Server part testing method, device, equipment, medium and product

Abstract

The invention discloses a server component test method, device and equipment, a medium and a product, and the method comprises the steps: applying a load to a server to increase the temperature of a to-be-tested component in the server under the condition that the pressure test of the to-be-tested component in the server is detected to be in a starting state, and collecting the temperature of the to-be-tested component and other components of the server in real time; when it is detected that the difference value between the temperature of the other parts and the current set temperature is smaller than a preset threshold value, the current set temperature is increased to a target set temperature according to a preset step length, and the speed regulation temperature of the other parts is set according to the temperature of the other parts and a temperature safety threshold value; and when it is detected that the temperature of the to-be-tested component reaches the target test temperature, starting to perform pressure test on the to-be-tested component. By increasing the set temperature of other components, the influence of the temperature of other components on the heat dissipation system of the server can be delayed, accurate temperature control of each component in the server is realized, and the temperature of the to-be-tested component is ensured to reach the temperature required by the test.

Description

Technical Field

[0001] The present application relates to the field of server testing technology, and in particular to server component testing methods, devices, equipment, media, and products. Background Art

[0002] In computing devices such as servers, high-temperature stress testing of components is necessary for reliability verification and fault detection. This can be accomplished by using external temperature control devices to raise the ambient temperature, thereby heating the server as a whole, or by reducing the speed of internal fans to reduce heat dissipation and increase internal temperatures. However, these methods are based on overall server temperature control and are unable to precisely control the temperature of specific components. Furthermore, due to the varying performance of individual server components, some may overheat locally, posing a risk of overheating and potentially damaging them. Therefore, ensuring that the temperatures of other components remain within a safe range while precisely heating the test components to the desired test temperature has become a pressing issue. Summary of the Invention

[0003] The present application provides a server component testing method, apparatus, equipment, medium and product to at least solve the problem in the related art of how to control the test component to accurately heat up to the temperature required for the test while ensuring that the temperature of other components is within a safe range.

[0004] The present application provides a component testing method for a server, comprising: applying a load to the server to increase the temperature of the component in the server when detecting that a stress test of a component to be tested in the server is in an activated state, and collecting the temperature of the component to be tested and other components of the server in real time; For any other component of the server, when it is detected that the difference between the temperature of the other component and the current set temperature is less than a preset threshold, the current set temperature is increased to the target set temperature according to the preset step size, and the speed regulation temperature of the other component is set according to the temperature of the other component and the temperature safety threshold; the target set temperature is less than or equal to the speed regulation temperature; the speed regulation temperature is the temperature used to indicate the temperature for adjusting the heat dissipation power of the server; When it is detected that the temperature of the component to be tested reaches the target test temperature, the pressure test on the component to be tested begins.

[0005] The present application also provides a component testing device for a server, comprising: a processing module for applying a load to the server to increase the temperature of the component in the server when detecting that a stress test of a component to be tested in the server is in an activated state; Acquisition module, used to collect the temperature of the component to be tested and other components of the server in real time; The processing module is further configured to, for any other component of the server, when it is detected that the difference between the temperature of the other component and the current set temperature is less than a preset threshold, increase the current set temperature to a target set temperature according to a preset step size, and set a speed regulating temperature of the other component according to the temperature of the other component and a temperature safety threshold; the target set temperature is less than or equal to the speed regulating temperature; the speed regulating temperature is a temperature used to indicate adjustment of the heat dissipation power of the server; The processing module is further configured to start a pressure test on the component to be tested when it is detected that the temperature of the component to be tested reaches a target test temperature.

[0006] The present application also provides an electronic device, comprising: a memory for storing a computer program; and a processor for implementing the steps of any of the above-mentioned server component testing methods when executing the computer program.

[0007] The present application also provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of any of the above-mentioned server component testing methods are implemented.

[0008] The present application also provides a computer program product, including a computer program, which implements the steps of any of the above-mentioned server component testing methods when executed by a processor.

[0009] Through this application, when it is detected that the stress test of the component to be tested in the server is in the activated state, a load is applied to the server to increase the temperature of the component in the server, and the temperature of the component to be tested and other components of the server are collected in real time; for any other component of the server, when it is detected that the difference between the temperature of the other component and the current set temperature is less than a preset threshold, the current set temperature is increased to the target set temperature according to the preset step size, and the speed control temperature of the other component is set according to the temperature of the other component and the temperature safety threshold; the target set temperature is less than or equal to the speed control temperature; the speed control temperature is a temperature used to indicate the adjustment of the heat dissipation power of the server; when it is detected that the temperature of the component to be tested reaches the target test temperature, the stress test of the component to be tested is started. In this solution, by adjusting the speed control temperature of other components except the component to be tested and increasing the set temperature, the influence of the temperature of other components on the heat dissipation system of the server can be delayed, without relying on external equipment, reducing costs, and achieving precise temperature control of each component in the server, not only ensuring that the temperature of the component to be tested can reach the temperature required for the test, but also controlling the temperature of other components within an ideal range. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] Figure 1 A system architecture diagram of a server component testing method provided in an embodiment of the present application; Figure 2 A schematic diagram of a server component testing method provided in an embodiment of the present application Figure 1 ; Figure 3 A schematic diagram of a server component testing method provided in an embodiment of the present application Figure 2 ; Figure 4 A schematic structural diagram of a server component testing device provided in an embodiment of the present application; Figure 5 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0012] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0013] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0014] It should be noted that in the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being more preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0015] In server and computing device reliability verification, high-temperature memory testing (e.g., target temperature ≥70°C) is critical for verifying stability and detecting faults. Current technologies utilize a temperature chamber test method to achieve component temperature increases. This involves using an external temperature control device (e.g., a high-temperature test chamber) to raise the ambient temperature, thereby heating the entire device and passively heating the memory. This solution relies heavily on external equipment, resulting in high costs. The large size of the equipment makes it difficult to move, restricting the testing environment. Testing large-scale server clusters is limited by the number of temperature chambers available, resulting in significant cost increases. Furthermore, a temperature chamber can only control the ambient temperature and cannot precisely control the temperature of specific components, such as memory. Maintaining a high temperature requires a constant balance of cooling and heating, resulting in extremely high energy consumption. Furthermore, different components have varying heat dissipation characteristics, raising the overall temperature and posing the risk of overheating individual components, potentially damaging them over time.

