A method for measuring cutting forces for atomic precision machining

Abstract

The application discloses a kind of atomic precision machining cutting force measurement methods, belong to atomic precision machining field, including step one, determine atomic force microscope probe elastic stiffness;Step two, pretreatment atomic force microscope probe;Step three, prepare the sample being cut;Step four, prepare atomic grade sharp diamond tool;Step five, install sheet sample in X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod;Step six, using X-Nano multi-degree-of-freedom nanomanipulation technology realizes the measurement of cutting force;Step seven, the displacement of diamond tool and sheet sample along x direction under different frames is calculated, and the relationship curve of cutting stroke and cutting force is drawn.The application is based on AFM probe under TEM realizes the cutting force measurement of atomic precision machining, and cutting force measurement range can be flexibly adjusted according to the magnification of TEM and the elastic stiffness of AFM probe, and is suitable for the cutting force measurement of multiple materials.

Description

Technical Field

[0001] The present invention relates to the technical field of atomic precision machining, and in particular to a cutting force measurement method for atomic precision machining. Background Art

[0002] In atomic precision machining, the characteristic dimensions of the mechanical interaction between the tool and the workpiece are at the atomic scale. Atomically sharp diamond tools are used to apply cutting forces to the atomic-scale workpiece, enabling the controlled removal of atomic workpiece material with a thickness of several nanometers or tens of nanometers, thereby achieving atomic-level form and position tolerances and surface roughness. The mechanical interaction mechanism between atomic-scale tools and workpiece materials under complex stress states and high strain rates during atomic precision machining is a key scientific issue that urgently needs to be addressed in atomic precision machining. Therefore, the simultaneous realization of cutting, measurement, and characterization during atomic precision machining will contribute to the research of the basic theory and process equipment of atomic precision cutting.

[0003] An atomic force microscope (AFM) probe is a microcantilever beam that is extremely sensitive to weak forces. The deformation of its tiny tip when interacting with a sample can be used to measure contact forces. Previous experimental studies have shown that using AFM probes can measure interaction forces with samples under transmission electron microscopy (TEM).

[0004] However, there is currently a lack of a method that can integrate atomic-resolution dynamic observation and atomic force probes to achieve the perception and measurement of information such as the evolution of workpiece surface quality, tool wear behavior, chip formation mechanism, and cutting force changes during atomic precision machining. Summary of the Invention

[0005] The purpose of the present invention is to provide a cutting force measurement method for atomic precision machining, which realizes cutting force measurement for atomic precision machining under TEM based on an AFM probe. The cutting force measurement range can be flexibly adjusted according to the magnification of the TEM and the elastic stiffness of the AFM probe, and is suitable for cutting force measurement of various materials.

[0006] To achieve the above object, the present invention provides a cutting force measurement method for atomic precision machining, comprising the following steps:

[0007] Step 1: Determine the elastic stiffness of the atomic force microscope probe: determine the maximum bending displacement of the atomic force microscope probe based on the field of view of the transmission electron microscope at the experimental observation magnification, and determine the elastic stiffness of the atomic force microscope probe based on the range of the cutting force and the maximum bending displacement;

[0008] Step 2: Pre-treat the AFM probe: Select a gold wire and fold it into a paper clip-shaped platform, with the tail of the gold wire perpendicular to the paper clip-shaped platform, and stick the AFM probe onto the platform;

[0009] Step three, preparation of the cut sample: a micrometer sheet is processed on the surface of the cut sample by focused ion beam (FIB) micro-nano cutting technology, the micrometer sheet is transferred to an atomic force microscope probe, and a thin sheet is processed on the top end of the micrometer sheet;

[0010] Step four, preparation of an atomic-level sharp diamond tool: a diamond micrometer sheet is processed by focused ion beam micro-nano cutting technology and transferred to a half-copper mesh stylus, a diamond nanometer needle tip is processed on the diamond micrometer sheet and polished, and the diamond nanometer needle tip is cleaved by multi-degree-of-freedom nano-manipulation technology;

