Method of cleaning a circuit board

Abstract

The application discloses a cleaning method of a circuit board, and relates to the technical field of intelligent manufacturing, which comprises the following steps: identifying a to-be-cleaned area on the circuit board and acquiring height data; determining a cleaning starting point and a cleaning ending point; outputting corresponding cleaning path points and corresponding cleaning heights of the circuit board by using a pre-constructed cleaning path model, so as to determine a cleaning path; and generating a cleaning instruction of a cleaning device, and cleaning the circuit board in response to the cleaning instruction until a certain cleaning condition is met, thereby solving the technical problems of high manual cleaning cost, product damage, and improvement of the defective rate; and solving the technical problems of time-consuming machine cleaning, low cleaning quality and efficiency, achieving the technical effects of automatic identification of a cleaning area, full consideration of height differences, automatic adjustment of a cleaning path, avoidance of collision, reduction of equipment loss risk, substantial reduction of the setting time and cleaning time of a cleaning device, and improvement of cleaning efficiency and quality.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of intelligent manufacturing, and particularly relates to a cleaning method of a circuit board. BACKGROUND

[0002] In the related art, the circuit board can be cleaned manually by a user or cleaned by a machine. For example, according to the positional relationship between the intelligent cleaning robot and the obstacle, the working mode and the cleaning module of the intelligent cleaning robot can be adjusted, so as to realize automatic cleaning of the specified area. In addition, when the outer layer rust on the cleaning area of the circuit board is removed and softened to a predetermined degree, the flow rate of the cleaning solution can be used to flush away the outer layer rust, so that the cleaning solution reacts with the inner layer rust.

[0003] However, in the related art, manual cleaning is not only costly, but also easy to cause collision between products during the cleaning process, which indirectly causes damage to the products and increases the defective rate of the products. In addition, the machine cleaning is easy to consume time during the cleaning process, which reduces the cleaning quality and efficiency, and needs to be improved. SUMMARY

[0004] The present application provides a cleaning method of a circuit board, which at least solves the technical problems in the related art that manual cleaning is costly and easy to cause damage to the products, which increases the defective rate of the products, and machine cleaning consumes a lot of time and has low cleaning quality and efficiency.

[0005] The present application provides a cleaning method of a circuit board, which includes the following steps: identifying a to-be-cleaned area on the circuit board, and obtaining height data of at least one component in the to-be-cleaned area at at least one measurement point; determining at least one cleaning starting point and at least one cleaning ending point in the cleaning process of the to-be-cleaned area based on the to-be-cleaned area; inputting the height data, the cleaning starting point and the cleaning ending point into a pre-constructed cleaning path model to output at least one cleaning path point corresponding to the circuit board and a cleaning height corresponding to the cleaning path point, and determining at least one cleaning path by using the cleaning path point and the cleaning height; generating a cleaning instruction of a cleaning device according to the cleaning path, and controlling the cleaning device to clean the circuit board in response to the cleaning instruction until the cleanliness of the to-be-cleaned area meets a preset cleaning condition.

[0006] The application further provides a cleaning device for a circuit board, comprising: an acquisition module, configured to identify a to-be-cleaned area on the circuit board and acquire height data of at least one component in the to-be-cleaned area at at least one measuring point; a determination module, configured to determine at least one cleaning starting point and at least one cleaning ending point in a cleaning process of the to-be-cleaned area based on the to-be-cleaned area; an output module, configured to input the height data, the cleaning starting point and the cleaning ending point into a pre-constructed cleaning path model to output at least one cleaning path point of the circuit board and a cleaning height corresponding to the cleaning path point, so as to determine at least one cleaning path by using the cleaning path point and the cleaning height; and a control module, configured to generate a cleaning instruction of a cleaning device according to the cleaning path and control the cleaning device to clean the circuit board in response to the cleaning instruction until the cleanliness of the to-be-cleaned area meets a preset cleaning condition.

[0007] The application further provides an electronic device, comprising: a memory configured to store a computer program; and a processor configured to execute the computer program to implement the steps of any of the cleaning methods for a circuit board.

[0008] The application further provides a computer-readable storage medium, which stores a computer program, wherein the computer program is executed by a processor to implement the steps of any of the cleaning methods for a circuit board.

[0009] The application further provides a computer program product, which comprises a computer program, wherein the computer program is executed by a processor to implement the steps of any of the cleaning methods for a circuit board.

[0010] By the application, the to-be-cleaned area on the circuit board can be identified, the height data of the components in the to-be-cleaned area can be acquired, the cleaning starting point and the cleaning ending point of the to-be-cleaned area can be determined, the cleaning path point of the circuit board and the cleaning height corresponding to the cleaning path point can be determined by using the pre-constructed cleaning path model, the corresponding cleaning path can be determined, the cleaning instruction of the cleaning device can be generated according to the cleaning path, and thus the circuit board can be cleaned until the cleanliness of the to-be-cleaned area meets a certain cleaning condition, so that the technical problems of high manual cleaning cost, easy product damage and high product failure rate can be solved, the technical problems of long machine cleaning time, low cleaning quality and low cleaning efficiency can be solved, the technical effect of automatically identifying the cleaning area, fully considering the height difference of the components, automatically adjusting the cleaning path, avoiding collision between the cleaning device and the components, reducing the equipment loss risk, greatly reducing the setting time and cleaning time of the cleaning device, and improving the cleaning efficiency and quality can be achieved. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings described in the following embodiments are only some of the embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort based on these drawings.

[0012] Figure 1 A block diagram of a circuit board component cleaning device according to an embodiment of the present application;

[0013] Figure 2 A flow chart of a cleaning method of a circuit board according to an embodiment of the present application;

[0014] Figure 3 A flow chart of the working principle of a cleaning method of a circuit board according to an embodiment of the present application;

[0015] Figure 4 A block diagram of a cleaning device of a circuit board according to an embodiment of the present application.

[0016] Reference signs:

[0017] Wherein, 10-circuit board component cleaning device; 101-moving platform, 102-robotic arm, 103-distance measuring sensor, 104-computing server; 20-cleaning device of a circuit board; 100-first acquisition module, 200-first determination module, 300-output module, 400-control module. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without any creative effort fall within the protection scope of the present application.

[0019] It should be noted that, in the description of the present application, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that the processes, methods, articles or devices comprising a series of elements not only include those elements, but also include other elements not explicitly listed or inherent to such processes, methods, articles or devices. The terms "first", "second" and the like in the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0020] Before introducing the cleaning method of a circuit board according to the embodiments of the present application, a circuit board component cleaning device involved in the embodiments of the present application will be introduced.

