Industrial personal computer mainboard with water cooling structure and industrial personal computer

Abstract

The invention belongs to the technical field of industrial personal computers, and particularly relates to an industrial personal computer mainboard with a water cooling structure and an industrial personal computer. The industrial personal computer mainboard comprises a mainboard body and a heat dissipation module. The heat dissipation module comprises a heat conduction base attached to the CPU, a mounting groove is formed in the upper surface of the heat conduction base, a boss is arranged on the bottom face of the mounting groove, and a containing groove is formed in the boss; the heat dissipation module further comprises a refrigeration piece, a sealing head and a sealing cover, wherein the sealing head enables the refrigeration piece to abut downwards and be sealed in the containing groove, and the sealing cover abuts downwards against the sealing head and seals the installation groove. A convection groove communicated with the water inlet channel and a water outlet channel with a downward outlet are formed in the lower surface of the sealing head; the multiple water outlet channels form an annular structure, and the diameter of the annular structure is larger than that of the boss. The sealing cover is provided with a water inlet and a water outlet corresponding to the water inlet channel and the water outlet channel respectively; the cooling fins are arranged on the bosses, so that the CPU can be rapidly cooled through the heat conduction base, the overall size is smaller, and the cooling effect is better.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial control computers, and in particular to an industrial control computer mainboard and an industrial control computer with a water cooling structure. Background Art

[0002] An industrial personal computer (IPC), or industrial control computer, is a general term for tools that utilize a bus architecture to monitor and control production processes, electromechanical equipment, and process equipment. IPCs possess key computer attributes and characteristics, including a CPU, hard drive, memory, peripherals, and interfaces, as well as an operating system, control networks and protocols, computing power, and a user-friendly human-computer interface. The products and technologies of the industrial control industry are highly specialized, serving as intermediate products, providing reliable, embedded, and intelligent industrial computers for other industries.

[0003] Industrial computers (ICs) typically operate in harsh environments, particularly those with consistently high ambient temperatures, such as in injection molding plants. Heat dissipation is a major challenge in these environments. Currently, traditional IPCs typically use heat sinks and cooling fans to dissipate heat from the CPU. However, heat sinks have limited performance and consume available space on the motherboard. Furthermore, cooling fans often introduce ambient dust into the IPC, impacting the proper functioning of its components. To address this issue, we propose an IPC motherboard with a water-cooling structure. Summary of the Invention

[0004] The object of the present invention is to provide an industrial computer motherboard and an industrial computer with a water cooling structure to solve the problems raised in the background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: an industrial computer motherboard with a water-cooling structure, comprising a motherboard body and a heat dissipation module for dissipating heat from the CPU on the motherboard body; the heat dissipation module comprises a heat-conducting base that is attached to the CPU, the upper surface of the heat-conducting base is provided with a mounting groove, the bottom surface of the mounting groove is integrally provided with a boss, and the boss is provided with a receiving groove; the heat dissipation module also includes a cooling fin, a sealing head that presses the cooling fin downward and seals it in the receiving groove, and a cover that presses the sealing head downward and seals the mounting groove; the upper surface of the sealing head is provided with a water inlet channel, and the lower surface is provided with a convection groove connected to the water inlet channel and a water outlet channel with an outlet facing downward; the water outlet channels are provided in plurality and form an annular structure, the diameter of the annular structure is larger than the diameter of the boss; the cover is provided with a water inlet and a water outlet corresponding to the water inlet channel and the water outlet channel, respectively.

[0006] The industrial computer motherboard with a water-cooling structure described in the present invention is characterized in that the upper surface of the refrigeration plate is provided with an effective working area and a sealing area, the sealing area is annular and is arranged around the effective working area, and when assembled in place, the sealing area is tightly fitted against the lower surface of the sealing head, and the convection groove is located above the effective working area.

[0007] The industrial computer motherboard with a water-cooling structure described in the present invention, wherein the sealing head includes a head body, the upper and lower surfaces of the head body are respectively in contact with the cover and the boss, and the lower surface of the head body is provided with a groove connected to the water inlet channel; the sealing head also includes a heat convection conduit vertically arranged in the groove, the upper end of the heat convection conduit is connected to the water inlet channel, and a plurality of heat convection fins are circumferentially distributed on the outer side wall of the heat convection conduit.

