Photosensitive resin composition and chip

By using a mixed photocrosslinker in the photosensitive resin composition, the exposure window is widened, the problem of reproducing the performance of the photosensitive composition under different conditions is solved, and higher process tolerance and chip quality stability are achieved.

CN120669475APending Publication Date: 2025-09-19CHANGZHOU LEADER NEW ELECTRONIC MATERIALS CO LTD +1
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202410318744.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-03-19
Publication Date
2025-09-19

AI Technical Summary

Technical Problem

Existing photosensitive compositions have a narrow exposure window and low tolerance in the photoresist process, making it difficult to reproduce excellent performance under different machines, different process conditions, and different time periods.

Method used

A mixed photocrosslinking agent is used, including a first difunctional acrylate and an optional second difunctional acrylate or multifunctional acrylate, and the exposure window of the photosensitive resin composition is broadened by controlling the proportion and type of each component.

Benefits of technology

Provide a wide exposure window in different application scenarios, improve the tolerance of the process technology, reduce process difficulty, and improve chip quality and stability.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120669475A_ABST
    Figure CN120669475A_ABST
Patent Text Reader

Abstract

The invention provides a photosensitive resin composition and a chip. The photosensitive resin composition comprises a photosensitive polyimide resin precursor, a photo-crosslinking agent, a photoinitiator and an organic solvent, the photo-crosslinking agent is selected from a mixture of a first bifunctional acrylate and an optional second bifunctional acrylate, or is selected from a mixture of a first bifunctional acrylate and a multifunctional acrylate; the first bifunctional acrylate is a mixture of compounds with different q values and structures, and R1'is selected from hydrogen, a C1-C20 straight-chain alkyl group or a C1-C20 branched-chain alkyl group; r2'is selected from a straight chain alkyleneoxy group of C1 to C20 or a branched chain alkyleneoxy group of C1 to C20; and q is any integer from 1 to 20. The exposure window of the photosensitive resin composition is wide, and the tolerance of a photoresist manufacturing process can be effectively improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a photosensitive resin composition and a chip. Background Art

[0002] Photosensitive polyimide (PSPI) is a class of high-performance polymers with excellent comprehensive properties. Depending on the application, polyimide must meet complex performance requirements, such as high-temperature stability, low dielectric constant, low stress accumulation, mechanical stability, high elongation at break and flexibility, excellent adhesion, good planarization performance, low water absorption and chemical resistance. Improving the lithography window tolerance of photosensitive polyimide compositions is of great significance for applications in different scenarios.

[0003] During the photoresist manufacturing process, exposure windows can vary due to various factors, such as different machines, different process conditions, and different time periods for different application scenarios. This results in a low tolerance for photoresist manufacturing processes. Furthermore, a narrow window complicates the photoresist manufacturing process, making it difficult to replicate the excellent performance of the photosensitive composition in different application scenarios. Previously, photocrosslinkers used in photosensitive compositions were mostly single-component crosslinkers. Using a single-component crosslinker results in a narrow photoresist window. While adjusting the ratio of the single-component crosslinker can shift the entire window toward higher or lower exposure energy zones, it is difficult to change the window width, making it difficult to meet the requirements of different application scenarios, such as those caused by different machines, different process conditions, or different time periods for photosensitive compositions.

[0004] Therefore, it is necessary to increase the exposure window of the photosensitive composition and improve the process tolerance of the photoresist process. Summary of the Invention

[0005] The main purpose of the present invention is to provide a photosensitive resin composition and a chip to solve the problems of narrow exposure window of the photosensitive composition and low process tolerance of the photoresist in the prior art.

[0006] To achieve the above object, according to one aspect of the present invention, a photosensitive resin composition is provided, comprising a photosensitive polyimide resin precursor, a photocrosslinking agent, a photoinitiator, and an organic solvent; the photocrosslinking agent is selected from a mixture of a first difunctional acrylate and an optional second difunctional acrylate, or a mixture of a first difunctional acrylate and a multifunctional acrylate; the first difunctional acrylate is a mixture of compounds having different q values ​​and having a structure represented by general formula (I), and the second difunctional acrylate is a difunctional acrylate other than the first difunctional acrylate:

[0007]

[0008] In the general formula (I), R1' is selected from hydrogen, a C1-C20 straight-chain alkyl group, or a C1-C20 branched-chain alkyl group; R2' is selected from a C1-C20 straight-chain alkyleneoxy group, or a C1-C20 branched-chain alkyleneoxy group;

[0009] Any hydrogen in the general formula (I) may be optionally replaced by a hydroxyl group, a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group, or a substituted phenyl group; the substituent of the substituted phenyl group is one or more of a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group, and a halogen; and q is any integer from 1 to 20.

[0010] Furthermore, in the first difunctional acrylate, the compound of the general formula (I) with q=2-5 accounts for 70-95wt%; preferably, the compound of the general formula (I) with q=2 is used as the first component, the compound of the general formula (I) with q=3 is used as the second component, the compound of the general formula (I) with q=4 is used as the third component, and the compound of the general formula (I) with q=5 is used as the fourth component; the content of the first component is 2-10wt%, the content of the second component is 15-35wt%, the content of the third component is 20-55wt%, and the content of the fourth component is 15-25wt%.

[0011] Furthermore, relative to the total amount of the first difunctional acrylate, the content of the first component is 5-10wt%, the content of the second component is 25-35wt%, the content of the third component is 25-38wt%, the content of the fourth component is 15-25wt%, and the total content of the first component, the second component, the third component, and the fourth component is 80-95%; preferably, the first difunctional acrylate also includes other components, and the other components are 0.001-3wt% of the compound of general formula (I) with q=1 and 2-20wt% of the compound of general formula (I) with q=6-20.

[0012] Furthermore, the second difunctional acrylate is a compound having a structure represented by general formula (II); Any hydrogen atom in the general formula (II) is optionally substituted by a hydroxyl group, a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group, or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group, and a halogen group; wherein R1 is selected from hydrogen, a C1-C20 straight-chain alkyl group, or a C1-C20 branched-chain alkyl group; R2 is selected from a C1-C20 straight-chain alkyleneoxy group, a C1-C20 branched-chain alkyleneoxy group; R3 is selected from a phenylene group, C1-C20 straight-chain alkyl or C1-C20 branched-chain alkyl; wherein R7, R8 and R9 are independently selected from C1-C10 straight-chain alkylene or C1-C10 branched-chain alkylene.

[0013] Furthermore, the multifunctional acrylate is a compound having a structure represented by general formula (III), general formula (IV) or general formula (V):

[0014]

[0015] wherein R1 is selected from hydrogen, C1-C20 straight chain alkyl or C1-C20 branched chain alkyl; R2 is selected from C1-C20 straight chain alkyleneoxy or C1-C20 branched chain alkyleneoxy; R3 is selected from phenylene, C1-C20 straight-chain alkyl or C1-C20 branched-chain alkyl; wherein R7, R8 and R9 are independently selected from C1-C10 straight-chain alkylene or C1-C10 branched-chain alkylene; R4 is selected from hydrogen, hydroxy, C1-C20 straight-chain alkyl, C1-C20 branched-chain alkyl, C1-C20 straight-chain alkoxy or C1-C20 branched-chain alkoxy; R5 and R6 are independently selected from hydrogen, C1-C20 straight-chain alkyl, C1-C20 branched-chain alkyl or C1-C20 branched-chain alkyl. R1 and R2 have the same definitions as above; any hydrogen atom in general formula (III), general formula (IV) and general formula (V) is optionally substituted by a hydroxyl group, a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group and a halogen; m, n, a, b, c, d, e, f, g, h, i, j and k are independently selected from any integer from 0 to 20, and p is any integer from 0 to 10.

[0016] Furthermore, in the first difunctional acrylate, R1' is selected from hydrogen, a C1-C5 straight-chain alkyl group, or a C1-C5 branched-chain alkyl group; R2' is selected from a C1-C10 straight-chain alkyleneoxy group, or a C1-C10 branched-chain alkyleneoxy group; any hydrogen atom in the general formula (I) is optionally substituted by a hydroxyl group, a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, and a halogen; q is any integer from 1 to 10; in the second difunctional acrylate, R1 is selected from hydrogen, a C1-C5 straight-chain alkyl group, or a C1-C5 branched-chain alkyl group; R 2 is selected from C1-C10 straight-chain alkyleneoxy or C1-C10 branched-chain alkyleneoxy; any one of the hydrogen atoms in the general formula (II) is optionally substituted by a hydroxyl group, a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, and a halogen; m and n are independently selected from any integer of 0-10; in the multifunctional acrylate, R1 is selected from hydrogen, a C1-C5 straight-chain alkyl group, or a C1-C5 branched-chain alkyleneoxy group; R2 is selected from a C1-C10 straight-chain alkyleneoxy group, or a C1-C10 branched-chain alkyleneoxy group; R3 is selected from a phenylene group, C1-C5 straight-chain alkyl or C1-C5 branched-chain alkyl; wherein R7, R8 and R9 are independently selected from C1-C5 straight-chain alkylene or C1-C5 branched-chain alkylene; R4 is selected from hydrogen, hydroxy, C1-C5 straight-chain alkyl, C1-C5 branched-chain alkyl, C1-C5 straight-chain alkoxy, C1-C5 branched-chain alkoxy; R5 and R6 are independently selected from hydrogen, C1-C5 straight-chain alkyl, C1-C5 branched-chain alkyl or Any hydrogen atom in the general formula (III), general formula (IV) and general formula (V) may be optionally substituted by a hydroxyl group, a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group and a halogen; a, b, c, d, e, f, g, h, i, j and k are independently selected from any integer from 0 to 10, and p is any integer from 0 to 5.