[0021] Specifically, Figure 1 A block diagram of a circuit board component cleaning device according to an embodiment of the present application is provided.

[0022] As Figure 1 shown, the circuit board component cleaning device 10 includes a moving platform 101, a mechanical arm 102, a distance measuring sensor 103, and a computing server 104.

[0023] The moving platform 101 is composed of two groups of servo motion systems, which control the movement of servo motors through a trigger controller PLC (Programmable Logic Controller) to transport the circuit board to be cleaned to the cleaning working position of the moving platform 101.

[0024] The mechanical arm 102 is used to adjust the height data of the cleaning port according to the height data of different components of the circuit board to be cleaned, and then complete the cleaning.

[0025] The distance measuring sensor 103 is used to measure the height of each component of the circuit board to be cleaned.

[0026] The computing server 104 is used for data calculation, storage, and processing.

[0027] For example, the circuit board, such as a PCBA (Printed Circuit Board Assembly) board, is placed on the moving platform 101, the trigger controller PLC is triggered, the servo motion system controls the movement of the servo motor to transport the circuit board to be cleaned to the cleaning working position of the moving platform 101, after reaching the cleaning working position, the distance measuring sensor 103 is triggered to measure the height of each component of the PCBA board, after the distance measurement is completed, the height data of the cleaning area of the PCBA board is identified, and the actual point coordinates are converted according to the calibration relationship, at least one cleaning path is generated through the computing server 104, to ensure that the generated cleaning path can cover the entire cleaning area, and then the mechanical arm 102 adjusts the height data of the cleaning port to complete the cleaning.

[0028] In order for those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] The embodiments of the present application provide a cleaning method for a circuit board, which is described in detail in combination with the execution flow of the cleaning method for a circuit board.

[0030] Specifically, Figure 2A flowchart of a cleaning method of a circuit board according to an embodiment of the present application.

[0031] As shown in Figure 2 The cleaning method of the circuit board comprises the following steps:

[0032] In step S201, a region to be cleaned on the circuit board is identified, and height data of at least one component in the region to be cleaned at at least one measurement point is obtained.

[0033] It can be understood that in the embodiments of the present application, the circuit board can include but is not limited to a PCBA board, a PCB (Printed Circuit Board) board, etc., and the present application does not make specific limitations.

[0034] In addition, the embodiments of the present application can identify the region to be cleaned on the circuit board through an amplifier, a microscope, an ion contamination detector, and an electrical tester (such as a multimeter, an oscilloscope, etc., which are not specifically limited by the present application).

[0035] For example, the embodiments of the present application can observe whether there are contaminants in the pin gap of resistors, capacitors, etc. on the circuit board through a 10-100 times amplifier or microscope; the region to be cleaned can also be located by measuring the ion concentration (such as chloride ions, sulfate ions, etc., which are not specifically limited by the present application) on the surface of the circuit board through an ion contamination detector; and the region to be cleaned can also be identified by measuring the resistance value of the key node using a multimeter, for example, an abnormally high resistance value.

[0036] Further, the components on the circuit board according to the embodiments of the present application can be divided into active components and passive components according to their functions. The active components can include but are not limited to integrated circuits such as microprocessors, memories, etc.; discrete semiconductor devices such as diodes, transistors, etc.; optoelectronic devices such as optocouplers, photoresistors / diodes, etc., which are not specifically limited by the present application; and the passive components can include but are not limited to resistors, capacitors, inductors, transformers, etc., which are not specifically limited by the present application.

[0037] As a possible implementation, the embodiments of the present application can identify the region to be cleaned on the circuit board, and then obtain the height data of each component in the region to be cleaned at different measurement points. The number of measurement points can be determined by the size and type of the component, and the position of the measurement point can be determined by the position of the component and the type of the circuit board, etc. The specific settings can be made by those skilled in the art according to the actual situation, and the present application does not make specific limitations.

[0038] It should be noted that the height data can be image data, table data, or file data, and the specific settings can be made by those skilled in the art according to the actual situation, and the present application does not make specific limitations.

[0039] Exemplarily, in combination with Figure 1 As shown, the embodiment of the present application can move the circuit board to the cleaning station of the moving platform, and then identify the to-be-cleaned area of the circuit board by using the computing server, and obtain the height data of different components in the to-be-cleaned area at different measurement points by using the distance measuring sensor, which can be corresponding image data.

[0040] Optionally, in an embodiment of the present application, the height data of at least one component in the to-be-cleaned area at at least one measurement point is obtained, including: judging whether the height data meets a preset data condition; if the height data does not meet the preset data condition, processing the height data until the height data that meets the preset data condition is obtained.

[0041] It can be understood that the height data of the embodiment of the present application can include but is not limited to the size of the height, the corresponding format, etc., which is not specifically limited by the present application.

[0042] In some embodiments, the embodiment of the present application can judge whether the height data meets a certain data condition, and process the height data when it does not meet the certain data condition, until the height data that meets the certain data condition is obtained. The certain data condition can be set by those skilled in the art according to the actual situation, which is not specifically limited by the present application.

[0043] Exemplarily, the height of the patch resistor is generally between 0.5mm and 0.84mm, and the embodiment of the present application can judge whether the height data of the patch resistor is located between 0.5mm and 0.84mm, and if not, the height data is processed, such as reacquiring, replacing, etc., until the corresponding height data is located between 0.5mm and 0.84mm.

[0044] In addition, the embodiment of the present application can set the format of the height data to keep the last two digits after the decimal point, and if the corresponding format does not meet it and the number of digits after the decimal point is greater than two, the embodiment of the present application can round off; if the corresponding format does not meet it and the number of digits after the decimal point is less than two, the embodiment of the present application can fill zeros, which can be set by those skilled in the art according to the actual situation, which is not specifically limited by the present application.

[0045] The embodiment of the present application can judge whether the height data meets a certain data condition, and process the height data when it does not meet the certain data condition, until the height data that meets the certain data condition is obtained. The obtained height data is screened and judged by the certain data condition, the abnormal data is eliminated, the data quality is improved, and the cleaning effect is guaranteed.

[0046] Optionally, in an embodiment of the present application, before the height data of at least one component in the to-be-cleaned area at at least one measurement point is acquired, the method further comprises: acquiring position data of the circuit board; determining whether the position data satisfies a preset position condition; if the position data satisfies the preset position condition, allowing the height data to be acquired; and if the position data does not satisfy the preset position condition, adjusting the position data based on the preset position condition until adjusted position data satisfying the preset position condition is obtained, and allowing the height data to be acquired based on the adjusted position data.

