Wire welding machine for high-precision semiconductor manufacturing

Abstract

The invention discloses a wire welding machine for high-precision semiconductor manufacturing, which belongs to the technical field of semiconductor manufacturing equipment, and comprises a mounting box arranged at the lower part, a plurality of ultrasonic driving plates and a group of cooling mechanisms are mounted in the mounting box, and an industrial personal computer is further mounted in the mounting box; the cooling mechanism comprises two cooling assemblies, a purging assembly, two gas conveying assemblies and a driving assembly. According to the cooling mechanism, the two cooling assemblies and the driving assembly are arranged, when the driving assembly operates, the two cooling assemblies can be driven to operate, then hot air in the mounting box is rapidly discharged, and heat generated when the ultrasonic driving plate operates is taken away in time; performance degradation and element aging or failure of the ultrasonic drive board caused by too high temperature are avoided.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing equipment, and in particular relates to a high-precision wire bonding machine for semiconductor manufacturing. Background Art

[0002] In the field of semiconductor manufacturing, wire bonding machines are one of the key equipment, and their performance directly affects the quality and reliability of semiconductor devices. With the rapid development of semiconductor technology, people have placed higher demands on the precision, stability, and efficiency of wire bonding machines. As the core equipment in the semiconductor packaging process, the technological development of wire bonding machines for high-precision semiconductor manufacturing has evolved from traditional hot pressing welding to ultrasonic welding. Traditional hot pressing welding technology uses heat and pressure to connect the wire to the pad, but has disadvantages such as a large heat-affected zone and easy damage to the chip. Ultrasonic welding technology, on the other hand, uses energy generated by high-frequency vibration to achieve welding. It has the advantages of a small heat-affected zone, high welding strength, and suitability for fine wires. Therefore, it has gradually become the mainstream welding technology in high-precision semiconductor manufacturing.

[0003] However, existing ultrasonic wire bonding machines still have the following shortcomings: First, the ultrasonic driver board is the core energy component of the ultrasonic wire bonding machine. During operation, the ultrasonic driver board generates a large amount of heat due to power conversion losses and mechanical vibrations. Traditional heat dissipation methods often use a single fan or heat sink, which has low heat dissipation efficiency and cannot achieve rapid replacement of hot air. This causes the ultrasonic driver board temperature to continue to rise, affecting the stability of welding energy and even causing component aging and failure. Second, the semiconductor manufacturing environment has high requirements for cleanliness. Particles and contaminants generated during the welding process need to be removed promptly, otherwise the performance and reliability of semiconductor devices will be affected. However, the welding workbench of existing ultrasonic wire bonding machines mostly relies on manual cleaning. Not only is the cleaning efficiency slow, but the manual contact cleaning method also easily leaves new contaminants on the welding workbench. Summary of the Invention

[0004] The purpose of the present invention is to provide a high-precision semiconductor manufacturing wire bonding machine to solve the problems in the prior art. Traditional wire bonding machines mostly use a single fan or heat sink for heat dissipation, which has low heat dissipation efficiency and cannot achieve rapid replacement of hot air. This causes the temperature of the ultrasonic driver board to continue to rise, affecting the stability of welding energy and even causing technical problems such as component aging and failure.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A high-precision wire bonding machine for semiconductor manufacturing includes an installation box arranged at the bottom, wherein a plurality of ultrasonic drive plates and a cooling mechanism are installed in the installation box, wherein the cooling mechanism includes: two cooling components, both installed in the installation box, for conveying air in the installation box to the outside of the installation box; a purge component, for purging the welding workbench of the wire bonding machine with gas; two gas delivery components, for conveying gas into the purge components; and a drive component, for driving the two cooling components and the two gas delivery components to operate simultaneously.

[0006] Preferably, the cooling mechanism further includes a drying component, which includes: a drying box, placed in the installation box, having two first connecting pipes and one second connecting pipe, the first connecting pipes being used to connect to the gas transmission component; a plurality of drying plates, staggeredly installed in the drying box, forming an air flow channel between the plurality of drying plates; and a card slot, opened on the drying box.

