Broadband optimization method for radio frequency coaxial connector

Abstract

The invention relates to the technical field of modern communication, in particular to a radio frequency coaxial connector broadband optimization method, which comprises the following steps: S1, data acquisition and processing: acquiring demand information for data transmission of a radio frequency coaxial connector, corresponding connection structure information of the radio frequency coaxial connector and material manufacturing information of the radio frequency coaxial connector according to a communication demand; the broadband performance and the mass production consistency of the radio frequency coaxial connector are remarkably improved through the multi-dimensional collaborative optimization technology, and the voltage standing wave ratio is optimized to be smaller than or equal to 1.25 from 1.5 of a traditional design within the range of 0-40 GHz by adopting a three-stage index gradual change impedance structure and combining non-equidistant stepped distribution; and the outer conductor thread part is embedded into the distributed LC compensation network, the 30-40GHz high-frequency band reflection is inhibited, the phase distortion is greatly reduced, the spiral radial slotted medium support ring forms an air-medium mixed structure, and the gradient injection molding process is combined, so that the effective dielectric constant, the dielectric constant gradient error and the insertion loss are greatly reduced.

Description

Technical Field

[0001] The present invention relates to the technical field, and in particular to a method for optimizing a wide-band radio frequency coaxial connector. Background Art

[0002] With the rapid advancement of modern communications technology, the technical requirements for RF coaxial connectors in integrated equipment are also rising. This has not only led to the emergence of new connectors featuring wideband, low standing wave (VSWR), miniaturization, versatility, high reliability, and fast connection, but has also posed more stringent challenges to connector product design. RF coaxial connectors play a vital role in the microwave field. They are not only key components in RF transmission but are also widely favored for their wide bandwidth, convenient and reliable connection, excellent performance, and affordable cost. Their applications are ubiquitous in microwave communications equipment, instrumentation, and weapon systems.

[0003] For example, a low-profile dual-port high-isolation dual circularly polarized antenna array with application number CN202110504811.5 and authorization announcement date 20220503 belongs to the field of microwave antenna technology. The present invention consists of 4 radiating units, which are distributed in an oblique cross shape, wherein each two radiating units form a group and adopt a differential feeding method. Through the full-duplex feeding network, the solution provided by the present invention achieves dual-port co-directional circular polarization while having high port isolation, thereby achieving good transmit and receive isolation. The present invention can be used in satellite communications, civil communication systems and other microwave communication systems.

[0004] For example, a household socket with improved safety and versatility, with application number CN202011117412.5 and publication date 20210129, includes a socket body, a switch is movably connected to the right end of the top of the socket body, a fixed disk is fixedly connected to the top of the socket body, a rotating disk is elastically connected to the interior of the fixed disk through a spring, movable balls are movably connected to the left and right sides of the rotating disk near the middle, and a double-sided rack is movably connected to the middle of the rotating disk. This household socket with improved safety and versatility is not energized when an object is simply inserted but the trigger rod is not fully depressed or the switch is disconnected to insert an object, thereby preventing children from inserting toys into the socket and causing electric shock, thereby improving the safety performance of the socket, and the socket and the rotating disk rotate inside the fixed disk to prevent the wires from twisting and entangled, thereby meeting the insertion of two plugs, improving the versatility of the socket, and enhancing the user experience.

[0005] As a core component for high-frequency signal transmission, the performance of RF coaxial connectors directly affects the bandwidth, signal integrity, and reliability of communication systems. With the rapid development of technologies such as 5G millimeter-wave communications (24-40GHz) and satellite communications (Ka-band), traditional connectors face the following challenges:

[0006] Wideband impedance mismatch: In the ultra-wideband range of 0-40GHz, the interface between the inner and outer conductors causes impedance discontinuity (VSWR>1.5) due to step mutations, which triggers signal reflection (return loss>-15dB), especially in the millimeter wave band (>30GHz).

[0007] High-frequency dielectric loss: Traditional dielectric support rings use a uniform dielectric constant design (such as PTFE with a dielectric constant of 2.1). At a frequency of 40 GHz, the dielectric polarization effect causes the insertion loss to increase sharply (>0.4 dB / mm).

[0008] Insufficient mechanical stability: The plugging and unplugging life (<300 times) and contact resistance (>2mΩ) are difficult to meet the requirements of harsh environments such as automotive and aerospace, and the plugging and unplugging force fluctuations (±10N) cause accelerated wear on the connector interface.

[0009] Disconnect between design and manufacturing: Existing technologies rely on trial and error and lack a closed-loop verification system from simulation to mass production, resulting in long design iteration cycles (>6 months) and poor batch consistency (standing wave ratio fluctuations >5%).

