Semiconductor double-sided grinding equipment

Abstract

The invention provides semiconductor double-sided grinding equipment, and relates to the technical field of semiconductor grinding, the semiconductor double-sided grinding equipment comprises a wafer ring, an inner cavity of the wafer ring is used for clamping and positioning a wafer, and four insertion plates are uniformly arranged on the outer wall of the wafer ring; the two conveying rails are arranged in parallel; a plurality of groups of clamping assemblies are arranged on the outer wall of each conveying track; the outer sides of the two ends of the whole formed by the two conveying rails are each provided with a grinding assembly; in the conveying direction of the conveying rails, a material moving assembly, a thickness detecting assembly, a film covering assembly and a film tearing assembly are sequentially arranged between the two conveying rails, and the material moving assembly is used for transferring wafer rings between the grinding assembly and the conveying rails; the thickness detection assembly is used for detecting the thickness of the wafer and outputting an unqualified wafer; the film laminating assembly is used for laminating a baffle film on one surface of the wafer ring; the film tearing assembly is used for tearing off the used baffle film on the wafer ring; according to the invention, film coating and overturning film tearing of the wafer can be realized, and the double-sided grinding efficiency is improved.

Description

[0001] This application is a divisional application of the invention application with the application date of November 25, 2024, Chinese application number 202411687671X, and invention name “A kind of automated semiconductor polishing equipment”. Technical Field

[0002] The present invention relates to the technical field of semiconductor polishing equipment, and in particular to a semiconductor double-side polishing equipment. Background Art

[0003] Wafer grinding and thinning is a key process step in semiconductor manufacturing. Its main purpose is to reduce the thickness of the silicon wafer to a specific size requirement. In semiconductor chip manufacturing, the initial thickness of the silicon wafer may exceed the actual chip manufacturing requirements due to factors such as the growth process. Grinding and thinning is necessary to accurately control the thickness of the silicon wafer. The grinder is the main equipment, usually consisting of a grinding disk and a carrier that holds the silicon wafer.

[0004] After grinding one side of a silicon wafer, it needs to be turned over and ground on the other side. This way, the wafer can be reduced in thickness and double-sided polished. However, the current double-sided grinding and thickness reduction work has the following shortcomings:

[0005] After one side is ground, workers need to remove the wafer ring, apply a new film, and then tear off the old film. The entire operation process is cumbersome and the preparation time for changing the side is long. Summary of the Invention

[0006] In view of the deficiencies in the prior art, the present invention provides a semiconductor double-side polishing device, which solves the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] A semiconductor double-side polishing device, comprising:

[0009] The inner cavity is used to clamp and position the wafer ring, and four inserts are evenly arranged on its outer wall;

[0010] Two parallel conveyor tracks; each conveyor track is equipped with multiple sets of clamping components on the outer wall, and the wafer ring between the two conveyor tracks can be clamped, transported and flipped by the clamping components on both sides;

[0011] A grinding assembly is provided on the outer sides of both ends of the two conveying tracks.

[0012] The grinding assembly includes a lower base body, on which a support plate and a constraint assembly for clamping and positioning the wafer ring are provided, and the support plate is arranged in the constraint assembly, and a lifting grinding disc is provided above the support plate;

[0013] In the conveying direction of the conveying track, the material moving assembly, thickness detection assembly, film laminating assembly and film tearing assembly are arranged in sequence between the two conveying tracks, wherein:

[0014] A material transfer assembly, used to transfer wafer rings between the grinding assembly and the conveyor track;

[0015] Thickness detection component, used to detect the thickness of wafers and output unqualified wafers;

[0016] The covering assembly is used to cover a blocking film on one side of the wafer ring, and the area of ​​the blocking film is larger than the area of ​​the wafer ring;

[0017] The film tearing assembly is used to tear off the used blocking film on the wafer ring.