[0047] It can be understood that the position data in the embodiments of the present application can be acquired by a sensor, a camera or other positioning device, which is not specifically limited in the present application.

[0048] For example, the horizontal coordinate and the vertical coordinate of the circuit board can be acquired by a position sensor (such as an encoder, a laser range finder, etc., which is not specifically limited in the present application), and the vertical coordinate of the circuit board can be acquired by a height sensor (such as ultrasonic, infrared, etc., which is not specifically limited in the present application).

[0049] In some embodiments, the position data of the circuit board can be determined to satisfy a certain position condition, and if so, the height data corresponding to different components is allowed to be acquired; if not, the position of the circuit board is adjusted based on the certain position condition until the adjusted position data satisfies the certain position condition, and then the corresponding height data is allowed to be acquired. The certain position condition can be set by a person skilled in the art according to actual conditions, which is not specifically limited in the present application.

[0050] For example, as shown in Figure 1 , the horizontal coordinate of the cleaning station of the mobile platform can be limited to a range of , the vertical coordinate can be limited to a range of , and the vertical coordinate can be limited to a range of , wherein can be set by a person skilled in the art according to actual conditions, which is not specifically limited in the present application.

[0051] Further, it can be determined whether the horizontal coordinate data, the vertical coordinate data and the vertical coordinate data of the circuit board are located in the corresponding range interval, if the horizontal coordinate data is not located in , the corresponding horizontal coordinate data is adjusted based on until the corresponding horizontal coordinate data is located in ; if the vertical coordinate data is not located in , the corresponding vertical coordinate data is adjusted based on until the corresponding vertical coordinate data is located in ; and if the vertical coordinate data is not located in If the corresponding vertical coordinate data is located in the range of [L, H], the corresponding vertical coordinate data is adjusted until the corresponding vertical coordinate data is located in the range of [L, H]. The corresponding vertical coordinate data is adjusted until the corresponding vertical coordinate data is located in the range of [L, H]. The corresponding vertical coordinate data is adjusted until the corresponding vertical coordinate data is located in the range of [L, H].

[0052] Before obtaining the height data of at least one component in the to-be-cleaned area at at least one measurement point, the position data of the circuit board is judged whether to satisfy a certain position condition, and the position data is adjusted when it does not satisfy the certain position condition until the adjusted position data that satisfies the certain position condition is obtained. The certain position condition sets an accurate position standard for the circuit board, and only when the position data of the circuit board satisfies the certain position condition, the accuracy of the measurement point position can be ensured, the measurement error is reduced, the accuracy of the height data is improved, the operation safety and effectiveness of the cleaning equipment are ensured, and effective cleaning is achieved.

[0053] Optionally, in an embodiment of the present application, obtaining the height data of at least one component in the to-be-cleaned area at at least one measurement point comprises: obtaining initial height data of the component at the measurement point; determining a neighborhood radius of the corresponding measurement point based on the measurement point and the component; determining neighborhood height data of the measurement point in the neighborhood radius based on the neighborhood radius; determining median data of the neighborhood height data and the initial height data based on the neighborhood height data and the initial height data, and obtaining the height data according to the median data. Wherein, the calculation formula of the height data can be but not limited to:

[0054] ,

[0055] Wherein, is the neighborhood radius, is the coordinate of the measurement point in the neighborhood radius, is the initial height data of the corresponding measurement point, is the median operation.

[0056] It can be understood that the embodiments of the present application can filter the obtained height data to remove noise interference, and then obtain the corresponding height data.

[0057] In some embodiments, the embodiments of the present application can obtain initial height data at different measurement points, determine the neighborhood radius of the corresponding measurement point, and then determine the neighborhood height data of different measurement points in the neighborhood radius, so as to obtain the height data by using the median data of the neighborhood height data and the initial height data. Wherein, the neighborhood radius can be set by the person skilled in the art according to the actual situation, and the present application does not make specific limitation.

[0058] Wherein, the calculation formula of the height data can be but not limited to:

[0059] ,

[0060] wherein, is a neighborhood radius, when the neighborhood size is 3x3, , when the neighborhood size is 5x5, ; is a coordinate of a measurement point within the neighborhood radius, is initial height data of the corresponding measurement point, is a median operation.

[0061] Exemplarily, the resistor has two measurement points, and the processor has ten measurement points. The measurement point density of the resistor is much greater than the measurement point density of the processor. Further, the embodiment of the present application can set the neighborhood radius of the resistor to 5 mm, and the neighborhood radius of the processor to 3 mm, and then obtain the corresponding neighborhood height data within the neighborhood radius. Further, the embodiment of the present application can obtain the height data by using the calculation formula of the height data.

[0062] The embodiment of the present application can obtain the initial height data of the component at the measurement point, determine the neighborhood radius of the corresponding measurement point, and then determine the neighborhood height data within the neighborhood radius, so as to calculate the height data by using the calculation formula of the height data, eliminate the interference of abnormal values, compensate for local measurement errors, improve the accuracy and reliability of the overall height data, adapt to different measurement scenes, and improve the flexibility and scalability of the system.

[0063] In step S202, at least one cleaning starting point and at least one cleaning ending point in the cleaning process of the to-be-cleaned region are determined based on the to-be-cleaned region.

[0064] It can be understood that the embodiment of the present application can select one edge foot coordinate of the to-be-cleaned region of the circuit board as the cleaning starting point, and the opposite edge foot coordinate as the cleaning ending point. Other appropriate cleaning starting points and cleaning ending points can also be selected according to actual cleaning requirements and component layout. The specific settings can be made by a person skilled in the art according to actual conditions, and the present application does not make specific limitations.

[0065] As a possible implementation manner, the embodiment of the present application can determine the cleaning starting point and the cleaning ending point in the cleaning process of the to-be-cleaned region based on the to-be-cleaned region.

[0066] Exemplarily, in the embodiment of the present application, the circuit board includes two to-be-cleaned regions, to-be-cleaned region 1 and to-be-cleaned region 2. The pollution degree of to-be-cleaned region 1 is much greater than the pollution procedure of to-be-cleaned region 2. Therefore, the embodiment of the present application can determine the cleaning starting point ( ) and the cleaning ending point ( ) of to-be-cleaned region 1 based on different pollution degrees, and the cleaning starting point ( ) and the cleaning ending point ( ) of to-be-cleaned region 2.

