Laser cutting method and device, computer equipment and storage medium

Abstract

The invention relates to a laser cutting method and device, computer equipment and a storage medium, and the laser cutting method comprises the steps that the height of a base material is measured along a preset cutting track, and an actual cutting plane is generated; a focal plane is generated based on the laser field lens parameters, and an ideal cutting plane where the focal plane intersects with the preset cutting track is formed; and the linear distance between the ideal cutting plane and the actual cutting plane is obtained, the distance between the laser cutter and the base material is compensated according to the linear distance, and the base material is cut. According to the laser cutting method and device, the computer equipment and the storage medium, it can be guaranteed that the actual cutting plane is always located in the focal depth working range of the focal plane, and therefore the consistency of cutting precision and quality is achieved.

Description

Technical Field

[0001] The present invention belongs to the field of laser cutting technology, and in particular relates to a laser cutting method, device, computer equipment and storage medium. Background Art

[0002] When using laser to cut ultra-thin substrates, such as using a picosecond laser to cut ultra-thin substrates within 50um, the substrate is too thin and easily deformed by external influences during the cutting process, thereby affecting the cutting accuracy. Moreover, due to the inconsistency of external influencing factors, it is difficult to ensure the consistency of cutting quality.

[0003] Existing control solutions generally only implement open-loop control of laser focus. This process is often highly dependent on the experience of the laser technician. Focusing also requires technicians to constantly test and adjust the laser height to ultimately find a suitable focus height, which is time-consuming and labor-intensive. Furthermore, when cutting substrates of varying thicknesses, the laser's height cannot be adjusted in real time. As a result, the cut surface of the substrate may deviate from the laser's focal plane during the laser cutting process, making it difficult to ensure dimensional accuracy and consistent quality of the cut product. Summary of the Invention

[0004] In view of this, the present invention provides a laser cutting method and device to solve the problem of focusing during the laser cutting process.

[0005] In order to achieve the above-mentioned purpose, in the first aspect, the technical solution of the present invention to solve the technical problem is to provide a laser cutting method, including: measuring the height of the substrate along a predetermined cutting trajectory to generate an actual cutting plane; generating a focal plane based on the laser field mirror parameters, and forming an ideal cutting plane where the focal plane intersects the predetermined cutting trajectory; obtaining the linear spacing between the ideal cutting plane and the actual cutting plane, compensating the distance between the laser cutter and the substrate according to the linear spacing, and cutting the substrate.

[0006] In one embodiment, compensating the distance between the laser cutter and the substrate based on the linear spacing includes: forming an association between the linear spacing and the Z-axis movement stroke of the driving module, and generating a movement instruction based on the association result; the Z-axis of the driving module moves according to the movement control instruction.

[0007] In one embodiment, when the Z axis of the driving module moves according to the movement control instruction, a grating ruler is provided to read the displacement of the movement in real time, forming a feedback closed loop.

[0008] In one embodiment, obtaining the linear distance between the ideal cutting plane and the actual cutting plane includes: matching the spatial coordinates of the ideal cutting plane and the actual cutting plane; and calculating the linear distance between the ideal cutting plane and the actual cutting plane in the Z-axis direction.

[0009] In one embodiment, after cutting the substrate, the method further includes: collecting parameters of the cut product for analysis, and optimizing the initial position of the Z axis of the driving module according to the analysis results.

[0010] In one embodiment, measuring the height of the substrate along a predetermined cutting trajectory and generating an actual cutting plane includes: fixing the substrate to be measured flatly on a cutting platform; providing a height measuring sensor, and performing multi-point measurement of the substrate surface along the predetermined cutting trajectory by the height measuring sensor, and obtaining the X-axis and Y-axis displacement and Z-axis height value of the measurement points; uploading the data of the measurement points obtained by the height measuring sensor to a host computer, and generating the actual cutting plane.

