Shell and memory card device
The shell design that combines metal and plastic parts solves the problem that traditional memory card devices cannot be waterproof, dustproof, or resistant to high pressure, enabling normal use in high-pressure environments and extending the life of the device.
Patent Information
- Application Number
- CN202410317013.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-19
- Publication Date
- 2025-09-19
AI Technical Summary
The casing of traditional memory card devices cannot meet the requirements of waterproof, dustproof and high-pressure resistance, affecting their normal use.
The shell design adopts a combination of metal and plastic parts. The metal parts are embedded in the hollow part of the plastic parts and connected through sealing to enhance the compressive strength and protective performance of the shell.
It improves the normal use ability of memory card devices in high-pressure environments, ensures waterproof and dustproof performance, and extends the service life of the equipment.
Smart Images

Figure CN120671707A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of storage devices, and in particular to a housing and a memory card device. Background Art
[0002] As a portable storage device, memory card devices can be used in high-performance mobile digital products, such as high-performance cameras, high-speed cameras, high-altitude drones, and shooting equipment for use in severe cold conditions.
[0003] However, the shell of the traditional memory card device is made of epoxy resin by one-time injection molding, which cannot meet the requirements of waterproof, dustproof and high-pressure resistance, affecting the normal use of the memory card device and resulting in poor use of the memory card device. Summary of the Invention
[0004] In view of the above, it is necessary to provide a housing and a memory card device that can solve the technical problem that the normal use of the memory card device is affected due to failure to meet the requirements of waterproof, dustproof and high-pressure resistance, resulting in poor use of the memory card device.
[0005] A first aspect of an embodiment of the present application provides a shell, which includes: an upper shell, the upper shell including a plastic part and a metal part, the plastic part is provided with a hollow portion adapted to the metal part, the metal part is embedded in the hollow portion, and the upper surface of the plastic part and the upper surface of the metal part are on the same horizontal plane; a lower shell, the lower shell is connected to the upper shell.
[0006] In one embodiment, the edge shape of the metal piece matches the edge shape of the hollow portion.
[0007] In one embodiment, a ratio of a surface area of the metal component to a surface area of the upper housing is greater than a preset threshold.
[0008] In one embodiment, the metal component is sealed to the plastic component.
[0009] In one embodiment, the lower shell is sealed to the upper shell.
[0010] In one embodiment, the lower shell is made of plastic material.
[0011] In one embodiment, the plastic part is provided with at least one first clamping portion, and the lower shell is provided with at least one second clamping portion corresponding to the at least one first clamping portion, and the at least one first clamping portion is clamped with the at least one second clamping portion.
[0012] A second aspect of an embodiment of the present application provides a memory card device, comprising the above-mentioned shell, and the memory card device further comprises: a circuit board, the end surface of the circuit board is fixedly connected to the lower shell, and the back surface of the end surface of the circuit board is fixedly connected to the metal part.
[0013] In one embodiment, a receiving groove is provided on the plastic component, and the receiving groove is used to receive the circuit board.
[0014] In one embodiment, the circuit board and the lower shell are bonded together by glue, and the circuit board and the metal component are bonded together by glue.
[0015] The technical effects of the embodiments of the present application include: by fixing the circuit board in the shell, the shell is assembled using metal and plastic parts, which improves the compressive strength of the shell, ensures that the memory card device can be used normally in a high-pressure environment, and improves the use effect of the memory card device. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a structural schematic diagram of the shell provided in Example 1 of the present application.
[0017] Figure 2 This is an exploded view of the shell provided in Example 1 of the present application.
[0018] Figure 3 This is a structural diagram of the plastic part provided in Example 1 of the present application.
[0019] Figure 4 It is a structural diagram of the memory card device provided in Example 1 of the present application.
[0020] Figure 5 This is an exploded view of the memory card device provided in Example 1 of the present application.
