A semiconductor double-sided polishing device

Abstract

This invention provides a semiconductor double-sided polishing apparatus, relating to the field of semiconductor polishing technology. It includes a wafer ring with an inner cavity for clamping and positioning wafers, four insert plates evenly arranged on its outer wall; two parallel conveyor tracks; multiple clamping assemblies on the outer wall of each conveyor track; a polishing assembly on the outer side of each end of the two conveyor tracks forming a whole; and, in the conveying direction of the conveyor tracks, a material transfer assembly, a thickness detection assembly, a film coating assembly, and a film removal assembly sequentially arranged between the two conveyor tracks. Specifically: the material transfer assembly is used to transfer the wafer ring between the polishing assembly and the conveyor tracks; the thickness detection assembly is used to detect the thickness of the wafer and output defective wafers; the film coating assembly is used to apply a protective film to one side of the wafer ring; and the film removal assembly is used to remove the used protective film from the wafer ring. This invention enables the coating and flipping / removing of the wafer film, improving the efficiency of double-sided polishing.

Description

[0001] This application is a divisional application of the invention application filed on November 25, 2024, with Chinese application number 202411687671X and title "An Automated Semiconductor Grinding Equipment". Technical Field

[0002] This invention relates to the field of semiconductor polishing equipment technology, and more specifically to a semiconductor double-sided polishing equipment. Background Technology

[0003] Wafer grinding and thickness reduction is a key process step in semiconductor manufacturing. Its main purpose is to reduce the thickness of the silicon wafer to specific dimensional requirements. In semiconductor chip manufacturing, the initial thickness of the silicon wafer may exceed the actual chip manufacturing requirements due to factors such as growth processes, necessitating grinding and thickness reduction to precisely control the wafer thickness; the grinding machine is the main equipment, typically consisting of a grinding disc and a carrier for holding the silicon wafer;

[0004] After one side of a silicon wafer is ground, it needs to be flipped over and the other side ground. This allows for both thickness reduction and double-sided polishing of the silicon wafer. However, current double-sided grinding for thickness reduction has the following shortcomings:

[0005] After one side is ground, workers need to remove the wafer ring, apply a new film, and peel off the old film. The whole process is cumbersome and takes a long time to prepare for changing sides. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a semiconductor double-sided polishing apparatus, which solves the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A semiconductor double-sided polishing apparatus, comprising:

[0009] The inner cavity is used to hold and position the wafer ring, and four insert plates are evenly provided on its outer wall;

[0010] Two parallel conveyor tracks; each conveyor track has multiple sets of clamping components on its outer wall, and the wafer ring between the two conveyor tracks can be clamped, transferred and flipped by the clamping components on both sides;

[0011] A grinding assembly is provided on the outer side of each of the two conveying tracks forming a whole;

[0012] The grinding assembly includes a lower body, on which a support plate and a constraint assembly for clamping and positioning a wafer ring are provided. The support plate is located inside the constraint assembly, and a height-adjustable grinding disc is provided above the support plate.

[0013] Along the conveying direction of the conveying tracks, a material transfer assembly, a thickness detection assembly, a film coating assembly, and a film peeling assembly are sequentially installed between the two conveying tracks, wherein:

[0014] A transfer assembly for transferring wafer rings between the grinding assembly and the transport track;

[0015] Thickness detection component, used to detect the thickness of wafers and output defective wafers;

[0016] A coating assembly for attaching a shielding film to one side of a wafer ring, wherein the area of ​​the shielding film is larger than the area of ​​the wafer ring;

[0017] A film-removing assembly is used to remove the used protective film from the wafer ring.

[0018] Furthermore, a rinsing assembly is provided outside the tray; the rinsing assembly includes a cutting fluid cleaning agent storage tank, a sealing cover, a second drive rod, and a vertical guide rail. The vertical guide rail is located outside the corresponding tray, and the second drive rod is horizontally arranged, with one end connected to the vertical guide rail and the other end connected to the horizontally arranged sealing cover. The sealing cover has an opening facing downwards, and a spray head is provided on the vertical wall of its inner cavity, while air jet plates are symmetrically slidably arranged on the top of the inner cavity. The cutting fluid cleaning agent storage tank is located outside the sealing cover and is connected to the spray head through a conduit. When rinsing the wafer, the sealing cover is sealed and mated to the wafer ring with a baffle attached to the bottom, forming a closed cleaning chamber. The spray head tilts downwards to discharge the cutting fluid cleaning agent to rinse the wafer, and the cutting fluid cleaning agent in the sealing cover is intermittently extracted. The two sets of air jet plates move horizontally in opposite directions to dry the wafer.

