Packaging module and packaging method for lead frame products

Abstract

The invention relates to the technical field of semiconductor packaging, and discloses a packaging module and a packaging method of a lead frame product, and the packaging module of the lead frame product comprises a lead frame which comprises a frame base island and a plurality of frame pins; the electronic component module comprises a bearing frame and electronic components; the bearing frame is mounted on the frame base island through an insulating structure, and the bearing frame comprises a first base island and a second base island; the electronic component is provided with a first pin and a second pin, one of the first pin and the second pin is configured as an input end, and the other one is configured as an output end; the first pin is arranged on the first base island and is electrically connected with the first base island, and the first base island is electrically connected with a frame pin; the second pin is arranged on the second base island and is electrically connected with the second base island, and the second base island is electrically connected with the other frame pin. The method has the advantages that the use number of steel mesh jigs can be greatly reduced, the packaging universality is good, the cost is low, and packaging is simple.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a packaging module and a packaging method for lead frame products. Background Art

[0002] Leadframes are a common structure used in semiconductor packaging. For example, chips or electronic components like capacitors, inductors, and resistors often need to be integrated onto leadframes for packaging. The main current packaging method involves printing solder paste onto the leadframe's pads using a stencil, precisely placing the electronic components (such as capacitors, inductors, and resistors) using a placement machine, and then curing them through reflow soldering to create electrical connections.

[0003] Although the above packaging method has a relatively simple process, there are also some corresponding problems, such as: Components need to be mounted using SMT placement machines, and for different product designs, steel mesh fixtures for applying solder paste at specific locations need to be developed separately. The more types of products there are, the more types of steel mesh fixtures need to be developed accordingly, otherwise the quality of the solder paste cannot be guaranteed; Most electronic components have fixed sizes and must be mounted on adjacent pins of the lead frame. Therefore, the pin spacing needs to be designed to match the size of the electronic components, which also affects the pin signal arrangement and requires sacrificing design flexibility. For large-sized or special-shaped electronic components, the pins have insufficient load-bearing capacity, making stable placement difficult. The width of the pins of QFP (Quad Flat Package) products is very small, so electronic components cannot be mounted in this way. Summary of the Invention

[0004] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a packaging module and packaging method for lead frame products with good versatility, low cost and simple packaging.

[0005] The present invention solves the technical problem by adopting a technical solution of providing a packaging module for lead frame products, comprising: A lead frame, comprising a frame base island and a plurality of frame pins; An electronic component module, comprising a carrying frame and electronic components arranged on the carrying frame; The supporting frame is mounted on the frame base island via an insulating structure, and the supporting frame includes a first base island and a second base island that are spaced apart; The electronic component is provided with a first pin and a second pin, one of the first pin and the second pin is configured as an input end, and the other is configured as an output end; The first pin is arranged on the first base island and electrically connected to the first base island, and the first base island is electrically connected to one of the frame pins; the second pin is arranged on the second base island and electrically connected to the second base island, and the second base island is electrically connected to another of the frame pins.

[0006] Furthermore, the electronic components are configured as one or more of a capacitor, an inductor and a resistor; Furthermore, the capacitor, the inductor, or the resistor can be mounted on the frame base island via a supporting frame.

[0007] Furthermore, the electronic components are fixedly connected to the supporting frame through solder paste, and are electrically connected to the supporting frame through solder paste.

[0008] Furthermore, after brushing the solder paste on the first base island and the second base island on the supporting frame through a steel mesh jig, the electronic components are fixedly connected to the first base island and the second base island; By brushing solder paste on a plurality of the carrying frames using the same steel mesh jig, different types of electronic components can be mounted on the carrying frames.

[0009] Further, the insulating structure is configured as a non-conductive glue; After the electronic components are mounted on the supporting frame to form the electronic component module, the electronic component module is mounted on the frame base island using the non-conductive adhesive; The non-conductive glue isolates the signal between the carrier frame and the lead frame.

