Connector assembly, pin structure thereof and electronic equipment

Abstract

The invention relates to a connector assembly, a pin structure thereof and electronic equipment, and the pin structure comprises a grounding pin group which comprises a plurality of grounding pins which are arranged at intervals in a first direction and are adjacently arranged in a second direction; the first signal pin group comprises a first signal pin and a second signal pin which are arranged between two adjacent grounding pins at intervals along the first direction; the second signal pin group comprises a third signal pin and a fourth signal pin, and one of the third signal pin and the fourth signal pin is arranged between the first signal pin and the second signal pin of one first signal pin group; and the other one is arranged between the first signal pin and the second signal pin of the other first signal pin group, and the third signal pin and the fourth signal pin are adjacently arranged in the second direction. According to the pin structure, the arrangement density of the signal pins can be improved under the condition that impedance and isolation are not sacrificed.

Description

Technical Field

[0001] The present disclosure relates to the technical field of connector assemblies, and in particular, to a connector assembly, a pin structure thereof, and an electronic device. Background Art

[0002] In existing high-speed array connector assemblies, one or more GND (Ground) pins are assigned between two adjacent pairs of differential pins in each row. The GND pins serve as signal return paths and isolate interference between differential pairs. This arrangement allows for a maximum of (M-1) / 3 differential pairs per row, where M is the number of pins in each row (one GND pin is assigned to each pair of adjacent differential pins). This results in a relatively low density of high-speed differential pairs. Summary of the Invention

[0003] The purpose of the present disclosure is to provide a connector assembly, a pin structure thereof, and an electronic device, wherein the pin structure can improve the arrangement density of signal pins without sacrificing impedance and isolation.

[0004] In order to achieve the above-mentioned object, according to a first aspect of the present disclosure, a pin structure of a connector assembly is provided, the pin structure comprising: a ground pin group, comprising a plurality of ground pins arranged at intervals along a first direction and adjacently arranged along a second direction; a first signal pin group, comprising a first signal pin and a second signal pin spaced apart between two adjacent ground pins along the first direction; wherein the signals of the first signal pin and the second signal pin have the same amplitude and a phase difference of 180 degrees; and The second signal pin group includes a third signal pin and a fourth signal pin, one of the third signal pin and the fourth signal pin is arranged between the first signal pin and the second signal pin of one of the first signal pin groups; the other is arranged between the first signal pin and the second signal pin of another first signal pin group, and the third signal pin and the fourth signal pin are arranged adjacent to each other in the second direction; wherein, the signal amplitudes of the third signal pin and the fourth signal pin are the same and the phase difference is 180 degrees.

[0005] Optionally, at least two of the second signal pin groups adjacently arranged in the second direction are staggered in the first direction.

[0006] Optionally, sizes of the third signal pin and the fourth signal pin are larger than sizes of the first signal pin and the second signal pin.

[0007] Optionally, in the same first signal pin group, a distance between the first signal pin and the nearest ground pin along the first direction is equal to a distance between the second signal pin and the nearest ground pin.

[0008] Optionally, in the same second signal pin group, along the first direction, the distance between the third signal pin and the first signal pin is equal to the distance between the third signal pin and the second signal pin; Along the first direction, a distance between the fourth signal pin and the first signal pin is equal to a distance between the fourth signal pin and the second signal pin.

[0009] Optionally, along the first direction, a distance between the third signal pin and the first signal pin, a distance between the fourth signal pin and the first signal pin, and a distance between the ground pin and the first signal pin are all equal.

[0010] According to a second aspect of the present disclosure, a connector assembly is provided, comprising the above-mentioned pin structure.

[0011] Optionally, the connector assembly further includes a connector body, and the pin structure is provided on the connector body.

[0012] Optionally, the connector assembly is a male connector or a female connector.

[0013] According to a third aspect of the present disclosure, an electronic device is further provided, comprising the above-mentioned connector assembly.