[0008] The industrial computer motherboard with a water-cooling structure described in the present invention has a convection gap between the lower end of the heat convection conduit and the upper surface of the refrigeration fin, and the convection gap forms the convection groove. The position height of the inlet of the water outlet channel is greater than the outlet of the heat convection conduit. When assembled in place, the lower end of the heat convection fin is tightly fitted against the upper surface of the refrigeration fin.

[0009] The industrial computer motherboard with a water-cooling structure described in the present invention is characterized in that the heat convection duct and the groove are both cylindrical and coaxially arranged, a horizontal extension portion is provided on the outer side wall of the upper end of the heat convection duct, the upper surface of the extension portion is flush with the upper end surface of the heat convection duct, a positioning groove for positioning the extension portion is provided on the bottom surface of the groove, the outlet of the water inlet channel is located on the bottom surface of the positioning groove, and a sealing soft rubber pad is provided between the bottom surface of the positioning groove and the extension portion.

[0010] The industrial computer motherboard with a water cooling structure described in the present invention has a slot for inserting the thermal convection fin on the side wall of the groove. When assembled in place, the inner wall of the slot fits the outer surface of the thermal convection fin.

[0011] The industrial computer motherboard with a water-cooling structure described in the present invention is characterized in that the outlet of the water outlet channel is located at the edge of the lower surface of the head body and at the outside of the side wall of the boss, and an annular convection area surrounding the boss is provided on the bottom surface of the mounting groove, and the outlet of the water outlet channel is located above the annular convection area. When assembled in place, the side wall of the mounting groove and the outer side wall of the head body jointly enclose a secondary heat convection cavity.

[0012] The industrial computer motherboard with a water-cooling structure described in the present invention is characterized in that a temperature sensor and a humidity sensor are provided on the lower surface of the heat-conducting base below the annular convection zone, and multiple temperature sensors and humidity sensors are provided and are arranged alternately in sequence along the circumferential direction of the annular convection zone.

[0013] The industrial computer motherboard with a water-cooling structure described in the present invention is characterized in that the water outlet channel is L-shaped with its longitudinal end facing vertically downward and its transverse end passing through the groove; a sealing ring is further provided between the head body and the boss, the sealing ring is arranged around the accommodating groove, and a sealing groove is provided on the head body corresponding to the sealing ring, and two sealing rings are provided, one of which is attached to the sealing area and the other is attached to the upper surface of the boss.

[0014] In addition, the present invention further provides an industrial computer, which includes the industrial computer mainboard with the water cooling structure as described above.

[0015] Compared with the existing technology, the present invention has the following beneficial effects: by placing the cooling fin on the boss, the cooling fin can quickly absorb the heat generated by the CPU through the heat-conducting base and the boss during operation, thereby achieving rapid cooling of the CPU. Compared with traditional heat dissipation methods, this solution can achieve better cooling effect, faster heat dissipation response speed, and greatly reduce the overall volume. No additional heat dissipation fins are required, which is more conducive to the installation of other components on the industrial computer motherboard. Among them, for the heat generated by the hot end of the cooling plate, the cooperation of the convection groove and the water outlet channel can make the coolant flow quickly through the upper surface of the cooling plate to take away the heat, and the coolant flowing out of the water outlet channel directly flushes the bottom surface of the heat-conducting base and the area surrounding the boss after flowing out, which can perform secondary cooling on the bottom surface of the heat-conducting base, and prevent the heat transferred from the CPU to the bottom surface of the heat-conducting base from being transferred to the outside at the lower part of its wall, which can not only further enhance the cooling effect, but also make full use of the coolant. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 It is a three-dimensional structural diagram of the present invention.

[0018] Figure 2 It is a top view of the present invention.

[0019] Figure 3 for Figure 2 AA cross-sectional view.

[0020] Figure 4 for Figure 3 A magnified view of the local structure.

[0021] Figure 5 for Figure 3 A magnified view of the local structure.

[0022] Figure 6 for Figure 5 A magnified view of the local structure.

[0023] Figure 7 Schematic diagram of the flow direction of the coolant inside the heat dissipation module of the present invention. DETAILED DESCRIPTION

[0024] The terms "first," "second," "third," and "fourth," etc., in the specification, claims, and accompanying drawings of the present invention are used to distinguish between different items, not to describe a particular order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements, but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0025] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute a separate or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0026] "Multiple" refers to two or more. "And / or" describes the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0027] Moreover, the terms "up, down, left, right, upper end, lower end, longitudinal" and the like indicating directions are all based on the posture and position of the device or apparatus described in this solution during normal use.

