Chip mounting device and design method

Abstract

The invention relates to a chip mounting device and a design method. Comprising a working table provided with a first opening, a carrying table arranged at a working plane and provided with a second opening, a limiting mechanism used for fixing a wafer to enable the wafer to be suspended, a feeding plane used for placing a packaging substrate, a first displacement assembly moving along the working plane, a picking assembly with an adsorption piece, and an ejection mechanism arranged in a first containing space. The ejection mechanism comprises a movable ejection end and an abutting piece provided with a plurality of through holes, the ejector pins penetrate through the through holes and are used for ejecting crystal grains from the lower portion, and the ejector pins are configured in the mode that when target pressure is applied to the downward pressing stroke of the adsorption piece, the area of a supporting area defined by contact points at the ends of the ejector pins is not smaller than the needed supporting area. Therefore, the problem of damage caused by insufficient support in the crystal grain adsorption process is solved, the cooperation of support and adsorption is realized, and the mounting reliability and adaptability are improved.

Description

Technical Field

[0001] The present invention relates to a patch device, and in particular to a patch device for wafer packaging and a design method thereof. Background Art

[0002] As integrated circuit packaging technology evolves toward miniaturization, high density, and high precision, wafer-level packaging (WLP) has gradually become the mainstream process. In this process, the bonding device, a key component for efficiently transferring the die to the packaging substrate after wafer dicing, directly impacts packaging efficiency and yield. Typically, after wafer dicing, the wafer remains attached to one side of a film (such as a blue film). The bonding device must separate each die from the film and precisely attach it to the pre-set packaging position. This places higher demands on the stability of the die support, as well as the precision and reliability of the separation process.

[0003] Most existing placement systems utilize a transfer strategy based on bottom-up ejection and top-down suction. In these systems, the wafer and its carrier film are placed on a support platform. An ejection mechanism applies force from below to partially lift the wafer, while a top pickup mechanism cooperates with suction to complete the transfer.

[0004] However, in existing die placement structures, the ejection process mostly uses a fixed number of ejector pins with a fixed spacing to support the die, which lacks the ability to adapt to different die sizes and changes in the upper adsorption structure. During the actual adsorption process, the upper surface of the die is subjected to downward pressure by the adsorption component. If the support area on the lower surface is insufficient or the force is uneven, it is very easy to cause local stress concentration on the die, leading to breakage or microcracks. Therefore, a new die placement device is urgently needed to solve the above problems. A structural design scheme that can automatically determine the support requirements based on the adsorption parameters and realize matching of the ejector pin layout can improve the adaptability of the die placement process and the integrity of the die. Summary of the Invention

[0005] The object of the present invention is to provide a chip placement device that overcomes the problem of damage or cracks to the die caused by the lack of matching between the ejector support structure and the pressure applied by the adsorption member during the die adsorption process.

[0006] The technical solution adopted by the present invention to solve the above-mentioned problem is: a chip placement device for transferring the die on the wafer adhered to one side of the diaphragm and completed to the packaging substrate, comprising: A workbench, comprising a first accommodating space and a work plane, wherein the work plane is provided with a first opening; a carrier, arranged at the working plane so that the wafer adhered to the membrane is in a suspended state; Material transfer mechanism, including: an adsorption member, which moves in a controlled manner, wherein the adsorption member includes an adsorption surface to generate negative pressure when the adsorption member is in an operating state; The ejection mechanism is arranged in the first accommodating space, and the ejection mechanism includes: a second displacement assembly comprising a second movable end controlled to move in a second plane, the second plane being parallel to the working plane; An ejection assembly is provided at the second moving end, and the ejection assembly includes: The abutment member comprises an abutment surface parallel to the working plane and a second accommodating space, wherein the abutment surface is provided with a plurality of through holes communicating with the second accommodating space; an ejection end, disposed in the second accommodating space and controlled to move along the first direction; an ejector pin, disposed on a side of the ejection end close to the through hole, and passing through the through hole, wherein an end of the ejector pin away from the ejection end is configured to pass through the through hole and move to the outside of the ejection assembly when the ejection end is in an ejection state; The ejector pin is configured so that when the adsorption member is in contact with one side of the die and moves a preset stroke toward the die so as to apply a target pressure to the side of the die away from the ejector pin, the area of ​​the support region formed by the contact position between the end of the ejector pin and the die is greater than or equal to the minimum support area required according to the target pressure, and the target pressure is determined by the material of the adsorption member and the preset stroke.

[0007] Preferably, the first opening is communicated with the first accommodating space; A feeding plane moves in a controlled manner, wherein a packaging position is provided on the feeding plane, and the packaging position is used to place a packaging substrate; The carrier includes a carrying surface parallel to the working plane, and a second opening is formed on the carrying surface and communicates with the first opening; the carrier also includes a limiting mechanism for limiting the wafer adhered to the diaphragm at the second opening of the carrying surface; The material transfer mechanism also includes a picking component that is controlled to move in a first plane parallel to the working plane. The picking component includes an adsorption end that is controlled to rotate and move along a first direction. The rotation axis of the adsorption end and the first direction are both perpendicular to the working plane.

[0008] Preferably, the number of the ejector pins and the number of the ejector ends are both several, each ejector pin is connected to each ejector end in a one-to-one correspondence, and each ejector end is independently controlled.

[0009] The support area is configured to increase the number of ejection pins and reduce the distance between adjacent ejection pins when the target pressure increases.

[0010] Preferably, the number of the through holes is greater than the number of the ejector pins, and the ejection assembly further comprises: a plurality of connecting tubes, one end of each connecting tube being connected to an end of the through hole not penetrated by the ejector pin and facing away from the material moving mechanism; An air source operates in a controlled manner and is connected to the other end of the connecting pipe.

[0011] Preferably, the patch device further includes: The first conveying mechanism includes an upper material position, a lower material position, and a feeding plane which is arranged between the upper material position and the lower material position and moves in a controlled manner. The feeding plane is arranged parallel to the working plane.

[0012] Preferably, the material moving mechanism further comprises: a first displacement assembly, comprising a first moving end controlled to move in a first plane parallel to the working plane, the first moving end being connected to the pickup assembly to drive the pickup assembly to move; The third displacement component includes a third mobile end, which is controlled to move within the first plane. The movement trajectory of the third mobile end is perpendicular to the movement trajectory of the first mobile end, and the first displacement component is arranged on the third mobile end to move synchronously with the third mobile end.