[0019] Furthermore, the constraint assembly includes a constraint frame and two first drive rods; the constraint frame is annular and located on the top of the lower seat, the support plate is located inside the constraint frame, and a fluid guiding cavity is left between the support plate and the support plate; the two first drive rods are symmetrically installed on the outer wall of the constraint frame, and the inner end of the first drive rod is connected to a first rectangular insertion tube located inside the constraint frame, the first rectangular insertion tube being used to cooperate with the insertion plate; the side of the constraint frame is connected to the cutting fluid recovery tank through a liquid pump, and the outlet end of the cutting fluid recovery tank is connected to a spray pipe located on the constraint frame.

[0020] Furthermore, a cleaning ring is rotatably mounted on the outer wall of the tray, located below the first rectangular insertion tube; the outer wall of the cleaning ring is connected to the cleaning plate, and a first motor for driving the cleaning ring to rotate is installed inside the tray.

[0021] Furthermore, the clamping assembly includes a base, a third drive rod, and a second motor. The third drive rod is rotatably mounted inside each base, and the second motor is mounted at the rotatable connection. The output end of the third drive rod is connected to a second rectangular insert, which is used to cooperate with the insert plate. The second motor is used to drive the third drive rod to rotate.

[0022] Furthermore, the material transfer assembly includes a first horizontal guide rail disposed above the two conveying tracks. The extension direction of the first horizontal guide rail is parallel to the extension direction of the conveying tracks. A hanging plate is slidably mounted vertically on the bottom surface of the first horizontal guide rail. A second horizontal guide rail is slidably mounted on the bottom end of the hanging plate. A rack is provided on the surface of the second horizontal guide rail. A third motor for driving the second horizontal guide rail to move is provided on the bottom side wall of the hanging plate. A fourth motor is slidably mounted on the bottom surface of the second horizontal guide rail. The output end of the fourth motor is connected to a double-headed screw seat. A fifth drive rod is symmetrically slidably mounted on the bottom of the double-headed screw seat. A third rectangular insertion tube is provided at the bottom end of the fifth drive rod. The third rectangular insertion tube is used to cooperate with the insertion plate.

[0023] Furthermore, the thickness detection component includes a top frame, a bottom frame, thickness probes, and reference plates. The top frame is located above the conveying track, and its bottom surface is equipped with multiple sets of thickness probes. The bottom frame is located below the conveying track, and its upper surface is equipped with multiple sets of reference plates, each set of reference plates corresponding to a set of thickness probes. Vertical plates are rotatably connected to both ends of the bottom frame, and a fifth motor is installed at the rotatable connection. Adsorption holes are opened on the surface of the reference plates. A waste bin is located below the bottom frame, and vertical slide rails are symmetrically arranged on the inner wall of the waste bin. The bottom end of the vertical plate is slidably embedded in the vertical slide rail.

[0024] Furthermore, the film coating assembly includes a film feeding wheel, a film taking-up wheel, a recycling wheel, a ring cutter, a top plate, and a bottom plate. Sixth drive rods are installed at both ends of the bottom surface of the top plate, with the bottom ends of the two sixth drive rods connected to the film feeding wheel and the film taking-up wheel, respectively. A recycling wheel is installed on one side of the film feeding wheel. A seventh drive rod is located in the middle of the bottom surface of the top plate, with the bottom end of the seventh drive rod connected to the ring cutter. An eighth drive rod is vertically installed on the top surface of the bottom plate, with an abutting ring frame at its top. A protective belt is wound around the outside of the film feeding wheel, and release paper is coated on the bottom surface of the protective belt. The recycling wheel is used to wind up the release paper. The ring cutter is used to cut a retaining film on the protective belt, and an adhesive layer is provided on the retaining film.

