Wafer handler

Abstract

The application provides a wafer sorting machine, and relates to the technical field of wafer production.The wafer sorting machine comprises a bearing base, a carrying device, a sorting device and a detection device which are located at the upper end of the bearing base, a first limiting assembly for limiting wafers is arranged at the upper end of the bearing base, a second limiting assembly for limiting a tray is arranged at the upper end of the bearing base, the sorting device is located between the first limiting assembly and the second limiting assembly, the sorting device comprises a first sorting wheel and a second sorting wheel, the sorting wheel comprises a wheel body and a plurality of suction cups which are distributed equidistantly around the arc surface of the wheel body, a driving rotating shaft is fixed to the first side plane of the wheel body, and a negative pressure assembly which is communicated with the plurality of suction cups is arranged on the second side plane. In the conveying and transferring process of the plurality of chips, the detection is automatically completed, the detection efficiency is improved, the chip deflection angle is large, and the accuracy of the detection result is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer production, in particular to a wafer sorting machine. BACKGROUND

[0002] In the market environment, advanced packaging gradually squeezes the market share of traditional packaging with the advantages of low cost, high yield and high chip integration, and is expected to become the mainstream technical direction.

[0003] In the advanced packaging process flow, the chip detection and sorting equipment is applied to the last process of the advanced packaging process of the semiconductor chip, and is an indispensable link in the production process of the semiconductor chip.

[0004] The traditional sorting machine is built-in at least two sorting mechanical arms, the sorting mechanical arm is exposed in the visual detection structure, the mechanical arm imitates the human hand to transfer and turn over the chip, and the six surfaces of the chip are visually detected; but the traditional sorting method imitates the human hand to detect, and the chip is turned over and transported in a plane, in order to detect the thin side surface around the chip, the chip needs to be deflected in the detection process, the action process of the traditional bionic sorting structure is complex, the detection efficiency is low, and the detection accuracy is limited under the condition that the deflection angle is small. SUMMARY

[0005] In view of the above problems, the present application provides a wafer sorting machine, which automatically completes detection during the conveying and transferring process of multiple chips, improves the detection efficiency, and has a larger chip deflection angle to ensure the accuracy of the detection result.

[0006] To solve the above problems, the technical scheme adopted by the present application is:

[0007] A wafer sorting machine, comprising a bearing base, a carrying device, a sorting device and a detection device located at the upper end of the bearing base, a first limiting component for limiting the wafer is arranged at the upper end of the bearing base, and a second limiting component for limiting the tray is arranged at the upper end of the bearing base, the sorting device is located between the first limiting component and the second limiting component, the sorting device comprises a first sorting wheel and a second sorting wheel, the sorting wheel comprises a wheel body and a plurality of suction cups distributed equidistantly around the arc surface of the wheel body, a driving shaft is fixed on the first side plane of the wheel body, a negative pressure component communicated with the plurality of suction cups is arranged on the second side plane, the first sorting wheel and the second sorting wheel rotate in the first plane and the second plane respectively, and the first plane and the second plane intersect with each other.

[0008] Preferably, the upper end of the bearing base is further provided with a mounting platform, the sorting device is arranged on the upper end of the mounting platform, the mounting platform is rotationally connected with the bearing base, and the mounting platform is deflected by a predetermined angle through the driving element.

[0009] Through the above structural design, the position of the sorting device as a whole can be quickly adjusted through the mounting platform, the distance between the first sorting wheel and the second sorting wheel inside the sorting device is relatively unchanged, the first limiting assembly and the second limiting assembly of different widths can be adaptively adjusted, and the quick adjustment of wafers and trays of different sizes is met.

[0010] Preferably, the detection device is located between the first limiting assembly and the second limiting assembly, the detection device only includes a first detection assembly and a second detection assembly, the first detection assembly and the second detection assembly are both visual detection elements, the detection direction of the first detection assembly is towards the arc surface of the first sorting wheel, and the detection direction of the second detection assembly is towards the arc surface of the second sorting wheel.

[0011] The above detection process is synchronously performed in the adsorption and transport process of the chips, the first sorting wheel and the second sorting wheel are continuously rotated or intermittently rotated at a predetermined speed, and the efficiency of sorting and transport and detection is greatly improved.

[0012] The unqualified chips are placed in different positions of the waste box, and are sorted from the qualified chips.

[0013] Preferably, the sorting device includes a third sorting wheel, the second sorting wheel is located between the third sorting wheel and the first sorting wheel, and the third sorting wheel rotates in the first plane.