[0017] Furthermore, in the first difunctional acrylate, R1' is selected from hydrogen, a C1-C5 linear alkyl group or a C1-C5 branched alkyl group; R2' is selected from Any hydrogen atom in the general formula (I) may be optionally substituted by a hydroxyl group, a C1-C5 linear alkyl group, a C1-C5 branched alkyl group, a phenyl group, or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 linear alkyl group, a C1-C5 branched alkyl group, a phenyl group, and a halogen group; q is any integer from 1 to 10; in the second difunctional acrylate, R1 is selected from hydrogen, a C1-C5 linear alkyl group, or a C1-C5 branched alkyl group; R2 is selected from Any hydrogen atom in the general formula (II) may be optionally substituted by a hydroxyl group, a C1-C5 linear alkyl group, a C1-C5 branched alkyl group, a phenyl group, or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 linear alkyl group, a C1-C5 branched alkyl group, a phenyl group, and a halogen group; m and n are independently selected from any integer from 0 to 10; in the multifunctional acrylate, R1 is selected from hydrogen, a C1-C5 linear alkyl group, or a C1-C5 branched alkyl group; R2 is selected from R3 is selected from R4 is selected from hydrogen, hydroxy, C1-C5 straight-chain alkyl, C1-C5 branched-chain alkyl, C1-C5 straight-chain alkoxy, C1-C5 branched-chain alkoxy; R5 and R6 are independently selected from hydrogen, C1-C5 straight-chain alkyl, C1-C5 branched-chain alkyl or Any hydrogen atom in the general formula (III), general formula (IV) and general formula (V) may be optionally substituted by a hydroxyl group, a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group and a halogen; a, b, c, d, e, f, g, h, i, j and k are independently selected from any integer from 0 to 10, and p is any integer from 0 to 5.

[0018] Furthermore, in the first difunctional acrylate, R1' is selected from hydrogen, C1-C3 straight chain alkene alkyl, C1-C3 branched chain alkene alkyl; R2' is selected from q is any integer from 1 to 10; in the second difunctional acrylate, R1 is selected from hydrogen, a C1 to C5 straight chain alkyl group or a C1 to C5 branched chain alkyl group; R2 is selected from m and n are independently selected from any integer from 0 to 10; in the multifunctional acrylate, R1 is selected from hydrogen, a C1 to C5 straight chain alkyl group or a C1 to C5 branched chain alkyl group; R2 is selected from R3 is selected from a C1-C5 straight-chain alkyl group or a C1-C5 branched-chain alkyl group; R4 is selected from hydrogen, a C1-C5 straight-chain alkyl group or a C1-C5 branched-chain alkyl group; R5 and R6 are independently selected from hydrogen, a C1-C5 straight-chain alkyl group or a C1-C5 branched-chain alkyl group; a, b, c, d, e, f, g, h, i, j, k are independently selected from any integer from 0 to 10, and p is any integer from 0 to 5; preferably, the first difunctional acrylate is one or more of polyethylene glycol dimethacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, polypropylene glycol methyl diacrylate, polytetramethylene glycol diacrylate, 2-hydroxy-3-propyl methacrylate, hexanediol diacrylate and nonanediol diacrylate; more preferably polyethylene glycol dimethacrylate and polyethylene glycol diacrylate and / or the second difunctional acrylate is one or more of tricyclodecanemethanol diacrylate, epoxidized bisphenol A diacrylate, benzyl dimethacrylate and ethoxylated trimethylolpropane trimethacrylate; and / or the multifunctional acrylate is one or more of trimethylolpropane trimethacrylate, pentaerythritol tetraacrylate and dipentaerythritol acrylate; and / or when the photocrosslinker is a mixture of the first difunctional acrylate and the second difunctional acrylate, the second difunctional acrylate is 0.001 to 50% of the photocrosslinker by weight; when the photocrosslinker is a mixture of the first difunctional acrylate and the multifunctional acrylate, the multifunctional acrylate is 0.001 to 50% of the photocrosslinker by weight.

[0019] Furthermore, the photosensitive resin composition comprises, by mass percentage, 10 to 80% of a photosensitive polyimide precursor, 0.001 to 20% of a photocrosslinker, 0.001 to 10% of a photoinitiator and 10 to 80% of an organic solvent; preferably, the photosensitive resin composition comprises 30 to 60% of a photosensitive polyimide precursor, 0.1 to 10% of a photocrosslinker, 0.1 to 3% of a photoinitiator and 30 to 65% of an organic solvent.

[0020] Furthermore, the photosensitive polyimide precursor is a compound represented by formula (VI); wherein at least one of R1″ and R2″ is a monovalent organic group containing a carbon-carbon unsaturated double bond;

[0021] X is a combination of one or more of the following groups: Wherein, R3" is selected from -O-, -S-, Arylene, keto or sulfone; preferably, the arylene group has one of the following structures: Y has one of the following structures: Wherein, R4″ and R5″ are independently selected from hydrogen, alkyl, alkoxy or trifluoromethyl, R6″ is selected from O, S, carbonyl, sulfone or sulfoxide; R7″ is selected from carboxyl, trifluoromethyl, alkyl, alkoxy or halogen; in terms of molar ratio, the molar ratio of X and Y is (1.5-0.5):1, preferably (1.5-1.0):1, and the weight average molecular weight of the photosensitive polyimide precursor is 5000-50000, preferably 10000-20000; preferably, the photosensitive polyimide precursor dianhydride is PMDA, BPDA, ODPA, BTDA, etc., and the diamine is one or more of MPD, ODA, 4,4-diamino-2,2'-bistrifluoromethylbiphenyl and 4,4'-diamino-2,2'-dimethylbiphenyl.

[0022] Furthermore, the organic solvent is selected from one or more of amides, lactones, sulfoxides, ketones, ethers, halogenated hydrocarbons, hydrocarbons and tetramethylureas, preferably one or more of N-methyl-2-pyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, dimethyl sulfoxide, tetramethylurea, γ-butyrolactone and ethyl lactate.

[0023] Furthermore, the photoinitiator is one or more of an oxime-based photoinitiator, a benzophenone-based photoinitiator, an aminoketone-based photoinitiator, and an aromatic titanium-based photoinitiator; wherein the oxime-based photoinitiator has a structure represented by the general formula (VII) or the general formula (VIII): Pass In the general formula (VII), Z is empty or a C1-C5 alkylene group; W is selected from O, S, NR 20 ” or CR 20 ”R 21 ”, R 20 ”、R 21" are independently selected from hydrogen, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, and alkyl containing unsaturated bonds; preferably, the alkyl containing unsaturated bonds is selected from allyl or butenyl; in general formula (VII) and general formula (VIII), R7" is selected from C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, alkoxy, phenyl or substituted phenyl; preferably, the substituent of the substituted phenyl is one or more of C1-C20 straight-chain alkyl, C1-C20 branched alkyl, phenyl and halogen; R8" is selected from hydrogen, a C1-C20 straight-chain alkyl group, a C3-C20 cycloalkyl group, a C4-C20 cycloalkylalkyl group, a C4-C20 alkylcycloalkyl group, a phenyl group, a C1-C20 straight-chain alkyl group, a C3-C20 cycloalkyl group, a C4-C20 cycloalkylalkyl group, a C4-C20 alkylcycloalkyl group, or a C7-C20 aryl group; wherein any hydrogen in the C1-C20 straight-chain alkyl group, the C3-C20 cycloalkyl group, the C4-C20 cycloalkylalkyl group, the C4-C20 alkylcycloalkyl group, or the C7-C20 aryl group may be replaced by a substituent, and the substituent is one or more of halogen, nitro, hydroxyl, carboxyl, sulfonic acid, amino, cyano, and alkoxy; R9", R 10 ”、R 11 ”、R 12 ”、R 13 ”、R 14 ”、R 15 ”、R 16 ”、R 17 ”、R 18 ”、R 19 " are independently selected from hydrogen, halogen, nitro, hydroxyl, carboxyl, sulfonic acid, amino, cyano, alkoxy, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl or C4-C20 alkylcycloalkyl; wherein any hydrogen in the C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl or C4-C20 alkylcycloalkyl is optionally substituted by a substituent, and the substituent is one or more of halogen, nitro, hydroxyl, carboxyl sulfonic acid, amino, cyano and alkoxy; the benzophenone photoinitiator has the structure shown in the general formula (IX): In the general formula (IX), R 22 ”、R 23" are independently selected from hydrogen, phenyl, alkylbenzene, halogen, nitro, cyano, C1-C20 linear alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, amino, dimethylamino or diethylamino; the aminoketone photoinitiator has any of the structures shown in general formula (X) and general formula (XI): In the general formula (X), R 24 " is selected from hydrogen, phenyl, alkylbenzene, halogen, nitro, cyano, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, methylthio, alkoxy or hydroxyethylthio; in the general formula (XI), R 25 " is selected from hydrogen, C1-C20 linear alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, allyl or butenyl; R 26 " is selected from hydrogen, phenyl, alkylbenzene, halogen, nitro, cyano, C1-C20 linear alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, methylthio, alkoxy or hydroxyethylthio; the titanocene photoinitiator has the structure shown in the general formula (XII): In the general formula (XII), R 27 " is selected from hydrogen, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl or C4-C20 alkylcycloalkyl; R 28 " is selected from hydrogen, pyrrole or C1-C20 alkyl substituted amino, preferably hydrogen, diethylamino or dimethylamino; preferably, the photoinitiator is one or more of an oxime ester photoinitiator, a benzophenone photoinitiator, an aminoketone photoinitiator and a titanocene initiator; more preferably, the oxime ester photoinitiator is One or more of; Benzophenone photoinitiator is One or more of; aminoketone photoinitiator is One or more of; titanocene initiator is One or more of.

[0024] According to another aspect of the present invention, there is provided a use of the above-mentioned photosensitive resin composition as a photoresist in chip manufacturing.