[0007] Preferably, the purge assembly includes: an air storage box, installed in the installation box, with a second connector installed on one side of the air storage box, and the second connector is detachably connected to the second connecting pipe; a bent pipe, installed on one side of the air storage box, with a valve installed on it; a fixed cylinder, installed at the upper end of the bent pipe; a hose, fixedly connected to and communicated with the fixed cylinder; a vertical pipe, fixedly connected to and communicated with the hose; and a gas nozzle, installed at the upper end of the vertical pipe, facing the welding workbench of the wire welding machine.

[0008] Preferably, the cooling mechanism also includes: a guide box, installed on the welding workbench of the wire welding machine; a first guide groove, opened on one side of the guide box, and the air nozzle is slidably connected to the first guide groove; a second guide groove, opened on the bottom surface of the guide box, and the vertical pipe is slidably connected to the second guide groove.

[0009] Preferably, the cooling mechanism also includes a reciprocating assembly, which includes: a reciprocating screw, which is installed on the top surface of the air storage box through two vertical plates, and one end of which is rotatably connected to the fixed cylinder; a screw nut, which is sleeved on the reciprocating screw and fixedly connected to the lower end of the vertical tube; a second bevel gear, which is located in the fixed cylinder and fixedly connected to the reciprocating screw; a rotating rod, which is installed on the inner wall of the fixed cylinder through a second fixed frame; a first bevel gear, which is fixedly sleeved on the rotating rod and meshed with the second bevel gear; and a second fan blade is installed on the first bevel gear.

[0010] Preferably, the cooling component includes: a cylinder, which is installed through the bottom surface of the installation box; a rotating shaft, which is rotatably installed inside the cylinder; a second pulley, which is fixedly mounted on the rotating shaft; and a first fan blade, which is installed on the rotating shaft.

[0011] Preferably, the gas delivery assembly includes: a first fixing frame, mounted on the inner bottom surface of the mounting box; a piston cylinder, mounted on the first fixing frame, with a piston plate slidably connected to its interior, a piston rod mounted on the piston plate, the piston rod and the piston cylinder being slidably connected, an air extraction pipe and an air delivery pipe mounted on the bottom surface of the piston cylinder, the air delivery pipe being detachably connected to the first connecting pipe; a push plate, fixedly connected to the upper end of the piston rod, an arc-shaped groove being provided on its top surface; a spring, with its two ends respectively connected to the piston cylinder and the push plate.

[0012] Preferably, the drive assembly includes: a drive motor, mounted on the inner bottom surface of the mounting box; a shaft, fixedly connected to the power output shaft of the drive motor; a first pulley, fixedly sleeved on the shaft, the first pulley being connected to two second pulleys respectively through two transmission belts; a cross plate, mounted on the upper end of the shaft; two arc-shaped plates, both mounted on the bottom surface of the cross plate, matching the arc-shaped groove.

[0013] Preferably, four groups of support components are installed on the bottom surface of the installation box, and the support components include: a threaded column, fixedly connected to the bottom surface of the installation box; a base, threadedly connected to the threaded column; a mounting plate, sleeved on the threaded column and threadedly connected to the threaded column, and plugged into the slot; and a universal wheel, installed on the bottom surface of the mounting plate.

[0014] Preferably, two doors are hingedly mounted on the installation box, and air intake grilles are provided on both sides of the installation box.

[0015] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are: 1. The cooling mechanism of the present invention is provided with two sets of cooling components and a driving component. When the driving component is in operation, it will drive the two sets of cooling components to operate, thereby quickly discharging the hot air in the installation box, and promptly taking away the heat generated by the ultrasonic driving board during operation, thereby avoiding the performance degradation of the ultrasonic driving board, aging or failure of the components due to excessive temperature.

[0016] 2. The cooling mechanism of the present invention is provided with a purge component, two sets of gas delivery components and a drying component. When the driving component is in operation, it will drive the gas delivery component to deliver gas to the drying box. After drying, the gas enters the gas storage box for storage. After opening the valve, the gas in the gas storage box will enter the gas nozzle through the elbow, hose, and vertical pipe, and the gas will be discharged through the gas nozzle to purge the welding workbench, remove dust, metal debris and other impurities on the welding workbench, prevent impurities from affecting the bonding of the welding wire and the welding surface, reduce welding defects, and improve the quality and reliability of welding in the semiconductor manufacturing process.