[0011] In one embodiment, after generating the focal plane based on the laser field mirror parameters, the method further includes: determining a focal depth working range of the focal plane, where the focal depth working range is an effective scanning area parallel to the focal plane.

[0012] In a second aspect, the present invention also provides a laser cutting device, comprising a height measuring module, a focusing module and a compensation module; wherein the height measuring module is used to measure the height of the substrate along a predetermined cutting trajectory to generate an actual cutting plane; the focusing module is used to generate a focal plane based on the laser field mirror parameters, and form an ideal cutting plane where the focal plane intersects the predetermined cutting trajectory; the compensation module is used to obtain the linear spacing between the ideal cutting plane and the actual cutting plane, compensate the distance between the laser cutter and the substrate according to the linear spacing, and cut the substrate.

[0013] In a third aspect, the present invention further provides a computer device comprising a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the laser cutting method when executing the computer program.

[0014] In a fourth aspect, the present invention further provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program implements the laser cutting method when executed by a processor.

[0015] Compared with the prior art, the laser cutting method, device, computer equipment and storage medium provided by the present invention have the following beneficial effects: The ideal cutting plane is formed by the actual cutting plane generated by height measurement and the focal plane generated based on the laser field mirror parameters, and the linear spacing between the two is obtained. The linear spacing association driving module is used to drive the displacement of the laser cutter in the height direction, so that the laser cutter forms a closed-loop feedback when cutting the substrate, and judges and adjusts the laser height in real time to ensure that the actual cutting plane is always within the focal depth working range of the focal plane, thereby achieving cutting accuracy and quality consistency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the application environment of the laser cutting method provided by the present invention; Figure 2 A flow chart of the laser cutting method provided by the present invention; Figure 3 A schematic diagram of the positional relationship between the actual cutting plane and the ideal cutting plane in the laser cutting method provided by the present invention; Figure 4 This is a flow chart of an embodiment of step S100 in the laser cutting method provided by the present invention; Figure 5 This is a flow chart of an embodiment of step S300 in the laser cutting method provided by the present invention; Figure 6 This is a flow chart of another embodiment of step S300 in the laser cutting method provided by the present invention; Figure 7 A flowchart of the subsequent steps of step S300 in the laser cutting method provided by the present invention; Figure 8 This is a closed-loop control logic diagram of the laser cutting method provided by the present invention. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0018] It should be noted that all directional indications in the embodiments of the present application are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0019] In addition, the descriptions of "first", "second", etc. in this application are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0020] The laser cutting method provided in the first embodiment of the present application can be applied to Figure 1 In the application environment shown, a substrate N to be cut is fixed on a cutting platform 1, and a laser cutter 2 is connected to a drive module 3. Both the laser cutter 2 and the drive module 3 communicate with a host computer. The host computer can store a predetermined cutting trajectory for the substrate N and control the drive module 3 to drive the laser cutter 2 to cut the substrate N according to the predetermined cutting trajectory. The laser cutter 2 includes a laser emitter and a laser field mirror, which form an optical path and are both connected to the drive module 3.

[0021] In one embodiment, Figures 2 and 3 As shown, a laser cutting method is provided, which includes: S100, measuring the height of the substrate along a predetermined cutting trajectory to generate an actual cutting plane; For example, the substrate N is fixed on the cutting platform and adsorbed to be flat. Based on this, a height sensor is used to perform multi-point measurement of the substrate N along the predetermined cutting trajectory. The X / Y displacement of the measurement point and the height data of the Z axis of the measurement point are transmitted to the host computer, and a three-dimensional actual cutting plane S is simulated and generated in the host computer.

[0022] It should be noted that the predetermined cutting trajectory can be set according to the requirements for cutting the substrate.

[0023] S200, generating a focal plane based on laser field mirror parameters, and forming an ideal cutting plane where the focal plane intersects with a predetermined cutting trajectory; Exemplarily, the laser field mirror parameters are input into the host computer, which simulates and generates a virtual focal plane Q, then projects the predetermined cutting trajectory onto the focal plane Q, and uses the projected trajectory to form an ideal cutting plane S'.