[0016] Additionally, servers can be equipped with fans to dissipate heat and ensure that the temperature of each component remains within an appropriate range. Therefore, during high-temperature stress testing, the fan speed can be set to a lower setting to heat up the server components, reducing heat dissipation and raising the internal temperature. However, reducing heat dissipation capacity by lowering fan speed makes it impossible to prioritize components, potentially causing localized overheating and damaging them. Furthermore, high component temperatures can trigger the baseboard management controller (BMC) protection mechanism, leading to test interruption.

[0017] Therefore, when conducting high-temperature stress testing on a server, it is necessary to accurately increase the temperature of the test components in the server to achieve the target test temperature while ensuring the safety of other components, such as the network card, etc., without relying on external equipment, reducing costs and limiting the test environment.

[0018] In order to solve all or part of the above-mentioned technical problems, the embodiments of the present application provide a server component testing method, device, equipment, medium and product. In order to enable technical personnel in this technical field to better understand the application scheme, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0019] Figure 1 This is a system architecture diagram of the server component testing method provided in an embodiment of the present application, wherein the system includes a hardware layer and a software layer.

[0020] like Figure 1As shown, the hardware layer can include server hardware, temperature sensors, and a cooling system. The server hardware, or the server being tested, includes components such as memory, network interface card (NIC), CPU, hard drive, and power supply. The temperature sensors can be internal to the server, monitoring the temperature of each component. The cooling system primarily consists of a fan array, dissipating heat from the server components. Other cooling devices, such as liquid cooling, can also be used.

[0021] like Figure 1 As shown, the software layer may include a stress testing unit, a temperature monitoring and control control unit, and a control unit. The stress testing unit can perform continuous high-intensity stress testing on the components to be tested by running a stress testing tool in the server. This can rapidly increase the component temperature and easily expose component failures under high-intensity stress. The stress testing tool may include memtester or stressapp. The temperature monitoring and control control unit can read the real-time temperature of each component in the server through the BMC, make judgments based on a preset algorithm, and dynamically adjust the heat dissipation control strategy, including how to adjust the set point and speed control point of each component, how to adjust the fan speed, etc. The control unit can execute commands to achieve control through the BMC's Intelligent Platform Management Interface (IPMI) or Redfish interface according to the adjustment strategy given by the temperature monitoring and control control unit.

[0022] like Figure 2 As shown, Figure 2 This is a flowchart of a component testing method for a server provided in an embodiment of the present application. The method can be implemented by the cooperation between the above-mentioned hardware layer and software layer. The method may include the following steps: 201. When it is detected that a stress test of a component to be tested in a server is in an activated state, a load is applied to the server to increase the temperature of the component in the server, and the temperature of the component to be tested and other components of the server are collected in real time.

[0023] In an embodiment of the present application, the component to be tested can be any component in the server that needs to be stress tested, which can usually refer to the memory, but of course it can also be other components. Other components can refer to components in the server other than the component to be tested. When it is necessary to stress test the component to be tested, it is necessary to increase the temperature of the component to be tested so that the temperature of the component to be tested reaches the target test temperature required for the test. Therefore, a load can be applied to the server to increase the temperature of the components in the server.

[0024] It should be noted that you can use a stress testing tool to impose a high load on the server, causing the various components in the server to start heating up. The stress testing tool can be memtester or stressapp. Specifically, you can use the following command: / memtester -t $time -m $ (free -g | awk ' / Mem / {print $7-10}'), where -t means running by time; $time is the test time, which is selected according to the test requirements; -m is the size of the component to be stress tested.

[0025] In some embodiments, assuming that the component to be tested is memory, that is, when the memory needs to be stress tested, when determining the size of the component to be stress tested, a certain amount of memory can be subtracted from the size of the available memory, for example: 10G. The 10G can be used as reserved memory for the normal operation overhead of the server to avoid the situation where the remaining memory is too small, causing memory overflow, and affecting the normal operation of the server.

[0026] In an embodiment of the present application, when the temperature of each component in the server is increased, the temperature of the component to be tested and other components of the server can be collected in real time. Specifically, the temperature of each component of the server can be monitored in real time through the IPMI or Redfish interface of the BMC. For example, ipmitool sensor list can be executed under Linux to read the temperature value of each component. Here, not only the temperature of the component to be tested needs to be read, but also the temperature of other components except the component to be tested needs to be read.