[0010] Furthermore, after the electronic component module is mounted on the frame base island, the first base island is electrically connected to one of the frame pins via a bonding wire, and the second base island is electrically connected to another of the frame pins via a bonding wire; The current may pass through the frame pin, the first base island, the electronic component and the second base island in sequence and flow out from another frame pin; or the current may pass through the frame pin, the second base island, the electronic component and the first base island in sequence and flow out from another frame pin.

[0011] Furthermore, it also includes a chip, and the chip is mounted on the frame base island through the non-conductive adhesive; The chip has a plurality of chip pins, and the plurality of chip pins are electrically connected one by one to the plurality of frame pins through bonding wires.

[0012] Furthermore, the supporting frame is cut from a supporting frame template, and the supporting frame template includes a plurality of the supporting frames, and two adjacent supporting frames are connected by connecting ribs.

[0013] Furthermore, the load-bearing frame template includes multiple rows and columns of the load-bearing frames, and the load-bearing frames in two adjacent rows are connected by the connecting ribs arranged transversely, and the load-bearing frames in two adjacent columns are connected by the connecting ribs arranged longitudinally; The first base island and the second base island are arranged in a rectangular or square shape. In the same supporting frame: the three sides of the first base island away from the second base island are provided with base island connecting bars, and the three sides of the second base island away from the first base island are provided with the base island connecting bars; the first base island and the second base island are both connected to the connecting bars through the base island connecting bars.

[0014] The present invention further provides a packaging method, which is applied to a packaging module of a lead frame product. The packaging module comprises: A lead frame, comprising a frame base island and a plurality of frame pins; An electronic component module and a chip, wherein the electronic component module comprises a carrying frame and electronic components arranged on the carrying frame; The carrier frame is mounted on the frame base island via an insulating structure, and the carrier frame includes a first base island and a second base island arranged at an interval; the electronic component is provided with a first pin and a second pin, one of the first pin and the second pin is configured as an input end, and the other is configured as an output end; the first pin is provided on the first base island and electrically connected to the first base island, and the first base island is electrically connected to one of the frame pins; the second pin is provided on the second base island and electrically connected to the second base island, and the second base island is electrically connected to another of the frame pins; The chip is mounted on the frame base island through an insulating structure, and a plurality of chip pins of the chip are electrically connected one by one with a plurality of frame pins respectively; The packaging method comprises the following steps: S1. Using a steel mesh jig, apply solder paste to the carrier frame and mount the electronic components on the carrier frame; wherein connecting ribs are retained on the first and second base islands of the carrier frame; S2. Removing the connecting ribs on the supporting frame, retaining the first base island, the second base island and the electronic components, to form the electronic component module; S3, mounting the chip and the electronic component module on the frame base island using the insulating structure, isolating the signal between the carrying frame and the lead frame; S4, performing wire bonding on the chip and the carrier frame, so that the circuits of the chip and the electronic components are connected to designated frame pins; S5, subsequent plastic sealing and / or cutting and / or packaging.

[0015] Compared with the prior art, the present invention has at least the following beneficial effects: In this invention, a carrier frame is incorporated into the packaging module. When electronic components need to be packaged on a lead frame, the electronic components are first mounted on the carrier frame to form an electronic component module. This module is then mounted to the lead frame's frame base islands via an insulating structure. Finally, the first and second base islands of the carrier frame are electrically connected to different frame pins via wirebonds. This allows the same carrier frame to be used for packaging different types of electronic components of similar size (e.g., inductors, resistors, and capacitors), ensuring that solder paste-applying stencil jigs can be used interchangeably, significantly reducing the number of stencil jigs required.

[0016] In the present invention, after the chip and electronic component module are mounted on the lead frame, the chip pins and the frame pins, the first base island and the frame pins, and the second base island and the frame pins are connected by welding wires. As long as the welding wires are feasible, the input and output pins can be selected at will.

