Disc type motor controller and driving device

Abstract

The invention relates to the field of controllers, in particular to a disc type motor controller and a driving device. The disc type motor controller comprises a heat dissipation mechanism and a power control mechanism. The heat dissipation mechanism comprises a heat dissipation plate, and the outline of the heat dissipation plate is matched with the outline of the motor; a welding table assembly is arranged on one side of the heat dissipation plate so as to be connected with the power control mechanism; heat dissipation protrusions are arranged on the other side of the heat dissipation plate. According to the disc type motor controller provided by the invention, the outline of the heat dissipation plate is matched with the outline of the motor, so that the heat dissipation mechanism can also be set to be in a form of large diameter and small axial size, the size of the motor in the axial direction can be reduced, and the compactness of the assembly of the heat dissipation mechanism and the motor is realized.

Description

Technical Field

[0001] The present application relates to the field of controllers, and in particular to a disc motor controller and a drive device. Background Art

[0002] Axial flux drive motor systems play a key role in improving the driving performance and competitiveness of electric vehicles. Due to their advantages such as high power density, high torque density, high efficiency and good NVH (Noise Vibration Harshness) performance, they have become a hot topic of research in the electric vehicle drive motor system industry.

[0003] Because axial flux drive motors are characterized by a large diameter and small axial dimensions, existing motor controllers are not well-matched axially with these motors, reducing the compactness of their placement on the vehicle. Therefore, designing a motor controller that is well-matched with axial flux drive motors has become an urgent challenge. Summary of the Invention

[0004] The purpose of this application is to provide a disc motor controller and drive device that can be well matched with the axial flux drive motor and improve the compactness of its layout on the vehicle.

[0005] The present application provides a disc motor controller, including a heat dissipation mechanism and a power control mechanism; The heat dissipation mechanism includes a heat dissipation plate, and the contour of the heat dissipation plate is adapted to the contour of the motor; A soldering station assembly is provided on one side of the heat dissipation plate to connect with the power control mechanism; a heat dissipation protrusion is provided on the other side of the heat dissipation plate.

[0006] In the above technical solution, further, the soldering station assembly includes a plurality of first soldering stations and a plurality of second soldering stations; the plurality of first soldering stations are arranged at intervals on a first circumference, and the plurality of second soldering stations are arranged at intervals on a second circumference, the first circumference and the second circumference are concentric circles, and the first soldering stations correspond to the second soldering stations one by one; The power control mechanism includes a plurality of power modules; the upper bridge of the power module is connected to the first soldering station, and the lower bridge of the power module is connected to the corresponding second soldering station.

[0007] In the above technical solution, further, the power control mechanism also includes a detection component; The detection component includes an integrated packaged temperature sensor and an insulation sensor, and the detection component is contoured to the power module; The sensing portion of the temperature sensor is connected to one of the first soldering station and the second soldering station that are opposite to each other, and the insulation sensor is connected to the other one.

[0008] In the above technical solution, further, the plurality of power modules form a first phase module group, a second phase module group and a third phase module group, the first phase module group includes at least one power module, the second phase module group includes at least one power module, and the third phase module group includes at least one power module; There are three detection components, namely, a first phase detection component, a second phase detection component and a third phase detection component; the first phase detection component is located between the first phase module group and the second phase module group; the second phase detection component is located between the second phase module group and the third phase module group; the third phase detection component is located between the third phase module group and the first phase module group.

[0009] In the above technical solution, further, it also includes a conductive component; The conductive assembly includes a first conductive bar, a second conductive bar and a third conductive bar, and the first conductive bar, the second conductive bar and the third conductive bar are all connected to the motor; The first conductive bar is connected to the neutral point of the power module in the first phase module group; the second conductive bar is connected to the neutral point of the power module in the second phase module group; and the third conductive bar is connected to the neutral point of the power module in the third phase module group.

[0010] In the above technical solution, further comprising a circuit board; The circuit board is adapted to the contour of the motor; the circuit board is spaced apart from the heat sink; The power module and the detection component are both provided with pins, and the circuit board is correspondingly provided with connecting holes, and the pins are connected to the connecting holes.