[0027] 202. For any other component of the server, when it is detected that the difference between the temperature of the other component and the current set temperature is less than the preset threshold, the current set temperature is increased to the target set temperature according to the preset step size, and the speed regulation temperature of the other component is set according to the temperature of the other component and the temperature safety threshold.

[0028] It should be noted that each component in the server is set with a corresponding speed control temperature and a set temperature. The speed control temperature indicates the temperature at which the server's heat dissipation power is adjusted. That is, when the component temperature reaches the speed control temperature, the server's heat dissipation power needs to be increased to reduce the component temperature. For example, if the speed control temperature of the network card is 100°C, the fan speed will be increased when the network card temperature exceeds 100°C. The set temperature refers to the optimal temperature that the server expects the component to maintain. For each component, the set temperature is lower than the speed control temperature.

[0029] In an embodiment of the present application, subsequent operations are performed on any other component of the server. If the difference between the temperature of any other component and the current set temperature corresponding to the component is less than the preset threshold, it can be said that the component is likely to trigger the adjustment of the heat dissipation power. Therefore, it is necessary to adjust its set temperature and speed regulation temperature so that the temperature change of the component will not trigger the adjustment of the heat dissipation power. Specifically, the speed regulation temperature of other components can be set according to the current temperature and temperature safety threshold of other components, and the current set temperature can be increased to the target set temperature according to the preset step size. The preset step size can be a customized smaller temperature change value, such as: 1°C, that is, the current set temperature of the component is increased by 1°C each time.

[0030] In addition, when setting the speed control temperature, you can refer to the temperature safety threshold. The temperature safety threshold can be considered as the safe upper limit temperature of the component. The temperature safety threshold of each component can be the same or different, and is not specifically limited. If the component temperature exceeds the temperature safety threshold, the component may be damaged by overheating. Therefore, the component temperature cannot exceed the temperature safety threshold. In addition, since the speed control temperature can trigger an increase in the heat dissipation power, if the heat dissipation power increases, the temperature of the component to be tested will inevitably decrease, which makes it impossible to perform a stress test. Therefore, in order to ensure that the component to be tested can be heated smoothly, it is also necessary to ensure that the temperature of other components does not exceed the speed control temperature. Since the set temperature of other components will increase gradually in a cycle, there is a correlation between the current set temperature and the real-time temperature of the component. Therefore, in order to ensure that the temperature of other components does not exceed the speed control temperature, it is necessary to ensure that the target set temperature of the other components after each adjustment is less than or equal to the speed control temperature.

[0031] In some embodiments, since the temperatures of various components in the entire server may rise, that is, it is possible that the temperatures of multiple other components may reach the set temperature, or the difference between the temperatures and the current set temperature may be less than a preset threshold. Therefore, the current set temperature of each of the multiple other components can be increased to the target set temperature according to a preset step size, and the speed regulation temperature of the other components can be set according to the temperature of the other components and the temperature safety threshold.

[0032] 203. When it is detected that the temperature of the component to be tested reaches the target test temperature, start pressure testing on the component to be tested.

[0033] In an embodiment of the present application, the component to be tested will continue to heat up under the influence of the server load, and by dynamically adjusting the speed regulation trigger thresholds (i.e., the set temperature and the speed regulation temperature) corresponding to other components, the occupancy of its cooling system is delayed to ensure that the cooling system does not affect the heating of the component to be tested. Therefore, if it is detected that the temperature of the component to be tested reaches the target test temperature, it means that the current temperature environment is suitable for stress testing, so the stress test of the component to be tested can be started.

[0034] In the embodiment of the present application, by adjusting the speed control temperature of other components except the component to be tested and increasing the set temperature, the impact of the temperature of other components on the cooling system of the server can be delayed, without relying on external equipment, reducing costs, and achieving precise temperature control of each component in the server, which not only ensures that the temperature of the component to be tested can reach the temperature required for the test, but also can control the temperature of other components to be within the ideal range.

[0035] like Figure 3 As shown, Figure 3 Another flowchart of a component testing method for a server provided in an embodiment of the present application, the method may include the following steps: 301. When it is detected that a stress test of a component to be tested in a server is in an activated state, a load is applied to the server to increase the temperature of the component in the server, and the temperature of the component to be tested and other components of the server are collected in real time.

[0036] In the embodiment of the present application, for the description of step 301, please refer to the detailed description of step 201 in the above embodiment, and the embodiment of the present application will not be repeated.

[0037] 302. For any other component of the server, when it is detected that the difference between the temperature of the other component and the current set temperature is less than a preset threshold, determine the speed regulation temperature adjustment value of the other component according to the temperature of the other component, the temperature safety threshold and the safety factor.

[0038] In an embodiment of the present application, when setting the speed regulation temperature corresponding to other components, the speed regulation temperature adjustment value corresponding to the other components can be determined based on the current temperature of the other components, the temperature safety threshold corresponding to the other components, and the safety factor.

[0039] In some embodiments, the current temperature of other components and the temperature safety threshold corresponding to the component can be obtained through the ipmitool sensor list command.

[0040] In some embodiments, the speed regulation temperature adjustment value can be calculated using the following formula:

[0041] in, Indicates the speed control temperature adjustment value, Indicates the temperature safety threshold corresponding to other components, Indicates the current temperature of other components, Indicates the safety factor. The default value of the safety factor is 0.8. .