[0014] Through the above structural design, the third sorting wheel can restore the chips on the surface of the second sorting wheel to the initial same state, the first sorting wheel grasps the chips in the horizontal state on one side of the first limiting assembly, and then converts the chips on one side of the second sorting wheel into a vertical state, and finally converts the chips on one side of the third sorting wheel into a horizontal state, so that the chips are restored to the initial state, the postures before and after detection are ensured to be the same, the chips are placed in the same posture at the position outside, and especially suitable for chips of different lengths and widths or part of special-shaped chips, and the relative consistency of the distribution state of the chips before and after detection is ensured.

[0015] Preferably, the first sorting wheel, the second sorting wheel and the third sorting wheel are of the same size and have the same rotating speed.

[0016] Preferably, the arc surface of the wheel body is provided with a plurality of mounting ports, the suction cups are arranged in the corresponding mounting ports, the suction cups are in communication with the negative pressure assembly through a negative pressure branch, the negative pressure branch is provided with an on-off valve, and the on-off valve is electrically connected with the driving shaft.

[0017] Preferably, the negative pressure assembly comprises a negative pressure main pipe, which is sealingly and rotatably connected with the wheel body central axis position through a sealing rotary connector.

[0018] Preferably, the suction disc comprises a fixed limiting sleeve on the outer side and a relatively movable suction body inside the limiting sleeve, and an elastic assembly is arranged between the suction body and the inner wall of the mounting port.

[0019] Preferably, the elastic assembly is an elastic air bag with expansion elasticity, which is normally in an expanded state, and the elastic air bag is connected in series between the suction disc and the negative pressure branch pipe.

[0020] Through the above structural design, the suction body can drive the chip to move towards the inner side after grabbing the chip, the moving speed of the chip towards the inner side is greater than the deformation speed of the corresponding suction body of the suction disc towards the outer side, the gap between the two suction bodies is increased, a larger area can be formed to accommodate the chip, and further collision and damage of the chip during the transfer process can be avoided.

[0021] Preferably, the carrying base is provided with a first storage assembly for storing wafers and a second storage assembly for storing trays, and the carrying device comprises a first carrying end, a second carrying end, a first joint for controlling the lifting movement of the first carrying end and the second carrying end, and a second joint for controlling the horizontal movement of the first carrying end and the second carrying end.

[0022] The beneficial effects of the present application are:

[0023] Compared with the prior art, the first sorting wheel and the second sorting wheel can control the chip to be transferred in different three-dimensional planes, control the chip to be quickly detected in different postures, and automatically complete the detection of multiple chips during the conveying and transferring process, thereby improving the detection efficiency, the chip deflection angle is large, and the accuracy of the detection result is guaranteed; and only two detection sources need to be designed to complete the rapid detection of the six surfaces of the chip, the areas of the two detections are the same, the detection rates are synchronous, detection delay and detection waiting are avoided, and the detection efficiency and accuracy are greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a first side perspective view of the present application.

[0025] Figure 2 It is a second side perspective view of the present application.

[0026] Figure 3 It is a front view of the present application.

[0027] Figure 4 It is a top view of the present application.

[0028] Figure 5 is a side view of the present application.

[0029] Figure 6 is a side view of the present application Figure 4

[0030] Figure 7 is a perspective view of the sorting wheel of the present application.

[0031] Figure 8 is a front view of the present application Figure 7

[0032] Figure 9 is a top view of the present application Figure 7

[0033] In the figure: 100, a bearing base; 110, a first limiting assembly; 120, a second limiting assembly; 200, a first storage assembly; 210, a wafer; 300, a second storage assembly; 310, a tray; 400, a carrying device; 410, a second joint; 420, a first joint; 430, a first carrying end; 440, a second carrying end; 500, a sorting device; 5001, a first sorting wheel; 5002, a second sorting wheel; 5003, a third sorting wheel; 510, a wheel body; 511, a mounting port; 520, a driving shaft; 530, a sealed rotary connecting piece; 540, a negative pressure main pipe; 550, a suction cup; 551, a limiting sleeve; 552, a suction main body; 600, a detection device; 700, a mounting platform; 710, a driving element. DETAILED DESCRIPTION

[0034] The present application will be further described below in conjunction with the drawings and examples.