[0011] In the above technical solution, further, the heat dissipation mechanism further includes a flow channel housing; The flow channel housing is disc-shaped, the heat dissipation plate is covered on the opening of the flow channel housing, and the heat dissipation plate and the flow channel housing are surrounded to form a refrigeration cavity, and the heat dissipation protrusion is located in the refrigeration cavity; Cooling liquid flows in the refrigeration cavity, the heat dissipation protrusions are immersed in the cooling liquid, and the heat dissipation protrusions are arranged to form a flow guide structure.

[0012] In the above technical solution, further comprising a busbar film capacitor; The busbar film capacitor is located on a side of the flow channel housing away from the heat sink, and the busbar film capacitor is closely connected to the flow channel housing; The heat dissipation mechanism is provided with a through hole, and the busbar film capacitor passes through the through hole to be electrically connected to the power control mechanism.

[0013] In the above technical solution, further comprising a connecting bar; The connecting bar is located on a side of the heat sink where the soldering station assembly is provided. The connecting bar is connected to the upper bridges of the plurality of power modules and is connected to the positive electrode of the busbar film capacitor.

[0014] The present application also provides a driving device, including the disc motor controller described in the above solution.

[0015] Compared with the prior art, the present invention has the following advantages: The disc motor controller provided in the present application sets the contour of the heat sink to match the contour of the motor, so that the heat dissipation mechanism can also be set to have a large diameter and a small axial size, which can reduce the size in the axial direction of the motor and achieve compact assembly of the heat dissipation mechanism and the motor.

[0016] The present application also provides a driving device, including the disc motor controller described in the above solution. Based on the above analysis, it can be seen that the driving device also has the above beneficial effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 A schematic diagram of the structure of the disc motor controller provided in this application; Figure 2 Schematic diagram of the exploded structure of the disc motor controller provided in this application; Figure 3 A schematic diagram of the arrangement structure of the power control mechanism provided in this application on the heat sink; Figure 4 A schematic diagram of the structure of one side of the heat dissipation plate provided in this application; Figure 5 A schematic diagram of the structure of the other side of the heat sink provided in this application; Figure 6 A schematic diagram of the structure of the temperature sensor provided in this application; Figure 7 A schematic diagram of the structure of the insulation sensor provided in this application; Figure 8This is a schematic diagram of the structure of the copper busbar provided in this application.

[0019] In the figure: 101-heat sink; 102-heat dissipation protrusion; 103-first soldering station; 104-second soldering station; 105-power module; 106-temperature sensor; 107-insulation sensor; 108-PIN needle; 109-U phase module group; 110-V phase module group; 111-W phase module group; 112-first conductive bar; 113-second conductive bar; 114-third conductive bar; 115-circuit board; 116-flow channel shell; 117-busbar film capacitor; 118-plastic-coated positive copper bar; 119-window; 120-conductive component; 121-positive output copper bar; 122-negative output copper bar. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solution of this application in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0021] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0023] Example 1 See also Figures 1 to 8 As shown, the disc motor controller provided by the present application includes a heat dissipation mechanism and a power control mechanism.

[0024] The heat dissipation mechanism includes a heat dissipation plate 101, and the outline of the heat dissipation plate 101 is adapted to the outline of the motor. In this way, the heat dissipation mechanism can also be set to a form with a large diameter and a small axial size, which can reduce the size in the axial direction of the motor and achieve compact assembly of the heat dissipation mechanism and the motor. Specifically, the heat dissipation plate 101 is circular and adapted to the circular outline of the axial flux drive motor. The thickness of the heat dissipation plate 101 can be set between 5mm and 30mm according to actual conditions, and the diameter of the heat dissipation plate 101 can be set between 250-500mm according to actual conditions. The material of the heat dissipation plate 101 can be aluminum alloy, or pure copper with surface treatment such as nickel plating.

[0025] One side of the heat sink 101 is equipped with a soldering pad assembly for connecting to the power control mechanism; the other side of the heat sink 101 is equipped with a heat dissipation protrusion 102. The power control mechanism is directly soldered to the heat sink 101 via the soldering pad assembly, forming a short and efficient heat conduction path that quickly transfers heat to the heat sink 101. The heat dissipation protrusion 102 on the heat sink 101 increases the heat dissipation area, thereby improving convective and radiative heat transfer capabilities and accelerating heat dissipation.