[0011] Step five, installation of the thin sheet sample on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod: the diamond tool and the thin sheet sample are installed on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod respectively;

[0012] Step six, measurement of cutting force using X-Nano multi-degree-of-freedom nano-manipulation technology: the relative position and relative height of the thin sheet sample and the diamond tool are adjusted, and the atomic-level sharp edge formed by the intersection of the cleavage surface of the diamond tool nanometer needle tip and the surface is used to cut the thin sheet sample;

[0013] Step seven, calculation of cutting force based on transmission electron microscope video: according to the images of each frame in the obtained high-resolution video, the displacement of the diamond tool and the thin sheet sample along the x direction under different frames is calculated, and the relationship curve between cutting stroke and cutting force is drawn.

[0014] Preferably, in step one, under a given cutting force, the greater the elastic stiffness of the atomic force microscope probe, the smaller the bending displacement, and the elastic stiffness of the atomic force microscope probe is calculated according to the following formula:

[0015] ;

[0016] In the formula, is the elastic stiffness of the atomic force microscope probe, is the maximum bending displacement allowed by the atomic force microscope probe within the field of view under the experimental observation magnification, is the cutting stroke, is the cutting force.

[0017] Preferably, in step two, a gold wire with a suitable diameter is selected, a pair of tweezers and pliers are used to bend one end into a U-shaped platform, the tail of the gold wire is reserved, and the tail is bent to be perpendicular to the U-shaped platform, conductive silver paste is used to stick the AFM probe to the top end of the platform, one end of the atomic force microscope probe is a cantilever beam, the free end of the cantilever beam faces the bending direction of the tail of the gold wire, and the atomic force microscope probe is perpendicular to the tail of the gold wire.

[0018] Preferably, in step three, the pretreated atomic force microscope probe is integrally adhered to the FIB micro-nano cutting sample table with the gold wire, and the atomic force microscope probe is vertical, the cut sample is adhered to the pin-shaped sample table and is simultaneously placed in the sample table, the free end of the cantilever beam on the atomic force microscope probe is trimmed flat using focused ion beam micro-nano processing technology, a micrometer sheet is processed on the surface of the cut sample, the micrometer sheet is vertically transferred to the trimmed free end of the cantilever beam, and a plurality of thin sheets are processed on the top end of the micrometer sheet by the focused ion beam.

[0019] Preferably, in step four, the {111} oriented diamond is used as a base material, a diamond micrometer sheet is prepared and vertically transferred to the finger of the half-copper mesh by using focused ion beam micro-nano processing technology, a diamond nano-needle tip is processed on the diamond micrometer sheet by the focused ion beam, the diamond nano-needle tip is polished by using an ion thinning instrument, the half-copper mesh with the diamond nano-needle tip is installed on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod, and based on the sub-nanometer level displacement control capability, the bending of the diamond nano-needle tip is realized until the cleavage fracture, thereby obtaining an atomic-level sharp diamond cutter.

[0020] Preferably, in step five, the half-copper mesh with the diamond cutter is installed on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod, the atomic force microscope probe with the thin sheet sample is integrally installed on the external frame of the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod, the free end of the cantilever beam faces the diamond cutter on the half-copper mesh, and the half-copper mesh, the external frame and the thin sheet sample are coplanar.

[0021] Preferably, in step six, under the transmission electron microscope, the relative position and relative height of the thin sheet sample and the diamond cutter are adjusted by using the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod for displacement control, so that the diamond cutter is aligned with the thin sheet sample and contacts one side of the cut thin sheet, the nano-needle tip of the diamond cutter is controlled to move uniformly along the x-axis by the X-Nano control program, the atomic-level sharp edge formed by the intersection of the cleavage surface and the surface of the nano-needle tip of the diamond cutter is used to cut the thin sheet sample, and the cutting depth is processed with nanometer-level atomic precision.