[0025] Furthermore, the film-tearing assembly includes a third horizontal guide rail, on the bottom surface of which a fourth drive rod is vertically slidably mounted. The bottom end of the fourth drive rod is connected to a film-tearing gripper, which is used to hold the extended portion of the used film.

[0026] This invention provides a semiconductor double-sided polishing apparatus. Compared with the prior art, it has the following advantages:

[0027] 1. The outer wall of the wafer ring is equipped with four sets of insert plates, which facilitates the rotation and positioning of the wafer ring at various workstations;

[0028] 2. During the grinding process, the cutting fluid can be sealed by the confinement component, and then the cutting fluid and cutting impurities can be extracted to the cutting fluid recovery tank in real time, realizing the rapid recovery of the cutting fluid and making the work site cleaner;

[0029] 3. The flushing component can spray water to clean the cutting fluid after the upper surface is ground, which is convenient for subsequent turnover. At the same time, the cleaning process is a closed operation, which can prevent the cutting fluid cleaning agent from entering the restraint component and avoid contaminating the repeatedly used cutting fluid.

[0030] 4. To improve double-sided grinding efficiency, after the wafer is ground and thickened in a set of grinding components, the wafer can be automatically picked up by the transfer component and placed into the conveyor track, thus realizing automatic wafer unloading. The coating component can make a retaining film and cover the top of the wafer ring. After the coating is completed, the wafer ring can rotate, so that the newly coated retaining film is placed below the wafer to stop the wafer, while the old retaining film is placed on top. The subsequent film peeling component can directly peel off the old film on top, thus completing the automatic flipping and film replacement. Finally, the transfer component transfers the wafer to the next set of grinding components. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 A schematic diagram of the side cross-sectional structure of the semiconductor double-sided polishing apparatus of the present invention is shown;

[0033] Figure 2 A schematic diagram of the distribution structure of the sealing cover and constraint components of the present invention is shown;

[0034] Figure 3 A top view cross-sectional structural diagram of the constraint frame of the present invention is shown;

[0035] Figure 4 A schematic diagram of the sealing cover connection structure of the present invention is shown;

[0036] Figure 5 A schematic diagram of the material transfer assembly structure of the present invention is shown;

[0037] Figure 6 A schematic diagram of the cross-sectional structure of the thickness detection component of the present invention is shown;

[0038] Figure 7 A schematic diagram of the reference plate distribution structure of the present invention is shown;

[0039] Figure 8 A schematic diagram of the side cross-sectional structure of the coating component of the present invention is shown;

[0040] Figure 9 A schematic diagram of the shielding membrane surface structure of the present invention is shown;

[0041] Figure 10 A schematic diagram of the side cross-sectional structure of the film-peeling assembly of the present invention is shown;

[0042] The diagram shows: 1. Grinding assembly; 11. Main housing; 12. Grinding disc; 13. Lower seat; 131. Support plate; 14. Constraint assembly; 141. Constraint frame; 142. First drive rod; 143. First rectangular tube; 15. Spray pipe; 16. Cutting fluid recovery tank; 17. Cleaning ring; 171. Cleaning plate; 172. First motor; 2. Fluid flushing assembly; 21. Vertical guide rail; 22. Second drive rod; 23. Sealing cover; 231. Spray head; 232. Spray plate; 24. Cutting fluid cleaning agent storage tank; 3. Transfer channel; 31. Conveying track; 4. Clamping assembly; 41. Base; 42. Third drive rod; 43. Second motor; 44. Second rectangular tube; 5. Transfer assembly; 51. First horizontal guide rail; 52. Hanging plate; 53. Second horizontal guide rail; 531. Rack; 5 4. Third motor; 55. Fourth motor; 56. Double-headed screw seat; 57. Fifth drive rod; 58. Third rectangular insert; 6. Thickness detection assembly; 61. Top frame; 62. Thickness probe; 63. Base frame; 64. Reference plate; 641. Adsorption hole; 65. Vertical plate; 66. Fifth motor; 67. Waste bin; 68. Vertical slide rail; 7. Coating assembly; 71. Top plate; 72. Sixth drive rod; 73. Film feeding wheel; 74. Film taking wheel; 75. Recycling wheel; 76. Seventh drive rod; 77. Ring cutter; 78. Eighth drive rod; 79. Contact ring frame; 8. Protective belt; 81. Film barrier; 82. Adhesive layer; 9. Film tearing assembly; 91. Hanging plate; 92. Fourth drive rod; 93. Third horizontal guide rail; 94. Film tearing gripper; 9a. Wafer ring; 91a. Insert plate; 9b. Wafer. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are described clearly and completely. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] To address the technical problems in the background section, a semiconductor double-sided polishing device is provided as follows:

[0045] Combination Figures 1-10 As shown, the present invention provides a semiconductor double-sided polishing apparatus, including a transfer channel 3;

[0046] Grinding assembly 1 is symmetrically arranged at both ends of transfer channel 3. The two grinding assemblies 1 are used to grind and reduce the thickness of the two sides of the wafer respectively. Grinding assembly 1 includes main housing 11. The top of the main housing 11 is equipped with a liftable grinding disc 12. The bottom of the main housing 11 is equipped with a lower seat 13. The middle of the surface of the lower seat 13 is equipped with a support plate 131. The top of the support plate 131 is equipped with a constraint assembly 14 and a spray pipe 15. The outside of the main housing 11 is equipped with a cutting fluid recovery tank 16. The side of the constraint assembly 14 is connected to the cutting fluid recovery tank 16. The outlet end of the cutting fluid recovery tank 16 is connected to the spray pipe 15.

[0047] The rinsing assembly 2 is slidably installed inside the main housing 11. The rinsing assembly 2 is used to remove residual liquid from the surface of the wafer for subsequent coating.

[0048] A wafer ring 9a has a wafer 9b clamped and positioned inside it. A baffle 81 is attached to one side of the wafer ring. The area of ​​the baffle 81 is larger than the area of ​​the wafer ring. The outer wall of the wafer ring is provided with four sets of ring-shaped array of insert plates 91a.

[0049] The conveying track 31 is symmetrically arranged inside the transfer channel 3. The processing area is between the two sets of conveying tracks 31. The processing area is arranged in sequence along the conveying direction as the loading position, the first processing position, the second processing position, the third processing position and the unloading position. The outer wall of the conveying track 31 is provided with multiple sets of clamping components 4. The clamping components 4 are engaged with the insert plate of the wafer ring.

[0050] The transfer assembly 5 is installed in the loading position inside the transfer channel 3. The transfer assembly 5 is used to transfer the wafers in one set of grinding assemblies 1 to the conveyor track 31, and then transfer the wafers to another set of grinding assemblies 1.

[0051] Thickness detection component 6 is installed at the first processing position in the processing area. Thickness detection component 6 is used to detect the thickness of the wafer and output unqualified wafers.

[0052] The coating assembly 7 is installed at the second processing position in the processing area and is used to cover the baffle 81 on the upper surface of the wafer ring.

[0053] The film-removing assembly 9 is installed at the third processing position in the processing area. The film-removing assembly 9 is used to remove the used retaining film 81 on the wafer ring.

[0054] In the above scheme:

[0055] 1. The outer wall of the wafer ring is equipped with four sets of insert plates, which facilitates the rotation and positioning of the wafer ring at various workstations;

[0056] 2. During the grinding process, the cutting fluid can be sealed by the confinement component, and then the cutting fluid and cutting impurities can be extracted to the cutting fluid recovery tank in real time, realizing the rapid recovery of the cutting fluid and making the work site cleaner;

[0057] 3. The flushing component can spray water to clean the cutting fluid after the upper surface is ground, which is convenient for subsequent turnover. At the same time, the cleaning process is a closed operation, which can prevent the cutting fluid cleaning agent from entering the restraint component and avoid contaminating the repeatedly used cutting fluid.

[0058] 4. To improve double-sided grinding efficiency, a transfer channel is designed between two grinding components. After the wafer is ground and thickened in one grinding component, the transfer component can automatically pick up the wafer and put it into the conveyor track, thus realizing automatic wafer unloading. The coating component can make a retaining film and cover the top of the wafer ring. After coating is completed, the wafer ring can rotate, so that the newly coated retaining film is placed below the wafer to stop the wafer, while the old retaining film is placed on top. The subsequent film peeling component can directly peel off the old film on top, thus completing the automatic flipping and film replacement. Finally, the transfer component transfers the wafer to the next grinding component.

