Display panel and preparation method thereof

Abstract

The invention discloses a display panel and a display panel preparation method. The display panel comprises a substrate; the conducting layer is located in the non-display area and comprises a third conducting layer, a first conducting layer and a second conducting layer which are arranged in a stacked mode in the direction away from the substrate; the first conductive layer comprises a first surface and a second surface which are opposite and a first side surface connected with the first surface and the second surface, the second conductive layer comprises a second side surface connected with one end, facing the second conductive layer, of the first side surface, and the third conductive layer and a third side surface connected with one end, facing the third conductive layer, of the first side surface. During preparation, the conductive layer can be protected by using the etching protection layer, so that the conductive layer cannot be etched together with subsequent film layer etching, the reliability and the signal transmission effect of the first conductive layer are ensured, the problem of reliability bottom dark spot failure is avoided, and the reliability of the first conductive layer is improved. And the packaging effect, the reliability and the use performance of the display panel are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic products, and in particular relates to a display panel and a method for manufacturing the display panel. Background Art

[0002] With the advancement of technology, the preparation methods of digital display panels such as smartphones and tablets have been widely used. Among them, the display screen is an indispensable interpersonal communication interface in these display panel preparation methods. For example, the preparation method of OLED (Organic Light Emitting Diode) display panels has the advantages of self-luminescence, energy saving and consumption reduction, bendability, and good flexibility. In addition, the preparation method of display panels that realize display does not require a backlight source and has the characteristics of fast response speed and good display effect. It has attracted the attention of users and is widely used in terminal products such as smartphones and tablets.

[0003] However, due to the structural limitations of existing display panels, the reliability of the display panels cannot meet the requirements.

[0004] Therefore, a new display panel and a method for manufacturing the display panel are urgently needed. Summary of the Invention

[0005] An embodiment of the present invention provides a display panel and a method for preparing a display panel. During preparation, an etching protection layer can be used to protect the conductive layer so that the conductive layer will not be etched together with the etching of subsequent film layers, ensuring that the second side of the second conductive layer is connected to the first side facing one end of the second conductive layer, and the third side of the third conductive layer is connected to the first side facing one end of the third conductive layer, that is, at least the first conductive layer can be prevented from side etching, thereby ensuring the reliability of the first conductive layer and the signal transmission effect, avoiding the problem of reliability failure due to dark spots at the bottom, and improving the packaging effect, reliability and performance of the display panel.

[0006] In a first aspect, an embodiment of the present invention provides a display panel, comprising a display area and a non-display area at least partially arranged around the display area, the display panel comprising: a substrate; a conductive layer located in the non-display area, wherein the conductive layer comprises a third conductive layer, a first conductive layer, and a second conductive layer stacked in a direction away from the substrate; the first conductive layer comprises a first surface, a second surface, and a first side surface connected to the first surface and the second surface relative to each other, the first surface being arranged close to the third conductive layer relative to the second surface, the second conductive layer comprising a second side surface connected to the first side surface toward one end of the second conductive layer, and a third side surface of the third conductive layer connected to the first side surface toward one end of the third conductive layer.

[0007] In a second aspect, an embodiment of the present invention provides a method for preparing a display panel, wherein the display panel has a display area and a non-display area adjacent to the display area, the method for preparing the display panel comprising the following steps: providing a substrate; forming a conductive layer on one side of the substrate in the non-display area, wherein the conductive layer comprises a third conductive layer, a first conductive layer, and a second conductive layer stacked in a direction away from the substrate, the etching rate of the material of the first conductive layer being greater than the etching rate of the material of the second conductive layer and the third conductive layer, the first conductive layer comprising a first surface, a second surface, and a first side surface connected to the first surface and the second surface relative to each other, the first surface being arranged close to the third conductive layer relative to the second surface, the second conductive layer comprising a second side surface connected to the first side surface toward one end of the second conductive layer, and a third side surface of the third conductive layer connected to the first side surface toward one end of the third conductive layer; forming an etching protection layer on at least the first side surface; forming a material layer to be etched in the display area, and etching the material layer to be etched to form a functional layer; and removing the etching protection layer.