[0021] Description of main component symbols
[0022] Housing 10
[0023] Upper shell 11
[0024] Plastic parts 110
[0025] Hollow part 1101
[0026] First clamping portion 1102
[0027] Accommodation groove 1103
[0028] Metal Parts 111
[0029] Lower housing 12
[0030] The second clamping portion 121
[0031] Memory card device 20
[0032] Circuit board 201
[0033] The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION
[0034] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.
[0035] It should be noted that when a component is referred to as being "mounted on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a central component at the same time.
[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.
[0037] Some embodiments of the present application will be described in detail below with reference to the accompanying drawings.
[0038] See also Figures 1 to 3 An embodiment of the present application provides a housing 10, comprising an upper housing 11 and a lower housing 12. The upper housing 11 comprises a plastic component 110 and a metal component 111. The plastic component 110 is provided with a hollow portion 1101 adapted to mate with the metal component 111. The metal component 111 is embedded in the hollow portion 1101, and the upper surface of the plastic component 110 and the upper surface of the metal component 111 are on the same horizontal plane. The lower housing 12 is connected to the upper housing 11.
[0039] In one embodiment, by embedding a metal part 111 on the plastic part 110 of the upper shell 11, the compressive strength of the upper shell 11 is enhanced, and the upper shell 11 is connected to the lower shell 12, thereby improving the compressive strength of the shell 10 and preventing the shell 10 from deforming under high pressure.
[0040] In one embodiment, the edge shape of the metal member 111 matches the edge shape of the hollow portion 1101. For example, the edge shape of the metal member 111 includes one or more of the following: W-shaped, sawtooth-shaped, and straight line.
[0041] In some other embodiments, the edge shape of the metal part 111 can be preset according to actual conditions. For example, the edge shape of the metal part 111 is a special shape, which is not limited in this embodiment.
[0042] In one embodiment, the metal member 111 may be manufactured by stamping, metal powder casting, wire drawing, etc.
[0043] In one embodiment, the ratio of the surface area of the metal member 111 to the surface area of the upper housing 11 is greater than a preset threshold. Specifically, the preset threshold may be set to 40%.
[0044] In one embodiment, by presetting the ratio of the surface area of the metal member 111 to the surface area of the upper shell 11 , it is ensured that the compressive strength of the upper shell 11 meets the use requirements.
[0045] In one embodiment, the metal member 111 is provided with a label, and the label includes one or more of the following: text, patterns. Specifically, the label can be obtained by drawing or laser engraving the upper surface of the metal member 111, or the label can be adhered to the upper surface of the metal member 111.
[0046] In one embodiment, a label is provided on the metal part 111 of the housing 10 , and the label is used to identify the corresponding product, while improving the aesthetics of the housing 10 .
[0047] In one embodiment, the metal member 111 is sealed to the plastic member 110 to prevent water or dust from entering the housing 10 through the connection between the metal member 111 and the plastic member 110. For example, the metal member 111 and the plastic member 110 can be sealed by dispensing glue.
[0048] In one embodiment, the lower housing 12 is sealed to the upper housing 11 to prevent water, dust, etc. from entering the housing 10 through the connection between the upper housing 11 and the lower housing 12. For example, the sealing method between the lower housing 12 and the upper housing 11 includes one or more of the following: sealing the connection between the upper housing 11 and the lower housing 12 by dispensing glue, or sealing the upper housing 11 and the lower housing 12 by ultrasonic waves.
[0049] In one embodiment, the lower housing 12 is made of plastic material.
[0050] In one embodiment, the plastic member 110 is provided with at least one first engaging portion 1102, and the lower housing 12 is provided with at least one second engaging portion 121 corresponding to the at least one first engaging portion 1102. The at least one first engaging portion 1102 is engaged with the at least one second engaging portion 121. For example, the first engaging portion 1102 may be configured as a groove, and the second engaging portion 121 may be configured as a protrusion corresponding to the first engaging portion.