[0042] 303. Determine a first speed regulation temperature according to the speed regulation temperature adjustment value and the temperatures of other components.

[0043] In the embodiment of the present application, after the speed regulation temperature adjustment value is calculated, the speed regulation temperature adjustment value and the current temperature of other components can be added to obtain the first speed regulation temperature.

[0044] In some embodiments, combined with the above formula, the first speed adjustment temperature can be expressed as , the first speed regulation temperature is lower than the temperature safety threshold.

[0045] 304. Determine the speed regulation temperature of other components according to the initial speed regulation temperature and the first speed regulation temperature corresponding to the other components.

[0046] In the embodiment of the present application, each component is provided with an original set temperature and speed control temperature. In the server BMC system, the temperature control policy can be queried using the monitor_app --show-fan-param command, which includes the original speed control temperature and set temperature corresponding to the other components. Since the speed control temperature directly affects the heat dissipation power, the higher the speed control temperature, the smaller the impact of the other component on the heat dissipation system. However, since the original speed control temperature is not taken into account when calculating the speed control temperature adjustment value, the first speed control temperature determined based on the temperature, temperature safety threshold, and safety factor of the other component cannot guarantee a size relationship with the original speed control temperature. Therefore, the final speed control temperature corresponding to the other component can be determined based on the initial speed control temperature and the first speed control temperature corresponding to the other component.

[0047] In some embodiments, the speed regulation temperature of other components is determined based on the initial speed regulation temperature and the first speed regulation temperature corresponding to other components. Specifically, it may include: numerically comparing the initial speed regulation temperature and the first speed regulation temperature to obtain a comparison result; and determining the speed regulation temperature of other components based on the maximum value between the initial speed regulation temperature and the first speed regulation temperature indicated by the comparison result.

[0048] It should be noted that the initial speed regulation temperature and the first speed regulation temperature can be compared to determine the maximum value between the initial speed regulation temperature and the first speed regulation temperature, and the maximum value can be determined as the speed regulation temperature of other components, and the speed regulation temperature of other components can be updated.

[0049] In some embodiments, assuming that the temperature safety threshold of the network card is 105°C, the initial speed regulation temperature of the network card is 100°C, and the first speed regulation temperature obtained after calculation is 101°C. After comparison: 101°C>100°C, therefore 101°C can be determined as the latest speed regulation temperature of the network card, and the speed regulation temperature of the network card is updated to 101°C according to the monitor_app --set-fan-param bjpid11_threshold80:101 command.

[0050] In some embodiments, the speed regulation temperature will affect the adjustment of the triggering heat dissipation power. Therefore, when adjusting the speed regulation temperature of other components, in order to delay the impact of the temperature of other components on the heat dissipation power as much as possible, it is necessary to increase the speed regulation temperature as much as possible. Therefore, based on the temperature safety threshold and the real-time temperature, it is possible to further combine the initial speed regulation temperature to take the maximum value. This can ensure that the temperature increase of the component to be tested will not be affected by the heat dissipation system, and accurately control the temperature of the component to be tested.

[0051] 305. When it is detected that the difference between the speed regulation temperature of other components and the current set temperature is greater than or equal to the preset step length, the current set temperature corresponding to the other components is increased to the target set temperature according to the preset step length.

[0052] In the embodiment of the present application, since the heat dissipation power will be adjusted when the temperature of other components exceeds the speed regulation temperature, it is necessary to ensure that the set temperature does not exceed the speed regulation temperature when adjusting the set temperature. Since each adjustment of the set temperature is made according to a preset step size, that is, the adjusted target set temperature is equal to the sum of the current set temperature and the preset step size, in order to ensure that the adjusted target set temperature does not exceed the preset step size, before adjustment, the difference between the current set temperature and the speed regulation temperature can be calculated. If the difference is greater than or equal to the preset step size, then the adjusted target set temperature is still less than or equal to the speed regulation temperature and will not exceed the speed regulation temperature. However, if the difference is less than the preset step size, then the adjusted target set temperature will be greater than the speed regulation temperature, which will cause the heat dissipation power of the server to change, and it will be impossible to achieve continuous heating of the component to be tested. Therefore, only when it is detected that the difference between the speed regulation temperature of other components and the current set temperature is greater than or equal to the preset step size, can the current set temperature corresponding to the other components be increased to the target set temperature according to the preset step size.

[0053] In some embodiments, assuming that the current set temperature of the network card is 85°C and the preset step size is 1°C, that is, the current set temperature is increased by one degree each time, and the current set temperature is increased from 85°C to 86°C as the target set temperature, which can be achieved by using the monitor_app --set-fan-param bjpid11_sp86 command.

[0054] In some embodiments, before adjusting the set temperature of other components, it is necessary to compare the difference between the set temperature and the speed regulation temperature with the preset step size. This is to ensure that after the set temperature is increased according to the preset step size, it will not exceed the speed regulation temperature, avoid causing an increase in the server's heat dissipation power, and ensure that the component to be tested can continue to heat up.

[0055] 306. When it is detected that the temperature of the component to be tested is lower than the target test temperature, the current set temperature of other components is increased according to the preset step size, or the heat dissipation power of the server is reduced according to the difference between the current set temperature of other components and the speed regulation temperature.