[0010] In view of this, there is an urgent need to design a wide-bandwidth optimization method for RF coaxial connectors to solve the above problems. Summary of the Invention

[0011] The object of the present invention is to provide a method for optimizing the wideband of a radio frequency coaxial connector to solve the above-mentioned deficiencies in the prior art.

[0012] In order to achieve the above object, the present invention provides the following technical solutions:

[0013] A method for optimizing a radio frequency coaxial connector over a wide frequency band comprises the following steps:

[0014] Step S1. Data acquisition and processing: Based on communication requirements, obtain the demand information of the RF coaxial connector for data transmission, the corresponding connection structure information of the RF coaxial connector, and the material manufacturing information of the RF coaxial connector, and then extract and analyze the acquired information to obtain key data;

[0015] Step S2. Structural Design and Production: Select key data from the RF coaxial connector material production information, then improve the selected data based on the analysis results. After the improvement is completed, select appropriate materials and produce the RF coaxial connector based on the improved structure;

[0016] Step S3. Simulation and testing: The fabricated RF coaxial connector is tested to obtain RF coaxial connector data. A virtual model of the RF coaxial connector is constructed based on the data. A data transmission test model is constructed based on the demand information and connection structure information. The virtual model of the RF coaxial connector is then embedded into the data transmission test model. Parameters are input into the data transmission test model, the data transmission test model is started, and the data transmission effect of the virtual model of the RF coaxial connector is tested. After the test is completed, the test data is output.

[0017] Step S4. Problem analysis and optimization: Acquire test data, analyze the test data, and determine whether the test data meets the data transmission requirements. If not, extract the test data to obtain problem data, analyze the problem data, determine the cause of the problem data, and then trace the cause of the problem data. Based on the traceability, determine the location in the RF coaxial connector virtual model that corresponds to the cause of the problem data, analyze the cause of the problem data, write a solution based on the analysis, and then modify the RF coaxial connector virtual model based on the solution. After the modification is completed, continue the test in the previous step until the test results meet the data transmission requirements;

[0018] Step S5. Production testing and mass production: multiple RF coaxial connectors are produced using test data that meets data transmission requirements, and the RF coaxial connectors are tested. After the test is correct, mass production can be carried out. If the test is incorrect, repeat the above steps to continue testing.

[0019] Furthermore, in step S1, the requirement information includes the target frequency band (0-40GHz), voltage standing wave ratio (VSWR≤1.25), insertion loss (≤0.3dB / mm) and mechanical plug-in life (≥500 times); the connection structure information includes the diameter tolerance of the inner and outer conductors (±5μm), the dielectric constant gradient distribution of the dielectric support ring (2.2-3.5) and the contact surface roughness (Ra≤0.4μm).

[0020] Furthermore, in step S2, the structural improvement includes:

[0021] (1) Design a three-level exponential gradient impedance matching structure at the contact interface between the inner and outer conductors, with the step width and depth distributed at non-uniform intervals;

[0022] (2) The dielectric support ring adopts a spiral radial slot design to form an air-dielectric hybrid structure to reduce dielectric loss;

[0023] (3) A distributed LC compensation network is configured at the threaded connection of the outer conductor to suppress high-frequency signal reflection.

[0024] Furthermore, in step S2, material selection includes:

[0025] (1) The inner conductor is made of gold-plated copper alloy (conductivity ≥ 90% IACS), and the outer conductor is made of silver-plated aluminum alloy;

[0026] (2) The dielectric support ring is made of polytetrafluoroethylene-ceramic nanocomposite material (PTFE+Al2O3), and the gradient distribution of ceramic particles is controlled by injection molding process.

[0027] Furthermore, in step S3, the virtual model of the RF coaxial connector is constructed using three-dimensional electromagnetic simulation software (Ansys HFSS or CST Studio), and the simulation parameters include the skin effect of the conductor surface, the dielectric loss tangent (tanδ≤0.001) and the contact surface impedance mutation point; the data transmission test model simulates multi-band signal transmission (0-40GHz) and mechanical vibration environment (20-2000Hz).

[0028] Furthermore, in step S3, the test parameters include:

[0029] (1) Frequency domain parameters: voltage standing wave ratio (VSWR), insertion loss, return loss (≤-20dB);

[0030] (2) Time domain parameters: impedance continuity (time domain reflection fluctuation ≤ 5%), signal rise time (≤ 10 ps);

[0031] (3) Mechanical parameters: insertion and extraction force (20-50N), contact resistance (≤1mΩ).

[0032] Furthermore, in step S4, the problem data tracing method includes:

[0033] (1) Use time domain reflectometry (TDR) to locate the impedance mutation point with an accuracy of 0.1mm;

[0034] (2) Dynamically assign weights to multi-source data through a Bayesian network to identify the main failure modes (such as dielectric constant deviation or contact surface oxidation).