[0018] Furthermore, a flushing component is provided outside the support plate; the flushing component includes a cutting fluid cleaning agent storage box, a sealing cover, a second driving rod, and a vertical guide rail. The vertical guide rail is provided outside the corresponding support plate, and the second driving rod is arranged horizontally, and one end thereof is connected to the vertical guide rail and the other end is connected to the horizontally arranged sealing cover; the sealing cover is opened downward, and a spray head is provided on the vertical wall of its inner cavity and a jet plate is symmetrically slidably provided on the top of the inner cavity; the cutting fluid cleaning agent storage box is provided outside the sealing cover and is connected to the spray head through a conduit; when flushing the wafer, the sealing cover is sealed and docked with the wafer ring with a baffle film attached to the bottom to form a closed cleaning chamber; the spray head is tilted downward to discharge the cutting fluid cleaning agent to flush the wafer, and the cutting fluid cleaning agent in the sealing cover is intermittently extracted; the two groups of jet plates move horizontally in opposite directions to air-dry the wafer.

[0019] Furthermore, the constraint assembly includes a constraint frame and two first drive rods; the constraint frame is annular and is arranged on the top of the lower seat body, the support plate is arranged in the constraint frame, and a liquid guide cavity is left between the support plate; the two first drive rods are symmetrically installed on the outer wall of the constraint frame, and the inner end of the first drive rod is connected to the first rectangular insert provided in the constraint frame, and the first rectangular insert is used to cooperate with the insert plate; the side of the constraint frame is connected to the cutting fluid recovery tank through a liquid pump, and the outlet end of the cutting fluid recovery tank is connected to the liquid spray pipe provided on the constraint frame.

[0020] Furthermore, the outer wall of the support plate is rotatably sleeved with a cleaning ring arranged below the first rectangular insert; the outer wall of the cleaning ring is connected to the cleaning plate, and a first motor that drives the cleaning ring to rotate is installed in the support plate.

[0021] Furthermore, the clamping assembly includes a base, a third driving rod, and a second motor. A third driving rod is rotatably installed inside each base and a second motor is installed at the rotating connection. The output end of the third driving rod is connected to the second rectangular insert, and the second rectangular insert is used to cooperate with the insert plate; the second motor is used to drive the third driving rod to rotate.

[0022] Furthermore, the material moving assembly includes a first transverse guide rail arranged above the two conveying rails, the extension direction of the first transverse guide rail is parallel to the extension direction of the conveying rail, the bottom surface of the first transverse guide rail is vertically slidably installed with a hanging plate, the bottom end of the hanging plate is slidably provided with a second transverse guide rail, the surface of the second transverse guide rail is provided with a rack, the bottom end side wall of the hanging plate is provided with a third motor for driving the second transverse guide rail to move horizontally, the bottom surface of the second transverse guide rail is slidably installed with a fourth motor, the output end of the fourth motor is connected to the double-headed screw seat, the bottom of the double-headed screw seat is symmetrically slidably installed with a fifth drive rod, the bottom end of the fifth drive rod is provided with a third rectangular insert, and the third rectangular insert is used to cooperate with the insert plate.

[0023] Furthermore, the thickness detection assembly includes a top frame, a bottom frame, a thickness measuring probe and a reference plate. The top frame is arranged above the conveying track, and a plurality of groups of thickness measuring probes are provided on its bottom surface. The bottom frame is arranged below the conveying track, and a plurality of groups of reference plates are provided on its upper surface, and each group of reference plates corresponds to a group of thickness measuring probes. The two ends of the bottom frame are rotatably connected to the vertical plates and a fifth motor is installed at the rotating connection. Adsorption holes are provided on the surface of the reference plate. A waste box is provided below the bottom frame, and the inner wall of the waste box is symmetrically provided with vertical slide rails. The bottom end of the vertical plate is slidably embedded in the vertical slide rails.

[0024] Furthermore, the laminating assembly includes a film-releasing wheel, a film-collecting wheel, a recovery wheel, a circular cutter, a top plate and a bottom plate. Sixth driving rods are installed at both ends of the bottom surface of the top plate. The bottom ends of the two sixth driving rods are respectively connected to the film-releasing wheel and the film-collecting wheel. A recovery wheel is installed on one side of the film-releasing wheel. A seventh driving rod is provided in the middle of the bottom surface of the top plate. The bottom end of the seventh driving rod is connected to the circular cutter. An eighth driving rod is vertically provided on the top surface of the bottom plate. A resistance ring frame is provided on the top of the eighth driving rod. The outside of the film-releasing wheel is wound with a protective belt, the bottom surface of the protective belt is coated with release paper, and the recovery wheel is used to roll up the release paper; the circular cutter is used to open a blocking film on the protective belt, and the blocking film is provided with a glue layer.

