Glue sealing device for diode lead

Abstract

The invention discloses a glue sealing device for a diode lead, and relates to the technical field of diode processing, and the glue sealing device comprises a mounting box and a fixing assembly; uniformly distributed openings are formed in the upper side of the mounting box, mounting blocks are fixed in the openings, connecting grooves are formed in the lower sides of the mounting blocks, two corresponding connecting holes are formed in the upper sides of the interiors of the connecting grooves, and diode bodies are arranged in the connecting grooves; two pins of the diode body are inserted into the two connecting holes, two corresponding clamping grooves are formed in the left side and the right side of the mounting box, the lower ends of all the connecting grooves are provided with the forming assembly, the lower side of the mounting box is provided with the storage assembly, the connecting assembly is arranged above the mounting box, and the connecting assembly is arranged above the mounting box. The connecting assembly is connected with the two clamping grooves, and the moving assembly is installed on the upper side of the connecting assembly. And meanwhile, a glue solution can be quickly dried.

Description

Technical Field

[0001] The invention relates to the technical field of diode processing, in particular to a sealing device for diode leads. Background Art

[0002] The leads of the diode need to be sealed with glue to make a complete diode. In the existing sealing process, the leads are often repeatedly contacted between multiple sealing teeth on the sealing rack, so that the glue on the sealing teeth can be glued to the leads. However, in the above-mentioned sealing device, the leads may be deformed and bent due to the friction of the glue teeth, resulting in sealing failure. In addition, the glue application uniformity of this device is poor and difficult to control, and the glue cannot be quickly dried after sealing, resulting in an increase in the defective rate. Therefore, we propose a sealing device for diode leads. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to overcome the existing defects and provide a sealing device for diode leads, which can evenly apply glue and quickly dry the glue, thereby effectively solving the problems in the background technology.

[0004] To achieve the above-mentioned object, the present invention provides the following technical solutions: a sealing device for diode leads, comprising a mounting box and a fixing assembly; Installation box: The upper side is provided with evenly distributed openings, the interior of which is fixed with a mounting block, the lower side of which is provided with a connecting groove, the upper side of which is provided with two corresponding connecting holes, the interior of which is provided with a diode body, the two pins of which are plugged into the interior of the two connecting holes, the left and right sides of which are provided with two corresponding card slots, the lower ends of all the connecting slots are provided with forming components, the lower side of which is provided with a storage component, the upper side of which is provided with a connecting component, the connecting component is connected to the two card slots, and the upper side of which is provided with a moving component; The fixing assembly comprises a fixing bar, a moving bar, a first motor, a threaded rod and a limit rod, the interior of the installation box is fixed with evenly distributed fixing bars, the side of the fixing bar is provided with a moving bar, the rear side of the installation box is installed with a first motor, the left and right sides of all the fixing bars are provided with through holes, the interior of all the through holes on the right side are rotatably connected with threaded rods, the interior of all the through holes on the left side are fixed with limit rods, the right sides of all the moving bars are provided with threaded holes, the threaded rods are threadedly connected to the interior of all the threaded holes, the output shaft of the first motor is fixed to the rear end of the threaded rod, the left sides of all the moving bars are provided with limit holes, all the limit rods are slidably connected to the interior of all the limit holes, the two pins of all the diode bodies are located between all the fixing bars and the moving bars, the input end of the first motor is electrically connected to the output end of the external PLC controller, and the pins of the diode body are fixed by setting a fixing assembly.

[0005] Furthermore, the molding assembly includes a molding frame and a connecting plate. The molding frame is clamped inside the connecting groove. A connecting plate is provided on the lower side of the installation box. The lower side of the connecting plate is provided with evenly distributed fastening holes. The molding frame is fixed inside the corresponding fastening holes. The molding assembly is provided to facilitate the shaping of the glue.

[0006] Furthermore, the storage component includes a sealing plate, a guide strip opening, an electromagnet, an iron plate and a storage box. A sealing plate is provided on the lower side of the storage box, and the sealing plate is in contact with the lower sides of all the forming frames. The lower side of the sealing plate is provided with evenly distributed guide strip openings. Four corresponding electromagnets are fixed on the upper side of the sealing plate, and four corresponding iron plates are fixed on the lower side of the installation box. The iron plates are adsorbed together with the electromagnets. The input end of the electromagnet is electrically connected to the output end of the external PLC controller, and the glue is stored by setting up the storage component.