[0035] Furthermore, in step S4, the problem data solution includes:

[0036] (1) Adjust the concentration gradient of ceramic particles in the injection molding process according to the dielectric constant deviation of the medium;

[0037] (2) To prevent contact surface oxidation, increase the thickness of the inner conductor gold plating layer (≥2μm) and optimize the insertion gap (5-10μm).

[0038] Furthermore, in step S5, the production test includes:

[0039] (1) Environmental reliability test: high and low temperature cycle (-55℃~+125℃), salt spray test (48h), vibration test (20gRMS);

[0040] (2) Electrical performance retest: Verify the batch consistency of standing wave ratio and insertion loss at 40 GHz (fluctuation ≤ 3%).

[0041] Furthermore, in step S5, batch production adopts an automated assembly line, including:

[0042] (1) Inner conductor precision turning module (CNC accuracy ±2μm);

[0043] (2) Dielectric ring gradient injection mold (temperature control ±1°C);

[0044] (3) Contact surface plasma cleaning equipment (surface oxygen content ≤ 5%).

[0045] In the above technical solution, the present invention provides a method for optimizing the wide-bandwidth of a radio frequency coaxial connector, which has the following beneficial effects:

[0046] (1) The present invention significantly improves the broadband performance and mass production consistency of RF coaxial connectors through multi-dimensional collaborative optimization technology, and adopts a three-level exponential gradient impedance structure, combined with non-equidistant step distribution, to optimize the voltage standing wave ratio from 1.5 of the traditional design to ≤1.25 in the range of 0-40GHz, and the return loss is ≤-20dB; and the threaded part of the outer conductor is embedded with a distributed LC compensation network, which suppresses the high-frequency reflection of 30-40GHz and greatly reduces the phase distortion. The spiral radial slotted dielectric support ring forms an air-dielectric hybrid structure, combined with the gradient injection molding process, the equivalent dielectric constant is reduced from 3.5 to 2.2-2.5, the dielectric constant gradient error is ±0.1, and the 40GHz insertion loss is ≤0.3dB / mm.

[0047] (2) The present invention solves the problem of disconnection between traditional design and mass production through closed-loop verification and intelligent manufacturing system; dynamically allocates multi-source data weights through Bayesian network tracing technology, improves the failure mode recognition accuracy from 10% to 90%, and greatly shortens the design iteration cycle; combines time domain reflectometry to locate impedance mutation points, quickly optimizes contact surface roughness and insertion gap, and reduces production costs.

[0048] (3) The present invention has been applied to fields such as 5G base stations and satellite feeding systems. The insertion loss at the 40GHz frequency point is reduced by 40%, and the performance consistency of mass production batches reaches the international leading level (IEC61169 standard), providing a cost-effective and highly reliable connector solution for high-frequency communication systems. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments described in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0050] Figure 1 A schematic diagram of a flow chart of an embodiment of a method for optimizing a wide-bandwidth radio frequency coaxial connector according to the present invention.

[0051] Figure 2 Schematic diagram of step S1. data acquisition and processing provided in an embodiment of a method for wide-band optimization of a radio frequency coaxial connector of the present invention.

[0052] Figure 3 Schematic diagram of step S2. structural design and production provided in an embodiment of a method for optimizing wide-bandwidth radio frequency coaxial connectors according to the present invention.

[0053] Figure 4 This is a schematic diagram of simulation and testing of step S3 of an embodiment of a method for wide-band optimization of a radio frequency coaxial connector according to the present invention.

[0054] Figure 5 This is a schematic diagram of problem analysis and optimization in step S4 of an embodiment of a method for wide-band optimization of a radio frequency coaxial connector according to the present invention. DETAILED DESCRIPTION

[0055] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0056] like Figure 1-5 As shown, an embodiment of the present invention provides a method for optimizing a wide-bandwidth radio frequency coaxial connector, comprising the following steps:

[0057] Step S1. Data acquisition and processing: Based on communication requirements, obtain the demand information of the RF coaxial connector for data transmission, the corresponding connection structure information of the RF coaxial connector, and the material manufacturing information of the RF coaxial connector, and then extract and analyze the acquired information to obtain key data;

[0058] In step S1, the required information includes the target frequency band (0-40GHz), voltage standing wave ratio (VSWR≤1.25), insertion loss (≤0.3dB / mm) and mechanical plug-in life (≥500 times); the connection structure information includes the diameter tolerance of the inner and outer conductors (±5μm), the dielectric constant gradient distribution of the dielectric support ring (2.2-3.5) and the contact surface roughness (Ra≤0.4μm).

