Etching device for semiconductor chip production

Abstract

The invention relates to the field of semiconductor chip production, and discloses an etching device for semiconductor chip production, which comprises a shell mechanism and a recovery mechanism arranged below the shell mechanism, a placement mechanism is arranged in the shell mechanism, the shell mechanism comprises a fixed shell, an arc-shaped connecting shell is fixedly connected below the outer side of the fixed shell, and the arc-shaped connecting shell is fixedly connected with the recovery mechanism. According to the device disclosed by the invention, the chip and the bottom of the container are kept in micro-distance suspension through a transverse partition plate and a convex block structure arranged in the placement barrel, so that the etching liquid can be in 360-degree dead-angle-free contact with the surface of the chip, and the chip can be prevented from being damaged; when etching liquid is injected from the etching liquid injection pipe, the liquid level slowly rises through the containing cavity and completely wraps the chip, the supporting effect of the protruding blocks avoids the shielding effect caused by the fact that the chip directly makes contact with the bottom of the barrel, and therefore the potential quality hazard that the bottom face is not thoroughly etched is eliminated.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip production, in particular to an etching device for semiconductor chip production. Background Art

[0002] In the patent application with application publication number CN216528790U, it includes a box body, an etching chamber, a lifting mechanism, a placement mechanism, a top cover, a valve, a window and a discharge valve; the utility model has a reasonable and simple structure, low production cost, easy installation, and complete functions. The second motor is set up, which can drive the placement seat to move right to expose the placement groove, and then the semiconductor chip can be directly placed in the placement groove, thereby improving the convenience of taking and placing the semiconductor chip during etching treatment; the motor one set in this application can drive the front and rear sliders to synchronously drive the placement mechanism to move downward as a whole, so that the semiconductor chip can be moved to the etching liquid for etching treatment, thereby avoiding the inconvenience and trouble caused by manual movement; the valve set in the utility model is only opened when the semiconductor chip is taken and placed, so that the emission of toxic gas is relatively limited, thereby ensuring the physical and mental health of the staff.

[0003] In the above-mentioned patents, in most semiconductor chip etching equipment, the etching process of the semiconductor chip will cause uneven etching due to the bottom surface contacting the container. The uneven etching of the semiconductor chip will lead to a decrease in graphic accuracy, affecting the device performance and yield. The residual etching liquid will corrode the chip or contaminate subsequent processes, and the direct discharge of the etching waste liquid will increase environmental risks and treatment costs, while wasting a large amount of deionized water, reducing production efficiency and sustainability. Summary of the Invention

[0004] The object of the present invention is to provide an etching device for producing semiconductor chips to solve the problems raised in the above background technology.

[0005] To solve the above technical problems, the technical solution of the present invention is as follows: an etching device for semiconductor chip production, comprising a housing mechanism and a recovery mechanism disposed below the housing mechanism, wherein a placement mechanism is disposed within the housing mechanism, the housing mechanism comprising a fixed shell, an arc-shaped connecting shell fixedly connected to the lower outer side of the fixed shell, an etching liquid injection pipe fixedly connected to the lower outer side of the fixed shell, and a deionized water inlet pipe fixedly connected to the upper outer side of the fixed shell; The placement mechanism includes a placement component arranged in a fixed shell, a baffle component is arranged on one side of the interior of the placement component, the placement component includes a placement barrel, a connecting element is fixedly arranged on the upper end of the placement barrel, a fixed frame is fixedly connected to the outside of the placement barrel, a through hole is provided on the side of the placement barrel facing the fixed frame, a baffle is fixedly connected to the fixed frame, a liquid inlet hole is provided above the baffle, a slot is provided above the placement barrel, the slot and the fixed frame are arranged opposite to each other in the axial direction of the placement barrel, a plurality of cavities are provided on the outside of the placement barrel, a plurality of transverse partitions corresponding to the cavities are fixedly connected to the inside of the placement barrel, and a plurality of protrusions are fixedly provided above the transverse partitions.

[0006] Preferably, the baffle assembly includes an arc-shaped plate slidably connected in a slot, a handle is fixedly connected above the arc-shaped plate, and a plurality of vertical water grooves are provided on the arc-shaped plate.