[0067] Optionally, in an embodiment of the present application, before the height data, the cleaning starting point and the cleaning ending point are input into the pre-constructed cleaning path model, the following steps are further included: determining initial working height data of the cleaning device based on the target height data; determining corresponding safe working height data of the cleaning device based on different components; and calculating target cleaning height of the cleaning device based on the initial working height data, the safe working height data and the target height data, so as to construct the cleaning path model by using the target cleaning height. The expression of the target cleaning height can be, but is not limited to,

[0068] ,

[0069] wherein, is the initial working height data, is the safe working height data.

[0070] It can be understood that in the cleaning process of the cleaning device, the initial working height data of the cleaning device can be determined according to experiments in advance to ensure the dust collection effect and avoid colliding with the components. The initial working height data can be set by a person skilled in the art according to actual conditions, and the present application does not make specific limitations.

[0071] In addition, in order to ensure that the cleaning device maintains a certain safety distance from the components in the cleaning process and prevents collision, the safe working height data is introduced , which generally has a value range of 2mm-5mm, and the present application does not make specific limitations.

[0072] In some embodiments, the initial working height data of the cleaning device can be determined based on the target height data, and the corresponding safe working height data of the cleaning device can be determined based on different components, and then the target cleaning height of the cleaning device is calculated based on the initial working height data, the safe working height data and the target height data, so as to construct the cleaning path model by using the target cleaning height. The expression of the target cleaning height can be, but is not limited to,

[0073] ,

[0074] wherein, is the initial working height data, is the safe working height data.

[0075] For example, the initial working height data can be set as H1 and the safe working height data can be set as based on the target height data of the resistor, and the initial working height data can be set as H2 and the safe working height data can be set as and the processor at different measurement points corresponding target cleaning height is calculated by using the expression of the target cleaning height, thereby constructing the cleaning path model.

[0076] Before the height data, the cleaning starting point and the cleaning ending point are input to the pre-constructed cleaning path model, the initial working height data of the cleaning equipment can be determined in the embodiment of the application, and then the corresponding safe working height data of the cleaning equipment is determined, and then the target cleaning height of the cleaning equipment is calculated by combining the calculation of the working hours of the target cleaning height, thereby constructing the cleaning path model. By determining the safe working height and calculating the target cleaning height based thereon, it can be ensured that the cleaning equipment always maintains a safe distance from the components during the running process, effectively avoiding collision accidents, prolonging the service life of the equipment, reducing the production cost, and enabling the cleaning equipment to better adapt to complex working environments, improving the reliability and stability of the cleaning process.

[0077] Optionally, in an embodiment of the application, before the height data, the cleaning starting point and the cleaning ending point are input to the pre-constructed cleaning path model, it further includes: based on at least one target cleaning starting point and at least one target cleaning ending point, obtaining the path direction according to the target cleaning starting point and the target cleaning ending point; based on the target cleaning starting point, the target cleaning ending point and the path direction, determining the target step length; based on the target cleaning starting point, the target cleaning ending point and the target step length, determining at least one target cleaning path point, so as to construct the cleaning path model by using the target cleaning path point.

[0078] It can be understood that in the embodiment of the application, the cleaning equipment can include one or more target cleaning starting points, such as target cleaning starting point 1, target cleaning starting point 2, target cleaning starting point 3, etc., which are not specifically limited by the application; one or more target cleaning ending points, such as target cleaning ending point 1, target cleaning ending point 2, target cleaning ending point 3, etc., which are not specifically limited by the application.

[0079] Further, the path directions of the target cleaning starting point 1 to the target cleaning ending point 1 and the target cleaning starting point 1 to the target cleaning ending point 2 are inconsistent in the embodiment of the application, and therefore, the corresponding target step length can be determined according to the corresponding path direction of the target cleaning starting point to the target cleaning ending point in the embodiment of the application. The target step length can be adjusted according to the size of the circuit board, the component distribution density, etc., and generally has a value range of 5mm-20mm, which can be set by a person skilled in the art according to the actual situation, and the application does not make specific limitations.

[0080] In some embodiments, the embodiments of the present application can first acquire a path direction from the target cleaning starting point to the target cleaning ending point, and then determine a target step length based on the corresponding target cleaning starting point and target cleaning ending point and the path direction, and then determine at least one target cleaning path point, so as to construct a cleaning path model by using the at least one target cleaning path point.

[0081] For example, the embodiments of the present application have a larger component distribution density in the path direction from the target cleaning starting point 1 to the target cleaning ending point 1. Therefore, the embodiments of the present application can set the target step length to 5 mm, and then determine the target cleaning path point based on the target cleaning starting point 1, the target cleaning ending point 1 and the target step length of 5 mm, so as to construct a cleaning path model.

[0082] However, the embodiments of the present application have a smaller component distribution density in the path direction from the target cleaning starting point 1 to the target cleaning ending point 2. Therefore, the embodiments of the present application can set the target step length to 12 mm, and then determine the target cleaning path point based on the target cleaning starting point 1, the target cleaning ending point 2 and the target step length of 12 mm, so as to construct a cleaning path model.

[0083] Before inputting the height data, the cleaning starting point and the cleaning ending point into the pre-constructed cleaning path model, the embodiments of the present application can determine a target step length according to the path direction of the target cleaning starting point and the target cleaning ending point and the target cleaning starting point and the target cleaning ending point, and then determine the target cleaning path point of the cleaning device, so as to construct a cleaning path model. A path that can comprehensively cover the to-be-cleaned area can be constructed, so as to avoid a cleaning dead angle and ensure comprehensive coverage. Therefore, the most suitable cleaning path can be planned, and efficient and thorough cleaning can be achieved on a complex surface structure, so as to improve the cleaning efficiency and shorten the production cycle.

[0084] Optionally, in an embodiment of the present application, determining the at least one target cleaning path point based on the target cleaning starting point, the target cleaning ending point and the target step length comprises: determining a target adjacent cleaning path point of the target current cleaning path point based on the target current cleaning path point, the target cleaning ending point and the target step length; fitting the target cleaning starting point, the target cleaning ending point, the target current cleaning path point and the target adjacent cleaning path point to obtain a fitting function between different target cleaning path points between the target cleaning starting point and the target cleaning ending point; and determining the target cleaning path point based on the target cleaning starting point, the target cleaning ending point and the fitting function.

[0085] ​​​​It can be understood that the embodiment of the present application can perform fitting of the target cleaning path points based on the target cleaning starting point, the target cleaning ending point and the target step length, and then obtain the corresponding fitting function, and use the fitting function to fit the next target cleaning path point, so as to determine all the target cleaning path points.