[0025] By limiting the type and ratio of the crosslinking agent in the photosensitive resin composition, the present invention can broaden the exposure window of the photosensitive resin composition, effectively improving the tolerance of the manufacturing process. This allows the photosensitive resin composition to provide a wide exposure window in various application scenarios, including different machines, different process conditions, and different time periods. The photosensitive resin composition also requires less testing, verification, and production processes. When used in chip manufacturing, the chip preparation process requirements are relatively relaxed, resulting in high-quality and stable chips. DETAILED DESCRIPTION

[0026] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the embodiments.

[0027] It should be noted that, in this application, “*” means a group connection site.

[0028] As described in the background of the present invention, the prior art suffers from the narrow exposure window of photosensitive compositions and the low process tolerance of photoresist manufacturing. To address the above issues, in a typical embodiment of the present invention, a photosensitive resin composition is provided, comprising a photosensitive polyimide resin precursor, a photocrosslinker, a photoinitiator, and an organic solvent; the photocrosslinker is selected from a mixture of a first difunctional acrylate and an optional second difunctional acrylate, or a mixture of a first difunctional acrylate and a multifunctional acrylate; the first difunctional acrylate is a mixture of compounds having different q values ​​and having the structure represented by general formula (I), and the second difunctional acrylate is a difunctional acrylate other than the first difunctional acrylate:

[0029]

[0030] In the general formula (I), R1' is selected from hydrogen, a C1-C20 straight-chain alkyl group, or a C1-C20 branched-chain alkyl group; R2' is selected from a C1-C20 straight-chain alkyleneoxy group, or a C1-C20 branched-chain alkyleneoxy group; any hydrogen in the general formula (I) may be optionally substituted by a hydroxyl group, a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group, or a substituted phenyl group; the substituent of the substituted phenyl group is one or more of a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group, and a halogen; and q is any integer from 1 to 20.

[0031] During preliminary experiments, the exposure window of the photosensitive polyimide resin composition changed after exposure and development in different application scenarios, such as different machines, different process conditions, and different time periods. In particular, the photosensitive polyimide resin composition, which has a relatively narrow window itself, has an extremely narrow available exposure window in different application scenarios, resulting in a small range of variation in its exposure time and exposure energy. This, in turn, leads to strict requirements on the exposure conditions of the process technology, low fault tolerance, and poor process stability. The polyimide composition is easily affected by slight changes in exposure conditions, resulting in quality problems.

[0032] The inventors unexpectedly discovered that by controlling the type of photocrosslinker in a photosensitive polyimide resin composition within a specific range, the exposure window of the photosensitive resin composition can be broadened, effectively improving the process tolerance. This allows the photosensitive resin composition to provide a wide exposure window in various application scenarios, including different machines, different process conditions, and different time periods. Furthermore, the photosensitive resin composition requires minimal testing, verification, and production process testing. When used in chip production, the resulting chips are high-quality and highly stable.

[0033] In a preferred embodiment, in the first difunctional acrylate, the compound of formula (I) with q=2-5 accounts for 70-95 wt %. Preferably, the compound of formula (I) with q=2 is used as the first component, the compound of formula (I) with q=3 is used as the second component, the compound of formula (I) with q=4 is used as the third component, and the compound of formula (I) with q=5 is used as the fourth component. The content of the first component is 2-10 wt %, the content of the second component is 15-35 wt %, the content of the third component is 20-55 wt %, and the content of the fourth component is 15-25 wt %. By controlling the ratio of each component in the photocrosslinking agent of the photosensitive polyimide resin composition within the above range, or by adding other acrylates in a certain proportion thereto, the effect of widening the exposure window can be more effectively achieved, so that a wider window can be used in different situations, thereby more effectively improving the process tolerance, further reducing the process difficulty, and more conducive to improving the quality and stability of the product.

[0034] In order to ensure the quality and stability of the chip, it is necessary to ensure the exposure window and process tolerance of the photosensitive composition. In a preferred embodiment, relative to the total amount of the first difunctional acrylate, the content of the first component is 5-10wt%, the content of the second component is 25-35wt%, the content of the third component is 25-38wt%, and the content of the fourth component is 15-25wt%, and the total content of the first component, the second component, the third component, and the fourth component (q=2-5) accounts for 80-95%; preferably, the first difunctional acrylate also includes other components, and the other components are 0.001-3wt% of the compound of formula (I) with q=1 and 2-20wt% of the compound of formula (I) with q=6-20. Under the above conditions, the photosensitive resin composition has a wider lithography window range under different circumstances, a better effect of widening the exposure window, a higher process tolerance, a more significant reduction in process difficulty, a more stable residual film rate of the photoresist, and a more stable and controllable product quality.

[0035] In order to further increase the exposure window of the photosensitive composition and improve the process latitude, the photocrosslinking agent may also be a mixture of the first difunctional acrylate and the second difunctional acrylate. In a preferred embodiment, the second difunctional acrylate is a compound having a structure represented by general formula (II);

[0036]

[0037] Any hydrogen atom in the general formula (II) is optionally substituted by a hydroxyl group, a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group, or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group, and a halogen group; wherein R1 is selected from hydrogen, a C1-C20 straight-chain alkyl group, or a C1-C20 branched-chain alkyl group; R2 is selected from a C1-C20 straight-chain alkyleneoxy group, a C1-C20 branched-chain alkyleneoxy group; R3 is selected from a phenylene group, C1-C20 straight-chain alkyl or C1-C20 branched-chain alkyl; wherein R7, R8 and R9 are independently selected from C1-C10 straight-chain alkylene or C1-C10 branched-chain alkylene.

[0038] In order to ensure the exposure window of the photosensitive composition and to further guarantee the quality and stability of the product, the photocrosslinker may also be a mixture of a first difunctional acrylate and a multifunctional acrylate. In a preferred embodiment, the multifunctional acrylate is a compound having a structure represented by formula (III), formula (IV) or formula (V):

[0039]

[0040]

[0041] wherein R1 is selected from hydrogen, C1-C20 straight chain alkyl or C1-C20 branched chain alkyl; R2 is selected from C1-C20 straight chain alkyleneoxy or C1-C20 branched chain alkyleneoxy; R3 is selected from phenylene, C1-C20 straight-chain alkyl or C1-C20 branched-chain alkyl; wherein R7, R8 and R9 are independently selected from C1-C10 straight-chain alkylene or C1-C10 branched-chain alkylene; R4 is selected from hydrogen, hydroxy, C1-C20 straight-chain alkyl, C1-C20 branched-chain alkyl, C1-C20 straight-chain alkoxy or C1-C20 branched-chain alkoxy; R5 and R6 are independently selected from hydrogen, C1-C20 straight-chain alkyl, C1-C20 branched-chain alkyl or C1-C20 branched-chain alkyl. R1 and R2 have the same definitions as described above; any hydrogen atom in general formula (III), general formula (IV) and general formula (V) is optionally substituted by a hydroxyl group, a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group or a substituted phenyl group. Preferably, the substituent of the substituted phenyl group is one or more of a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group and a halogen; m, n, a, b, c, d, e, f, g, h, i, j and k are independently selected from any integer from 0 to 20, and p is any integer from 0 to 10.

[0042] In order to further improve the exposure window of the photosensitive resin composition, improve the process tolerance, and ensure product quality and stability, in a preferred embodiment, in the first difunctional acrylate, R1' is selected from hydrogen, C1-C5 straight-chain alkyl or C1-C5 branched alkyl; R2' is selected from C1-C10 straight-chain alkyleneoxy or C1-C10 branched alkyleneoxy; any hydrogen atom in the general formula (I) can be optionally substituted by hydroxyl, C1-C5 straight-chain alkyl, C1-C5 branched alkyl, phenyl, or substituted phenyl; preferably, the substituent of the substituted phenyl is one or more of C1-C5 straight-chain alkyl, C1-C5 branched alkyl, phenyl and halogen; q is any integer from 1 to 10; in the second difunctional acrylate, R1 is selected from hydrogen , C1-C5 straight-chain alkyl or C1-C5 branched-chain alkyl; R2 is selected from C1-C10 straight-chain alkyleneoxy or C1-C10 branched-chain alkyleneoxy; any one of the hydrogen atoms in the general formula (II) is optionally substituted by hydroxyl, C1-C5 straight-chain alkyl, C1-C5 branched-chain alkyl, phenyl, or substituted phenyl; preferably, the substituent of the substituted phenyl is one or more of C1-C5 straight-chain alkyl, C1-C5 branched-chain alkyl, phenyl and halogen; m and n are independently selected from any integer of 0-10; in the multifunctional acrylate, R1 is selected from hydrogen, C1-C5 straight-chain alkyl or C1-C5 branched-chain alkyl; R2 is selected from C1-C10 straight-chain alkyleneoxy or C1-C10 branched-chain alkyleneoxy; R3 is selected from phenylene, C1-C5 straight-chain alkyl or C1-C5 branched-chain alkyl; wherein R7, R8 and R9 are independently selected from C1-C5 straight-chain alkylene or C1-C5 branched-chain alkylene; R4 is selected from hydrogen, hydroxy, C1-C5 straight-chain alkyl, C1-C5 branched-chain alkyl, C1-C5 straight-chain alkoxy, C1-C5 branched-chain alkoxy; R5 and R6 are independently selected from hydrogen, C1-C5 straight-chain alkyl, C1-C5 branched-chain alkyl or Any hydrogen atom in the general formula (III), general formula (IV) and general formula (V) may be optionally substituted by a hydroxyl group, a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group and a halogen; a, b, c, d, e, f, g, h, i, j and k are independently selected from any integer from 0 to 10, and p is any integer from 0 to 5.

