Multi-system access platform and pilot frequency combiner thereof

Abstract

The invention provides a multi-system access platform and a pilot frequency combiner thereof, and relates to the technical field of communication equipment. The pilot frequency combiner comprises a first metal shell, a second metal shell and a middle metal layer. The middle metal layer is fixed between the first metal shell and the second metal shell and forms a first resonant cavity and a second resonant cavity with the first metal shell and the second metal shell in a surrounding mode. The first metal shell is provided with a first input coaxial feed and a second input coaxial feed, and the second metal shell is provided with an output coaxial feed. And a first coupling hole group and a second coupling hole group are constructed on the middle metal layer and are used for communicating the first resonant cavity and the second resonant cavity. The middle metal layer is provided with a frequency tuning unit which is used for disturbing the resonant frequency of the first input coaxial feed or the second input coaxial feed. According to the pilot frequency combiner provided by the invention, the miniaturization design is realized, the transmission loss is low, the flexible tuning capability of the working frequency band is realized, and the excellent working characteristic is realized.

Description

Technical Field

[0001] The present application relates to the technical field of communication equipment, and in particular to a multi-system access platform and an inter-frequency combiner thereof. Background Art

[0002] Multi-system point of interface (POI) platforms are key components of modern communications infrastructure, enabling simultaneous access and combining of signals from multiple communication formats. Their core component, the inter-frequency combiner, efficiently combines signals from different frequency bands for transmission and distribution to coverage systems, minimizing inter-system interference and ensuring signal quality.

[0003] Currently, the technologies for achieving heterogeneous frequency combining mainly include traditional cavity combiners based on metal cavity filters, microstrip line combiners using planar circuit design, and substrate integrated waveguide solutions that combine the characteristics of waveguides and planar circuits.

[0004] However, the existing heterodyne combiner technology has poor multi-band compatibility, high insertion loss, and insufficient isolation, making it difficult to meet the requirements of modern communications for high-quality and high-efficiency signal transmission. Summary of the Invention

[0005] The present application provides a multi-system access platform and its heterogeneous frequency combiner, which achieves the coordinated optimization of miniaturization size and high resonance quality factor, while having both low transmission loss characteristics and flexible frequency band tuning capabilities.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions:

[0007] One aspect of the present application provides a heterofrequency combiner, comprising a first metal shell, provided with a first input coaxial feed and a second input coaxial feed, the axial extension direction of the first input coaxial feed and the axial extension direction of the second input coaxial feed being perpendicular to each other in a first plane; a second metal shell, provided with an output coaxial feed; an intermediate metal layer, fixed between the first metal shell and the second metal shell, and the intermediate metal layer is parallel to the first plane; the intermediate metal layer and the first metal shell enclose a first resonant cavity, and the intermediate metal layer and the second metal shell enclose a second resonant cavity; a first coupling hole group and a second coupling hole group are constructed on the intermediate metal layer, the first coupling hole group and the second coupling hole group respectively connecting the first resonant cavity and the second resonant cavity; the first coupling hole group is arranged along the axial extension direction of the first input coaxial feed, and the second coupling hole group is arranged along the axial extension direction of the second input coaxial feed; a frequency tuning unit, arranged in the intermediate metal layer, is configured to perturb the resonant frequency of the first input coaxial feed or the second input coaxial feed.

[0008] In a possible embodiment, the frequency tuning unit includes a first tuning part and a second tuning part; the first tuning part includes a first metal column and a second metal column, the first metal column and the second metal column are respectively vertically arranged in the middle metal layer, the first metal column is located in the first resonant cavity, and the second metal column is located in the second resonant cavity; the second tuning part includes a third metal column and a fourth metal column, the third metal column and the fourth metal column are respectively vertically arranged in the middle metal layer, the third metal column is located in the first resonant cavity, and the fourth metal column is located in the second resonant cavity.

[0009] In a possible implementation, the first tuning portion and the second tuning portion are arranged along an axial extension direction of the first input coaxial feed and are symmetrical with respect to an axial extension direction of the second input coaxial feed.

[0010] In a possible implementation, the first tuning portion and the second tuning portion are arranged along an axial extension direction of the second input coaxial feed and are symmetrical with respect to the axial extension direction of the first input coaxial feed.

[0011] In a possible implementation, the first coupling hole group includes a first coupling hole and a second coupling hole, and the first coupling hole and the second coupling hole are symmetrical with respect to an axial extension direction of the second input coaxial feed;

[0012] In a possible implementation, the second coupling hole group includes a third coupling hole and a fourth coupling hole, and the third coupling hole and the fourth coupling hole are symmetrical with respect to an axial extension direction of the first input coaxial feed.