[0013] Preferably, the ejection mechanism further comprises: The fourth displacement component includes a fourth mobile end arranged in the first accommodating space, the fourth mobile end is controlled to move in the second plane, the movement trajectory of the fourth mobile end is perpendicular to the movement trajectory of the second mobile end, and the second displacement component is arranged on the fourth mobile end to move synchronously with the fourth mobile end.

[0014] Preferably, the adsorption end of the pickup assembly is configured to be driven by a voice coil motor.

[0015] In particular, a design method for the above patch device includes the following steps: Obtaining the size parameters of the grain, including the length, width, and thickness of the grain on the side facing the ejection mechanism; Obtaining the material of the adsorption member and the preset stroke, and determining the target pressure applied by the adsorption member to the die in a working state based on the elastic modulus and structural rebound characteristics of the die material and the preset stroke; Determining the minimum support area required for the bottom surface of the grain based on the target pressure and the material properties of the grain; Taking the minimum support area as the support region area, and based on the boundary range of the side of the die facing the ejection mechanism, planning the contact positions of a plurality of ejector pins at one end facing the material transfer mechanism on the side of the die facing the ejection mechanism, such that the support area enclosed by the lines connecting the contact points of the ejector pin ends with the die is not less than the minimum support area, and the support region is completely located within the range of the side of the die facing the ejection mechanism; The required number of ejector pins and the position distribution of the ejector pins are determined according to the number and relative positions of the contact points.

[0016] Preferably, the step of obtaining the minimum support area required for the bottom surface of the grain according to the target pressure and the material properties of the grain comprises the following steps: The upper limit of the pressure per unit area that the grains can withstand is obtained based on the material properties of the grains; The minimum support area is obtained according to the target pressure and the upper pressure limit.

[0017] Beneficial effects of the embodiments of the present invention: 1. Due to the technical means adopted in which the area of ​​the support area formed by the contact position between the end of the ejector pin and the die is greater than or equal to the required support area obtained according to the target pressure of the adsorption component, and the target pressure is jointly limited by the material of the adsorption component and the downward pressure stroke, the problem of the die breaking or microcracks caused by insufficient bottom support or uneven force during the adsorption process in the prior art is effectively solved, thereby achieving the matching and coordination between the support structure and the adsorption action during the bonding process, improving the stability and integrity of the wafer adsorption, and enhancing the adaptability of the equipment to different die sizes and adsorption parameters.

[0018] 2. The design method uses a method that determines the target pressure based on the die size, adsorption material, and preset stroke, combined with the die material properties. The minimum support area is deduced from this target pressure, and the number of ejector pins and the distribution of contact positions are planned based on this area. Therefore, it effectively solves the problem in the existing technology that the bottom support structure cannot be dynamically adjusted according to the adsorption load, resulting in uneven force and easy damage to the wafer during the adsorption process. It then achieves a precise match between the ejector pin support structure and the adsorption conditions, improves the adaptability of die under various sizes and material conditions, and improves the stability of the placement process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic top view of the interior of a patch device shown in a preferred embodiment of the present invention.

[0020] Figure 2 It is a schematic front view of the interior of the patch device shown in a preferred embodiment of the present invention.

[0021] Figure 3It is a schematic structural diagram of the interior of a patch device with a pickup component in a separated state, shown in a preferred embodiment of the present invention.

[0022] Figure 4 It is a schematic structural diagram of an ejection assembly shown in a preferred embodiment of the present invention.

[0023] Figure 5 It is a schematic cross-sectional view of an ejection assembly shown in a preferred embodiment of the present invention.

[0024] Figure 6 It is a schematic structural diagram showing a preferred embodiment of the present invention when the ejector pin and the ejection end are in a connected state.

[0025] Figure 7 It is a schematic structural diagram of a patch device shown in a preferred embodiment of the present invention.

[0026] Figure 8 It is a flowchart of a design method of a patch device shown in a preferred embodiment of the present invention.

[0027] Figure 9 yes Figure 7 Flow chart of each sub-step of step S300.

[0028] Among them: 10, workbench; 110, first accommodating space; 120, working plane; 20, carrier; 210, bearing surface; 211, second opening; 220, limiting mechanism; 30, first conveying mechanism; 310, loading position; 320, unloading position; 330, feeding plane; 40, material moving mechanism; 410, first displacement component; 420, picking component; 421, adsorption end; 430, adsorption part; 440, third displacement component; 50, ejection mechanism; 510, ejection component; 511, abutment member; 5111, abutment surface; 5112, through hole; 512, ejection end; 513, ejector. DETAILED DESCRIPTION

[0029] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0030] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description created by the present application, unless otherwise specified, "multiple" means two or more.

[0031] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0032] See also Figure 1-Figure 7 In a preferred embodiment of the present application, a patch device is provided to transfer the grains on the wafer that has been adhered to one side of the diaphragm and completed the segmentation to the packaging substrate. The patch device is suitable for automatic attachment of grains during wafer-level packaging, and is suitable for installation in packaging equipment with precision control capabilities. It can operate in a clean environment with constant temperature, constant humidity and no vibration.

