Finished product defect detection device for semiconductor chip packaging

Abstract

The invention discloses a finished product defect detection device for semiconductor chip packaging, relates to the field of semiconductor chip packaging detection, solves the problem that an existing detection device needs to turn over a finished product for multiple times, and comprises a device base and two conveying support plates which are symmetrically and fixedly mounted at the top of the device base, an annular shell is fixedly installed between the two conveying supporting plates, and a detection probe is arranged on the inner side of the annular shell. The detection mechanism is used for carrying out packaging double-sided detection on the semiconductor chip, the detection mechanism is mounted between the two conveying support plates, and the detection mechanism comprises a rotating ring arranged on the inner side of the annular shell; through the detection mechanism, a semiconductor chip package can be conveyed to the inner side of the annular shell, the top of the semiconductor chip package is detected by the detection probe, then the detection probe is moved to the bottom of the semiconductor chip package through the rotating ring, and the detection probe can detect the bottom of the semiconductor chip package. Therefore, the detection efficiency of semiconductor chip packaging is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor chip packaging detection, in particular to a finished product defect detection device for semiconductor chip packaging. Background Art

[0002] Semiconductor chip packaging refers to processing qualified wafers that have passed testing into independent chips, assembling them onto a packaging substrate through a packaging process, and then packaging the chips into single-chip modules and multi-chip modules with a packaging shell to achieve communication between the chips and external circuits.

[0003] Defect detection of finished semiconductor products after packaging is a key link in ensuring chip reliability, performance and yield. The semiconductor chip is imaged by the detection probe to check whether the semiconductor chip has problems such as pin deformation, surface scratches, and contamination. The existing defect detection of finished semiconductor chip packaging products basically adopts the method of conveying the finished product to move the finished product to the bottom of the detection probe, so that the detection probe detects the front of the finished product, and then the finished product is turned over by the robotic arm, so that the detection probe detects the back of the finished product to achieve comprehensive inspection of the finished product. However, the robotic arm requires a certain gripping pressure on the finished product. If the same batch of finished products with different heights and thicknesses are inspected, the gripping force needs to be adjusted accordingly, which is more troublesome to operate. In addition, after the robotic arm flips the finished product, it needs to turn the finished product back to the front side up, which requires a second flip, and the inspection efficiency is low. Summary of the Invention

[0004] The object of the present invention is to provide a finished product defect detection device for semiconductor chip packaging to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions: A finished product defect detection device for semiconductor chip packaging, comprising: a device base and two conveying support plates symmetrically fixedly installed on the top of the device base, an annular shell fixedly installed between the two conveying support plates, and a detection probe provided on the inner side of the annular shell; also comprising: a detection mechanism for double-sided detection of semiconductor chip packaging, the detection mechanism being installed between the two conveying support plates, the detection mechanism comprising a rotating ring provided on the inner side of the annular shell, and the detection probe fixedly installed on the inner side of the rotating ring, and the rotating ring being capable of rotating the detection probe; a positioning mechanism for positioning detection of semiconductor chip packaging, the positioning mechanism being installed on the inner side of the annular shell, the positioning mechanism comprising a baffle provided on the inner side of the annular shell, the baffle being capable of providing blocking and positioning for the moving semiconductor chip package; a pushing mechanism for smoothly pushing and pressing the semiconductor chip package to prevent it from deflecting, the pushing mechanism being installed on the inner side of the annular shell, the pushing mechanism comprising four pressing rollers symmetrically provided on the inner side of the annular shell, the pressing rollers being capable of providing a limit for the top of the semiconductor chip package.

