Infrared and visible light chip integrated packaging structure and manufacturing method

Abstract

According to the infrared and visible light chip integrated packaging structure and the manufacturing method provided by the invention, the infrared chip and the visible light chip are integrated on the same plane, the micro-channel is arranged between the infrared chip and the visible light chip, the cooling liquid can cool the visible light chip through the micro-channel, and the cooling efficiency is improved. The influence of heat generated in the light sensing process of the visible light chip on the sensitivity of the infrared chip is avoided, meanwhile, the cooling liquid cools the infrared chip through the micro-channel, the temperature rise of the chip can be prevented from being too high, and the service life of the device is prolonged; moreover, the infrared chip and the visible light chip are integrated on the same plane, and the relative coordinates of the infrared chip and the visible light chip are fixed, so that the correction of the imaging effect of the chip can be quickly completed according to a central point deviation value given by factory in subsequent development. In addition, the infrared chip, the visible light chip and the temperature sensing module are integrated, the device size can be reduced, and the cost is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of light detection, and relates to an infrared and visible light chip integrated packaging structure and a manufacturing method. Background Art

[0002] Infrared images and visible light images have advantages and complementarity in information distribution. Combining the unique advantages of visible light images and infrared images can make up for the reduced accuracy brought about by infrared image target detection. Traditional CMOS sensors have limitations under single detector measurement.

[0003] While the stacking and integration of infrared chips and visible light chips has improved image sensors, the complex operating circuits have also led to an increase in chip size, which is not conducive to the integration and miniaturization of devices. In addition, during the chip stacking process, the heat dissipation of the internal chips is difficult to transfer. The inner chips of the stacked structure gradually increase in junction temperature, causing chip failure and affecting the life of the device. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide an infrared and visible light chip integrated packaging structure and a manufacturing method, which is used to solve the problems of high chip junction temperature, short device life and large external dimensions in the image sensor formed by the fusion of infrared and visible light in the prior art.

[0005] To achieve the above-mentioned and other related objectives, the present invention provides a method for manufacturing an integrated package structure of an infrared and visible light chip, comprising the following steps:

[0006] Providing a bottom plate, wherein the bottom plate is provided with an annular micro-channel heat sink mounting groove;

[0007] Providing a microchannel heat sink, installing the microchannel heat sink in the microchannel heat sink installation slot, wherein the microchannel heat sink is provided with a microchannel, and the microchannel is provided with a coolant inlet and a coolant outlet;

[0008] Providing an infrared chip and a visible light chip, and mounting the infrared chip and the visible light chip on the base plate, wherein the microchannel heat sink surrounds the infrared chip and the visible light chip surrounds the microchannel heat sink in a horizontal direction;

[0009] The infrared chip and the visible light chip are electrically connected.

[0010] Optionally, the method of providing a micro-channel heat sink and installing the micro-channel heat sink in the micro-channel heat sink installation slot includes:

[0011] Providing a micro-channel heat sink substrate, and etching the micro-channel heat sink substrate to form a half-channel surface pattern by an etching method;

[0012] The microchannel heat sink substrate with the half-channel surface pattern is installed face-to-face in the microchannel heat sink installation groove, wherein the half-channel patterns that are connected together constitute the microchannel.

[0013] Optionally, the method further includes the following steps:

[0014] A transparent substrate is provided, wherein the transparent substrate is arranged above the base plate, and four substrate dams spaced at a preset distance are provided on a side of the transparent substrate facing the base plate, and the visible light chip and the substrate dams are electrically connected by a wire bonding method, wherein the substrate dams are located at the periphery of the base plate, and a solder pad is provided on a side of the substrate dam away from the transparent substrate, and microchannel buried holes are provided in at least two of the substrate dams, and the microchannel buried hole in at least one of the substrate dams is connected to the coolant inlet, and the microchannel buried hole in at least one of the substrate dams is connected to the coolant outlet.