[0013] In a possible implementation, the first metal shell and the second metal shell are hemispherical shells, the first metal shell and the second metal shell have the same inner diameter, and the first metal shell and the second metal shell are symmetrically arranged about the middle metal layer.

[0014] In a possible implementation manner, the first metal shell and the second metal shell are filled with ceramic medium.

[0015] Another aspect of the present application provides a multi-system access platform, comprising: at least one heterodyne frequency combiner as described above; a bridge, the input end of the bridge being connected to the output coaxial feed port of the heterodyne frequency combiner; and at least one antenna, the antenna being connected to the output end of the bridge.

[0016] In a possible implementation, a plurality of heterodyne frequency combiners are provided, and the first input coaxial feeds of the plurality of heterodyne frequency combiners are arranged along the same direction.

[0017] The heterofrequency combiner provided in the present application includes: a first metal shell, a second metal shell and an intermediate metal layer. The intermediate metal layer is fixed between the first metal shell and the second metal shell, and the intermediate metal layer and the first metal shell enclose a first resonant cavity. The intermediate metal layer and the second metal shell enclose a second resonant cavity. In this way, the intermediate metal layer can serve as both the bottom boundary of the first resonant cavity and the top boundary of the second resonant cavity. In this way, the stacking structure of the first metal shell and the second metal shell can effectively reduce the volume of the heterofrequency combiner while maintaining the high quality factor characteristics of the first resonant cavity and the second resonant cavity, thereby realizing a miniaturized design.

[0018] The intermediate metal layer also forms a first and second coupling hole group, connecting the first and second resonant cavities, respectively. The first coupling hole group is arranged along the axial direction of the first input coaxial feed, while the second coupling hole group is arranged along the axial direction of the second input coaxial feed. This allows the first and second resonant cavities to form an energy transmission channel through the first and second coupling hole groups, forming a cascade resonant unit and ensuring efficient signal transmission and combining.

[0019] The middle metal layer also houses a first coaxial input feed and a second coaxial input feed. The axial extension directions of the first and second coaxial input feeds are perpendicular to each other within a first plane. This allows the first or second coaxial input feed ports to be located precisely within the field intensity node region of the other resonant mode, creating a natural port isolation mechanism and effectively suppressing crosstalk from inter-frequency signals. The first plane is parallel to the plane of the middle metal layer.

[0020] The heterofrequency combiner also includes a frequency tuning unit, which is arranged in the middle metal layer and can be used to perturb the resonant frequency of the first input coaxial feed or the second input coaxial feed, thereby achieving flexible tuning capabilities of the heterofrequency combiner's operating frequency band. The heterofrequency combiner of the present application achieves a miniaturized design while combining low transmission loss and flexible tuning capabilities of the operating frequency band, exhibiting excellent operating characteristics. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0022] Figure 1 A schematic diagram of the structure of the inter-frequency combiner provided in an embodiment of the present application;

[0023] Figure 2 An electric field distribution diagram of a resonant mode of the first input coaxial feeding excitation in the first resonant cavity provided in an embodiment of the present application;

[0024] Figure 3 The electric field distribution diagram of the resonant mode of the second input coaxial feeding excitation in the first resonant cavity provided in an embodiment of the present application;

[0025] Figure 4 A schematic diagram of the structure of a multi-system access platform provided in an embodiment of the present application;

[0026] Figure 5 This is a graph showing the S-parameter frequency response of the heterodyne combiner provided in an embodiment of the present application;

[0027] Figure 6 This is a graph showing the S-parameter frequency response of the second inter-frequency combiner provided in an embodiment of the present application.

[0028] Description of reference numerals:

[0029] 1-Multi-system access platform;

[0030] 10-inter-frequency combiner; 10a-first inter-frequency combiner; 10b-second inter-frequency combiner; 20-bridge;

[0031] 100 - first metal shell; 200 - second metal shell; 300 - middle metal layer; 400 - frequency tuning unit;

[0032] 110 - first input coaxial feed; 120 - second input coaxial feed; 210 - output coaxial feed; 310 - first coupling hole group; 320 - second coupling hole group; 410 - first tuning section; 420 - second tuning section;

[0033] 311 - first coupling hole; 312 - second coupling hole; 321 - third coupling hole; 322 - fourth coupling hole; 411 - first metal pillar; 412 - second metal pillar; 421 - third metal pillar; 422 - fourth metal pillar;

[0034] 21-input terminal; 22-output terminal;

[0035] A-first resonant cavity; B-second resonant cavity. DETAILED DESCRIPTION

[0036] As mentioned in the background, amidst the rapid development of wireless communication technology, Point of Access (POI) has become a core device supporting modern communications infrastructure, widely used in complex environments with diverse coverage requirements, such as subway tunnels, large airport terminals, and stadiums. The core function of POI is to simultaneously access multiple communication standards from different operators and service systems, and effectively synthesize and distribute these signals operating in different frequency bands.