[0008] Compared with the related art, the display panel provided by the embodiment of the present invention includes a substrate and a conductive layer. The conductive layer is located in the non-display area and can be used for the transmission of display signals, such as power supply voltage and other signals. In the direction away from the substrate, the conductive layer includes a third conductive layer, a first conductive layer and a second conductive layer arranged in a stacked manner. During preparation, the conductive layer can be protected by an etching protection layer so that the conductive layer will not be etched together due to the etching of subsequent film layers, ensuring that the second side of the second conductive layer and the first side are connected toward one end of the second conductive layer, and the third side of the third conductive layer and the first side are connected toward one end of the third conductive layer, that is, at least the first conductive layer can be prevented from side etching, thereby ensuring the reliability of the first conductive layer and the signal transmission effect, avoiding the problem of reliability bottom dark spot failure, and improving the packaging effect, reliability and performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0010] Figure 1 is a schematic structural diagram of a display panel provided according to an embodiment of the present invention;

[0011] Figure 2 An embodiment of the present invention provides Figure 1 Partial schematic diagram of point B in the middle;

[0012] Figure 3 Another embodiment of the present invention provides Figure 2 Schematic cross-section at CC;

[0013] Figure 4 An embodiment of the present invention provides Figure 1 Schematic cross-section diagram at EE;

[0014] Figure 5 is a flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0015] Figures 6 to 11 It is a schematic diagram of the structure obtained during the preparation process of the display panel preparation method provided by the present invention. DETAILED DESCRIPTION

[0016] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the detailed description below, many specific details are proposed in order to provide a comprehensive understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.

[0017] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0018] In order to better understand the present invention, Figures 1 to 11 A display panel and a method for manufacturing the display panel according to embodiments of the present invention are described in detail.

[0019] Please also refer to Figures 1 to 3 , Figure 1 is a schematic structural diagram of a display panel provided according to an embodiment of the present invention; Figure 2 An embodiment of the present invention provides Figure 1 Partial schematic diagram of point B in the middle; Figure 3 Another embodiment of the present invention provides Figure 2 Schematic diagram of the cross section at CC.

[0020] An embodiment of the present invention provides a display panel, including a display area AA and a non-display area NA at least partially surrounding the display area AA, the display panel including: a substrate 1; a conductive layer 2, located in the non-display area NA, along the direction away from the substrate 1, the conductive layer 2 including a third conductive layer 23, a first conductive layer 21, and a second conductive layer 22 arranged in a stacked manner; the first conductive layer 21 includes a first surface F1 and a second surface F2 relative to each other, and a first side surface C1 connected to the first surface F1 and the second surface F2, the first surface F1 is arranged close to the third conductive layer 23 relative to the second surface F2, the second conductive layer 22 includes a second side surface C2 connected to the first side surface C1 toward one end of the second conductive layer 22, and the third conductive layer 23 is connected to the first side surface C1 toward one end of the third conductive layer 23.

[0021] The display panel provided by the embodiment of the present invention includes a substrate 1 and a conductive layer 2. The conductive layer 2 is located in the non-display area NA and can be used for transmitting display signals, such as power supply voltage and other signals. In the direction away from the substrate 1, the conductive layer 2 includes a third conductive layer 23, a first conductive layer 21 and a second conductive layer 22 arranged in a stacked manner. During preparation, the conductive layer 2 can be protected by an etching protection layer 4 so that the conductive layer 2 will not be etched together due to the etching of subsequent film layers, ensuring that the second side surface C2 of the second conductive layer 22 and the first side surface C1 are connected toward one end of the second conductive layer 22, and the third side surface C3 of the third conductive layer 23 and the first side surface C1 are connected toward one end of the third conductive layer 23, that is, at least the first conductive layer 21 can be prevented from side etching, thereby ensuring the reliability of the first conductive layer 21 and the signal transmission effect, avoiding the problem of reliability bottom dark spot failure, and improving the packaging effect, reliability and performance of the display panel.

[0022] It should be noted that the etching protection layer 4 can be removed after the subsequent film preparation is completed to avoid affecting the film structure design of the display panel.