[0056] In an embodiment of the present application, after increasing the current set temperatures corresponding to other components to the target set temperature, the current temperature of the component to be tested can be detected. If the temperature of the component to be tested is lower than the target test temperature, it means that the component to be tested has not yet met the requirements of the stress test, and then it is necessary to continue to heat up. At this time, the current set temperatures of other components can be increased cyclically according to the preset step size, or the heat dissipation power of the server can be reduced. The specific measures taken can be determined based on the difference between the current set temperatures of other components and the speed regulation temperature.

[0057] In some embodiments, when it is detected that the temperature of the component under test is lower than the target test temperature, the current set temperature of other components is increased according to a preset step size, or the heat dissipation power of the server is reduced, based on the difference between the current set temperature of other components and the speed regulation temperature. Specifically, the following two optional implementation methods may be included: Implementation method 1: When it is detected that the temperature of the component to be tested is lower than the target test temperature, and the difference between the current set temperature and the speed regulation temperature of other components is greater than or equal to the preset step size, the current set temperature of other components is increased according to the preset step size.

[0058] It should be noted that, on the basis that the temperature of the component to be tested is lower than the target test temperature, if it is detected that the difference between the current set temperature and the speed regulation temperature of other components is greater than or equal to the preset step size, it means that on the basis of the current set temperature, the current set temperature can be increased according to the preset step size, and the increased target set temperature will not exceed the speed regulation temperature, so the current set temperature of other components can continue to be increased according to the preset step size.

[0059] Implementation method 2: When it is detected that the temperature of the component to be tested is lower than the target test temperature, and the difference between the current set temperature and the speed regulation temperature of other components is smaller than the preset step size, the heat dissipation power of the server is reduced.

[0060] It should be noted that, on the basis that the temperature of the component to be tested is lower than the target test temperature, if it is also detected that the difference between the current set temperature and the speed regulation temperature of other components is less than the preset step size, it means that on the basis of the current set temperature, if the current set temperature is increased according to the preset step size, the increased target set temperature will exceed the speed regulation temperature, thereby causing the adjustment of the heat dissipation power, and the temperature of the component to be tested cannot be increased. Therefore, the set temperature cannot be further increased. In other words, if the set temperature of other components can no longer be increased, but the temperature of the component to be tested still does not reach the target test temperature, then in order to ensure that the component to be tested can continue to heat up, the heat dissipation power of the server can be reduced.

[0061] In some embodiments, the server's heat dissipation system can be implemented through at least liquid cooling or air cooling. Liquid cooling involves cooling the server through the flow of coolant, while air cooling involves cooling the server through the operation of fans. Reducing the server's heat dissipation power can specifically include reducing the coolant's flow rate or flow area, and reducing fan speed to suppress heat dissipation. Of course, other methods can also be used to achieve server heat dissipation, and these methods are not specifically limited in this embodiment.

[0062] In some embodiments, when adjusting the set temperature of other components, the temperature of the component to be tested may not be able to rise to the test temperature in one go. Therefore, it may be necessary to adjust the set temperature cyclically, and each time the set temperature is adjusted, it is necessary to ensure that the speed regulation temperature is not exceeded, thereby taking different heat dissipation suppression tests to ensure that the component to be tested can continue to heat up, while also ensuring that the temperature changes of other components will not increase the heat dissipation power.

[0063] 307. When the temperature of the component to be tested is greater than the target test temperature, the current set temperatures of other components are reduced according to a preset step size, and the heat dissipation power of the server is increased.

[0064] In an embodiment of the present application, if after increasing the current set temperature to the target set temperature, it is detected that the temperature of the component to be tested has exceeded the target test temperature, then the component to be tested needs to be cooled down, so the current set temperatures of other components can be lowered and the heat dissipation power of the server can be increased.

[0065] It should be noted that when the component under test is heating up, other components in the server will also heat up. The speed control temperature corresponding to the component is greater than the set temperature. Once the component temperature exceeds the speed control temperature, it will trigger a substantial increase in the heat dissipation power. For example, the fan speed will be directly increased from the original 40% speed to 80% speed to achieve the purpose of rapid cooling. If the component temperature exceeds the set temperature, it will not trigger a substantial increase in the heat dissipation power. However, the heat dissipation power will be fine-tuned according to the algorithm of the cooling system. For example, the fan speed will be fine-tuned from the original 40% speed to 42% speed to try to keep the component temperature at the set temperature. It is understandable that if the current set temperature of other components is lowered, then the other components will reach the current set temperature faster, that is, the fine-tuning of the heat dissipation power will be triggered faster, which may achieve the cooling of the component under test. However, lowering the current set temperature does not ensure that the heat dissipation power will be fine-tuned immediately. Therefore, if you want to quickly make the temperature of the component under test equal to the target test temperature, you can also directly increase the heat dissipation power of the server.

[0066] In some embodiments, the temperature of the component to be tested may be higher than the test temperature. In this case, corresponding measures need to be taken to cool the component to be tested so that the temperature of the component to be tested can meet the test temperature.

[0067] 308. After the server is left stationary for a preset period of time, when it is detected that the temperature of the component to be tested reaches the target test temperature, a stress test is started on the component to be tested.

[0068] In the embodiment of the present application, each time the set temperature of other components is increased, the system can be left to stand for a period of time to ensure that the temperatures of all components in the server and the cooling system have stabilized before testing the temperature of the component under test. The preset time period can be a customizable time period, such as 50 seconds or 1 minute. After adjusting the set temperatures of other components or adjusting the cooling power of the server, if the temperature of the component under test reaches the target test temperature, it indicates that the component under test has met the test temperature environment, and thus the stress test can be started on the component under test.