[0017] 3. The reciprocating assembly in the present invention is provided with a reciprocating screw, a screw nut, a second bevel gear, a rotating rod, a first bevel gear, a rotating rod, a first bevel gear and a second fan blade. When the gas enters the fixed cylinder through the bent pipe, it drives the second fan blade to rotate, and drives the reciprocating screw to rotate through the first bevel gear and the second bevel gear, and then the screw nut drives the vertical pipe and the gas nozzle to move back and forth horizontally, thereby expanding the coverage of the gas blown out by the gas nozzle, improving the comprehensiveness of cleaning, further ensuring the cleanliness of the welding environment, and providing protection for high-precision welding.

[0018] 4. The cooling mechanism in the present invention is provided with a driving assembly. The driving assembly adopts a driving motor to drive the shaft to rotate, and drives the rotating shaft and the first fan blade of the cooling assembly to operate through the first pulley, the transmission belt and the second pulley. At the same time, the rotation of the shaft drives the cross plate and the arc plate, and pushes the push plate to make the piston cylinder of the gas transmission assembly reciprocate to transmit gas, so that heat dissipation and gas transmission are carried out at the same time, thereby improving production efficiency and energy utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 The present invention is a three-dimensional high-precision semiconductor manufacturing wire bonding machine Figure 1 ; Figure 2 The present invention is a three-dimensional high-precision semiconductor manufacturing wire bonding machine Figure 2 ; Figure 3 The present invention is a three-dimensional high-precision semiconductor manufacturing wire bonding machine Figure 3 ; Figure 4 For the present invention Figure 3 A magnified schematic diagram of part A; Figure 5 It is a three-dimensional diagram of the cooling mechanism in the present invention; Figure 6 Schematic diagram of the assembly structure of the driving motor, the rotating shaft, the first pulley, the second pulley and the first fan blade in the present invention; Figure 7 Schematic diagram of the assembly structure of the drive component, gas delivery component and drying component in the present invention; Figure 8 Schematic diagram of the interior of the drying box of the present invention; Figure 9 Schematic diagram of the assembly structure of the purge assembly and the reciprocating assembly in the present invention; Figure 10 Schematic diagram of the assembly structure of the reciprocating assembly and the guide box in the present invention; Figure 11 For the present invention Figure 10 An enlarged schematic diagram of Section B; Figure numerals: 100, wire welding machine; 101, installation box; 102, box door; 103, industrial computer; 104, ultrasonic driving plate; 111, threaded column; 112, base; 113, mounting plate; 114, universal wheel; 211, cylinder; 212, rotating shaft; 213, second pulley; 214, first fan blade; 221, driving motor; 222, shaft; 223, first pulley; 224, transmission belt; 225, horizontal plate; 226, arc plate; 231, first fixing frame; 232, piston cylinder; 233, piston rod; 234, push plate; 235, arc groove; 236, spring; 237, exhaust pipe; 238, air supply Tube; 241, drying box; 242, first connecting pipe; 243, second connecting pipe; 244, drying plate; 245, air flow channel; 246, slot; 251, air storage box; 252, second connecting head; 253, elbow; 254, valve; 255, fixing cylinder; 256, hose; 257, vertical pipe; 258, air nozzle; 259, pressure relief valve; 261, guide box; 262, first guide groove; 263, second guide groove; 271, reciprocating screw; 272, vertical plate; 273, screw nut; 274, second bevel gear; 275, rotating rod; 276, second fixed frame; 277, first bevel gear; 278, second fan blade. DETAILED DESCRIPTION

[0021] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of the specific embodiments of the present invention is given in conjunction with the accompanying drawings. It is obvious that the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary persons in this field without creative work should fall within the scope of protection of the present invention.

[0022] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0023] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive of other embodiments.

[0024] The present invention is described in detail with reference to the accompanying drawings. When describing embodiments of the present invention, cross-sectional views illustrating device structures may be partially enlarged and not to scale for ease of illustration. Furthermore, the accompanying drawings are merely illustrative and should not limit the scope of protection of the present invention. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.

[0025] At the same time, in the description of the present invention, it should be noted that the terms "first, second or third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0026] In this disclosure, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly. For example, they may refer to fixed, removable, or integral connections. They may also refer to mechanical, electrical, or direct connections, indirect connections through an intermediary, or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure.