[0007] Preferably, a deionized water drain pipe and an etching liquid drain pipe are fixedly connected to the outer side of the arc-shaped connecting shell, and valves are provided on both the deionized water drain pipe and the etching liquid drain pipe.

[0008] Preferably, the lower end of the fixed shell is fixedly connected to the connecting bottom shell, a driving motor is fixedly arranged at the lower part of the connecting bottom shell, a water baffle is fixedly connected to the upper part of the connecting bottom shell, the output end of the driving motor passes through the water baffle and is fixedly connected to a stirring blade, and a plurality of drainage holes are opened on the upper outside of the connecting bottom shell.

[0009] Preferably, a connecting ring is fixedly connected to the lower part of the interior of the fixed shell, and the shape of the internal through groove of the connecting ring corresponds to the placement mechanism.

[0010] Preferably, the connecting ring is provided with a hole corresponding to the etching liquid injection pipe.

[0011] Preferably, a liquid baffle is fixedly connected to one side of a deionized water inlet pipe provided above the interior of the fixed shell, and liquid baffle vertical plates are fixedly provided above both sides of the liquid baffle.

[0012] Preferably, the recovery mechanism includes a collecting assembly arranged at the bottom of the fixed shell, and a liquid storage assembly for collecting the cleaning liquid is arranged on the outside of the collecting assembly.

[0013] Preferably, the collecting assembly includes a connecting shell fixedly connected to the lower end of the fixed shell, the connecting shell is arranged on the outside of the connecting bottom shell, the lower end of the connecting shell is fixedly connected to a conical shell, the lower end of the conical shell is fixedly connected to a drainage pipe, and a drainage valve is provided on the drainage pipe.

[0014] Preferably, the liquid storage assembly includes a liquid storage shell fixedly connected to the lower end of the fixed shell, the liquid storage shell is arranged on the outside of the connecting shell, a fixed support rod is fixedly connected to the upper inner wall of the liquid storage shell, the fixed support rod is fixedly connected to the connecting shell, a plurality of legs are fixedly connected to the outside of the liquid storage shell, a liquid injection pipe is fixedly connected to the lower outside of the liquid storage shell, a water pump is fixedly arranged at the lower inside of the liquid storage shell, a connecting pipe is fixedly connected to the water pump, and the other end of the connecting pipe is fixedly connected to the liquid injection pipe.

[0015] Compared with the prior art, the technical solution of the present invention has the following advantages: (1) A recovery mechanism is provided below the shell mechanism, and a placement mechanism is provided inside the shell mechanism. The etching device effectively solves the problem of uneven etching caused by the bottom surface of the semiconductor chip contacting the container in the traditional etching process through the unique placement mechanism design. Specifically, the transverse partition and bump structure provided in the placement barrel keep the chip and the bottom of the container suspended at a micro distance, ensuring that the etching liquid can contact the chip surface 360° without dead angles. When the etching liquid is injected from the etching liquid injection pipe, the liquid level slowly rises through the cavity and completely wraps the chip. The supporting effect of the bump avoids the "shielding effect" caused by the chip directly contacting the bottom of the barrel, thereby eliminating the quality risk of incomplete etching of the bottom surface. In addition, the coordinated design of the fixed frame and the baffle not only prevents the chip from shifting, but also controls the liquid flow direction through the liquid inlet hole, making the fluid dynamics of the etching process more stable. Compared with the traditional immersion process, the device can improve the etching uniformity of the chip surface and significantly improve the graphic integrity of the semiconductor chip. (2) The device innovatively integrates the etching liquid recovery and cleaning water circulation systems to form a green production closed loop with efficient resource utilization. The core of the device is to collect cleaning water containing low-concentration etching liquid through the liquid storage component and use it for pre-cleaning in the next operation. In the specific work process, the water pump re-injects the mixed liquid temporarily stored in the liquid storage shell into the etching pipeline, which not only completes the preliminary neutralization of the residual liquid inside the equipment, but also reduces the consumption of fresh deionized water. The forced stirring of the stirring blade during the cleaning stage allows the diluted etching liquid to fully contact the dead corners of the equipment. Combined with the staged drainage design, the high-concentration mixed liquid is first discharged to the dedicated pipeline, and the low-concentration liquid is then discharged to the liquid storage shell, which can improve the etching liquid recovery rate. Compared with the traditional direct discharge process, this closed-loop system saves water and avoids the direct discharge of heavy metal waste liquid. The funnel-shaped design connecting the drainage hole of the bottom shell and the conical shell ensures that the waste liquid is transferred without retention, eliminates cross contamination, and reduces the cost of hazardous waste treatment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the fixed shell structure of the present invention; Figure 3 This is a schematic diagram of the housing structure of the present invention; Figure 4 This is a schematic structural diagram of the recovery mechanism of the present invention; Figure 5 This is a schematic structural diagram of the liquid storage component of the present invention; Figure 6 This is a schematic diagram of the structure of the collection component of the present invention; Figure 7 This is a schematic diagram of the placement mechanism structure of the present invention; Figure 8 This is a schematic diagram of the component placement structure of the present invention; Figure 9 This is a schematic diagram of the internal structure of the components of the present invention; Figure 10 Schematic diagram of the baffle assembly structure of the present invention.