[0026] Optionally, the plurality of heat dissipation protrusions 102 provided on the heat dissipation plate 101 form a fin structure to improve the heat dissipation effect. In a plane parallel to the heat dissipation plate 101, the cross-sectional shape of the heat dissipation protrusion 102 can be set to a circular, elliptical, trapezoidal, triangular or teardrop shape.

[0027] In an optional solution of this embodiment, the soldering station assembly includes multiple first soldering stations 103 and multiple second soldering stations 104; the multiple first soldering stations 103 are arranged at intervals on the first circumference, and the multiple second soldering stations 104 are arranged at intervals on the second circumference, the first circumference and the second circumference are concentric circles, and the first soldering stations 103 and the second soldering stations 104 correspond one to one; the power control mechanism includes multiple power modules 105; the upper bridge of the power module 105 is connected to the first soldering station 103, and the lower bridge of the power module 105 is connected to the corresponding second soldering station 104.

[0028] In this embodiment, if Figure 4 As shown, heat sink 101 is provided with two circles of solder pads, an inner circle and an outer circle. Each circle has 12 evenly distributed solder pads. The inner and outer circle solder pads correspond one to one and are used to connect the upper and lower bridges of power module 105. The centers of the two circles of solder pads are concentric with the center of heat sink 101 to adapt to the circular structure of heat sink 101, thereby achieving a reasonable layout of the heat dissipation modules.

[0029] Specifically, whether the inner ring soldering pads are connected to the upper or lower bridge of power module 105 can be determined based on practical circumstances. For ease of description, the first soldering pad 103 located on the outer ring is connected to the upper bridge of power module 105, while the second soldering pad 104 located on the inner ring is connected to the lower bridge of power module 105. When heat sink 101 is made of aluminum alloy, the surfaces of first soldering pad 103 and second soldering pad 104 are copper-sprayed or silver-plated to facilitate connection with power module 105. Specifically, power module 105 is a single-transistor TPAK device, which offers advantages such as high power density, low on-resistance, excellent thermal performance, and high reliability.

[0030] When connecting a TPAK single-tube device to a soldering station, the substrate on the back of the TPAK device is connected to the top surface of the soldering station. This connection is crucial for heat transfer and requires minimal thermal resistance and a certain degree of connection strength. The connection between the TPAK single-tube device and the soldering station can be achieved through a vacuum formic acid reflow process, using tin foil as solder to form an alloy layer. Alternatively, it can be achieved through sintering processes such as copper sintering and silver sintering.

[0031] In an optional solution of this embodiment, the power control mechanism also includes a detection component; the detection component includes an integrated packaged temperature sensor 106 and an insulation sensor 107, and the detection component is contoured with the power module 105; in the first soldering station 103 and the second soldering station 104 that are relatively arranged, the sensing part of the temperature sensor 106 is connected to one of them, and the insulation sensor 107 is connected to the other.

[0032] In this embodiment, in order to facilitate platform design and manufacturing process, the present application also integrates the temperature sensor 106 of the detection component and the insulation sensor 107 for detecting high-voltage insulation resistance into a TPAK package, but the color is different from that of the power module 105 to facilitate differentiation during production line assembly.

[0033] like Figure 6 As shown, when the detection component is connected to the soldering station component, the copper substrate on the bottom of the temperature sensor 106 is connected to the second soldering station 104 on the inner circle to detect the surface temperature of the second soldering station 104. The principle is to transmit the change in the surface temperature of the second soldering station 104 to the internal detection circuit. The internal detection circuit can be a thermistor voltage divider circuit. The voltage signal is connected to the circuit board 115 through two PIN pins 108. The circuit board 115 is provided with a filtering circuit to transmit the temperature signal to the main control chip.