[0023] In the prior art, after preparing the conductive layer 2, it is usually necessary to prepare an organic film layer or other film layers that require photolithography or wet etching processes to form the desired pattern, such as a planarization layer 5, an anode and other film layers. During the preparation of the above-mentioned film layers, reagents such as the developer or etching solution used to achieve patterning will etch part of the film layer of the conductive layer 2, resulting in the second side C2, the first side C1, and the third side C3 being unable to be continuously connected, that is, side etching is formed. When the amount of side etching is large, organic matter remains at the side seam, forming a channel for water vapor to enter, resulting in packaging failure and affecting the reliability of the display panel.

[0024] In order to avoid the above problems, the embodiment of the present invention can additionally form an etching protection layer 4 to protect the conductive layer 2 after the conductive layer 2 is prepared, so that the conductive layer 2 will not be etched together with the etching of the subsequent film layer, and the etching protection layer 4 can be removed later without affecting the film layer structure of the display panel. The etching protection layer 4 protects the conductive layer 2 to prevent the conductive layer 2 from being etched, so that the second side surface C2 of the second conductive layer 22 of the conductive layer 2 finally formed is connected to the first side surface C1 toward one end of the second conductive layer 22, and the third side surface C3 of the third conductive layer 23 is connected to the first side surface C1 toward one end of the third conductive layer 23, thereby ensuring the reliability of the first conductive layer 21 and the signal transmission effect, avoiding the problem of reliability bottom dark spot failure, and improving the packaging effect, reliability and performance of the display panel.

[0025] It should be noted that, in this embodiment, the first conductive layer 21, the second conductive layer 22, and the third conductive layer 23 can all be made of metal materials. Taking into account factors such as material properties and preparation process, the etching rate of the material of the first conductive layer 21 can be greater than the etching rate of the material of the second conductive layer 22 and the third conductive layer 23. For example, the first conductive layer 21 includes an aluminum metal layer, the second conductive layer 22 includes a first titanium metal layer, and the third conductive layer 23 includes a second titanium metal layer.

[0026] Since titanium metal has better etching resistance than aluminum metal, if there is no etching protection layer 4, the developer or etching solution will only etch the exposed side of the aluminum metal layer, while the first titanium metal layer and the second titanium metal layer will not be etched, that is, side etching will occur at the first side surface C1. By setting the etching protection layer 4, the silver ions Ag in the aluminum metal and the reagent can be reduced. + Silver particles produced by the reaction.

[0027] See also Figure 4 , Figure 4 An embodiment of the present invention provides Figure 1 Schematic cross-sectional view at EE in the figure; Optionally, the substrate 1 may include a substrate and an array layer, and the array layer may include a driving circuit. For example, the array layer may include a first metal layer M1, a second metal layer M2, a third metal layer M3 and a fourth metal layer M4 arranged on one side of the substrate and stacked, and the conductive layer 2 may be arranged on the same layer as the fourth metal layer M4. An insulating layer is provided between adjacent conductive film layers. Exemplarily, the pixel driving circuit provided in the array layer includes a transistor and a storage capacitor C. The transistor includes an active layer, a gate G, a source S and a drain D. The material of the source S and the gate G may include a combination of one or more of molybdenum, titanium, aluminum, copper, etc. The gate G of the transistor is generally used to receive a control signal so that the transistor is turned on or off under the control of the control signal. One of the source S and the drain D of the thin film transistor is connected to the light-emitting unit 6 to control the normal light emission of the light-emitting unit 6.

[0028] The storage capacitor C includes a first plate C1 and a second plate C2. As an example, the gate G and the first plate C1 may be located in the first metal layer M1, the second plate C2 may be located in the second metal layer M2, and the source S and drain D may be located in the third metal layer M3.

[0029] The substrate can be a hard substrate, such as a glass substrate, or a flexible substrate made of polyimide, polystyrene, polyethylene terephthalate, polyparaxylene, polyethersulfone, or polyethylene naphthalate. The substrate is mainly used to support the devices mounted thereon.

[0030] Optionally, the display panel also includes a planarization layer 5 and a pixel definition layer 7 stacked in sequence on the side of the fourth metal layer M4 facing away from the substrate. The pixel definition layer 7 includes a pixel opening, and a light-emitting unit 6 is provided in the pixel opening. In the direction away from the substrate 1, the light-emitting unit 6 includes an anode layer 61, a light-emitting layer 62 and a cathode layer 63 stacked in a stacked manner.

