Method and apparatus for manufacturing a component carrier

Abstract

A method and apparatus for manufacturing a component carrier is described, the method comprising: i) providing a liquid medium (130) having a specific translucency index such that a beam (120) of electromagnetic radiation having a specific wavelength can pass through the liquid medium (130); ii) immersing the component carrier preform (110) in the liquid medium (130) such that the component carrier preform (110) is at least partially covered by the liquid medium (130); and iii) removing the material of the immersed component carrier preform (110) by means of a beam of electromagnetic radiation (120), the beam of electromagnetic radiation (120) passing through the liquid medium (130) prior to contact with the immersed component carrier preform (110) for removing the material.

Description

Technical Field

[0001] The present invention relates to a method for producing a component carrier, comprising removing material from a component carrier preform immersed in a liquid medium by means of an electromagnetic radiation beam, wherein the electromagnetic radiation beam passes through the liquid medium before coming into contact with the immersed component carrier preform for the purpose of removing the material. The invention also relates to an apparatus for carrying out this method.

[0002] Thus, the present invention may relate to the technical field of component carriers, such as printed circuit boards or IC substrates, and their manufacture. Background Art

[0003] Against the backdrop of the ever-increasing product functionality of component carriers equipped with one or more electronic components, the increasing miniaturization of such electronic components, and the ever-increasing number of electronic components to be mounted on component carriers, such as printed circuit boards, increasingly powerful array-like components or packages are being used, comprising a plurality of electronic components, with a plurality of contacts or connections, wherein the spacing between these contacts is increasingly smaller. The removal of heat generated by these electronic components and the component carriers themselves during operation is becoming an increasingly important issue. Furthermore, the effective prevention of electromagnetic interference (EMI) is becoming an increasingly important issue. At the same time, component carriers should be mechanically robust and electrically reliable in order to be able to operate even under adverse conditions.

[0004] When manufacturing a component carrier, the component carrier preform has to be processed, wherein the processing may include removing material from the component carrier preform in order to form, for example, cavities, grooves or holes.

[0005] Figure 2 This conventional process for removing material from a component carrier preform 210 is shown. The component carrier preform 210 is mounted on a support structure 231, which is further arranged on a machine table 232. A laser head 221 is arranged on top of the component carrier preform 210 to provide a laser beam 220 to the surface of the component carrier preform 210. The laser beam 220 is thus configured to remove material from the component carrier preform 210 (e.g., to form a hole, groove, or cavity). However, it can be seen that during the material removal process, a large amount of debris 161 is generated. This debris 161 may be ejected onto delicate surfaces of the component carrier preform 210 (e.g., traces, pads, ink, etc.), thereby causing undesirable contamination and damage to such delicate surfaces of the component carrier preform 210.

[0006] Therefore, a protective device is needed to protect the component carrier preform during production. For this purpose, a protective film such as polyester film is usually used. In a conventional example, the following steps may be necessary:

[0007] i) laminating a polyester film to the surface of the component carrier preform 210,

[0008] ii) transferring the component carrier preform 210 for laser processing,

[0009] iii) loading fixture,

[0010] iv) loading the component carrier preform onto the fixture,

[0011] v) start of laser material removal,

[0012] vi) unloading the processed component carrier preforms,

[0013] vii) removing / peeling off the polyester film,

[0014] viii) Furthermore, the component carrier preform is transferred to a next processing station, such as high-pressure washing (HPR), in order to remove debris remaining on the surface of the component carrier preform 210 .

[0015] The polyester film prevents, for example, carbon splatter from getting onto the component carrier preform surfaces (particularly the copper trace / pad / ink surfaces).

[0016] However, the protective film incurs additional costs and effort. In addition, it may happen that the polyester film cannot be completely removed, resulting in disadvantages such as loss of production and clogging of the filtration system. Summary of the Invention

[0017] It may be desirable to remove material from a component carrier under manufacture in an efficient and reliable manner.

[0018] A method and apparatus are described.

[0019] According to a first aspect of the invention, a method for producing a component carrier is described, the method comprising:

[0020] i) providing a liquid medium (e.g., a solvent such as deionized water) having a specific translucency index, such that an electromagnetic radiation beam (e.g., a laser beam) having a specific wavelength can pass through the liquid medium;

[0021] ii) immersing a component carrier preform (eg a panel) in said liquid medium such that the component carrier preform is at least partially covered (in particular completely covered) by the liquid medium; and

[0022] iii) Removing material (e.g. drilling, cutting) of the immersed component carrier preform by (using) an electromagnetic radiation beam, wherein the electromagnetic radiation beam passes through a liquid medium before coming into contact with the immersed component carrier preform (surface) for material removal.

[0023] According to a second aspect of the invention, a device for producing a component carrier is described, comprising:

[0024] i) an electromagnetic beam device (e.g. a laser head) configured to provide a beam of electromagnetic radiation having a specific wavelength; and

[0025] ii) a receiving device (eg a fixture and / or a bath) configured to receive the component carrier preform and to flow / receive the liquid medium such that the liquid medium is immersed in the component carrier preform.

[0026] The apparatus is configured to remove material from the immersed component carrier preform by means of the electromagnetic radiation beam device, such that the electromagnetic radiation beam passes through the liquid medium before coming into contact with the immersed component carrier preform.

[0027] In this context, the term "component carrier" can refer to both the final component carrier product and a component carrier preform (e.g., a component carrier in production, in other words, a semi-finished product). In an example, a component carrier preform can be a panel consisting of multiple semi-finished component carriers manufactured together. At the final stage, the panel can be divided into multiple final component carrier products.