[0015] Optionally, the method further includes the following steps:

[0016] A semiconductor mainboard is provided, and the soldering pad is soldered to the semiconductor mainboard. A temperature sensing module is provided on the semiconductor mainboard, and the temperature sensing module is used to monitor the temperature of the infrared chip and the visible light chip.

[0017] Optionally, a heat dissipation module is further provided on the semiconductor mainboard, and the heat dissipation module includes a micro water tank and a micro pump, and the micro water tank, the micro pump and the micro channel buried hole are connected through a heat dissipation pipe.

[0018] The present invention also provides an infrared and visible light chip integrated packaging structure, comprising:

[0019] A bottom plate, wherein an annular micro-channel heat sink mounting groove is provided in the bottom plate;

[0020] A microchannel heat sink is installed in the microchannel heat sink installation slot, wherein the microchannel heat sink is provided with a microchannel, and the microchannel is provided with a coolant inlet and a coolant outlet;

[0021] An infrared chip is mounted on the base plate, and in the horizontal direction, the microchannel heat sink surrounds the periphery of the infrared chip;

[0022] A visible light chip is mounted on the base plate. In a horizontal direction, the visible light chip surrounds the periphery of the microchannel heat sink. The infrared chip and the visible light chip are electrically connected.

[0023] Optionally, a transparent substrate is further included, wherein the transparent substrate is arranged above the base plate, and four substrate dams spaced at a preset distance are provided on the side of the transparent substrate facing the base plate, and the visible light chip is electrically connected to the substrate dams, wherein the substrate dams are located on the periphery of the base plate, and a solder pad is provided on the side of the substrate dam away from the transparent substrate, microchannel buried holes are provided in at least two of the substrate dams, the microchannel buried hole in at least one of the substrate dams is connected to the coolant inlet, and the microchannel buried hole in at least one of the substrate dams is connected to the coolant outlet.

[0024] Optionally, a semiconductor mainboard is further included, and the soldering pad is soldered to the semiconductor mainboard, wherein a temperature sensing module is provided on the semiconductor mainboard, and the temperature sensing module is used to monitor the temperature of the infrared chip and the visible light chip.

[0025] Optionally, a heat dissipation module is further provided on the semiconductor mainboard, and the heat dissipation module includes a micro water tank and a micro pump, and the micro water tank, the micro pump and the micro channel buried hole are connected through a heat dissipation pipe.

[0026] Optionally, the material of the microchannel heat sink includes one of silicon, metal or ceramic.

[0027] As described above, in the infrared and visible light chip integrated packaging structure and manufacturing method of the present invention, the infrared chip and the visible light chip are on the same plane, and a microchannel is provided between the infrared chip and the visible light chip. The coolant can cool the visible light chip through the microchannel to prevent the heat generated during the photosensitivity of the visible light chip from affecting the sensitivity of the infrared chip. At the same time, the coolant can cool the infrared chip through the microchannel to prevent the chip temperature from rising too high, thereby improving the service life of the device. Moreover, since the infrared chip and the visible light chip are integrated on the same plane, the relative coordinates of the two are fixed, and subsequent development can quickly complete the correction of the chip imaging effect based on the center point offset value given by the factory. In addition, the infrared chip, visible light chip and temperature sensor module are integrated into one, which can reduce the size of the device and reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Shown is a process flow chart of a method for manufacturing an integrated packaging structure of infrared and visible light chips according to a first embodiment of the present invention.

[0029] Figure 2 Shown is a schematic diagram of providing a base plate in embodiment 1 of the present invention.

[0030] Figure 3 It is a schematic diagram showing the installation of a micro-channel heat sink in a micro-channel heat sink installation groove according to the first embodiment of the present invention.

[0031] Figure 4It is a schematic diagram showing that an infrared chip and a visible light chip are mounted on a base plate according to the first embodiment of the present invention.

[0032] Figure 5 It shows a schematic diagram of the planar layout of the microfluidic channel, infrared chip and visible light chip in the first embodiment of the present invention.

[0033] Figure 6 It shows a schematic diagram of electrically connecting the infrared chip and the visible light chip in the first embodiment of the present invention.