[0031] Optionally, the light-emitting layer 62 includes one or more of an electron injection layer, an electron transport layer, a light-emitting material layer, a hole blocking layer, an electron blocking layer, a hole transport layer, and a hole injection layer. The specific type of light-emitting layer 62 can be selected and is not particularly limited. The electron injection layer, electron transport layer, and hole blocking layer can be disposed between the second electrode layer and the light-emitting material layer. The electron blocking layer, hole transport layer, and hole injection layer can be disposed between the first electrode layer and the light-emitting material layer.

[0032] The material of the anode layer 61 is generally a material with a high work function to improve hole injection efficiency, and can be gold (Au), platinum (Pt), titanium (Ti), silver (Ag), indium tin oxide (ITO), zinc tin oxide (IZO), or a transparent conductive polymer (such as polyaniline). For example, the anode layer 61 can be made of an ITO-Ag-ITO composite material, without particular limitation.

[0033] The material of the cathode layer 63 can be one of the metal materials such as silver (Ag), aluminum (Al), lithium (Li), magnesium (Mg), ytterbium (Yb), calcium (Ca) or indium (In), or it can be an alloy of the aforementioned metal materials, such as magnesium-silver alloy (Mg / Ag) and lithium-aluminum alloy (Li / Al). This embodiment does not impose any restrictions on this.

[0034] In some optional embodiments, along a direction perpendicular to the plane of the substrate 1, the orthographic projection of the second conductive layer 22 on the substrate 1 is located within the orthographic projection of the first conductive layer 21 on the substrate 1, and the orthographic projection of the first conductive layer 21 on the substrate 1 is located within the orthographic projection of the third conductive layer 23 on the substrate 1.

[0035] It will be appreciated that in this embodiment, the size of the first conductive layer 21 needs to be greater than or equal to the size of the second conductive layer 22 so that the first conductive layer 21 can cover the second conductive layer 22. Similarly, the size of the third conductive layer 23 needs to be greater than or equal to the size of the first conductive layer 21. That is, the cross-sectional areas of the third conductive layer 23, the first conductive layer 21, and the second conductive layer 22, parallel to the plane of the substrate 1, gradually decrease in a direction away from the substrate 1. Optionally, the cross-sectional shape of the conductive layer 2, perpendicular to the plane of the substrate 1, is trapezoidal, with the second side surface C2, the first side surface C1, and the third side surface C3 connected in sequence to form the waist of the trapezoid.

[0036] In some optional embodiments, the orthographic projection area of ​​the first surface F1 on the substrate 1 is larger than the orthographic projection area of ​​the second surface F2 on the substrate 1 .

[0037] It can be understood that in this embodiment, the first conductive layer 21 has a structure that is small at the top and large at the bottom, that is, along the direction perpendicular to the plane where the substrate 1 is located, the cross-section of the first conductive layer 21 can be trapezoidal, the first surface F1 corresponds to the bottom side of the trapezoid, and the second surface F2 corresponds to the top side of the trapezoid, and the length of the bottom side is greater than the length of the top side, which facilitates the subsequent preparation of the first conductive layer 21.

[0038] In some optional embodiments, the conductive layer 2 includes a power supply voltage signal line extending along a first direction Y; in the non-display area NA, the display panel further includes a blocking structure 3 extending along a second direction X, and the blocking structure 3 is located on the side of the conductive layer 2 facing away from the substrate 1, and the first direction Y and the second direction X intersect.

[0039] It should be noted that in this embodiment, the power supply voltage signal line can be either PVDD (a high-level voltage signal line) or PVEE (a low-level voltage signal line), depending on the specific wiring configuration of the display panel. Furthermore, a barrier structure 3 is provided in the non-display area NA to prevent external water and oxygen from entering the display area AA of the display panel, thereby improving the reliability of the display panel.

[0040] Optionally, the power supply voltage signal line and the barrier structure 3 are both located in the lower frame area of ​​the display panel, that is, in the non-display area NA below the display panel.