[0028] In an embodiment, the component carrier "stack" comprises at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier can be a laminate of the mentioned electrically insulating layer structure and the electrically conductive layer structure, in particular formed by applying mechanical pressure and / or heat energy. The mentioned stack can provide a plate-like component carrier that can provide a large mounting surface for further components. In an example, the stack can still be very thin and compact. In another example, for high-density products, the stack can be very thick. The stacking direction (height / thickness) can be arranged in the vertical direction z. In addition, the stacking direction can be perpendicular to both directions of the main extension (along x and y) of the (plate-like) component carrier.

[0029] In one example, all layers of a component carrier may form a stack. In another example, only a portion of the layers of a component carrier may form a stack. In this document, the term "layer structure" may particularly refer to a continuous or discontinuous layer (or separate islands within the same plane) of electrically conductive and / or electrically insulating material. A plurality of such layers stacked parallel to one another may form a stack in the vertical direction.

[0030] In this context, the term "translucency index" (or translucency performance, translucency characteristic) can refer to a measure of the translucency of a material. The concept of translucency can be related to how much electromagnetic radiation, particularly light, can be measured to pass through a material. Therefore, the material can be neither completely transparent nor completely opaque. In specific embodiments, the translucency index can also include transparent materials. In an example, the translucency index can refer to the absorption of a material, where the material can absorb less than 20% of the energy and / or intensity of an applied electromagnetic wave or light.

[0031] In the present context, the term "receiving device" may refer to a device that is suitable for accommodating a component carrier preform. For example, the component carrier preform can be placed and / or attached in the receiving device. The receiving device can also be configured to accommodate a liquid medium, for example as a bath. In an example, the receiving device can be filled with a liquid medium and the component carrier preform can be immersed in the liquid medium in the receiving device. The receiving device may include an inlet / outlet for the liquid medium to flow. In an example, the receiving device is arranged / mounted on a mounting device (e.g. a machine workbench). In an example, the receiving device can be arranged on a supporting structure (e.g. a fixture table). In another example, the supporting structure can be part of the receiving device.

[0032] According to exemplary embodiments, the present invention may be based on the concept that material can be removed from a component carrier under production in an efficient and reliable manner when the component carrier preform is at least partially immersed in a liquid medium, in particular covered by the liquid medium. The material removal can be performed by an electromagnetic radiation beam, preferably a laser beam, which passes through the liquid medium before contacting and interacting with the surface of the component carrier preform.

[0033] In this way, the liquid medium can protect the surface of the component carrier preform (particularly the metal traces / pads) from the effects of material removal debris such as carbon and / or metal (oxide) particles and dust. The wavelength of the electromagnetic radiation beam and the translucency index of the liquid medium are selected so that the electromagnetic radiation beam can pass through the liquid medium (substantially without interaction) and then remove material from the protected component carrier preform below.

[0034] By protecting the component carrier preform with a liquid medium during material removal, protective films such as polyester films become obsolete, saving costs and effort. Furthermore, defects during the manufacturing process (caused by incomplete removal of the PET film) can be avoided, thereby improving the quality of the component carrier.

[0035] In embodiments, the component carrier preform can be further protected, for example, by an inorganic (e.g., glass) cover on top of the liquid medium. A loop circulation system can further process (e.g., filter) the used liquid medium to remove debris and reuse it for immersion. Furthermore, the looped liquid medium can aid in cooling the component carrier preform during the material removal process. The described method can be directly implemented into existing production lines.

[0036] Exemplary embodiments

[0037] In embodiments, removing material includes at least one of cutting, etching, forming a cavity, forming a through-connection, forming a groove, laser drilling, and laser ablation. Thus, removing material can be used to achieve a variety of technically and economically important component carrier features. For example, material can be removed to form (blind / through holes), cavities, roughened surfaces, grooves, or recesses.

[0038] In one embodiment, the liquid medium covers the component carrier preform along the corresponding planar extension. For example, the liquid medium covers the (upper) main surface of the component carrier preform. Additionally or alternatively, the liquid medium covers the side walls of the component carrier preform. This provides reliable protection.

[0039] In the context of the present application, the term "main surface" of a body may particularly denote one of the two largest opposing surfaces of the body. The main surfaces may be connected by a circumferential sidewall. The thickness of a body, such as a stack, may be defined by the distance between the two opposing main surfaces.

[0040] In embodiments, the liquid medium covers the component carrier preform to a defined constant thickness. In other words, the thickness of the liquid medium (layer) on top of the component carrier preform can be (substantially) the same even at different locations on the component carrier preform (surface). In embodiments, the liquid medium has a constant translucency index. By maintaining a constant thickness of the liquid medium, a reliable and constant translucency index can be provided, thereby enabling efficient material removal. In an example, the constant thickness of the liquid medium can be 1 mm or greater, in particular 1 cm or greater.

[0041] In one embodiment, the method further comprises evaluating the translucency index of the liquid medium, in particular, evaluating the translucency index of the liquid medium before / during the step of immersing the component carrier preform in the liquid medium. Evaluation can include, for example, monitoring and / or measuring. In one example, the consistency of the thickness and / or translucency index of the liquid medium can be evaluated. This ensures that the electromagnetic radiation beam can effectively penetrate the liquid medium and controls the accuracy of material removal.

[0042] In one embodiment, the material removal is performed without a protective film, particularly a polyester film, applied to the component carrier preform. As mentioned above, applying such a film can result in additional work, while incomplete film removal can reduce the performance / manufacturing of the component carrier, as film debris can remain on the component carrier surface after stripping and potentially cause undesirable contamination. Therefore, performing the (complete) material removal without an additional protective film can significantly improve efficiency and quality. In particular, all manufacturing steps associated with lamination and removal of the protective film can become obsolete.

[0043] In an embodiment, the method further comprises providing a cover layer structure having a specific transparency index on top of the liquid medium, such that the electromagnetic radiation beam having a specific wavelength can pass through the cover layer structure before passing through the liquid medium. Such an additional cover layer (structure) can provide the advantage of creating an additional layer of protection from propagating debris and the external environment (the electromagnetic radiation beam can (substantially) pass through this protection layer without interaction), thereby improving reliability. In addition, the cover layer can maintain a constant thickness of the liquid medium (see above).