[0035] In order to solve the problems mentioned in the background art, with reference to the drawings Figure 1 - the drawings Figure 9 A wafer sorting machine, comprising a bearing base 100, a carrying device 400, a sorting device 500 and a detection device 600 located at the upper end of the bearing base 100, the upper end of the bearing base 100 is provided with a first storage assembly 200 for storing wafers 210 and a second storage assembly 300 for storing trays 310, the wafers 210 to be detected are stored vertically in the first storage assembly 200, a plurality of finished chips are arrayed on the surface of the wafer 210, the plurality of chips are grabbed and detected by the sorting device 500 and the detection device 600, and the good products and defective products are sorted to different positions to realize sorting and shunting.

[0036] ​​​Specifically, the carrying device 400 comprises a first carrying end 430, a second carrying end 440, a first joint 420 for controlling the lifting movement of the first carrying end 430 and the second carrying end 440, and a second joint 410 for controlling the horizontal movement of the first carrying end 430 and the second carrying end 440. The second joint 410 and the first joint 420 can be selected as electric sliding joints, which can drive the first carrying end 430 and the second carrying end 440 to move to different positions. The first carrying end 430 and the second carrying end 440 can adaptively grasp the wafer 210 and the tray 310, respectively. The first carrying end 430 and the second carrying end 440 can be provided with negative pressure suction cups or mechanical limiting structures to limit the grasped objects, thereby ensuring the stability of the objects during movement.

[0037] The first limiting assembly 110 for limiting the wafer 210 and the second limiting assembly 120 for limiting the tray 310 are arranged at the upper end of the bearing base 100. The sorting device 500 is located between the first limiting assembly 110 and the second limiting assembly 120. The wafer 210 is vertically placed in the first limiting assembly 110 for limiting. The vertically placed wafer 210 can avoid dust falling onto the chip surface to the greatest extent, thereby avoiding the wafer 210 and the chip from being contaminated during detection. The sorting device 500 is located between the first limiting assembly 110 and the second limiting assembly 120 to grasp the chips on the surface of the wafer 210. The chips are grasped from the surface of the wafer 210 for visual detection. The six surfaces of the chip are detected to determine whether the chip meets the detection requirements. The chips meeting the detection requirements are placed in the tray 310 on one side of the second limiting assembly 120 for collection. The chips not meeting the detection requirements are placed in a waste box for recycling.

[0038] Specifically, the sorting device 500 comprises a first sorting wheel 5001 and a second sorting wheel 5002. The sorting wheels each comprise a wheel body 510 and a plurality of suction cups 550 equidistantly distributed around the arc surface of the wheel body 510. The suction cups 550 can grasp the chips by negative pressure. A driving shaft 520 is fixed to the first side plane of the wheel body 510. A negative pressure assembly in communication with the plurality of suction cups 550 is arranged on the second side plane. The driving shaft 520 can drive the corresponding wheel body 510 to rotate in a designated direction. The negative pressure assembly can provide negative pressure at a position opposite to the axis, thereby ensuring the stability of the negative pressure grasping of the suction cups 550.

[0039] It should be noted that the first sorting wheel 5001 and the second sorting wheel 5002 rotate in the first plane and the second plane, respectively. The first plane and the second plane intersect with each other. Preferably, the first plane and the second plane are in the same horizontal plane. Figure 6The first limiting assembly 110 on one side can be grabbed by the first sorting wheel 5001 in the perpendicular state shown, and the first side surface of the chip is in a state of negative pressure adsorption at this time. The remaining surface can be visually detected by the detection device 600. After the chip is detected for the first time, the chip adsorbed by the first sorting wheel 5001 is transferred and grabbed by the second sorting wheel 5002. At this time, the surface of the chip adsorbed by the first sorting wheel 5001 can be exposed to the outside for the second visual detection, and the visual detection of the six surfaces of the chip is completed.

[0040] It needs to be emphasized that the detection on both sides of the detection device 600 only needs to be detected in two directions. The first visual detection is the second side surface and the left and right side surfaces of the chip, and the second visual detection is the first side surface and the upper and lower side surfaces of the chip. Through the above structural design, only two detection sources are needed to complete the rapid detection of the six surfaces of the chip. The areas of the two detections are the same, the detection rates are synchronized, the detection delay and detection waiting are avoided, and the detection efficiency and accuracy are greatly improved.

[0041] Meanwhile, the first sorting wheel 5001 and the second sorting wheel 5002 can control the transfer of the chip in different three-dimensional planes, control the rapid detection of the chip in different postures, avoid detection dead angles, and facilitate the arrangement of the detection device 600 at different positions. The sorting device 500 and the detection device 600 can be integrated and simplified and arranged between the first limiting assembly 110 and the second limiting assembly 120, further improving the detection efficiency and ensuring the accuracy of the detection result.