[0033] The patch device includes a workbench 10 , a carrier 20 , a first conveying mechanism 30 , a material moving mechanism 40 and an ejecting mechanism 50 .The workbench 10 includes a first accommodating space 110 and a working plane 120 parallel to the horizontal plane, and a first opening communicating with the first accommodating space 110 is provided on the working plane 120; the carrier 20 is arranged at the working plane 120, and the carrier 20 includes a bearing surface 210 parallel to the working plane 120, and a second opening 211 communicating with the first opening is provided on the bearing surface 210; the carrier 20 also includes a limiting mechanism 220 for limiting the wafer adhered to the diaphragm at the second opening 211 of the bearing surface 210, so that the wafer adhered to the diaphragm is suspended; the first conveying mechanism 30 includes a loading position 310, a unloading position 320 and a position provided between the loading position 310 and the unloading position. The feeding plane 330 is controlled to move between the positions 320 and is controlled to move, and a packaging position is provided on the feeding plane 330, and a packaging substrate is placed on the packaging position; the material moving mechanism 40 includes a first displacement component 410, a picking component 420 and an adsorption component 430, wherein the first displacement component 410 includes a first moving end, the first moving end is controlled to move in a first plane, the first plane is parallel to the working plane 120, the picking component 420 is connected to the first moving end to move with the first moving end, the picking component 420 includes an adsorption end 421, the adsorption end 421 is controlled to rotate and move along the first direction, the rotation axis of the adsorption end 421 and the first direction are perpendicular to the working plane 120, and the adsorption component 43 0 is arranged at the adsorption end 421, the adsorption member 430 includes an adsorption surface, and the adsorption member 430 is controlled to generate negative pressure at the adsorption surface; the ejection mechanism 50 is arranged in the first accommodating space 110, and the ejection mechanism 50 includes a second displacement component and an ejection component 510, wherein the second displacement component includes a second moving end arranged in the first accommodating space 110, the second moving end is controlled to move in a second plane, the second plane is parallel to the working plane 120, the ejection component 510 is arranged on the second moving end, and the orthographic projection of the movement trajectory of the ejection component 510 on the working plane 120 is located within the range of the orthographic projection of the second opening 211 on the working plane 120, the The ejection assembly 510 includes an abutment member 511, an ejection end 512 and a plurality of ejector pins 513, wherein the abutment member 511 includes an abutment surface 5111 parallel to the working plane 120 and a second accommodating space, the abutment surface 5111 is provided with a plurality of through holes 5112 communicating with the second accommodating space, the ejection end 512 is disposed in the second accommodating space and is controlled to move along the first direction, the ejector pins 513 are disposed on a side of the ejection end 512 close to the through holes 5112, and the ejector pins 513 are passed through the through holes 5112, and the end of the ejector pins 513 away from the ejection end 512 is configured to pass through the through holes 5112 and move to the outside of the through holes 5112 when the ejection end 512 is in the ejected state.Furthermore, the ejector pin 513 is configured such that when the adsorption member 430 is attached to one side of the die and moves a preset stroke toward the die so as to apply a target pressure to the side of the die away from the ejector pin 513, the area of ​​the support region enclosed by the contact position between the end of the ejector pin 513 and the die is greater than or equal to the required support area obtained based on the target pressure; the target pressure is jointly defined by the material of the adsorption member 430 and the preset stroke.

[0034] Specifically: The workbench 10 has a first accommodating space 110 and a horizontally parallel work surface 120. A first opening is provided in the center of the work surface 120, forming a through-space. The carrier 20 is mounted on the work surface 120 and has a supporting surface 210 parallel to the work surface 120. The supporting surface 210 defines a second opening 211 that communicates with the first opening and is provided with a retaining mechanism 220. The retaining mechanism 220 is used to secure the wafer at the edge of the second opening 211, keeping it suspended in the air and providing space for the ejection mechanism 50 to operate from bottom to top.

[0035] The first conveying mechanism 30 includes a loading position 310, a unloading position 320 and a feeding plane 330 arranged therebetween. The feeding plane 330 can move horizontally under control instructions. The packaging substrate is placed in the packaging position on the feeding plane 330 and then moved to the position to be packaged, waiting for the material transfer mechanism 40 to transfer the grain to the packaging substrate for grain bonding.

[0036] The material transfer mechanism 40 is used to transfer the die from the blue film to the packaging substrate and includes a first displacement assembly 410, a pickup assembly 420, and a suction member 430. The first displacement assembly 410 includes a movable end that can move within a plane, and the pickup assembly 420 is connected to it and can move with it in the plane. The suction end 421 of the pickup assembly 420 can rotate about a vertical axis and can move up and down in the vertical direction. The suction member 430 is located at the suction end 421. Its suction surface generates negative pressure under control to absorb the die. The movement range of the suction end 421 is preset and can be precisely controlled.

[0037] The ejection mechanism 50 is arranged in the first accommodating space 110 below the workbench 10, and includes a second displacement assembly and an ejection assembly 510. The second displacement assembly can drive the second movable end installed thereon to move in a direction parallel to the working plane 120. The ejection assembly 510 is arranged on the movable end, and the orthographic projection of its movement trajectory is always located within the orthographic projection of the second opening 211 of the working surface to ensure that the ejector 513 is accurately aligned with the target grain. The ejection assembly 510 includes an abutment 511, the upper surface of the abutment 5111 is an abutment surface 5111 parallel to the working plane 120, and the interior is a second accommodating space, and a plurality of through holes 5112 are evenly distributed on the abutment surface 5111. The ejection end 512 is arranged in the second accommodating space and can be moved up and down in the vertical direction under control. Multiple ejector pins 513 are arranged on the side of the ejection end 512 close to the through hole 5112. Each ejector pin 513 is inserted into the corresponding through hole 5112. When the ejection end 512 moves upward to the ejection state, the end away from the ejection end 512 can pass through the through hole 5112 and protrude outside the abutment surface 5111.

[0038] During operation, when the adsorption part 430 is attached from above the grain and compressed downward to a preset stroke, it will apply a certain target pressure to the top of the grain. In order to prevent the grain from being damaged due to downward pressure, the ejector pins 513 in the ejection mechanism 50 are arranged on the bottom surface of the grain as needed, and the support area formed by the contact points of the ejector pins 513 is not less than the minimum support area required to withstand the target pressure. The size of the target pressure is determined by the material and stroke of the adsorption part 430, so the design of the support area can be dynamically adjusted according to the grain size and adsorption conditions. During the equipment initialization phase or after the grain parameters are updated, the control system automatically calculates the target support area according to the adsorption conditions, and adjusts the number and distribution position of the ejector pins 513 to ensure mechanical matching.

[0039] The placement device is suitable for the automatic placement process of various specifications of grains. In terms of applicable environment, it can operate with high stability in a clean room. The operating temperature range can cover conventional packaging production conditions and is suitable for blue films or wafers of different sizes.

[0040] This embodiment adopts a structural design method that dynamically determines the die support area based on the adsorption parameters and encloses a support area that matches the area by multiple ejector pins 513. Therefore, it effectively solves the technical problem in the prior art that the die is easily damaged due to insufficient bottom support or uneven force during the adsorption process, thereby achieving coordinated linkage between the adsorption structure and the support structure during the mounting process, improving the integrity of the die adsorption, the stability of the mounting process, and the adaptability of the equipment to various packaging conditions.

[0041] Furthermore, in some embodiments, the number of the ejector pins 513 and the number of the ejection ends 512 are both multiple (not shown in the figures), each ejector pin 513 is connected to each ejection end 512 in a one-to-one correspondence, and each ejection end 512 is independently controlled; the support area is configured to increase the number of ejection pins 513 and reduce the distance between adjacent ejector pins 513 when the target pressure increases, so that the support area meets the mechanical support conditions required for the grain under the action of the target pressure.