[0044] In one example, the covering layer can be formed as a (planar) layer. In another example, the covering layer can be formed as a cover (a semi-box-shaped member) that can also at least partially cover the side walls of the component carrier being manufactured. For example, the covering layer can be placed on the component carrier preform (on the supporting structure) and prevent the liquid medium from escaping. In other words, the covering layer can serve to define / contain the liquid medium.

[0045] In an embodiment, the cover structure comprises an inorganic material. In particular, the inorganic cover structure comprises glass, particularly quartz glass. This offers the advantage of allowing the direct application of practical and inexpensive materials. For example, glass may be particularly suitable for this application due to its translucency, allowing, for example, a laser beam to pass through. Alternatively, the cover structure comprises an organic material, particularly a polymeric organic material, such as at least one of polyethylene, poly(meth)acrylate, and PTFE.

[0046] In an embodiment, the cover structure is configured to maintain a constant thickness of the liquid medium (see discussion above). Additionally or alternatively, the cover structure may reduce or prevent evaporation of the liquid medium.

[0047] In an embodiment, the cover structure is arranged on top of the liquid medium so that the immersed component carrier preform is protected from debris generated by the material removal. This can provide the advantage of providing additional protection (a further level of safety) in a simple manner. In particular, the combination of additional protection and maintaining a constant thickness of the liquid medium can be particularly advantageous.

[0048] In an embodiment, the method further comprises: flowing the liquid medium along the component carrier preform to remove debris generated by the material removal. In an embodiment, the method further comprises: flowing the liquid medium along the diagonal direction of the component carrier preform to remove debris generated by the material removal, so that maximum (physical) contact can be achieved between the liquid medium and the surface of the component carrier preform, thereby further improving the efficiency of the material removal. Although in one embodiment, the liquid medium can remain in place (static) during the material removal process, in another embodiment, the liquid medium can (actively) flow (dynamically) through the receiving device (e.g., from the inlet to the outlet). This can provide the advantage that debris collected by the liquid medium can be removed and the liquid medium is no longer free of debris.

[0049] In an embodiment, the method further comprises cooling the heat generated by material removal from (the surface of) the component carrier (preform). Material removal (e.g., by a laser beam) can generate significant amounts of heat, ultimately leading to damage. Therefore, cooling the hot locations / surfaces with a liquid medium, which is present regardless of the application being described, can be particularly advantageous.

[0050] In embodiments, the liquid medium comprises water, particularly deionized water, and more particularly ultrapure water. This can provide the advantage of allowing direct application of practical and inexpensive materials. For example, water may be particularly suitable for this application due to its translucency index, thereby allowing, for example, a laser beam to pass through. Alternatively, other liquids or liquid mixtures having a suitable specific translucency index, such as ethanol or octane, may be used.

[0051] In an embodiment, the component carrier preform is at least partially housed in a support structure, in particular a fixture. This allows the component carrier preform to be effectively held in place (by suitable fixation) during material removal. Fixation can be achieved, for example, by means of a mechanical fixture, a clamp, or a flexible pad. In an embodiment, the (flowing) liquid medium contacts the support structure. Thus, the support structure can serve as a bath for the liquid medium. The support structure can be part of the housing device or a separate structure associated with the housing device.

[0052] In an embodiment, the method further comprises, after the material removal, the step of exposing the component carrier preform to the liquid medium. This can be done, for example, by allowing the liquid medium to flow away (e.g., via an outlet controlled by a valve (e.g., an air knife)) or by waiting until the liquid medium has evaporated. In an embodiment, the method further comprises, after the material removal, the step of flowing a gaseous medium (e.g., air, preferably cold / dry air) along the component carrier preform. This allows (further) cleaning of the component carrier preform (by removing debris resulting from the material removal). Additionally or alternatively, the gaseous medium can dry the component carrier preform, for example, by removing residues of the liquid medium.

[0053] In an embodiment, the gaseous medium comprises air, in particular cold air and / or dry air. Thus, a further cleaning and / or drying effect can be achieved in a cost-effective manner.

[0054] In an embodiment, the method further comprises: treating debris generated by the material removal from the gaseous medium and / or the liquid medium, in particular filtering the debris generated by the material removal from the gaseous medium and / or the liquid medium. Thus, the debris can be removed (e.g., to a debris tank), and the medium liquid and / or gaseous medium can be treated and ultimately circulated, for example, in a (closed) circuit between an inlet and an outlet of the receiving device.

[0055] In one embodiment, the method further comprises, after purification, in particular filtration, recirculating the gaseous medium and / or the filtered liquid medium along the component carrier preform. This can have the advantage of making the entire method more cost- and / or material-efficient, thereby saving natural resources.

[0056] In embodiments, the liquid medium and / or the gaseous medium is kept in a loop. This offers the advantage of an environmentally friendly circulation. Furthermore, material costs can be saved. In one example, a large number of component carrier preforms can be processed in a system, making continuous circulation of the medium particularly cost-effective.

[0057] In an embodiment, the debris generated by removing the material includes at least one of carbon, metal, metal oxides (particles and / or dust).Such debris may be typical for component carrier manufacturing and may be effectively removed by the described method.

[0058] In an embodiment, the method further comprises storing the removed debris in a debris trough.If the removed debris is not stored, the material will be in the environment, particularly in the air, thereby harming humans and / or animals.

[0059] In an embodiment, the component carrier preform comprises a stack having at least one electrically insulating layer structure and / or at least one electrically conductive layer structure.Thus, technically and economically important architectures (see further definitions below) can be directly applied.

[0060] In an embodiment, the component carrier preform is completely covered by the liquid medium during the material removal process. This can increase the reliability of the component carrier preform and thus reduce scrap.