[0086] In some embodiments, the embodiment of the present application can determine the target adjacent cleaning path point of the target current cleaning path point based on the target current cleaning path point, the target cleaning ending point and the target step length, and then perform fitting of the target cleaning starting point, the target cleaning ending point, the target current cleaning path point and the target adjacent cleaning path point, so as to obtain the fitting function between different target cleaning path points between the target cleaning starting point and the target cleaning ending point, and determine the target cleaning path point by using the fitting function.

[0087] For example, the embodiment of the present application can use a path planning method based on cubic spline interpolation to obtain the fitting function, and the specific content can be that the embodiment of the present application uses the target cleaning path points scattered in the path direction from the target cleaning starting point to the target cleaning ending point as the fitting points, and the target cleaning path points are distributed according to the target step length. ( ) represents the motion trajectory of the cleaning device, and the target cleaning path points are distributed in the path direction from the target cleaning starting point to the target cleaning ending point according to the target step length, wherein, is inversely proportional to the target step length. The cubic spline interpolation function and is used to fit the target cleaning path points, so that the motion trajectory of the cleaning device has continuous first and second derivatives in the x and y directions, thereby ensuring the smoothness of the motion.

[0088] Among them, for each adjacent target cleaning path point (x ) and (x ), on the interval , there are cubic polynomials and , so that and satisfy:

[0089] ,

[0090] ,

[0091] ,

[0092] ,

[0093] ,

[0094] ,

[0095] ,

[0096] ,

[0097] The embodiment of the present application can determine the target adjacent cleaning path point of the target current cleaning path point based on the target current cleaning path point, the target cleaning end point and the target step length, and then fit the target cleaning start point, the target cleaning end point, the target current cleaning path point and the target adjacent cleaning path point, so as to obtain the fitting function between different target cleaning path points, and then determine the target cleaning path point. The target cleaning path point determined by the fitting function can make the movement of the cleaning device between different path points more smooth, improve the cleaning quality, and in addition, the fitting function can make the movement of the cleaning device more smooth, reduce the number of acceleration and deceleration, thereby shortening the cleaning time and improving the production efficiency.

[0098] Optionally, in an embodiment of the present application, the target cleaning path point is used to construct a cleaning path model, comprising: obtaining a target cleaning height corresponding to the target cleaning path point; and constructing a cleaning path model based on the target cleaning path point and the target cleaning height. The expression of the cleaning path model can be but is not limited to:

[0099] ,

[0100] wherein, is the total number of path points, is a cleaning path point, is a cleaning path point corresponding to the cleaning height.

[0101] It can be understood that the cleaning path model constructed by the embodiment of the present application can represent a data set composed of a series of target cleaning path points and corresponding target cleaning heights, and the expression thereof can be but is not limited to:

[0102] ,

[0103] wherein, is the total number of path points, is a cleaning path point, is a cleaning path point corresponding to the cleaning height, These target cleaning path points form a cleaning path of the cleaning device in a certain order (such as arranged in turn from the target cleaning start point to the target cleaning end point, which is not specifically limited by the present application), and then the cleaning device is controlled to perform cleaning work according to the target cleaning path point, and the cleaning device such as the height data of the suction port is adjusted according to the target cleaning height at each target cleaning path point.

[0104] The embodiment of the present application can construct a cleaning path model according to the target cleaning height corresponding to the target cleaning path point and the target cleaning path point, and the model can adjust the cleaning path in real time according to the change of the target cleaning height, thereby improving the cleaning efficiency and coverage, and further reducing the manual intervention and cost.

[0105] In step S203, the height data, the cleaning starting point and the cleaning ending point are input into the pre-constructed cleaning path model to output at least one cleaning path point corresponding to the circuit board and the cleaning height corresponding to the cleaning path point, so as to determine at least one cleaning path by using the cleaning path point and the cleaning height.

[0106] In some embodiments, the embodiment of the present application inputs the height data, at least one cleaning starting point and at least one cleaning ending point into the pre-constructed cleaning path model, and then outputs at least one cleaning path point of the cleaning device corresponding to the circuit board and the cleaning height corresponding to the at least one cleaning path point, so as to determine at least one cleaning path of the cleaning device by using the at least one cleaning path point and the corresponding cleaning height.

[0107] For example, the embodiment of the present application can input the height data, the cleaning starting point 1, the cleaning ending point 1 and the cleaning ending point 2 into the pre-constructed cleaning path model, and then determine the cleaning path point A1, the cleaning path point B1, the cleaning path point B1', between the cleaning starting point 1 and the cleaning ending point 1 by using the pre-constructed cleaning path model, and then obtain the cleaning path 1: A1-B1, the cleaning path 2: A1-B1', the cleaning path point A2, the cleaning path point B2, the cleaning path point B2' between the cleaning starting point 1 and the cleaning ending point 2, and then obtain the cleaning path 3: A2-B2, the cleaning path 4: A2-B2', and automatically generate the optimal cleaning path with adjustable running height in combination with the corresponding cleaning height.

[0108] Optionally, in an embodiment of the present application, before the cleaning device is controlled to respond to the cleaning instruction, it further includes: judging whether the cleaning device is in a working state based on the working information of the cleaning device; if the cleaning device is in the working state, allowing the cleaning device to execute the cleaning instruction; and if the cleaning device is not in the working state, adjusting the cleaning device based on the working state until the cleaning device in the working state is obtained, and allowing the cleaning device in the working state to execute the cleaning instruction.

[0109] It can be understood that the working information of the embodiment of the present application can include but is not limited to the voltage, current and the like of the cleaning device, which is not specifically limited in the present application.

[0110] In some embodiments, the embodiment of the present application can judge whether the cleaning device is in a working state based on the working information of the cleaning device, and if it is, allow the cleaning instruction to be executed; and if it is not, adjust the cleaning device to the working state.

[0111] For example, the embodiment of the present application can obtain the voltage and current of the cleaning device, and determine whether the cleaning device is in a working state according to the voltage and current of the cleaning device. If it is, the cleaning instruction is executed; if not, the cleaning device is adjusted to the working state.

[0112] The embodiment of the present application can determine whether the cleaning device is in a working state before controlling the cleaning device to execute the cleaning instruction according to at least one cleaning path point and the corresponding cleaning height, and adjust the cleaning device when it is not in the working state until the cleaning device in the working state is obtained, thereby avoiding the risk of misstarting, ensuring operation safety and device stability, reducing invalid waiting time, improving task execution efficiency and reliability, and optimizing user experience and operation convenience.