[0059] In this embodiment, the rinsing assembly 2 includes a cutting fluid cleaning agent storage tank 24, a sealing cover 23, a second drive rod 22, and a vertical guide rail 21. The vertical guide rail 21 is located on the inner side of the main housing 11. The inner end of the second drive rod 22 is vertically slidably embedded in the vertical guide rail 21. The second drive rod 22 is horizontally arranged, and its output end is connected to the horizontally arranged sealing cover 23. The opening of the sealing cover 23 faces downward. A spray head 231 is provided on the inner side of the sealing cover 23. A jet plate 232 is symmetrically slidably arranged on the top of the inner side of the sealing cover 23. The cutting fluid cleaning agent storage tank 24 is located on the outer wall of the main housing 11 and is connected to the sealing cover 23 through a conduit. When rinsing the wafer, the sealing cover 23 is sealed and connected to the wafer ring to form a closed cleaning chamber. The spray head 231 tilts downward to discharge the cutting fluid cleaning agent to rinse the wafer, and the cutting fluid cleaning agent in the sealing cover 23 is intermittently extracted. The two sets of jet plates 232 move horizontally in opposite directions to dry the wafer.

[0060] In the above scheme: during sealing and cleaning, the second drive rod drives the sealing cover to move above the wafer ring, and then the second drive rod descends along the vertical guide rail, so that the sealing cover seals and fits against the wafer ring; then the side spray head works first, and the cutting fluid cleaner is sprayed onto the wafer to clean the cutting fluid. Various liquids gather inside the sealing cover and will not splash out. Then the pump body extracts the mixture inside the sealing cover. After extraction is complete, the two sets of jet plates slide outward synchronously, which can exhaust air downward to dry the wafer. The airflow distribution is uniform and the drying effect is good.

[0061] In this embodiment, the constraint assembly 14 includes a constraint frame 141 and a first drive rod 142. The constraint frame 141 is annular and is disposed on the surface of the lower seat 13. The constraint frame 141 is spaced apart from the outside of the support plate 131. A fluid guiding cavity is left between the constraint frame 141 and the support plate 131. The first drive rod 142 is symmetrically installed on the outer wall of the constraint frame 141. The inner end of the first drive rod 142 is provided with a first rectangular insertion tube 143, which is inserted into the insertion plate. The side of the constraint frame 141 is connected to the cutting fluid recovery tank 16 through a liquid pump.

[0062] In the above scheme: after the wafer ring is placed on the tray, the first drive rod drives the first rectangular insertion tube to move inward, and the first rectangular insertion tube is inserted into the tray. In this way, the wafer ring can be clamped and positioned, which effectively ensures the stability of the wafer ring and wafer during the grinding process. The constraint frame can also contain the cutting fluid, prevent the cutting fluid from flowing into the equipment, reduce the contaminated area, and facilitate cleaning.

[0063] In this embodiment, a cleaning ring 17 is rotatably mounted on the outer wall of the tray 131. The outer wall of the cleaning ring 17 is connected to the cleaning plate 171. The cleaning ring is located at the bottom of the first rectangular insertion tube. A first motor 172 that drives the cleaning ring 17 to rotate is installed inside the tray 131. The cleaning plate 171 is used to push the liquid and impurities in the liquid guiding chamber to the inlet of the liquid pump.

[0064] The above solution is traced back to the following: When the pump extracts the cutting fluid, impurities will accumulate in the liquid guiding chamber and cannot be completely cleaned. In order to thoroughly clean the impurities, the first motor can drive the cleaning ring to rotate, which in turn drives the cleaning plate to rotate in the liquid guiding chamber. This can push the impurities and liquid to the outlet of the constraint frame, where they can be immediately extracted by the pump, achieving thorough cleaning.

[0065] In this embodiment, the clamping assembly 4 includes a base 41, a third drive rod 42, and a second motor 43. The base 41 is symmetrically arranged on two sets of conveying tracks 31. The third drive rod 42 is rotatably installed inside each set of bases 41, and the second motor 43 is installed at the rotatable connection. The output end of the third drive rod 42 is connected to a second rectangular insertion tube 44, which is inserted into the insertion plate. The second motor 43 is used to drive the third drive rod 42 to rotate, thereby changing the orientation of the wafer.