[0061] In an embodiment, the method further comprises: fixing the component carrier preform to the support structure. Thereby, the process can be more reliable / safe. Additionally or alternatively, the component carrier preform can be kept in place and the application of the electromagnetic radiation beam can be more precise.

[0062] In an embodiment, the method further comprises: removing bubbles from the liquid medium, in particular, using a pre-vacuum to remove bubbles from the liquid medium. A bubble-free liquid medium can result in a more precise material removal process. The bubble removal step can be performed before the liquid medium is caused to flow / flow through / placed into the receiving device. Alternatively, the bubble removal step can be performed in the receiving device, for example before the component carrier preform is immersed in the liquid medium. Furthermore, the bubble removal step can be performed together with filtering the liquid medium after the liquid medium has passed through the surface of the component carrier preform. In an example, the term "pre-vacuum" can refer to an environment in which the bubble removal step can be performed before the liquid medium is caused to flow / flow through / placed into the receiving device.

[0063] In an embodiment, the electromagnetic radiation beam comprises a laser beam, in particular a green laser beam (eg having a wavelength of 515 nm).Therefore, established and precise measurements from the component carrier manufacturer can be directly applied.

[0064] In an embodiment, the apparatus further comprises: a loop cycle configured to circulate the liquid medium and / or the gaseous medium to perform the purification process (see discussion above and Figure 1 ).

[0065] In an embodiment, the loop circuit comprises at least one of the following features: a chip storage device, a filter, a valve, a pump, a clamp, a mounting device configured to hold / attach a component carrier preform, a (storage) tank, a bubble removal device, a cooling device for cooling the medium, an ion removal device. For example Figure 1 As shown, the liquid medium can flow in a loop between the outlet and the inlet of the receiving device. The flow can be provided by a pump and controlled / regulated by one or more valves. The loop can also include a storage tank, a filter, and a debris tank.

[0066] In an embodiment, a device comprises more than one laser head (eg two laser heads connected in parallel). This may provide the advantage that the productivity of the device may be increased.

[0067] In an embodiment, two or more devices (including, for example, containers, support structures, etc.) are coupled, in particular, in series or in parallel. Thus, a loop can flow from a first device to a second device, and so on. In this way, one loop (e.g., with filters, pumps, valves, etc.) can be used for two or more devices, which can result in a more efficient process and reduced workload.

[0068] In an embodiment, the device includes at least one of the following features:

[0069] a bubble removal device configured to remove bubbles from the liquid medium;

[0070] a cooling device configured to cool the liquid medium;

[0071] an ion removal device configured to maintain a constant conductivity of the liquid medium;

[0072] A drying device, the drying device being configured to dry the gaseous medium;

[0073] a heat exchange device configured to control the temperature of the gaseous medium or remove undesired heat caused by the material removal;

[0074] An oxygen removal device is configured to keep the liquid medium and / or the gaseous medium free of oxygen.

[0075] In one embodiment, the component carrier is formed as a plate. This facilitates a compact design, while still providing a large base for mounting components on the component carrier. Furthermore, bare chips, in particular, as an example of embedded electronic components, can be easily embedded in thin boards such as printed circuit boards due to their low thickness.

[0076] In an embodiment, the component carrier is configured as one of a printed circuit board, a substrate (particularly an IC substrate) and an interposer.

[0077] In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a plate-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, the lamination being performed, for example, by applying pressure and / or by supplying heat. As a preferred material for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures may comprise, for example, resin and / or fiberglass, so-called prepregs or FR4 materials. The individual electrically conductive layer structures may be connected to one another in the desired manner by forming holes through the laminate, for example by laser drilling or mechanical drilling, and by partially or completely filling the holes with an electrically conductive material, in particular copper, thereby forming vias or any other through-hole connections. A filled hole connecting the entire stack (a through-hole connection extending through multiple layers or the entire stack) or connecting at least two electrically conductive layers is referred to as a via. Similarly, optical interconnects may be formed through the various layers of the stack to receive an electro-optical circuit board (EOCB). In addition to one or more components that can be embedded in a printed circuit board, a printed circuit board is typically configured to accommodate one or more components on one or both opposing surfaces of the plate-shaped printed circuit board. The one or more components can be connected to the corresponding major surfaces by soldering. The dielectric portion of the PCB may include a resin with reinforcing fibers (such as glass fibers).

[0078] In the context of the present application, the term "substrate" can particularly refer to a small component carrier. Relative to a PCB, a substrate can be a relatively small component carrier on which one or more components can be mounted, and can be used as a connection medium between one or more chips and another PCB. For example, a substrate can have approximately the same size as the components (particularly electronic components) to be mounted on the substrate (for example, in the case of a chip scale package (CSP)). More specifically, a substrate can be understood as a component carrier for electrical connectors or electrical networks and a component carrier for connectors that are comparable to a printed circuit board (PCB) but have a relatively high density of lateral and / or vertical arrangements. Lateral connectors are, for example, conductive paths, while vertical connectors can be, for example, drill holes. These lateral connectors and / or vertical connectors are arranged in the substrate and can be used to provide electrical, thermal, and / or mechanical connections between accommodated components or unaccommodated components (such as bare wafers), particularly IC chips and printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes "IC substrates." The dielectric portion of the substrate may comprise a resin with reinforcing particles such as reinforcing spheres, particularly glass spheres.