[0017] In the present invention, electronic components are not directly mounted on the frame pins, so there is no problem of difficulty in stable mounting. Both QFN (quad flat package with no leads) and QFP (quad flat package with leads) can be used for component packaging.

[0018] In the present invention, the load-bearing frame is cut from a load-bearing frame template, wherein the load-bearing frame template includes multiple rows and columns of load-bearing frames, the load-bearing frames of two adjacent rows are connected by horizontally arranged connecting ribs, and the load-bearing frames of two adjacent columns are connected by vertically arranged connecting ribs, thereby ensuring the structural strength of the load-bearing frame template to avoid deformation, and rationally arranging multiple load-bearing frames horizontally and vertically to ensure the utilization rate of raw materials during punching. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic structural diagram of a packaging module for a lead frame product of the present invention; Figure 2 for Figure 1 Structural diagram from another perspective; Figure 3 It is a structural diagram of the bearing frame template; Figure 4 This is a schematic diagram of mounting electronic components onto a carrier frame; Figure 5 for Figure 4 Schematic diagram of electronic component module formed by cutting away connecting ribs; Figure 6 This is a schematic diagram of an electronic component module being mounted on a lead frame; Figure 7 For Figure 6 Schematic diagram of mounting the chip on the lead frame; Figure 8 This is a schematic diagram of a QFP product; Figure 9 This is a packaging flow chart of the packaging module of the lead frame product of the present invention.

[0020] In the picture: 1. Lead frame; 10. Frame base island; 11. Frame pin; 2. Electronic component module; 20. Carrier frame; 21. Electronic components; 22. Solder paste; 200. Carrier frame template; 201. First base island; 202. Second base island; 203. Connecting ribs; 204. Base island connecting ribs; 3. Insulation structure; 4. Welding wire; 5. Chip; 50. Chip pins. DETAILED DESCRIPTION

[0021] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solutions of the present invention, but the present invention is not limited to these embodiments.

[0022] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0023] In addition, in the present invention, descriptions such as "first," "second," and "one" are for descriptive purposes only and should not be understood to indicate or imply their relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0024] In the present invention, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0025] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0026] Example 1: like Figure 1-Figure 2 As shown, a packaging module of a lead frame product of this embodiment mainly includes: a lead frame 1, an electronic component module 2, an insulating structure 3, bonding wires 4 and a chip 5. Among them: The lead frame 1 includes a frame base island 10 and a plurality of frame pins 11. The plurality of frame pins 11 are arranged along the circumference of the frame base island 10. When no other components are connected, the plurality of frame pins 11 are not connected to each other, and the plurality of frame pins 11 are not connected to the frame base island 10. The electronic component module 2 includes a carrier frame 20 and electronic components 21 disposed on the carrier frame 20. In the actual packaging process, the electronic components 21 are first mounted on the carrier frame 20 and then mounted together on the lead frame 1. The supporting frame 20 is mounted on the frame base island 10 via the insulating structure 3, and the supporting frame 20 includes a first base island 201 and a second base island 202 that are spaced apart. When no other components are conducting, the first base island 201 and the second base island 202 are not conducting. The electronic component 21 is provided with a first pin and a second pin, one of the first pin and the second pin is configured as an input end, and the other of the first pin and the second pin is configured as an output end. Current flows into the input end, passes through the electronic component 21, and then flows out of the output end. The first pin is set on the first base island 201 and electrically connected to the first base island 201, and the first base island 201 is electrically connected to one of the frame pins 11; the second pin is set on the second base island 202 and electrically connected to the second base island 202, and the second base island 202 is electrically connected to another of the frame pins 11.

[0027] It needs to be explained that the electronic component 21 of this embodiment is configured as one or more of a capacitor, an inductor and a resistor, that is, it can be one of the capacitor, the inductor and the resistor, or two of the capacitor, the inductor and the resistor, or all three of the capacitor, the inductor and the resistor. Regardless of whether it is a capacitor, an inductor or a resistor, it can be mounted on the supporting frame 20 of this embodiment to form an electronic component module 2, and the capacitor or the inductor or the resistor can be mounted on the frame base island 10 through the supporting frame 20 respectively.