[0022] Preferably, in step seven, the displacement of the diamond cutter along the x direction in different frames is recorded as , and the displacement of the thin sheet sample along the x direction in different frames is recorded as ,

[0023] Cutting stroke According to the displacement difference between the cutter and the cut sample at the same time, the formula is as follows:

[0024] ;

[0025] Cutting force According to the displacement of the wafer sample and the elastic stiffness of the cantilever beam The formula is as follows:

[0026] ;

[0027] The cutting stroke and the cutting force at different times are calculated And the cutting force The relationship curve between the cutting stroke and the cutting force is drawn.

[0028] Therefore, the atomic precision machining cutting force measurement method has the following beneficial effects:

[0029] 1. The atomic resolution dynamic observation and atomic force probe are integrated, so that the workpiece surface quality evolution, tool wear behavior, chip formation mechanism and cutting force change information in the atomic precision machining process are perceived and measured;

[0030] 2. The atomic precision machining cutting force measurement method based on the AFM probe under the TEM is proposed, the cutting force measurement range can be flexibly adjusted according to the magnification of the TEM and the elastic stiffness of the AFM probe, and the cutting force measurement is suitable for cutting force measurement of various materials.

[0031] The technical solutions of the present application will be further described in detail below with the help of the drawings and examples. DRAWINGS

[0032] Figure 1 It is a cutting force measurement principle diagram of the atomic precision machining cutting force measurement method embodiment of the present application;

[0033] Figure 2 It is a gold wire bending structure diagram of the embodiment of the present application;

[0034] Figure 3 It is a structure diagram of the AFM probe sticking to the gold wire platform of the embodiment of the present application;

[0035] Figure 4 It is a diagram of transferring the micrometer sheet to the top end of the free end of the AFM cantilever beam of the embodiment of the present application;

[0036] Figure 5 It is a diagram of etching a plurality of wafer on the top of the micrometer sheet of the embodiment of the present application;

[0037] Figure 6 It is a SEM diagram of the diamond tool nanometer needle tip of the embodiment of the present application;

[0038] Figure 7Fig. 1 is a schematic diagram of a nanometer needle tip of a polished diamond cutter according to an embodiment of the present application;

[0039] Figure 8 Fig. 2 is a process diagram of forming a dissociation surface at the top end of a nanometer needle tip of a diamond cutter according to an embodiment of the present application, wherein Fig. 2a is a schematic diagram before forming, Fig. 2b is a process diagram of bending the nanometer needle tip, Fig. 2c is a process diagram of breaking the nanometer needle tip, and Fig. 2d is a schematic diagram after forming the dissociation surface;

[0040] Figure 9 Fig. 3 is a schematic diagram of a structure after installing a flake sample and a diamond cutter according to an embodiment of the present application;

[0041] Figure 10 Fig. 4 is a continuous cutting process diagram according to an embodiment of the present application, wherein Fig. 4a is a sample diagram at the beginning, Fig. 4b is a sample diagram at 32s, Fig. 4c is a sample diagram at 53s, Fig. 4d is a sample diagram at 65s, Fig. 4e is a sample diagram at 77s, and Fig. 4f is a sample diagram at 103s;

[0042] Figure 11 Fig. 5 is a curve diagram of cutting force versus cutting stroke according to an embodiment of the present application.

[0043] Reference numerals

[0044] 1, external frame; 2, AFM probe; 3, gold wire; 4, half copper mesh; 5, copper mesh clamp; 6, movable end of sample rod. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the embodiments of the present application are further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the embodiments of the present application and are not used to limit the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the scope of protection of the present application. Examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout.