[0034] like Figure 7As shown, the outer packaging of insulation sensor 107 is similar to that of a TPAK plastic package. The bottom copper substrate of insulation sensor 107 is connected to first soldering pad 103, detecting the insulation resistance between first soldering pad 103 and the high voltage. Because first soldering pad 103 is made of metal and connected to the controller housing, it actually tests the insulation resistance between the high voltage and the controller housing. Insulation sensor 107 has four pins 108, two of which are used to power the internal detection circuit, and the other two are used to draw power from the high voltage and transmit the detection signal, respectively. Insulation sensor 107 is implemented by connecting one pin 108 to the high-voltage module on circuit board 115. The bottom copper substrate is connected to first soldering pad 103. The internal detection circuit calculates the resistance between the high voltage on circuit board 115 and first soldering pad 103. The resistance signal is then transmitted via one pin 108 to the filter circuit on circuit board 115, and finally to the main control chip.

[0035] In an optional solution of this embodiment, multiple power modules 105 form a first phase module group, a second phase module group and a third phase module group, the first phase module group includes at least one power module 105, the second phase module group includes at least one power module 105, and the third phase module group includes at least one power module 105; the number of detection components is three, namely, a first phase detection component, a second phase detection component and a third phase detection component; the first phase detection component is located between the first phase module group and the second phase module group; the second phase detection component is located between the second phase module group and the third phase module group; the third phase detection component is located between the third phase module group and the first phase module group.

[0036] In this embodiment, if Figure 3 As shown, multiple power modules 105 form a three-phase UVW module group. The U-phase module group 109 includes three power modules 105, occupying three first soldering pads 103 and three second soldering pads 104. The V-phase module group 110 includes three power modules 105, occupying three first soldering pads 103 and three second soldering pads 104. The W-phase module group 111 includes three power modules 105, occupying three first soldering pads 103 and three second soldering pads 104. The three-phase power modules 105 are implemented using a parallel TPAK single-transistor (TPAK) solution. The internal switching devices of the power modules 105 can be IGBTs, SiC MOSs, GANMOSs, etc. Within the TPAK single-transistor devices, platform-based design can be achieved by varying the switching device type and the number of switch chips connected in parallel. Selecting switching devices of different withstand voltage ratings can cover electronic control products with bus voltages ranging from 300V to 1000V. By varying the number of switch chips connected in parallel, electronic control products with different power ranges can also be covered, matching motors of different power levels.

[0037] The remaining first soldering station 103 and second soldering station 104 can be used to place temperature sensors 106 and insulation sensors 107. Specifically, a temperature sensor 106 is placed on the second soldering station 104 of each phase to detect temperature. An insulation sensor 107 is placed on the first soldering station 103 of the UW phase to detect the insulation resistance between the positive and negative poles of the high-voltage DC bus and ground. An insulation sensor 107 is placed on the first soldering station 103 of the V phase to detect the insulation resistance between the three-phase motor windings and the stator core.

[0038] In an optional solution of this embodiment, the disc motor controller also includes a conductive component 120; the conductive component 120 includes a first conductive bar 112, a second conductive bar 113 and a third conductive bar 114, and the first conductive bar 112, the second conductive bar 113 and the third conductive bar 114 are all connected to the motor; the first conductive bar 112 is connected to the neutral point of the power module 105 in the first phase module group; the second conductive bar 113 is connected to the neutral point of the power module 105 in the second phase module group; and the third conductive bar 114 is connected to the neutral point of the power module 105 in the third phase module group.

[0039] In this embodiment, specifically Figure 8 As shown, the first conductive bar 112, the second conductive bar 113, and the third conductive bar 114 are three-phase copper bars. Each of the first conductive bar 112, the second conductive bar 113, and the third conductive bar 114 includes an arcuate portion and a straight portion. The arcuate portion is adapted to the first circumference and the second circumference so that the arcuate portion of each conductive bar spans multiple power modules 105 of the same phase, thereby connecting to the neutral point of the power module 105. The straight portion extends radially along the first circumference and the second circumference, with one end of the straight portion connected to the middle of the arcuate portion, and the other end of the straight portion leads to a three-phase line for connection to the motor.

[0040] In an optional solution of this embodiment, the disc motor controller also includes a circuit board 115; the circuit board 115 is adapted to the contour of the motor; the circuit board 115 is spaced apart from the heat sink 101; the power module 105 and the detection component are both provided with pins, and the circuit board 115 is correspondingly provided with connection holes, and the pins are connected to the connection holes.