[0041] In this embodiment, the barrier structure 3 is located on the side of the conductive layer 2 facing away from the substrate 1, which means that the barrier structure 3 can partially cover the conductive layer 2, that is, the overlapping part of the barrier structure 3 and the conductive layer 2. Since the first direction Y and the second direction X intersect, there is another part of the barrier structure 3 and the conductive layer 2 that does not overlap, thereby achieving water and oxygen barrier for other areas of the display panel.

[0042] See also Figure 5An embodiment of the present invention further provides a method for manufacturing a display panel, wherein the display panel has a display area AA and a non-display area NA adjacent to the display area AA. The method for manufacturing the display panel comprises the following steps:

[0043] S110: Provide a substrate 1, such as Figure 6 As shown;

[0044] S120: forming a conductive layer 2 on one side of the substrate 1 in the non-display area NA, wherein the conductive layer 2 includes a third conductive layer 23, a first conductive layer 21, and a second conductive layer 22 which are stacked in a direction away from the substrate 1, wherein the etching rate of the material of the first conductive layer 21 is greater than the etching rate of the material of the second conductive layer 22 and the third conductive layer 23, the first conductive layer 21 includes a first surface F1 and a second surface F2 which are opposite to each other, and a first side surface C1 which is connected to the first surface F1 and the second surface F2, the first surface F1 is arranged close to the third conductive layer 23 relative to the second surface F2, the second conductive layer 22 includes a second side surface C2 which is connected to the first side surface C1 toward one end of the second conductive layer 22, and the third conductive layer 23 includes a third side surface C3 which is connected to the first side surface C1 toward one end of the third conductive layer 23, as shown in FIG. Figure 2 and Figure 3 As shown;

[0045] S130: forming an etching protection layer 4 at least on the first side surface C1, such as Figure 7 and Figure 8 As shown;

[0046] S140: forming a material layer to be etched in the display area AA, and etching the material layer to be etched to form a functional layer P, such as Figure 9 As shown;

[0047] S150: removing the etching protection layer 4.

[0048] In the display panel preparation method provided by the embodiment of the present invention, after the conductive layer 2 is formed on one side of the substrate 1 in the non-display area NA, an etching protection layer 4 is formed on at least the first side C1 to protect the first side C1 with the etching protection layer 4 to prevent the developer or etching solution used in the subsequent etching of the material layer to be etched to form the functional layer P from etching the first side C1 exposed by the first conductive layer 21, thereby avoiding side etching problems. At the same time, after completing the preparation of the functional layer P, the embodiment of the present invention also removes the etching protection layer 4 to avoid affecting the film structure of the display panel. Therefore, the embodiment of the present invention is achieved by During the preparation, an etching protection layer 4 is formed to protect the conductive layer 2 using the etching protection layer 4, so that the conductive layer 2 will not be etched together with the etching of the subsequent film layer, ensuring that the second side surface C2 of the second conductive layer 22 is connected to the first side surface C1 toward one end of the second conductive layer 22, and the third side surface C3 of the third conductive layer 23 is connected to the first side surface C1 toward one end of the third conductive layer 23, that is, at least the first conductive layer 21 can be prevented from side etching, thereby ensuring the reliability of the first conductive layer 21 and the signal transmission effect, avoiding the problem of reliability bottom dark spot failure, and improving the packaging effect, reliability and performance of the display panel.

[0049] In step S110, substrate 1 includes a backing and an array layer. The backing can be formed through processes such as coating, curing, and film formation. The backing can be a rigid substrate, such as a glass substrate, or a flexible substrate made of polyimide, polystyrene, polyethylene terephthalate, polyparaxylene, polyethersulfone, or polyethylene naphthalate. The backing is primarily used to support the devices disposed thereon.

[0050] In step S120, the first conductive layer 21, the second conductive layer 22, and the third conductive layer 23 can all be made of metal materials. Taking into account factors such as material properties and preparation process, the etching rate of the material of the first conductive layer 21 can be greater than the etching rate of the material of the second conductive layer 22 and the third conductive layer 23. For example, the first conductive layer 21 includes an aluminum metal layer, the second conductive layer 22 includes a first titanium metal layer, and the third conductive layer 23 includes a second titanium metal layer.

