it is only marked as a possible defective product and requires further detailed research by engineers to determine.

[0085] (2)If R partition shows OL, it is determined that the common line surface of the partition line 300 of the partition to be measured is completely cut off.

[0086] The detection method for abnormal cutting of the dimming film partition line 300 provided by the embodiment of the present invention first places the dimming film to be measured in a detection environment with constant temperature and humidity. Through the analysis of the equivalent circuit of the film and the detection of the parallel internal resistance of the corresponding equivalent circuit, by pre-controlling the environmental conditions to reduce the influence of environmental changes on the detected resistance value, it is beneficial to improve the detection accuracy of the internal resistance; comprehensively analyze according to the detected internal resistance situation in the area of the partition line 300, and thus judge the different states of the cutting of the partition line 300 according to different detection results. It does not require long-term power-on detection, can quickly realize the detection of the cutting condition of the entire dimming film partition line 300, has high detection efficiency, and can improve the detection accuracy through the set judgment conditions, ensuring the detection accuracy.

[0087] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0088] The terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more.

[0089] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. In the description of this specification, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for detecting abnormal cutting of partition lines in a dimming liquid crystal film, characterized in that, Including: S100, placing the dimming liquid crystal film to be detected in a detection environment with a preset temperature and humidity; S200, determining adjacent待测 partitions of the dimming liquid crystal film, and obtaining the internal resistance corresponding to the待测 partition under this temperature and humidity condition; the待测 partition includes adjacent first and second partitions, and the area between the first partition and the second partition is the partition line area; S300, determining the parallel resistance value corresponding to the partition line area according to the internal resistance of the first partition and the internal resistance of the second partition; S400, when it is confirmed that the parallel resistance value corresponding to the partition line area is less than the minimum value of the preset resistance value, it is determined that there is an abnormality in the cutting of the partition line.

2. The method for detecting abnormal cutting of dimming liquid crystal film partition lines according to claim 1, characterized in that, The internal resistance of the first partition is R1, the internal resistance of the second partition is R2, and the equivalent internal resistance of the partition line is R3; The parallel resistance value corresponding to the partition line area is R partition, R partition = 1 / (1 / R3 + 1 / (R1 + R2)); when cutting normally, 1 / R3 is infinitely close to 0, then R partition = R1 + R2; The parallel resistance value corresponding to the first partition is R partition1, R partition1 = 1 / (1 / R1 + 1 / (R2 + R3)); The parallel resistance value corresponding to the second partition is R partition2, R partition2 = 1 / (1 / R2 + 1 / (R1 + R3)).

3. The method for detecting abnormal cutting of dimming liquid crystal film partition lines according to claim 2, characterized in that, The S400 further includes: Setting R1 and R2 to fluctuate between 150 kΩ and 200 kΩ. When it is confirmed that 300 kΩ < R partition < 400 kΩ, it is determined that there is no abnormality in the cutting of the partition line of the待测 partition; where the minimum value of the preset resistance value is 300 kΩ.

4. The method for detecting abnormal cutting of dimming liquid crystal film partition lines according to claim 3, characterized in that, In the S400, when it is confirmed that the parallel resistance value corresponding to the partition line area is less than the minimum value of the preset resistance value, determining that there is an abnormality in the cutting of the partition line includes: S410, if the parallel resistance value R partition corresponding to the partition line area is greater than the relay resistance value R0 and less than the preset resistance value, it is necessary to comprehensively judge whether the partition of the dimming liquid crystal film is available in combination with the voltage and internal resistance conditions; S420, if the parallel resistance value corresponding to the partition line area is less than or equal to the relay resistance value R0, it is confirmed that the partition line is not cut, and it is directly determined as defective.

5. The method for detecting abnormal cutting of dimming liquid crystal film partition lines according to claim 4, characterized in that, The relay resistance value R0 is taken as 10 kΩ.

6. The method for detecting abnormal cutting of dimming liquid crystal film partition lines according to claim 4, characterized in that, In the S410, comprehensively judging whether the partition of the dimming liquid crystal film is available in combination with the voltage and internal resistance conditions includes: S411, lighting the second partition and obtaining the partial voltage of the first partition; S412, comprehensively judging whether the partition of the dimming liquid crystal film is available according to the partial voltage of the first partition and the internal resistance conditions; Among them, the partial voltage of the first partition is V1, and the partial voltage of the second partition is V2, then R1 / R3 = V1 / (48 - V1); [[ID= If 12 kΩ < R partition 1 + R partition 2 - R < 27 kΩ and V1 is between 2 V and 5 V, it indicates that the first partition is slightly transmissive; at this time, by turning off the second partition and using the second partition to discharge like a power supply, a flashing phenomenon is generated in the first partition, and then it is judged whether the diaphragm is abnormal. If there is flashing, the diaphragm is judged to be abnormal; If 27 kΩ < R partition 1 + R partition 2 - R < 300 kΩ and V1 > 5 V, the first partition is in an obvious transmissive state, and the diaphragm is judged to be abnormal.

7. The method for detecting abnormal cutting of dimming liquid crystal film partition lines according to claim 2, characterized in that, The S400 further includes: If 400 kΩ < R partition < OL, it is determined that the coplanar surface of the partition line of the待测 partition is not completely cut off and has no effect on power-on; If R partition shows OL, it is determined that the coplanar surface of the partition line of the待测 partition is completely cut off.

8. The method for detecting abnormal cutting of dimming liquid crystal film partition lines according to claim 6, characterized in that, When 12 kΩ < R partition 1 + R partition 2 - R < 27 kΩ, the dimming liquid crystal film to be detected is sent to the test area for long-term power-on for power-on repair.

9. The method for detecting abnormal cutting of dimming liquid crystal film partition lines according to claim 1, characterized in that, In the S100, placing the dimming liquid crystal film to be detected in a detection environment with a preset temperature and humidity includes: Placing the dimming liquid crystal film to be detected in a detection environment with a temperature of 5°C to 55°C and a humidity maintained at 20% to 80%; After the placement time reaches 2 H, the dimming liquid crystal film to be detected is transferred to the test area for internal resistance detection.

10. A detection system for abnormal cutting of dimming liquid crystal film partition lines, characterized in that, For implementing the detection method for abnormal cutting of the partition line of the dimming liquid crystal film according to any one of claims 1 to 9.

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