[0042] In summary, through the above structural design, the first sorting wheel 5001 and the second sorting wheel 5002 can control the transfer of the chip in different three-dimensional planes, control the rapid detection of the chip in different postures, and automatically complete the detection of multiple chips during the conveying and transferring process, improve the detection efficiency, and ensure the accuracy of the detection result. The chip deflection angle is large, the detection efficiency and accuracy are greatly improved, and only two detection sources are needed to complete the rapid detection of the six surfaces of the chip. The areas of the two detections are the same, the detection rates are synchronized, the detection delay and detection waiting are avoided, and the detection efficiency and accuracy are greatly improved.

[0043] Further, the upper end of the bearing base 100 is further provided with a mounting platform 700, and the sorting device 500 is arranged on the upper end of the mounting platform 700. The mounting platform 700 is rotationally connected with the bearing base 100. The mounting platform 700 is deflected by a predetermined angle through a driving element 710. The mounting platform 700 can be controlled to be located on a predetermined vertical axis for deflection through the driving element 710. The mounting platform 700 can drive the first sorting wheel 5001 and the second sorting wheel 5002 above to be deflected to different positions in the process of deflection, so as to finally adjust the width of the first sorting wheel 5001 and the second sorting wheel 5002 (see FIG. 7). Figure 6 The distance between the left and right vertices in the middle).

[0044] Through the above structure design, the position of the sorting device 500 as a whole can be quickly adjusted through the mounting platform 700. The distance between the first sorting wheel 5001 and the second sorting wheel 5002 inside the sorting device 500 is relatively unchanged. The first limiting assembly 110 and the second limiting assembly 120 of different widths can be adaptively adjusted, so as to meet the quick adjustment of wafers 210 and trays 310 of different sizes.

[0045] Specifically, the detection device 600 only includes a first detection assembly and a second detection assembly. Both the first detection assembly and the second detection assembly are visual detection elements. The detection direction of the first detection assembly is towards the arc surface of the first sorting wheel 5001. The detection direction of the second detection assembly is towards the arc surface of the second sorting wheel 5002.

[0046] Here, the first detection assembly is horizontally arranged. The horizontally arranged first detection assembly is towards the position of the center of the first sorting wheel 5001, so as to realize the visual detection of the three surfaces of the chip adsorbed on the arc surface outside the first sorting wheel 5001. Here, the second detection assembly is vertically arranged. The vertically arranged second detection assembly is arranged towards the center of the second sorting wheel 5002, so as to realize the visual detection of the remaining three surfaces of the chip.

[0047] The above detection process is synchronously performed in the adsorption and transportation process of the chip. The first sorting wheel 5001 and the second sorting wheel 5002 are continuously rotated or intermittently rotated at a predetermined speed. The chip is adsorbed and rotated by the first sorting wheel 5001 on one side of the first limiting assembly 110. After the chip moves to the position between the first sorting wheel 5001 and the second sorting wheel 5002, the negative pressure of the first sorting wheel 5001 on the chip is cancelled. At the same time, the second sorting wheel 5002 adsorbs the chip on the other side of the surface through negative pressure, so as to realize the transfer and transportation of the chip. After the second visual detection of the chip on the surface of the second sorting wheel 5002, the chip is finally transported into the tray 310 on one side of the second limiting assembly 120 for storage.

[0048] Specifically, the sorting device 500 further comprises a third sorting wheel 5003, the second sorting wheel 5002 is located between the third sorting wheel 5003 and the first sorting wheel 5001, and the third sorting wheel 5003 rotates in the first plane, the third sorting wheel 5003 is located in the same plane as the first sorting wheel 5001, and the third sorting wheel 5003 can perform the last side grabbing and transfer of the chips on the surface of the second sorting wheel 5002 after the second detection, and the third sorting wheel 5003 can transport the chips after the two detections to a predetermined position on one side of the second limiting assembly 120.

[0049] Through the above structural design, the third sorting wheel 5003 can restore the chips on the surface of the second sorting wheel 5002 to the initial same state, the first sorting wheel 5001 grabs the chips in the horizontal state on one side of the first limiting assembly 110, and then converts the chips on one side of the second sorting wheel 5002 to the vertical state, and finally converts the chips on one side of the third sorting wheel 5003 to the horizontal state, thereby restoring the chips to the initial state, ensuring that the post-detection posture is the same as the pre-detection posture, and the chips are placed in the same posture on the outside, which is especially suitable for chips of different lengths and widths or partially shaped chips, and ensures that the distribution state of the chips before and after detection is relatively consistent.