[0024] Exemplarily, the parameters of the laser field lens include EFL, FFL, WD, Scanangle, Scanlength, Scanfield, etc.; the focal plane Q is a curved surface generated in the scanning area of ​​the field lens according to the imaging principle of light after the laser passes through the field lens; the ideal cutting plane S' is the projection trajectory plane of the predetermined cutting trajectory on the focal plane Q.

[0025] In some examples, the focal plane Q and the ideal cutting plane S' in step S202 may be generated first, and then the actual cutting plane S may be generated by height measurement. That is, the order of step S201 and step S202 may be interchanged.

[0026] S300, obtaining a linear distance between an ideal cutting plane and an actual cutting plane, compensating a distance between a laser cutter and a substrate according to the linear distance, and cutting the substrate; For example, after obtaining the actual cutting plane S and the ideal cutting plane S', the distance between the laser cutter 2 and the substrate N is associated with the linear spacing, that is, the displacement of the laser cutter 2 in the Z-axis direction driven by the driving module 3 is associated with the linear spacing. When cutting, the driving module 3 adjusts the distance between the laser cutter 2 and the substrate N according to the linear distance to compensate for the linear spacing between the actual cutting plane S and the ideal cutting plane S', and after compensation, the laser cutter 2 is used to cut the substrate N.

[0027] Among them, the linear distance between the ideal cutting plane S' and the actual cutting plane S reflects the offset between the actual cutting plane and the ideal cutting plane caused by the deformation of the surface of the substrate N. By compensating the distance between the laser cutter 2 and the substrate N, the actual cutting plane is aligned with the ideal cutting plane, that is, the height of the laser cutter on the Z axis is adjusted so that the laser cutter uses the focal plane to cut the substrate N, thereby improving the cutting accuracy and ensuring the consistency of the cutting quality.

[0028] Take a specific operation example as an illustration: after the actual cutting plane S and the ideal cutting plane S' are generated in the host computer, the actual cutting plane S is corresponded to the substrate N on the cutting platform 101 through virtual reality technology and AI technology, and the focal plane Q is corresponded to the Z axis of the drive module 3. The linear spacing between the ideal cutting plane S' and the virtual cutting plane S is associated with the actual Z axis movement Δs of the drive module 3, and can be output to the host computer through the grating ruler, that is, drag the ideal cutting plane S' or the actual cutting plane S to move s1, and the Z axis of the drive module 3 makes a corresponding movement s1, that is, the corresponding movement distance of the laser cutter 2 in the height direction is s1.

[0029] When the linear distance between the ideal cutting plane S' and the actual cutting plane S is Δs', the distance the ideal cutting plane S' is dragged to coincide with the actual cutting plane S is Δs'. At this point, the host computer controls the Z-axis displacement Δs' of the drive module 3, which in turn drives the laser cutter 2 in the height direction by Δs'. The grating scale accurately feedbacks the movement amount, aligning the cutting surface of the ultra-thin substrate with the focal plane of the laser field mirror, enabling the visualization of autofocus and digital twin technology. By repeatedly adjusting the accuracy of height measurement, Z-axis movement, and grating scale, the movement amount can be precisely controlled, thus achieving an online closed loop of height measurement, Z-axis movement, and grating scale feedback.

[0030] In one embodiment, Figure 4 As shown, in the above step S100, the height of the substrate is measured along the predetermined cutting trajectory to generate the actual cutting plane, and the following steps are also included: S110, fixing the substrate to be tested flatly on the cutting platform; S120, providing a height measuring sensor, measuring multiple points on the substrate surface along a predetermined cutting trajectory using the height measuring sensor, and obtaining displacements of the measurement points along the X and Y axes and height values ​​along the Z axis; S130, uploading the data of the measurement points obtained by the height measuring sensor to the host computer, and generating the actual cutting plane; For example, before cutting substrate N, substrate N is first secured to cutting platform 1, either by adsorption or any other method. A height sensor is then used to perform multi-point measurements along the predetermined cutting trajectory. The measured data is transmitted to a host computer, which uses the uploaded data to generate the actual cutting plane S.