[0051] In one embodiment, the upper shell 11 and the lower shell 12 are clamped together by at least one first clamping portion 1102 and at least one second clamping portion 121, thereby simplifying the assembly process of the upper shell 11 and the lower shell 12 and ensuring the stability of the connection between the upper shell 11 and the lower shell 12.
[0052] See also Figure 4 and Figure 5 One embodiment of the present application provides a memory card device 20 including a housing 10. The memory card device 20 also includes a circuit board 201. The end surface of the circuit board 201 is fixedly connected to the lower housing 12, and the back surface of the end surface of the circuit board 201 is fixedly connected to the metal member 111. For example, the memory card includes an SD card, an XD card, a CF memory card, an MMC memory card, etc.
[0053] In one embodiment, the housing 10 is assembled by a metal part 111 and a plastic part 110 . The memory card device 20 can increase the high pressure resistance to 200N, and the memory card device 20 can still be used normally after 60 seconds.
[0054] In one embodiment, a receiving groove 1103 is defined on the plastic component 110 , and the receiving groove 1103 is used to receive the circuit board 201 .
[0055] In one embodiment, the circuit board 201 and the lower housing 12 are bonded together by glue. The circuit board 201 and the metal member 111 are bonded together by glue.
[0056] In one embodiment, the circuit board 201 is fixedly connected in the housing 10 to ensure the connection performance of the memory card device 20 and improve the service life of the memory card device 20.
[0057] In one embodiment, by fixing the circuit board 201 within the housing 10 and assembling the housing 10 with metal components 111 and plastic components 110, the compressive strength of the housing 10 is improved, enabling the memory card device 20 to withstand high pressures, ensuring normal operation in high-pressure environments and improving the performance of the memory card device 20. Furthermore, the housing 10 is sealed, making the memory card device 20 waterproof and dustproof, preventing water or dust from entering the memory card device 20 and causing it to malfunction, thereby improving the performance and service life of the memory card device 20.
[0058] Those skilled in the art should recognize that the above embodiments are merely intended to illustrate the present application and are not intended to limit the present application. As long as they are within the spirit of the present application, appropriate changes and modifications to the above embodiments fall within the scope disclosed in the present application.
Claims
1. A housing, characterized in that: The housing comprises: An upper shell, the upper shell comprising a plastic part and a metal part, the plastic part being provided with a hollow portion adapted to fit the metal part, the metal part being embedded in the hollow portion, and the upper surface of the plastic part and the upper surface of the metal part being on the same horizontal plane; A lower shell is connected to the upper shell.
2. The housing according to claim 1, wherein The edge shape of the metal piece is adapted to the edge shape of the hollow portion.
3. The housing according to claim 1, wherein: A ratio of a surface area of the metal component to a surface area of the upper shell is greater than a preset threshold.
4. The housing according to claim 1, wherein The metal component is sealed to the plastic component.
5. The housing according to claim 1, wherein: The lower shell is sealed and connected to the upper shell.
6. The housing according to claim 1, wherein: The lower shell is made of plastic material.
7. The housing according to claim 1, wherein: At least one first clamping portion is provided on the plastic part, and at least one second clamping portion corresponding to the at least one first clamping portion is provided on the lower shell, and the at least one first clamping portion is clamped with the at least one second clamping portion.
8. A memory card device, characterized in that: The memory card device comprises the housing according to any one of claims 1 to 7, and further comprises: A circuit board, wherein the end surface of the circuit board is fixedly connected to the lower shell, and the back surface of the end surface of the circuit board is fixedly connected to the metal part.
9. The memory card device according to claim 8, wherein: The plastic part is provided with a receiving groove, and the receiving groove is used to receive the circuit board.
10. The memory card device according to claim 9, wherein The circuit board and the lower shell are bonded together by glue, and the circuit board and the metal part are bonded together by glue.
Citation Information
Patent Citations
Storage card
CN201732389U
Memory card
CN217588097U
Automatic package process for a card and package for a small card
US20040178277A1