[0007] Furthermore, the moving component includes a base plate, a connecting frame, an electric telescopic rod and a mounting plate. The storage box is placed above the base plate. The connecting frame is fixed on the upper side of the base plate. Two corresponding electric telescopic rods are installed on the upper side of the connecting frame. The telescopic arms of the electric telescopic rods are fixed with mounting plates. The input end of the electric telescopic rod is electrically connected to the output end of an external PLC controller. The mounting box is driven to move by setting the moving component.

[0008] Furthermore, the shaping component includes a support frame, an electric heating tube and a temperature sensor. The support frame is fixed inside the connecting frame, and the interior of the support frame is installed with evenly distributed electric heating tubes. The interior of the support frame is installed with a temperature sensor. The temperature sensor is bidirectionally electrically connected to an external PLC controller, and the input end of the electric heating tube is electrically connected to the output end of the external PLC controller. The glue is dried by setting the shaping component.

[0009] Furthermore, the connecting assembly includes an installation frame, a movable frame, a guide rod, a spring and a card block. The installation frame is fixed on the lower side of the two mounting plates, and the interior of the installation frame is slidably connected to two corresponding movable frames. The upper side edge of the movable frame is provided with a guide hole, and the interior of the guide hole is slidably connected to the guide rod, and the two guide rods are fixed to the interior of the installation frame. A spring is sleeved on the circumferential surface of the guide rod, one end of the spring is fixed on the side of the movable frame, and the other end of the spring is fixed on the side of the interior of the installation frame. A card block is fixed on the side of the movable frame, and the card block is clamped in the interior of the corresponding card slot. The movable assembly is connected to the installation box by setting a connecting assembly.

[0010] Furthermore, it also includes an extrusion assembly, which includes a connecting box, a second motor and an extrusion elliptical disk. The connecting box is fixed in the middle of the interior of the installation frame, and the second motor is installed inside the connecting box. The extrusion elliptical disk is fixed on the output shaft of the second motor, and the extrusion elliptical disk is located between the two movable frames. The input end of the second motor is electrically connected to the output end of the external PLC controller, and the two movable frames are further extruded by setting the extrusion assembly.

[0011] Furthermore, a groove is provided on the left side of the movable rack on the left, an infrared transmitter is installed inside the groove, and an infrared receiver is installed on the left side inside the connecting rack. The infrared receiver cooperates with the infrared transmitter, and the infrared receiver is bidirectionally electrically connected to the external PLC controller. The input end of the infrared transmitter is electrically connected to the output end of the external PLC controller. By setting the infrared transmitter and the infrared receiver, it is convenient to locate the position of the installation box, thereby facilitating the shaping component to dry and shape the glue inside the molding frame and the connecting groove.

[0012] Furthermore, an anti-skid plate is fixed to the lower side of the base plate, and evenly distributed anti-skid grooves are opened on the lower side of the anti-skid plate. The stability of the base plate can be effectively guaranteed by providing the anti-skid plate.

[0013] Furthermore, evenly distributed card holes are opened on the lower side of the bottom plate, and card columns are connected inside the card holes. Four card columns are fixed on the lower side of the storage box. By setting the card columns, the stability of the storage box can be effectively guaranteed.

[0014] Compared with the prior art, the present invention has the following advantages: 1. The motor drives the flexible clamping of the pins by cooperating with the adjustable movable bar in the fixed assembly, effectively avoiding the bending and deformation of the pins caused by traditional friction methods. The precise matching design of the molding frame and the connecting groove, combined with the diversion structure of the storage assembly, ensures that the glue liquid evenly fills the mold cavity under the action of gravity, eliminating bubbles and uneven glue layer thickness. 2. The magnetic adsorption structure of the electromagnet and the iron disc enables the rapid opening and closing of the sealing plate, which not only ensures the sealing during the glue injection stage, but also automatically recovers excess glue during the lifting process through the guide strip opening, reducing material waste. The modular design of the storage box and installation box facilitates the recycling, maintenance and cleaning of the glue. 3. The mobile components are aligned with the infrared transmitter and receiver, and the electric telescopic rod is used for lifting and lowering control to achieve precise transfer of the installation box between the injection station and the drying station. The gradient temperature control system of the shaped components provides real-time feedback through the temperature sensor, and cooperates with the evenly distributed electric heating tubes to form a stable thermal field, which significantly shortens the glue curing time and improves the molding quality.