[0006] Preferably, the detection mechanism also includes two positioning rings symmetrically arranged on the inner side of the annular shell, an inner support plate is fixedly installed between the inner side of the annular shell and the positioning ring, the swivel is rotatably installed between the two positioning rings, a driving motor is fixedly installed on the outer side of the positioning ring located at the right end of the swivel, the output end of the driving motor is fixedly installed with a first gear, and a gear ring matching the first gear is fixedly installed on the outer side of the swivel, two symmetrically distributed driving rods are rotatably installed between the two conveying support plates, two symmetrically distributed transmission belts are rotatably installed between the two driving rods, a conveying belt is fixedly installed on the outer side of the transmission belt, the conveying support plate can drive the transmission belt to rotate and move through the driving rod, so that the transmission belt drives the conveying belt to rotate and move, and a plurality of equidistantly distributed support rods are fixedly installed on the corresponding side of the two conveying belts.

[0007] The top of the gear selector is connected with the gear train of claim 1, wherein the first gear train is connected to the gear train of the second gear train and the second gear train is connected with the gear train of the second gear train.

[0008] Preferably, the pushing mechanism also includes two U-shaped slides that are symmetrically fixedly installed between the inner sides of the two positioning rings, and two symmetrically distributed moving blocks are slidably installed on the outer side of the U-shaped slide, and the four pressure rollers are rotatably installed on the outer sides of the four moving blocks. The inner side of the U-shaped slide is rotatably installed with a different-direction screw that cooperates with the moving block, and the outer side of the different-direction screw is fixedly installed with a third gear, and the inner side of the rotating ring is fixedly installed with an arc-shaped rack that cooperates with the third gear. A plurality of equally distributed push plates are fixedly installed on the corresponding sides of the two conveyor belts, and a positioning rod is fixedly installed on one end of the push plate, and the outer side of the positioning rod is docked with the inner side of the conveyor belt through a coil spring.

[0009] Preferably, a control host is fixedly mounted on the outer side of the annular shell, and the control host is connected to the detection probe via a cable.

[0010] Preferably, two symmetrically distributed positioning shafts are fixedly mounted on the bottom of the rotating ring, and positioning grooves for mounting the inner rings of the positioning shafts are provided on the outer sides of the two inner support plates.

[0011] Preferably, a support frame is provided on the outer side of the conveyor belt, the outer side of the support frame is in contact with the outer side of the support rod, and the two support frames are respectively fixedly installed on the corresponding sides of the two conveyor support plates.

[0012] Preferably, two symmetrically distributed sliding blocks are fixedly mounted on the outer sides of the first rack plate and the second rack plate, and sliding grooves for limiting the sliding of the sliding blocks are provided on the outer sides of the positioning sleeve.

[0013] Preferably, a pulley is fixedly mounted on one end of the top plate close to the mounting rod, and an annular groove for the annular sliding of the pulley is formed at the end of the positioning ring.

[0014] Preferably, a limiting rod is provided on the outer side of the push plate, and the limiting rod is fixedly installed on the outer side of the conveyor belt.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The present invention can transport the semiconductor chip package to the inner side of the annular shell through the detection mechanism, so that the detection probe can detect the top of the semiconductor chip package, and then move the detection probe to the bottom of the semiconductor chip package through the rotating ring. The detection probe can then detect the bottom of the semiconductor chip package without turning the semiconductor chip package over, thereby improving the detection efficiency of the semiconductor chip package.

[0016] The present invention uses a positioning mechanism to enable the baffle to move upward to provide a barrier for the semiconductor chip package when the semiconductor chip package moves to the inner side of the annular shell, so that the conveyor belt can continue to rotate and move, while the support rod can be in a moving state, without causing any obstruction to the bottom of the semiconductor chip package, thereby facilitating the detection probe to fully detect the bottom of the semiconductor chip package, thereby achieving a comprehensive detection effect.