[0017] In the figure: 1. Shell mechanism; 11. Fixed shell; 12. Arc-shaped connecting shell; 121. Deionized water drain pipe; 122. Etching liquid drain pipe; 13. Etching liquid injection pipe; 14. Deionized water inlet pipe; 15. Connecting ring; 16. Connecting bottom shell; 161. Drive motor; 162. Water baffle; 163. Stirring blade; 164. Drain hole; 17. Liquid baffle; 171. Liquid baffle vertical plate; 2. Recovery mechanism; 21. Liquid storage assembly; 211. Liquid storage shell; 212. Fixed support rod; 213. Support leg; 214 , liquid injection pipe; 215, water pump; 216, connecting pipe; 22, collecting assembly; 221, connecting shell; 222, conical shell; 223, drainage pipe; 224, drain valve; 3, placement mechanism; 31, placement assembly; 311, placement barrel; 312, connecting element; 313, fixing frame; 314, baffle; 315, liquid inlet hole; 316, slot; 317, cavity; 318, partition; 319, bump; 32, baffle assembly; 321, arc plate; 322, vertical water groove; 323, handle. DETAILED DESCRIPTION

[0018] To make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0019] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words “including” or “comprising” and the like used in this disclosure mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The words “connected” or “connected” and the like are not limited to physical or mechanical connections, but may also include electrical connections, whether direct or indirect. “Up”, “down”, “left”, “right” and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0020] like Figures 1 to 10 As shown, the present invention provides an etching device for semiconductor chip production, comprising a housing mechanism 1 and a recovery mechanism 2 disposed below the housing mechanism 1. A placement mechanism 3 is disposed inside the housing mechanism 1. The housing mechanism 1 comprises a fixed shell 11, to which an arc-shaped connecting shell 12 is fixedly connected at the lower outer side of the fixed shell 11, an etching liquid injection pipe 13 is fixedly connected at the lower outer side of the fixed shell 11, and a deionized water inlet pipe 14 is fixedly connected at the upper outer side of the fixed shell 11. One end of the deionized water inlet pipe 14 is connected to a deionized water injection device, and the etching liquid injection pipe 13 is connected to the etching liquid injection device and a hose via a tee pipe. The placement mechanism 3 includes a placement component 31 arranged in the fixed shell 11, a baffle component 32 is provided on one side of the placement component 31, the placement component 31 includes a placement barrel 311, a connecting element 312 is fixedly provided on the upper end of the placement barrel 311, the placement barrel 311 is connected to the driving device through the connecting element 312, and the driving device is used to control the height of the placement mechanism 3 in the fixed shell 11, a fixing frame 313 is fixedly connected to the outside of the placement barrel 311, a through hole is provided on the side of the placement barrel 311 facing the fixing frame 313, a baffle 314 is fixedly connected to the fixing frame 313, a liquid inlet hole 315 is provided above the baffle 314, a slot 316 is provided above the placement barrel 311, the slot 316 and the fixing frame 313 are arranged opposite to each other in the axial direction of the placement barrel 311, a plurality of cavities 317 are provided on the outside of the placement barrel 311, a plurality of transverse partitions 318 corresponding to the cavities 317 are fixedly connected to the placement barrel 311, and a plurality of protrusions 319 are fixedly provided above the transverse partitions 318.