[0037] The key component to achieve this function is the inter-frequency combiner. Through specific filtering and combining mechanisms, the inter-frequency combiner can converge inter-frequency signals into a single transmission channel, while ensuring sufficient isolation between systems to avoid mutual interference, ultimately ensuring high-quality transmission of all signals to the remote coverage system.

[0038] Conventional cavity combiners utilize metal resonant cavities to form a filter network, achieving a high quality factor (Q), resulting in low insertion loss and good frequency selectivity. However, these traditional cavity combiners are physically large and less adaptable in dense, space-constrained deployment scenarios. More importantly, their cavity structure lacks flexibility for frequency band expansion. Adding new operating bands typically requires redesigning and remanufacturing the entire cavity system, resulting in high costs and lengthy development cycles.

[0039] Microstrip combiners use a planar transmission line structure on a printed circuit board to achieve filtering and combining functions. This solution offers advantages in reducing the physical size and weight of the device and is relatively simple to manufacture. However, its planar structure results in a relatively low Q factor, resulting in high insertion loss and weak out-of-band rejection.

[0040] Substrate-integrated waveguide combiners (SIWCs) employ dense arrays of metallized through-holes (VOHs) formed on a dielectric substrate, creating electromagnetic wave propagation boundary conditions within the substrate similar to those of traditional metal waveguides. This allows them to combine the low-loss characteristics of waveguide structures with the ease of integration of planar circuits. However, existing SIC designs are often limited to a single resonant cavity or a simple cascade of multiple resonant cavities. This results in large device sizes and limited design freedom, making it difficult to achieve complex, compact, and high-performance multi-band inter-frequency combining.

[0041] Therefore, it is difficult for existing heterodyne frequency combiners to simultaneously achieve miniaturization, low transmission loss, and flexible control of the source frequency.

[0042] In view of this, the researchers of this application designed a multi-system access platform and its different frequency combiner.

[0043] The researchers and developers of this application noticed that the closed structure of the metal cavity can maintain the low-loss transmission characteristics of the waveguide. In order to solve the volume redundancy problem of the traditional combiner with multiple cavities arranged side by side, the researchers and developers of this application stacked the first metal shell and the second metal shell up and down, and set an intermediate metal layer in between. The intermediate metal layer and the first metal shell are enclosed to form a first resonant cavity. At the same time, the intermediate metal layer and the second metal shell are enclosed to form a second resonant cavity. In this way, compared with the traditional side-by-side cavity layout, the stacking structure of this application can effectively reduce the volume of the combiner while maintaining the high Q value characteristics of the first resonant cavity and the second resonant cavity, thereby realizing a miniaturized design.

[0044] By analyzing the distribution of electromagnetic modes within a metal cavity, the researchers discovered that when the axes of two coaxial input feeds remain perpendicular to each other in the same plane, they can excite independent, spatially orthogonal resonant modes within the metal cavity. This allows each coaxial input feed port to be precisely located within the field intensity node region of the other resonant mode, creating a natural port isolation mechanism that effectively suppresses crosstalk between signals of different frequencies.

[0045] In order to solve the problem of energy transmission efficiency, the researchers of this application further constructed a coupling hole group extending along the feed axis in the intermediate metal layer, and achieved magnetic coupling and efficient energy transmission by matching the polarization direction of the electromagnetic field, significantly reducing the insertion loss.

[0046] In addition, in order to address the problem that the frequency band expansion of the existing technology requires reconstruction of the cavity, the researchers of this application set up a frequency tuning unit in the middle metal layer, breaking the degeneracy of the resonant mode by perturbing the structural parameters, and realizing the adjustment of the resonant frequency.

[0047] In this way, the researchers of this application stacked the first metal shell, the middle metal layer and the second metal shell to form upper and lower resonant cavities, and combined the collaborative design of the coupling hole group and the frequency tuning unit to construct a heterodyne frequency combiner solution with high isolation, low loss and frequency flexibility, solving the bottleneck problem of the existing technology in the application of POI systems.

[0048] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0049] Figure 1 This is a schematic diagram of the structure of the frequency combiner provided in the embodiment of the present application. Figure 1As shown, the present application provides a heterofrequency combiner, which can be applied to various scenarios related to the wireless communication multi-system access platform 1. For example, the heterofrequency combiner 10 can be applied to transportation hub scenarios such as subway tunnels, airport terminals, and high-speed rail stations to achieve the combined transmission of multi-operator 2G / 3G / 4G / 5G signals and WiFi and private network communication signals. Alternatively, the heterofrequency combiner 10 can also be used to meet the multi-standard signal coverage requirements in densely populated areas such as stadiums, convention and exhibition centers, and commercial complexes. Of course, the heterofrequency combiner 10 can also be used in infrastructure such as 5G base stations and communication rooms to support efficient combining and distribution of multi-band signals.