[0113] In step S204, the cleaning instruction of the cleaning device is generated according to the cleaning path, and the cleaning device is controlled to clean the circuit board in response to the cleaning instruction until the cleanliness of the to-be-cleaned area meets the preset cleaning condition.

[0114] It can be understood that the embodiment of the present application can determine the pollution degree of different cleaning paths before generating corresponding cleaning instructions according to different cleaning paths.

[0115] In some embodiments, the embodiment of the present application can generate corresponding cleaning instructions according to different cleaning paths, and then control the cleaning device to respond to the cleaning instruction, and then clean the circuit board until the cleanliness of the to-be-cleaned area meets a certain cleaning condition. The certain cleaning condition can be set by those skilled in the art according to the actual situation, and the present application does not make specific limitations.

[0116] For example, the embodiment of the present application determines that the pollution degree of the cleaning path 1 is mild pollution, so the generated cleaning instruction can be mild cleaning, and the cleanliness of the to-be-cleaned area is set to 98%, and then respond to the mild cleaning instruction until the cleanliness of the to-be-cleaned area is greater than 98%.

[0117] And the embodiment of the present application determines that the pollution degree of the cleaning path 2 is heavy pollution, so the generated cleaning instruction can be heavy cleaning, and the cleanliness of the to-be-cleaned area is set to 80%, and then respond to the heavy cleaning instruction until the cleanliness of the to-be-cleaned area is greater than 80%.

[0118] Optionally, in an embodiment of the present application, cleaning the circuit board comprises: determining a second cleaning height of the cleaning device at the next cleaning path point based on the cleaning path point and the corresponding cleaning height; adjusting the cleaning device to the next cleaning path point based on the second cleaning height; and cleaning the circuit board based on the second cleaning height and the next cleaning path point.

[0119] In some embodiments, the cleaning method for the circuit board can first determine the second cleaning height of the cleaning device at the next cleaning path point, and then adjust the cleaning device to the next cleaning path point based on the second cleaning height, so as to clean the circuit board.

[0120] The cleaning method for the circuit board can determine the second cleaning height of the cleaning device at the next cleaning path point based on at least one cleaning path point and the corresponding cleaning height, and then adjust the cleaning device to the next cleaning path point, so as to clean the circuit board. This can accurately adapt to the complex structure of the circuit board, avoid cleaning dead angles, improve cleaning coverage, protect the circuit board from mechanical damage, and improve reliability.

[0121] The working principle of the cleaning method for the circuit board according to an embodiment of the present application will be described below in combination with a specific embodiment.

[0122] Among them, Figure 3 The flow chart of the working principle of the cleaning method for the circuit board according to an embodiment of the present application is shown in the figure.

[0123] Step S301: Collect image data of the to-be-cleaned area on the circuit board.

[0124] Among them, the image data in the embodiment of the present application can include but is not limited to the initial height data of different components at different measurement points.

[0125] Step S302: Determine the height data using the initial height data.

[0126] Among them, the embodiment of the present application can determine the corresponding height data by using the calculation formula of the height data.

[0127] Step S303: Build a cleaning path model.

[0128] Step S304: Input the height data, the cleaning starting point and the cleaning ending point into the pre-built cleaning path model to determine the cleaning path of the cleaning device.

[0129] Step S305: Clean the circuit board.

[0130] Through the above description of the embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be realized by means of software and the necessary general hardware platform, of course, it can also be realized by hardware, but in many cases the former is a better embodiment.

[0131] The cleaning method of the circuit board provided in the embodiment of the present application can identify the to-be-cleaned area on the circuit board, obtain the height data of the components in the to-be-cleaned area, determine the cleaning starting point and the cleaning ending point of the to-be-cleaned area, determine the cleaning path point of the circuit board and the cleaning height corresponding to the cleaning path point by using the cleaning path model constructed in advance, and then determine the corresponding cleaning path and generate the cleaning instruction of the cleaning equipment according to the cleaning path, so as to clean the circuit board until the cleanliness of the to-be-cleaned area meets a certain cleaning condition. Therefore, the technical problem that manual cleaning is high in cost and easy to cause damage to products and improve the product failure rate and the technical problem that machine cleaning is time-consuming and low in cleaning quality and efficiency can be solved, the technical effect that the cleaning area can be automatically identified, the height difference of the components is fully considered, the cleaning path is automatically adjusted, the collision between the cleaning equipment and the components is avoided, the equipment loss risk is reduced, the setting time and the cleaning time of the cleaning equipment are greatly reduced, and the cleaning efficiency and quality are improved can be achieved.

[0132] The embodiment of the present application also provides a cleaning device of a circuit board.

[0133] Figure 4 A block schematic diagram of the cleaning device of the circuit board provided in the embodiment of the present application is shown.

[0134] As shown in Figure 4 The cleaning device 20 of the circuit board, a plurality of components are arranged on the circuit board, wherein the cleaning device 20 of the circuit board comprises a first acquisition module 100, a first determination module 200, an output module 300 and a control module 400.

[0135] The first acquisition module 100 is configured to identify the to-be-cleaned area on the circuit board and obtain the height data of at least one component in the to-be-cleaned area at at least one measurement point.

[0136] The first determination module 200 is configured to determine at least one cleaning starting point and at least one cleaning ending point in the cleaning process of the to-be-cleaned area based on the to-be-cleaned area.

[0137] The output module 300 is configured to input the height data, the cleaning starting point and the cleaning ending point into a cleaning path model constructed in advance, to output at least one cleaning path point of the circuit board and the cleaning height corresponding to the cleaning path point, and to determine at least one cleaning path by using the cleaning path point and the cleaning height.

[0138] The control module 400 is configured to generate the cleaning instruction of the cleaning equipment according to the cleaning path, and to control the cleaning equipment to clean the circuit board in response to the cleaning instruction until the cleanliness of the to-be-cleaned area meets a preset cleaning condition.

[0139] Optionally, in one embodiment of the present application, further comprising: a second obtaining module, a first judging module, a third obtaining module and an adjusting module.

[0140] The second obtaining module is configured to obtain position data of the circuit board before obtaining height data of at least one component in the to-be-cleaned area at at least one measurement point.

[0141] The first judging module is configured to judge whether the position data satisfies a preset position condition.

[0142] The third obtaining module is configured to allow the height data to be obtained when the position data satisfies the preset position condition.

[0143] The adjusting module is configured to adjust the position data by using the preset position condition when the position data does not satisfy the preset position condition, until adjusted position data satisfying the preset position condition is obtained, and allow the height data to be obtained based on the adjusted position data.