[0079] In the context of this application, the term "inorganic layer structure" may particularly denote a layer structure comprising an inorganic material, such as an inorganic compound. In particular, the dielectric material of the inorganic layer structure or even the entire inorganic layer structure may be made solely of inorganic material or at least substantially solely of inorganic material. In another embodiment, the inorganic layer structure may comprise an inorganic dielectric material and an additional dielectric material. The inorganic compound may be a compound lacking carbon-hydrogen bonds or a compound that is not an organic compound. In an example, the inorganic layer structure may comprise glass, such as silicon-based glass, in particular soda-lime glass, and / or borosilicate glass, and / or aluminosilicate glass, and / or lithium silicate glass, and / or alkali-free glass. In another example, the inorganic layer structure may comprise a ceramic material, such as aluminum nitride, and / or aluminum oxide, and / or silicon nitride, and / or boron nitride, and / or tungsten comprising a ceramic material. However, in another example, the inorganic layer structure may include semiconductor materials such as silicon and / or germanium and / or silicon oxide and / or germanium oxide and / or silicon carbide and / or gallium nitride. In another embodiment, the inorganic layer structure may include (elemental) metals and / or metal alloys such as copper and / or tin and / or bronze. In yet another embodiment, the inorganic layer structure may include inorganic materials not listed in the above examples, such as MoS2, CuGaO2, AgAlO2, LiGaTe2, AgInSe2, CuFeS2, BeO.

[0080] The substrate or interposer may include or be composed of at least a glass layer, silicon (Si), and / or a photoimageable or dry-etchable organic material such as an epoxy-based build-up material (e.g., an epoxy-based build-up film), or a polymer composite such as polyimide or polybenzoxazole (the polymer composite may or may not include photosensitive and / or heat-sensitive molecules).

[0081] In an embodiment, at least one electrically insulating layer structure (and / or a curable dielectric element) comprises at least one of the following: a resin or polymer, such as an epoxy resin, a cyanate resin, a benzocyclobutene resin, a bismaleimide triazine resin, a polyphenylene derivative (e.g., based on polyphenylene ether, PPE), a polyimide (PI), a polyamide (PA), a liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), and / or a combination thereof. Reinforcement structures such as meshes, fibers, spheres, or other types of filler particles, made of, for example, glass (multilayer glass) to form a composite material, may also be used. Semi-cured resins combined with reinforcing agents, such as fibers impregnated with the above resins, are referred to as prepregs. These prepregs are typically named after their properties, such as FR4 or FR5, to describe their flame retardant properties. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based buildup materials (e.g., buildup films) or photoimageable dielectric materials, may also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and / or cyanate ester resins may be preferred. In addition to these polymers, low-temperature co-fired ceramics (LTCC) or other low-DK materials, relatively low-DK materials, or ultra-low-DK materials can be used as the electrical insulation layer structure in the component carrier.

[0082] In an embodiment, at least one electrically conductive layer structure comprises at least one of copper, aluminum, nickel, silver, gold, palladium, tungsten, carbon, platinum, (doped) silicon, and magnesium. Although copper is generally preferred, other materials or other types of coatings thereof are also possible, in particular coated with a superconducting material or a conducting polymer, such as graphene or poly (3,4-ethylenedioxythiophene) (PEDOT), respectively.

[0083] At least one further component can be embedded in the component carrier and / or surface-mounted on the component carrier. Such a component can be selected from: a non-conductive inlay, a conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (such as a heat pipe), an optical element (such as an optical waveguide or optical conductor connector), an electronic component, or a combination thereof. The inlay can be, for example, a metal block with or without an insulating material coating (IMS-inlay), which can be embedded or surface-mounted to promote heat dissipation. Suitable materials are defined according to their thermal conductivity, which should be at least 2 W / mK. Such materials are typically based on, but not limited to, metals, metal oxides and / or ceramics, such as copper, aluminum oxide (Al2O3) or aluminum nitride (AlN). In order to increase the heat exchange capacity, other geometric structures with increased surface area are also often used. Furthermore, the component may be an active electronic component (implementing at least one pn junction), a passive electronic component such as a resistor, an inductor or a capacitor, an electronic chip, a memory device (e.g., a DRAM or other data memory), a filter, an integrated circuit (e.g., a field programmable gate array (FPGA), a programmable array logic (PAL), a general array logic (GAL) and a complex programmable logic device (CPLD)), a signal processing component, a power management component (e.g., a field effect transistor (FET), a metal oxide semiconductor field effect transistor (MOSFET), a complementary metal oxide semiconductor (CMOS), a junction field effect transistor (JFET), or an insulated-gate transistor (IGFET)). Field effect transistors (IGFETs), all of the above power management components are based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), and / or any other suitable inorganic compound), optoelectronic interface elements, light-emitting diodes, optocouplers, voltage converters (e.g., DC / DC converters or AC / DC converters), cryptographic components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips, and energy harvesting units. However, other components can be embedded in the component carrier. For example, a magnetic element can be used as a component. Such a magnetic element can be a permanent magnetic element (e.g., a ferromagnetic element, an antiferromagnetic element, a multiferroic element, or a ferrimagnetic element, such as a ferrite core), or such a magnetic element can be a paramagnetic element. However, the component can also be an IC substrate, an interposer, or another component carrier, for example in a board-in-board configuration. The components can be surface mounted on the component carrier and / or can be embedded in the interior of the component carrier. In addition, other components can also be used as components, in particular those that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagated from the environment.

[0084] In an embodiment, the component carrier is a laminated component carrier. In this embodiment, the component carrier is a composite of multiple layers that are stacked and connected together by applying force and / or heat.

[0085] After processing the internal layer structure of the component carrier, one or both main surfaces of the processed layer structure can be covered symmetrically or asymmetrically with one or more further electrically insulating and / or electrically conductive layer structures (in particular by lamination). In other words, the stacking can be continued until the desired number of layers is obtained.

[0086] After the formation of the stack of electrically insulating and electrically conductive layer structures has been completed, the resulting layer structure or component carrier can be subjected to a surface treatment.

[0087] In particular, with regard to surface treatment, an electrically insulating solder resist can be applied to one or both opposing main surfaces of a laminate or component carrier. For example, such a solder resist can be formed over the entire main surface and then patterned to expose one or more electrically conductive surface portions used to electrically connect the component carrier to an electronic peripheral. Surface portions of the component carrier that remain covered with the solder resist, particularly those containing copper, can be effectively protected from oxidation or corrosion.