[0051] Since titanium metal has better etching resistance than aluminum metal, if there is no etching protection layer 4, the developer or etching solution will only etch the exposed side of the aluminum metal layer, while the first titanium metal layer and the second titanium metal layer will not be etched, that is, side etching will occur at the first side surface C1. By setting the etching protection layer 4, the silver ions Ag in the aluminum metal and the reagent can be reduced. + Silver particles produced by the reaction.

[0052] In step S130, the etching protection layer 4 is formed at least on the first side surface C1, and can cover the entire first side surface C1, and can also cover the second side surface C2 and the third side surface C3 at the same time to ensure that the conductive layer 2 material at the second side surface C2 and the third side surface C3 will not be etched. The etching protection layer 4 can be prepared using organic materials to facilitate subsequent removal.

[0053] Optionally, the material of the etching protection layer 4 can be hexamethyldisiloxane, epoxy resin or polyimide (PI), etc., and can be formed by coating or other methods.

[0054] In step S140, the functional layer P includes at least one of the anode layer 61 and the pixel definition layer 7, that is, the material layer to be etched may include multiple layers, and the materials of each layer may be the same or different. For example, the material layer to be etched may include film layers such as the pixel definition material layer and the anode material layer. The pixel definition material layer is etched to form the pixel definition layer 7, and the anode material layer is etched to form the anode layer 61. During the etching process, the etching protection layer 4 can protect the first side surface C1 to prevent the etching solvent from contacting the first side surface C1, thereby preventing the first side surface C1 from being etched.

[0055] In step S150 , the etching protection layer 4 may be removed by an etching process to form an organic clearance area to prevent water and oxygen corrosion.

[0056] See also Figure 10 , Figure 10 It is a schematic diagram of the structure obtained during the preparation process of the display panel preparation method provided by the present invention. In some optional embodiments, the step of removing the etching protection layer 4 includes: forming a first opening K1 in the display area AA through an etching process, and removing the etching protection layer 4 at the same time.

[0057] It should be noted that the first opening K1 can be used to correspond to the optical elements such as cameras, fingerprint recognition elements, infrared elements, etc. that have requirements for light input. When forming the first opening K1, it is necessary to etch and remove the film layers in the corresponding area through a mask, such as the planarization layer 5, the pixel definition layer 7 and other film layers. The mask pattern can be adjusted to remove the etching protection layer 4 located in the non-display area NA at the same time as the first opening K1 is formed. The reason for removing the etching protection layer 4 at the same time as the first opening K1 is, on the one hand, to simplify the process flow and reduce production costs. On the other hand, after the first opening K1 is formed, the display panel has no other preparation process flow, which will cause etching to the conductive layer 2, that is, the etching protection layer 4 has completed its function and is removed at the same time as the first opening K1 is formed.

[0058] In some optional embodiments, the step of forming the etching protection layer 4 on at least the first side C1 includes: forming an organic material layer on the side of the conductive layer 2 facing away from the substrate 1 and on the side of the substrate 1 not covering the conductive layer 2; patterning the organic material layer so that part of the organic material layer forms the etching protection layer 4, and part of the organic material layer forms the barrier structure 3, and the extension direction of the barrier structure 3 intersects with the extension direction of the conductive layer 2.

[0059] It can be understood that in this embodiment, the organic material layer can be formed as a whole layer, part of the organic material layer can form an etching protection layer 4 corresponding to the first side C1 position of the conductive layer 2, and part of the organic material layer forms a barrier structure 3, that is, one layer of the barrier structure 3 is an organic material layer.

[0060] Optionally, the conductive layer 2 includes a power supply voltage signal line extending along the first direction Y. In the non-display area NA, the blocking structure 3 extends along the second direction X. The blocking structure 3 is located on the side of the conductive layer 2 away from the substrate 1. The first direction Y and the second direction X intersect.

[0061] It should be noted that in this embodiment, the power supply voltage signal line can be either PVDD (a high-level voltage signal line) or PVEE (a low-level voltage signal line), depending on the specific wiring configuration of the display panel. Furthermore, a barrier structure 3 is provided in the non-display area NA to prevent external water and oxygen from entering the display area AA of the display panel, thereby improving the reliability of the display panel.

[0062] In some optional embodiments, the thickness of the organic material layer in the barrier structure 3 is greater than or equal to the thickness of the etching protection layer 4 .