[0025] Furthermore, the film tearing assembly includes a third transverse guide rail, a fourth driving rod is vertically slidably mounted on the bottom surface of the third transverse guide rail, and a film tearing clamp is connected to the bottom end of the fourth driving rod, which is used to clamp the protruding part of the used barrier film.

[0026] The present invention provides a semiconductor double-side polishing device. Compared with the prior art, it has the following advantages:

[0027] 1. The outer wall of the wafer ring is equipped with four sets of inserts, which can facilitate the turnover and positioning of the wafer ring at each station;

[0028] 2. During the grinding process, the cutting fluid can be sealed by the constraint component, and then the cutting fluid and cutting impurities can be extracted to the cutting fluid recovery box in real time, realizing the rapid recovery of the cutting fluid and making the working site cleaner;

[0029] 3. After the upper surface is ground, a flushing component can be set up to spray water to clean the cutting fluid, which is convenient for subsequent turnover. At the same time, the cleaning process is a closed operation, which can prevent the cutting fluid cleaning agent from entering the constraint component and avoid contaminating the repeatedly used cutting fluid;

[0030] 4. In order to improve the efficiency of double-sided grinding, after the wafer is ground and thickened in a set of grinding components, the material moving component can automatically grab the wafer and put it into the conveying track, thus realizing automatic unloading of the wafer; the film covering component can be used to make a blocking film and cover the top of the wafer ring. After the film covering is completed, the wafer ring can rotate so that the newly covered blocking film is placed under the wafer to stop the wafer, and the old blocking film is placed on top; the subsequent film tearing component can directly tear off the old film on the top, thus completing the automatic flipping and film changing. Finally, the material moving component transfers the wafer to the next set of grinding components. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 A schematic side cross-sectional view of the semiconductor double-side polishing apparatus of the present invention is shown;

[0033] Figure 2 A schematic diagram of the distribution structure of the sealing cover and the restraining assembly of the present invention is shown;

[0034] Figure 3 A schematic diagram of a top cross-sectional structure of a constraining frame of the present invention is shown;

[0035] Figure 4 A schematic diagram of the sealing cover connection structure of the present invention is shown;

[0036] Figure 5 Shows a schematic structural diagram of the material moving assembly of the present invention;

[0037] Figure 6 It shows a schematic diagram of the cross-sectional structure of the thickness detection assembly of the present invention;

[0038] Figure 7 shows a schematic diagram of the reference plate distribution structure of the present invention;

[0039] Figure 8 A schematic diagram of the side cross-sectional structure of the film covering assembly of the present invention is shown;

[0040] Figure 9 A schematic diagram of the surface structure of the barrier film of the present invention is shown;

[0041] Figure 10 A schematic diagram of the side cross-sectional structure of the film tearing assembly of the present invention is shown;

[0042] As shown in the figure: 1. Grinding assembly, 11. Main box, 12. Grinding disc, 13. Lower seat, 131. Support plate, 14. Constraint assembly, 141. Constraint frame, 142. First drive rod, 143. First rectangular insert, 15. Spray pipe, 16. Cutting fluid recovery box, 17. Cleaning ring, 171. Cleaning plate, 172. First motor, 2. Flushing assembly, 21. Vertical guide rail, 22. Second drive rod, 23. Sealing cover, 231. Spray head, 232. Jet plate, 24. Cutting fluid cleaning agent storage tank, 3. Transfer channel, 31. Conveying track, 4. Clamping assembly, 41. Base, 42. Third drive rod, 43. Second motor, 44. Second rectangular insert, 5. Material moving assembly, 51. First horizontal guide rail, 52. Hanging plate, 53. Second horizontal guide rail, 531. Rack, 5 4. Third motor, 55. Fourth motor, 56. Double-headed screw seat, 57. Fifth drive rod, 58. Third rectangular insert, 6. Thickness detection assembly, 61. Top frame, 62. Thickness measuring probe, 63. Bottom frame, 64. Reference plate, 641. Adsorption hole, 65. Vertical plate, 66. Fifth motor, 67. Waste box, 68. Vertical slide rail, 7. Laminating assembly, 71. Top plate, 72. Sixth drive rod, 73. Film release wheel, 74. Film collection wheel, 75. Recovery wheel, 76. Seventh drive rod, 77. Circular cutter, 78. Eighth drive rod, 79. Contact ring frame, 8. Protective belt, 81. Block film, 82. Adhesive layer, 9. Film tearing assembly, 91. Hanging plate, 92. Fourth drive rod, 93. Third horizontal guide rail, 94. Film tearing clamp, 9a. Wafer ring, 91a. Insert plate, 9b. Wafer. DETAILED DESCRIPTION