[0015] The connection component adopts a linkage mechanism of spring return and elliptical disk extrusion to achieve rapid locking and release of the installation box, which can effectively meet the needs of continuous production. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the front structure of the present invention; Figure 2 This is a schematic diagram of the structure of the fixing assembly of the present invention; Figure 3 This is a schematic structural diagram of the molding assembly of the present invention; Figure 4 A schematic diagram of the storage component structure of the present invention; Figure 5 A schematic structural diagram of the sealing plate of the present invention; Figure 6 A schematic diagram of the structure of the diode body of the present invention; Figure 7 A schematic diagram of the structure of the card slot of the present invention; Figure 8 It is a structural schematic diagram of the clamping column of the present invention.

[0017] In the figure: 1 installation box, 2 fixing assembly, 21 fixing bar, 22 moving bar, 23 first motor, 24 threaded rod, 25 limiting rod, 3 forming assembly, 31 forming frame, 32 connecting plate, 4 storage assembly, 41 sealing plate, 42 guide strip mouth, 43 electromagnet, 44 iron plate, 45 storage box, 5 connecting assembly, 51 installation frame, 52 moving frame, 53 guide rod, 54 spring, 55 clamping block, 6 extrusion assembly, 61 connecting box, 62 second motor, 63 extruded elliptical disk, 7 moving assembly, 71 bottom plate, 72 connecting frame, 73 electric telescopic rod, 74 installation plate, 8 shaping assembly, 81 support frame, 82 electric heating pipe, 83 temperature sensor, 9 infrared receiver, 10 infrared transmitter, 11 anti-skid plate, 12 installation block, 13 connecting groove, 14 diode body, 15 clamping slot, 16 clamping column. DETAILED DESCRIPTION

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] See also Figure 1-8 , this embodiment provides a technical solution: a sealing device for diode leads, comprising a mounting box 1 and a fixing assembly 2; Installation box 1: The upper side is provided with evenly distributed openings, the inside of which is fixed with a mounting block 12, the lower side of the mounting block 12 is provided with a connecting groove 13, the upper side of the inside of the connecting groove 13 is provided with two corresponding connecting holes, the inside of the connecting groove 13 is provided with a diode body 14, the two pins of the diode body 14 are plugged into the inside of the two connecting holes, the left and right sides of the installation box 1 are provided with two corresponding card slots 15, the lower ends of all the connecting grooves 13 are provided with a forming component 3, the lower side of the installation box 3 is provided with a storage component 4, the upper side of the installation box 1 is provided with a connecting component 5, the connecting component 5 is connected to the two card slots 15, the upper side of the connecting component 5 is provided with a moving component 7, the forming component 3 includes a forming frame 31 and a connecting plate 32, the connecting groove 13 The interior of the storage box 45 is connected with a forming frame 31, and a connecting plate 32 is provided on the lower side of the installation box 1. The lower side of the connecting plate 32 is provided with evenly distributed fastening holes. The forming frame 32 is fixed to the inside of the fastening holes corresponding thereto. The storage assembly 4 includes a sealing plate 41, a guide strip opening 42, an electromagnet 43, an iron disk 44 and a storage box 45. The lower side of the storage box 45 is provided with a sealing plate 41. The sealing plate 41 fits the lower side of all the forming frames 31. The lower side of the sealing plate 41 is provided with evenly distributed guide strip openings 42. Four corresponding electromagnets 43 are fixed on the upper side of the sealing plate 41. Four corresponding iron disks 44 are fixed on the lower side of the installation box 1. The iron disk 44 is adsorbed together with the electromagnet 43, and the input end of the electromagnet 43 is electrically connected to the external P At the output end of the LC controller, the mobile component 7 includes a base plate 71, a connecting frame 72, an electric