[0042] Specifically: The ejection mechanism 50 is configured as multiple independently controlled ejection units. Each ejection unit includes an ejection end 512 and a corresponding ejection pin 513. The ejection ends 512 are independent of each other, and each ejection pin 513 is inserted into a corresponding through-hole 5112, thereby achieving independent drive control of multiple support points. Each ejection end 512 can be independently actuated by the control system, allowing its corresponding ejection pin 513 to pass through the through-hole 5112 and provide local support at a specific location on the bottom of the die.

[0043] During operation, the control system first calculates the minimum support area required for the grain during adsorption based on the grain size, material properties, and the current target pressure parameters of the adsorption element 430. The system then dynamically selects an appropriate number of ejector pins 512 based on this support area, combined with the geometric dimensions and support capacity of the ejector pins 513. The greater the target pressure, the more ejector pins 512 the system allocates for ejection, and the spacing between the ejector pins 513 decreases accordingly, resulting in a denser distribution of support points to ensure the higher mechanical stability required by the grain under increasing pressure.

[0044] During the device's response, each ejector port 512 receives control commands via independent channels, enabling rapid response to changes in die position, structure, or stress requirements. When the device processes die of varying sizes, materials, or shapes, the control system can update the support strategy in real time, enabling reconfiguration of the support area for various sizes and operating conditions. This structure is particularly suitable for packaging applications requiring uniform force distribution, such as those involving irregularly shaped die and fragile chips.

[0045] This device is suitable for high-precision automated placement processes, particularly in cleanroom environments where temperature and humidity are strictly controlled in precision electronics manufacturing lines. Its modular structure allows for high adaptability and can be installed on various die placement platforms, integrating with industrial vision systems or motion control platforms.

[0046] This embodiment adopts the technical means of independent control of multiple ejection terminals 512, dynamic adjustment of the number of ejection pins 513 and variable spacing. Therefore, it effectively solves the problem in the prior art that the fixed support structure cannot adapt to different adsorption pressure changes, resulting in concentrated force and insufficient support of the grains during high-pressure adsorption. It also realizes the real-time response of the support structure to the target pressure change, improves the mechanical stability of the grain adsorption process, and enhances the adaptability of the patch equipment to various grain specifications and process conditions.

[0047] To optimize the recovery process of the ejector pins 513 after the die has been adsorbed and transferred, and to reduce the resistance to demolding caused by film adhesion during the recovery of the ejector pins 513, the ejector assembly 510 is further equipped with an auxiliary gas release mechanism based on the existing structure. The number of through-holes 5112 is greater than the number of ejector pins 513. The ejector assembly 510 also includes several connecting tubes and an air source. One end of the connecting tube is connected to the end of the through-hole 5112 not penetrated by the ejector pins 513, facing away from the material transfer mechanism 40. The air source is controlled and connected to the other end of the connecting tube.

[0048] Specifically: The number of through-holes 5112 on the abutment member 511 is greater than the number of ejector pins 513. During each die ejection operation, some through-holes 5112 are not penetrated by the ejector pins 513. The ejection assembly 510 also includes several connecting tubes and an air source. One end of the connecting tube is connected to the bottom of the through-holes 5112 not penetrated by the ejector pins 513, and the other end is connected to the air source. The air source is controlled and can pass compressed air into the connecting tubes at preset times.

[0049] After the grains are successfully adsorbed, ejector pins 513 begin to retract downward to below the abutment surface 5111. Simultaneously, the air source is activated, delivering gas to the through-holes 5112 not pierced by ejector pins 513. The resulting airflow is ejected from the upper ends of through-holes 5112, acting on the gap between the bottom surface of the diaphragm and the abutment surface 5111. This process creates a localized back-pressure region, reducing the adhesion of the diaphragm surface to the ends of ejector pins 513, facilitating natural separation of the diaphragm and preventing deformation or tearing of the diaphragm due to negative pressure adsorption or surface tension caused by the retraction of ejector pins 513.

[0050] This structure's coordinated actions are coordinated by a control system. When the adsorption element 430 confirms the completion of die adsorption and is ready for transfer, it automatically triggers the air supply and activates the ejector end 512 to retract the ejector pin 513, ensuring rapid diaphragm desorption and synchronized equipment operation. This control strategy can be precisely controlled through pre-set timing logic or feedback sensing.

[0051] This structure is suitable for packaging processes involving highly viscous blue films or thin, deformation-sensitive films. It is particularly well-suited for packaging and transfer equipment for thin wafers and brittle die. Installation requirements dictate that the gas supply system possess stable output and micro-pressure control accuracy, often integrating with the equipment's main control system. The system's overall design is compact, minimally impacting existing equipment, and easy to integrate and maintain.

[0052] In this embodiment, since a structural design method is adopted in which airflow is released through the through hole 5112 without the ejector pin 513 to assist in the detachment of the diaphragm, the problem of easy adhesion, pullback and local tearing of the diaphragm during the recovery process of the ejector pin 513 in the prior art is effectively solved, thereby achieving the coordination of the retraction of the ejector pin 513 and the smooth separation of the diaphragm, improving the stability and diaphragm protection capability of the patch device under high-speed continuous operation conditions, and improving the operating efficiency and yield of the entire machine.

[0053] In order to improve the freedom of movement of the material moving mechanism 40 in the horizontal plane and expand the picking range, in some embodiments, the material moving mechanism 40 also includes a third displacement component 440, including a third mobile end, and the third mobile end moves in a controlled manner in the first plane. The moving trajectory of the third mobile end is perpendicular to the moving trajectory of the first mobile end, and the first displacement component 410 is arranged on the third mobile end to move synchronously with the third mobile end.

[0054] Specifically: The third movable end can perform reciprocating linear motion along a direction within the first plane, while the first movable end can independently move in a direction perpendicular to it. The combination of the two allows for arbitrary point control within a two-dimensional plane, enabling precise movement of the pickup assembly 420 to directly above any target die. The pickup assembly 420 achieves precise bonding and adsorption of the die through vertical movement of the adsorption end 421. This structure, through the coordination of the two-layered mobile platforms, enables high-degree-of-freedom and high-precision displacement control within a confined space.

[0055] During actual operation, the control system independently controls the third and first mobile terminals, sequentially planning and dynamically adjusting their movements based on the set die coordinate information. This allows the pickup assembly 420 to precisely align with the target die, completing operations such as adsorption, extraction, and transfer. This structure effectively expands the pickup coverage area without increasing the equipment's footprint, making it particularly suitable for applications requiring larger wafer diameters or densely packed wafers.

[0056] This structure is suitable for fully automated packaging equipment used for medium-to-large wafer transfer operations, and is particularly well-suited for production scenarios where space is limited but high precision bonding is required. Environmentally, the mechanism operates stably in a constant-temperature, clean environment, exhibits shock resistance and dynamic compensation capabilities, and can be integrated into existing horizontal motion platforms or multi-axis systems.