[0043] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0044] In order to solve the technical problems in the background technology, a semiconductor double-side polishing device is provided as follows:

[0045] Combine Figures 1-10 As shown, the present invention provides a semiconductor double-side polishing device, comprising a transfer channel 3;

[0046] The grinding assembly 1 is symmetrically arranged at both ends of the transfer channel 3. The two groups of grinding assemblies 1 are used to grind and reduce the thickness of the two sides of the wafer respectively; the grinding assembly 1 includes a main box 11, a liftable grinding disc 12 is installed on the top of the main box 11, a lower base 13 is provided at the bottom of the main box 11, a support plate 131 is provided in the middle of the surface of the lower base 13, a restraining assembly 14 and a liquid spray pipe 15 are installed on the top of the support plate 131, and a cutting fluid recovery box 16 is installed on the outside of the main box 11. The side of the restraining assembly 14 is connected to the cutting fluid recovery box 16, and the outlet end of the cutting fluid recovery box 16 is connected to the liquid spray pipe 15;

[0047] The rinsing assembly 2 is slidably mounted inside the main housing 11 and is used to remove residual liquid from the upper surface of the wafer for subsequent lamination;

[0048] Wafer ring 9a, which holds wafer 9b in place. A barrier film 81 is applied to one side of the ring. The barrier film 81 is larger than the area of ​​the ring. Four plates 91a are arranged in a circular array on the outer wall of the ring.

[0049] The conveying tracks 31 are symmetrically arranged inside the transfer channel 3. The processing area is located between the two sets of conveying tracks 31. The processing area is divided into the loading position, the first processing position, the second processing position, the third processing position and the unloading position in the conveying direction. The outer wall of the conveying track 31 is provided with multiple groups of clamping components 4, which cooperate with the insert plate of the wafer ring;

[0050] The material transfer assembly 5 is installed at the internal loading position of the transfer channel 3. The material transfer assembly 5 is used to transfer the wafers in one group of grinding assemblies 1 to the conveying track 31, and then transfer the wafers to another group of grinding assemblies 1;

[0051] A thickness detection assembly 6 is installed at the first processing position of the processing area. The thickness detection assembly 6 is used to detect the thickness of the wafer and output unqualified wafers;

[0052] The film covering assembly 7 is installed at the second processing position of the processing area, and the film covering assembly 7 is used to cover the blocking film 81 on the upper surface of the wafer ring;

[0053] The film tearing assembly 9 is installed at the third processing position of the processing area. The film tearing assembly 9 is used to tear off the used blocking film 81 on the wafer ring.

[0054] In the above scheme:

[0055] 1. The outer wall of the wafer ring is equipped with four sets of inserts, which can facilitate the turnover and positioning of the wafer ring at each station;

[0056] 2. During the grinding process, the cutting fluid can be sealed by the constraint component, and then the cutting fluid and cutting impurities can be extracted to the cutting fluid recovery box in real time, realizing the rapid recovery of the cutting fluid and making the working site cleaner;

[0057] 3. After the upper surface is ground, a flushing component can be set up to spray water to clean the cutting fluid, which is convenient for subsequent turnover. At the same time, the cleaning process is a closed operation, which can prevent the cutting fluid cleaning agent from entering the constraint component and avoid contaminating the repeatedly used cutting fluid;

[0058] 4. In order to improve the efficiency of double-sided grinding, a transfer channel is designed to be located between the two groups of grinding components. After the wafer is ground and thickened in one group of grinding components, the material moving component can automatically grab the wafer and put it into the conveying track, thus realizing automatic unloading of the wafer; the film covering component can be used to make a blocking film and cover the top of the wafer ring. After the film covering is completed, the wafer ring can rotate so that the newly covered blocking film is placed under the wafer to stop the wafer, and the old blocking film is placed on top; the subsequent film tearing component can directly tear off the old film on the top, thus completing the automatic flipping and film changing. Finally, the material moving component transfers the wafer to the next group of grinding components.