[0028] In actual use, the packaging module of this embodiment incorporates a carrier frame 20. When electronic components 21 need to be packaged onto the lead frame 1, the electronic components 21 are first mounted onto the carrier frame 20 to form the electronic component module 2. The electronic component module 2 is then mounted onto the frame base island 10 of the lead frame 1 via the insulating structure 3. Finally, the first base island 201 and the second base island 202 of the carrier frame 20 are electrically connected to different frame pins 11 via wire bonds 4. The same carrier frame 20 can be used to package different types of electronic components 21 of similar size (e.g., inductors, resistors, and capacitors). This ensures that the stencil jig for applying solder paste 22 can be universally used, significantly reducing the number of stencil jigs, simplifying the manufacturing process, and effectively reducing costs. This eliminates the need to develop separate stencil jigs specifically for applying solder paste 22 to specific locations for different product designs.

[0029] like Figure 4 and Figure 5 As shown, the electronic components 21 of this embodiment are fixedly connected to the carrier frame 20 via solder paste 22 and are electrically connected to the carrier frame 20 via the solder paste 22. After applying the solder paste 22 to the first and second islands 201, 202 on the carrier frame 20 using a stencil jig, the electronic components 21 are fixedly connected to the first and second islands 201, 202. In the actual packaging process, by applying solder paste 22 to multiple carrier frames 20 using the same stencil jig, different types of electronic components 21 can be mounted on the carrier frame 20.

[0030] It should be explained that in the existing lead frame 1 type products, using a steel mesh jig to print solder paste 22 on the lead frame 1 pad is a common surface mount technology (SMT) process. Generally, the steel mesh jig is hollowed out, and there are openings on the steel mesh jig that match the position and shape of the lead frame 1 pad. These openings allow the solder paste 22 to pass through and be deposited on the corresponding pad. For different electronic components 21, different steel mesh jigs are generally designed, that is, the hollowing position of the steel mesh jig is different. The steel mesh jig is used to ensure that a precise amount of solder paste 22 is accurately applied to the pad. In this embodiment, by introducing the carrier frame 20, different types of electronic components 21 of similar sizes can be adapted to the carrier frame 20 and then mounted on the lead frame 1, ensuring that the same steel mesh jig can complete the solder paste 22 brushing process.

[0031] like Figure 3As shown, in this embodiment, the supporting frame 20 is cut from a supporting frame template 200, wherein the supporting frame template 200 includes a plurality of the supporting frames 20, and adjacent two supporting frames 20 are connected by connecting ribs 203, that is, a piece of supporting frame template 200 can be cut into a plurality of supporting frames 20, so as to be mounted with a plurality of electronic components 21 accordingly, so as to achieve batch production and assembly line manufacturing.

[0032] Specifically, the load-bearing frame template 200 includes multiple rows and columns of load-bearing frames 20. In the figure, the load-bearing frame template 200 includes three rows of load-bearing frames 20, including two columns of load-bearing frames 20. Adjacent rows of load-bearing frames 20 are connected by transverse connecting ribs 203, and adjacent columns of load-bearing frames 20 are connected by longitudinal connecting ribs 203. This ensures that the individual load-bearing frames 20 will not detach from the load-bearing frame template 200 during the manufacturing process. This load-bearing frame template 200 can be manufactured using a stamping die through one or more punching operations. More specifically, the first base island 201 and the second base island 202 are arranged in a rectangular or square shape. Optimally, the first base island 201 and the second base island 202 are arranged in the shape of squares of equal size. In the same supporting frame 20: the three sides of the first base island 201 away from the second base island 202 are all provided with base island connecting bars 204, that is, on the first base island 201, except for one side adjacent to the second base island 202 without base island connecting bars 204, the other three sides have two base island connecting bars 204, ensuring that the first base island 201 will not detach from the supporting frame template 200; the three sides of the second base island 202 away from the first base island 201 are all provided with the base island connecting bars 204, that is, on the second base island 202, except for one side adjacent to the first base island 201 without base island connecting bars 204, the other three sides have two base island connecting bars 204, ensuring that the second base island 202 will not detach from the supporting frame template 200. Moreover, the first base island 201 and the second base island 202 are both connected to the connecting ribs 203 via the base island connecting ribs 204. Regardless of whether they are connected to the longitudinally arranged connecting ribs 203 or the transversely arranged connecting ribs 203, at least two base island connecting ribs 204 are ensured for connection, thereby ensuring a reliable connection with high strength, and the first base island 201 and the second base island 202 are not easily deformed.