[0017] The present invention uses a pushing mechanism to enable the conveyor belt to push the semiconductor chip package through the pushing plate, thereby facilitating the contact between the semiconductor chip package and the baffle, and utilizing the rebound force of the coil spring and the top limit of the semiconductor chip package by the four pressure rollers, so that the semiconductor chip package can be stably located on the inner side of the annular shell, ensuring the accuracy of the detection probe in detecting the semiconductor chip package, thereby achieving the effect of smooth feeding, and when the detection probe moves, the four pressure rollers are synchronously moved away from the initial position, facilitating the detection probe to perform comprehensive detection on the top of the semiconductor chip package. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 Schematic diagram of the structure of the conveying support plate and support rod in the present invention; Figure 3 This is a schematic diagram of the structure of the rotating ring and the positioning ring in the present invention; Figure 4 Schematic diagram of the positioning sleeve and annular shell structure in the present invention; Figure 5 This is a schematic diagram of the structure of the pressure roller and the arc-shaped rack in the present invention; Figure 6 for Figure 5 Schematic diagram of the enlarged structure of area A; Figure 7Schematic diagram of the V-shaped folding rod and slider structure in the present invention; Figure 8 It is a schematic diagram of the baffle and the abutment plate structure in the present invention.

[0019] In the figure: 1. device base; 2. conveying support plate; 3. annular shell; 4. detection probe; 5. swivel; 6. baffle; 7. pressure roller; 8. positioning ring; 9. inner support plate; 10. driving motor; 11. first gear; 12. gear ring; 13. driving rod; 14. transmission belt; 15. conveying belt; 16. support rod; 17. positioning sleeve; 18. first rack plate; 19. second rack plate; 20. second gear; 21. push plate; 22. mounting rod; 23. top plate; 24. V-shaped folding rod; 25. spring; 26. U-shaped slide; 27. moving block; 28. counter-rotating screw; 29. ​​third gear; 30. arc rack; 31. push plate; 32. positioning rod; 33. coil spring; 34. control host; 35. positioning shaft; 36. support frame; 37. slider; 38. pulley; 39. limit rod. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figures 1-8 The figure shows a finished product defect detection device for semiconductor chip packaging, which includes a device base 1 and two conveying support plates 2 symmetrically fixedly installed on the top of the device base 1, an annular shell 3 is fixedly installed between the two conveying support plates 2, and a detection probe 4 is provided on the inner side of the annular shell 3. The semiconductor chip package between the two conveying support plates 2 is detected by the detection probe 4; it also includes: a detection mechanism for double-sided detection of the semiconductor chip package, and the detection mechanism is installed between the two conveying support plates 2.

[0022] The detection mechanism includes a rotating ring 5 arranged on the inner side of the annular shell 3, and the detection probe 4 is fixedly installed on the inner side of the rotating ring 5. The rotating ring 5 can rotate the detection probe 4. The detection mechanism also includes two positioning rings 8 symmetrically arranged on the inner side of the annular shell 3. An inner support plate 9 is fixedly installed between the inner side of the annular shell 3 and the positioning ring 8. The rotating ring 5 is rotatably installed between the two positioning rings 8, so that the positioning ring 8 provides support and positioning for the rotating ring 5. A driving motor 10 is fixedly installed on the outer side of the positioning ring 8 at the right end of the rotating ring 5. A first gear 11 is fixedly installed on the output end of the driving motor 10. The outer side of the rotating ring 5 A gear ring 12 is fixedly installed to cooperate with the first gear 11, so that the driving motor 10 can drive the rotating ring 5 to rotate between the two positioning rings 8 through the first gear 11 and the gear ring 12. The detection probe 4 on the rotating ring 5 can first detect the top of the semiconductor chip package and then detect the bottom of the semiconductor chip package. Two symmetrically distributed drive rods 13 are rotatably installed between the two conveying support plates 2. Two symmetrically distributed transmission belts 14 are rotatably installed between the two drive rods 13. A conveying belt 15 is fixedly installed on the outside of the transmission belt 14. The conveying support plate 2 can The driving rod 13 drives the transmission belt 14 to rotate and move, so that the transmission belt 14 drives the conveyor belt 15 to rotate and move. A plurality of equally distributed support rods 16 are fixedly installed on the corresponding side of the two conveyor belts 15, so that the conveyor belt 15 supports and conveys the semiconductor chip package through the support rods 16, and moves the semiconductor chip package to the bottom of the detection probe 4, so that the detection probe 4 that can rotate and move can perform double-sided detection on the semiconductor chip package. A control host 34 is fixedly installed on the outside of the annular shell 3, and the control host 34 is connected to the detection probe 4 through a cable. The detection probe The detection data can be displayed on the control host 34. Two symmetrically distributed positioning shafts 35 are fixedly installed at the bottom of the rotating ring 5. The outer sides of the two inner support plates 9 are provided with positioning grooves for the inner rings of the positioning shafts 35 to be installed, thereby improving the smooth rotation of the rotating ring 5. A support frame 36 is provided on the outer side of the conveyor belt 15. The outer side of the support frame 36 contacts the outer side of the support rod 16. The two support frames 36 are respectively fixedly installed on the corresponding sides of the two conveyor support plates 2, so that the support frames 36 provide support for the support rod 16, ensuring the smooth transportation of the semiconductor chip packaging by the support rod 16.