[0027] Example 1: Figure 1 、 Figure 2 and Figure 5-Figure 9 As shown, a high-precision wire bonding machine for semiconductor manufacturing includes an installation box 101 arranged at the lower part, and multiple ultrasonic driving plates 104 and a group of cooling mechanisms are installed in the installation box 101. An industrial computer 103 is also installed in the installation box 101. The cooling mechanism includes two groups of cooling components, a purge component, two groups of gas supply components and a drive component.

[0028] Two doors 102 are hingedly mounted on the installation box 101, and air intake grilles are provided on both sides of the installation box 101. Two cooling assemblies are installed within the installation box 101, and the cooling assemblies are used to transport air from the installation box 101 to the outside of the installation box 101. A purge assembly is used to purge the welding worktable of the wire bonder 100 with gas. Two gas delivery assemblies are used to deliver gas to the purge assemblies. A drive assembly is used to drive the two cooling assemblies and the two gas delivery assemblies to operate simultaneously.

[0029] Specifically, when the ultrasonic driving board 104 is in operation, the ultrasonic vibration generated causes high-frequency friction between the welding wire and the welding surface (such as copper foil, silicon chip electrode), destroying the surface oxide layer. At the same time, through plastic deformation, atomic-level bonding is formed between metal atoms, and welding can be completed without additional solder.

[0030] However, the ultrasonic driving board 104 generates heat during operation, and the temperature of the ultrasonic driving board 104 itself and the interior of the wire bonding machine 100 will rise. Therefore, the ultrasonic driving board 104 and the interior of the wire bonding machine 100 need to be cooled.

[0031] When the ultrasonic driving board 104 needs to be cooled, the driving component is started to drive the two sets of cooling components to operate, thereby transporting the hot air in the installation box 101 to the outside of the installation box 101, allowing the outside air to enter the installation box 101 through the air intake grille, thereby accelerating the circulation speed of the air in the installation box 101 and improving the heat dissipation efficiency of the ultrasonic driving board 104, thereby facilitating cooling of the ultrasonic driving board 104.

[0032] When the driving component is running, gas is also delivered to the purge component through the gas delivery component. When the welding workbench of the wire bonding machine 100 needs to be cleaned, the gas can be discharged through the purge component, and the welding workbench of the wire bonding machine 100 can be purged by the gas, thereby improving the cleanliness of the welding workbench of the wire bonding machine 100.

[0033] like Figure 7 and Figure 8 As shown, the cooling mechanism also includes a drying assembly, which includes a drying box 241, multiple drying plates 244, and a slot 246. The drying box 241 is placed in the installation box 101 and has two first connecting pipes 242 and a second connecting pipe 243. The first connecting pipe 242 is used to connect to the gas supply assembly. The multiple drying plates 244 are staggeredly installed in the drying box 241, forming airflow channels 245 between the multiple drying plates 244. The slot 246 is provided on the drying box 241.

[0034] Specifically, the drying plates 244 are activated carbon adsorption plates. Gas enters the drying box 241 through the first connecting pipe 242, passes through the airflow channel 245, and contacts the multiple drying plates 244 before being discharged through the second connecting pipe 243. As the gas passes through the drying box 241, the multiple drying plates 244 reduce the humidity of the gas.

[0035] like Figures 9-11As shown, the purge assembly includes an air storage box 251, a curved pipe 253, a fixed tube 255, a fixed tube 255, a hose 256, a vertical pipe 257, and an air nozzle 258. The air storage box 251 is installed in the installation box 101. The air storage box 251 is equipped with multiple reinforcing ribs to improve the pressure resistance of the air storage box 251. A second connector 252 is installed on one side of the air storage box 251. The second connector 252 is detachably connected to the second connecting pipe 243. A one-way valve is installed inside the second connector 252, preventing gas from entering the drying box 241 through the air storage box 251. A pressure relief valve 259 is installed on the air storage box 251. When the air pressure in the air storage box 251 exceeds a preset value, the air will be automatically exhausted and the pressure will be relieved.

[0036] The bent pipe 253 is installed on one side of the air storage box 251, and a valve 254 is installed on the bent pipe 253; the fixed cylinder 255 is installed at the upper end of the bent pipe 253; the hose 256 is fixedly connected to and communicates with the fixed cylinder 255; the vertical pipe 257 is fixedly connected to and communicates with the hose 256; the gas nozzle 258 is installed at the upper end of the vertical pipe 257, and the gas nozzle 258 faces the welding workbench of the wire welding machine 100.