[0059] It should be noted that the specific implementation process of step S1. data acquisition and processing is as follows:

[0060] 1. Extraction of demand information:

[0061] Input: Communication system design requirements (such as the 5G base station millimeter wave frequency band 0-40GHz), industry standards (IEC61169-42), and customer customization requirements (such as plug-in life ≥500 times).

[0062] Key parameters:

[0063] Frequency band: 0-40GHz (segment requirements: 0-6GHz, 6-28GHz, 28-40GHz).

[0064] Electrical performance: VSWR ≤ 1.25 (full frequency band), insertion loss ≤ 0.3dB / mm@40GHz.

[0065] Mechanical properties: insertion and extraction force 20-50N, contact resistance ≤1mΩ.

[0066] Output: Requirement parameter table (Excel / CSV format), marked with priority and tolerance range.

[0067] 2. Connection structure information collection:

[0068] Data source:

[0069] Existing product CAD drawings (inner and outer conductor diameter tolerance ±5μm).

[0070] Dielectric support ring material parameters (dielectric constant gradient 2.2-3.5, axial distribution).

[0071] Tools and methods:

[0072] The three-dimensional coordinate measuring machine (CMM) measures the geometric dimensions of the conductor (accuracy ±1μm).

[0073] A dielectric constant tester (such as the Keysight N1500A) measures dielectric gradient distribution.

[0074] 3. Material production information integration:

[0075] Key Stats:

[0076] Conductor plating process (gold plating thickness ≥ 2μm, silver plating thickness ≥ 5μm).

[0077] Injection molding parameters of dielectric material (temperature 180±1℃, pressure 80MPa).

[0078] Data Analysis:

[0079] Principal component analysis (PCA) was used to screen key factors (such as the influence weight of coating roughness on VSWR).

[0080] Generate material-property correlation matrices (e.g., dielectric loss vs. ceramic particle concentration for PTFE+Al2O3).

[0081] Step S2. Structural Design and Production: Select key data from the RF coaxial connector material production information, then improve the selected data based on the analysis results. After the improvement is completed, select appropriate materials and produce the RF coaxial connector based on the improved structure;

[0082] In step S2, the structural improvement includes:

[0083] (1) Design a three-level exponential gradient impedance matching structure at the contact interface between the inner and outer conductors, with the step width and depth distributed at non-uniform intervals;

[0084] (2) The dielectric support ring adopts a spiral radial slot design to form an air-dielectric hybrid structure to reduce dielectric loss;

[0085] (3) A distributed LC compensation network is configured at the threaded connection of the outer conductor to suppress high-frequency signal reflection.

[0086] In step S2, material selection includes:

[0087] (1) The inner conductor is made of gold-plated copper alloy (conductivity ≥ 90% IACS), and the outer conductor is made of silver-plated aluminum alloy;

[0088] (2) The dielectric support ring is made of polytetrafluoroethylene-ceramic nanocomposite material (PTFE+Al2O3), and the gradient distribution of ceramic particles is controlled by injection molding process.

[0089] It should be noted that the specific implementation process of step S2. structural design and production is as follows:

[0090] 1. Structural improvement design:

[0091] Three-stage exponential gradient impedance matching structure:

[0092] Parameter settings:

[0093] First level (0-8GHz): step width 0.3mm, depth 0.05mm.

[0094] Second level (8-30GHz): width 0.15mm, depth 0.1mm.

[0095] Level 3 (30-40GHz): width 0.08mm, depth 0.2mm.

[0096] Simulation verification: The gradient coefficient k (K=0.05-0.1) was optimized by Ansys HFSS.

[0097] Spiral radial slot design:

[0098] Slot parameters: slot width 0.1mm, helix angle 45°, air ratio 40% (reduces equivalent dielectric constant by 15%).

[0099] Processing method: Five-axis precision milling machine (tool diameter 0.1mm, speed 50,000rpm).

[0100] Distributed LC compensation network:

[0101] Layout: An alternating array of capacitors (0.5pF) and inductors (1nH) is embedded in the threaded portion of the outer conductor to suppress 28GHz / 38GHz reflections.

[0102] Verification: S11 ≤ -20dB was measured using a vector network analyzer (VNA).

[0103] 2. Material selection and processing:

[0104] Inner conductor: Gold-plated copper alloy C7025 (conductivity ≥ 90% IACS), gold plating thickness 2±0.2μm (magnetron sputtering process).

[0105] Outer conductor: Silver-plated aluminum alloy 6061 (conductivity ≥ 85% IACS), surface roughness Ra ≤ 0.4 μm (chemical polishing).

[0106] Medium support ring: PTFE+Al2O3 (particle size 100 nm, volume fraction 20%), injection mold temperature gradient control (180°C→160°C→140°C).