[0023] Example 2: Please refer to Figure 2-Figure 8, this embodiment further explains Example 1, the positioning mechanism in the figure includes a baffle 6 arranged on the inner side of the annular shell 3, the baffle 6 can provide blocking and positioning for the moving semiconductor chip package, the positioning mechanism also includes a positioning sleeve 17 fixedly installed on the outer side of the annular shell 3, the baffle 6 is located above the positioning sleeve 17, the bottom of the baffle 6 is fixedly installed with a first rack plate 18, the inner side of the positioning sleeve 17 is slidably installed with a second rack plate 19, the inner side of the positioning sleeve 17 is rotatably installed with a second gear 20, the first rack plate 18 and the second rack plate 19 are both matched with the second gear 20, and the first rack plate 18 and the second rack plate 19 are centrally symmetrically distributed at On the outside of the second gear 20, when the second rack plate 19 moves upward, the first rack plate 18 can be driven upward by the second gear 20, so that the baffle 6 and the semiconductor chip package are on the same horizontal line, providing a barrier for the semiconductor chip package, and the semiconductor chip package can stay on the inner side of the annular shell 3, and the support rod 16 in the moving state can facilitate the detection probe 4 to perform a comprehensive inspection of the bottom of the semiconductor chip package. The bottom of the second rack plate 19 is fixedly installed with a support plate 21, and the outside of the rotating ring 5 is fixedly installed with two symmetrically distributed mounting rods 22, and a top plate 23 is fixedly installed between the two mounting rods 22, and the two sides of the support plate 21 and the two sides of the top plate 23 are fixedly installed. The bottom of the support plate 21 contacts the top of the top plate 23, so that when the swivel 5 rotates, the top plate 23 can be driven away from the support plate 21 through the mounting rod 22, and when the top plate 23 is reset, the inclined surface of the top plate 23 can contact the inclined surface of the support plate 21, so that the top plate 23 pushes the support plate 21 to move. Two symmetrically distributed V-shaped folding rods 24 are hingedly assembled between the baffle 6 and the support plate 21, and a spring 25 is installed between the middle position of the V-shaped folding rod 24 and the outer side of the positioning sleeve 17. When the top plate 23 is away from the support plate 21, the rebound force of the spring 25 is used to make the V-shaped folding rod 24 push the top plate 23 and the support plate 21 quickly away from the positioning sleeve 17, which is convenient for The baffle 6 provides timely obstruction for semiconductor chip packaging. Two symmetrically distributed sliders 37 are fixedly installed on the outer sides of the first rack plate 18 and the second rack plate 19. A sliding groove is provided on the outer side of the positioning sleeve 17 for the sliders 37 to slide within a limited position, thereby improving the stability of the movement of the first rack plate 18 and the second rack plate 19. A pulley 38 is fixedly installed on one end of the top plate 23 close to the mounting rod 22, and an annular groove is provided on the end of the positioning ring 8 for the pulley 38 to slide in an annular manner, so that the mounting rod 22 can drive the pulley 38 on the top plate 23 to move along the inner side of the annular groove. The pulley 38 can provide auxiliary support for the top plate 23, so that the top plate 23 can smoothly push the abutment plate 21 to move.