[0050] Reference Figure 1 As shown, the frequency combiner 10 includes a first metal housing 100, a second metal housing 200, and an intermediate metal layer 300. The first metal housing 100 and the second metal housing 200 are stacked one above the other. The shapes of the first metal housing 100 and the second metal housing 200 can be designed to have metal cavity shapes such as hemispherical, rectangular, or cylindrical, depending on the application requirements.

[0051] The intermediate metal layer 300 is fixed between the first metal shell 100 and the second metal shell 200. The intermediate metal layer 300 and the first metal shell 100 enclose a first resonant cavity A. The intermediate metal layer 300 and the second metal shell 200 enclose a second resonant cavity B. In this way, the intermediate metal layer 300 serves as both the bottom boundary of the first resonant cavity A and the top boundary of the second resonant cavity B. The coupling structure of the intermediate metal layer 300 forms an energy transmission channel between the first resonant cavity A and the second resonant cavity B, allowing the first resonant cavity A and the second resonant cavity B to form a cascaded resonant unit.

[0052] In this way, the vertical stacking layout of the first metal shell 100 and the second metal shell 200 effectively eliminates the redundant gaps between the side-by-side metal cavities of a conventional frequency combiner, reducing the lateral footprint of the frequency combiner 10 and achieving a miniaturized design. The enclosed nature of the first resonant cavity A and the second resonant cavity B allows for a high-Q resonant environment to be constructed, reducing signal transmission loss. Furthermore, the flexible cavity shapes of the first metal shell 100 and the second metal shell 200 provide a structural foundation for dynamic control of the resonant frequency and multi-band signal combining, adapting to the signal access requirements of multiple systems in different scenarios.

[0053] In some embodiments, the first metal shell 100 and the second metal shell 200 can be configured as hemispherical shells, and the first metal shell 100 and the second metal shell 200 have the same inner diameter and are symmetrically arranged with respect to the intermediate metal layer 300. Thus, due to the rotational symmetry of the hemispherical cavity, the orthogonal electromagnetic modes excited by the first input coaxial feed 110 and the second input coaxial feed 120 can be regularly distributed within the first resonant cavity A and the second resonant cavity B, thereby avoiding field strength distortion and energy loss caused by the asymmetric structures of the first resonant cavity A and the second resonant cavity B. Furthermore, the symmetrical arrangement of the first metal shell 100 and the second metal shell 200 with respect to the intermediate metal layer 300 naturally matches the resonant characteristics, ensuring efficient energy transfer from the first resonant cavity A to the second resonant cavity B.

[0054] In some embodiments, the first resonant cavity A and the second resonant cavity B can be configured as hollow cavities. Thus, air serves as the dielectric medium within the first resonant cavity A and the second resonant cavity B. The inherent low-loss characteristics of air minimize energy dissipation during signal transmission. Furthermore, the absence of dielectric filling in the first and second resonant cavities A and B eliminates the need for dielectric material processing and assembly, significantly reducing the manufacturing complexity and mass production cost of the inter-frequency combiner 10.

[0055] In other embodiments, the first resonant cavity A and the second resonant cavity B can be set as a physical structure, and the first resonant cavity A and the second resonant cavity B can be filled with ceramic media such as aluminum oxide or zirconium oxide, which is not limited in this embodiment of the present application.

[0056] Continue to refer to Figure 1 As shown, a first input coaxial feed 110 and a second input coaxial feed 120 are disposed on the first metal housing 100. For ease of description, in this embodiment of the present application, a plane parallel to the plane where the intermediate metal layer 300 is located is defined as a first plane. The axial extension direction of the first input coaxial feed 110 and the axial extension direction of the second input coaxial feed 120 are perpendicular to each other within the first plane.

[0057] In this way, by arranging the first input coaxial feed 110 and the second input coaxial feed 120 in a perpendicular axial direction, orthogonally distributed electromagnetic resonant modes can be excited within the first resonant cavity A. Specifically, when energy is supplied to the first input coaxial feed 110, the excited resonant mode forms a field intensity null at the feeding point of the second input coaxial feed 120. Similarly, when energy is supplied to the second input coaxial feed 120, the excited resonant mode forms a field intensity null at the feeding point of the first input coaxial feed 110.

[0058] Figure 2 This is an electric field distribution diagram of the resonant mode of the first input coaxial feeding excitation in the first resonant cavity provided in an embodiment of the present application. Figure 3 This is an electric field distribution diagram of the resonant mode of the second input coaxial feeding excitation in the first resonant cavity provided in an embodiment of the present application.