telescopic rod 73 and a mounting plate 74. The storage box 45 is placed above the base plate 71. The connecting frame 72 is fixed on the upper side of the base plate 71. Two corresponding electric telescopic rods 73 are installed on the upper side of the connecting frame 72. The mounting plate 74 is fixed on the telescopic arm of the electric telescopic rod 73. The input end of the electric telescopic rod 73 is electrically connected to the output end of the external PLC controller. The shaping component 8 includes a support frame 81, an electric heating pipe 82 and a temperature sensor 83. The support frame 81 is fixed inside the connecting frame 72. The electric heating pipes 82 are evenly distributed inside the support frame 81. The temperature sensor 83 is installed inside the support frame 81. The temperature sensor 83 is connected to the external PL The C controller is bidirectionally electrically connected, and the input end of the electric heating tube 82 is electrically connected to the output end of the external PLC controller. The connecting component 5 includes a mounting frame 51, a movable frame 52, a guide rod 53, a spring 54 and a clamping block 55. The lower side of the two mounting plates 74 is fixed with the mounting frame 51. The interior of the mounting frame 51 is slidably connected to two corresponding movable frames 52. The upper side edge of the movable frame 52 is provided with a guide hole, and the interior of the guide hole is slidably connected to the guide rod 53. The two guide rods 53 are both fixed to the interior of the mounting frame 51. The circumferential surface of the guide rod 53 is sleeved with a spring 54. One end of the spring 54 is fixed to the side of the movable frame 52, and the other end of the spring 54 is fixed to the side of the interior of the mounting frame 51. The clamping block 55 is fixed to the side of the movable frame 52.The card block 55 is clamped in the interior of the corresponding card slot 15, and also includes an extrusion assembly 6, which includes a connecting box 61, a second motor 62 and an extrusion elliptical disk 63. The connecting box 61 is fixed in the middle of the interior of the installation frame 51, and the second motor 62 is installed inside the connecting box 61. The extrusion elliptical disk 63 is fixed on the output shaft of the second motor 62, and the extrusion elliptical disk 63 is located between the two movable frames 52. The input end of the second motor 62 is electrically connected to the output end of the external PLC controller. The two movable frames 52 are further extruded by providing the extrusion assembly 6, the mobile assembly 7 is connected to the installation box 1 by providing the connecting assembly 5, the glue is dried by providing the shaping assembly 8, the installation box 1 is driven to move by providing the moving assembly 7, the glue is stored by providing the storage assembly 4, and the glue is conveniently shaped by providing the molding assembly 3; The fixing component 2 includes a fixing bar 21, a moving bar 22, a first motor 23, a threaded rod 24 and a limit rod 25. The inside of the installation box 1 is fixed with evenly distributed fixing bars 21, and the side of the fixing bar 21 is provided with a moving bar 22. The rear side of the installation box 1 is installed with a first motor 23. All the left and right sides of the fixing bars 21 are provided with through holes. The insides of all the through holes on the right side are rotatably connected with threaded rods 24, and the insides of all the through holes on the left side are fixed with limit rods 25. The right sides of all the moving bars 22 are provided with threaded holes, and the threaded rods 24 are threadedly connected to the insides of all the threaded holes. The output shaft of the first motor 23 is fixed to the rear end of the threaded rod 24, and the left sides of all the moving bars 22 are provided with limit holes. All the limit rods 25 are slidably connected to the insides of all the limit holes. The two pins of all the diode bodies 14 are located between all the fixing bars 21 and the moving bars 22. The input end of the first motor 23 is electrically connected to the output end of the external PLC controller. The pins of the diode body 14 are fixed by setting the fixing component 2.