[0028] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the following will be a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work shall fall within the scope of protection of the present invention.

[0029] This embodiment discloses Figures 1 to 7 The industrial computer motherboard shown has a water-cooling structure. The industrial computer motherboard includes a motherboard body 10 and a heat dissipation module for dissipating heat from the CPU 300 on the motherboard body 10. The heat dissipation module includes a heat-conducting base 20 that is tightly attached to the upper surface of the CPU. The heat-conducting base 20 is made of a material with good thermal conductivity. Specifically, a mounting groove 21 is provided on the upper surface of the heat-conducting base 20. A boss 22 is integrally provided on the bottom surface of the mounting groove 21, and a receiving groove 23 is provided on the upper surface of the boss 22. Furthermore, the heat dissipation module also includes a cooling fin 30, a sealing head 40 that presses the cooling fin 30 downward and seals it in the receiving groove 23, and a cover 50 that presses the sealing head 40 downward and seals the mounting groove 21. The cover 50 is detachably connected to the heat-conducting base 20 by screws, and a sealing rubber ring 60 is provided between the cover 50 and the heat-conducting base 20.

[0030] The refrigeration fin 30 is generally a refrigeration fin 30 encapsulated with aluminum nitride ceramic or alumina ceramic to ensure good thermal conductivity and waterproof performance. Furthermore, a water inlet channel 70 is provided on the upper surface of the sealing head 40, and a convection groove 80 connected to the water inlet channel 70 and a water outlet channel 90 with an outlet facing downward is provided on the lower surface of the sealing head 40. The convection groove 80 is specifically arranged in the center of the sealing head 40. Among them, there are multiple water outlet channels 90 and they form an annular structure. The diameter of the annular structure is larger than the diameter of the boss 22, so that the coolant can directly splash onto the bottom surface of the heat-conducting base 20 located on the side of the boss 22 after flowing out. Furthermore, a water inlet 100 and a water outlet 110 are provided on the cover 50 corresponding to the water inlet channel 70 and the water outlet channel 90, respectively, for connecting the water inlet pipe 120 and the water outlet pipe 130 of the radiator, respectively, to achieve circulating cooling of the coolant and continuously absorb the heat generated by the hot end of the refrigeration fin 30.

[0031] This solution places the cooling fin 30 on the boss 22, so that the cooling fin 30 can quickly absorb the heat generated by the CPU through the heat-conducting base 20 and the boss 22 during operation, thereby achieving rapid cooling of the CPU. Compared with the traditional method of directly using heat dissipation fins in combination with fans for heat dissipation, this solution can achieve better cooling effects, faster heat dissipation response speed, and greatly reduce the overall volume. There is no need for additional heat dissipation fins, which is more conducive to the installation of other components on the industrial computer motherboard.

[0032] In addition, since the cooling fin 30 and the sealing head 40 are installed in the installation groove 21 with the opening facing upward, the sealing rubber ring 60 between the cover 50 and the heat-conducting base 20 can be kept away from the high-temperature CPU, which can effectively reduce the life of the sealing rubber ring 60 caused by repeated heating. Compared with the implementation method of the installation groove 21 with the opening facing downward, the risk of leakage is lower and the practical life is longer.

[0033] Among them, for the heat generated by the hot end of the cooling fin 30, the convection groove 80 and the water outlet channel 90 cooperate to allow the coolant to quickly flow through the upper surface of the cooling fin 30 to take away the heat, and the coolant flowing out of the water outlet channel 90, after flowing out, directly rinses the bottom surface of the heat-conducting base 20 and the area surrounding the boss 22, which can perform secondary cooling on the bottom surface of the heat-dissipating base, and prevent the heat transferred from the CPU to the bottom surface of the heat-conducting base 20 from being transferred to the outside at the lower part of its wall, which can not only further enhance the cooling effect, but also make full use of the heat absorption of the coolant.

[0034] In this embodiment, the upper surface of the refrigeration fin 30 is provided with an effective working area 31 and a sealing area 32. The sealing area 32 is annular and arranged around the effective working area 31. When assembled in place, the sealing area 32 is tightly fitted against the lower surface of the sealing head 40, and the convection groove 80 is located above the effective working area 31 to ensure that enough coolant flows into the convection groove 80 from the water inlet channel 70 and contacts the heated effective working area 31 as soon as possible to take away its heat, thereby realizing an outward-expanding heat dissipation method from the center to the edge, which can effectively reduce the central heat aggregation effect of the refrigeration fin 30 and ensure the timeliness and efficiency of heat dissipation.