[0069] In some embodiments, each time the set temperature of other components is increased, there may be a certain response time between the adjustment of the set temperature and the real-time temperature increase, because the temperature of the component may not change in time, and the temperature of the component may suddenly increase and become unstable due to other influences. Therefore, it is possible to wait for a period of time before detecting the real-time temperature. This can improve the accuracy of temperature detection and achieve precise temperature control of each component.

[0070] 309. Compare the temperature of each component with the temperature safety threshold to obtain a temperature detection result.

[0071] In an embodiment of the present application, the server may also be configured with a safety fuse mechanism, that is, each component is set with a corresponding temperature safety threshold. If the temperature safety threshold is exceeded, the component may be damaged by overheating. Therefore, based on the real-time collection of the temperature of the component to be tested and other components of the server, the temperature of each component can be compared with the temperature safety threshold to obtain a temperature detection result. The temperature detection result can indicate the size relationship between the temperature of each component and the corresponding temperature safety threshold.

[0072] 310. Take corresponding safety measures for components in the server based on the temperature detection results.

[0073] In the embodiment of the present application, safety measures corresponding to various temperature detection results can be pre-set. After the temperature detection result of a current component is determined, safety measures corresponding to the temperature detection result can be taken for the component.

[0074] In some embodiments, temperature safety measures can be set up with multiple levels of protection such as early warning, recovery, and emergency cooling.

[0075] In some embodiments, when a component temperature reaches 98% of the temperature safety threshold, an alert is issued. When a component temperature reaches the temperature safety threshold, the speed control and setpoint temperatures of all components are immediately restored to ensure timely triggering of server cooling power adjustments. When a component temperature reaches 102% of the temperature safety threshold, the server cooling power is immediately adjusted to its maximum value to achieve rapid cooling and prevent hardware damage caused by overheating. The values ​​of 98% and 102% of the temperature safety thresholds are configurable and are not limited.

[0076] In some embodiments, the temperature of each component is monitored in real time through a safety fuse mechanism, and corresponding measures are taken to ensure that the component temperature does not exceed a safety threshold, thereby ensuring the normal operation of the server and the normal testing of the components to be tested.

[0077] 311. When it is detected that the temperature of the component to be tested reaches the target test temperature, the set temperature increase value of other components is determined.

[0078] In an embodiment of the present application, when it is detected that the temperature of the component to be tested reaches the target test temperature, it means that the component to be tested meets the test temperature environment and the test can be started. It also means that the current adjustment of the set temperature of other components is appropriate. Therefore, the set temperature increase value of the other components can be determined. The set temperature increase value can refer to the difference between the initial set temperature of the other components and the set temperature when the temperature of the component to be tested reaches the target test temperature.

[0079] 312. Generate a temperature change model of the server according to the temperature change value of the component to be tested, the set temperature increase value, the load power of the component to be tested, and the heat dissipation power of the server.

[0080] In an embodiment of the present application, the temperature change value of the component to be tested may refer to the difference between the temperature value when the load is first applied to the server so that each component begins to heat up and the temperature value when the temperature of the component to be tested reaches the target test temperature (i.e., the target test temperature); the load power of the component to be tested may refer to the load power applied to the server. If the load changes, the load power may take the maximum value; the heat dissipation power of the server may refer to the initial heat dissipation power of the server. It should be noted that, ideally, the temperature of the component to be tested can reach the target test temperature only by adjusting the speed control temperature and set temperature of other components. The adjustment of the heat dissipation power of the server involved in this application is only an operation performed in some scenarios.

[0081] In some embodiments, the temperature variation model of the server can be expressed by the following formula:

[0082] in, Indicates the temperature change value of the component to be tested. Indicates the set temperature increase value. Indicates the load power of the component under test, Indicates the heat dissipation power of the server. Indicates the heat dissipation coupling coefficient, which is related to the design of the heat dissipation system and is usually 0.6-0.9; and Both are power influence coefficients, which can be obtained through a large amount of data experiments.

[0083] From this formula, it can be seen that for the same server, multiple component temperature rise tests can be performed, and different components to be tested can be selected each time. Different target test temperatures can also be set. By performing multiple experiments and recording the temperature change value of the component to be tested, the set temperature increase value, the load power of the component to be tested, the heat dissipation power of the server and other data for each experiment, the temperature change model can be generated.

[0084] In some embodiments, after generating the temperature change model, if the stress test on other components in the server requires heating, the corresponding test temperature can be directly input into the model. Ideally, the load power and heat dissipation power of the same server are the same, so the corresponding set temperature increase value can be directly calculated through the temperature change model. In this way, the set temperature of other components can be directly increased, and fine-tuning can be performed on this basis without increasing it step by step according to a certain step size.

[0085] In some embodiments, a temperature change model is generated based on the corresponding temperature increase value, power, fan speed and other data during the stress test, so that the specific temperature increase value can be directly obtained through the model during subsequent stress tests. There is no need to gradually increase the temperature, and the component temperature can be quickly increased, thereby improving test efficiency.

[0086] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus the necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method.