[0037] Specifically, the gas delivered by the gas delivery assembly to the drying box 241 enters the gas storage box 251 through the second connector 252 and is stored in the gas storage box 251. As the gas continues to enter the gas storage box 251, the air pressure in the gas storage box 251 increases. When the welding workbench of the wire bonding machine 100 needs to be cleaned, the valve 254 is opened to allow the gas in the gas storage box 251 to be delivered to the standpipe 257 through the elbow 253 and the hose 256. The gas is then discharged through the gas nozzle 258. The gas discharged from the gas nozzle 258 purges the welding workbench of the wire bonding machine 100, thereby improving the cleanliness of the welding workbench of the wire bonding machine 100.

[0038] like Figure 10 As shown, the cooling mechanism further includes a guide box 261, a first guide groove 262, and a second guide groove 263. The guide box 261 is mounted on the welding workbench of the wire bonding machine 100. The first guide groove 262 is defined on one side of the guide box 261, and the air nozzle 258 is slidably connected to the first guide groove 262. The second guide groove 263 is defined on the bottom surface of the guide box 261, and the vertical pipe 257 is slidably connected to the second guide groove 263.

[0039] Specifically, by providing the guide box 261 , the vertical pipe 257 and the air nozzle 258 can move horizontally along the guide box 261 , thereby facilitating improving the coverage of the air blown out by the air nozzle 258 .

[0040] like Figures 9-11As shown, the cooling mechanism also includes a reciprocating assembly, which includes a reciprocating screw 271, a screw nut 273, a second bevel gear 274, a rotating rod 275, a first bevel gear 277, a rotating rod 275, a first bevel gear 277 and a second fan blade 278.

[0041] Two vertical plates 272 are installed on the top surface of the air storage box 251 . The reciprocating screw 271 passes through the two vertical plates 272 and is rotatably connected to the two vertical plates 272 . One end of the reciprocating screw 271 passes through the fixed cylinder 255 and is rotatably connected to the fixed cylinder 255 .

[0042] The screw nut 273 is sleeved on the reciprocating screw 271, and the screw nut 273 can move back and forth horizontally along the reciprocating screw 271. The screw nut 273 is fixedly connected to the lower end of the vertical tube 257; the second bevel gear 274 is located in the fixed cylinder 255, and the second bevel gear 274 is fixedly connected to the reciprocating screw 271; the rotating rod 275 is installed on the inner wall of the fixed cylinder 255 through the second fixed frame 276; the first bevel gear 277 is fixedly sleeved on the rotating rod 275, and the first bevel gear 277 is meshed with the second bevel gear 274; the second fan blade 278 is installed on the first bevel gear 277.

[0043] Specifically, when valve 254 is opened, gas in gas storage tank 251 enters fixed cylinder 255 through elbow 253 and is then discharged from fixed cylinder 255 through hose 256. When gas enters fixed cylinder 255 through elbow 253, it drives second fan blade 278 to rotate, which in turn drives rotating rod 275 and first bevel gear 277 to rotate, which in turn meshes and drives second bevel gear 274 to rotate, which in turn drives reciprocating screw 271 to rotate. When reciprocating screw 271 rotates, screw nut 273 moves back and forth horizontally along reciprocating screw 271.

[0044] like Figure 6 As shown, the cooling assembly includes a cylinder 211, a rotating shaft 212, a second pulley 213, and a first fan blade 214. The cylinder 211 is installed through the bottom surface of the installation box 101; the rotating shaft 212 is rotatably mounted inside the cylinder 211; the second pulley 213 is fixedly mounted on the rotating shaft 212; and the first fan blade 214 is mounted on the rotating shaft 212.

[0045] Specifically, when the rotating shaft 212 rotates, it drives the first fan blade 214 to rotate, and the rotating first fan blade 214 blows air downward, so that the air in the installation box 101 is quickly transported to the outside of the installation box 101.