[0035] In addition, by pressing the sealing head 40 against the sealing area 32, on the one hand, the refrigeration is pressed against the ground of the receiving tank 23 to ensure the stability of heat conduction, while the semiconductor chip inside the refrigeration plate 30 will not be affected by the pressure from the upper and lower sides and its normal working performance, which can greatly improve the long-term stability of the refrigeration plate 30 in the receiving tank 23. On the other hand, it facilitates the subsequent sealing of the effective working area 31 through the cooperation of the sealing head 40 and the sealing area 32 to prevent the coolant from flowing into the receiving tank 23.

[0036] In this embodiment, the sealing head 40 includes a sealing head body 41, the upper and lower surfaces of which are respectively in contact with the sealing cover 50 and the boss 22. Specifically, the horizontal cross-sections of the sealing head body 41 and the boss 22 are both square, while the longitudinal cross-sections are rectangular, and the opposing end surfaces of the two are both smooth planes. When assembled, the sealing head body 41 and the boss 22 are coaxial. Furthermore, a groove 140 is provided on the lower surface of the sealing head body 41, which is connected to the water inlet channel 70. The inlet of the water inlet channel 70 is eccentrically arranged on the upper surface of the sealing head body 41, while the outlet of the water inlet channel 70 is coaxially located on the bottom surface of the groove 140. The connecting channel 73 between the inlet 71 and outlet 72 of the water inlet channel 70 is horizontal.

[0037] Furthermore, the sealing head 40 includes a heat convection conduit 42 vertically disposed within the recess 140. When fully assembled, the upper end of the heat convection conduit 42 communicates with the water inlet channel 70. Multiple heat convection fins 420 are circumferentially distributed on the outer wall of the heat convection conduit 42. The heat convection conduit 42 and the heat convection fins 420 are also integrally formed from a material with good thermal conductivity. A convection gap is defined between the lower end of the heat convection conduit 42 and the upper surface of the cooling fin 30. This convection gap forms a convection groove 80, which is used to accommodate a certain amount of coolant and directly absorb heat from the hot end of the cooling fin 30.

[0038] The height of the inlet 91 of the water outlet channel 90 is greater than the outlet 421 of the heat convection pipe 42. When assembled in place, the lower end of the heat convection fin 420 is tightly fitted with the upper surface of the cooling plate 30 to quickly transfer the heat on the hot end of the cooling plate 30 to the heat convection fin 420 and the heat convection pipe 42, so that the coolant first performs the first step of indirect heat dissipation after entering the heat convection pipe 42 from the water inlet channel 70, and then flows to the convection gap to directly contact the hot end of the cooling plate 30 for the first step of heat dissipation. The second step is direct heat dissipation, and then flows to the thermal convection fins 420 for the third step of indirect heat dissipation. Since the inlet of the water outlet channel 90 is located above the outlet of the thermal convection duct 42, the coolant can absorb heat from the thermal convection fins 420 from bottom to top, and preferentially cool the lower end of the thermal convection fins 420 with a higher temperature that is in direct contact with the hot end of the refrigeration plate 30, and finally achieve rapid cooling of the hot end of the refrigeration plate 30, providing a prerequisite for the refrigeration plate 30 to continuously and efficiently cool the CPU.

[0039] In this embodiment, the heat convection conduit 42 and the groove 140 are both cylindrical and coaxially arranged. After assembly, the upper end opening of the heat convection conduit 42 is coaxially aligned with the outlet of the water inlet channel 70 and the inner diameters of the two are consistent. A horizontal extension portion 422 is provided on the outer wall of the upper end of the heat convection conduit 42. The upper surface of the extension portion 422 is flush with the upper end surface of the heat convection conduit 42. A positioning groove 141 for positioning the extension portion 422 is provided on the bottom surface of the groove 140. The outlet of the water inlet channel 70 is located on the bottom surface of the positioning groove 141. A sealing soft rubber pad 150 is provided between the bottom surface of the positioning groove 141 and the extension portion 422. Specifically, a through hole 72 corresponding to the outlet 72 of the water inlet channel 70 is provided on the sealing soft rubber pad 150. Hole is provided for the coolant to enter the heat convection conduit 42. The positioning groove 141 and the sealing soft rubber pad 150 are provided to position the heat convection conduit 42 on the one hand, and to ensure the sealing of the connection between the heat convection conduit 42 and the outlet of the water inlet channel 70 on the other hand. The coolant inside and outside the heat convection conduit 42 will not mix, thereby ensuring the cooling effect. Secondly, the sealing soft rubber pad 150 can also play a role in buffering and maintaining pressure. When the heat convection conduit 42 and the heat convection fin 420 are heated and expanded, the sealing soft rubber pad 150 can provide a certain upward deformation space for the heat convection conduit 42 and the heat convection fin 420, thereby avoiding excessive pressure on the downward mortgage refrigeration plate 30.