[0088] In terms of surface treatment, a surface treatment can also be selectively applied to exposed electrically conductive surface portions of the component carrier. This surface treatment can be an electrically conductive covering material on exposed electrically conductive layer structures (such as pads, conductive traces, etc., particularly comprising or consisting of copper) on the surface of the component carrier. If such exposed electrically conductive layer structures are not protected, the exposed electrically conductive component carrier material (particularly copper) can oxidize, making the component carrier less reliable.

[0089] The surface treatment can then be formed as a joint between, for example, a surface-mounted component and a component carrier. The surface treatment has the function of protecting the exposed electrically conductive layer structure (particularly copper circuits) and enabling a joining process with one or more components, for example by soldering. Examples of suitable materials for the surface treatment are organic solderability preservative (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (particularly hard gold), chemical tin (chemical and electroplated), nickel-gold, nickel-palladium, and the like. BRIEF DESCRIPTION OF THE DRAWINGS

[0090] The aspects defined above and further aspects of the invention are apparent from the examples of embodiment described hereinafter and are explained with reference to these examples of embodiment.

[0091] Figure 1 A device for producing a component carrier according to an exemplary embodiment of the invention is shown.

[0092] Figure 2 A conventional apparatus for producing a component carrier is shown. DETAILED DESCRIPTION

[0093] Figure 1 A device 100 for manufacturing 110 a component carrier according to an exemplary embodiment of the present invention is shown. The device 100 includes an electromagnetic beam device 121, which is configured to provide an electromagnetic radiation beam 120 having a specific wavelength (e.g., 515 nm). In addition or alternatively, other wavelengths, such as 694 nm, 594 nm, or 488 nm, can be used. In the example shown, the electromagnetic beam device 121 is implemented as a laser device that provides a laser beam to a component carrier preform 110 (the component carrier under production). Preferably, the electromagnetic radiation beam 120 is applied perpendicular to the main surface of the component carrier preform. Alternatively, the electromagnetic radiation beam 120 is applied to the main surface of the component carrier in such a way that there is an inclination angle between the main surface of the component carrier preform 110 and the electromagnetic beam device 100 in the range of 15° and 89°. By providing the laser beam, laser drilling can be performed on the component carrier preform 110. In this way, for example, a cavity can be formed in the component carrier preform 110. Preferably, the cavity may have a tapered shape, such as a truncated cone, or a vertical shape (with straight sidewalls), depending on specific requirements. Laser beams inherently have a specific wavelength (for coherence); in this example, green laser light may be preferred.

[0094] The apparatus 100 further includes a receiving device 131 configured to receive the component carrier preform 110 during the laser drilling process. The receiving device 131 may include a support structure, such as a fixture (workbench), to attach the component carrier preform 110 during processing using the electromagnetic radiation beam 120. The fixture may be mounted on a mounting structure 132, such as a machine workbench. The receiving device 131 is further configured to store and / or facilitate a flow of a liquid medium 130, such that when the component carrier preform 110 is placed in the receiving device 100, the liquid medium 130 is immersed in the component carrier preform 110. In one example, (deionized) water is used as the liquid medium 130. Alternatively or in addition, the liquid medium 130 may include ethanol, ethyl acetate, or octane. Additives may be used to reduce / prevent the dispersed phase. The liquid medium 130 is thus in contact with the support structure 131.

[0095] Using the described architecture, material is removed from the immersed component carrier preform 110 (located in the receiving device 131) by means of an electromagnetic radiation beam device 120 (laser cutting / drilling), so that the electromagnetic radiation beam 120 passes through the liquid medium 130 before coming into contact with the immersed component carrier preform 110 (surface).

[0096] The liquid medium 130 covers the component carrier preform 110 along the respective planar extensions, such that the liquid medium 130 covers the component carrier preform 110 to define a constant thickness. The thickness of the liquid medium 130 can be in the range of 200 μm to 5 cm, in particular in the range of 500 μm to 2 cm. The liquid medium 130 includes a specific translucency index that enables an electromagnetic radiation beam 120 (in particular a laser beam) having a specific wavelength to pass through the liquid medium 130 before treating (the surface of) the component carrier preform 110. The specific translucency index can refer to the absorption of the material of the liquid medium, wherein the material can absorb less than 20%, in particular less than 10%, of the energy and / or intensity of the applied electromagnetic radiation beam. Here, the specific translucency index is constant in the liquid medium 130, in particular, constant throughout the thickness. Alternatively, the specific translucency index can vary with the thickness of the liquid medium. In order to ensure the performance quality, the translucency index of the liquid medium 130 may be evaluated / measured before / during the step of immersing the component carrier preform 110 in the liquid medium 130 .

[0097] The apparatus 100 further comprises a cover structure 140 having a specific translucency index, located on top of the liquid medium 130, such that the electromagnetic radiation beam 120 having a specific wavelength can pass through the cover structure 140 before passing through the liquid medium 130. The specific translucency index of the cover structure 140 can be different from or the same as the translucency index of the liquid medium 130. The cover structure 140 comprises an inorganic material, which in this example is a layer of (quartz) glass (e.g., the fixture is covered by a glass cover). Alternatively, the cover structure 140 can comprise an organic material, in particular a polymeric organic material such as polyethylene, PTFE, or poly(meth)acrylate. The cover structure 140 is also configured to maintain a constant thickness of the liquid medium 130. The cover structure 140 is arranged on top of the liquid medium 130 to protect the immersed component carrier preform 110 from debris 161 generated, for example, by material removal during the laser cutting process. The debris 161 comprises, for example, carbon particles, metals, or metal oxides. In another example, the cover structure 140 can also at least partially cover the sidewalls of the component carrier preform 110 being manufactured. For example, the cover layer can be placed on the component carrier preform 110 (on the support structure) and prevent the liquid medium 130 from flowing away. The cover structure 140 can also be omitted during this process.