[0059] Reference Figure 2 As shown, in the embodiment of the present application, when the first input coaxial feed 110 inputs energy, TM is excited in the first resonant cavity A. 201 Mode, TM 201 The electric field distribution of the mode is symmetrical about the axial extension direction of the first input coaxial feed 110, and symmetrical strong field concentration areas are formed on both sides of the axial extension direction of the first input coaxial feed 110. In addition, when the port of the first input coaxial feed 110 is excited, the TM 201 In the mode, the field intensity in the area where the port of the second input coaxial feed 120 is located is almost zero.

[0060] Similarly, refer to Figure 3 As shown, when the second input coaxial feed 120 inputs energy, TM is excited in the first resonant cavity A. 102 Mode, TM 102 The electric field distribution of the mode is symmetrical about the axial extension direction of the second input coaxial feed 120, and symmetrical strong field concentration areas are formed on both sides of the axial extension direction of the second input coaxial feed 120. 102 In the CMOS mode, the field intensity in the area where the port of the first input coaxial feed 110 is located is almost zero.

[0061] In this way, the electromagnetic field distribution characteristics can be used to construct an isolation mechanism between the port of the first input coaxial feed 110 and the port of the second input coaxial feed 120, respectively, so that electromagnetic energy isolation between the feeding points of the first input coaxial feed 110 and the second input coaxial feed 120 can be achieved without additional isolation components.

[0062] Continue to refer to Figure 1 As shown, the second metal housing 200 is provided with an output coaxial feed 210. After the energy input by the first input coaxial feed 110 and the second input coaxial feed 120 excites a specific electromagnetic mode in the first resonant cavity A, the energy is transmitted to the second resonant cavity B through the intermediate metal layer 300 and undergoes secondary resonance filtering. Ultimately, the first-frequency signal from the first input coaxial feed 110 and the second-frequency signal from the second input coaxial feed 120 are vector-synthesized at the port of the output coaxial feed 210, achieving combined output of the different-frequency signals.

[0063] Reference Figure 1As shown, a first coupling hole group 310 and a second coupling hole group 320 are formed on the intermediate metal layer 300. The first coupling hole group 310 connects the first resonant cavity A and the second resonant cavity B, and the second coupling hole group 320 connects the first resonant cavity A and the second resonant cavity B, so that the first resonant cavity A and the second resonant cavity B constitute a cascade resonant unit, thereby realizing energy transmission between the first resonant cavity A and the second resonant cavity B.

[0064] It should be noted that the first coupling hole group 310 and the second coupling hole group 320 of the embodiment of the present application are both arranged at locations with relatively strong magnetic fields, that is, the first coupling hole group 310 is arranged at the TM field excited by the first input coaxial feed 110. 201 The second coupling hole group 320 is set at the TM of the second input coaxial feed 120 excitation 102 The point where the magnetic field of the pattern is strongest.

[0065] The first coupling hole group 310 includes a first coupling hole 311 and a second coupling hole 312. The first coupling hole 311 and the second coupling hole 312 are arranged along the axial extension direction of the first input coaxial feed 110. Furthermore, the first coupling hole 311 and the second coupling hole 312 are symmetrically distributed relative to the axial extension direction of the second input coaxial feed 120.

[0066] The first coupling hole 311 and the second coupling hole 312 are through-holes that extend through the thickness of the intermediate metal layer, thereby connecting the first resonant cavity A and the second resonant cavity B. The first coupling hole 311 and the second coupling hole 312 have the same shape and size. For example, the first coupling hole 311 and the second coupling hole 312 may be rectangular holes, with the long side of the first coupling hole 311 extending parallel to the long side of the second coupling hole 312.

[0067] The second coupling hole group 320 includes a third coupling hole 321 and a fourth coupling hole 322 . The third coupling hole 321 and the fourth coupling hole 322 are arranged along the axial extension direction of the second input coaxial feed 120 , and the third coupling hole 321 and the fourth coupling hole 322 are symmetrically distributed with respect to the axial extension direction of the first input coaxial feed 110 .

[0068] The third coupling hole 321 and the fourth coupling hole 322 are through-holes extending through the thickness of the intermediate metal layer 300, thereby connecting the first resonant cavity A and the second resonant cavity B. The third coupling hole 321 and the fourth coupling hole 322 have the same shape and size. For example, the third coupling hole 321 and the fourth coupling hole 322 may be rectangular holes, with the long side of the third coupling hole 321 extending parallel to the long side of the fourth coupling hole 322.