[0066] In the above scheme: after the wafer ring is placed on the conveying track, a clamping assembly is provided to ensure stable conveying of the wafer ring and to perform cooperative actions; the third drive rod can drive the second rectangular insertion tube to be inserted into the other two sets of insertion plates to realize clamping and picking up materials; when it is necessary to flip and tear the film, the second motor drives the third drive rod to rotate.

[0067] In this embodiment, the material transfer assembly 5 includes a first horizontal guide rail 51, which is located on the inner top surface of the transfer channel 3. A hanging plate 52 is vertically slidably mounted on the bottom surface of the first horizontal guide rail 51. A second horizontal guide rail 53 is slidably mounted on the bottom end of the hanging plate 52. A rack 531 is provided on the surface of the second horizontal guide rail 53. A third motor 54 is provided on the bottom side wall of the hanging plate 52 to drive the second horizontal guide rail 53 to move. A fourth motor 55 is slidably mounted on the bottom surface of the second horizontal guide rail 53. The output end of the fourth motor 55 is connected to a double-ended screw seat 56. A fifth drive rod 57 is symmetrically slidably mounted on the bottom of the double-ended screw seat 56. A third rectangular insertion tube 58 is provided at the bottom end of the fifth drive rod 57. The third rectangular insertion tube 58 is inserted into the insertion plate.

[0068] In the above scheme: the material transfer component is designed as a three-stage translation structure to meet the loading and unloading needs of the two sets of grinding components. The hanging plate moves along the first horizontal guide rail. The third motor can drive the second horizontal guide rail to perform a second-stage lateral movement. The fourth motor can perform a third-stage lateral movement along the second horizontal guide rail. The fourth motor can drive the double-headed screw seat to rotate, so as to switch the third rectangular insertion tube to dock with any two sets of insertion plates. The fifth drive rod can drive the third rectangular insertion tube to descend. Then the fifth drive rod moves synchronously along the double-headed screw seat to realize wafer ring docking.

[0069] In this embodiment, the thickness detection component 6 includes a top frame 61, a bottom frame 63, thickness probes 62, and a reference plate 64. The top frame 61 is located on the top of the conveying track 31, and the bottom surface of the top frame 61 is provided with multiple sets of thickness probes 62. The bottom frame 63 is located at the bottom of the conveying track 31, and the surface of the bottom frame 63 is provided with multiple sets of reference plates 64, each set of reference plates 64 corresponding to a set of thickness probes 62.

[0070] In the above scheme: the ground wafer is transported to the bottom of the thickness probe by the clamping assembly. During the process, multiple sets of thickness probes can linearly fit and detect on the surface of the wafer, realizing multi-point comprehensive detection, thereby quickly determining whether the thickness of the wafer is qualified, without the need for separate detection. The reference plate can be used as the basis for adjusting the side probe.

[0071] In this embodiment, the two ends of the base frame 63 are rotatably connected to the vertical plates 65 and a fifth motor 66 is installed at the rotatable connection. The surface of the reference plate 64 is provided with adsorption holes 641. The bottom surface of the transfer channel 3 is provided with a waste bin 67. The inner wall of the waste bin 67 is symmetrically provided with vertical slide rails 68. The bottom end of the vertical plate 65 is slidably embedded in the vertical slide rail 68.

[0072] In the above scheme: when the thickness of a wafer is found to be unqualified, the adsorption hole can adsorb and position the wafer from below, then the clamping assembly is unlocked, the vertical plate moves downward along the vertical slide rail, the fifth motor drives the wafer to rotate, so that the reference plate is above, and then the vertical plate continues to descend, so that the wafer falls into the waste bin. After placement, the adsorption hole no longer adsorbs.