[0014] Through the above-mentioned technical solution, the pin structure of the connector assembly disclosed herein includes a ground pin group, a first signal pin group, and a second signal pin group. The ground pins of the ground pin group are spaced apart along a first direction and adjacent to each other along a second direction. The first signal pin and the second signal pin of the first signal pin group are spaced apart between two adjacent ground pins along the first direction. One of the third signal pin and the fourth signal pin of the second signal pin group is located between the first signal pin and the second signal pin of one first signal pin group, and the other is located between the first signal pin and the second signal pin of another first signal pin group. Furthermore, the third signal pin and the fourth signal pin are adjacent to each other in the second direction. Because the signals of the first signal pin and the second signal pin, and the third signal pin and the fourth signal pin, have the same amplitude and a 180-degree phase difference, the pin structure of the connector assembly disclosed herein can increase the signal pin arrangement density without sacrificing impedance and isolation.

[0015] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following detailed description, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings: Figure 1 is a schematic diagram of the pin arrangement of a connector assembly in the related art; Figure 2 is a schematic diagram of the pin structure of a connector assembly provided in some embodiments of the present disclosure; Figure 3 is a schematic diagram of the pin structure of a connector assembly provided in other embodiments of the present disclosure; Figure 4 It is a schematic structural diagram of some connector assemblies disclosed in the present invention.

[0017] Description of Reference Numerals 10-pin structure; 110-ground pin; 210-first signal pin; 220-second signal pin; 310-third signal pin; 320-fourth signal pin; 20-connector body. DETAILED DESCRIPTION

[0018] The following describes the specific embodiments of the present disclosure in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present disclosure and are not intended to limit the present disclosure.

[0019] In the present disclosure, unless otherwise specified, directional words such as "inside" and "outside" refer to the inside and outside of the outline of the corresponding component; "far" and "near" refer to the corresponding structure or corresponding component being far away from or close to another structure or component. In addition, the terms "first", "second" and the like used in the present disclosure are intended to distinguish one element from another and do not have order or importance. In addition, in the following description, when referring to the drawings, unless otherwise explained, the same figure marks in different drawings represent the same or similar elements. The above definitions are only used to explain and illustrate the present disclosure and should not be understood as limitations on the present disclosure.

[0020] In the related art, the structure of the high-speed array connector assembly is as follows Figure 1As shown, taking row 1 as an example, one or more ground pins 110 (e.g., GND pins) are assigned between two adjacent pairs of differential pins. A first signal pin 210 and a second signal pin 220 (a differential pair) are arranged between the two ground pins 110. Ground pins 110 (GND pins) serve as signal return paths and isolate interference between the differential pairs. This arrangement allows for a maximum of (M-1) / 3 pairs of differential pins per row, where M is the number of pins in each row (a GND pin is assigned to each side of two adjacent differential pins). This results in a high-speed differential pair arrangement density of (M-1) / (3M). This low arrangement density cannot accommodate the increasing demands for smaller connector assemblies and larger pin counts.

[0021] The purpose of the present disclosure is to provide a pin structure 10 of a connector assembly, a connector assembly including the pin structure 10, and an electronic device including the connector assembly, wherein the pin structure 10 can improve the arrangement density of signal pins without sacrificing impedance and isolation.

[0022] In order to achieve the above purpose, Figures 2 to 4 As shown, according to a first aspect of the present disclosure, a pin structure 10 of a connector assembly is provided. The pin structure 10 includes a ground pin group, a first signal pin group, and a second signal pin group. The ground pin group includes a plurality of ground pins 110 spaced apart along a first direction X and adjacent to each other along a second direction Y. The first signal pin group includes a first signal pin 210 and a second signal pin 220 spaced apart between two adjacent ground pins 110 along the first direction X. The signals of the first signal pin 210 and the second signal pin 220 have the same amplitude and are 180 degrees out of phase with each other. The second signal pin group includes a third signal pin 310 and a fourth signal pin 320. One of the third signal pin 310 and the fourth signal pin 320 is located between the first signal pin 210 and the second signal pin 220 of one first signal pin group; the other is located between the first signal pin 210 and the second signal pin 220 of another first signal pin group. The third signal pin 310 and the fourth signal pin 320 are adjacent to each other in the second direction Y. The signals of the third signal pin 310 and the fourth signal pin 320 have the same amplitude and are 180 degrees out of phase with each other.