[0069] In addition, the long side direction of the first coupling hole 311 and the second coupling hole 312 in this application is the same as the TM 201The magnetic field vectors generated by the modes are in the same direction, forming a magnetic coupling structure. 201 mode, the input energy can be effectively transmitted to the second resonant cavity B through the first coupling hole group 310. Similarly, the long side direction of the third coupling hole 321 and the fourth coupling hole 322 is the same as the TM 102 The direction of the magnetic field vector generated by the mode is consistent, so that the energy input by the second input coaxial feed 120 is excited by the TM 102 mode, the energy generated can also be transmitted from the first resonant cavity to the second resonant cavity through the second coupling hole group 320.

[0070] Thus, by placing the coupling holes in the TM 201 Patterns and TM 102 The magnetic field of the mode is stronger and the long side of the coupling hole is made to be in the same direction as the magnetic field vector. This not only optimizes the energy transmission efficiency, but also utilizes the magnetic field distribution characteristics to further enhance the isolation between different modes, ensuring that the two signals do not interfere with each other during the combining process.

[0071] It should be noted that the heterodyne combiner 10 needs to utilize the frequency difference between the different frequency band signals transmitted by the first input coaxial feed 110 and the second input coaxial feed 120 to achieve sub-band resonance, isolated transmission and vector synthesis of the signals. In other words, the energy frequencies input by the first input coaxial feed 110 and the second input coaxial feed 120 must be different.

[0072] Therefore, the frequency combiner 10 further includes a frequency tuning unit 400 (see Figure 1 ), the frequency tuning unit 400 is disposed in the middle metal layer 300 and can be used to perturb the resonant frequency of the first input coaxial feed 110 or the second input coaxial feed 120. For ease of description, this embodiment of the application uses the frequency tuning unit 400 perturbing the resonant frequency of the first input coaxial feed 110 as an example for explanation.

[0073] The frequency tuning unit 400 includes a first tuning portion 410 and a second tuning portion 420. The first tuning portion 410 includes a first metal pillar 411 and a second metal pillar 412, which are respectively disposed perpendicularly to the intermediate metal layer 300. Furthermore, the first metal pillar 411 is located inside the first resonant cavity A, and the second metal pillar 412 is located inside the second resonant cavity B.

[0074] The second tuning portion 420 includes a third metal pillar 421 and a fourth metal pillar 422. The third metal pillar 421 and the fourth metal pillar 422 are respectively arranged perpendicular to the intermediate metal layer 300. The third metal pillar 421 is located inside the first resonant cavity A, and the fourth metal pillar 422 is located inside the second resonant cavity B. The first metal pillar, the second metal pillar, the third metal pillar, and the fourth metal pillar can have a rectangular, cylindrical, spiral, or other shape, which is not specifically limited in this embodiment of the present application.

[0075] The first tuning portion 410 and the second tuning portion 420 are disposed along the axial extension direction of the first input coaxial feed 110 and are symmetrical with respect to the axial extension direction of the second input coaxial feed 120 .

[0076] Thus, the first tuning section 410 and the second tuning section 420 are located at TM 102 The strong magnetic field of the mode can be combined with the TM 201 The electromagnetic fields of the TM modes form a strong coupling. 102 Mode magnetic field and TM 201 The orthogonal magnetic field distribution of the modes can reduce the interference of the first tuning portion 410 and the second tuning portion 420 on the resonant characteristics of the second input feed, thereby achieving that the frequency tuning unit 400 only interferes with the resonant frequency of the first input coaxial feed 110.

[0077] When the extension height of the first metal pillar 411 or the third metal pillar 421 in the first resonant cavity A is changed, or when the extension height of the second metal pillar 412 or the third metal pillar 421 in the second resonant cavity B is changed, the equivalent boundary conditions of the first resonant cavity A and the second resonant cavity B are changed, thereby continuously regulating the TM 201 The resonant frequency of the mode is adjusted to achieve flexible adaptation of the working frequency band of the different-frequency combiner 10.

[0078] Alternatively, the distance between the first tuning part 410 and the second tuning part 420 can be changed by adjusting the relative position of the first tuning part 410 and the second tuning part 420 in the axial extension direction of the first input coaxial feed 110, thereby achieving the TM 201 For example, when the first tuning part 410 and the second tuning part 420 are close to each other along the axial direction of the first input coaxial feed 110, the equivalent inductance of the electromagnetic coupling structure formed by them increases, making the TM 201 The magnetic field energy storage of the mode is enhanced, and the resonant frequency shifts to a lower frequency. When the first tuning portion 410 and the second tuning portion 420 move away from each other along the axial direction of the first input coaxial feed 110, the coupling strength is weakened, the equivalent inductance is reduced, and the resonant frequency shifts to a higher frequency.