[0057] In this embodiment, due to the technical means of orthogonally superimposing the third displacement component 440 and the first moving end, the problem in the prior art that the picking component 420 is limited in the horizontal movement direction and cannot flexibly cover a large-size wafer area is effectively solved, thereby achieving multi-axis decoupling and improved displacement accuracy of the picking path, and enhancing the mounting flexibility and stability of the patch device under high-density packaging conditions.

[0058] In a further embodiment, to enhance the lateral accessibility of the ejection mechanism 50 and provide flexible alignment support for the die area, the ejection mechanism 50 further includes a fourth displacement assembly. This fourth displacement assembly is disposed within the first accommodating space 110 and includes a fourth movable end capable of controlled movement within the second plane, with its movement trajectory perpendicular to that of the second movable end. The second displacement assembly is mounted on the fourth movable end and moves synchronously with it, thereby forming a composite motion structure within a two-dimensional plane.

[0059] Specifically, The second displacement assembly, through its own drive mechanism, drives the ejection assembly 510 in one direction, while the fourth movable end, through its fourth displacement assembly, moves in the other direction. The combination of the two enables free lateral movement of the ejection mechanism 50 below the working plane 120. The abutment 511, ejection end 512, and multiple ejector pins 513 in the ejection assembly 510 can thus reach a wider range of locations beneath the wafer, supporting die at various locations.

[0060] During actual operation, the control system dynamically links and controls the fourth and second displacement assemblies based on the spatial distribution coordinates of the die, moving the ejection assembly 510 to the target position below the corresponding die. The ejection end 512 then moves vertically, protruding multiple ejector pins 513 through the through-holes 5112 to provide support for the bottom of the target die. Once support is complete and the upper suction member 430 has completed suction, the ejection end 512 retracts the ejector pins 513, and the fourth displacement assembly drives the entire ejection structure to the support position for the next die, continuing the support operation.

[0061] This structure is suitable for placement processes involving large wafers, high-density matrix arrangements, or uneven support point distribution. It is particularly well-suited for packaging equipment environments requiring high dynamic support range adjustment. The device's highly modular structure allows integration into a variety of industrial control platforms, making it suitable for precision device production lines operating in cleanrooms and environments with constant temperature and humidity.

[0062] This embodiment adopts the technical means of orthogonally arranging and controlling the second displacement component to be orthogonal to each other, thereby effectively solving the problem in the prior art that the ejection mechanism 50 can only move in a single direction and is unable to flexibly support the grains with unstable distribution positions. This achieves precise coverage of the support area within a larger range below the wafer, and improves the adaptability and support efficiency of the device in a high-density arrangement environment.

[0063] To improve the vertical response speed and motion accuracy of the pickup assembly 420 and adapt it to the demands of high-frequency, high-density die placement, in some embodiments, the suction end 421 of the pickup assembly 420 is configured to be driven by a voice coil motor. As a linear drive device, a voice coil motor features a compact structure, high acceleration, and fast positioning response, making it suitable for placement processes with high requirements for displacement accuracy and frequency.

[0064] Specifically: The suction end 421 is connected to the voice coil motor's rotor via a support frame. The stator is fixedly mounted on the main structural frame of the pickup assembly 420. The voice coil motor uses the electromagnetic force between the control coil and the permanent magnet to drive the rotor, causing the suction end 421 to precisely move vertically. The suction end 421 is equipped with a suction surface that applies negative pressure to the target position to achieve grain suction.

[0065] During operation, the control system issues displacement commands to the voice coil motor based on the actual die height coordinates and the current placement task requirements, enabling the suction end 421 to complete downward pressing, contacting, and upward lifting actions in a very short period of time. The acceleration and deceleration curves, motion range, and acceleration values ​​during this process can be adjusted in real time via software to accommodate varying die thicknesses, suction pressures, and process cycles.

[0066] The voice coil motor drive method offers advantages such as zero mechanical contact, zero backlash, and zero commutation noise. Furthermore, due to its frictionless structure, it maintains stability and longevity during high-frequency reciprocating motion, making it particularly suitable for continuous, high-speed operation. This configuration is ideal for packaging lines with high-speed placement requirements, and excels in scenarios requiring rapid point-to-point pickup or low-vibration displacement.

[0067] In terms of applicable environments, this structure can be integrated into fully automated placement platforms, making it suitable for operation in packaging production environments with high cleanliness and constant temperature and humidity. The voice coil motor system can form a closed-loop control system using a servo controller and encoder, achieving millimeter- to micron-level displacement control accuracy.

[0068] This embodiment adopts the technical means of using a voice coil motor to drive the adsorption end 421. Therefore, the problems of slow response, large inertia and inaccurate positioning of the adsorption end 421 in the prior art are effectively solved, thereby realizing the rapid response and precise control of the pickup component 420 in high-frequency and high-speed adsorption operations, improving the grain transfer efficiency, positioning accuracy and overall working rhythm of the device, and adapting to the process requirements of high-performance semiconductor packaging.

[0069] In some embodiments, see Figure 8 A design method for the above-mentioned patch device is characterized by comprising the following steps: Step S100: Obtaining the size parameters of the grain, including the length, width, and thickness of the grain facing the ejection mechanism 50 ; Step S200: Obtaining the material of the adsorption member 430 and the preset stroke, and determining the target pressure applied by the adsorption member 430 to the die in the working state based on the elastic modulus and structural rebound characteristics of the die material and the preset stroke; Step S300: deriving the minimum support area required for the bottom surface of the die according to the target pressure and the material properties of the die; Step S400: Using the minimum support area as the support region area, and planning the contact positions of the ends of the ejector pins 513 facing the material transfer mechanism 40 on the side of the die facing the ejector mechanism 50 based on the boundary range of the die facing the ejector mechanism 50, so that the support area enclosed by the lines connecting the contact points between the ends of the ejector pins 513 and the die is not less than the minimum support area, and the support region is completely located within the range of the side of the die facing the ejector mechanism 50; Step S500 : determining the required number of ejector pins 513 and the position distribution of the ejector pins 513 according to the number and relative positions of the contact points.

[0070] In step S100, the size parameters of the grain are obtained, including the length, width, and thickness of the grain on the side facing the ejection mechanism 50. The size parameters of the grain, i.e., the length, width, and thickness of the grain on the side facing the ejection mechanism 50, can be obtained by: On the one hand, predictable standard die size information for batch wafer processing can be directly extracted from packaging process design documents or manufacturing data. This information is usually derived from wafer cutting layouts or product structure specifications, and is preset by the upstream process platform, making it fixed and repeatable.