[0098] Due to the arrangement of the cover structure 140 and the liquid medium 130, the material removal is carried out without a protective film 210, such as a polyester film. This can provide a particular advantage: providing the component carrier preform 110 with a protective film 210 (in contrast to the protective film 210) can be omitted. Figure 2 Compared with conventional examples), the time- and cost-intensive setup is eliminated, thereby making the manufacturing process more efficient in terms of time and cost.

[0099] The liquid medium 130 can flow along the component carrier preform 110 (arranged in the receiving device 131) to remove debris 161 generated by the material removal. Flowing the liquid medium 130 can further cool the component carrier preform 110, as heat is typically generated by the material removal. The flow can occur in the horizontal (x, y) directions of the component carrier preform 110 or along the diagonal directions of the component carrier preform 110. In embodiments, the flow of the liquid medium 130 includes a Reynolds number greater than 2000, particularly greater than 3000. This can indicate turbulent flow and thus ensure good transport of debris 161 and / or heat.

[0100] After processing the component carrier preform 110 (after material removal), the component carrier preform 110 is exposed to the liquid medium 130, for example by flowing or drying the liquid medium 130. A gaseous medium 160 can then flow along the component carrier preform 110 to further remove debris 161 resulting from the material removal. Alternatively or additionally, a gaseous medium 160 (e.g., air) can dry the component carrier preform 110 from the liquid medium 130. For this purpose, the gaseous medium 160 can preferably be cold and / or dry, for example, cold and dry air. Optionally, the gaseous medium 160 can be oxygen-free to prevent oxidation of (the electrically conductive material of) the component carrier preform. Furthermore, the gaseous medium 160 can have an elevated temperature, for example, above 30°C, in particular above 45°C. This can ensure reliable drying of the component carrier preform.

[0101] from Figure 1 As can be seen in FIG, a loop circuit 150 is implemented between the liquid medium 130 inlet and the liquid medium 130 outlet of the receiving device 131. In this way, a circulation (particularly a closed circulation) of the liquid medium 130 (and / or gaseous medium 160) for the purification process is established. The loop circuit 150 includes a storage tank 135 for storing the liquid medium 130, such as deionized water. The liquid medium 130 is delivered to the inlet of the receiving device 131 by a (circulation) pump 157. Before entering the receiving device 131, the liquid medium 130 passes through a filter 155. A third valve 158 controls the liquid medium 130 from entering the receiving device 131.

[0102] A gaseous medium inlet, such as another valve, is also provided in front of the inlet of the receiving device 131. This gaseous medium inlet controls the entry of the gaseous medium 160 into the receiving device 131. After passing through the receiving device 131, the medium (liquid medium 130 and / or gaseous medium 160) passes through a first valve 152, which controls the medium's exit from the receiving device 131. The medium 130, 160 then passes through a debris chute 153, which is configured to store debris (from material removal) transported by the medium 130, 160. A separation device, such as a sedimentation device or centrifuge, can be used, in which the separated debris can be stored. After the debris chute 153, the medium 130, 160 passes through a filter 154, whereby the flow of the medium 130, 160 is controlled by a second valve 156. A (liquid) medium storage tank 135 is arranged downstream of the second valve 156, thereby closing the loop 150. As a result, the gaseous medium 160 and / or the filtered liquid medium 130 can be recirculated along the component carrier preform again after purification, in particular filtration.

[0103] The device 100 may further include at least one of the following means:

[0104] -Bubble removal device, the bubble removal device is used to ensure that the liquid medium does not contain gas.

[0105] -Cooling unit, the cooling unit is used to cool the liquid medium.

[0106] - Ion removal device, which is used to maintain a constant conductivity of the liquid medium.

[0107] - A gaseous medium drying device (such as a drying tower), which is used to dry the gaseous medium.

[0108] - Heat exchangers, which serve to change the temperature of a gaseous medium or to remove undesirable heat generated by material removal.

[0109] - An oxygen removal device for keeping the liquid medium and / or gaseous medium free of oxygen.

[0110] Reference numerals

[0111] 100-component carrier manufacturing equipment

[0112] 110 component carrier prefabricated parts

[0113] 120 electromagnetic radiation beams

[0114] 121 Electromagnetic Radiation Beam Device

[0115] 130 liquid medium

[0116] 131 Liquid medium containing device, supporting device, fixture table

[0117] 132 Installation device, machine workbench

[0118] 135 liquid medium storage tank

[0119] 140 covering layer structural parts, glass layer

[0120] 150 loops

[0121] 151 Gas medium inlet

[0122] 152 first valve

[0123] 153 chip trough

[0124] 154 First Filter

[0125] 155 Second Filter

[0126] 156 Second Valve

[0127] 157 pumps

[0128] 158 Third Valve

[0129] 160 gas medium

[0130] 161 debris

[0131] 210 conventional protective film, polyester film.

Claims

1. A method for manufacturing a component carrier, the method comprising: Providing a liquid medium (130) having a specific translucency index so that an electromagnetic radiation beam (120) having a specific wavelength can pass through the liquid medium (130); immersing a component carrier preform (110) in the liquid medium (130) such that the component carrier preform (110) is at least partially covered by the liquid medium (130); as well as Material of the immersed component carrier preform (110) is removed by the electromagnetic radiation beam (120), wherein the electromagnetic radiation beam (120) passes through the liquid medium (130) before coming into contact with the immersed component carrier preform (110) for the purpose of removing the material.

2. The method according to claim 1, in, The material removal includes at least one of cutting, etching, forming a cavity, forming a through-connection, laser drilling, and laser ablation.