[0073] In this embodiment, the coating assembly 7 includes a film-feeding wheel 73, a film-receiving wheel 74, a recovery wheel 75, a ring cutter 77, a top plate 71, and a bottom plate. Sixth drive rods 72 are installed at both ends of the bottom surface of the top plate 71. The bottom ends of the two sets of sixth drive rods 72 are respectively connected to the film-feeding wheel 73 and the film-receiving wheel 74. The recovery wheel 75 is installed on the side of the film-feeding wheel 73. A seventh drive rod 76 is provided in the middle of the bottom surface of the top plate 71. The bottom end of the seventh drive rod 76 is connected to the ring cutter 77. An eighth drive rod 78 is vertically provided on the top surface of the bottom plate. A contact ring frame 79 is provided at the top of the eighth drive rod 78. The contact ring frame 79 is relatively attached to the outside of the wafer ring. A protective strip 8 is wound around the outside of the film-feeding wheel 73. Release paper is coated on the bottom surface of the protective strip 8. The recovery wheel 75 is used to wind up the release paper. The ring cutter 77 is used to cut a retaining film 81 on the protective strip 8. An adhesive layer 82 is provided on the retaining film 81.

[0074] In the above scheme: during lamination, the film-releasing wheel releases the protective belt, the release paper is wound onto the take-up wheel, the new protective belt is placed above the wafer ring, the sixth drive rod drives the film-releasing wheel and the take-up wheel to descend, the eighth drive rod drives the contact ring frame to move upward, the contact ring frame is placed outside the wafer ring, the adhesive layer of the protective belt is bonded to the wafer ring, and then the seventh drive rod drives the ring cutter to move downward and contact the contact ring frame, the ring cutter cuts out a circular retaining film inside the protective belt.

[0075] In this embodiment, the film-tearing assembly 9 includes a hanging plate 91, a fourth drive rod 92 is vertically arranged below the hanging plate 91, the top end of the fourth drive rod 92 is connected to a third horizontal guide rail 93, and a film-tearing claw 94 is installed at the bottom end of the fourth drive rod 92. The film-tearing claw 94 is used to hold the extended front end of the used film 81.

[0076] In the above scheme: when tearing the film, the tearing gripper holds the front end of the film extension, and then the fourth drive rod drives the tearing gripper to move upward. The fourth drive rod then moves along the third horizontal guide rail to tear off the film.

[0077] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0078] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor double-sided polishing apparatus, characterized in that, include: The inner cavity is used to hold and position the wafer ring, and four insert plates are evenly provided on its outer wall; Two parallel conveyor tracks; each conveyor track has multiple sets of clamping components on its outer wall, and the wafer ring between the two conveyor tracks can be clamped, transferred and flipped by the clamping components on both sides; A grinding assembly is provided on the outer side of each of the two conveying tracks forming a whole; The grinding assembly includes a lower body, on which a support plate and a constraint assembly for clamping and positioning a wafer ring are provided. The support plate is located inside the constraint assembly, and a height-adjustable grinding disc is provided above the support plate. Along the conveying direction of the conveying tracks, a material transfer assembly, a thickness detection assembly, a film coating assembly, and a film peeling assembly are sequentially installed between the two conveying tracks, wherein: A transfer assembly for transferring wafer rings between the grinding assembly and the transport track; Thickness detection component, used to detect the thickness of wafers and output defective wafers; A coating assembly for attaching a shielding film to one side of a wafer ring, wherein the area of ​​the shielding film is larger than the area of ​​the wafer ring; A film-removing assembly is used to remove the used protective film from the wafer ring.

2. The semiconductor double-sided polishing equipment according to claim 1, characterized in that: A rinsing assembly is also provided outside the pallet; the rinsing assembly includes a cutting fluid cleaning agent storage tank, a sealing cover, a second drive rod, and a vertical guide rail. The vertical guide rail is located outside the corresponding pallet, and the second drive rod is horizontally arranged, with one end connected to the vertical guide rail and the other end connected to the horizontally arranged sealing cover. The sealing cover has an opening facing downwards, and a spray head is provided on the vertical wall of its inner cavity, while air jet plates are symmetrically slidably arranged on the top of the inner cavity. The cutting fluid cleaning agent storage tank is located outside the sealing cover and is connected to the spray head through a conduit. When rinsing the wafer, the sealing cover is sealed and mated to the wafer ring with a baffle attached to the bottom to form a closed cleaning chamber. The spray head tilts downwards to discharge the cutting fluid cleaning agent to rinse the wafer, and the cutting fluid cleaning agent in the sealing cover is intermittently extracted. The two sets of air jet plates move horizontally in opposite directions to dry the wafer.