[0079] Of course, if the frequency tuning unit 400 disturbs the resonant frequency of the second input coaxial feed 120, then it is only necessary to arrange the first tuning portion 410 and the second tuning portion 420 along the axial extension direction of the second input coaxial feed 120 and symmetrically with respect to the axial extension direction of the first input coaxial feed 110. This will not be further described here.

[0080] Figure 4 This is a schematic diagram of the structure of the multi-system access platform provided in the embodiment of the present application. Figure 4 As shown, the multi-system access platform 1 includes at least one heterofrequency combiner 10, a bridge 20 and at least one antenna, wherein the input end 21 of the bridge 20 is connected to the port of the output coaxial feed 210 of the heterofrequency combiner 10, and the antenna is connected to the output end 22 of the bridge 20.

[0081] In some embodiments, the multi-system access platform 1 may be provided with multiple hetero-frequency combiners 10 to process signals in more frequency bands. The first input coaxial feeds 110 of the multiple hetero-frequency combiners 10 are arranged in the same direction. The arrangement in the same direction can keep the direction, bending angle and connection method of the feed lines of each hetero-frequency combiner 10 consistent, reducing the signal attenuation difference caused by different line lengths and bending angles. Thus, it helps to make the attenuation degree of the input signal of each hetero-frequency combiner 10 consistent, ensure the amplitude balance of the input signal, and improve the performance stability of the multi-system access platform 1.

[0082] In this way, energy is inputted by the first input coaxial feed 110, causing resonance in the first resonant cavity A. The energy is then transferred to the second resonant cavity B through the first coupling hole group 310, causing resonance in the second resonant cavity B, and then outputted from the output coaxial feed 210. When energy is inputted by the second input coaxial feed 120, resonance occurs in the first resonant cavity A. The energy is then transferred to the second resonant cavity B through the second coupling hole group 320, causing resonance in the second resonant cavity B, and then outputted from the output coaxial feed 210. The energy inputted from the first input coaxial feed 110 and the second input coaxial feed 120 is combined into different frequency signals at the port of the output coaxial feed 210.

[0083] The outputs of multiple inter-frequency combiners 10 are connected to a bridge 20, which integrates the combined signals into a unified transmission link through impedance matching and amplitude and phase calibration. Finally, the combined signal is converted into electromagnetic waves via the antenna, achieving simultaneous radiation coverage of multi-band, multi-standard signals, supporting multi-system access requirements in complex communication scenarios.

[0084] In the embodiments of the present application, an experiment was conducted using an example in which the first resonant cavity A and the second resonant cavity B were hemispherical resonant cavities, and the frequency tuning unit 400 perturbed the resonant frequency of the first input coaxial feed 110. Furthermore, in the embodiments of the present application, an experiment was conducted using an example in which the multi-system access platform 1 included two inter-frequency combiners 10. For ease of description, the two inter-frequency combiners 10 were defined as a first inter-frequency combiner 10a and a second inter-frequency combiner 10b.

[0085] Figure 5 This is a graph showing the S parameter frequency response of the first frequency combiner provided in the embodiment of the present application. Figure 5 As shown in the figure, S 11 is the return loss of the output coaxial feed 210 port, S 21 is the transmission coefficient from the first input coaxial feed port 110 to the output coaxial feed port 210, corresponding to a frequency range of 10.885 GHz to 11.105 GHz (bandwidth 220 MHz), and an insertion loss of 0.114 dB. 31 is the transmission coefficient from the second input coaxial feed port 120 to the output coaxial feed port 210, which corresponds to a frequency range of 11.405 GHz to 11.700 GHz (bandwidth 295 MHz), an insertion loss of 0.1365 dB, and S 32 Characterizing the isolation between the first input coaxial feed 110 port and the second input coaxial feed 120 port, the isolation is better than 24 dB.

[0086] Figure 6 This is a graph of the S-parameter frequency response of the second inter-frequency combiner provided in an embodiment of the present application. By adjusting the frequency tuning unit 400 of the second inter-frequency combiner 10b, a frequency response characteristic different from that of the first inter-frequency combiner 10a can be achieved. Specifically, the frequency range corresponding to the first input coaxial feed port 110 to the output coaxial feed port 210 in the second inter-frequency combiner 10b is 10.895 GHz to 11.105 GHz (bandwidth 210 MHz), with an insertion loss of 0.1180 dB. The frequency range corresponding to the second input coaxial feed port 120 to the output coaxial feed port 210 in the second inter-frequency combiner 10b is 11.410 GHz to 11.700 GHz (bandwidth 290 MHz), with an insertion loss of 0.1186 dB. The isolation between the first input coaxial feed port 110 and the second input coaxial feed port 120 remains better than 24 dB. This verifies that the inter-frequency combiner 10 of the present application can achieve flexible adaptation of the working frequency band of the inter-frequency combiner 10 by adjusting the frequency tuning unit 400 while maintaining the performance indicators of low loss and high isolation.