[0041] In this embodiment, if Figure 1 and Figure 2 As shown, circuit board 115 is specifically a circular printed circuit board 115, integrating a drive circuit and a control circuit. Printed circuit board 115 is provided with small connection holes, through which the pins 108 of the TPAK single-tube device can be inserted, electrically connecting the PCBA to the TPAK single-tube device via tin wave soldering. Similarly, the pins 108 of the temperature sensor 106 and the insulation sensor 107 can be inserted into the corresponding connection holes, electrically connecting the PCBA to the temperature sensor 106 and the insulation sensor 107 via tin wave soldering.

[0042] In an optional solution of this embodiment, the heat dissipation mechanism also includes a flow channel shell 116; the flow channel shell 116 is disc-shaped, the heat dissipation plate 101 covers the opening of the flow channel shell 116, and the heat dissipation plate 101 and the flow channel shell 116 are surrounded to form a refrigeration cavity, and the heat dissipation protrusion 102 is located in the refrigeration cavity; coolant flows in the refrigeration cavity, the heat dissipation protrusion 102 is immersed in the coolant, and the heat dissipation protrusion 102 is arranged to form a guide structure.

[0043] In this embodiment, the heat dissipation protrusion 102 is directly immersed in the coolant, so that heat can be quickly transferred from the heat dissipation protrusion 102 to the coolant, thereby improving the heat dissipation efficiency. Figure 4 As shown, the cross-sectional shape of the heat dissipation protrusion 102 is a teardrop shape, and the teardrop-shaped heat dissipation protrusion 102 is arranged along the flow direction of the coolant, so that the heat dissipation protrusion 102 can play the role of both dissipating heat and reducing flow resistance, thereby accelerating heat dissipation and improving heat dissipation efficiency.

[0044] Example 2 The disk motor controller in the second embodiment is an improvement on the above embodiment. The technical contents disclosed in the above embodiment will not be described repeatedly. The contents disclosed in the above embodiment also belong to the contents disclosed in the second embodiment.

[0045] See also Figure 1 and Figure 2 As shown, in an optional solution of this embodiment, the disc motor controller also includes a busbar film capacitor 117; the busbar film capacitor 117 is located on the side of the flow channel shell 116 away from the heat sink 101, and the busbar film capacitor 117 is fitly connected to the flow channel shell 116; the heat dissipation mechanism is provided with a through hole, and the busbar film capacitor 117 passes through the through hole to be electrically connected to the power control mechanism.

[0046] In this embodiment, the positive and negative output copper bars 121 and 122 of the busbar film capacitor 117 are designed as two cylindrical shapes, one inside and one outside, and pass through a through hole, facilitating connection with the positive and negative electrodes of the inner and outer three-phase power modules 105, respectively. In addition, the upper surface of the busbar film capacitor 117 is configured in a disc shape and is bonded to the back of the flow channel housing 116, enabling direct cooling of the busbar film capacitor 117. The core package of the busbar film capacitor 117 is placed in the circular solid portion at the bottom.

[0047] In an optional solution of this embodiment, the disc motor controller further includes a connection bar; the connection bar is located on the side of the heat sink 101 where the soldering station assembly is provided. The connection bar is connected to the upper bridges of the multiple power modules 105 and the positive electrode of the busbar film capacitor 117. The connection bar is specifically a circular plastic-coated positive copper bar 118, which is used to connect the C electrode of the upper bridge of the three-phase power to the positive electrode of the busbar film capacitor 117. The connection bar is provided with multiple windows 119, through which the PIN pins 108 of the power module 105, the PIN pins 108 of the temperature sensor 106, and the PIN pins 108 of the insulation sensor 107 can pass to connect to the circuit board 115.

[0048] The connections between all copper busbars, including the connection between the CE poles of the single tubes in the upper and lower bridge arms, the connection between the C pole of the TPAK single tube device in the upper bridge arm and the plastic-coated positive copper busbar 118, the connection between the E pole of the lower bridge arm and the negative copper busbar of the busbar film capacitor 117, the connection between the plastic-coated positive copper busbar 118 and the positive copper busbar of the busbar film capacitor 117, and the connection between the three-phase copper busbar and the neutral points of the upper and lower bridge arms, all use laser welding technology.