[0023] It should be noted that the first direction X and the second direction Y are perpendicular to each other. For ease of description, pins arranged along the first direction X are defined as being in the same row, and pins arranged along the second direction Y are defined as being in the same column. In this disclosure, ground pins are arranged alternately in the row direction and adjacent in the column direction.

[0024] Through the above-described technical solution, the pin structure 10 of the connector assembly disclosed herein includes a ground pin group, a first signal pin group, and a second signal pin group. The ground pins 110 of the ground pin group are spaced apart along a first direction X and adjacent to each other along a second direction Y. The first signal pins 210 and the second signal pins 220 of the first signal pin group are spaced apart between two adjacent ground pins 110 along the first direction X. One of the third signal pin 310 and the fourth signal pin 320 of the second signal pin group is located between the first signal pin 210 and the second signal pin 220 of one first signal pin group, and the other is located between the first signal pin 210 and the second signal pin 220 of another first signal pin group. Because the signals of the first signal pin 210 and the second signal pin 220, and the third signal pin 310 and the fourth signal pin 320, have the same amplitude and a 180-degree phase difference, the pin structure 10 of the connector assembly disclosed herein can increase the signal pin arrangement density without sacrificing impedance and isolation.

[0025] It should be noted that both the first and second signal pin groups are differential signals. The first signal pin group includes a first signal pin 210 and a second signal pin 220, and the second signal pin group includes a third signal pin 310 and a fourth signal pin 320. The signals on the first and second signal pins 210 and 220 have the same amplitude and a 180-degree phase difference. The signals on the third and fourth signal pins 310 and 320 have the same amplitude and a 180-degree phase difference. The amplitudes of the first signal pin 210 (or the second signal pin 220) and the third signal pin 310 (or the fourth signal pin 320) can be the same or different.

[0026] It is understood that the pins can be pins, as used in male connectors, and arranged on the connector body of the connector assembly. Alternatively, the pins can be grooves, as used in female connectors, and arranged on the base of the connector assembly. The connector body can be made of any suitable material, for example, a non-conductive composite material, ceramic, etc. For details, please refer to the relevant art.

[0027] The arrangement of the pins along the first direction X is defined as a row; the arrangement of the pins in the second direction Y is defined as a column. Figure 2 and Figure 3As shown, taking the first and second rows as an example, the third signal pin 310 (2p) is inserted between the first signal pin 210 and the second signal pin 220 (1p and 1n) in the first row, and the fourth signal pin 320 (2n) is inserted between the first signal pin 210 and the second signal pin 220 (i.e., 3p and 3n) in the second row. The other pins are arranged similarly. This arrangement structure can increase the differential pair density to 3 (M-1) / (8M), compared to Figure 1 The pin structure of the conventional connector assembly is 10, and the high-speed differential pair arrangement density is increased by 12.5%.

[0028] Regarding the interference between differential pairs, although there is no ground pin 110 (GND pin) to isolate 2p / 2n from 1p / 1n and 3p / 3n, this does not increase the interference for the following reasons: Define Xtalk_i_j as the interference of pin j on pin i. For example, Xtalk_2p_1p represents the interference of pin 1p on pin 2p. The total interference received by pin 2p is: Xtalk_2p_total=Xtalk_2p_1p+Xtalk_2p_1n+Xtalk_2p_3p+Xtalk_2p_3n Since 2p / 2n and 3p / 3n are differential pairs, the phase difference between the p and n signals is 180 degrees. Therefore: Xtalk_2p_1p=-Xtalk_2p_1n, Xtalk_2p_3p=-Xtalk_2p_3n Then we can deduce: Xtalk_2p_total=0 Similarly, we can deduce that: Xtalk_2n_total=0 Therefore, for the 2p / 2n differential pair, although there is no isolated ground pin nearby, the interference from 1p / 1n and 3p / 3n is theoretically 0 (of course, since the phase of the differential pair is not strictly 180 degrees in engineering, there will still be weak interference in practice, which can be ignored here).