[0144] Optionally, in one embodiment of the present application, the first obtaining module 100 comprises: a first obtaining unit, a first determining unit, a second determining unit and a third determining unit.

[0145] The first obtaining unit is configured to obtain initial height data of the component at the measurement point.

[0146] The first determining unit is configured to determine a neighborhood radius of the measurement point based on the measurement point and the component.

[0147] The second determining unit is configured to determine neighborhood height data of the measurement point in the neighborhood radius based on the neighborhood radius.

[0148] The third determining unit is configured to determine median data of the neighborhood height data and the initial height data based on the neighborhood height data and the initial height data, and obtain the height data according to the median data.

[0149] Optionally, in one embodiment of the present application, the calculation formula of the height data can be but is not limited to:

[0150] ,

[0151] wherein, is the neighborhood radius, is the coordinate of the measurement point in the neighborhood radius, is the initial height data of the measurement point, is the median operation.

[0152] Optionally, in one embodiment of the present application, further comprising: a second determining module, a third determining module and a first constructing module.

[0153] The second determining module is configured to determine initial working height data of the cleaning device based on the target height data before the height data, the cleaning start point and the cleaning end point are input into the pre-constructed cleaning path model.

[0154] The third determining module is configured to determine safety working height data corresponding to the cleaning device based on different components.

[0155] The first constructing module is configured to calculate target cleaning height of the cleaning device based on the initial working height data, the safety working height data and the target height data, so as to construct the cleaning path model by using the target cleaning height.

[0156] Optionally, in an embodiment of the present application, the expression of the target cleaning height can be but is not limited to:

[0157]

[0158] wherein, is the initial working height data, is the safety working height data.

[0159] Optionally, in an embodiment of the present application, the fourth obtaining module, the fourth determining module and the second constructing module are further included.

[0160] The fourth obtaining module is configured to obtain a path direction according to the target cleaning start point and the target cleaning end point before the height data, the cleaning start point and the cleaning end point are input into the pre-constructed cleaning path model.

[0161] The fourth determining module is configured to determine a target step length based on the target cleaning start point, the target cleaning end point and the path direction.

[0162] The second constructing module is configured to determine at least one target cleaning path point based on the target cleaning start point, the target cleaning end point and the target step length, so as to construct the cleaning path model by using the target cleaning path point.

[0163] Optionally, in an embodiment of the present application, the second constructing module includes the fourth determining unit, the generating unit and the fifth determining unit.

[0164] The fourth determining unit is configured to determine a target adjacent cleaning path point of the target current cleaning path point based on the target current cleaning path point, the target cleaning end point and the target step length.

[0165] The generating unit is configured to fit the target cleaning start point, the target cleaning end point, the target current cleaning path point and the target adjacent cleaning path point, so as to obtain a fitting function between different target cleaning path points between the target cleaning start point and the target cleaning end point.​

[0166] The fifth determining unit is configured to determine the target cleaning path point based on the target cleaning start point, the target cleaning end point, and the fitting function.

[0167] Optionally, in an embodiment of the present application, the second construction module comprises a second acquisition unit and a construction unit.

[0168] The second acquisition unit is configured to acquire a target cleaning height corresponding to the target cleaning path point.

[0169] The construction unit is configured to construct a cleaning path model based on the target cleaning path point and the target cleaning height.

[0170] Optionally, in an embodiment of the present application, the method further comprises a second judgment module, a first cleaning module, and a second cleaning module.

[0171] The second judgment module is configured to, before controlling the cleaning device to respond to the cleaning instruction, judge whether the cleaning device is in a working state based on working information of the cleaning device.

[0172] The first cleaning module is configured to, when the cleaning device is in the working state, allow the cleaning device to execute the cleaning instruction.

[0173] The second cleaning module is configured to, when the cleaning device is not in the working state, adjust the cleaning device based on the working state until the cleaning device in the working state is obtained, and allow the cleaning device in the working state to execute the cleaning instruction.

[0174] Optionally, in an embodiment of the present application, the first acquisition module 100 comprises a judgment unit and a processing unit.

[0175] The judgment unit is configured to judge whether the height data satisfies a preset data condition.

[0176] The processing unit is configured to, when the height data does not satisfy the preset data condition, process the height data until the height data satisfying the preset data condition is obtained.

[0177] Optionally, in an embodiment of the present application, the control module 400 comprises a sixth determining unit, an adjustment unit, and a control unit.

[0178] The sixth determining unit is configured to determine a second cleaning height of the cleaning device at a next cleaning path point based on the cleaning path point and the corresponding cleaning height.

[0179] The adjustment unit is configured to adjust the cleaning device to the next cleaning path point based on the second cleaning height.

[0180] The control unit is configured to clean the circuit board based on the second cleaning height and the next cleaning path point.

[0181] Optionally, in an embodiment of the present application, the expression of the cleaning path model can be, but is not limited to, the following:

[0182] ,

[0183] wherein, is the total number of path points, is the cleaning path point, is the cleaning path point corresponding cleaning height.

[0184] The features of the embodiments of the cleaning device for the circuit board can be referred to the related descriptions of the embodiments of the cleaning method for the circuit board, which will not be repeated here.

[0185] According to the cleaning device for the circuit board provided in the embodiments of the present application, the to-be-cleaned area on the circuit board can be recognized, the height data of the components in the to-be-cleaned area can be obtained, the cleaning starting point and the cleaning ending point of the to-be-cleaned area can be determined, the cleaning path points of the circuit board and the cleaning height corresponding to the cleaning path points can be determined by using the pre-constructed cleaning path model, the corresponding cleaning path can be determined, the cleaning instruction of the cleaning equipment can be generated according to the cleaning path, and thus the circuit board can be cleaned until the cleanliness of the to-be-cleaned area meets a certain cleaning condition. Therefore, the technical problems of high manual cleaning cost, easy product damage, and high product failure rate can be solved, the technical problems of long machine cleaning time, low cleaning quality and efficiency can be solved, the technical effects of automatically recognizing the cleaning area, fully considering the height difference of the components, automatically adjusting the cleaning path, avoiding the collision between the cleaning equipment and the components, reducing the equipment loss risk, greatly reducing the setting time and cleaning time of the cleaning equipment, and improving the cleaning efficiency and quality can be achieved.

[0186] The embodiments of the present application also provide an electronic device, which comprises a memory and a processor, the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any of the above-mentioned cleaning method embodiments for the circuit board.