[0043] Based on the same or similar reasons, in a preferred embodiment, in the first difunctional acrylate, R1' is selected from hydrogen, C1-C5 linear alkyl or C1-C5 branched alkyl; R2' is selected from or alkyl; any hydrogen atom in the general formula (I) is optionally substituted by a hydroxyl group, a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, and a halogen; q is any integer from 1 to 10; in the second difunctional acrylate, R1 is selected from hydrogen, a C1-C5 straight-chain alkyl group, or a C1-C5 branched-chain alkyl group; R2 is selected from Any hydrogen atom in the general formula (II) may be optionally substituted by a hydroxyl group, a C1-C5 linear alkyl group, a C1-C5 branched alkyl group, a phenyl group, or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 linear alkyl group, a C1-C5 branched alkyl group, a phenyl group, and a halogen group; m and n are independently selected from any integer from 0 to 10; in the multifunctional acrylate, R1 is selected from hydrogen, a C1-C5 linear alkyl group, or a C1-C5 branched alkyl group; R2 is selected from R3 is selected from R4 is selected from hydrogen, hydroxy, C1-C5 straight-chain alkyl, C1-C5 branched-chain alkyl, C1-C5 straight-chain alkoxy, C1-C5 branched-chain alkoxy; R5 and R6 are independently selected from hydrogen, C1-C5 straight-chain alkyl, C1-C5 branched-chain alkyl or Any hydrogen atom in the general formula (III), general formula (IV) and general formula (V) may be optionally substituted by a hydroxyl group, a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group and a halogen; a, b, c, d, e, f, g, h, i, j and k are independently selected from any integer from 0 to 10, and p is any integer from 0 to 5.

[0044] Based on the same or similar reasons, in a preferred embodiment, in the first difunctional acrylate, R1' is selected from hydrogen, C1-C5 straight chain alkene alkyl, C1-C5 branched chain alkene alkyl; R2' is selected from q is any integer from 1 to 10;

[0045] In the second difunctional acrylate, R1 is selected from hydrogen, C1-C3 linear alkyl or C1-C3 branched alkyl; R2 is selected from m and n are independently selected from any integer from 0 to 10;

[0046] In the multifunctional acrylate, R1 is selected from hydrogen, C1-C5 linear alkyl or C1-C5 branched alkyl; R2 is selected from R3 is selected from a C1-C5 straight-chain alkyl group or a C1-C5 branched-chain alkyl group; R4 is selected from hydrogen, a C1-C5 straight-chain alkyl group or a C1-C5 branched-chain alkyl group; R5 and R6 are independently selected from hydrogen, a C1-C5 straight-chain alkyl group or a C1-C5 branched-chain alkyl group; a, b, c, d, e, f, g, h, i, j, k are independently selected from any integer from 0 to 10, and p is any integer from 0 to 5.

[0047] In a preferred embodiment, the first difunctional acrylate is one or more of polyethylene glycol dimethacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, polypropylene glycol methyl diacrylate, polytetramethylene glycol diacrylate, 2-hydroxy-3-propyl methacrylate, hexanediol diacrylate, and nonanediol diacrylate; preferably one or more of polyethylene glycol dimethacrylate and polyethylene glycol diacrylate. Under these conditions, the first difunctional acrylate better matches the other components of the composition. When used as a photocrosslinker, it can initiate a crosslinking reaction within a wide range of exposure windows in different application scenarios, resulting in a wider process tolerance and enhanced stability and durability of the photosensitive composition.

[0048] In order to make the synergistic effect of the first difunctional acrylate and the second difunctional acrylate or multifunctional acrylate in the photocrosslinker stronger, in a preferred embodiment, the second difunctional acrylate is one or more of tricyclodecanemethanol diacrylate, epoxidized bisphenol A diacrylate, benzyl dimethacrylate and ethoxylated trimethylolpropane trimethacrylate; and / or the multifunctional acrylate is one or more of trimethylolpropane trimethacrylate, pentaerythritol tetraacrylate and dipentaerythritol acrylate.

[0049] In order to better match the photocrosslinker with other components in the composition, in a preferred embodiment, when the photocrosslinker is a mixture of a first difunctional acrylate and a second difunctional acrylate, the second difunctional acrylate is 0.001 to 50% of the photocrosslinker by weight; when the photocrosslinker is a mixture of a first difunctional acrylate and a multifunctional acrylate, the multifunctional acrylate is 0.001 to 50% of the photocrosslinker by weight.

[0050] To ensure synergistic coordination among the components of the photosensitive resin composition, thereby further improving the film-forming stability and production efficiency of the photosensitive resin, in a preferred embodiment, the photosensitive resin composition comprises, by weight, 10-80% of a photosensitive polyimide precursor, 0.001-20% of a photocrosslinker, 0.001-10% of a photoinitiator, and 10-80% of an organic solvent. Preferably, the photosensitive resin composition comprises 30-60% of a photosensitive polyimide precursor, 0.1-10% of a photocrosslinker, 0.1-3% of a photoinitiator, and 30-65% of an organic solvent. Under these conditions, the curing temperature of the photosensitive composition is within the range of 200-400°C, meeting process requirements and requiring minimal testing, verification, and production testing.

[0051] In order to further improve the film-forming stability and production efficiency of the photosensitive resin composition, in a preferred embodiment, the photosensitive polyimide precursor is a compound represented by general formula (VI);

[0052]

[0053] wherein at least one of R1″ and R2″ is a monovalent organic group containing a carbon-carbon unsaturated double bond;

[0054] X is a combination of one or more of the following groups:

[0055]

[0056] Wherein, R3" is selected from -O-, -S-, Arylene, keto or sulfone; preferably, the arylene group has one of the following structures:

[0057]

[0058] Y has one of the following structures:

[0059]

[0060] wherein R4″ and R5″ are independently selected from hydrogen, alkyl, alkoxy or trifluoromethyl, R6″ is selected from O, S, carbonyl, sulfone or sulfoxide; R7″ is selected from carboxyl, trifluoromethyl, alkyl, alkoxy or halogen;

[0061] In terms of molar ratio, the molar ratio of X to Y is (1.5 to 0.5):1, preferably (1.5 to 1.0):1, and the weight average molecular weight of the photosensitive polyimide precursor is 5,000 to 50,000, preferably 10,000 to 20,000.

[0062] In a preferred embodiment, the photosensitive polyimide precursor dianhydride is PMDA, BPDA, ODPA, BTDA, or the like, and the diamine is one or more of MPD, ODA, 4,4-diamino-2,2'-bis(trifluoromethyl)biphenyl, and 4,4'-diamino-2,2'-dimethylbiphenyl. A photosensitive polyimide precursor within this range can more effectively participate in the photocrosslinking reaction, and the first difunctional acrylate can more effectively polymerize with the polyimide precursor to form a three-dimensional network structure. This results in a better synergistic effect between the photosensitive polyimide precursor and the first difunctional acrylate, and improves the film-forming stability and production efficiency of the photosensitive resin composition.

[0063] To better adjust the viscosity and fluidity of the photosensitive resin, making it easier to apply and coat, and thus effectively improving its quality, in a preferred embodiment, the organic solvent is selected from one or more of amides, lactones, sulfoxides, ketones, ethers, halogenated hydrocarbons, hydrocarbons, and tetramethylurea. Preferably, the organic solvent is one or more of N-methyl-2-pyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, dimethyl sulfoxide, tetramethylurea, γ-butyrolactone, and ethyl lactate. Under these conditions, the organic solvent exhibits a more synergistic effect with the polyimide precursor, photocrosslinker, and photoinitiator.

[0064] In order to more effectively initiate the photocrosslinking reaction of the photosensitive resin composition, further accelerate the crosslinking reaction, thereby more conducive to shortening the curing time of the photosensitive resin composition and improving the production efficiency of the photosensitive resin composition, in a preferred embodiment, the photoinitiator is one or more of an oxime photoinitiator, a benzophenone photoinitiator, an aminoketone photoinitiator and an aromatic titanium cyclopentadiene photoinitiator;

[0065] Among them, the oxime lipid photoinitiator has a structure represented by the general formula (VII) or the general formula (VIII):

[0066]

[0067] In the general formula (VII), Z is empty or a C1-C5 alkylene group; W is selected from O, S, NR 20 ” or CR 20 ”R 21 ”, R 20 ”、R 21 " are independently selected from hydrogen, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, and alkyl containing unsaturated bonds; preferably, the alkyl containing unsaturated bonds is selected from allyl or butenyl;

[0068] In the general formula (VII) and the general formula (VIII), R7" is selected from C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, alkoxy, phenyl or substituted phenyl; preferably, the substituent of the substituted phenyl is one or more of C1-C20 straight-chain alkyl, C1-C20 branched alkyl, phenyl and halogen; R8" is selected from hydrogen, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, alkoxy, phenyl or substituted phenyl; preferably, the substituent of the substituted phenyl is one or more of C1-C20 straight-chain alkyl, C1-C20 branched alkyl, phenyl and halogen; R9", R 10 ”、R 11 ”、R 12 ”、R 13 ”、R 14 ”、R 15 ”、R 16 ”、R 17 ”、R 18 ”、R 19 " are independently selected from hydrogen, halogen, nitro, hydroxyl, carboxyl, sulfonic acid, amino, cyano, alkoxy, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl or C4-C20 alkylcycloalkyl; wherein any hydrogen in the C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl or C4-C20 alkylcycloalkyl is optionally substituted by a substituent, and the substituent is one or more of halogen, nitro, hydroxyl, carboxylsulfonic acid, amino, cyano and alkoxy;

[0069] Benzophenone photoinitiators have the structure shown in the general formula (IX): general formula

[0070] In the general formula (IX), R 22 ”、R 23 " are independently selected from hydrogen, phenyl, alkylbenzene, halogen, nitro, cyano, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, amino, dimethylamino or diethylamino;

[0071] The aminoketone photoinitiator has any structure represented by the general formula (X) or the general formula (XI):

[0072]

[0073] In the general formula (X), R 24 " is selected from hydrogen, phenyl, alkylbenzene, halogen, nitro, cyano, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, methylthio, alkoxy or hydroxyethylthio; in the general formula (XI), R 25 " is selected from hydrogen, C1-C20 linear alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, allyl or butenyl; R 26 " is selected from hydrogen, phenyl, alkylbenzene, halogen, nitro, cyano, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, methylthio, alkoxy or hydroxyethylthio;

[0074] Aromatic titanium cyclopentadienyl photoinitiator has the structure shown in the general formula (XII):

[0075]

[0076] In the general formula (XII), R 27 " is selected from hydrogen, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl or C4-C20 alkylcycloalkyl; R 28 " is selected from hydrogen, pyrrole or C1-C20 alkyl substituted amino, preferably hydrogen, Diethylamino or dimethylamino;

[0077] Preferably, the photoinitiator is one or more of an oxime-based photoinitiator, a benzophenone-based photoinitiator, an aminoketone-based photoinitiator, and a titanocene-based initiator. More preferably, the oxime-based photoinitiator is One or more of; Benzophenone photoinitiator is One or more of; aminoketone photoinitiator is

[0078] One or more of; titanocene initiator is One or more of.