[0107] Step S3. Simulation and testing: The fabricated RF coaxial connector is tested to obtain RF coaxial connector data. A virtual model of the RF coaxial connector is constructed based on the data. A data transmission test model is constructed based on the demand information and connection structure information. The virtual model of the RF coaxial connector is then embedded into the data transmission test model. Parameters are input into the data transmission test model, the data transmission test model is started, and the data transmission effect of the virtual model of the RF coaxial connector is tested. After the test is completed, the test data is output.

[0108] In step S3, a virtual model of the RF coaxial connector is constructed using three-dimensional electromagnetic simulation software (Ansys HFSS or CST Studio). The simulation parameters include the skin effect of the conductor surface, the dielectric loss tangent (tanδ≤0.001), and the contact surface impedance mutation point; the data transmission test model simulates multi-band signal transmission (0-40GHz) and mechanical vibration environment (20-2000Hz).

[0109] In step S3, the test parameters include:

[0110] (1) Frequency domain parameters: voltage standing wave ratio (VSWR), insertion loss, return loss (≤-20dB);

[0111] (2) Time domain parameters: impedance continuity (time domain reflection fluctuation ≤ 5%), signal rise time (≤ 10 ps);

[0112] (3) Mechanical parameters: insertion and extraction force (20-50N), contact resistance (≤1mΩ).

[0113] It should be noted that the specific implementation process of step S3. simulation and testing is as follows:

[0114] 1. Virtual model construction:

[0115] Modeling tools:

[0116] Ansys HFSS: Import the 3D CAD model and set the material properties (skin depth of the gold plating layer is 0.07μm @ 40GHz).

[0117] Boundary conditions: Radiation boundary box size ≥ λ / 4@40GHz (λ = 7.5mm).

[0118] Key simulation parameters:

[0119] Dielectric loss tangent tanδ≤0.001 (PTFE+Al2O3 measured data).

[0120] Contact surface impedance mutation point (positioning accuracy 0.1mm through TDR).

[0121] 2. Data transmission test model:

[0122] Multi-band signal input:

[0123] Sweep frequency signal: 0-40GHz, step 1GHz, power 0dBm.

[0124] Step pulse: rise time 10ps, amplitude 1V.

[0125] Mechanical vibration simulation:

[0126] Vibration frequency 20-2000Hz, acceleration 20g, three-axis synchronous vibration (embedded in the multi-body dynamics module through CSTStudio).

[0127] 3. Test execution and data collection:

[0128] Frequency domain testing:

[0129] VSWR test: VNA full-band scan, save S11 / S21 parameters.

[0130] Insertion loss: The loss value is recorded at 40GHz (accuracy ±0.01dB).

[0131] Time domain test:

[0132] The impedance fluctuation is detected by a time domain reflectometer (TDR) with a sampling rate of 80GSa / s.

[0133] Mechanical testing:

[0134] Insertion and extraction force test: driven by a servo motor (speed 5 mm / s), recording the peak value of the force-displacement curve.

[0135] Step S4. Problem analysis and optimization: Acquire test data, analyze the test data, and determine whether the test data meets the data transmission requirements. If not, extract the test data to obtain problem data, analyze the problem data, determine the cause of the problem data, and then trace the cause of the problem data. Based on the traceability, determine the location in the RF coaxial connector virtual model that corresponds to the cause of the problem data, analyze the cause of the problem data, write a solution based on the analysis, and then modify the RF coaxial connector virtual model based on the solution. After the modification is completed, continue the test in the previous step until the test results meet the data transmission requirements;

[0136] In step S4, the problem data tracing method includes:

[0137] (1) Use time domain reflectometry (TDR) to locate the impedance mutation point with an accuracy of 0.1mm;

[0138] (2) Dynamically assign weights to multi-source data through a Bayesian network to identify the main failure modes (such as dielectric constant deviation or contact surface oxidation).

[0139] In step S4, the problem data solution includes:

[0140] (1) Adjust the concentration gradient of ceramic particles in the injection molding process according to the dielectric constant deviation of the medium;

[0141] (2) To prevent contact surface oxidation, increase the thickness of the inner conductor gold plating layer (≥2μm) and optimize the insertion gap (5-10μm).

[0142] It should be noted that the specific implementation process of step S4. Problem analysis and optimization is as follows:

[0143] 1. Problem data tracing:

[0144] TDR locates impedance mutation points:

[0145] If a reflection point is detected (e.g., 2.5 mm from the interface), it is located as the contact surface between the dielectric support ring and the conductor in combination with the CAD model.

[0146] Bayesian Network Analysis:

[0147] Input parameters: material batch data (coating thickness deviation ±0.1μm), injection temperature fluctuation (±2℃).

[0148] Output results: failure mode probability (such as dielectric constant deviation probability 65%, contact oxidation probability 25%).