[0033] During the actual manufacturing process, the load-bearing frame 20 of this embodiment is cut from the load-bearing frame template 200, wherein the load-bearing frame template 200 includes multiple rows and columns of load-bearing frames 20, and the load-bearing frames 20 in two adjacent rows are connected by horizontally arranged connecting ribs 203, and the load-bearing frames 20 in two adjacent columns are connected by vertically arranged connecting ribs 203, thereby ensuring the structural strength of the load-bearing frame template 200 to avoid deformation, and reasonably arranging multiple load-bearing frames 20 horizontally and vertically to ensure the utilization rate of raw materials during punching.

[0034] In this embodiment, the insulating structure 3 is configured as a non-conductive adhesive. Non-conductive adhesive is generally used in locations where physical fixation is required but electrical connection is not. Non-conductive adhesive can also provide protection against moisture, dust, and other contaminants, helping to improve the reliability and service life of each electronic component 21. After the electronic component 21 is mounted on the carrier frame 20 to form the electronic component module 2, the electronic component is mounted on the frame base island 10 using the non-conductive adhesive. The non-conductive adhesive isolates the signal between the carrier frame 20 and the lead frame 1. The provision of the non-conductive adhesive ensures both reliable fixation of the electronic component module 2 and signal isolation between the carrier frame 20 and the lead frame 1.

[0035] like Figure 7 and Figure 1 As shown, the package module of this embodiment further includes a chip 5, which is mounted on the frame base island 10 using a non-conductive adhesive. The non-conductive adhesive isolates the signal between the lead frame 1 and the chip 5. The chip 5 has a plurality of chip pins 50, and each of the plurality of chip pins 50 is electrically connected to the plurality of frame pins 11 via bonding wires 4.

[0036] Furthermore, after the electronic component module 2 is mounted on the frame base island 10, the first base island 201 is electrically connected to one of the frame pins 11 via the bonding wire 4, and the second base island 202 is electrically connected to another of the frame pins 11 via the bonding wire 4. Current can sequentially flow through the frame pin 11, the first base island 201, the electronic component 21, and the second base island 202, and out of the other frame pin 11; or current can sequentially flow through the frame pin 11, the second base island 202, the electronic component 21, and the first base island 201, and out of the other frame pin 11.

[0037] During actual use, after the chip 5 and the electronic component module 2 are mounted on the lead frame 1, the chip pin 50 and the frame pin 11, the first base island 201 and the frame pin 11, and the second base island 202 and the frame pin 11 are connected through the welding wire 4. As long as the welding wire 4 is feasible, the input and output pins can be selected at will, which can ensure high design flexibility.

[0038] like Figure 8 As shown, a QFP (quad flat package) is a common integrated circuit package type with pins extending from all four sides. It is often used for chips 5 that require a large number of pins. The pins are distributed on the four sides of the chip 5, making the spacing between the pins very close. If the electronic component 21 is directly mounted on the pins, it will often be difficult to mount because the space is too narrow.

[0039] In this embodiment, the electronic component 21 is not directly mounted on the frame pin 11, so there is no problem of difficulty in stable mounting. Both QFN (quad flat package with no leads) and QFP (quad flat package with leads) can be used for component packaging.