[0079] In another typical embodiment of the present invention, the use of the above-mentioned photosensitive resin composition as a photoresist in chip manufacturing is also provided. The above-mentioned photosensitive resin composition is used as a photoresist in chip manufacturing, which has relatively loose requirements on chip manufacturing process and the obtained chip is of high quality and strong stability.

[0080] Typically, but not limited to, in the first difunctional acrylate, the compound of formula (I) with q=2-5 accounts for 70 wt%, 80 wt%, 85 wt%, 87.21 wt%, 87.57 wt%, 88.83 wt%, 89.79 wt%, 90 wt%, 90.27 wt%, 94.19 wt%, 94.95 wt%, 95 wt% or a range consisting of any two of these values;

[0081] Typically, but not limited to, in the first difunctional acrylate, the content of the first component is 2wt%, 2.10wt%, 4wt%, 4.36wt%, 5wt%, 5.01wt%, 6wt%, 6.76wt%, 7.96wt%, 8wt%, 8.56wt%, 9.84wt%, 10wt% or a range consisting of any two of them; the content of the second component is 15wt%, 20wt%, 25wt%, 25.34wt%, 26wt%, 26.68wt%, 27wt%, 27.84wt%, 28wt%, 28.78wt%, 29wt%, 29.78wt%, 30wt%, 30.78wt%, 31wt%, 32wt%, 32.45wt%, 33wt%, 34wt%, 35wt% or any two of them % or a range value consisting of any two of the values ​​thereof; the content of the fourth component is 15wt%, 15.23wt%, 15.35wt%, 16.01wt%, 17.29wt%, 19.53wt%, 20wt%, 20.35wt%, 22.2wt%, 25wt% or a range value consisting of any two of the values ​​thereof;

[0082] Typically, but not limited to, in the first difunctional acrylate, the content of the compound of formula (I) with q=1 is 0.001wt%, 0.19wt%, 0.28wt%, 0.29wt%, 0.3wt%, 0.31wt%, 3wt% or a range consisting of any two of them; the content of the compound of formula (I) with q=6-20 is 2wt%, 9.44wt%, 9.9wt%, 10.98wt%, 12.13wt%, 12.51wt%, 20wt% or a range consisting of any two of them;

[0083] Typically, but not limited to, when the photocrosslinking agent is a mixture of a first difunctional acrylate and a second difunctional acrylate, the second difunctional acrylate is 0.001 wt%, 5 wt%, 10 wt%, 20 wt%, 30 wt%, 40 wt%, 50 wt% of the photocrosslinking agent, or a range consisting of any two of these values;

[0084] Typically, but not limited to, when the photocrosslinking agent is a mixture of a first difunctional acrylate and a multifunctional acrylate, the multifunctional acrylate is 0.001 wt%, 5 wt%, 10 wt%, 20 wt%, 30 wt%, 40 wt%, 50 wt% of the photocrosslinking agent, or a range consisting of any two of these values;

[0085] Typically, but not limitatively, the photosensitive resin composition comprises a photosensitive polyimide precursor content of 10 wt%, 30 wt%, 31.3 wt%, 60 wt%, 80 wt% or a range consisting of any two of them; a photocrosslinker content of 0.001 wt%, 0.1 wt%, 2.6 wt%, 10 wt%, 20 wt% or a range consisting of any two of them; a photoinitiator content of 0.001 wt%, 0.1 wt%, 0.84 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt%, 10 wt% or a range consisting of any two of them; and an organic solvent content of 10 wt%, 30 wt%, 65 wt%, 65.2 wt%, 70 wt%, 80 wt% or a range consisting of any two of them.

[0086] The present application is further described in detail below with reference to specific embodiments. These embodiments should not be construed as limiting the scope of protection claimed in this application.

[0087] Example 1

[0088] In a 250 ml reactor, specific amounts of organic solvent, photoinitiator, photocrosslinker and polyimide resin precursor were added in sequence, dry nitrogen was introduced at 23±2°C in the yellow light region, and the mixture was stirred to dissolve the components. After all components were completely dissolved to form a homogeneous dissolved glue solution, the dissolved glue solution was filtered using a 0.2 μm filter membrane to obtain a photosensitive resin composition.

[0089] The organic solvent is N-methyl-2-pyrrolidone, the photoinitiator is a mixture of OXE01 and photoinitiator 1173 (the mass ratio of OXE01 to photoinitiator 1173 is 1:1), and the photocrosslinker is polyethylene glycol diacrylate (relative to the total amount of polyethylene glycol diacrylate, the content of polyethylene glycol diacrylate with n=2 is 7.96wt%, the content of polyethylene glycol diacrylate with n=3 is 28.78wt%, and the content of polyethylene glycol diacrylate with n=4 is 10. The content of n=5 polyethylene glycol diacrylate is 31.30wt%, the content of n=5 polyethylene glycol diacrylate is 19.53wt%, the total proportion of the above four components is 87.57wt%, and it also includes 0.3wt% of n=1 polyethylene glycol diacrylate and 12.13wt% of n=6-10 polyethylene glycol acrylate), the polyimide precursor includes a dianhydride monomer and a diamine monomer (the dianhydride monomer is 4,4'-diphenyl ether tetracarboxylic dianhydride, and the diamine monomer is 4,4'-diaminodiphenyl ether);

[0090] Calculated by mass percentage, the contents of the organic solvent, photoinitiator, photocrosslinking agent and polyimide precursor in the photosensitive composition are 65.2 wt %, 0.84 wt %, 2.6 wt % and 31.3 wt %, respectively.

[0091] The photosensitive composition was placed in a clean room at 23±2℃ and 50±10% RH. The photolithography windows were followed up under different exposure machines (exposure machine 1, exposure machine 2), different soft baking conditions and different development conditions on the same day, 10 days, 20 days and 30 days after storage under the environmental conditions. Combined with the cross-sectional photos, a unified photolithography window that can be used under various conditions was confirmed.

[0092] Example 2

[0093] The only difference from Example 1 is:

[0094] The photocrosslinker is polyethylene glycol diacrylate (relative to the total amount of polyethylene glycol diacrylate, the content of polyethylene glycol diacrylate with n=2 is 5.01wt%, the content of polyethylene glycol diacrylate with n=3 is 32.45wt%, the content of polyethylene glycol diacrylate with n=4 is 27.55wt%, and the content of polyethylene glycol diacrylate with n=5 is 22.2wt%. The total proportion of the above four components is 87.21wt%, and it also includes 0.28wt% of polyethylene glycol diacrylate with n=1 and 12.51wt% of polyethylene glycol acrylate with n=6-10).

[0095] Example 3

[0096] The only difference from Example 1 is:

[0097] The photocrosslinker is polyethylene glycol diacrylate (relative to the total amount of polyethylene glycol diacrylate, the content of polyethylene glycol diacrylate with n=2 is 9.84wt%, the content of polyethylene glycol diacrylate with n=3 is 27.84wt%, the content of polyethylene glycol diacrylate with n=4 is 35.30wt%, and the content of polyethylene glycol diacrylate with n=5 is 17.29wt%. The total proportion of the above four components is 90.27wt%, and also includes 0.29wt% of polyethylene glycol diacrylate with n=1; 9.44wt% of polyethylene glycol acrylate with n=6-10).

[0098] Example 4

[0099] The only difference from Example 1 is:

[0100] The photocrosslinker is polyethylene glycol diacrylate (relative to the total amount of polyethylene glycol diacrylate, the content of polyethylene glycol diacrylate with n=2 is 2.10wt%, the content of polyethylene glycol diacrylate with n=3 is 25.34wt%, the content of polyethylene glycol diacrylate with n=4 is 51.52wt%, and the content of polyethylene glycol diacrylate with n=5 is 15.23wt%. The total proportion of the above four components is 94.19wt%, and it also includes 0.3wt% of polyethylene glycol diacrylate with n=1 and 12.13wt% of polyethylene glycol acrylate with n=6-10).

[0101] Example 5

[0102] The only difference from Example 1 is:

[0103] The photocrosslinker is polyethylene glycol diacrylate (relative to the total amount of polyethylene glycol diacrylate, the content of polyethylene glycol diacrylate with n=2 is 6.76wt%, the content of polyethylene glycol diacrylate with n=3 is 26.68wt%, the content of polyethylene glycol diacrylate with n=4 is 45.50wt%, and the content of polyethylene glycol diacrylate with n=5 is 16.01wt%. The total proportion of the above four components is 94.95wt%, and also includes 0.3wt% of polyethylene glycol diacrylate with n=1; 12.13wt% of polyethylene glycol acrylate with n=6-10).