[0040] In this embodiment, a slot 142 for inserting the heat convection fin 420 is provided on the side wall of the groove 140. When assembled in place, the inner wall of the slot 142 fits with the outer surface of the heat convection fin 420 to further increase the contact area between the heat convection fin 420 and the inner wall of the groove 140, which can fully utilize the coolant at both ends of the heat convection fin 420 in the horizontal direction, and can also prevent the heat convection conduit 42 from rotating and limit its up and down movement, which is also convenient for early production assembly and processing as well as later maintenance, disassembly and installation.

[0041] In this embodiment, the outlet 92 of the water outlet channel 90 is located at the edge of the lower surface of the head body 41 and at the outside of the side wall of the boss 22. An annular convection area 210 surrounding the boss 22 is provided on the bottom surface of the mounting groove 21. The outlet 92 of the water outlet channel 90 is located above the annular convection area 210. When assembled in place, the side walls of the mounting groove 21 and the outer side walls of the head body 41 are jointly enclosed to form a secondary heat convection cavity 160. Through the cooperation of the boss 22 and the annular convection area 210, the heat of the CPU can be concentrated on the boss 22 and can be quickly neutralized by the cold end of the cooling plate 30, which can greatly improve the cooling efficiency. Moreover, the secondary heat convection cavity 160 can also separate the bottom surface of the heat-conducting base 20 at the bottom of the boss 22 and the surrounding area to avoid condensation when the bottom surface temperature of the heat-conducting base 20 is lower than room temperature.

[0042] In this embodiment, a temperature sensor 170 and a humidity sensor 180 are provided on the lower surface of the heat-conducting base 20, below the annular convection zone 210. There are multiple temperature sensors 170 and humidity sensors 180, which are arranged alternately in the circumferential direction of the annular convection zone 210. The temperature sensor 170 and the humidity sensor 180 are connected to the cooling control system to realize feedback control of temperature and humidity. When the temperature of the bottom of the heat-conducting base 20 located at the periphery of the CPU is lower than the room temperature or the humidity is greater than the threshold, the two sensors are triggered, which makes it easier for the control system to adjust the power of the cooling plate 30 or control the radiator in time to avoid excessive water droplets falling onto the mainboard body 10 and causing a short circuit accident.

[0043] In this embodiment, the water outlet channel 90 is L-shaped and its longitudinal end is vertically downward, and its transverse end passes through the inner side wall of the groove 140; a sealing ring 190 is further provided between the head body 41 and the boss 22, and the sealing ring 190 is arranged around the accommodating groove 23. A sealing groove 410 is provided on the head body 41 corresponding to the sealing ring 190. The sealing ring 190 is specifically provided with two and one is attached to the sealing area 32 and the other is attached to the upper surface of the boss 22. The sealing area 32 is arranged around the outside of the effective working area 31, and can be opened through the sealing head 40 The cooperation with the inner sealing ring 190 seals the effective working area 31 to prevent the coolant from entering the receiving groove 23 and generating a freezing reaction with the cold end of the refrigeration plate 30. The outer sealing ring 190 can prevent the coolant in the secondary heat convection cavity 160 from entering the receiving groove 23. The sealing rings 190 on both sides can ensure the airtightness of the refrigeration plate 30 in the receiving groove 23. In addition, a sealing gasket 200 is coaxially provided on the bottom surface of the receiving groove 23 below the sealing area 32 to further prevent the coolant from contacting the cold end of the refrigeration plate 30.

[0044] Furthermore, the present solution also discloses an industrial computer, which includes the above-mentioned industrial computer mainboard with a water-cooling structure.

[0045] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the appended claims of the present invention.