[0046] like Figure 7As shown, the air delivery assembly includes a first fixing frame 231, a piston cylinder 232, a push plate 234, and a spring 236. The first fixing frame 231 is mounted on the inner bottom surface of the mounting box 101; the piston cylinder 232 is mounted on the first fixing frame 231, and a piston plate is slidably connected to the piston cylinder 232. The piston plate is mounted on the piston rod 233, and the piston rod 233 is slidably connected to the piston cylinder 232. The bottom surface of the piston cylinder 232 is mounted with an air extraction pipe 237 and an air delivery pipe 238. The air delivery pipe 238 is detachably connected to the first connecting pipe 242 via a first connector. The first connector is rotatably connected to the air delivery pipe, and the first connector is threadedly connected to the first connecting pipe 242. The air extraction pipe 237 and the air delivery pipe 238 are both installed with a one-way valve, so that the air in the piston cylinder 232 can only be discharged in one direction through the air delivery pipe 238. Both the first and second connectors 252 are provided with hand-tightening plates, allowing the first connector to be connected to or disconnected from the first connecting tube 242, and the second connector to be connected to or disconnected from the second connecting tube 243, without the use of tools. The second connector 252 is rotatably connected to the intake pipe of the air storage tank 251, and the second connector 252 is threadedly connected to the second connecting tube 243.

[0047] The push plate 234 is fixedly connected to the upper end of the piston rod 233 , and an arc-shaped groove 235 is formed on the top surface of the push plate 234 ; both ends of the spring 236 are connected to the piston cylinder 232 and the push plate 234 respectively.

[0048] Specifically, when push plate 234 is pressed downward, piston rod 233 and piston plate move downward, thereby delivering air in piston cylinder 232 to drying box 241 via air delivery pipe 238. When push plate 234 is moved upward, piston rod 233 and piston plate move upward, thereby allowing outside air to enter piston cylinder 232 via air extraction pipe 237. By reciprocating and intermittently pressing push plate 234, and with the cooperation of spring 236, air can be continuously delivered to drying box 241 through piston cylinder 232.

[0049] like Figure 5-Figure 7 As shown, the driving assembly includes a driving motor 221 , a shaft 222 , a first pulley 223 , a transverse plate 225 and two arc-shaped plates 226 .

[0050] The driving motor 221 is installed on the inner bottom surface of the installation box 101; the shaft 222 is fixedly connected to the power output shaft of the driving motor 221; the first pulley 223 is fixedly sleeved on the shaft 222, and the first pulley 223 is respectively connected to the two second pulleys 213 through two transmission belts 224; the cross plate 225 is installed on the upper end of the shaft 222; the two arc plates 226 are both installed on the bottom surface of the cross plate 225, and the arc plate 226 matches the arc groove 235.

[0051] Specifically, when the driving motor 221 is running, it will drive the shaft 222 to rotate, and then drive the first pulley 223 to rotate, and then drive the two second pulleys 213 to rotate through the two transmission belts 224, and then drive the two rotating shafts 212 and the two first fan blades 214 to rotate. The rotating first fan blades 214 will blow air downward, so that the air in the installation box 101 is quickly transported to the outside of the installation box 101.

[0052] When the shaft 222 rotates, it also drives the cross plate 225 and the two curved plates 226 to rotate. When the curved plate 226 contacts the push plate 234, it pushes the push plate 234 to move downward. When the curved plate 226 separates from the push plate 234, the rebound force of the spring 236 pushes the push plate 234 to move upward.

[0053] Working principle: During specific use, when it is necessary to cool down the ultrasonic driving plate 104 and the industrial computer 103 in the installation box 101, the driving motor 221 is started to drive the shaft 222 to rotate, thereby driving the first pulley 223 to rotate, and then driving the two second pulleys 213 to rotate through two transmission belts 224, thereby driving the two rotating shafts 212 and the two first fan blades 214 to rotate. The rotating first fan blades 214 will blow air downward, so that the air in the installation box 101 is quickly transported to the outside of the installation box 101, and the outside air enters the installation box 101 through the air intake grille, thereby accelerating the circulation speed of the air in the installation box 101 and improving the heat dissipation efficiency of the ultrasonic driving plate 104, thereby facilitating cooling of the ultrasonic driving plate 104.

[0054] When the shaft 222 rotates, the horizontal plate 225 and the two curved plates 226 are also driven to rotate. When the curved plate 226 contacts the push plate 234, the push plate 234 is pushed downward. When the curved plate 226 separates from the push plate 234, the rebound force of the spring 236 pushes the push plate 234 upward.