[0087] It should be noted that phrases such as "one embodiment," "an embodiment," "exemplary embodiments," and "some embodiments" in this specification may indicate embodiments that may include a particular feature, structure, or characteristic, but not every embodiment necessarily includes that particular feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not.

[0088] Generally speaking, terms should be understood, at least in part, based on the context in which they are used. For example, as used herein, the term "one or more" can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense, depending at least in part on the context. Similarly, terms such as "a" or "an" can also be understood to convey either singular or plural usage, depending at least in part on the context.

[0089] It should be readily understood that “on,” “above,” and “over” in this application should be interpreted in the broadest manner, such that “on” means not only “directly on something,” but also includes “on something” with intervening features or layers therebetween, and “above” or “over” includes not only the meaning of “above” or “over,” but also includes “above” or “over” with no intervening features or layers therebetween (i.e., directly on something).

[0090] Additionally, spatially relative terms, such as "below," "beneath," "beneath," "above," and the like, may be used herein for ease of description to describe the relationship of one element or feature to other elements or features as depicted in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90° or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0091] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A frequency combiner, characterized in that: include: A first metal housing is provided with a first input coaxial feed and a second input coaxial feed, wherein the axial extension direction of the first input coaxial feed and the axial extension direction of the second input coaxial feed are perpendicular to each other in a first plane; A second metal shell is provided with an output coaxial feed; an intermediate metal layer fixed between the first metal shell and the second metal shell, and the intermediate metal layer is parallel to the first plane; the intermediate metal layer and the first metal shell enclose a first resonant cavity, and the intermediate metal layer and the second metal shell enclose a second resonant cavity; A first coupling hole group and a second coupling hole group are formed on the intermediate metal layer, wherein the first coupling hole group and the second coupling hole group are connected to the first resonant cavity and the second resonant cavity respectively; The first coupling hole group is arranged along the axial extension direction of the first input coaxial feed, and the second coupling hole group is arranged along the axial extension direction of the second input coaxial feed; A frequency tuning unit is provided on the middle metal layer and is configured to disturb the resonant frequency of the first input coaxial feed or the second input coaxial feed.

2. The frequency combiner according to claim 1, wherein: The frequency tuning unit includes a first tuning part and a second tuning part; The first tuning part includes a first metal column and a second metal column, the first metal column and the second metal column are respectively arranged vertically on the middle metal layer, the first metal column is located in the first resonant cavity, and the second metal column is located in the second resonant cavity; The second tuning part includes a third metal column and a fourth metal column. The third metal column and the fourth metal column are respectively arranged vertically on the middle metal layer. The third metal column is located in the first resonant cavity, and the fourth metal column is located in the second resonant cavity.

3. The frequency combiner according to claim 2, wherein: The first tuning portion and the second tuning portion are arranged along an axial extension direction of the first input coaxial feed and are symmetrical with respect to an axial extension direction of the second input coaxial feed.

4. The different-frequency combiner according to claim 2, characterized in that: The first tuning portion and the second tuning portion are arranged along an axial extension direction of the second input coaxial feed and are symmetrical with respect to the axial extension direction of the first input coaxial feed.

5. The different-frequency combiner according to claim 1, characterized in that: The first coupling hole group includes a first coupling hole and a second coupling hole, and the first coupling hole and the second coupling hole are symmetrical with respect to an axial extension direction of the second input coaxial feed.

6. The different-frequency combiner according to claim 1, characterized in that: The second coupling hole group includes a third coupling hole and a fourth coupling hole, and the third coupling hole and the fourth coupling hole are symmetrical with respect to the axial extension direction of the first input coaxial feed.

7. The different-frequency combiner according to claim 1, characterized in that: The first metal shell and the second metal shell are hemispherical shells; The first metal shell and the second metal shell have the same inner diameter, and the first metal shell and the second metal shell are symmetrically arranged with respect to the intermediate metal layer.

8. The different-frequency combiner according to claim 7, characterized in that: The first metal shell and the second metal shell are filled with ceramic medium.

9. A multi-system access platform, characterized in that: include: At least one different frequency combiner according to any one of claims 1 to 8; An electric bridge, the input end of the electric bridge being connected to the output coaxial feed port of the heterodyne frequency combiner; At least one antenna is connected to the output end of the bridge.

10. The multi-system access platform according to claim 9, characterized in that: There are multiple heterodyne frequency combiners, and the first input coaxial feeds of the multiple heterodyne frequency combiners are arranged in the same direction.

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