Claims

1. An industrial computer motherboard with a water cooling structure, characterized in that: The heat dissipation module comprises a main body of a motherboard, and a heat dissipation module for dissipating heat from the CPU on the main body of the motherboard; the heat dissipation module comprises a heat-conducting base fitted with the CPU, the upper surface of the heat-conducting base is provided with a mounting groove, the bottom surface of the mounting groove is integrally provided with a boss, and the boss is provided with a receiving groove; the heat dissipation module also comprises a cooling fin, a sealing head which presses the cooling fin downward and seals it in the receiving groove, and a cover which presses the sealing head downward and seals the mounting groove; the upper surface of the sealing head is provided with a water inlet channel, and the lower surface is provided with a convection groove connected to the water inlet channel and a water outlet channel with an outlet facing downward; the water outlet channels are provided in plurality and form an annular structure, the diameter of the annular structure is larger than the diameter of the boss; the cover is provided with a water inlet and a water outlet corresponding to the water inlet channel and the water outlet channel respectively.

2. The industrial computer motherboard with a water cooling structure according to claim 1, characterized in that: The upper surface of the refrigeration plate is provided with an effective working area and a sealing area. The sealing area is annular and arranged around the effective working area. When assembled in place, the sealing area is tightly fitted against the lower surface of the sealing head, and the convection groove is located above the effective working area.

3. The industrial computer motherboard with a water cooling structure according to claim 2, characterized in that: The sealing head includes a head body, the upper and lower surfaces of the head body are respectively in contact with the sealing cover and the boss, and the lower surface of the head body is provided with a groove connected to the water inlet channel; the sealing head also includes a heat convection tube vertically arranged in the groove, the upper end of the heat convection tube is connected to the water inlet channel, and a plurality of heat convection fins are circumferentially distributed on the outer side wall of the heat convection tube.

4. The industrial computer motherboard with a water cooling structure according to claim 3, characterized in that: There is a convection gap between the lower end of the heat convection tube and the upper surface of the refrigeration fin, and the convection gap forms the convection groove. The position height of the inlet of the water outlet channel is greater than the outlet of the heat convection tube. When assembled in place, the lower end of the heat convection fin is tightly fitted against the upper surface of the refrigeration fin.

5. The industrial computer motherboard with a water cooling structure according to claim 3 or 4, characterized in that: The thermal convection tube and the groove are both cylindrical and coaxially arranged. A horizontal extension portion is provided on the outer side wall of the upper end of the thermal convection tube. The upper surface of the extension portion is flush with the upper end surface of the thermal convection tube. A positioning groove for positioning the extension portion is provided on the bottom surface of the groove. The outlet of the water inlet channel is located on the bottom surface of the positioning groove. A sealing soft rubber pad is provided between the bottom surface of the positioning groove and the extension portion.

6. The industrial computer motherboard with a water cooling structure according to claim 5, characterized in that: A slot for inserting the thermal convection fin is provided on the side wall of the groove. When assembled in place, the inner wall of the slot fits with the outer surface of the thermal convection fin.

7. The industrial computer motherboard with a water cooling structure according to claim 4, characterized in that: The outlet of the water outlet channel is located at the edge of the lower surface of the head body and on the outside of the side wall of the boss. An annular convection area surrounding the boss is provided on the bottom surface of the mounting groove. The outlet of the water outlet channel is located above the annular convection area. When assembled in place, the side wall of the mounting groove and the outer side wall of the head body together enclose a secondary heat convection cavity.

8. The industrial computer motherboard with a water cooling structure according to claim 7, characterized in that: A temperature sensor and a humidity sensor are provided on the lower surface of the heat-conducting base below the annular convection zone. A plurality of the temperature sensors and the humidity sensors are provided and are alternately arranged in sequence along the circumferential direction of the annular convection zone.

9. The industrial computer motherboard with a water cooling structure according to claim 3, characterized in that: The water outlet channel is L-shaped with its longitudinal end facing vertically downward and its transverse end passing through the groove; a sealing ring is also provided between the head body and the boss, and the sealing ring is arranged around the accommodating groove, and a sealing groove is provided on the head body corresponding to the sealing ring, and two sealing rings are provided, one of which is attached to the sealing area and the other is attached to the upper surface of the boss.

10. An industrial computer, characterized in that: The industrial computer includes an industrial computer mainboard with a water cooling structure as described in any one of claims 1-4, 7-9.

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