[0049] Example 3 Embodiment 3 of the present application provides a driving device, including the disc motor controller of any of the above embodiments, and thus has all the beneficial technical effects of the disc motor controller of any of the above embodiments, which will not be repeated here.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application. In addition, those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments means that they are within the scope of the present application and form different embodiments.

Claims

1. A disc motor controller, characterized in that: including a heat dissipation mechanism and a power control mechanism; The heat dissipation mechanism includes a heat dissipation plate, and the contour of the heat dissipation plate is adapted to the contour of the motor; A soldering station assembly is provided on one side of the heat dissipation plate to connect with the power control mechanism; a heat dissipation protrusion is provided on the other side of the heat dissipation plate.

2. The disc motor controller according to claim 1, characterized in that: The soldering station assembly includes a plurality of first soldering stations and a plurality of second soldering stations; the plurality of first soldering stations are arranged at intervals on a first circumference, and the plurality of second soldering stations are arranged at intervals on a second circumference, the first circumference and the second circumference are concentric circles, and the first soldering stations correspond to the second soldering stations one by one; The power control mechanism includes a plurality of power modules; the upper bridge of the power module is connected to the first soldering station, and the lower bridge of the power module is connected to the corresponding second soldering station.

3. The disk motor controller according to claim 2, characterized in that: The power control mechanism also includes a detection component; The detection component includes an integrated packaged temperature sensor and an insulation sensor, and the detection component is contoured to the power module; The sensing portion of the temperature sensor is connected to one of the first soldering station and the second soldering station that are opposite to each other, and the insulation sensor is connected to the other one.

4. The disk motor controller according to claim 3, characterized in that: The plurality of power modules form a first phase module group, a second phase module group, and a third phase module group, wherein the first phase module group includes at least one power module, the second phase module group includes at least one power module, and the third phase module group includes at least one power module; There are three detection components, namely, a first phase detection component, a second phase detection component and a third phase detection component; the first phase detection component is located between the first phase module group and the second phase module group; the second phase detection component is located between the second phase module group and the third phase module group; the third phase detection component is located between the third phase module group and the first phase module group.

5. The disk motor controller according to claim 4, characterized in that: Also included are conductive components; The conductive assembly includes a first conductive bar, a second conductive bar and a third conductive bar, and the first conductive bar, the second conductive bar and the third conductive bar are all connected to the motor; The first conductive bar is connected to the neutral point of the power module in the first phase module group; the second conductive bar is connected to the neutral point of the power module in the second phase module group; and the third conductive bar is connected to the neutral point of the power module in the third phase module group.

6. The disk motor controller according to claim 3, characterized in that: Also includes circuit boards; The circuit board is adapted to the contour of the motor; the circuit board is spaced apart from the heat sink; The power module and the detection component are both provided with pins, and the circuit board is correspondingly provided with connecting holes, and the pins are connected to the connecting holes.

7. The disk motor controller according to claim 2, characterized in that: The heat dissipation mechanism further includes a flow channel housing; The flow channel housing is disc-shaped, the heat dissipation plate is covered on the opening of the flow channel housing, and the heat dissipation plate and the flow channel housing are surrounded to form a refrigeration cavity, and the heat dissipation protrusion is located in the refrigeration cavity; Cooling liquid flows in the refrigeration cavity, the heat dissipation protrusions are immersed in the cooling liquid, and the heat dissipation protrusions are arranged to form a flow guide structure.

8. The disk motor controller according to claim 7, characterized in that: Also includes busbar film capacitors; The busbar film capacitor is located on a side of the flow channel housing away from the heat sink, and the busbar film capacitor is closely connected to the flow channel housing; The heat dissipation mechanism is provided with a through hole, and the busbar film capacitor passes through the through hole to be electrically connected to the power control mechanism.

9. The disk motor controller according to claim 8, characterized in that: Also includes connecting rows; The connecting bar is located on a side of the heat sink where the soldering station assembly is provided. The connecting bar is connected to the upper bridges of the plurality of power modules and is connected to the positive electrode of the busbar film capacitor.

10. A driving device, characterized in that: The utility model comprises a disk motor and a disk motor controller according to any one of claims 1 to 9.

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