[0034] Figure 7 It is a schematic diagram showing the formation of a glue layer between adjacent chips in the first embodiment of the present invention.

[0035] Figure 8 It is a schematic diagram showing a transparent substrate provided and electrically connecting the visible light chip and the substrate dam in the first embodiment of the present invention.

[0036] Figure 9 It shows a cross-sectional view of a microchannel buried hole provided in a substrate dam in the first embodiment of the present invention.

[0037] Figure 10 A cross-sectional view showing a substrate dam without microchannel buried holes in the first embodiment of the present invention.

[0038] Figure 11 It is a schematic diagram showing a semiconductor motherboard provided in the first embodiment of the present invention and soldering the pads to the semiconductor motherboard.

[0039] Component number description

[0040] 1 bottom plate

[0041] 100 Microchannel heat sink mounting slot

[0042] 101 Grooves

[0043] 2 Microchannel heat sink

[0044] 200 microfluidics

[0045] 201 Coolant inlet

[0046] 202 Coolant outlet

[0047] 3 infrared chips

[0048] 4 Visible light chip

[0049] 5 Bonding wires

[0050] 6 adhesive layer

[0051] 7 Transparent substrate

[0052] 8 substrate dam

[0053] 800 pins

[0054] 801 Microchannel Buried Via

[0055] 9 pads

[0056] 10 Motherboard

[0057] 11 Temperature sensor module

[0058] 12 Micro water tank

[0059] 13 Micro Pump

[0060] 14 heat sink fins

[0061] Steps S1-S4 DETAILED DESCRIPTION

[0062] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0063] See also Figures 1 to 11 It should be noted that the diagrams provided in this embodiment are merely schematic illustrations of the basic concept of the present invention. Therefore, the diagrams only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0064] The idea adopted by the present invention is a comprehensive light-oriented design guiding concept. An integrated packaging structure includes two chip photosensitive areas. The visible light sensing part and the infrared sensing part are in the same plane, adopting a co-planar layout design rather than an overlapping layout.

[0065] Example 1

[0066] This embodiment provides a method for manufacturing an integrated packaging structure of an infrared and visible light chip. Figure 1 , which is a process flow chart of the production method, comprising the following steps:

[0067] S1: Providing a base plate, wherein the base plate is provided with an annular micro-channel heat sink mounting groove;

[0068] S2: providing a micro-channel heat sink, and installing the micro-channel heat sink in the micro-channel heat sink installation slot, wherein the micro-channel heat sink is provided with a micro-channel, and the micro-channel is provided with a coolant inlet and a coolant outlet;

[0069] S3: Providing an infrared chip and a visible light chip, and mounting the infrared chip and the visible light chip on the base plate, wherein the microchannel heat sink surrounds the infrared chip and the visible light chip surrounds the microchannel heat sink in a horizontal direction;

[0070] S4: electrically connecting the infrared chip and the visible light chip.

[0071] First, see Figure 2 , executing step S1: providing a base plate 1, wherein the base plate 1 is provided with an annular micro-channel heat sink mounting groove 100.

[0072] As an example, the base plate 1 is made of ceramic, and the micro-channel heat sink mounting groove 100 is formed by etching, laser drilling or other suitable methods.

[0073] As an example, a groove 101 is provided on the periphery of the micro-channel heat sink installation slot 100 .

[0074] Next, see Figure 3 , execute step S2: provide a microchannel heat sink 2, install the microchannel heat sink 2 in the microchannel heat sink installation groove 100, the microchannel heat sink 2 is provided with a microchannel 200, and the microchannel 200 is provided with a coolant inlet and a coolant outlet.

[0075] As an example, the method of providing the micro-channel heat sink 2 and installing the micro-channel heat sink 2 in the micro-channel heat sink installation groove 100 includes:

[0076] (1) providing a microfluidic heat sink substrate, and etching the microfluidic heat sink substrate to form a half-channel surface pattern using an etching method, wherein the microfluidic heat sink substrate is made of a high thermal conductivity material, such as silicon, metal, or ceramic;

[0077] (2) The microchannel heat sink substrate with the half-channel surface pattern is installed face-to-face in the microchannel heat sink installation groove 100 , wherein the face-to-face half-channel patterns constitute the microchannel 200 .