[0020] Among them: a groove is opened on the left side of the movable frame 52 on the left side, an infrared transmitter 10 is installed inside the groove, and an infrared receiver 9 is installed on the left side inside the connecting frame 72. The infrared receiver 9 cooperates with the infrared transmitter 10, and the infrared receiver 9 is bidirectionally electrically connected to the external PLC controller. The input end of the infrared transmitter 10 is electrically connected to the output end of the external PLC controller. By setting the infrared transmitter 10 and the infrared receiver 9, it is convenient to locate the position of the installation box 1, so as to facilitate the shaping component 8 to dry and shape the glue inside the molding frame 31 and the connecting groove 13.

[0021] Among them, an anti-skid plate 11 is fixed to the lower side of the bottom plate 71, and evenly distributed anti-skid grooves are opened on the lower side of the anti-skid plate 11. By setting the anti-skid plate 11, the stability of the bottom plate 71 can be effectively guaranteed.

[0022] Among them: the lower side of the bottom plate 71 is provided with evenly distributed card holes, the inside of the card holes is connected with card columns 16, and the four card columns 16 are fixed on the lower side of the storage box 45. By setting the card columns 16, the stability of the storage box 45 can be effectively guaranteed.

[0023] The working principle of the glue sealing device for diode leads provided by the present invention is as follows: the operator inserts the diode body 14 vertically into the connecting hole of the mounting block 12 of the mounting box 1 at the external work station in advance, drives the threaded rod 24 to rotate through the first motor 23 of the fixing component 2, drives the moving bar 22 to move closer to the fixing bar 21, and realizes non-destructive clamping of the pin, and then moves the pre-assembled mounting box 1 to the working position, and the spring 54 reset mechanism of the connecting component 5 makes the card block 55 embed into the card slot 15 on both sides of the mounting box 1 to complete locking. After the glue is injected into the storage box 45, the electric telescopic rod 73 of the moving component 7 controls the mounting box 1 to move downward as a whole. During the process of inserting the molding frame 31 downward, the interior of the storage box 45 is filled with glue. In this case, the glue will automatically enter the interior of the molding frame 31. When the lower side of all the molding frames 31 is in contact with the sealing plate 41 in the storage box 45, the four electromagnets 43 are started. After the four electromagnets 43 are started, they will be adsorbed together with the four iron plates 44. Under this condition, all the molding frames 31 can be sealed. After sealing, the glue inside the molding frame 31 can cover the pin connection of the diode body 14. After covering, the moving component 7 lifts the installation box 1 and cooperates with the infrared transmitter 10 and the infrared receiver 9 to move all the molding frames 31 horizontally to the support frame 81 of the shaping component 8. During this process, the excess glue will flow back to the interior of the storage box 45 through the guide strip mouth 42. At this time, all the electric heating tubes 82 start the gradient heating program to solidify the glue under the feedback of the temperature sensor 83. After the cured installation box 1 cools down to the threshold along with the support frame 81, the second motor 62 of the extrusion component 6 drives the extrusion elliptical disk 63 to rotate, pushing the moving frame 52 to compress the spring 54 to make the block 55 disengage from the slot 15. The operator removes the installation box 1 and separates the sealing plate 41. The molding frame 31 is removed along with the connecting plate 32 to complete the demoulding. The moving bar 22 of the loosening component 2 can be taken out to take out the finished product, and then the spare installation box 1 can be replaced to perform the sealing operation again.

[0024] It is worth noting that the external PLC controller disclosed in the above embodiment is specifically a Siemens S7-200 model, and the electromagnet 43, the first motor 23, the second motor 62, the electric telescopic rod 73, the temperature sensor 83, the infrared receiver 9, the electric heating tube 82 and the infrared transmitter 10 can be freely configured according to the actual application scenario. The external PLC controller controls the operation of the electromagnet 43, the first motor 23, the second motor 62, the electric telescopic rod 73, the electric heating tube 82 and the infrared transmitter 10 using methods commonly used in the prior art.

[0025] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention's description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A sealing device for diode leads, characterized in that: It includes a mounting box (1) and a fixing assembly (2); Installation box (1): openings are evenly distributed on the upper side, a mounting block (12) is fixed inside the opening, a connecting groove (13) is provided on the lower side of the mounting block (12), two corresponding connecting holes are provided on the upper side of the connecting groove (13), a diode body (14) is provided inside the connecting groove (13), two pins of the diode body (14) are plugged into the two connecting holes, two corresponding card slots (15) are provided on the left and right sides of the installation box (1), a forming assembly (3) is installed at the lower end of all the connecting grooves (13), a storage assembly (4) is provided on the lower side of the installation box (3), a connecting assembly (5) is provided on the upper side of the installation box (1), the connecting assembly (5) is connected to the two card slots (15), and a moving assembly (7) is installed on the upper side of the connecting assembly (5); The fixing assembly (2) comprises a fixing bar (21), a moving bar (22), a first motor (23), a threaded rod (24) and a limiting rod (25). The fixing bars (21) are evenly distributed and fixed inside the installation box (1). The moving bar (22) is provided on the side of the fixing bar (21). The first motor (23) is installed on the rear side of the installation box (1). All the left and right sides of the fixing bars (21) are provided with through holes. The insides of all the through holes on the right side are rotatably connected with the threaded rod (24). The insides of all the through holes on the left side are fixed with the limiting rod (25). The right side of some moving bars (22) is provided with a threaded hole, the threaded rod (24) is threadedly connected to the inside of all the threaded holes, the output shaft of the first motor (23) is fixed to the rear end of the threaded rod (24), the left side of all moving bars (22) is provided with a limit hole, all the limit rods (25) are slidably connected to the inside of all the limit holes, the two pins of all the diode bodies (14) are located between all the fixed bars (21) and the moving bars (22), and the input end of the first motor (23) is electrically connected to the output end of the external PLC controller.

2. The sealing device for diode leads according to claim 1, characterized in that: The molding assembly (3) comprises a molding frame (31) and a connecting plate (32); the molding frame (31) is clamped inside the connecting groove (13); a connecting plate (32) is provided on the lower side of the installation box (1); evenly distributed fastening holes are provided on the lower side of the connecting plate (32); the molding frame (32) is fixed inside the corresponding fastening holes.