[0055] With the cooperation of the rotating curved plate 226 and the spring 236, the piston cylinder 232 continuously delivers air into the drying box 241 through the air delivery pipe 238. After entering the drying box 241, the air passes through the air flow channel 245, contacts the multiple drying plates 244, and is discharged through the second connecting pipe 243. The air discharged through the second connecting pipe 243 is then stored in the air storage box 251. As the air continues to enter the air storage box 251, the air pressure in the air storage box 251 increases.

[0056] When the welding workbench of the wire bonding machine 100 needs to be cleaned, the valve 254 is opened to allow the air in the air storage box 251 to be transported to the vertical pipe 257 through the elbow 253 and the hose 256, and then discharged through the air nozzle 258. The air discharged from the air nozzle 258 will purge the welding workbench of the wire bonding machine 100, removing dust, metal debris and other impurities on the welding workbench, preventing impurities from affecting the bonding of the bonding wire and the welding surface, reducing welding defects, and improving the quality and reliability of welding in the semiconductor manufacturing process.

[0057] And when air enters the fixed cylinder 255 through the bent pipe 253, it will drive the second fan blade 278 to rotate, and then drive the rotating rod 275 and the first bevel gear 277 to rotate, and then engage to drive the second bevel gear 274 to rotate, and then drive the reciprocating screw 271 to rotate. When the reciprocating screw 271 rotates, the screw nut 273 will move back and forth horizontally along the reciprocating screw 271, and then drive the vertical rod and the air nozzle 258 to move back and forth horizontally, thereby facilitating the improvement of the coverage range of the air blown out by the air nozzle 258, ensuring that all areas of the welding workbench can be effectively blown, improving the comprehensiveness of cleaning, further ensuring the cleanliness of the welding environment, and providing protection for high-precision welding.

[0058] When the gas passes through the drying box 241, the drying plate 244 inside the drying box 241 will reduce the humidity of the gas, thereby ensuring that the gas entering the gas storage box 251 and used for purging is dry, preventing the moist gas from condensing on the welding workbench or affecting the metal surface, thereby preventing poor welding caused by moisture.

[0059] Example 2: Figure 3 、 Figure 4 and Figure 7 As shown, when other parts are the same as those in Example 1, the difference between this embodiment and Example 1 is: The bottom surface of the installation box 101 is mounted with four support assemblies, including threaded posts 111, a base 112, a mounting plate 113, and universal wheels 114. The threaded posts 111 are fixedly connected to the bottom surface of the installation box 101; the base 112 is threadedly connected to the threaded posts 111; the mounting plate 113 is sleeved over and threadedly connected to the threaded posts 111; the mounting plate 113 plugs into the slots 246 on the drying box 241. The universal wheels 114 are mounted on the bottom surface of the mounting plate 113.

[0060] Specifically, when the ground is uneven, the corresponding base 112 is rotated to change the position of the base 112 on the threaded column 111, thereby adjusting the height of one corner of the installation box 101, so that the device can be placed stably on the ground.

[0061] Working principle: In actual use, when the device needs to be moved, the box door 102 is opened, the first connector is separated from the first connecting tube 242, and the second connector 252 is separated from the second connecting tube 243, so that the drying box 241 is free from restrictions, and then the drying box 241 is taken out from the installation box 101.

[0062] The slots 246 on the drying box 241 are inserted into the mounting plate 113. Rotating the drying box 241 drives the mounting plate 113, which in turn moves the mounting plate 113 downward along the threaded posts 111. This causes the universal wheels 114 on the mounting plate 113 to contact the ground, separating the base 112 from the ground. The increased lever arm between the drying box 241 and the mounting plate 113 allows for easier rotation to the mounting plate 113.

[0063] Repeat the above operation and make the other three universal wheels 114 contact the ground, so that the device can be pushed more easily and the flexibility of the device is improved.

[0064] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

[0065] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to specific embodiments. Obviously, many modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A high-precision wire bonding machine for semiconductor manufacturing, comprising a mounting box disposed at the bottom, wherein a plurality of ultrasonic drive plates and a set of cooling mechanisms are mounted in the mounting box, characterized in that: The cooling mechanism comprises: Two sets of cooling components are installed in the installation box and are used to transport the air in the installation box to the outside of the installation box; a purge assembly, used for purging the welding workbench of the wire bonding machine with gas; Two sets of gas delivery components, used for delivering gas into the purge component; The driving assembly is used to drive the two groups of cooling assemblies and the two groups of gas delivery assemblies to operate simultaneously.