[0046] It should be noted that the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or server comprising a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0047] Similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0048] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the present application is usually placed, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0049] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0050] Embodiment

[0051] As shown in Figure 1 , the cutting force measurement method for atomic precision machining according to the present application comprises the following steps:

[0052] Step one, determine the elastic stiffness of the AFM probe 2. Restricted by the field of view range of the transmission electron microscope under a certain magnification in experimental observation, the bending deflection of the AFM probe 2 must be controlled within a certain range. Under a given cutting force, the greater the elastic stiffness of the AFM probe 2, the smaller the bending displacement. The elastic stiffness of the AFM is estimated according to the following formula:

[0053] ;

[0054] In the formula, is the estimated elastic stiffness of the atomic force microscope probe, is the maximum bending displacement allowed by the AFM probe 2 within the field of view range under the experimental observation magnification, is the estimated cutting stroke, is the estimated cutting force, which is mainly affected by the cutting depth, sample thickness, sample material properties, etc.

[0055] Step two, pretreat the AFM probe 2. As shown in Figure 2 , select a 0.25mm diameter gold wire 3, use tweezers and pliers to fold one end into a platform shaped like a paperclip, with the platform being 3.5mm long in total. The tail of the gold wire 3 is left 15mm long, and the tail is bent to be perpendicular to the platform shaped like a paperclip. As shown in Figure 3As shown, the AFM probe 2 (for example, model PPP-NCST) is adhered to the gold wire 3 platform using conductive silver paste. One end of the AFM probe 2 is a cantilever beam, and attention should be paid to the fact that the free end of the cantilever beam should be directed towards the tail of the gold wire 3 platform, and the AFM probe 2 should be perpendicular to the tail of the gold wire 3.

[0056] Step three, preparation of the cut sample. The pretreated AFM probe 2-gold wire 3 is adhered to the FIB micro-nano cutting sample stage, and the AFM probe 2 is ensured to be vertical. The cut sample is adhered to the pin-shaped sample stage and simultaneously placed in the FIB micro-nano cutting sample stage. Using the focused ion beam micro-nano processing technology, the free end of the cantilever beam on the AFM probe 2 is flattened, and a micrometer piece with a thickness of 1 μm, a height of 5 μm, and a length of 15 μm is processed on the surface of the cut sample. The micrometer piece is vertically transferred to the flattened free end of the cantilever beam, as shown in FIG. 4. Figure 4 Subsequently, a series of thin pieces with a height of 1 μm, a length of 2 μm, and a thickness of 100 nm are processed at the top end of the micrometer piece using the focused ion beam, as shown in FIG. 5. Figure 5 Under a voltage of 5 kv, the thin pieces are blown by the focused ion beam to further reduce the thickness at the top end of the micrometer piece to 30 nm. It is necessary to ensure the flatness and uniform thickness of the top of the cut sample to reduce the change of the cutting depth and the cutting thickness with the cutting stroke. The FIB micro-nano cutting sample stage and the pin-shaped sample stage are common structures used by FIB, and the cut sample is a non-magnetic solid material that can be processed by FIB, such as metal materials such as gold, silver, and copper, high-entropy alloys, covalent materials such as silicon and silicon carbide, and the like. In this embodiment, the demonstration material is single-crystal gold.

[0057] Step four, preparation of the atomically sharp diamond tool. Using the {111} oriented diamond as the base material, a diamond micrometer piece with a height of 5 μm, a width of 1 μm, and a thickness of 1 μm is prepared using the focused ion beam micro-nano processing technology and is vertically transferred to the finger of the half-copper mesh 4. Then, a diamond nanometer needle tip with a height of 1 μm and a diameter of 100 nm is processed on the diamond micrometer piece using the focused ion beam, as shown in FIG. 6. Figure 6 The diamond nanometer needle tip is polished to a diameter of 30 nm using an ion thinning instrument, as shown in FIG. 7. Figure 7 The half-copper mesh 4 with the diamond nanometer needle tip is installed on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod. Based on the sub-nanometer level displacement control capability, the bending of the diamond nanometer needle tip until the cleavage fracture can be realized, and the atomically sharp diamond tool can be obtained. The process of forming the cleavage surface at the top end of the diamond tool nanometer needle tip is shown in FIG. 8. Figure 8 The X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod is a carrier of the sample, and the existing structure is adopted. The X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod is used in cooperation with the transmission electron microscope.