[0149] 2. Implementation of optimization plan:

[0150] Dielectric constant adjustment:

[0151] Modify the injection molding process: the concentration of ceramic particles is gradually adjusted from 20% to 10% at the front, 25% in the middle, and 15% at the back.

[0152] Verification: After re-injection, the measured dielectric constant gradient was 2.3 → 3.2 (target 2.2-3.5).

[0153] Contact surface oxidation protection:

[0154] The gold plating layer of the inner conductor is increased to 3μm, and the insertion gap is optimized to 8±1μm (laser fine-tuning process).

[0155] Surface plasma cleaning (argon flow rate 50 sccm, power 500 W, time 30 s).

[0156] 3. Iterative verification:

[0157] After modifying the virtual model, rerun the simulation and test in step S3 until the VSWR is ≤ 1.25 and the insertion loss is ≤ 0.3 dB / mm.

[0158] Step S5. Production testing and mass production: multiple RF coaxial connectors are produced using test data that meets data transmission requirements, and the RF coaxial connectors are tested. After the test is correct, mass production can be carried out. If the test is incorrect, repeat the above steps to continue testing.

[0159] In step S5, the production test includes:

[0160] (1) Environmental reliability test: high and low temperature cycle (-55℃~+125℃), salt spray test (48h), vibration test (20gRMS);

[0161] (2) Electrical performance retest: Verify the batch consistency of standing wave ratio and insertion loss at 40 GHz (fluctuation ≤ 3%).

[0162] In step S5, batch production uses an automated assembly line, including:

[0163] (1) Inner conductor precision turning module (CNC accuracy ±2μm);

[0164] (2) Dielectric ring gradient injection mold (temperature control ±1°C);

[0165] (3) Contact surface plasma cleaning equipment (surface oxygen content ≤ 5%).

[0166] It should be noted that the specific implementation process of step S5. production test and batch production is as follows:

[0167] 1. Small batch trial production:

[0168] Precision machining:

[0169] Inner conductor turning: CNC machine tool (spindle speed 30,000 rpm, diamond tool), diameter tolerance ±2μm.

[0170] Dielectric ring injection molding: Multi-cavity mold temperature control ±1℃, holding time 30s.

[0171] Automated assembly:

[0172] Robot assembly line (repeat positioning accuracy ±5μm), plug-in force closed-loop feedback control (20-50N).

[0173] 2. Reliability test:

[0174] High and low temperature cycle: -55℃(30min)→+125℃(30min), cycle 100 times, contact resistance change ≤3%.

[0175] Salt spray test: 5% NaCl solution, spray at 35℃ for 48h, no surface corrosion (SEM detection of oxide layer thickness ≤ 50nm).

[0176] Vibration test: 20-2000Hz random vibration, contact resistance real-time monitoring fluctuation ≤2%.

[0177] 3. Batch production control:

[0178] Statistical Process Control (SPC):

[0179] Key parameter monitoring: coating thickness (XR control chart), injection temperature (CPK≥1.33).

[0180] Full inspection and random inspection rules:

[0181] Full inspection items: VSWR@40GHz, insertion and removal force.

[0182] Sampling ratio: 10% of samples are subject to salt spray test and TDR test.

[0183] Example 1: 5G millimeter wave base station connector optimization

[0184] Technical solution:

[0185] 1. Requirements and structural design:

[0186] Target frequency band: 28GHz / 39GHz (5G millimeter wave band), VSWR ≤ 1.25, insertion loss ≤ 0.25dB / mm.

[0187] Structural improvements:

[0188] The inner conductor adopts three-level exponential gradient impedance matching (step width 0.1-0.3mm, gradient coefficient k=0.08) to suppress 28GHz reflection.

[0189] The dielectric support ring is spirally grooved (groove width 0.08mm, air ratio 45%), reducing the equivalent dielectric constant to 2.5.

[0190] Material selection: Inner conductor is gold-plated copper alloy (conductivity 92% IACS), and dielectric ring is PTFE+30% nano-Al2O3.

[0191] 2. Simulation and testing:

[0192] Model construction: CSTStudio was used to simulate multi-band signal transmission and embed mechanical vibration (frequency 1000Hz) to verify the plug-in life.

[0193] Test results: VSWR = 1.18 @ 39 GHz, insertion loss 0.22 dB / mm, insertion force 35 N (contact resistance ≤ 1.2 mΩ after 500 cycles).

[0194] 3. Mass production control:

[0195] Automated assembly line (inner conductor turning accuracy ±2μm), standing wave ratio fluctuation between batches ≤2%.

[0196] Example 2: Satellite Communication Environment-Resistant Connector

[0197] Technical solution:

[0198] 1. Requirements and structural design:

[0199] Target frequency band: 0-40GHz (full frequency band coverage), salt spray protection level ASTMB117, vibration tolerance 20gRMS.