[0024] Example 3: Please refer to Figure 2-Figure 5, this embodiment further illustrates other embodiments. The pushing mechanism shown in the figure includes four pressure rollers 7 symmetrically arranged on the inner side of the annular shell 3. The pressure roller 7 can provide a limit for the top of the semiconductor chip package. The pushing mechanism also includes two U-shaped slides 26 symmetrically fixedly installed between the inner sides of the two positioning rings 8. Two symmetrically distributed moving blocks 27 are slidably installed on the outer sides of the U-shaped slides 26. The four pressure rollers 7 are rotatably installed on the outer sides of the four moving blocks 27. The inner side of the U-shaped slide 26 is rotatably installed with a counter-rotating screw 28 that cooperates with the moving block 27. When the counter-rotating screw 28 rotates, it can drive the two moving blocks 27 on the outer sides of the U-shaped slide 26 to move in opposite directions to achieve position offset of the pressure roller 7. A third gear 29 is fixedly installed on the outer side of the counter-rotating screw 28. An arc-shaped rack 30 that cooperates with the third gear 29 is fixedly installed on the inner side of the rotating ring 5. When the rotating ring 5 rotates, the third gear 29 can be driven to rotate by the arc-shaped rack 30 to achieve position offset of the pressure roller 7, which is convenient for detecting the semiconductor chip by the probe 4. The top of the package is fully inspected. A plurality of push plates 31 are fixedly installed on the corresponding sides of the two conveyor belts 15 at equal distances. A positioning rod 32 is fixedly installed at one end of the push plate 31. The outer side of the positioning rod 32 is connected to the inner side of the conveyor belt 15 through a coil spring 33, so that the push plate 31 can push the semiconductor chip package to move to the inner side of the annular shell 3, thereby improving the stability of the movement of the semiconductor chip package and achieving the effect of anti-skewness in conveying. The four pressing rollers 7 can contact the top of the semiconductor chip package, and when the semiconductor chip package contacts the baffle 6, the resistance of the baffle 6 to the semiconductor chip package is used to enable the push plate 31 to swing with the positioning rod 32 as the fulcrum and compress the coil spring 33, so that the push plate 31 avoids the semiconductor chip package and facilitates the semiconductor chip package to stay on the inner side of the annular shell 3. A limit rod 39 is provided on the outer side of the push plate 31. The limit rod 39 is fixedly installed on the outer side of the conveyor belt 15. The coil spring 33 can make the push plate 31 contact with the limit rod 39 through the positioning rod 32 to ensure the normal reset of the push plate 31.