3. The sealing device for diode leads according to claim 2, characterized in that: The storage assembly (4) comprises a sealing plate (41), a guide strip opening (42), an electromagnet (43), an iron plate (44) and a storage box (45). The lower side of the storage box (45) is provided with a sealing plate (41). The sealing plate (41) is in contact with the lower sides of all the forming frames (31). The lower side of the sealing plate (41) is provided with evenly distributed guide strip openings (42). Four corresponding electromagnets (43) are fixed on the upper side of the sealing plate (41). Four corresponding iron plates (44) are fixed on the lower side of the installation box (1). The iron plates (44) are adsorbed together with the electromagnets (43). The input end of the electromagnet (43) is electrically connected to the output end of an external PLC controller.

4. The sealing device for diode leads according to claim 3, characterized in that: The mobile assembly (7) comprises a base plate (71), a connecting frame (72), an electric telescopic rod (73) and a mounting plate (74); the storage box (45) is placed above the base plate (71); a connecting frame (72) is fixed on the upper side of the base plate (71); two corresponding electric telescopic rods (73) are mounted on the upper side of the connecting frame (72); a mounting plate (74) is fixed on the telescopic arm of the electric telescopic rod (73); and an input end of the electric telescopic rod (73) is electrically connected to an output end of an external PLC controller.

5. The sealing device for diode leads according to claim 4, characterized in that: The shaping component (8) comprises a support frame (81), an electric heating pipe (82) and a temperature sensor (83); the support frame (81) is fixed inside the connecting frame (72); the electric heating pipes (82) are evenly distributed inside the support frame (81); the temperature sensor (83) is installed inside the support frame (81); the temperature sensor (83) is bidirectionally electrically connected to an external PLC controller; the input end of the electric heating pipe (82) is electrically connected to the output end of the external PLC controller.

6. The sealing device for diode leads according to claim 4, characterized in that: The connecting assembly (5) comprises a mounting frame (51), a movable frame (52), a guide rod (53), a spring (54) and a clamping block (55). The mounting frame (51) is fixed to the lower side of the two mounting plates (74). The interior of the mounting frame (51) is slidably connected to two corresponding movable frames (52). The upper side edge of the movable frame (52) is provided with a guide hole. The interior of the guide hole is slidably connected to the guide rod (53). The two guide rods (53) are both fixed to the interior of the mounting frame (51). The circumferential surface of the guide rod (53) is sleeved with a spring (54). One end of the spring (54) is fixed to the side surface of the movable frame (52), and the other end of the spring (54) is fixed to the side surface of the inner side of the mounting frame (51). A clamping block (55) is fixed to the side surface of the movable frame (52), and the clamping block (55) is clamped to the interior of the corresponding clamping slot (15).

7. The sealing device for diode leads according to claim 6, characterized in that: The invention also includes an extrusion assembly (6), wherein the extrusion assembly (6) includes a connection box (61), a second motor (62) and an extrusion elliptical disk (63). The connection box (61) is fixed in the middle of the interior of the installation frame (51), the second motor (62) is installed inside the connection box (61), the extrusion elliptical disk (63) is fixed on the output shaft of the second motor (62), and the extrusion elliptical disk (63) is located between the two movable frames (52). The input end of the second motor (62) is electrically connected to the output end of an external PLC controller.

8. The sealing device for diode leads according to claim 6, characterized in that: A groove is provided on the left side of the movable frame (52) on the left side, an infrared transmitter (10) is installed inside the groove, an infrared receiver (9) is installed on the left side inside the connecting frame (72), the infrared receiver (9) cooperates with the infrared transmitter (10), the infrared receiver (9) is bidirectionally electrically connected to an external PLC controller, and the input end of the infrared transmitter (10) is electrically connected to the output end of the external PLC controller.

9. The sealing device for diode leads according to claim 4, characterized in that: An anti-skid plate (11) is fixed to the lower side of the bottom plate (71), and evenly distributed anti-skid grooves are provided on the lower side of the anti-skid plate (11).

10. The sealing device for diode leads according to claim 4, characterized in that: Evenly distributed clamping holes are provided on the lower side of the bottom plate (71), and clamping columns (16) are clamped inside the clamping holes. The four clamping columns (16) are all fixed on the lower side of the storage box (45).

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