[0031] In one embodiment, when the focal plane is generated based on the laser field mirror parameters in the above step S200, orthogonality is achieved through an F-theta lens or a telecentric lens to compensate for the geometric deformation of the edge of the focal plane.

[0032] It should be noted that there is a distortion problem in the focal plane Q. When forming the focal plane Q, the distortion of the focal plane Q is caused by the image deformation caused by the design and optical characteristics of the field lens, especially at the edges, which may lead to misjudgment of the size, position or shape of the object. Orthogonal correction can be achieved through an F-theta lens or a telecentric lens. That is, when generating the focal plane Q, the focal plane is orthogonally corrected through an F-theta lens or a telecentric lens to compensate for the geometric deformation of the edge of the focal plane Q.

[0033] In one embodiment, after the focal plane is generated based on the laser field mirror parameters in the above step S200, the step further includes: determining a focal depth working range of the focal plane, where the focal depth working range is an effective scanning area parallel to the focal plane.

[0034] It should be noted that under ideal circumstances, the actual cutting plane S and the ideal cutting plane S' can coincide with each other. However, there are errors in actual processing and assembly, which lead to allowable tolerances in the equipment. Moreover, after the laser passes through the field lens, there are multiple focal lengths under microscopic conditions due to the refraction angle. The focus is only the most concentrated point among the multiple focal lengths. Therefore, the depth of field is the effective cutting range centered on the focal length H. The working range of the depth of field is [Hmin, Hmax], and the working range of the depth of field is the effective scanning area parallel to the focal plane Q [Qmin, Qmax].

[0035] Due to the tolerance of the cutting base plate and the uneven thickness of the substrate N, the actual cutting plane S is a 3D curved surface with undulations. Therefore, it is difficult for the actual cutting plane S to completely coincide with the ideal cutting plane S'. Therefore, the depth of field working plane [Qmin, Qmax] is imported into the host computer, and error control is introduced into the 3D virtual control, so that the cut product can guarantee better size and quality.

[0036] That is, when compensating the distance between the laser cutter and the substrate, the compensated distance may have a tolerance within the working range of the depth of focus.

[0037] In one embodiment, Figure 5 As shown, the linear distance between the ideal cutting plane and the actual cutting plane in the above step S300 includes: S310, matching the spatial coordinates of the ideal cutting plane and the actual cutting plane; S320, calculating the linear distance between the ideal cutting plane and the actual cutting plane in the Z-axis direction; For example, after forming the ideal cutting plane S' and the actual cutting plane S, the X and Y coordinates of the ideal cutting plane S' and the actual cutting plane S are matched in sequence, and the linear spacing of each coordinate point in the Z-axis direction is calculated.

[0038] It should be noted that, instead of obtaining every coordinate point on the plane, it is also possible to use multiple coordinate points as anchor points for matching and then calculate the linear spacing in the Z-axis direction on the anchor points to reduce the computational workload.

[0039] In one embodiment, Figure 6 As shown, the above step S300 compensates the distance between the laser cutter and the substrate according to the linear spacing, and further includes: S330, forming an association between the linear spacing and the Z-axis movement stroke of the driving module, and generating a movement instruction according to the association result; S340, the Z axis of the driving module moves according to the movement control instruction; S350 provides a grating ruler to read the displacement in real time, forming a feedback closed loop; For example, after obtaining the linear spacing between the actual cutting plane S and the ideal cutting plane S', the amount of travel required for the Z axis of the drive module 3 to move is associated with the linear spacing, that is, the linear spacing corresponding to each spatial coordinate point is equal to the amount of travel required for the Z axis of the drive module 3 to move at that point. After completing the above association, the movement instructions for the Z axis of the drive membrane assembly in each section can be generated based on the association results. The drive module 3 moves its Z axis according to the movement instructions to achieve distance compensation between the laser cutter and the substrate. When the drive module 3 moves the Z axis, the grating ruler reads the Z axis movement in real time and feeds it back to the host computer, forming a feedback closed loop.