[0071] For grains whose dimensions may exhibit slight deviations during actual production, the system can be configured with an industrial vision measurement module or laser displacement sensor to enable online grain size detection. The vision module, mounted on the suction end 421 or above the workbench 10, uses an image recognition algorithm to extract the contours of individual grains, thereby determining their length and width on the side facing the ejection mechanism 50. The laser displacement sensor, mounted on the pickup path, scans the distance difference between the top surface of the grain and the diaphragm surface before suction to infer the actual grain thickness.

[0072] After acquiring this data, the system controller converts it into standardized parameters and inputs them into the support structure calculation model, serving as the basis for subsequent target pressure calculations and ejector pin 513 placement planning. If non-standard die or deviations are present after dicing, the system triggers parameter corrections through a feedback mechanism to ensure the support design adapts to the actual die state.

[0073] The target pressure in step S200 refers to the normal pressure actually applied to the die by the adsorption element 430 when in operation (i.e., when the adsorption element 430 is attached to the die and has completed the predetermined adsorption stroke). This target pressure is determined by the material stiffness (elastic modulus), structural shape, downward pressure stroke, and contact deformation behavior of the die itself. In the implementation of the present invention, the target pressure can be calculated using the following method: Based on the mechanical calculation method of the flexible structure compression deformation model, the suction element 430 is usually a suction head or suction cup made of a flexible material (such as silicone, polyurethane, etc.), which can be simplified to an approximate elastic structure. According to Hooke's law, the target pressure P can be calculated using the following relationship: .in, is the pressure exerted by the adsorption member 430 on the die at the end of the downward stroke (unit: Newton); is the equivalent stiffness of the adsorption member 430 (unit: Newton / meter), which can be derived from the elastic modulus E of the material and the geometric shape of the adsorption structure (such as the thickness, bottom area, and cross-sectional shape of the suction cup). is the preset downward pressing stroke (unit: meter), that is, the maximum vertical compression displacement of the adsorption member 430 from the initial position to the complete bonding with the die.

[0074] Equivalent stiffness It can be calculated as follows: .in, is the elastic modulus of the material of the adsorption member 430 (unit: Pa); is the effective contact area of ​​the adsorption surface (unit: square meters); is the effective load-bearing thickness or deformation height of the adsorption structure (unit: meter). Substituting into the above formula, the target pressure is expressed as: , this formula is applicable to the ideal elastic adsorption structure, and in practical applications, the parameters can be corrected according to experimental calibration.

[0075] Combined with the correction mechanism of grain rebound characteristics, since the grain itself is a brittle material, the deformation is minimal during the compression process, but some materials will still have slight rebound or displacement, and the relative stroke between the adsorption structure and the grain needs to be corrected. The actual action stroke can be defined as: , where Δ is the vertical compression displacement of the grain under the expected pressure, which can be estimated through simulation or literature data and is generally much smaller than the compression displacement of the adsorption member 430; δ' is the actual compression deformation stroke of the adsorption member 430, which is ultimately used to calculate the target pressure.

[0076] In this embodiment, the target pressure is obtained based on the elastic deformation of the adsorption part 430 within the set pressing stroke. The material of the adsorption part 430 is a flexible elastomer, and its pressing process can be regarded as an approximate elastic compression behavior. The system first calculates its equivalent stiffness based on the elastic modulus, effective contact area and structural thickness of the adsorption part 430, and then combines the preset pressing stroke with the elastic mechanics model to calculate the target pressure finally applied to the surface of the grain. At the same time, in order to correct the influence of the slight deformation of the grain material on the stroke, the pressing stroke can be corrected by difference based on the rebound characteristics of the grain to improve the accuracy of the pressure estimation.

[0077] See Figure 9 The step S300 of obtaining the minimum support area required for the bottom surface of the grain according to the target pressure and the material properties of the grain includes the following steps: Step S310: obtaining the upper limit of the pressure per unit area that the grain can withstand based on the material properties of the grain; Step S320: Obtaining the minimum support area according to the target pressure and the upper pressure limit.

[0078] In step S310, the upper limit of the pressure per unit area that the grain can withstand is obtained based on the material properties of the grain. The method for obtaining the upper limit is as follows: First, a theoretical estimation method based on material parameters can be used. Grains are usually made of brittle materials such as silicon, gallium arsenide, and gallium nitride. The fracture of their structure under external forces is mainly manifested as brittle fracture or crack propagation. The upper limit of the pressure per unit area that can be tolerated can be approximately equal to the safe use limit of its compressive strength or flexural strength. The estimation method is as follows: Consult the material manual or literature to obtain the compressive strength σc or flexural strength σb of the material used for the grain; Correction is made based on the safety factor K (usually a fixed empirical value, such as an integer constant): The obtained σmax is the upper limit of the pressure per unit area that the grain can withstand without being damaged, and the unit is Pascal.

[0079] Secondly, based on simulation modeling methods, for special-shaped dies or dies with special packaging structures, finite element simulation modeling can also be used to simulate the stress. The process is as follows: Establish a three-dimensional grain structure model and define its boundary conditions and material properties; Apply uniform surface pressure in the vertical direction, gradually increase the loading value, and record the critical point where the structure undergoes obvious deformation or local stress mutation; Divide the critical pressure value by the loading area to obtain the corresponding upper limit of the pressure per unit area.

[0080] This method is suitable for chip structures with complex structures or the presence of cavities, nested metal layers, etc., and can improve the design targeting.

[0081] Finally, data tables based on actual measurements or empirical methods can also be used. During mass production, a process test database can be established. Through actual sample pressure failure experiments, the failure thresholds of different materials and sizes of grains under actual loading can be recorded, and a "grain type-maximum pressure" comparison table can be established. In actual use, the upper pressure limit value for the corresponding material and size combination can be directly called.

[0082] In summary, in this embodiment, the upper limit of the pressure per unit area that the grain can withstand can be determined by: first, based on the compressive or flexural strength of the material to which the grain belongs, corrected by an empirical safety factor; second, by simulating and analyzing the critical deformation value of the grain structure under vertical loading through finite element simulation; and third, by querying the pressure failure threshold of similar grains through packaging test processes or empirical databases to obtain the maximum allowable surface pressure value. This value serves as a mechanical benchmark for determining whether the grain is safe under the target pressure.