[0063] It should be noted that, considering that the etching protection layer 4 needs to be removed later, and the organic material layer in the barrier structure 3 needs to be retained to block water and oxygen, the embodiment of the present invention can reduce the thickness of the etching protection layer 4 to reduce the difficulty of subsequent removal. Specifically, the thickness of the etching protection layer 4 formed can be adjusted and controlled through a half-etching process.

[0064] In some optional embodiments, the step of forming the etching protection layer 4 on at least the first side surface C1 includes: forming a planarizing material layer on the side of the substrate 1 in the display area AA and on the side of the conductive layer 2 in the non-display area NA facing away from the substrate 1; and patterning the planarizing material layer to form a planarizing layer 5 in the display area AA and an etching protection layer 4 in the non-display area NA.

[0065] It is understandable that the etching protection layer 4 and the planarization layer 5 can be formed together through the same process to simplify the process flow, reduce costs, and do not need to add additional processes. The etching protection layer 4 and the planarization layer 5 can be made of the same material.

[0066] Optionally, substrate 1 may include a substrate and an array layer, and the array layer may include a driving circuit. For example, the array layer may include a first metal layer M1, a second metal layer M2, a third metal layer M3, and a fourth metal layer M4, which are stacked and disposed on one side of the substrate. The conductive layer 2 may be disposed on the same layer as the fourth metal layer M4. In the display area AA, the planarization layer 5 is formed on the side of the fourth metal layer M4 facing away from the substrate.

[0067] See also Figure 11 , Figure 11 It is a schematic diagram of the structure obtained during the preparation process of the display panel preparation method provided by the present invention. In some optional embodiments, along the direction perpendicular to the plane where the substrate 1 is located, the orthographic projection of the etching protection layer 4 on the substrate 1 covers the orthographic projection of the conductive layer 2 on the substrate 1.

[0068] It can be understood that, in this embodiment, the etching protection layer 4 can not only cover the first side surface C1, but also cover and protect other exposed surfaces of the conductive layer 2, that is, the etching protection layer 4 can cover the first side surface C1, the second side surface C2, the third side surface C3 and the side surface of the second conductive layer 22 facing away from the substrate 1, thereby achieving full coverage and preventing the conductive layer 2 from being etched.

[0069] Alternatively, in some other optional embodiments, the step of forming the etching protection layer 4 on at least the first side C1 includes: forming the etching protection layer 4 on the first side C1, the second side C2 and the third side C3, but not forming the etching protection layer 4 on the surface of the second conductive layer 22 facing away from the substrate 1, so as to facilitate the removal of the etching protection layer 4.

[0070] Optionally, in the step of forming the etching protection layer 4 on the first side surface C1 , the second side surface C2 and the third side surface C3 , the etching protection layer 4 extends from the second side surface C2 to the surface of the second conductive layer 22 facing away from the substrate 1 .

[0071] In this embodiment, the etching protection layer 4 can only cover a portion of the surface of the second conductive layer 22 facing away from the substrate 1, that is, the edge portion of the surface of the second conductive layer 22 facing away from the substrate 1 close to the second side surface C2 can be covered by the etching protection layer 4. While ensuring the protection effect, it also avoids the formation of the etching protection layer 4 on the entire layer, which facilitates the subsequent removal of the etching protection layer 4.

[0072] The display panel provided in the embodiment of the present invention may be an organic light-emitting diode (OLED) display panel, a quantum dot light-emitting diode (QLED) or a micro flat panel display panel (Micro-OLED or Micro-LED), etc.

[0073] The display panel provided in the embodiment of the present invention can be applied to mobile phones, or any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop monitors, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc. The embodiment of the present invention does not specifically limit this.

[0074] The above is only a specific embodiment of the present invention. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited to this. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be covered within the protection scope of the present invention.

[0075] It should also be noted that the exemplary embodiments described herein describe methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the steps described above. In other words, the steps may be performed in the order described in the embodiments, or in a different order, or several steps may be performed simultaneously.