[0029] For 1p / 1n or 3p / 3n, the interference of 2p / 2n can also be deduced to be 0 in theory.

[0030] It should be noted that in actual use, there will be interference between 1p / 1n and 3p / 3n, but 1p / 1n and 3p / 3n belong to different rows. The interference between them can be significantly reduced by adjusting the row spacing or staggering adjacent rows by a certain distance in the horizontal direction.

[0031] In some embodiments, the row spacing (i.e., the distance in the second direction Y) between the same second signal pin group or between two adjacent second signal pin groups can be appropriately increased, thereby reducing the crosstalk between 1p / 1n and 3p / 3n, or reducing the crosstalk between 2p / 2n groups, and the crosstalk between 3p / 3n and 1p / 1n.

[0032] In some embodiments, in two adjacent second signal pin groups, the distance L2 (i.e., the distance in the second direction Y) between the row where the third signal pins 310 of one second signal pin group are located and the row where the fourth signal pins 320 of the other second signal pin group are located is greater than or equal to the distance L1 (i.e., the distance in the second direction Y) between the row where the third signal pins 310 of the same second signal pin group are located and the fourth signal pins 320. Figure 3 As shown, the third signal pin 310 and the fourth signal pin 320 of the second signal pin group are arranged in the first row and the second row, respectively. Therefore, the spacing between two adjacent second signal pin groups is arranged slightly larger, that is, the spacing L2 between the second row and the third row is increased to be larger than the spacing L1 between the first row and the second row, so as to reduce the interference of the first signal pin 210 (3p) in the second row on the first signal pin 210 (1p) in the third row and the interference of the second signal pin 220 (3n) in the second row on the second signal pin 220 (1n) in the third row. Of course, it is also possible to increase the spacing between the first row and the second row, and between the second row and the third row at the same time, that is, to increase the row spacing to reduce crosstalk between rows.

[0033] In other embodiments, at least two second signal pin groups adjacently arranged in the second direction Y are staggered in the first direction X. That is, among the plurality of second signal pin groups between two adjacent rows of ground pins 110, two adjacent second signal pin groups are staggered in the column direction. Specifically, the first signal pins 210 and the second signal pins 220 in the row where the third signal pin 310 of one second signal pin group is located may be staggered in the column direction with the first signal pins 210 and the second signal pins 220 in the row where the fourth signal pin 320 of another second signal pin group is located. For example, by staggering the first signal pin 210 (3p) of the second row of the second column and the first signal pin 210 (1p) of the third row in the column direction, and staggering the second signal pin 220 (3n) of the second row of the fourth column and the second signal pin 220 (1n) of the third row in the column direction, the interference of the first signal pin 210 (3p) in the second row on the first signal pin 210 (1p) in the third row and the interference of the second signal pin 220 (3n) in the second row on the second signal pin 220 (1n) in the third row can be reduced.

[0034] In some other embodiments, a combination of the above two approaches (ie, staggered arrangement of columns upward and increased distance between rows) may be used to achieve interference between the first signal pins 210 and the second signal pins 220 in different rows.

[0035] It should be noted that the interference between the third signal pins 310 and the fourth signal pins 320 between different second signal pin groups can also be adjusted in the above manner.

[0036] In some embodiments, the amplitudes of the first and second signal pin groups can be the same. Specifically, the first signal pin 210 and the second signal pin 220 of the first signal pin group are differential signal pins, and the third signal pin 310 and the fourth signal pin 320 of the second signal pin group are also differential signal pins. Furthermore, the amplitudes of the signals on the first, second, third, and fourth signal pins 210, 220, 310, and 320 are the same. Furthermore, the phases of the signals on the first, second, third, and fourth signal pins 210, 220, 310, and 320 are opposite (i.e., 180 degrees apart). Therefore, by utilizing the characteristics of equal amplitude and opposite phase, the above arrangement can improve the density of high-speed differential pairs without sacrificing impedance and isolation.