[0040] In the above embodiment, the Z-axis movement of the drive module 3 is achieved by inputting the PLC control driver through the host computer.

[0041] In one embodiment, Figure 7 、 8 As shown, after the above step S300 obtains the linear distance between the ideal cutting plane and the actual cutting plane, compensates the distance between the laser cutter and the substrate according to the linear distance, and cuts the substrate, the method further includes: S400, collects and analyzes the parameters of the product after cutting, and optimizes the initial position of the Z axis of the drive module based on the analysis results; It should be noted that after collecting the parameters of the product after cutting, the product data is analyzed. If it is judged that the cutting effect is not ideal, the Z-axis initial position of the mold 3 is adjusted to optimize the subsequent cutting effect.

[0042] For example, after obtaining the linear distance between the ideal cutting plane S' and the actual cutting plane S, the Z-axis movement of the driving module 3 can be determined, and the laser cutter 2 on the driving module 3 is driven according to the movement amount to approach or move away from the substrate N along the Z-axis movement amount to achieve cutting of the substrate N. When the cutting is completed, the second dimension is used to collect product data, such as cutting slope, thermal impact, etc., and the collected data is analyzed by tools such as Six Sigma. The initial position of the Z axis of the driving module 3 is optimized based on the conclusion of the data analysis. If the cutting effect is judged to be poor, it can be determined that the actual cutting plane is not within the focal depth working range of the focal plane Q. At this time, by adjusting the initial position of the Z axis of the driving module 3, that is, adjusting the initial height of the laser cutter 2, so that when the distance between the laser cutter and the substrate is compensated according to the linear spacing next time, the movement amount is first compared with the initial position of the Z axis of the driving module 3, and the Z axis is moved according to the comparison result, that is, the height of the laser cutter 2 is moved up and down, so as to ensure that the laser is focused within the focal depth working range of the laser focal plane Q when cutting the substrate N through the field lens, thereby ensuring the cutting accuracy and consistency of the cutting.

[0043] A second embodiment of the present application provides a laser cutting device, which includes: a height measurement module, a focusing module, and a compensation module, wherein: The height measurement module is used to measure the height of the substrate along the predetermined cutting trajectory to generate the actual cutting plane; The focusing module is used to generate a focal plane based on the laser field mirror parameters and form an ideal cutting plane where the focal plane intersects with the predetermined cutting trajectory; The compensation module is used to obtain the linear distance between the ideal cutting plane and the actual cutting plane, compensate the distance between the laser cutter and the substrate according to the linear distance, and cut the substrate.

[0044] In one embodiment, the laser cutting device further includes a feedback module, which is used to collect parameters of the product after cutting for analysis, and optimize the initial position of the Z axis of the driving module based on the analysis results.

[0045] Each module in the above-mentioned laser cutting device can be implemented in whole or in part through software, hardware, or a combination thereof. Each module can be embedded in or independent of the processor of the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the corresponding operations of each module.

[0046] It should be noted that in the aforementioned device, data from the altimeter, focusing, and compensation modules are linked using virtual reality and AI technologies to achieve a digital twin. Specifically, the altimeter, focusing, and compensation modules are all linked via a computer. After the altimeter module acquires altimeter data and generates an actual cutting plane, and the focusing module forms a focal plane and an ideal cutting plane, the compensation module can be rapidly adjusted remotely based on this data linkage, enabling high-speed, visual debugging.

[0047] A third embodiment of the present application provides a computer device, which includes a memory and at least one processor. The memory stores a computer program, and the processor implements the steps in the above-mentioned method embodiments when executing the computer program.