[0050] Further, the first sorting wheel 5001, the second sorting wheel 5002, and the third sorting wheel 5003 have the same size and the same rotation rate, and through the above structural design, the difficulty of control is further reduced, the rotation rates of the three sorting wheels are the same, and the rotation direction can be adjusted according to actual conditions, without the need to set a special detection element to determine the position of the chips. While the second sorting wheel 5002 is located on one side of the first sorting wheel 5001 to grab the chips, the third sorting wheel 5003 can be located on the outside to synchronously grab the chips on one side of the second sorting wheel 5002.

[0051] A plurality of mounting holes 511 are formed in the arc surface of the wheel body 510, and the suction cups 550 are arranged in the corresponding mounting holes 511. The suction cups 550 are detachably mounted in the corresponding mounting holes 511 and can be replaced. The corresponding suction cups 550 and the negative pressure assembly are in communication through a negative pressure branch, and an on-off valve is arranged in the negative pressure branch. The on-off valve is electrically connected with the driving shaft 520. The inside of the negative pressure assembly is in a state of negative pressure. The on-off valve is controlled to be in a conductive state, so that the corresponding suction cups 550 on the outside and the negative pressure assembly are in communication, and the suction cups 550 on the outside can grab the chips through negative pressure. By controlling the on-off valve to be in a closed state, the negative pressure effect can be cut off, and the corresponding suction cups 550 on the outside cannot grab the chips through negative pressure at this time.

[0052] And the on-off valve is electrically connected between the driving shaft 520, and the position of the corresponding suction cup 550 can be determined by the driving shaft 520; when the suction cup 550 rotates to a predetermined position, the on-off valve is controlled to be turned on or closed, so that the chip is gripped or placed.

[0053] For example, when the first suction cup 550 on the side wall of the first sorting wheel 5001 rotates to one side of the first limiting assembly 110, the on-off valve is controlled to be turned on, so that the chip on one side of the first limiting assembly 110 is gripped; after the suction cup 550 rotates to the position between the first sorting wheel 5001 and the second sorting wheel 5002, the negative pressure of the first sorting wheel 5001 on the chip is cancelled, and at the same time, the second sorting wheel 5002 performs negative pressure adsorption on the other surface of the chip, so that the chip is transferred and conveyed; after the chip is detected by the second vision detection device on the surface of the second sorting wheel 5002, the chip is finally conveyed into the tray 310 on one side of the second limiting assembly 120 for storage.

[0054] Further, the negative pressure assembly includes a negative pressure main pipe 540, the negative pressure main pipe 540 is sealingly and rotatably connected to the center axis of the wheel body 510 through the sealing rotary connecting piece 530, and the outer side of the negative pressure main pipe 540 is communicated with a negative pressure device to generate negative pressure at any time; the negative pressure main pipe 540 is communicated with the center axis of the wheel body 510 through the sealing rotary connecting piece 530, so that the wheel body 510 can rotate normally, and the suction cup 550 around the wheel body 510 can be in a normal negative pressure state, and the normal negative pressure gripping is ensured.

[0055] Further, the suction cup 550 includes a relatively fixed limiting sleeve 551 on the outer side and a relatively movable adsorption body 552 on the inner side of the limiting sleeve 551, and the adsorption body 552 is provided with an elastic assembly between the inner wall of the mounting port 511; the limiting sleeve 551 can be positioned on the inner side of the adsorption body 552, the suction cup 550 has a certain flexibility, and rigid collision can be avoided to damage the chip during transfer, and the elastic assembly can be elastically buffered during gripping and placing of the chip to avoid damage to the chip.

[0056] It should be noted that the distance between the suction cups 550 of different sorting wheels is determined according to the thickness of the chip, and the installation distance between the suction cup 550 and the wheel body 510 can also be adjusted, so that the corresponding gripping gap between the two suction cups 550 can be formed to accommodate the chip.

[0057] Specifically, the elastic component is an elastic air bag with expansion elasticity, the elastic air bag is in an expanded state normally, the elastic air bag is connected between the suction cup 550 and the negative pressure branch pipe, the elastic air bag can well buffer and limit the outer suction body 552, and the flexibility of the suction cup 550 as a whole is ensured, and damage of the chip is avoided; meanwhile, the elastic air bag is in an expanded state normally, under negative pressure, the elastic air bag is contracted, and the elastic air bag can drive the suction body 552 and the chip on the surface to move towards the inner side in the process of contraction of the elastic air bag; through the above structure design, the suction body 552 can drive the chip to move towards the inner side after the chip is gripped, the moving speed of the chip towards the inner side is greater than the moving speed of the corresponding suction body 552 of the suction cup 550 towards the outer side, the gap between the two suction bodies 552 relatively increases, a larger area can accommodate the chip, and further collision and damage of the chip in the transfer process are avoided.