[0037] It should be pointed out that the signal amplitude of the third signal pin 310 and the fourth signal pin 320 may also be different from the signal amplitude of the first signal pin 210 and the second signal pin 220. For example, it may be smaller than the signal amplitude of the first signal pin 210 and the second signal pin 220. Since the first signal pin group and the second signal pin group are both differential signal groups, the two signal pins in the same pair of signal pin groups can offset each other to ensure that crosstalk is not increased.

[0038] In terms of differential pair impedance control, the differential pair characteristic impedance is defined as Z0. The characteristic impedance of a differential pair is related to the distance L from the signal pin to the GND pin; a larger L indicates a higher characteristic impedance. It is also related to the distance S between the p and n pins within the differential pair; a larger S indicates a higher characteristic impedance. Furthermore, it is related to the pin size; larger pins indicate a lower characteristic impedance.

[0039] From the above three points, we can deduce that, given the same pin size, the differential characteristic impedance of 2p / 2n will be greater than that of 1p / 1n and 3p / 3n; and that the differential characteristic impedance of 1p / 1n and 3p / 3n will be the same given the same pin size. Therefore, to ensure that the characteristic impedance of all differential pairs is Z0, the pin size of 2p / 2n must be larger than that between 1p / 1n and 3p / 3n.

[0040] In some embodiments of the present disclosure, the third signal pin 310 and the fourth signal pin 320 are larger than the first signal pin 210 and the second signal pin 220. The pin size refers to the cross-sectional area of ​​the pin, which can also be understood as the area through which current or signals flow. For example, the third signal pin 310 and the fourth signal pin 320 are the same size, and the first signal pin 210 and the second signal pin 220 are the same size. Furthermore, the third signal pin 310 and the fourth signal pin 320 need to be larger than the first signal pin 210 and the second signal pin 220 to reduce the characteristic impedance between 2p / 2n, so that the differential characteristic impedance of 2p / 2n is equal to the differential characteristic impedance of 1p / 1n and 3p / 3n, ensuring that the characteristic impedance of all differential pairs is Z0.

[0041] Optionally, in two rows where the same second signal pin group is located, the row spacings between the ground pins 110 are equal; Figure 2 As shown, in the first and second rows, the first, fifth, and Mth columns, the column spacing between two corresponding ground pins 110 (i.e., the spacing between two adjacent ground pins 110 in the same column) is the same. Similarly, in the third and fourth rows, the first, fifth, and Mth columns, the column spacing between two corresponding ground pins 110 (i.e., the spacing between two adjacent ground pins 110 in the same column) is also the same.

[0042] It should be noted that in adjacent rows where two adjacent second signal pin groups are located, for example, in rows 2 and 3, and columns 1, 5, ..., M, the column spacing between corresponding ground pins 110 (i.e., the spacing between adjacent ground pins 110 in the same column) may be the same. However, the column spacing between two ground pins 110 between rows 2 and 3 may be greater than or equal to the spacing between two ground pins 110 between rows 1 and 2, or between rows 3 and 4. This is primarily intended to coordinate the signal pins in rows 2 and 3, isolating the signal pins while reducing or preventing crosstalk between the signal pins in rows 2 and 3.

[0043] In some embodiments, in two adjacent rows where two adjacent second signal pin groups are located, the row spacing between the first signal pin groups is equal. Figure 2As shown, in rows 1 and 2, columns 2, 4, ..., M-1, the column spacing between corresponding first signal pins 210 and corresponding second signal pins 220 (i.e., the spacing between adjacent non-differential signal pins in the same column) is the same. Similarly, in rows 3 and 4, columns 2, 4, ..., M-1, the column spacing between corresponding first signal pins 210 and second signal pins 220 is also the same. This design further facilitates the layout and manufacture of the first signal pin group.