[0059] In this embodiment, the flushing assembly 2 includes a cutting fluid cleaning agent storage box 24, a sealing cover 23, a second driving rod 22, and a vertical guide rail 21. The vertical guide rail 21 is provided on the inner side of the main box body 11, and the inner end of the second driving rod 22 slides vertically and is embedded in the vertical guide rail 21. The second driving rod 22 is arranged horizontally, and the output end of the second driving rod 22 is connected to the horizontally arranged sealing cover 23. The opening of the sealing cover 23 faces downward, and a liquid spray head 231 is provided on the inner side of the sealing cover 23. The inner top of the sealing cover 23 is symmetrically slidably provided with a jet plate 232. The cutting fluid cleaning agent storage box 24 is provided on the outer wall of the main box body 11, and the cutting fluid cleaning agent storage box 24 is connected to the sealing cover 23 through a conduit; when flushing the wafer, the sealing cover 23 is sealed and docked on the wafer ring to form an airtight cleaning chamber; the liquid spray head 231 is tilted downward to discharge the cutting fluid cleaning agent to flush the wafer, and the cutting fluid cleaning agent in the sealing cover 23 is intermittently extracted; the two groups of jet plates 232 move horizontally in opposite directions to air-dry the wafer.

[0060] In the above scheme: during seal cleaning, the second driving rod drives the sealing cover to move above the wafer ring, and then the second driving rod descends along the vertical guide rail so that the sealing cover is sealed and fits above the wafer ring; then the side liquid spray head works first, and the cutting fluid cleaning agent is sprayed onto the wafer to clean the cutting fluid. Various liquids gather in the sealing cover and will not splash out. Then the pump body extracts the mixed liquid in the sealing cover. After the extraction is completed, the two sets of jet plates slide outward synchronously, which can exhaust air downward to dry the wafer. The airflow is evenly distributed and the drying effect is good.

[0061] In this embodiment, the constraint assembly 14 includes a constraint frame 141 and a first driving rod 142. The constraint frame 141 is annular and is arranged on the surface of the lower seat body 13. The constraint frame 141 is spaced apart on the outside of the support plate 131. A liquid guide cavity is left between the constraint frame 141 and the support plate 131. The outer wall of the constraint frame 141 is symmetrically installed with the first driving rod 142. The inner end of the first driving rod 142 is provided with a first rectangular insert 143, and the first rectangular insert 143 is inserted into the insert plate; the side of the constraint frame 141 is connected to the cutting fluid recovery tank 16 through a liquid pump.

[0062] In the above scheme: after the wafer ring is placed on the support plate, the first driving rod drives the first rectangular insert to move inward, and the first rectangular insert is inserted into the insert plate. In this way, the wafer ring can be clamped and positioned, effectively ensuring the stability of the wafer ring and wafer during the grinding process; the constraint frame can also enclose the cutting fluid to prevent the cutting fluid from flowing into the equipment, reduce the contaminated area, and facilitate cleaning.

[0063] In this embodiment, the outer wall of the support plate 131 is rotatably sleeved with a cleaning ring 17, the outer wall of the cleaning ring 17 is connected to a cleaning plate 171, the cleaning ring is arranged at the bottom of the first rectangular insert, and a first motor 172 for driving the cleaning ring 17 to rotate is installed inside the support plate 131, and the cleaning plate 171 is used to push the liquid and impurities in the liquid guide cavity to the inlet of the liquid pump.

[0064] Tracking of the above solution: When the liquid pump extracts the cutting fluid, impurities will accumulate in the liquid guide cavity and cannot be completely cleaned. In order to thoroughly clean the impurities, the first motor can drive the cleaning ring to rotate, and then drive the cleaning plate to rotate in the liquid guide cavity, which can push the impurities and liquid to the outlet of the constraint frame and can be immediately extracted by the liquid pump to achieve sufficient cleaning.