[0078] Next, see Figure 4 , execute step S3: provide an infrared chip 3 and a visible light chip 4, and install the infrared chip 3 and the visible light chip 4 on the base plate 1. In the horizontal direction, the microchannel heat sink 2 surrounds the periphery of the infrared chip 3, and the visible light chip 4 surrounds the periphery of the microchannel heat sink 2.

[0079] As an example, the infrared chip 3 and the visible light chip 4 are fixed to the base plate 1 by heating and curing the patch. Figure 5 , which is a schematic diagram of the planar layout of the microfluidic channel, infrared chip and visible light chip. The microfluidic channel 200 surrounds the periphery of the infrared chip 3, and the visible light chip 4 surrounds the periphery of the microfluidic channel 200. The microfluidic channel 200 has a cooling liquid inlet 201 and a cooling liquid outlet 202.

[0080] Next, see Figure 6 , execute step S4: electrically connect the infrared chip 3 and the visible light chip 4.

[0081] As an example, the infrared chip 3 and the visible light chip 4 are electrically connected by wire bonding, and the bonding wires 5 are located between the infrared chip 3 and the visible light chip 4 .

[0082] As an example, see Figure 7 After the infrared chip 3 and the visible light chip 4 are electrically connected, epoxy resin glue is injected between adjacent chips and cured to form the glue layer 6. The glue layer 6 protects the microchannel heat sink 2 and the bonding wire 5.

[0083] As an example, see Figure 8 , further comprising the following steps: providing a transparent substrate 7, wherein the transparent substrate 7 is disposed above the base plate 1, and four substrate dams 8 spaced at a preset distance are provided on a side of the transparent substrate 7 facing the base plate 1, and the visible light chip 4 and the substrate dams 8 are electrically connected by a wire bonding method, wherein the substrate dams 8 are located at the periphery of the base plate 1, and a solder pad 9 is provided on a side of the substrate dam 8 away from the transparent substrate 7, and microchannel buried holes are provided in at least two of the substrate dams 8, and the microchannel buried hole in at least one of the substrate dams 8 is connected to the coolant inlet 201, and the microchannel buried hole in at least one of the substrate dams 8 is connected to the coolant outlet 202.

[0084] As an example, an adhesive layer is also provided between the visible light chip 4 and the substrate dam 8 to protect the bonding wires, wherein the adhesive layer extends into the groove 101 to improve the bonding force between the adhesive layer and the base plate 1 .

[0085] As an example, the transparent substrate 7 includes optical glass. The transparent substrate 7 protects the infrared chip 3 and the visible light chip 4 , and infrared light and visible light can pass through the transparent substrate 7 to be detected by the infrared chip 3 and the visible light chip 4 .

[0086] As an example, the material of the substrate dam 8 includes ceramic, and four substrate dams 8 are distributed around the visible light chip 4, wherein two of the substrate dams 8 are provided with microchannel buried holes, and the other two substrate dams 8 are not provided with microchannel buried holes. Figure 9 , showing a cross-sectional view of a microchannel buried via set in a substrate dam, see Figure 10 , showing a cross-sectional view in which no microchannel buried hole is provided in the substrate dam, a conductive hole is provided in the substrate dam 8, a pin 800 is provided in the conductive hole, the pin 800 is electrically connected to the visible light chip 4 through a bonding wire, and the pin 800 is electrically connected to the pad 9; and the microchannel buried hole 801 in one of the substrate dams 8 is connected to the coolant inlet 201, and the microchannel buried hole 801 in the other substrate dam 8 is connected to the coolant outlet 202, and the pin 800 and the microchannel buried hole 801 are used to achieve electrical connection and heat exchange with the outside world.