[0187] The embodiments of the present application also provide a computer readable storage medium, which stores a computer program, wherein the computer program is configured to execute the steps in any of the above-mentioned cleaning method embodiments for the circuit board when running.

[0188] In an example embodiment, the computer readable storage medium described above can include, but is not limited to, a U disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a mobile hard disk, a magnetic disk or an optical disk, and various media that can store computer programs.

[0189] Embodiments of the present application also provide a computer program product, which comprises a computer program, and the computer program, when executed by a processor, implements the steps in any of the circuit board cleaning method embodiments described above.

[0190] Embodiments of the present application also provide another computer program product, which comprises a non-volatile computer readable storage medium, and the non-volatile computer readable storage medium stores a computer program, and the computer program, when executed by a processor, implements the steps in any of the circuit board cleaning method embodiments described above.

[0191] The skilled in the art can further realize that the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be realized in electronic hardware, computer software or a combination of both. In order to clearly illustrate the interchangeability of hardware and software, the components and steps of the examples have been described in the above description in general terms. Whether the functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. The skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0192] The above describes in detail a circuit board cleaning method provided by the present application. The principles and implementation modes of the present application are described by applying specific examples in this paper, and the above description of the examples is only applicable to help understand the method of the present application and its core idea. It should be pointed out that for ordinary skilled in the art, without departing from the principles of the present application, some improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A method of cleaning a circuit board, characterized by, The method comprises the following steps: identifying a to-be-cleaned area on the circuit board and obtaining height data of at least one component in the to-be-cleaned area at at least one measurement point; based on the to-be-cleaned area, determining at least one cleaning starting point and at least one cleaning ending point in the to-be-cleaned area during the cleaning process; inputting the height data, the cleaning starting point and the cleaning ending point into a pre-constructed cleaning path model to output at least one cleaning path point corresponding to the circuit board and a cleaning height corresponding to the cleaning path point, so as to determine at least one cleaning path by using the cleaning path point and the cleaning height; generating a cleaning instruction of a cleaning device according to the cleaning path, and controlling the cleaning device to clean the circuit board in response to the cleaning instruction until the cleanliness of the to-be-cleaned area meets a preset cleaning condition; wherein, before inputting the height data, the cleaning starting point and the cleaning ending point into the pre-constructed cleaning path model, it further comprises: based on at least one target cleaning starting point and at least one target cleaning ending point, obtaining a path direction according to the target cleaning starting point and the target cleaning ending point; based on the target cleaning starting point, the target cleaning ending point and the path direction, determining a target step length; based on the target cleaning starting point, the target cleaning ending point and the target step length, determining at least one target cleaning path point to construct the cleaning path model by using the target cleaning path point; the determination of the at least one target cleaning path point based on the target cleaning starting point, the target cleaning ending point and the target step length comprises: based on a target current cleaning path point, the target cleaning ending point and the target step length, determining a target adjacent cleaning path point of the target current cleaning path point; fitting the target cleaning starting point, the target cleaning ending point, the target current cleaning path point and the target adjacent cleaning path point to obtain a fitting function between different target cleaning path points between the target cleaning starting point and the target cleaning ending point; based on the target cleaning starting point, the target cleaning ending point and the fitting function, determining the target cleaning path point; the construction of the cleaning path model by using the target cleaning path point comprises: obtaining a target cleaning height corresponding to the target cleaning path point; based on the target cleaning path point and the target cleaning height, constructing the cleaning path model.

2. The method of claim 1, wherein, before obtaining the height data of at least one component in the to-be-cleaned area at at least one measurement point, it further comprises: obtaining position data of the circuit board; determining whether the position data meets a preset position condition; if the position data meets the preset position condition, allowing the height data to be obtained; if the position data does not meet the preset position condition, adjusting the position data by using the preset position condition until adjusted position data meeting the preset position condition is obtained, and allowing the height data to be obtained based on the adjusted position data.

3. The method of claim 1, wherein, the obtaining of the height data of at least one component in the to-be-cleaned area at at least one measurement point comprises: obtaining initial height data of the component at the measurement point; determining a neighborhood radius of the corresponding measurement point based on the measurement point and the component; determining neighborhood height data of the measurement points within the neighborhood radius based on the neighborhood radius; determining median data of the neighborhood height data and the initial height data based on the neighborhood height data and the initial height data, and obtaining the height data according to the median data.

4. The method of claim 3, wherein, The calculation formula of the height data is: ， wherein, is a neighborhood radius, is a coordinate of a measurement point within the neighborhood radius, is initial height data for the corresponding measurement point, is a median operation.

5. The method of claim 1, wherein, Before inputting the height data, the cleaning starting point and the cleaning ending point into the pre-constructed cleaning path model, further comprising: determining initial working height data of the cleaning device based on target height data; determining corresponding safe working height data of the cleaning device based on different components; calculating target cleaning height of the cleaning device based on the initial working height data, the safe working height data and the target height data, so as to construct the cleaning path model by using the target cleaning height.

6. The method of claim 5, wherein, The expression of the target cleaning height is: ， wherein, is initial working height data, is safe working height data.

7. The method of claim 1, wherein, Before controlling the cleaning device to respond to the cleaning instruction, further comprising: judging whether the cleaning device is in a working state based on working information of the cleaning device; if the cleaning device is in the working state, allowing the cleaning device to execute the cleaning instruction; if the cleaning device is not in the working state, adjusting the cleaning device based on the working state until the cleaning device in the working state is obtained, and allowing the cleaning device in the working state to execute the cleaning instruction.

8. The method of claim 1, wherein, The obtaining of the height data of at least one component in the to-be-cleaned area at at least one measurement point comprises: judging whether the height data meets a preset data condition; if the height data does not meet the preset data condition, processing the height data until the height data meeting the preset data condition is obtained.

9. The method of claim 1, wherein, The cleaning of the circuit board comprises: determining a second cleaning height of the cleaning device at a next cleaning path point based on the cleaning path point and the corresponding cleaning height; adjusting the cleaning device to the next cleaning path point based on the second cleaning height; cleaning the circuit board based on the second cleaning height and the next cleaning path point.

10. The method of claim 1, wherein, The expression of the cleaning path model is: ， wherein, is the total number of waypoints, is a cleaning waypoint, is a cleaning waypoint the corresponding cleaning height.

11. An electronic device, comprising: comprising: a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the cleaning method of the circuit board according to any one of claims 1-10.

12. A computer readable storage medium having stored thereon a computer program, characterized in that, The program is executed by the processor to implement the cleaning method of the circuit board according to any one of claims 1-10.

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