[0104] Example 6

[0105] The only difference from Example 1 is:

[0106] The photocrosslinker is polyethylene glycol diacrylate (relative to the total amount of polyethylene glycol diacrylate, the content of polyethylene glycol diacrylate with n=2 is 4.36wt%, the content of polyethylene glycol diacrylate with n=3 is 29.78wt%, the content of polyethylene glycol diacrylate with n=4 is 40.30wt%, and the content of polyethylene glycol diacrylate with n=5 is 15.35wt%. The total proportion of the above four components is 89.79wt%, and it also includes 0.31wt% of polyethylene glycol diacrylate with n=1 and 9.90wt% of polyethylene glycol acrylate with n=6-10.

[0107] Example 7

[0108] The only difference from Example 1 is:

[0109] The photocrosslinker is polyethylene glycol diacrylate (relative to the total amount of polyethylene glycol diacrylate, the content of polyethylene glycol diacrylate with n=2 is 8.56wt%, the content of polyethylene glycol diacrylate with n=3 is 30.78wt%, the content of polyethylene glycol diacrylate with n=4 is 29.14wt%, and the content of polyethylene glycol diacrylate with n=5 is 20.35wt%, with the total proportion of the above four components being 88.83wt%). It also includes 0.19wt% of polyethylene glycol diacrylate with n=1 and 10.98wt% of polyethylene glycol acrylates with n=6-10.

[0110] Example 8

[0111] The only difference from Example 1 is:

[0112] The photocrosslinking agent further includes tricyclodecane methanol diacrylate. The content of tricyclodecane methanol diacrylate is 30 wt % relative to the total amount of the photocrosslinking agent.

[0113] Example 9

[0114] The only difference from Example 1 is:

[0115] The photocrosslinking agent further includes trimethylolpropane trimethacrylate. The content of trimethylolpropane trimethacrylate is 30 wt % relative to the total amount of the photocrosslinking agent.

[0116] Example 10

[0117] The only difference from Example 1 is:

[0118] The photocrosslinking agent further comprises pentaerythritol tetraacrylate, and the content of pentaerythritol tetraacrylate is 50 wt % relative to the total amount of the photocrosslinking agent.

[0119] Example 11

[0120] The only difference from Example 10 is:

[0121] The content of pentaerythritol tetraacrylate was 40 wt % relative to the total amount of the photocrosslinking agent.

[0122] Example 12

[0123] The only difference from Example 10 is:

[0124] The content of pentaerythritol tetraacrylate was 30 wt % relative to the total amount of the photocrosslinking agent.

[0125] Example 13

[0126] The only difference from Example 10 is:

[0127] The content of pentaerythritol tetraacrylate was 20 wt % relative to the total amount of the photocrosslinking agent.

[0128] Example 14

[0129] The only difference from Example 10 is:

[0130] The content of pentaerythritol tetraacrylate was 10 wt % relative to the total amount of the photocrosslinking agent.

[0131] Example 15

[0132] The only difference from Example 10 is:

[0133] The content of pentaerythritol tetraacrylate was 5 wt % relative to the total amount of the photocrosslinking agent.

[0134] Example 16

[0135] The only difference from Example 1 is:

[0136] The photocrosslinking agent further comprises dipentaerythritol polyhexaacrylate, and the content of the dipentaerythritol polyhexaacrylate is 30 wt % relative to the total amount of the photocrosslinking agent.

[0137] Example 17

[0138] The only difference from Example 1 is:

[0139] The photoinitiator is a mixture of OXE01, photoinitiator 1173 and 1-(9,9-dibutyl-9H-fluoren-2-yl)-2-methyl-2-morpholin-4-yl-propane-1-one (code: NPI20400) (the mass ratio of OXE01 to NPI20400 is 1:1).

[0140] Example 18

[0141] The only difference from Example 6 is that:

[0142] The photoinitiator was a mixture of OXE01 and NPI20400 (the mass ratio of OXE01 to NPI20400 was 1:1).

[0143] Example 19

[0144] The only difference from Example 9 is:

[0145] The photoinitiator was a mixture of OXE01 and NPI20400 (the mass ratio of OXE01 to NPI20400 was 1:1).

[0146] Example 20

[0147] The only difference from Example 13 is:

[0148] The photoinitiator was a mixture of OXE01 and NPI20400 (the mass ratio of OXE01 to NPI20400 was 1:1).

[0149] Example 21

[0150] The only difference from Example 17 is:

[0151] The polyimide precursor includes a dianhydride monomer and a diamine monomer (the dianhydride monomer is pyromellitic anhydride, and the diamine monomer is 4,4'-diaminodiphenyl ether).

[0152] Example 22

[0153] The only difference from Example 18 is that:

[0154] The polyimide precursor includes a dianhydride monomer and a diamine monomer (the dianhydride monomer is pyromellitic anhydride, and the diamine monomer is 4,4'-diaminodiphenyl ether).

[0155] Example 23

[0156] The only difference from Example 19 is:

[0157] The polyimide precursor includes a dianhydride monomer and a diamine monomer (the dianhydride monomer is pyromellitic anhydride, and the diamine monomer is 4,4'-diaminodiphenyl ether).

[0158] Example 24

[0159] The only difference from Example 20 is:

[0160] The polyimide precursor includes a dianhydride monomer and a diamine monomer (the dianhydride monomer is pyromellitic anhydride, and the diamine monomer is 4,4'-diaminodiphenyl ether).

[0161] Example 25

[0162] The only difference from Example 21 is:

[0163] The organic solvents are 90% by mass of NMP and 10% by mass of EL.

[0164] Example 26

[0165] The only difference from Example 22 is:

[0166] The organic solvents are 90% by mass of NMP and 10% by mass of EL.

[0167] Example 27

[0168] The only difference from Example 23 is:

[0169] The organic solvents are 90% by mass of NMP and 10% by mass of EL.

[0170] Example 28

[0171] The only difference from Example 24 is:

[0172] The organic solvents are 90% by mass of NMP and 10% by mass of EL.

[0173] Example 29

[0174] The only difference from Example 1 is that the polyimide precursor includes a dianhydride monomer and a diamine monomer (the dianhydride monomer is pyromellitic anhydride, and the diamine monomer is 4,4'-diaminodiphenyl ether).

[0175] Example 30

[0176] The only difference from Example 1 is:

[0177] The photoinitiator was a mixture of OXE01 and NPI20400 (the mass ratio of OXE01 to NPI20400 was 1:1).

[0178] Example 31

[0179] The only difference from Example 1 is that the organic solvents are 90% by mass of NMP and 10% by mass of EL.

[0180] Comparative Example 1

[0181] The only difference from Example 1 is:

[0182] The photocrosslinking agent is polyethylene glycol diacrylate (relative to the total amount of polyethylene glycol diacrylate, the content of polyethylene glycol diacrylate with n=2 is 96.5wt%, and it also includes 0.19wt% of polyethylene glycol diacrylate with n=1 and 3.31wt% of polyethylene glycol acrylate with n=3-10.

[0183] Comparative Example 2

[0184] The only difference from Example 1 is:

[0185] The photocrosslinking agent is polyethylene glycol diacrylate (relative to the total amount of polyethylene glycol diacrylate, the content of polyethylene glycol diacrylate with n=3 is 97.43 wt%, and it also includes 0.19 wt% of polyethylene glycol diacrylate with n=1, 0.14 wt% of polyethylene glycol acrylate with n=2 and 2.24 wt% of polyethylene glycol acrylate with n=4-10).

[0186] Comparative Example 3

[0187] The only difference from Example 1 is:

[0188] The photocrosslinking agent is polyethylene glycol diacrylate (relative to the total amount of polyethylene glycol diacrylate, the content of polyethylene glycol diacrylate with n=4 is 98.23 wt%, and it also includes 0.34 wt% of polyethylene glycol diacrylate with n=1-3 and 1.43 wt% of polyethylene glycol acrylate with n=5-10).

[0189] Comparative Example 4

[0190] The only difference from Example 1 is:

[0191] The photocrosslinking agent is polyethylene glycol diacrylate (relative to the total amount of polyethylene glycol diacrylate, the content of polyethylene glycol diacrylate with n=5 is 95.65 wt%, and it also includes 1.39 wt% of polyethylene glycol diacrylate with n=1-4 and 2.96 wt% of polyethylene glycol acrylate with n=6-10).

[0192] Comparative Example 5

[0193] The only difference from Example 1 is:

[0194] The photocrosslinking agent is polypropylene glycol diacrylate (relative to the total amount of polypropylene glycol diacrylate, the content of polypropylene glycol diacrylate with n=4 is 95.61 wt%, and it also includes 1.28 wt% of polyethylene glycol diacrylate with n=1-3 and 3.11 wt% of polyethylene glycol acrylate with n=5-10).

[0195] Comparative Example 6

[0196] The only difference from Example 1 is:

[0197] The photocrosslinker is polyethylene glycol diacrylate (relative to the total amount of polyethylene glycol diacrylate, the content of polyethylene glycol diacrylate with n=2 is 0.35wt%, the content of polyethylene glycol diacrylate with n=3 is 14.78wt%, the content of polyethylene glycol diacrylate with n=4 is 70.30wt%, and the content of polyethylene glycol diacrylate with n=5 is 9.15wt%. The total proportion of the above four components is 94.58wt%, and it also includes 0.34wt% of polyethylene glycol diacrylate with n=1 and 5.08wt% of polyethylene glycol diacrylate with n=6-10.