[0083] The minimum support area in step S320 refers to the minimum effective support area required at the bottom of the die to withstand the target pressure applied by the adsorption element 430 during the adsorption process. Its calculation method is based on basic mechanical relationships and is as follows: when the adsorption element 430 acts on the top of the die at the set target pressure P, there must be a sufficiently large support area at the bottom of the die so that the pressure per unit area does not exceed the upper pressure limit σmax of the die material. Otherwise, the die will fracture or develop stress cracks.

[0084] To meet this condition, the support area Amin should satisfy the following relationship: .

[0085] in: The target pressure (in Newtons) applied by the adsorption member 430 during the set downward stroke; is the minimum required support area in square meters.

[0086] In summary, in the specific implementation process, obtaining the target pressure , which is usually derived from the calculation results of the material stiffness of the adsorption member 430 and the preset parameters of the downward stroke. , whose value can be obtained through material mechanical parameters or fracture test experience.

[0087] Substitute the two into the above formula for calculation, namely: , income That is, the area of ​​the bottom of the die that needs to be supported by the ejector pins 513 at least, which is used for the subsequent ejector pin 513 layout design.

[0088] In this embodiment, the minimum support area is determined based on the physical relationship between the target pressure applied to the die and the upper pressure limit of its material. By dividing the target pressure by the upper pressure limit of the die material, the minimum support area required on the die's bottom surface is calculated to ensure that the die does not suffer structural damage due to insufficient bottom support during adsorption and downward pressure. This area serves as a structural input parameter for planning the placement of ejector pins 513, used to determine the number and distribution range of ejector pins 513.

[0089] The core purpose of step S400 is to reasonably arrange the contact points of the ejector pins 513 under the premise of meeting the boundary restrictions of the grain structure size, so that the enclosed support area meets the minimum support area requirement and is ensured to be completely within the bottom surface of the grain.

[0090] The input conditions come from the previous step, including the known dimensions (length and width) of the die facing the ejection mechanism 50; the calculated minimum support area; the known geometric boundaries of the die bottom surface (rectangular, polygonal, or irregular area); and structural constraint parameters such as the range of optional ejector pins 513 numbers, the end dimensions of a single ejector pin 513, the minimum distance between ejector pins 513, and the minimum spacing between ejector pins 513.

[0091] The following is a detailed implementation method, which is the process of planning the support point layout: First, a two-dimensional coordinate system is established with the bottom surface of the die as a reference. The boundary projection area of ​​the die facing the ejection mechanism 50 is used as the design boundary for limiting the point arrangement.

[0092] Next, select an initial point distribution strategy. Based on the shape and size of the grain, choose an appropriate initial point distribution strategy. Common strategies include, but are not limited to, rectangular edge symmetrical distribution (suitable for regular grains), diagonal cross distribution, ring distribution, cross-shaped or honeycomb distribution (suitable for larger grains or high-pressure support requirements), and multi-row and multi-column uniform distribution (suitable for large areas where uniform force distribution is required).

[0093] Next, the support area is determined. The system calculates the area of ​​the polygon formed by geometrically connecting the contact points of all ejector pins 513 under the current layout method, recording this as the actual support area. Standard calculation methods (such as polygon area calculation formulas, convex hull algorithms, etc.) can be used to solve for this area. If the actual support area is greater than or equal to the minimum support area obtained in the previous step, the layout is considered to meet the requirements.

[0094] Next, the support area boundary is verified. This determines whether the enclosed support area is completely within the grain bottom surface. If any overflow occurs, the contact point distribution is adjusted to converge inward and the area calculation is repeated.

[0095] Finally, iterative optimization is performed. If the support area is insufficient or the support area does not meet the boundary conditions, the system is optimized in the following ways: Increase the number of ejector pins 513 or reduce the spacing between adjacent ejector pins 513 or change the arrangement strategy (such as changing from a rectangular shape to a "M" shape) or partially adjust the contact point position to avoid boundary interference.

[0096] The cycle continues until the area condition is met and the region is complete.

[0097] In this embodiment, a two-dimensional coordinate reference system is established for the bottom surface of the die based on the boundary range of the die facing the ejection mechanism 50 and the minimum support area obtained in the previous step. Within this range, the contact points of several ejector pins 513 are planned. Each contact point is geometrically connected to form a support area. The area of ​​this support area should be greater than or equal to the required minimum support area and completely within the boundary of the die bottom surface. The point planning process can be performed based on standard shape strategies (such as rectangular, diagonal, circular, or cross-shaped) for initial point placement, and automatically optimized through area calculation and boundary verification. The final output is a point placement plan that determines the number and precise positions of ejector pins 513, which serves as the basis for subsequent device structural parameter configuration.

[0098] The purpose of step S500 is to further determine the specific number of ejector pins 513 required based on the planned contact points of the ejector pins 513 that meet the minimum support area, and to map these contact points to the position distribution of the ejector pins 513 in the actual structure as a basis for device design or dynamic control configuration.

[0099] Input conditions include the support area obtained in step S400; the contact point coordinates of the ends of each ejector pin 513 have been confirmed; the known arrangement of the through holes 5112 on the abutment member 511 (such as a regular grid, a circular arrangement, a free arrangement, etc.); the specifications, end dimensions, minimum installation spacing and structural interference restrictions of the ejector pins 513; and whether a variable number of ejector pins 513 (partially movable / partially fixed) is allowed as a system parameter.

[0100] The specific implementation process includes: Count the number of contact points. Based on the contact point coordinate set determined in step S400, directly calculate the number of ejector pins 513 required, i.e., the number of contact points is equal to the actual number of ejector pins 513 required. This step is a categorical determination and does not involve optimization.

[0101] Matching structure arrangement. The contact point coordinates are converted to alignment coordinates relative to the array of through-holes 5112 on the ejector assembly 510. The nearest actual through-hole 5112 location is selected for ejector pin 513 insertion. If there are locations where exact matching is not possible, the contact point can be fine-tuned, preferably closer to the center of an available through-hole 5112. For high-precision placement, a high-density through-hole 5112 module can be added.

[0102] Output the distribution parameters of ejector pins 513. This ultimately results in a clear number of ejector pins 513 and the corresponding position coordinates (or through-hole 5112 numbers) of each ejector pin 513 on the abutment surface 5111. These distribution parameters can be used to determine the arrangement of through-holes 5112 during the structural design phase of the ejector mechanism 50; activate specific ejector pin 513 motion paths during dynamic control; and subsequently conduct simulation verification in conjunction with the downward pressure of the suction element 430.