[0021] The baffle assembly 32 includes an arc-shaped plate 321 slidably connected to the slot 316 , a handle 323 is fixedly connected to the top of the arc-shaped plate 321 , and a plurality of vertical water-passing grooves 322 are formed on the arc-shaped plate 321 .

[0022] A deionized water drain pipe 121 and an etching liquid drain pipe 122 are fixedly connected to the outside of the arc-shaped connecting shell 12 . Both the deionized water drain pipe 121 and the etching liquid drain pipe 122 are provided with valves.

[0023] The lower end of the fixed shell 11 is fixedly connected to the connecting bottom shell 16, a driving motor 161 is fixedly arranged at the lower part of the connecting bottom shell 16, a water-blocking plate 162 is fixedly connected to the upper part of the connecting bottom shell 16, the output end of the driving motor 161 passes through the water-blocking plate 162 and is fixedly connected to a stirring blade 163, and a plurality of drainage holes 164 are opened on the upper outside of the connecting bottom shell 16.

[0024] A connecting ring 15 is fixedly connected to the lower portion of the fixed shell 11 , and the shape of the through groove inside the connecting ring 15 corresponds to that of the placement mechanism 3 .

[0025] The connecting ring 15 is provided with a hole corresponding to the etching liquid injection pipe 13 .

[0026] A liquid baffle plate 17 is fixedly connected to one side of a deionized water inlet pipe 14 provided on the upper portion of the fixed shell 11 , and liquid baffle vertical plates 171 are fixedly provided on both sides of the liquid baffle plate 17 .

[0027] The recovery mechanism 2 includes a collecting assembly 22 disposed at the bottom of the fixed shell 11 , and a liquid storage assembly 21 for collecting cleaning liquid is disposed outside the collecting assembly 22 .

[0028] The collecting assembly 22 includes a connecting shell 221 fixedly connected to the lower end of the fixed shell 11. The connecting shell 221 is arranged on the outside of the connecting bottom shell 16. The lower end of the connecting shell 221 is fixedly connected to a conical shell 222. The lower end of the conical shell 222 is fixedly connected to a drainage pipe 223. A drain valve 224 is provided on the drainage pipe 223. The drain valve 224 is fixedly connected to the handwheel through a connecting rod passing through the liquid storage shell 211.

[0029] The liquid storage assembly 21 includes a liquid storage shell 211 fixedly connected to the lower end of the fixed shell 11, the liquid storage shell 211 is arranged on the outside of the connecting shell 221, and a fixed support rod 212 is fixedly connected to the upper inner wall of the liquid storage shell 211, and the fixed support rod 212 is fixedly connected to the connecting shell 221. A plurality of legs 213 are fixedly connected to the outside of the liquid storage shell 211, and an injection pipe 214 is fixedly connected to the lower outer side of the liquid storage shell 211. The other end of the injection pipe 214 is connected to a liquid hose, and the hose is connected to the tee pipe at one end of the etching liquid injection pipe 13. A water pump 215 is fixedly provided at the lower inside of the liquid storage shell 211, and a connecting pipe 216 is fixedly connected to the water pump 215, and the other end of the connecting pipe 216 is fixedly connected to the injection pipe 214.