[0058] Step five, install the lamella sample on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample holder. Install the half copper mesh 4 with diamond knife on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample holder, and connect the half copper mesh 4 with the sample holder movable end 6 through the copper mesh clamp 5. Install the AFM probe 2 with gold wire 3 on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample holder external frame 1. The installation requires that the free end of the cantilever beam faces the diamond knife on the half copper mesh 4, and the half copper mesh 4, the external frame 1 and the lamella sample are coplanar. The schematic diagram after installation is shown in Figure 9 .

[0059] Step six, use the X-Nano multi-degree-of-freedom nanomanipulation technology to measure the cutting force. As shown in Figure 10 , under the transmission electron microscope, use the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample holder to control the displacement, adjust the relative position and height of the lamella sample and the diamond knife, so that the diamond knife is aligned with the lamella sample and contacts on one side of the cut lamella. Through the X-Nano control program, control the nanoneedle to move along the x-axis, and the movement process needs to be slow and uniform. Use the atomic-level sharp edge formed by the intersection of the cleavage plane and the surface to cut the sample, realize atomic precision machining of the cutting depth in the range of several nanometers to several tens of nanometers. Note that the X-Nano multi-degree-of-freedom in-situ transmission electron microscope goniometer stage cannot be moved at this time.

[0060] Step seven, calculate the cutting force based on the transmission electron microscope video. According to the pictures of each frame in the high-resolution video, calculate the displacement of the cutter and the cut sample along the x-direction in different frames, respectively denoted as and . The cutting stroke is calculated according to the displacement difference of the cutter and the cut sample at the same time, and the formula is as follows:

[0061] ;

[0062] The cutting force can be calculated according to the product of the displacement of the cut sample and the elastic stiffness of the cantilever beam , and the formula is as follows:

[0063] ;

[0064] According to this method, the cutting stroke and the cutting force at different times are calculated, and the "cutting stroke-cutting force" curve can be drawn, as shown in Figure 11 .

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit the same. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solutions of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solutions to deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. An atomic precision machining method of cutting force measurement, characterized by, The method comprises the following steps: Step one, determining the elastic stiffness of the atomic force microscope probe: according to the field of view range of the transmission electron microscope under the experimental observation magnification, the maximum bending displacement of the atomic force microscope probe is determined, and the elastic stiffness of the atomic force microscope probe is determined by the range of cutting force and the maximum bending displacement; Step two, pretreating the atomic force microscope probe: selecting a gold wire and folding it into a platform in the shape of a U-shaped needle, the tail of the gold wire is perpendicular to the platform in the shape of a U-shaped needle, and the atomic force microscope probe is adhered to the platform; Step three, preparing the sample to be cut: a micrometer sheet is processed on the surface of the sample to be cut by the focused ion beam micro-nano cutting technology, the micrometer sheet is transferred to the atomic force microscope probe, and a thin sheet is processed at the top end of the micrometer sheet; Step four, preparing the atomic-level sharp diamond tool: a diamond micrometer sheet is processed by the focused ion beam micro-nano cutting technology and is transferred to the half-copper mesh stylus, a diamond nano needle tip is processed on the diamond micrometer sheet and is polished, and the diamond nano needle tip is cleaved by the multi-degree-of-freedom nano manipulation technology; Step five, installing the thin sheet sample on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod: the diamond tool and the thin sheet sample are installed on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod respectively; Step six, measuring the cutting force by using the X-Nano multi-degree-of-freedom nano manipulation technology: the relative position and the relative height of the thin sheet sample and the diamond tool are adjusted, the atomic-level sharp edge formed by the intersection of the cleavage surface of the diamond tool nano needle tip and the surface is used to cut the thin sheet sample; Step seven, calculating the cutting force based on the transmission electron microscope video: according to each frame of picture in the obtained high-resolution video, the displacement of the diamond tool and the thin sheet sample along the x direction under different frames is calculated, and the relationship curve between the cutting stroke and the cutting force is drawn.