3. The semiconductor double-sided polishing equipment according to claim 1, characterized in that: The constraint assembly includes a constraint frame and two first drive rods; the constraint frame is annular and located on the top of the lower seat, with a support plate inside the constraint frame and a fluid guiding cavity left between the support plate and the support plate; the two first drive rods are symmetrically installed on the outer wall of the constraint frame, and the inner end of the first drive rod is connected to a first rectangular insertion tube located inside the constraint frame, the first rectangular insertion tube being used to cooperate with the insertion plate; the side of the constraint frame is connected to a cutting fluid recovery tank via a liquid pump, and the outlet end of the cutting fluid recovery tank is connected to a spray pipe located on the constraint frame.

4. The semiconductor double-sided polishing equipment according to claim 3, characterized in that: The outer wall of the tray is rotatably fitted with a cleaning ring located below the first rectangular insertion tube; the outer wall of the cleaning ring is connected to the cleaning plate, and a first motor that drives the cleaning ring to rotate is installed inside the tray.

5. A semiconductor double-sided polishing apparatus according to claim 1, characterized in that: The clamping assembly includes a base, a third drive rod, and a second motor. The third drive rod is rotatably mounted inside each base, and the second motor is mounted at the rotatable connection. The output end of the third drive rod is connected to a second rectangular insert, which is used to cooperate with the insert plate. The second motor is used to drive the third drive rod to rotate.

6. A semiconductor double-sided polishing apparatus according to claim 1, characterized in that: The material transfer assembly includes a first horizontal guide rail positioned above two conveying tracks. The extension direction of the first horizontal guide rail is parallel to the extension direction of the conveying tracks. A hanging plate is slidably mounted vertically on the bottom surface of the first horizontal guide rail. A second horizontal guide rail is slidably mounted on the bottom end of the hanging plate. A rack is provided on the surface of the second horizontal guide rail. A third motor is provided on the bottom side wall of the hanging plate to drive the second horizontal guide rail to move horizontally. A fourth motor is slidably mounted on the bottom surface of the second horizontal guide rail. The output end of the fourth motor is connected to a double-headed screw seat. A fifth drive rod is symmetrically slidably mounted on the bottom of the double-headed screw seat. A third rectangular insertion tube is provided at the bottom end of the fifth drive rod. The third rectangular insertion tube is used to cooperate with the insertion plate.

7. A semiconductor double-sided polishing apparatus according to claim 1, characterized in that: The thickness detection assembly includes a top frame, a bottom frame, thickness probes, and reference plates. The top frame is located above the conveying track and has multiple sets of thickness probes on its bottom surface. The bottom frame is located below the conveying track and has multiple sets of reference plates on its upper surface, with each set of reference plates corresponding to a set of thickness probes. Vertical plates are rotatably connected to both ends of the bottom frame, and a fifth motor is installed at the rotatable connection. Adsorption holes are opened on the surface of the reference plates. A waste bin is located below the bottom frame, and vertical slide rails are symmetrically arranged on the inner wall of the waste bin. The bottom end of the vertical plate is slidably embedded in the vertical slide rail.

8. A semiconductor double-sided polishing apparatus according to claim 1, characterized in that: The film coating assembly includes a film feeding wheel, a film taking-up wheel, a recycling wheel, a ring cutter, a top plate, and a bottom plate. Sixth drive rods are installed at both ends of the bottom surface of the top plate, with the bottom ends of the two sixth drive rods connected to the film feeding wheel and the film taking-up wheel, respectively. A recycling wheel is installed on one side of the film feeding wheel. A seventh drive rod is located in the middle of the bottom surface of the top plate, with the bottom end of the seventh drive rod connected to the ring cutter. An eighth drive rod is vertically installed on the top surface of the bottom plate, with an abutment ring frame at its top. A protective belt is wound around the outside of the film feeding wheel, and release paper is coated on the bottom surface of the protective belt. The recycling wheel is used to wind up the release paper. The ring cutter is used to cut a retaining film on the protective belt, and an adhesive layer is provided on the retaining film.

9. A semiconductor double-sided polishing apparatus according to claim 1, characterized in that: The film-tearing assembly includes a third horizontal guide rail, on the bottom surface of which a fourth drive rod is vertically slidably mounted. The bottom end of the fourth drive rod is connected to a film-tearing gripper, which is used to hold the extended part of the used film.

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