[0040] Example 2: like Figure 9 , and combined with Figure 1-Figure 7 As shown, a packaging method of this embodiment is applied to the packaging module of the lead frame type 1 product in the first embodiment, so the packaging module includes: a lead frame 1, an electronic component module 2 and a chip 5, wherein the lead frame 1 includes a frame base island 10 and a plurality of frame pins 11; the electronic component module 2 includes a carrier frame 20 and an electronic component 21 arranged on the carrier frame 20; the carrier frame 20 is mounted on the frame base island 10 through an insulating structure 3 (i.e., non-conductive glue), and the carrier frame 20 includes a first base island 201 and a second base island 202 arranged at intervals; the electronic component 21 is provided with a first base island 201 and a second base island 202. A pin and a second pin, one of the first pin and the second pin is configured as an input end, and the other is configured as an output end; the first pin is set on the first base island 201 and is electrically connected to the first base island 201, and the first base island 201 is electrically connected to one of the frame pins 11; the second pin is set on the second base island 202 and is electrically connected to the second base island 202, and the second base island 202 is electrically connected to another of the frame pins 11; the chip 5 is mounted on the frame base island 10 through the insulating structure 3, and the multiple chip pins 50 of the chip 5 are respectively electrically connected to the multiple frame pins 11 one by one.

[0041] The packaging method comprises the following steps: S1, use a steel mesh fixture to brush solder paste 22 on the carrier frame 20, and mount the electronic components 21 on the carrier frame 20; wherein, the first base island 201 and the second base island 202 of the carrier frame 20 retain connecting ribs, such as Figure 4 As shown; S2, the connecting ribs on the supporting frame 20 are removed, and the first base island 201, the second base island 202 and the electronic components 21 are retained to form the electronic component module 2, such as Figure 5 As shown; S3, the chip 5 and the electronic component module 2 are mounted on the frame base island 10 using the insulating structure 3, and the signal between the carrier frame 20 and the lead frame 1 is isolated, as shown in FIG. Figure 6 and Figure 7 As shown; S4, perform wire bonding 4 on the chip 5 and the carrier frame 20, so that the circuits of the chip 5 and the electronic components 21 are connected to the designated frame pins 11, as shown in FIG. Figure 1 and Figure 2 As shown; S5, subsequent plastic sealing and / or cutting and / or packaging to form a finished product.

[0042] In this solution, different types of electronic components 21 of similar sizes can all be applied to the same carrier frame 20 in this solution, and the steel mesh fixture for brushing solder paste 22 can also be universal, which can greatly reduce the number of steel mesh fixtures; the electronic components 21 and the carrier frame 20 are mounted on the packaging frame, and the pin signals are connected through the welding wire 4. As long as the welding wire 4 is feasible, the input and output pins can be selected at will; the electronic components 21 are not mounted on the pins, and there is no problem of difficult or stable mounting; it can be packaged as components in both QFN and QFP.

Claims

1. A packaging module for a lead frame product, characterized in that: include: A lead frame, comprising a frame base island and a plurality of frame pins; An electronic component module, comprising a carrying frame and electronic components arranged on the carrying frame; The supporting frame is mounted on the frame base island via an insulating structure, and the supporting frame includes a first base island and a second base island that are spaced apart; The electronic component is provided with a first pin and a second pin, one of the first pin and the second pin is configured as an input end, and the other is configured as an output end; The first pin is arranged on the first base island and electrically connected to the first base island, and the first base island is electrically connected to one of the frame pins; the second pin is arranged on the second base island and electrically connected to the second base island, and the second base island is electrically connected to another of the frame pins.

2. The packaging module of the lead frame product according to claim 1, characterized in that: The electronic component is configured as one or more of a capacitor, an inductor and a resistor; Furthermore, the capacitor, the inductor, or the resistor can be mounted on the frame base island via a supporting frame.