Claims

1. A display panel, characterized in that: The display panel comprises a display area and a non-display area at least partially surrounding the display area, the display panel comprising: substrate; a conductive layer located in the non-display area and away from the substrate, the conductive layer comprising a third conductive layer, a first conductive layer, and a second conductive layer stacked; The first conductive layer includes a first surface, a second surface and a first side surface connected to the first surface and the second surface. The first surface is arranged close to the third conductive layer relative to the second surface. The second conductive layer includes a second side surface connected to the first side surface toward one end of the second conductive layer. The third conductive layer is connected to the first side surface toward one end of the third conductive layer.

2. The display panel according to claim 1, wherein: Along a direction perpendicular to the plane of the substrate, the orthographic projection of the second conductive layer on the substrate is located within the orthographic projection of the first conductive layer on the substrate, and the orthographic projection of the first conductive layer on the substrate is located within the orthographic projection of the third conductive layer on the substrate.

3. The display panel according to claim 1, wherein: An orthographic projection area of ​​the first surface on the substrate is larger than an orthographic projection area of ​​the second surface on the substrate.

4. The display panel according to claim 1, wherein: The conductive layer includes a power supply voltage signal line extending along a first direction; In the non-display area, the display panel further includes a blocking structure extending along a second direction. The blocking structure is located on a side of the conductive layer away from the substrate. The first direction and the second direction intersect.

5. The display panel according to claim 1, wherein: The first conductive layer includes an aluminum metal layer, the second conductive layer includes a first titanium metal layer, and the third conductive layer includes a second titanium metal layer.

6. A method for preparing a display panel, characterized in that: The display panel comprises a display area and a non-display area adjacent to the display area. The method for preparing the display panel comprises the following steps: providing a substrate; A conductive layer is formed on one side of the substrate in the non-display area, wherein the conductive layer includes a third conductive layer, a first conductive layer, and a second conductive layer stacked in a direction away from the substrate, an etching rate of a material of the first conductive layer being greater than an etching rate of a material of the second conductive layer and the third conductive layer, the first conductive layer includes a first surface and a second surface opposite to each other, and a first side surface in contact with the first surface and the second surface, the first surface is disposed relative to the second surface and close to the third conductive layer, the second conductive layer includes a second side surface in contact with the first side surface facing one end of the second conductive layer, and the third side surface of the third conductive layer in contact with the first side surface facing one end of the third conductive layer; forming an etching protection layer at least on the first side surface; forming a material layer to be etched in the display area, and etching the material layer to be etched to form a functional layer; The etching protection layer is removed.

7. The method for preparing a display panel according to claim 6, wherein: The step of removing the etching protection layer includes: A first opening is formed in the display area by an etching process, and the etching protection layer is removed at the same time.

8. The method for preparing a display panel according to claim 6, wherein: The step of forming an etching protection layer at least on the first side surface includes: forming an organic material layer on a side of the conductive layer facing away from the substrate and on a portion of the substrate not covered by the conductive layer; The organic material layer is patterned so that a portion of the organic material layer forms the etching protection layer and a portion of the organic material layer forms a barrier structure, wherein an extension direction of the barrier structure intersects with an extension direction of the conductive layer.

9. The method for manufacturing a display panel according to claim 8, wherein: The thickness of the organic material layer in the barrier structure is greater than or equal to the thickness of the etching protection layer.

10. The method for manufacturing a display panel according to claim 6, wherein: The step of forming an etching protection layer at least on the first side surface includes: forming a planarization material layer on a side of the substrate in the display area and on a side of the conductive layer in the non-display area facing away from the substrate; The planarization material layer is patterned to form a planarization layer in the display area and to form the etching protection layer in the non-display area.

11. The method for manufacturing a display panel according to claim 6, wherein: Along a direction perpendicular to the plane where the substrate is located, the orthographic projection of the etching protection layer on the substrate covers the orthographic projection of the conductive layer on the substrate.

12. The method for manufacturing a display panel according to claim 6, wherein: The step of forming an etching protection layer at least on the first side surface includes: The etching protection layer is formed on the first side surface, the second side surface, and the third side surface.

13. The method for manufacturing a display panel according to claim 12, wherein: In the step of forming the etching protection layer on the first side surface, the second side surface, and the third side surface: The etching protection layer extends from the second side surface to a surface of the second conductive layer facing away from the substrate.

14. The method for manufacturing a display panel according to claim 6, wherein: The functional layer includes at least one of an anode layer and a pixel definition layer.

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