[0065] In this embodiment, the clamping assembly 4 includes a base 41, a third driving rod 42, and a second motor 43. The base 41 is symmetrically arranged on two groups of conveying rails 31. The interior of each group of bases 41 is rotatably installed with a third driving rod 42 and a second motor 43 is installed at the rotating connection. The output end of the third driving rod 42 is connected to the second rectangular insert 44, and the second rectangular insert 44 is plugged into the insert plate; the second motor 43 is used to drive the third driving rod 42 to rotate to change the orientation of the wafer.

[0066] In the above scheme: after the wafer ring is placed on the conveying track, a clamping assembly is provided to ensure stable conveying of the wafer ring and perform coordinated actions; the third driving rod can drive the second rectangular insert to be inserted into the other two sets of insert plates to achieve clamping and material picking. When it is necessary to turn over and tear the film, the second motor drives the third driving rod to rotate.

[0067] In this embodiment, the material moving assembly 5 includes a first transverse guide rail 51, which is arranged on the inner top surface of the transfer channel 3. A hanging plate 52 is vertically slidably installed on the bottom surface of the first transverse guide rail 51, and a second transverse guide rail 53 is slidably provided on the bottom end of the hanging plate 52. A rack 531 is provided on the surface of the second transverse guide rail 53, and a third motor 54 for driving the second transverse guide rail 53 to move horizontally is provided on the bottom end side wall of the hanging plate 52. A fourth motor 55 is slidably installed on the bottom surface of the second transverse guide rail 53, and the output end of the fourth motor 55 is connected to a double-headed screw seat 56. A fifth drive rod 57 is symmetrically slidably installed on the bottom of the double-headed screw seat 56. The bottom end of the fifth drive rod 57 is provided with a third rectangular insert 58, and the third rectangular insert 58 is plugged into the insert plate.

[0068] In the above scheme: the material moving assembly is designed as a three-stage translation structure to meet the needs of loading and unloading of two groups of grinding assemblies. The hanging plate moves along the first horizontal guide rail, the third motor can drive the second horizontal guide rail for secondary horizontal movement, the fourth motor can perform tertiary horizontal movement along the second horizontal guide rail, the fourth motor can drive the double-headed screw seat to rotate, so as to switch the third rectangular insert to dock with any two groups of insert plates, the fifth drive rod can drive the third rectangular insert to descend, and then the fifth drive rod moves synchronously along the double-headed screw seat to realize wafer ring docking.

[0069] In this embodiment, the thickness detection assembly 6 includes a top frame 61, a bottom frame 63, a thickness measuring probe 62 and a reference plate 64. The top frame 61 is arranged at the top of the conveying track 31, and the bottom surface of the top frame 61 is provided with multiple groups of thickness measuring probes 62. The bottom frame 63 is arranged at the bottom of the conveying track 31, and the surface of the bottom frame 63 is provided with multiple groups of reference plates 64, and each group of reference plates 64 corresponds to a group of thickness measuring probes 62.

[0070] In the above scheme: the ground wafer is transported to the bottom of the thickness gauge probe by the clamping assembly. During the process, multiple sets of thickness gauge probes can perform linear fitting detection on the surface of the wafer, realizing multi-point comprehensive detection, so as to quickly determine whether the thickness of the wafer is qualified. There is no need for separate detection. The reference plate can be used as the basis for adjusting the side head probe.

[0071] In this embodiment, the two ends of the base frame 63 are rotatably connected to the vertical plates 65 and a fifth motor 66 is installed at the rotating connection. Adsorption holes 641 are provided on the surface of the reference plate 64. A waste box 67 is provided on the bottom surface of the transfer channel 3. The inner wall of the waste box 67 is symmetrically provided with vertical slide rails 68. The bottom end of the vertical plate 65 is slidably embedded in the vertical slide rail 68.

[0072] In the above scheme: when the thickness of a wafer is detected to be unqualified, the adsorption hole can adsorb and position the wafer from the bottom, and then the clamping assembly is unlocked, the vertical plate moves downward along the vertical slide rail, and the fifth motor drives the wafer to rotate so that the reference plate is located above. Subsequently, the vertical plate continues to descend, causing the wafer to fall into the waste box. After placement, the adsorption hole no longer adsorbs.