[0058] Finally, it should be further pointed out that the first limiting component 110 and the second limiting component 120 are provided with movable joints, the wafer 210 and the tray 310 can be driven to move to different positions in the vertical plane, the sorting device 500 is located at a relatively constant position to grip the moving chip, and full-range gripping, sorting and detection of the chip are realized.

[0059] Some wafers 210 have N different specifications of chips, each tray 310 corresponds to different specifications of chips, when all the first type of chips on the wafer 210 are taken away and pasted on the tray 310, the conveying device 400 changes a new tray 310 to the second limiting component 120, and sorting of the next specification of chips is started.

[0060] The above only describes the preferred embodiments of the present application and is not used to limit the present application, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer sorting machine, comprising a support base (100), a conveying device (400), a sorting device (500), and a detection device (600) located on the upper end of the support base (100), characterized in that: The upper end of the support base (100) is also provided with a first limiting component (110) for limiting the wafer (210) and a second limiting component (120) for limiting the material tray (310). The sorting device (500) is located between the first limiting component (110) and the second limiting component (120). The sorting device (500) includes a first sorting wheel (5001) and a second sorting wheel (5002). Each sorting wheel includes a wheel body (510) and a plurality of suction cups (550) equidistantly distributed around the arc-shaped surface of the wheel body (510). A drive shaft (520) is fixed on the first side plane of the wheel body (510), and a negative pressure assembly communicating with the plurality of suction cups (550) is provided on the second side plane. The first sorting wheel (5001) and the second sorting wheel (5002) rotate in the first plane and the second plane respectively, and the first plane and the second plane intersect each other. The sorting device (500) includes a third sorting wheel (5003), the second sorting wheel (5002) is located between the third sorting wheel (5003) and the first sorting wheel (5001), and the third sorting wheel (5003) rotates in a first plane; The first sorting wheel (5001), the second sorting wheel (5002), and the third sorting wheel (5003) have the same size and the same rotation speed; The wheel body (510) has multiple mounting ports (511) on its arc-shaped surface. The suction cup (550) is disposed in the corresponding mounting port (511). The suction cup (550) is connected to the negative pressure assembly through a negative pressure channel. An opening and closing valve is disposed in the negative pressure channel. The opening and closing valve is electrically connected to the drive shaft (520). The negative pressure assembly includes a negative pressure main pipe (540). The suction cup (550) includes a limiting sleeve (551) that is relatively fixed on the outside and an adsorption body (552) that is relatively movable on the inside of the limiting sleeve (551). An elastic component is provided between the adsorption body (552) and the inner wall of the mounting port (511). The elastic component is an elastic airbag with expansion elasticity. The elastic airbag is normally in an inflated state and is connected in series between the suction cup (550) and the negative pressure branch tube. The detection device (600) is located between the first limiting component (110) and the second limiting component (120). The detection device (600) includes only the first detection component and the second detection component. Both the first detection component and the second detection component are visual detection elements. The detection direction of the first detection component is towards the arc-shaped surface of the first sorting wheel (5001), and the detection direction of the second detection component is towards the arc-shaped surface of the second sorting wheel (5002).

2. The wafer sorting machine according to claim 1, characterized in that, The upper end of the support base (100) is also provided with an installation platform (700), the sorting device (500) is provided on the upper end of the installation platform (700), the installation platform (700) is rotatably connected to the support base (100), and the installation platform (700) is deflected by a predetermined angle by a driving element (710).

3. A wafer sorting machine according to claim 1, characterized in that, The negative pressure main pipe (540) is sealed and rotatedly connected to the central axis of the wheel body (510) through a sealed rotating connector (530).

4. A wafer sorting machine according to claim 1, characterized in that, The upper end of the support base (100) is provided with a first storage component (200) for storing wafers (210) and a second storage component (300) for storing material trays (310). The conveying device (400) includes a first conveying end (430), a second conveying end (440), a first joint (420) for controlling the lifting and lowering movement of the first conveying end (430) and the second conveying end (440), and a second joint (410) for controlling the horizontal movement of the first conveying end (430) and the second conveying end (440).

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