3. The packaging module of the lead frame product according to claim 1 or 2, characterized in that: The electronic components are fixedly connected to the supporting frame through solder paste, and are electrically connected to the supporting frame through solder paste.

4. The packaging module of the lead frame product according to claim 3, characterized in that: After brushing the solder paste on the first base island and the second base island on the supporting frame using a steel mesh jig, the electronic components are fixedly connected to the first base island and the second base island; By brushing solder paste on a plurality of the carrying frames using the same steel mesh jig, different types of electronic components can be mounted on the carrying frames.

5. The packaging module of the lead frame product according to claim 1, characterized in that: The insulating structure is configured as a non-conductive adhesive; After the electronic components are mounted on the supporting frame to form the electronic component module, the electronic component module is mounted on the frame base island using the non-conductive adhesive; The non-conductive glue isolates the signal between the carrier frame and the lead frame.

6. The packaging module of the lead frame product according to claim 5, characterized in that: After the electronic component module is mounted on the frame base island, the first base island is electrically connected to one of the frame pins via a welding wire, and the second base island is electrically connected to another of the frame pins via a welding wire; The current may pass through the frame pin, the first base island, the electronic component and the second base island in sequence and flow out from another frame pin; or the current may pass through the frame pin, the second base island, the electronic component and the first base island in sequence and flow out from another frame pin.

7. The packaging module of the lead frame product according to claim 5, characterized in that: It also includes a chip, which is mounted on the frame base island through the non-conductive adhesive; The chip has a plurality of chip pins, and the plurality of chip pins are electrically connected one by one to the plurality of frame pins through bonding wires.

8. The packaging module of the lead frame product according to claim 1, characterized in that: The load-bearing frame is cut from a load-bearing frame template. The load-bearing frame template includes a plurality of load-bearing frames, and two adjacent load-bearing frames are connected by connecting ribs.

9. The packaging module of the lead frame product according to claim 8, characterized in that: The load-bearing frame template includes multiple rows and columns of the load-bearing frames, and the adjacent rows of the load-bearing frames are connected by the horizontally arranged connecting ribs, and the adjacent columns of the load-bearing frames are connected by the longitudinally arranged connecting ribs; The first base island and the second base island are arranged in a rectangular or square shape. In the same supporting frame: the three sides of the first base island away from the second base island are provided with base island connecting bars, and the three sides of the second base island away from the first base island are provided with the base island connecting bars; the first base island and the second base island are both connected to the connecting bars through the base island connecting bars.

10. A packaging method, applied to a packaging module of a lead frame product, characterized in that: The packaging module includes: A lead frame, comprising a frame base island and a plurality of frame pins; An electronic component module and a chip, wherein the electronic component module comprises a carrying frame and electronic components arranged on the carrying frame; The carrier frame is mounted on the frame base island via an insulating structure, and the carrier frame includes a first base island and a second base island arranged at an interval; the electronic component is provided with a first pin and a second pin, one of the first pin and the second pin is configured as an input end, and the other is configured as an output end; the first pin is provided on the first base island and electrically connected to the first base island, and the first base island is electrically connected to one of the frame pins; the second pin is provided on the second base island and electrically connected to the second base island, and the second base island is electrically connected to another of the frame pins; The chip is mounted on the frame base island through an insulating structure, and a plurality of chip pins of the chip are electrically connected one by one with a plurality of frame pins respectively; The packaging method comprises the following steps: S1. Using a steel mesh jig, apply solder paste to the carrier frame and mount the electronic components on the carrier frame; wherein connecting ribs are retained on the first and second base islands of the carrier frame; S2. Removing the connecting ribs on the supporting frame, retaining the first base island, the second base island and the electronic components, to form the electronic component module; S3, mounting the chip and the electronic component module on the frame base island using the insulating structure, isolating the signal between the carrying frame and the lead frame; S4, performing wire bonding on the chip and the carrier frame, so that the circuits of the chip and the electronic components are connected to designated frame pins; S5, subsequent plastic sealing and / or cutting and / or packaging.

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