[0030] The working principle of the present invention is as follows: when in use, the semiconductor chip is placed above the transverse partition 318 through the cavity 317, the protrusion 319 is pressed against the bottom of the semiconductor chip, the arc plate 321 is inserted into the slot 316, and the semiconductor chip is blocked to prevent the semiconductor chip from being removed from the placement barrel 311. The driving device drives the placement barrel 311 into the bottom of the fixed shell 11 through the connecting element 312. At this time, the placement barrel 311 blocks the top of the connecting bottom shell 16, so that the liquid cannot enter the connecting bottom shell 16. At this time, the etching liquid The etching liquid is injected into the lower part of the fixed housing 11 through the connecting ring 15, and the liquid level does not exceed the height of the connecting ring 15. After entering the fixed housing 11, as the liquid flows in, the liquid level enters the placement barrel 311 from the receiving cavity 317. As the liquid level rises, the liquid level completely submerges the semiconductor chip. Due to the arrangement of the bumps 319, the liquid level also etches the bottom surface of the semiconductor chip, eliminating direct contact between the bottom surface of the semiconductor chip and the bottom of the container. As a result, the etching liquid cannot completely etch the bottom surface of the semiconductor chip, affecting the etching quality. When etching is completed, the valve on the etching liquid drain pipe 122 is opened to drain the etching liquid in the fixed shell 11, and then the etching liquid drain pipe 122 is closed. The driving device drives the placement barrel 311 to rise above the interior of the fixed shell 11 through the connecting element 312. At this time, the liquid inlet hole 315 is located above the liquid baffle plate 17, and deionized water is poured into the fixed shell 11 through the deionized water inlet pipe 14. At this time, the placement barrel 311 and the bottom of the fixed frame 313 are not separated from the connecting ring 15, preventing deionized water from entering the bottom of the fixed shell 11. The placement barrel 311, the fixed frame 313, the liquid baffle plate 17 and the liquid baffle vertical plate 171 form a separate cavity. The deionized water is first injected into the placement barrel 311, the fixed frame 313 and the liquid baffle plate 17. The deionized water forms a cavity with the liquid-blocking vertical plate 171, and then enters the placement barrel 311 through the liquid inlet hole 315. After the deionized water completely submerges the placement barrel 311, the driving device drives the placement barrel 311 to rise slightly upward through the connecting element 312, so that the placement barrel 311 is no longer in contact with the connecting ring 15. At this time, the distance between the placement barrel 311 and the connecting ring 15 is small, and the deionized water above the interior of the fixed shell 11 slowly penetrates into the interior of the fixed shell 11 below. The deionized water continues to flow into the fixed shell 11. There is no obstruction of the placement barrel 311 above the connecting bottom shell 16. The liquid contacts the stirring blade 163, and the driving motor 161 drives the stirring blade 163 to rotate to stir the deionized water below the interior of the fixed shell 11, so that the solid The deionized water at the bottom of the fixed shell 11 cleans the residual etching liquid at the bottom of the fixed shell 11. As the deionized water at the top of the fixed shell 11 slowly flows downward, the liquid is in a flowing state, cleaning the semiconductor chips in the placement barrel 311, and completely stopping the etching liquid from etching the semiconductor chips. When the liquid level at the bottom of the fixed shell 11 is about to be filled, the valve on the deionized water drain pipe 121 is opened to drain the deionized water containing more etching liquid in the fixed shell 11. When the etching liquid in the deionized water is less, the deionized water drain pipe 121 is closed and the drain valve 224 is opened to allow the deionized water containing less etching liquid in the fixed shell 11 to enter the connecting shell 2 through the drainage hole 164. 21, enters the liquid storage shell 211 through the drainage pipe 223. When the semiconductor chip is cleaned, the injection of deionized water is stopped. During the next cleaning, the deionized water containing a small amount of etching solution in the liquid storage shell 211 is first extracted by the water pump 215 and injected into the hose connected to the injection pipe 214. The water is then injected into the etching solution injection pipe 13 through the hose, and the deionized water in the liquid storage shell 211 is injected into the lower part of the interior of the fixed shell 11. The lower part of the interior of the fixed shell 11 is first cleaned. After etching the semiconductor chip, the semiconductor chip is directly cleaned, and the etching equipment is cleaned with the cleaned deionized water to prevent the etching solution from remaining and deteriorating, which will affect the next etching of the semiconductor chip and the etching quality of the semiconductor chip.

[0031] The above embodiments are merely exemplary embodiments of the present invention and are not intended to limit the scope of the present invention. The scope of protection of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the spirit and scope of protection of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the scope of protection of the present invention.