[0103] In this embodiment, based on the set of contact point coordinates obtained in step S400, the number of ejector pins 513 forming the support area is counted and mapped to the array of through-holes 5112 on the ejector assembly 510 based on their relative positions. The system prioritizes matching the positions of the nearest through-holes 5112 and performs spatial interference checks based on factors such as structural spacing and the drive path of the ejector pins 513. While ensuring the minimum support area and point density, the final number of ejector pins 513 and their corresponding positional distribution coordinates are determined and output as key configuration parameters for structural design and drive control.

[0104] The above contents described in this specification are merely examples of the present invention. Those skilled in the art may make various modifications, additions, or substitutions to the described embodiments, without departing from the contents of this specification or exceeding the scope defined by the claims, and such modifications, additions, or substitutions may be made to the described embodiments. Such modifications, additions, or substitutions may be made by persons skilled in the art. Such modifications, additions, or substitutions may be made to the described embodiments without departing from the contents of this specification or exceeding the scope defined by the claims, and such modifications shall fall within the scope of protection of the present invention.

Claims

1. A chip placement device for transferring dies from a wafer adhered to one side of a diaphragm and having been separated to a packaging substrate, characterized in that: include: A workbench, comprising a first accommodating space and a work plane, wherein the work plane is provided with a first opening; a carrier, arranged at the working plane so that the wafer adhered to the membrane is in a suspended state; Material transfer mechanism, including: an adsorption member, which moves in a controlled manner, wherein the adsorption member includes an adsorption surface to generate negative pressure when the adsorption member is in an operating state; The ejection mechanism is arranged in the first accommodating space, and the ejection mechanism includes: a second displacement assembly comprising a second movable end controlled to move in a second plane, the second plane being parallel to the working plane; An ejection assembly is provided at the second moving end, and the ejection assembly includes: The abutment member comprises an abutment surface parallel to the working plane and a second accommodating space, wherein the abutment surface is provided with a plurality of through holes communicating with the second accommodating space; an ejection end, disposed in the second accommodating space and controlled to move along a first direction perpendicular to the working plane; an ejector pin, disposed on a side of the ejection end close to the through hole, and passing through the through hole, wherein an end of the ejector pin away from the ejection end is configured to pass through the through hole and move to the outside of the ejection assembly when the ejection end is in an ejection state; The ejector pin is configured so that when the adsorption member is in contact with one side of the die and moves a preset stroke toward the die so as to apply a target pressure to the side of the die away from the ejector pin, the area of ​​the support region formed by the contact position between the end of the ejector pin and the die is greater than or equal to the minimum support area required according to the target pressure, and the target pressure is determined by the material of the adsorption member and the preset stroke.

2. A patch device according to claim 1, characterized in that: The first opening is in communication with the first accommodating space; A feeding plane moves in a controlled manner, wherein a packaging position is provided on the feeding plane, and the packaging position is used to place a packaging substrate; The carrier includes a carrying surface parallel to the working plane, and a second opening is formed on the carrying surface and communicates with the first opening; the carrier also includes a limiting mechanism for limiting the wafer adhered to the diaphragm at the second opening of the carrying surface; The material transfer mechanism also includes a picking component that is controlled to move in a first plane parallel to the working plane. The picking component includes an adsorption end that is controlled to rotate and move along the first direction. The rotation axis of the adsorption end and the first direction are both perpendicular to the working plane.

3. A patch device according to claim 2, characterized in that: The number of the ejector pins and the number of the ejector ends are both several, each ejector pin is connected to each ejector end in a one-to-one correspondence, and each ejector end is independently controlled; The support area is configured to increase the number of ejection pins and reduce the distance between adjacent ejection pins when the target pressure increases.

4. A patch device according to claim 2, characterized in that: The number of the through holes is greater than the number of the ejector pins, and the ejection assembly further comprises: a plurality of connecting tubes, one end of each connecting tube being connected to an end of the through hole not penetrated by the ejector pin and facing away from the material moving mechanism; An air source operates in a controlled manner and is connected to the other end of the connecting pipe.

5. A patch device according to claim 2, characterized in that: Also includes: The first conveying mechanism includes an upper material position, a lower material position, and a feeding plane which is arranged between the upper material position and the lower material position and moves in a controlled manner. The feeding plane is arranged parallel to the working plane.

6. A patch device according to claim 2, characterized in that: The material transfer mechanism further comprises: a first displacement assembly, comprising a first moving end controlled to move in a first plane parallel to the working plane, the first moving end being connected to the pickup assembly to drive the pickup assembly to move; The third displacement component includes a third mobile end, which is controlled to move within the first plane. The movement trajectory of the third mobile end is perpendicular to the movement trajectory of the first mobile end, and the first displacement component is arranged at the third mobile end to move with the third mobile end.

7. A patch device according to claim 2, characterized in that: The ejection mechanism further comprises: The fourth displacement component includes a fourth mobile end arranged in the first accommodating space, the fourth mobile end is controlled to move in the second plane, the movement trajectory of the fourth mobile end is perpendicular to the movement trajectory of the second mobile end, and the second displacement component is arranged on the fourth mobile end to move synchronously with the fourth mobile end.

8. A patch device according to claim 2, characterized in that: The adsorption end of the pickup assembly is configured to be driven by a voice coil motor.

9. A design method for the patch device according to claim 2 or 3, characterized in that: The steps include: Obtaining the size parameters of the grain, including the length, width, and thickness of the grain on the side facing the ejection mechanism; Obtaining the material of the adsorption member and the preset stroke, and determining the target pressure applied by the adsorption member to the die in a working state based on the elastic modulus and structural rebound characteristics of the die material and the preset stroke; Determining the minimum support area required for the bottom surface of the grain based on the target pressure and the material properties of the grain; Taking the minimum support area as the support region area, and based on the boundary range of the side of the die facing the ejection mechanism, planning the contact positions of a plurality of ejector pins at one end facing the material transfer mechanism on the side of the die facing the ejection mechanism, such that the support area enclosed by the lines connecting the contact points of the ejector pin ends with the die is not less than the minimum support area, and the support region is completely located within the range of the side of the die facing the ejection mechanism; The required number of ejector pins and the position distribution of the ejector pins are determined according to the number and relative positions of the contact points.

10. The design method according to claim 9, characterized in that: Determining the minimum support area required for the bottom surface of the grain based on the target pressure and the material properties of the grain comprises the following steps: The upper limit of the pressure per unit area that the grains can withstand is obtained based on the material properties of the grains; The minimum support area is obtained according to the target pressure and the upper pressure limit.

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