[0087] like Figure 4 As shown, an embodiment of the present application further provides a component testing device for a server, which may include: The processing module 401 is configured to apply a load to the server to increase the temperature of the component in the server when detecting that the stress test of the component to be tested in the server is in the activated state; Acquisition module 402, for collecting the temperature of the component to be tested and other components of the server in real time; The processing module 401 is further configured to, for any other component of the server, increase the current set temperature to a target set temperature according to a preset step size when it is detected that the difference between the temperature of the other component and the current set temperature is less than a preset threshold, and set a speed regulating temperature of the other component according to the temperature of the other component and a temperature safety threshold; the target set temperature is less than or equal to the speed regulating temperature; the speed regulating temperature is a temperature used to indicate adjustment of the heat dissipation power of the server; The processing module 401 is further configured to start a pressure test on the component to be tested when it is detected that the temperature of the component to be tested reaches a target test temperature.

[0088] In some embodiments, the processing module 401 is specifically configured to determine the speed regulation temperature adjustment value of other components based on the temperature, temperature safety threshold, and safety factor of other components; The processing module 401 is specifically configured to determine a first speed regulating temperature according to the speed regulating temperature adjustment value and the temperatures of other components; The processing module 401 is specifically configured to determine the speed regulation temperature of other components according to the initial speed regulation temperature and the first speed regulation temperature corresponding to the other components.

[0089] In some embodiments, the processing module 401 is specifically configured to perform a numerical comparison between the initial speed adjustment temperature and the first speed adjustment temperature to obtain a comparison result; The processing module 401 is specifically configured to determine the speed regulation temperatures of other components according to the maximum value between the initial speed regulation temperature and the first speed regulation temperature indicated by the comparison result.

[0090] In some embodiments, the processing module 401 is specifically configured to increase the current set temperature corresponding to the other component to the target set temperature according to the preset step length when it is detected that the difference between the speed regulation temperature of the other component and the current set temperature is greater than or equal to the preset step length.

[0091] In some embodiments, the processing module 401 is specifically configured to start a stress test on the component to be tested when it is detected that the temperature of the component to be tested reaches a target test temperature after the server has been left stationary for a preset period of time.

[0092] In some embodiments, the processing module 401 is also used to increase the current set temperature of other components according to a preset step size, or reduce the heat dissipation power of the server, based on the difference between the current set temperature of other components and the speed regulation temperature, when it is detected that the temperature of the component to be tested is lower than the target test temperature.

[0093] In some embodiments, the processing module 401 is specifically used to increase the current set temperature of other components according to the preset step size when it is detected that the temperature of the component to be tested is lower than the target test temperature and the difference between the current set temperature of other components and the speed regulation temperature is greater than or equal to the preset step size.

[0094] In some embodiments, the processing module 401 is specifically configured to reduce the heat dissipation power of the server when it is detected that the temperature of the component to be tested is lower than the target test temperature and the difference between the current set temperature and the speed regulation temperature of other components is smaller than a preset step size.

[0095] In some embodiments, the processing module 401 is further configured to, when the temperature of the component to be tested is greater than the target test temperature, reduce the current set temperatures of other components according to a preset step size and increase the heat dissipation power of the server.

[0096] In some embodiments, the processing module 401 is further configured to compare the temperature of each component with a temperature safety threshold to obtain a temperature detection result; The processing module 401 is further configured to take corresponding safety measures for components in the server according to the temperature detection result.

[0097] In some embodiments, the processing module 401 is further configured to determine an increase in the set temperature of other components when it is detected that the temperature of the component to be tested reaches the target test temperature; The processing module 401 is further configured to generate a temperature change model of the server according to the temperature change value of the component to be measured, the set temperature increase value, the load power of the component to be measured, and the heat dissipation power of the server.

[0098] In the embodiments of the present application, the description of the features in the embodiments corresponding to the component testing device of the server can be found in the relevant description of the embodiments corresponding to the component testing method of the server, and will not be repeated here.

[0099] like Figure 5 As shown, an embodiment of the present application also provides an electronic device, including a memory 501 and a processor 502, wherein the memory 501 stores a computer program, and the processor 502 is configured to run the computer program to execute the steps in any of the above-mentioned server component testing method embodiments.

[0100] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps of any of the above-mentioned server component testing method embodiments when running.

[0101] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.

[0102] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps in any of the above-mentioned server component testing methods are implemented.

[0103] An embodiment of the present application also provides another computer program product, including a non-volatile computer-readable storage medium, the non-volatile computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, implementing the steps in any of the above-mentioned server component testing method embodiments.

[0104] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0105] The above is a detailed introduction to the component testing method, device, equipment, medium and product of a server provided by this application. This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only applicable to help understand the method and core ideas of this application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. A method for testing components of a server, characterized in that: include: When it is detected that the stress test of the component to be tested in the server is in an activated state, applying a load to the server to increase the temperature of the component in the server, and collecting the temperature of the component to be tested and other components of the server in real time; For any other component of the server, when it is detected that the difference between the temperature of the other component and the current set temperature is less than a preset threshold, the current set temperature is increased to a target set temperature according to a preset step size, and the speed regulation temperature of the other component is set according to the temperature of the other component and a temperature safety threshold; the target set temperature is less than or equal to the speed regulation temperature; the speed regulation temperature is a temperature used to indicate adjustment of the heat dissipation power of the server; When it is detected that the temperature of the component to be tested reaches the target test temperature, the pressure test of the component to be tested begins.