3. The method according to claim 1 or 2, in, The liquid medium (130) covers the component carrier preform (110) along the corresponding planar extension; and / or wherein the liquid medium (130) covers the component carrier preform (110) so as to define a constant thickness; and / or Wherein, the liquid medium (130) comprises a constant translucency index.

4. The method according to claim 1, wherein: The method further comprises: The translucency index of the liquid medium (130) is evaluated, in particular, the translucency index of the liquid medium (130) is evaluated before / during the step of immersing the component carrier preform (110) in the liquid medium (130).

5. The method according to claim 1 , in, The material is removed without a protective film (210) for the component carrier preform (110), in particular without a polyester film for the component carrier preform (110).

6. The method according to claim 1, wherein: The method further comprises: A cover structure (140) having a specific translucency index is provided on top of the liquid medium (130) so that the electromagnetic radiation beam (120) having the specific wavelength can pass through the cover structure (140) before passing through the liquid medium (130).

7. The method according to claim 6, in, The cover structure (140) comprises an inorganic material.

8. The method according to claim 7, in, The inorganic cover layer structure (140) comprises glass, and in particular, the inorganic cover layer structure (140) comprises quartz glass.

9. The method according to claim 6 , in, The cover structure (140) is configured to maintain a constant thickness of the liquid medium (130).

10. The method according to one of claims 6 to 9, in, The cover structure (140) is arranged on top of the liquid medium (130) so that the immersed component carrier preform (110) is protected from debris (161) resulting from the removal of the material.

11. The method according to one of the preceding claims, wherein The method further comprises: The liquid medium (130) is caused to flow along the component carrier preform (110), thereby: removing debris (161) resulting from said material removal; and / or The heat generated by the material removal is cooled.

12. The method according to claim 1, in, The liquid medium (130) includes water, in particular, the liquid medium (130) includes deionized water, and more particularly, the liquid medium (130) includes ultrapure water.

13. The method according to one of the preceding claims, in, The component carrier preform (110) is at least partially accommodated in a support structure (131), in particular, the component carrier preform (110) is at least partially accommodated in a fixture.

14. The method according to any one of the preceding claims, wherein The method further comprises the following steps after removing the material: exposing the component carrier preform (110) from the liquid medium (130); A gaseous medium (160) is caused to flow along the component carrier preform (110) so as to: removing debris (161) resulting from said material removal; and / or The component carrier preform (110) is dried.

15. The method according to claim 14, in, The gaseous medium (160) comprises air, and in particular, the gaseous medium (160) comprises cold air and / or dry air.

16. The method according to one of the preceding claims, wherein The method further comprises: Debris (161) resulting from the material removal is filtered from the gaseous medium (160) and / or the liquid medium (130).

17. A method according to any one of the preceding claims, wherein The method further comprises: After purification, the gaseous medium (160) and / or the filtered liquid medium (130) is recirculated along the component carrier preform (110), in particular after filtering, the gaseous medium (160) and / or the filtered liquid medium (130) is recirculated along the component carrier preform (110).

18. The method according to any one of the preceding claims, in, The liquid medium (130) and / or the gaseous medium (160) are kept in a loop circulation.

19. The method according to one of the preceding claims, in, Debris (161) generated by removing the material includes at least one of carbon particles, metals, and metal oxides.

20. The method according to one of the preceding claims, wherein The method further comprises: The removed debris (161) is stored in a debris trough (153).

21. The method according to one of the preceding claims, in, The component carrier preform (110) comprises a stack having at least one electrically insulating layer structure and / or at least one electrically conductive layer structure.

22. The method according to one of the preceding claims, in, During the material removal, the component carrier preform (110) is completely covered by the liquid medium (130).

23. The method according to one of the preceding claims, further comprising: The component carrier preform (110) is secured to the support structure (131).

24. A method according to any one of the preceding claims, wherein The method further comprises: Air bubbles are removed from the liquid medium (130), in particular, a pre-vacuum is used to remove air bubbles from the liquid medium (130).

25. The method according to one of the preceding claims, in, The electromagnetic radiation beam (120) comprises a laser beam, in particular, the electromagnetic radiation beam (120) comprises a green laser beam.

26. The method according to one of the preceding claims, wherein The method further comprises: The liquid medium (130) is caused to flow along a diagonal direction of the component carrier preform (110).

27. A device (100) for manufacturing a component carrier, the device (100) comprising: an electromagnetic beam device (121) configured to provide a beam of electromagnetic radiation (120) having a specific wavelength; as well as a receiving device (131) configured to receive a component carrier preform (110) and to receive a liquid medium (130) such that the liquid medium is immersed in the component carrier preform (110); Wherein, the device (100) is configured as follows: Material is removed from the immersed component carrier preform (110) by means of the electromagnetic radiation beam device (121), such that the electromagnetic radiation beam (120) passes through the liquid medium (130) before coming into contact with the immersed component carrier preform (110).

28. The apparatus (100) according to claim 27, wherein The device (100) further comprises: A loop circuit (150) is configured to circulate the liquid medium (130) and / or the gaseous medium (160) for use in a purification process.

29. The apparatus of claim 28, wherein The loop cycle (150) includes at least one of the following features: a debris storage device (153); Filters (154, 155); valves (152, 156); Pump (157); a clamping device (131); a mounting device (132) configured to hold / attach the component carrier preform (110); Liquid medium storage tank (135).

30. The device (100) according to one of claims 27 to 29, wherein The device (100) further comprises at least one of the following features: a bubble removal device configured to remove bubbles from the liquid medium; a cooling device configured to cool the liquid medium; an ion removal device configured to maintain a constant conductivity of the liquid medium; a drying device configured to dry the gaseous medium; a heat exchange device configured to: control the temperature of the gaseous medium or remove undesired heat caused by the material removal; An oxygen removal device is configured to keep the liquid medium and / or gaseous medium free of oxygen.

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