2. The high-precision wire bonding machine for semiconductor manufacturing according to claim 1, wherein: The cooling mechanism further includes a drying component, which includes: A drying box is placed in the installation box and has two first connecting pipes and one second connecting pipe, wherein the first connecting pipes are used to connect to the gas transmission component; A plurality of drying plates are staggeredly installed in the drying box, and air flow channels are formed between the plurality of drying plates; The card slot is provided on the drying box.

3. The high-precision wire bonding machine for semiconductor manufacturing according to claim 2, wherein: The purge assembly comprises: An air storage box is installed in the installation box, and a second connector is installed on one side of the air storage box, and the second connector is detachably connected to the second connecting pipe; an elbow, installed on one side of the gas storage box and having a valve installed thereon; A fixed cylinder, mounted on the upper end of the elbow; A hose, fixedly connected to and in communication with the fixing cylinder; a vertical pipe, fixedly connected to and in communication with the hose; An air nozzle is installed at the upper end of the vertical pipe and faces the welding workbench of the wire welding machine.

4. The high-precision wire bonding machine for semiconductor manufacturing according to claim 3, wherein: The cooling mechanism further comprises: A guide box is mounted on the welding workbench of the wire bonding machine; a first guide groove, which is provided on one side of the guide box, and the air nozzle is slidably connected to the first guide groove; The second guide groove is provided on the bottom surface of the guide box, and the vertical pipe is slidably connected to the second guide groove.

5. The high-precision wire bonding machine for semiconductor manufacturing according to claim 3, wherein: The cooling mechanism further includes a reciprocating assembly, which includes: A reciprocating screw is mounted on the top surface of the air storage box via two vertical plates, and one end of the reciprocating screw is rotatably connected to the fixed cylinder; A screw nut, sleeved on the reciprocating screw, fixedly connected to the lower end of the vertical tube; a second bevel gear, located in the fixed cylinder and fixedly connected to the reciprocating screw; A rotating rod is mounted on the inner wall of the fixing cylinder via a second fixing bracket; a first bevel gear, fixedly sleeved on the rotating rod and meshingly connected with the second bevel gear; The second fan blade is mounted on the first bevel gear.

6. The high-precision wire bonding machine for semiconductor manufacturing according to claim 2, wherein: The cooling component comprises: A cylinder is installed through the bottom surface of the installation box; A rotating shaft, rotatably mounted inside the cylinder; a second pulley fixedly sleeved on the rotating shaft; The first fan blade is mounted on the rotating shaft.

7. The high-precision wire bonding machine for semiconductor manufacturing according to claim 6, wherein: The gas delivery assembly comprises: A first fixing bracket is installed on the inner bottom surface of the installation box; A piston cylinder is mounted on the first fixing frame, wherein a piston plate is slidably connected to the interior of the piston cylinder, a piston rod is mounted on the piston plate, the piston rod is slidably connected to the piston cylinder, an air extraction pipe and an air supply pipe are mounted on the bottom surface of the piston cylinder, and the air supply pipe is detachably connected to the first connecting pipe; A push plate, fixedly connected to the upper end of the piston rod, with an arc-shaped groove formed on its top surface; The two ends of the spring are respectively connected to the piston cylinder and the push plate.

8. The high-precision wire bonding machine for semiconductor manufacturing according to claim 7, wherein: The drive assembly includes: A driving motor is installed on the inner bottom surface of the installation box; A shaft, fixedly connected to the power output shaft of the drive motor; a first pulley, fixedly sleeved on the shaft, the first pulley being connected to the two second pulleys respectively through two transmission belts; a transverse plate mounted on the upper end of the shaft; Two arc-shaped plates are both installed on the bottom surface of the horizontal plate and matched with the arc-shaped groove.

9. The high-precision wire bonding machine for semiconductor manufacturing according to claim 2, wherein: Four sets of support components are installed on the bottom surface of the installation box, and the support components include: A threaded column fixedly connected to the bottom surface of the installation box; a base, threadedly connected to the threaded column; A mounting plate is sleeved on the threaded column and is threadedly connected to the threaded column and plugged into the slot; The universal wheel is mounted on the bottom surface of the mounting plate.

10. The high-precision wire bonding machine for semiconductor manufacturing according to claim 1, wherein Two doors are hingedly mounted on the installation box, and air intake grilles are arranged on both sides of the installation box.

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