[0087] As an example, the structure after the transparent substrate 8 is provided is recorded as structure A. Figure 11 , further comprising the following steps: providing a semiconductor mainboard 10, soldering the structure A to the semiconductor mainboard 10 through the soldering pad 9, wherein a temperature sensing module 11 is provided on the semiconductor mainboard 10, and the temperature sensing module 11 is used to detect the temperature inside the chip in real time.

[0088] As an example, after the pad 9 is welded to the semiconductor mainboard 10 , epoxy resin glue is used to perform airtight sealing on the pad 9 and the gap.

[0089] As an example, a heat dissipation module is also provided on the semiconductor mainboard 10, and the heat dissipation module includes a micro water tank 12 and a micro pump 13. The micro water tank 12, the micro pump 13 and the microchannel buried hole 801 are connected through a heat dissipation pipe. When the temperature sensing module 11 detects that the temperature inside the chip is higher than the set threshold, the micro pump 13 is started to allow the coolant to cool the chip, and the micro pump 13 is stopped when the temperature is lower than the set threshold.

[0090] As an example, the heat dissipation module further includes heat dissipation fins 14 , which can further reduce the ambient temperature to cool the chip.

[0091] As described above, in the manufacturing method of the infrared and visible light chip integrated packaging structure of this embodiment, the infrared chip and the visible light chip are on the same plane, and a microchannel is provided between the infrared chip and the visible light chip. The coolant can cool the visible light chip through the microchannel to prevent the heat generated during the photosensitivity of the visible light chip from affecting the sensitivity of the infrared chip. At the same time, the coolant can cool the infrared chip through the microchannel to prevent the chip temperature from rising too high, thereby improving the service life of the device. Moreover, since the infrared chip and the visible light chip are integrated on the same plane, the relative coordinates of the two are fixed, and subsequent development can quickly complete the correction of the chip imaging effect based on the center point offset value given by the factory. In addition, the infrared chip, visible light chip and temperature sensor module are integrated into one, which can reduce the size of the device and reduce costs.

[0092] Example 2

[0093] This embodiment provides an infrared and visible light chip integrated packaging structure, which can be manufactured by the method for manufacturing the infrared and visible light chip integrated packaging structure described in the first embodiment.

[0094] See also Figure 5 and Figure 7 The infrared and visible light chip integrated packaging structure includes a base plate 1, a microchannel heat sink 2, an infrared chip 3 and a visible light chip 4, wherein the base plate 1 is provided with an annular microchannel heat sink mounting groove; the microchannel heat sink 2 is installed in the microchannel heat sink mounting groove, and a microchannel 200 is provided in the microchannel heat sink 2, and the microchannel 200 is provided with a coolant inlet 201 and a coolant outlet 202; the infrared chip 3 is installed on the base plate 1, and in the horizontal direction, the microchannel heat sink 2 surrounds the periphery of the infrared chip 3; the visible light chip 4 is installed on the base plate 1, and in the horizontal direction, the visible light chip 4 surrounds the periphery of the microchannel heat sink 2, wherein the infrared chip 3 and the visible light chip 4 are electrically connected.

[0095] As an example, the base plate 1 is made of ceramic, and the microchannel heat sink 2 is made of a material with high thermal conductivity, such as silicon, metal, or ceramic.

[0096] As an example, the infrared chip 3 and the visible light chip 4 are fixed to the base plate 1 by heating and curing the patch, and the infrared chip 3 and the visible light chip 4 are electrically connected through bonding wires 5, wherein an adhesive layer 6 is provided between the infrared chip 3 and the visible light chip 4, and the adhesive layer 6 protects the microchannel heat sink 2 and the bonding wires 5.

[0097] As an example, see Figure 8 、 Figure 9 and Figure 10, further comprising a transparent substrate 7, wherein the transparent substrate 7 is arranged above the base plate 1, and four substrate dams 8 spaced at a preset distance are provided on the side of the transparent substrate 7 facing the base plate 1, and the infrared chip 3 and the substrate dams 8 are electrically connected through bonding wires, wherein the substrate dams 8 are located at the periphery of the base plate 1, and a solder pad 9 is provided on the side of the substrate dam 8 away from the transparent substrate 7, and microchannel buried holes 801 are provided in at least two of the substrate dams 8, and the microchannel buried hole 801 in at least one of the substrate dams 8 is connected to the coolant inlet 201, and the microchannel buried hole 801 in at least one of the substrate dams 8 is connected to the coolant outlet 202.