[0198] Comparative Example 7

[0199] The only difference from Example 1 is:

[0200] The photocrosslinker is polyethylene glycol diacrylate (relative to the total amount of polyethylene glycol diacrylate, the content of polyethylene glycol diacrylate with n=2 is 15.34wt%, the content of polyethylene glycol diacrylate with n=3 is 40.21wt%, the content of polyethylene glycol diacrylate with n=4 is 12.76wt%, and the content of polyethylene glycol diacrylate with n=5 is 29.85wt%. The total proportion of the above four components is 98.16wt%, and it also includes 0.12wt% of polyethylene glycol diacrylate with n=1 and 1.72wt% of polyethylene glycol diacrylate with n=6-10.

[0201] Comparative Example 8

[0202] The only difference from Example 1 is:

[0203] The photocrosslinker is tricyclodecanemethanol diacrylate.

[0204] Comparative Example 9

[0205] The only difference from Example 1 is:

[0206] The photocrosslinker was trimethylolpropane trimethacrylate.

[0207] Comparative Example 10

[0208] The only difference from Example 1 is:

[0209] The photocrosslinking agent is pentaerythritol tetraacrylate.

[0210] Comparative Example 11

[0211] The only difference from Example 1 is:

[0212] The photocrosslinking agent is dipentaerythritol polyhexaacrylate (hydroxyl value is 50 mgKOH / g).

[0213] Performance testing:

[0214] The proportion of the photocrosslinker polyethylene glycol diacrylate was determined by GC FID normalization method;

[0215] Photosensitive composition silicon surface lithography window: Use a fully automatic coating and developing machine to coat the photosensitive composition on the surface of an 8-inch silicon wafer (3000 rpm, 30 seconds), test the initial film thickness F1, and then perform pre-baking (100°C, 180 seconds). After pre-baking, use stepper exposure machine 1 or exposure machine 2 for full exposure, and then continue to use a fully automatic coating and developing machine for development, test the film thickness F2, and then cure in a clean oven (nitrogen atmosphere) at 350°C for 2 hours. After post-baking and cooling, perform OM appearance inspection (circular holes and lines) on the wafer to confirm that there is a normal development window without shrinkage cavities, residual glue, undercuts, and footing fractures. Then perform a cross-sectional inspection (SEM or FIB) on the normal window range to confirm that the cross-sectional pattern and angle are normal, and further determine the lithography window range;

[0216] Residual film rate of photosensitive composition: perform film thickness test according to the above-mentioned lithography window test process and test conditions and record the film thickness F1 and F2. Calculate the residual film rate according to (F2 / F1)*100%

[0217] The overlapping lithography window ranges of the photosensitive resin compositions of the above embodiments and comparative examples under the above different exposure machines and different process conditions are shown in Table 1; the minimum residual film rates under the above different exposure machines and different process conditions are shown in Table 2.

[0218] Table 1

[0219]

[0220]

[0221]

[0222] Table 2

[0223]

[0224]

[0225]

[0226] As can be seen from the above, compared with the comparative example, the photosensitive resin composition of the embodiment of the present invention, when the photocrosslinker is present in a fixed ratio within a certain range, has a wider exposure window, a higher residual film rate, a higher process tolerance, and a higher process stability, which is more conducive to obtaining high-quality and stable chips. In contrast, in the comparative example, the photocrosslinker is present in a relatively single state, resulting in a narrow exposure window, a low residual film rate, and a small range of variation in exposure time and exposure energy. This easily leads to strict requirements on process exposure conditions, low fault tolerance, and poor process stability.

[0227] In addition, it can be seen that when the process parameters are within the preferred range of the present invention, the exposure window of the photosensitive resin composition is wider and the residual film rate is higher.

[0228] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A photosensitive resin composition, characterized in that The invention comprises a photosensitive polyimide resin precursor, a photocrosslinking agent, a photoinitiator and an organic solvent; the photocrosslinking agent is selected from a mixture of a first bifunctional acrylate and an optional second bifunctional acrylate, or a mixture of the first bifunctional acrylate and a multifunctional acrylate; the first bifunctional acrylate is a mixture of compounds having different q values ​​and having a structure represented by general formula (I), and the second bifunctional acrylate is a bifunctional acrylate other than the first bifunctional acrylate: In the general formula (I), R1' is selected from hydrogen, a C1-C20 straight-chain alkyl group, or a C1-C20 branched-chain alkyl group; R2' is selected from a C1-C20 straight-chain alkyleneoxy group, or a C1-C20 branched-chain alkyleneoxy group; Any hydrogen in the general formula (I) may be optionally replaced by a hydroxyl group, a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group, or a substituted phenyl group; the substituent of the substituted phenyl group is one or more of a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group, and a halogen; and q is any integer from 1 to 20.

2. The photosensitive resin composition according to claim 1, wherein In the first bifunctional acrylate, the compound of formula (I) with q=2-5 accounts for 70-95 wt%; Preferably, the compound of general formula (I) with q=2 is used as the first component, the compound of general formula (I) with q=3 is used as the second component, the compound of general formula (I) with q=4 is used as the third component and the compound of general formula (I) with q=5 is used as the fourth component; the content of the first component is 2-10wt%, the content of the second component is 15-35wt%, the content of the third component is 20-55wt%, and the content of the fourth component is 15-25wt%.

3. The photosensitive resin composition according to claim 2, wherein Relative to the total amount of the first bifunctional acrylate, the content of the first component is 5-10 wt %, the content of the second component is 25-35 wt %, the content of the third component is 25-38 wt %, the content of the fourth component is 15-25 wt %, and the total content of the first component, the second component, the third component, and the fourth component is 80-95%; Preferably, the first bifunctional acrylate further comprises other components, wherein the other components are 0.001 to 3 wt % of the compound of the general formula (I) with q=1, and 2 to 20 wt % of the compound of the general formula (I) with q=6 to 20.

4. The photosensitive resin composition according to any one of claims 1 to 3, characterized in that The second bifunctional acrylate is a compound having a structure represented by general formula (II); Any hydrogen atom in the general formula (II) may be optionally substituted by a hydroxyl group, a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group, or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group, and a halogen; wherein R1 is selected from hydrogen, a C1-C20 straight-chain alkyl group, or a C1-C20 branched-chain alkyl group; R2 is selected from C1-C20 straight chain alkyleneoxy, C1-C20 branched chain alkyleneoxy; R3 is selected from phenylene, C1-C20 straight-chain alkyl or C1-C20 branched-chain alkyl; wherein R7, R8 and R9 are independently selected from C1-C10 straight-chain alkylene or C1-C10 branched-chain alkylene.

5. The photosensitive resin composition according to any one of claims 1 to 4, characterized in that The multifunctional acrylate is a compound having a structure represented by general formula (III), general formula (IV) or general formula (V): wherein R1 is selected from hydrogen, a C1-C20 straight-chain alkyl group, or a C1-C20 branched-chain alkyl group; R2 is selected from a C1-C20 straight chain alkyleneoxy group or a C1-C20 branched chain alkyleneoxy group; R3 is selected from phenylene, C1-C20 straight-chain alkyl or C1-C20 branched-chain alkyl; wherein R7, R8 and R9 are independently selected from C1-C10 straight-chain alkylene or C1-C10 branched-chain alkylene; R4 is selected from hydrogen, hydroxy, C1-C20 straight-chain alkyl, C1-C20 branched-chain alkyl, C1-C20 straight-chain alkoxy or C1-C20 branched-chain alkoxy; R5 and R6 are independently selected from hydrogen, C1-C20 straight chain alkyl or C1-C20 branched chain alkyl or R1 and R2 have the same definitions as above; Any hydrogen atom in the general formula (III), general formula (IV), and general formula (V) is optionally substituted by a hydroxyl group, a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group, or a substituted phenyl group. Preferably, the substituent of the substituted phenyl group is one or more of a C1-C20 straight-chain alkyl group, a C1-C20 branched-chain alkyl group, a phenyl group, and a halogen; m, n, a, b, c, d, e, f, g, h, i, j, and k are independently selected from any integer from 0 to 20, and p is any integer from 0 to 10.

6. The photosensitive resin composition according to any one of claims 1 to 5, characterized in that In the first bifunctional acrylate, R1' is selected from hydrogen, a C1-C5 linear alkyl group, or a C1-C5 branched alkyl group; R2' is selected from a C1-C10 linear alkyleneoxy group, or a C1-C10 branched alkyleneoxy group; Any hydrogen atom in the general formula (I) may be optionally substituted by a hydroxyl group, a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, and a halogen; q is any integer from 1 to 10; In the second difunctional acrylate, R1 is selected from hydrogen, a C1-C5 linear alkyl group, or a C1-C5 branched alkyl group; R2 is selected from a C1-C10 linear alkyleneoxy group or a C1-C10 branched alkyleneoxy group; Any hydrogen atom in the general formula (II) may be optionally substituted by a hydroxyl group, a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, and a halogen; m and n are independently selected from any integer from 0 to 10; In the multifunctional acrylate, R1 is selected from hydrogen, C1-C5 straight chain alkyl or C1-C5 branched chain alkyl; R2 is selected from C1-C10 straight chain alkyleneoxy or C1-C10 branched chain alkyleneoxy; R3 is selected from phenylene, C1-C5 straight-chain alkyl or C1-C5 branched-chain alkyl; wherein R7, R8 and R9 are independently selected from C1-C5 straight-chain alkylene or C1-C5 branched-chain alkylene; R4 is selected from hydrogen, hydroxy, C1-C5 straight-chain alkyl, C1-C5 branched-chain alkyl, C1-C5 straight-chain alkoxy, C1-C5 branched-chain alkoxy; R5 and R6 are independently selected from hydrogen, C1-C5 straight-chain alkyl, C1-C5 branched-chain alkyl or Any hydrogen atom in the general formula (III), general formula (IV), and general formula (V) may be optionally substituted by a hydroxyl group, a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, and a halogen; a, b, c, d, e, f, g, h, i, j, and k are independently selected from any integer from 0 to 10, and p is any integer from 0 to 5.