[0200] Structural improvements:

[0201] The threaded portion of the outer conductor integrates a distributed LC compensation network (capacitance 0.8pF, inductance 1.2nH) to suppress 40GHz signal reflections.

[0202] The gold plating layer on the contact surface is thickened to 3μm, and the insertion gap is 8μm (laser fine-tuning).

[0203] Material selection: outer conductor silver-plated aluminum alloy (salt spray protection), dielectric ring gradient injection molding (front PTFE + 10% Al2O3, rear PTFE + 25% Al2O3).

[0204] 2. Testing and optimization:

[0205] Environmental testing:

[0206] After high and low temperature cycling (-55℃~+125℃), VSWR fluctuation is ≤1.5%.

[0207] After 48 hours of salt spray, the surface roughness Ra is 0.38 μm (SEM detection shows no corrosion).

[0208] Failure analysis: Bayesian network tracing revealed a medium gradient deviation, and the injection temperature was adjusted to 182°C (the uniformity of ceramic particle distribution was improved by 30%).

[0209] 3. Mass production application:

[0210] The contact surface is plasma cleaned (oxygen content ≤ 3%), and the salt spray batch qualification rate is ≥ 99%.

[0211] Example 3: Micro high-precision connector for medical equipment

[0212] Technical solution:

[0213] 1. Requirements and structural design:

[0214] Target frequency band: 0-18GHz (MRI equipment), miniaturization (outer diameter ≤ 2mm), plug-in life ≥ 1000 times.

[0215] Structural improvements:

[0216] The inner conductor adopts non-equidistant three-level gradient (step depth 0.03-0.1mm) and matches the impedance to 50Ω±1%.

[0217] The dielectric ring is radially slotted (slot width 0.05mm, air accounts for 50%), and the dielectric constant is 2.2.

[0218] Material selection: inner conductor gold-plated beryllium copper (conductivity 95% IACS), outer conductor gold-plated stainless steel (anti-magnetic interference).

[0219] 2. Simulation and testing:

[0220] Multiphysics simulation: Ansys HFSS coupled electromagnetic-mechanical model to verify insertion and removal forces and signal integrity at 18 GHz.

[0221] Measured data: Insertion loss 0.28dB / mm@18GHz, insertion force 25N (contact resistance ≤0.8mΩ after 1000 times).

[0222] 3. Mass production process:

[0223] Five-axis precision machining (tool diameter 0.05mm), dielectric ring injection mold temperature control ±0.5℃.

[0224] Fully automated optical inspection (AOI) screens connectors with a dimensional tolerance of ±3μm.

[0225] Example 4: Military Radar Wide Temperature Range Connector

[0226] Technical solution:

[0227] 1. Requirements and structural design:

[0228] Target frequency band: 2-40GHz (phased array radar), operating temperature -65℃~+150℃, vibration resistance 30g.

[0229] Structural improvements:

[0230] The LC compensation network (capacitor 1pF, inductor 0.8nH) on the threaded part of the outer conductor compensates for 40GHz phase distortion.

[0231] The dielectric ring is axially gradient-molded (dielectric constant 2.2→3.5) to match broadband impedance.

[0232] Material selection: inner conductor gold-plated copper-tungsten alloy (thermal conductivity 180W / m·K), outer conductor silver-plated titanium alloy.

[0233] 2. Testing and optimization:

[0234] Extreme environment testing:

[0235] -65℃ low temperature startup: VSWR=1.22@40GHz, insertion loss 0.29dB / mm.

[0236] Impedance fluctuation ≤4% under 30g vibration.

[0237] Problem tracing: TDR positioning revealed oxidation on the contact surface, so the plasma cleaning time was increased to 40 seconds (oxygen content ≤ 2%).

[0238] 3. Military standard mass production:

[0239] Military-grade SPC control (CPK ≥ 1.67), 100% full inspection of vibration and high and low temperature performance.

[0240] Summary of technical points of embodiment:

[0241] The above examples demonstrate the technical implementation path and effects of this method in a variety of harsh scenarios, verifying the universality and engineering practicality of its broadband optimization capabilities.

[0242] The above description is merely illustrative of certain exemplary embodiments of the present invention. It goes without saying that those skilled in the art will be able to modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims.