[0098] As an example, the transparent substrate 7 comprises optical glass. The transparent substrate 7 protects the infrared chip 3 and the visible light chip 4, and visible light and infrared light can pass through the transparent substrate 7 and be detected by the infrared chip 3 and the visible light chip 4. An inert gas or vacuum is introduced between the transparent substrate 7 and the chip layer to prevent impurities in the air from falling onto the chip and affecting detection accuracy.

[0099] As an example, the substrate dams 8 are made of ceramic, and four of the substrate dams 8 are distributed around the visible light chip 4. Two of the substrate dams 8 are provided with buried microchannel vias 801, while the other two are not. The substrate dams 8 are provided with vias, each of which contains pins 800. The pins 800 are electrically connected to the infrared chip 4 via bonding wires, and the pins 800 are electrically connected to the pads 9. The buried microchannel vias 801 in one substrate dam 8 are connected to the coolant inlet 201, while the buried microchannel vias 801 in another substrate dam 8 are connected to the coolant outlet 202. The pins 800 and buried microchannel vias 801 are used to achieve electrical connection and heat exchange with the outside world.

[0100] As an example, the structure after the transparent substrate 8 is provided is recorded as structure A. Figure 11 , also includes a semiconductor mainboard 10, structure A is soldered to the semiconductor mainboard 10 through the soldering pad 9, wherein a temperature sensing module 11 is provided on the semiconductor mainboard 10, and the temperature sensing module 11 is used to detect the temperature inside the chip in real time.

[0101] As an example, a heat dissipation module is also provided on the semiconductor mainboard 10, and the heat dissipation module includes a micro water tank 12 and a micro pump 13. The micro water tank 12, the micro pump 13 and the microchannel buried hole 801 are connected through a heat dissipation pipe. When the temperature sensing module 11 detects that the temperature inside the chip is higher than the set threshold, the micro pump 13 is started to allow the coolant to cool the chip, and the micro pump 13 is stopped when the temperature is lower than the set threshold.

[0102] As an example, the heat dissipation module further includes heat dissipation fins 14 , which can further reduce the ambient temperature to cool the chip.

[0103] In summary, in the infrared and visible light chip integrated packaging structure and manufacturing method of the present invention, the infrared chip and the visible light chip are on the same plane, and a microchannel is provided between the infrared chip and the visible light chip. The coolant can cool the visible light chip through the microchannel to prevent the heat generated during the photosensitivity of the visible light chip from affecting the sensitivity of the infrared chip. At the same time, the coolant can cool the infrared chip through the microchannel to prevent the chip temperature from rising too high, thereby increasing the service life of the device. Moreover, since the infrared chip and the visible light chip are integrated on the same plane, the relative coordinates of the two are fixed. Subsequent development can quickly complete the correction of the chip imaging effect based on the center point offset value given by the factory. In addition, the infrared chip, the visible light chip and the temperature sensor module are integrated into one, which can reduce the device size and reduce costs. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has high industrial utilization value.

[0104] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A method for manufacturing an integrated packaging structure of an infrared and visible light chip, characterized in that: The following steps are involved: Providing a bottom plate, wherein the bottom plate is provided with an annular micro-channel heat sink mounting groove; Providing a microchannel heat sink, installing the microchannel heat sink in the microchannel heat sink installation slot, wherein the microchannel heat sink is provided with a microchannel, and the microchannel is provided with a coolant inlet and a coolant outlet; Providing an infrared chip and a visible light chip, and mounting the infrared chip and the visible light chip on the base plate, wherein the microchannel heat sink surrounds the infrared chip and the visible light chip surrounds the microchannel heat sink in a horizontal direction; The infrared chip and the visible light chip are electrically connected.