[0044] In some embodiments, in two adjacent rows where two adjacent second signal pin groups are located, the row spacing between the third signal pin 310 and the fourth signal pin is equal. Figure 2 As shown, the column spacing between the corresponding third signal pins 310 and fourth signal pins 320 in rows 1 and 2, columns 3, 7, ..., M-2 (i.e., the spacing between the third signal pins 310 and fourth signal pins 320 of the second signal pin group in the same column) is the same. Similarly, the column spacing between the third signal pins 310 and fourth signal pins 320 in rows 3 and 4, columns 3, 7, ..., M-2 is also the same. This design further facilitates the layout and manufacture of the second signal pin group.

[0045] like Figure 2 and Figure 3 As shown, in some embodiments, the column spacing between the ground pins 110 is equal, where the column spacing refers to the distance between each column, that is, the distance in the second direction Y. Specifically, in all rows, the column spacing between the ground pins 110 in the first column and the ground pins 110 in the fifth column is the same, and the column spacing between the ground pins 110 in the fifth column and the ground pins 110 in the ninth column is the same. This configuration facilitates the arrangement of the ground pins 110.

[0046] In some embodiments, in the same first signal pin group, along the first direction X, the spacing between the first signal pin 210 and its nearest ground pin 110 is equal to the spacing between the second signal pin 220 and its nearest ground pin 110. That is, the column spacing between the first signal pin 210 and its nearest ground pin 110 is equal to the column spacing between the second signal pin 220 and its nearest ground pin 110. Figure 3As shown, the spacing between the first signal pin 210 in the second column of the first row and the ground pin 110 in the first column is equal to the spacing between the second signal pin 220 in the fourth column of the first row and the ground pin 110 in the fifth column, thereby ensuring the same differential signal impedance between the first signal pin 210 and the second signal pin 220. It should be noted that in the second, third, and subsequent rows, the spacing between the first signal pin 210 in the second column and the ground pin 110 in the first column is equal to the spacing between the second signal pin 220 in the fourth column and the ground pin 110 in the fifth column, thereby ensuring the same characteristic impedance across the multiple first signal pin groups and improving the stability of the connector assembly.

[0047] Since a third signal pin 310 or a fourth signal pin 320 is inserted between the first signal pin 210 and the second signal pin 220 in the same row, in order to avoid signal interference caused by the different spacing between the inserted signal pin and the first signal pin 210 and the second signal pin 220, in other embodiments, within the same second signal pin group, along the first direction X, the spacing between the third signal pin 310 and the first signal pin 210 is equal to the spacing between the third signal pin 310 and the second signal pin 220; and along the first direction X, the spacing between the fourth signal pin 320 and the first signal pin 210 is equal to the spacing between the fourth signal pin 320 and the second signal pin 220.

[0048] The column spacing between the third signal pin 310 and the first signal pin 210 and the second signal pin 220 is equal to the column spacing between the fourth signal pin 320 and the first signal pin 210 and the second signal pin 220. In rows 1 and 2, the column spacing between the third signal pin 310 and the first signal pin 210 and the second signal pin 220 in the third column is the same, and the column spacing between the fourth signal pin 320 and the first signal pin 210 and the second signal pin 220 in the third column is also the same. This further reduces or eliminates interference with other signal pins caused by the inserted third signal pin 310 and fourth signal pin 320. This also simplifies the design and manufacturing process, reducing costs.

[0049] In some embodiments, in the two rows forming the differential pair, the distance between the third signal pin 310 and the fourth signal pin 320 is the same, which is also for the convenience of manufacturing. In addition, it should be noted that in order to ensure that the characteristic impedance of all differential pairs is Z0, the size (cross-sectional area) of the third signal pin 310 and the fourth signal pin 320 needs to be larger than the size of the first signal pin 210 and the second signal pin 220. The specific size parameters can be determined after testing during actual use, and will not be repeated here.