2. The method according to claim 1, characterized in that The step of setting the speed regulating temperature of the other components according to the temperature of the other components and the temperature safety threshold comprises: determining a speed regulation temperature adjustment value of the other component according to the temperature of the other component, the temperature safety threshold, and the safety factor; determining a first speed regulating temperature according to the speed regulating temperature adjustment value and the temperatures of the other components; The speed regulation temperature of the other component is determined according to the initial speed regulation temperature corresponding to the other component and the first speed regulation temperature.

3. The method according to claim 2, characterized in that The determining the speed regulating temperature of the other component according to the initial speed regulating temperature corresponding to the other component and the first speed regulating temperature includes: Comparing the initial speed regulation temperature with the first speed regulation temperature to obtain a comparison result; The speed regulating temperature of the other component is determined according to the maximum value between the initial speed regulating temperature and the first speed regulating temperature indicated by the comparison result.

4. The method according to claim 1, wherein Increasing the current set temperature to the target set temperature according to a preset step size includes: When it is detected that the difference between the speed regulation temperature of the other component and the current set temperature is greater than or equal to the preset step length, the current set temperature corresponding to the other component is increased to the target set temperature according to the preset step length.

5. The method according to claim 1, wherein When it is detected that the temperature of the component to be tested reaches the target test temperature, starting to perform a pressure test on the component to be tested includes: After the server is left to stand for a preset period of time, when it is detected that the temperature of the component to be tested reaches the target test temperature, a pressure test is started on the component to be tested.

6. The method according to claim 1, characterized in that After the method further comprises: when it is detected that the difference between the temperature of the other component and the current set temperature is less than a preset threshold, increasing the current set temperature to a target set temperature according to a preset step size, and setting the speed regulation temperature of the other component according to the temperature of the other component and a temperature safety threshold, the method further comprises: When it is detected that the temperature of the component to be tested is lower than the target test temperature, the current set temperature of the other components is increased according to the preset step size, or the heat dissipation power of the server is reduced according to the difference between the current set temperature of the other components and the speed regulation temperature.

7. The method according to claim 6, characterized in that When it is detected that the temperature of the component to be tested is lower than the target test temperature, increasing the current set temperature corresponding to the other component according to the preset step size according to the difference between the current set temperature of the other component and the speed regulation temperature, and / or reducing the heat dissipation power of the server, includes: When it is detected that the temperature of the component to be tested is lower than the target test temperature, and the difference between the current set temperature of the other components and the speed regulation temperature is greater than or equal to the preset step size, the current set temperature of the other components is increased according to the preset step size.

8. The method according to claim 6, characterized in that When it is detected that the temperature of the component to be tested is lower than the target test temperature, increasing the current set temperature corresponding to the other component according to the preset step size according to the difference between the current set temperature of the other component and the speed regulation temperature, and / or reducing the heat dissipation power of the server, includes: When it is detected that the temperature of the component to be tested is lower than the target test temperature, and the difference between the current set temperature of the other components and the speed regulation temperature is smaller than the preset step size, the heat dissipation power of the server is reduced.

9. The method according to claim 1, characterized in that After the method further comprises: when it is detected that the difference between the temperature of the other component and the current set temperature is less than a preset threshold, increasing the current set temperature to a target set temperature according to a preset step size, and setting the speed regulation temperature of the other component according to the temperature of the other component and a temperature safety threshold, the method further comprises: When the temperature of the component to be tested is greater than the target test temperature, the current set temperatures of the other components are reduced according to the preset step size, and the heat dissipation power of the server is increased.

10. The method according to claim 1, characterized in that The method further comprises: Comparing the temperature of each component with the temperature safety threshold to obtain a temperature detection result; According to the temperature detection result, corresponding safety measures are taken for components in the server.

11. The method according to claim 1, characterized in that The method further comprises: When it is detected that the temperature of the component to be tested reaches the target test temperature, determining the set temperature increase value of the other components; A temperature change model of the server is generated according to the temperature change value of the component to be measured, the set temperature increase value, the load power of the component to be measured, and the heat dissipation power of the server.

12. A component testing device for a server, characterized in that: include: a processing module, configured to apply a load to the server to increase the temperature of the component in the server when detecting that the stress test of the component to be tested in the server is in an activated state; An acquisition module, configured to collect the temperature of the component to be tested and other components of the server in real time; The processing module is further configured to, for any other component of the server, increase the current set temperature to a target set temperature according to a preset step size when detecting that the difference between the temperature of the other component and the current set temperature is less than a preset threshold, and set a speed regulating temperature for the other component based on the temperature of the other component and a temperature safety threshold; the target set temperature is less than or equal to the speed regulating temperature; and the speed regulating temperature is a temperature used to indicate adjustment of the heat dissipation power of the server; The processing module is further configured to start a pressure test on the component to be tested when it is detected that the temperature of the component to be tested reaches a target test temperature.

13. An electronic device, characterized in that: include: memory for storing computer programs; A processor, configured to implement the steps of the server component testing method according to any one of claims 1 to 11 when executing the computer program.

14. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, wherein when the computer program is executed by a processor, the steps of the component testing method of the server according to any one of claims 1 to 11 are implemented.

15. A computer program product, characterized in that The computer program product comprises a computer program, and when the computer program is executed by a processor, the steps of the component testing method of the server according to any one of claims 1 to 11 are implemented.

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