Claims

1. An etching device for semiconductor chip production, comprising a housing mechanism (1) and a recovery mechanism (2) arranged below the housing mechanism (1), wherein a placement mechanism (3) is arranged inside the housing mechanism (1), characterized in that: The housing structure (1) comprises a fixed shell (11), an arc-shaped connecting shell (12) is fixedly connected to the lower outer side of the fixed shell (11), an etching liquid injection pipe (13) is fixedly connected to the lower outer side of the fixed shell (11), and a deionized water inlet pipe (14) is fixedly connected to the upper outer side of the fixed shell (11); The placement mechanism (3) includes a placement component (31) disposed in a fixed shell (11), a baffle component (32) is disposed on one side of the placement component (31), the placement component (31) includes a placement barrel (311), a connecting element (312) is fixedly disposed on the upper end of the placement barrel (311), a fixed frame (313) is fixedly connected to the outer side of the placement barrel (311), a through hole is opened on one side of the placement barrel (311) facing the fixed frame (313), and a baffle component (32) is fixedly connected to the fixed frame (313). A plate (314) is provided above the baffle (314), a liquid inlet hole (315) is provided above the placement barrel (311), a slot (316) is provided above the placement barrel (311), the slot (316) and the fixing frame (313) are arranged opposite to each other in the axial direction of the placement barrel (311), a plurality of cavities (317) are provided outside the placement barrel (311), a plurality of transverse partitions (318) corresponding to the cavities (317) are fixedly connected inside the placement barrel (311), and a plurality of protrusions (319) are fixedly provided above the transverse partitions (318).

2. The etching device for semiconductor chip production according to claim 1, characterized in that: The baffle assembly (32) comprises an arc-shaped plate (321) slidably connected in the slot (316), a handle (323) is fixedly connected above the arc-shaped plate (321), and a plurality of vertical water-passing grooves (322) are provided on the arc-shaped plate (321).

3. The etching device for semiconductor chip production according to claim 1, characterized in that: A deionized water drain pipe (121) and an etching liquid drain pipe (122) are fixedly connected to the outside of the arc-shaped connecting shell (12), and valves are provided on both the deionized water drain pipe (121) and the etching liquid drain pipe (122).

4. The etching device for semiconductor chip production according to claim 1, wherein: The lower end of the fixed shell (11) is fixedly connected to the connecting bottom shell (16), a driving motor (161) is fixedly provided at the lower part of the connecting bottom shell (16), a water baffle (162) is fixedly connected to the upper part of the connecting bottom shell (16), an output end of the driving motor (161) passes through the water baffle (162) and is fixedly connected to a stirring blade (163), and a plurality of drainage holes (164) are provided at the upper part of the outer side of the connecting bottom shell (16).

5. The etching device for semiconductor chip production according to claim 1, characterized in that: A connecting ring (15) is fixedly connected to the lower portion of the interior of the fixed shell (11), and the shape of the internal through groove of the connecting ring (15) corresponds to that of the placement mechanism (3).

6. The etching device for semiconductor chip production according to claim 5, characterized in that: The connecting ring (15) is provided with a hole corresponding to the etching liquid injection pipe (13).

7. The etching device for semiconductor chip production according to claim 1, characterized in that: A liquid baffle (17) is fixedly connected to one side of a deionized water inlet pipe (14) provided above the interior of the fixed shell (11), and liquid baffle vertical plates (171) are fixedly provided above both sides of the liquid baffle (17).

8. The etching device for semiconductor chip production according to claim 1, characterized in that: The recovery mechanism (2) comprises a collection assembly (22) arranged at the bottom of the fixed shell (11), and a liquid storage assembly (21) for collecting cleaning liquid is arranged outside the collection assembly (22).

9. The etching device for semiconductor chip production according to claim 8, characterized in that: The collecting assembly (22) comprises a connecting shell (221) fixedly connected to the lower end of the fixed shell (11); the connecting shell (221) is arranged outside the connecting bottom shell (16); the lower end of the connecting shell (221) is fixedly connected to a conical shell (222); the lower end of the conical shell (222) is fixedly connected to a drainage pipe (223); and a drainage valve (224) is provided on the drainage pipe (223).

10. The etching device for semiconductor chip production according to claim 8, characterized in that: The liquid storage assembly (21) comprises a liquid storage shell (211) fixedly connected to the lower end of the fixed shell (11); the liquid storage shell (211) is arranged on the outside of the connecting shell (221); a fixed support rod (212) is fixedly connected to the upper inner wall of the liquid storage shell (211); the fixed support rod (212) is fixedly connected to the connecting shell (221); a plurality of legs (213) are fixedly connected to the outside of the liquid storage shell (211); a liquid injection pipe (214) is fixedly connected to the lower outer side of the liquid storage shell (211); a water pump (215) is fixedly arranged at the lower inner side of the liquid storage shell (211); a connecting pipe (216) is fixedly connected to the water pump (215); the other end of the connecting pipe (216) is fixedly connected to the liquid injection pipe (214).

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