[0025] Working principle: First, the staff places the semiconductor chip package to be tested between the two conveyor support plates 2, so that the semiconductor chip package contacts the support rods 16 on the two conveyor belts 15, and the driving rod 13 drives the transmission belt 14 to rotate and move, so that the transmission belt 14 drives the conveyor belt 15 to rotate and move synchronously, and the push plate 31 on the conveyor belt 15 cooperates with the support rod 16 to push the semiconductor chip package to the inner side of the annular shell 3, so that the semiconductor chip package moves to the bottom of the four pressure rollers 7. At this time, the driving motor 10 is running, and the driving motor 10 drives the gear ring 12 to rotate through the first gear 11, so that the gear ring 12 drives the swivel 5 to rotate along between the two positioning rings 8, and the swivel 5 drives the detection probe 4 to move to the semiconductor chip package. At the same time, the rotating ring 5 drives the top plate 23 to move through the mounting rod 22, so that the top plate 23 is away from the abutment plate 21, and the middle position of the corresponding V-shaped folding rod 24 is pulled close to the positioning sleeve 17 by the resilience of the two springs 25. The two ends of the V-shaped folding rod 24 respectively push the abutment plate 21 and the baffle 6 to move in the opposite direction of the positioning sleeve 17. The baffle 6 is close to the semiconductor chip package, providing a barrier for the semiconductor chip package in the moving state. At the same time, the rotating ring 5 drives the arc-shaped rack 30 to approach the third gear 29. Due to the obstruction of the semiconductor chip package by the baffle 6, under the movement of the conveyor belt 15, the push plate 31 can swing with the positioning rod 32 as the fulcrum and compress the coil spring 33. When the pressure roller 7 presses the semiconductor chip package Under the pressing and positioning of the device, the push plate 31 can be moved out from the bottom of the semiconductor chip package, and then the detection probe 4 detects the top of the semiconductor chip package, and the driving motor 10 drives the first gear 11 to rotate continuously, so that the arc rack 30 drives the third gear 29 to rotate, and the third gear 29 drives the counter-rotating screw 28 to rotate synchronously, and the counter-rotating screw 28 drives the two moving blocks 27 to move in opposite directions along the inner side of the U-shaped slide 26. The moving block 27 drives the pressure roller 7 to move along the top of the semiconductor chip package, so that the detection probe 4 can fully detect the top of the semiconductor chip package. Subsequently, the rotating ring 5 drives the detection probe 4 to move to the bottom position inside the annular shell 3. Because the conveyor belt 15 drives the support rod 16 to maintain Continue to move, the support rod 16 will not continue to block the bottom of the semiconductor chip package, and the detection probe 4 can fully detect the bottom of the semiconductor chip package. Finally, the driving motor 10 drives the rotating ring 5 to reset, so that the top plate 23 is close to the support plate 21 again, so that the top plate 23 pushes the support plate 21 to move upward, and the support plate 21 pushes the second rack plate 19 to move. The second rack plate 19 drives the first rack plate 18 to move downward through the second gear 20, and the first rack plate 18 can pull the baffle 6 away from the semiconductor chip package. As a result, the push plate 31 can cooperate with the support rod 16 again to transport the semiconductor chip package out. There is no need to turn the semiconductor chip package over during this process, thereby achieving the effect of improving detection efficiency and comprehensive detection.

[0026] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0027] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A finished product defect detection device for semiconductor chip packaging, characterized in that: include: A device base (1) and two conveying support plates (2) symmetrically fixedly mounted on the top of the device base (1); an annular shell (3) is fixedly mounted between the two conveying support plates (2); and a detection probe (4) is provided on the inner side of the annular shell (3); Also includes: A detection mechanism for detecting double sides of semiconductor chip packaging, the detection mechanism being installed between the two conveying support plates (2), the detection mechanism comprising a rotating ring (5) arranged inside the annular shell (3), and the detection probe (4) being installed inside the rotating ring (5), and the rotating ring (5) being capable of rotating the detection probe (4); A positioning mechanism for detecting the positioning of a semiconductor chip package, the positioning mechanism being installed on the inner side of the annular shell (3), the positioning mechanism comprising a baffle (6) arranged on the inner side of the annular shell (3), the baffle (6) being capable of providing blocking and positioning for the moving semiconductor chip package; A pushing mechanism is used for smoothly pushing and pressing the semiconductor chip package to prevent it from twisting. The pushing mechanism is installed on the inner side of the annular shell (3). The pushing mechanism includes four pressing rollers (7) arranged on the inner side of the annular shell (3). The pressing rollers (7) can provide a limit for the top of the semiconductor chip package.