Claims

1. A method for optimizing a radio frequency coaxial connector over a wide frequency band, characterized in that: The following steps are involved: Step S1. Data acquisition and processing: Based on communication requirements, obtain the demand information of the RF coaxial connector for data transmission, the corresponding connection structure information of the RF coaxial connector, and the material manufacturing information of the RF coaxial connector, and then extract and analyze the acquired information to obtain key data; Step S2. Structural Design and Production: Select key data from the RF coaxial connector material production information, then improve the selected data based on the analysis results. After the improvement is completed, select appropriate materials and produce the RF coaxial connector based on the improved structure; Step S3. Simulation and testing: The fabricated RF coaxial connector is tested to obtain RF coaxial connector data. A virtual model of the RF coaxial connector is constructed based on the data. A data transmission test model is constructed based on the demand information and connection structure information. The virtual model of the RF coaxial connector is then embedded into the data transmission test model. Parameters are input into the data transmission test model, the data transmission test model is started, and the data transmission effect of the virtual model of the RF coaxial connector is tested. After the test is completed, the test data is output. Step S4. Problem analysis and optimization: Acquire test data, analyze the test data, and determine whether the test data meets the data transmission requirements. If not, extract the test data to obtain problem data, analyze the problem data, determine the cause of the problem data, and then trace the cause of the problem data. Based on the traceability, determine the location in the RF coaxial connector virtual model that corresponds to the cause of the problem data, analyze the cause of the problem data, write a solution based on the analysis, and then modify the RF coaxial connector virtual model based on the solution. After the modification is completed, continue the test in the previous step until the test results meet the data transmission requirements; Step S5. Production testing and mass production: multiple RF coaxial connectors are produced using test data that meets data transmission requirements, and the RF coaxial connectors are tested. After the test is correct, mass production can be carried out. If the test is incorrect, repeat the above steps to continue testing.

2. The method for optimizing a radio frequency coaxial connector at a wide bandwidth according to claim 1, wherein: In step S1, the requirement information includes the target frequency band, voltage standing wave ratio, insertion loss and mechanical plug-in life; the connection structure information includes the diameter tolerance of the inner and outer conductors, the dielectric constant gradient distribution of the dielectric support ring and the contact surface roughness.

3. The method for optimizing a radio frequency coaxial connector at a wide bandwidth according to claim 1, wherein: In step S2, the structural improvement includes: (1) Design a three-level exponential gradient impedance matching structure at the contact interface between the inner and outer conductors, with the step width and depth distributed at non-uniform intervals; (2) The dielectric support ring adopts a spiral radial slot design to form an air-dielectric hybrid structure to reduce dielectric loss; (3) A distributed LC compensation network is configured at the threaded connection of the outer conductor to suppress high-frequency signal reflection.

4. The method for optimizing a radio frequency coaxial connector at a wide bandwidth according to claim 1, wherein: In step S2, material selection includes: (1) The inner conductor is made of gold-plated copper alloy and the outer conductor is made of silver-plated aluminum alloy; (2) The dielectric support ring is made of polytetrafluoroethylene-ceramic nanocomposite material, and the gradient distribution of ceramic particles is controlled by injection molding process.

5. The method for optimizing a radio frequency coaxial connector at a wide bandwidth according to claim 1, wherein: In step S3, the RF coaxial connector virtual model is constructed using three-dimensional electromagnetic simulation software, and the simulation parameters include the skin effect of the conductor surface, the dielectric loss tangent, and the contact surface impedance mutation point; the data transmission test model simulates multi-band signal transmission and mechanical vibration environment.

6. The method for optimizing a radio frequency coaxial connector at a wide bandwidth according to claim 1, wherein: In step S3, the test parameters include: (1) Frequency domain parameters: voltage standing wave ratio, insertion loss, return loss; (2) Time domain parameters: impedance continuity, signal rise time; (3) Mechanical parameters: insertion and removal force, contact resistance.

7. The method for optimizing a radio frequency coaxial connector at a wide bandwidth according to claim 1, wherein: In step S4, the problem data tracing method includes: (1) Use time domain reflectometry to locate the impedance mutation point with an accuracy of 0.1mm; (2) Dynamically assign weights to multi-source data through Bayesian networks to identify the main failure modes.

8. The method for optimizing a radio frequency coaxial connector at a wide bandwidth according to claim 1, wherein: In step S4, the problem data solution includes: (1) Adjust the concentration gradient of ceramic particles in the injection molding process according to the dielectric constant deviation of the medium; (2) To prevent oxidation of the contact surface, increase the thickness of the gold plating layer on the inner conductor and optimize the insertion gap.

9. The method for optimizing a radio frequency coaxial connector over a wide frequency band according to claim 1, wherein: In step S5, the production test includes: (1) Environmental reliability test: high and low temperature cycle, salt spray test, vibration test; (2) Electrical performance retest: Verify the batch consistency of standing wave ratio and insertion loss at 40 GHz.

10. The method for optimizing a radio frequency coaxial connector at a wide bandwidth according to claim 1, wherein: In step S5, batch production adopts an automated assembly line, including: (1) Inner conductor precision turning module; (2) Dielectric ring gradient injection mold; (3) Contact surface plasma cleaning equipment.

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