2. The method for manufacturing an integrated package structure of infrared and visible light chips according to claim 1, characterized in that: The method of providing a micro-channel heat sink and installing the micro-channel heat sink in the micro-channel heat sink installation groove includes: Providing a micro-channel heat sink substrate, and etching the micro-channel heat sink substrate to form a half-channel surface pattern by an etching method; The microchannel heat sink substrate with the half-channel surface pattern is installed face-to-face in the microchannel heat sink installation groove, wherein the half-channel patterns that are connected together constitute the microchannel.

3. The method for manufacturing an integrated package structure of infrared and visible light chips according to claim 1, characterized in that: The following steps are also included: A transparent substrate is provided, wherein the transparent substrate is arranged above the base plate, and four substrate dams spaced at a preset distance are provided on a side of the transparent substrate facing the base plate, and the visible light chip and the substrate dams are electrically connected by a wire bonding method, wherein the substrate dams are located at the periphery of the base plate, and a solder pad is provided on a side of the substrate dam away from the transparent substrate, and microchannel buried holes are provided in at least two of the substrate dams, and the microchannel buried hole in at least one of the substrate dams is connected to the coolant inlet, and the microchannel buried hole in at least one of the substrate dams is connected to the coolant outlet.

4. The method for manufacturing an integrated package structure of infrared and visible light chips according to claim 3, characterized in that: The following steps are also included: A semiconductor mainboard is provided, and the soldering pad is soldered to the semiconductor mainboard. A temperature sensing module is provided on the semiconductor mainboard, and the temperature sensing module is used to monitor the temperature of the infrared chip and the visible light chip.

5. The method for manufacturing the infrared and visible light chip integrated packaging structure according to claim 4, characterized in that: The semiconductor mainboard is further provided with a heat dissipation module, which includes a micro water tank and a micro pump. The micro water tank, the micro pump and the micro channel buried hole are connected through a heat dissipation pipe.

6. An infrared and visible light chip integrated packaging structure, characterized in that: include: A bottom plate, wherein an annular micro-channel heat sink mounting groove is provided in the bottom plate; A microchannel heat sink is installed in the microchannel heat sink installation slot, wherein the microchannel heat sink is provided with a microchannel, and the microchannel is provided with a coolant inlet and a coolant outlet; An infrared chip is mounted on the base plate, and in the horizontal direction, the microchannel heat sink surrounds the periphery of the infrared chip; A visible light chip is mounted on the base plate. In a horizontal direction, the visible light chip surrounds the periphery of the microchannel heat sink. The infrared chip and the visible light chip are electrically connected.

7. The infrared and visible light chip integrated packaging structure according to claim 6, characterized in that: It also includes a transparent substrate, which is arranged above the base plate, and four substrate dams spaced at a preset distance are provided on the side of the transparent substrate facing the base plate, and the visible light chip is electrically connected to the substrate dams, wherein the substrate dams are located on the periphery of the base plate, and a solder pad is provided on the side of the substrate dam away from the transparent substrate, at least two of the substrate dams are provided with microchannel buried holes, the microchannel buried hole in at least one of the substrate dams is connected to the coolant inlet, and the microchannel buried hole in at least one of the substrate dams is connected to the coolant outlet.

8. The infrared and visible light chip integrated packaging structure according to claim 7, characterized in that: It also includes a semiconductor mainboard, the soldering pad is soldered to the semiconductor mainboard, wherein a temperature sensing module is provided on the semiconductor mainboard, and the temperature sensing module is used to monitor the temperature of the infrared chip and the visible light chip.

9. The infrared and visible light chip integrated packaging structure according to claim 8, characterized in that: The semiconductor mainboard is further provided with a heat dissipation module, which includes a micro water tank and a micro pump. The micro water tank, the micro pump and the micro channel buried hole are connected through a heat dissipation pipe.

10. The infrared and visible light chip integrated packaging structure according to claim 6, characterized in that: The material of the micro-channel heat sink includes one of silicon, metal or ceramic.

Images