2. The device for detecting defects in finished semiconductor chip packaging according to claim 1, wherein: The detection mechanism further comprises two positioning rings (8) arranged on the inner side of the annular shell (3), an inner support plate (9) is fixedly installed between the annular shell (3) and the positioning ring (8), the rotating ring (5) is rotatably installed between the two positioning rings (8), a driving motor (10) is fixedly installed on the outer side of the positioning ring (8) located at the right end of the rotating ring (5), a first gear (11) is fixedly installed on the output end of the driving motor (10), a gear ring (12) is fixedly installed on the outer side of the rotating ring (5), two driving rods (13) are rotatably installed between the two conveying support plates (2), two transmission belts (14) are rotatably installed between the two driving rods (13), a conveying belt (15) is fixedly installed on the outer side of the transmission belt (14), and a plurality of support rods (16) are fixedly installed on the corresponding sides of the two conveying belts (15).

3. The device for detecting defects in finished semiconductor chip packaging products according to claim 2, wherein: The positioning mechanism further includes a positioning sleeve (17) mounted on the outside of the annular shell (3), a first rack plate (18) is fixedly mounted on the bottom of the baffle (6), a second rack plate (19) is slidably mounted on the inner side of the positioning sleeve (17), a second gear (20) is rotatably mounted on the inner side of the positioning sleeve (17), the first rack plate (18) and the second rack plate (19) are both matched with the second gear (20), a back plate (21) is mounted on the bottom of the second rack plate (19), two mounting rods (22) are fixedly mounted on the outer side of the rotating ring (5), a top plate (23) is mounted between the two mounting rods (22), two V-shaped folding rods (24) are hingedly assembled between the baffle (6) and the back plate (21), and a spring (25) is mounted between the middle position of the V-shaped folding rod (24) and the outer side of the positioning sleeve (17).

4. The device for detecting defects in finished semiconductor chip packaging products according to claim 3, wherein: The pushing mechanism further comprises two U-shaped slides (26) mounted between the inner sides of the two positioning rings (8), two moving blocks (27) being slidably mounted on the outer sides of the U-shaped slides (26), and the four pressure rollers (7) being rotatably mounted on the outer sides of the four moving blocks (27), and a different direction screw (28) cooperating with the moving blocks (27) being rotatably mounted on the inner side of the U-shaped slide (26), a third gear (29) being fixedly mounted on the outer side of the different direction screw (28), an arc-shaped rack (30) being fixedly mounted on the inner side of the rotating ring (5), and a plurality of push plates (31) being fixedly mounted on the corresponding sides of the two conveying belts (15), a positioning rod (32) being fixedly mounted on one end of the push plate (31), and the outer side of the positioning rod (32) being docked with the inner side of the conveying belt (15) through a coil spring (33).

5. The device for detecting defects in finished semiconductor chip packaging products according to claim 1, wherein: A control host (34) is installed on the outside of the annular shell (3), and the control host (34) is connected to the detection probe (4) via a cable.

6. The device for detecting defects in finished semiconductor chip packaging products according to claim 2, wherein: Two positioning shafts (35) are fixedly mounted on the bottom of the rotating ring (5), and positioning grooves are provided on the outer sides of the two inner support plates (9).

7. The device for detecting defects in finished products for semiconductor chip packaging according to claim 2, wherein: A support frame (36) is provided on the outside of the conveying belt (15), the outside of the support frame (36) contacts the outside of the support rod (16), and the two support frames (36) are respectively installed on the corresponding sides of the two conveying support plates (2).

8. The device for detecting defects in finished products for semiconductor chip packaging according to claim 3, wherein: Two sliding blocks (37) are fixedly mounted on the outer sides of the first rack plate (18) and the second rack plate (19), and a sliding groove is provided on the outer side of the positioning sleeve (17).

9. The device for detecting defects in finished products for semiconductor chip packaging according to claim 3, wherein: A pulley (38) is fixedly mounted on one end of the top plate (23), and an annular groove is formed at the end of the positioning ring (8).

10. The device for detecting defects in finished products for semiconductor chip packaging according to claim 4, wherein: A limiting rod (39) is provided on the outer side of the push plate (31), and the limiting rod (39) is installed on the outer side of the conveying belt (15).

Images