[0048] A fourth embodiment of the present application provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0049] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, database or other media used in the embodiments provided in this application may include at least one of non-volatile and volatile memory. Non-volatile memory may include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory may include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processors involved in each embodiment provided in this application may be general-purpose processors, central processing units, graphics processors, digital signal processors, programmable logic devices, data processing logic devices based on quantum computing, etc., but are not limited to this. The various technical features of the above embodiments can be arbitrarily combined. In order to make the description concise, not all possible combinations of the various technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] Compared with the existing technology, the laser cutting method, device, computer equipment and storage medium provided by the present invention form an ideal cutting plane by measuring the actual cutting plane and the focal plane generated based on the laser field mirror parameters, obtain the linear spacing between the two, and use the linear spacing association drive module to drive the displacement of the laser cutter in the height direction, so that the laser cutter forms a closed-loop feedback when cutting the substrate, judges and adjusts the laser height in real time, and ensures that the actual cutting plane is always within the focal depth working range of the focal plane, thereby achieving cutting accuracy and quality consistency.

[0051] The specific embodiments of the present invention described above do not limit the scope of protection of the present invention. Any other corresponding changes and modifications made based on the technical concept of the present invention should be included in the scope of protection of the claims of the present invention.

Claims

1. A laser cutting method, characterized in that: include: Measure the height of the substrate along the predetermined cutting trajectory to generate the actual cutting plane; Generate a focal plane based on the laser field mirror parameters, and form an ideal cutting plane where the focal plane intersects with the predetermined cutting trajectory; A linear distance between an ideal cutting plane and an actual cutting plane is obtained, the distance between the laser cutter and the substrate is compensated according to the linear distance, and the substrate is cut.

2. A laser cutting method according to claim 1, characterized in that: Compensating the distance between the laser cutter and the substrate according to the linear spacing includes: Form an association between the linear spacing and the Z-axis movement stroke of the drive module, and generate a movement instruction based on the association result; The Z axis of the drive module moves according to the movement control instruction.

3. A laser cutting method according to claim 2, characterized in that: When the Z axis of the driving module moves according to the movement control instruction, a grating ruler is provided to read the displacement of the movement in real time, forming a feedback closed loop.

4. A laser cutting method according to claim 1, characterized in that: The obtaining of the linear distance between the ideal cutting plane and the actual cutting plane comprises: Match the spatial coordinates of the ideal cutting plane and the actual cutting plane; Calculate the linear distance between the ideal cutting plane and the actual cutting plane in the Z-axis direction.

5. A laser cutting method according to claim 1, characterized in that: After cutting the substrate, the method further comprises: Collect and analyze the product parameters after cutting, and optimize the initial position of the Z axis of the drive module based on the analysis results.

6. A laser cutting method according to claim 1, characterized in that: Measuring the height of the substrate along the predetermined cutting trajectory to generate an actual cutting plane includes: Fix the substrate to be tested flatly on the cutting platform; Providing a height measuring sensor, using which the height measuring sensor measures multiple points on the substrate surface along a predetermined cutting trajectory, and obtains the displacement of the measurement points along the X and Y axes and the height value of the Z axis; The data of the measurement points obtained by the height sensor are uploaded to the host computer, and the actual cutting plane is generated.

7. A laser cutting method according to claim 1, characterized in that: After generating the focal plane based on the laser field mirror parameters, the method further includes: A focal depth working range of the focal plane is determined, where the focal depth working range is an effective scanning area parallel to the focal plane.

8. A laser cutting device, characterized in that: Including height measurement module, focusing module and compensation module; The height measurement module is used to measure the height of the substrate along a predetermined cutting trajectory to generate an actual cutting plane; The focusing module is used to generate a focal plane based on the laser field mirror parameters, and form an ideal cutting plane where the focal plane intersects with the predetermined cutting trajectory; The compensation module is used to obtain a linear distance between an ideal cutting plane and an actual cutting plane, compensate the distance between the laser cutter and the substrate according to the linear distance, and cut the substrate.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 7 is implemented.

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