[0073] The top of the eighth drive rod 78 is provided with a resistance ring frame 79, which is relatively fitted to the outside of the wafer ring. The outside of the film-releasing wheel 73 is wound with a protective tape 8, and the bottom surface of the protective tape 8 is coated with release paper. The recovery wheel 75 is used to roll up the release paper; the ring cutter 77 is used to open a blocking film 81 on the protective tape 8, and the blocking film 81 is provided with a glue layer 82.

[0074] In the above scheme: during lamination, the film-releasing wheel releases the protective tape, the release paper is rolled up on the recovery wheel, and the new protective tape is placed above the wafer ring. The sixth driving rod drives the film-releasing wheel and the film-recovering wheel to descend, and the eighth driving rod drives the contact ring frame to move upward. The contact ring frame is placed on the outside of the wafer ring, and the adhesive layer of the protective tape is bonded to the wafer ring. Then the seventh driving rod drives the circular cutter to move downward and contact the contact ring frame, and the circular cutter cuts a circular barrier film in the protective tape.

[0075] In this embodiment, the film tearing assembly 9 includes a hanging plate 91, a fourth driving rod 92 is vertically provided below the hanging plate 91, the top end of the fourth driving rod 92 is connected to the third horizontal guide rail 93, and the bottom end of the fourth driving rod 92 is installed with a film tearing clamp 94, which is used to clamp the front end protruding part of the used blocking film 81.

[0076] In the above solution, when tearing the film, the film tearing claw clamps the front end protruding part of the blocking film, and then the fourth driving rod drives the film tearing claw to move upward, and the fourth driving rod then moves along the third transverse guide rail to tear off the blocking film.

[0077] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0078] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A semiconductor double-side polishing device, characterized in that: include: The inner cavity is used to clamp and position the wafer ring, and four inserts are evenly arranged on its outer wall; Two parallel conveyor tracks; each conveyor track is equipped with multiple sets of clamping components on the outer wall, and the wafer ring between the two conveyor tracks can be clamped, transported and flipped by the clamping components on both sides; A grinding assembly is provided on the outer sides of both ends of the two conveying tracks. The grinding assembly includes a lower base body, on which a support plate and a constraint assembly for clamping and positioning the wafer ring are provided, and the support plate is arranged in the constraint assembly, and a lifting grinding disc is provided above the support plate; In the conveying direction of the conveying track, the material moving assembly, thickness detection assembly, film laminating assembly and film tearing assembly are arranged in sequence between the two conveying tracks, wherein: A material transfer assembly, used to transfer wafer rings between the grinding assembly and the conveyor track; Thickness detection component, used to detect the thickness of wafers and output unqualified wafers; The covering assembly is used to cover a blocking film on one side of the wafer ring, and the area of ​​the blocking film is larger than the area of ​​the wafer ring; The film tearing assembly is used to tear off the used blocking film on the wafer ring.

2. A semiconductor double-side polishing device according to claim 1, characterized in that: A flushing component is also provided outside the support plate; the flushing component includes a cutting fluid cleaning agent storage box, a sealing cover, a second driving rod, and a vertical guide rail. The vertical guide rail is provided outside the corresponding support plate, and the second driving rod is arranged horizontally, and one end thereof is connected to the vertical guide rail and the other end is connected to the horizontally arranged sealing cover; the sealing cover is opened downward, and a spray head is provided on the vertical wall of its inner cavity and a jet plate is symmetrically slidably provided on the top of the inner cavity; the cutting fluid cleaning agent storage box is provided outside the sealing cover and is connected to the spray head through a conduit; when flushing the wafer, the sealing cover is sealed and docked with the wafer ring with a baffle film attached to the bottom to form a closed cleaning chamber; the spray head is tilted downward to discharge the cutting fluid cleaning agent to flush the wafer, and the cutting fluid cleaning agent in the sealing cover is intermittently extracted; the two groups of jet plates move horizontally in opposite directions to air-dry the wafer.