[0050] like Figure 3 As shown, in some embodiments, along the first direction X, the spacing between the third signal pin 310 and the first signal pin 210, the spacing between the fourth signal pin 320 and the first signal pin 210, and the spacing between the ground pin 110 and the first signal pin 210 are all equal. That is, a column of first signal pins 210 and a column of second signal pins 220 are provided between the columns where two adjacent ground pins 110 are located, wherein the first signal pins 210 and the second signal reference in the same row form a differential pair (first signal pin group). In order to further increase the arrangement density of the signal pairs, a column is inserted between the column where the first signal pin 210 is located and the column where the second signal pin 220 is located. The column includes a second signal pin group formed by the third signal pin 310 and the fourth signal reference, and the third signal pin 310 and the fourth signal pin 320 between two adjacent rows form a differential pair. The third signal pin 310 is located in one of the rows and is between the first signal pin 210 and the second signal pin 220. Between the second signal pins 220, the fourth signal pin 320 is located in an adjacent row and between the first signal pin 210 and the second signal pin 220. The two can be completely corresponding one to one in the column, that is, the distance between the third signal reference and the first signal pin 210 and the second signal pin 220 adjacent to it is equal. Similarly, the distance between the fourth signal pin 320 and the first signal pin 210 and the second signal pin 220 adjacent to it is also equal, which can further facilitate manufacturing. Similarly, when the amplitudes of the differential signals formed by the first signal pin group and the second signal pin group are the same or different, because the phases are opposite (that is, the phase difference is 180 degrees), mutual interference can be avoided.

[0051] It should be noted that the differential pairs formed by some second signal pin groups located in the same column (i.e., the third signal pins 310 and the fourth signal pins 320) can be staggered. Accordingly, within the two rows containing these staggered differential pairs, the first signal pins 210 and second signal pins 220 corresponding to each other in the column direction can also be staggered. However, the column spacing between the first signal pins 210 and the second signal pins 220 of each second signal pin group and the ground pin 110 must be the same, and the column spacing between the third signal pins 310 and the fourth signal pins 320 and the first signal pins 210 and the second signal pins 220, respectively, must also be the same. This also achieves the goal of increasing arrangement density and reducing interference. Any interference or impedance differences between the third signal pins 310 and the fourth signal pins 320, or between the third signal pins 310 and the fourth signal pins 320 and the first signal pins 210 and the second signal pins 220, can be addressed by adjusting the dimensions of the third signal pins 310 and the fourth signal pins 320.

[0052] like Figure 4As shown, according to the second aspect of the present disclosure, a connector assembly is provided, which includes the above-mentioned pin structure 10. Because the connector assembly adopts the above-mentioned pin structure 10, a second signal pin group is inserted between two corresponding first signal pin groups in two adjacent rows (i.e., between the first signal pin 210 and the second signal pin 220), and the third signal pin 310 of the second signal pin group is located between the first signal pin 210 and the second signal pin 220 in the previous row, and the fourth signal pin 320 of the second signal pin group is located between the first signal pin 210 and the second signal pin 220 in the next row. Therefore, the connector assembly also has all the advantages brought by the above-mentioned pin structure 10, which will not be repeated here.

[0053] To ensure that the characteristic impedance of all differential pairs is Z0, the third signal pin 310 and the fourth signal pin 320 may optionally be larger than the first signal pin 210 and the second signal pin 220. Because larger pin sizes result in smaller characteristic impedances, the third signal pin 310 and the fourth signal pin 320 are increased in size to achieve the same differential characteristic impedance as that of 1p / 1n and 3p / 3n.

[0054] Optionally, the connector assembly further includes a connector body 20, and the pin structure 10 is provided on the connector body 20. The connector assembly may be a high-speed array connector assembly, which includes the connector body 20, and the pin structure 10 is arranged on the connector body 20 in a matrix structure.