2. The cutting force measurement method for atomic precision machining according to claim 1, characterized in that: In step one, under a given cutting force, the greater the elastic stiffness of the atomic force microscope probe, the smaller the bending displacement, and the elastic stiffness of the atomic force microscope probe is calculated according to the following formula: ； In the formula is the elastic stiffness of the atomic force microscope probe, is the maximum bending displacement allowed for the atomic force microscope probe within the field of view at the experimental observation magnification, is the cutting travel, is the cutting force.

3. The atomically precise machining cutting force measurement method of claim 1, wherein: In step two, a gold wire with a suitable diameter is selected, one end of the gold wire is folded into a platform in the shape of a U-shaped needle by using tweezers and forceps, the tail of the gold wire is reserved, and the tail is bent to be perpendicular to the platform in the shape of a U-shaped needle, the atomic force microscope probe is adhered to the top end of the platform by using conductive silver paste, one end of the atomic force microscope probe is a cantilever beam, the free end of the cantilever beam faces the bending direction of the tail of the gold wire, and the atomic force microscope probe is perpendicular to the tail of the gold wire.

4. The atomically precise machining, cutting force measurement method of claim 1, wherein: In step three, the pretreated atomic force microscope probe and the gold wire are adhered to the focused ion beam micro-nano cutting sample table as a whole, the atomic force microscope probe is vertical, the sample to be cut is adhered to the pin-shaped sample table and is placed in the focused ion beam micro-nano cutting sample table at the same time, the free end of the cantilever beam on the atomic force microscope probe is flattened by the focused ion beam micro-nano processing technology, a micrometer sheet is processed on the surface of the sample to be cut, the micrometer sheet is vertically transferred to the free end of the cantilever beam, and a plurality of thin sheets are processed at the top end of the micrometer sheet by the focused ion beam.

5. The atomically precise machining, cutting force measurement method of claim 1, wherein: In step four, taking {111} oriented diamond as the base material, diamond micropellets are prepared by using focused ion beam micro-nano processing technology and are vertically transferred to the fingers of the half copper mesh. Diamond nanoneedle tips are processed on the diamond micropellets by focused ion beam. The diamond nanoneedle tips are polished by using an ion thinning instrument. The half copper mesh with the diamond nanoneedle tips is installed on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod. Based on the sub-nanometer level displacement control capability, the bending of the diamond nanoneedle tips is realized until the cleavage fracture, and an atomic level sharp diamond cutter is obtained.

6. The atomically precise machining, cutting force measurement method of claim 1, wherein: In step five, the half copper mesh with the diamond cutter is installed on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod. The atomic force microscope probe with the thin sheet sample is integrally installed on the external frame of the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod. The free end of the cantilever beam faces the diamond cutter on the half copper mesh. The half copper mesh, the external frame and the thin sheet sample are coplanar.

7. The atomically precise machining, cutting force measurement method of claim 1, wherein: In step six, under the transmission electron microscope, the relative position and the relative height of the thin sheet sample and the diamond cutter are adjusted by using the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod for displacement control. The diamond cutter and the thin sheet sample are aligned and are in contact on one side of the cut thin sheet. The nanoneedle tip of the diamond cutter is uniformly moved along the x-axis by using the X-Nano control program. The thin sheet sample is cut by using the atomic level sharp edge formed by the intersection of the nanoneedle tip and the cleavage surface of the diamond cutter. The cutting depth is nanometer level atomic precision machining.

8. The atomically precise machining, cutting force measurement method of claim 1, wherein: In step seven, the displacement of the diamond tool along the x direction under different frames is recorded as The displacement of the thin slice sample along the x direction under different frames is calculated and recorded as , Cutting stroke According to the displacement difference of the cutter and the sample at the same time, the formula is as follows: ； Cutting force According to the product of the displacement of the wafer sample and the elastic stiffness of the cantilever beam The formula is as follows: ； The cutting stroke at different time is calculated and the cutting force , and a curve of the cutting stroke and the cutting force is drawn.

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