7. The photosensitive resin composition according to any one of claims 1 to 6, characterized in that: In the first bifunctional acrylate, R1' is selected from hydrogen, C1-C5 straight chain alkyl or C1-C5 branched chain alkyl; R2' is selected from Any hydrogen atom in the general formula (I) may be optionally substituted by a hydroxyl group, a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, and a halogen; q is any integer from 1 to 10; In the second bifunctional acrylate, R1 is selected from hydrogen, C1-C5 linear alkyl or C1-C5 branched alkyl; R2 is selected from Any hydrogen atom in the general formula (II) may be optionally substituted by a hydroxyl group, a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group, and a halogen; m and n are independently selected from any integer from 0 to 10; In the multifunctional acrylate, R1 is selected from hydrogen, C1-C5 straight chain alkyl or C1-C5 branched chain alkyl; R2 is selected from R3 is selected from R4 is selected from hydrogen, hydroxy, C1-C5 straight-chain alkyl, C1-C5 branched-chain alkyl, C1-C5 straight-chain alkoxy, C1-C5 branched-chain alkoxy; R5 and R6 are independently selected from hydrogen, C1-C5 straight-chain alkyl, C1-C5 branched-chain alkyl or Any hydrogen atom in the general formula (III), general formula (IV) and general formula (V) may be optionally substituted by a hydroxyl group, a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group or a substituted phenyl group; preferably, the substituent of the substituted phenyl group is one or more of a C1-C5 straight-chain alkyl group, a C1-C5 branched-chain alkyl group, a phenyl group and a halogen; a, b, c, d, e, f, g, h, i, j and k are independently selected from any integer from 0 to 10, and p is any integer from 0 to 5.

8. The photosensitive resin composition according to any one of claims 1 to 7, characterized in that In the first bifunctional acrylate, R1' is selected from hydrogen, C1-C3 straight chain alkene alkyl, C1-C3 branched chain alkene alkyl; R2' is selected from q is any integer from 1 to 10; In the second bifunctional acrylate, R1 is selected from hydrogen, C1-C5 linear alkyl or C1-C5 branched alkyl; R2 is selected from m and n are independently selected from any integer from 0 to 10; In the multifunctional acrylate, R1 is selected from hydrogen, a C1-C5 linear alkyl group, or a C1-C5 branched alkyl group; R2 is selected from R3 is selected from C1-C5 straight chain alkyl or C1-C5 branched chain alkyl; R4 is selected from hydrogen, C1-C5 straight chain alkyl or C1-C5 branched chain alkyl; R5 and R6 are independently selected from hydrogen, C1-C5 straight chain alkyl or C1-C5 branched chain alkyl; a, b, c, d, e, f, g, h, i, j, and k are independently selected from any integer from 0 to 10, and p is any integer from 0 to 5; Preferably, The first bifunctional acrylate is one or more of polyethylene glycol dimethacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, polypropylene glycol methyl diacrylate, polytetramethylene glycol diacrylate, 2-hydroxy-3-propyl methacrylate, hexanediol diacrylate and nonanediol diacrylate; more preferably one or more of polyethylene glycol dimethacrylate and polyethylene glycol diacrylate; and / or The second difunctional acrylate is one or more of tricyclodecanemethanol diacrylate, epoxidized bisphenol A diacrylate, benzyl dimethacrylate and ethoxylated trimethylolpropane trimethacrylate; and / or The multifunctional acrylate is one or more of trimethylolpropane trimethacrylate, pentaerythritol tetraacrylate and dipentaerythritol acrylate; and / or Calculated by mass percentage, when the photocrosslinker is a mixture of the first bifunctional acrylate and the second bifunctional acrylate, the second bifunctional acrylate is 0.001 to 50% of the photocrosslinker; calculated by mass percentage, when the photocrosslinker is a mixture of the first bifunctional acrylate and the multifunctional acrylate, the multifunctional acrylate is 0.001 to 50% of the photocrosslinker.

9. The photosensitive resin composition according to any one of claims 1 to 8, characterized in that Calculated by mass percentage, the photosensitive resin composition includes 10-80% of the photosensitive polyimide precursor, 0.001-20% of the photocrosslinking agent, 0.001-10% of the photoinitiator and 10-80% of the organic solvent; Preferably, the photosensitive resin composition comprises 30-60% of the photosensitive polyimide precursor, 0.1-10% of the photocrosslinking agent, 0.1-3% of the photoinitiator, and 30-65% of the organic solvent.

10. The photosensitive resin composition according to any one of claims 1 to 9, characterized in that The photosensitive polyimide precursor is a compound represented by general formula (VI); wherein at least one of R1″ and R2″ is a monovalent organic group containing a carbon-carbon unsaturated double bond; X is a combination of one or more of the following groups: Wherein, R3" is selected from -O-, -S-, Arylene, keto or sulfone; preferably, the arylene has one of the following structures: Y has one of the following structures: wherein R4″ and R5″ are independently selected from hydrogen, alkyl, alkoxy or trifluoromethyl, R6″ is selected from O, S, carbonyl, sulfone or sulfoxide; R7″ is selected from carboxyl, trifluoromethyl, alkyl, alkoxy or halogen; In terms of molar ratio, the molar ratio of X to Y is (1.5-0.5):1, preferably (1.5-1.0):1, and the weight average molecular weight of the photosensitive polyimide precursor is 5000-50000, preferably 10000-20000; Preferably, the photosensitive polyimide precursor dianhydride is PMDA, BPDA, ODPA, BTDA, etc., and the diamine is one or more of MPD, ODA, 4,4-diamino-2,2'-bis(trifluoromethyl)biphenyl and 4,4'-diamino-2,2'-dimethylbiphenyl.

11. The photosensitive resin composition according to any one of claims 1 to 10, characterized in that: The organic solvent is selected from one or more of amides, lactones, sulfoxides, ketones, ethers, halogenated hydrocarbons, hydrocarbons and tetramethylureas, Preferred are one or more of N-methyl-2-pyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, dimethyl sulfoxide, tetramethylurea, γ-butyrolactone and ethyl lactate.

12. The photosensitive resin composition according to any one of claims 1 to 11, characterized in that: The photoinitiator is one or more of an oxime-based photoinitiator, a benzophenone-based photoinitiator, an aminoketone-based photoinitiator, and an aromatic titanium-based photoinitiator; Wherein, the oxime lipid photoinitiator has a structure represented by general formula (VII) or general formula (VIII): In the general formula (VII), Z is empty or a C1-C5 alkylene group; W is selected from O, S, NR 20 ” or CR 20 ”R 21 ”, R 20 ”、R 21 " are independently selected from hydrogen, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, and alkyl containing unsaturated bonds; preferably, the alkyl containing unsaturated bonds is selected from allyl or butenyl; In the general formula (VII) and the general formula (VIII), R7" is selected from C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, alkoxy, phenyl or substituted phenyl; preferably, the substituent of the substituted phenyl is one or more of C1-C20 straight-chain alkyl, C1-C20 branched alkyl, phenyl and halogen; R8" is selected from hydrogen, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, phenyl, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl or C7-C20 aryl; wherein any hydrogen in the C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl or C7-C20 aryl may be replaced by a substituent, and the substituent is one or more of halogen, nitro, hydroxyl, carboxyl, sulfonic acid, amino, cyano and alkoxy; R9", R 10 ”、R 11 ”、R 12 ”、R 13 ”、R 14 ”、R 15 ”、R 16 ”、R 17 ”、R 18 ”、R 19 " are independently selected from hydrogen, halogen, nitro, hydroxyl, carboxyl, sulfonic acid, amino, cyano, alkoxy, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl or C4-C20 alkylcycloalkyl; wherein any hydrogen in the C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl or C4-C20 alkylcycloalkyl is optionally substituted by a substituent, and the substituent is one or more of halogen, nitro, hydroxyl, carboxylsulfonic acid, amino, cyano and alkoxy; The benzophenone photoinitiator has a structure shown in the general formula (IX): In the general formula (IX), R 22 ”、R 23 " are independently selected from hydrogen, phenyl, alkylbenzene, halogen, nitro, cyano, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, amino, dimethylamino or diethylamino; The aminoketone photoinitiator has a structure represented by any one of the general formulas (X) and (XI): In the general formula (X), R 24 " is selected from hydrogen, phenyl, alkylbenzene, halogen, nitro, cyano, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, methylthio, alkoxy or hydroxyethylthio; In the general formula (XI), R 25 " is selected from hydrogen, C1-C20 linear alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, allyl or butenyl; R 26 " is selected from hydrogen, phenyl, alkylbenzene, halogen, nitro, cyano, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl, C4-C20 alkylcycloalkyl, methylthio, alkoxy or hydroxyethylthio; The titanium aryl cyclopentadienyl photoinitiator has a structure shown in the general formula (XII): In the general formula (XII), R 27 " is selected from hydrogen, C1-C20 straight-chain alkyl, C3-C20 cycloalkyl, C4-C20 cycloalkylalkyl or C4-C20 alkylcycloalkyl; R 28 " is selected from hydrogen, pyrrole or C1-C20 alkyl substituted amino, preferably hydrogen, Diethylamino or dimethylamino; Preferably, the photoinitiator is one or more of an oxime-based photoinitiator, a benzophenone-based photoinitiator, an aminoketone-based photoinitiator, and a titanocene-based initiator; more preferably, the oxime-based photoinitiator is One or more of; the benzophenone photoinitiator is One or more of; the aminoketone photoinitiator is One or more of; the titanocene initiator is One or more of.

13. Use of the photosensitive resin composition according to any one of claims 1 to 12 as a photoresist in chip manufacturing.