[0055] Optionally, the connector assembly is a male connector or a female connector. When the connector assembly is a male connector, the pin structure 10 can be pins provided on the connector body 20, forming a raised structure for mating with the female connector. When the connector assembly is a female connector, the pin structure 10 can be a groove (or depression) provided on the connector body 20 (or also referred to as the base) for connecting with the pins of the male connector.

[0056] According to a third aspect of the present disclosure, an electronic device is also provided, comprising the aforementioned connector assembly, thereby providing all the advantages of the aforementioned connector assembly. The connector may be a male connector and / or a female connector, i.e., the pin structure 10 of the male connector assembly may be needle-shaped, and the female connector may be groove-shaped, so that the two can be mated and connected to achieve signal transmission.

[0057] The pin structure 10 of the connector assembly, the connector assembly, and the electronic device disclosed herein may include a ground pin group, a first signal pin group, and a second signal pin group. The ground pin group includes multiple ground pins 110 arranged in a matrix along rows and columns. The first signal pin 210 and the second signal pin 220 of the first signal pin group are arranged between two adjacent ground pins 110 in each row. One of the third signal pin 310 and the fourth signal pin 320 of the second signal pin group is located between the first signal pin 210 and the second signal pin 220 of one of two adjacent rows, and the other is located between the first signal pin 210 and the second signal pin 220 of the other of two adjacent rows. Because the signal phases of the first signal pin 210 and the second signal pin 220, and the third signal pin 310 and the fourth signal pin 320, are all 180 degrees apart, the pin structure 10 of the connector assembly, the connector assembly, and the electronic device disclosed herein can increase the density of signal pins without sacrificing impedance and isolation.

[0058] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details of the above embodiments. Within the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all fall within the scope of protection of the present disclosure.

[0059] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any appropriate manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0060] In addition, the various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A pin structure of a connector assembly, characterized in that: The pin structure includes: a ground pin group, comprising a plurality of ground pins arranged at intervals along a first direction and adjacently arranged along a second direction; a first signal pin group, comprising a first signal pin and a second signal pin spaced apart between two adjacent ground pins along the first direction; wherein the signals of the first signal pin and the second signal pin have the same amplitude and a phase difference of 180 degrees; and The second signal pin group includes a third signal pin and a fourth signal pin, one of the third signal pin and the fourth signal pin is arranged between the first signal pin and the second signal pin of one of the first signal pin groups; the other is arranged between the first signal pin and the second signal pin of another first signal pin group, and the third signal pin and the fourth signal pin are arranged adjacent to each other in the second direction; wherein, the signal amplitudes of the third signal pin and the fourth signal pin are the same and the phase difference is 180 degrees.

2. The pin structure according to claim 1, characterized in that: At least two of the second signal pin groups adjacently arranged in the second direction are staggered in the first direction.

3. The pin structure according to claim 1, wherein: The sizes of the third signal pin and the fourth signal pin are larger than those of the first signal pin and the second signal pin.

4. The pin structure according to any one of claims 1 to 3, characterized in that: In the same first signal pin group, along the first direction, a distance between the first signal pin and the nearest ground pin is equal to a distance between the second signal pin and the nearest ground pin.

5. The pin structure according to claim 4, characterized in that: In the same second signal pin group, along the first direction, the distance between the third signal pin and the first signal pin is equal to the distance between the third signal pin and the second signal pin; Along the first direction, a distance between the fourth signal pin and the first signal pin is equal to a distance between the fourth signal pin and the second signal pin.

6. The pin structure according to claim 5, characterized in that: Along the first direction, a distance between the third signal pin and the first signal pin, a distance between the fourth signal pin and the first signal pin, and a distance between the ground pin and the first signal pin are all equal.

7. A connector assembly, characterized in that: The connector assembly includes the pin structure according to any one of claims 1 to 6.

8. The connector assembly according to claim 7, wherein: The connector assembly further includes a connector body, and the pin structure is provided on the connector body.

9. The connector assembly according to claim 7, wherein: The connector is generally a male connector or a female connector.

10. An electronic device, characterized in that: The electronic device comprises the connector assembly according to any one of claims 7 to 9.

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