3. A semiconductor double-side polishing device according to claim 1, characterized in that: The constraint assembly includes a constraint frame and two first driving rods; the constraint frame is annular and is arranged on the top of the lower seat body, the support plate is arranged in the constraint frame, and a liquid guide cavity is left between the support plate; the two first driving rods are symmetrically installed on the outer wall of the constraint frame, and the inner ends of the first driving rods are connected to the first rectangular insert provided in the constraint frame, and the first rectangular insert is used to cooperate with the insert plate; the side of the constraint frame is connected to the cutting fluid recovery tank through a liquid pump, and the outlet end of the cutting fluid recovery tank is connected to the spray pipe provided on the constraint frame.

4. A semiconductor double-side polishing device according to claim 3, characterized in that: The outer wall of the supporting plate is rotatably sleeved with a cleaning ring arranged below the first rectangular insert; the outer wall of the cleaning ring is connected to the cleaning plate, and a first motor driving the cleaning ring to rotate is installed in the supporting plate.

5. The semiconductor double-side polishing device according to claim 1, wherein: The clamping assembly includes a base, a third driving rod, and a second motor. The third driving rod is rotatably installed inside each base and the second motor is installed at the rotating connection. The output end of the third driving rod is connected to the second rectangular insert, and the second rectangular insert is used to cooperate with the insert plate; the second motor is used to drive the third driving rod to rotate.

6. The semiconductor double-side polishing device according to claim 1, wherein: The material moving assembly includes a first transverse guide rail arranged above the two conveying rails, the extension direction of the first transverse guide rail is parallel to the extension direction of the conveying rail, the bottom surface of the first transverse guide rail is vertically slidably installed with a hanging plate, the bottom end of the hanging plate is slidably provided with a second transverse guide rail, the surface of the second transverse guide rail is provided with a rack, the bottom end side wall of the hanging plate is provided with a third motor for driving the second transverse guide rail to move horizontally, the bottom surface of the second transverse guide rail is slidably installed with a fourth motor, the output end of the fourth motor is connected to the double-headed screw seat, the bottom of the double-headed screw seat is symmetrically slidably installed with a fifth drive rod, the bottom end of the fifth drive rod is provided with a third rectangular insert, and the third rectangular insert is used to cooperate with the insert plate.

7. The semiconductor double-side polishing device according to claim 1, wherein: The thickness detection assembly includes a top frame, a bottom frame, a thickness measuring probe and a reference plate. The top frame is arranged above the conveying track, and a plurality of groups of thickness measuring probes are provided on its bottom surface. The bottom frame is arranged below the conveying track, and a plurality of groups of reference plates are provided on its upper surface, and each group of reference plates corresponds to a group of thickness measuring probes. The two ends of the bottom frame are rotatably connected to the vertical plates, and a fifth motor is installed at the rotating connection. Adsorption holes are provided on the surface of the reference plate. A waste box is provided below the bottom frame, and vertical slide rails are symmetrically provided on the inner wall of the waste box. The bottom ends of the vertical plates are slidably embedded in the vertical slide rails.

8. The semiconductor double-side polishing device according to claim 1, wherein: The laminating assembly includes a film-releasing wheel, a film-collecting wheel, a recovery wheel, a circular cutter, a top plate and a bottom plate. Sixth driving rods are installed at both ends of the bottom surface of the top plate. The bottom ends of the two sixth driving rods are respectively connected to the film-releasing wheel and the film-collecting wheel. A recovery wheel is installed on one side of the film-releasing wheel. A seventh driving rod is provided in the middle of the bottom surface of the top plate. The bottom end of the seventh driving rod is connected to the circular cutter. An eighth driving rod is vertically provided on the top surface of the bottom plate. A resistance ring frame is provided on the top of the eighth driving rod. A protective belt is wound on the outside of the film-releasing wheel. The bottom surface of the protective belt is coated with release paper. The recovery wheel is used to roll up the release paper; the circular cutter is used to open a blocking film on the protective belt, and a glue layer is provided on the blocking film.

9. The semiconductor double-side polishing device according to claim 1, wherein: The film tearing assembly includes a third transverse guide rail, a fourth driving rod is vertically slidably mounted on the bottom surface of the third transverse guide rail, and a film tearing clamp is connected to the bottom end of the fourth driving rod. The film tearing clamp is used to clamp the protruding part of the used barrier film.

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